WO2023038035A1 - Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique - Google Patents

Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique Download PDF

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Publication number
WO2023038035A1
WO2023038035A1 PCT/JP2022/033480 JP2022033480W WO2023038035A1 WO 2023038035 A1 WO2023038035 A1 WO 2023038035A1 JP 2022033480 W JP2022033480 W JP 2022033480W WO 2023038035 A1 WO2023038035 A1 WO 2023038035A1
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Prior art keywords
resin composition
compound
compounds
curing agent
phenol
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PCT/JP2022/033480
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English (en)
Japanese (ja)
Inventor
雄太 助川
実佳 田中
勇磨 竹内
有紗 山内
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株式会社レゾナック
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Priority to KR1020247007904A priority Critical patent/KR20240052770A/ko
Publication of WO2023038035A1 publication Critical patent/WO2023038035A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Definitions

  • the present disclosure relates to a sealing resin composition, an electronic component device, and a method for manufacturing an electronic component device.
  • the amount of loss (dielectric loss) related to insulators such as circuit sealing materials is determined by the frequency of radio waves, the square root of the dielectric constant of the insulator, and the dielectric constant of the insulator. It increases in proportion to the product of the dielectric loss tangent. Therefore, as the frequency of radio waves increases, the reduction of dielectric constant or dielectric loss tangent of insulators is becoming more important from the viewpoint of suppressing transmission loss of electrical signals.
  • JP-A-2012-246367 and JP-A-2014-114352 disclose a resin composition containing an active ester resin as a curing agent for epoxy resins, and are obtained by curing this resin composition.
  • the dielectric loss tangent is said to be kept low in insulators with
  • thermosetting resin compositions described in JP-A-2012-246367 and JP-A-2014-114352 have a low dielectric loss tangent, but there is room for improvement in bending strength.
  • the present disclosure has been made in view of the above circumstances, a sealing resin composition that provides a cured product having a low dielectric loss tangent and excellent bending strength, an electronic component device sealed using the same, and An object of the present invention is to provide a method for manufacturing an electronic component device sealed using this.
  • An encapsulating resin composition comprising an epoxy resin and a curing agent, wherein the curing agent contains an active ester compound and a phenol compound having a hydroxyl equivalent of 150 g/eq or more.
  • the encapsulating resin composition according to ⁇ 1> wherein the proportion of the phenol compound having a hydroxyl equivalent of 150 g/eq or more in the entire curing agent is 20% by mass or more and 60% by mass or less.
  • ⁇ 4> The encapsulating resin composition according to any one of ⁇ 1> to ⁇ 3>, wherein the phenol compound having a hydroxyl equivalent of 150 g/eq or more contains a naphthalene structure.
  • ⁇ 5> The encapsulating resin composition according to any one of ⁇ 1> to ⁇ 4>, further comprising an inorganic filler, wherein the inorganic filler has an average particle size of 10 ⁇ m or less.
  • ⁇ 6> A support member, an element placed on the support member, and a cured product of the sealing resin composition according to any one of ⁇ 1> to ⁇ 5> sealing the element and an electronic component device.
  • An electronic component device comprising a step of placing an element on a support member and a step of sealing the element with the sealing resin composition according to any one of ⁇ 1> to ⁇ 5>. manufacturing method.
  • a sealing resin composition that provides a cured product having a low dielectric loss tangent and excellent bending strength, an electronic component device sealed using the same, and an electronic device sealed using the same A method of manufacturing a component device is provided.
  • the term "process” includes a process that is independent of other processes, and even if the purpose of the process is achieved even if it cannot be clearly distinguished from other processes.
  • the numerical range indicated using "-" includes the numerical values before and after "-" as the minimum and maximum values, respectively.
  • the upper limit or lower limit of one numerical range may be replaced with the upper or lower limit of another numerical range described step by step.
  • the upper or lower limits of the numerical ranges may be replaced with the values shown in the examples.
