WO2023125455A1 - 一种bga元件自对位结构及对位方法 - Google Patents

一种bga元件自对位结构及对位方法 Download PDF

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Publication number
WO2023125455A1
WO2023125455A1 PCT/CN2022/142105 CN2022142105W WO2023125455A1 WO 2023125455 A1 WO2023125455 A1 WO 2023125455A1 CN 2022142105 W CN2022142105 W CN 2022142105W WO 2023125455 A1 WO2023125455 A1 WO 2023125455A1
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Prior art keywords
bga
circuit board
printed circuit
jigs
pair
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PCT/CN2022/142105
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English (en)
French (fr)
Inventor
邵冬冬
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深圳中科四合科技有限公司
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Publication of WO2023125455A1 publication Critical patent/WO2023125455A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Definitions

  • the invention relates to the technical field of printed circuit board design and processing, in particular to a BGA component self-alignment structure and an alignment method suitable for mounting BGA components and printed circuit boards.
  • BGA component packaging is widely used in the design of printed circuit board products and in production.
  • a BGA component includes a substrate and BGA balls, wherein the substrate is the package substrate, and the BGA balls are solder balls.
  • Embodiments of the present invention provide a BGA component self-alignment structure and alignment method to solve the technical problems that high-density BGA assembly requires high precision, and BGA component assembly is easy to deviate, resulting in product repair and seriously affecting product yield and production efficiency.
  • the present invention provides a self-alignment structure of a BGA component.
  • the BGA component includes a substrate and a BGA ball planted on the bottom surface of the substrate, including a circuit board mechanism and a second alignment structure.
  • the circuit board mechanism includes A printed circuit board and a first alignment structure disposed on the printed circuit board, the first alignment structure is used to match with BGA ball planting;
  • the second alignment structure includes a pair of jigs, A pair of the jigs are arranged on the upper side of the printed circuit board at intervals and facing each other, and are used to be limited on both sides of the substrate.
  • the first alignment structure includes an opening opened on the printed circuit board, a filling medium structure filling the cavity of the opening, and a groove provided on the filling medium structure , the groove matches the shape of the BGA ball.
  • the opening is a through hole or a blind hole
  • the filling medium structure is formed by filling the inner cavities of the opening with ink or resin.
  • a conduction layer is added on the top surface of the filling dielectric structure, and the conduction layer electrically conducts the lines of the printed circuit board on both sides of the groove.
  • the pair of jigs have inclined limiting surfaces arranged opposite to each other, and the inclined angle range of the inclined limiting surfaces is 2°-20°.
  • a titanium-plated film is provided on the outer surfaces of the pair of jigs.
  • a pair of the jigs are respectively fastened above the printed circuit board on both sides of the substrate.
  • the present invention provides a method for self-alignment of BGA components, comprising the following steps:
  • a first positioning structure matching the BGA ball planting of the BGA component is arranged on the printed circuit board;
  • the second positioning structure is limited to the two sides of the BGA component, and the BGA component is aligned on the printed circuit board.
  • the step of "according to the obtained electrical design requirements of the printed circuit board and BGA components, setting a first positioning structure on the printed circuit board that matches the BGA ball planting of the BGA components" specifically includes The following steps:
  • a conduction layer is added on the top surface of the filled dielectric structure to electrically conduct the lines on the printed circuit board on both sides of the groove.
  • the step of "making a second positioning structure according to the obtained size information of the BGA component” specifically includes the following steps:
  • a titanium film is vacuum-plated with PVD on the surfaces of the pair of fixtures that have been fabricated.
  • the BGA component self-alignment structure provided by the present invention is provided with a first alignment structure and a second alignment structure, the first alignment structure matches the BGA ball planting, and the second alignment structure is limited to both sides of the substrate and printed On the top of the circuit board, the BGA components are accurately aligned on the printed circuit board, which effectively guarantees the placement yield of the BGA components on the printed circuit board, reduces the repair and scrap costs caused by poor BGA placement, and improves the BGA components. placement processing efficiency.
  • Fig. 1 is a side view of a BGA component
  • Fig. 2 is the bottom view of BGA component
  • Fig. 3 is the usage status diagram of the BGA component self-alignment structure provided by the present invention.
  • Fig. 4 is another usage status diagram of the BGA component self-alignment structure provided by the present invention.
  • Figure 5 is a cross-sectional view of a printed circuit board without holes
  • FIG. 6 is a cross-sectional view of a printed circuit board with through holes provided by the present invention.
