Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
  • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
  • C08F290/06—Polymers provided for in subclass C08G
  • C08F290/062—Polyethers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F2/00—Processes of polymerisation
  • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/24—Acids; Salts thereof
  • C08K3/26—Carbonates; Bicarbonates
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/80—Constructional details
  • H10N30/85—Piezoelectric or electrostrictive active materials
  • H10N30/857—Macromolecular compositions
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/20—Oxides; Hydroxides
  • C08K3/22—Oxides; Hydroxides of metals
  • C08K2003/2237—Oxides; Hydroxides of metals of titanium
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/001—Conductive additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
  • C08K3/24—Acids; Salts thereof
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/01—Manufacture or treatment
  • H10N30/09—Forming piezoelectric or electrostrictive materials
  • H10N30/098—Forming organic materials

Definitions

• the present disclosure relates to a curable composition, a cured product thereof, and a piezoelectric element.
• Patent Document 1 discloses a polymer composite piezoelectric body in which piezoelectric particles are dispersed in a matrix made of a polymer material.
• a polymeric composite piezoelectric body is disclosed which contains particles of 5 vol % or more and 30 vol % or less.
• one aspect of the present invention aims to provide a curable composition capable of forming a cured product with excellent flexibility even when the content of piezoelectric particles is increased.
• the present inventors have found that a curable composition using a combination of a specific bifunctional monomer having a polyoxyalkylene chain and piezoelectric particles exhibits excellent flexibility even when the content of the piezoelectric particles is increased. We have found that it is possible to form objects.
• a curable composition containing piezoelectric particles and a compound represented by the following formula (1) includes the following aspects.
• R 11 and R 12 each independently represent a hydrogen atom or a methyl group
• R 13 represents a divalent group having a polyoxyalkylene chain.
• R 31 and R 32 each independently represent a hydrogen atom or a monovalent organic group, and may combine with each other to form a ring.
• R33 represents a hydrogen atom or a methyl group.
• a cured product of the curable composition according to any one of [1] to [10].
• a piezoelectric element comprising the cured product of [11].
• the curable composition capable of forming a cured product with excellent flexibility even when the content of piezoelectric particles is increased.
• the curable composition can form a cured product suitable for use in piezoelectric elements.
• the cured product of the curable composition of one aspect can suppress deterioration in piezoelectric properties even when placed in a high-temperature environment.
• (meth)acryloyl means “acryloyl” and its corresponding “methacryloyl”, and the same applies to similar expressions such as “(meth)acrylate” and “(meth)acryl”. .
• the weight average molecular weight (Mw) and the ratio of the weight average molecular weight to the number average molecular weight (Mw/Mn) herein are measured using gel permeation chromatography (GPC) under the following conditions, and polystyrene is used as a standard substance.
• GPC gel permeation chromatography
• a curable composition according to one embodiment of the present invention contains piezoelectric particles.
• the piezoelectric particles may be, for example, ceramic particles having a perovskite or wurtzite crystal structure. Ceramics constituting the piezoelectric particles include, for example, barium titanate (BaTiO 3 ), lead zirconate titanate (PZT), lead zirconate titanate lanthanate (PLZT), zinc oxide (ZnO), and titanic acid.
• a solid solution (BFBT) of barium and bismuth ferrite (BiFe 3 ) can be mentioned.
• the average particle diameter of the piezoelectric particles may be, for example, 0.05 ⁇ m or more, 0.1 ⁇ m or more, or 0.3 ⁇ m or more, and may be 50 ⁇ m or less, 30 ⁇ m or less, or 20 ⁇ m or less.
• the average particle size of the piezoelectric particles is measured by a laser diffraction/scattering particle size distribution analyzer (for example, LA-950V2 manufactured by Horiba, Ltd.).
• the curable composition may contain two or more types of piezoelectric particles having different average particle sizes.
• the content of the piezoelectric particles may be, for example, 30% by volume or more based on the total amount of the curable composition.
• the curable composition can form a cured product having excellent flexibility even when the content of the piezoelectric particles is increased. Therefore, in order to further improve the piezoelectric properties, the content of the piezoelectric particles is 35% by volume or more, 40% by volume or more, 50% by volume or more, 55% by volume or more, 60% by volume or more, based on the total amount of the curable composition. % or more, or 65 volume % or more.
• the content of the piezoelectric particles may be, for example, 80% by volume or less or 70% by volume or less based on the total amount of the curable composition.
• the curable composition contains a compound represented by the following formula (1) in addition to piezoelectric particles.
• R 11 and R 12 each independently represent a hydrogen atom or a methyl group
• R 13 represents a divalent group having a polyoxyalkylene chain.
