WO2023112667A1 - 電子部品 - Google Patents

電子部品 Download PDF

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Publication number
WO2023112667A1
WO2023112667A1 PCT/JP2022/044051 JP2022044051W WO2023112667A1 WO 2023112667 A1 WO2023112667 A1 WO 2023112667A1 JP 2022044051 W JP2022044051 W JP 2022044051W WO 2023112667 A1 WO2023112667 A1 WO 2023112667A1
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WIPO (PCT)
Prior art keywords
electrode
electronic component
conductive particles
component according
intermediate electrode
Prior art date
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PCT/JP2022/044051
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English (en)
French (fr)
Japanese (ja)
Inventor
孝志 大林
嘉孝 中村
浩克 伊藤
恭佑 磯野
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to CN202280077841.5A priority Critical patent/CN118302829A/zh
Priority to JP2023567662A priority patent/JP7724483B2/ja
Publication of WO2023112667A1 publication Critical patent/WO2023112667A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H01C1/148—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Definitions

  • This disclosure relates to electronic components. More particularly, it relates to an electronic component having an element portion on a substrate.
  • Patent Document 1 describes a chip resistor.
  • the chip resistor includes a substrate having an upper surface, a resistance layer provided on the upper surface of the substrate, and electrically connected to the resistance layer at both ends of the resistance layer on the upper surface of the substrate.
  • a first upper electrode layer provided; and silver particles provided on the first upper electrode layer and having a content of 75% by weight or more and 85% by weight or less and an average particle diameter of between 0.3 ⁇ m and 2 ⁇ m.
  • a second upper electrode layer containing 1% by weight or more and 10% by weight or less of carbon and resin.
  • An object of the present disclosure is to provide an electronic component that can reduce the occurrence of disconnection due to sulfide gas and can suppress the generation of sulfide.
  • An electronic component includes a substrate, an element portion formed on the substrate, a lead electrode connected to the element portion, an insulating protective layer, an intermediate electrode, and covering the intermediate electrode. and an external electrode.
  • the insulating protective layer covers the element section and part of the extraction electrode.
  • the intermediate electrode covers a portion of the insulating protective layer and a portion of the surface of the extraction electrode that is not covered with the insulating protective layer.
  • the intermediate electrode includes conductive particles and a resin component.
  • the conductive particles include fibrous conductive particles and flaky conductive particles.
  • FIG. 1 is a cross-sectional view showing an electronic component (chip resistor) according to this embodiment.
  • 2A to 2C are explanatory diagrams showing the manufacturing process of the electronic component (chip resistor) according to this embodiment.
  • 3A to 3H are explanatory diagrams showing the manufacturing process of the electronic component (chip resistor) according to this embodiment.
  • An electronic component 10 according to the present embodiment has a configuration similar to that of the chip resistor described in Patent Document 1. That is, the electronic component 10 includes a substrate 1, an element portion 2 formed on the substrate 1, a lead electrode 3 connected to the element portion 2, an insulating protective layer 13, an intermediate electrode 9, and an intermediate electrode 9. and a covering external electrode 14 .
  • the insulating protective layer 13 covers the element section 2 and part of the extraction electrode 3 .
  • the intermediate electrode 9 covers part of the insulating protective layer 13 and the surface of the extraction electrode 3 that is not covered with the insulating protective layer 13 .
  • the intermediate electrode 9 contains conductive particles and a resin component, and the conductive particles contain fibrous conductive particles and flaky conductive particles.
  • disconnection of the extraction electrode 3 means both the case where the extraction electrode 3 is physically cut by the grown sulfide and the case where the electrical resistance of the extraction electrode 3 is increased by the sulfide and the electrical connection is interrupted. including.
  • the intermediate electrode 9 contains resin, fibrous conductive particles, and flaky conductive particles, the intermediate electrode 9 has good adhesion to the lead-out electrode 3, is less likely to peel off, has a low resistance value, and has a low resistance value. Generation (crystal growth) of sulfide from the electrode 9 can also be suppressed, and appearance defects can be reduced.
