WO2023000369A1 - 发光二极管面板及拼接面板 - Google Patents

发光二极管面板及拼接面板 Download PDF

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Publication number
WO2023000369A1
WO2023000369A1 PCT/CN2021/109191 CN2021109191W WO2023000369A1 WO 2023000369 A1 WO2023000369 A1 WO 2023000369A1 CN 2021109191 W CN2021109191 W CN 2021109191W WO 2023000369 A1 WO2023000369 A1 WO 2023000369A1
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WO
WIPO (PCT)
Prior art keywords
conductor
holes
light
hole
region
Prior art date
Application number
PCT/CN2021/109191
Other languages
English (en)
French (fr)
Inventor
李艳
Original Assignee
惠州华星光电显示有限公司
Tcl华星光电技术有限公司
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Filing date
Publication date
Application filed by 惠州华星光电显示有限公司, Tcl华星光电技术有限公司 filed Critical 惠州华星光电显示有限公司
Priority to US17/599,568 priority Critical patent/US20240047442A1/en
Publication of WO2023000369A1 publication Critical patent/WO2023000369A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present application relates to the field of display technology, in particular to a light emitting diode panel and a splicing panel.
  • the inventors of the present application found that in sub-millimeter LED splicing panels and micro LED splicing panels, the flexible circuit board generally needs to be bent to the back of the LED panel , thereby forming a bending radius, resulting in a large distance between the light emitting diodes at the splicing seam, which affects the optical uniformity.
  • Embodiments of the present application provide a light emitting diode panel and a splicing panel, which can reduce the distance between the light emitting diodes at the splicing seam during splicing.
  • An embodiment of the present application provides a light emitting diode panel, which includes:
  • a substrate the substrate includes a first area and a second area located on the outer peripheral side of the first area, a plurality of through holes are arranged on the substrate, and the through holes are located in the first area or the second area. Area;
  • a plurality of conductors, one conductor is correspondingly arranged in one of the through holes;
  • a plurality of light-emitting units are arranged on the substrate and correspond to the first region, and one of the light-emitting units includes at least one light-emitting diode;
  • first wirings are arranged on the substrate, and the first wirings are connected to the light emitting diodes and the conductor;
  • At least one flexible circuit board is arranged on the surface of the substrate away from the light emitting unit;
  • a plurality of second wirings, the second wirings are arranged on the surface of the substrate away from the light-emitting unit, the second wirings are connected to the conductor and the flexible circuit board.
  • the through hole is located in the first region.
  • the light emitting units and the through holes are respectively arranged along the first direction, and the through holes and at least part of the light emitting units are arranged alternately along the second direction , the first direction and the second direction intersect;
  • the light emitting unit is connected to a conductor through at least one first wire.
  • the first area includes a first sub-area, a second sub-area located on one side of the first sub-area, and a second sub-area located on the other side of the first sub-area.
  • the third sub-region; the through hole includes a first through hole and a second through hole, a plurality of the first through holes are arranged at the junction of the first sub-region and the second sub-region, and a plurality of the first through holes are arranged at the junction of the first sub-region and the second sub-region.
  • the second through hole is disposed at the junction of the first subregion and the third subregion;
  • the conductor includes a first conductor disposed in the first through hole and a conductor disposed in the second a second electrical conductor within the via;
  • the light-emitting unit located in the second sub-region is electrically connected to the first conductor; the light-emitting unit located in the third sub-region is electrically connected to the second conductor; The light emitting units in a sub-region are electrically connected to the first conductor and/or the second conductor.
  • the first region includes a first subregion and a second subregion located on one side of the first subregion;
  • the through holes include a plurality of first through holes and a plurality of second through holes, the first through holes and the second through holes are arranged along the first direction, and the conductor includes a first conductor disposed in the first through hole and a a second conductor disposed in the second through hole;
  • the first through hole and the second through hole are disposed at the junction of the first subregion and the second subregion;
  • the light-emitting units located in the first sub-area are electrically connected to the first conductor through at least one of the first wires, and the light-emitting units located in the second sub-area are electrically connected to the first conductor through at least one of the first wires.
  • a wire is connected to the second conductor.
  • the first through holes and the second through holes are arranged alternately along the first direction.
  • the through holes are arranged in the second region, and the through holes are arranged on one side of the first region; a plurality of the through holes are arranged along the first Arranged in a direction, a plurality of the light emitting units are arranged along a first direction, a plurality of the light emitting units are arranged along a second direction, and the first direction and the second direction are arranged to cross;
  • Each row of the light-emitting units is connected to a conductor through the first wiring.
  • the through holes are arranged in the second area, the through holes include first through holes and second through holes, and a plurality of the first through holes are arranged in On one side of the first area, a plurality of second through holes are arranged on the other side of the first area;
  • the conductor includes a first conductor arranged in the first through hole and a set of a second electrical conductor within the second via;
  • a plurality of the first through holes and the second through holes are respectively arranged along the first direction, a plurality of the light emitting units are arranged along the first direction, and a plurality of the light emitting units are arranged along the second direction cloth, the first direction intersects with the second direction;
  • the through holes are arranged in the second area, the through holes include first through holes and second through holes, and a plurality of the first through holes are arranged in On one side of the first region, a plurality of second through holes are arranged on another side of the first region;
  • the conductor includes a first conductor arranged in the first through hole and a set of a second electrical conductor within the second via;
  • a plurality of the first through holes are arranged along the first direction, and the second through holes are respectively arranged along the second direction; a plurality of the light emitting units are arranged along the first direction, and a plurality of the light emitting units are arranged along the first direction.
  • the units are arranged along a second direction, and the first direction and the second direction are intersected;
  • a part of the light emitting unit is connected to a first conductor through the first wiring, and another part of the light emitting unit is connected to a second conductor through the first wiring.
  • the light emitting diodes are submillimeter light emitting diodes or micro light emitting diodes.
  • An embodiment of the present application further provides a spliced panel, wherein at least two LED panels as described in any one of the above embodiments are spliced and arranged.
  • the LED panel includes:
  • a substrate the substrate includes a first area and a second area located on the outer peripheral side of the first area, a plurality of through holes are arranged on the substrate, and the through holes are located in the first area or the second area. Area;
  • a plurality of conductors, one conductor is correspondingly arranged in one of the through holes;
  • a plurality of light-emitting units are arranged on the substrate and correspond to the first region, and one of the light-emitting units includes at least one light-emitting diode;
  • first wirings are arranged on the substrate, and the first wirings are connected to the light emitting diodes and the conductor;
  • At least one flexible circuit board is arranged on the surface of the substrate away from the light emitting unit;
  • a plurality of second wirings, the second wirings are arranged on the surface of the substrate away from the light-emitting unit, the second wirings are connected to the conductor and the flexible circuit board.
