WO2023153341A1 - Système de montage et procédé de montage - Google Patents

Système de montage et procédé de montage Download PDF

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Publication number
WO2023153341A1
WO2023153341A1 PCT/JP2023/003702 JP2023003702W WO2023153341A1 WO 2023153341 A1 WO2023153341 A1 WO 2023153341A1 JP 2023003702 W JP2023003702 W JP 2023003702W WO 2023153341 A1 WO2023153341 A1 WO 2023153341A1
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WIPO (PCT)
Prior art keywords
behavior
unit
mounting
mounting system
capturing
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PCT/JP2023/003702
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English (en)
Japanese (ja)
Inventor
悠人 海老原
晋平 杉野
弘之 藤原
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to CN202380012591.1A priority Critical patent/CN117598038A/zh
Publication of WO2023153341A1 publication Critical patent/WO2023153341A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present disclosure relates to an implementation system and an implementation method.
  • the nozzle picks up the component from the component supply section and mounts it on the board.
  • a component mounter normally mounts components on a board based on a production job. At this time, the component mounting apparatus performs control (servo) to automatically operate so as to follow target values using the position, orientation, attitude, etc. of the nozzle as control variables.
  • control servo
  • the component mounting apparatus includes an assembly diagnostic routine for diagnosing vibration caused by assembly of the component mounting apparatus, and an environmental vibration diagnosis routine for diagnosing vibration caused by the surrounding environment. do a routine.
  • the component mounter moves the nozzle to the imaging position and turns off the servo control of the nozzle. That is, in the diagnostic routine, the component mounting apparatus performs an operation (diagnostic routine operation) different from the normal operation described above. Then, the component mounting apparatus captures an image of the tip of the nozzle using the imaging means, obtains vibration data of the tip of the nozzle from the captured image, determines whether or not the vibration data falls within a predetermined allowable range, and determines whether or not the vibration data falls within a predetermined allowable range. If so, an error is output to the outside.
  • the diagnostic routine assembly diagnostic routine and environmental vibration diagnostic routine
  • a component mounting apparatus that mounts a component (second object) on a board (first object) as in Patent Document 1 performs diagnosis by an operation (diagnosis routine) different from normal operation. Loss of time was occurring, which reduced productivity. Therefore, it is required to detect malfunction of the apparatus while suppressing the decrease in productivity.
  • An object of the present disclosure is to provide a mounting system and a mounting method capable of detecting device failure while suppressing a decrease in productivity.
  • a mounting system performs a production operation of mounting a second object on a first object.
  • the mounting system includes a mounting head, an imaging section, a behavior detection section, a behavior determination section, and an output section.
  • the mounting head has a capturing part capable of capturing the second object.
  • the imaging section images the capture section during the production operation.
  • the behavior detection section obtains a behavior value corresponding to the behavior of the capturing section during the production operation based on the captured image of the imaging section.
  • the behavior determination unit determines whether the behavior value is within an allowable range.
  • the output unit notifies that the behavior is unsatisfactory if the behavior value does not fall within an allowable range.
  • a mounting method performs a production operation of mounting a second object on a first object.
  • the mounting method includes an imaging step, a behavior detection step, a behavior determination step, and an output step.
  • an imaging step an image of a capture unit provided in the mounting head and capable of capturing the second object is captured during the production operation.
  • the behavior detection step obtains a behavior value corresponding to the behavior of the capturing unit during the production operation based on the captured image captured in the imaging step.
  • the behavior determination step determines whether or not the behavior value is within an allowable range.
  • the outputting step indicates that the behavior is bad if the behavior value is not within an acceptable range.
  • FIG. 1 is a configuration diagram showing a mounting system according to an embodiment.
  • FIG. 2 is a perspective view showing a main part of the mounting system same as the above.
  • FIG. 3 is a block diagram showing the same mounting system.
  • FIG. 4 is a side view showing the vicinity of the capture section and imaging section of the mounting system; 5A to 5D are diagrams showing the production operation of the same mounting system.
  • FIG. 6 is a diagram showing a normal stroke operation of the above mounting system.
  • FIG. 7 is a graph showing the time change of the stroke amount of the mounting system in the normal state.
  • FIG. 8 is a diagram showing a stroke operation of the mounting system when the same mounting system is out of order.
  • FIG. 9 is a graph showing the change over time of the stroke amount when the mounting system described above is malfunctioning.
  • FIG. 1 is a configuration diagram showing a mounting system according to an embodiment.
  • FIG. 2 is a perspective view showing a main part of the mounting system same as the above.
  • FIG. 3 is
  • FIG. 10A is a diagram showing normal vibration of the mounting system
  • FIG. 10B is a graph showing the time change of the vibration behavior value in the normal state
  • FIG. 11A is a diagram showing vibration of the same mounting system when it malfunctions.
  • FIG. 11B is a graph showing temporal changes in vibration behavior values when the same is out of order.
  • FIG. 12 is a flowchart showing a mounting method executed by the mounting system
  • FIG. 13 is a graph for explaining a modification of the mounting system
  • FIG. 14 is a side view showing a modification of the imaging section of the mounting system;
  • the following embodiments generally relate to implementation systems and implementation methods. More specifically, the present invention relates to a mounting system and a mounting method that perform a production operation of mounting a second object on a first object.
  • each drawing described in the following embodiments is a schematic drawing, and the ratio of the size and thickness of each component does not necessarily reflect the actual dimensional ratio.
  • the configurations described in the following embodiments are merely examples of the present disclosure.
  • the present disclosure is not limited to the following embodiments, and various modifications can be made according to design and the like as long as the effects of the present disclosure can be achieved.
  • X-axis, Y-axis, and Z-axis that are orthogonal to each other are defined in FIGS. 1 and 2 unless otherwise specified.
  • the X and Y axes extend horizontally, and the Z axis extends vertically.
  • the mounting system 1 is a mounting apparatus (mounting machine) that performs a production operation of mounting a second object T2 on a first object T1.
  • the mounting system 1 is used, for example, in facilities such as factories, research institutes, offices, and educational facilities for manufacturing various products such as electronic devices, automobiles, clothing, foods, medicines, and handicrafts. be done.
  • the “production operation” is an operation for producing a product T3 (see FIG. 5D) in which the second object T2 is mounted on the first object T1. does not include the diagnostic operation of mounting the second object T2 in .
  • a typical electronic device has various circuit blocks such as a power supply circuit and a control circuit.
  • a solder application process cream solder is applied (or printed) on a board (including a printed wiring board).
  • the mounting process components (including electronic components) are mounted (mounted) on the board.
  • the board on which the components are mounted is heated in a reflow oven to melt creamy solder for soldering.
