WO2022265314A1 - 표시장치 및 이를 포함하는 전자장치 - Google Patents
표시장치 및 이를 포함하는 전자장치 Download PDFInfo
- Publication number
- WO2022265314A1 WO2022265314A1 PCT/KR2022/008233 KR2022008233W WO2022265314A1 WO 2022265314 A1 WO2022265314 A1 WO 2022265314A1 KR 2022008233 W KR2022008233 W KR 2022008233W WO 2022265314 A1 WO2022265314 A1 WO 2022265314A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- area
- display
- disposed
- folding area
- Prior art date
Links
- 238000013016 damping Methods 0.000 claims abstract description 71
- 229920000642 polymer Polymers 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 445
- 239000012790 adhesive layer Substances 0.000 claims description 78
- 239000012783 reinforcing fiber Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 24
- 239000011521 glass Substances 0.000 claims description 21
- 229910052755 nonmetal Inorganic materials 0.000 claims description 13
- 230000003287 optical effect Effects 0.000 claims description 11
- 239000011241 protective layer Substances 0.000 claims description 11
- -1 polyethylene terephthalate Polymers 0.000 claims description 10
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 5
- 229920002284 Cellulose triacetate Polymers 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 239000004417 polycarbonate Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 62
- 239000002184 metal Substances 0.000 description 62
- 238000005452 bending Methods 0.000 description 25
- 239000000463 material Substances 0.000 description 14
- 230000004888 barrier function Effects 0.000 description 13
- 239000002131 composite material Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 102220472148 Protein ENL_E11N_mutation Human genes 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 11
- 101100347958 Arabidopsis thaliana NAP1;1 gene Proteins 0.000 description 10
- 101150046077 nfa1 gene Proteins 0.000 description 10
- 101100347962 Arabidopsis thaliana NAP1;2 gene Proteins 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 8
- 230000010287 polarization Effects 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 239000008186 active pharmaceutical agent Substances 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 239000012044 organic layer Substances 0.000 description 7
- 230000035945 sensitivity Effects 0.000 description 7
- 101100055224 Anemone leveillei AL10 gene Proteins 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 101000666063 Homo sapiens WD repeat-containing protein 74 Proteins 0.000 description 5
- 102100038091 WD repeat-containing protein 74 Human genes 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 5
- 210000004905 finger nail Anatomy 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 108090000841 L-Lactate Dehydrogenase (Cytochrome) Proteins 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 239000000088 plastic resin Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 101150080924 CNE1 gene Proteins 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 101100166255 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CEP3 gene Proteins 0.000 description 3
- 101100495436 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) CSE4 gene Proteins 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 210000000282 nail Anatomy 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 101000797623 Homo sapiens Protein AMBP Proteins 0.000 description 2
- 101001108716 Homo sapiens Ribosome biogenesis protein NSA2 homolog Proteins 0.000 description 2
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 2
- 101001022553 Phytolacca americana Lectin-D2 Proteins 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 102100032859 Protein AMBP Human genes 0.000 description 2
- 102100021459 Ribosome biogenesis protein NSA2 homolog Human genes 0.000 description 2
- 101100225106 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) EDC2 gene Proteins 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 229920002457 flexible plastic Polymers 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 2
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 102100031001 Hepatoma-derived growth factor-related protein 2 Human genes 0.000 description 1
- 101001083788 Homo sapiens Hepatoma-derived growth factor-related protein 2 Proteins 0.000 description 1
- 101710198595 Hypoxic response protein 1 Proteins 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- 102100021015 Ubiquitin carboxyl-terminal hydrolase 6 Human genes 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000003666 anti-fingerprint Effects 0.000 description 1
- 150000008378 aryl ethers Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000005345 chemically strengthened glass Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1601—Constructional details related to the housing of computer displays, e.g. of CRT monitors, of flat displays
- G06F1/1605—Multimedia displays, e.g. with integrated or attached speakers, cameras, microphones
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1643—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being associated to a digitizer, e.g. laptops that can be used as penpads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
- G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/872—Containers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04104—Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger
Definitions
- the electro-optical module may include a camera module.
- the display device of the present invention can improve the sensing sensitivity of the digitizer.
