WO2023019915A1 - Structure de substrat de circuit à conduction thermique élevée destinée à être utilisée dans un dispositif magnétique non réciproque à paramètre localisé de carte de circuit imprimé - Google Patents

Structure de substrat de circuit à conduction thermique élevée destinée à être utilisée dans un dispositif magnétique non réciproque à paramètre localisé de carte de circuit imprimé Download PDF

Info

Publication number
WO2023019915A1
WO2023019915A1 PCT/CN2022/079421 CN2022079421W WO2023019915A1 WO 2023019915 A1 WO2023019915 A1 WO 2023019915A1 CN 2022079421 W CN2022079421 W CN 2022079421W WO 2023019915 A1 WO2023019915 A1 WO 2023019915A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
circuit
heat conduction
copper
dielectric layer
Prior art date
Application number
PCT/CN2022/079421
Other languages
English (en)
Chinese (zh)
Inventor
杨勤
胡艺缤
张华峰
冯楠轩
赵春美
朱家辉
Original Assignee
西南应用磁学研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 西南应用磁学研究所 filed Critical 西南应用磁学研究所
Publication of WO2023019915A1 publication Critical patent/WO2023019915A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • the invention relates to a substrate structure of microwave components, in particular to a circuit substrate structure with high heat conduction for lumped parameter non-reciprocal magnetic devices of PCB boards.
  • the circuit substrate structure of traditional PCB lumped parameter non-reciprocal magnetic devices consists of double-sided copper clad laminates and single-sided copper clad laminates.
  • the double-sided copper clad laminates are composed of upper surface circuits, intermediate dielectric layers and lower surface circuits;
  • the surface copper clad board is composed of the pin dielectric layer and the pin copper clad layer, and the circuit on the pin lower surface is made on the pin copper clad layer;
  • the substrate is made of double-sided copper clad laminates and single-sided copper clad laminates bonded by epoxy resin .
  • the upper surface circuit is composed of a transmission circuit and a grounding circuit.
  • the intermediate dielectric layer is the heat source transmission channel, insulating layer, signal transmission channel, and ground transmission channel;
  • the lower surface circuit is the ground layer and the signal transmission layer;
  • the pin dielectric layer is the signal transmission channel and the ground transmission channel ;
  • the lower surface circuit of the pin is composed of a transmission circuit and a grounding circuit.
  • the circuit substrate structure realizes the circuit LC matching welding carrier and the circuit transmission function of the lumped parameter non-reciprocal magnetic device.
  • circuit substrate structure of the traditional PCB lumped parameter non-reciprocal magnetic device mainly has the following defects:
  • the lumped parameter non-reciprocal magnetic device uses a traditional circuit substrate, the device has an abnormal increase in the power loss and small signal test loss under normal temperature and high power conditions;
  • the traditional circuit substrate structure can basically only achieve 5W device passing power in a normal temperature environment
  • the circuit board medium may burn when the continuous wave passes through the power of 10W at a high temperature of 125°C.
  • the purpose of the present invention is to provide a solution to the problem of power dissipation of the current PCB lumped parameter non-reciprocal magnetic device, which changes the heat dissipation path, improves the heat dissipation efficiency, and improves the passing power of this type of lumped parameter non-reciprocal magnetic device.
  • 1. Solving the problem of abnormal increase in loss of lumped parameter non-reciprocal devices under power, a high thermal conductivity circuit substrate structure for lumped parameter non-reciprocal magnetic devices on PCB boards.
  • a PCB board lumped parameter non-reciprocal magnetic device with high thermal conductivity circuit substrate structure including double-sided copper-clad laminates and single-sided copper-clad laminates arranged sequentially from top to bottom Copper plate, the two are bonded by high thermal conductivity epoxy resin, the double-sided copper clad laminate includes an upper copper clad layer, an intermediate dielectric layer, and a lower copper clad layer arranged in sequence from top to bottom, and the upper copper clad layer is provided with an upper surface A circuit, the lower surface circuit is arranged on the lower copper clad layer;
  • the upper surface circuit is used to form the main installation position of the central conductor module and the auxiliary installation position of the matching circuit, as well as the grounding channel of the central conductor module circuit and the matching circuit.
