WO2023002570A1 - Carte de câblage et procédé pour sa fabrication - Google Patents

Carte de câblage et procédé pour sa fabrication Download PDF

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Publication number
WO2023002570A1
WO2023002570A1 PCT/JP2021/027165 JP2021027165W WO2023002570A1 WO 2023002570 A1 WO2023002570 A1 WO 2023002570A1 JP 2021027165 W JP2021027165 W JP 2021027165W WO 2023002570 A1 WO2023002570 A1 WO 2023002570A1
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WO
WIPO (PCT)
Prior art keywords
base material
conductive pattern
wiring board
region
shaping
Prior art date
Application number
PCT/JP2021/027165
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English (en)
Japanese (ja)
Inventor
崇 中島
稔 飯塚
英明 横山
雄一 老田
清 藤巻
Original Assignee
エレファンテック株式会社
タカハタプレシジョン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by エレファンテック株式会社, タカハタプレシジョン株式会社 filed Critical エレファンテック株式会社
Priority to JP2021569472A priority Critical patent/JP7026367B1/ja
Priority to PCT/JP2021/027165 priority patent/WO2023002570A1/fr
Publication of WO2023002570A1 publication Critical patent/WO2023002570A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to a wiring board and its manufacturing method.
  • a flexible conductive base material having a conductive layer is arranged in series and/or in parallel along the direction of current flow of the conductive layer, and has cross-linked necks that are pierced through by slits and/or holes, respectively. and at least a part of the conductive base material is sealed and covered without being exposed by a rubber elastic sheet piece, and at least one of the crosslinked neck rows in the middle of the row consisting of a plurality of crosslinked necks
  • the width of one bridge neck is shorter than the width of the bridge neck at the end of the row, and the insulating rubber elastic sheet piece has a through slit and/or a through hole smaller than the punch hole and the punch slit in accordance with the punched peripheral edge part.
  • the conductive base material has gaps between the plurality of punched peripheral edge portions, respectively, and the rubber elastic sheet piece has cut slits smaller than the gaps corresponding to the punched gaps.
  • Patent Document 1 a stretchable elastic sheet having cut holes penetrating therethrough is known.
  • the present invention provides a wiring board and a method of manufacturing the same that can suppress disconnection associated with shaping a circuit pattern formed on a deformable base material into a three-dimensional shape.
  • the wiring board according to claim 1 A wiring board in which a conductive pattern is arranged on one surface of a base material, Compared to the first region where the conductive pattern is arranged in the region where the base material is subjected to shaping into a three-dimensional shape, the second region where the conductive pattern is not arranged is the above in the shaping.
  • the elongation rate of the base material is large, It is characterized by
  • the invention according to claim 2 is the wiring board according to claim 1, In the second region of the base material, a cut is formed in the thickness direction of the base material, It is characterized by
  • the invention according to claim 3 is the wiring board according to claim 2,
  • the cut has a longitudinal direction in a direction intersecting with the direction in which the conductive pattern extends, It is characterized by
  • the invention according to claim 4 is the wiring board according to claim 2 or 3,
  • the cut is formed with a depth that penetrates the base material in the thickness direction, It is characterized by
  • the invention according to claim 5 is the wiring board according to claim 2 or 3,
  • the cut is formed to a depth that does not penetrate the base material in the thickness direction, It is characterized by
  • the invention according to claim 6 is the wiring board according to any one of claims 2 to 5,
  • the conductive pattern is arranged in the first region so as to extend in a direction intersecting with the stretching direction of the base material due to shaping, and the cut is in the second region close to the conductive pattern. formed, It is characterized by
  • the invention according to claim 7 is the wiring board according to any one of claims 2 to 5,
  • the conductive pattern is bent in the first region in a direction intersecting the elongation direction of the base material due to shaping and arranged in a meandering shape, and the cut is bent in the meandering shape in the second region. At least one is formed between the conductive patterns that It is characterized by
  • the invention according to claim 8 is the wiring board according to any one of claims 1 to 7, wherein the substrate is a deformable film made of a synthetic resin material; It is characterized by
  • the invention according to claim 9 is the wiring board according to any one of claims 1 to 8,
  • the conductive pattern is a metal plating layer made of at least one metal selected from Cu, Ni, Ag, and Au. It is characterized by
  • the invention according to claim 10 is the wiring board according to any one of claims 1 to 9, Further comprising a resin layer covering at least one surface of the base material, It is characterized by
  • the wiring board manufacturing method comprises: A conductive pattern is arranged on one surface of a base material, and a first area where the conductive pattern is arranged in the area where the base material is formed into a three-dimensional shape and the conductive pattern is not arranged.
