WO2023103493A1 - 一种基于双积分球的芯片测试设备及测试方法 - Google Patents

一种基于双积分球的芯片测试设备及测试方法 Download PDF

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Publication number
WO2023103493A1
WO2023103493A1 PCT/CN2022/117444 CN2022117444W WO2023103493A1 WO 2023103493 A1 WO2023103493 A1 WO 2023103493A1 CN 2022117444 W CN2022117444 W CN 2022117444W WO 2023103493 A1 WO2023103493 A1 WO 2023103493A1
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WIPO (PCT)
Prior art keywords
chip
integrating sphere
test
adsorption
alignment
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PCT/CN2022/117444
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English (en)
French (fr)
Inventor
张智峰
杜海洋
杨宁
梁书尧
刘强
薛飞飞
Original Assignee
河北圣昊光电科技有限公司
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Publication of WO2023103493A1 publication Critical patent/WO2023103493A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G01M11/0207—Details of measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02—Details
    • G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
    • G01J3/0254—Spectrometers, other than colorimeters, making use of an integrating sphere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/28—Investigating the spectrum
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G01M11/0207—Details of measuring devices
    • G01M11/0214—Details of devices holding the object to be tested

Definitions

  • the present application relates to the technical field of chip testing, in particular to a chip testing device and testing method based on a double integrating sphere.
  • Integrated Circuit also known as microchip, chip or chip
  • Integrated Circuit is a way to miniaturize circuits (including semiconductor devices, including passive components, etc.), and is often manufactured on the surface of semiconductor wafers, and widely It is used in various fields such as mobile terminals, computer equipment, face recognition, smart home, unmanned driving, and aerospace.
  • the thickness of integrated circuit chips is becoming thinner and thinner, and the processing and detection accuracy of chips is getting higher and higher.
  • the chip size manufactured by the manufacturer the most common size is a rectangle. After the existing chip is processed, it needs to be detected by a detection mechanism. Whether the photoelectric characteristics and working status meet the requirements.
  • the existing chip test system can only test chips with a single range and range of power and wavelength.
  • test system configuration structure needs to be dismantled, and then another set of test system configuration structure with the corresponding range and range needs to be replaced; the other is that a test that only applies to the range and range of the chip under test needs to be purchased separately equipment.
  • the above two methods have not only greatly increased the equipment investment cost, but also are extremely inconvenient to replace and use, which affects the test efficiency and test accuracy.
  • the technical problem to be solved in this application is to overcome the defects that the chip testing device in the prior art cannot measure chips of different powers and wavelengths at the same time, the operation is complicated, and the testing efficiency is low, thereby providing a low-cost, high testing efficiency , convenient and flexible, chip testing equipment and testing methods based on double integrating spheres that can measure chips of different powers and wavelengths arbitrarily.
  • the application provides a chip testing device based on double integrating spheres, including:
  • An automatic supply device, an automatic alignment device, a test device and a storage device are arranged in sequence along the chip transmission direction;
  • the test equipment includes:
  • the driving structure is arranged on one side of the turntable, and includes a bracket, a driving member connected to the bracket, and a slide rail slidingly connected to the bracket, and two installation stations are arranged side by side on the bracket;
  • the first integrating sphere and the second integrating sphere are respectively arranged on the two installation stations, and under the action of the driving member, the first integrating sphere or the second integrating sphere and the two installation stations The test station is aligned, and the maximum testable power of the first integrating sphere and the second integrating sphere are different.
  • both the first integrating sphere and the second integrating sphere are provided with two spectral output terminals and one PD output terminal.
  • a pair of probes is also included, and a pair of probes corresponds to the setting of the testing station between the two installation stations.
  • it also includes a first camera and a second camera set corresponding to the test station between the two installation stations, the first camera is set perpendicular to the test station, and the second camera is perpendicular to the test station Describe the first camera settings.
  • a temperature control structure is set on the testing station, and the slide stage is set on the temperature control structure.
  • the automatic supply device includes:
  • the carrying mechanism has a carrying area for placing chips, the carrying area is made of transparent material, and the carrying mechanism is connected with a first driving mechanism;
  • the ejector mechanism is arranged below the carrying mechanism, and includes a seat body and a thimble provided at the center of the seat body.
  • the end surface of the seat body facing the carrying mechanism is provided with a plurality of channels for absorbing the carrying area. hole, the seat body is connected with an air pumping mechanism, and the thimble is connected with a second driving mechanism;
  • the first adsorption mechanism and the positioning and alignment mechanism are sequentially arranged above the carrying mechanism, and the centers of the positioning and alignment mechanism, the first adsorption mechanism, and the chip to be tested on the carrying area of the carrying mechanism coincide with the thimble.
  • a plurality of through holes are evenly distributed in the circumferential direction of the ejector pin.
  • the positioning and alignment mechanism is a camera, and the center of the "cross" alignment line of the camera is set to coincide with the center of the first adsorption mechanism, the chip to be tested and the thimble on the carrying area of the carrying mechanism .
  • the first drive mechanism includes a first drive member and a second drive member perpendicular to each other, and a second drive member rotatably connected to the carrying mechanism, and the second drive mechanism is perpendicular to the The vertical drive member that moves in the direction of the bearing mechanism.
  • a blue film or a transparent film is provided on the carrying area.
  • the automatic alignment device includes:
  • the alignment member is installed on the moving mechanism, the alignment member has a correction plate, and the correction plate is arranged correspondingly to the loading stage, and the moving mechanism is suitable for driving the correction plate on the plane where the loading stage is located. moving upward along the first direction and/or the second direction, the first direction and the second direction being perpendicular to each other;
  • the correction plate is provided with a first hole suitable for the chip to pass through, and a group of opposite sides of the first hole is provided with an avoidance groove to prevent the light-emitting point on the chip from contacting the first hole .
  • the escape groove is arc-shaped, and the inner diameter is smaller than the width of the chip.
  • the cross-section of the first hole is rectangular, and is arranged close to the slide table.
  • the correction plate is also provided with a second hole that is connected to the first hole, the second hole is set away from the slide table, and the center line of the second hole is It coincides with the center line of the first hole body, and the cross section of the second hole body is circular, which is suitable for the suction nozzle for absorbing the chip to pass through.
  • adsorption holes are opened on the slide table.
  • it also includes a workbench, on which a slide stage is installed, and the moving mechanism includes a first moving mechanism and a second moving mechanism, and the first moving mechanism is slidably installed on the second moving mechanism. mechanism, the second moving mechanism is fixedly installed on the workbench;
  • the alignment member is installed on the first moving mechanism.
  • the storage device includes multiple containing structures.
  • a test method comprising the following steps:
  • it also includes applying required current or voltage to a pair of probes according to the test requirements of the chip to be tested.
  • the thimble is separated from the jacked point of the carrying mechanism, and at the same time, the first adsorption mechanism continues to apply adsorption force to the chip, and the adsorption chip continues to rise. After three predetermined positions, the chip is moved laterally to the station of the next process through the linear slide rail.
  • the first adsorption mechanism descends to a second predetermined position above the chip.
  • the thimble and the first adsorption mechanism are synchronously raised to a first predetermined position.
  • the specific steps for adjusting the centers of the positioning alignment mechanism, the first adsorption mechanism and the thimble to coincide are as follows:
  • it also includes the step of blowing air on the chip by the suction nozzle when the first adsorption force is applied to the chip.
  • the chip to be tested is transferred to the automatic alignment device for correction through the automatic supply device, and then transferred to the test device for photoelectric performance testing.
  • the chip is tested, it is only necessary to move the drive bracket to the corresponding first integrating sphere or the second integrating sphere to align with the test station between the two installation stations. There is no need to disassemble the test structure, and the test is convenient , higher efficiency.