  • each component may contain multiple types of applicable substances.
  • the content rate or content of each component is the total content rate or content of the multiple types of substances present in the composition unless otherwise specified.
  • Particles corresponding to each component in the present disclosure may include a plurality of types.
  • the particle size of each component means a value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.
  • active ester compound refers to a compound having one or more ester groups (active ester groups) capable of reacting with epoxy groups in one molecule and having a curing action for epoxy resins.
  • phenol compound refers to a compound that has one or more hydroxyl groups in one molecule that can react with epoxy groups and has a curing action for epoxy resins.
  • the encapsulating resin composition of the present disclosure contains an epoxy resin and a curing agent, wherein the curing agent contains an active ester compound and a phenol compound having a hydroxyl equivalent of 150 g/eq or more. It is a thing.
  • the cured product obtained by curing the encapsulating resin composition having the above configuration exhibits excellent bending strength while maintaining a low dielectric loss tangent.
  • the encapsulating resin composition of the present disclosure contains an active ester compound as a curing agent.
  • Phenolic compounds that are generally used as curing agents for epoxy resins generate secondary hydroxyl groups upon reaction with epoxy resins.
  • the reaction between the epoxy resin and the active ester compound produces an ester group having a lower polarity than the secondary hydroxyl group.
  • the encapsulating resin composition of the present disclosure can suppress the dielectric loss tangent of the cured product to a lower level than the encapsulating resin composition containing only a curing agent that produces secondary hydroxyl groups by reaction with an epoxy resin. is considered possible.
  • the encapsulating resin composition of the present disclosure contains a phenol compound having a hydroxyl equivalent of 150 g/eq or more as a curing agent.
  • the ratio of the active ester compound to the total curing agent is not particularly limited, and can be selected depending on the desired properties of the encapsulating resin composition.
  • the proportion of the active ester compound in the total curing agent is preferably 40% by mass or more, more preferably 45% by mass or more. , more preferably 50% by mass or more.
  • the proportion of the active ester compound in the total curing agent is preferably 85% by mass or less, more preferably 80% by mass or less. It is preferably 75% by mass or less, and more preferably 75% by mass or less.
  • the ratio of the phenolic compound having a hydroxyl equivalent of 150 g/eq or more in the total curing agent is not particularly limited, and can be selected depending on the desired properties of the encapsulating resin composition. From the viewpoint of reducing the dielectric loss tangent of the cured product of the encapsulating resin composition, the proportion of the phenol compound having a hydroxyl equivalent of 150 g/eq or more in the entire curing agent is preferably 60% by mass or less, and 55% by mass. % or less, more preferably 50 mass % or less.
  • the proportion of the phenol compound having a hydroxyl equivalent of 150 g/eq or more in the entire curing agent is preferably 20% by mass or more. It is more preferably 30% by mass or more, more preferably 30% by mass or more.
  • the equivalent ratio between the epoxy resin and the curing agent that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the epoxy resin (number of functional groups in the curing agent/number of functional groups in the epoxy resin) is not particularly limited. From the viewpoint of suppressing the unreacted amount of each, it is preferably set in the range of 0.5 to 2.0, and more preferably set in the range of 0.6 to 1.3. From the viewpoint of moldability and reflow resistance, it is more preferable to set the ratio in the range of 0.8 to 1.2.
  • epoxy resin The type of epoxy resin contained in the encapsulating resin composition of the present disclosure is not particularly limited.
  • the epoxy resin is at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A and bisphenol F, and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene.
  • a novolac type epoxy resin (phenol novolak type epoxy resins, ortho-cresol novolac-type epoxy resins, etc.); triphenylmethane-type phenolic resins obtained by condensation or co-condensation of the above phenolic compounds and aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde in the presence of acidic catalysts as epoxy resins.