  • the invention according to claim 12 is the wiring board manufacturing method according to claim 11, After the shaping step, placing the shaped base material in a mold and injection molding a resin layer covering at least one surface of the base material. It is characterized by
  • the invention according to claim 13 is the wiring board manufacturing method according to claim 11 or 12, the notch is formed in the substrate using a laser, die cutting, or blade; It is characterized by
  • the cut is opened and extended, and the extension of the area where the conductive pattern is arranged is reduced.
  • air leakage can be suppressed when the substrate is vacuum-sucked.
  • the seventh aspect of the invention it is possible to suppress disconnection accompanying the shaping of the conductive pattern into a three-dimensional shape.
  • the base material can be shaped into a three-dimensional shape.
  • the base material on which the conductive pattern is arranged can be shaped into a three-dimensional shape.
  • the wiring board can be formed into a three-dimensional shape.
  • disconnection of the conductive pattern formed on the deformable base material can be suppressed.
  • the wiring board can have a three-dimensional shape.
  • the cut can be formed with high accuracy.
  • FIG. 1A is a schematic cross-sectional view showing an example of a wiring board according to this embodiment
  • FIG. 1B is a schematic plan view showing an example of the wiring board.
  • FIG. 2A is a schematic plan view for explaining the relationship between the cut S formed in the base material 2 and the conductive pattern 3
  • FIG. 2B is a cut when the base material 2 in which the cut S is formed is shaped into a three-dimensional shape. It is a figure explaining the opening of S.
  • FIG. FIG. 3A is a cross-sectional schematic diagram showing a cut formed with a depth that penetrates the base material in the thickness direction
  • FIG. 3B is a cross-sectional schematic diagram that shows a cut formed with a depth that does not penetrate the base material in the thickness direction.
  • FIG. 10 is a diagram showing a resin filling step of injection-molding a resin layer on a shaped base material
  • FIG. 1A is a schematic cross-sectional view showing an example of the wiring board 1 according to the present embodiment
  • FIG. 1B is a schematic plan view showing an example of the wiring board 1
  • FIG. 2B is a diagram for explaining the opening of the cut S when the base material 2 in which the cut S is formed is shaped into a three-dimensional shape
  • FIG. 3A is a cross-sectional schematic diagram showing a cut formed with a depth that penetrates the base material in the thickness direction
  • FIG. 3B is a cross-sectional schematic diagram that shows a cut formed with a depth that does not penetrate the base material in the thickness direction.
  • the wiring board 1 includes a substrate 2, a conductive pattern 3 arranged as wiring on one surface 2a of the substrate 2, an electronic component 4 electrically connected by the conductive pattern 3, and a substrate. and a resin layer 5 covering the other surface 2b of the material 2 opposite to the one surface 2a.
  • the base material 2 in this embodiment is a deformable insulating film-like base material made of a synthetic resin material.
  • a "deformable substrate” is one that can be deformed after placement of the conductive pattern 3, i.e. from a substantially flat two-dimensional shape to a substantially three-dimensional shape by thermoforming, vacuum forming or air pressure forming. It means a substrate that can be deformed into a shape.