  • the main installation position is located in the center of the upper copper layer and It is circular, and the secondary installation positions are distributed around the main installation, which are used to install the circuit components in the matching circuit, and make the circuit components distributed;
  • the intermediate dielectric layer is made of FR-4 material or high-frequency hydrocarbon material The thickness is 0.1mm-0.254mm;
  • the intermediate medium layer has several first heat conduction channels corresponding to the main installation position, and several second heat conduction channels corresponding to the auxiliary installation position, and the first heat conduction channel and the second heat conduction channel are both Penetrating through the upper copper clad layer and the intermediate dielectric layer;
  • the first heat conduction channel is a through hole that penetrates the upper copper layer and the intermediate dielectric layer, and the through hole is filled with copper or silver, and the second heat conduction channel is a metallization that penetrates the intermediate dielectric layer and the upper copper layer. through hole;
  • the lower surface of the lower copper clad layer is also provided with an electroplated copper layer, and the lower copper clad layer and the electroplated copper layer form a thick copper layer as a whole, and the circuit on the lower surface is arranged on the thick copper layer.
  • the upper surface of the double-sided copper clad laminate is further provided with a layer of solder resist ink.
  • the thick copper layer has a thickness of 60-80 microns.
  • the TG value of the FR-4 material is 180°C-210°C
  • the thermal expansion coefficient of the high-frequency hydrocarbon material is less than 45ppm/°C within the range of 30°C-260°C
  • the frequency is DC-10GHz.
  • the FR-4 material with a TG value of 180°C-210°C is a high TG value material.
  • the single-sided copper-clad laminate includes a lead dielectric layer and a lead copper-clad layer in order from top to bottom, and the material of the lead dielectric layer is the same as that of the middle dielectric layer, and the thickness is 0.1mm-0.168mm.
  • the range of 30-260°C is less than 45ppm/°C for low thermal expansion coefficient, and DC-10GHz is for high frequency.
  • the processing method of the first heat conduction channel is:
  • the central body module refers to the various components wrapped by the central conductor in the non-reciprocal magnetic device with lumped parameters of the PCB, including the central conductor, ferrite substrate, and PI insulating film. These components compose the central conductor module and are installed in the lumped parameter non-reciprocal magnetic device of the PCB board, and the input, output and isolation ends of the lumped parameter non-reciprocal magnetic device of the PCB board also need to be set to match The circuit performs impedance matching on the center conductor module.
  • the present invention has the advantages of:
  • the distribution method of the upper surface circuit is improved, the circuit components of the matching circuit can be dispersed, and the installation position size of the central conductor module is increased from ⁇ 2.1mm to ⁇ 2.3mm, which increases the heat dissipation area ;
  • the circular circuit installed in the central conductor module is designed with high thermal conductivity layout, and the thermal conduction hole design of ⁇ 0.15-0.2mm is adopted. The hole of this size and diameter is convenient for processing and electroplating hole filling or plugging treatment.
  • the intermediate dielectric layer is improved and a medium with a thickness of 0.1mm-0.254mm is selected.
  • the intermediate dielectric layer within this range is beneficial to the heat dissipation design and the processing of the heat conduction channel.
  • the installation position of the central conductor module is actually the location where the heat source of the device is concentrated, so a heat conduction channel is set on the installation position for targeted heat dissipation.
  • the heat conduction channel is made and processed according to the thickness of the intermediate dielectric layer. High thermal conductivity thermal channels.
  • the lower copper clad layer corresponding to the lower surface circuit of the double-sided copper clad laminate is designed with a thick copper layer, with a thickness of 60-80 ⁇ m, which enhances the copper thickness of the lower surface circuit of the intermediate dielectric layer and enhances the substrate strength of the device. Test It is not easy to deform when used, and has the effect of high heat sink.