  • the electronic component 10 is a chip resistor.
  • a chip resistor is, for example, a chip resistor for surface mounting (SMT) that is mounted on the surface (mounting surface) of a printed circuit board using a surface mounter (mounter). Also, the chip resistor is, for example, a thick film chip resistor.
  • the electronic component 10 includes, for example, a substrate 1, an element section 2, a lead electrode 3, an insulating protective layer 13, an intermediate electrode 9, and an external electrode 14, as shown in FIG.
  • the substrate 1 is electrically insulating and is, for example, an alumina substrate containing 96% to 99% Al 2 O 3 (alumina).
  • the shape of the substrate 1 in plan view is, for example, a rectangular shape such as a rectangular shape.
  • the element section 2 is a resistive element, has electrical resistance, is a thick film, and is provided on one surface of the substrate 1 (upper surface in FIG. 1).
  • the element section 2 is made of RuO 2 , AgPd, CuNi, or the like, for example.
  • the element portion 2 is positioned substantially in the center of the substrate 1 in plan view, and has a rectangular shape in plan view, for example.
  • the extraction electrodes 3 are top electrodes, and are provided in pairs on the top surface of the substrate 1 .
  • Each extraction electrode 3 is electrically connected to the element portion 2 at both ends in the longitudinal direction (horizontal direction in FIG. 1) of the element portion 2 . Specifically, one end of each extraction electrode 3 is positioned below the element section 2 , and the other end of each extraction electrode 3 is positioned at the right end or left end of the substrate 1 .
  • the extraction electrode 3 is formed containing metallic silver. Moreover, the extraction electrode 3 may contain a metal such as copper, gold, nickel, or tin.
  • the extraction electrode 3 is made of, for example, a hardened conductive paste.
  • the conductive paste contains, for example, a resin component or a glass component and conductor particles.
  • the conductor particles can be formed of particles containing the above metal.
  • the extraction electrode 3 is made of, for example, an Ag-based cermet thick film electrode.
  • the insulating protective layer 13 is a layer for protecting the element section 2 by making it difficult for gases such as sulfide gas and moisture (humidity) to come into contact with the element section 2 .
  • the insulating protective layer 13 covers the entire element section 2 .
  • the insulating protective layer 13 partially covers the extraction electrode 3 .
  • the part of the lead-out electrode 3 is the end portion of the lead-out electrode 3 connected to the element portion 2 and its peripheral portion.
  • the insulating protective layer 13 is an electrically insulating layer, and includes a glass film (pre-coated glass) 4 and a resin layer 5 .
  • the glass coating 4 is formed on the surface of the element section 2 and covers the entire element section 2 .
  • the glass film 4 partially covers the extraction electrode 3 at both ends in the longitudinal direction (horizontal direction in FIG. 1). That is, the glass film 4 covers the boundary between the element portion 2 and the pair of lead-out electrodes 3 when viewed from the film thickness direction of the element portion 2 (thickness direction of the substrate 1). It is continuously covered over the edge and its peripheral portion.
  • the resin layer 5 is formed on the surface of the glass coating 4 and covers the entire glass coating 4 . Therefore, the resin layer 5 covers the entire element section 2 with the glass coating 4 interposed therebetween.
  • the glass coating 4 is made of an inorganic material, such as a glass material such as crystal glass or quartz glass, or an inorganic material containing Al 2 O 3 (alumina). Also, the glass coating 4 may be formed of a metal oxide other than alumina, or a metal nitride.
  • the resin layer 5 is a layer for protecting the element portion 2 and the glass coating 4.
  • the resin layer 5 is made of a cured coating agent containing epoxy resin.
  • the resin layer 5 covers the entire surface of the glass coating 4 and part of the pair of extraction electrodes 3 . That is, the resin layer 5 covers the boundary between the glass film 4 and the pair of lead-out electrodes 3 when viewed from the film thickness direction of the element portion 2, and extends continuously from the glass film 4 to at least a part of the pair of lead-out electrodes 3. covering. Therefore, the resin layer 5 covers the element section 2 .
