WO2023045288A1 - 一种无焊料焊接接头及其焊接制造方法 - Google Patents

一种无焊料焊接接头及其焊接制造方法 Download PDF

Info

Publication number
WO2023045288A1
WO2023045288A1 PCT/CN2022/082403 CN2022082403W WO2023045288A1 WO 2023045288 A1 WO2023045288 A1 WO 2023045288A1 CN 2022082403 W CN2022082403 W CN 2022082403W WO 2023045288 A1 WO2023045288 A1 WO 2023045288A1
Authority
WO
WIPO (PCT)
Prior art keywords
superconducting
strip
flux
joint
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/082403
Other languages
English (en)
French (fr)
Inventor
黄振
任伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Jiao Tong University
Original Assignee
Shanghai Jiao Tong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Jiao Tong University filed Critical Shanghai Jiao Tong University
Priority to US18/694,422 priority Critical patent/US12528132B2/en
Publication of WO2023045288A1 publication Critical patent/WO2023045288A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Definitions

  • the invention relates to the field of welding/the technical field of (superconducting) wire preparation, in particular to a solderless welding joint and a welding manufacturing method thereof.
  • Welding is the process of joining metals or other materials by means of heat, pressure, or both.
  • the base metal For the commonly used method of connecting the base metal with solder, since the melted solder resolidifies and becomes solid, sometimes the mechanical properties of the base material will be reduced, resulting in failure of the soldering method with solder in some application scenarios.
  • lead in tin-lead solder is one of the three major heavy metal pollutants. If it accidentally enters the human body, it will cause great harm. Other solder alternatives that do not contain this element but perform less well.
  • the superconducting magnet which is the key to its power core, is known as one of the most critical technologies, just like internal combustion engines are to automobiles and engines are to airplanes. Due to factors such as actual operation scenarios and economics, superconducting magnets often operate in continuous current mode, that is, power is cut off after initial excitation, and continuous operation is achieved by relying on the unimpeded characteristics of the superconductor itself.
  • the daily attenuation rate is its key indicator, that is, the daily magnetic field Therefore, in actual production, in addition to low resistance, the joint resistance should also ensure clean and smooth surfaces and edges, good strip coincidence, good overall bending, and good axial tensile stress.
  • Superconducting joints are one of the key technologies in the design of superconducting magnets. They undertake important tasks such as connecting electrical circuits, cooling circuits and insulating layers, and are widely used in various large superconducting magnets and related supporting devices. When the current flows through the superconducting joint, the superconducting joint forces the current to redistribute. Therefore, the superconducting joint is required to have the characteristics of low resistance, low AC loss, good strength, simple structure, and good manufacturability. During the development and assembly of superconducting joints, the superconducting strips will be damaged to a certain extent, which will affect their critical current, DC loss and AC loss, and even lead to irreversible performance degradation of the superconducting conductor. Therefore, the joint is the weak link in the development process of its superconducting magnet. The performance of the joint of the superconducting magnet will directly affect the success or failure of the development of the whole magnet.
  • the resistance of the existing technology is too high, the existence of solder leads to a decrease in the mechanical properties of the raw material, it is difficult to remove the residual solder on the surface, there is a risk of damaging the strip during cleaning, the volume and thickness of the raw material increase, and the current near the joint will appear when the coil is wound. Distorted distribution.
  • the disadvantages of soldered joints using solder are: (1) the electrical resistance is too high; (2) the presence of solder leads to a reduction in the mechanical properties of some parts of the raw material; (3) due to the uncertainty of the flow of molten solder when pressurized , the residual solder on the surface after solidification is difficult to remove, and there is a risk of damaging the strip during cleaning; (4) The volume and thickness of the raw material increase, and when the coil is wound, the magnetic field distribution near the joint will be deformed after the current is passed; (5) Heterogeneous Metal alloy layer bonding performance is slightly worse.
  • the purpose of the present invention is to provide a solderless joint and its welding manufacturing method;
  • the technical problem to be solved by the present invention is: to reduce the resistance of the joint as much as possible (can be reduced to the minimum); the manufacturing process is simple Reliable and low cost; the mechanical properties of the joint are improved (including the improvement of mechanical strength, bending radius and other mechanical properties); the joint is easy to bend during use, and it is not easy to cause plastic deformation, fracture and other failures and damage the original properties of the base metal; guarantee In order to ensure that there is no solder between the surface of the raw material and the raw material, the volume and thickness of the joint should be reduced as much as possible (to a minimum).
  • the present invention provides the following technical solutions:
  • the present invention relates to a soldering manufacturing method of a solderless joint, said method comprising the following steps:
  • the present invention also relates to a joint crimping method, especially a solderless joint manufacturing method for second-generation high-temperature superconducting coated conductors.
  • the method specifically includes the following steps:
  • Step 1 Cut 2 sections of superconducting tape of appropriate length
  • Step 2 Uniformly coat viscous substances such as flux on the strip surface (superconducting surface) close to the superconducting layer;
  • Step 3 Bond the superconducting surfaces of the two strips
  • Step 4 Put the strip into the hot pressing equipment
  • Step 5 Set the required pressure, temperature.
  • step 3 the superconducting surfaces are bonded and aligned.
  • the hot pressing equipment may be a welding equipment; the compact may be independent of the welding equipment.
  • the flux is selected to remove the oxide layer on the surface of the material, so that the Cu2p energy spectrum on the surface of the material contains less than or equal to two flux peaks.
  • the Cu2p energy spectrum on the surface of the material contains less than or equal to two peaks, which means that almost all copper elements exist in the form of copper.
  • the material may be various superconducting materials and/or various surfaces are conductors such as metals and/or alloys and/or graphite materials, and/or semiconductor materials.
  • the application of flux in step S1 may be on the surface of one section of the material; or on the surfaces of both sections of materials.
  • cleaning agent can be used for several sections of material to wipe surface oil and dust.
  • the shape of the material can be various shapes such as strips, blocks, cylinders, etc.
  • the maximum pressure applied between the briquettes of the hot-pressing equipment, taking the superconducting copper-plated strip as an example, is generally below 800 MPa.
  • the maximum heating temperature, taking the superconducting copper-plated strip as an example, is generally below 300 degrees Celsius.
  • the bonding may be in various overlapping ways such as complete surface overlapping, partial surface overlapping, and angular overlapping.
  • the required pressure is above 10 MPa, preferably 84 MPa-420 MPa.
  • the required temperature is above 37°C, preferably 190°C to 260°C.
  • the method is a soldering manufacturing method of a solderless joint not exceeding 260°C.
  • the material is a superconducting strip, the surface of which is a conductor of metal and/or alloy and/or graphite material, or a semiconductor material.
  • the superconducting tape is a second-generation superconducting tape; its surface is a copper layer.
  • the surface of the material is a copper layer.
  • the material is a superconducting tape.
  • the method also includes:
  • the best field of application of the present invention is the welding of superconducting strips, that is, the solderless joint of superconducting strips is only a preferred embodiment of the present invention, but does not exclude other metals and/or graphite materials (strips, Various shapes such as bulk material, cylinder, etc.) and/or semiconductor materials are used as welding base materials.
  • the solderless joint of superconducting strips is characterized in that it comprises A superconducting strips, B superconducting strips, a flux layer, a superconducting surface of said A superconducting strips and a superconducting surface of said B superconducting strips. The surfaces are placed face to face, and the flux layer is arranged between the superconducting surface of the A superconducting strip and the superconducting surface of the B superconducting strip.
  • the A superconducting tape includes A copper layer, A silver layer, A base layer, A buffer layer, A superconducting layer, A silver layer, A copper layer, A superconducting surface
  • the B superconducting tape includes B copper layer, B silver layer, B base layer, B buffer layer, B superconducting layer, B silver layer, B copper layer, B superconducting surface, the A superconducting surface and the B The superconducting surfaces are respectively on two sides of the flux layer.
  • the invention also relates to a solderless joint obtained by the aforementioned method.
  • the present invention has the following beneficial effects:
  • the present invention minimizes the joint resistance, minimizes the process, and greatly shortens the time-consuming; the operation is more convenient; the mechanical strength is improved, and the mechanical properties such as bending radius are improved; it ensures that there is no solder between the surface of the raw material and the raw material, and the volume and The thickness is reduced to the minimum; no solder is used, and the environment is protected on the basis of saving materials.
