WO2021090785A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2021090785A1
WO2021090785A1 PCT/JP2020/040995 JP2020040995W WO2021090785A1 WO 2021090785 A1 WO2021090785 A1 WO 2021090785A1 JP 2020040995 W JP2020040995 W JP 2020040995W WO 2021090785 A1 WO2021090785 A1 WO 2021090785A1
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WIPO (PCT)
Prior art keywords
wiring pattern
metal wiring
base material
resin
electronic device
Prior art date
Application number
PCT/JP2020/040995
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English (en)
Japanese (ja)
Inventor
雅明 杉本
将吏 登口
横山　英明
雄一 老田
Original Assignee
エレファンテック株式会社
タカハタプレシジョン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by エレファンテック株式会社, タカハタプレシジョン株式会社 filed Critical エレファンテック株式会社
Publication of WO2021090785A1 publication Critical patent/WO2021090785A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present invention relates to an electronic device.
  • An electronic circuit that performs a predetermined process, a substrate on which the electronic circuit is arranged, and a pad provided on the substrate by bending one end thereof are joined and electrically connected to the electronic circuit via the pad.
  • the pin header used for positioning in the secondary molding with the other end serving as the connector terminal and one end of the electronic circuit, substrate and pin header are resin-sealed so that the connector terminal is exposed.
  • a module including the above-mentioned primary molded body is known (Patent Document 1).
  • a method for manufacturing electromechanical structures in relation to the process of making multiple conductors and / or multiple graphics on a substantially flat film and the desired three-dimensional shape of the film As an inserter in a step of mounting a plurality of electronic elements on a film, a step of forming a film accommodating an electronic element into a substantially three-dimensional shape, and an injection molding process by substantially molding on the film.
  • a method of forming an electromechanical structure by attaching a preferable layer of a material to the surface of the film which comprises a step of using a three-dimensional film (Patent Document 2).
  • the present invention suppresses melting due to heat and pressure of a joining means for conductively joining an electronic element to a metal wiring pattern formed on a deformable base material, and holds the electronic element on the metal wiring pattern with high positional accuracy and electricity.
  • a joining means for conductively joining an electronic element to a metal wiring pattern formed on a deformable base material and holds the electronic element on the metal wiring pattern with high positional accuracy and electricity.
  • an electronic device capable of maintaining a target bond.
  • the electronic device In order to solve the above problems, the electronic device according to claim 1 is used.
  • Deformable base material and The metal wiring pattern arranged on the base material and An electronic element bonded by a bonding means containing a heat-meltable conductive component to the metal wiring pattern, A resin layer covering one surface on which the metal wiring pattern of the base material is arranged, and A resin coating layer having a softening point higher than that of the resin layer and covering a part or all of the joining means so as to be separated from the resin layer is provided. It is characterized by that.
  • the electronic device In order to solve the above problems, the electronic device according to claim 2 is used.
  • Deformable base material and The metal wiring pattern arranged on the base material and An electronic element bonded by a bonding means containing a heat-meltable conductive component to the metal wiring pattern, A resin layer covering one surface on which the metal wiring pattern of the base material is arranged, and A resin coating layer that thermally and pressureally separates a part or all of the bonding means from the resin layer is provided. It is characterized by that.
  • the electronic device In order to solve the above problems, the electronic device according to claim 3 is used.
  • Deformable base material and The metal wiring pattern arranged on the base material and An electronic element bonded by a bonding means containing a heat-meltable conductive component to the metal wiring pattern, A resin layer covering one surface on which the metal wiring pattern of the base material is arranged, and A part or all of the joining means and a resin coating layer for thermally and pressure-separating the electronic element from the resin layer It is characterized by that.
  • the invention according to claim 4 is the electronic device according to any one of claims 1 to 3.
  • the metal wiring pattern is a metal plating layer made of at least one metal selected from copper (Cu), nickel (Ni), silver (Ag), and gold (Au). It is characterized by that.
  • the invention according to claim 5 is the electronic device according to any one of claims 1 to 3.
  • the joining means is a low-temperature solder having a melting temperature lower than the softening point of the base material. It is characterized by that.
  • the invention according to claim 6 is the electronic device according to any one of claims 1 to 3.
  • the resin layer is made of a thermoplastic material
  • the resin coating layer is made of a thermosetting resin material, a two-component curable resin material, a photocurable resin material, or a moisture-curable resin material. It is characterized by that.