  • FIG. 7 is a sectional view of a printed circuit board with blind holes provided by the present invention.
  • Fig. 8 is a cross-sectional view of a structure filled with a medium in the through hole of the printed circuit board provided by the present invention.
  • Fig. 9 is a cross-sectional view of a structure filled with a medium in a blind hole of a printed circuit board provided by the present invention.
  • Fig. 10 is a cross-sectional view of a through-hole of a printed circuit board provided with a filling medium structure and grooves provided by the present invention
  • Fig. 11 is a cross-sectional view of a filled medium structure and a groove in a blind hole of a printed circuit board provided by the present invention.
  • Fig. 12 is a sectional view of a filled dielectric structure, a groove and a conductive layer in the through hole of the printed circuit board provided by the present invention
  • Fig. 13 is a cross-sectional view of a filled dielectric structure, a groove and a conductive layer in a blind hole of a printed circuit board provided by the present invention
  • Fig. 14 is a schematic structural view of a pair of jigs provided by the present invention.
  • Fig. 15 is a schematic structural view of a pair of jigs provided with a titanium coating layer provided by the present invention.
  • Fig. 16 is a structural schematic diagram of a pair of jigs screwed and fixed on a printed circuit board provided by the present invention.
  • Fig. 17 is a structural schematic diagram of a pair of jigs provided by the present invention being clamped and fixed on a printed circuit board.
  • the embodiment of the present invention provides a BGA component self-alignment structure and alignment method, which can solve the high-density BGA assembly requirement of high precision, and the BGA component assembly is easy to deviate, which leads to product repair and seriously affects product yield and production efficiency. question.
  • the present invention provides a self-alignment structure for BGA components, including a circuit board mechanism and a second alignment structure
  • the circuit board mechanism includes a printed circuit board 20 and is located on the printed circuit
  • the first alignment structure on the board 20 the first alignment structure is used to match the BGA ball planting 12
  • the second alignment structure includes a pair of jigs 30, and a pair of jigs 30 are facing each other at intervals It is arranged above the printed circuit board 20 and used to be limited on both sides of the substrate 11 .
  • the BGA component self-alignment structure provided by the present invention is provided with a first alignment structure and a second alignment structure, the first alignment structure matches the BGA ball planting 12, and the second alignment structure is limited to both sides of the substrate 11 and
  • the BGA components are accurately aligned on the printed circuit board 20, which effectively guarantees the placement yield of the BGA components on the printed circuit board 20, and reduces the repair and scrap costs caused by poor BGA placement , improving the mounting and processing efficiency of BGA components; different from the traditional BGA component plane mounting, the BGA component self-alignment structure provided by the present invention uses the printed circuit board 20 with grooves 24, which is easier to position and correct the BGA component positional accuracy.
  • the present invention provides a method for self-alignment of BGA components, comprising the following steps:
  • the BGA component self-alignment method provided by the invention realizes high-precision alignment and placement processing of the BGA component, and has low cost, flexible design and wide application range.
  • the embodiment of the present invention provides a BGA component self-alignment structure and alignment method, which can solve the high-density BGA assembly requirement of high precision, and the BGA component assembly is easy to deviate, which leads to product repair and seriously affects product yield and production efficiency. question.
  • the present invention provides a self-alignment structure for BGA components, including a circuit board mechanism and a second alignment structure
  • the circuit board mechanism includes a printed circuit board 20 and is located on the printed circuit
  • the first alignment structure on the board 20 the first alignment structure is used to match the BGA ball planting 12
  • the second alignment structure includes a pair of jigs 30, and a pair of jigs 30 are facing each other at intervals It is arranged above the printed circuit board 20 and used to be limited on both sides of the substrate 11 .
  • the BGA component self-alignment structure provided by the present invention is provided with a first alignment structure and a second alignment structure, the first alignment structure matches the BGA ball planting 12, and the second alignment structure is limited to both sides of the substrate 11 and
  • the BGA components are accurately aligned on the printed circuit board 20, which effectively guarantees the placement yield of the BGA components on the printed circuit board 20, and reduces the repair and scrap costs caused by poor BGA placement , improving the mounting and processing efficiency of BGA components; different from the traditional BGA component plane mounting, the BGA component self-alignment structure provided by the present invention uses the printed circuit board 20 with grooves 24, which is easier to position and correct the BGA component positional accuracy.
  • the first alignment structure includes an opening opened on the printed circuit board 20, a filling medium structure 23 filled in the cavity of the opening, and a filling medium structure 23 provided in the filling medium.