  • the resistance can be reduced to the greatest extent. After testing, it can achieve 6n ⁇ cm level 2 (the resistance value of the joint is multiplied by the actual superconducting surface of A and superconducting surface B. area) below the joint resistance; the critical current refers to the current value obtained under the 1 ⁇ V/cm criterion, that is, the voltage at both ends of the joint exceeds the distance between the voltage leads in the four-lead method test of the welded superconducting joint multiplied by 1 ⁇ V/cm The value of current passed in cm.
  • the mechanical test performance of the critical turning radius and critical axial tensile stress of the joint is good, the critical turning radius can be less than 4cm, and the critical axial tensile stress can reach 400MPa and/or more than 200N.
  • the test results are shown in Figure 8, Figure 9 shows.
  • the so-called critical turning radius refers to the critical current retention rate when the superconducting joint is bent around this radius (the critical current retention rate refers to the critical current under the current test conditions divided by the critical current without any additional test conditions) at 95%.
  • the so-called critical axial tensile stress means that the critical current retention rate is above 95% when a tensile force of this magnitude is applied to both ends of the joint.
  • Fig. 1 is the schematic side view of two superconducting strips before welding in Example 1 of the present invention after the superconducting surfaces are joined;
  • Fig. 2 is a schematic diagram of the multilayer structure of the superconducting strip in Embodiment 1 of the present invention
  • Fig. 3 is the schematic diagram before welding of a section of base metal of embodiment 1 of the present invention.
  • Fig. 4 is a schematic side view of the joint before welding in Embodiment 1 of the present invention.
  • Figure 5 is the change curve of joint critical current and joint resistance at different temperatures from 190°C to 260°C when the set pressure is 168MPa and the pressure holding time is 3 minutes;
  • Figure 6 is the change curve of joint resistance under different pressures from 84MPa to 420MPa when the set temperature is 200°C and the pressure holding time is 3 minutes;
  • Figure 7 is the change curve of joint critical current and joint resistance when the set pressure is 168MPa and the temperature is 200°C, when the time is from 3 minutes to 30 minutes under different pressure holding times;
  • Fig. 8 shows the tensile stress test results of the original base metal, solderless joints and soldered joints, wherein the fabrication process of the solderless joints and soldered joints is the same.
  • the critical tensile stress of the three is about 180N, showing the excellent tensile properties of the solderless joint;
  • Figure 9 shows the experimental results of the turning diameter of the original base metal, joints without solder, and joints with solder, where the fabrication process of the joints without solder and joints with solder is the same.
  • the critical turning diameter of all three reaches 40 mm, demonstrating the excellent bending performance of the solderless joint;
  • FIG. 10 is an image of a section of a solderless joint under a scanning electron microscope. It can be clearly seen that the strip A and the strip B have been bonded in several places, although they are discontinuous. It indicates that the stable diffusion of the copper layer has occurred at this time;
  • Fig. 11 is an electron backscattered image of a cross-sectional scanning electron microscope of a solderless joint. It can be clearly seen that the copper crystals of the copper layer of the strip A and the strip B have diffused and bonded, and the original contact surface has disappeared;
  • Figure 12 is the energy spectrum of Cu2p in X-ray photoelectron spectroscopy (XPS) without any treatment on the surface of the strip.
  • the figure contains two peaks with high amplitude (between 930eV ⁇ 940eV and 950eV ⁇ 960eV respectively) and 2 accompanying peaks with lower amplitude (respectively between 940eV ⁇ 950eV and 960eV ⁇ 970eV);
  • FIG 13 is the energy spectrum of CuLM2 in XPS without any treatment on the surface of the strip. This figure and Figure 12 together illustrate that the surface of the strip without any treatment contains not only copper, but also copper oxide, cuprous oxide, etc. compound;
  • Figure 14 is the energy spectrum of Cu2p in XPS after smearing ET810L flux on the surface of the strip, in which there are only 2 peaks (between 930eV ⁇ 940eV and 950eV ⁇ 960eV respectively);
  • FIG 15 is the energy spectrum of CuLM2 in XPS after smearing ET810L flux on the surface of the strip. This figure and Figure 14 together illustrate that the surface of the strip is almost pure copper;
  • Figure 16 is the strip surface coating
  • the energy spectrum of Cu2p in XPS after fluxing contains 2 peaks with high amplitude (between 930eV ⁇ 940eV and 950eV ⁇ 960eV respectively) and 2 accompanying peaks with low amplitude (between 940eV ⁇ between 950eV and 960eV ⁇ 970eV);
  • FIG 17 is the strip surface coating The energy spectrum of CuLM2 in XPS after fluxing, this figure and Figure 16 together illustrate that there are copper compounds on the surface of the strip in addition to copper simple substances;
  • the embodiment of the present invention adopts superconducting tape, flux (preferably ET 810L) and other materials to prepare, but the present invention wants to protect more than this, but wants to protect a kind of hot pressing method without solder, heat
  • the crimping process and parameters of the crimping device do not use solder as the material of the connecting joint, except for the superconducting material in the embodiment, it is expanded to other metal welding fields.
  • a solderless joint crimping method specifically includes the following steps: first, cut two sections of superconducting strips of appropriate length, wipe the oil and dust on the surface with alcohol/propanol and other cleaning agents, and then in 2 The superconducting surfaces of the root superconducting strips 1 and 2 are evenly coated with flux (to form a flux layer), and the superconducting surfaces of the two sections of strips are bonded together, preferably bonded and aligned, and placed in the crimping equipment Finally, set the crimping parameters with the temperature not less than 37 degrees Celsius and the pressure not less than 10MPa, and it can be taken out after crimping.
  • the superconducting tape joint is a link of forced current redistribution, that is, the current passes through the silver layer, copper layer, (solder layer, the present invention omits this layer), copper layer, silver layer from the superconducting layer of superconducting tape 1.
  • the resistance can be reduced to the greatest extent, and the joint resistance of 6n ⁇ cm2 can be achieved after testing; at the same time, the surface of the joint strip Clean and tidy, without the original solder residue, to ensure that when the joint is wound into a coil, the strip and the strip are tightly fitted, reducing leakage current and no local stress; joint turning radius, axial tension Stress and other mechanical tests have good performance, the turning radius can reach less than 3cm, and the axial tensile stress can reach more than 300MPa.
  • the present invention provides a solderless superconducting joint, as shown in Figures 3 and 4, before the solderless superconducting joint is welded, it is divided into upper and lower sections of strips, which are respectively superconducting strip A 10, superconducting strip Strip B 11;
  • the superconducting tape A 10 includes a first copper layer 1, a first silver layer 2, a base layer 3, a buffer layer 4, a superconducting layer 5, a second silver layer 6, and a second copper layer 7, wherein the first , the second copper layer 1 and 7 are both 20 microns, the first and second silver layers 2 and 6 are both ⁇ 1.5 microns, the base layer 3 is ⁇ 50 microns, the buffer layer 4 is 0.2 ⁇ 0.3 microns, and the high temperature superconducting layer 5 is ⁇ 1 micron, evenly coat flux ET810L on the surface of the second copper layer 7, that is, the superconducting surface 8, to form a flux layer 9;
  • Described superconducting tape B 11 comprises the first copper layer 1, the first silver layer 2, base layer 3, buffer layer 4, superconducting layer 5, the second silver layer 6, the second copper layer 7, each layer thickness and
  • the flux ET810L is evenly coated on the surface of the second copper layer 7 , that is, the superconducting surface 8 to form a flux layer 9 .
  • the welding manufacturing method of the solderless superconducting joint includes the following steps:
  • the pressure range is 84MPa-420MPa, and at the same time heat up to the required temperature, the temperature range is 190°C-260°C, choose whether to maintain the pressure and/or the maintenance time, the maintenance time is preferably 3 minutes; the influence of temperature, pressure, and pressure holding time on the critical current and resistance of joints are shown in Figures 5 to 7 respectively; from Figures 5-7, it can be seen that the temperature range at which superconducting strips can be bonded is 190°C to 260°C , The pressure range is 84MPa ⁇ 420MPa, and the holding time is 3min ⁇ 20min.
  • Fig. 10 is an image of a cross-section of a solderless joint under a scanning electron microscope, and it can be clearly seen that the superconducting strip A and the superconducting strip B have been combined in several places, although they are discontinuous; At this point a stable diffusion of the copper layer has occurred.
  • Fig. 11 is an electron backscattered image of a cross-sectional scanning electron microscope of a solderless joint. It can be clearly seen that the copper crystals of the superconducting tape A and the copper layer of the superconducting tape B have diffused and bonded, and the original contact The face has disappeared.
  • Figure 12 is the energy spectrum of Cu2p in XPS without any treatment on the surface of the strip
  • Figure 13 is the energy spectrum of CuLM2 in XPS without any treatment on the surface of the strip.
  • Figure 12 together illustrate the strip without any treatment
  • copper compounds such as copper oxide and cuprous oxide on the surface of the material
  • Figure 14 is the energy spectrum of Cu2p in XPS after smearing ET810L flux on the surface of the strip
  • Figure 15 is the energy spectrum of CuLM2 in XPS after smearing ET810L flux on the surface of the strip. The surface is almost pure copper.
  • This comparative example provides a solderless superconducting joint, which differs from Example 1 in that the flux is selected
  • Figure 16 is the strip surface coating The energy spectrum of Cu2p in XPS after flux;
  • Figure 17 is the strip surface coating The energy spectrum of CuLM2 in XPS after fluxing. This figure and Figure 16 together illustrate that there are more copper compounds on the surface of the strip in addition to copper.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)