  • the through hole is located in the first region.
  • the light emitting units and the through holes are respectively arranged along the first direction, and the through holes and at least part of the light emitting units are arranged alternately along the second direction , the first direction and the second direction intersect;
  • the light emitting unit is connected to a conductor through at least one first wire.
  • the first area includes a first sub-area, a second sub-area located on one side of the first sub-area, and a second sub-area located on the other side of the first sub-area.
  • the third sub-region; the through hole includes a first through hole and a second through hole, a plurality of the first through holes are arranged at the junction of the first sub-region and the second sub-region, and a plurality of the first through holes are arranged at the junction of the first sub-region and the second sub-region.
  • the second through hole is disposed at the junction of the first subregion and the third subregion;
  • the conductor includes a first conductor disposed in the first through hole and a conductor disposed in the second a second electrical conductor within the via;
  • the light-emitting unit located in the second sub-region is electrically connected to the first conductor; the light-emitting unit located in the third sub-region is electrically connected to the second conductor; The light emitting units in a sub-region are electrically connected to the first conductor and/or the second conductor.
  • the first region includes a first subregion and a second subregion located on one side of the first subregion;
  • the through holes include a plurality of first through holes and a plurality of second through holes, the first through holes and the second through holes are arranged along the first direction, and the conductor includes a first conductor disposed in the first through hole and a a second conductor disposed in the second through hole;
  • the first through hole and the second through hole are disposed at the junction of the first subregion and the second subregion;
  • the light-emitting units located in the first sub-area are electrically connected to the first conductor through at least one of the first wires
  • the light-emitting units located in the second sub-area are electrically connected to the first conductor through at least one of the first wires.
  • a trace is electrically connected to the second conductor.
  • the first through holes and the second through holes are arranged alternately along the first direction.
  • the through holes are arranged in the second region, and the through holes are arranged on one side of the first region; a plurality of the through holes are arranged along the first Arranged in a direction, a plurality of the light emitting units are arranged along a first direction, a plurality of the light emitting units are arranged along a second direction, and the first direction and the second direction are arranged to cross;
  • Each row of the light-emitting units is connected to a conductor through the first wiring.
  • the through holes are arranged in the second area, the through holes include first through holes and second through holes, and a plurality of the first through holes are arranged in On one side of the first area, a plurality of second through holes are arranged on the other side of the first area;
  • the conductor includes a first conductor arranged in the first through hole and a set of a second electrical conductor within the second via;
  • a plurality of the first through holes and the second through holes are respectively arranged along the first direction, a plurality of the light emitting units are arranged along the first direction, and a plurality of the light emitting units are arranged along the second direction cloth, the first direction intersects with the second direction;
  • the through holes are arranged in the second area, the through holes include first through holes and second through holes, and a plurality of the first through holes are arranged in On one side of the first region, a plurality of second through holes are arranged on another side of the first region;
  • the conductor includes a first conductor arranged in the first through hole and a set of a second electrical conductor within the second via;
  • a plurality of the first through holes are arranged along the first direction, and the second through holes are respectively arranged along the second direction; a plurality of the light emitting units are arranged along the first direction, and a plurality of the light emitting units are arranged along the first direction.
  • the units are arranged along a second direction, and the first direction and the second direction are intersected;
  • a part of the light emitting unit is connected to a first conductor through the first wiring, and another part of the light emitting unit is connected to a second conductor through the first wiring.
  • the light emitting diodes are submillimeter light emitting diodes or micro light emitting diodes.
  • a through hole is provided on the substrate, and the conductor is disposed in the through hole, wherein the light-emitting unit is connected to one end of the conductor through the first wiring, and the flexible circuit board is connected to the other end of the conductor through the second wiring.
  • the flexible circuit board is directly arranged on the back of the substrate, reducing the frame width of the light-emitting diode panel, and further reducing the distance between the light-emitting diodes on both sides of the splicing seam when the light-emitting diode panels are spliced.
  • FIG. 1 is a schematic top view of a first structure of a light emitting diode panel provided in an embodiment of the present application
  • Fig. 2 is a schematic cross-sectional structure diagram along cd line in Fig. 1;
  • FIG. 3 is a schematic bottom view of the first structure of the LED panel provided by the embodiment of the present application.
  • Fig. 4 is a schematic top view of the second structure of the LED panel provided by the embodiment of the present application.
  • Fig. 5 is a schematic bottom view of the second structure of the LED panel provided by the embodiment of the present application.
  • Fig. 6 is a schematic top view of the third structure of the light emitting diode panel provided by the embodiment of the present application.
  • Fig. 7 is a schematic cross-sectional structure along line ef in Fig. 6;
  • Fig. 8 is a schematic bottom view of the third structure of the LED panel provided by the embodiment of the present application.
  • Fig. 9 is a schematic top view of the fourth structure of the light emitting diode panel provided by the embodiment of the present application.
  • Fig. 10 is a schematic top view of the fifth structure of the light emitting diode panel provided by the embodiment of the present application.
  • Fig. 11 is a schematic top view of the sixth structure of the LED panel provided by the embodiment of the present application.
  • Fig. 12 is a schematic structural diagram of a splicing panel provided by an embodiment of the present application.
  • Embodiments of the present application provide a light emitting diode panel and a splicing panel, which will be described in detail below. It should be noted that the description sequence of the following embodiments is not intended to limit the preferred sequence of the embodiments.
  • the embodiment of the present application provides a light-emitting diode panel 100, which includes a substrate 11, a plurality of conductors 12, a plurality of light-emitting units 13, a plurality of first wiring 14, and at least one flexible circuit. board 15 and a plurality of second traces 16.
  • the substrate 11 includes a first area AA and a second area NA located on the outer peripheral side of the first area AA.
  • a plurality of through holes 111 are disposed on the substrate 11 , and the through holes 111 are located in the first area AA or the second area NA.
  • a conductor 12 is correspondingly disposed in a through hole 111 .
  • the conductors 12 and the through holes 111 are provided in one-to-one correspondence.
  • the light emitting unit 13 is disposed on the substrate 11 and corresponds to the first area AA.
  • a light emitting unit 13 includes at least one light emitting diode 131 .
  • the first wiring 14 is disposed on the substrate 11 .
  • the first wiring 14 is connected to the LED 131 and the conductor 12 . That is, both the light emitting unit 13 and the first wiring 14 are disposed on the same surface of the substrate 11 .
  • One light emitting unit 13 is correspondingly electrically connected to one conductor 12 ; or a plurality of light emitting units 13 is correspondingly electrically connected to one conductor 12 .
