WO2021205980A1 - Système de montage, procédé de montage, et programme - Google Patents

Système de montage, procédé de montage, et programme Download PDF

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Publication number
WO2021205980A1
WO2021205980A1 PCT/JP2021/014166 JP2021014166W WO2021205980A1 WO 2021205980 A1 WO2021205980 A1 WO 2021205980A1 JP 2021014166 W JP2021014166 W JP 2021014166W WO 2021205980 A1 WO2021205980 A1 WO 2021205980A1
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WIPO (PCT)
Prior art keywords
imaging device
mounting
imaging
axis
image
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PCT/JP2021/014166
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English (en)
Japanese (ja)
Inventor
晋平 杉野
永井　大介
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パナソニックＩｐマネジメント株式会社
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Priority to JP2022514442A priority Critical patent/JPWO2021205980A1/ja
Publication of WO2021205980A1 publication Critical patent/WO2021205980A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • This disclosure generally relates to mounting systems, mounting methods and programs. More specifically, the present disclosure relates to a mounting system, mounting method and program for mounting a first object on a second object.
  • Patent Document 1 describes an electronic component mounting device that mounts an electronic component on a substrate conveyed to a predetermined position with a mounting head.
  • an electronic component mounted on a substrate is imaged by a detection camera, and a mounting deviation of the electronic component from a predetermined mounting position is detected based on the imaging result. Then, when the electronic component is mounted on the next substrate transported to the predetermined position, the mounting position of the electronic component is corrected based on the detection result.
  • An object of the present disclosure is to provide a mounting system, a mounting method, and a program capable of improving the productivity of a second object on which the first object is mounted.
  • the mounting system is a mounting system that mounts the first object on the mounting surface of the second object.
  • the mounting system includes a mounting head, a first imaging device, a second imaging device, and a driving device.
  • the mounting head has a catching portion for catching the first object.
  • the first imaging apparatus includes a specific region held by the mounting head and facing the capturing unit in a direction perpendicular to the mounting surface in the first imaging field of view.
  • the second imaging device is held by the mounting head, images are taken from a direction different from that of the first imaging device on a specific plane parallel to the mounting surface, and the specific region is included in the second imaging field of view.
  • the drive device moves the mounting head along a first axis and a second axis that are orthogonal to each other in the specific plane.
  • the mounting method is a mounting method used in a mounting system in which the first object is mounted on the mounting surface of the second object.
  • the mounting system includes a mounting head, a first imaging device, a second imaging device, and a driving device.
  • the mounting head has a catching portion for catching the first object.
  • the first imaging apparatus includes a specific region held by the mounting head and facing the capturing unit in a direction perpendicular to the mounting surface in the first imaging field of view.
  • the second imaging device is held by the mounting head, images are taken from a direction different from that of the first imaging device on a specific plane parallel to the mounting surface, and the specific region is included in the second imaging field of view.
  • the drive device moves the mounting head along a first axis and a second axis that are orthogonal to each other in the specific plane.
  • the mounting method includes an imaging step and a moving step.
  • the imaging step is a step of imaging the specific region by the first imaging device and the second imaging device.
  • the moving step is a step of moving the mounting head by the driving device.
  • the program according to one aspect of the present disclosure is a program for causing one or more processors to execute the implementation method.
  • FIG. 1 is a schematic perspective view of a mounting system according to an embodiment.
  • FIG. 2 is a block diagram of the same mounting system.
  • FIG. 3 is a plan view schematically showing the mounting head of the mounting system of the same.
  • FIG. 4 is a schematic side view of the mounting head in FIG. 3 as viewed from the A1 direction with respect to the mounting system of the same.
  • FIG. 5 is a schematic side view of the mounting head of the same mounting system as viewed from the A2 direction in FIG.
  • FIG. 6 is a schematic view showing an example of a first image captured by the first imaging device of the same mounting system.
  • FIG. 7 is a schematic view showing another example of the first image captured by the first imaging device of the same mounting system.
  • FIG. 1 is a schematic perspective view of a mounting system according to an embodiment.
  • FIG. 2 is a block diagram of the same mounting system.
  • FIG. 3 is a plan view schematically showing the mounting head of the mounting system of the same.
  • FIG. 4 is
  • FIG. 8 is a schematic view showing an example of a second image captured by the second imaging device of the same mounting system.
  • FIG. 9 is a schematic view showing another example of the second image captured by the second imaging device of the same mounting system.
  • FIG. 10 is a schematic side view showing a main part of the same mounting system in the first state.
  • FIG. 11 is a schematic view showing an example of a second image captured by the second imaging device in the first state of the mounting system of the same.
  • FIG. 12 is a schematic side view showing a main part of the same mounting system in the second state.
  • FIG. 13 is a schematic view showing an example of a second image captured by the second imaging device in the second state of the mounting system of the same.
  • FIG. 14 is a schematic side view showing a main part in the third state of the mounting system of the same.
  • FIG. 15 is a schematic view showing an example of a second image captured by the second imaging device in the third state of the mounting system of the same.
  • FIG. 16 is a schematic side view showing a main part of the same mounting system in the fourth state.
  • FIG. 17 is a schematic view showing an example of a second image captured by the second imaging device in the fourth state of the mounting system of the same.
  • FIG. 18 is a flowchart showing an operation example of the same mounting system.
  • FIG. 19 is a schematic side view showing a main part of the mounting system according to the first modification of the embodiment.
  • FIG. 20 is a schematic view showing an example of a first image captured by the first imaging device of the same mounting system.
  • FIG. 21 is a block diagram of the mounting system according to the second modification of the embodiment.
  • each of the figures described in the following embodiments and the like is a schematic view, and the ratio of the size and the thickness of each component in each figure does not necessarily reflect the actual dimensional ratio. Not always.
  • the mounting system 1 is a mounting device (mounting machine) for mounting the first object T1 captured by the capturing unit 111 on the second object T2.
  • the mounting system 1 is used for the production of various products such as electronic devices, automobiles, clothing, foodstuffs, pharmaceuticals and crafts in facilities such as factories, laboratories, offices and educational facilities. Be done.
  • a general electronic device has various circuit blocks such as a power supply circuit and a control circuit, for example.
  • a soldering step, a mounting step, and a soldering step are performed in this order.
  • creamy solder is applied (or printed) to the substrate (including the printed wiring board).
  • components including electronic components
  • the soldering step for example, the cream-like solder is melted and soldered by heating the substrate in which the parts are mounted in a reflow furnace.
  • the mounting system 1 performs a work of mounting a component of the first object T1 on a substrate of the second object T2.
  • the mounting system 1 used for mounting the first object T1 (component) on the second object T2 (board) captures the first object T1 as shown in FIG.
  • a mounting head 11 having a portion 111 is provided.
  • the capturing unit 111 is composed of a suction nozzle as an example, and captures (holds) a component that is the first object T1 in a state in which it can be released (that is, the capture is released).
  • the capturing unit 111 is lowered so as to approach the second object T2, and the first object T1 is moved to the second object T2. It is mounted on the mounting surface T21.
  • the mounting system 1 when mounting the first object T1 on the mounting surface T21 of the second object T2, recognition of a specific region R1 (see FIG. 4) which is a mounting position on the mounting surface T21, etc. For the purpose, it is required to image the specific region R1. Therefore, the mounting system 1 according to the present embodiment includes the first imaging device 12 and the second imaging device 13 in addition to the mounting head 11. As a result, the mounting system 1 images the specific region R1 of the mounting surface T21 with the first imaging device 12 and the second imaging device 13, and for example, immediately before and / or immediately before mounting the first object T1 by the mounting head 11. Immediately after that, it becomes possible to confirm the state of the first object T1 and / or the second object T2 with an image. Therefore, in the present embodiment, each of the first imaging device 12 and the second imaging device 13 is configured to be capable of imaging at least a region of the mounting surface T21 immediately below the capturing unit 111.
  • the mounting system 1 is a mounting system 1 that mounts the first object T1 on the mounting surface T21 of the second object T2.
  • the mounting system 1 includes a mounting head 11, a first imaging device 12, a second imaging device 13, and a driving device 15.
  • the mounting head 11 has a capturing unit 111 that captures the first object T1.
  • the first imaging device 12 is fixed (held) to the mounting head 11 and has a specific region R1 (see FIG. 4) facing the capturing unit 111 in a direction perpendicular to the mounting surface T21 in the first imaging field of view R11 (see FIG. 4). Included in.
  • the second imaging device 13 is fixed (held) to the mounting head 11 and takes an image from a direction different from that of the first imaging device 12 on a specific plane (for example, an XY plane) parallel to the mounting surface T21. (See FIG. 5) is included in the second imaging field R12 (see FIG. 5).
  • the drive device 15 moves the mounting head 11 along the first axis 101 and the second axis 102 (see FIG. 3) that are orthogonal to each other in a specific plane.