  • the present invention improves the through power tolerance of the device, so that the device can withstand the continuous wave through power of 5W-15W in the environment of 125°C; and realizes the low frequency and high power PCB assembly.
  • the loss increase of the total parameter non-reciprocal magnetic device at high temperature and high power is small, between 0.5dB-1.5dB.
  • Fig. 1 is a top view of a circuit substrate for a traditional PCB board lumped parameter non-reciprocal magnetic device
  • Fig. 2 is A-A sectional view of Fig. 1;
  • Figure 3 is a rear view of a double-sided copper clad laminate in a circuit substrate for a traditional PCB lumped parameter non-reciprocal magnetic device
  • Fig. 4 is the solder resist ink layer matched with the circuit substrate in Fig. 1;
  • Fig. 5 is a rear view of a single-sided copper-clad laminate in a circuit substrate for a traditional PCB lumped parameter non-reciprocal magnetic device
  • Figure 6 is a perspective view of the layered structure of the present invention.
  • Fig. 7 is a top view of the solder resist ink layer in Fig. 6;
  • Fig. 8 is a top view of a double-sided copper clad laminate in the present invention.
  • Fig. 9 is a B-B sectional view of Fig. 8.
  • Fig. 10 is a rear view of the double-sided copper clad laminate of the present invention.
  • Fig. 11 is the structural explosion diagram of the 758-803MHz lumped parameter isolator applying the present invention.
  • Fig. 12 is the simulation result of standing wave electrical performance at the port of the 758-803MHz lumped parameter isolator applying the present invention
  • Fig. 13 is the isolation performance simulation result of applying the 758-803MHz lumped parameter isolator of the present invention.
  • Fig. 14 is the loss simulation result of the 758-803MHz lumped parameter isolator applying the present invention.
  • Embodiment 1 See Fig. 1-Fig. 5, which are circuit substrate structures for traditional traditional PCB lumped parameter non-reciprocal magnetic devices.
  • the traditional circuit substrate structure also includes double-sided copper-clad laminates and single-sided copper-clad laminates arranged in sequence from top to bottom, and the two are bonded into a whole by high thermal conductivity epoxy resin.
  • the double-sided copper-clad board includes a solder resist ink layer 10 , an upper copper-clad layer 5 , an intermediate dielectric layer 6 , and a lower copper-clad layer 7 .
  • the single-sided copper-clad board includes a lead dielectric layer 11 and a lead copper-clad layer 12 .
  • Upper clad copper layer 5 see Figure 1, used to set the upper surface circuit, the upper surface circuit is used to form the installation position of the circuit element and the grounding channel of the circuit element; the installation position is mainly used to install the central conductor module 8, and the matching The capacitance and resistance of the circuit can be seen in Figure 1.
  • the upper surface circuit includes input circuit 1, output circuit 2, isolation circuit 3, and ferrite installation position 4, input circuit 1, output circuit 2,
  • the isolated circuit 3 is provided with metallized through holes for signal transmission.
  • the intermediate dielectric layer 6 is generally a solid structure, see FIG. 2 .
  • Lower copper clad layer 7 used to set the lower surface circuit, which is mainly used to form input and output transmission circuits and ground plane circuits, see FIG. 3 .
  • Solder resist ink layer 10 used to isolate the non-component mounting area of the upper copper clad layer 5 by solder resist, see Figure 4, in Figure 4, the oblique area is the welding area, and the rest of the white area is the area covered by solder resist ink. The area covered by the solder resist ink varies slightly according to the actual upper surface circuit.
  • the installation position of the central conductor module 8 is actually the concentrated position of the heat source of the device, but neither the upper copper layer 5 nor the corresponding area of the intermediate dielectric layer 6 has a reasonable heat dissipation design.
  • the thickness of the copper layer is not enough, resulting in insufficient strength of the substrate, easy deformation, and does not have the effect of high heat sink.