  • connection may not only refer to a physical connection, but may also refer to an electrical connection.
  • the flexible circuit board 15 is disposed on the surface of the substrate 11 away from the light emitting unit 13 .
  • the second wiring 16 is disposed on the surface of the substrate 11 away from the light emitting unit 13 .
  • the second wiring 16 is connected to the conductor 12 and the flexible circuit board 15 . That is to say, both the flexible circuit board 15 and the second wiring 16 are disposed on the other surface of the substrate 11 .
  • a through hole 111 is disposed on the substrate 11 , and the conductor 12 is disposed in the through hole 111 .
  • the light-emitting unit 13 is connected to one end of the conductor 12 through the first wiring 14, and the flexible circuit board 15 is connected to the other end of the conductor 12 through the second wiring 16, so that the flexible circuit board 15 is directly arranged on the back of the substrate 11,
  • the width of the frame of the LED panel 100 is reduced, so that when the LED panel 100 is spliced, the distance between the LEDs 131 on both sides of the splicing seam can be reduced.
  • the substrate 11 is a rigid substrate, such as a glass substrate, a sapphire substrate, or a silicon substrate.
  • the substrate 11 may also be a flexible substrate.
  • the material of the conductor 12 may be conductive substances such as solder, metal, nano-gold wire, metal oxide, conductive glue or conductive particles.
  • the light emitting diode 131 may be a submillimeter level light emitting diode (Mini-LED) or a micro light emitting diode (Micro-LED).
  • Mini-LED submillimeter level light emitting diode
  • Micro-LED micro light emitting diode
  • the flexible circuit board 15 may be a flexible circuit board or a chip on film.
  • the materials of the first wiring 14 and the second wiring 16 can be indium tin oxide, indium zinc oxide, etc., and can also be metals, alloys, compounds and mixtures thereof with various conductive properties, for example, gold can be used , silver, tungsten, molybdenum, iron, aluminum, aluminum-silicon, aluminum-titanium, metal material nitride, etc.
  • the through holes 111 are located in the first area AA.
  • the through hole 111 is disposed in the first area AA, so that the second area NA does not have the through hole 111, and the width of the second area NA is reduced.
  • the through holes 111 can be arranged between the light emitting units 13 , that is, the space between the light emitting units 13 is used to arrange the through holes 111 , so as to save space.
  • one light emitting unit 13 includes one light emitting diode 131 , and may also include two, three or more than three light emitting diodes 131 .
  • the light emitting units 13 and the through holes 111 are arranged in a row along the first direction M respectively.
  • the through holes 111 and at least part of the light emitting units 13 are alternately arranged along the second direction N.
  • first direction M and the second direction N intersect.
  • first direction M is perpendicular to the second direction N.
  • the light emitting unit 13 is connected to a conductor 12 through at least one first wire 14 .
  • the first area AA includes a first sub-area A1, a second sub-area A2 located on one side of the first sub-area A1, and a third sub-area A3 located on the other side of the first sub-area A1.
  • the through hole 111 includes a first through hole 11a and a second through hole 11b, a plurality of first through holes 11a are arranged at the junction of the first sub-area A1 and the second sub-area A2, and a plurality of second through holes 11b are arranged in the second sub-area The junction of the first sub-area A1 and the third sub-area A3.
  • the conductors 12 include a first conductor 121 disposed in the first through hole 11a and a second conductor 122 disposed in the second through hole 11b.
  • the light emitting unit 13 located in the second sub-area A2 is electrically connected to the first conductor 121 .
  • the light emitting units 13 located in the third sub-area A3 are electrically connected to the second conductor 122 .
  • the light emitting unit 13 located in the first sub-region A1 is electrically connected to the first conductor 121 or the second conductor 122 .
  • some of the light emitting units 13 are electrically connected to the first conductor 121 , and another part of the light emitting units 13 are electrically connected to the second conductor 122 .
  • the first through hole 11a and the second through hole 11b are arranged in a misalignment, so as to reduce the risk of damage to the substrate 11 .
  • each second wiring 16 is connected to a conductor 12 .
  • the length of the second wiring 16 decreases gradually from the edge areas at both ends to the middle area.
  • the pattern of the conductors 12 connected to the second wiring 16 in the middle area is square, and the pattern of the conductors 12 connected to the second wiring 16 in the edge area is circular. Such setting is used to reduce the difference in resistance between the second wires 16 .
  • the corresponding through hole 111 is also square.
  • the corresponding through hole 111 is also circular.
  • the shapes of the through holes 111 may also be all round or square, or other shapes.
  • the second wiring 16 includes a connecting section, an intermediate section and a binding section connected in sequence, the connecting section is connected to the conductor 12 , and the binding section is bound and connected to the flexible circuit board 15 .
  • extension directions of two adjacent connecting sections are arranged in parallel; the width of the connecting section connected to the square conductor 12 is greater than that connected to the circular conductor 12 .
  • the extension directions of the two adjacent binding sections are also arranged in parallel; the widths of the two adjacent binding sections are equal.
  • the widths of the connecting section, the middle section and the binding section are equal; in the second wiring 16 connected to the square conductor 12 , the width of the connecting segment is greater than the width of the binding segment; from the connecting segment to the direction of the binding segment, the width of the intermediate segment decreases.
  • the above settings are used to reduce the impedance difference between the second wires 16 .
  • the light emitting diode panel 200 of this embodiment is different from the light emitting diode panel 100 of the above embodiment in that: the first area AA includes the first sub-area A1 and is located on the side of the first sub-area A1
  • the through holes 111 include a plurality of first through holes 11a and a plurality of second through holes 11b, and the first through holes 11a and the second through holes 11b are arranged along the first direction M.
  • the conductors 12 include a first conductor 121 disposed in the first through hole 11a and a second conductor 122 disposed in the second through hole 11b.
  • the first through hole 11a and the second through hole 11b are disposed at the junction of the first sub-area A1 and the second sub-area A2.
  • the light-emitting units 13 located in the first sub-area A1 are electrically connected to a first conductor 121 through at least one first wiring 14
  • the light-emitting units 13 located in the second sub-area A2 are electrically connected through at least one first wiring 14 in a second conductor 122 .
  • first through holes 11a and the second through holes 11b are arranged alternately along the first direction M. Arranging the first through holes 11 a and the second through holes 11 b alternately can save one flexible circuit board 15 .
  • a plurality of light emitting units 13 are arranged in a matrix.
  • the LED panel 300 of this embodiment is different from the LED panel 100 of the above embodiment in that: the through hole 111 is disposed in the second area NA.
  • the through hole 111 is disposed on one side of the first area AA.
  • the plurality of through holes 111 are arranged in a row along the first direction M.