  • the first imaging device 12 and the second imaging device 13 image the specific region R1 from different directions. Therefore, unlike the electronic component mounting device described in Patent Document 1 described above, it is not necessary to move the first imaging device 12 and the second imaging device 13 directly above the first object T1, and the mounting head 11 is moved. The amount is small and the working time can be shortened. As a result, the productivity of the second object T2 on which the first object T1 is mounted can be improved.
  • the mounting system 1 is used for mounting a component (first object T1) by surface mount technology (SMT)
  • the component as the first object T1 is a surface mount device (SMD), and is mounted by being arranged on the surface (mounting surface) of the substrate as the second object T2.
  • SMT surface mount technology
  • the present invention is not limited to this example, and the mounting system 1 may be used for mounting a component (first object T1) by an insertion mounting technology (IMT: Insertion Mount Technology).
  • the component as the first object T1 is a component for insertion mounting having a lead terminal, and by inserting the lead terminal into the hole of the substrate as the second object T2, the substrate (second object) It is mounted on the surface (mounting surface) of the object T2).
  • the "imaging optical axis" referred to in the present disclosure is an optical axis for an image captured by the first imaging device 12 and the second imaging device 13, and is a respective optical axis of the first imaging device 12 and the second imaging device 13 described later. It is an optical axis determined by both the image pickup elements 121 and 131 (see FIG. 2) and the optical systems 122 and 132 (see FIG. 2). That is, the optical path through which the light from the center of the image captured by the first imaging device 12 and the second imaging device 13 passes is the first imaging optical axis Ax1 (see FIG. 4) and the second imaging device of the first imaging device 12. It becomes the second imaging optical axis Ax2 (see FIG. 5) of 13.
  • the first straight line connects the center of the light-receiving surface of the image sensors 121 and 131 and the portion of the subject that is imaged at the center of the light-receiving surface of the image sensors 121 and 131 through the optical systems 122 and 132. It becomes the first image pickup optical axis Ax1 of the image pickup apparatus 12 and the second image pickup optical axis Ax2 of the second image pickup apparatus 13.
  • the "image” referred to in the present disclosure is an image captured by each of the first imaging device 12 and the second imaging device 13, and includes a still image (still image) and a moving image (moving image). Further, the "moving image” includes an image composed of a plurality of still images obtained by time-lapse photography or the like.
  • the image does not have to be the data itself output from each of the first imaging device 12 and the second imaging device 13.
  • the image is appropriately compressed as necessary, converted to another data format, or processed to cut out a part from the images taken by each of the first imaging device 12 and the second imaging device 13, and the focus adjustment. , Brightness adjustment, contrast adjustment, etc. may be performed.
  • the image is a full-color still image.
  • the image may be monochrome (black and white).
  • orthogonal means not only a state in which the angle between the two parties is exactly 90 degrees, but also a state in which the angle between the two parties is substantially orthogonal within a tolerance range in which an effect can be substantially obtained. It means to include.
  • parallel in the present disclosure, not only the angle between the two is exactly 0 degrees, but also the angle between the two is substantially parallel within the range of the tolerance at which the effect can be substantially obtained. It is a meaning that includes the state of doing.
  • the axes parallel to the surface of the substrate (mounting surface T21), which is the second object T2 are the "X-axis” and "Y".
  • the "axis” is defined as the axis parallel to the thickness direction of the substrate, and the "Z" axis is defined as the axis.
  • the "X-axis” is an axis along the direction in which a plurality of capturing portions 111, which will be described later, are arranged.
  • the capture portion 111 side as seen from the substrate, which is the second object T2 is defined as the positive direction of the Z axis (also referred to as “upward”). Further, the state viewed from the positive direction (upper side) of the Z axis is also referred to as "planar view” below.
  • the X-axis, Y-axis, and Z-axis are all virtual axes, and the arrows indicating "X", "Y", and “Z” in the drawings are shown for explanation only. , Neither is accompanied by substance. Further, these directions are not intended to limit the directions when the mounting system 1 is used.
  • a pipe for circulating cooling water, a cable for supplying electric power, a pipe for supplying pneumatic pressure (including positive pressure and vacuum), and the like are connected to the mounting system 1, but in the present embodiment, these are connected.
  • the illustration will be omitted as appropriate.
  • the mounting system 1 includes a mounting head 11, a first imaging device 12, a second imaging device 13, a control device 14, a driving device 15, and parts.
  • a supply device 16, a transfer device 17, a backup device 18, and a lighting device 19 are provided.
  • the control device 14, the component supply device 16, the transfer device 17, the backup device 18, and the lighting device 19 are not essential configurations for the mounting system 1. That is, at least one of the control device 14, the component supply device 16, the transfer device 17, the backup device 18, and the lighting device 19 does not have to be included in the components of the mounting system 1.
  • FIG. 1 only the mounting head 11 and the driving device 15 are shown, and the other configurations of the mounting system 1 are not shown as appropriate.
  • the mounting head 11 has at least one capturing unit 111.
  • the mounting head 11 has a plurality of (16 as an example) capturing portions 111.
  • the mounting head 11 moves the capturing unit 111 closer to the second object T2 (board) while the first object T1 (part) is captured by the capturing unit 111, and moves the first object T1 to the first object T1. 2 It is mounted on the mounting surface T21 of the object T2.
  • the mounting head 11 moves the capturing unit 111 between the first position closer to the second object T2 and the second position farther from the second object T2 than the first position. Hold as possible. That is, the mounting head 11 holds the capturing unit 111 so as to be movable toward the second object T2.
  • the mounting head 11 in addition to the capturing unit 111, the mounting head 11 further includes an actuator 112 (see FIG. 2) for moving the capturing unit 111, and a head body 113 for holding the capturing unit 111 and the actuator 112. Have.
  • an actuator 112 for moving the capturing unit 111
  • a head body 113 for holding the capturing unit 111 and the actuator 112.
  • a plurality of capture units 111 and actuators 112 (16 as an example) are held in one head body 113.
  • the mounting head 11 can simultaneously capture a plurality of (16 in this case) first objects T1 (parts).
  • the capture unit 111 is, for example, a suction nozzle.
  • the capture unit 111 is controlled by the control device 14 and can switch between a capture state in which the first object T1 is captured (held) and a release state in which the first object T1 is released (released from capture). ..
  • the capturing unit 111 is not limited to the suction nozzle, and may be configured to capture (hold) the first object T1 by sandwiching (picking) it, for example, like a robot hand.
  • the mounting head 11 operates by receiving the supply of air pressure (vacuum) as power. That is, the mounting head 11 switches between the capture state and the release state of the capture unit 111 by opening and closing the valve on the air pressure (vacuum) supply path connected to the capture unit 111.
  • the actuator 112 moves the capturing unit 111 straight in the Z-axis direction. Further, the actuator 112 rotationally moves the capturing unit 111 in the rotational direction (hereinafter, referred to as “ ⁇ direction”) about the axis along the Z-axis direction.
  • the actuator 112 is driven by the driving force generated by the linear motor with respect to the movement of the capturing unit 111 in the Z-axis direction.
  • the actuator 112 is driven by the driving force generated by the rotary motor.
  • the mounting head 11 is moved straight in the X-axis direction and the Y-axis direction by the drive device 15.
  • the capturing unit 111 included in the mounting head 11 can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction, and the ⁇ direction by the drive device 15 and the actuator 112.
  • the drive device 15 is the first drive device and the actuator 112 is the second drive device.
  • the mounting head 11 further includes a second drive device (actuator 112).
  • the second drive device is different from the first drive device as the drive device 15, and the third direction D3 (see FIG. 4) orthogonal to both the first direction D1 (see FIG. 3) and the second direction D2 (see FIG. 3).
  • the first direction D1 is the direction along the Y axis (Y axis direction)
  • the second direction D2 is the direction along the X axis (X axis direction). Therefore, in the present embodiment, the third direction D3 is a direction along the Z axis (Z axis direction).
  • the plurality of capturing portions 111 included in the mounting head 11 move together.
  • the plurality of capturing portions 111 included in the mounting head 11 move individually. Further, the plurality of capture units 111 included in the mounting head 11 can individually switch between the capture state and the release state.
  • the head body 113 is made of metal and is formed in a rectangular parallelepiped shape long in the X-axis direction.
  • the head body 113 holds the capturing unit 111 and the actuator 112.
  • the capturing unit 111 is indirectly held by the head body 113 via the actuator 112 in a state where it can move in the Z-axis direction and the ⁇ direction.
  • the mounting head 11 moves in the XY plane when the head body 113 is moved in the XY plane by the drive device 15.
  • the mounting head 11 moves the capture unit 111 so as to approach the second object T2 (board) in a state where the capture unit 111 captures the first object T1 (part).
  • the first object T1 can be mounted on the mounting surface T21 of the second object T2. That is, the mounting head 11 has the capturing unit 111 at least between the first position closer to the second object T2 and the second position farther from the second object T2 than the first position. Move it.
  • the mounting head 11 moves the capturing unit 111 in the state of capturing the first object T1 from the second position to the first position to move the first object T1 to the mounting surface T21 of the second object T2.
