WO2022265237A1 - 안테나 모듈을 포함하는 전자 장치 - Google Patents
안테나 모듈을 포함하는 전자 장치 Download PDFInfo
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- WO2022265237A1 WO2022265237A1 PCT/KR2022/007212 KR2022007212W WO2022265237A1 WO 2022265237 A1 WO2022265237 A1 WO 2022265237A1 KR 2022007212 W KR2022007212 W KR 2022007212W WO 2022265237 A1 WO2022265237 A1 WO 2022265237A1
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- injection member
- electronic device
- module
- permittivity
- metal housing
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/062—Hermetically-sealed casings sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/02—Refracting or diffracting devices, e.g. lens, prism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
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Definitions
- the present disclosure relates to arrangement and combination of structures included in an electronic device to improve waterproof performance and antenna performance.
- Electronic devices include home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet personal computers (PCs), video/audio devices, desktop/laptop computers, and car navigation systems that have specific functions depending on the installed program. It may refer to a device that performs For example, these electronic devices may output stored and/or transmitted information as sound or image.
- a single electronic device such as a mobile communication terminal may be equipped with various functions. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are integrated into one electronic device. will be.
- These electronic devices are miniaturized so that users can conveniently carry them.
- metal frames included in electronic products or elements included in electronic products are also being miniaturized and slimmed down.
- the metal frames or elements may be formed of various types of metal materials.
- An electronic device may provide various functions to a user through wireless communication. These electronic devices may include antennas of various shapes or structures for communication through various frequencies. According to existing technologies, it may be difficult to secure a space for installing an antenna in an electronic device, for example, a mobile communication terminal. For example, due to miniaturization of electronic devices, it may be difficult to sufficiently secure a physical separation distance between circuit devices and an antenna.
- radiator included as at least a part of the antenna is disposed close to the surface of the electronic device, circuit devices (eg, printed circuit board (PCB) wiring, PCB ground, semiconductor chips, resistors, capacitors or inductors, etc.) and at least a part of the antenna.
- circuit devices eg, printed circuit board (PCB) wiring, PCB ground, semiconductor chips, resistors, capacitors or inductors, etc.
- a general electronic device has an appearance, and the appearance of the electronic device may be affected by materials or component arrangement.
- a part of the exterior of the electronic device may include a plurality of members related to the exterior.
- a display, a receiver, a front camera, etc. may be disposed on the front of the exterior of the electronic device, and a rear camera, flash, speaker hole, etc. may be disposed on the rear of the exterior.
- side keys, universal serial bus (USB) connectors, earphone jack connectors, microphone holes, and the like may be disposed on the side of the electronic device.
- the arrangement of the components may be changed according to the external design of the electronic product.
- a part related to the exterior disposed in the electronic device may include an exterior member.
- an exterior member for example, among exterior members, a movable exterior member that performs a physical pressing operation or an exterior member having a hole for insertion may be vulnerable to waterproofing.
- a volume control key or a power key disposed on a side surface of an electronic device may be movably disposed with a key top exposed to the outside.
- a gap is generated between the moving member and the case frame, and foreign matter such as moisture penetrates into the electronic device through the gap and damages the substrate or the like.
- an aspect of the present disclosure is to provide an electronic device having a highly waterproof structure while securing antenna performance.
- a metal housing (hereinafter referred to as metal) forming the exterior of an electronic device and a shape for a coupling structure are required, so a segment made of one injection material is required for waterproofing and rigidity, and the antenna radiation range is limited, thereby limiting the radiation range of the antenna.
- metal a metal housing
- the material surrounding the exterior is molded into a single material to ensure the reliability of the mechanical structure, such as waterproof performance.
- a single material such as polybutylene terephthalate (PBT)/glass fiber (GF) is used at about 45%. If a single material with a permittivity of about 3.5 is used, the margin may be insufficient to secure antenna performance.