• R 11 and R 12 may be a hydrogen atom and the other may be a methyl group, in another embodiment both R 11 and R 12 may be a hydrogen atom, In another embodiment, both R 11 and R 12 can be methyl groups.
• the polyoxyalkylene chain includes a structural unit represented by formula (1a) below.
• R 13 may be a divalent group having a polyoxyethylene chain, and the compound represented by formula (1) is preferably a compound represented by the following formula (1-2) (polyethylene glycol di (meth)acrylate).
• formula (1-2) polyethylene glycol di (meth)acrylate
• R 11 and R 12 have the same definitions as R 11 and R 12 in formula (1), respectively, and m is an integer of 2 or more.
• the polyoxyalkylene chain comprises a structural unit represented by formula (1b) below. This can facilitate handling of the curable composition.
• R 13 may be a divalent group having a polyoxypropylene chain, and the compound represented by formula (1) is preferably a compound represented by the following formula (1-3) (polypropylene glycol di (meth)acrylate).
• formula (1-3) polypropylene glycol di (meth)acrylate.
• R 11 and R 12 have the same definitions as R 11 and R 12 in formula (1), respectively, and n is an integer of 2 or more.
• the polyoxyalkylene chain preferably has the above-described, It is a copolymer chain containing a structural unit represented by formula (1a) and a structural unit represented by formula (1b).
• the copolymer chains may be alternating copolymer chains, block copolymer chains, or random copolymer chains.
• the copolymer chain is preferably a random copolymer chain from the viewpoint of further reducing the crystallinity of the compound represented by formula (1) and further facilitating the handling of the curable composition.
• the polyoxyalkylene chain includes an oxytetramethylene group, an oxybutylene group, an oxypentylene group, in addition to the structural unit represented by the formula (1a) and the structural unit represented by the formula (1b). It may have an oxyalkylene group having 4 to 5 carbon atoms, such as, as a structural unit.
• R 13 may be a divalent group further having another organic group in addition to the polyoxyalkylene chain described above.
• Other organic groups may be chain groups other than polyoxyalkylene chains, such as methylene chains (chains having —CH 2 — as structural units), polyester chains (including chains), polyurethane chains (chains containing —OCON— in their structural units), and the like.
• the compound represented by Formula (1) may be a compound represented by Formula (1-4) below.
• R 11 and R 12 have the same definitions as R 11 and R 12 in formula (1), and R 14 and R 15 are each independently an alkylene group having 2 to 5 carbon atoms.
• k1, k2 and k3 are each independently an integer of 2 or more.
• k2 may be an integer of 16 or less, for example.
• a plurality of R 14 and R 15 may be the same as or different from each other. Multiple occurrences of R 14 and R 15 preferably contain an ethylene group and a propylene group, respectively. That is, the polyoxyalkylene chain represented by (R 14 O) k1 and the polyoxyalkylene chain represented by (R 15 O) k3 are each preferably an oxyethylene group (represented by formula (1a) above). ) and an oxypropylene group (structural unit represented by the above formula (1b)).
• the number of oxyalkylene groups in the polyoxyalkylene chain is preferably 100 or more.
• the main chain of the compound represented by the formula (1) becomes longer, so that the elongation of the cured product is further excellent and the strength of the cured product is increased. can be done.
• the number of oxyalkylene groups corresponds to m in formula (1-2), n in formula (1-3), and k1 and k3 in formula (1-4).
• the number of oxyalkylene groups in the polyoxyalkylene chain is more preferably 130 or more, 180 or more, 200 or more, 220 or more, 250 or more, 270 or more, 300 or more, or 320 or more.
• the number of oxyalkylene groups in the polyoxyalkylene chain may be 600 or less, 570 or less, or 530 or less.
• the weight-average molecular weight of the compound represented by formula (1) is preferably 5000 or more, 6000 or more, 7000 or more, 8000 or more, 9000 or more, 10000 or more, 11000, from the viewpoint that the cured product has lower elasticity and excellent elongation. 12000 or more, 13000 or more, 14000 or more, or 15000 or more.
• the weight average molecular weight of the compound represented by formula (1) is preferably 100,000 or less, 80,000 or less, 60,000 or less, 34,000 or less, 31,000 or less, or 28,000 or less from the viewpoint of facilitating adjustment of the viscosity of the curable composition. is.
• the compound represented by Formula (1) may be liquid at 25°C.
• the viscosity of the compound represented by formula (1) at 25° C. is preferably 1000 Pa s or less from the viewpoint of facilitating application to the coating surface and enhancing the adhesion of the cured product to the coating surface. , 800 Pa ⁇ s or less, 600 Pa ⁇ s or less, 500 Pa ⁇ s or less, 350 Pa ⁇ s or less, 300 Pa ⁇ s or less, or 200 Pa ⁇ s or less.