  • Materials for the base material 2 include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyamides such as nylon 6-10 and nylon 46, polyetheretherketone (PEEK), ABS, PMMA, and polyvinyl chloride. and other thermoplastic resins.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PEEK polyetheretherketone
  • ABS polymethyl methacrylate
  • PMMA polyvinyl chloride
  • polyvinyl chloride polyvinyl chloride
  • polyester is more preferable, and among these, polyethylene terephthalate (PET) is most preferable because it has a good balance of economy, electrical insulation, chemical resistance, and the like.
  • a surface treatment to one surface 2a of the base material 2 in order to evenly apply catalyst ink such as metal nanoparticles.
  • catalyst ink such as metal nanoparticles.
  • the surface treatment for example, corona treatment, plasma treatment, solvent treatment, and primer treatment can be used.
  • the deformable base material 2 has a first region R1 (indicated by a dashed line in FIG. 2A) in which the conductive pattern 3 of the region W to be shaped into a three-dimensional shape is arranged, and the conductive pattern 3
  • the elongation rate of the base material 2 during shaping is different in the second regions R2 (indicated by a two-dot chain line in FIG. 2A) that are not arranged.
  • the second region R2 where the conductive pattern 3 is not arranged has a larger elongation rate of the base material 2 during shaping.
  • the cut S is formed in the thickness direction of the base material 2 in the second region R2.
  • the conductive pattern 3A (indicated by a broken line in FIG. 2A) extends in the direction of elongation of the base material 2 due to shaping ( 2) are bent in a direction (indicated by Y in FIG. 2) to form a meandering shape.
  • the conductive pattern 3A By forming the conductive pattern 3A into a meandering shape, it is possible to increase the wiring length in the region W where the base material 2 bends, and to reduce the load on the conductive pattern 3A caused by bending.
  • a notch S is formed in the second region R2 between the meandering conductive patterns 3A.
  • the cut S is formed to have a longitudinal direction (direction of arrow Y in FIG. 2) that intersects the direction in which the conductive pattern 3 extends (direction of arrow X in FIG. 2).
  • the cut S is formed with a predetermined depth in the thickness direction of the base material 2 (in the direction of arrow Z in FIG. 3).
  • the predetermined depth depends on the thickness of the base material 2. For example, when the thickness of the base material 2 is thin, as shown in FIG. If it is thick, it may be formed with a depth L2 that does not penetrate, as shown in FIG. 3B.
  • the formed base material 2 is placed on the injection mold K and, for example, vacuum-sucked as described later. air leakage from the notch S can be suppressed when the cavity shape of the mold K for injection molding is to be met.
  • the shape of the cut S in the cut depth direction includes a straight shape, a tapered shape, a wedge shape, and the like, but is not limited to these.
  • the conductive pattern 3B intersects the elongation direction of the base material 2 by shaping (the arrow X direction in FIG. 2A), as shown in FIG. 2A. It may be arranged to extend in the direction of Specifically, the conductive pattern 3B is arranged obliquely with respect to the extension direction of the base material 2 by shaping (the direction of the arrow X in FIG. 2A), thereby increasing the wiring length and by bending the conductive pattern 3B. It is possible to reduce the load on In this case, as shown in FIG. 2A, the cut S is formed so as to have a longitudinal direction in a direction intersecting with the extending direction of the conductive pattern 3B. Further, as shown in FIG.
  • the depth of the cut S is determined according to the thickness of the base material 2. For example, when the thickness of the base material 2 is thin, the cut depth is set to a depth that penetrates the base material 2. If it is thick, it may be formed to a depth that does not penetrate.
  • the number of cuts S to be formed may be adjusted according to the curvature of the shaping applied to the base material 2 . For example, when the curvature of shaping is large, the number may be increased compared to when the curvature is small. Moreover, it is desirable to form the cut S in the vicinity of the conductive pattern 3 . By opening the cut S formed adjacent to the conductive pattern S, the extension of the base material 2 in the portion (first region R1) where the conductive pattern 3 is arranged is reduced, and the conductive pattern 3 is disconnected. is suppressed.