- the present disclosure it is possible to combine two injection members made of different injection materials in a region bonded to metal for waterproofing and rigidity, and the dielectric constants of the injection members may be different.
- the material bonded to the metal from the inside serves to reinforce the rigidity by preventing cracks by supplementing mechanical rigidity, and the material bonded to the metal from the outside increases the permittivity unlike the internal material to help secure antenna performance. there is.
- a plurality of injection members may use materials having different dielectric constants, and different raw materials may be applied to each. When different raw materials are applied, they may not be completely chemically bonded during injection, so mechanical rigidity can be secured by forming a physical bonding structure.
- a portable electronic device includes a metal housing, an antenna module located in the metal housing, a first extruded member positioned in a radial direction of the antenna module and having a first permittivity, and at least a portion of the first extruded member being in contact with the antenna.
- a second injection member positioned on the radial direction of the module and having a second permittivity different from the first permittivity and a first organic material disposed along the inner surface of the metal housing for bonding with at least a portion of the first ejection member. contains the membrane
- the second injection member forms an external appearance of the portable electronic device together with the metal housing.
- the second injection member is engaged with the first injection member through a coupling structure in which one of the first injection member and the second injection member protrudes at least partially from the other one of the first injection member and the second injection member. It can be.
- an electronic device includes a metal housing, an antenna module disposed in the metal housing, a first extrusion member containing an inorganic material and having a first permittivity, and a second injection member having a second permittivity higher than the first permittivity.
- the second injection member forms an exterior of the portable electronic device together with the metal housing. At least a portion of the second injection member may be bonded to the first injection member through a coupling structure with the first injection member.
- the first ejection member and the second ejection member may be positioned in a radial direction of the antenna module to ensure antenna radiation performance.
- Various embodiments of the present disclosure may have high rigidity through a coupling structure between the first injection member and the second injection member having different dielectric constants.
- Various embodiments of the present disclosure may have high waterproof performance due to the second injection member present on the exterior of the portable electronic device.
- FIG. 1 is a block diagram of an electronic device in a network environment, according to an embodiment of the present disclosure.
- FIG. 2 is a front perspective view of an electronic device according to an embodiment of the present disclosure.
- FIG. 3 is a rear perspective view of an electronic device according to an embodiment of the present disclosure.
- FIG. 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.
- FIG 5 shows an appearance of an antenna module according to an embodiment of the present disclosure.
- FIG 6 shows an existing structure including an antenna module.
- FIG. 7 illustrates an improvement structure for securing antenna performance according to an embodiment of the present disclosure.
- 8A, 8B, and 8C illustrate a coupling structure of an ejection member according to various embodiments of the present disclosure.
- 9A, 9B, and 9C illustrate a coupling structure of an ejection member according to various embodiments of the present disclosure.
- FIG. 10 illustrates a manufacturing process using injection molding materials having different dielectric constants according to an embodiment of the present disclosure.
- 11A and 11B show an antenna module stack structure to which additional components may be attached according to various embodiments of the present disclosure.
- FIG. 12 illustrates a coupling structure of a first injection member and a second injection member according to an embodiment of the present disclosure.
- FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment of the present disclosure.
- an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
- the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included.
- at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added.
- some of these components eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.
- the processor 120 for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
- software eg, the program 140
- processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
- the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor (AP)), or a secondary processor 123 (eg, a graphics processing unit, It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
- a main processor 121 eg, a central processing unit or an application processor (AP)
- a secondary processor 123 eg, a graphics processing unit, It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
- NPU neural processing unit
- the auxiliary processor 123 uses less power than the main processor 121 or is set to be specialized for a designated function. It can be.
- the secondary processor 123 may be implemented separately from or as part of the main processor 121 .
- the secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
- the auxiliary processor 123 eg, image signal processor or communication processor
- the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
- AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 108).
- the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited.
- the artificial intelligence model may include a plurality of artificial neural network layers.
- Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples.
- the artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
- the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 .