  • the shape of the resin layer 5 in plan view is, for example, a rectangular shape such as a rectangular shape. Portions of the pair of extraction electrodes 3 located between both ends in the longitudinal direction of the glass film 4 (horizontal direction in FIG. 1) and the metal plating layer 7 are directly covered with the resin layer 5 .
  • the resin layer 5 may contain silica particles and silicone rubber particles in addition to the resin. In this case, the stress generated in the resin layer 5 due to heat or the like can be relaxed as compared with the case where the resin layer 5 is formed of resin alone. Therefore, the thermal expansion and contraction of the resin layer 5 easily follows the thermal expansion and contraction of the glass coating 4, and the resin layer 5 and the glass coating 4 are less likely to separate.
  • the intermediate electrode 9 acts as an electrode.
  • the intermediate electrode 9 also acts as a layer that protects the extraction electrode 3 . That is, the intermediate electrode 9 reduces the exposure of the lead-out electrode 3 to gas and moisture to make it less likely to corrode, and also reduces the generation of sulfides such as silver sulfide in the lead-out electrode 3 . As a result, disconnection of the extraction electrode 3 can be reduced, and deterioration of the external appearance due to the formation of sulfide can be reduced.
  • the intermediate electrode 9 partially covers the insulating protective layer 13 .
  • the part of the insulating protective layer 13 is an end portion of the insulating protective layer 13 , and the end surface of the intermediate electrode 9 is in contact with the surface of the resin layer 5 to cover the end portion of the resin layer 5 . . Thereby, the boundary portion between the insulating protective layer 13 and the extraction electrode 3 is covered with the intermediate electrode 9 .
  • the intermediate electrode 9 partially covers the extraction electrode 3 .
  • the portion of the extraction electrode 3 is the portion not covered with the insulating protective layer 13 .
  • the intermediate electrode 9 is formed on the surface of the extraction electrode 3 in a portion not covered with the insulating protective layer 13 . In this manner, the intermediate electrode 9 covers the surface of the lead-out electrode 3 to reduce contact of the lead-out electrode 3 with gas or moisture.
  • the electronic component 10 further includes a pair of backside electrodes 8 .
  • a pair of backside electrodes 8 are provided on the lower surface of the substrate 1 (the surface without the element section 2 and the lead-out electrode 3).
  • Each of the pair of backside electrodes 8 is composed of, for example, an Ag-based cermet thick film electrode.
  • the pair of backside electrodes 8 are positioned at both ends in the longitudinal direction (horizontal direction in FIG. 1) of the backside of the substrate 1 (bottom surface in FIG. 1).
  • the pair of backside electrodes 8 correspond to the pair of extraction electrodes 3 on a one-to-one basis. Note that the pair of backside electrodes 8 may be omitted.
  • the external electrode 14 is a portion used as a terminal for electrical connection when mounting the electronic component 10 on a device.
  • the external electrode 14 has a pair of electrode layers (end face electrodes) 6 and a pair of metal plating layers 7 .
  • Each of the pair of electrode layers 6 is made of a metal layer containing metal such as Ag.
  • the pair of electrode layers 6 are positioned at both ends of the substrate 1 in the longitudinal direction (horizontal direction in FIG. 1).
  • the pair of electrode layers 6 are electrically connected to the pair of extraction electrodes 3 and the pair of backside electrodes 8, respectively.
  • the pair of electrode layers 6 are provided in contact with the surfaces of the lead-out electrode 3 and the back electrode 8 at the ends opposite to the ends on the element section 2 side. Accordingly, the pair of electrode layers 6 cover the intermediate electrode 9 and the back electrode 8, respectively.
  • Each electrode layer 6 is preferably made of a conductor containing resin, carbon particles, and silver powder, for example.
  • the resin component is phenoxy resin, epoxy resin, or the like.
  • the carbon particles are blended for the purpose of assisting the conductivity of the electrode layer 6 .