• the viscosity at 25° C. of the compound represented by formula (1) is 0.1 Pa ⁇ s or more, 0.2 Pa ⁇ s or more, 0.3 Pa ⁇ s or more, 1 Pa ⁇ s or more, 2 Pa ⁇ s or more, or 3 Pa ⁇ s or more. s or more.
• the compound represented by formula (1) may be solid at 25°C.
• the compound represented by Formula (1) is preferably liquid at 50° C. from the viewpoint of improving the handleability of the curable composition.
• the viscosity of the compound represented by formula (1) at 50° C. is preferably 100 Pa s or less, more preferably 50 Pa s or less, from the viewpoint of further improving the handleability of the curable composition. It is more preferably 30 Pa ⁇ s or less, particularly preferably 20 Pa ⁇ s or less.
• the viscosity at 50° C. of the compound represented by Formula (1) may be 0.1 Pa ⁇ s or more, 0.2 Pa ⁇ s or more, or 0.3 Pa ⁇ s or more.
• viscosity means a value measured based on JIS Z8803, specifically, a value measured by an E-type viscometer (for example, PE-80L manufactured by Toki Sangyo Co., Ltd.) means The viscometer can be calibrated based on JIS Z8809-JS14000.
• the viscosity of the compound represented by formula (1) can be adjusted by adjusting the weight average molecular weight of the compound.
• the content of the compound represented by formula (1) is preferably 1% by mass or more, 1.5% by mass or more, 2% by mass, based on the total amount of the curable composition, from the viewpoint that the cured product is more excellent in elongation.
• % or more 2.5 mass % or more, or 3 mass % or more, and may be, for example, 10 mass % or less, 7 mass % or less, or 5 mass % or less.
• the curable composition may further contain other polymerizable compounds other than the compound represented by formula (1) in addition to the compound represented by formula (1) as polymerizable compounds (details described later).
• the content of the compound represented by formula (1) is the total of the compound represented by formula (1) and other polymerizable compounds (hereinafter referred to as "polymerizable component content It is preferably 5 parts by mass or more, 10 parts by mass or more, or 15 parts by mass or more, for example, 40 parts by mass or less, 30 parts by mass or less, or 20 parts by mass. may be:
• the curable composition may further contain a compound represented by the following formula (2) from the viewpoint of improving the heat resistance of the cured product.
• R21 and R22 each independently represent a hydrogen atom or a methyl group
• R23 represents a divalent group having a poly(meth)acrylate chain.
• R 21 and R 22 may be a hydrogen atom and the other may be a methyl group, in another embodiment both R 21 and R 22 may be a hydrogen atom, In another embodiment, both R 21 and R 22 can be methyl groups.
• a poly(meth)acrylate chain includes a structural unit represented by the following formula (2a).
• R24 represents a hydrogen atom or a monovalent organic group
• R25 represents a hydrogen atom or a methyl group.
• the monovalent organic group represented by R 24 may be, for example, a hydrocarbon group or an organic group having an oxygen atom, a nitrogen atom, or the like.
• the hydrocarbon group may be chain-shaped and may have a ring (eg, aromatic ring).
• the number of carbon atoms in the hydrocarbon group may be, for example, 1 or more and 18 or less.
• Hydrocarbon groups include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group, n-hexyl group and n-heptyl group.
• n-octyl group 2-ethylhexyl group, 2-propylheptyl group, nonyl group, decyl group, isodecyl group, dodecyl group, octadecyl group, phenyl group, toluyl group, and benzyl group.
• Organic groups having an oxygen atom include groups having an alkoxy group, groups having a hydroxyl group, groups having a carboxyl group, and groups having a glycidyl group.
• Examples of organic groups having an oxygen atom include 2-methoxyethyl group, 3-methoxybutyl group, 2-hydroxyethyl group, 2-hydroxypropyl group, 4-hydroxybutyl group, carboxyl group and glycidyl group.
• Examples of the organic group having a nitrogen atom include groups having an amino group and a nitrile group. Examples of the organic group having a nitrogen atom include a 2-aminoethyl group and a nitrile group.
• the monovalent organic group represented by R 24 may be a group having a polar group, and may be a group having a hydroxyl group or a carboxyl group.
• the compound represented by formula (2) may be a compound represented by formula (2-2) below.
• R 21 and R 22 have the same definitions as R 21 and R 22 in formula (2)
• R 24 and R 25 have the same definitions as R 24 and R 25 in formula (2a).
• a is an integer of 2 or more.