Abstract

本发明公开了一种无焊料焊接接头及其焊接制造方法；所述方法包括以下步骤：S1、在待焊接的若干段材料表面均匀涂抹助焊剂形成助焊剂层；S2、按材料表面、助焊剂层、材料表面进行贴合；S3、放入热压设备中，设置所需的压力、温度进行焊接。本发明在焊接前的预处理过程中没有添加任何焊料；制备得到的无焊料焊接接头具有良好的导电性能和力学性能。

Description

一种无焊料焊接接头及其焊接制造方法 技术领域
本发明涉及焊接领域/(超导)线材制备技术领域，具体涉及一种无焊料焊接接头及其焊接制造方法。
背景技术
焊接是一种以加热、加压或者两者同时存在的方式，将金属或其他材料接合起来的工艺技术。对于通常使用的焊料将母材连接的方法，由于融化后的焊料再凝固会变成固体，有时会降低母材的力学性能，导致在某些应用场景有焊料的焊接方法失效。同时在部分应用情景中，往往不希望有焊料中的部分金属元素存在，如锡铅焊料中的铅属于三大重金属污染物之一，如果不慎进入人体内危害巨大，退而求其次选择了其他不含该元素但性能稍差的焊料替代。
以超导领域需要焊接的超导带材为例：
随着超导磁悬浮技术的发展，陆地最快速度已经达到603km/h，作为其动力核心关键的超导磁体被称为其中最为关键的技术之一，如同内燃机之于汽车、发动机之于飞机。由于实际运行场景和经济性等因素，超导磁体往往运行在持续电流模式，即初始励磁后断电，依靠超导体本身的无阻特性实现其持续运行，其中日衰减率为其关键指标，即每天磁场的衰减程度，因此在实际制作中，接头电阻除了需要满足低电阻，还应保证表面和边缘整洁光滑、带材重合度好、全段弯曲度好、轴向拉伸应力好等特性。
同时，目前的核磁共振设备也大多采用低温超导磁体作为励磁元件，但由于低温环境由液氦提供，液氦为稀缺资源且十分昂贵，且带有复杂制冷结构的低温超导磁体体积很大。如果可以采用第二代高温超导带材将会极大的降低磁体重量，节省占地面积。但由于第二代高温超导材料无法制作长距离超导带，同时超导接头工艺极其复杂且不成熟，第二代高温超导带材的超导接头公开于论文1(Park Y,Lee M,Ann H,et al.A superconducting joint for GdBa2Cu3O7δ-coated conductors[J].Npg Asia Materials,2014,6(5):e98.)。常规扩散接头或搭接接头电阻太大，无法应用在核磁共振磁体上。受限于此，第二代高温超导带材的低阻接头成为其应用于商用核磁共振仪器的困难的关键一环，也是业界科研人员努力的方向之一。
超导接头是超导磁体设计中的关键技术之一，它承担着连接电回路、冷却回路和绝缘 层等重要任务，被广泛地应用在各种大型超导磁体和相关配套装置中。当电流流过超导接头，超导接头强制电流重新分布，因此要求超导接头具有电阻小、交流损耗小、强度好、结构简单、工艺性好等特点。在超导接头研制和组装的过程中，该处的超导带材会受到一定程度的损伤，影响其临界电流、直流损耗和交流损耗等性能，甚至导致超导导体出现不可逆的性能退化。因而，接头是其超导磁体研制过程中的薄弱环节。超导磁体的接头性能将直接影响到整个磁体的研制成败。
现有的焊料接头由于焊料融化后再凝固而局部堆积造成材料的部分位置弯曲度下降，使得焊接母材原有的力学性能降低，在绕制线圈时极易造成损坏。另外，由于该种接头是通过异种金属结合，随着使用时间的增加会导致合金中不可避免的产生裂纹、缝隙等影响接头性能的缺陷，因此如何设计制造出可以同时满足力学和电学性能的接头成为本领域的重大需求之一。
但是，现有技术电阻偏大，焊料的存在导致原材料的机械性能降低，表面残留焊锡难以清除，清理时会有损坏带材的风险，原材料体积和厚度增加，绕制线圈是会出现接头附近电流分布畸形。具体来说，使用焊料的焊接接头的缺点是：(1)电阻偏大；(2)焊料的存在导致原材料的部分位置力学性能降低；(3)由于熔融态焊料加压时流动的不确定性，凝固后表面残留焊锡难以清除，清理时存在可能损坏带材的风险；(4)原材料体积和厚度增加，绕制线圈时会出现通入电流后接头附近磁场分布畸形的情况；(5)异种金属合金层结合性能稍差。
因此，本领域的技术人员致力于开发一种无焊料接头及其焊接制造方法。
发明内容
有鉴于现有技术的上述缺陷，本发明的目的在于提供一种无焊料接头及其焊接制造方法；本发明所要解决的技术问题是：使接头电阻尽量降低(可降到最低)；制造工艺简单可靠、成本低；接头力学性能提升(包括机械强度提升，弯曲半径等机械性能提升)；接头使用时全段易弯曲，不易发生塑性变形、断裂等失效和损伤母材原有各项性能；保证了原材料表面和原材料之间没有焊锡，接头体积和厚度尽量降低(可降到最低)。
为实现上述目的，本发明提供了如下技术方案：
本发明涉及一种无焊料接头的焊接制造方法，所述方法包括以下步骤：
S1、在待焊接的若干段材料表面均匀涂抹助焊剂形成助焊剂层；
S2、将材料涂抹助焊剂的表面面对面贴合，即按材料表面、助焊剂层、材料表面进行贴合；
S3、设置所需的压力、温度进行热压焊接。
作为一个实施方案，本发明还涉及一种接头的压接方法，特别是一种对二代高温超导涂层导体的无焊料接头制造方法。该方法具体包括以下步骤：
步骤1.剪下2段适当长度的超导带材；
步骤2.在靠近超导层的带材表面(超导面)均一涂上助焊剂等粘性物质；
步骤3.将两段带材的超导面贴合；
步骤4.将带材放入热压设备中；
步骤5.设置所需的压力、温度。
作为一个实施方案，步骤3中超导面贴合并对齐。
作为一个实施方案，所述热压设备的压块间加压至所需压力，加温至所需温度，且加压和加温无先后顺序，也可同时加温加压。所述热压设备可以为焊接设备；压块可以独立于焊接设备。
作为一个实施方案，焊接过程中可选择是否维持压力和/或维持时间。可以是加压后立即分离上下压块；也可以是保压3-20分钟。
作为一个实施方案，所述助焊剂选用去除材料表面氧化层，使得材料表面Cu2p能谱图含有小于等于两个波峰的助焊剂。材料表面Cu2p能谱图含有小于等于两个波峰即表明铜元素几乎全部以铜单质形式存在。
作为一个实施方案，步骤S1中，所述材料，可以为各种超导材料和/或各种表面为金属和/或合金和/或石墨材料等导体，和/或半导体材料。
作为一个实施方案，选用两段材料焊接时，步骤S1中涂抹助焊剂可选为在其中一段材料的表面；或者两段材料的表面都涂抹。
作为一个实施方案，步骤S1中，若干段材料可选用清洁剂擦拭表面油污和灰尘。材料的形状可以为带材、块材、圆柱形等各种形状。