  • the invention according to claim 7 is the electronic device according to any one of claims 1 to 6.
  • the surface of the base material opposite to the one on which the metal wiring pattern is arranged is covered with a thermoplastic resin layer. It is characterized by that.
  • the invention according to claim 8 is the electronic device according to any one of claims 1 to 7.
  • the electronic element includes an external connection terminal for electrically connecting an element electrically connected to the metal wiring pattern and an external element provided outside the resin layer, and at least the external connection terminal of the external connection terminal.
  • the terminal surface which is the surface, is exposed from the resin layer. It is characterized by that.
  • the electronic element is conductive on the metal wiring pattern formed on the deformable base material as compared with the configuration in which the resin coating layer covering a part or all of the joining means is not provided. It is possible to suppress leaching due to heat and pressure of the joining means to be joined.
  • the electronic element is placed on the metal wiring pattern by suppressing melting due to heat and pressure of the joining means for conductively joining the electronic element to the metal wiring pattern formed on the deformable base material. It is possible to maintain the position accuracy and maintain the electrical connection.
  • the heat and pressure of the molten resin layer are transmitted to the electronic element as compared with the configuration in which the bonding means and the electronic element are not provided with the resin coating layer that thermally separates the electronic element from the resin layer. Can be avoided.
  • the metal wiring pattern can be arranged along the three-dimensional shape of the deformed base material.
  • the electronic element can be conductively bonded to the metal wiring pattern arranged on the deformable base material.
  • softening of the resin coating layer can be suppressed when the high temperature molten resin comes into contact with the resin coating layer.
  • the strength of the electronic device can be improved.
  • FIG. 6A is a schematic partial plan view showing the connection between the metal wiring pattern and the pin header in the embodiment
  • FIG. 6B is a schematic cross-sectional view showing the connection between the metal wiring pattern and the pin header
  • FIG. 6C is a metal wiring pattern filled with a resin layer.
  • FIG. 6A is a schematic partial plan view showing the connection between the metal wiring pattern and the pin header in the embodiment
  • FIG. 6B is a schematic cross-sectional view showing the connection between the metal wiring pattern and the pin header
  • FIG. 6C is a metal wiring pattern filled with a resin layer.
  • FIG. 6C is a partial cross-sectional schematic diagram which shows the bonding state of a pin header. It is a figure which shows the lighting confirmation result of the LED in the electronic device which concerns on Example.
  • FIG. 1 is a schematic plan view showing an example of the electronic device according to the present embodiment with the resin layer not shown
  • FIG. 2 is a partial cross-sectional schematic showing an example of the electronic device according to the present embodiment
  • FIG. 3 is a schematic partial cross-sectional view showing an example of another aspect of the electronic device according to the present embodiment.
  • the electronic device 1 is formed into a wiring pattern by applying an insulating base material 2 made of a thermoplastic resin and a conductive ink containing metal nanoparticles on the base material 2.
  • a metal wiring pattern 3 formed by plating on the formed conductive layer 3a, a pin header 5 as an example of an electronic element bonded with low-temperature solder 4 as an example of bonding means on the metal wiring pattern 3, and a pin header 5. It is configured to include a resin coating layer 6 that covers a part or all of the low temperature solder 4, and a resin layer 7 that covers one surface 2a on which the metal wiring pattern 3 of the base material 2 is arranged.
  • the insulating base material 2 used in the present embodiment is not particularly limited to a film-like base material, but will be described below as a film-like base material.
  • the material of the base material 2 is an insulating and deformable thermoplastic resin, and when the melting point Tm is present, the temperature is preferably 150 ° C. or higher, more preferably 200 ° C. or higher.
  • the range of the glass transition point Tg of the base material 2 is preferably 20 ° C. to 250 ° C., more preferably 50 ° C. to 200 ° C., and most preferably 70 ° C. to 150 ° C. If the glass transition point Tg is too low, the strain of the base material 2 may increase when the metal nanoparticles are sintered.
  • the material of the base material 2 is not particularly limited as long as it meets the conditions of the melting point Tm and the glass transition point Tg as described above, but specifically, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) (PEN).
  • polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) (PEN).