  • the device is suitable for measuring chips of different powers and wavelengths, reduces the user's investment cost for the equipment, and has multiple functions in one machine, which can satisfy the test of high-power and low-power chips with one device.
  • the wavelength range of the spectrometer on the sphere can be freely selected without overlapping, which expands the wavelength test range.
  • the air pumping mechanism pumps air to the seat, so that the end face of the seat facing the carrying mechanism is adsorbed and fixed to the carrying mechanism, so that when When the thimble rises to apply ejection force to the chip on the supporting mechanism, since most of the supporting mechanism is adsorbed and fixed to the seat body, even if the ejecting force is large, it will not move, thereby ensuring that the position of the chip will not change, that is The center of the chip and the center of the adsorption mechanism are always coincident, without readjustment, which ensures the accuracy of the adsorption; at the same time, the carrying mechanism is fixed to the seat through multiple through holes on the seat, and the force is uniform and will not be affected by the adsorption force. Larger bending damage occurs, which reduces the cost.
  • the alignment part is installed on the moving mechanism, and the moving mechanism can control the alignment part to move in the first direction and/or the second direction.
  • the alignment member is driven to move back and forth in the first direction and the second direction by controlling the moving mechanism.
  • the alignment member moves back and forth, the chip located in the first hole of the alignment member The angle and position are adjusted under the action of the side of the hole body, and an avoidance groove is provided on the first hole body.
  • the avoidance groove is located at the end of the alignment member facing the slide table. The avoidance groove can prevent the light-emitting point on the chip from touching side of the first hole.
  • this device can also make the chip move to the designated position for testing each time, So that the chip is in a specific test position during the test. Although the position of the chip when it falls on the carrier is random, it will still fall on the adsorption hole, that is, the chip is randomly dropped on the carrier within the range close to the adsorption hole.
  • the chip stage when the position and angle of the chip are adjusted, the chip moves horizontally and vertically under the action of the alignment piece (the moving distance of the alignment piece is fixed), so that the area near the adsorption hole is worn evenly, During the test, it is ensured that the contact between the chip and the slide table is in this uniform area, so that the conductivity and thermal conductivity of the chip are stable during the test process, which greatly improves the test accuracy of the chip.
  • the chip is placed on the slide table, the calibration plate pushes the chip to move along the first direction and the second direction on the slide table, and the angle and position of the chip are adjusted during the movement process , so that the chip can be accurately positioned horizontally and vertically at the predetermined position, so that when the detection mechanism detects the chip, the position of the chip and the receiver PD is accurate, and the coupling efficiency of the spectrum is extremely high, ensuring that the detection mechanism can accurately carry out the photoelectric signal.
  • Measurement at the same time, the luminous point on the chip during the moving process corresponds to and does not touch the avoidance groove on the calibration board, so as to prevent the luminous point from being damaged and cause degradation, and to ensure the good rate of the chip after testing.
  • Fig. 1 is the schematic diagram of the chip testing equipment based on double integrating sphere that the application provides;
  • Figure 2 is a partially enlarged schematic view of the test device in Figure 1;
  • Fig. 3 is a partial enlarged schematic diagram of the automatic supply device in Fig. 1;
  • Fig. 4 is the top view of seat body
  • Fig. 5 is a partially enlarged schematic diagram of the automatic alignment device in Fig. 1;
  • Fig. 6 is a schematic diagram of the alignment member.
  • the workbench 1 is provided with a frame body 13, a linear slide rail 12 is provided on one side of the frame body 13, and a positioning and alignment mechanism is provided on the frame body 13.
  • the linear slide rail 12 is provided with a first adsorption mechanism 4 and a second adsorption mechanism 35, the first adsorption mechanism 4 reciprocates between the automatic supply device and the automatic alignment device, the second adsorption mechanism 35 It moves back and forth between the automatic alignment device and the storage device.
  • the automatic supply device includes a carrying mechanism 2 , an ejecting mechanism 3 , a first adsorption mechanism 4 and a positioning and alignment mechanism 5 .
  • the bearing area of the carrying mechanism 2 is provided with a blue film of transparent material, which can also be a transparent film.
  • the blue film is arranged on the support plate 6 arranged horizontally, and the support plate 6 is arranged on the first driver 7 arranged horizontally.
  • the driving part 7 is slidably disposed on the second driving part 8 , and the moving directions of the first driving part 7 and the second driving part 8 are perpendicular to each other.
  • the first driver 7 and the second driver 8 both include a slide rail, a slider that is slidably arranged on the slide rail and a motor connected to the slider, and one end of the support plate 6 is fixedly connected with the slider of the first driver 7,
  • the first driving member 7 and the second driving member 8 form a first driving structure.
  • the blue film has a bearing area for placing chips. Multiple chips are placed on the blue film in rows and columns. When a chip is absorbed and transferred, the next chip is moved by the movement of the first driving member 7 and the second driving member 8. to the position to be
  • the ejection mechanism 3 is arranged under the carrying mechanism 2 , and includes a seat 9 and a thimble 10 arranged at the center of the seat 9 .
  • the seat body 9 is a cylinder, and a plurality of through holes 11 are provided on the end surface facing the carrying mechanism 2 , and the plurality of through holes 11 are evenly distributed in the circumferential direction of the ejector pin 10 .
  • the seat body 9 is connected with an air pumping mechanism, and the thimble 10 is connected with a second driving mechanism, which is a vertical driving member moving in a direction perpendicular to the carrying mechanism 2 (that is, a vertical direction), for example Motor or motor;
  • the air pumping mechanism is a vacuum pump, and the inside of the seat body 9 is provided with a cavity communicated with the through hole 11 and the vacuum pump at the same time, so that negative pressure is applied to the cavity through the vacuum pump, so that the top of the seat body 9 is firmly attached to the blue film.
  • the first adsorption mechanism 4 is arranged above the carrying mechanism 2.
  • the first adsorption mechanism 4 includes a suction nozzle, an air suction structure connected with the suction nozzle and a seat body slidably connected with a linear slide rail.
  • the rail 12 moves back and forth between the automatic supply station and the automatic alignment station to transport the chips.
  • the positioning and alignment mechanism 5 is arranged above the first adsorption mechanism 4 through the frame body 13, and is arranged higher than the first adsorption mechanism 4, so as to avoid interference during three-point-one-line alignment.
  • the positioning and alignment mechanism 5 is a camera, and the center of the "cross" alignment line of the camera coincides with the center of the chip to be tested and the thimble 10 on the carrying area of the first adsorption mechanism 4 and the carrying mechanism 2. .
  • the automatic positioning device includes a moving mechanism and a positioning member installed on the moving mechanism.
  • the alignment member 14 is installed on the moving mechanism 21, and the movement mechanism 21 can drive the alignment member 14 to move in the first direction and/or the second direction above the plane where the slide table 20 is located.
  • the first direction and the second direction They are perpendicular to each other, wherein the plane where the slide table 20 is located is the plane where chips are placed on the slide table 20 , and the plane where the alignment member 14 moves is parallel to the plane where the slide table 20 is located.
  • the alignment member 14 has a correction plate 16, the correction plate 16 is arranged correspondingly to the slide stage 20, the correction plate 16 is arranged above the slide stage 20, the correction plate 16 is provided with a first hole 18, and the chip can pass through the first hole 18.
  • the holes 18 drop onto the slide table 20; a group of opposite sides of the first holes 18 are provided with avoidance grooves 19 to prevent the light-emitting points on the chip from contacting the first holes 18, so that the light-emitting points can be placed in the avoidance grooves 19 At this time, there is a gap between the light-emitting point and the groove wall of the avoidance groove 19 , so as to prevent the light-emitting point from contacting the inner wall of the first hole body 18 .