- the data may include, for example, input data or output data for software (eg, program 140) and commands related thereto.
- the memory 130 may include volatile memory 132 or non-volatile memory 134 .
- the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
- the input module 150 may receive a command or data to be used in other components (eg, the processor 120) of the electronic device 101 from an outside of the electronic device 101 (eg, a user).
- the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
- the sound output module 155 may output sound signals to the outside of the electronic device 101 .
- the sound output module 155 may include, for example, a speaker or a receiver.
- the speaker can be used for general purposes such as multimedia playback or recording playback.
- a receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
- the display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
- the display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
- the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.
- the audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
- the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
- the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
- the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.
- the interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102).
- the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
- HDMI high definition multimedia interface
- USB universal serial bus
- SD card interface Secure Digital Card interface
- audio interface audio interface
- connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102).
- the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
- the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses.
- the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
- the camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
- the power management module 188 may manage power supplied to the electronic device 101 .
- the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
- PMIC power management integrated circuit
- the battery 189 may supply power to at least one component of the electronic device 101 .
- the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
- the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported.
- the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
- the communication module 190 may be a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a : a local area network (LAN) communication module or a power line communication module).
- a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, a legacy communication module).
- the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
- the electronic device 101 may be identified and/or authenticated.
- the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology).
- NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)).
- eMBB enhanced mobile broadband
- mMTC massive machine type communications
- URLLC ultra-reliable and low latency
- -latency communications can be supported.
- the wireless communication module 192 may support, for example, a high frequency band (eg, a millimeter wave (mmWave) band) in order to achieve a high data rate.
- mmWave millimeter wave
- the wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported.
- the wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199).
- the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.
- eMBB peak data rate for eMBB realization
- a loss coverage for mMTC realization eg, 164 dB or less
- U-plane latency for URLLC realization eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less
- the antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device).
- the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, a printed circuit board (PCB)).
- the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
- other components eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
- RFIC radio frequency integrated circuit
- the antenna module 197 may form a mmWave antenna module.
- the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
- peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
- signal e.g. commands or data
- commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
- Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
- all or part of operations executed in the electronic device 101 may be executed in one or more external devices among the external electronic devices 102 , 104 , and 108 .
- the electronic device 101 when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself.
- one or more external electronic devices may be requested to perform the function or at least part of the service.
- One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 .
- the electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed.
- cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
- the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
- the external electronic device 104 may include an internet of things (IoT) device.
- Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 .
- the electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
- Electronic devices may be devices of various types.
- the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
- a portable communication device eg, a smart phone
- a computer device e.g., a smart phone
- a portable multimedia device e.g., a portable medical device
- a camera e.g., a portable medical device
- a camera e.g., a portable medical device
- a camera e.g., a portable medical device
- a camera e.g., a camera
- a wearable device e.g., a smart bracelet
- first, second, or first or secondary may simply be used to distinguish that component from other corresponding components, and may refer to that component in other respects (eg, importance or order) is not limited.
- a (eg, first) component is said to be “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively.”
- the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.
- module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits.
- a module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions.
- the module may be implemented in the form of an application-specific integrated circuit (ASIC).
- ASIC application-specific integrated circuit
- a storage medium eg, internal memory 136 or external memory 138
- a machine eg, electronic device 101
- a processor eg, the processor 120
- a device eg, the electronic device 101
- the one or more instructions may include code generated by a compiler or code executable by an interpreter.
- the device-readable storage medium may be provided in the form of a non-transitory storage medium.
- the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.
- a signal e.g. electromagnetic wave
- the method according to various embodiments disclosed in this document may be included and provided in a computer program product.
- Computer program products may be traded between sellers and buyers as commodities.
- a computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
- a device-readable storage medium eg compact disc read only memory (CD-ROM)
- an application store eg Play Store TM
- It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
- at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.
- each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is.
- one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added.