• the weight average molecular weight of the compound represented by formula (2) is preferably 3000 or more, 4000 or more, 5000 or more, 6000 or more, 7000 or more, 8000 or more, 9000 or more, 10000 or more, 11000 or more, 12000 or more, or 13000 That's it.
• the weight average molecular weight of the compound represented by formula (2) is preferably 100,000 or less, 80,000 or less, 60,000 or less, 34,000 or less, 31,000 or less, or 28,000 or less from the viewpoint of facilitating adjustment of the viscosity of the curable composition. is.
• a may be an integer such that the weight-average molecular weight of the compound represented by formula (2) falls within the above range.
• the ratio (Mw/Mn) between the weight average molecular weight (Mw) and the number average molecular weight (Mn) of the compound represented by formula (2) is preferably 1.4 or less or 1.2 or less.
• the compound represented by formula (2) may be liquid at 23°C.
• the viscosity of the compound represented by formula (2) at 23° C. is 1000 Pa s or less, 800 Pa s or less, from the viewpoint of facilitating application to the coating surface and from the viewpoint of enhancing adhesion of the cured product to the coating surface. s or less, 700 Pa ⁇ s or less, 600 Pa ⁇ s or less, or 550 Pa ⁇ s or less.
• the viscosity at 25° C. of the compound represented by formula (2) is 5 Pa s or more, 10 Pa s or more, 15 Pa s or more, 20 Pa s or more, 25 Pa s or more, 30 Pa s or more, or 35 Pa s. or more.
• the glass transition temperature (Tg) of the compound represented by formula (2) may be 0°C or lower, -10°C or lower, or -30°C or lower, and may be -60°C or higher, -50°C or higher, or -40°C. °C or higher.
• a glass transition temperature means a value measured by differential scanning calorimetry.
• the content of the compound represented by the formula (2) is preferably 3 parts by mass or more and 5 parts by mass with respect to the total 100 parts by mass of the content of the polymerizable component, from the viewpoint that the cured product has more excellent heat resistance.
• parts or more, or 10 parts by mass or more and may be, for example, 30 parts by mass or less, 20 parts by mass or less, or 15 parts by mass or less.
• the curable composition may further contain a compound represented by the following formula (3) from the viewpoint of further improving elongation and heat resistance of the cured product.
• R 31 and R 32 each independently represent a hydrogen atom or a monovalent organic group, and may combine with each other to form a ring.
• R33 represents a hydrogen atom or a methyl group.
• one of R 31 and R 32 may be a hydrogen atom and the other may be a monovalent organic group, and in another embodiment both R 31 and R 32 are hydrogen atoms. may be, and in another embodiment, both R 31 and R 32 may be monovalent organic groups that may combine with each other to form a ring.
• the monovalent organic group may be, for example, a monovalent hydrocarbon group or an alkyl group.
• the number of carbon atoms in the monovalent hydrocarbon group (alkyl group) may be, for example, 1 or more and 6 or less.
• alkyl groups include methyl, ethyl, n-propyl and isopropyl groups.
• Examples of the compound represented by formula (3) when R 31 and R 32 are not combined to form a ring include dimethylacrylamide, diethylacrylamide and diisopropylacrylamide.
• R 31 and R 32 are preferably combined with each other to form a ring.
• the ring may be, for example, a 5-membered ring, a 6-membered ring, or a 7-membered ring, preferably a 6-membered ring.
• the ring is formed by a nitrogen atom and groups represented by R 31 and R 32 , and in addition to the nitrogen atom, may contain a carbon atom, a hydrogen atom, an oxygen atom, a sulfur atom, etc., preferably , contains only carbon, hydrogen and oxygen atoms.
• the group represented by R 31 and R 32 may be a group containing a carbon atom, a hydrogen atom, an oxygen atom, a sulfur atom, etc., preferably a group containing only a carbon atom, a hydrogen atom and an oxygen atom. It can be.
• Examples of the compound represented by formula (3) in which R 31 and R 32 are bonded together to form a ring include N-(meth)acryloylmorpholine, N-acryloylthiomorpholine, N- Acryloyloxazoline, N-acryloylthiazolidine, N-acryloylimidazolidine, N-(meth)acryloylpiperazine, N-vinylpyrrolidone, and N-vinylcaprolactam.
• the content of the compound represented by formula (3) is preferably 1 part by mass or more with respect to the total 100 parts by mass of the content of the polymerizable component, from the viewpoint of further improving the elongation and heat resistance of the cured product. , 5 parts by mass or more, or 7 parts by mass or more, and may be, for example, 30 parts by mass or less, 20 parts by mass or less, or 10 parts by mass or less.