  • the calibration plate 16 can adjust the chip, it is possible to prevent the light-emitting points on the chip from contacting the calibration plate 16 .
  • the chip When the chip is placed on the slide table 20, the chip passes through the first hole 18 and falls onto the slide table 20, and then the moving mechanism 21 is controlled to move back and forth in the first direction and move left and right in the second direction, and the chip Adjust the angle and position of the chip to make the chip meet the position and angle requirements to be detected; this device can also make the chip move to the designated position for testing each time, so that the chip is in a specific test position during the test, although the chip falls
  • the position when arriving on the slide table 20 is random, but still can fall on the adsorption hole of the slide table, that is, the chip is randomly dropped on the slide table 20 in the range close to the adsorption hole, at the position of the chip
  • the chip moves horizontally and vertically under the action of the alignment member, so that the area near the adsorption hole wears evenly, that is, the position where the chip falls on the slide table 20 is a uniformly worn area, so that the area of the chip is evenly worn.
  • the back side is in relatively close contact with the
  • the avoidance groove 19 is opened on the end of the correction plate 16 facing the slide table 20, the end of the correction plate 16 facing the slide table 20 is the bottom surface of the correction plate 16, and the bottom surface of the correction plate 16 and the slide table 20 There is a gap between them, and this gap is smaller than the thickness of the chip.
  • the bottom surface of the calibration plate 16 will not be in frictional contact with the loading table 20, nor will it scratch the loading table 20.
  • the escape groove 19 is set on the front and rear sides of the first hole body 18, and the left and right sides of the first hole body 18 are kept straight, so as to ensure that the horizontal direction is straight when moving left and right.
  • the alignment member 14 also has a mounting plate 15, the correction plate 16 is connected on the mounting plate 15, the mounting plate 15 is connected on the moving mechanism 21 by bolts, the alignment member formed by the correction plate 16 and the mounting plate 15 14 is T-shaped.
  • the first hole body 18 has a rectangular cross-section and is placed close to the slide table 20
  • the first hole body 18 moves in the first direction and the second direction, due to the first direction and the second direction are perpendicular to each other, so that the first holes 18 can adjust the chip to a horizontal, flat and vertical state.
  • the escape groove 19 is arc-shaped, and the inner diameter is smaller than the width of the chip.
  • the chip can still move through the inner wall of the first hole 18 under the premise of avoiding the light-emitting point from contacting the first hole 18 .
  • the escape groove 19 can be rectangular or other polygonal, or irregular, as long as it can avoid the position of the light-emitting point on the chip and can push the side of the chip to move.
  • the height of the escape groove 19 can be set to be the same as the height of the first hole body 18 . At this time, it must be ensured that the bottom of the mounting plate 15 cannot be worn to the surface of the slide table 20 during installation.
  • the height of the avoidance groove 19 can also be set to be smaller than the height of the first hole 18 , as long as the depth of the avoidance groove 19 can prevent the luminous point on the chip from contacting the calibration plate 16 .
  • the correction plate 16 is provided with a second hole body 17 which is arranged through the first hole body 18.
  • the cross-sectional area of the second hole body 17 is larger than that of the first hole body 18, and the second hole body 17 It is arranged above the correction plate 16 and away from the slide table 20.
  • the centerline of the second hole 17 is set to coincide with the centerline of the first hole 18.
  • the cross section of the second hole 17 is circular.
  • the suction nozzle can be allowed to enter into the second hole body 17 , so that the suction nozzle with the chip adsorbed is closer to the slide table 20 .
  • the cross-sectional area of the second hole body 17 may also be the same as that of the first hole body 18 , that is, the cross-section of the second hole body 17 may also be rectangular.
  • both the moving mechanism 21 and the slide table 20 are installed on the turntable 22 .
  • the moving mechanism 21 includes a first moving mechanism and a second moving mechanism.
  • the second moving mechanism is installed on the turntable 22, and the first moving mechanism is installed on the driving end of the second moving mechanism; specifically, the second moving mechanism can be that the first slide block is slidably installed on the first slide rail,
  • the first slide rail is installed on the turntable 22, and the first direction can be that the second slide rail is installed on the first slide block, and the second slide block is slidably installed on the second slide rail, and the alignment member 14 passes through the mounting plate 15 Installed on the second slider.
  • the first moving mechanism is installed on the turntable 22, and the second moving mechanism is installed on the driving end of the first moving mechanism.
  • the second moving mechanism can also be the first electric cylinder, the first moving mechanism is the second electric cylinder, the first electric cylinder is installed on the slide stage 20, and the second electric cylinder is installed on the second electric cylinder.
  • the alignment member 14 is installed on the driving end of the second electric cylinder through the mounting plate 15 .
  • an adsorption hole is provided on the loading table 20.
  • the suction hole on the loading table 20 generates suction, and the chip is adsorbed on the loading table 20 to realize the adsorption fixation.
  • the test device includes a turntable 22 , a driving structure arranged on one side of the turntable 22 , and a first integrating sphere 23 and a second integrating sphere 24 arranged on the driving structure.
  • the turntable 22 has two test stations oppositely arranged, one test station is used to accept the chip transferred by the first adsorption mechanism 4, and correct the position of the chip, and the other test station is used to test the corrected chip. Related photoelectric tests.
  • the turntable 22 is driven by a motor to rotate to transfer the calibrated chips to the testing station, and after the tested chips are transported to the calibration station, they are transferred to the corresponding holding structure 36 of the storage device by the second adsorption mechanism 35 .
  • the test station is provided with a temperature control structure 25
  • the loading platform 20 is set on the temperature control structure 25
  • the chip is placed on the loading platform 20 .
  • a drive structure including a bracket 26, a driver connected to the bracket 26, and a slide rail 27 slidingly connected to the bracket 26.
  • the slide rail 27 is Linear slide rail, the bottom of the bracket 26 is provided with a slide seat 28 slidingly connected with the slide rail 27, and the upper part is provided with two installation stations side by side; the driving part is a motor, which is used to drive the slide seat 28 to reciprocate on the slide rail 27 Slide to toggle the position of the two mounting stations.
  • the first integrating sphere 23 and the second integrating sphere 24 are separately arranged on the two installation stations, specifically, the first integrating sphere has a first power, and the second integrating sphere 24 has a second power, wherein, The first power is greater than the second power.
  • Two spectral output ports 29 and one PD output port 30 are provided on the spherical surfaces of the first integrating sphere and the second integrating sphere away from the turntable 22 .
  • the first integrating sphere 23 is aligned with the test station between the two installation stations;
  • the second integrating sphere 24 is aligned with the testing station between the two mounting stations.
  • a pair of mounting frames 31 are also provided on both sides of the testing station between the two mounting stations, and a pair of probes 32 are respectively arranged on the pair of mounting frames 31 .
  • a pair of probes 32 were applied with a driving current at the same time; Auxiliary to press the chip to improve the contact effect between the chip and the slide table.
  • a first camera 33 and a second camera 34 are also arranged above the test station between the two installation stations.
  • 33 is arranged perpendicular to the testing station, and the second camera 34 is arranged perpendicular to the first camera 33 between two installation stations.
  • a test method comprising the steps of:
  • the distance is relatively large, and the position of the positioning and alignment mechanism 5 is fixed and does not move any more.
  • a plurality of chips are arranged sequentially and orderly on the blue film placed on the carrying area of the carrying mechanism 2 , and the air suction mechanism sucks air into the seat body 9 so that the seat body 9 and the carrying mechanism 2 are adsorbed and fixed.
  • the center of a chip in the loading area driven by the first driver 7 and the second driver 8 coincides with the center of the "cross" alignment line of the positioning and alignment mechanism 5, which is equivalent to placing
  • the center of the positioning and alignment mechanism 5 , the center of the first adsorption mechanism 4 , the center of the chip and the tip of the thimble 10 coincide.