作为一个实施方案，热压设备的压块间加压的最大压力，以超导镀铜带材为例一般为800MPa以下。
作为一个实施方案，加温的最高温度，以超导镀铜带材为例，一般为300摄氏度以下。
作为一个实施方案，步骤S2中，所述贴合可以为表面完全重合、表面部分重合、有角度重合等各种重合方式。
作为一个实施方案，所需压力为10MPa以上，优选为84MPa～420MPa。
作为一个实施方案，所需温度为37℃以上，优选为190℃～260℃。
作为一个实施方案，所述方法为不超过260℃的无焊料接头的焊接制造方法。
作为一个实施方案，所述材料为超导带材，表面为金属和/或合金和/或石墨材料的导体， 或半导体材料。
作为一个实施方案，所述超导带材为第二代超导带材；其表面为铜层。
作为一个实施方案，所述材料的表面为铜层。所述材料为超导带材。
作为一个实施方案，所述方法还包括：
S4、将上下压块缓慢分离，冷却；
S5、取出所述的无焊料接头。
本发明的最佳适用领域为超导带材的焊接，即超导带材的无焊料接头仅为本发明的一个最佳实施例，但并不排除其他金属和/或石墨材料(带材、块材、圆柱形等各种形状)和/或半导体材料用作焊接母材。超导带材的无焊料接头特征在于，包括A超导带材，B超导带材，助焊剂层，所述A超导带材的超导面和所述B超导带材的超导面采用面对面放置方式，所述A超导带材的超导面和所述B超导带材的超导面中间设置有所述助焊剂层。
在一些实施例中，所述A超导带材包括A铜层、A银层、A基底层、A缓冲层、A超导层、A银层、A铜层，A超导面，所述B超导带材包括B铜层、B银层、B基底层、B缓冲层、B超导层、B银层、B铜层，B超导面，所述A超导面和所述B超导面分别在所述助焊剂层的两边。
本发明还涉及一种前述的方法获得的无焊料接头。
与现有技术相比，本发明具有以下的有益效果：
(1)本发明使接头电阻降到最低，工艺降到最低，耗费时间大大缩短；操作更加简便；机械强度提升，弯曲半径等机械性能提升；保证了原材料表面和原材料之间没有焊锡，体积和厚度降到最低；不使用焊料，在节省了材料的基础上保护了环境。
(2)在保证超导带材临界电流不衰减的前提下可以实现最大限度的降低电阻，经测试可实现6nΩ·cm 2级(接头电阻值乘以A超导面和B超导面实际重合的面积)以下的接头电阻；所述临界电流是指在1μV/cm判据下得到的电流值，即焊接超导接头四引线法测试中接头两端电压超过电压引线间的距离乘以1μV/cm时所通的电流值。
(3)同时，接头带材表面干净整洁，没有原来的焊料残留，保证了在将焊接接头绕制成超导线圈时，带材与带材之间紧密贴合，接头的全段位置弯曲度良好。
(4)接头临界转弯半径、临界轴向拉伸应力等力学测试性能良好，临界转弯半径可达4cm以下、临界轴向拉伸应力可达400MPa和/或200N以上，测试结果如附图8、图9所示。所谓临界转弯半径是指超导接头在该半径下弯曲环绕时临界电流保有率(临界电流保有率是指当前测试条件下的临界电流除以不加任何额外测试条件下的临界电流)在95％以上，所谓临 界轴向拉伸应力是指在该大小的拉伸力施加于接头两端时临界电流保有率在95％以上。
(5)经过扫描电子显微镜和电子背散射的微观观察，可以清晰地看到带材A和带材B扩散结合，晶粒相互融合，微观图像如附图10、11所示。
附图说明
通过阅读参照以下附图对非限制性实施例所作的详细描述，本发明的其它特征、目的和优点将会变得更明显：
图1为本发明的实施例1中焊接前2根超导带材超导面对接后的侧视示意图；
图2为本发明的实施例1中超导带材的多层结构示意图；
图3是本发明的实施例1的一段母材焊接前的示意图；
图4是本发明的实施例1焊接前的接头侧视示意图；
图5是当设定压力为168MPa,保压时间为3分钟时，当温度从190℃到260℃不同温度下，接头临界电流与接头电阻的变化曲线；
图6是当设定温度为200℃,保压时间为3分钟时，当压力从84MPa到420MPa不同压力下，接头电阻的变化曲线；
图7是当设定压力为168MPa,温度为200℃时，当时间从3分钟到30分钟不同保压时间下，接头临界电流与接头电阻的变化曲线；
图8是关于原始母材、无焊料接头、有焊料接头的拉伸应力实验结果，其中无焊料接头和有焊料接头的制作工艺相同。三者的临界拉伸应力均在180N左右，展示出了无焊料接头优异的拉伸性能；
图9是关于原始母材、无焊料接头、有焊料接头的转弯直径实验结果，其中无焊料接头和有焊料接头的制作工艺相同。三者的临界转弯直径均达到40毫米，展示出了无焊料接头优异的弯曲性能；
图10是无焊料接头的截面在扫描电子显微镜下的图像，可以清晰的看到，所述带材A和所述带材B已经在若干处结合，尽管是不连续的。说明此时已经发生铜层的稳定扩散；
图11是无焊料接头的截面扫描电子显微镜下电子背散射的图像，可以清晰的看到，所述带材A和所述带材B铜层的铜晶体已经扩散结合，原始接触面已经消失；
图12是带材表面没有任何处理的X射线光电子能谱技术(XPS)中Cu2p的能谱图,图中含有2个幅值高的波峰(分别在930eV～940eV和950eV～960eV之间)和2个幅值较低的伴随波峰(分别在940eV～950eV和960eV～970eV之间)；
图13是带材表面没有任何处理的XPS中CuLM2的能谱图，本图与图12共同说明了未经任何处理的带材表面除铜单质外，还有氧化铜、氧化亚铜等铜的化合物；
图14是带材表面涂抹ET810L助焊剂后的XPS中Cu2p的能谱图，图中仅含有2个波峰(分别在930eV～940eV和950eV～960eV之间)；
图15是带材表面涂抹ET810L助焊剂后的XPS中CuLM2的能谱图，本图与图14共同说明了带材表面几乎为铜单质；
图16是带材表面涂抹
Figure PCTCN2022082403-appb-000001
助焊剂后的XPS中Cu2p的能谱图，图中含有2个幅值高的波峰(分别在930eV～940eV和950eV～960eV之间)和2个幅值较低的伴随波峰(分别在940eV～950eV和960eV～970eV之间)；
图17是带材表面涂抹
Figure PCTCN2022082403-appb-000002
助焊剂后的XPS中CuLM2的能谱图，本图与图16共同说明了带材表面除铜单质外，还有铜的化合物；