  • a plurality of light emitting units 13 are arranged in a row along the first direction M.
  • a plurality of light emitting units 13 are arranged in a row along the second direction N.
  • the first direction M intersects with the second direction N.
  • the first direction M is perpendicular to the second direction N.
  • Each row of light emitting units 13 is connected to a conductor 12 through a first wire 14 .
  • the conductor 12 is provided in the through hole 111 .
  • the light emitting diode panel 300 includes short sides and long sides, and the through holes 111 are located on the short sides to reduce the number of through holes 111 .
  • the LED panel 400 of this embodiment is different from the LED panel 300 of the above embodiment in that: a plurality of through holes 111 are arranged in a row along the second direction N.
  • a plurality of light emitting units 13 are arranged in a row along the first direction M. As shown in FIG. A plurality of light emitting units 13 are arranged in a row along the second direction N.
  • the first direction M and the second direction N are intersected.
  • the first direction M is perpendicular to the second direction N.
  • Each row of light emitting units 13 is connected to a conductor 12 through a first wire 14 .
  • the conductor 12 is provided in the through hole 111 .
  • the LED panel 300 includes a short side and a long side, and the through hole 111 is located on the long side to reduce the impedance of the first wiring 14 .
  • the LED panel 500 of this embodiment is different from the LED panel 300 of the above embodiment in that: the through hole 111 includes a first through hole 11a and a second through hole 11b, and a plurality of first through holes 11a It is arranged on one side of the first region AA, and a plurality of second through holes 11b are arranged on the other side of the first region AA; the conductor 12 includes a first conductor 121 arranged in the first through hole 11a and a first The second conductor 122 in the two through holes 11b.
  • the plurality of first through holes 11 a and the second through holes 11 b are arranged in a row along the first direction M, respectively.
  • a plurality of light emitting units 13 are arranged in a row along the first direction M. As shown in FIG. A plurality of light emitting units 13 are arranged in a row along the second direction N.
  • the first direction M and the second direction N are intersected.
  • the first direction M is perpendicular to the second direction N.
  • each row of light-emitting units 13 part of the light-emitting units 13 are connected to a first conductor 121 through the first wiring 14, and another part of the light-emitting units 13 are connected to a second conductor 121 through the first wiring 14.
  • Conductor 122 In each row of light-emitting units 13, part of the light-emitting units 13 are connected to a first conductor 121 through the first wiring 14, and another part of the light-emitting units 13 are connected to a second conductor 121 through the first wiring 14.
  • the light emitting diode panel 600 of this embodiment is different from the light emitting diode panel 300 of the above embodiment in that: the through hole 111 includes a first through hole 11a and a second through hole 11b, and a plurality of first through holes 11a It is disposed on one side of the first area AA, and a plurality of second through holes 11b are disposed on another side of the first area AA; the conductor 12 includes a first conductor 121 disposed in the first through hole 11a and a first The second conductor 122 in the two through holes 11b.
  • a plurality of first through holes 11a are arranged in a row along the first direction M, and the second through holes 11b are respectively arranged in a row along the second direction N; a plurality of light emitting units 13 are arranged in a row along the first direction M, A plurality of light emitting units 13 are arranged in a row along the second direction N.
  • the first direction M intersects with the second direction N.
  • Part of the light emitting unit 13 is connected to a first conductor 121 through the first wiring 14 , and another part of the light emitting unit 13 is connected to a second conductor 122 through the first wiring 14 .
  • the through hole 111 can also be arranged around the first area AA, that is, the through hole 111 is arranged in the surrounding area around the first area AA, and the connection part of the conductor 12 in the through hole 111 in each area Lighting unit 13. Such setting can further reduce the impedance difference between the first traces 14 .
  • the embodiment of the present application further provides a splicing panel 1000, wherein at least two LED panels as described in any one of the above embodiments are spliced and arranged.
  • the distance D between the two LEDs 131 at the seam between the two LED panels MB can be as small as possible.
  • one side of the LED panel MB has the through hole 111 and the other side of the LED panel MB does not have the through hole 111.
  • One side of the splicing is arranged to reduce the distance D between the two LEDs 131 at the splicing seam.
  • the LED panel MB is the LED panel 600, among the two LED panels MB, the side of one LED panel MB with the through hole 111 and the side of the other LED panel MB without the through hole 111 are spliced. , so as to reduce the distance D between the two LEDs 131 at the splicing seam.
  • this embodiment takes the LED panel MB as the LED panel 300 of the above-mentioned embodiment as an example, but it is not limited thereto.
  • a through hole is provided on the substrate, and the conductor is disposed in the through hole, wherein the light-emitting unit is connected to one end of the conductor through the first wiring, and the flexible circuit board is connected to the other end of the conductor through the second wiring.
  • the flexible circuit board is directly arranged on the back of the substrate, reducing the frame width of the light-emitting diode panel, and further reducing the distance between the light-emitting diodes on both sides of the splicing seam when the light-emitting diode panels are spliced.