• the curable composition is a compound represented by the above-described formula (1), a compound represented by the formula (2), and a compound represented by the formula (3) for the purpose of adjusting the physical properties of the curable composition. It may further contain other polymerizable compounds that can be copolymerized with the compound.
• the other polymerizable compound may be, for example, a compound having one (meth)acryloyl group other than the compound represented by formula (3).
• the compound may be, for example, an alkyl (meth)acrylate.
• Other polymerizable compounds include, in addition to one (meth)acryloyl group, an aromatic hydrocarbon group, a group containing a polyoxyalkylene chain, a group containing a heterocycle, an alkoxy group, a phenoxy group, a group containing a silane group, A compound having a group containing a siloxane bond, a halogen atom, a hydroxyl group, a carboxyl group, an amino group, or an epoxy group may be used.
• the viscosity of the curable composition can be adjusted.
• the curable composition contains a compound having a hydroxyl group, a carboxyl group, an amino group, or an epoxy group in addition to a (meth)acryloyl group, so that the curable composition and its cured product adhere to a member. can further improve performance.
• the alkyl group (the alkyl group portion other than the (meth)acryloyl group) in the alkyl (meth)acrylate may be linear, branched, or alicyclic.
• the number of carbon atoms in the alkyl group may be, for example, 1-30.
• the number of carbon atoms in the alkyl group may be 1 to 11, 1 to 8, 1 to 6, or 1 to 4; ⁇ 14.
• Alkyl (meth)acrylates having a linear alkyl group include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, n-hexyl ( meth)acrylate, n-heptyl (meth)acrylate, octyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, etc.
• Linear alkyl groups having 1 to 11 carbon atoms Alkyl (meth) acrylate, dodecyl (meth) acrylate (lauryl (meth) acrylate), tetradecyl (meth) acrylate, hexadecyl (meth) acrylate (cetyl (meth) acrylate), octadecyl (meth) acrylate (stearyl (meth) acrylate) Alkyl ( meth)acrylates.
• Alkyl (meth)acrylates having a branched alkyl group include s-butyl (meth)acrylate, t-butyl (meth)acrylate, isobutyl (meth)acrylate, isopentyl (meth)acrylate, isoamyl (meth)acrylate, isooctyl Alkyl (meth)acrylates and isomyristyl (meth)acrylates having a branched alkyl group having 1 to 11 carbon atoms such as (meth)acrylates, 2-ethylhexyl (meth)acrylates, isononyl (meth)acrylates, and isodecyl (meth)acrylates , 2-propylheptyl (meth)acrylate, isoundecyl (meth)acrylate, isododecyl (meth)acrylate, isotridecyl (meth)acrylate, isopentadecyl (meth)acrylate
• Alkyl (meth)acrylates having an alicyclic alkyl group include cyclohexyl (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate, isobornyl (meth)acrylate, terpene (meth)acrylate, ) acrylate, dicyclopentanyl (meth)acrylate and the like.
• Examples of compounds having a (meth)acryloyl group and an aromatic hydrocarbon group include benzyl (meth)acrylate.
• (Meth) acryloyl group and compounds having a group containing a polyoxyalkylene chain, polyethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, Polybutylene glycol (meth)acrylate, methoxypolybutylene glycol (meth)acrylate and the like are included.
• Examples of compounds having a (meth)acryloyl group and a heterocyclic ring-containing group include tetrahydrofurfuryl (meth)acrylate and the like.
• 2-methoxyethyl acrylate and the like are examples of compounds having a (meth)acryloyl group and an alkoxy group.
• Examples of compounds having a (meth)acryloyl group and a phenoxy group include phenoxyethyl (meth)acrylate.
• Compounds having groups containing (meth)acryloyl groups and silane groups include 3-acryloxypropyltriethoxysilane, 10-methacryloyloxydecyltrimethoxysilane, 10-acryloyloxydecyltrimethoxysilane, 10-methacryloyloxydecyl triethoxysilane, 10-acryloyloxydecyltriethoxysilane, and the like.
• Examples of compounds having a (meth)acryloyl group and a group containing a siloxane bond include silicone (meth)acrylates.
• (Meth) compounds having an acryloyl group and a halogen atom include trifluoromethyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 1,1,1,3,3,3-hexafluoro -2-propyl (meth)acrylate, perfluoroethylmethyl (meth)acrylate, perfluoropropylmethyl (meth)acrylate, perfluorobutylmethyl (meth)acrylate, perfluoropentylmethyl (meth)acrylate, perfluorohexylmethyl ( meth)acrylate, perfluoroheptylmethyl (meth)acrylate, perfluorooctylmethyl (meth)acrylate, perfluorononylmethyl (meth)acrylate, perfluorodecylmethyl (meth)acrylate, perfluoroundecylmethyl (meth)acrylate, Perfluorododecylmethyl (meth)acrylate,
• Compounds having a (meth)acryloyl group and a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, Hydroxyalkyl (meth)acrylate such as 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, etc. ) acrylates; and hydroxyalkylcycloalkane (meth)acrylates such as (4-hydroxymethylcyclohexyl)methyl (meth)acrylate.