- FIG. 5 is a plan view of a display panel according to an exemplary embodiment of the present invention.
- FIG 8 is a plan view of a support layer according to an embodiment of the present invention.
- 9A is a partial perspective view of a support layer according to an embodiment of the present invention.
- first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.
- the electronic device ED may be out-folded so that the display surface DS is exposed to the outside. In one embodiment of the present invention, the electronic device ED may be configured such that an in-folding or out-folding operation is repeated from an unfolding operation, but is not limited thereto. In one embodiment of the present invention, the electronic device ED may be configured to select any one of an unfolding operation, an in-folding operation, and an out-folding operation.
- 2A is an exploded perspective view of an electronic device (ED) according to an embodiment of the present invention.
- 2B is a block diagram of an electronic device (ED) according to an embodiment of the present invention.
- the first active area DP-TA may have higher transmittance than the second active area DP-NTA and the non-active area DP-NDA.
- the driving chip DIC may include driving elements for driving pixels of the display panel DP, for example, a data driving circuit.
- FIG. 2A shows a structure in which the driving chip DIC is mounted on the display panel DP, the present invention is not limited thereto.
- the driving chip DIC may be mounted on the flexible circuit film FCB.
- the electro-optical module ELM overlaps the first display area TA (see FIG. 1A ) and the first active area DP-TA.
- the electro-optical module (ELM) may be disposed below the display module (DM).
- FIG. 3 is a cross-sectional view corresponding to the cutting line II′ shown in FIG. 1A.
- the through hole TA-T may be formed by stacking the components shown in FIG. 3 or by stacking components having holes.
- the bezel pattern BP may correspond to the non-display area NDA shown in FIG. 1A.
- the bezel pattern BP may have a closed curve shape on a plane.
- An inner area of the inner edge B-IE of the bezel pattern BP may correspond to the second display area NTA shown in FIG. 1A.
- the first adhesive layer AL1 may be a pressure sensitive adhesive film (PSA) or an optically clear adhesive (OCA). Or it may include a conventional adhesive.
- PSA pressure sensitive adhesive film
- OCA optically clear adhesive
- the description of the first adhesive layer AL1 may be equally applied to the adhesive layers described below.
- the scan lines SL1 to SLm may extend in the second direction DR2 and be connected to the scan driver SDV.
- the data lines DL1 to DLn extend in the first direction DR1 and may be connected to the driving chip DIC via the bending area BA.
- the light emitting lines EL1 to ELm may extend in the first direction DR1 and be connected to the light emitting driver EDV.
- the 1st-3rd sub-pixels E13M are spaced apart in the second direction DR2 with the 1-2nd sub-pixels E12M interposed therebetween, and the two spaced 1-3rd sub-pixels E13M are It may be disposed in a diagonal direction along the fifth direction DR5. In this embodiment, the 1st to 3rd sub-pixels E13M may provide blue light.
- the 2-2nd sub-pixel E22M is spaced apart from the 2-1st sub-pixel E21M along the fourth direction DR4, and the 2-3rd sub-pixel E23M is the 2-1st sub-pixel E23M. They may be spaced apart along the fifth direction DR5 based on (E21M). The 2-3rd sub-pixel E23M may be spaced apart from the 2-2nd sub-pixel E22M along the second direction DR2.
- the 2-3rd sub-pixel E23M may have a square shape defined in the fourth and fifth directions DR4 and DR5.
- the 2-3 sub-pixels E23M may provide red light.
- the 2-3rd sub-pixel E23M is based on the 1-1st sub-pixels E11M providing the same color among the sub-pixels E11M, E12M, and E13M disposed in the first active area DP-TA. may have a rhombus shape.
- 6B is a cross-sectional view of a display module DM according to an embodiment of the present invention.
- the insulating layer of the first insulating layer L10 as well as the circuit layer 120 to be described below may be an inorganic layer and/or an organic layer, and may have a single-layer or multi-layer structure.
- the inorganic layer may include at least one of the above materials, but is not limited thereto.
- the fourth insulating layer L40 may be disposed on the third insulating layer L30.