  • the groove 24 on the structure 23 matches the shape of the BGA ball planting 12 .
  • the opening can be realized as a through hole 21 as shown in FIG. 6 , or as a blind hole as shown in FIG. 7 . 22, as long as the filling cavity can be provided at the relative positions of the filling medium and the BGA ball 12 on the BGA component.
  • one of the openings is provided as the filling medium filling inlet, and the other opening is provided for electrical conduction between the BGA ball planting 12 and the printed circuit board 20 on both sides of the opening.
  • the conduction layer 25 provides flexibility to select the operating space.
  • the filling medium structure 23 is formed by filling holes with ink or resin material, so as to ensure that the holes are completely filled without gaps.
  • a conduction layer 25 is added on the top surface of the filling dielectric structure 23 , and the conduction layer 25 electrically connects the lines of the printed circuit board 20 on both sides of the groove 24 .
  • a pair of jigs 30 have inclined limiting surfaces 31 arranged opposite to each other.
  • the pair of inclined limiting surfaces 31 are arranged above the printed circuit board 20 at intervals. The distance between them, that is, the gap, depends on the size of the BGA component. , including the height and width of the substrate 11 and the depth value of the mounting and embedding groove 24 of the BGA ball planting 12, a pair of inclined limiting surfaces 31 are fixed on the top of the printed circuit board 20 at intervals, for the BGA components to be located on the printed circuit board
  • the circuit board 20 provides an alignment guide and a final limit function.
  • the inclination angle of the inclination limiting surface 31 ranges from 2° to 20°, which is determined according to the size of the BGA component and the depth of the embedding groove 24 of the BGA ball planting 12 .
  • the outer surfaces of the pair of fixtures 30 are provided with an anti-wear and high-temperature resistant film.
  • the surfaces of a pair of jigs 30 are electroplated with a titanium film 301 by vacuum PVD technology.
  • the thickness of the titanium coating film 301 is controlled within a range of 3 ⁇ m-5 ⁇ m.
  • a pair of fixtures 30 are detachably connected above the printed circuit board 20, and after the BGA components are assembled on the printed circuit board 20, the pair of fixtures 30 are removed from the circuit board .
  • a pair of the jigs 30 are respectively screwed or clamped on the printed circuit board 20 on both sides of the substrate 11 .
  • the present invention provides a method for self-alignment of BGA components, comprising the following steps:
  • the BGA component self-alignment method provided by the invention realizes high-precision alignment and placement processing of the BGA component, and has low cost, flexible design and wide application range.
  • a positioning structure” step specifically includes the following steps:
  • step S121 referring to the position of the BGA ball planting 12 of the BGA component and the specific size of the lead of the BGA component, holes are opened in the corresponding area of the printed circuit board 20, the processing is simple and convenient, and no new processing technology is required , It can be realized by using conventional circuit board processing technology to open holes.
  • step S123 the groove 24 matching the shape of the BGA ball planting 12 is molded on the top surface of the filling dielectric structure 23 by means of laser ablation or solution erosion.
  • a conduction layer 25 is added on the top or bottom surface of the filling dielectric structure 23 where conduction holes are required.
  • metallization is performed on the top or bottom of the filled dielectric structure 23, and a conduction layer is implemented on the top or bottom of the filled dielectric structure 23 at the opening that needs to be conducted by means of sputtering, chemical deposition, etc. 25.
  • the step of "S220, making a second positioning structure according to the obtained size information of the BGA component” specifically includes the following steps:
  • step S222 a pair of jigs 30 that meet the size requirements are manufactured through electroforming technology, and the high precision of electroforming technology is used to make auxiliary alignment electroforming jigs 30, which further improves the reliability of BGA components. Alignment accuracy.
  • the "S300, by matching the BGA ball planting 12 into the first positioning structure, the second positioning structure is limited to the two sides of the BGA component, and the BGA component is aligned on the printed circuit Board 20" step, specifically comprises the following steps:
  • the step "S310, fixing the two fixtures 30 on the printed circuit board 20 at intervals” specifically includes the following steps:
  • the two jigs 30 are detachably connected and fixed on the printed circuit board 20 at intervals.
  • the detachable connection can be implemented as a screwed fixing method as shown in FIG. 16, which is fixed by screws 32, or can also be realized as a clamping and fixing method as shown in FIG. 17.
  • the ends of the two jigs 30 and the The two ends of the above-mentioned printed circuit board 20 are correspondingly locked and fixed together by the locking structure 33 .