  • the meander-shaped conductive pattern 3A and the conductive pattern 3B obliquely formed with respect to the extension direction of the base material 2 by shaping are arranged, and the conductive patterns 3A and 3B are not arranged.
  • the conductive patterns 3A and 3B are more easily stretched than when they are arranged linearly in the stretching direction of the base material 2, and disconnection due to shaping of the conductive patterns 3A and 3B as wiring is suppressed. can do.
  • the base material 2 is extended by opening the cuts S, thereby reducing the extension of the first region R1 in which the conductive patterns 3A and 3B are arranged, thereby preventing disconnection due to shaping of the conductive patterns 3A and 3B. can be suppressed.
  • the conductive pattern 3 (hereinafter referred to as the conductive pattern 3 when it is not necessary to distinguish between the meander-shaped conductive pattern 3A and the conductive pattern 3B arranged diagonally with respect to the extension direction of the base material) is , a linear conductive pattern 3 arranged in a region where shaping is not performed on the substrate 2, a meandering conductive pattern 3A arranged in a region W where shaping is performed on the substrate 2, and an oblique shape of the conductive pattern 3B.
  • the meandering conductive pattern 3A is formed so as to meander repeatedly in a direction intersecting with the direction in which the linear conductive pattern 3 extends, and has a longer wiring length.
  • the oblique conductive pattern 3B is obliquely formed in a direction crossing the extending direction of the linear conductive pattern 3, and has a long wiring length.
  • the meander-shaped conductive pattern 3A and the oblique-shaped conductive pattern 3B have a longer wiring length than the linear shape, so that the conductive pattern 3 tends to stretch when the base material 2 is shaped. Disconnection of the conductive pattern 3 is suppressed.
  • a base layer (not shown) made of a catalyst such as metal nanoparticles that triggers growth of the metal plating is formed in a predetermined pattern.
  • the predetermined pattern includes a meandering shape.
  • the base layer is formed by applying a catalyst ink such as metal nanoparticles on the substrate 2, followed by drying and baking.
  • the thickness ( ⁇ m) of the underlayer is preferably 0.1 to 20 ⁇ m, more preferably 0.2 to 5 ⁇ m, most preferably 0.5 to 2 ⁇ m. If the underlayer is too thin, the strength of the underlayer may decrease. Also, if the underlayer is too thick, the manufacturing cost may increase because metal nanoparticles are more expensive than ordinary metals.
  • gold, silver, copper, palladium, nickel, etc. are used, and gold, silver, and copper are preferred from the viewpoint of conductivity, and copper, which is cheaper than gold and silver, is most preferred.
  • the particle size (nm) of the catalyst is preferably 1-500 nm, more preferably 10-100 nm. If the particle size is too small, the reactivity of the particles increases, which may adversely affect the storability and stability of the ink. If the particle size is too large, it may become difficult to form a uniform thin film, and the particles of the ink may easily precipitate.
  • the conductive pattern 3 is formed on the underlying layer by electroplating or electroless plating.
  • the plating metal copper, nickel, tin, silver, gold, etc. can be used, but copper is most preferable from the viewpoint of extensibility, conductivity and cost.
  • the conductive pattern 3 is formed in a meandering shape and an oblique shape in the region W where the substrate 2 is shaped.
  • the thickness ( ⁇ m) of the plating layer is preferably 0.03-100 ⁇ m, more preferably 1-35 ⁇ m, and most preferably 3-18 ⁇ m. If the plated layer is too thin, the mechanical strength may be insufficient, and sufficient electrical conductivity may not be obtained for practical use. If the plating layer is too thick, the time required for plating will be long, and there is a risk that the manufacturing cost will increase.
  • a plurality of electronic components 4 may be attached to the conductive pattern 3 .