- the fourth insulating layer L40 overlaps the gate GT2 of the oxide transistor O-TFT, and the source region SE2 and drain region DE2 of the oxide transistor O-TFT are exposed. It may be an insulating pattern that
- each of the sixth insulating layer L60 , the seventh insulating layer L70 , and the eighth insulating layer L80 may be an organic layer.
- each of the sixth insulating layer L60, the seventh insulating layer L70, and the eighth insulating layer L80 may be made of BCB (Benzocyclobutene), polyimide, HMDSO (Hexamethyldisiloxane), or Polymethylmethacrylate (PMMA).
- B general-purpose polymers such as polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide polymers, arylether polymers, amide polymers, fluorine polymers, p-xylene polymers, vinyl alcohol polymers, and blends thereof, and the like.
- the input sensor IS may be disposed on the display panel DP.
- the input sensor IS may be formed on the display panel DP through a continuous process.
- the input sensor IS may be directly disposed on the display panel DP.
- “directly disposed” may mean that a third component is not disposed between the input sensor IS and the display panel DP.
- the first and second conductive layers 220 and 240 may include a metal layer or a transparent conductive layer.
- the sensing insulating layer 230 may be disposed between the first conductive layer 220 and the second conductive layer 240 .
- the sensing insulating layer 230 may include an inorganic layer.
- the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.
- the third adhesive layer (or upper adhesive layer, AL3) is directly disposed on the lower surface of the damping layer DL.
- the display panel DP is shown in FIG. 7A for convenience, as shown in FIG. 6B , the color filter layer 300 and the input sensor IS are further disposed between the display panel DP and the third adhesive layer AL3. That is, the third adhesive layer AL3 may combine the damping layer DL and the color filter layer 300 .
- the thickness of the fourth adhesive layer indicates the thickness of the aforementioned fourth adhesive layer AL4.
- the thickness of the damping layer represents the thickness of the aforementioned damping layer (DL), and in Comparative Example 4 in which the polarization layer is applied instead of the damping layer, the thickness of the polarization layer is represented.
- the electronic device of Comparative Example 4 includes the fourth adhesive layer and includes a polarization layer instead of the damping layer.
- the polarization layer may be disposed at the same position as the damping layer, and may be specifically disposed on the display panel.
- the folding operation may be easy without defects. That is, although the electronic device of the present invention includes a damping layer on the display panel, stress applied to the display panel can be reduced like the electronic device of the reference example that does not include a damping layer or a polarization layer.
- the sixth adhesive layer AL6 couples the barrier layer BRL and the support layer PLT.
- the sixth adhesive layer AL6 may include a first portion AL6 - 1 and a second portion AL6 - 2 spaced apart from each other.
- the first part AL6 - 1 and the second part AL6 - 2 are defined as different parts of one adhesive layer, but are not limited thereto.
- the first portion AL6 - 1 is defined as one adhesive layer (eg, the first adhesive layer)
- the second portion AL6 - 2 may be defined as another adhesive layer (eg, the second adhesive layer).
- the support layer PLT corresponds to the folding area FA0 and is disposed between the first support portion PLT-1 and the second support portion PLT-2, and has a plurality of openings OP.
- a defined folding part may be further included.
- the folding portion PLT-F may prevent foreign matter from penetrating into an area of the barrier layer BRL opened from the first support portion PLT-1 and the second support portion PLT-2 during operation.
- the folding portion PLT-F may be omitted.
- a cover layer SCV and a digitizer DTM are disposed below the support layer PLT.
- a cover layer SCV is disposed to overlap the folding area FA0.
- the digitizer DTM may include a first digitizer DTM-1 and a second digitizer DTM-2 overlapping the first and second support parts PLT-1 and PLT-2, respectively. .
- a portion of each of the first digitizer DTM-1 and the second digitizer DTM-2 may be disposed below the cover layer SCV.
- the ninth adhesive layer AL9 couples the digitizer DTM and the metal layer ML.
- the ninth adhesive layer AL9 may include a first part AL9 - 1 and a second part AL9 - 2 corresponding to the first metal layer ML1 and the second metal layer ML2 .
- the tenth adhesive layer AL10 couples the metal layer ML and the metal plate MP.
- the tenth adhesive layer AL10 may include a first part AL10 - 1 and a second part AL10 - 2 corresponding to the first metal plate MP1 and the second metal plate MP2 .