附图中，1、第一铜层，2、第一银层，3、基底层，4、缓冲层，5、超导层，6、第二银层，7、第二铜层，8、超导面，9、助焊剂层，10、超导带材A，11、超导带材B。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的组件以相似数字标号表示。附图所示的每一组件的尺寸和厚度是任意示出的，本发明并没有限定每个组件的尺寸和厚度。为了使图示更清晰，附图中有些地方适当夸大了部件的厚度。
具体实施方式
下面结合实施例对本发明进行详细说明。以下实施例将有助于本领域的技术人员进一步理解本发明，但不以任何形式限制本发明。应当指出的是，对本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干调整和改进。这些都属于本发明的保护范围。
本发明所述的实施例是采用超导带材，助焊剂(优选ET 810L)等材料进行制备，但是本发明想保护的不止于此，而是想保护一种无焊料的热压方法，热压装置压接流程和参数，不使用焊料作为连接接头的材料，除了实施例中的超导材料、拓展到其他金属焊接领域。
一种无焊料接头压接方法，如图1、2，具体包括以下步骤：首先剪取2段适当长度的超导带材，用酒精/丙醇等清洁剂擦拭表面油污和灰尘，之后在2根超导带材1、2的超导面均匀涂上助焊剂(形成助焊剂层)，将两段带材的超导面贴合到一起，优选的为贴合并对齐，放置到压接设备后，设定温度不小于37摄氏度、压力不小于10MPa的压接参数，压接后即可取出。超导带材接头是强制电流重新分配的一个环节，即使得电流从超导带材1的超导层经银层、铜层、(焊料层，本发明省去这层)、铜层、银层流到超导带材2的超导层，将接头中电阻最大的焊料层去掉后，可以实现最大限度的降低电阻，经测试可实现6nΩ·cm2级的接头电阻；同时，接头带材表面干净整洁，没有 原来的焊料残留，保证了在将接头绕制成线圈时，带材与带材之间紧密贴合，减小了漏电流且没有局部应力产生；接头转弯半径、轴向拉伸应力等力学测试性能良好，转弯半径可达3cm以下、轴向拉伸应力可达300MPa以上。
更具体的，详见以下各实施例：
实施例1
本发明提供一种无焊料超导接头，如图3、4所示，所述无焊料超导接头焊接前，分为上、下两段带材，分别为超导带材A 10、超导带材B 11；
所述超导带材A 10包括第一铜层1，第一银层2，基底层3，缓冲层4，超导层5，第二银层6，第二铜层7，其中，第一、二铜层1、7均为20微米、第一、二银层2、6均为 ～1.5微米、基底层3为 ～50微米、缓冲层4为0.2～0.3微米、高温超导层5为～1微米，在所述第二铜层7表面，即超导面8上均匀涂上助焊剂ET810L，形成助焊剂层9；
所述超导带材B 11包括第一铜层1，第以银层2，基底层3，缓冲层4，超导层5，第二银层6，第二铜层7，各层厚度与所述超导带材A中的一致，在所述第二铜层7表面，即超导面8上均匀涂上助焊剂ET810L，形成助焊剂层9。
所述无焊料超导接头的焊接制造方法，包括以下步骤：
S1、取两段所需长度的所述超导带材A和所述超导带材B，可选用清洁剂擦拭表面油污和灰尘；
S2、在所述超导带材A的超导面上均匀涂上助焊剂，形成助焊剂层；在所述超导带材B的超导面上均匀涂上助焊剂，形成助焊剂层；将所述超导带材A和所述超导带材B的超导面面对面，优选的为贴合并对齐；
S3、将所述超导带材A、所述助焊剂层、所述超导带材B一起放置到焊接设备上的压块之间；
S4、所述压块之间开始加压，压力范围为84MPa～420MPa，同时加温至所需温度，温度范围为190℃～260℃，选择是否维持压力和/或维持时间，维持时间优选为3分钟；温度、压力、保压时间对接头临界电流和电阻的影响分别如图5～7所示；由图5-7可知，超导带材可以实现结合的温度范围为190℃～260℃，压力范围为84MPa～420MPa，保压时间为3min～20min。
S5、将上下压块缓慢分离，冷却；
S6、取出所述的无焊料接头。
通过X射线光电子能谱(XPS)检测后，XPS能谱图仅含有2个波峰，超导带材表面，没有Cu-O键，即带材表面铜元素几乎均以铜单质形式存在。表明该助焊剂去除铜表 面氧化层的能力优异。图8是关于原始母材、无焊料接头、Sn-Pb焊料接头的拉伸应力实验结果，其中无焊料接头和有焊料接头的制作工艺相同；三者的临界拉伸应力均在180N左右，展示出了无焊料接头优异的拉伸性能。图9是关于原始母材、无焊料接头、有焊料接头的转弯直径实验结果，其中无焊料接头和有焊料接头的制作工艺相同；三者的临界转弯直径均达到40毫米，展示出了无焊料接头优异的弯曲性能。图10是无焊料接头的截面在扫描电子显微镜下的图像，可以清晰的看到，所述超导带材A和所述超导带材B已经在若干处结合，尽管是不连续的；说明此时已经发生铜层的稳定扩散。图11是无焊料接头的截面扫描电子显微镜下电子背散射的图像，可以清晰的看到，所述超导带材A和所述超导带材B铜层的铜晶体已经扩散结合，原始接触面已经消失。图12是带材表面没有任何处理的XPS中Cu2p的能谱图；图13是带材表面没有任何处理的XPS中CuLM2的能谱图，本图与图12共同说明了未经任何处理的带材表面除铜单质外，还有氧化铜、氧化亚铜等铜的化合物。图14是带材表面涂抹ET810L助焊剂后的XPS中Cu2p的能谱图；图15是带材表面涂抹ET810L助焊剂后的XPS中CuLM2的能谱图，本图与图14共同说明了带材表面几乎为铜单质。
对比例1
本对比例提供一种无焊料超导接头，与实施例1的不同在于：助焊剂选用
Figure PCTCN2022082403-appb-000003
当仅将实施例中的ET810L助焊剂改为
Figure PCTCN2022082403-appb-000004
助焊剂，其他所有材料和方法保持与实施例1相同方法时，不能形成接头，即实施例1中S6步骤取出来的仍是2段带材。
图16是带材表面涂抹
Figure PCTCN2022082403-appb-000005
助焊剂后的XPS中Cu2p的能谱图；图17是带材表面涂抹
Figure PCTCN2022082403-appb-000006
助焊剂后的XPS中CuLM2的能谱图，本图与图16共同说明了带材表面除铜单质外，还有较多铜的化合物。
以上详细描述了本发明的较佳具体实施例。应当理解，本领域的普通技术无需创造性劳动就可以根据本发明的构思作出诸多修改和变化。因此，凡本技术领域中技术人员依本发明的构思在现有技术的基础上通过简单改变材料、逻辑分析、推理或者有限的实验可以得到的技术方案，皆应在由权利要求书所确定的保护范围内。