  • the mounting system 1 mounts the component T20, which is the second target T2, on the substrate T10, which is the first target T1. That is, in the mounting system 1 according to this embodiment, the first target T1 is the board T10, and the second target T2 is the component T20 mounted on the board T10.
  • the mounting system 1 used for mounting the second object T2 (component T20) on the first object T1 (board T10) includes, as shown in FIG. A unit 4 , a control unit 5 , a base 61 , a conveying device 62 , a plurality of component supply devices 63 and a fixed camera 7 are provided.
  • the transport device 62 has a pair of conveyor mechanisms 62a extending in the X-axis direction on the base 61, transports the substrate T10, which is the first object T1, in the X-axis direction and positions it in a predetermined mounting space. do.
  • a plurality of component supply devices 63 have tape feeders mounted side by side in the X-axis direction on a feeder base 65 of a carriage 64 connected to the base 61 .
  • Each component supply device 63 pitch-feeds the carrier tape 67 supplied from the reel 66, and supplies the component T20, which is the second object T2 held on the carrier tape 67, to the component supply port 63a.
  • a reel 66 is held by a carriage 64 .
  • the fixed camera 7 is mounted on the base 61 and images the upper side.
  • the mounting head 2 is movable along the XY plane and further has a catching section 21 for catching the second object T2.
  • the catching unit 21 is, for example, a suction nozzle capable of stroking to move (up and down) in the vertical direction along the Z-axis.
  • the mounting system 1 performs the production operation of mounting the component T20 (second target T2) on the board T10 (first target T1).
  • Production operations performed in the mounting process include catching operations and mounting operations.
  • the catching operation is an operation of moving the catching portion 21 that has not caught the component T20 so as to approach the component supply port 63a to capture (hold) the component T20 positioned at the component supply port 63a.
  • the mounting operation is an operation of moving the capturing unit 21 capturing the component T20 closer to the substrate T10 and mounting the component T20 on the mounting surface T11 of the substrate T10. Position control of the catching part 21 in such catching operation and mounting operation requires high positioning accuracy.
  • the behavior of the catching part 21 greatly affects the improvement of the positioning accuracy.
  • the behavior when the mounting head 2 moves from the component supply device 63 to above the substrate T10 and stops above the substrate T10, and the behavior when the catching part 21 performs a stroke operation to move in the vertical direction are important. Become.
  • the mounting system 1 of the present embodiment includes the mounting head 2, the imaging unit 3, the behavior detection unit 53, the behavior determination unit 54, and the output unit 55.
  • the mounting head 2 has a capture section 21 capable of capturing the component T20.
  • the imaging unit 3 images the capturing unit 21 during production operation.
  • the behavior detection unit 53 obtains a behavior value corresponding to the behavior of the capture unit 21 during production operation based on the captured image of the imaging unit 3 .
  • the behavior determination unit 54 determines whether the behavior value is within the allowable range. If the behavior value does not fall within the allowable range, the output unit 55 outputs a notification signal notifying that the behavior is not good.
  • the term "malfunction" includes not only abnormalities but also poor conditions.
  • the mounting system 1 described above can detect device malfunctions while suppressing a decline in productivity.
  • the mounting system 1 is used for mounting a component T20 by surface mount technology (SMT)
  • SMT surface mount technology
  • the component T20 is a component for surface mounting (SMD: Surface Mount Device), and is mounted by being arranged on the mounting surface T11 (front surface) of the substrate T10.
  • the mounting system 1 is not limited to this example, and may be used to mount the component T20 by an insertion mount technology (IMT).
  • IMT insertion mount technology
  • the component T20 is a component for insertion mounting having lead terminals, and is mounted on the mounting surface T11 of the substrate T10 by inserting the lead terminals into the holes of the substrate T10.
  • the “imaging optical axis” referred to in the present disclosure is an optical axis of an image captured by the imaging unit 3 (captured image of the imaging unit 3), and is an image sensor 31 (see FIG. 3) of the imaging unit 3 It is the optical axis defined by both the optical system 32 (see FIG. 3).
  • images captured by the imaging unit 3 include still images (still images) and moving images (moving images).
  • moving image includes captured images composed of a plurality of still images obtained by frame-by-frame shooting or the like.
  • the image captured by the imaging unit 3 may not be the data output from the imaging unit 3 itself.
  • the image captured by the image capturing unit 3 can be appropriately compressed, converted to another data format, processed to cut out a part of the image captured by the image capturing unit 3, adjusted in focus, adjusted in brightness, or adjusted in contrast. etc. processing may be applied.
  • the image captured by the imaging unit 3 is a full-color moving image.
  • the axes parallel to the mounting surface T11 of the substrate T10 are defined as the "X-axis" and the "Y-axis", and the thickness direction of the substrate T10
  • the axis parallel to be the "Z" axis is the upward direction
  • the other direction is the downward direction.
  • the substrate T10 is positioned below the capturing portion 21 when the capturing portion 21 faces the mounting surface T11 of the substrate T10.
  • X-axis, Y-axis, and Z-axis are all virtual axes, and the arrows indicating "X”, “Y”, and “Z” in the drawings are notated for the sake of explanation. nothing, and none of them involve substance. Moreover, these directions are not meant to limit the directions during use of the mounting system 1 .
  • the mounting system 1 is connected to a pipe for circulating cooling water, a cable for power supply, a pipe for supplying air pressure (including positive pressure and vacuum), and the like. Illustrations are omitted as appropriate.
  • a mounting system 1 includes a mounting head 2 , an imaging section 3 , a drive section 4 and a control section 5 .
  • the mounting system 1 in the present embodiment includes, as shown in FIG. A camera 7 is further provided.
  • the transport device 62 , the component supply device 63 and the fixed camera 7 are not essential components of the mounting system 1 . That is, all or part of the transport device 62 , the component supply device 63 , and the fixed camera 7 may not be included in the components of the mounting system 1 .
  • FIG. 2 only the mounting head 2, the imaging unit 3, and the driving unit 4 are illustrated, and the other configuration of the mounting system 1 is omitted as appropriate.
  • FIG. 4 shows the periphery of the mounting head 2 and omits the other configuration of the mounting system 1 as appropriate.
  • the mounting head 2 has at least one catching portion 21 .
  • the mounting head 2 has a head unit 23 and one catching part 21 is attached to the head unit 23 . Then, the mounting head 2 moves the catching portion 21 closer to the substrate T10 while catching the component T20 with the catching portion 21, and mounts the component T20 on the mounting surface T11 of the substrate T10. That is, the mounting head 2 holds the capturing part 21 movably toward the substrate T10.
  • the imaging unit 3 is fixed to the head unit 23 of the mounting head 2.
  • the imaging unit 3 has an imaging device 31 and an optical system 32 .
  • the imaging unit 3 is, for example, a video camera that captures moving images.
