WO2020262654A1 - Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique - Google Patents

Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique Download PDF

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Publication number
WO2020262654A1
WO2020262654A1 PCT/JP2020/025356 JP2020025356W WO2020262654A1 WO 2020262654 A1 WO2020262654 A1 WO 2020262654A1 JP 2020025356 W JP2020025356 W JP 2020025356W WO 2020262654 A1 WO2020262654 A1 WO 2020262654A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
epoxy resin
sealing resin
active ester
ester compound
Prior art date
Application number
PCT/JP2020/025356
Other languages
English (en)
Japanese (ja)
Inventor
貴大 齋藤
格 山浦
圭一 春日
Original Assignee
昭和電工マテリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和電工マテリアルズ株式会社 filed Critical 昭和電工マテリアルズ株式会社
Priority to KR1020227000610A priority Critical patent/KR20220025804A/ko
Priority to JP2021527800A priority patent/JPWO2020262654A1/ja
Priority to CN202080046323.8A priority patent/CN114008105A/zh
Publication of WO2020262654A1 publication Critical patent/WO2020262654A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic

Abstract

Une composition de résine d'étanchéité selon la présente invention contient une résine époxy et un agent de durcissement comprenant un composé ester actif, le rapport équivalent du composé ester actif à la résine époxy (composé ester actif/résine époxy) étant inférieur ou égal à 0,9.
PCT/JP2020/025356 2019-06-26 2020-06-26 Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique WO2020262654A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020227000610A KR20220025804A (ko) 2019-06-26 2020-06-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
JP2021527800A JPWO2020262654A1 (fr) 2019-06-26 2020-06-26
CN202080046323.8A CN114008105A (zh) 2019-06-26 2020-06-26 密封用树脂组合物、电子零件装置及电子零件装置的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-118699 2019-06-26
JP2019118699 2019-06-26

Publications (1)

Publication Number Publication Date
WO2020262654A1 true WO2020262654A1 (fr) 2020-12-30

Family

ID=74060413

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/025356 WO2020262654A1 (fr) 2019-06-26 2020-06-26 Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique

Country Status (5)

Country Link
JP (1) JPWO2020262654A1 (fr)
KR (1) KR20220025804A (fr)
CN (1) CN114008105A (fr)
TW (1) TW202108655A (fr)
WO (1) WO2020262654A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023038035A1 (fr) * 2021-09-09 2023-03-16 株式会社レゾナック Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique
WO2023238951A1 (fr) * 2022-06-10 2023-12-14 株式会社レゾナック Composition de résine pour moulage et dispositif à composants électroniques

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11349666A (ja) * 1998-06-05 1999-12-21 Kanagawa University エポキシ樹脂組成物
JP2010111859A (ja) * 2008-10-07 2010-05-20 Ajinomoto Co Inc エポキシ樹脂組成物
JP2012246367A (ja) * 2011-05-26 2012-12-13 Dic Corp 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP2012246497A (ja) * 2012-09-04 2012-12-13 Sekisui Chem Co Ltd 樹脂フィルム、積層板、及びプリプレグ
JP2015106698A (ja) * 2013-12-02 2015-06-08 味の素株式会社 半導体装置の製造方法
JP2016079384A (ja) * 2014-10-17 2016-05-16 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
JP2018100421A (ja) * 2018-03-19 2018-06-28 味の素株式会社 樹脂組成物
JP2018172519A (ja) * 2017-03-31 2018-11-08 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2019006895A (ja) * 2017-06-23 2019-01-17 味の素株式会社 樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6070134B2 (ja) 2012-12-07 2017-02-01 Dic株式会社 活性エステル樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11349666A (ja) * 1998-06-05 1999-12-21 Kanagawa University エポキシ樹脂組成物
JP2010111859A (ja) * 2008-10-07 2010-05-20 Ajinomoto Co Inc エポキシ樹脂組成物
JP2012246367A (ja) * 2011-05-26 2012-12-13 Dic Corp 熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
JP2012246497A (ja) * 2012-09-04 2012-12-13 Sekisui Chem Co Ltd 樹脂フィルム、積層板、及びプリプレグ
JP2015106698A (ja) * 2013-12-02 2015-06-08 味の素株式会社 半導体装置の製造方法
JP2016079384A (ja) * 2014-10-17 2016-05-16 太陽インキ製造株式会社 ドライフィルム、硬化物およびプリント配線板
JP2018172519A (ja) * 2017-03-31 2018-11-08 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP2019006895A (ja) * 2017-06-23 2019-01-17 味の素株式会社 樹脂組成物
JP2018100421A (ja) * 2018-03-19 2018-06-28 味の素株式会社 樹脂組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023038035A1 (fr) * 2021-09-09 2023-03-16 株式会社レゾナック Composition de résine d'étanchéité, dispositif de composant électronique et procédé de fabrication de dispositif de composant électronique
WO2023238951A1 (fr) * 2022-06-10 2023-12-14 株式会社レゾナック Composition de résine pour moulage et dispositif à composants électroniques

Also Published As

Publication number Publication date
TW202108655A (zh) 2021-03-01
CN114008105A (zh) 2022-02-01
KR20220025804A (ko) 2022-03-03
JPWO2020262654A1 (fr) 2020-12-30

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