  • a triphenylmethane-type epoxy resin obtained by epoxidizing a triphenylmethane-type epoxy resin
  • a copolymer-type epoxy resin obtained by epoxidizing a novolak resin obtained by co-condensing the above phenol compound and naphthol compound with an aldehyde compound in the presence of an acidic catalyst
  • bisphenol A diphenylmethane-type epoxy resins that are diglycidyl ethers such as bisphenol F
  • biphenyl-type epoxy resins that are diglycidyl ethers of alkyl-substituted or unsubstituted biphenols
  • stilbene-type epoxy resins that are diglycidyl ethers of stilbene-based phenol compounds
  • sulfur atom-containing epoxy resins that are diglycidyl ethers such as S
  • epoxy resins that are glycidyl ethers of alcohols such as butanediol, polyethylene glycol and polypropylene
  • the epoxy equivalent (molecular weight/number of epoxy groups) of the epoxy resin is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance and electrical reliability, it is preferably 100 g/eq to 1000 g/eq, more preferably 150 g/eq to 500 g/eq.
  • the epoxy equivalent of the epoxy resin shall be the value measured by the method according to JIS K 7236:2009.
  • the softening point or melting point of the epoxy resin is not particularly limited. From the viewpoint of moldability and reflow resistance, the temperature is preferably 40° C. to 180° C., and from the viewpoint of handleability in preparation of the encapsulating resin composition, it is more preferably 50° C. to 130° C.
  • the melting point or softening point of the epoxy resin is the value measured by the single-cylinder rotational viscometer method described in JIS K 7234:1986 and JIS K 7233:1986.
  • the content of the epoxy resin in the resin composition for sealing is preferably 0.5% by mass to 50% by mass, and more preferably 2% by mass to 30% by mass, from the viewpoint of strength, fluidity, heat resistance, moldability, etc. % is more preferred.
  • the encapsulating resin composition contains an active ester compound as a curing agent.
  • an active ester compound as a curing agent for the encapsulating resin composition, the dielectric loss tangent of the cured product can be kept low.
  • the type of the active ester compound is not particularly limited as long as it has one or more ester groups in the molecule that react with epoxy groups.
  • active ester compounds include phenol ester compounds, thiophenol ester compounds, N-hydroxyamine ester compounds, and esters of heterocyclic hydroxy compounds.
  • active ester compounds include ester compounds obtained from at least one of aliphatic carboxylic acids and aromatic carboxylic acids and at least one of aliphatic hydroxy compounds and aromatic hydroxy compounds.
  • Ester compounds containing an aliphatic compound as a polycondensation component tend to have excellent compatibility with epoxy resins due to having an aliphatic chain.
  • Ester compounds containing an aromatic compound as a polycondensation component tend to have excellent heat resistance due to having an aromatic ring.
  • a specific example of the active ester compound is an aromatic ester obtained by a condensation reaction between an aromatic carboxylic acid and a phenolic hydroxyl group of an aromatic hydroxy compound.
  • an aromatic carboxylic acid component in which 2 to 4 hydrogen atoms of an aromatic ring such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, and diphenylsulfonic acid are substituted with a carboxy group, and the hydrogen atom of the aromatic ring described above.
  • a mixture of a monohydric phenol in which one of is substituted with a hydroxyl group and a polyhydric phenol in which 2 to 4 of the hydrogen atoms on the aromatic ring are substituted with a hydroxyl group is used as a raw material to obtain an aromatic carboxylic acid and an aromatic hydroxy compound.
  • An aromatic ester obtained by a condensation reaction with a phenolic hydroxyl group is preferred. That is, aromatic esters having structural units derived from the aromatic carboxylic acid component, structural units derived from the monohydric phenol, and structural units derived from the polyhydric phenol are preferred.
  • the active ester compound examples include a phenol resin having a molecular structure in which a phenol compound is knotted via an aliphatic cyclic hydrocarbon group, described in JP-A-2012-246367, and an aromatic dicarboxylic acid or Examples thereof include active ester resins having a structure obtained by reacting the halide with an aromatic monohydroxy compound.