  • the imaging unit 3 images the capturing unit 21 during production operation.
  • the capturing unit 21 and the imaging unit 3 described above are attached to the head unit 23 , and the capturing unit 21 and the imaging unit 3 move in synchronization with the mounting head 2 .
  • Control unit 5 controls each unit of the mounting system 1.
  • Control unit 5 preferably comprises a computer system. That is, in the control unit 5, a processor such as a CPU (Central Processing Unit) or MPU (Micro Processing Unit) reads and executes a program stored in a memory, thereby performing part or all of the functions of the control unit 5 is realized.
  • the control unit 5 has a processor that operates according to a program as a main hardware configuration. Any type of processor can be used as long as it can implement functions by executing a program.
  • the processor is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or LSI (Large Scale Integration).
  • ICs and LSIs are called ICs and LSIs, but the names change depending on the degree of integration, and may be called system LSIs, VLSIs (Very Large Scale Integration), or ULSIs (Ultra Large Scale Integration).
  • a field programmable gate array (FPGA) which is programmed after the LSI is manufactured, or a reconfigurable logic device capable of reconfiguring the junction relationships inside the LSI or setting up circuit partitions inside the LSI for the same purpose. can be done.
  • a plurality of electronic circuits may be integrated on one chip or may be provided on a plurality of chips. A plurality of chips may be collectively arranged or distributed.
  • the control unit 5 is electrically connected to each of the mounting head 2, the imaging unit 3, the driving unit 4, the conveying device 62, the component supply device 63, and the fixed camera 7, for example.
  • the control unit 5 outputs control signals to the mounting head 2 and the driving unit 4, and controls the mounting head 2 and the driving unit 4 so that the component T20 captured by the capturing unit 21 is mounted on the mounting surface T11 of the substrate T10. Control.
  • the control unit 5 outputs control signals to the imaging unit 3 and the fixed camera 7 to control the imaging unit 3 and the fixed camera 7, and outputs images captured by the imaging unit 3 and the fixed camera 7 to the imaging unit 3. and the fixed camera 7, respectively.
  • the drive unit 4 is a device that moves the mounting head 2 .
  • the driving section 4 moves the mounting head 2 within the XY plane.
  • the “XY plane” referred to here is a plane including the X-axis and the Y-axis and perpendicular to the Z-axis.
  • the driving section 4 moves the mounting head 2 in the X-axis direction and the Y-axis direction.
  • the imaging unit 3 is fixed to the mounting head 2 , so the driving unit 4 also moves the imaging unit 3 together with the mounting head 2 .
  • the mounting head 2 and the imaging unit 3 are positioned above the substrate T10 positioned in the mounting space of the transport device 62 and above the component supply port 63a of the component supply device 63 by the drive unit 4. move between
  • the driving section 4 has an X-axis driving section 41 and a Y-axis driving section 42, as shown in FIG.
  • the X-axis driving section 41 moves the mounting head 2 straight in the X-axis direction.
  • the Y-axis driving section 42 moves the mounting head 2 straight in the Y-axis direction.
  • the Y-axis drive unit 42 moves the mounting head 2 along the Y-axis together with the X-axis drive unit 41, thereby linearly moving the mounting head 2 in the Y-axis direction.
  • each of the X-axis driving section 41 and the Y-axis driving section 42 includes a linear motor, and moves the mounting head 2 by driving force generated by the linear motor upon receiving power supply.
  • the component supply device 63 supplies the component T20 captured by the capturing section 21 of the mounting head 2 .
  • the component supply device 63 has, for example, a tape feeder that supplies components T20 accommodated in a carrier tape.
  • the component supply device 63 may have a tray on which a plurality of components T20 are placed.
  • the mounting head 2 captures the component T ⁇ b>20 from the component supply device 63 with the capturing section 21 .
  • the transport device 62 is a device that transports the substrate T10.
  • the conveying device 62 is implemented by, for example, a belt conveyor.
  • the transport device 62 transports the substrate T10, for example, along the X-axis.
  • the conveying device 62 conveys the substrate T10 to at least a mounting space below the mounting head 2, that is, a mounting space facing the capturing section 21 in the Z-axis direction. Then, the transport device 62 stops the board T10 in the mounting space until the mounting of the component T20 on the board T10 by the mounting head 2 is completed.
  • FIG. 5A shows an outline of the production operation performed in the mounting process.
  • the capturing portion 21 that does not capture the component T20 is located above the component supply port 63a.
  • the catching unit 21 descends in the vertical direction indicated by the arrow M1 to perform a catching operation of catching (holding) the component T20 positioned at the component supply port 63a.
  • the mounting head 2 moves in the horizontal direction indicated by the arrow M2 so as to approach the substrate T10. That is, the capturing part 21 capturing the component T20 moves closer to the substrate T10.
  • the mounting head 2 stops when the capturing part 21 moves above the substrate T10.
  • the capture unit 21 descends in the vertical direction indicated by the arrow M3, and the component T20 is mounted on the mounting surface T11 of the substrate T10, thereby producing the product T3.
  • the catching part 21 may start to descend while the mounting head 2 is moving in the horizontal direction.
  • the mounting system 1 may include a backup device, a lighting device, a communication unit, and the like.
  • the backup device backs up the board T10 transported to the mounting space by the transport device 62. That is, the substrate T10 transferred to the mounting space by the transfer device 62 is held in the mounting space by the backup device.
  • the lighting device illuminates the imaging region R1 of the imaging unit 3.
  • the lighting device may be turned on at least at the timing when the image capturing unit 3 captures an image, and for example, emits light in accordance with the image capturing timing of the image capturing unit 3 .
  • the image captured by the imaging unit 3 is a full-color moving image, so the illumination device outputs light in the wavelength range of the visible light region, such as white light.
  • the illumination device has a plurality of light sources such as LEDs (Light Emitting Diodes).
  • the illumination device illuminates the imaging region R1 of the imaging unit 3 by causing the plurality of light sources to emit light.
  • the illumination device is realized by an appropriate illumination method such as ring illumination or coaxial epi-illumination.
  • the illumination device is fixed to the mounting head 2 together with the imaging unit 3, for example.
  • the communication unit is configured to communicate with the host system directly or indirectly via a network, repeater, or the like. This allows the mounting system 1 to exchange data with the host system.
  • FIG. 2 (2.3) Mounting Head A more detailed configuration of the mounting head 2 will be described with reference to FIGS. 2, 3, and 4. FIG.
  • the mounting head 2 further includes an actuator 22 (see FIG. 3) for moving the catching portion 21, and a head unit 23 for holding the catching portion 21 and the actuator 22, in addition to the catching portion 21. have.
  • an actuator 22 see FIG. 3 for moving the catching portion 21, and a head unit 23 for holding the catching portion 21 and the actuator 22, in addition to the catching portion 21. have.