  • Embodiment 2 Referring to Fig. 6-Fig. 10, a kind of high heat conduction circuit substrate structure for non-reciprocal magnetic device of PCB board lump parameter, comprises double-sided copper-clad board and single-sided copper-clad board arranged in order from top to bottom, both Bonded by high thermal conductivity epoxy resin, the double-sided copper clad laminate includes an upper copper clad layer 5, an intermediate dielectric layer 6, and a lower copper clad layer 7 arranged in sequence from top to bottom, and the upper copper clad layer 5 is provided with an upper surface circuit, the lower surface circuit is arranged on the lower copper clad layer 7;
  • the upper surface circuit is used to form the main installation position 16 of the center conductor module 8 and the auxiliary installation position 17 of the matching circuit, as well as the grounding channel of the center conductor module 8 circuit and the matching circuit, and the main installation position 16 is located on the upper surface.
  • the center of the copper clad layer 5 is circular, and the secondary installation positions 17 are distributed around the main installation, and are used to install circuit components in the matching circuit, and make the circuit components distributed;
  • the intermediate dielectric layer 6 is made of FR-4 material or high-frequency hydrocarbon material, with a thickness of 0.1mm-0.254mm; the intermediate dielectric layer 6 is provided with several first heat conduction channels 13 corresponding to the main installation position 16, corresponding to the auxiliary installation Several second heat conduction passages 14 are provided at position 17, and the first heat conduction passage 13 and the second heat conduction passage 14 both penetrate the upper copper clad layer 5 and the intermediate dielectric layer 6;
  • the first heat conduction channel 13 is a through hole penetrating the upper copper clad layer 5 and the intermediate dielectric layer 6, and the through hole is filled with copper or silver
  • the second heat conduction channel 14 is a through hole that penetrates the intermediate dielectric layer 6 and the upper Metallized vias on copper layer 5;
  • the lower surface of the lower copper clad layer 7 is also provided with an electroplated copper layer, and the lower copper clad layer 7 and the electroplated copper layer form a thick copper layer as a whole, and the circuit on the lower surface is arranged on the thick copper layer.
  • the upper surface of the double-sided copper clad laminate is also provided with a solder resist ink layer 10 .
  • the thick copper layer has a thickness of 60-80 microns.
  • the TG value of the FR-4 material is 180°C-210°C
  • the thermal expansion coefficient of the high-frequency hydrocarbon material is less than 45ppm/°C within the range of 30°C-260°C
  • the frequency is DC-10GHz.
  • the single-sided copper-clad board includes a lead dielectric layer 11 and a lead copper-clad layer 12 in order from top to bottom.
  • the lead dielectric layer 11 is made of the same material as the intermediate dielectric layer 6 and has a thickness of 0.1mm-0.168mm.
  • the processing method of the first heat conduction channel 13 is:
  • the composition of the present invention its multi-layer structure from top to bottom is solder resist ink layer 10, upper copper clad layer 5, intermediate dielectric layer 6, lower copper clad layer 7, high thermal conductivity adhesive Layer 15, pin dielectric layer 11, pin copper clad layer 12.
  • the first to fourth layers are double-sided copper-clad laminates
  • the fifth layer is made of glue
  • the sixth to seventh layers are single-sided copper-clad laminates.
  • the first layer is the solder resist ink layer 10 , referring to FIG. 7 , the hatched area is the welding area, and the remaining white areas are the areas covered by the solder resist ink.
  • the area covered by the solder resist ink varies slightly according to the actual upper surface circuit.
  • the second layer is the upper copper clad layer 5, referring to Fig. 8, the upper surface circuit is arranged on this layer, the purpose is to form the main installation position 16 for installing the center conductor module 8 and the auxiliary installation position 17 for the matching circuit, and the center conductor module
  • the grounding channel of the 8 circuit and the matching circuit can be designed according to actual needs.
  • Figure 8 shows a specific design method.
  • the main installation position 16 is located in the center as a circle, which is used to install the central conductor module 8 circuits, and the auxiliary installation position 17 includes several parts, namely:
  • the irregular circuit block in the upper left corner of the main installation position 16 is the signal input terminal of the product of the present invention.
  • the small white circle in this area is a metallized through hole for signal input.