• Compounds having a (meth)acryloyl group and a carboxyl group include (meth)acrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, monohydroxyethyl phthalate (e.g., Toagosei Co., Ltd. " Aronix M5400”), and 2-acryloyloxyethyl succinate (for example, Shin-Nakamura Chemical Co., Ltd., "NK Ester A-SA”).
• Examples of compounds having a (meth)acryloyl group and an amino group include N,N-dimethylaminoethyl (meth)acrylate, N,N-diethylaminoethyl (meth)acrylate, and N,N-dimethylaminopropyl (meth)acrylate. , N,N-diethylaminopropyl (meth)acrylate and the like.
• Compounds having a (meth)acryloyl group and an epoxy group include, for example, glycidyl (meth)acrylate, ⁇ -ethyl glycidyl (meth)acrylate, ⁇ -n-propyl glycidyl (meth)acrylate, ⁇ -n-butyl Glycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 4,5-epoxypentyl (meth)acrylate, 6,7-epoxyheptyl (meth)acrylate, ⁇ -ethyl ( 6,7-epoxyheptyl meth)acrylate, 3-methyl-3,4-epoxybutyl (meth)acrylate, 4-methyl-4,5-epoxypentyl (meth)acrylate, (meth)acrylic acid-5-methyl-5,6-epoxyhexyl, ⁇ -methylglycidyl (meth)acrylate, ⁇ -ethy
• the content of the other polymerizable compound is preferably 2 based on the total amount of the curable composition, from the viewpoint of facilitating adjustment of the viscosity of the curable composition, or from the viewpoint of further enhancing the adhesion of the curable composition. % by mass or more, 4% by mass or more, 6% by mass or more, 8% by mass or more, or 10% by mass or more, and may be, for example, 30% by mass or less, 20% by mass or less, or 15% by mass or less.
• the content of other polymerizable compounds is based on the total content of 100 parts by mass of the polymerizable components. is preferably 40 parts by mass or more, 50 parts by mass or more, or 60 parts by mass or more, and may be, for example, 90 parts by mass or less, 80 parts by mass or less, or 70 parts by mass or less.
• the curable composition may further contain a polymerization initiator.
• the polymerization initiator may be, for example, a thermal polymerization initiator that generates radicals by heat, a photopolymerization initiator that generates radicals by light, or the like.
• the polymerization initiator is preferably a thermal polymerization initiator.
• the curable composition contains a thermal polymerization initiator
• a cured product of the curable composition can be obtained by applying heat to the curable composition.
• the curable composition may be a curable composition that is cured by heating at a temperature of preferably 105° C. or higher, more preferably 110° C. or higher, and even more preferably 115° C. or higher. C. or less, or 180.degree. C. or less may be a curable composition that is cured by heating.
• the heating time for heating the curable composition may be appropriately selected according to the composition of the curable composition so that the curable composition is suitably cured.
• Thermal polymerization initiators include azo compounds such as azobisisobutyronitrile, azobis-4-methoxy-2,4-dimethylvaleronitrile, azobiscyclohexanone-1-carbonitrile, azodibenzoyl, benzoyl peroxide, peroxide lauroyl oxide, di-t-butyl peroxide, di-t-hexyl peroxide, di-t-butylperoxyhexahydroterephthalate, t-butylperoxy-2-ethylhexanoate, 1,1-t- Examples include organic peroxides such as butylperoxy-3,3,5-trimethylcyclohexane and t-butylperoxyisopropyl carbonate. Thermal polymerization initiators may be used alone or in combination of two or more.
• the content of the polymerization initiator is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, relative to the total 100 parts by mass of the content of the polymerizable components, from the viewpoint of favorably progressing the polymerization. , more preferably 0.1 parts by mass or more, and particularly preferably 0.5 parts by mass or more.
• the content of the polymerization initiator is such that the molecular weight of the polymer in the cured product of the curable composition is in a suitable range, and from the viewpoint of suppressing decomposition products, the total content of the polymerizable component is 100 parts by mass. , preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 3 parts by mass or less.
• the curable composition may further contain a plasticizer.
• a plasticizer By containing a plasticizer in the curable composition, the adhesion of the curable composition and the elongation of the cured product can be further enhanced.