  • one capture section 21 and one actuator 22 are attached to one head unit 23 .
  • the mounting head 2 can pick up one component T20.
  • the capture unit 21 is, for example, a suction nozzle.
  • the catching unit 21 is controlled by the control unit 5 and can switch between a catching state of catching (holding) the component T20 and a released state of releasing (releasing the catching) of the component T20.
  • the catching unit 21 is not limited to the suction nozzle, and may be configured to catch (hold) the component T20 by pinching (picking) the component T20, for example, like a robot hand.
  • the mounting head 2 operates by being supplied with air pressure (vacuum) as power. In other words, the mounting head 2 switches between the captured state and the released state of the capturing section 21 by opening and closing a valve on a pneumatic (vacuum) supply path connected to the capturing section 21 .
  • the actuator 22 linearly moves the capturing part 21 in the Z-axis direction. Further, the actuator 22 rotates the catching portion 21 in a rotational direction (hereinafter referred to as "the ⁇ direction") about an axis along the Z-axis direction.
  • the actuator 22 is driven by a driving force generated by a linear motor to move the catching portion 21 in the Z-axis direction.
  • the actuator 22 is driven by a driving force generated by a rotary motor.
  • the mounting head 2 is linearly moved in the X-axis direction and the Y-axis direction by the drive unit 4 .
  • the catching portion 21 included in the mounting head 2 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the ⁇ direction by the driving portion 4 and the actuator 22 .
  • the head unit 23 is made of metal and has a rectangular parallelepiped shape.
  • the head unit 23 holds the capturing part 21 and the actuator 22 by assembling the capturing part 21 and the actuator 22 to the head unit 23 .
  • the capture section 21 is indirectly held by the head unit 23 via the actuator 22 in a state in which it can move in the Z-axis direction and the ⁇ direction.
  • the mounting head 2 moves within the XY plane by moving the head unit 23 within the XY plane by the drive unit 4 .
  • the mounting head 2 moves the catching section 21 that has not caught the component T20 so as to approach the component supply port 63a, and performs a catching operation of catching (holding) the component T20 in the component supply device 63. can be done.
  • the mounting head 2 moves the catching unit 21 closer to the substrate T10 while the mounting system 1 has captured the component T20, and mounts the component T20 on the mounting surface T11 of the substrate T10. It becomes possible to perform the mounting operation.
  • Imaging Unit 3 (2.4) Imaging Unit A more detailed configuration of the imaging unit 3 will be described with reference to FIGS. 2 to 4.
  • FIG. 2 A more detailed configuration of the imaging unit 3 will be described with reference to FIGS. 2 to 4.
  • the imaging unit 3 is composed of one moving camera 3a that moves together with the mounting head 2 as shown in FIG. 4. As shown in FIG. have.
  • the optical system 32 forms a captured image of the imaging region R ⁇ b>1 on the imaging element 31 .
  • the imaging element 31 is, for example, an image sensor such as CCD (Charge Coupled Devices) or CMOS (Complementary Metal-Oxide Semiconductor).
  • the imaging device 31 converts the image formed on the light receiving surface into an electrical signal and outputs the electrical signal.
  • the optical system 32 includes one or more lenses, mirrors, and the like. As an example in this embodiment, the optical system 32 is implemented by a combination of a plurality of lenses (lens group). The optical system 32 forms an image of the light from the imaging region R1 on the light receiving surface of the imaging device 31 . Note that the optical system 32 is not limited to the configuration described above.
  • the imaging section 3 is positioned relative to the capturing section 21 so that at least the tip (lower end) 210 (see FIG. 4) of the capturing section 21 is included in the imaging region R1. Therefore, at least the tip 210 of the capturing section 21 is captured in the image captured by the imaging section 3 .
  • the imaging section 3 is arranged below the head unit 23 and on the side of the capturing section 21 in plan view from the Z-axis direction. In this manner, the imaging section 3 is attached to the head unit 23 together with the catching section 21, and the catching section 21 and the imaging section 3 move simultaneously. Therefore, the mounting system 1 can shorten the time required for mounting and improve productivity compared to a configuration in which the capture unit 21 and the imaging unit 3 are moved separately.
  • the imaging unit 3 has an imaging optical axis AX1 that intersects the Z axis (vertical direction).
  • the imaging optical axis AX1 extends obliquely with respect to the vertical direction. That is, the imaging section 3 is fixed to the head unit 23 so that the imaging direction of the imaging section 3 intersects the vertical direction. Therefore, the imaging unit 3 can capture the behavior of the capturing unit 21 in the horizontal direction and the behavior of the capturing unit 21 in the vertical direction.
  • the horizontal direction is the direction along the XY plane
  • the vertical direction is the direction orthogonal to the horizontal direction (direction along the Z-axis).
  • the fixed camera 7 takes an image of the mounting head 2 moving between the board T10 positioned in the mounting space and the component supply port 63a of the component supply device 63 from below. Therefore, the captured image of the fixed camera 7 shows the component T20 captured by the capture unit 21. As shown in FIG. That is, the image captured by the fixed camera 7 contains information on the mutual positional relationship between the capture unit 21 and the component T20, in other words, information on the displacement of the component T20 with respect to the capture unit 21.
  • the fixed camera 7 preferably takes an image of the mounting head 2 moving from the component supply port 63a to the substrate T10 from below. In this case, the fixed camera 7 does not always take an image, but takes an image at the timing when the capture unit 21 capturing the part T20 passes above the fixed camera 7 .
  • the fixed camera 7 may be installed below the component supply port 63a.
  • the mounting system 1 preferably further includes an illumination device that illuminates the imaging area of the fixed camera 7 .
  • the control unit 5 includes a head control unit 51 , an image acquisition unit 52 , a behavior detection unit 53 , a behavior determination unit 54 and an output unit 55 .
  • the head control unit 51 controls the mounting head 2 and the driving unit 4 by outputting control signals to the mounting head 2 and the driving unit 4 .
  • the head control unit 51 outputs a horizontal control signal to the driving unit 4 and controls the driving unit 4 to move the mounting head 2 and the imaging unit 3 within the XY plane.
  • the head control unit 51 also outputs a vertical control signal to the actuator 22 and controls the actuator 22 to move the catching unit 21 along the Z axis.
  • the head control unit 51 outputs a rotation control signal to the actuator 22 and controls the actuator 22 to rotate the catching unit 21 in the ⁇ direction.
  • the head control unit 51 feedback-controls the driving unit 4 and the actuator 22 based on the captured image of the imaging unit 3 in the capturing operation of capturing the component T20 and the mounting operation of mounting the component T20.