  • the "S320 move the BGA component down from the gap between the two jigs 30 until the BGA balls 12 are embedded in the corresponding grooves 24, and the two sides of the substrate 11 are limited by the two jigs 30."
  • the following steps are also included:
  • connection should be interpreted in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, It can also be an electrical connection; it can be a direct connection, or an indirect connection through an intermediary, or an internal communication between two components.
  • connection should be interpreted in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, It can also be an electrical connection; it can be a direct connection, or an indirect connection through an intermediary, or an internal communication between two components.
  • the BGA component self-alignment structure provided by the present invention is provided with a first alignment structure and a second alignment structure, the first alignment structure matches the BGA ball planting 12, and the second alignment structure is limited to both sides of the substrate 11 and
  • the BGA components are accurately aligned on the printed circuit board 20, which effectively guarantees the placement yield of the BGA components on the printed circuit board 20, and reduces the repair and scrap costs caused by poor BGA placement , improving the mounting and processing efficiency of BGA components;
  • the BGA component self-alignment structure provided by the present invention uses the printed circuit board 20 with grooves 24, which is easier to position and correct the BGA component Position accuracy, can be applied in industry, and can meet the requirements of industrial applicability

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

一种BGA元件自对位结构及对位方法，BGA元件包括基板（11）和设于其底面的BGA植球（12），BGA元件自对位结构包括电路板机构和第二对位结构，电路板机构包括印制电路板（20）以及设于印制电路板（20）上的第一对位结构，第一对位结构用于与BGA植球（12）相匹配；第二对位结构包括一对治具（30），一对治具（30）间隔相向设置于印制电路板（20）的上方，用于限位于基板（11）的两侧。所述结构和方法提升了贴装加工效率，有效保障了BGA元件在印制电路板上的贴装良率，降低BGA贴装不良导致的返修和报废成本。

Description

一种BGA元件自对位结构及对位方法 技术领域