  • the first adsorption mechanism 4 descends to a second predetermined position above the chip.
  • the second predetermined position is a position where the first adsorption mechanism 4 is almost in contact with the chip.
  • the second driving mechanism drives the thimble 10 to move toward the carrying area to lift the chip and rise to the first predetermined position, and the first predetermined position is higher than the second predetermined position. Apply suction force, and the suction chip rises synchronously.
  • the second drive mechanism drives the thimble 10 to separate from the jacked point of the carrier mechanism 2.
  • the first adsorption mechanism 4 exerts a continuous adsorption force on the chip, and the adsorption chip continues to rise.
  • the third predetermined position i.e., the safety height
  • the chip is moved laterally to the automatic alignment device through the linear slide rail 12 .
  • the first adsorption mechanism 4 moves to the top of the carrying mechanism 2 again, and coincides with the center of the "cross" alignment line of the positioning and alignment mechanism 5 .
  • control the first driver 7 and the second driver 8 according to the program to drive the next chip on the blue film to coincide with the center of the "cross" word alignment line of the positioning alignment mechanism 5 (that is, the center of the chip and the center of the thimble are also aligned.
  • Neutralization repeat the above steps until all the chips in the loading area are transferred to the loading stage of the automatic alignment device.
  • the suction nozzle blows air on the chip to place the chip on the chip stage 20, and at the same time, exerts a first adsorption force on the chip; the correction plate 16 pushes the chip to move along the first direction and/or the second direction on the chip stage 20. Move until reaching a predetermined position, the luminescent point on the chip during the movement corresponds to the avoidance groove 19 on the calibration plate 16 and does not touch, and applies a second adsorption force to the chip; wherein, the first direction and the second direction are perpendicular to each other , the second adsorption force is smaller than the first adsorption force.
  • the calibration plate 16 is controlled by the moving mechanism 21 to push the chip to move along the first direction and the second direction on the slide table 20, and the light-emitting point on the chip during the movement is in the avoidance groove 19; it passes through the first hole during the movement Body 18 adjusts the angle and position of the chip, so that the chip can be in a horizontal and vertical state, so that when the detection mechanism detects the chip, the angle and position of the chip meet the detection standards, ensuring that the detection mechanism can accurately detect the chip; at the same time,
  • the luminous point on the chip during the movement corresponds to and does not touch the avoidance groove 19 on the calibration plate 16, so that the luminous point is in the avoidance groove 19, and there is a gap with the groove wall of the avoidance groove 19 to avoid the luminous point from being damaged , to ensure the accuracy of chip detection.
  • the adsorption hole on the slide table 20 is connected with an air extraction device, such as a vacuum pump, an air extraction pump, etc., and the air extraction device is provided with a switch, which can control the flow rate and flow rate of the air extraction, and then realize the adsorption of the chip by the adsorption hole.
  • Force size adjustment When the chip falls on the loading table 20, the adsorption hole applies the first adsorption force to the chip, and the chip is firmly adsorbed on the loading table 20 so that it cannot move; when the chip is pushed to move on the loading table 20, Control the switch of the air extraction device to weaken the adsorption force generated by the adsorption hole, and the adsorption hole applies a second adsorption force to the chip.