Claims (10)

  1. 一种无焊料接头的焊接制造方法，其特征在于，所述方法包括以下步骤：
    S1、在待焊接的若干段材料表面涂抹助焊剂形成助焊剂层；
    S2、将材料涂抹助焊剂的表面面对面贴合；
    S3、设置所需压力、温度进行热压焊接。
  2. 一种无焊料接头的焊接制造方法，其特征在于，所述方法包括以下步骤：
    步骤1.剪下两段适当长度的超导带材；
    步骤2.在靠近超导层的带材表面(超导面)均一涂上助焊剂；
    步骤3.将两段带材的超导面贴合；
    步骤4.将带材放入热压设备中；
    步骤5.设置所需压力、温度。
  3. 根据权利要求2所述的方法，其特征在于，步骤3中超导面贴合并对齐。
  4. 根据权利要求1或2所述的方法，其特征在于，热压设备的压块间加压至所需压力，加温至所需温度；且加压和加温无先后顺序，可同时加温加压。
  5. 根据权利要求1或2所述的方法，其特征在于，所需压力为10MPa以上；所需温度为37℃以上。
  6. 根据权利要求5所述的方法，其特征在于，所需压力为84MPa～420MPa；所需温度为190℃～260℃。
  7. 根据权利要求1或2所述的方法，其特征在于，所述助焊剂选用去除材料表面氧化层，使得材料表面Cu2p能谱图含有小于等于两个波峰的助焊剂。
  8. 根据权利要求1所述的方法，其特征在于，所述材料为超导带材，表面为金属和/或合金和/或石墨材料的导体，或半导体材料。
  9. 根据权利要求8所述的方法，其特征在于，所述超导带材为第二代超导带材，其表面为铜层。
  10. 一种根据权利要求1-9中任一项所述的方法获得的无焊料接头。
PCT/CN2022/082403 2021-09-24 2022-03-23 一种无焊料焊接接头及其焊接制造方法 Ceased WO2023045288A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US18/694,422 US12528132B2 (en) 2021-09-24 2022-03-23 Solder-free joint and welding method thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202111121534.6 2021-09-24
CN202111121534 2021-09-24
CN202210257863.1A CN114619131B (zh) 2021-09-24 2022-03-14 一种无焊料焊接接头及其焊接制造方法
CN202210257863.1 2022-03-14