  • PA polyamide
  • PA polyamide
  • PE polyetheretherketone
  • ABS polyMMA
  • polyvinyl chloride polyvinyl chloride
  • PET polyethylene terephthalate
  • PET polyethylene terephthalate
  • the thickness of the base material 2 is preferably 5 ⁇ m to 3 mm, more preferably 12 ⁇ m to 1 mm, and most preferably 50 ⁇ m to 200 ⁇ m. If the thickness of the base material 2 is too thin, the strength may be insufficient and the distortion of the base material 2 may increase during the plating process of the metal wiring pattern 3. This thickness is a condition when the base material 2 is a film-like base material, and the insulating base material 2 to which the present invention is applied is not limited to the film-like base material.
  • the surface treatment for example, corona treatment, plasma treatment, solvent treatment, and primer treatment can be used.
  • the film-like base material 2 made of such a deformable thermoplastic resin has a substantially flat two-dimensional shape by thermoforming, vacuum forming, or pressure molding, depending on the required usage of the electronic device 1. Is formed into a three-dimensional shape.
  • the conductive layer 3a composed of metal nanoparticles is first applied.
  • the thickness of the conductive layer 3a is preferably 100 nm to 20 ⁇ m, more preferably 200 nm to 5 ⁇ m, and most preferably 500 nm to 2 ⁇ m. If the conductive layer 3a is too thin, the strength of the conductive layer 3a may decrease. Further, if the conductive layer 3a is too thick, the metal nanoparticles are more expensive than ordinary metals, which may increase the manufacturing cost.
  • gold (Au), silver (Ag), copper (Cu), palladium (Pd), nickel (Ni) and the like are used, and gold (Au) and silver (Ag) are used from the viewpoint of conductivity.
  • Copper (Cu) is preferable, and silver, which is less likely to be oxidized than copper (Cu) and is cheaper than gold (Au), is most preferable.
  • the particle size of the metal nanoparticles is preferably 1 nm to 500 nm, more preferably 10 nm to 100 nm. If the particle size is too small, it becomes difficult to generate voids for introducing the resin of the base material 2 by heating and pressurizing, and the reactivity of the particles becomes high, which may adversely affect the storage stability and stability of the ink. is there. If the particle size is too large, it becomes difficult to form a thin film uniformly, and there is a risk that ink particles are likely to precipitate.
  • the metal wiring pattern 3 is formed on the conductive layer 3a by electrolytic plating or electroless plating.
  • the plating metal copper (Cu), nickel (Ni), silver (Ag), gold (Au) and the like can be used, but copper (Cu) may be used from the viewpoint of extensibility, conductivity and price. Most preferred.
  • the thickness of the plating layer is preferably 0.03 ⁇ m to 100 ⁇ m, more preferably 1 ⁇ m to 35 ⁇ m, and most preferably 3 ⁇ m to 18 ⁇ m. If the plating layer is too thin, the mechanical strength may be insufficient and the conductivity may not be sufficiently obtained in practice. If the plating layer is too thick, the time required for plating becomes long, which may increase the manufacturing cost.
  • a plurality of electronic components are attached to the metal wiring pattern 3.
  • Electronic components include control circuits, distortion, resistance, capacitance, contact sensing such as TIR, and light detection components, tactile or vibrating components such as piezoelectric actuators or vibration motors, light emitting components such as LEDs, microphones and speakers. Sounds or sounds such as, memory chips, programmable logic chips and device operation components such as CPUs, digital signal processors (DSPs), ALS devices, PS devices, processing devices, MEMS and the like can be mentioned.
  • FIG. 1 shows, as an example of these electronic components, a heater 3A which is a resistor, an LED 3B which is a light emitting component, and a touch sensor 3C.
  • a pin header 5 as an example of an electronic element is joined on the metal wiring pattern 3.
  • the pin header 5 is an external connection terminal for electrically connecting a plurality of electronic components mounted on the electronic device 1 electrically connected to the metal wiring pattern 3 and an external element provided outside the electronic device 1. It has a 51 and a pin holding portion 52 that holds a plurality of external connection terminals 51 so as to be separated from each other by a predetermined distance.
  • the external connection terminal 51 is formed in a quadrangular prism shape using, for example, a copper alloy.
  • the surface of the external connection terminal 51 may be nickel-plated, and the nickel plating may be plated with a metal such as gold (AU) or tin (Sn) or an alloy containing these metals. good.
  • the pitch of the external connection terminal 51 corresponds to the standard of the connector to which it is connected.
  • the external connection terminal 51 is composed of, for example, a terminal portion 51a serving as a connector terminal and an anchor portion 51b joined to the metal wiring pattern 3, and the anchor portion 51b is joined to the metal wiring pattern 3.