Abstract

本申请实施例公开了一种发光二极管面板及拼接面板，在发光二极管面板中，基板包括第一区和第二区，基板上设置有多个通孔，通孔位于第一区或第二区；导电体对应设置在通孔内；发光单元对应于第一区，发光单元包括至少一个发光二极管；第一走线连接于发光二极管和导电体；柔性电路板设置在基板的背面；第二走线连接于导电体和柔性电路板。

Description

发光二极管面板及拼接面板 技术领域
本申请涉及显示技术领域，具体涉及一种发光二极管面板及拼接面板。
 背景技术
在对现有技术的研究和实践过程中，本申请的发明人发现，在次毫米级发光二级管拼接面板和微型发光二极管拼接面板中，由于柔性电路板一般需弯折到发光二极管面板背面，进而形成弯折半径，导致拼接缝处的发光二极管之间的距离较大，影响了光学的均一性。
 技术问题
本申请实施例提供一种发光二极管面板以及拼接面板，在拼接时能降低拼接缝处的发光二极管之间距离。
 技术解决方案
本申请实施例提供一种发光二极管面板，其包括：
一基板，所述基板包括第一区和位于所述第一区外周侧的第二区，所述基板上设置有多个通孔，所述通孔位于所述第一区或所述第二区；
多个导电体，一所述导电体对应设置在一所述通孔内；
多个发光单元，所述发光单元设置在所述基板上且对应于所述第一区，一所述发光单元包括至少一个发光二极管；
多条第一走线，所述第一走线设置在所述基板上，所述第一走线连接于所述发光二极管和所述导电体；
至少一柔性电路板，所述柔性电路板设置在所述基板远离所述发光单元的表面上；
多条第二走线，所述第二走线设置在所述基板远离所述发光单元的表面上，所述第二走线连接于所述导电体和所述柔性电路板。
可选的，在本申请的一些实施例中，所述通孔位于所述第一区。
可选的，在本申请的一些实施例中，所述发光单元与所述通孔分别沿着第一方向排布，所述通孔与至少部分所述发光单元沿着第二方向交替排布，所述第一方向和所述第二方向交叉设置；
所述发光单元通过至少一条所述第一走线连接于一所述导电体。
可选的，在本申请的一些实施例中，所述第一区包括第一子区、位于所述第一子区一侧的第二子区和位于所述第一子区另一侧的第三子区；所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一子区和所述第二子区的交界处，多个所述第二通孔设置在所述第一子区和所述第三子区的交界处；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
位于所述第二子区的所述发光单元电性连接于所述第一导电体；位于所述第三子区的所述发光单元电性连接于所述第二导电体；位于所述第一子区的所述发光单元电性连接于所述第一导电体和/或所述第二导电体。
可选的，在本申请的一些实施例中，所述第一区包括第一子区、位于所述第一子区一侧的第二子区；所述通孔包括多个第一通孔和多个第二通孔，所述第一通孔和所述第二通孔沿着第一方向排布设置，所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
所述第一通孔和所述第二通孔设置在所述第一子区和所述第二子区的交界处；
位于所述第一子区的所述发光单元通过至少一所述第一走线电性连接于所述第一导电体，位于所述第二子区的所述发光单元通过至少一所述第一走线连接于所述第二导电体。
可选的，在本申请的一些实施例中，所述第一通孔和所述第二通孔沿着所述第一方向交替设置。
可选的，在本申请的一些实施例中，所述通孔设置在所述第二区，所述通孔设置在所述第一区的一侧；多个所述通孔沿着第一方向排布，多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
每一行所述发光单元通过所述第一走线连接于一所述导电体。
可选的，在本申请的一些实施例中，所述通孔设置在所述第二区，所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一区的一侧，多个所述第二通孔设置在所述第一区的另一侧；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
多个所述第一通孔和所述第二通孔分别沿着第一方向排布，多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
每一行所述发光单元中，部分的所述发光单元通过所述第一走线连接于一所述第一导电体，另一部分的所述发光单元通过第一走线连接于一所述第二导电体。
可选的，在本申请的一些实施例中，所述通孔设置在所述第二区，所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一区的一侧，多个所述第二通孔设置在所述第一区的又一侧；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
多个所述第一通孔沿着第一方向排布，所述第二通孔分别沿着第二方向排布；多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
部分的所述发光单元通过所述第一走线连接于一所述第一导电体，另一部分的所述发光单元通过第一走线连接于一所述第二导电体。
可选的，在本申请的一些实施例中，所述发光二极管是次毫米级发光二极管或微型发光二极管。
本申请实施例还提供一种拼接面板，其中，至少两个如上述任意一项实施例所述的发光二极管面板，至少两个所述发光二极管面板拼接设置。
可选的，所述发光二极管面板包括：
一基板，所述基板包括第一区和位于所述第一区外周侧的第二区，所述基板上设置有多个通孔，所述通孔位于所述第一区或所述第二区；
多个导电体，一所述导电体对应设置在一所述通孔内；
多个发光单元，所述发光单元设置在所述基板上且对应于所述第一区，一所述发光单元包括至少一个发光二极管；
多条第一走线，所述第一走线设置在所述基板上，所述第一走线连接于所述发光二极管和所述导电体；
至少一柔性电路板，所述柔性电路板设置在所述基板远离所述发光单元的表面上；
多条第二走线，所述第二走线设置在所述基板远离所述发光单元的表面上，所述第二走线连接于所述导电体和所述柔性电路板。
可选的，在本申请的一些实施例中，所述通孔位于所述第一区。
可选的，在本申请的一些实施例中，所述发光单元与所述通孔分别沿着第一方向排布，所述通孔与至少部分所述发光单元沿着第二方向交替排布，所述第一方向和所述第二方向交叉设置；
所述发光单元通过至少一条所述第一走线连接于一所述导电体。
可选的，在本申请的一些实施例中，所述第一区包括第一子区、位于所述第一子区一侧的第二子区和位于所述第一子区另一侧的第三子区；所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一子区和所述第二子区的交界处，多个所述第二通孔设置在所述第一子区和所述第三子区的交界处；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
位于所述第二子区的所述发光单元电性连接于所述第一导电体；位于所述第三子区的所述发光单元电性连接于所述第二导电体；位于所述第一子区的所述发光单元电性连接于所述第一导电体和/或所述第二导电体。
可选的，在本申请的一些实施例中，所述第一区包括第一子区、位于所述第一子区一侧的第二子区；所述通孔包括多个第一通孔和多个第二通孔，所述第一通孔和所述第二通孔沿着第一方向排布设置，所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
所述第一通孔和所述第二通孔设置在所述第一子区和所述第二子区的交界处；
位于所述第一子区的所述发光单元通过至少一所述第一走线电性连接于所述第一导电体，位于所述第二子区的所述发光单元通过至少一所述第一走线电性连接于所述第二导电体。
可选的，在本申请的一些实施例中，所述第一通孔和所述第二通孔沿着所述第一方向交替设置。