  • an input terminal is provided to connect the central conductor module 8
  • the transmission line welding area and the input matching capacitor welding area, C1 in the figure is the input matching capacitor;
  • the irregular circuit block in the upper right corner of the main installation position 16 is the signal output terminal of the product of the present invention.
  • the small white circle in this area is a metallized through hole for signal output.
  • an output terminal is provided to connect the central conductor module 8
  • the transmission line welding area and the output matching capacitor welding area, C2 in the figure is the output matching capacitor;
  • the strip-shaped area between the signal input terminal and the signal output terminal is the common ground installation position for the input and output circuit components, and the circular hole on it is the second heat conduction channel 14;
  • the rectangular area on the left side of the main installation position 16 is the grounding circuit of the input matching capacitor C1, and the small white circle on it is the grounding metallization through hole;
  • the rectangular area on the right side of the main installation position 16 is the grounding circuit of the matching capacitor C2 at the output end, and the small white circle on it is the grounding metallization through hole;
  • the arc-shaped circuit block below the main installation position 16 is the welding area of the transmission line at the isolation end of the central conductor module 8 and the matching capacitance and resistance welding area of the isolation end.
  • C3 is the isolation end matching capacitor
  • R is the isolation end matching resistance
  • the lowermost area of the main installation position 16 is the grounding circuit and the resistance grounding circuit of the isolation terminal matching capacitor C3, and the small white circle on it is the grounding metallization through hole.
  • the marked C1, C2, C3, and R all refer to the installation positions of the capacitors and resistors. From Figure 8, it can be seen that the matching capacitors at the input end, the matching capacitors at the output end, and the matching capacitors at the isolation end are scattered and distributed, and are set separately The grounding circuit of the capacitor is also dispersedly distributed. This distribution method increases the space of the main installation position 16 and is beneficial to the heat dissipation of the central conductor module 8 .
  • the first heat conduction channel 13 and the second heat conduction channel 14 are arranged.
  • the first heat conduction channel 13 is located in the area of the central conductor module 8, and the high density is concentrated in the main installation position 16, which is more targeted.
  • the heat dissipation of the first heat conduction channel 13 is different according to the thickness of the intermediate dielectric layer 6 , and the manufacturing and processing methods are different, finally forming a heat conduction channel with high thermal conductivity. Effective heat dissipation of the central conductor module 8 is ensured.
  • the second heat conduction channel 14 is distributed at the sub-installation position 17 for heat dissipation of the matching circuit.
  • the third layer is the intermediate dielectric layer 6 .
  • different processing techniques for the first heat conduction channel 13 are selected.
  • the fourth layer is the lower copper clad layer 7, and the lower surface circuit is arranged on this layer.
  • the traditional lower copper clad layer 7 is a single-layer copper film, and its thickness and strength are not enough.
  • the present invention adds an electroplated copper layer to increase the lower copper clad layer.
  • the thickness of 7 has enhanced the intensity of product of the present invention.
  • the lower surface circuit is an input and output transmission circuit and a ground plane circuit.
  • the fifth layer is the high thermal conductivity adhesive layer 15 , since the double-sided copper-clad laminate and the single-sided copper-clad laminate are bonded by high thermal conductivity epoxy resin, when the high thermal conductivity epoxy resin is cured, the high thermal conductivity adhesive layer 15 is formed.
  • the sixth layer is the pin dielectric layer 11, which uses FR-4 with a TG value of 180-210°C or high-frequency hydrocarbon materials with a low thermal expansion coefficient.
  • the low thermal expansion coefficient means that the range of 30-260°C is less than 45ppm/°C.
  • High frequency refers to the frequency range of DC-10GHz.