  • the second adsorption force can still make the chip be adsorbed on the slide table 20, but the adsorption force is small at this time.
  • the displacement of the chip on the slide stage 20 can be allowed, and the chip will not be detached from the adsorption of the adsorption hole, so that the angle and position of the chip can be adjusted.
  • the adsorption hole exerts the first adsorption force on the chip.
  • the suction nozzle changes from the adsorption state to the air blowing state to blow air on the chip, which can quickly detach the chip from the suction nozzle, thereby being released.
  • adsorption hole adsorption.
  • the suction nozzle is connected with an air pump with two working states, that is, the air pump can realize both the suction state and the blowing state, that is, the suction function and the blowing function of the suction nozzle, which can be achieved through the air pump’s Realize different working states.
  • the motor drives the turntable 22 to rotate 180°, and rotate until the automatically aligned chip to be tested reaches another test station between the two installation stations, and the probe 32 is pressed down to contact the chip to be tested.
  • the chip to be tested When the power is relatively large and the wavelength is between 750nm-1100nm, current must be applied to the two probes 32 at the same time, and the corresponding first integrating sphere must be driven to align with the chip to be tested on the test station to scan the optical power characteristics and spectral characteristics. test.
  • the suction nozzle transfers another chip from the supply station to the test station far away from the driving structure for automatic positioning and alignment correction. According to customer needs, judge the test results, that is, whether the chip is qualified or not.
  • the holding structure is blue film or card boxes arranged in rows, and multiple blue film or card boxes can be set according to requirements, such as product grade requirements.
  • the second integrating sphere is aligned with the chip to be tested on the test station to perform a scanning test of optical power characteristics and spectral characteristics.
  • the support 26 includes two sets arranged side by side, and each support 26 is provided with an installation station.
  • two groups of test stations are oppositely arranged on the turntable 22, and the connecting lines of the two groups of test stations are arranged perpendicular to each other.
  • a group of test stations can place high-power chips, and another group of test stations can place low-power chips to improve detection efficiency.

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Abstract

一种基于双积分球的芯片测试设备及测试方法，涉及芯片测试技术领域。芯片测试设备包括：沿芯片传输方向依次设置的自动供给装置、自动对位装置、测试装置和收纳装置；测试装置包括：转盘（22），具有相对设置的至少两个测试工位；驱动结构，设于转盘（22）的一侧，包括支架（26）、与支架（26）连接的驱动件和与支架（26）滑动连接的滑轨（27），支架（26）上并排设有两个安装工位；第一积分球（23）和第二积分球（24），分设于两个安装工位上，在驱动件的作用下，第一积分球（23）或第二积分球（24）与两个安装工位之间的测试工位对准，第一积分球（23）和第二积分球（24）可测试的最大功率不同，可以同时测量不同功率和波长的芯片，测试效率较高。

Description

一种基于双积分球的芯片测试设备及测试方法
相关申请的交叉引用
本申请要求在2021年12月06日提交中国专利局、申请号为202111472132.0、申请名称为“一种基于双积分球的芯片测试设备及测试方法”的中国专利申请的优先权，其全部内容通过引用的方式并入本文中。
技术领域
本申请涉及芯片测试技术领域，具体涉及一种基于双积分球的芯片测试设备及测试方法。
背景技术
集成电路(Integrated Circuit，IC)，也称微芯片、晶片或芯片，是一种将电路(包括半导体设备，也包括被动组件等)小型化的方式，并时常制造在半导体晶圆表面，并广泛应用于移动终端、计算机设备、人脸识别、智能家居、无人驾驶、航空航天等各个领域中。随着半导体行业的发展，集成电路芯片的厚度越做越薄，芯片的加工和检测精度越来越高。对于生产厂家制造的芯片尺寸以矩形最为常见，现有的芯片在加工完成之后需要通过检测机构进行检测，检测的参数包括光束发散角、光功率、电流、电压以及光谱的波长等，以确定芯片的光电特性和工作状态是否满足要求。但现有的芯片测试系统只能针对单一量程和范围的功率和波长的芯片进行测试，当需要对超出测试系统的量程和范围的功率和波长的芯片进行测试时，只能采取如下两种方法：一种是需要将现有的测试系统配置结构拆除，再更换相应量程和范围的另一套测试系统配置结构；另一种是需要单独购买只能适用于待测芯片的量程和范围的测试设备。上述两种方法既大幅增加了设备投资成本，且更换使用中极其不方便，影响测试效率和测试精度。
发明内容
因此，本申请要解决的技术问题在于克服现有技术中的芯片测试装置不能同时测量不同功率和波长的芯片，操作复杂，测试效率较低的缺陷，从而提供一种成本低廉，测试效率极高，方便灵活，可以任意测量不同功率和波长芯片的基于双积分球的芯片测试设备及测试方法。
为了解决上述技术问题，本申请提供了一种基于双积分球的芯片测试设备，包括：
沿芯片传输方向依次设置的自动供给装置、自动对位装置、测试装置和收纳装置；
所述测试装置包括：