  • carbon particles are added as a coloring agent for recognizing the application of the conductive paste.
  • As the silver powder a whisker-like inorganic filler whose surface is coated with a silver conductive film, and flaky silver powder can be used.
  • the whisker-like inorganic filler can improve the bending strength of the electrode layer 6 .
  • the flaky silver powder can improve the adhesion between the electrode layer 6 and the metal plating layer 7 .
  • the electrode layer 6 may be a conductor formed from a metal sputter such as a nickel-chromium alloy.
  • the pair of metal plating layers 7 each include a first plating layer 71 and a second plating layer 72 .
  • Each of the pair of metal plating layers 7 is connected to a part of the corresponding lead electrode 3 of the pair of lead electrodes 3 and is in contact with the surface of the resin layer 5 of the insulating protective layer 13 .
  • each of the pair of metal plating layers 7 covers the corresponding electrode layer 6 of the pair of electrode layers 6 .
  • the first plating layer 71 can be formed by Ni plating, for example.
  • the second plating layer 72 can be formed by Sn plating, for example.
  • the external electrode 14 partially covers the insulating protective layer 13 .
  • the part of the insulating protective layer 13 is the end of the insulating protective layer 13
  • the end of the lead electrode 3 on the element section 2 side is covered with the end of the insulating protective layer 13 . Therefore, by covering the edge of the insulating protective layer 13 with the external electrode 14, the boundary between the insulating protective layer 13 and the lead-out electrode 3 can be covered with the external electrode 14, and gas and moisture can enter the lead-out electrode 3. becomes difficult.
  • the intermediate electrode 9 of the electronic component 10 contains conductive particles and a resin component.
  • the conductive particles include fibrous conductive particles and flaky conductive particles.
  • the content of carbon particles in the intermediate electrode 9 is preferably less than 1 wt % with respect to the weight of the solid content contained in the intermediate electrode 9 .
  • the solid content contained in the intermediate electrode 9 includes conductive particles, resin content, and carbon particles.
  • the carbon particles are used as a coloring agent or the like to supplementarily improve the conductivity of the intermediate electrode 9 and to improve the visibility of whether or not the conductive paste is applied when the intermediate electrode 9 is formed with a conductive paste. then used.
  • the intermediate electrode 9 contains carbon particles, sedimentation of the conductive particles is suppressed, and many conductive particles are exposed on the surface, so that sulfides such as silver sulfide (metal sulfides) are easily generated.
  • the carbon particles are less than 1 wt % with respect to the weight of the solid content contained in the intermediate electrode 9 .
  • the intermediate electrode 9 preferably contains as few carbon particles as possible, so the intermediate electrode 9 does not substantially contain carbon particles. That is, the content of carbon particles in the intermediate electrode 9 is 0 wt %.
  • the content of the conductive particles in the intermediate electrode 9 is preferably 46 wt % or more and 61 wt % or less with respect to the weight of the solid content contained in the intermediate electrode 9 . If it is 61 wt% or less, the surface exposure of the conductive particles is small, so if it is in this range, sulfides are less likely to occur in the intermediate electrode 9 even in a sulfide gas atmosphere. , the resistance value of the intermediate electrode 9 is unlikely to increase and the conductivity is unlikely to decrease.
  • the content of the conductive particles in the intermediate electrode 9 is more preferably 48 wt % or more and 60 wt % or less, more preferably 50 wt % or more and 58 wt % or less with respect to the weight of the solid content contained in the intermediate electrode 9 .
  • the resin portion contained in the intermediate electrode 9 is a cured resin, and preferably contains a polyfunctional epoxy resin and a curing agent.
  • the polyfunctional epoxy resin is cured with a curing agent to constitute the resin portion of the intermediate electrode 9 .
  • a polyfunctional epoxy resin is an epoxy resin having multiple epoxy groups in one molecule. Polyfunctional epoxy resins have a higher crosslink density upon curing than monofunctional epoxy resins. Therefore, the glass transition point of the resin portion of the intermediate electrode 9 becomes higher than when a monofunctional epoxy resin is used, and the heat resistance of the intermediate electrode 9 can be improved.
