WO2023092470A1 - 一种单头锡球植球喷射头 - Google Patents

一种单头锡球植球喷射头 Download PDF

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Publication number
WO2023092470A1
WO2023092470A1 PCT/CN2021/133584 CN2021133584W WO2023092470A1 WO 2023092470 A1 WO2023092470 A1 WO 2023092470A1 CN 2021133584 W CN2021133584 W CN 2021133584W WO 2023092470 A1 WO2023092470 A1 WO 2023092470A1
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WO
WIPO (PCT)
Prior art keywords
channel
blanking
spray head
base block
feeding
Prior art date
Application number
PCT/CN2021/133584
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English (en)
French (fr)
Inventor
罗后勇
吴朋
Original Assignee
东莞市鸿骐电子科技有限公司
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Priority claimed from CN202011358933.XA external-priority patent/CN112388098A/zh
Application filed by 东莞市鸿骐电子科技有限公司 filed Critical 东莞市鸿骐电子科技有限公司
Publication of WO2023092470A1 publication Critical patent/WO2023092470A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
    • Y02P60/20—Reduction of greenhouse gas [GHG] emissions in agriculture, e.g. CO2
    • Y02P60/21—Dinitrogen oxide [N2O], e.g. using aquaponics, hydroponics or efficiency measures

Definitions

  • the invention relates to the technical fields of semiconductors, electronic component packaging, and electronic mounting equipment, and in particular to a single-head solder ball planting spray head.
  • the solder ball planting process is a process method for implanting solder ball particles on the surface of circuit boards, wafers, and chips waiting to be balled.
  • the solder ball planting process has successively experienced manual stencil planting and automated stencil planting. The three stages of the ball, and the massive transfer of the ball.
  • the principle of manual stencil ball planting is the same as that of automatic stencil ball planting. It mainly makes spherical particles of tin material and pours them into the hollowed out stencil. At the same time, a layer of flux is coated on the surface of the component to be ball planted.
  • Massive ball transfer technology uses a suction head to vacuum up the solder balls, then transfers them to the surface of the component to be balled, and uses gas to blow off the solder balls to complete the ball planting.
  • a suction cup is stuck on the head, and there are adsorption holes on the suction cup, which can suck up the number of solder balls corresponding to the adsorption holes at one time.
  • the distance between the surface of the component to be planted is very small, so this process is not suitable for components with uneven surfaces (such as components with a curved surface structure or components whose surface has been pre-mounted); the smaller the adsorption hole on the suction cup, The more difficult the processing is, the higher the processing cost is, and it cannot be applied to solder balls with a hole diameter of less than 0.1mm for ball planting; when performing ball planting on a large surface, a large number of adsorption holes need to be opened on the suction cup, which will also lead to the processing cost of the suction cup
  • the rise of the process limits the use of this process; moreover, when the diameter of the solder ball or the type of the component to be soldered changes, the suction cup or even the entire suction head needs to be replaced at the same time, thereby increasing the cost.
  • the prior art still lacks a ball planting device that is applicable to different component shapes and different solder ball particle sizes, and has high ball planting efficiency and low processing cost.
  • the object of the present invention is to provide a single-head solder ball planting spray head, which can control the rapid movement of solder balls in the main body of the spray head and eject them from the nozzle one by one in an orderly manner. , can accurately implant solder balls on the surface of circuit boards, wafers, or chips, and can precisely control solder balls with a particle size of 0.06mm or more for ball planting, with high ball planting efficiency, yield, and accuracy. It is suitable for ball planting of components of various shapes, models, and sizes, with low processing cost and good equipment operation stability.
  • a single-head tin ball planting spray head comprising a spray head main body, a vertical blanking channel is formed inside it, and a vertical blanking channel is communicated with the vertical blanking channel.
  • a feed channel, and a feed channel communicated with the feed channel is formed on the spray head main body, and a nozzle communicated with the vertical discharge channel is provided on the spray head main body; at the same time, on the spray head body
  • a blanking control mechanism is provided on the main body of the spray head, and the blanking control mechanism includes a blanking control air circuit, a ventilation channel, and a vacuum channel, and the blanking control gas circuit, ventilation channel and vacuum channel are respectively connected to a
  • the first electromagnetic valve, the blanking control gas path is connected to the position where the feeding channel communicates with the longitudinal blanking channel, and the main body of the spray head includes:
  • the lower part the longitudinal blanking channel is formed in the lower part, the feeding channel is formed at the upper end of the lower part, and the nozzle is arranged at the lower end of the lower part;
  • An upper part it is located above the lower part, and the ventilation channel, vacuum channel and feeding channel are all formed in the upper part;
  • a base block A it is located between the upper part and the lower part, and the material drop control air passage is formed on the base block A.
  • the blanking control mechanism also includes a buffer control air path formed on the base block A and communicated with the feed channel.
  • the buffer control air path, vacuum channel and ventilation channel are respectively connected to a A second solenoid valve, the second solenoid is arranged on the upper part.
  • the blanking control mechanism also includes a blowing air path formed on the base block A and communicated with the feeding channel.
  • the blowing air path and the ventilation channel are respectively connected to a third electromagnetic valve, the third solenoid valve is arranged on the upper part.
  • the blanking control air path has a first vent hole corresponding to the position where the vertical blanking channel communicates with the feed channel; the buffer control air circuit has a second vent hole corresponding to the feed channel. air vent.
  • a first bent portion is formed at one end of the falling material control air path close to the first vent hole, and the width of the first bent portion gradually decreases from the bend to the first vent hole ;
  • a second bent portion is formed at one end of the buffer control air path close to the second vent hole, and the width of the second bent portion gradually decreases from the bend to the second vent hole.
  • the main body of the spray head further includes a base block B, which is arranged between the base block A and the lower part, the feed channel is formed on the base block B, and a A blanking opening corresponding to the longitudinal blanking channel, the first air hole communicates with the material blanking opening, and the second air hole communicates with the position of the feeding channel near the material blanking opening.
