JPWO2023032866A1 - - Google Patents
Info
- Publication number
- JPWO2023032866A1 JPWO2023032866A1 JP2023545536A JP2023545536A JPWO2023032866A1 JP WO2023032866 A1 JPWO2023032866 A1 JP WO2023032866A1 JP 2023545536 A JP2023545536 A JP 2023545536A JP 2023545536 A JP2023545536 A JP 2023545536A JP WO2023032866 A1 JPWO2023032866 A1 JP WO2023032866A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/062—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/098—Forming organic materials
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021139907 | 2021-08-30 | ||
| JP2021166019 | 2021-10-08 | ||
| PCT/JP2022/032287 WO2023032866A1 (ja) | 2021-08-30 | 2022-08-26 | 硬化性組成物及びその硬化物、並びに圧電素子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023032866A1 true JPWO2023032866A1 (https=) | 2023-03-09 |
Family
ID=85412735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023545536A Pending JPWO2023032866A1 (https=) | 2021-08-30 | 2022-08-26 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240352177A1 (https=) |
| JP (1) | JPWO2023032866A1 (https=) |
| TW (1) | TW202323338A (https=) |
| WO (1) | WO2023032866A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120787240A (zh) * | 2023-02-24 | 2025-10-14 | 株式会社力森诺科 | 固化性组合物及其固化物、以及压电元件 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012167263A (ja) * | 2011-01-25 | 2012-09-06 | Sanyo Chem Ind Ltd | マイクロ波硬化型組成物 |
| JP2012188507A (ja) * | 2011-03-09 | 2012-10-04 | Kaneka Corp | 放熱シート用組成物、および、これを硬化させてなる放熱シート |
| JP2013018842A (ja) * | 2011-07-08 | 2013-01-31 | Sanyo Chem Ind Ltd | 感光性組成物 |
| JP2017122139A (ja) * | 2016-01-05 | 2017-07-13 | セメダイン株式会社 | 光硬化性組成物 |
| JP6022094B1 (ja) * | 2016-01-22 | 2016-11-09 | 共栄社化学株式会社 | 活性エネルギー線硬化型樹脂組成物、その硬化物及びレンズシート |
| JP2018172565A (ja) * | 2017-03-31 | 2018-11-08 | コニシ株式会社 | アクリル系硬化性樹脂組成物 |
| KR102801346B1 (ko) * | 2018-06-05 | 2025-04-25 | 이데미쓰 고산 가부시키가이샤 | 열경화성 조성물, 그것을 이용한 성형품의 제조 방법, 및 경화물 |
| JP7099704B2 (ja) * | 2018-11-05 | 2022-07-12 | 北川工業株式会社 | 熱伝導材 |
| US11940634B2 (en) * | 2019-09-03 | 2024-03-26 | National Research Council Of Canada | 3D printed antenna |
| CN115103866A (zh) * | 2019-11-29 | 2022-09-23 | 昭和电工材料株式会社 | 含有具有聚氧亚烷基链的化合物的组合物套组 |
| US20240132646A1 (en) * | 2021-02-26 | 2024-04-25 | Resonac Corporation | Composition containing (meth)acrylamide compound and compound having polyoxyalkylene chain |
| JPWO2022181454A1 (https=) * | 2021-02-26 | 2022-09-01 |
-
2022
- 2022-08-26 JP JP2023545536A patent/JPWO2023032866A1/ja active Pending
- 2022-08-26 US US18/686,436 patent/US20240352177A1/en active Pending
- 2022-08-26 WO PCT/JP2022/032287 patent/WO2023032866A1/ja not_active Ceased
- 2022-08-29 TW TW111132444A patent/TW202323338A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023032866A1 (ja) | 2023-03-09 |
| US20240352177A1 (en) | 2024-10-24 |
| TW202323338A (zh) | 2023-06-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250627 |