  • Structural formula (1) is a DPP novolac type epoxy resin.
  • Structural formula (2) is a tetraphenylolethane type epoxy resin.
  • Structural formula (3) is a cresol novolac type epoxy resin.
  • Structural formula (4) is a dicyclopentadiene type epoxy resin.
  • Structural formula (5) is an arylene type epoxy resin.
  • Structural formula (6) is a naphthalenediol type epoxy resin. Note that n is an arbitrary integer.
  • the DPP novolac type epoxy resin represented by the structural formula (1) or the tetraphenylolethane type epoxy resin represented by the structural formula (2) is preferable.
  • These epoxy resins give cured products with higher flexibility than other polyfunctional epoxy resins. Therefore, cracks (cracks) and chips are less likely to occur in the intermediate electrode 9 in the thermal cycle test.
  • the curing agent is a curing agent for polyfunctional epoxy resin. That is, the polyfunctional epoxy resin is cured by a curing agent to form the resin portion. At least one of an imidazole curing agent, a phenol novolac curing agent, and a dicyandiamide curing agent can be used as the curing agent.
  • an imidazole curing agent one represented by the following structural formula (7) can be used.
  • a dicyandiamide curing agent one represented by the following structural formula (8) can be used.
  • the phenol novolac type curing agent one represented by the following structural formula (9) can be used. Note that n is an arbitrary integer.
  • a dicyandiamide curing agent is used as the curing agent, it is preferable to use aromatic dimethylurea as a curing catalyst in combination, thereby accelerating the curing of the polyfunctional epoxy resin.
  • the weight ratio of fibrous conductive particles and flaky conductive particles in the intermediate electrode 9 is preferably 5/5 to 7/3. Within this range, it is possible to suppress the generation of sulfide in the intermediate electrode 9 . That is, when the proportion of the flake-like conductive particles is greater than the weight ratio of 5/5, the surface exposure of the conductive particles increases, and silver sulfide tends to occur. Also, if the weight ratio is less than 7/3, the resistance value will increase.
  • the fibrous conductive particles are preferably particles in which fibrous inorganic substances are covered with metal. That is, the fibrous conductive particles are formed by covering the surface of a fibrous inorganic material (inorganic filler) such as a whisker with a metallic conductive film. As a result, the fibrous conductive particles can be obtained with a smaller amount of metal used than in the case of forming the fibrous conductive particles only from metal.
  • a fibrous inorganic material inorganic filler
  • the fibrous inorganic material contains one or more selected from the group consisting of potassium titanate, wastonite, sepiolite, zinc oxide, titanium oxide, barium sulfate, magnesium sulfate, and silicon nitride.
  • the metal forming the conductive film may contain one or more selected from the group consisting of silver, copper, gold, nickel and tin.
  • As the fibrous conductive particles it is possible to use a plurality of types of fibrous conductive particles having different types of fibrous inorganic substances and different types of metals forming the conductive film. , fibrous conductive particles in which the metal forming the conductive film is silver.
  • the fibrous conductive particles preferably have an average fiber diameter of 0.1 ⁇ m or more and 2 ⁇ m or less, an average fiber length of 5 ⁇ m or more and 30 ⁇ m or less, and an aspect ratio of 5 or more and 200 or less.
  • the resistance value can be lowered without breaking the conductive particles.
  • the aspect ratio of the fibrous conductive particles is represented by the value obtained by dividing the average fiber length by the average fiber diameter (average fiber length/average fiber diameter).
  • the average fiber diameter and average fiber length are values determined by SEM observation.
  • the flaky conductive particles preferably contain flaky metal powder, which can further suppress the generation of sulfide in the intermediate electrode 9 .
  • Thin metal foil pieces can be used as the flaky metal powder.
  • the flaky conductive particles include, for example, flaky silver particles.
  • the flaky conductive particles may also contain one or more metals selected from the group consisting of copper, gold, nickel and tin.