- a heat dissipation layer HRP may be disposed below the metal plate MP.
- the heat dissipation layer HRP may include a first heat dissipation layer HRP1 and a second heat dissipation layer HRP2 overlapping the first metal plate MP1 and the second metal plate MP2 , respectively.
- the heat dissipation layer (HRP) dissipates heat generated from electronic components disposed on the lower side.
- the electronic components may be electronic modules (EM) shown in FIGS. 2A and 2B.
- the heat dissipation layer (HRP) may have a structure in which an adhesive layer and a graphite layer are alternately laminated. An outermost adhesive layer may be attached to the metal plate MP.
- a magnetic field shielding sheet is disposed below the metal plate (MP).
- the magnetic field shielding sheet (MSM) shields a magnetic field generated from a magnetic body (not shown) disposed on the lower side.
- the magnetic field shielding sheet (MSM) can prevent the magnetic field generated from the magnetic material from interfering with the digitizer (DTM).
- the support layer PLT is divided into a first support portion PLT-1, a folding portion PLT-F, and a second support portion PLT-2 along the second direction DR2.
- a plurality of openings OP may be defined in the folding portion PLT-F.
- the support layer PLT of the present invention may include a non-metal.
- a reinforcing fiber composite and a plastic may be included.
- FIG. 9A is a partial perspective view of a support layer PLT according to an embodiment of the present invention.
- Figure 9b is a perspective view showing an embodiment of a reinforcing fiber.
- 9C is a partial perspective view of the support layer PLT according to an embodiment of the present invention.
- the reinforcing fibers FB may be carbon fibers or glass fibers.
- the matrix MX may be formed of a polymer resin.
- the matrix MX may be formed of a thermoplastic resin.
- the matrix MX may include a polyamide-based resin or a polypropylene-based resin.
- the reinforced fiber composite material may be carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP).
- FIG. 10 is an enlarged view of the BB region of the support layer PLT shown in FIG. 8 .
- the first digitizer DTM- 1 includes the base layer BL, first coils 510 disposed on one surface of the base layer BL, and the other surface of the base layer BL. It includes second coils 520 disposed on.
- the base layer BL may include a plastic film, for example, a polyimide film.
- the first coils 510 and the second coils 520 may include metal, and may include gold (Au), silver (Ag), copper (Cu), or aluminum (Al).
- a planarization layer (not shown) disposed on the first protective layer PL-D1 may be further included.
- the curve generated on the upper surface of the digitizer DTM may be removed.
- the planarization layer PLL may include at least one of a resin layer and an adhesive layer.
- the first support portion PLT-1 and the second support portion PLT-2 may include reinforcing fibers. Accordingly, the magnetic field generated by the digitizer DTM may pass through the support layer PLT while maintaining sensitivity.
- the digitizer DTM disposed below the support layer PLT may detect an external input.
- the sensitivity of the digitizer (DTM) can be maintained excellently by applying the support layer (PLT) including a non-metal on the digitizer (DTM).
- a through hole TA-T may be formed in any one of the first digitizer DTM-1 and the second digitizer DTM-2.
- the first digitizer DTM -1) may have a through hole TA-T formed therein.
- the electronic device of the present invention may include a damping layer to improve impact resistance.
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Multimedia (AREA)
- Electromagnetism (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
평가 항목 | 실시예 1 | 비교예 1 | ||
비폴딩영역 | 폴딩영역 | 비폴딩영역 | 폴딩영역 | |
손톱 가압(kgf) | 12 | 7 | 12 | 3 |
펜 내충격(cm) | 6 | 4 | 5 | 3 |
평가 항목 | 실시예 2 | 비교예 2 | 비교예 3 | 비교예 4 | 참고예 |
제4 접착층 두께 (㎛) |
25 | 25 | 18 | 18 | 18 |
댐핑층(편광층) 두께 (㎛) |
23 | 40 | 40 | (31) | - |
최저 온도(℃) | -20 | -15 | -10 | -15 | -20 |
Claims (20)
- 윈도우모듈; 및제1 비폴딩영역, 제2 비폴딩영역 및 상기 제1 비폴딩영역과 상기 제2 비폴딩영역 사이에 배치된 폴딩영역이 구분된 표시모듈; 을 포함하고,상기 표시모듈은 상기 윈도우모듈 아래에 순서대로 적층된 댐핑층, 컬러필터층, 표시패널, 및 하측부재를 포함하고,상기 댐핑층은 폴리머를 포함하는 표시장치.