转盘，具有相对设置的至少两个测试工位；
驱动结构，设于所述转盘的一侧，包括支架、与支架连接的驱动件和与所述支架滑动连接的滑轨，所述支架上并排设有两个安装工位；
第一积分球和第二积分球，分设于两个所述安装工位上，在所述驱动件的作用下，所述第一积分球或第二积分球与两个安装工位之间的测试工位对准，所述第一积分球和第二积分球可测试的最大功率不同。
可选地，所述第一积分球和第二积分球均设有两个光谱输出端和一个PD输出端。
可选地，还包括一对探针，一对探针对应两个安装工位之间的测试工位设置。
可选地，还包括对应两个安装工位之间的测试工位设置的第一相机和第二相机，所述第一相机垂直于所述测试工位设置，所述第二相机垂直于所述第一相机设置。
可选地，所述测试工位上设有温控结构，载片台设于所述温控结构上。
可选地，所述自动供给装置包括:
承载机构，具有用于放置芯片的承载区，所述承载区为透明材质，所述承载机构连接有第一驱动机构；
顶出机构，设于所述承载机构的下方，包括座体和设于所述座体中心的顶针，所述座体朝向所述承载机构的端面上设有多个用于吸附承载区的通孔，所述座体连接有抽气机构，所述顶针连接有第二驱动机构；
第一吸附机构和定位对准机构，依次设置在所述承载机构上方，且所述定位对准机构、第一吸附机构、承载机构的承载区上的待测芯片和顶针的中心重合。
可选地，多个所述通孔均布在所述顶针的周向。
可选地，所述定位对准机构为相机，所述相机的“十”字对准线的中心与所述第一吸附机构、承载机构的承载区上的待测芯片和顶针的中心重合设置。
可选地，所述第一驱动机构包括相互垂直设置的第一驱动件和第二驱动件，以及与所述承载机构转动连接的第二驱动件，所述第二驱动机构为在垂直于所述承载机构方向运动的竖直驱动件。
可选地，所述承载区上设有蓝膜或透明膜。
所述自动对位装置包括：
移动机构；
对位件，安装在所述移动机构上，所述对位件具有校正板，所述校正板与载片台对应设置，所述移动机构适于驱动所述校正板在载片台所处的平面上方沿第一方向和/或第二方向上进行移动，所述第一方向和第二方向相互垂直；
所述校正板上开设有适于芯片通过的第一孔体，所述第一孔体一组相对的侧面上开设有防止所述芯片上的发光点与所述第一孔体接触的避让槽。
可选地，所述避让槽为弧形，内径小于芯片的宽度。
可选地，所述第一孔体的横截面呈矩形，且靠近载片台设置。
可选地，所述校正板上还设有与所述第一孔体贯通设置的第二孔体，所述第二孔体远离所述载片台设置，所述第二孔体的中 心线和第一孔体的中心线重合，且所述第二孔体的横截面为圆形，适于用于吸附芯片的吸嘴通过。
可选地，所述载片台上开设有吸附孔。
可选地，还包括工作台，所述工作台上安装有载片台，所述移动机构包括有第一移动机构和第二移动机构，所述第一移动机构滑动安装在所述第二移动机构上，所述第二移动机构固定安装在所述工作台上；
所述对位件安装在所述第一移动机构上。
可选地，所述收纳装置包括多个盛放结构。
还提供了一种测试方法，包括以下步骤：
将待测芯片自动对位后运送至测试工位，根据待测芯片的功率和波长驱动相应的第一积分球或第二积分球对准测试工位上的待测芯片进行测试；根据测试结果将测试完的芯片转移至收纳装置的相应位置。
可选地，还包括根据待测芯片的测试要求向一对探针施加所需要的电流或电压。
可选地，第二驱动机构驱动顶针上升至第一预定位置后，顶针与承载机构的被顶起点脱离，同时，第一吸附机构对芯片持续施加吸附力，并且吸附芯片继续上升，当到达第三预定位置后，将芯片通过直线滑轨横向移动至下道工序的工位。
可选地，还包括在第二驱动机构驱动顶针上升前，第一吸附机构下降至芯片上方的第二预定位置。
可选地，所述顶针和所述第一吸附机构同步上升至第一预定位置。
可选地，将定位对准机构、第一吸附机构和顶针的中心调整至重合的具体步骤为：
先将顶针与定位对准机构的中心调整至同轴；以定位对准机构的“十”字中心为参照，移动第一吸附机构使得第一吸附机构的中心与定位对准机构的中心重合。
可选地，还包括在对芯片施加第一吸附力时同时吸嘴对芯片 吹气的步骤。
本申请技术方案，具有如下优点：
1.本申请提供的基于双积分球的芯片测试设备，待测芯片经自动供给装置转移至自动对位装置校正后，再传输至测试装置中进行光电性能测试，当需要对不同功率和波长的芯片进行测试时，只需驱动件驱动支架移动至相应的第一积分球或第二积分球与两个安装工位之间的测试工位对准即可，不需要拆装测试结构，测试方便，效率较高。该装置适用于任意测量不同功率和波长的芯片，降低用户对于设备的投资成本，起到一机多用，可满足一台设备可适用于大功率和小功率芯片的测试，同时，由于两个积分球上的光谱仪波长范围可自由选配，不重叠，扩展了波长的测试范围。
2.本申请提供的基于双积分球的芯片测试设备，当需要将芯片与承载机构分离时，抽气机构对座体抽气，使得座体朝向承载机构的端面与承载机构吸附固定，这样当顶针上升对承载机构上的芯片施加顶出力时，由于承载机构的大部分均与座体吸附固定，因此即使顶出力较大，也不会发生移动，从而保证芯片的位置不会发生变化，即芯片的中心与吸附机构的中心始终重合，无需重新调整，保证了吸附的准确性；同时，承载机构通过座体上的多个通孔与座体吸附固定，受力均匀，不会因吸附力较大发生弯折损坏，降低了成本。
3.本申请提供的基于双积分球的芯片测试设备，对位件安装在移动机构上，移动机构可以控制对位件进行第一方向和/或第二方向上的移动，当芯片放置在载片台上时，通过控制移动机构带动对位件进行第一方向和第二方向上前后左右的移动，在对位件进行前后左右移动时，位于对位件第一孔体内的芯片在第一孔体的侧面作用下进行角度和位置的调整，并且在第一孔体上设置有避让槽，避让槽位于对位件朝向载片台的端部，避让槽可以避免芯片上的发光点接触到第一孔体的侧面。保证芯片在检测时处于准确的位置及角度，避免检测机构无法精准检测芯片上对应位置 的现象发生，保证芯片检测结果的准确性；本装置还可以使得芯片每次移动至指定的位置进行测试，使得芯片在测试时均处于特定的测试位置，虽然芯片下落至载片台上时的位置是随机的，但是仍然会落在吸附孔上，即芯片是在靠近吸附孔的范围内随机落至载片台上，在对芯片的位置及角度进行调整时，芯片在对位件的作用下发生横平竖直的移动(对位件的移动距离是固定的)，使得吸附孔附近的区域磨损均匀，测试时保证了芯片与载片台上的接触都在这个均匀区域，使得芯片在测试过程中的导电与导热性能稳定，极大的提高了芯片的测试精准度。
4.本申请提供的测试方法，顶针与承载机构脱离的同时吸附机构对芯片持续施加吸附力，避免了芯片在自身重力作用下再次与承载区贴合，影响吸附效果，同时有效防止了顶针将承载机构和芯片损坏的现象。
5.本申请提供的测试方法，将芯片放置在载片台上，校正板推动芯片在载片台上沿第一方向和第二方向进行移动，在移动过程中对芯片的角度及位置进行调整，使得芯片横平竖直的准确定位在预定的位置，使得在检测机构对芯片进行检测时，芯片与接收器PD的位置准确，光谱的耦合效率极高，保证检测机构可以精准的进行光电信号的测量；同时，移动过程中的芯片上的发光点与校正板上的避让槽对应且不接触，避免发光点被破坏产生劣化现象，保证了芯片测试后的良好率。
附图说明
为了更清楚地说明本申请具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他附图。
图1为本申请提供的基于双积分球的芯片测试设备的示意图；
图2为图1中测试装置的局部放大示意图；
图3为图1中自动供给装置的局部放大示意图；
图4为座体的俯视图；
图5为图1中自动对位装置的局部放大示意图；
图6为对位件的示意图。
附图标记说明：
1、工作台；2、承载机构；3、顶出机构；4、第一吸附机构；5、定位对准机构；6、支撑板；7、第一驱动件；8、第二驱动件；9、座体；10、顶针；11、通孔；12、直线滑轨；13、架体；14、对位件；15、安装板；16、校正板；17、第二孔体；18、第一孔体；19、避让槽；20、载片台；21、移动机构；22、转盘；23、第一积分球；24、第二积分球；25、温控结构；26、支架；27、滑轨；28、滑座；29、光谱输出端；30、PD输出端；31、安装架；32、探针；33、第一相机；34、第二相机；35、第二吸附机构；36、盛放结构。
具体实施方式
下面将结合附图对本申请的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
此外，下面所描述的本申请不同实施方式中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。
如图1至6所示的基于双积分球的芯片测试设备的一种具体实施方式，包括沿芯片传输方向依次设置的自动供给装置、自动对位装置、测试装置和收纳装置，自动供给装置、自动对位装置、测试装置和收纳装置均设于工作台1上，工作台1上设有架体13，架体13一侧设有直线滑轨12，架体13上设有定位对准机构5和第一相机33，直线滑轨12上设有第一吸附机构4和第二吸附机构35，第一吸附机构4在自动供给装置和自动对位装置之间往复移 动，第二吸附机构35在自动对位装置和收纳装置之间往复移动。
如图3和4所示，自动供给装置包括承载机构2、顶出机构3、第一吸附机构4和定位对准机构5。