  • the mounting system 1 includes two imaging devices (first imaging device 12 and second imaging device 13).
  • the first imaging device 12 and the second imaging device 13 are fixed (held) to the mounting head 11.
  • the first image pickup device 12 includes an image pickup element 121 and an optical system 122.
  • the second image pickup device 13 includes an image pickup element 131 and an optical system 132.
  • Each of the first imaging device 12 and the second imaging device 13 is, for example, a camera that captures a moving image.
  • each of the first imaging device 12 and the second imaging device 13 has a specific region R1 (see FIGS. 4 and 5) of the mounting surface T21 of the second object T2 (board) facing the capturing portion 111. ) Is included in the imaging field of view (first imaging field of view R11 and second imaging field of view R12).
  • Each of the image sensors 121 and 131 is an image sensor such as a CCD (Charge Coupled Devices) or a CMOS (Complementary Metal-Oxide Semiconductor).
  • Each of the image pickup elements 121 and 131 converts the image formed on the light receiving surface into an electric signal and outputs the image.
  • Each of the optical systems 122 and 132 includes one or more lenses, mirrors, and the like.
  • each of the optical systems 122 and 132 is realized by a combination of a plurality of lenses (lens group).
  • Each of the optical systems 122 and 132 forms an image of light from the imaging field of view (first imaging field of view R11 or second imaging field of view R12) on the light receiving surfaces of the image pickup elements 121 and 131.
  • the first imaging device 12 is fixed to the mounting head 11 by being held by the head body 113 of the mounting head 11.
  • the second imaging device 13 is also fixed to the mounting head 11 by being held by the head body 113 of the mounting head 11.
  • each of the first imaging device 12 and the second imaging device 13 is fixed to the lower surface of the head body 113, that is, the surface of the head body 113 facing the second object T2, thereby being fixed to the head body 113. It is being held.
  • the capturing unit 111 is arranged on the lower surface of the head body 113, the first imaging device 12 and the second imaging device 13 are arranged on the side of the capturing unit 111 in a plan view (). (See FIG. 3). The arrangement of the first imaging device 12 and the second imaging device 13 will be described in the column of "(3) Arrangement of imaging devices".
  • the drive device 15 is a device for moving the mounting head 11.
  • the drive device 15 moves the mounting head 11 in the XY plane.
  • the "XY plane” referred to here is a plane including the X-axis and the Y-axis, and is a plane orthogonal to the Z-axis.
  • the drive device 15 moves the mounting head 11 in the X-axis direction and the Y-axis direction.
  • the driving device 15 since the first imaging device 12 and the second imaging device 13 are fixed to the mounting head 11, the driving device 15 also attaches X to the first imaging device 12 and the second imaging device 13 together with the mounting head 11. Move in the axial direction and the Y-axis direction. In other words, the drive device 15 moves the mounting head 11, the first image pickup device 12, and the second image pickup device 13 in the XY plane.
  • the XY plane including the X-axis and the Y-axis is a specific plane. That is, the specific plane is a plane parallel to the mounting surface T21 of the second object T2. Therefore, in the present embodiment, of the X-axis and the Y-axis orthogonal to each other on the specific plane, the X-axis is the first axis 101 and the Y-axis is the second axis 102. Then, the drive device 15 moves the mounting head 11 along the first axis 101 and the second axis 102 that are orthogonal to each other in the specific plane (XY plane).
  • the drive device 15 includes an X-axis drive unit 151 and a Y-axis drive unit 152.
  • the X-axis drive unit 151 moves the mounting head 11 linearly in the X-axis direction.
  • the Y-axis drive unit 152 moves the mounting head 11 straight in the Y-axis direction.
  • the Y-axis drive unit 152 moves the mounting head 11 together with the X-axis drive unit 151 along the Y-axis to move the mounting head 11 straight in the Y-axis direction.
  • each of the X-axis drive unit 151 and the Y-axis drive unit 152 includes a linear motor, and the mounting head 11 is moved by a driving force generated by the linear motor in response to power supply.
  • the control device 14 controls each part of the mounting system 1.
  • the control device 14 mainly comprises a computer system having one or more processors and one or more memories. That is, the function of the control device 14 (including the conversion unit 141) is realized by executing the program recorded in one or more memories of the computer system by one or more processors.
  • the program may be pre-recorded in a memory, provided through a telecommunication line such as the Internet, or may be recorded and provided on a non-temporary recording medium such as a memory card.
  • the control device 14 is electrically connected to, for example, each of the mounting head 11, the first image pickup device 12, the second image pickup device 13, the drive device 15, the component supply device 16, the transfer device 17, the backup device 18, and the lighting device 19. Has been done.
  • the control device 14 outputs a control signal to the mounting head 11 and the driving device 15, and mounts the first object T1 captured by at least the capturing unit 111 on the mounting surface T21 of the second object T2. 11 and the drive device 15 are controlled.
  • control device 14 outputs a control signal to the first imaging device 12, the second imaging device 13, and the lighting device 19 to control the first imaging device 12, the second imaging device 13, and the lighting device 19, or the first
  • the image captured by the 1 imaging device 12 and the 2nd imaging device 13 is acquired from the 1st imaging device 12 and the 2nd imaging device 13.
  • the control device 14 has a conversion unit 141.
  • the conversion unit 141 converts the movement amount of the specific point P1 into a first movement amount in the direction along the first axis 101 and a second movement amount in the direction along the second axis 102.
  • the specific point P1 is a mounting surface of the second object T2 in each of the first image Im1 (see FIG. 6) and the second image Im2 (see FIG. 8) imaged by the first image pickup device 12 and the second image pickup device 13. It is an index which shows the position of the capturing part 111 on T21.
  • the specific point P1 moves along the third axis 103 (see FIG. 3).
  • the third axis 103 is a virtual axis different from the first axis 101 and the second axis 102 in the specific plane (XY plane). Then, the conversion unit 141 converts the movement amount of the specific point P1 into the first movement amount and the second movement amount so that the specific point P1 moves along the third axis 103.
  • the first movement amount is the movement amount in the direction along the X axis
  • the second movement amount is the movement amount in the direction along the Y axis.
  • control device 14 controls the drive device 15 so that the specific point P1 in each of the first image Im1 and the second image Im2 moves relatively toward the target position P2 (see FIG. 6).
  • the target position P2 is the mounting position of the first object T1 on the mounting surface T21 of the second object T2. That is, the control device 14 controls the drive device 15 so that the mounting head 11 moves to a position where the specific point P1 and the target position P2 overlap. In this case, the control device 14 individually determines the amount of deviation of the specific point P1 with respect to the target position P2 for each of the first image Im1 and the second image Im2.
  • the control device 14 obtains the second deviation amount ⁇ X (see FIG. 6), which is the deviation amount of the specific point P1 with respect to the target position P2 in the X-axis (first axis 101) direction, for the first image Im1.
  • the drive device 15 is controlled so that the second deviation amount ⁇ X becomes zero.
  • the mounting head 11 has the first axis 101 (X) based on the deviation amount ⁇ X of the specific point P1 with respect to the target position P2 in the second direction D2 (X-axis direction) included in the first image Im1.
  • the drive device 15 is controlled so as to move along the axis).
  • the control device 14 obtains the first deviation amount ⁇ Y (see FIG. 8), which is the deviation amount of the specific point P1 with respect to the target position P2 in the Y-axis (second axis 102) direction, with respect to the second image Im2.
  • the drive device 15 is controlled so that the deviation amount ⁇ Y becomes zero.
  • the mounting head 11 has the second axis 102 (Y) based on the deviation amount ⁇ Y of the specific point P1 with respect to the target position P2 in the first direction D1 (Y-axis direction) included in the second image Im2.
  • the drive device 15 is controlled so as to move along the axis).
  • control device 14 has a third deviation amount ⁇ Z (FIG. 9) which is an deviation amount of the specific point P1 with respect to the target position P2 in the third direction D3 when at least the first deviation amount ⁇ Y is within the first specific range. Based on (see), the actuator 112 is controlled so that the specific point P1 moves relatively toward the target position P2. Further, the control device 14 has a third deviation amount ⁇ Z (FIG. 7), which is an deviation amount of the specific point P1 with respect to the target position P2 in the third direction D3 when at least the second deviation amount ⁇ X is within the second specific range. Based on (see), the actuator 112 is controlled so that the specific point P1 moves relatively toward the target position P2.
  • the first specific range is a range in which the mounting position of the first object T1 in the first direction D1 can be regarded as a normal mounting position, for example, a range of ⁇ 0.025 mm ( ⁇ 25 ⁇ m).
  • the second specific range is a range in which the mounting position of the first object T1 in the second direction D2 can be regarded as a regular mounting position, for example, a range of ⁇ 0.025 mm ( ⁇ 25 ⁇ m).
  • the parts supply device 16 supplies parts as the first object T1 captured by the capture unit 111 of the mounting head 11.