  • the head control unit 51 corrects the capturing position and the mounting position by feedback-controlling the driving unit 4 and the actuator 22 based on the captured image of the imaging unit 3 .
  • the mounting system 1 can improve the capturing accuracy in the capturing operation and the mounting accuracy in the mounting operation.
  • the image acquisition unit 52 has a function of a communication interface for acquiring (receiving) captured image data from the imaging unit 3 .
  • Wireless communication is, for example, Wi-Fi (registered trademark) or wireless communication conforming to standards such as low-power wireless (specified low-power wireless) that does not require a license.
  • Wired communication is wired communication via, for example, a twisted pair cable, a dedicated communication line, or a LAN (Local Area Network) cable.
  • the behavior detection unit 53 obtains a behavior value corresponding to the behavior of the capturing unit 21 during production operation based on the captured image of the imaging unit 3 .
  • the behavior detection unit 53 can detect the behavior of the capture unit 21 in the horizontal direction and the behavior of the capture unit 21 in the vertical direction based on the captured image. Then, the behavior detection unit 53 analyzes the behavior of the trapping unit 21 in the horizontal direction and the behavior of the trapping unit 21 in the vertical direction, thereby obtaining a behavior value corresponding to the behavior.
  • the behavior of the catching portion 21 includes the stroke motion of the catching portion 21 and the behavior of the tip 210 of the catching portion 21 .
  • the behavior of the tip 210 of the catching portion 21 is vibration of the tip 210 of the catching portion 21 .
  • the behavior value of the stroke operation of the catching unit 21 is called a stroke behavior value.
  • Behavior values for the behavior of tip 210 are referred to as vibration behavior values.
  • the stroke motion of the catching part 21 is the motion of moving the catching part 21 in the vertical direction (direction along the Z-axis).
  • the stroke motion of the catcher 21 is included in the production motion.
  • the stroking motion includes a lower stroking motion performed with each of the mounting and catching motions, and an upward stroking motion performed after each of the mounting and catching motions.
  • the lower stroke operation in the mounting operation is the operation of lowering the capturing unit 21 when moving the capturing unit 21 capturing the component T20 so as to approach the substrate T10 (see FIG. 5D).
  • the upward stroke operation after the mounting operation is an operation to raise the catcher 21 after mounting the component T20 on the mounting surface T11 of the substrate T10.
  • the downward stroke operation in the catching operation is an operation of lowering the catching portion 21 when moving the catching portion 21 that does not catch the component T20 so as to approach the component supply port 63a (see FIG. 5A).
  • the upward stroke operation after the catching operation is an operation for raising the catching unit 21 after the component supply device 63 has caught the component T20.
  • the moving distance in the vertical direction of the catching unit 21 that is performing the stroke operation will be referred to as the stroke amount. That is, the stroke amount of the catching portion 21 that is moving downward is the downward movement distance of the catching portion 21 .
  • the stroke amount of the catching portion 21 performing the upward movement is the moving distance of the catching portion 21 in the upward direction.
  • the behavior detection unit 53 creates stroke behavior data indicating changes in the stroke amount over time (changes over time) of the catching unit 21 that is performing the stroke operation, and obtains stroke behavior values based on the stroke behavior data.
  • This stroke behavior value is the amount of change in stroke amount per unit time.
  • the catching part 21 moves in the vertical direction with substantially uniform acceleration. Therefore, the stroke behavior value falls within a predetermined allowable range according to the elapsed time from the stroke start.
  • the catching part 21 moves in the vertical direction at a faster or slower speed than in normal times, or the dispersion of acceleration in the vertical direction becomes larger than in normal times. . Therefore, stroke behavior values occur that fall outside the predetermined tolerance range.
  • the capturing unit 21 may change the acceleration on the way.
  • FIG. 6 shows the downward stroke operation of the catching part 21 when the behavior is normal.
  • FIG. 7 shows the change over time of the stroke amount in the downward stroke operation of the catching unit 21 in normal times.
  • Time t1 is before starting the downward stroke motion.
  • Time t2 is the timing after the unit time ta has passed from time t1.
  • Time t3 is the timing after the unit time ta has passed from time t2.
  • Time t4 is the timing after the unit time ta has passed from time t3.
  • the tip 210 of the catching portion 21 moves (falls) downward from the vertical position P1->P2->P3->P4 as time passes in the order of t1->t2->t3->t4.
  • the stroke behavior value ⁇ P1 between the vertical positions P1-P2 is the difference obtained by subtracting the Z-axis coordinate of P1 from the Z-axis coordinate of P2.
  • the stroke behavior value ⁇ P2 between the vertical positions P2-P3 is the difference obtained by subtracting the Z-axis coordinate of P2 from the Z-axis coordinate of P3.
  • the stroke behavior value ⁇ P3 between the vertical positions P3-P4 is the difference obtained by subtracting the Z-axis coordinate of P3 from the Z-axis coordinate of P4.
  • each of the stroke behavior values ⁇ P1, ⁇ P2, and ⁇ P3 falls within a stroke allowable range (allowable range) determined in advance according to the elapsed time from the start of the stroke.
  • each of the stroke behavior values ⁇ P1, ⁇ P2, and ⁇ P3 falls within a range equal to or lower than the upper limit value of the allowable stroke range and equal to or higher than the lower limit value of the allowable stroke range.
  • the allowable stroke range is set to a predetermined range centered on the design value of the stroke behavior value.
  • FIG. 8 shows the downward stroke operation of the catching part 21 when the behavior is bad.
  • FIG. 9 shows the change over time of the stroke amount in the downward stroke operation of the catching unit 21 in a malfunction.
  • Time t11 is before starting the downward stroke motion.
  • Time t12 is the timing after the unit time ta has passed from time t11.
  • Time t13 is the timing after the unit time ta has passed from time t12.
  • Time t14 is the timing after the unit time ta has passed from time t13.
  • Time t15 is the timing after the unit time ta has passed from time t14.
  • the tip 210 of the catching portion 21 moves (falls) downward from the vertical position P11 ⁇ P12 ⁇ P13 ⁇ P14 ⁇ P15 as time passes from t11 ⁇ t12 ⁇ t13 ⁇ t14 ⁇ t15.
  • the stroke behavior value ⁇ P11 between the vertical positions P11-P12 is the difference obtained by subtracting the Z-axis coordinate of P11 from the Z-axis coordinate of P12.
  • the stroke behavior value ⁇ P12 between the vertical positions P12-P13 is the difference obtained by subtracting the Z-axis coordinate of P12 from the Z-axis coordinate of P13.
  • the stroke behavior value ⁇ P13 between the vertical positions P13-P14 is the difference obtained by subtracting the Z-axis coordinate of P13 from the Z-axis coordinate of P14.