• plasticizers include tackifiers such as butadiene rubber, isoprene rubber, silicone rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, butyl rubber, ethylene propylene rubber, urethane rubber, acrylic resin, rosin-based resin, terpene-based resin, or poly alkylene glycol and the like.
• the content of the plasticizer may be 0.1 parts by mass or more, 1 part by mass or more, or 3 parts by mass or more with respect to the total 100 parts by mass of the content of the polymerizable component, and may be 20 parts by mass or less, or 15 parts by mass. It may be 10 parts by mass or less, or 10 parts by mass or less.
• the curable composition may further contain an antioxidant from the viewpoint of improving the thermal reliability of the cured product.
• Antioxidants may be, for example, phenolic antioxidants, benzophenone antioxidants, benzoate antioxidants, hindered amine antioxidants, benzotriazole antioxidants, etc., preferably phenolic antioxidants. It is an inhibitor.
• Phenolic antioxidants have, for example, a hindered phenol structure (hindered phenol ring).
• the hindered phenol structure may be, for example, a structure in which a t-butyl group is bonded to one or both of the positions ortho to the hydroxyl group on the phenol ring.
• the phenolic antioxidant has one or more such hindered phenol rings, preferably two or more, more preferably three or more, still more preferably four or more.
• the content of the antioxidant may be 0.1% by mass or more, 0.2% by mass or more, or 0.3% by mass or more, 5% by mass or less, and 3% by mass. or less, or 1% by mass or less.
• the curable composition can further contain other additives as necessary.
• Other additives include, for example, surface treatment agents (e.g., silane coupling agents), dispersants, curing accelerators, colorants, crystal nucleating agents, heat stabilizers, foaming agents, flame retardants, damping agents, dehydrating agents. , flame retardant aids (for example, metal oxides), and the like.
• the content of other additives may be 0.1% by mass or more and 10% by mass or less based on the total amount of the curable composition.
• the curable composition described above is used after being cured. That is, another embodiment of the present invention is a cured product of the curable composition described above.
• a cured product can be obtained, for example, by heating and/or light irradiation of the curable composition depending on the type of the polymerization initiator described above.
• the cured product may be in the form of a sheet, for example.
• the thickness of the sheet-like cured product may be, for example, 10 ⁇ m or more, 30 ⁇ m or more, or 50 ⁇ m or more, and may be 2.0 mm or less, 1.0 mm or less, or 0.3 mm or less.
• the cured product can be suitably used for piezoelectric elements. That is, another embodiment of the present invention is a piezoelectric element containing the cured product.
• the above-mentioned cured product is excellent in flexibility (can suppress an increase in tensile elastic modulus) even when the content of the piezoelectric particles is increased. can be improved.
• the cured product is excellent in terms of mechanical strength such as elongation at break and strength at break.
• the cured product can suppress deterioration of piezoelectric properties even when placed in a high-temperature environment. Therefore, a piezoelectric element containing the above cured product can exhibit excellent piezoelectric properties even in a higher temperature range than a piezoelectric element containing a conventional polymer material (for example, a piezoelectric element containing PVDF).
• the piezoelectric element containing the cured product has excellent heat resistance.
• the 5% weight loss temperature of the cured product can be, for example, 250° C. or higher, 300° C. or higher, or 350° C. or higher.
• the weight reduction rate of the cured product after being held at 150° C. for 1 hour can be, for example, 1.0% by weight or less, 0.5% by weight or less, or 0.2% by weight or less.
• the 5% weight loss temperature and the weight loss rate after holding at 150° C. for 1 hour are measured by the method described in Examples.
• the piezoelectric element may be, for example, a piezoelectric element (sensor, etc.) that generates an electric charge when an external force (pressure) is applied, or a piezoelectric element (actuator, oscillator, etc.) that generates displacement when a voltage is applied. There may be. Piezoelectric elements may be used, for example, in haptics applications, speaker applications, and the like.
• A-1 Piezoelectric particles (barium titanate, Pulcerum BTE-UP (manufactured by Nippon Kagaku Kogyo Co., Ltd.), average particle size 14 ⁇ m)
• A-2 Piezoelectric particles (barium titanate, Pulcerum BT-UP2 (manufactured by Nippon Kagaku Kogyo Co., Ltd.), average particle size 2 ⁇ m)
• A-3 Piezoelectric particles (barium titanate, Pulcerum BTC-4FB (manufactured by Nippon Kagaku Kogyo Co., Ltd.), average particle size 0.4 ⁇ m)
• B-1 A compound represented by the following formula (1-5) synthesized by the procedure shown below (weight average molecular weight: 8000, m in formula (1-5) is an integer of approximately 180 ⁇ 3. , Viscosity at 50°C: 10 Pa s (solid at 25°C))
• B-2 A compound represented by the formula (1-6) synthesized by the procedure shown below (weight average molecular weight: 9400, m1 + m2 in formula (1-6) is approximately 160 ⁇ 5, n is approximately 38 ⁇ A mixture that is an integer of 5, viscosity at 50° C.: 8 Pa s (solid at 25° C.))