  • the anchor portion 51b of the external connection terminal 51 of the pin header 5 is joined with a metal wiring pattern 3 and a low-temperature solder 4 as an example of a joining means containing a heat-meltable conductive component.
  • the low-temperature solder 4 is a solder having a melting temperature lower than the softening point of the base material 2, and is, for example, an alloy of tin (Sn) and bismuth (Bi) (SnBi), tin (Sn) and bismuth (Bi).
  • PET polyethylene terephthalate
  • examples of the solder paste of the low-temperature solder 4 include those represented by Sn-40Bi- (0 to 1.1) Cu-0.03Ni.
  • examples of such low-temperature solder 4 include the trade name “ECO SOLDER PASTE LT142” (manufactured by Senju Metal Industry Co., Ltd.).
  • the reflow process can be controlled so that the reflow temperature is higher than the melting point of the solder paste but lower than the softening point of the base material 2. ..
  • the base material 2 is polyethylene terephthalate (PET)
  • PET polyethylene terephthalate
  • the base material 2 does not melt or other deformation, while the solder paste melts. It becomes a state where it can be chemically and physically bonded to the metal wiring pattern 3.
  • the low-temperature solder 4 is solidified, and the pin header 5 as an example of the electronic element is joined to the metal wiring pattern 3 via the low-temperature solder 4.
  • the resin layer 7 is formed by performing secondary molding on one surface 2a of the base material 2 on which the metal wiring pattern 3 and the pin header 5 are arranged, and covers the one surface 2a on which the metal wiring pattern 3 is arranged. And a connector portion 72 having a tubular shape and having an external connection terminal 51 of the pin header 5 exposed inside the cylinder.
  • the resin layer 7 is a thermoplastic resin made of a thermoplastic resin material that can be secondarily molded. Specifically, polycarbonate (PC), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA), polyamide (PA), acrylic butadiene styrene (ABS), polyethylene (PE), polypropylene (PP), modified polyphenylene ether (m). -PPE), modified polyphenylene oxide (m-PPO), cycloolefin copolymer (COC), cycloolefin polymer (COP), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), or a mixture thereof.
  • a plastic resin can be used.
  • the resin layer 7 may also be formed on the surface 2b opposite to the one surface 2a on which the metal wiring pattern 3 of the base material 2 is arranged.
  • the strength of the electronic device 1 can be improved by forming the resin layer 7 on the surface 2b opposite to the one surface 2a of the base material 2.
  • the resin coating layer 6 covers a part or all of the low-temperature solder 4 that joins the pin header 5 as an example of the electronic element on the metal wiring pattern 3, and the resin layer 7 is molded on one surface of the base material 2 by injection molding or the like. At that time, it comes into contact with the high-temperature molten resin and suppresses the melt-out of the molten resin of the low-temperature solder 4 due to heat and pressure. Therefore, the resin coating layer 6 is a material having a higher softening point than the material of the resin layer 7, and is made of a thermosetting resin material, a two-component curable resin material, a photocurable resin material, or a moisture-curable resin material. It is a curable resin.
  • various resins such as epoxy resin, urethane resin, acrylic resin, polyimide resin, polyamide resin, bismaleimide resin, phenol resin, polyester resin, silicone resin, and oxetane resin can be used. These may be used alone or in combination of two or more. Of these, epoxy resins are particularly suitable.
  • curable resin materials are also used as adhesives and paints, have high adhesion to various materials, and have low viscosity in the state of the monomer before curing, so that they are excellent in moldability, and the pin header 5 has excellent moldability. It is suitable for covering the entire low-temperature solder 4 for joining the anchor portion 51b onto the metal wiring pattern 3.
  • curable resins are excellent in heat resistance, chemical resistance and dimensional stability after curing, and when the resin layer 7 is secondarily molded by injection molding, the temperature of the molten resin is set to, for example, 280 ° C to 320 ° C.
  • the temperature is set to ° C.
  • softening of the resin coating layer 6 in contact with the molten resin forming the resin layer 7 can be suppressed, and melting of the molten resin of the low-temperature solder 4 due to heat and pressure can be suppressed.
  • the pin header 5 can be held on the metal wiring pattern 3 with high positional accuracy and the electrical connection can be maintained.
  • these curable resins may contain inorganic fillers such as glass fillers and mineral fillers, and these curable resins may be used alone or in combination of two or more. May be good.