  • the stroke behavior value ⁇ P14 between the vertical positions P14-P15 is the difference obtained by subtracting the Z-axis coordinate of P14 from the Z-axis coordinate of P15.
  • at least one of the behavior values deviates from the stroke allowable range predetermined according to the elapsed time from the start of the stroke.
  • all of the behavior values ⁇ P11, ⁇ P12, ⁇ P13, and ⁇ P14 are out of the allowable stroke range.
  • each of the stroke behavior values ⁇ P11, ⁇ P12, and ⁇ P14 is less than the lower limit value of the allowable stroke range, and the stroke behavior value ⁇ P13 is greater than the upper limit value of the allowable stroke range.
  • the behavior of the tip 210 of the catching portion 21 is vibration of the tip 210 of the catching portion 21 .
  • the mounting head 2 that performs the mounting operation moves closer to the substrate T10 while the catching unit 21 is catching the component T20. Then, as shown in FIG. 5C, the mounting head 2 suddenly decelerates and stops (sudden stop) when the catching portion 21 moves above the substrate T10. Specifically, when the mounting head 2 reaches the target position (head target position) on the XY plane, the head control section 51 stops the driving of the mounting head 2 by the driving section 4 .
  • the head control unit 51 may start the downward stroke operation of the catching unit 21 before the mounting head 2 reaches the head target position, or may start the downward stroke operation of the catching unit 21 after the mounting head 2 reaches the head target position. Stroke motion may be initiated. When stopping, the mounting head 2 may be decelerated at a constant acceleration from the start of deceleration and then stopped.
  • the capturing part 21 attached to the mounting head 2 vibrates due to inertia. Specifically, the distal end 210 swings with the proximal end (upper end) of the catching portion 21 as a fulcrum. This deflection of the tip 210 also affects the operation of the catching portion 21 . Therefore, the behavior detection section 53 detects the amplitude of the vibration of the tip 210 of the catching section 21 before the catching section 21 stops moving.
  • the capturing unit 21 stops moving when it reaches a target position (capturing unit target position) determined by the coordinates of the X-axis, Y-axis, Z-axis, and ⁇ .
  • the behavior detection unit 53 detects the target position of the catching unit immediately before the catching unit 21 performing the downward stroke operation reaches the target position of the catching unit (for example, when it approaches the target position of the catching unit by a predetermined distance).
  • the amplitude of the vibration of the tip 210 is detected during the detection period up to and including .
  • the behavior detection unit 53 takes the amplitude of the vibration of the tip 210 as the vibration behavior value.
  • the vibration behavior value is the instantaneous value of the tip 210 amplitude.
  • the vibration behavior value during normal times falls within a predetermined allowable range.
  • the vibration behavior value during malfunction may deviate from the predetermined allowable range.
  • the catching section 21 that performs the mounting operation reaches the catching section target position
  • the component T20 that is caught by the catching section 21 comes into contact with the mounting surface T11.
  • the tip 210 of the catching portion 21 comes into contact with the component T20. That is, the catching part target position in the mounting operation corresponds to the mounting position, and the catching part target position in the catching operation corresponds to the catching position.
  • FIG. 10A shows the vibration V1 of the tip 210 of the catching portion 21 during normal operation.
  • FIG. 10B shows the change over time of the vibration behavior value W1 due to the vibration V1 during normal operation.
  • the mounting head 2 stops moving in the horizontal direction at time t21, and the component T20 is brought into contact with the mounting surface T11 at time t22 by the lowered catcher 21.
  • the normal vibration behavior value W1 falls within a predetermined vibration allowable range K10.
  • the allowable vibration range K10 is an amplitude range defined by an upper limit value K11 (positive value) and a lower limit value K12 (negative value).
  • FIG. 11A shows the vibration V11 of the tip 210 of the catching part 21 when the behavior is bad.
  • FIG. 11B shows the change over time of the vibration behavior value W11 due to the vibration V11 during malfunction.
  • the mounting head 2 stops moving in the horizontal direction at time t31, and the component T20 is brought into contact with the mounting surface T11 at time t32 by the lowered catcher 21.
  • the vibration behavior value W11 at the time of malfunction may deviate from the vibration allowable range K10.
  • the vibration behavior value W11 is out of the vibration allowable range K10 at times t33 and t34.
  • the behavior determination unit 54 determines whether or not the behavior value is within the allowable range.
  • the behavior determination unit 54 periodically determines whether or not the stroke behavior value falls within the stroke allowable range when the capturing unit 21 starts the stroke motion.
  • the stroke behavior values fall within the allowable stroke range, like the stroke behavior values ⁇ P1, ⁇ P2, and ⁇ P3 in FIGS.
  • stroke behavior values outside the allowable stroke range occur, such as the stroke behavior values ⁇ P11, ⁇ P12, ⁇ P13, and ⁇ P14 in FIGS.
  • the behavior determination unit 54 determines that the behavior of the catching unit 21 is unsatisfactory if a stroke behavior value outside the allowable stroke range is generated. In this case, the cause of the malfunction may be foreign matter caught in the driving portion 4, lack of lubricant, or the like.
  • the behavior determination unit 54 may determine that the behavior of the catching unit 21 is bad when a predetermined number (two or more) of stroke behavior values outside the allowable stroke range occur.
  • the behavior determination unit 54 may determine the behavior of the capture unit 21 based on the average value of the stroke behavior values.
  • the behavior determination unit 54 determines whether or not the vibration behavior value is within the vibration allowable range.
  • the vibration behavior value falls within the vibration allowable range like the vibration behavior value W1 in FIG. 10B.
  • the vibration of the tip 210 of the catching portion 21 during malfunction may deviate from the vibration allowable range K10, as shown by the vibration behavior value W11 in FIG. 11B.
  • the behavior determining unit 54 determines that the behavior of the catching unit 21 is abnormal if a vibration behavior value outside the allowable vibration range is generated. In this case, factors of malfunction include loosening of bolts, wear of parts constituting the actuator 22, and the like.
  • the behavior determination unit 54 may determine that the behavior of the capture unit 21 is abnormal when a predetermined number (2 or more) of vibration behavior values outside the vibration allowable range K10 occur. Further, even if the vibration behavior value is within the vibration allowable range K10, the behavior determination unit 54 determines whether the behavior of the capturing unit 21 is malfunctioning when there is a sign (tendency) that the vibration behavior value deviates from the vibration allowable range K10. It may be determined that there is an omen.
  • the behavior determination unit 54 may determine the behavior of the capture unit 21 based on the average value of the vibration behavior values.
  • the output unit 55 outputs a notification signal indicating that the behavior is unsatisfactory if the behavior value does not fall within the allowable range.
  • the notification signal contains information such as a warning, a comparison result between the behavior value (stroke behavior value and vibration behavior value) and the allowable range (stroke allowable range and vibration allowable range K10), the occurrence of malfunction, and the cause of the malfunction. included.