  • the base block B includes an upper base block B and a lower base block B below the upper base block B, the feeding channel is formed on the upper base block B, and on the lower base block B A lower channel is formed below the feed channel, wherein the lower channel extends along the length direction of the feed channel and communicates with the discharge opening, and the width of the lower channel is smaller than that of the feed channel.
  • a first communication hole communicating with the first electromagnetic valve and the blanking control air circuit, a second communication hole communicating with the second electromagnetic valve and the buffer control air channel, and a communication hole are respectively formed on the upper part.
  • a third communicating hole between the third solenoid valve and the blowing channel; a feeding pipe connected with the feeding channel is also arranged on the upper part.
  • the lower end of the feeding channel has an inverted tapered structure, and the cross section of the lower end of the feeding channel has an elliptical structure;
  • the lower end is matched with a material storage tank, the cross section of the material storage tank has an elliptical structure, and the end of the feeding channel extends below the material storage tank and coincides with the long axis of the material storage tank.
  • a spray channel communicating with the longitudinal discharge channel is formed in the nozzle.
  • the beneficial effects of the single-head solder ball planting spray head of the present invention are: a communication channel for the movement of the solder balls composed of a feeding channel, a feeding channel, and a longitudinal blanking channel is set in the main body of the spray head, and at the same time, through The dropping control mechanism is set up to control the process of solder balls falling from the feeding channel into the longitudinal blanking channel, so as to realize the sequential, accurate and rapid dropping of the solder balls one by one, so that the solder balls are ejected from the nozzle one by one.
  • the blanking control air circuit, ventilation channel and vacuum channel are isolated from each other, and are only connected through the first solenoid valve, which will not
  • the phenomenon of air leakage and gas series is beneficial to the precise control of the solder balls by the blanking control mechanism; and by controlling the switching frequency of the solenoid valve, the solder balls can be quickly sucked up and blown off. It can be completed quickly; it can precisely control the solder balls with a particle size of 0.06mm or more for ball planting, and there will be no phenomenon of solder ball accumulation and missing ball planting. It is suitable for component ball planting of various shapes, models, and sizes; processing costs Low, good running stability.
  • Fig. 1 is the exploded view of single head tin ball planting spray head of the present invention
  • Fig. 2 is a schematic structural view of a single-head tin ball planting spray head of the present invention
  • Fig. 3 is a partial enlarged view of position E in Fig. 2;
  • Fig. 4 is a cross-sectional view of a position of a single-head tin ball planting spray head of the present invention
  • Fig. 5 is a partial enlarged view of position F in Fig. 4;
  • Fig. 6 is a connection structure diagram of the main body of the spray head below the base block A in the single-head solder ball planting spray head of the present invention
  • Fig. 7 is an internal structure diagram of the middle and upper part of the single-head solder ball planting spray head of the present invention.
  • Fig. 8 is the bottom structure of the base block C in the single-head solder ball planting spray head of the present invention.
  • Fig. 9 is a structural diagram of base block A and a partial enlarged diagram of position G in the single-head solder ball planting spray head of the present invention.
  • Fig. 10 is a schematic structural view of the base block B in the single-head solder ball planting spray head of the present invention and a partial enlarged view of the position H;
  • Fig. 11 is an exploded view of the base block B in the single-head solder ball planting spray head of the present invention.
  • FIG. 12 is a cross-sectional view of another position of the single-head solder ball planting spray head of the present invention.
  • Fig. 13 is a structural view of the bottom of the upper base block B in the single-head solder ball planting spray head of the present invention and a partially enlarged view of position I.
  • the embodiment of the present invention provides a kind of single-head tin ball planting spray head, comprises a spray head main body 1, and a vertical blanking channel 2 is formed in it respectively, and this longitudinal blanking channel 2 communicated with a feed channel 3, and a feed channel 4 communicated with the feed channel 3 is formed on the spray head main body 1, and a feed channel 4 connected with the vertical drop channel 2 is provided on the spray head main body 1.
  • a nozzle 5 is connected; at the same time, a blanking control mechanism is arranged on the spray head main body 1, and the blanking control mechanism corresponds to the communication position between the vertical blanking channel 2 and the feeding channel 3;
  • the solder balls are fed from the feeding channel 4, and enter the feeding channel 3 in turn; then fall into the longitudinal blanking channel 2 in turn, and fall to the nozzle 5 along the longitudinal blanking channel 2 under the action of their own gravity, and finally It is sprayed from 5 nozzles and implanted on the surface of the component to be balled. It can precisely control the solder balls with a particle size of 0.06mm or more for ball planting. There is no problem of solder ball adsorption and accumulation, and it is not affected by the shape of the component, which is conducive to improving ball planting. accuracy and efficiency.
  • the dropping control mechanism by setting the dropping control mechanism, the process of solder balls falling from the feed channel 3 into the longitudinal blanking channel 2 is controlled, so that the solder balls can be dropped one by one in order, accurately and quickly, and can be controlled
  • the time for each tin ball to fall into the vertical blanking channel 2 enables the tin balls to be ejected from the nozzle 5 one by one, which is convenient for improving the accuracy and speed of solder ball planting.
  • the blanking control mechanism includes a blanking control air circuit 61, a ventilation channel 71, and a vacuum channel 72, and the blanking control air circuit 61, the ventilation channel 71 and the vacuum channel 72 are respectively connected to a first A solenoid valve 81, the blanking control air path 61 is connected to the position where the feeding channel 3 communicates with the longitudinal blanking channel 2, namely the following blanking port 31;
  • the ventilation passage 71 communicates with external compressed air, and the vacuum passage 72 communicates with an external vacuum machine.
  • an inert gas is passed into the vent channel 71 , and in this embodiment, nitrogen gas is vented into the vent channel 71 .