  • the electronic component 4 includes a control circuit, strain, resistance, capacitance, contact sensing such as TIR, light detection component, tactile component or vibration component such as piezoelectric actuator or vibration motor, light emission such as LED, OLED, LCD, etc. devices, sound generators such as microphones and speakers, device operating components such as memory chips, programmable logic chips and CPUs, digital signal processors (DSPs), ALS devices, PS devices, processing devices, MEMS, and the like.
  • DSPs digital signal processors
  • the conductive pattern 3 may be formed with a connector contact 7 at one end.
  • the connector contact 7 is formed on the substrate 2 as a part of the conductive pattern 3 so that one end 2c of the substrate 2 protrudes outward from the end of the resin layer 5 .
  • a plate member (not shown) is arranged on the other surface 2b side of the substrate 2 on which the connector contacts 7 are formed to form a connector for electrically connecting to an external device provided outside the wiring board 1.
  • An insulating layer 6 integrally covering the substrate 2 and the conductive pattern 3 may be provided on the surface 2a of the substrate 2 on which the conductive pattern 3 is arranged (shown in FIG. 1A). However, the insulating layer 6 is not provided on the joint portion of the conductive pattern 3 with the electronic component 4 .
  • a solder resist is applied to protect the conductive pattern 3 .
  • the solder resist prevents short circuits caused by solder adhering to areas other than joints for electrical connection when electronic components are mounted by soldering. In addition, it maintains insulation between the conductive patterns 3 and protects the conductive patterns 3 from the external environment such as dust, heat, and humidity.
  • the resin layer 5 is formed to cover at least one surface of the substrate 2 via the adhesive layer AD.
  • the adhesive layer AD may be toned to hide the conductive pattern 3 invisibly from the outside.
  • the resin layer 5 is formed by making the adhesive layer AD light-transmitting and then using a transparent resin material as the resin material. It can be visible.
  • the resin layer 5 is formed so as to cover the other surface 2b opposite to the surface 2a on which the conductive pattern 3 is arranged. After forming so as to cover, the electronic component 4 may be mounted later.
  • the resin layer 5 may be formed so as to cover both surfaces of the base material 2 depending on the function of the wiring board 1 .
  • the resin layer 5 is a thermoplastic resin made of a thermoplastic resin material that can be injection molded. Specifically, polycarbonate (PC), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), modified polyphenylene ether (m -PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), or mixtures thereof.
  • a plastic resin can be used.
  • FIG. 4 is a flow chart showing an example of a schematic procedure of the wiring board 1 manufacturing method
  • FIG. 6 is an explanatory diagram for explaining each step of hot press molding for shaping the base material 2 into a three-dimensional shape
  • FIG. It is a figure which shows a filling process.
  • the wiring board 1 is manufactured through a preparation step S11 for the base material 2, a wiring plating step S12 for forming the conductive pattern 3 on the base material 2, and a three-dimensional shape on the base material 2.
  • a shaping step S14 for shaping the base material 2, and one surface 2a of the base material 2 on which the conductive pattern 3 is formed by placing the shaped base material 2 on the injection mold K. is manufactured through a resin filling step S15 for injection molding a resin layer 5 covering the other surface 2b on the opposite side.
  • Base material preparation step S11 Metal plating is first performed on the base material 2 in order to dispose the conductive pattern 3 on the substantially flat film-like base material 2 formed in a predetermined shape and size.
  • a base layer made of catalyst particles such as metal nanoparticles that trigger growth is formed in a predetermined pattern including a meandering shape.
  • the substrate 2 is preferably subjected to surface treatment such as corona treatment, plasma treatment, solvent treatment, and primer treatment.
  • Methods for applying a catalyst ink made of catalyst particles such as metal nanoparticles on the substrate 2 include an inkjet printing method, a silk screen printing method, a gravure printing method, an offset printing method, a flexographic printing method, a roller coater method, and a brush coating method.
  • Methods include spray method, knife jet coater method, pad printing method, gravure offset printing method, die coater method, bar coater method, spin coater method, comma coater method, impregnation coater method, dispenser method, and metal mask method.