  • the component supply device 16 has a tape feeder that supplies components housed in a carrier tape.
  • the component supply device 16 may have a tray on which a plurality of components are placed, or may have both a tape feeder and a tray.
  • the component supply device 16 may have a bulk feeder.
  • the mounting head 11 captures the first object T1 (component) from such a component supply device 16 by the capturing unit 111.
  • the transport device 17 is a device that transports a substrate as a second object T2.
  • the transfer device 17 is realized by, for example, a belt conveyor or the like.
  • the transport device 17 transports the second object T2 (board) along, for example, the X-axis.
  • the transport device 17 transports the second object T2 at least below the mounting head 11, that is, in the mounting space facing the capturing unit 111 in the Z-axis direction. Then, the transfer device 17 stops the second object T2 in the mounting space until the mounting of the first object T1 (component) on the second object T2 (board) by the mounting head 11 is completed.
  • the backup device 18 backs up the substrate as the second object T2 transported to the mounting space by the transfer device 17. That is, the second object T2 (board) transported to the mounting space by the transport device 17 is held in the mounting space by the backup device 18. The backup device 18 backs up the second object T2 in the mounting space at least until the mounting of the first object T1 (component) on the second object T2 (board) by the mounting head 11 is completed.
  • the illumination device 19 illuminates the first imaging field of view R11 of the first imaging device 12 and the second imaging field of view R12 of the second imaging device 13.
  • the lighting device 19 may illuminate the first imaging field R11 and the second imaging field R12 at least at the timing when the first imaging device 12 and the second imaging device 13 take images.
  • the first imaging device 12 and the second imaging device 12 and the second imaging device 19 may be illuminated. Light is emitted according to the imaging timing of the device 13.
  • the lighting device 19 since the images captured by the first imaging device 12 and the second imaging device 13 are full-color moving images, the lighting device 19 outputs light in the wavelength range of the visible light region such as white light. ..
  • the lighting device 19 has a plurality of light sources such as LEDs (Light Emitting Diodes). The lighting device 19 illuminates the first imaging field of view R11 of the first imaging device 12 and the second imaging field of view R12 of the second imaging device 13 by causing the plurality of light sources to emit light.
  • the lighting device 19 is realized by an appropriate lighting method such as ring lighting or coaxial epi-illumination.
  • the lighting device 19 is fixed to the mounting head 11 together with the first imaging device 12 and the second imaging device 13, for example.
  • the mounting system 1 also includes, for example, a communication unit and the like.
  • the communication unit is configured to communicate with the host system directly or indirectly via a network or a repeater or the like. As a result, the mounting system 1 can exchange data with and from the host system.
  • FIG. 3 is a plan view schematically showing the mounting head 11 of the mounting system 1 according to the present embodiment.
  • FIG. 4 is a schematic side view of the mounting head 11 as viewed from the A1 direction in FIG.
  • FIG. 5 is a schematic side view of the mounting head 11 as viewed from the A2 direction in FIG.
  • the first axis 101 (X axis), the second axis 102 (Y axis), and the third axis 103 shown in FIG. 3 are all virtual axes, and the first axis 101 and the second axis in the drawing are the second.
  • the arrows indicating the axis 102 and the third axis 103 are shown only for the sake of explanation, and neither of them is accompanied by an entity. Further, these directions are not intended to limit the directions when the mounting system 1 is used. Further, in FIGS. 3 to 5, only one of the plurality of capture units 111 is illustrated in order to simplify the illustration.
  • the capturing unit 111 and the first imaging device 12 are arranged along the Y axis (second axis 102), and the capturing unit 111 and the second imaging device 12 are arranged side by side.
  • the device 13 and the device 13 are arranged along the X axis (first axis 101). That is, in the mounting system 1 according to the present embodiment, the first imaging device 12 and the second imaging device 13 are arranged so as to image the specific region R1 (see FIGS. 4 and 5) from different directions.
  • the first imaging device 12 images the specific region R1 from the first direction D1 orthogonal to the X axis (first axis 101), and the second imaging device 13 images the Y axis (second axis 102).
  • the specific region R1 is imaged from the second direction D2 orthogonal to.
  • the imaging direction of the first imaging device 12 on the specific plane is the first direction D1 orthogonal to the first axis 101, as shown in FIG.
  • the imaging direction of the second imaging device 13 on the specific plane is the second direction D2 orthogonal to the second axis 102.
  • the first imaging optical axis Ax1 of the first imaging device 12 and the second imaging optical axis Ax2 of the second imaging device 13 are perpendicular to the mounting surface T21 of the second object T2 in a plan view. It is orthogonal to each other (when viewed from any direction).
  • the first imaging device 12 has a specific region R1 of the mounting surface T21 of the second object T2 facing the capturing unit 111 in the direction perpendicular to the mounting surface T21 (vertical direction in FIG. 4).
  • the first imaging field of view R11 is set to include. Further, the first imaging optical axis Ax1 of the first imaging device 12 is inclined with respect to the perpendicular line N1 of the mounting surface T21. That is, the first imaging optical axis Ax1 of the first imaging device 12 is directed to the specific region R1. Therefore, according to the first imaging device 12, the first image Im1 (see FIGS. 6 and 7) including the specific region R1 can be imaged.
  • the second imaging device 13 faces the capturing unit 111 in the direction perpendicular to the mounting surface T21 (vertical direction in FIG. 5) of the mounting surface T21 of the second object T2.
  • the second imaging field of view R12 is set so as to include the specific region R1.
  • the second imaging optical axis Ax2 of the second imaging device 13 is inclined with respect to the perpendicular line N1 of the mounting surface T21. That is, the second imaging optical axis Ax2 of the second imaging device 13 is directed to the specific region R1. Therefore, according to the second imaging device 13, the second image Im2 (see FIGS. 8 and 9) including the specific region R1 can be imaged.
  • FIGS. 6 and 7 are schematic views of the first image Im1 captured by the first imaging device 12, and FIGS. 8 and 9 are schematic views of the second image Im2 captured by the second imaging device 13.
  • “P1” in FIGS. 6 to 9 is a specific point indicating the position of the capturing portion 111 on the mounting surface T21 of the second object T2 in each of the first image Im1 and the second image Im2.
  • the specific point P1 is predetermined by performing calibration. Specifically, for example, the catching portion 111 is lowered with respect to the glass substrate, and the contact point (bottom dead center) of the capturing portion 111 with respect to the glass substrate is set as the specific point P1.
  • the specific point P1 may be any point as long as it is a point on the glass substrate and is included in the first image Im1 and the second image Im2. In other words, the specific point P1 is predetermined at any position in each of the first image Im1 and the second image Im2 in association with the capturing unit 111.
  • the mounting head 11 since the mounting head 11 has a plurality of capturing units 111, a plurality of specific points P1 having a one-to-one correspondence with the plurality of capturing units 111 are predetermined.
  • the "bottom dead center” referred to in the present disclosure is not the lower limit position in the range of motion of the capture unit 111, but the lower limit position of the capture unit 111 when the first object T1 is mounted on the mounting surface T21 of the second object T2. To say.
  • P2 in FIGS. 6 to 9 is a target (mounting) position of the first object T1 on the mounting surface T21 of the second object T2.
  • T22 in FIGS. 6 to 9 is solder applied to the mounting surface T21 of the second object T2. The first object T1 is mounted (mounted) on the mounting surface T21 of the second object T2 via the solder T22.
  • the specific point P1 is deviated from the target position P2 in the X-axis (first axis 101) direction by ⁇ X. That is, the amount of deviation (second amount of deviation) of the specific point P1 with respect to the target position P2 in the X-axis direction is ⁇ X.
  • the control device 14 controls the drive device 15 so that the mounting head 11 moves by ⁇ X in the X-axis direction based on the first image Im1.
  • the first image Im1 captured by the first imaging device 12 changes from FIG. 6 to FIG. 7.
  • the deviation amount (first deviation amount) ⁇ Y of the specific point P1 with respect to the target position P2 in the Y-axis direction is within the first specific range.
  • the deviation amount of the specific point P1 with respect to the target position P2 in FIG. 7 is the deviation amount (third deviation amount) ⁇ Z in the Z-axis direction.
  • the control device 14 corrects the movement amount (descending amount) of the capture unit 111 in the Z-axis direction at the time of calibration based on ⁇ Z, and the capture unit 111 moves in the Z-axis direction by the corrected movement amount.
  • the actuator 112 is controlled in such a manner.
  • the specific point P1 is deviated from the target position P2 in the Y-axis (second axis 102) direction by ⁇ Y. That is, the amount of deviation (first amount of deviation) of the specific point P1 with respect to the target position P2 in the Y-axis direction is ⁇ Y.
  • the control device 14 controls the drive device 15 so that the mounting head 11 moves by ⁇ Y in the Y-axis direction based on the second image Im2.
  • the second image Im2 captured by the second imaging device 13 changes from FIG. 8 to FIG.