  • the resin coating layer 6 is a resin formed by covering a part or all of a low-temperature solder 4 as a joining means and a pin header 5 as an example of an electronic element and filling the resin coating layer 6 by injection molding. It may be arranged so as to be thermally separated from the layer 7 and not affected by the pressure.
  • FIG. 4 is a flowchart showing an example of a schematic procedure of the manufacturing method of the electronic device 1 according to the present embodiment.
  • the electronic device 1 is a conductive ink coating step S1 in which a conductive ink (metal nanoparticle ink) containing metal nanoparticles is coated on a deformable base material 2 made of a thermoplastic resin by an inkjet method or flexo printing.
  • the plating step S2 for forming a metal wiring pattern on the conductive ink layer by the plating process, and the solder paste application for applying the solder paste for joining the pin header 5 as an example of the electronic element on the metal wiring pattern 3.
  • Step S3 joining step S4 in which the pin header 5 is placed on the metal wiring pattern 3 and joined by the reflow process, and coating step S5 in which a part or all of the low-temperature solder 4 solidified by the reflow process is covered with a thermosetting resin.
  • a resin filling step S6 is provided in which the thermoplastic resin is secondarily molded by injection molding so as to cover one surface of the base material 2 to which the pin header 5 is bonded on the metal wiring pattern 3.
  • Examples of the method of applying the metal nanoparticle ink to the base film include an inkjet method and flexographic printing, and the inkjet method is used in this embodiment. Specifically, after applying a low-viscosity metal nanoparticle ink of 1000 cps or less, for example, 2 cps to 30 cps by an inkjet method, the solvent is volatilized to leave only the metal nanoparticles. Then, the solvent is removed (drying) and the silver nanoparticles are sintered (baking).
  • the mass ratio is preferably 5% to 60%, more preferably 10% to 30%. If the content ratio is too low, the nanoparticles required to form the conductive layer of metal nanoparticles may be insufficient and pinholes may occur, and if the content ratio is too high, the particles tend to aggregate in the ink. There is a risk that stability will be impaired.
  • the metal nanoparticle layer formed on the base material 2 through the metal nanoparticle ink coating step is subjected to electrolytic plating or electroless plating to deposit plated metal on the surface and inside of the metal nanoparticle layer.
  • the plating method is the same as that of known plating solutions and plating treatments, and specific examples thereof include electrolytic copper plating and electrolytic copper plating.
  • solder paste application process In order to join the pin header 5 on the metal wiring pattern 3 formed on the base material 2, the solder paste of the low temperature solder 4 is applied to form the low temperature solder 4.
  • the solder paste can be printed using a known device such as a stencil printing device, a screen printing device, or a dispenser device. In this embodiment, the solder paste is applied using a dispenser device.
  • the pin header 5 After applying the solder paste on the metal wiring pattern 3 by the dispenser device, the pin header 5 is mounted using, for example, a device mounting device, the solder is melted and solidified, and the solder is melted and solidified on the metal wiring pattern 3 via the low temperature solder 4.
  • the anchor portion 51b of the pin header 5 is joined.
  • the base material 2 made of a thermoplastic resin that can be deformed by thermoforming or the like has a low softening point, but by executing the reflow process at 140 ° C. using the low-temperature solder 4, the base material 2 is in the joining process. It does not melt or otherwise deform due to heat.
  • the coating step S5 is a step of forming a resin coating layer 6 that covers a part or all of the low-temperature solder 4 and the pin header 5 by applying a curable resin.
  • the resin coating layer 6 formed in the coating step S5 is separated from the heat and pressure of the molten resin of the resin layer 7 to which the low temperature solder 4 is secondarily molded.
  • the resin filling step S6 In the resin filling step S6, the laminate of the base material 2, the metal wiring pattern 3, the pin header 5, the low temperature solder 4 and the resin coating layer 6 formed up to the coating step S5 was placed on the secondary molding die. The rear mold is closed and the thermoplastic resin is injection-molded so as to cover one surface of the base material 2. The low-temperature solder 4 that joins the metal wiring pattern 3 and the pin header 5 is subjected to a reflow process at, for example, 140 ° C., but is thermally and pressured by a resin coating layer 6 made of a curable resin having a softening point higher than that of the resin layer 7.
  • the resin temperature is set to 280 ° C. to 320 ° C., and ordinary thermoplastic resin injection molding is possible.
  • the thermoplastic resin is injected by injection molding with the mold and the pin header 5 positioned, and the resin layer 7 is formed.