  • the flaky conductive particles have an average particle size of 1 ⁇ m or more and 30 ⁇ m or less, and the aspect ratio between the thickness and the average particle size is preferably 5 or more and 300 or less. If the aspect ratio is less than 5, the conductive particles (flakes The bulk density of the conductive particles) is lowered, the conductive particles are not exposed on the surface, and the resistance value is increased. On the other hand, if the aspect ratio exceeds 300, the bulk density becomes too high, and many conductive particles are exposed on the surface, and silver sulfide is likely to occur. Within this range, generation of sulfide in the intermediate electrode 9 can be further suppressed.
  • the aspect ratio between the thickness and the average grain size is represented by the value obtained by dividing the average grain size by the thickness (average grain size/thickness).
  • the average particle size is the 50% particle size by laser diffraction method.
  • a sheet-like substrate 111 is used as shown in FIG. 2A.
  • the sheet-like substrate 111 is formed in a substantially rectangular shape in plan view, and is made of the same material as the substrate 1 and has the same thickness.
  • the sheet-like substrate 111 is formed larger than the substrate 1 and has a size that allows a plurality of substrates 1 to be taken.
  • a plurality of chip regions 12 having the same size as the substrate 1 are formed on the sheet-like substrate 111 .
  • Each chip area 12 corresponds to one substrate 1 . That is, one electronic component 10 is manufactured by forming the element portion 2 and the insulating protective layer 13 in each chip region 12 .
  • a plurality of chip regions 12 are arranged on the sheet-like substrate 111 in the vertical and horizontal directions.
  • the sheet-like substrate 111 is divided into strip-like substrates 11 in which a plurality of chip regions 12 are arranged in the vertical direction as shown in FIG. 2B.
  • the strip-shaped substrate 11 is laterally divided to form the substrate 1 having one chip region 12 as shown in FIG. 2C.
  • a back surface electrode (not shown in FIGS. 2A to 2C and FIGS. 3A to 3H) is formed on the back surface of each chip region 12 of the sheet-like substrate 111.
  • lead electrodes 3 are formed on the surface of each chip region 12 of the sheet-like substrate 111 (see FIG. 3A).
  • the lead-out electrode 3 and the rear surface electrode are formed by, for example, printing (applying) a conductive paste to both longitudinal ends of the front surface and rear surface of the chip region 12 by screen printing, and then sintering the paste.
  • the extraction electrode 3 and the back electrode are formed by forming a metal film on both longitudinal ends of the front and back surfaces of the chip region 12 by sputtering, and then removing unnecessary portions of the film by photolithography and etching. good too.
  • the element portions 2 are formed on the surface of each chip region 12 of the sheet-like substrate 111 (see FIG. 3B).
  • the element portion 2 is formed by, for example, printing (coating) a resistor paste made of RuO 2 on the surface of the chip region 12 by screen printing, and then firing the paste.
  • a glass film 4 is formed to cover the surface of the element portion 2 (see FIG. 3C).
  • the glass coating 4 is formed, for example, by printing (applying) a glass coating agent to each chip region 12 by screen printing and then baking the printed material.
  • trimming is performed (see FIG. 3D). Trimming is performed to adjust the resistance value of the electronic component 10 . Trimming is performed by removing part of the element part 2 and the glass coating 4 of each chip area 12 to form a trimming part 20 .
  • a resin layer 5 is formed to cover the surface of the glass coating 4 (see FIG. 3E).
  • the resin layer 5 is formed by printing (applying) a coating agent, which will be described later, onto the chip region 12 by screen printing, and then curing the coating by heating or the like.
  • a display portion is formed on the surface of the resin layer 5 .
  • characters "102" are formed as the display portion.
  • the display section indicates the resistance value, product number, type, and the like of the electronic component 10 .
  • the display section is formed, for example, by printing ink on the surface of the resin layer 5 by imprinting or the like, and then curing the ink with heat, ultraviolet rays, or the like.