• B-3 A compound represented by the formula (1-7) synthesized by the procedure shown below (weight average molecular weight: 16000, m in formula (1-7) is approximately 246 ⁇ 5, n is approximately 105 ⁇ A mixture that is an integer of 5, viscosity at 25° C.: 55 Pa s)
• -r- is a sign representing random copolymerization.
• C-1 A compound represented by the following formula (2-3) (RC100C, manufactured by Kaneka Corporation, weight average molecular weight: 24000, R 21 and R 22 in formula (2-3) are hydrogen atoms or methyl groups and R 24 is an alkyl group, viscosity at 23° C.: 160 Pa s, Tg: ⁇ 50° C.)
• C-2 Compound represented by the above formula (2-3) (RC200C, manufactured by Kaneka Corporation, weight average molecular weight: 18000, R 21 and R 22 in formula (2-3) are hydrogen atoms or methyl groups and R 24 is a polar group, viscosity at 23° C.: 530 Pa s, Tg: ⁇ 39° C.)
• D-1 Hydroxybutyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.)
• D-2 2-acryloyloxyethyl succinic acid (manufactured by Shin-Nakamura Chemical Co., Ltd.)
• D-3 Acryloylmorpholine (manufactured by KJ Chemicals Co., Ltd.)
• D-4 isodecyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd.)
• D-5 Methoxy polyethylene glycol acrylate (AM-90G, manufactured by Shin-Nakamura Chemical Co., Ltd.)
• D-6 Ethoxylated-o-phenylphenol acrylate (A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.)
• D-7 Urethane acrylate (UA-4200, manufactured by Shin-Nakamura Chemical Co., Ltd.)
• D-8 Bifunctional polyethylene glycol acrylate (A-200, manufactured
• E-1 plasticizer (rosin ester, KE359, Arakawa Chemical Industries)
• F-1 Antioxidant (phenolic antioxidant, AO-60, manufactured by ADEKA Co., Ltd.)
• F-2 Antioxidant (phenolic antioxidant, AO-80, manufactured by ADEKA Co., Ltd.)
• G-1 Thermal polymerization initiator (Perbutyl O, manufactured by NOF Corporation)
• G-2 Thermal polymerization initiator (Perhexyl O, manufactured by NOF Corporation)
• the piezoelectric constant d33 was measured using a d33 meter manufactured by Lead Techno Co., Ltd. for the film-like cured product after the polarization treatment of each example. More specifically, the film-like cured product was sandwiched between the terminals of a ⁇ 8 mm cylindrical piezometer at 1N, and the piezoelectric constant d33 was measured under the conditions of a preload force of 1N and a load force of 1.5N. The measurement of d33 was performed on 5 sheets of the film-like cured product after the polarization treatment of each example, and the average value of the measured d33 was obtained. Table 1 shows the results.
• the tensile elastic modulus at 25° C. of the cured film material after polarization treatment of each example was measured using a tensile tester (“Autograph EZ-TEST EZ-S” manufactured by Shimadzu Corporation). More specifically, a film-like cured product of 0.2 mm (thickness) ⁇ 5 mm (width) ⁇ 30 mm (length) is stretched based on JIS K7161 under the conditions of a distance between chucks of 20 mm and a tensile speed of 5 mm / min. Elastic modulus was measured. Table 1 shows the results. If the measured tensile modulus is 50 MPa or less, it is recognized that the decrease in flexibility can be suppressed.
• the 5% weight loss temperature and the weight loss rate after holding at 150° C. for 1 hour were measured in order to evaluate the heat resistance.
• the 5% weight loss temperature is measured from 25 ° C. to 500 under the conditions of nitrogen flow: 400 mL / min using a differential thermal thermogravimetric simultaneous measurement device (manufactured by Hitachi High-Tech Science Co., Ltd., TG / DTA6300). It was measured as the temperature (°C) at which the weight of the cured film material decreased by 5% relative to the weight of the cured film material before the temperature was raised.
• the weight loss rate after holding at 150 ° C is measured from 25 ° C. to 500 under the conditions of nitrogen flow: 400 mL / min using a differential thermal thermogravimetric simultaneous measurement device (manufactured by Hitachi High-Tech Science Co., Ltd., TG / DTA6300). It was measured as the temperature (°C) at which the weight of the cured film material decreased by 5% relative to the weight of the cured film material

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