承载机构2的承载区上设有透明材质的蓝膜，也可以为透明膜，蓝膜设于水平设置的支撑板6上，支撑板6设于水平设置的第一驱动件7上，第一驱动件7滑动设于第二驱动件8上，且第一驱动件7和第二驱动件8的运动方向相互垂直。第一驱动件7和第二驱动件8均包括滑轨、滑动设于滑轨上的滑块和与滑块连接的电机，支撑板6的一端与第一驱动件7的滑块固定连接，第一驱动件7和第二驱动件8组成第一驱动结构。蓝膜具有用于放置芯片的承载区，多个芯片成行列放置在蓝膜上，当一个芯片被吸附转移后，通过第一驱动件7和第二驱动件8的移动，将下一个芯片移动至待吸附抓取位置。
如图3所示，顶出机构3设于所述承载机构2的下方，包括座体9和设于所述座体9中心的顶针10。如图3所示，所述座体9为圆柱体，朝向所述承载机构2的端面上设有多个通孔11，多个所述通孔11均布在所述顶针10的周向。所述座体9连接有抽气机构，顶针10连接有第二驱动机构，所述第二驱动机构为在垂直于所述承载机构2方向(即竖直方向)运动的竖直驱动件，例如马达或电机；抽气机构为真空泵，座体9内部设有同时与通孔11和真空泵连通的腔体，以通过真空泵对腔体内施加负压，使得座体9顶部与蓝膜牢固贴附。
第一吸附机构4设置在承载机构2上方，第一吸附机构4包括吸嘴、与吸嘴连接的抽气结构和与直线滑轨滑动连接的座体，通过安装在工作台1上的直线滑轨12在自动供给工位和自动对位工位往复移动，以输送芯片。
在测试时，定位对准机构5通过架体13设置在所述第一吸附机构4上方，且高于第一吸附机构4设置，以避免三点一线对位时的干涉。所述定位对准机构5为相机，所述相机的“十”字对准线的中心与所述第一吸附机构4、承载机构2的承载区上的待测 芯片和顶针10的中心重合设置。
如图5和6所示，自动对位装置包括移动机构和安装在移动机构上的对位件。
移动机构21上安装有对位件14，移动机构21可以带动对位件14在载片台20所处的平面上方进行第一方向和/或第二方向的移动，第一方向和第二方向互相垂直，其中，载片台20所处的平面为载片台20上放置芯片的平面，对位件14移动的平面平行于载片台20所处的平面。对位件14具有校正板16，校正板16与载片台20对应设置，校正板16设置在载片台20的上方，校正板16上开设有第一孔体18，芯片可以穿过第一孔体18下落至载片台20上；第一孔体18一组相对的侧面上开设有防止芯片上的发光点与第一孔体18接触的避让槽19，可以使发光点处于避让槽19的位置处，此时发光点与避让槽19的槽壁之间具有间隙，从而避免发光点接触到第一孔体18的内壁。在保证校正板16可以对芯片进行调整的前提下，可以避免芯片上的发光点接触到校正板16。在芯片放置到载片台20的过程中，芯片穿过第一孔体18落至载片台20上，然后控制移动机构21进行第一方向的前后移动和第二方向的左右移动，对芯片的角度和位置进行调整，以使芯片达到待检测的位置和角度要求；本装置还可以使得芯片每次移动至指定的位置进行测试，使得芯片在测试时均处于特定的测试位置，虽然芯片下落至载片台20上时的位置是随机的，但是仍然会落在载片台的吸附孔上，即芯片是在靠近吸附孔的范围内随机落至载片台20上，在对芯片的位置及角度进行调整时，芯片在对位件的作用下发生横平竖直的移动，使得吸附孔附近的区域磨损均匀，即芯片落在载片台20上的位置为磨损均匀的区域，使得芯片的背面与载片台之间处于较紧密的接触，保证了芯片在测试过程中对导电和导热性的苛刻要求，保证芯片的测试结果的准确性。
具体地，避让槽19开设在校正板16朝向载片台20的端部上，校正板16朝向载片台20的端部为校正板16的底面，校正板16的底面与载片台20之间具有间隙，此间隙小于芯片的厚度，校正 板16在对芯片位置校正的过程中，校正板16的底面不会与载片台20发生摩擦接触，也不会划伤载片台20。
本实施例中，避让槽19开设在第一孔体18的前后侧面上，第一孔体18的左右侧面保持平直，从而保证左右推移时横向平直。
如图2所示，对位件14还具有安装板15，校正板16连接在安装板15上，安装板15通过螺栓连接在移动机构21上，校正板16与安装板15形成的对位件14呈T形。
具体地，当第一孔体18的横截面呈矩形，并且靠近载片台20设置，第一孔体18在进行第一方向和第二方向上的移动时，由于第一方向和第二方向互相垂直，使得第一孔体18可以将芯片调整为横平竖直的状态。
如图4所示，避让槽19呈弧形，内径小于芯片的宽度。使得芯片在避免发光点接触到第一孔体18的前提下，仍可通过第一孔体18的内壁进行移动。作为一种可替换的实施方式，避让槽19可以呈矩形或其他多边形，还可以是不规则形状，只要其能够避让芯片上发光点的位置，并且能够推动芯片侧面移动即可。
本实施例中，避让槽19的高度可以设置为与第一孔体18相同的高度，此时在安装时必须要保证安装板15的底部不能磨损到载片台20的表面。
作为一种可替换的实施方式，避让槽19的高度还可以设置为小于第一孔体18的高度，只要避让槽19的槽深能够避免芯片上发光点与校正板16接触即可。
本实施例中，校正板16上开设有与第一孔体18贯通设置的第二孔体17，第二孔体17的截面积大于第一孔体18的截面积，并且第二孔体17设置在校正板16的上方，远离载片台20设置，第二孔体17的中心线与第一孔体18的中心线重合设置，具体地，第二孔体17的横截面为圆形，可以允许吸嘴进入第二孔体17内，使吸附有芯片的吸嘴与载片台20更加接近。
作为一种可替换的实施方式，第二孔体17的截面积还可以与第一孔体18的截面积相同，即第二孔体17的横截面也可呈矩形。
本实施例中，移动机构21和载片台20均安装在转盘22上。移动机构21包括有第一移动机构和第二移动机构。具体地，第二移动机构安装在转盘22上，第一移动机构安装在第二移动机构的驱动端上；具体地，第二移动机构可以是第一滑块滑动安装在第一滑轨上，第一滑轨安装在转盘22上，第一方向可以是第二滑轨安装在第一滑块上，并且在第二滑轨上滑动安装有第二滑块，对位件14通过安装板15安装在第二滑块上。
作为一种可替换的实施方式，也可以是第一移动机构安装在转盘22上，第二移动机构安装在第一移动机构的驱动端上。
作为一种可替换的实施方式，第二移动机构还可以是第一电缸，第一移动机构为第二电缸，第一电缸安装在载片台20上，第二电缸安装在第一电缸的驱动端上，对位件14通过安装板15安装在第二电缸的驱动端上。
本实施例中，载片台20上开设有吸附孔，当芯片放置到载片台20上时，载片台20上的吸附孔产生吸力，将芯片吸附在载片台20上，实现对芯片的吸附固定。
如图2所示，测试装置包括转盘22、设于所述转盘22的一侧的驱动结构和设于驱动结构上的第一积分球23、第二积分球24。
转盘22具有相对设置的两个测试工位，一个测试工位用于承接经第一吸附机构4转移的芯片，并对芯片的位置进行校正，另一个测试工位用于对校正后的芯片进行相关的光电测试。转盘22由电机驱动进行旋转，以将校正后的芯片转移至测试工位，并将测试完成的芯片输送至校正工位后，由第二吸附机构35转移至收纳装置的相应盛放结构36中。具体地，测试工位上设有温控结构25，载片台20设于所述温控结构25上，芯片放置在载片台20上。
为实现对不同功率和波长的芯片的高效测试，本实施例中设置了驱动结构，包括支架26、与支架26连接的驱动件和与所述支架26滑动连接的滑轨27，滑轨27为直线滑轨，所述支架26的底部设有与滑轨27滑动连接的滑座28，上部并排设有两个安装工位；驱动件为电机，用于驱动滑座28在滑轨27上往复滑动，以切换 两个安装工位的位置。
第一积分球23和第二积分球24分设于两个所述安装工位上，具体地，所述第一积分球具有第一功率，所述第二积分球24具有第二功率，其中，第一功率大于第二功率。所述第一积分球和第二积分球远离转盘22的球面上均设有两个光谱输出端29和一个PD输出端30。在所述驱动件的作用下，当待测芯片的功率和波长(750nm-1100nm之间)较大时，所述第一积分球23与两个安装工位之间的测试工位对准；当待测芯片的功率和波长(300nm-750nm之间)较小时，所述第二积分球24与两个安装工位之间的测试工位对准。这是由于若使用大功率积分球测试小功率芯片，分辨率较低，测试准确度也较低；而若用小功率积分球测试大功率芯片，当大功率芯片上施加的驱动电流较大时，会产生很大的峰值功率，平均功率也会很高，对积分球造成损害，甚至烧毁。
在两个安装工位之间的测试工位的两侧还设有一对安装架31，一对探针32分设在一对安装架31上。当待测芯片的功率较大时，同时，对一对探针32施加驱动电流；当待测芯片的功率较小时，只对其中一个探针32施加驱动电流，另一个探针32只起到辅助按压芯片，以提高芯片与载片台的接触效果的作用。
为保证一对探针32既能准确按压芯片，又不至于损坏芯片，在两个安装工位之间的测试工位上方还设置有第一相机33和第二相机34，所述第一相机33垂直于所述测试工位设置，所述第二相机34垂直于所述第一相机33设置在两个安装工位之间。
一种测试方法，包括以下步骤：
先将顶针10与定位对准机构5的“十”字对准线的中心调整至同轴，为方便第一吸附机构4和承载机构2的调节，定位对准机构5与顶针10之间的距离较大，且定位对准机构5的位置固定后便不再移动。驱动第一吸附机构4朝向承载区移动，直至第一吸附机构4的中心与定位对准机构5的“十”字对准线的中心重合，从而将定位对准机构5、第一吸附机构4和顶针10的中心调 整至重合。在承载机构2的承载区上放置的蓝膜上依次有序地排列多个芯片，抽气机构对座体9吸气，以使座体9与承载机构2吸附固定。以定位对准机构5的中心为参照，第一驱动件7和第二驱动件8驱动承载区的一个芯片中心与定位对准机构5的“十”字对准线的中心重合，相当于将定位对准机构5的中心、第一吸附机构4的中心、芯片的中心以及顶针10的顶端重合。