  • the next solder ball moves to the blanking port 31; at the same time, the first electromagnetic valve 81 shuts off the communication with the air passage 71, and connects the blanking control air passage 61 and the vacuum passage 72, and passes through the vacuum passage 72. Vacuum adsorption is performed on the blanking control air path 61, so that the solder balls entering the blanking port 31 from the feed channel 3 stop falling into the vertical blanking channel 2 until the last solder ball is ejected from the nozzle 5.
  • the switching frequency of the solenoid valve can quickly pick up and blow off the solder balls, and it can also be completed quickly when performing large-scale ball planting.
  • the spray head body 1 includes:
  • the longitudinal blanking channel 2 is formed in the lower part 11, the feeding channel 2 is formed at the upper end of the lower part 11, and the nozzle 5 is arranged at the lower end of the lower part 11;
  • An upper part 12 it is located above the lower part 11, and the ventilation channel 71, the vacuum channel 72 and the feeding channel 4 are all formed in the upper part 12;
  • a base block A13 it is located between the upper part 12 and the lower part 11, and the material drop control air passage 61 is formed on the base block A13.
  • the blanking control air circuit 61, the ventilation channel 71 and the vacuum channel 72 are isolated from each other, and are only connected through the first solenoid valve 81, so that there will be no cross-gas phenomenon, which is beneficial to the precise control of the blanking control mechanism on the solder balls, so that The solder balls enter the longitudinal blanking channel 2 one by one in an orderly manner, effectively improving the accuracy of solder ball planting, low processing cost, and good equipment operation stability.
  • the blanking control mechanism also includes a buffer control air path 62 formed on the base block A13 and communicated with the feed channel 3.
  • the buffer control air path 62, the vacuum channel 72 and the The ventilation passages 71 are connected to a second solenoid valve 82 respectively, and the second solenoid valve 82 is disposed on the upper part 12 .
  • the buffer control air circuit 62 and the vacuum channel 72 are vacuumed to vacuumize the solder balls behind the blanking port 31, so that the blanking
  • the solder ball behind the port 31 stops moving toward the blanking port 31; and when the solder ball on the blanking port 31 is blown into the longitudinal blanking channel 2, the second solenoid valve 82 shuts off the buffer control air circuit 62 and the vacuum channel 72 connection, and connect the buffer control air circuit 62 and the ventilation channel 71, so that the solder balls behind the blanking port 31 are blown off, and at the same time, the first solenoid valve 81 connects the blanking control air circuit 61 to the ventilation channel 71 It is in a state of vacuum adsorption, so that the blown-off tin balls are adsorbed to the discharge port 31. As a result, the solder balls move forward sequentially without interfering with each other, so that the entire action process is carried out in an orderly and
  • the blanking control mechanism in order to enable the solder balls on the feed channel 3 to smoothly move sequentially toward the discharge opening 31, the blanking control mechanism also includes a A blowing air passage 63 is connected, and the blowing air passage 63 and the air passage 71 are connected to a third solenoid valve 83 respectively, and the third solenoid valve 83 is arranged on the upper part 11 .
  • the end of the spray head body 1 close to the longitudinal blanking channel 2 can also be inclined downward at a certain angle. Roll forward under action.
  • the blanking control air passage 61 has a first vent hole 611 corresponding to the position where the vertical blanking channel 2 communicates with the feeding channel 3; the buffer control The gas path 62 has a second vent hole 621 corresponding to the feed channel 3 .
  • the distance between the position where the first vent hole 611 acts on the longitudinal blanking channel 2 and the position where the second vent hole 621 acts on the feed channel 3 is greater than the diameter of the solder ball and less than the diameter of the two solder balls. And, in this way, balls are avoided between the first air hole 611 and the second air hole 621 , and it is better to control the solder balls entering into the vertical discharge channel 2 one by one.
  • a first bent portion 612 is formed at one end of the blanking control air passage 61 close to the first vent hole 611 , and the width of the first bent portion 612 extends from the bend to the first vent hole 611 The place gradually decreases; the blanking control air path 61 is designed into a bent shape, and the end connected to the longitudinal blanking channel 2 has a pointed structure, so that when the blanking control air path 61 communicates with the ventilation channel 71, in A stable air flow can be formed in the blanking control air passage 61.
  • the blanking control air passage 61 communicates with the vacuum passage 72, a stable vacuum state is formed; the end communicating with the vertical blanking passage 2 has a pointed structure, so that the first The strength of air blowing and air suction of the air hole 611 is increased, which effectively sucks up and blows off the solder balls, which is beneficial to improve the accuracy and speed of ball planting.
  • a second bent portion 622 is formed at one end of the buffer control air passage 62 close to the second vent hole 621, and the width of the second bent portion 622 gradually decreases from the bent point to the second vent hole 621. It is beneficial to form a stable air flow or a stable vacuum state in the buffer control air circuit 62, and at the same time, increase the strength of the second air hole 621 for blowing and sucking the solder balls, so as to realize precise control of the solder balls.
  • the spray head body 1 also includes a base block B14, which is arranged between the base block A13 and the lower part 11, and the feed channel 3 is formed on the base block B14 , a blanking port 31 corresponding to the longitudinal blanking channel 2 is formed on the feeding channel 3, the first vent hole 611 is communicated with the blanking port 31, and the second vent hole 621 is connected to the blanking port near the blanking port. Port 31 is connected at the feed channel 3 position.
  • the base block B14 includes an upper base block B141 and a lower base block B142 below the upper base block B141.
  • the block B142 is formed with a lower channel 1421 located below the feed channel 3, wherein the lower channel 1421 extends along the length direction of the feed channel 3 and communicates with the blanking port 31, and the width of the lower channel 1421 is wider than that of the feed channel 3.