  • the output unit 55 outputs the notification signal to information terminals such as equipment monitors, personal computers, tablet terminals, and smartphones used by the administrator.
  • the notification signal is a signal containing image information and may further contain audio information.
  • This notification signal is a signal that prompts the administrator to perform maintenance on the mounting system 1 .
  • the administrator sees the image information displayed on the information terminal, grasps the state of malfunction, and performs maintenance of the mounting system 1 . In other words, the administrator can take appropriate measures to return the behavior of the capture unit 21 to the normal behavior.
  • the output unit 55 may output a notification signal to the management system.
  • the management system updates the maintenance scheduler for maintenance of the mounting system 1 based on the notification signal. That is, the management system can take appropriate measures to restore the behavior of the capture unit 21 to the normal behavior.
  • the output unit 55 may output a notification signal notifying that the behavior is normal if the behavior value is within the allowable range.
  • the notification signal includes information indicating that the behavior is normal, information such as a behavior value, and the like.
  • the mounting system 1 determines whether or not the behavior is abnormal based on the captured image of the capture unit 21 during production operation. That is, the mounting system 1 can determine in real time whether or not the behavior is abnormal during the production operation without performing a diagnostic operation or the like that is different from the production operation. Therefore, the mounting system 1 can determine whether or not there is a malfunction in the behavior that greatly affects the mounting accuracy of the product T3 in the production operation for actually producing the product T3, and notify that the behavior is malfunctioning. can. As a result, the mounting system 1 can detect malfunction of the device while suppressing a decrease in productivity.
  • the implementation system 1 can notify the administrator or the management system that the behavior of the capturing unit 21 deviates from the normal behavior (preferred behavior) by notifying that the behavior is unsatisfactory.
  • the term “malfunction” includes not only abnormalities but also poor conditions.
  • the “normal behavior” is a behavior that can maintain the positioning accuracy of the catching portion 21 at a predetermined accuracy or higher.
  • the administrator or management system can take measures to restore the behavior of the capture unit 21 to the normal behavior.
  • the mounting system 1 can suppress the behavior of the capture unit 21 from deviating from the normal behavior, thereby suppressing a decrease in productivity due to malfunction of the device.
  • the maintenance cycle is set to be shorter than the period during which the performance of the mounting system can be ensured so that maintenance can be performed before the deterioration of the performance of the mounting system becomes unacceptable. Therefore, if the operator decides to change the maintenance execution timing, there is a possibility that the performance of the mounting system cannot be maintained.
  • the mounting system 1 can detect signs of malfunction based on the behavior during production operation, and can instruct the implementation of maintenance at the timing necessary for the mounting system 1 .
  • the frequency of maintenance can be reduced while maintaining the performance of the mounting system 1, and the operator's workload is reduced.
  • the mounting method performs a production operation to produce a product T3 in which the component T20 is mounted on the board T10.
  • the implementation method includes an imaging step S1, a behavior detection step S2, a behavior determination step S3, and an output step S4.
  • the image capturing step S1 the image capturing unit 3 captures an image of the capturing unit 21 provided in the mounting head 2 and capable of capturing the component T20 during the production operation.
  • the behavior detection unit 53 obtains a behavior value corresponding to the behavior of the capture unit 21 during the production operation based on the captured image captured at the imaging step S1.
  • the behavior determination unit 54 determines whether or not the behavior value is within the allowable range.
  • the output unit 55 notifies that the behavior is not good if the behavior value is not within the allowable range.
  • the mounting method described above can determine whether or not there is a malfunction in the behavior that greatly affects the mounting accuracy of the product T3 in the production operation for actually producing the product T3, and can notify that the behavior is malfunctioning. .
  • the mounting method can detect malfunction of the apparatus while suppressing a decrease in productivity.
  • the implementation method can suppress the behavior of the capture unit 21 from deviating from the normal behavior by notifying that the behavior is malfunctioning, thereby suppressing the decrease in productivity due to the malfunction of the device.
  • the mounting method can reduce the frequency of maintenance while maintaining the performance of the mounting system 1, thus reducing the workload of the operator. In addition, it is possible to prevent the performance of the mounting system 1 from deteriorating excessively due to delays in maintenance.
  • the stroke behavior value described above may be the position of the tip 210 of the catching portion 21 in the vertical direction.
  • the position of the tip 210 is represented by the stroke amount, which is the moving distance of the catching portion 21 in the vertical direction.
  • the stroke behavior value is the stroke amount.
  • the stroke behavior value falls within a predetermined allowable range according to the elapsed time from the start of the stroke.
  • the catching portion 21 moves in the vertical direction at a faster or slower speed than in the normal state, or the dispersion of the acceleration in the vertical direction becomes larger than in the normal state. or Therefore, stroke behavior values occur that fall outside the predetermined tolerance range.
  • the behavior determination unit 54 periodically determines whether the stroke amount (stroke behavior value) is within the allowable range.
  • the behavior determination unit 54 sets an allowable stroke range K20 for the stroke amount L1, as shown in FIG.
  • the permissible stroke range K20 is predetermined according to the elapsed time from the start of the stroke, and the permissible stroke range is set within a predetermined range (eg ⁇ 10%) around the design value of the stroke amount L1.
  • the behavior determination unit 54 determines that the behavior of the catching unit 21 is not good if the stroke amount L1 is out of the allowable stroke range K20.
  • the behavior determination unit 54 determines that the behavior of the catching unit 21 is normal if the stroke amount L1 that deviates from the allowable stroke range K20 does not occur.
  • FIG. 14 shows a modification of the imaging section 3 .
  • the imaging unit 3 in FIG. 14 includes two moving cameras 3b and 3c.
  • the moving cameras 3b and 3c are so-called stereo cameras arranged side by side along the Y-axis direction. Therefore, the imaging unit 3 can capture the behavior of the capturing unit 21 in the horizontal direction and the behavior of the capturing unit 21 in the vertical direction.
  • the behavior detection unit 53 detects, as stroke motions to be detected, a downward stroke motion performed in each of the mounting motion and the capturing motion, and an upward stroke motion performed after each of the mounting motion and the capturing motion. including.
  • the behavior detection unit 53 detects the behavior of the tip 210 of the catching unit 21 to be detected as the behavior when the catching unit 21 stops above the substrate T10 for the mounting operation, and the behavior when the catching unit 21 stops above the substrate T10 for the catching operation. 21 stops above the parts supply port 63a.
  • the relative positions of the capturing part 21 and the first target object T1 such as the substrate T10 are not limited to the configuration in which they face each other in the vertical direction along the Z-axis. That is, the relative positions of the capturing part 21 and the first target object T1 may be other configurations such as a configuration in which they face each other in the horizontal direction.