Publications (1)

Publication Number Publication Date
WO2023045288A1 true WO2023045288A1 (zh) 2023-03-30

Family

ID=81902853

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/082403 Ceased WO2023045288A1 (zh) 2021-09-24 2022-03-23 一种无焊料焊接接头及其焊接制造方法

Country Status (3)

Country Link
US (1) US12528132B2 (zh)
CN (1) CN114619131B (zh)
WO (1) WO2023045288A1 (zh)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87101570A (zh) * 1987-06-08 1988-12-28 中国科学院金属研究所 氧化物超导体之间的连接方法
JPH07135034A (ja) * 1993-11-08 1995-05-23 Toshiba Corp 超電導線の接続方法
JP5695772B1 (ja) * 2014-03-17 2015-04-08 株式会社フジクラ 超電導線材接続体の製造方法、超電導線材接続体及び超電導線材の接続装置
CN104671818A (zh) * 2014-12-19 2015-06-03 上海大学 扩散焊银层连接ybco高温超导薄膜带材工艺
CN105636719A (zh) * 2013-08-16 2016-06-01 K.约恩 ReBCO高温超导线材接合装置及利用其的接合方法
CN205464859U (zh) * 2016-03-01 2016-08-17 西南交通大学 一种具有极低电阻的高温超导涂层带材接头焊接装置
US20170005256A1 (en) * 2013-11-27 2017-01-05 Siemens Plc Method For Forming A Superconducting Connection Structure And Superconducting Connection Structure
CN107845713A (zh) * 2016-09-19 2018-03-27 戴莉霞 固晶稳固方法
CN110867713A (zh) * 2019-12-13 2020-03-06 东部超导科技（苏州）有限公司 一种超导带材的焊接方法

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3964667A (en) * 1966-01-19 1976-06-22 The United States Of America As Represented By The United States Energy Research And Development Administration Diffusion bonding
US3707762A (en) * 1970-10-29 1973-01-02 North American Rockwell Methods of using fluxes in joining metal surfaces
FR2512069A1 (fr) * 1981-08-26 1983-03-04 Inst Ochistke T Procede de preparation de pieces d'insertion renforcatrices et pieces d'insertion ainsi obtenues
CN85109182B (zh) * 1985-12-20 1988-03-02 中国科学院物理研究所 超导带(线)材的扩散焊接方法及其装置
JP2655332B2 (ja) * 1988-08-08 1997-09-17 スカイアルミニウム株式会社 セラミックス接合用アルミニウム合金
JP2832509B2 (ja) * 1994-01-20 1998-12-09 関東冶金工業株式会社 金属合金材料の接合方法
JP3771012B2 (ja) * 1997-09-02 2006-04-26 株式会社フジクラ 酸化物超電導導体
JP3692135B2 (ja) * 2002-09-26 2005-09-07 株式会社ファインプロセス 異種金属のレーザロール接合方法およびレーザロール接合装置
JP4810268B2 (ja) * 2006-03-28 2011-11-09 株式会社東芝 超電導線材の接続方法及び超電導線材
JP2008066399A (ja) * 2006-09-05 2008-03-21 Sumitomo Electric Ind Ltd 超電導線材の接続構造、超電導コイルおよび超電導線材の接続方法
JP4936858B2 (ja) * 2006-11-08 2012-05-23 株式会社東芝 超電導電流リードおよびその製造方法
JP2009016253A (ja) * 2007-07-06 2009-01-22 Sumitomo Electric Ind Ltd 超電導線材の接続構造、超電導機器および超電導線材の接続方法
KR100964354B1 (ko) * 2008-08-04 2010-06-18 케이조인스(주) 초전도체층의 직접 용융확산에 의한 2세대 초전도 선재의접합방법
KR100964361B1 (ko) * 2008-08-04 2010-06-17 케이조인스(주) 산소분압 조절을 통한 2세대 초전도 선재의 용융확산접합방법
TWI462676B (zh) * 2009-02-13 2014-11-21 千住金屬工業股份有限公司 The solder bumps for the circuit substrate are formed using the transfer sheet
JP5422494B2 (ja) * 2010-06-18 2014-02-19 株式会社フジクラ 超電導線材の金属端子接合構造体、および超電導線材と金属端子の接合方法
JP2013107122A (ja) * 2011-11-24 2013-06-06 Tetsuo Harada 電縫鋼管製造方法とその製造装置及び電縫鋼管
GB201203030D0 (en) * 2012-02-22 2012-04-04 Tubefuse Applic B V Forge welding of tubular articles
JP2014130730A (ja) * 2012-12-28 2014-07-10 Fujikura Ltd 酸化物超電導線材の接続構造体及び接続方法並びに接続構造体を用いた酸化物超電導線材
CN103170699A (zh) * 2013-03-07 2013-06-26 中国科学院等离子体物理研究所 一种用于高温超导带材的焊接装置及方法
KR101427204B1 (ko) * 2013-03-29 2014-08-08 케이조인스(주) 고온 초전도체층의 직접 접촉에 의한 고상 원자확산 압접 및 산소 공급 어닐링 열처리에 의한 초전도 회복을 이용한 2세대 ReBCO 고온 초전도체의 영구전류모드 접합 방법
CN103433648B (zh) * 2013-09-09 2015-05-13 哈尔滨工业大学 一种用于钛合金超塑成形/扩散连接的易涂覆TiO2固体止焊剂及其制备方法
KR101466799B1 (ko) * 2013-12-18 2014-11-28 안동대학교 산학협력단 2세대 고온초전도 선재의 초음파용접 접합방법
CN104710186B (zh) * 2014-12-19 2016-12-07 上海大学 Ybco高温超导薄膜带材的连接工艺及其专用辅助夹具
DE102015010676A1 (de) * 2015-08-12 2017-02-16 Karlsruher Institut für Technologie Verfahren und Vorrichtung zur Herstellung eines supraleitfähigen Leiters
JP6605942B2 (ja) * 2015-12-21 2019-11-13 古河電気工業株式会社 超電導線材の接続構造及び超電導線材の接続方法
CN105618967A (zh) * 2016-03-01 2016-06-01 西南交通大学 一种具有极低电阻的高温超导涂层带材接头焊接装置
CN106340381B (zh) * 2016-09-09 2019-03-22 西南交通大学 一种高温超导磁悬浮列车用超导磁体的制作方法
CN107096994A (zh) * 2017-04-25 2017-08-29 南京云启金锐新材料有限公司 一种高纯氧化锆复合陶瓷与紫铜的扩散焊接件及其生产方法
CN107275471B (zh) * 2017-06-05 2019-11-19 上海超导科技股份有限公司 一种超导带材封装装置
GB2565839A (en) * 2017-08-25 2019-02-27 Tokamak Energy Ltd Superconducting joint using exfoliated ReBCO
JP6569959B2 (ja) * 2017-08-30 2019-09-04 国立研究開発法人理化学研究所 高温超伝導線材の接続体
CN107962320A (zh) * 2017-12-03 2018-04-27 温州宏丰电工合金股份有限公司 一种应用于扩散焊的铝铜合金表面活性焊剂的制备方法
CN108555428B (zh) * 2018-05-29 2019-12-31 北京交通大学 一种金属基纳米复合焊料的制备方法及应用
CN108526640A (zh) * 2018-06-22 2018-09-14 江西联创光电科技股份有限公司 一种高温超导带材接头焊接装置
CN208570204U (zh) * 2018-08-27 2019-03-01 广东电网有限责任公司 一种超导带材封装结构
CN109065256B (zh) * 2018-08-27 2025-01-28 广东电网有限责任公司 一种超导带材封装结构及其制备方法
JP6993647B2 (ja) * 2018-10-09 2022-01-13 ＳｕｐｅｒＯｘ Ｊａｐａｎ合同会社 超電導線材、及び超電導線材の接合方法
JP7086874B2 (ja) * 2019-01-24 2022-06-20 株式会社東芝 超電導線の接続方法
JP2023508619A (ja) * 2019-02-18 2023-03-03 スーパーパワー インコーポレイテッド 超電導線材の製造方法
KR102705834B1 (ko) * 2019-09-27 2024-09-10 한국전기연구원 고온초전도 선재의 제조방법 및 이를 이용한 다중 초전도층을 갖는 고온초전도 선재
KR102804164B1 (ko) * 2019-11-28 2025-05-07 한국전기연구원 확산접합을 이용한 고온초전도코일의 제조방법
CN111009746A (zh) * 2019-12-16 2020-04-14 东部超导科技（苏州）有限公司 一种超导薄膜材料的焊接方法
CN113594348B (zh) * 2020-04-30 2024-10-29 中国科学院电工研究所 复合超导线及其制备方法与连接方法、一种连接超导线
CN111524653B (zh) * 2020-04-30 2021-12-07 中国科学院电工研究所 一种第二代高温超导带材的连接方法及超导线
CN113593767B (zh) * 2020-04-30 2022-11-04 中国科学院电工研究所 一种第二代高温超导线的连接方法及一种连接超导线
CN113217112B (zh) * 2021-06-21 2022-05-27 北京航空航天大学 一种钛合金空心叶片的制造方法及其钛合金空心叶片
CN113504265B (zh) * 2021-06-29 2022-12-13 上海交通大学 一种高温超导窄堆线中超导带材局部坏点的处理方法
US12503773B2 (en) * 2023-02-20 2025-12-23 Spirit Aerosystems, Inc. Method to produce void-free ferrous and non-ferrous aerospace structural castings