可选的，在本申请的一些实施例中，所述通孔设置在所述第二区，所述通孔设置在所述第一区的一侧；多个所述通孔沿着第一方向排布，多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
每一行所述发光单元通过所述第一走线连接于一所述导电体。
可选的，在本申请的一些实施例中，所述通孔设置在所述第二区，所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一区的一侧，多个所述第二通孔设置在所述第一区的另一侧；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
多个所述第一通孔和所述第二通孔分别沿着第一方向排布，多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
每一行所述发光单元中，部分的所述发光单元通过所述第一走线连接于一所述第一导电体，另一部分的所述发光单元通过第一走线连接于一所述第二导电体。
可选的，在本申请的一些实施例中，所述通孔设置在所述第二区，所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一区的一侧，多个所述第二通孔设置在所述第一区的又一侧；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
多个所述第一通孔沿着第一方向排布，所述第二通孔分别沿着第二方向排布；多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
部分的所述发光单元通过所述第一走线连接于一所述第一导电体，另一部分的所述发光单元通过第一走线连接于一所述第二导电体。
可选的，在本申请的一些实施例中，所述发光二极管是次毫米级发光二极管或微型发光二极管。
 有益效果
本申请实施例中，基板上设置通孔，导电体设置在通孔内，其中发光单元通过第一走线连接于导电体的一端，柔性电路板通过第二走线连接于导电体的另一端，使得柔性电路板直接设置在基板的背面，缩小了发光二极管面板的边框宽度，进而在发光二极管面板拼接时，降低了拼接缝处两侧发光二极管的距离。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的发光二极管面板的第一种结构的俯视结构示意图；
图2是图1中沿着cd线的剖视结构示意图；
图3是本申请实施例提供的发光二极管面板的第一种结构的仰视结构示意图；
图4是本申请实施例提供的发光二极管面板的第二种结构的俯视结构示意图；
图5是本申请实施例提供的发光二极管面板的第二种结构的仰视结构示意图；
图6是本申请实施例提供的发光二极管面板的第三种结构的俯视结构示意图；
图7是图6中沿着ef线的剖视结构示意图；
图8是本申请实施例提供的发光二极管面板的第三种结构的仰视结构示意图；
图9是本申请实施例提供的发光二极管面板的第四种结构的俯视结构示意图；
图10是本申请实施例提供的发光二极管面板的第五种结构的俯视结构示意图；
图11是本申请实施例提供的发光二极管面板的第六种结构的俯视结构示意图；
图12是本申请实施例提供的拼接面板的结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
本申请实施例提供一种发光二极管面板及拼接面板，下文进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
请参照图1至图3，本申请实施例提供一种发光二极管面板100，其包括一基板11、多个导电体12、多个发光单元13、多条第一走线14、至少一柔性电路板15和多条第二走线16。
基板11包括第一区AA和位于第一区AA外周侧的第二区NA。基板11上设置有多个通孔111，通孔111位于所述第一区AA或第二区NA。
一导电体12对应设置在一通孔111内。导电体12和通孔111一一对应设置。
发光单元13设置在基板11上且对应于第一区AA。一发光单元13包括至少一个发光二极管131。第一走线14设置在基板11上。第一走线14连接于发光二极管131和导电体12。也即，发光单元13和第一走线14均设置在基板11的同一表面上。
其中一个发光单元13对应电性连接于一个导电体12；或者多个发光单元13对应电性连接一个导电体12。
需要说明的是，“连接”不仅可表示物理上的连接，也可以表示电性上的连接。
柔性电路板15设置在基板11远离发光单元13的表面上。第二走线16设置在基板11远离发光单元13的表面上。第二走线16连接于导电体12和柔性电路板15。也即，柔性电路板15和第二走线16均设置在基板11的另一表面上。
本申请实施例的发光二极管面板100，在基板11上设置通孔111，导电体12设置在通孔111内。其中发光单元13通过第一走线14连接于导电体12的一端，柔性电路板15通过第二走线16连接于导电体12的另一端，使得柔性电路板15直接设置在基板11的背面，缩小了发光二极管面板100的边框宽度，进而发光二极管面板100在拼接时，可降低了拼接缝处两侧发光二极管131的距离。
可选的，基板11为硬性基板，比如可以是玻璃基板、蓝宝石基板或硅基板等。当然在一些实施例中，基板11也可以是柔性基板。
可选的，导电体12材料可以是焊锡、金属、纳米金线、金属氧化物、导电胶或导电粒子等导电物质。
可选的，发光二极管131可以是次毫米级发光二极管（Mini-LED）或微型发光二极管（Micro-LED）。
可选的，柔性电路板15可以是柔性电路板或覆晶薄膜。
可选的，第一走线14和第二走线16的材料分别可以是氧化铟锡、氧化铟锌等，还可以为各种导电特性的金属、合金以及化合物及其混合物，例如可以使用金、银、钨、钼、铁、铝、铝-硅、铝-钛、金属材料氮化物等。
可选的，所述通孔111位于第一区AA。将通孔111设置在第一区AA，使得第二区NA不设置通孔111，缩小了第二区NA的宽度。而通孔111可设置在发光单元13之间，也即利用发光单元13之间的空间设置通孔111，达到节省空间的效果。
可选的，一个发光单元13包括一个发光二极管131，也可以包括两个、三个或三个以上的发光二极管131。
可选的，发光单元13与通孔111分别沿着第一方向M排布成排。通孔111与至少部分发光单元13沿着第二方向N交替排布。
其中，第一方向M和第二方向N交叉设置。可选的，第一方向M垂直于第二方向N。
发光单元13通过至少一条第一走线14连接于一导电体12。
可选的，第一区AA包括第一子区A1、位于第一子区A1一侧的第二子区A2和位于第一子区A1另一侧的第三子区A3。通孔111包括第一通孔11a和第二通孔11b，多个第一通孔11a设置在第一子区A1和第二子区A2的交界处，多个第二通孔11b设置在第一子区A1和第三子区A3的交界处。
导电体12包括设置在第一通孔11a内的第一导电体121和设置在第二通孔11b内的第二导电体122。
位于第二子区A2的发光单元13电性连接于第一导电体121。位于第三子区A3的发光单元13电性连接于第二导电体122。位于第一子区A1的发光单元13电性连接于第一导电体121或第二导电体122。
在一些实施例中，位于第一子区A1的发光单元13中，部分发光单元13电性连接于第一导电体121，另一部分发光单元13电性连接第二导电体122。
可选的，在第二方向N上，第一通孔11a和第二通孔11b错位设置，降低基板11被破坏的风险。
另外，请参照图3，可选的，每一第二走线16连接一导电体12。其中自两端的边缘区域向中间区域，第二走线16的长度递减。与中间区域的第二走线16相连的导电体12的图案为方形，与边缘区域的第二走线16相连的导电体12的图案为圆形。这样的设置以降低第二走线16之间电阻的差异性。
当导电体12的图案为方形时，与其对应的通孔111也为方形。当导电体12的图案为圆形时，与其对应的通孔111也为圆形。
在一些实施例中，通孔111的形状也可以全是圆形或方形，也可以是其他形状。