  • the deviation amount (second deviation amount) ⁇ X of the specific point P1 with respect to the target position P2 in the X-axis direction is within the second specific range.
  • the deviation amount of the specific point P1 with respect to the target position P2 in FIG. 9 is the deviation amount (third deviation amount) ⁇ Z in the Z-axis direction.
  • the control device 14 corrects the movement amount (descending amount) of the capture unit 111 in the Z-axis direction at the time of calibration based on ⁇ Z so that the capture 111 moves in the Z-axis direction by the corrected movement amount. Controls the actuator 112.
  • the specific point P1 is determined by performing calibration as described above, but the specific point P1 is determined based on the position of the capturing unit 111 included in each of the first image Im1 and the second image Im2. You may. As an example, the specific point P1 may be determined based on the position of the tip (lower end) of the capture unit 111. In this case, the actuator 112 is controlled so that the capturing unit 111 moves by ⁇ Z (the amount of deviation of the specific point P1 with respect to the target position P2) in the Z-axis direction based on the first image Im1 (or the second image Im2).
  • ⁇ Z the amount of deviation of the specific point P1 with respect to the target position P2
  • FIG. 10 is a schematic side view showing a main part of the first state of the mounting system 1.
  • FIG. 11 is a schematic view of the second image Im2 captured by the second image pickup apparatus 13 in the first state of the mounting system 1.
  • the first state is a state in which the specific point P1 in the second image Im2 and the target position P2 on the mounting surface T21 of the second object T2 overlap.
  • the specific point P1 and the target position P2 also overlap in the second image Im2.
  • the control device 14 controls the actuator 112 to move the capture unit 111 in order to mount the first object T1 captured by the capture unit 111 on the mounting surface T21 of the second object T2. (Descent).
  • FIG. 12 is a schematic side view showing a main part of the second state of the mounting system 1.
  • FIG. 13 is a schematic view of the second image Im2 captured by the second image pickup apparatus 13 in the second state of the mounting system 1.
  • the second state is a state in which the target position P2 is shifted to the second imaging device 13 side from the specific point P1 in the direction in which the capturing unit 111 and the second imaging device 13 are aligned.
  • the control device 14 controls the drive device 15 to move the mounting head 11 so that the deviation amount ⁇ X in the X-axis direction becomes zero.
  • FIG. 14 is a schematic side view showing a main part of the third state of the mounting system 1.
  • FIG. 15 is a schematic view of the second image Im2 captured by the second image pickup apparatus 13 in the third state of the mounting system 1.
  • the third state is a state in which the target position P2 is deviated in the Z-axis direction due to the second object T2 warping toward the side opposite to the mounting head 11. In this case, as shown in FIG. 15, the target position P2 is deviated from the specific point P1 toward the second image pickup device 13 in the direction in which the capture unit 111 and the second image pickup device 13 are aligned.
  • the control device 14 corrects the movement amount (descending amount) of the capture unit 111 in the Z-axis direction at the time of calibration based on the deviation amount ⁇ Z, and the capture unit 111 Z by the corrected movement amount.
  • the actuator 112 is controlled so as to move in the axial direction.
  • FIG. 16 is a schematic side view showing a main part of the fourth state of the mounting system 1.
  • FIG. 17 is a schematic view of the second image Im2 captured by the second image pickup apparatus 13 in the fourth state of the mounting system 1.
  • the target position P2 is deviated in the Z-axis direction due to the second object T2 being warped on the side opposite to the mounting head 11, and the capturing unit 111 and the second imaging device 13 are aligned.
  • the target position P2 is deviated from the specific point P1 toward the second imaging device 13.
  • the target position P2 is deviated from the specific point P1 toward the second imaging device 13 in the direction in which the capturing unit 111 and the second imaging device 13 are aligned.
  • the control device 14 controls the drive device 15 to move the mounting head 11 based on the first image Im1 so that the deviation amount ⁇ X in the X-axis direction becomes zero.
  • control device 14 corrects the movement amount (descending amount) of the capture unit 111 in the Z-axis direction at the time of calibration based on the deviation amount ⁇ Z, and the capture unit 111 moves in the Z-axis direction by the corrected movement amount.
  • the actuator 112 is controlled so as to do so.
  • the mounting method according to the present embodiment is a mounting method used in the mounting system 1 for mounting the first object T1 on the mounting surface T21 of the second object T2.
  • the mounting system 1 includes a mounting head 11, a first imaging device 12, a second imaging device 13, and a driving device 15.
  • the mounting head 11 has a capturing unit 111 that captures the first object T1.
  • the first imaging device 12 includes a specific region R1 fixed (held) to the mounting head 11 and facing the capturing unit 111 in a direction perpendicular to the mounting surface T21 in the first imaging field of view R11.
  • the second imaging device 13 is fixed (held) to the mounting head 11 and takes an image from a direction different from that of the first imaging device 12 on a specific plane (for example, XY plane) parallel to the mounting surface T21 to capture the specific region R1. It is included in the second imaging field of view R12.
  • the drive device 15 moves the mounting head 11 along the first axis 101 and the second axis 102 that are orthogonal to each other in a specific plane.
  • the mounting method includes an imaging step S2 and a moving step S4.
  • the imaging step S2 is a step of imaging the specific region R1 by the first imaging device 12 and the second imaging device 13.
  • the moving step S4 is a step of moving the mounting head 11 by the driving device 15.
  • the mounting method according to the present embodiment is a method of mounting the first object T1 on the mounting surface T21 of the second object T2 by using the mounting system 1 according to the present embodiment.
  • the first imaging device 12 and the second imaging device 13 image the specific region R1 from different directions. Therefore, it is not necessary to move the first imaging device 12 and the second imaging device 13 directly above the first object T1 mounted on the mounting surface T21 of the second object T2, and the amount of movement of the mounting head 11 is small.
  • the work time can be shortened. As a result, the productivity of the second object T2 on which the first object T1 is mounted can be improved.
  • the second object T2 Since the first object T1 is mounted on the second object T2 while confirming the relative position between the specific point P1 and the target position P2 by the first imaging device 12 and the second imaging device 13, the second object T2 It is also possible to improve the mounting accuracy of the first object T1 with respect to the above.
  • FIG. 18 is a flowchart showing the overall operation of the mounting system 1 including the mounting method according to the present embodiment.
  • the mounting system 1 executes the capture step S1.
  • the capture step S1 the mounting system 1 directs the capture unit 111 located above the first object T1 (component) supplied from the component supply device 16 toward the component supply device 16 (first object T1).
  • the first object T1 is captured by the capturing unit 111.
  • the mounting system 1 moves (ascends) the capturing unit 111 in a state where the first object T1 is captured in a direction away from the component supply device 16 (first object T1).
  • the mounting head 11 since the mounting head 11 includes a plurality of capturing units 111, in the capturing step S1, the mounting system 1 drives each of the plurality of capturing units 111 to drive the plurality of capturing units 111.
  • the first object T1 is captured in each of the above.
  • the mounting system 1 drives the mounting head 11 by the driving device 15 and moves the capturing unit 111 in the state of capturing the first object T1 onto the second object T2. ..
  • the mounting system 1 executes the imaging step S2. That is, the mounting system 1 uses the first imaging device 12 and the second imaging device 13 to image the specific region R1 directly under the capturing unit 111 with the capturing unit 111 located on the second object T2. After that, the mounting system 1 executes the output step S3. In the output step S3, the mounting system 1 outputs the first image Im1 from the first imaging device 12 to the control device 14, and outputs the second image Im2 from the second imaging device 13 to the control device 14.
  • the control device 14 analyzes the first image Im1 and the second image Im2 acquired from the first image pickup device 12 and the second image pickup device 13, respectively, in real time.
  • the mounting system 1 executes the moving step S4 based on the analysis result of the control device 14.
  • the mounting system 1 moves the mounting head 11 so that the specific points P1 in each of the first image Im1 and the second image Im2 move relatively toward the target position P2.
  • the control device 14 controls the drive device 15 so that the specific point P1 and the target position P2 overlap in the X-axis direction based on the analysis result of the first image Im1, and Xs the mounting head 11. Move in the axial direction.
  • the control device 14 controls the drive device 15 so that the specific point P1 and the target position P2 overlap in the Y-axis direction based on the analysis result of the second image Im2, and moves the mounting head 11 in the Y-axis direction. Move.
  • the control device 14 determines whether or not the specific point P1 has reached the target position P2 on the XY plane (S5). If the specific point P1 does not reach the target position P2 on the XY plane (S5; No), the control device 14 repeatedly executes the imaging step S2, the output step S3, and the moving step S4. Then, when the specific point P1 reaches the target position P2 on the XY plane (S5; Yes), the control device 14 executes the mounting step S6.