- 제1 항에 있어서,상기 댐핑층의 두께는 5㎛ 이상 30㎛ 이하인 표시장치.
- 제1 항에 있어서,상기 윈도우모듈은 윈도우 보호층 및 박막 유리 기판을 포함하는 표시장치.
- 제3 항에 있어서,상기 댐핑층의 모듈러스 값은 상기 윈도우 보호층의 모듈러스 값 이하인 표시장치.
- 제1 항에 있어서,상기 댐핑층의 하면에 직접 배치된 상측 접착층을 더 포함하고,상기 상측 접착층의 두께는 40㎛ 이상 60㎛ 이하인 표시장치.
- 제1 항에 있어서,상기 표시패널 아래에 배치된 패널 보호층; 및상기 표시패널과 상기 패널 보호층을 결합시키는 하측 접착층; 을 더 포함하고,상기 하측 접착층의 두께는 20㎛ 이상 30 ㎛ 이하인 표시장치.
- 제1 항에 있어서,상기 하측부재는 비금속을 포함하는 지지층 및 상기 지지층 아래에 배치된 디지타이저를 포함하는 표시장치.
- 제7 항에 있어서,상기 비금속은 강화 섬유인 표시장치.
- 제1 항에 있어서,상기 댐핑층은 폴리이미드(Polyimide), 폴리 카보네이트(Polycarbonate), 폴리아미드(Polyamide), 트리아세틸셀루로오스(Triacetylcellulose), 폴리 메틸메타크릴레이트(Polymethylmethacrylate), 및 폴리에틸렌 테레프탈레이트(polyethylene terephthalate) 중 적어도 하나를 포함하는 표시장치.
- 제1 항에 있어서,상기 하측부재에는 평면상에서 상기 제1 비폴딩영역 및 상기 제2 비폴딩영역 중 어느 하나에 중첩한 관통홀이 정의되고,상기 표시패널은 평면상에서 상기 관통홀에 중첩하는 표시장치.
- 제1 항에 있어서,상기 컬러필터층 및 상기 표시패널 사이에 배치된 입력 센서를 더 포함하는 표시장치.
- 제1 비폴딩영역, 제2 비폴딩영역 및 폴딩영역이 구분된 표시패널;상기 표시패널 상측에 배치되고 컬러필터패턴들 및 분할패턴을 포함하는 컬러필터층;상기 컬러필터층 상측에 배치되고, 폴리머를 포함하는 댐핑층; 및상기 표시패널 하측에 배치된 하측부재; 를 포함하는 표시장치.
- 제12 항에 있어서,상기 하측부재에는 평면상에서 상기 제1 비폴딩영역 및 상기 제2 비폴딩영역 중 어느 하나에 중첩하는 관통홀이 정의되고,상기 표시패널은 평면상에서 상기 관통홀에 중첩하는 표시장치.
- 제12 항에 있어서,상기 하측부재는 상기 표시패널 아래에 배치된 패널 보호층;상기 패널 보호층 아래에 배치되고 비금속을 포함하는 지지층; 및상기 지지층 아래에 배치된 디지타이저; 를 더 포함하는 표시장치.
- 제14 항에 있어서,상기 비금속은 강화 섬유인 표시장치.
- 제12 항에 있어서,상기 댐핑층의 두께는 5㎛ 이상 30㎛ 이하인 표시장치.
- 광 신호가 통과하는 제1 표시 영역, 상기 제1 표시 영역에 인접한 제2 표시 영역, 및 상기 제2 표시 영역에 인접한 주변 영역을 포함하는 표시장치; 및상기 표시장치의 하측에 배치되고, 평면상에서 상기 제1 표시 영역에 중첩하며, 상기 광 신호를 수신하는 전자광학모듈; 을 포함하고,상기 표시장치는,윈도우모듈; 및제1 비폴딩영역, 제2 비폴딩영역 및 상기 제1 비폴딩영역과 상기 제2 비폴딩영역 사이에 배치된 폴딩영역이 구분된 표시모듈; 을 포함하고,상기 표시모듈은 상기 윈도우모듈 아래에 순서대로 적층된 댐핑층, 컬러필터층, 표시패널, 및 하측부재를 포함하고,상기 댐핑층은 폴리머를 포함하는 전자장치.