可选的，第二走线16包括依次相连的连接段、中间段和绑定段，所述连接段连接于导电体12，所述绑定段与柔性电路板15绑定连接。
其中相邻的两个所述连接段的延伸方向平行设置；连接于方形的导电体12的连接段的宽度大于连接于圆形的导电体12的宽度。相邻的两个所述绑定段的延伸方向也平行设置；相邻的两个所述绑定段的宽度相等。
在连接于圆形的导电体12的第二走线16中，所述连接段、所述中间段和所述绑定段的宽度相等；在连接于方形的导电体12的第二走线16中，所述连接段的宽度大于所述绑定段的宽度；自所述连接段向所述绑定段的方向上，所述中间段的宽度递减。上述的设置以降低第二走线16之间的阻抗差异。
请参照图4和图5，本实施例的发光二极管面板200与上述实施例的发光二极管面板100的不同之处在于：第一区AA包括第一子区A1、位于第一子区A1一侧的第二子区A2。通孔111包括多个第一通孔11a和多个第二通孔11b，第一通孔11a和第二通孔11b沿着第一方向M排布设置。导电体12包括设置在第一通孔11a内的第一导电体121和设置在第二通孔11b内的第二导电体122。
第一通孔11a和第二通孔11b设置在第一子区A1和第二子区A2的交界处。
位于第一子区A1的发光单元13通过至少一第一走线14电性连接于一第一导电体121，位于第二子区A2的发光单元13通过至少一第一走线14电性连接于一第二导电体122。
可选的，第一通孔11a和第二通孔11b沿着第一方向M交替设置。将第一通孔11a和第二通孔11b交替设置，可节省一个柔性电路板15。
可选的，多个发光单元13呈矩阵式排布。
请参照图6至图8，本实施例的发光二极管面板300与上述实施例的发光二极管面板100的不同之处在于：通孔111设置在第二区NA。
可选的，通孔111设置在第一区AA的一侧。多个通孔111沿着第一方向M排布成排。多个发光单元13沿着第一方向M排布成排。多个发光单元13沿着第二方向N排布成行。
第一方向M与所述第二方向N交叉设置。可选的，第一方向M垂直于第二方向N。
每一行发光单元13通过第一走线14连接于一导电体12。导电体12设置在通孔111内。
可选的，发光二极管面板300包括短边侧和长边侧，通孔111位于短边侧，以减少通孔111的数量。
请参照图9，本实施例的发光二极管面板400与上述实施例的发光二极管面板300不同之处在于：多个通孔111沿着第二方向N排布成行。多个发光单元13沿着第一方向M排布成排。多个发光单元13沿着第二方向N排布成行。
第一方向M与第二方向N交叉设置。可选的，第一方向M垂直于第二方向N。
每一排发光单元13通过第一走线14连接于一导电体12。导电体12设置在通孔111内。
可选的，发光二极管面板300包括短边侧和长边侧，通孔111位于长边侧，以减少第一走线14的阻抗。
请参照图10，本实施例的发光二极管面板500与上述实施例的发光二极管面板300不同之处在于：通孔111包括第一通孔11a和第二通孔11b，多个第一通孔11a设置在第一区AA的一侧，多个第二通孔11b设置在第一区AA的另一侧；导电体12包括设置在第一通孔11a内的第一导电体121和设置在第二通孔11b内的第二导电体122。
多个第一通孔11a和第二通孔11b分别沿着第一方向M排布成排。多个发光单元13沿着第一方向M排布成排。多个发光单元13沿着第二方向N排布成行。第一方向M与第二方向N交叉设置。可选的，第一方向M垂直于第二方向N。
每一行发光单元13中，部分的发光单元13通过所述第一走线14连接于一所述第一导电体121，另一部分的发光单元13通过第一走线14连接于一所述第二导电体122。
请参照图11，本实施例的发光二极管面板600与上述实施例的发光二极管面板300不同之处在于：通孔111包括第一通孔11a和第二通孔11b，多个第一通孔11a设置在第一区AA的一侧，多个第二通孔11b设置在第一区AA的又一侧；导电体12包括设置在第一通孔11a内的第一导电体121和设置在第二通孔11b内的第二导电体122。
多个第一通孔11a沿着第一方向M排布成排，第二通孔11b分别沿着第二方向N排布成行；多个发光单元13沿着第一方向M排布成排，多个发光单元13沿着第二方向N排布成行。第一方向M与所述第二方向N交叉设置。
部分的发光单元13通过所述第一走线14连接于一第一导电体121，另一部分的发光单元13通过第一走线14连接于一第二导电体122。
这样的设置降低第一走线14之间的阻抗的差异。
在一些实施例中，通孔111也可以设置在第一区AA的周围，也即通孔111设置在第一区AA周边的四周区域，每个区域通孔111内的导电体12连接部分的发光单元13。这样的设置以进一步降低第一走线14之间的阻抗的差异。
请参照图12，本申请实施例还提供一种拼接面板1000，其中，至少两个如上述任意一项实施例所述的发光二极管面板，至少两个所述发光二极管面板拼接设置。
当该发光二极管面板MB为发光二极管面板100或发光二极管面板200时，两个发光二极管面板MB之间的拼接缝处的两个发光二极管131之间的距离D可达到尽可能的小。
当该发光二极管面板MB为发光二极管面板300或发光二极管面板400时，两个发光二极管面板MB中，一个发光二极管面板MB具有通孔111的一侧和另一发光二极管面板MB不具有通孔111的一侧拼接设置，以降低拼接缝处的两个发光二极管131之间的距离D。
当该发光二极管面板MB为发光二极管面板600时，两个发光二极管面板MB中，一个发光二极管面板MB具有通孔111的一侧和另一发光二极管面板MB不具有通孔111的一侧拼接设置，以降低拼接缝处的两个发光二极管131之间的距离D。
需要说明的是，本实施例以发光二极管面板MB为上述实施例的发光二极管面板300为例作为示例，但不限于此。
本申请实施例中，基板上设置通孔，导电体设置在通孔内，其中发光单元通过第一走线连接于导电体的一端，柔性电路板通过第二走线连接于导电体的另一端，使得柔性电路板直接设置在基板的背面，缩小了发光二极管面板的边框宽度，进而在发光二极管面板拼接时，降低了拼接缝处两侧发光二极管的距离。
以上对本申请实施例所提供的一种发光二极管面板及拼接面板进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种发光二极管面板，其包括：
    一基板，所述基板包括第一区和位于所述第一区外周侧的第二区，所述基板上设置有多个通孔，所述通孔位于所述第一区或所述第二区；
    多个导电体，一所述导电体对应设置在一所述通孔内；
    多个发光单元，所述发光单元设置在所述基板上且对应于所述第一区，一所述发光单元包括至少一个发光二极管；
    多条第一走线，所述第一走线设置在所述基板上，所述第一走线连接于所述发光二极管和所述导电体；
    至少一柔性电路板，所述柔性电路板设置在所述基板远离所述发光单元的表面上；
    多条第二走线，所述第二走线设置在所述基板远离所述发光单元的表面上，所述第二走线连接于所述导电体和所述柔性电路板。
  2. 根据权利要求1所述的发光二极管面板，其中，所述通孔位于所述第一区。
  3. 根据权利要求2所述的发光二极管面板，其中，所述发光单元与所述通孔分别沿着第一方向排布，所述通孔与至少部分所述发光单元沿着第二方向交替排布，所述第一方向和所述第二方向交叉设置；
    所述发光单元通过至少一条所述第一走线连接于一所述导电体。
  4. 根据权利要求3所述的发光二极管面板，其中，所述第一区包括第一子区、位于所述第一子区一侧的第二子区和位于所述第一子区另一侧的第三子区；所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一子区和所述第二子区的交界处，多个所述第二通孔设置在所述第一子区和所述第三子区的交界处；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