  • the intermediate electrode 9 is formed on the surface of the extraction electrode 3 .
  • a conductive paste containing an uncured resin portion and conductive particles can be used.
  • the intermediate electrode 9 is formed by, for example, printing (applying) a conductive paste by screen printing onto the surface of the extraction electrode 3 in a portion not covered with the glass film 4 and the resin layer 5 (insulating protective layer 13), and then leaving the paste uncured. It is formed by curing the resin content of
  • the sheet-like substrate 111 is divided into elongated strips (primary division) to form the strip-shaped substrates 11 as shown in FIG. 2B.
  • the division position of the sheet-like substrate 111 is indicated by a dashed line in FIG. 2A.
  • the sheet-like substrate 111 is divided at both ends in the longitudinal direction of the chip area 12 . Thereby, a plurality of chip regions 12 are arranged along the longitudinal direction of the strip-shaped substrate 11 .
  • Lead electrodes 3 formed in each chip area 12 are arranged along the longitudinal direction of the strip-shaped substrate 11 .
  • an electrode layer 6 is formed in each chip area 12 (see FIG. 3F).
  • the electrode layers 6 are formed at the ends of the strip-shaped substrate 11 in the longitudinal direction.
  • the electrode layer 6 is formed by, for example, printing (applying) a conductive paste or the like and curing the paste.
  • the electrode layer 6 may be formed by sputtering, for example.
  • the strip-shaped substrate 11 is divided (secondary division) so as to be individualized in each chip region 12 to form the substrate 1 as shown in FIG. 2C.
  • a first plating layer 71 and a second plating layer 72 that constitute the metal plating layer 7 are sequentially formed (see FIGS. 3G and 3H).
  • the electronic component 10 is formed.
  • the electronic component 10 is subjected to completion inspection and taping, and then shipped.
  • the electronic component (10) includes the substrate (1), the element section (2) formed on the substrate (1), and the element section (2). It comprises an extraction electrode (3), an insulating protective layer (13), an intermediate electrode (9), and an external electrode (14) covering the intermediate electrode (9).
  • An insulating protective layer (13) covers the element section (2) and part of the extraction electrode (3).
  • the intermediate electrode (9) covers a portion of the insulating protective layer (13) and the surface of the extraction electrode (3) that is not covered with the insulating protective layer (13).
  • the intermediate electrode (9) contains conductive particles and a resin component.
  • the conductive particles include fibrous conductive particles and flaky conductive particles.
  • the intermediate electrode (9) can reduce disconnection of the lead-out electrode (3) due to sulfide gas, and has the advantage of suppressing the generation of sulfide.
  • a second aspect is the electronic component (10) according to the first aspect, wherein the content of carbon particles in the intermediate electrode (9) is less than 1 wt%.
  • a third aspect is the electronic component (10) according to the first or second aspect, wherein the weight ratio of the fibrous conductive particles and the flaky conductive particles in the intermediate electrode (9) is 5/5 to 7. /3.
  • a fourth aspect is the electronic component (10) according to any one of the first to third aspects, wherein the weight of the conductive particles in the solid content of the intermediate electrode (9) is 46 wt% or more and 61 wt% or less. is.
  • a fifth aspect is the electronic component (10) according to any one of the first to fourth aspects, wherein the resin component contains a polyfunctional epoxy resin and an epoxy curing agent.
  • a sixth aspect is the electronic component (10) according to any one of the first to fifth aspects, wherein the fibrous conductive particles include particles in which fibrous inorganic substances are covered with metal.
  • the fibrous conductive particles can be obtained with a reduced amount of metal used.
  • a seventh aspect is the electronic component (10) according to any one of the first to sixth aspects, wherein the fibrous conductive particles have an average fiber diameter of 0.1 ⁇ m or more and 2 ⁇ m or less and an average fiber length of 5 ⁇ m. 30 ⁇ m or more, and the aspect ratio is 5 or more and 200 or less.
  • An eighth aspect is the electronic component (10) according to any one of the first to seventh aspects, wherein the flake-like conductive particles contain flake-like metal powder.