  • the mounting system 1 moves (descends) the capturing unit 111 located above the second object T2 in a direction approaching the second object T2, and moves (descends) the first object T1 as the second target. It is mounted on the mounting surface T21 of the object T2. That is, when the first object T1 reaches the mounting surface T21 of the second object T2, the mounting system 1 releases the first object T1 by releasing the capture by the capturing unit 111. At this time, the mounting system 1 moves (descends) the capturing unit 111 to a position where the specific point P1 and the target position P2 overlap in the first image Im1 and the second image Im2.
  • the mounting system 1 moves (rises) the capturing unit 111 that has released the first object T1 in a direction away from the second object T2.
  • the mounting system 1 since the mounting head 11 includes a plurality of capturing units 111, in the mounting step S6, the mounting system 1 drives each of the plurality of capturing units 111 to drive the plurality of capturing units 111.
  • the first object T1 is mounted in each of the above.
  • the flowchart of FIG. 18 is merely an example of the overall operation of the mounting system 1, and the processing may be omitted or added as appropriate, or the order of the processing may be changed as appropriate.
  • the first imaging device 12 and the second imaging device 13 take an image of the specific region R1 directly under the capturing unit 111 after the mounting step S6, the state of the mounting surface T21 after mounting the first object T1.
  • the specific region R1 directly under the capturing unit 111 can be imaged, it becomes easy to confirm the mounting surface T21 immediately after mounting the first object T1.
  • the specific region R1 directly below the capture unit 111 is imaged by the first imaging device 12 and the second imaging device 13 in the middle of the mounting step S6, the mounting surface T21 during mounting of the first object T1 can be imaged. It is possible to confirm the state, for example, the state of capture of the first object T1 by the capture unit 111.
  • the specific region R1 directly under the capturing unit 111 can be imaged, it becomes easy to confirm the mounting surface T21 even during the mounting of the first object T1.
  • the above-described embodiment is only one of the various embodiments of the present disclosure.
  • the above-described embodiment can be changed in various ways depending on the design and the like as long as the object of the present disclosure can be achieved.
  • the same functions as the mounting method according to the above-described embodiment may be embodied in the mounting system 1, the (computer) program, the non-temporary recording medium on which the program is recorded, or the like.
  • the program according to one aspect is a program for causing one or more processors to execute the above-mentioned implementation method.
  • the first imaging optical axis Ax1 of the first imaging device 12 may be perpendicular to the mounting surface T21 of the second object T2.
  • the first imaging device 12 may have a first imaging optical axis Ax1 perpendicular to the mounting surface T21 of the second object T2.
  • the angles of the first imaging optical axis Ax1 of the first imaging device 12 and the second imaging optical axis Ax2 of the second imaging device 13 with respect to the mounting surface T21 of the second object T2 are set.
  • the other configurations are the same as those of the mounting system 1 according to the above-described embodiment, except that they are different. Therefore, in the following, the same components will be designated by the same reference numerals and detailed description thereof will be omitted.
  • the second imaging optical axis Ax2 of the second imaging device 13 is also perpendicular to the mounting surface T21 of the second object T2, so that the second imaging device is described here. The illustration and description of 13 will be omitted, and only the first imaging device 12 will be described.
  • the first imaging device 12 is fixed to the mounting head 11 by being held by the head body 113 of the mounting head 11.
  • the first imaging device 12 is held by the head body 113 by being fixed to the lower surface of the head body 113, that is, the surface of the head body 113 facing the second object T2. Since the capture unit 111 is arranged on the lower surface of the head body 113, the first imaging device 12 is arranged on the side of the capture unit 111 in a plan view.
  • the first imaging device 12 has a first imaging optical axis Ax1 perpendicular to the mounting surface T21. That is, the first imaging device 12 is fixed to the mounting head 11 in a posture in which the first imaging optical axis Ax1 is orthogonal to the mounting surface T21.
  • “orthogonal” as used herein means not only the state in which the angle between the two is exactly 90 degrees, but also the angle between the two is abbreviated within the range of the tolerance at which the effect can be substantially obtained. It means that it includes orthogonal states. Therefore, the angle between the first imaging optical axis Ax1 of the first imaging device 12 and the mounting surface T21 may be exactly 90 degrees, or may be slightly deviated from 90 degrees. In other words, the first imaging optical axis Ax1 of the first imaging device 12 may be an axis along the perpendicular line of the mounting surface T21.
  • the first imaging optical axis Ax1 of the first imaging device 12 is substantially parallel to the Z axis and is directed directly below the first imaging device 12.
  • the first imaging device 12 is arranged on the side of the capturing unit 111, and while the first imaging optical axis Ax1 is directed directly below along the Z axis, the specific region R1 directly below the capturing unit 111 Can be imaged.
  • the first imaging device 12 captures the specific region R1 not in the central portion of the first imaging visual field R11 but in the peripheral portion of the first imaging visual field R11, so that the specific region R1 directly below the capturing unit 111 can be imaged. And.
  • the specific region R1 is included in the peripheral portion of the first imaging field of view R11 of the first imaging device 12.
  • the specific region R1 is reflected toward the left end of the first image Im1.
  • the first imaging optical axis Ax1 of the first imaging device 12 is not directed to the specific region R1, but the first imaging optical axis Ax1 of the first imaging device 12 is intentionally set outside the specific region R1.
  • the specific region R1 is reflected toward the end of the first imaging field R11 of the first imaging device 12.
  • the first imaging optical axis Ax1 of the first imaging device 12 can be made perpendicular to the mounting surface T21. Therefore, for example, the occupied area of the first imaging device 12 in the plane parallel to the mounting surface T21 can be kept relatively small, and the moving range of the mounting head 11 by the first imaging device 12 is less likely to be restricted. be.
  • the first imaging optical axis Ax1 of the first imaging device 12 Is perpendicular to the mounting surface T21, so that the focusing range is wider than when the first imaging optical axis Ax1 is tilted with respect to the mounting surface T21.
  • the first imaging field R11 It is possible to capture the specific region R1 included in the above with high definition.
  • the mounting system 1 includes two imaging devices (first imaging device 12 and second imaging device 13), but as shown in FIG. 21, three imaging devices (first imaging device). 12.
  • the second imaging device 13 and the third imaging device 21) may be provided.
  • the mounting system 1 may include a plurality of imaging devices including the first imaging device 12 and the second imaging device 13.
  • the mounting system 1A according to the second modification will be described with reference to FIG.
  • FIG. 11, FIG. 13, FIG. 15, and FIG. 17, the second image Im2 is rotated 90 degrees counterclockwise in order to align with FIGS. 10, 12, 14, and 16, respectively.
  • the mounting system 1A according to the second modification is the same as the mounting system 1 according to the above-described embodiment except for the configuration of the third imaging device 21 and the control device 14A. Therefore, in the following, the same components will be designated by the same reference numerals and detailed description thereof will be omitted.
  • the mounting system 1A includes a mounting head 11, a first imaging device 12, a second imaging device 13, a control device 14A, a driving device 15, and a component supply device 16.
  • a transport device 17, a backup device 18, a lighting device 19, and a third imaging device 21 are provided.
  • the third imaging device 21 is fixed (held) to the mounting head 11 in the same manner as the first imaging device 12 and the second imaging device 13.
  • the third image pickup device 21 has an image pickup device 211 and an optical system 212, similarly to the first image pickup device 12 and the second image pickup device 13. Since the image sensor 211 is the same as the image sensors 121 and 131 described above and the optical system 212 is the same as the optical systems 122 and 132 described above, the description thereof will be omitted here.
  • the imaging direction of the third imaging device 21 is a direction different from the imaging direction of the first imaging device 12 and the imaging direction of the second imaging device 13 on the specific plane (XY plane). In other words, the third imaging device 21 is arranged so as to image the specific region R1 from a direction different from that of the first imaging device 12 and the second imaging device 13. Therefore, the third imaging device 21 includes the specific region R1 in the (third) imaging field of view.
  • the control device 14A has a conversion unit 141 and a selection unit 142.
  • the conversion unit 141 is the same as the conversion unit 141 described in the above-described embodiment, and the description thereof will be omitted here.
  • the selection unit 142 is configured to select at least two image pickup devices from the first image pickup device 12, the second image pickup device 13, and the third image pickup device 21 in order to image the specific region R1.
  • the selection unit 142 for example, when the first imaging field of view R11 of the first imaging device 12 includes a shield (other component) and the first imaging device 12 cannot image the specific region R1, the second imaging device 13 and the third imaging device 21 are selected.
  • the selection unit 142 identifies the plurality of imaging devices (first imaging device 12, second imaging device 13, and third imaging device 21) according to the state of the shield located around the specific region R1. The imaging device used for imaging the region R1 is selected.
  • the mounting system 1A according to the second modification as described above, for example, even if the first imaging device 12 cannot image the specific area R1, the second imaging device 13 and the third imaging device 21 image the specific area R1. be able to. Therefore, the position of the specific point P1 included in the specific region R1 can be detected more accurately than the above-described mounting system 1 including only the first imaging device 12 and the second imaging device 13.
  • the mounting system 1A has three image pickup devices, but four or more image pickup devices may be provided.