- 제17 항에 있어서,상기 컬러필터층은 컬러필터패턴들 및 분할패턴을 포함하는 전자장치.
- 제17 항에 있어서,상기 댐핑층의 두께는 5㎛ 이상 30㎛인 전자장치.
- 제17 항에 있어서,상기 전자광학모듈은 카메라 모듈을 포함하는 전자장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MX2023008052A MX2023008052A (es) | 2021-06-14 | 2022-06-10 | Dispositivo de visualizacion y dispositivo electronico que comprende el mismo. |
BR112023013141A BR112023013141A2 (pt) | 2021-06-14 | 2022-06-10 | Dispositivo de vídeo e dispositivo eletrônico compreendendo o mesmo |
EP22825239.1A EP4358073A1 (en) | 2021-06-14 | 2022-06-10 | Display device and electronic device comprising same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2021-0077029 | 2021-06-14 | ||
KR1020210077029A KR20220167844A (ko) | 2021-06-14 | 2021-06-14 | 표시장치 및 이를 포함하는 전자장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022265314A1 true WO2022265314A1 (ko) | 2022-12-22 |
Family
ID=83992269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2022/008233 WO2022265314A1 (ko) | 2021-06-14 | 2022-06-10 | 표시장치 및 이를 포함하는 전자장치 |
Country Status (7)
Country | Link |
---|---|
US (2) | US11860691B2 (ko) |
EP (1) | EP4358073A1 (ko) |
KR (1) | KR20220167844A (ko) |
CN (2) | CN217821941U (ko) |
BR (1) | BR112023013141A2 (ko) |
MX (1) | MX2023008052A (ko) |
WO (1) | WO2022265314A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230036642A (ko) * | 2021-09-07 | 2023-03-15 | 삼성디스플레이 주식회사 | 디지타이저를 포함한 전자 장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180196467A1 (en) * | 2017-01-10 | 2018-07-12 | Lenovo (Singapore) Pte. Ltd. | Portable information device |
KR20200098758A (ko) * | 2019-02-11 | 2020-08-21 | 삼성디스플레이 주식회사 | 표시 장치 |
CN111781999A (zh) * | 2020-07-01 | 2020-10-16 | 京东方科技集团股份有限公司 | 一种折叠显示结构及电子设备 |
KR20210016983A (ko) * | 2019-08-06 | 2021-02-17 | 삼성전자주식회사 | 플렉시블 디스플레이 어셈블리 및 이를 포함하는 전자 장치 |
CN213424443U (zh) * | 2020-10-10 | 2021-06-11 | 深圳市柔宇科技股份有限公司 | 可折叠显示模组和电子设备 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102578589B1 (ko) | 2016-09-30 | 2023-09-14 | 엘지디스플레이 주식회사 | 플렉서블 표시장치 |
KR20180058912A (ko) * | 2016-11-24 | 2018-06-04 | 삼성디스플레이 주식회사 | 하드 코팅 조성물 및 플렉서블 표시 장치 |
KR20180075779A (ko) * | 2016-12-26 | 2018-07-05 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102412154B1 (ko) * | 2017-07-07 | 2022-06-23 | 삼성디스플레이 주식회사 | 표시장치 및 그 제조방법 |
-
2021
- 2021-06-14 KR KR1020210077029A patent/KR20220167844A/ko active Search and Examination
-
2022
- 2022-01-13 US US17/574,872 patent/US11860691B2/en active Active
- 2022-06-10 WO PCT/KR2022/008233 patent/WO2022265314A1/ko active Application Filing
- 2022-06-10 MX MX2023008052A patent/MX2023008052A/es unknown
- 2022-06-10 BR BR112023013141A patent/BR112023013141A2/pt unknown
- 2022-06-10 EP EP22825239.1A patent/EP4358073A1/en active Pending
- 2022-06-13 CN CN202221481485.7U patent/CN217821941U/zh active Active