  • the width is small. Specifically, the width of the feed channel 3 is greater than the diameter of the solder ball and less than the sum of the diameters of the two solder balls, the width of the lower channel 1421 is smaller than the diameter of the solder ball, and at the same time, the depth of the feed channel 3 is greater than the diameter of the solder ball.
  • the lower channel 1421 has a guiding effect on the movement of the solder balls, so that the solder balls move along a straight line in the feeding channel 3, and the outer periphery of the solder balls is filled with gas, so that the solder balls are suspended in the gas, reducing the solder ball due to The frictional force generated by contacting the feed channel 3 enables the solder balls to move forward faster and more smoothly, further reducing the time for the solder balls to move inside the spray head main body 1, and improving the efficiency of solder ball planting.
  • An upper groove 1411 is formed on the upper base block B141 and on opposite sides of the blanking opening 31, and a lower groove 1422 matching the upper groove 1422 is formed on the lower base block B142.
  • An optical fiber sensor is disposed between the upper groove 1411 and the lower groove 1422 .
  • the optical fiber sensor has a light emitting end and a light receiving end.
  • the system judges that there is a ball at the blanking port 31; when there is no solder ball at the blanking port 31, the light receiving end can receive the light normally.
  • the light emitted by the transmitter at this time, the system judges that there is no solder ball at the blanking port 31, and through the detection result of the optical fiber sensor, it will inform the system whether there is a ball at the blanking port 31, and then judge whether each ball planting is normal, which is convenient for subsequent maintenance , to prevent the phenomenon of missed ball planting and improve product yield.
  • a first communication hole 121 communicating with the first electromagnetic valve 81 and the blanking control air passage 61, and a communication hole 121 communicating with the second electromagnetic valve 82 and the buffer control air passage 62 are respectively formed on the upper part 12.
  • a second communicating hole 122 and a third communicating hole 123 communicating with the third electromagnetic valve 83 and the blowing passage 63 ; a feeding pipe 9 connected to the feeding passage 4 is also arranged on the upper part 12 .
  • a base block C (not shown in the drawings) can also be provided between the upper part 12 and the base block A13, the first communication hole 121, the first communication hole 122, and the third communication hole 123 are all set on the base block C.
  • the lower end of the feeding channel 4 has an inverted tapered structure, and the cross section of the lower end of the feeding channel 4 has an elliptical structure.