  • the active ester resin a compound represented by the following structural formula (1) is preferable.
  • R 1 is an alkyl group having 1 to 4 carbon atoms, a phenyl group, or a hydrogen atom
  • X is a benzene ring, a naphthalene ring, a benzene ring substituted with an alkyl group having 1 to 4 carbon atoms, or a naphthalene ring or a biphenyl group
  • Y is a benzene ring, a naphthalene ring, or a benzene or naphthalene ring substituted with an alkyl group having 1 to 4 carbon atoms
  • k is 0 or 1
  • n is the number of repetitions represents the average value of
  • t-Bu in the structural formula is a tert-butyl group.
  • active ester compound is a compound represented by the following structural formula (2) and a compound represented by the following structural formula (3), which are described in JP-A-2014-114352. mentioned.
  • R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms
  • Z is a benzoyl group, a naphthoyl group, or a carbon an ester-forming structural moiety (z1) selected from the group consisting of a benzoyl group or naphthoyl group substituted with an alkyl group of number 1 to 4, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); at least one of which is an ester-forming structural site (z1).
  • R 1 and R 2 are each independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms
  • Z is a benzoyl group, a naphthoyl group, or a carbon an ester-forming structural moiety (z1) selected from the group consisting of a benzoyl group or naphthoyl group substituted with an alkyl group of number 1 to 4, and an acyl group having 2 to 6 carbon atoms, or a hydrogen atom (z2); at least one of which is an ester-forming structural site (z1).
  • Specific examples of the compound represented by structural formula (2) include the following exemplary compounds (2-1) to (2-6).
  • Specific examples of the compound represented by structural formula (3) include the following exemplary compounds (3-1) to (3-6).
  • a commercially available product may be used as the active ester compound.
  • Active ester compounds include "EXB9451”, “EXB9460”, “EXB9460S”, and “HPC-8000-65T” (manufactured by DIC Corporation) as active ester compounds containing a dicyclopentadiene type diphenol structure; “EXB9416-70BK”, “EXB-8”, “EXB-9425” (manufactured by DIC Corporation) as active ester compounds containing structures; "DC808” (Mitsubishi Chemical Corporation (manufactured by Mitsubishi Chemical Corporation); active ester compounds containing benzoylated phenol novolak include “YLH1026" (manufactured by Mitsubishi Chemical Corporation).
  • the active ester compound may be used singly or in combination of two or more.
  • the ester equivalent (molecular weight/number of active ester groups) of the active ester compound is not particularly limited. From the viewpoint of balance of various properties such as formability, reflow resistance, and electrical reliability, it is preferably 150 g/eq to 400 g/eq, more preferably 170 g/eq to 300 g/eq, and 200 g/eq to 250 g/eq. More preferred.
  • the ester equivalent of the active ester compound shall be the value measured by the method according to JIS K 0070:1992.
  • the encapsulating resin composition contains a phenol compound having a hydroxyl equivalent of 150 g/eq or more as a curing agent.
  • a phenol compound having a hydroxyl equivalent of 150 g/eq or more as a curing agent for the encapsulating resin composition, the bending strength of the cured product is improved.
  • phenol compounds having a hydroxyl equivalent of 150 g/eq or more include polyhydric phenol compounds such as resorcin, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenol; phenol, cresol, xylenol, resorcin, catechol, At least one phenolic compound selected from the group consisting of phenolic compounds such as bisphenol A, bisphenol F, phenylphenol and aminophenol, and naphthol compounds such as ⁇ -naphthol, ⁇ -naphthol and dihydroxynaphthalene, formaldehyde, acetaldehyde and propionaldehyde Novolac-type phenol compounds obtained by condensing or co-condensing an aldehyde compound such as a Aralkyl-type phenol compounds such as aralkyl compounds; para-xylylene-modified phenol compounds, meta-xylylene-modified phenol compounds;
  • the phenol compound having a hydroxyl equivalent of 150 g/eq or more is preferably a phenol compound containing a biphenyl structure or a naphthalene structure, and more preferably an aralkyl-type phenol compound containing a naphthalene structure or a biphenyl structure.