- 2022-06-13 CN CN202210662038.XA patent/CN115482729A/zh active Pending
-
2023
- 2023-11-20 US US18/514,672 patent/US20240094766A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180196467A1 (en) * | 2017-01-10 | 2018-07-12 | Lenovo (Singapore) Pte. Ltd. | Portable information device |
KR20200098758A (ko) * | 2019-02-11 | 2020-08-21 | 삼성디스플레이 주식회사 | 표시 장치 |
KR20210016983A (ko) * | 2019-08-06 | 2021-02-17 | 삼성전자주식회사 | 플렉시블 디스플레이 어셈블리 및 이를 포함하는 전자 장치 |
CN111781999A (zh) * | 2020-07-01 | 2020-10-16 | 京东方科技集团股份有限公司 | 一种折叠显示结构及电子设备 |
CN213424443U (zh) * | 2020-10-10 | 2021-06-11 | 深圳市柔宇科技股份有限公司 | 可折叠显示模组和电子设备 |
Also Published As
Publication number | Publication date |
---|---|
US11860691B2 (en) | 2024-01-02 |
BR112023013141A2 (pt) | 2024-01-16 |
MX2023008052A (es) | 2023-07-17 |
CN115482729A (zh) | 2022-12-16 |
US20240094766A1 (en) | 2024-03-21 |
US20220397934A1 (en) | 2022-12-15 |
KR20220167844A (ko) | 2022-12-22 |
EP4358073A1 (en) | 2024-04-24 |
CN217821941U (zh) | 2022-11-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2020036275A1 (ko) | 표시 장치 | |
AU2015368103B2 (en) | Window cover and display apparatus having the same and method of manufacturing display apparatus | |
WO2016144108A1 (ko) | 이미지 스캔 가능한 디스플레이 장치 | |
WO2016171421A1 (ko) | 터치 윈도우 | |
WO2020022589A1 (ko) | 압력 센서를 포함하는 표시 장치 | |
WO2016024760A1 (ko) | 터치윈도우 | |
WO2020145506A1 (ko) | 표시 장치 | |
WO2022265287A1 (ko) | 표시장치 및 이를 포함하는 전자장치 | |
WO2023033364A1 (ko) | 표시 장치 및 그것을 포함하는 전자 장치 | |
WO2022265243A1 (ko) | 표시 장치 및 그것을 포함하는 전자 장치 | |
WO2020075927A1 (ko) | 전자 장치 | |
WO2018048105A1 (ko) | 터치 입력 장치 | |
WO2022265314A1 (ko) | 표시장치 및 이를 포함하는 전자장치 | |
WO2022244979A1 (ko) | 표시 장치 및 그것을 포함하는 전자 장치 | |
WO2021167299A1 (en) | Electronic device | |
WO2022265329A1 (ko) | 표시 장치 및 이를 포함하는 전자 장치 | |
WO2023013899A1 (ko) | 표시장치 및 이를 포함하는 전자장치 | |
WO2020153593A1 (ko) | 터치 감지 유닛과 그를 포함하는 표시 장치 | |
WO2015170836A1 (en) | Electronic device | |
WO2022164093A1 (ko) | 롤러블 표시 장치 및 이의 제조 방법 | |
WO2020130368A1 (ko) | 표시 패널, 그를 포함한 표시 장치, 및 표시 장치의 제조 방법 | |
WO2022245092A1 (ko) | 전자 장치 | |
WO2022245158A1 (ko) | 표시장치 및 이를 포함하는 전자장치 | |
WO2022265313A1 (ko) | 표시장치 제조 방법, 그에 따라 제조된 표시장치, 및 표시장치를 포함하는 전자장치 | |
WO2024071800A1 (ko) | 표시 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22825239 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: MX/A/2023/008052 Country of ref document: MX |
|
REG | Reference to national code |
Ref country code: BR Ref legal event code: B01A Ref document number: 112023013141 Country of ref document: BR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2022825239 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 112023013141 Country of ref document: BR Kind code of ref document: A2 Effective date: 20230629 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2022825239 Country of ref document: EP Effective date: 20240115 |