  • a material loading accumulation groove 631 is formed which cooperates with the lower end of the material feeding channel 4.
  • the end of the channel 3 extends below the material storage tank 631 and coincides with the long axis of the material storage tank 631 .
  • the side wall of the material storage tank 631 with an elliptical structure has a guiding effect on the air flow, so that the gas flows along the two side walls, so that the material is accumulated in the material storage tank.
  • the middle part and both sides of the groove 631 form an airflow, thereby effectively blowing the solder balls.
  • the lower end of the feeding channel 4 has an inverted tapered structure, so that there is enough loose space for the solder balls in the vertical direction , which is conducive to blowing away the accumulated solder balls and smoothly entering the feeding channel 3, thereby improving the ball planting efficiency of the equipment.
  • the ventilation channel 71 and the vacuum channel 72 are arranged side by side in the upper part 11 and extend along the direction of the feeding channel 3 respectively.
  • a first socket group 124 for inserting the first solenoid valve 81, a second socket group 125 for inserting the second solenoid valve 82, and a third socket group for inserting the third solenoid valve 83 are formed on the top.
  • the third insertion hole group 123 is close to one end of the feeding channel 4, the first insertion hole group 121 is close to one end of the longitudinal blanking channel 2, and the ventilation channel 71, the vacuum channel 72 and the first communication hole 121 communicate with the first jack group 124 respectively; the ventilation passage 71, the vacuum passage 72 and the second communication hole 122 communicate with the second jack group 125 respectively; the ventilation passage 71, the vacuum passage 72 and the third communication hole 123 communicate with the third jack group 126 respectively.
  • an injection channel 51 communicating with the longitudinal discharge channel 2 is formed in the nozzle 5 . After the solder ball enters the nozzle 5 from the vertical blanking channel 2, it is sprayed out along the injection channel 51 to improve the accuracy of solder ball planting.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明公开了一种单头锡球植球喷射头，包括一喷射头主体，在其内部分别形成有一纵向落料通道、及与该纵向落料通道相连通的一进料通道，且在该喷射头主体上形成有与进料通道相连通的一上料通道；在该喷射头主体上设置有一落料控制机构，该落料控制机构对应于进料通道与纵向落料通道连通位置处。该单头锡球植球喷射头能控制锡球在喷射头主体内快速移动并一个个有序从喷嘴喷出，可以将锡球准确的植入到电路板、晶圆、或芯片的表面上，能精确控制粒径为0.06mm以上的锡球进行植球，植球效率、良率、以及精确度高，适用于各种形状、型号、及大小的元件植球，加工成本低，运行稳定性好。

Description

一种单头锡球植球喷射头 技术领域
本发明涉及半导体、电子元器件封装、及电子贴装设备技术领域，尤其涉及一种单头锡球植球喷射头。
背景技术
锡球植球工艺是在电路板、晶圆、芯片等待植球的元件表面上植入锡球颗粒的一种工艺方法，锡球植球工艺先后经历了手工钢网植球、自动化钢网植球、以及巨量转移植球三个阶段。
其中，手工钢网植球与自动化钢网植球原理相同，其主要是将锡料制成球状颗粒并倒入镂空的钢网上，同时，在待植球的元件表面上涂覆一层助焊剂并放置于镂空的钢网下方，然后将锡球倒在钢网上，利用刮刀刮动锡球，使锡球从钢网上的镂空处掉落元件表面上；钢网植球的工艺在操作时，需要将钢网与元件表面的距离控制在两个锡球的直径之和以内，这就要求对钢网、及待植球元件表面的平整性具较高的要求，而钢网在使用过程中，受到刮刀的挤压力，容易变形和破损，经常需要更换，钢网平整性同时还受面积的影响，钢网面积越容易变形，无法进行大面积植球；对于表面不平整的元件(例如具有曲面结构的元件或表面已经进行预先贴装的元件)钢网印刷也不适用；而且，由于电子产品逐渐向小型化发展，在对微小元件进行植球时，使用的锡球颗粒直径很小，锡球的直径越小，其比表面积越大，锡球表面的吸附力越大，容易出现锡球堆积或锡球吸附在钢网的现象，导致漏植球现象，降低了植球的良率和效率，同时，锡球植球的直径越小，钢网的加工越困难，成本越高，现有技术还无法加工孔径在0.1mm以下的钢网，上述问题均限制了钢网植球设备的使用。