  • a biphenyl structure or a naphthalene structure and a benzene ring alternately linked via a methylene group are more preferred phenol compounds.
  • the hydroxyl equivalent of the phenol compound having a hydroxyl equivalent of 150 g/eq or more is preferably 160 g/eq or more, more preferably 170 g/eq or more, further preferably 180 g/eq or more, and 190 g/eq or more. eq or more is particularly preferred.
  • the upper limit of the hydroxyl equivalent weight of the phenol compound having a hydroxyl equivalent weight of 150 g/eq or more is not particularly limited. From the viewpoint of the balance of properties such as moldability, reflow resistance, and electrical reliability, the hydroxyl equivalent of the phenolic compound having a hydroxyl equivalent of 150 g/eq or more is preferably 1000 g/eq or less, and 500 g/eq or less. is more preferably 300 g/eq or less.
  • the hydroxyl equivalent of a phenol compound is a value measured by a method according to JIS K 0070:1992.
  • the softening point or melting point of the phenol compound having a hydroxyl equivalent of 150 g/eq or more is not particularly limited.
  • the temperature is preferably 40° C. to 180° C., and from the viewpoint of handleability during production of the encapsulating resin composition, it is more preferably 50° C. to 160° C. .
  • the melting point or softening point of a phenolic compound having a hydroxyl equivalent of 150 g/eq or more is the value measured by the single-cylinder rotational viscometer method described in JIS K 7234:1986 and JIS K 7233:1986.
  • the encapsulating resin composition may contain an active ester compound as a curing agent and a curing agent (other curing agent) other than the phenol compound having a hydroxyl equivalent of 150 g/eq or more.
  • the type of other curing agent is not particularly limited, and can be selected according to the desired properties of the encapsulating resin composition.
  • Other curing agents include phenol curing agents having a hydroxyl equivalent of less than 150 g/eq, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents, and the like. be done.
  • Other curing agents may be used alone or in combination of two or more.
  • the ratio of the other curing agent to the total curing agent is preferably 1% by mass to 10% by mass, and 3% by mass to 8% by mass. % is more preferable.
  • the encapsulating resin composition may contain a curing accelerator.
  • the type of curing accelerator is not particularly limited, and can be selected according to the type of epoxy resin or curing agent, the desired properties of the encapsulating resin composition, and the like.
  • Curing accelerators include diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), Cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylhydroxyimidazole, 2-heptadecylimidazole; Derivatives of cyclic amidine compounds; phenol novolak salts of the cyclic amidine compounds or derivatives thereof; , 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, quinone compounds such as phenyl-1,4-benzoquinone, diazophenyl Compounds having intramolecular
  • a compound having intramolecular polarization obtained through a step of dehydrohalogenation after reacting a halogenated phenol compound Tetra-substituted phosphonium such as tetraphenylphosphonium; tetrasubstituted phosphonium compounds such as tetraphenylborate salts of substituted phosphonium and salts of tetrasubstituted phosphonium and phenolic compounds; phosphobetaine compounds; adducts of phosphonium compounds and silane compounds;
  • the amount thereof is preferably 0.1 to 30 parts by mass with respect to 100 parts by mass of the resin component (total amount of epoxy resin and curing agent). , more preferably 1 to 15 parts by mass.
  • the amount of the curing accelerator is 0.1 parts by mass or more with respect to 100 parts by mass of the resin component, there is a tendency for satisfactory curing in a short period of time.
  • the amount of the curing accelerator is 30 parts by mass or less with respect to 100 parts by mass of the resin component, the curing speed is not too fast and a good molded article tends to be obtained.