本发明涉及印制电路板设计加工技术领域，特别涉及适用于BGA元件和印制电路板贴装的一种BGA元件自对位结构及对位方法。
 背景技术
电子产品功能集成化、小型化发展导致印制电路板组装密度越来越高，精度要求越来越高，BGA元件封装因其体积小、可靠性高等特性广泛应用于印制电路板产品设计与生产中。
BGA(Ball Grid Array焊球阵列封装)，它是在封装体基板的底部制作阵列焊球作为电路I/O端与印制电路板（PCB）互接。采用该项技术封装的器件是一种表面贴装器件。如图1所示，BGA元件包括基板和BGA植球，其中基板即封装体基板，BGA植球即焊球。
 技术问题
由于BGA元件管脚多、功能复杂，而BGA元件与印制电路板精准对位贴装难度越来越高，BGA元件贴装不良缺陷导致的返修、报废等问题严重影响印制电路板和BGA元件组装产品的良率和生产效率。
 技术解决方案
本发明实施例提供一种BGA元件自对位结构及对位方法，以解决高密度BGA组装要求精度高，BGA元件组装易偏位导致产品返修并严重影响产品良率及生产效率的技术问题。
第一方面，本发明提供了一种BGA元件自对位结构，BGA元件包括基板和设于所述基板底面的BGA植球，包括电路板机构和第二对位结构，所述电路板机构包括印制电路板以及设于所述印制电路板上的第一对位结构，所述第一对位结构用于与BGA植球相匹配；所述第二对位结构包括一对治具，一对所述治具间隔相向设置于所述印制电路板的上方，用于限位于基板的两侧。
优选地，所述第一对位结构包括开设于所述印制电路板上的开孔、填充于所述开孔的孔腔内的填充介质结构、设于所述填充介质结构上的凹槽，所述凹槽与BGA植球形状相匹配。
优选地，所述开孔为通孔或盲孔，所述填充介质结构由油墨或树脂填充开孔内孔腔形成。
优选地，所述填充介质结构的顶面加附导通层，所述导通层电导通所述凹槽两侧的所述印制电路板的线路。
优选地，一对所述治具具有相向设置的倾斜限位面，所述倾斜限位面的倾斜角角度范围为2°-20°。
优选地，一对所述治具的外表设有镀钛膜。
优选地，一对所述治具分别紧固于基板两侧的所述印制电路板上方。
第二方面，本发明提供了一种BGA元件自对位方法，包括以下步骤：
获取印制电路板和BGA元件的电性设计需求；
根据获取的印制电路板和BGA元件的电性设计需求，在印制电路板上设置与所述BGA元件的BGA植球相匹配的第一定位结构；
获取BGA元件的尺寸信息；
根据获取的BGA元件的尺寸信息，制作第二定位结构；
通过将BGA植球匹配入所述第一定位结构中，第二定位结构限位于所述BGA元件的两侧位置，将BGA元件对位于印制电路板上。
优选地，所述“根据获取的印制电路板和BGA元件的电性设计需求，在印制电路板上设置与所述BGA元件的BGA植球相匹配的第一定位结构”步骤，具体包括以下步骤：
根据获取的印制电路板和BGA元件的电性设计需求，在印制电路板上开设多个开孔；
在开孔的孔腔内填充介质形成填充介质结构；
在填充介质结构的顶面塑型形成与BGA植球相匹配的凹槽；
在所述填充介质结构顶面加附电导通所述凹槽两侧的印制电路板上的线路的导通层。
优选地，所述“根据获取的BGA元件的尺寸信息，制作第二定位结构”步骤，具体包括以下步骤：
根据获取的BGA元件的尺寸信息，获取一对治具的高度、倾斜限位面的倾斜角和两个所述治具的间隙；
根据获取的一对治具的高度、倾斜限位面的倾斜角和两个所述治具的间隙，制作一对治具；
在制作完成的一对所述治具的表面PVD真空电镀镀钛膜。
 有益效果
本发明提供的技术方案带来的有益效果包括：
本发明提供的BGA元件自对位结构通过设置第一对位结构和第二对位结构，第一对位结构与BGA植球相匹配，第二对位结构限位于基板的两侧和印制电路板的上方，将BGA元件精准对位于印制电路板上，有效保障了BGA元件在印制电路板上的贴装良率，降低BGA贴装不良导致的返修和报废成本，提升了BGA元件的贴装加工效率。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为BGA元件的侧视图；
图2为BGA元件的仰视图；
图3为本发明提供的BGA元件自对位结构的使用状态图；
图4为本发明提供的BGA元件自对位结构的另一使用状态图；
图5为未开孔的印制电路板的剖面图；
图6为本发明提供的开通孔的印制电路板的剖面图；
图7为本发明提供的开盲孔的印制电路板的剖面图；
图8为本发明提供的印制电路板的通孔内设有填充介质结构的剖面图；
图9为本发明提供的印制电路板的盲孔内设有填充介质结构的剖面图；
图10为本发明提供的印制电路板的通孔设有填充介质结构和凹槽的剖面图；
图11为本发明提供的印制电路板的盲孔内设有填充介质结构和凹槽的剖面图；
图12为本发明提供的印制电路板的通孔内设有填充介质结构、凹槽和导通层的剖面图；
图13为本发明提供的印制电路板的盲孔内设有填充介质结构、凹槽和导通层的剖面图；