第一吸附机构4下降至芯片上方的第二预定位置。第二预定位置为第一吸附机构4与芯片几乎接触的位置。
第二驱动机构驱动顶针10朝向承载区运动以顶起芯片并上升至第一预定位置，且第一预定位置高于第二预定位置，此时，第一吸附机构4抽气对上升的芯片持续施加吸附力，并且吸附着芯片同步上升。
第二驱动机构驱动顶针10与承载机构2的被顶起点脱离，同时，第一吸附机构4对芯片施加持续吸附力，并且吸附芯片继续上升，当到达第三预定位置(即安全高度)后，将芯片通过直线滑轨12横向移动至自动对位装置中。
第一吸附机构4重新移动至承载机构2上方，且与定位对准机构5的“十”字对准线的中心重合。同时，根据程序控制第一驱动件7和第二驱动件8驱动蓝膜上的下一颗芯片与定位对准机构5的“十”字对准线的中心重合(即芯片中心与顶针中心也中和)，重复上述步骤，直至将承载区的全部芯片均转移至自动对位装置的载片台上。
吸嘴对芯片吹气以将芯片放置在载片台20上，同时，对芯片施加第一吸附力；校正板16推动芯片在载片台20上沿第一方向和/或第二方向上进行移动，直至到达预定位置，移动过程中的芯片上的发光点与校正板16上的避让槽19对应且不接触，且对芯片施加第二吸附力；其中，第一方向和第二方向相互垂直，第二吸附力小于第一吸附力。
通过移动机构21控制校正板16推动芯片在载片台20上沿第一方向和第二方向进行移动，移动过程中的芯片上的发光点处于 避让槽19内；在移动过程中通过第一孔体18对芯片的角度及位置进行调整，可以使芯片处于横平竖直的状态，使得在检测机构对芯片进行检测时，芯片的角度及位置符合检测标准，保证检测机构准确检测到芯片；同时，移动过程中的芯片上的发光点与校正板16上的避让槽19对应且不接触，使得发光点处于避让槽19内，并与避让槽19的槽壁之间具有间隙，避免发光点被破坏，保证芯片检测的准确性。
具体地，载片台20上的吸附孔连通有抽气装置，如真空泵、抽气泵等，并且抽气装置上设有开关，可以控制抽气的流量及流速，进而实现吸附孔对芯片的吸附力的大小调节。在芯片落在载片台20上时，吸附孔对芯片施加第一吸附力，将芯片牢牢吸附在载片台20上，使其无法移动；在推动芯片在载片台20上移动时，控制抽气装置的开关，减弱吸附孔产生的吸附力，吸附孔对芯片施加第二吸附力，第二吸附力仍可以使芯片被吸附在载片台20上，但此时吸附力较小，可以允许芯片在载片台20上发生位移，并且芯片不会脱离吸附孔的吸附，使得芯片的角度和位置能够进行调整。
当吸嘴带动芯片靠近吸附孔时，吸附孔对芯片施加第一吸附力，同时，吸嘴由吸附状态转换为吹气状态，对芯片进行吹气，这能够使芯片快速脱离吸嘴，从而被吸附孔吸附。
具体地，吸嘴连通有具有两种工作状态的空气泵，即空气泵既可以实现吸气状态，也可以实现吹气状态，即吸嘴的吸附作用和吹气作用，这可以通过空气泵的不同工作状态进行实现。
电机驱动转盘22旋转180°，并旋转至自动对位后的待测芯片到达两个安装工位之间的另一测试工位，探针32下压至与待测芯片接触，当待测芯片的功率较大且波长在750nm-1100nm之间时，必须对两个探针32同时施加电流，驱动相应的第一积分球对准测试工位上的待测芯片进行光功率特性和光谱特性扫描测试。与此同时，吸嘴将供给工位的另一芯片转移至远离驱动结构的测试工位后进行自动定位对准校正。根据客户需求，对测试结果进行判 定，即芯片是否合格。当该芯片测试完成后，探针32抬起，转盘22反向旋转180°，进行下一芯片的测试，并将测试完成的芯片通过第二吸附机构35转移至收纳装置的相应盛放结构中。盛放结构为成行列设置的蓝膜或卡片盒，可以根据需求，例如产品等级要求，设置多个蓝膜或卡片盒。
当待测芯片的功率较小且当波长在300nm-750nm之间时，只需要对一个探针32施加电流，另一个探针32只保持与芯片的接触，但不需要施加电流，驱动相应的第二积分球对准测试工位上的待测芯片进行光功率特性和光谱特性扫描测试。
作为替代的实施方式，支架26包括并排设置的两个，每个支架26上各设有一个安装工位。
作为替代的实施方式，转盘22上相对设置有两组测试工位，两组测试工位的连线相互垂直设置。一组测试工位可以放置大功率芯片，另一组测试工位则可以放置小功率芯片，以提高检测效率。
显然，上述实施例仅仅是为清楚地说明所作的举例，而并非对实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动和自由组合积分球功率量程和光谱仪测量范围。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围中。

Claims (10)

  1. 一种基于双积分球的芯片测试设备，其特征在于，包括沿芯片传输方向依次设置的自动供给装置、自动对位装置、测试装置和收纳装置；
    所述测试装置包括：
    转盘(22)，具有相对设置的至少两个测试工位；
    驱动结构，设于所述转盘(22)的一侧，包括支架(26)、与支架(26)连接的驱动件和与所述支架(26)滑动连接的滑轨(27)，所述支架(26)上并排设有两个安装工位；
    第一积分球(23)和第二积分球(24)，分设于两个所述安装工位上，在所述驱动件的作用下，所述第一积分球(23)或第二积分球(24)与两个安装工位之间的测试工位对准，所述第一积分球(23)和第二积分球(24)可测试的最大功率不同。
  2. 根据权利要求1所述的基于双积分球的芯片测试设备，其特征在于，所述第一积分球(23)和第二积分球(24)均设有两个光谱输出端(29)和一个PD输出端(30)。
  3. 根据权利要求1所述的基于双积分球的芯片测试设备，其特征在于，所述自动供给装置包括：
    承载机构(2)，具有用于放置芯片的承载区，所述承载区为透明材质，所述承载机构(2)连接有第一驱动机构；
    顶出机构(3)，设于所述承载机构(2)的下方，包括座体(9)和设于所述座体(9)中心的顶针(10)，所述座体(9)朝向所述承载机构(2)的端面上设有多个用于吸附承载区的通孔(11)，所述座体(9)连接有抽气机构，所述顶针(10)连接有第二驱动机构；
    第一吸附机构(4)和定位对准机构(5)，依次设置在所述承载机构(2)上方，且所述定位对准机构(5)、第一吸附机构(4)、承载机构(2)的承载区上的待测芯片和顶针(10)的中心重合。
  4. 根据权利要求3所述的基于双积分球的芯片测试设备，其特征在于，多个所述通孔(11)均布在所述顶针(10)的周向。
  5. 根据权利要求1-4任一项所述的基于双积分球的芯片测试设备，其特征在于，所述自动对位装置包括：
    移动机构(21)；
    对位件(14)，安装在所述移动机构(21)上，所述对位件(14)具有校正板(16)，所述校正板(16)与载片台(20)对应设置，所述移动机构(21)适于驱动所述校正板(16)在载片台(20)所处的平面上方沿第一方向和/或第二方向上进行移动，所述第一方向和第二方向相互垂直；
    所述校正板(16)上开设有适于芯片通过的第一孔体(18)，所述第一孔体(18)一组相对的侧面上开设有防止所述芯片上的发光点与所述第一孔体(18)接触的避让槽(19)。
  6. 根据权利要求5所述的基于双积分球的芯片测试设备，其特征在于，所述第一孔体(18)的横截面呈矩形，且靠近载片台(20)设置；所述校正板(16)上还设有与所述第一孔体(18)贯通设置的第二孔体(17)，所述第二孔体(17)远离所述载片台(20)设置，所述第二孔体(17)的中心线和第一孔体(18)的中心线重合，且所述第二孔体(17)的横截面为圆形，适于用于吸附芯片的吸嘴通过。
  7. 根据权利要求1-4任一项所述的基于双积分球的芯片测试设备，其特征在于，所述收纳装置包括多个盛放结构。
  8. 一种测试方法，其特征在于，包括以下步骤：
    将待测芯片自动对位后运送至测试工位，根据待测芯片的功率和波长驱动相应的第一积分球(23)或第二积分球(24)对准测试工位上的待测芯片进行测试；根据测试结果将测试完的芯片转移至收纳装置的相应位置。
  9. 根据权利要求8所述的测试方法，其特征在于，首先将定位对准机构(5)、第一吸附机构(4)和顶针(10)的中心调整至重合；然后将芯片放置在承载机构(2)的承载区，抽气机构对座体(9)抽气，以使座体(9)与承载机构(2)吸附固定；将芯片移动至中心与定位对准机构(5)的中心重合；第二驱动机构驱动顶针(10)朝向承载区运动以顶起芯片并上升至第一预定位置，顶针(10)与承载机构(2)的被顶起点脱离，同时第一吸附机构(4)对上升的芯片持续施加吸附力，并且吸附着芯片继续上升，当到达第三预定位置后，将其转移至下一工位。
  10. 根据权利要求9所述的测试方法，其特征在于，还包括：
    在将芯片放置在载片台(20)上，同时对芯片施加第一吸附力；校正板(16)推动芯片在载片台(20)上沿第一方向和/或第二方向上进行移动，直至到达预定位置，移动过程中芯片的发光点与校正板(16)上的避让槽(19)对应且不接触，推动芯片在载片台(20)上移动时，对芯片施加第二吸附力；其中，第一方向和第二方向相互垂直，第二吸附力小于第一吸附力。
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