  • the specific region R1 may be imaged by at least two imaging devices, and the specific region R1 may be imaged by three or more imaging devices.
  • the mounting system 1 in the present disclosure includes, for example, a computer system in the control device 14.
  • the main configuration of a computer system is a processor and memory as hardware.
  • the processor executes the program recorded in the memory of the computer system, the function as the implementation system 1 in the present disclosure is realized.
  • the program may be pre-recorded in the memory of the computer system, may be provided through a telecommunications line, and may be recorded on a non-temporary recording medium such as a memory card, optical disk, hard disk drive, etc. that can be read by the computer system. May be provided.
  • a processor in a computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large scale integrated circuit (LSI).
  • IC semiconductor integrated circuit
  • LSI large scale integrated circuit
  • the integrated circuit such as IC or LSI referred to here has a different name depending on the degree of integration, and includes an integrated circuit called a system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration).
  • an FPGA Field-Programmable Gate Array
  • a plurality of electronic circuits may be integrated on one chip, or may be distributed on a plurality of chips.
  • the plurality of chips may be integrated in one device, or may be distributed in a plurality of devices.
  • the computer system referred to here includes a microprocessor having one or more processors and one or more memories. Therefore, the microprocessor is also composed of one or a plurality of electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.
  • the mounting system 1 it is not an essential configuration for the mounting system 1 that a plurality of functions in the mounting system 1 are integrated in one housing.
  • the components of the mounting system 1 may be distributed in a plurality of housings. Further, at least a part of the functions of the mounting system 1 may be realized by a cloud (cloud computing) or the like.
  • At least a part of the functions of the mounting system 1 distributed in a plurality of devices may be integrated in one housing.
  • some of the functions distributed in the mounting head 11 and the control device 14 may be integrated in the mounting head 11.
  • the application of the mounting system 1 is not limited to the manufacture of electronic devices in factories.
  • the mounting system 1 when the mounting system 1 is used for mounting the machine component on the glass plate, the mounting system 1 mounts the machine component which is the first object T1 on the glass plate which is the second object T2. I do.
  • the mounting system 1 is used when mounting the first object T1 (component) on the mounting surface of the second object T2 (board), but the first object is captured by the capturing unit 111. It may be used when adsorbing an object T1 (part).
  • the first imaging device 12 and the second imaging device 13 image the specific region R1 facing the capturing unit 111 when capturing the first object T1 (component) from the component supply device 16.
  • the first image Im1 captured by the first imaging device 12 and the specific point P1 at each of the second image Im2 captured by the second imaging device 13 are housed in the carrier tape.
  • the drive device 15 is controlled so as to move relatively toward the suction position of the object T1 (part).
  • the imaging direction of the first imaging device 12 and the imaging direction of the second imaging device 13 are orthogonal to each other, but the imaging direction of the first imaging device 12 and the imaging direction of the second imaging device 13 are different. They may be different and may not be orthogonal. However, even in this case, it is necessary that the straight line connecting the first imaging device 12 and the specific point P1 and the straight line connecting the second imaging device 13 and the specific point P1 are orthogonal to each other. ..
  • the number of capture units 111 and the number of image pickup devices provided in the mounting head 11 are not limited to the numbers described in the above-described embodiment (including the second modification).
  • the number of capture units 111 may be 15 or less or 17 or more, and the number of image pickup devices may be 4 or more.
  • the mounting head 11 may include only one capturing unit 111.
  • the arrangement of the capturing unit 111 and the imaging device is not limited to the arrangement described in the above-described embodiment, and can be changed as appropriate.
  • Each of the first imaging device 12 and the second imaging device 13 is not limited to an RGB camera capable of capturing a full-color still image, for example, a camera capable of capturing a monochrome image, a camera capable of capturing a moving image, or a line sensor. And so on.
  • the imaging directions of the first imaging device 12 and the second imaging device 13 are fixed, but for example, at least one of the first imaging device 12 and the second imaging device 13 is attached to the mounting head 11. It may be configured to rotate relative to it.
  • the control device 14 controls the drive device 15 and the actuator 112 in consideration of the rotation angle of the image pickup device configured to be rotatable among the first image pickup device 12 and the second image pickup device 13.
  • the phrase "the first imaging device and the second imaging device are held by the mounting head" in the present disclosure means that the first imaging device and the second imaging device are attached to the mounting head so as not to move with respect to the mounting head. This includes the case where the first imaging device and the second imaging device are attached to the mounting head so as to be rotatable with respect to the mounting head.
  • the capture unit 111 is included in the first imaging field of view R11 of the first imaging device 12 and the second imaging field of view R12 of the second imaging device 13, but the first imaging field of view R11 and the second imaging field of view R11.
  • the capture unit 111 may not be included in R12.
  • the mounting head 11 may be moved in at least one of the X-axis direction and the Y-axis direction based on the specific point P1 predetermined by calibration.
  • the mounting system (1; 1A) is a mounting system (1; 1;) in which the first object (T1) is mounted on the mounting surface (T21) of the second object (T2). 1A).
  • the mounting system (1; 1A) includes a mounting head (11), a first imaging device (12), a second imaging device (13), and a driving device (15).
  • the mounting head (11) has a capturing unit (111) that captures the first object (T1).
  • the first imaging device (12) is held by the mounting head (11), and a specific region (R1) facing the capturing unit (111) in a direction perpendicular to the mounting surface (T21) is set as the first imaging field of view (R11).
  • the second imaging device (13) is held by the mounting head (11) and takes an image from a direction different from that of the first imaging device (12) on a specific plane (for example, XY plane) parallel to the mounting surface (T21).
  • the specific region (R1) is included in the second imaging field of view (R12).
  • the drive device (15) moves the mounting head (11) along the first axis (101) and the second axis (102) that are orthogonal to each other in a specific plane.
  • the mounting surface (T21) of the second object (T2) is imaged. It is not necessary to move the first imaging device (12) and the second imaging device (13) directly above the first object (T1) mounted on the), and the working time can be shortened. As a result, the productivity of the second object (T2) on which the first object (T1) is mounted can be improved.
  • the mounting system (1; 1A) further includes a control device (14) in the first aspect.
  • the control device (14) is a specific point (P1) at each of the first image (Im1) captured by the first image pickup device (12) and the second image (Im2) captured by the second image pickup device (13). ) Is controlled so that the drive device (15) moves relatively toward the target position (P2).
  • the control device (14) individually determines the amount of deviation ( ⁇ X, ⁇ Y, ⁇ Z) of the specific point (P1) with respect to the target position (P2) for each of the first image (Im1) and the second image (Im2).
  • the amount of deviation ( ⁇ X, ⁇ Y, ⁇ Z) of the specific point (P1) with respect to the target position (P2) can be determined based on the first image (Im1) and the second image (Im2). ..
  • the imaging direction of the first imaging device (12) on the specific plane is the first direction (D1) orthogonal to the first axis (101). ).
  • the imaging direction of the second imaging device (13) on the specific plane is the second direction (D2) orthogonal to the second axis (102).
  • the control device (14) has a mounting head (11) based on a deviation amount ( ⁇ X) of a specific point (P1) with respect to a target position (P2) in the second direction (D2) included in the first image (Im1).
  • the drive device (15) is controlled so as to move along the first axis (101).
  • the control device (14) has a mounting head (11) based on a deviation amount ( ⁇ Y) of a specific point (P1) with respect to a target position (P2) in the first direction (D1) included in the second image (Im2).
  • the drive device (15) is controlled so as to move along the second axis (102).
  • the mounting head (11) further includes a second driving device (112). Unlike the first drive device (15) as the drive device, the second drive device (112) captures in the third direction (D3) orthogonal to both the first direction (D1) and the second direction (D2). The unit (111) is moved.
  • the control device (14) when at least the first deviation amount ( ⁇ Y) is within the first specific range, the specific point (P1) is set to the target position (P2) based on the third deviation amount ( ⁇ Z).
  • the second drive device (112) is controlled so as to move relative to each other.
  • the specific point (P1) is set to the target position (P2) based on the third deviation amount ( ⁇ Z).
  • the second drive device (112) is controlled so as to move relative to each other.
  • the first deviation amount ( ⁇ Y) is the deviation amount of the specific point (P1) with respect to the target position (P2) in the first direction (D1).
  • the second deviation amount ( ⁇ X) is the deviation amount of the specific point (P1) with respect to the target position (P2) in the second direction (D2).
  • the third deviation amount ( ⁇ Z) is the deviation amount of the specific point (P1) with respect to the target position (P2) in the third direction (D3) included in the first image (Im1) or the second image (Im2).
  • the mounting system (1; 1A) according to the fifth aspect further includes a conversion unit (141) in any one of the second to fourth aspects.
  • the conversion unit (141) moves the specific point (P1) along the third axis (103), which is different from the first axis (101) and the second axis (102), on the specific plane. ) Is converted into a first movement amount in the direction along the first axis (101) and a second movement amount in the direction along the second axis (102).