图14为本发明提供的一对治具的结构示意图；
图15为本发明提供的一对治具上设有镀钛层的结构示意图；
图16为本发明提供的一对治具螺接固定于印制电路板上的结构示意图；
图17为本发明提供的一对治具卡接固定于印制电路板上的结构示意图。
图中：11、基板；12、BGA植球；20、印制电路板；21、通孔；22、盲孔；23、填充介质结构；24、凹槽；25、导通层；30、治具；301、镀钛膜；31、倾斜限位面；32、螺钉；33、卡接结构。
 本发明的最佳实施方式
本发明实施例提供了一种BGA元件自对位结构及对位方法，其能解决高密度BGA组装要求精度高，BGA元件组装易偏位导致产品返修并严重影响产品良率及生产效率的技术问题。
请参考图3-4，本发明提供了一种BGA元件自对位结构，包括电路板机构和第二对位结构，所述电路板机构包括印制电路板20以及设于所述印制电路板20上的第一对位结构，所述第一对位结构用于与BGA植球12相匹配；所述第二对位结构包括一对治具30，一对所述治具30间隔相向设置于所述印制电路板20的上方，用于限位于基板11的两侧。
本发明提供的BGA元件自对位结构通过设置第一对位结构和第二对位结构，第一对位结构与BGA植球12相匹配，第二对位结构限位于基板11的两侧和印制电路板20的上方，将BGA元件精准对位于印制电路板20上，有效保障了BGA元件在印制电路板20上的贴装良率，降低BGA贴装不良导致的返修和报废成本，提升了BGA元件的贴装加工效率；有别于传统BGA元件平面贴装，本发明提供的BGA元件自对位结构利用带凹槽24的印制电路板20，更易于定位校正BGA元件的位置精度。
基于同一发明构思，本发明提供了一种BGA元件自对位方法，包括以下步骤：
S110、获取印制电路板20和BGA元件的电性设计需求；
S120、根据获取的印制电路板20和BGA元件的电性设计需求，在印制电路板20上设置与所述BGA元件的BGA植球12相匹配的第一定位结构；
S210、获取BGA元件的尺寸信息；
S220、根据获取的BGA元件的尺寸信息，制作第二定位结构；
S300、通过将BGA植球12匹配入所述第一定位结构中，第二定位结构限位于所述BGA元件的基板11的两侧位置，将BGA元件对位于印制电路板20上。
本发明提供的BGA元件自对位方法，实现对BGA元件高精度对位贴装加工，实现成本低，设计灵活，适用范围广。
 本发明的实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明实施例提供了一种BGA元件自对位结构及对位方法，其能解决高密度BGA组装要求精度高，BGA元件组装易偏位导致产品返修并严重影响产品良率及生产效率的技术问题。
请参考图3-4，本发明提供了一种BGA元件自对位结构，包括电路板机构和第二对位结构，所述电路板机构包括印制电路板20以及设于所述印制电路板20上的第一对位结构，所述第一对位结构用于与BGA植球12相匹配；所述第二对位结构包括一对治具30，一对所述治具30间隔相向设置于所述印制电路板20的上方，用于限位于基板11的两侧。
本发明提供的BGA元件自对位结构通过设置第一对位结构和第二对位结构，第一对位结构与BGA植球12相匹配，第二对位结构限位于基板11的两侧和印制电路板20的上方，将BGA元件精准对位于印制电路板20上，有效保障了BGA元件在印制电路板20上的贴装良率，降低BGA贴装不良导致的返修和报废成本，提升了BGA元件的贴装加工效率；有别于传统BGA元件平面贴装，本发明提供的BGA元件自对位结构利用带凹槽24的印制电路板20，更易于定位校正BGA元件的位置精度。
在一实施例中，所述第一对位结构包括开设于所述印制电路板20上的开孔、填充于所述开孔的孔腔内的填充介质结构23、设于所述填充介质结构23上的凹槽24，所述凹槽24与BGA植球12形状相匹配。
在一实施例中，根据印制电路板20和BGA元件的电性设计需求，所述开孔可以实现为如图6所示的通孔21，也可以实现为如图7所示的盲孔22，只要能实现为填充介质和BGA元件上的BGA植球12相对位位置处提供填充孔腔即可。
在一实施例中，所述开孔为通孔21时，其中一个孔口提供为填充介质填充入口，另一个孔口为BGA植球12和开孔两侧的印制电路板20电导通设置导通层25提供灵活性选择操作空间。
在一实施例中，所述填充介质结构23由油墨或树脂类材料填孔而成，确保孔全部填充无间隙。
在一实施例中，所述填充介质结构23的顶面加附导通层25，所述导通层25电导通所述凹槽24两侧的所述印制电路板20的线路。
在一实施例中，一对所述治具30具有相向设置的倾斜限位面31，一对倾斜限位面31间隔设置印制电路板20上方，间隔距离即间隙根据BGA元件的尺寸而定，包括基板11的高度、宽度和BGA植球12的贴装嵌入凹槽24中的深度值，一对倾斜限位面31间隔固定于印制电路板20的上方，为BGA元件对位于印制电路板20上提供对位导向和最终限位作用。