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87101570A (zh) * 1987-06-08 1988-12-28 中国科学院金属研究所 氧化物超导体之间的连接方法
JPH07135034A (ja) * 1993-11-08 1995-05-23 Toshiba Corp 超電導線の接続方法
CN105636719A (zh) * 2013-08-16 2016-06-01 K.约恩 ReBCO高温超导线材接合装置及利用其的接合方法
US20170005256A1 (en) * 2013-11-27 2017-01-05 Siemens Plc Method For Forming A Superconducting Connection Structure And Superconducting Connection Structure
JP5695772B1 (ja) * 2014-03-17 2015-04-08 株式会社フジクラ 超電導線材接続体の製造方法、超電導線材接続体及び超電導線材の接続装置
CN104671818A (zh) * 2014-12-19 2015-06-03 上海大学 扩散焊银层连接ybco高温超导薄膜带材工艺
CN205464859U (zh) * 2016-03-01 2016-08-17 西南交通大学 一种具有极低电阻的高温超导涂层带材接头焊接装置
CN107845713A (zh) * 2016-09-19 2018-03-27 戴莉霞 固晶稳固方法
CN110867713A (zh) * 2019-12-13 2020-03-06 东部超导科技（苏州）有限公司 一种超导带材的焊接方法

Also Published As

Publication number Publication date
US20240391009A1 (en) 2024-11-28
US12528132B2 (en) 2026-01-20
CN114619131B (zh) 2023-03-31
CN114619131A (zh) 2022-06-14

Similar Documents

Publication Publication Date Title
JP4744248B2 (ja) Ｒｅ系酸化物超電導線材の接合方法
CN107799917A (zh) 一种rebco高温超导带材的低阻连接装置及其制造方法
CN105826789A (zh) ReBa2Cu3O7-δ高温超导薄膜带材的连接工艺及其施压加热系统
JP5097044B2 (ja) 金属コーティング層を用いた超伝導薄膜線材およびその接合方法
CN111106453B (zh) 一种第二代高温超导带材的连接方法及超导线
CN101075496B (zh) 一种高温超导磁体双饼线圈间的接头及其焊接方法
KR101466799B1 (ko) 2세대 고온초전도 선재의 초음파용접 접합방법
JP5005582B2 (ja) 超電導電流リードの製造方法
Masson et al. Die attach using silver sintering. Practical implementation and analysis
WO2017154228A1 (ja) 超電導線及びその製造方法
CN104710186A (zh) Ybco高温超导薄膜带材的连接工艺及其专用辅助夹具
CN104036914B (zh) 高温超导双饼线圈的高温超导带材接头制备方法
JP2005012915A (ja) 超電導ケーブルの接続構造および超電導ケーブル接続用絶縁スペーサー
CN113593767A (zh) 一种第二代高温超导线的连接方法及一种连接超导线
Shin et al. Joint characteristics of ultrasonic welded CC bridge joints for HTS coil applications
GB2498961A (en) Methods of joining superconducting wires
Ito et al. Comparison of heat assisted lap joints of high-temperature superconducting tapes with inserted indium foils
JPH02187042A (ja) 半導体装置の製造方法
WO2023045288A1 (zh) 一种无焊料焊接接头及其焊接制造方法
JPH1167523A (ja) 酸化物超電導線材の接続方法、酸化物超電導コイル装置およびそれを用いた超電導装置
CN105390830A (zh) 实现稀土钡铜氧高温超导导线之间超导连接的方法及结构
CN111524653A (zh) 一种第二代高温超导带材的连接方法及超导线
Chikumoto et al. Development of direct joint process using Cu stabilizing layers of REBCO tapes
CN109560439A (zh) 一种高温超导带接头的制备方法
CN220019848U (zh) 超导带材临界电流测试装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22871353

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 18694422

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22871353

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 22871353

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205N DATED 17/05/2024)

122 Ep: pct application non-entry in european phase

Ref document number: 22871353

Country of ref document: EP

Kind code of ref document: A1

WWG Wipo information: grant in national office

Ref document number: 18694422

Country of ref document: US