巨量转移植球工艺，是使用吸头采用抽真空将锡球吸起，然后转移到待植球元件表面上，采用气体将锡球吹落完成植球，为了提高植球效率，通过 在吸头上卡入一个吸盘，该吸盘上开设有吸附孔，可以一次性吸起与吸附孔相应数量的锡球，在使用时，为了使锡球同时准确掉落在相应位置上，要求吸头与待植球元件表面的距离很小，由此，对于表面不平整的元件(例如具有曲面结构的元件或表面已经进行预先贴装的元件)，该工艺也不适用；吸盘上吸附孔越小，加工难度越大，加工成本就越高，无法应用在孔径小于0.1mm以下的锡球进行植球；而在进行大面植球时，吸盘上需要开设大量的吸附孔，也会导致吸盘加工成本的升高，限制了该工艺的使用；而且，当锡球直径或待焊接元件型号改变时，需要同时更换吸盘甚至整个吸头，由此，增加了成本。
因此，现有技术还缺乏一种适用不同元件形状、不同锡球粒径使用且植球效率高、加工成本低的植球设备。
发明内容
针对上述不足，本发明的目的在于提供一种单头锡球植球喷射头，该单头锡球植球喷射头能控制锡球在喷射头主体内快速移动并一个个有序从喷嘴喷出，可以将锡球准确的植入到电路板、晶圆、或芯片的表面上，能精确控制粒径为0.06mm以上的锡球进行植球，植球效率、良率、以及精确度高，适用于各种形状、型号、及大小的元件植球，加工成本低，设备运行稳定性好。
本发明为达到上述目的所采用的技术方案是：一种单头锡球植球喷射头，包括一喷射头主体，在其内部分别形成有一纵向落料通道、及与该纵向落料通道相连通的一进料通道，且在该喷射头主体上形成有与进料通道相连通的一上料通道，在该喷射头主体上设置有与纵向落料通道相连通的一喷嘴；同时，在该喷射头主体上设置有一落料控制机构，该落料控制机构包括一落料控制气路、一通气通道、及一真空通道，所述落料控制气路、通气通道与真空通道分别连接于一第一电磁阀，所述落料控制气路连通于进料通道与纵向落料通道连通位置处，所述喷射头主体包括：
一下部：所述纵向落料通道形成于下部内，所述进料通道形成于下部的 上端，所述喷嘴设置于下部下端；
一上部：其位于下部上方，所述通气通道、真空通道与上料通道均形成于上部；
一基块A：其位于上部与下部间，所述落料控制气路形成于基块A上。
作为本发明的进一步改进，所述落料控制机构还包括形成于基块A上并与进料通道相连通的一缓冲控制气路，该缓冲控制气路、真空通道与通气通道分别连接于一第二电磁阀，所述第二电磁设置于上部上。
作为本发明的进一步改进，所述落料控制机构还包括形成于基块A上并与上料通道相连通的一吹气气路，该吹气气路与通气通道分别连接于一第三电磁阀，所述第三电磁阀设置于上部上。
作为本发明的进一步改进，所述落料控制气路具有对应于纵向落料通道与进料通道连通位置处的第一通气孔；所述缓冲控制气路具有对应于进料通道的一第二通气孔。
作为本发明的进一步改进，所述落料控制气路靠近第一通气孔的一端形成一第一弯折部，该第一弯折部的宽度由弯折处到第一通气孔处逐渐减小；所述缓冲控制气路靠近第二通气孔的一端形成一第二弯折部，该第二弯折部的宽度由弯折处到第二通气孔处逐渐减小。
作为本发明的进一步改进，所述喷射头主体还包括一基块B，其设置于基块A与下部间，所述进料通道形成于该基块B上，在进料通道上形成有与纵向落料通道相对应的一落料口，所述第一通气孔与该落料口连通，所述第二通气孔与靠近落料口的进料通道位置处相连通。
作为本发明的进一步改进，所述基块B包括一上基块B、及位该上基块B下方的一下基块B，所述上料通道形成于上基块B，在下基块B上形成有位于进料通道下方的一下通道，其中，该下通道沿进料通道长度方向延伸并与落料口连通，且该下通道的宽度比进料通道的宽度小。
作为本发明的进一步改进，在上部上分别形成有连通第一电磁阀与落料控制气路的一第一连通孔、连通第二电磁阀与缓冲控制气路的一第二连通孔、及连通第三电磁阀与吹气通道的一第三连通孔；在上部上还设置有与上料通 道连接的一上料管。
作为本发明的进一步改进，所述上料通道下端具有倒锥形结构，且上料通道下端的横截面具有椭圆结构；在所述吹气气路上且位于上料通道下方形成有与上料通道下端配合的一上料堆积槽，该上料堆积槽的横截面具有椭圆结构，进料通道的端部延伸至该上料堆积槽下方并与上料堆积槽的长轴重合。
作为本发明的进一步改进，在所述喷嘴内形成有与纵向落料通道连通的一喷射通道。
本发明单头锡球植球喷射头的有益效果为：通过在喷射头主体内设置由上料通道、进料通道、及纵向落料通道组成的供锡球移动的一连通通道，同时，通过设置落料控制机构，对锡球由进料通道落入纵向落料通道这个过程进行控制，实现锡球一个个依序、准确、快速的掉落，使锡球一个一个从喷嘴处喷出，便于提高锡球植球的精度与效率，结构简单，整体体积小；落料控制机构中，落料控制气路、通气通道与真空通道间相互隔离，仅通过第一电磁阀进行连接，不会出现漏气串气现象，利于落料控制机构对锡球的精准控制；且可以通过控制电磁阀的切换频率，快速的对锡球进行吸起和吹落，在进行大面积植球时，也可以快速完成；可以精确控制粒径为0.06mm以上的锡球进行植球，不会出现锡球堆积而漏植球的现象，适用于各种形状、型号、及大小的元件植球；加工成本低，运行稳定性好。
上述是发明技术方案的概述，以下结合附图与具体实施方式，对本发明做进一步说明。
附图说明
图1为本发明单头锡球植球喷射头的爆炸图；
图2为本发明单头锡球植球喷射头的结构示意图；
图3为图2中位置E的局部放大图；
图4为本发明单头锡球植球喷射头一位置的剖视图；
图5为图4中位置F的局部放大图；
图6为本发明单头锡球植球喷射头中喷射头主体在基块A以下部分的 连接结构图；
图7为本发明单头锡球植球喷射头中上部的内部结构图；
图8为本发明单头锡球植球喷射头中基块C的底部结构；
图9为为本发明单头锡球植球喷射头中基块A的结构图及位置G的局部放大图；
图10为本发明单头锡球植球喷射头中基块B的结构示意图及位置H的局部放大图；
图11为本发明单头锡球植球喷射头中基块B的爆炸图；
图12为本发明单头锡球植球喷射头另一位置的剖视图；
图13为本发明单头锡球植球喷射头中上基块B底部结构图及位置I的局部放大图。
具体实施方式
为更进一步阐述本发明为达到预定目的所采取的技术手段及功效，以下结合附图及较佳实施例，对本发明的具体实施方式详细说明。
请参照图1至图4，本发明实施例提供一种单头锡球植球喷射头，包括一喷射头主体1，在其内部分别形成有一纵向落料通道2、及与该纵向落料通道2相连通的一进料通道3，且在该喷射头主体1上形成有与进料通道3相连通的一上料通道4，在该喷射头主体1上设置有与纵向落料通道2相连通的一喷嘴5；同时，在该喷射头主体1上设置有一落料控制机构，该落料控制机构对应于纵向落料通道2与进料通道3连通位置处；