  • the thickness of the dielectric layer is 0.1mm-0.168mm.
  • the seventh layer is the pin copper clad layer 12 , on which the circuit on the lower surface of the pin is arranged, and the circuit on the lower surface of the pin constitutes a grounding pin and a signal transmission pin.
  • the manufacture technological process of product of the present invention is as follows:
  • the copper clad layer on one side of the double-sided copper clad laminate is electroplated with thick copper to form a thick copper layer, and then the lower surface circuit pattern is made on the thick copper layer;
  • a through hole is opened at the main installation position 16, and according to the thickness of the intermediate dielectric layer 6, the corresponding processing method is selected for filling to form the first heat conduction channel 13; the through hole only runs through the double-sided copper clad laminate The upper clad copper layer 5 and the intermediate dielectric layer 6;
  • Grooving of single-sided copper-clad laminates is mainly to open the middle card slot, which is used for assembly and welding of the lower metal shell 19, and is slotted to the thick copper layer of the lower surface circuit of the double-sided copper-clad laminate;
  • solder resist ink layer 10 The upper surface circuit is coated with solder resist ink to form a solder resist ink layer 10;
  • the substrate is slit to the required dimensions
  • Embodiment 3 see Fig. 11-Fig. 14; use the substrate mechanism and processing method of the present invention to manufacture a 758-803MHz lumped parameter isolator. , Strontium permanent magnetism 9, the circuit substrate structure of the present invention, the lower metal shell 19, the central conductor module, and the capacitive resistance element are installed on the circuit substrate structure. And the electrical performance simulation of this product is carried out, and the simulation results are shown in Figure 12, Figure 13, and Figure 14.
  • the three figures are port standing wave electrical performance, isolation performance simulation and loss simulation.
  • the simulation results show that the standing waves S11 and S22 of the device in the 758-803MHz band are both below -14dB, the loss S21 is 0.44-0.71dB, and the isolation at S12 is below -17dB.
  • the measured data of the device shows that the port standing wave S11 and S22 are at worst in the band -14dB, the loss S21 is 0.95-1dB, and the isolation S12 is below -10dB, which is equivalent to the electrical performance index of the device made by the traditional circuit substrate.
  • the present invention mainly solves the problems of abnormally increased loss and circuit substrates not being able to withstand power when the device is subjected to power testing at high temperature.
  • Devices made of traditional circuit substrates experience an abnormal increase in device loss when passing through a 10W continuous wave at room temperature, which is 1-2dB higher than the loss under small signals.
  • the device passes through a 10W continuous wave, and the device is burnt; when the device is transferred to a 125°C environment through a 10W continuous wave at normal temperature, there is a loss jump, and the output power and input power are changed from 2-3dB The difference jumps to 3-4dB. Since the device passes continuous wave power of 10W at 125°C for a long period of time in the actual use environment, the loss of traditional PCB board devices increases abnormally under high temperature and high power, which cannot meet the use requirements.
  • the device of the invention can withstand higher continuous wave passing power at 125°C, meets the use requirements of the device, and can increase the withstand power of the device.
  • the specific results are as follows:
  • the loss under power when the device passes through 10W continuous wave at room temperature is 0.5-0.6dB higher than the loss under signal;
  • the power loss under continuous wave is 0.3-0.5dB higher than the power loss under normal temperature environment; there is no sudden jump in loss when the device power is transferred from normal temperature environment to high temperature environment; the device can withstand 10W at 125°C for a long time continuous wave power, the circuit board does not burn.
  • the device When 25 first heat conduction channels 13 are set at the main installation position 16 of the device, the device can withstand a continuous wave passing power of 15W at 125°C, which increases the loss by 1-1.5dB compared with the small signal at normal temperature; and the circuit substrate has no Burnt condition.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