  • the encapsulating resin composition of the present disclosure may contain an inorganic filler.
  • the type of inorganic filler is not particularly limited. Specific examples include inorganic materials such as fused silica, crystalline silica, glass, alumina, aluminum nitride, boron nitride, talc, clay, and mica.
  • Inorganic fillers having a flame retardant effect may also be used. Inorganic fillers having a flame retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as composite hydroxides of magnesium and zinc, and zinc borate.
  • silica such as fused silica is preferable from the viewpoint of reducing the coefficient of linear expansion
  • alumina is preferable from the viewpoint of high thermal conductivity.
  • An inorganic filler may be used individually by 1 type, or may be used in combination of 2 or more types. Examples of the form of the inorganic filler include powders, beads obtained by spheroidizing powders, and fibers.
  • the inorganic filler When the inorganic filler is particulate, its average particle size is not particularly limited.
  • the average particle size of the inorganic filler is preferably 100 ⁇ m, more preferably 50 ⁇ m or less, and even more preferably 10 ⁇ m or less.
  • the average particle size of the inorganic filler is preferably 0.2 ⁇ m or more, more preferably 0.5 ⁇ m or more, and even more preferably 1 ⁇ m or more.
  • the average particle size of the inorganic filler is 0.2 ⁇ m or more, the increase in viscosity of the encapsulating resin composition is further suppressed.
  • the average particle size of the inorganic filler When the average particle size of the inorganic filler is 100 ⁇ m or less, the filling properties are further improved.
  • the average particle diameter of the inorganic filler is determined as the volume average particle diameter (D50) by a laser scattering diffraction method particle size distribution analyzer.
  • the content of the inorganic filler contained in the encapsulating resin composition is not particularly limited. From the viewpoint of fluidity and strength, it is preferably 30% to 90% by volume, more preferably 35% to 85% by volume, and 40% to 80% by volume of the entire sealing resin composition. % is more preferred.
  • the content of the inorganic filler is 30% by volume or more of the entire encapsulating resin composition, the properties of the cured product, such as coefficient of thermal expansion, thermal conductivity and elastic modulus, tend to be further improved.
  • the content of the inorganic filler is 90% by volume or less of the entire encapsulating resin composition, an increase in viscosity of the encapsulating resin composition is suppressed, fluidity is further improved, and moldability is further improved. tend to become
  • the encapsulating resin composition may contain various additives such as coupling agents, ion exchangers, release agents, flame retardants, colorants, and silicone compounds exemplified below.
  • the encapsulating resin composition may contain various additives known in the art as necessary, in addition to the additives exemplified below.
  • the encapsulating resin composition may contain a coupling agent.
  • the sealing resin composition preferably contains a coupling agent.
  • Coupling agents include known coupling agents such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, vinylsilane, silane compounds such as disilazane, titanium compounds, aluminum chelate compounds, and aluminum/zirconium compounds. mentioned.
  • the amount of the coupling agent is preferably 0.05 parts by mass to 15 parts by mass with respect to 100 parts by mass of the inorganic filler, and 0.1 part by mass. More preferably, it is up to 10 parts by mass.
  • the encapsulating resin composition may contain an ion exchanger.
  • the encapsulating resin composition preferably contains an ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of the electronic component device including the element to be sealed.
  • the ion exchanger is not particularly limited, and conventionally known ones can be used. Specific examples include hydrotalcite compounds and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium and bismuth.
  • the ion exchangers may be used singly or in combination of two or more. Among them, hydrotalcite represented by the following general formula (A) is preferable.
  • the encapsulating resin composition contains an ion exchanger
  • its content is not particularly limited as long as it is sufficient to capture ions such as halogen ions.
  • it is preferably 0.1 to 30 parts by mass, more preferably 1 to 10 parts by mass, per 100 parts by mass of the resin component (total amount of epoxy resin and curing agent).