锡球由上料通道4上料，并依次进入进料通道3；接着依次落入纵向落料通道2中，并在自身重力作用下，沿纵向落料通道2掉落到喷嘴5处，最后由喷嘴5处喷出植入待植球元件表面，可以精确控制粒径为0.06mm以上的锡球进行植球，不存在锡球吸附堆积问题，也不受元件形状的影响，利于提高植球的精度与效率。
在上述过程中，通过设置落料控制机构，对锡球由进料通道落3入纵向落料通道2这个过程进行控制，实现锡球一个个依序、准确、快速的掉落， 且可以控制每个锡球掉入纵向落料通道2的时间，使锡球一个一个从喷嘴5处喷出，便于提高锡球植球的精度与速度。
具体的，所述落料控制机构包括一落料控制气路61、一通气通道71、及一真空通道72，所述落料控制气路61、通气通道71与真空通道72分别连接于一第一电磁阀81，所述落料控制气路61连通于进料通道3与纵向落料通道2连通位置处，即下述的落料口31；
所述通气通道71与外界压缩气体连通，所述真空通道72与外界抽真空机连通。
为了防止锡球氧化，所述通气通道71中通入惰性气体，在本实施例中，所述通气通道71中通入氮气。
当第一电磁阀81接通通气通道71，而关断与真空通道72的连接时，由通气通道71向落料控制气路61通入气体，并由落料控制气路61向纵向落料通道2吹气，使得由进料通道3进入落料口31的锡球被快速、准确吹入纵向落料通道2中，相对于依靠锡球自身重量往下掉落，采用吹气的方式，明显提高了锡球掉落的速度，提高工作效率。
接着，下一个锡球移动到落料口31处；与此同时，第一电磁阀81关断与通气通道71的连通，而接通落料控制气路61与真空通道72，通过真空通道72对落料控制气路61进行真空吸附，使得由进料通道3进入落料口31的锡球停止掉落到纵向落料通道2内，直到上一个锡球由喷嘴5射出。
然后重复上述过程，由真空模式变为吹气模式，控制锡球一个个依次掉落至纵向落料通道2内，并由喷嘴5处一个个喷出，有效提高植球精确度，可以通过控制电磁阀的切换频率，快速的对锡球进行吸起和吹落，在进行大面积植球时，也可以快速完成。
本实施例中，所述喷射头主体1包括：
一下部11：所述纵向落料通道2形成于下部11内，所述进料通道2形成于下部11的上端，所述喷嘴5设置于下部11下端；
一上部12：其位于下部11上方，所述通气通道71、真空通道72与上料通4道均形成于上部12；
一基块A13：其位于上部12与下部11间，所述落料控制气路61形成于基块A13上。
这样，落料控制气路61、通气通道71与真空通道72间相互隔离，仅通过第一电磁阀81进行连接，不会出现串气现象，利于落料控制机构对锡球的精准控制，使锡球一个个有序进入纵向落料通道2内，有效提高锡球植球的精确度，加工成本低，设备运行稳定性好。
由上述过程可知，在纵向落料通道2与进料通道3连通位置处的锡球被抽真空吸附时，为了防止下一个锡球因过快的往前移动而撞击到被吸附的锡球，影响真空吸附，本实施例中，所述落料控制机构还包括形成于基块A13上并与进料通道3相连通的一缓冲控制气路62，该缓冲控制气路62、真空通道72与通气通道71分别连接于一第二电磁阀82，所述第二电磁阀82设置于上部12上。当第二电磁阀81接通缓冲控制气路62与真空通道72时，通过缓冲控制气路62与真空通道72进行抽真空，对落料口31后方的锡球进行抽真空吸附，使得落料口31后方的锡球停止往落料口31移动；而当落料口31上的锡球被吹入纵向落料通道2内时，第二电磁阀82关断缓冲控制气路62与真空通道72的连接，而接通缓冲控制气路62与通气通道71，使得落料口31后方的锡球被吹落，与此同时，第一电磁阀81将落料控制气路61与通气通道71接通，处于真空吸附状态，从而将被吹落的锡球吸附到落料口31处。由此，实现一个个锡球依序往前移动，相互之间无干扰，使得整个动作过程有序稳定的进行，从而提高整个喷射植球的精确度与效率。
在本实施例中，为了使进料通道3上的锡球能够顺利的往落料口31方向依序移动，所述落料控制机构还包括形成于基块A13上并与上料通道4相连通的一吹气气路63，该吹气气路63与通气通道71分别连接于一第三电磁阀83，所述第三电磁阀83设置于上部11上。
在使用时，还可以将喷射头主体1靠近纵向落料通道2的一端向下倾斜一定角度，这样，进料通道3具有一定的斜度，锡球进入进料通道3后在其自重力的作用下向前滚动。
本实施例中，如图5、图9所示，所述落料控制气路61具有对应于纵向 落料通道2与进料通道3连通位置处的一第一通气孔611；所述缓冲控制气路62具有对应于进料通道3的一第二通气孔621。由此，实现落料控制气路61与纵向落料通道2连通，以及缓冲控制气路62与进料通道3连通。
同时，所述第一通气孔611作用于纵向落料通道2的位置与第二通气孔621作用于进料通道3的位置之间的距离大于锡球的直径且小于两个锡球的直径之和，这样，避免第一通气孔611与第二通气孔621间藏球，更好的控制锡球一个一个进入纵向落料通道2中。
如图6所示，所述落料控制气路61靠近第一通气孔611的一端形成一第一弯折部612，该第一弯折部612的宽度由弯折处到第一通气孔611处逐渐减小；将落料控制气路61设计成弯折形状，并且与纵向落料通道2连接的一端具有尖嘴结构，这样，当落料控制气路61与通气通道71相连通时，在落料控制气路61内能形成稳定的气流，当落料控制气路61与真空通道72连通时，则形成稳定的真空状态；与纵向落料通道2连通的一端具有尖嘴结构，使第一通气孔611的吹气与吸气的强度增大，有效对锡球进行吸起与吹落，利于提高植球的精确度与速度。
同理，所述缓冲控制气路62靠近第二通气孔621的一端形成一第二弯折部622，该第二弯折部622的宽度由弯折处到第二通气孔621处逐渐减小；利于缓冲控制气路62内形成稳定的气流或具有稳定的真空状态，同时，增大第二通气孔621对锡球吹气与吸气的强度，实现对锡球的精确控制。
如图1、图10所示，为了方便加工，所述喷射头主体1还包括一基块B14，其设置于基块A13与下部11间，所述进料通道3形成于该基块B14上，在进料通道3上形成有与纵向落料通道2相对应的一落料口31，所述第一通气孔611与该落料口31连通，所述第二通气孔621与靠近落料口31的进料通道3位置处相连通。
如图11与图12所示，所述基块B14包括一上基块B141、及位该上基块B141下方的一下基块B142，所述上料通道3形成于上基块B141，在下基块B142上形成有位于进料通道3下方的一下通道1421，其中，该下通道1421沿进料通道3长度方向延伸并与落料口31连通，且该下通道1421的宽度比 进料通道3的宽度小。具体的，所述进料通道3的宽度大于锡球的直径且小于两个锡球的直径之和，下通道1421的宽度小于锡球的直径，同时，进料通道3的深度大于锡球的直径且小于两个锡球的直径之和。这样，进料通道3的每个位置上仅能容纳一个锡球，不会发生锡球堆积而堵塞的现象，同时，当吹气气路63进行吹气，吹动锡球沿进料通道3移动时，下通道1421对锡球的移动具有导向作用，使锡球在进料通道3内沿直线移动，而且，在锡球的外周充满气体，使锡球悬浮在气体中，降低锡球因接触进料通道3而产生的摩擦力，由此锡球能更快更顺畅的向前移动，进一步减小锡球在喷射头主体1内部移动的时间，提高锡球植球效率。