  • FIG. 5 is a schematic plan view showing the electronic device 1 according to the embodiment with the resin layer 7 not shown
  • FIG. 6A is a schematic plan view showing a joint between the metal wiring pattern 3 and the pin header 5 in the embodiment
  • FIG. 6B is a metal diagram.
  • FIG. 6C is a schematic partial cross-sectional view showing the joining state of the metal wiring pattern 3 filled with the resin layer 7 and the pin header 5
  • FIG. 7 is an electron according to an embodiment. It is a figure which shows the lighting confirmation result of LED 3B in apparatus 1.
  • FIG. Hereinafter, the present invention will be described with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.
  • the electronic device 1 was created as follows, and the lighting of the LED 3B was confirmed.
  • Base material A PET film having a thickness of 125 ⁇ m was cut out to a predetermined size and used as a base material 2.
  • a conductive layer 3a of metal nanoparticle ink was formed on the PET film by an inkjet device, and a metal wiring pattern 3 was formed using copper (Cu) by electroless plating. Further, as shown in FIG. 5, a part of the metal wiring pattern 3 was formed as a heater 3A and a touch sensor 3C. Further, a plurality of LEDs 3B are mounted on the metal wiring pattern 3 as an example of light emitting parts.
  • solder is low temperature solder, trade name "ECO SOLDER PASSE LT142" (manufactured by Senju Metal Industry Co., Ltd.), high temperature solder, trade name "ECO SOLDER PASSE M705-GRN360-K2-V” (manufactured by Senju Metal Industry Co., Ltd.) Bonding was performed by a reflow process controlled at 140 ° C. using the trade name "ECO SOLDER PASSE L20-JPP" (manufactured by Senju Metal Industry Co., Ltd.) consisting of solder and epoxy resin.
  • the resin coating layer 6 has a trade name "Super X” (Cemedine), which is an adhesive made of a moisture-curable resin, and a trade name "KE348", which is a moisture-curable silicone rubber adhesive. (Manufactured by Shin-Etsu Chemical Industry Co., Ltd.) was used to cover a part of the solder and the pin header 5.
  • the low temperature solder 4 (“ECO”). It is presumed that the melted resin of the low-temperature solder 4 is suppressed from melting due to heat and pressure because the SOLDER PASSE LT142 ”) is covered with the resin coating layer 6 having a softening point higher than that of the resin layer 7. Ru. As a result, the pin header 5 is held on the metal wiring pattern 3 with high positional accuracy, and the electrical connection is maintained.
  • the low-temperature solder 4 for joining the pin header 5 as an example of the electronic element on the metal wiring pattern 3 is injected before the resin layer 7 is injection-molded using the thermoplastic resin.
  • the base material 2 is deformable as compared with a configuration in which the resin coating layer 6 for covering the low-temperature solder 4 is not provided as an example of the joining means. It is possible to suppress melting due to heat and pressure of the low temperature solder 4 for conductively joining the electronic element to the metal wiring pattern 3 formed above.
  • the low-temperature solder 4 that conductively joins the electronic element to the metal wiring pattern 3 formed on the deformable base material 2 is suppressed from melting due to heat and pressure, and the electronic element is held on the metal wiring pattern 3 with high positional accuracy.
  • the electrical connection can be maintained.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un dispositif électronique capable de maintenir, avec une précision de position élevée, un élément électronique sur un motif de câblage métallique formé sur un matériau de base déformable et maintenant une liaison électrique par suppression de la fusion et de l'écoulement hors d'un moyen de jonction pour relier de manière conductrice l'élément électronique au motif de câblage métallique, du fait de la chaleur et de la pression.　Ce dispositif électronique est pourvu : d'un matériau de base déformable ; d'un motif de câblage métallique disposé sur le matériau de base ; d'un élément électronique relié au motif de câblage métallique par un moyen de jonction qui comprend un composant conducteur thermofusible ; d'une couche de résine qui recouvre une surface du matériau de base sur laquelle le motif de câblage métallique est disposé ; et d'une couche de revêtement en résine qui a un point de ramollissement plus élevé que la couche de résine et qui recouvre une partie ou la totalité du moyen de jonction de façon à être séparée de la couche de résine.
PCT/JP2020/040995 2019-11-05 2020-10-31 Dispositif électronique WO2021090785A1 (fr)

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JP2019-200479 2019-11-05

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