TW202323338A - 固化性組合物及其固化物、以及壓電元件 - Google Patents

固化性組合物及其固化物、以及壓電元件 Download PDF

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Publication number
TW202323338A
TW202323338A TW111132444A TW111132444A TW202323338A TW 202323338 A TW202323338 A TW 202323338A TW 111132444 A TW111132444 A TW 111132444A TW 111132444 A TW111132444 A TW 111132444A TW 202323338 A TW202323338 A TW 202323338A
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TW
Taiwan
Prior art keywords
meth
curable composition
formula
acrylate
group
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Application number
TW111132444A
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English (en)
Chinese (zh)
Inventor
岡田穣
古川直樹
橫田弘
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日商力森諾科股份有限公司
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Publication of TW202323338A publication Critical patent/TW202323338A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/062Polyethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/857Macromolecular compositions
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2237Oxides; Hydroxides of metals of titanium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/09Forming piezoelectric or electrostrictive materials
    • H10N30/098Forming organic materials

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW111132444A 2021-08-30 2022-08-29 固化性組合物及其固化物、以及壓電元件 TW202323338A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021139907 2021-08-30
JP2021-139907 2021-08-30
JP2021166019 2021-10-08
JP2021-166019 2021-10-08

Publications (1)

Publication Number Publication Date
TW202323338A true TW202323338A (zh) 2023-06-16

Family

ID=85412735

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111132444A TW202323338A (zh) 2021-08-30 2022-08-29 固化性組合物及其固化物、以及壓電元件

Country Status (4)

Country Link
US (1) US20240352177A1 (https=)
JP (1) JPWO2023032866A1 (https=)
TW (1) TW202323338A (https=)
WO (1) WO2023032866A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120787240A (zh) * 2023-02-24 2025-10-14 株式会社力森诺科 固化性组合物及其固化物、以及压电元件

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012167263A (ja) * 2011-01-25 2012-09-06 Sanyo Chem Ind Ltd マイクロ波硬化型組成物
JP2012188507A (ja) * 2011-03-09 2012-10-04 Kaneka Corp 放熱シート用組成物、および、これを硬化させてなる放熱シート
JP2013018842A (ja) * 2011-07-08 2013-01-31 Sanyo Chem Ind Ltd 感光性組成物
JP2017122139A (ja) * 2016-01-05 2017-07-13 セメダイン株式会社 光硬化性組成物
JP6022094B1 (ja) * 2016-01-22 2016-11-09 共栄社化学株式会社 活性エネルギー線硬化型樹脂組成物、その硬化物及びレンズシート
JP2018172565A (ja) * 2017-03-31 2018-11-08 コニシ株式会社 アクリル系硬化性樹脂組成物
KR102801346B1 (ko) * 2018-06-05 2025-04-25 이데미쓰 고산 가부시키가이샤 열경화성 조성물, 그것을 이용한 성형품의 제조 방법, 및 경화물
JP7099704B2 (ja) * 2018-11-05 2022-07-12 北川工業株式会社 熱伝導材
US11940634B2 (en) * 2019-09-03 2024-03-26 National Research Council Of Canada 3D printed antenna
CN115103866A (zh) * 2019-11-29 2022-09-23 昭和电工材料株式会社 含有具有聚氧亚烷基链的化合物的组合物套组
US20240132646A1 (en) * 2021-02-26 2024-04-25 Resonac Corporation Composition containing (meth)acrylamide compound and compound having polyoxyalkylene chain
JPWO2022181454A1 (https=) * 2021-02-26 2022-09-01

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Publication number Publication date
WO2023032866A1 (ja) 2023-03-09
US20240352177A1 (en) 2024-10-24
JPWO2023032866A1 (https=) 2023-03-09

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