  • an inkjet printing method is used.
  • the solvent is volatilized to leave only the metal nanoparticles.
  • the solvent is then removed (drying) and the metal nanoparticles are sintered (firing).
  • the firing temperature is preferably 100°C to 300°C, more preferably 150°C to 200°C. If the sintering temperature is too low, the sintering of the metal nanoparticles will be insufficient, and components other than the metal nanoparticles will remain, which may result in poor adhesion. Also, if the firing temperature is too high, the base material 2 may be deteriorated or distorted.
  • Electroplating or electroless plating is applied to the underlying layer formed on the base material 2 to deposit plating metal on the surface and inside of the underlying layer, thereby arranging the conductive pattern 3 (see FIG. 5A).
  • the plating method is the same as a known plating solution and plating treatment, specifically electroless copper plating and electrolytic copper plating.
  • a cut S is formed in the thickness direction of the substrate 2 in the second region R2 where the conductive pattern 3 is not arranged in the region W where the shaping of the substrate 2 where the conductive pattern 3 is arranged is performed ( (see Figure 5B).
  • a meander-shaped conductive pattern 3A is formed on the base material 2 so as to repeat meandering in a direction intersecting with the extending direction of the linear conductive pattern 3 in the shaped and bent region W,
  • a cut S is formed in the second region R2 between the meandering conductive patterns 3A.
  • a conductive pattern 3B is formed obliquely with respect to the extension direction of the base material 2 due to the shaping, and the conductive pattern 3B extends.
  • a cut S is formed to have a longitudinal direction in a direction transverse to the direction.
  • the incision S is formed with a depth that penetrates depending on the thickness of the base material 2, for example, if the thickness of the base material 2 is thin, using a laser device that irradiates a laser beam, die cutting, or a cutter blade. However, when the thickness of the base material 2 is thick, it is formed to a depth that does not penetrate.
  • shaping step S14 the base material 2 on which the conductive pattern 3 is arranged and the cut S is formed is formed into a three-dimensional shape by a forming means such as hot press forming, vacuum forming, pressure forming, vacuum pressure forming. shape.
  • the mold used for shaping is such that the outer surface of the shaped base material 2 conforms to the shape of the cavity CA of the injection mold K used for injection molding (in-mold molding) in the resin filling step S15 described later. formed to follow.
  • the substrate 2 is placed between the female mold 11 and the male mold 12 as shown in FIG. 6A.
  • the female mold 11 and the male mold 12 are heated to a predetermined temperature capable of softening the base material 2 .
  • FIG. 6B when the female mold 11 and the male mold 12 are clamped with a predetermined pressure, the base material 2 is sandwiched between the core portion 12a of the male mold 12 and the cavity portion 11a of the female mold 11. and shaped.
  • the female mold 11 and the male mold 12 are opened and cooled to obtain the base material 2 shaped into a predetermined three-dimensional shape before trimming. Then, the base material 2 is taken out from the female mold 11 and the male mold 12, and the unnecessary part is trimmed to obtain the base material 2 before the resin layer 5 is formed.
  • the base material 2 shaped in this way is used for injection molding (in-mold molding) in the resin filling step S15, and integrated with the resin layer 5 to form the wiring board 1.
  • the substrate 2 is placed on the other surface 2b opposite to the surface 2a on which the conductive pattern 3 of the substrate 2 which has been shaped into a three-dimensional shape in the shaping step S14 is arranged.
  • a binder ink for forming an adhesive layer AD is applied according to the combination of resin materials for the resin layer 5 (see FIG. 5C).
  • the binder ink contains an adhesive resin, is applied by screen printing, inkjet printing, spray coating, brush coating, or the like, and improves the adhesiveness between the base material 2 and the injection-molded resin layer 5 .
  • the binder ink is applied to the one surface 2a of the base material 2 without providing the insulating layer 6. .