La présente invention concerne une structure de substrat de circuit à conduction thermique élevée destinée à être utilisée dans un dispositif magnétique non réciproque à paramètre localisé de carte de circuit imprimé, comprenant un stratifié cuivré double face et un stratifié cuivré simple face liés l'un à l'autre. Le stratifié cuivré double face comprend une couche cuivrée supérieure (5), une couche diélectrique intermédiaire (6) et une couche cuivrée inférieure (7) disposées de manière séquentielle de haut en bas ; la couche cuivrée supérieure (5) est pourvue d'un circuit de surface supérieur ; le circuit de surface supérieur est utilisé pour former une position d'installation primaire (16) destinée à l'installation d'un module conducteur central (8) et une position d'installation secondaire (17) destinée à l'installation d'un circuit d'adaptation ; la position d'installation primaire (16) est pourvue d'un premier canal de conduction thermique (13), la position d'installation secondaire (17) est pourvue d'un second canal de conduction thermique (14), et le procédé utilisé pour traiter le premier canal de conduction thermique (13) dépend de l'épaisseur de la couche diélectrique intermédiaire (6) ; et la couche cuivrée inférieure (7) est épaissie, améliorant ainsi la tolérance à la puissance d'alimentation du dispositif, de telle sorte que celui-ci peut supporter une puissance d'alimentation en onde continue de 5 à 15 W dans un environnement de 125℃, et que l'augmentation de la perte du dispositif magnétique non réciproque à paramètre localisé de la carte de circuit imprimé à une température élevée et à une puissance élevée sous basse fréquence est relativement faible, c'est-à-dire entre 0,5 dB et 1,5 dB.
PCT/CN2022/079421 2021-08-17 2022-03-04 Structure de substrat de circuit à conduction thermique élevée destinée à être utilisée dans un dispositif magnétique non réciproque à paramètre localisé de carte de circuit imprimé WO2023019915A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110942562.8A CN113395826B (zh) 2021-08-17 2021-08-17 Pcb板集总参数非互易磁性器件用高导热电路基板结构
CN202110942562.8 2021-08-17