在一实施例中，所述倾斜限位面31的倾斜角角度范围为2°-20°，根据BGA元件尺寸和BGA植球12的嵌入凹槽24的深度值而定。
在一实施例中，为解决BGA元件对位后焊接组装过程中高温对一对治具30的形变造成影响，以及高温焊接时，焊料添加物或助焊剂材料的挥发附着对治具30表面特别是倾斜限位面31的光滑壁面的影响，一对所述治具30的外表设有抗磨耐高温膜。
在一较具体实施例中，一对所述治具30的表面通过真空PVD技术电镀镀钛膜301。
在一实施例中，通过控制PVD真空电镀参数，镀钛膜301的厚度控制在3μm-5μm范围内。
在一实施例中，一对所述治具30拆卸式连接于印制电路板20的上方，在将BGA元件组装于印制电路板20上后，将一对治具30从电路板上拆除。
在一具体实施例，一对所述治具30分别螺接或卡接固定于基板11两侧的所述印制电路板20上。
基于同一发明构思，本发明提供了一种BGA元件自对位方法，包括以下步骤：
S110、获取印制电路板20和BGA元件的电性设计需求；
S120、根据获取的印制电路板20和BGA元件的电性设计需求，在印制电路板20上设置与所述BGA元件的BGA植球12相匹配的第一定位结构；
S210、获取BGA元件的尺寸信息；
S220、根据获取的BGA元件的尺寸信息，制作第二定位结构；
S300、通过将BGA植球12匹配入所述第一定位结构中，第二定位结构限位于所述BGA元件的基板11的两侧位置，将BGA元件对位于印制电路板20上。
本发明提供的BGA元件自对位方法，实现对BGA元件高精度对位贴装加工，实现成本低，设计灵活，适用范围广。
在一实施例中，所述“S120、根据获取的印制电路板20和BGA元件的电性设计需求，在印制电路板20上设置与所述BGA元件的BGA植球12相匹配的第一定位结构”步骤，具体包括以下步骤：
S121、如图5-7所示，根据获取的印制电路板20和BGA元件的电性设计需求，在印制电路板20上开设多个开孔，所述开孔可以实现为通孔21或盲孔22；
S122、如图8-9所示，在开孔的孔腔内填充介质形成填充介质结构23；
S123、如图10-11所示，在填充介质结构23的顶面塑型形成与BGA植球12相匹配的凹槽24；
S124、如图12-13所示，在所述填充介质结构23顶面加附电导通所述凹槽24两侧的印制电路板20上的线路的导通层25。
在一实施例中，步骤S121中，参考BGA元件的BGA植球12位置以及BGA元件的引脚具体尺寸，在印制电路板20相应区域开孔，加工实现简单方便，无需引用新的加工工艺，利用常规电路板加工工艺开孔加工即可实现。
在一实施例中，步骤S123中，采用激光烧蚀、药水咬蚀的方式在填充介质结构23的顶面塑型与BGA植球12形状相匹配的凹槽24。
在一实施例中，步骤S124中，依据印制电路板20和BGA元件电性设计需求，在需要导通开孔处的填充介质结构23的顶面或底面加附导通层25。
在一实施例中，在填充介质结构23的顶面或底面金属化处理，利用溅射、化学沉积等手段在需要导通的开孔处的填充介质结构23的顶面或底面实现导通层25。
在一实施例中，所述“S220、根据获取的BGA元件的尺寸信息，制作第二定位结构”步骤，具体包括以下步骤：
S221、根据获取的BGA元件的尺寸信息，获取一对治具30的高度、倾斜限位面31的倾斜角和两个所述治具30的间隙；
S222、如图14所示，根据获取的一对治具30的高度、倾斜限位面31的倾斜角和两个所述治具30的间隙，制作一对治具30；
S223、如图15所示，在制作完成的一对所述治具30的表面PVD真空电镀镀钛膜301。
在一实施例中，步骤S222中，通过电铸工艺加工制作一对符合尺寸要求的治具30，充分利用电铸工艺的高精密性制作辅助对位电铸治具30，进一步提升BGA元件的对位精度。
其中，如图14所示，匹配BGA元件尺寸合理设计电铸治具30开口参数L、H及φ，其中L=BGA元件长度+封装尺寸最大正公差，BGA元件厚度*60%≤H≤BGA元件厚度*80%，H不超过BGA元件厚度，预防开口内叠料，0°≤φ≤30°。
在一实施例中，所述“S300、通过将BGA植球12匹配入所述第一定位结构中，第二定位结构限位于所述BGA元件的两侧位置，将BGA元件对位于印制电路板20上”步骤，具体包括以下步骤：
S310、将两治具30按照开口参数L，间隔固定于印制电路板20上；
S320、将BGA元件自两治具30之间的间隙下移，直至BGA植球12嵌入对应的凹槽24中，基板11的两侧限位于两治具30的倾斜限位面31之间时，完成BGA元件和印制电路板20的对位。
在一实施例中，步骤“S310、将两治具30间隔固定于印制电路板20上”具体包括以下步骤：
将两治具30间隔拆卸式连接固定于印制电路板20上。