  • the encapsulating resin composition may contain a mold release agent from the viewpoint of obtaining good releasability from the mold during molding.
  • the release agent is not particularly limited, and conventionally known agents can be used. Specific examples include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene.
  • the release agent may be used alone or in combination of two or more.
  • the amount thereof is preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the resin component (the total amount of the epoxy resin and the curing agent), and 0.1 More preferably 5 parts by mass to 5 parts by mass.
  • the encapsulating resin composition may contain a flame retardant.
  • the flame retardant is not particularly limited, and conventionally known ones can be used. Specific examples include organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms or phosphorus atoms, and metal hydroxides.
  • a flame retardant may be used individually by 1 type, or may be used in combination of 2 or more type.
  • the encapsulating resin composition contains a flame retardant
  • its amount is not particularly limited as long as it is sufficient to obtain the desired flame retardant effect.
  • it is preferably 1 to 30 parts by mass, more preferably 2 to 20 parts by mass, per 100 parts by mass of the resin component (total amount of epoxy resin and curing agent).
  • the encapsulating resin composition may contain a coloring agent.
  • coloring agents include known coloring agents such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide.
  • the content of the coloring agent can be appropriately selected according to the purpose and the like.
  • a coloring agent may be used individually by 1 type, or may be used in combination of 2 or more type.
  • a method for preparing the encapsulating resin composition is not particularly limited.
  • a general method there can be mentioned a method of thoroughly mixing components in predetermined amounts with a mixer or the like, melt-kneading the mixture with a mixing roll, an extruder or the like, cooling, and pulverizing. More specifically, for example, predetermined amounts of the components described above are uniformly stirred and mixed, kneaded with a kneader, roll, extruder, or the like preheated to 70° C. to 140° C., cooled, and pulverized. can be mentioned.
  • the encapsulating resin composition is preferably solid at room temperature and normal pressure (eg, 25°C, atmospheric pressure).
  • the shape is not particularly limited, and examples thereof include powder, granules, tablets, and the like.
  • the encapsulating resin composition is in the form of a tablet, it is preferable from the standpoint of handleability that the dimensions and mass are such that they meet the molding conditions of the package.
  • An electronic component device that is an embodiment of the present disclosure includes an element and a cured product of the sealing resin composition of the present disclosure that seals the element.
  • elements active elements such as semiconductor chips, transistors, diodes, thyristors, capacitors, resistors, etc.
  • passive elements such as coils, etc.
  • the element is fixed on a lead frame, and the terminal portion of the element such as a bonding pad and the lead portion are connected by wire bonding, bumps, or the like, and then transfer molding or the like is performed using a sealing resin composition.
  • TCP Tape Carrier Package having a structure in which an element connected to a tape carrier with bumps is sealed with a sealing resin composition
  • COB Chip On Board
  • COB Chip On Board
  • encapsulation BGAs Bit Grid Arrays
  • CSPs Chip Size Packages
  • MCPs Multi Chip Packages
  • a method of manufacturing an electronic component device of the present disclosure includes a step of placing an element on a support member and a step of encapsulating the element with the encapsulating resin composition of the present disclosure.
  • the method for implementing each of the above steps is not particularly limited, and can be performed by a general method. Further, the types of supporting members and elements used for manufacturing electronic component devices are not particularly limited, and supporting members and elements generally used for manufacturing electronic component devices can be used.
  • Examples of methods for encapsulating an element using the encapsulating resin composition of the present disclosure include a low-pressure transfer molding method, an injection molding method, a compression molding method, and the like. Among these, the low pressure transfer molding method is common.