  • the mounting system (1) of the first aspect performs a production operation of mounting the second object (T2) on the first object (T1).
  • a mounting system (1) includes a mounting head (2), an imaging section (3), a behavior detection section (53), a behavior determination section (54), and an output section (55).
  • the mounting head (2) has a capturing part (21) capable of capturing the second object (T2).
  • the imaging unit (3) images the capturing unit (21) during production operation.
  • a behavior detector (53) detects behavior values ( ⁇ P1 to ⁇ P3, ⁇ P11 to ⁇ P14, W1, W11, L1 ).
  • a behavior determination unit (54) determines whether or not the behavior values ( ⁇ P1 to ⁇ P3, ⁇ P11 to ⁇ P14, W1, W11, L1) are within allowable ranges (K10, K20). If the behavior values ( ⁇ P1 to ⁇ P3, ⁇ P11 to ⁇ P14, W1, W11, L1) are not within the allowable range (K10, K20), the output section (55) notifies that the behavior is not good.
  • the mounting system (1) described above can detect equipment malfunctions while suppressing productivity declines.
  • the behavior preferably includes a stroke motion of the catching part (21).
  • the mounting system (1) described above can improve the accuracy of the stroke motion.
  • the behavior detection section (53) detects the change in the stroke amount over time of the capturing section (21) performing the stroke motion. Create stroke behavior data to show.
  • the behavior detector (53) preferably obtains behavior values ( ⁇ P1 to ⁇ P3, ⁇ P11 to ⁇ P14, L1) based on the stroke behavior data.
  • the mounting system (1) described above can obtain behavior values ( ⁇ P1 to ⁇ P3, ⁇ P11 to ⁇ P14, L1) corresponding to stroke motion accuracy.
  • the behavior values are changes in stroke amount per unit time (ta). is preferred.
  • the mounting system (1) described above can obtain the behavior values ( ⁇ P1 to ⁇ P3, ⁇ P11 to ⁇ P14) corresponding to the stroke motion.
  • the stroke motion is a motion of moving the catching part (21) in the vertical direction. preferable.
  • the mounting system (1) described above can improve the accuracy of the mounting operation and the capturing operation.
  • the behavior preferably includes the behavior of the tip (210) of the catching part (21) .
  • the mounting system (1) described above can improve the accuracy of production operations that are affected by the behavior of the tip (210) of the catching part (21).
  • the behavior detection unit (53) detects the behavior values (W1, W11) before the capture unit (21) stops moving. It is preferable to ask
  • the mounting system (1) described above can obtain behavior values (W1, W11) corresponding to the behavior of the tip (210).
  • the behavior of the tip (210) of the catching part (21) is the vibration (V1, V11) of the tip (210) is preferably
  • the mounting system (1) described above can improve the accuracy of production operations affected by the vibration of the tip (210) of the catch (21).
  • the behavior values (W1, W11) are preferably the amplitudes of the vibrations (V1, V11).
  • the mounting system (1) described above can obtain behavior values (W1, W11) corresponding to the behavior of the tip (210) of the catching part (21).
  • the imaging unit (3) controls the behavior of the capturing unit (21) in the horizontal direction and the behavior in the vertical direction. It is preferable that the behavior of the capture section (21) in the direction can be imaged.
  • the mounting system (1) described above can accurately detect the behavior of the capture unit (21).
  • the capture unit (21) moves in the vertical direction, and the imaging direction of the imaging unit (3) intersects the vertical direction. is preferred.
  • the mounting system (1) described above can accurately detect the behavior of the capture unit (21).
  • the imaging unit (3) can move in synchronization with the mounting head (2). preferable.
  • the implementation system (1) described above can easily detect the behavior of the capture unit (21).
  • the mounting system (1) of the thirteenth aspect according to the embodiment, in the twelfth aspect, further comprises a head unit (23) to which the capturing section (21) and the imaging section (3) are attached.
  • the implementation system (1) described above can easily detect the behavior of the capture unit (21).
  • the mounting method of the fourteenth aspect performs the production operation of mounting the second target (T2) on the first target (T1).
  • the implementation method includes an imaging step (S1), a behavior detection step (S2), a behavior determination step (S3), and an output step (S4).
  • the image capturing step (S1) captures an image of a capture unit (21) provided in the mounting head (2) and capable of capturing a second object (T2) during production operation.
  • behavior detection step (S2) behavior values ( ⁇ P1 to ⁇ P3, ⁇ P11 to ⁇ P14, W1, W11, L1) are obtained.
  • the behavior determination step (S3) determines whether the behavior values ( ⁇ P1 to ⁇ P3, ⁇ P11 to ⁇ P14, W1, W11, L1) are within the allowable range (K10, K20). If the behavior values ( ⁇ P1 to ⁇ P3, ⁇ P11 to ⁇ P14, W1, W11, L1) are not within the allowable range (K10, K20), the output step (S4) notifies that the behavior is bad.
  • the implementation method described above can detect equipment malfunctions while suppressing productivity declines.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

La présente divulgation aborde le problème de la fourniture d'un système de montage et d'un procédé de montage qui permettent de détecter un dysfonctionnement d'un dispositif tout en supprimant la détérioration de la productivité. Un système de montage (1) effectue une opération de production pour monter un second objet (T2) sur un premier objet (T1). Une unité de détection de comportement (53) obtient une valeur de comportement correspondant au comportement d'une unité de capture (21) pendant l'opération de production sur la base d'une image capturée par une unité de capture d'image (3). Une unité de détermination de comportement (54) détermine si la valeur de comportement tombe ou non dans une plage admissible. Une unité de sortie (55) notifie que le comportement présente une condition anormale si la valeur de comportement ne se situe pas dans la plage admissible.
PCT/JP2023/003702 2022-02-08 2023-02-06 Système de montage et procédé de montage WO2023153341A1 (fr)

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CN202380012591.1A CN117598038A (zh) 2022-02-08 2023-02-06 安装系统以及安装方法

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JP2022018237 2022-02-08

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008098411A (ja) * 2006-10-12 2008-04-24 Juki Corp 装着部品検査方法
JP2010010463A (ja) * 2008-06-27 2010-01-14 Juki Corp 電子部品実装装置
JP2019169678A (ja) * 2018-03-26 2019-10-03 パナソニックＩｐマネジメント株式会社 実装ヘッド及び部品実装装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008098411A (ja) * 2006-10-12 2008-04-24 Juki Corp 装着部品検査方法
JP2010010463A (ja) * 2008-06-27 2010-01-14 Juki Corp 電子部品実装装置
JP2019169678A (ja) * 2018-03-26 2019-10-03 パナソニックＩｐマネジメント株式会社 実装ヘッド及び部品実装装置

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