Publications (1)

Publication Number Publication Date
WO2023019915A1 true WO2023019915A1 (fr) 2023-02-23

Family

ID=77622682

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/079421 WO2023019915A1 (fr) 2021-08-17 2022-03-04 Structure de substrat de circuit à conduction thermique élevée destinée à être utilisée dans un dispositif magnétique non réciproque à paramètre localisé de carte de circuit imprimé

Country Status (3)

Country Link
KR (1) KR20230026268A (fr)
CN (1) CN113395826B (fr)
WO (1) WO2023019915A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113395826B (zh) * 2021-08-17 2022-01-21 中国电子科技集团公司第九研究所 Pcb板集总参数非互易磁性器件用高导热电路基板结构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120077449A1 (en) * 2010-09-29 2012-03-29 Panasonic Corporation Radio frequency power amplifier
US9609741B1 (en) * 2015-09-24 2017-03-28 Canon Kabushiki Kaisha Printed circuit board and electronic apparatus
CN106961786A (zh) * 2017-05-19 2017-07-18 珠海英搏尔电气股份有限公司 一种pcb散热组件、pcb电路器件及其散热和制造方法
CN110677978A (zh) * 2019-09-11 2020-01-10 珠海精路电子有限公司 一种印制电路板及其制作方法
CN212162047U (zh) * 2020-07-15 2020-12-15 中国电子科技集团公司第九研究所 一种基于介质板互通技术构建的集总参数磁性器件
CN113395826A (zh) * 2021-08-17 2021-09-14 中国电子科技集团公司第九研究所 Pcb板集总参数非互易磁性器件用高导热电路基板结构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7543376B2 (en) * 2004-10-20 2009-06-09 Panasonic Corporation Manufacturing method of flexible printed wiring board
CN101841974A (zh) * 2010-05-12 2010-09-22 珠海市荣盈电子科技有限公司 电镀法制作高导热性电路板的方法及高导热性电路板
CN102026496A (zh) * 2010-12-24 2011-04-20 乐健线路板（珠海）有限公司 带有绝缘微散热器的印刷电路板的制备方法
CN102354790B (zh) * 2011-10-25 2014-04-09 电子科技大学 高度小型化的基片集成波导谐振器
CN203198324U (zh) * 2013-01-24 2013-09-18 广东生益科技股份有限公司 一种覆铜板及其印制电路板
CN110300489A (zh) * 2018-03-24 2019-10-01 铜陵国展电子有限公司 一种导热双层电路板及其制作方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120077449A1 (en) * 2010-09-29 2012-03-29 Panasonic Corporation Radio frequency power amplifier
US9609741B1 (en) * 2015-09-24 2017-03-28 Canon Kabushiki Kaisha Printed circuit board and electronic apparatus
CN106961786A (zh) * 2017-05-19 2017-07-18 珠海英搏尔电气股份有限公司 一种pcb散热组件、pcb电路器件及其散热和制造方法
CN110677978A (zh) * 2019-09-11 2020-01-10 珠海精路电子有限公司 一种印制电路板及其制作方法
CN212162047U (zh) * 2020-07-15 2020-12-15 中国电子科技集团公司第九研究所 一种基于介质板互通技术构建的集总参数磁性器件
CN113395826A (zh) * 2021-08-17 2021-09-14 中国电子科技集团公司第九研究所 Pcb板集总参数非互易磁性器件用高导热电路基板结构

Also Published As

Publication number Publication date
CN113395826B (zh) 2022-01-21
CN113395826A (zh) 2021-09-14
KR20230026268A (ko) 2023-02-24

Similar Documents

Publication Publication Date Title
RU2141152C1 (ru) Переходное устройство от волновода к электронной схеме, способ минимизации утечки сигналов из перехода, волновод-сигнальный проводник и переходное устройство печатной платы для минимизации утечки сигналов
US7360308B2 (en) Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers
US8094429B2 (en) Multilayer capacitors and methods for making the same
US7339260B2 (en) Wiring board providing impedance matching
EP1923950A1 (fr) Ensemble microondes compatible SMT avec interface de guide d'ondes
US20120292085A1 (en) Flexible printed circuit and method of manufacturing the same
CN113271709B (zh) 一种金属芯板的多层印制电路叠层结构及封装结构
WO2010096456A1 (fr) Structure d'isolation électrique pour des conducteurs dans un substrat
CN113347780B (zh) 一种多层电路板构成的鳍线结构
CN114256575B (zh) 一种多通道小型化微波组件及其金属基复合基板结构
CN113079623B (zh) 一种w波段毫米波芯片多层介质基板
WO2023019915A1 (fr) Structure de substrat de circuit à conduction thermique élevée destinée à être utilisée dans un dispositif magnétique non réciproque à paramètre localisé de carte de circuit imprimé
CN106376172A (zh) 一种混压金属基微波印制板及设计方法
GB2124035A (en) Printed circuit boards
US20050082087A1 (en) Dielectric structure for printed circuit board traces
CN106876851A (zh) 一种射频带状传输线
WO2023016024A1 (fr) Carte de circuit imprimé, structure d'antenne et dispositif électronique
US6586687B2 (en) Printed wiring board with high density inner layer structure
JP2009060092A (ja) 導電性フレームおよびシールドされた高周波回路モジュール
JP4018999B2 (ja) 配線基板
CN112533349B (zh) 电路板及其制作方法
JP2004265970A (ja) 配線基板
JP4031999B2 (ja) 配線基板
KR100850759B1 (ko) 인쇄회로기판 및 그 제조방법
CN219780494U (zh) 一种应用于毫米波电路的宽带多层pcb过孔结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22857236

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22857236

Country of ref document: EP

Kind code of ref document: A1