  • Epoxy resin 1 Triphenylmethane type epoxy resin containing alkyl group
  • Epoxy resin 2 Triphenylmethane type epoxy resin containing no alkyl group
  • Epoxy resin 3 Biphenyl type epoxy resin
  • Epoxy resin 4 Novolac type epoxy resin
  • Curing agent 1 active ester compound
  • Curing agent 2 aralkyl-type phenol compound containing naphthalene structure, hydroxyl equivalent 215 g/eq
  • Curing agent 3 aralkyl-type phenol compound containing biphenyl structure, hydroxyl equivalent 199 g/eq
  • Curing agent 4 triphenylmethane type phenol compound, hydroxyl equivalent 104 g / eq - Curing agent 5: Novolak type phenol compound, hydroxyl equivalent 106 g/eq
  • ⁇ Curing accelerator 1 adduct of triphenylphosphine and 1,4-benzoquinone
  • Coupling agent 1 N-phenyl-3-aminopropyltrimethoxysilane
  • Inorganic filler 1 silica particles, volume average particle diameter 3 ⁇ m
  • Inorganic filler 2 silica particles, volume average particle size 0.5 ⁇ m
  • the dielectric constant (Dk) and dielectric loss tangent (Df) of this test piece were measured at frequencies of 5 GHz and 10 GHz using a cavity resonator (Kanto Denshi Applied Development Co., Ltd.) and a network analyzer (Keysight Technologies, product name "PNA E8364B ”) was used, and the temperature was measured in an environment of 25 ⁇ 3°C. Table 1 shows the results.
  • the type of cavity resonator used at each measurement frequency is as follows. 5GHz...CP511 10GHz...CP531
  • the encapsulating resin composition was charged into a transfer molding machine, molded under conditions of a mold temperature of 175° C., a molding pressure of 6.9 MPa, and a curing time of 90 seconds.
  • a rectangular parallelepiped test piece of 12.7 mm ⁇ 4 mm was prepared.
  • Tensilon (A & D Co.) as an evaluation device, a three-point support bending test in accordance with JIS-K-7171 (2016) was performed at room temperature (25 ° C.), and the bending elastic modulus E, bending strength S and The elongation at break ⁇ was determined by the following formula.
  • Flexural modulus E (GPa), flexural strength S (MPa), and elongation at break ⁇ (%) are defined by the following equations.
  • P is the load cell value (N)
  • y is the amount of displacement (mm)
  • the suffix max indicates the maximum value.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne une composition de résine d'étanchéité comprenant une résine époxyde et un agent de durcissement, l'agent de durcissement contenant un composé ester actif et un composé phénolique ayant un équivalent hydroxyle de 150 g/éq. ou plus.
PCT/JP2022/033480 2021-09-09 2022-09-06 Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique WO2023038035A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018093120A (ja) * 2016-12-06 2018-06-14 住友ベークライト株式会社 樹脂シート
JP2018172519A (ja) * 2017-03-31 2018-11-08 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2019038930A (ja) * 2017-08-24 2019-03-14 味の素株式会社 樹脂組成物
WO2019127391A1 (fr) * 2017-12-29 2019-07-04 广东生益科技股份有限公司 Composition de résine maléimide, préimprégné, stratifié et carte de circuit imprimé
JP2019182891A (ja) * 2018-04-02 2019-10-24 味の素株式会社 樹脂組成物
WO2020262654A1 (fr) * 2019-06-26 2020-12-30 昭和電工マテリアルズ株式会社 Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018093120A (ja) * 2016-12-06 2018-06-14 住友ベークライト株式会社 樹脂シート
JP2018172519A (ja) * 2017-03-31 2018-11-08 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2019038930A (ja) * 2017-08-24 2019-03-14 味の素株式会社 樹脂組成物
WO2019127391A1 (fr) * 2017-12-29 2019-07-04 广东生益科技股份有限公司 Composition de résine maléimide, préimprégné, stratifié et carte de circuit imprimé
JP2019182891A (ja) * 2018-04-02 2019-10-24 味の素株式会社 樹脂組成物
WO2020262654A1 (fr) * 2019-06-26 2020-12-30 昭和電工マテリアルズ株式会社 Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique

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