所述拆卸式连接可以实现为如图16所示的螺接固定方式，通过螺钉32固定，还可以实现为如图17所示的卡接固定方式，将两个治具30的端部和所述印制电路板20的两端通过卡接结构33对应卡接固定在一起。
在一实施例中，所述“S320、将BGA元件自两治具30之间的间隙下移，直至BGA植球12嵌入对应的凹槽24中，基板11的两侧限位于两治具30的倾斜限位面31之间时，完成BGA元件和印制电路板20的对位”步骤之后，还包括以下步骤：
S400、将BGA元件焊接组装于印制电路板20上后，移除一对治具30，完成BGA元件和印制电路板20的组装。
在本发明的描述中，需要说明的是，术语“上”、“下”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
需要说明的是，在本发明中，诸如“第一”和“第二”等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本发明的具体实施方式，使本领域技术人员能够理解或实现本发明。对这些实施例的多种修改对本领域的技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所发明的原理和新颖特点相一致的最宽的范围。
 工业实用性
本发明提供的BGA元件自对位结构通过设置第一对位结构和第二对位结构，第一对位结构与BGA植球12相匹配，第二对位结构限位于基板11的两侧和印制电路板20的上方，将BGA元件精准对位于印制电路板20上，有效保障了BGA元件在印制电路板20上的贴装良率，降低BGA贴装不良导致的返修和报废成本，提升了BGA元件的贴装加工效率；有别于传统BGA元件平面贴装，本发明提供的BGA元件自对位结构利用带凹槽24的印制电路板20，更易于定位校正BGA元件的位置精度，可以在工业上进行应用，能够满足工业应用性要求
 序列表自由内容
在此处键入序列表自由内容描述段落。

Claims (7)

  1. 一种BGA元件自对位结构，BGA元件包括基板和设于所述基板底面的BGA植球，其特征在于，包括：
    电路板机构，包括印制电路板以及设于所述印制电路板上的第一对位结构，所述第一对位结构用于与BGA植球相匹配；
    第二对位结构，包括一对治具，一对所述治具间隔相向设置于所述印制电路板的上方，用于限位于基板的两侧；
    所述第一对位结构包括开设于所述印制电路板上的开孔、填充于所述开孔的孔腔内的填充介质结构、设于所述填充介质结构上的凹槽，所述凹槽与BGA植球形状相匹配。
  2. 如权利要求1所述的BGA元件自对位结构，其特征在于，所述开孔为通孔或盲孔，所述填充介质结构由油墨或树脂填充所述开孔的孔腔形成。
  3. 如权利要求1所述的BGA元件自对位结构，其特征在于，所述填充介质结构的顶面加附导通层，所述导通层电导通所述凹槽两侧的所述印制电路板的线路。
  4. 如权利要求1所述的BGA元件自对位结构，其特征在于，一对所述治具具有相向设置的倾斜限位面，所述倾斜限位面的倾斜角角度范围为2°-20°。
  5. 如权利要求4所述的BGA元件自对位结构，其特征在于，一对所述治具的外表设有镀钛膜。
  6. 如权利要求1所述的BGA元件自对位结构，其特征在于，一对所述治具分别紧固于所述基板两侧的所述印制电路板上方。
  7. 一种BGA元件自对位方法，其特征在于，包括以下步骤：
    获取印制电路板和BGA元件的电性设计需求；
    根据获取的印制电路板和BGA元件的电性设计需求，在印制电路板上设置与所述BGA元件的BGA植球相匹配的第一定位结构；
    获取BGA元件的尺寸信息；
    根据获取的BGA元件的尺寸信息，制作第二定位结构；
    通过将BGA植球匹配入所述第一定位结构中，第二定位结构限位于基板的两侧位置，将BGA元件对位于印制电路板上；所述“根据获取的印制电路板和BGA元件的电性设计需求，在印制电路板上设置与所述BGA元件的BGA植球相匹配的第一定位结构”步骤，具体包括以下步骤：
    根据获取的印制电路板和BGA元件的电性设计需求，在印制电路板上开设多个开孔；
    在开孔的孔腔内填充介质形成填充介质结构；
    在填充介质结构的顶面塑型形成与BGA植球相匹配的凹槽；
    在所述填充介质结构顶面加附电导通所述凹槽两侧的印制电路板上的线路的导通层；所述“根据获取的BGA元件的尺寸信息，制作第二定位结构”步骤，具体包括以下步骤：
    根据获取的BGA元件的尺寸信息，获取一对治具的高度、倾斜限位面的倾斜角和两个所述治具的间隙；
    根据获取的一对治具的高度、倾斜限位面的倾斜角和两个所述治具的间隙，制作一对治具；
    在制作完成的一对所述治具的表面PVD真空电镀镀钛膜。
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