  • the specific point (P1) can be moved along the third axis (103).
  • the specific point (P1) is the first image (Im1) and the second image (Im2). At any position in each, it is associated with the capturing unit (111) and predetermined.
  • the first image (Im1) is an image captured by the first imaging device (12).
  • the second image (Im2) is an image captured by the second image pickup apparatus (13).
  • the mounting head (11) by moving the mounting head (11) to a position where the specific point (P1) and the target position (P2) overlap, the first target is placed on the mounting surface (T21) of the second target (T2).
  • the object (T1) can be mounted.
  • the mounting head (11) has a plurality of capturing units (111).
  • a plurality of specific points (P1) corresponding to a plurality of capture units (111) in a one-to-one manner are predetermined.
  • the mounting head (11) even when the mounting head (11) has a plurality of capturing portions (111), the mounting head (11) is moved to a position where the specific point (P1) and the target position (P2) overlap. By doing so, the first object (T1) can be mounted on the mounting surface (T21) of the second object (T2).
  • the specific point (P1) is the first image (Im1) and the second image (Im2). It is determined based on the position of the capturing unit (111) included in each.
  • the specific point (P1) moves in the first image (Im1) and the second image (Im2) with the movement of the capturing unit (111).
  • the first image (Im1) is an image captured by the first imaging device (12).
  • the second image (Im2) is an image captured by the second image pickup apparatus (13).
  • the specific point (P1) can be corrected according to the position of the capturing unit (111).
  • the specific point (P1) is determined based on the position of the tip (lower end) of the capture unit (111).
  • the specific point (P1) can be corrected according to the tip position of the capturing unit (111).
  • each of the first imaging device (12) and the second imaging device (13) has a mounting surface. It has an imaging optical axis (Ax1, Ax2) perpendicular to (T21).
  • the first imaging device (12) and the second imaging device (13) in a posture orthogonal to the mounting surface (T21).
  • each of the first imaging device (12) and the second imaging device (13) has a mounting surface. It has an imaging optical axis (Ax1, Ax2) inclined with respect to the perpendicular line (N1) of (T21).
  • the first imaging device (12) and the second imaging device (13) in a posture in which the mounting surface (T21) is inclined with respect to the perpendicular line (N1).
  • the first imaging optical axis (Ax1) and the second imaging optical axis (Ax2) are oriented from the direction perpendicular to the mounting surface (T21). Seen and orthogonal to each other.
  • the first imaging optical axis (Ax1) is the imaging optical axis of the first imaging device (12).
  • the second imaging optical axis (Ax2) is the imaging optical axis of the second imaging device (13).
  • the mounting accuracy of the first object (T1) on the mounting surface (T21) of the second object (T2) can be improved.
  • the mounting system (1; 1A) is a plurality of imaging devices including the first imaging device (12) and the second imaging device (13) in any one of the first to twelfth aspects. (12, 13, 21) is provided.
  • the mounting system (1; 1A) further includes a selection unit (142).
  • the selection unit (142) is an imaging device used for imaging a specific region (R1) among a plurality of imaging devices (12, 13, 21) according to the state of a shield located around the specific region (R1). Select.
  • the imaging device used for imaging the specific region (R1) can be selected according to the state of the shield.
  • the mounting system (1; 1A) further includes a control device (14; 14A) in the first aspect.
  • the control device (14; 14A) is a specific point in each of the first image (Im1) captured by the first image pickup device (12) and the second image (Im2) captured by the second image pickup device (13).
  • the drive device (15) is controlled so that (P1) moves relatively toward the target position (P2).
  • the specific imaging device for example, the first imaging device 12
  • the control device (14; 14A) controls the drive device (15) based on the rotation angle of the specific imaging device.
  • the orientation of the specific imaging device can be rotated so as to include the specific point (P1) and the target position (P2).
  • the first object (T1) is a component and the second object (T2) is a component.
  • the productivity of the substrate as the second object (T2) on which the component as the first object (T1) is mounted can be improved.
  • the mounting method according to the sixteenth aspect is a mounting method used for a mounting system (1; 1A) in which the first object (T1) is mounted on the mounting surface (T21) of the second object (T2).
  • the mounting system (1; 1A) includes a mounting head (11), a first imaging device (12), a second imaging device (13), and a driving device (15).
  • the mounting head (11) has a capturing unit (111) that captures the first object (T1).
  • the first imaging device (12) is held by the mounting head (11), and a specific region (R1) facing the capturing unit (111) in a direction perpendicular to the mounting surface (T21) is set as the first imaging field of view (R11).
  • the second imaging device (13) is held by the mounting head (11) and takes an image from a direction different from that of the first imaging device (12) on a specific plane (for example, XY plane) parallel to the mounting surface (T21).
  • the specific region (R1) is included in the second imaging field of view (R12).
  • the drive device (15) moves the mounting head (11) along the first axis (101) and the second axis (102) that are orthogonal to each other in a specific plane.
  • the mounting method includes an imaging step (S2) and a moving step (S4).
  • the imaging step (S2) is a step of imaging a specific region (R1) by the first imaging device (12) and the second imaging device (13).
  • the moving step (S4) is a step of moving the mounting head (11) by the driving device (15).
  • the mounting surface (T21) of the second object (T2) is imaged. It is not necessary to move the first imaging device (12) and the second imaging device (13) directly above the first object (T1) mounted on the), and the working time can be shortened. As a result, the productivity of the second object (T2) on which the first object (T1) is mounted can be improved.
  • the program according to the 17th aspect is a program for causing one or more processors to execute the implementation method according to the 16th aspect.
  • the mounting surface (T21) of the second object (T2) is imaged. It is not necessary to move the first imaging device (12) and the second imaging device (13) directly above the first object (T1) mounted on the), and the working time can be shortened. As a result, the productivity of the second object (T2) on which the first object (T1) is mounted can be improved.
  • the configurations according to the second to fifteenth aspects are not essential configurations for the mounting system (1; 1A) and can be omitted as appropriate.
  • 1,1A Mounting system 11 Mounting head 12 First imaging device (imaging device) 13 Second imaging device (imaging device) 14 Control device 15 Drive device (1st drive device) 21 Third imaging device (imaging device) 101 1st axis 102 2nd axis 103 3rd axis 111 Capture unit 112 Actuator (2nd drive device) 141 Conversion unit 142 Selection unit Ax1 First imaging optical axis (imaging optical axis) Ax2 2nd imaging optical axis (imaging optical axis) D1 1st direction D2 2nd direction D3 3rd direction Im1 1st image Im2 2nd image N1 Perpendicular line P1 Specific point P2 Target position R1 Specific area R11 1st imaging field of view R12 2nd imaging field of view T1 1st object T2 2nd object Object T21 Mounting surface ⁇ X Second deviation amount (deviation amount) ⁇ Y 1st deviation amount (deviation amount) ⁇ Z 3rd deviation amount (deviation amount)

Abstract

La présente invention aborde le problème d'amélioration de la productivité d'un second objet sur lequel un premier objet est monté. Un système de montage (1) selon la présente invention comprend : une tête de montage (11) ; un premier dispositif d'imagerie (12) ; un second dispositif d'imagerie (13) ; et un dispositif d'entraînement (15). La tête de montage (11) comprend une unité de capture (111) qui capture le premier objet. Le premier dispositif d'imagerie (12) est maintenu par la tête de montage (11) et comprend, dans un premier champ visuel d'imagerie, une région spécifique qui est opposée à l'unité de capture (111) dans une direction perpendiculaire à la surface de montage du second objet. Le second dispositif d'imagerie (13) est maintenu par la tête de montage (11), effectue une imagerie depuis une direction différente du premier dispositif d'imagerie (12) dans un plan spécifique qui est parallèle à la surface de montage, et comprend la région spécifique dans un second champ visuel d'imagerie. Le dispositif d'entraînement (15) déplace la tête de montage (11) le long d'un premier axe et d'un second axe qui se croisent dans le plan spécifique.
PCT/JP2021/014166 2020-04-08 2021-04-01 Système de montage, procédé de montage, et programme WO2021205980A1 (fr)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2023163027A1 (fr) * 2022-02-25 2023-08-31 パナソニックＩｐマネジメント株式会社 Système de montage et procédé de montage

Citations (2)

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Publication number Priority date Publication date Assignee Title
JPH0645796A (ja) * 1992-07-23 1994-02-18 Matsushita Electric Works Ltd 部品実装方法
US20140198185A1 (en) * 2013-01-17 2014-07-17 Cyberoptics Corporation Multi-camera sensor for three-dimensional imaging of a circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0645796A (ja) * 1992-07-23 1994-02-18 Matsushita Electric Works Ltd 部品実装方法
US20140198185A1 (en) * 2013-01-17 2014-07-17 Cyberoptics Corporation Multi-camera sensor for three-dimensional imaging of a circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023163027A1 (fr) * 2022-02-25 2023-08-31 パナソニックＩｐマネジメント株式会社 Système de montage et procédé de montage

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