  • the base material 2 that has been shaped into a three-dimensional shape is positioned and set in the injection mold K (see FIG. 5D).
  • the base material 2 which has been formed into a three-dimensional shape, is self-sucked on the surface of the cavity CA and is not displaced. , it may be fixed by sticking it on the surface of the cavity CA with a double-sided tape, vacuum-adhering it, or providing a projection (not shown) on the cavity CA and fitting it into the projection.
  • the base material 2 that has been shaped into a three-dimensional shape in the shaping step S14
  • the springback phenomenon that occurs due to the rigidity of the base material 2 after being removed from the mold is suppressed. Therefore, when it is set in the cavity CA of the injection molding die K, there is also an effect that the gap that tends to occur between the surface of the cavity CA is reduced.
  • the method for manufacturing the wiring board 1 according to the present embodiment, disconnection due to shaping into a three-dimensional shape of the conductive pattern 3 as the circuit pattern formed on the deformable base material 2 can be prevented.
  • the wiring board 1 can be formed into a three-dimensional shape while suppressing the deformation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne une carte de câblage capable de supprimer la déconnexion d'un câblage associé à la mise en forme d'un motif de circuit formé sur un matériau de base déformable en une forme tridimensionnelle, et son procédé de production.　La carte de câblage a un motif conducteur disposé sur une surface d'un matériau de base, dans lequel : parmi des régions du matériau de base qui doivent être façonnées en une forme tridimensionnelle, le matériau de base a un coefficient d'extension supérieur dans une seconde région dans laquelle un motif conducteur n'est pas disposé que dans une première région dans laquelle un motif conducteur est disposé, et dans la seconde région, une fente est formée dans le matériau de base dans la direction de l'épaisseur du matériau de base.
PCT/JP2021/027165 2021-07-20 2021-07-20 Carte de câblage et procédé pour sa fabrication WO2023002570A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021569472A JP7026367B1 (ja) 2021-07-20 2021-07-20 配線基板及びその製造方法
PCT/JP2021/027165 WO2023002570A1 (fr) 2021-07-20 2021-07-20 Carte de câblage et procédé pour sa fabrication

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Application Number Priority Date Filing Date Title
PCT/JP2021/027165 WO2023002570A1 (fr) 2021-07-20 2021-07-20 Carte de câblage et procédé pour sa fabrication

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WO2023002570A1 true WO2023002570A1 (fr) 2023-01-26

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Citations (2)

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Publication number Priority date Publication date Assignee Title
US20150065840A1 (en) * 2013-08-30 2015-03-05 Thalmic Labs Inc. Systems, articles, and methods for stretchable printed circuit boards
JP2019075491A (ja) * 2017-10-18 2019-05-16 株式会社フジクラ 伸縮性基板

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DE4412278A1 (de) * 1994-04-09 1995-10-12 Bosch Gmbh Robert Starre und flexible Bereiche aufweisende Leiterplatte
JP2016021555A (ja) * 2014-05-27 2016-02-04 キヤノン・コンポーネンツ株式会社 フレキシブルプリント配線板およびフレキシブル回路板
EP3294046B1 (fr) * 2016-09-09 2023-08-02 TE Connectivity Germany GmbH Module d'éclairage à semi-conducteur et son procédé de fabrication
JP6554154B2 (ja) * 2017-10-27 2019-07-31 株式会社スクウェア・エニックス ビデオゲーム処理プログラム、及び、ビデオゲーム処理システム
EP3731604A4 (fr) * 2017-12-22 2021-08-04 ASAHI FR R&D Co., Ltd. Matériau de câblage électroconducteur extensible, et module de câblage électroconducteur extensible le comprenant

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US20150065840A1 (en) * 2013-08-30 2015-03-05 Thalmic Labs Inc. Systems, articles, and methods for stretchable printed circuit boards
JP2019075491A (ja) * 2017-10-18 2019-05-16 株式会社フジクラ 伸縮性基板

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