在上基块B141上且位于落料口31相对的两侧形成分别形成有一上凹槽1411，在下基块B142上形成有与上凹槽1422配合的下凹槽1422，在基块B14上且位于上凹槽1411与下凹槽1422间设置有一光纤传感器。具体的，光纤传感器具有一光发射端、及一光接收端，通过将光发射端、及光接收端相对设置在落料口31两侧，当落料口31有锡球时，光发射端发出的光被锡球挡住，光接收端接收不到光发射端发出的光，此时，系统判断落料口31处有球；当落料口31处没有锡球时，光接收端能正常接收光发射端发出的光，此时，系统判断落料口31处没有锡球，通过光纤传感器检测结果，来告知系统落料口31处是否有球，进而判断每次植球是否正常，方便后续检修，防止出现漏植球现象，提高产品良率。
如图8与图12所示，在上部12上分别形成有连通第一电磁阀81与落料控制气路61的一第一连通孔121、连通第二电磁阀82与缓冲控制气路62的一第二连通孔122、及连通第三电磁阀83与吹气通道63的一第三连通孔123；在上部12上还设置有与上料通道4连接的一上料管9。
当然，为了便于加工，还可以在上部12与基块A13之间设置一基块C(附图中未显示)，所述第一连通孔121、第一连通孔122、及第三连通孔123均设置在该基块C上。
如图4、图6与图9所示，所述上料通道4下端具有倒锥形结构，且上料通道4下端的横截面具有椭圆结构。同时，在所述吹气气路63上且位于 上料通道4下方形成有与上料通道4下端配合的一上料堆积槽631，该上料堆积槽631的横截面具有椭圆结构，进料通道3的端部延伸至该上料堆积槽631下方并与上料堆积槽631的长轴重合。在吹气气路63对上料堆积槽631进行吹气时，具有椭圆结构的上料堆积槽631的侧壁对气流有导向的作用，使气体沿两侧壁流动，这样，在上料堆积槽631的中部、及两侧边均形成气流，从而有效的对锡球进行吹气，同时，上料通道4的下端具有倒锥形结构，使锡球在竖直方向上有足够的松动空间，利于将堆积的锡球吹散并顺利进入进料通道3内，从而提高设备植球效率。
为了提高单头植球设备结构的紧凑性，降低制造成本，如图7所示，所述通气通道71与真空通道72并排设置于上部11内并分别沿进料通道3方向延伸，在上部12上形成有供第一电磁阀81插入的一第一插孔组124、供第二电磁阀82插入的一第二插孔组125、及供第三电磁阀83插入的一第三插孔组126，其中，所述第三插孔组123靠近上料通道4一端，所述第一插孔组121靠近纵向落料通道2一端，所述通气通道71、真空通道72与第一连通孔121分别与第一插孔组124连通；所述通气通道71、真空通道72与第二连通孔122分别与第二插孔组125连通；所述通气通道71、真空通道72与第三连通孔123分别与第三插孔组126连通。
如图4所示，在所述喷嘴5内形成有与纵向落料通道2连通的一喷射通道51。锡球在由纵向落料通道2进入喷嘴5后，沿喷射通道51喷出，提高锡球植球精确度。
以上所述，仅是本发明的较佳实施例而已，并非对本发明的技术范围作任何限制，故采用与本发明上述实施例相同或近似的技术特征，而得到的其他结构，均在本发明的保护范围之内。

Claims (10)

  1. 一种单头锡球植球喷射头，包括一喷射头主体，在其内部分别形成有一纵向落料通道、及与该纵向落料通道相连通的一进料通道，且在该喷射头主体上形成有与进料通道相连通的一上料通道，在该喷射头主体上设置有与纵向落料通道相连通的一喷嘴；同时，在该喷射头主体上设置有一落料控制机构，该落料控制机构包括一落料控制气路、一通气通道、及一真空通道，所述落料控制气路、通气通道与真空通道分别连接于一第一电磁阀，所述落料控制气路连通于进料通道与纵向落料通道连通位置处，其特征在于，
    所述喷射头主体包括：
    一下部：所述纵向落料通道形成于下部内，所述进料通道形成于下部的上端，所述喷嘴设置于下部下端；
    一上部：其位于下部上方，所述通气通道、真空通道与上料通道均形成于上部；
    一基块A：其位于上部与下部间，所述落料控制气路形成于基块A上。
  2. 根据权利要求1所述的单头锡球植球喷射头，其特征在于，所述落料控制机构还包括形成于基块A上并与进料通道相连通的一缓冲控制气路，该缓冲控制气路、真空通道与通气通道分别连接于一第二电磁阀，所述第二电磁设置于上部上。
  3. 根据权利要求2所述的单头锡球植球喷射头，其特征在于，所述落料控制机构还包括形成于基块A上并与上料通道相连通的一吹气气路，该吹气气路与通气通道分别连接于一第三电磁阀，所述第三电磁阀设置于上部上。
  4. 根据权利要求2所述的单头锡球植球喷射头，其特征在于，所述落料控制气路具有对应于纵向落料通道与进料通道连通位置处的第一通气孔；所述缓冲控制气路具有对应于进料通道的一第二通气孔。
  5. 根据权利要求4所述的单头锡球植球喷射头，其特征在于，所述落料控制气路靠近第一通气孔的一端形成一第一弯折部，该第一弯折部的宽度由弯折处到第一通气孔处逐渐减小；所述缓冲控制气路靠近第二通气孔的一端 形成一第二弯折部，该第二弯折部的宽度由弯折处到第二通气孔处逐渐减小。
  6. 根据权利要求4所述的单头锡球植球喷射头，其特征在于，所述喷射头主体还包括一基块B，其设置于基块A与下部间，所述进料通道形成于该基块B上，在进料通道上形成有与纵向落料通道相对应的一落料口，所述第一通气孔与该落料口连通，所述第二通气孔与靠近落料口的进料通道位置处相连通。
  7. 根据权利要求6所述的单头锡球植球喷射头，其特征在于，所述基块B包括一上基块B、及位该上基块B下方的一下基块B，所述上料通道形成于上基块B，在下基块B上形成有位于进料通道下方的一下通道，其中，该下通道沿进料通道长度方向延伸并与落料口连通，且该下通道的宽度比进料通道的宽度小。
  8. 根据权利要求3所述的单头锡球植球喷射头，其特征在于，在上部上分别形成有连通第一电磁阀与落料控制气路的一第一连通孔、连通第二电磁阀与缓冲控制气路的一第二连通孔、及连通第三电磁阀与吹气通道的一第三连通孔；在上部上还设置有与上料通道连接的一上料管。
  9. 根据权利要求3所述的单头锡球植球喷射头，其特征在于，所述上料通道下端具有倒锥形结构，且上料通道下端的横截面具有椭圆结构；在所述吹气气路上且位于上料通道下方形成有与上料通道下端配合的一上料堆积槽，该上料堆积槽的横截面具有椭圆结构，进料通道的端部延伸至该上料堆积槽下方并与上料堆积槽的长轴重合。
  10. 根据权利要求9所述的单头锡球植球喷射头，其特征在于，在所述喷嘴内形成有与纵向落料通道连通的一喷射通道。
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