    位于所述第二子区的所述发光单元电性连接于所述第一导电体；位于所述第三子区的所述发光单元电性连接于所述第二导电体；位于所述第一子区的所述发光单元电性连接于所述第一导电体和/或所述第二导电体。
  5. 根据权利要求2所述的发光二极管面板，其中，所述第一区包括第一子区、位于所述第一子区一侧的第二子区；所述通孔包括多个第一通孔和多个第二通孔，所述第一通孔和所述第二通孔沿着第一方向排布设置，所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
    所述第一通孔和所述第二通孔设置在所述第一子区和所述第二子区的交界处；
    位于所述第一子区的所述发光单元通过至少一所述第一走线电性连接于所述第一导电体，位于所述第二子区的所述发光单元通过至少一所述第一走线电性连接于所述第二导电体。
  6. 根据权利要求5所述的发光二极管面板，其中，所述第一通孔和所述第二通孔沿着所述第一方向交替设置。
  7. 根据权利要求1所述的发光二极管面板，其中，所述通孔设置在所述第二区，所述通孔设置在所述第一区的一侧；多个所述通孔沿着第一方向排布，多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
    每一行所述发光单元通过所述第一走线连接于一所述导电体。
  8. 根据权利要求1所述的发光二极管面板，其中，所述通孔设置在所述第二区，所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一区的一侧，多个所述第二通孔设置在所述第一区的另一侧；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
    多个所述第一通孔和所述第二通孔分别沿着第一方向排布，多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
    每一行所述发光单元中，部分的所述发光单元通过所述第一走线连接于一所述第一导电体，另一部分的所述发光单元通过第一走线连接于一所述第二导电体。
  9. 根据权利要求1所述的发光二极管面板，其中，所述通孔设置在所述第二区，所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一区的一侧，多个所述第二通孔设置在所述第一区的又一侧；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
    多个所述第一通孔沿着第一方向排布，所述第二通孔分别沿着第二方向排布；多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
    部分的所述发光单元通过所述第一走线连接于一所述第一导电体，另一部分的所述发光单元通过第一走线连接于一所述第二导电体。
  10. 根据权利要求1所述的发光二极管面板，其中，所述发光二极管是次毫米级发光二极管或微型发光二极管。
  11. 一种拼接面板，其中，至少发光二极管面板，至少两个所述发光二极管面板拼接设置；
    所述发光二极管面板包括：
    一基板，所述基板包括第一区和位于所述第一区外周侧的第二区，所述基板上设置有多个通孔，所述通孔位于所述第一区或所述第二区；
    多个导电体，一所述导电体对应设置在一所述通孔内；
    多个发光单元，所述发光单元设置在所述基板上且对应于所述第一区，一所述发光单元包括至少一个发光二极管；
    多条第一走线，所述第一走线设置在所述基板上，所述第一走线连接于所述发光二极管和所述导电体；
    至少一柔性电路板，所述柔性电路板设置在所述基板远离所述发光单元的表面上；
    多条第二走线，所述第二走线设置在所述基板远离所述发光单元的表面上，所述第二走线连接于所述导电体和所述柔性电路板。
  12. 根据权利要求11所述的拼接面板，其中，所述通孔位于所述第一区。
  13. 根据权利要求12所述的拼接面板，其中，所述发光单元与所述通孔分别沿着第一方向排布，所述通孔与至少部分所述发光单元沿着第二方向交替排布，所述第一方向和所述第二方向交叉设置；
    所述发光单元通过至少一条所述第一走线连接于一所述导电体。
  14. 根据权利要求13所述的拼接面板，其中，所述第一区包括第一子区、位于所述第一子区一侧的第二子区和位于所述第一子区另一侧的第三子区；所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一子区和所述第二子区的交界处，多个所述第二通孔设置在所述第一子区和所述第三子区的交界处；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
    位于所述第二子区的所述发光单元电性连接于所述第一导电体；位于所述第三子区的所述发光单元电性连接于所述第二导电体；位于所述第一子区的所述发光单元电性连接于所述第一导电体和/或所述第二导电体。
  15. 根据权利要求12所述的拼接面板，其中，所述第一区包括第一子区、位于所述第一子区一侧的第二子区；所述通孔包括多个第一通孔和多个第二通孔，所述第一通孔和所述第二通孔沿着第一方向排布设置，所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
    所述第一通孔和所述第二通孔设置在所述第一子区和所述第二子区的交界处；
    位于所述第一子区的所述发光单元通过至少一所述第一走线电性连接于所述第一导电体，位于所述第二子区的所述发光单元通过至少一所述第一走线电性连接于所述第二导电体。
  16. 根据权利要求15所述的拼接面板，其中，所述第一通孔和所述第二通孔沿着所述第一方向交替设置。
  17. 根据权利要求11所述的拼接面板，其中，所述通孔设置在所述第二区，所述通孔设置在所述第一区的一侧；多个所述通孔沿着第一方向排布，多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
    每一行所述发光单元通过所述第一走线连接于一所述导电体。
  18. 根据权利要求11所述的拼接面板，其中，所述通孔设置在所述第二区，所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一区的一侧，多个所述第二通孔设置在所述第一区的另一侧；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
    多个所述第一通孔和所述第二通孔分别沿着第一方向排布，多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
    每一行所述发光单元中，部分的所述发光单元通过所述第一走线连接于一所述第一导电体，另一部分的所述发光单元通过第一走线连接于一所述第二导电体。
  19. 根据权利要求11所述的拼接面板，其中，所述通孔设置在所述第二区，所述通孔包括第一通孔和第二通孔，多个所述第一通孔设置在所述第一区的一侧，多个所述第二通孔设置在所述第一区的又一侧；所述导电体包括设置在所述第一通孔内的第一导电体和设置在所述第二通孔内的第二导电体；
    多个所述第一通孔沿着第一方向排布，所述第二通孔分别沿着第二方向排布；多个所述发光单元沿着第一方向排布，多个所述发光单元沿着第二方向排布，所述第一方向与所述第二方向交叉设置；
    部分的所述发光单元通过所述第一走线连接于一所述第一导电体，另一部分的所述发光单元通过第一走线连接于一所述第二导电体。
  20. 根据权利要求11所述的拼接面板，其中，所述发光二极管是次毫米级发光二极管或微型发光二极管。
PCT/CN2021/109191 2021-07-22 2021-07-29 发光二极管面板及拼接面板 WO2023000369A1 (zh)

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