  • a ninth aspect is the electronic component (10) according to any one of the first to eighth aspects, wherein the flake-shaped conductive particles have an average particle size of 1 ⁇ m or more and 30 ⁇ m or less, and the thickness and the average particle size has an aspect ratio of 5 or more and 300 or less.
  • a tenth aspect is the electronic component (10) according to any one of the first to ninth aspects, wherein the intermediate electrode (9) does not substantially contain carbon particles.
  • An eleventh aspect is the electronic component (10) according to any one of the first to tenth aspects, wherein the insulating protective layer (13) comprises a glass film (4) covering the element portion (2), a glass and a resin layer (5) covering the coating (4).
  • the insulating protective layer (13) can be made difficult to peel off from the element section (2).
  • a twelfth aspect is the electronic component (10) according to any one of the first to eleventh aspects, wherein the external electrode (14) comprises an electrode layer (6) and a metal plating covering the electrode layer (6). a layer (7);
  • the electrode layer (6) is a conductor containing resin, carbon particles and silver powder, or a conductor formed by metal sputtering.
  • the external electrodes (14) can be easily formed.
  • a thirteenth aspect is the electronic component (10) according to any one of the first to twelfth aspects, wherein the external electrode (14) partially covers the insulating protective layer (13).
  • a fourteenth aspect is the electronic component (10) according to any one of the first to thirteenth aspects, wherein the extraction electrode (3) contains silver.
  • a fifteenth aspect is the electronic component (10) according to any one of the first to fourteenth aspects, wherein the conductive particles contain silver.
  • An electronic component (chip resistor) shown in FIG. 1 was fabricated according to the steps shown in FIGS. 2A-C and 3A-H.
  • An intermediate electrode was formed to have the composition shown in Table 1.
  • resin 1 of the polyfunctional epoxy resin a DPP novolak type epoxy resin of structural formula (1) was used.
  • resin 2 of the polyfunctional epoxy resin a tetraphenylolethane type epoxy resin of structural formula (2) was used.
  • curing agent A an imidazole-based curing agent of structural formula (7) was used.
  • the curing agent B the dicyandiamide curing agent of structural formula (8) and aromatic dimethylurea (curing catalyst) were used in combination.
  • fibrous conductive particles a fibrous inorganic material made of potassium titanate and coated with a silver conductive film was used.
  • flaky conductive particles flaky silver powder was used.

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
PCT/JP2022/044051 2021-12-13 2022-11-29 電子部品 Ceased WO2023112667A1 (ja)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06157876A (ja) * 1992-11-30 1994-06-07 Ajinomoto Co Inc 導電性一液型エポキシ樹脂組成物
JP2004079811A (ja) * 2002-08-19 2004-03-11 Hokuriku Electric Ind Co Ltd チップ電子部品及びその製造方法
JP2004288924A (ja) * 2003-03-24 2004-10-14 Alps Electric Co Ltd 可変抵抗器
WO2019131352A1 (ja) * 2017-12-25 2019-07-04 ペルノックス株式会社 チップ状電子部品
JP2021182587A (ja) * 2020-05-19 2021-11-25 Koa株式会社 チップ抵抗器およびチップ抵抗器の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06157876A (ja) * 1992-11-30 1994-06-07 Ajinomoto Co Inc 導電性一液型エポキシ樹脂組成物
JP2004079811A (ja) * 2002-08-19 2004-03-11 Hokuriku Electric Ind Co Ltd チップ電子部品及びその製造方法
JP2004288924A (ja) * 2003-03-24 2004-10-14 Alps Electric Co Ltd 可変抵抗器
WO2019131352A1 (ja) * 2017-12-25 2019-07-04 ペルノックス株式会社 チップ状電子部品
JP2021182587A (ja) * 2020-05-19 2021-11-25 Koa株式会社 チップ抵抗器およびチップ抵抗器の製造方法

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JP7724483B2 (ja) 2025-08-18
CN118302829A (zh) 2024-07-05

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