- a plurality of components eg modules or programs
- the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. .
- the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.
- FIG. 2 is a front perspective view of an electronic device according to an embodiment of the present disclosure.
- 3 is a rear perspective view of an electronic device according to an embodiment of the present disclosure.
- the electronic device 101 has a front side 310A, a back side 310B, and a side surface 310C surrounding a space between the front side 310A and the back side 310B. It may include a housing 310 including a). In another embodiment (not shown), the housing 310 may refer to a structure forming some of the front face 310A of FIG. 2 , the rear face 310B and the side face 310C of FIG. 3 . According to one embodiment, the front surface 310A may be formed by a front plate 302 (eg, a glass plate or a polymer plate including various coating layers) that is substantially transparent at least in part.
- a front plate 302 eg, a glass plate or a polymer plate including various coating layers
- the rear surface 310B may be formed by the rear plate 311 .
- the rear plate 311 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
- the side surface 310C may be formed by a side bezel structure (or "side member") 318 coupled to the front plate 302 and the rear plate 311 and including metal and/or polymer.
- the back plate 311 and the side bezel structure 318 may be integrally formed and include the same material (eg, glass, a metal material such as aluminum, or ceramic).
- the front plate 302 includes two first edge regions 310D curved from the front surface 310A toward the rear plate 311 and extending seamlessly, the front plate ( 302) at both ends of the long edge.
- the rear plate 311 has two second edge regions 310E that are curved from the rear surface 310B toward the front plate 302 and extend seamlessly at both ends of the long edges.
- the front plate 302 (or the rear plate 311) may include only one of the first edge regions 310D (or the second edge regions 310E). In another embodiment, some of the first edge regions 310D or the second edge regions 310E may not be included.
- the side bezel structure 318 when viewed from the side of the electronic device 101, has a side that does not include the first edge areas 310D or the second edge areas 310E.
- a side surface may have a first thickness (or width), and a side surface including the first edge regions 310D or the second edge regions 310E may have a second thickness smaller than the first thickness.
- the electronic device 101 includes a display 301 (eg, the display module 160 of FIG. 1 ), audio modules 303 , 307 , and 314 (eg, the audio module 170 of FIG. 1 ). ), a sensor module (eg, sensor module 176 of FIG. 1), a camera module 305, 312, 313 (eg, camera module 180 of FIG. 1), a key input device 317 (eg, FIG. 1 of the input module 150), and connector holes 308 and 309 (eg, the connection terminal 178 of FIG. 1).
- the electronic device 101 may omit at least one of the components (eg, the connector hole 309) or may additionally include other components.
- the display 301 may be visually exposed, for example, through a substantial portion of the front plate 302 .
- at least a portion of the display 301 may be exposed through the front plate 302 forming the front surface 310A and the first edge regions 310D.
- a corner of the display 301 may be substantially identical to an adjacent outer shape of the front plate 302 .
- the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.
- the surface of the housing 310 may include a screen display area formed as the display 301 is visually exposed.
- the screen display area may include a front surface 310A and first edge areas 310D.
- a recess or an opening is formed in a portion of a screen display area (eg, the front surface 310A and the first edge area 310D) of the display 301, and the recess Alternatively, at least one of an audio module 314, a sensor module (not shown), a light emitting device (not shown), and a camera module 305 aligned with the opening may be included.
- an audio module 314, a sensor module (not shown), a camera module 305, a fingerprint sensor (not shown), and a light emitting element (not shown) may include at least one or more.
- At least one camera module 305 or 312 may be disposed in a lower direction of the display 301 .
- the first camera module 305 may be disposed in at least a partial area of the display 301 corresponding to a camera field of view (FOV).
- FOV camera field of view
- the position of the first camera module 305 may not be visually distinguished (or exposed).
- the first camera module 305 when viewing the display 301 from the front 310A, the first camera module 305 is disposed in at least a part of the display 301, corresponding to the camera field of view (FOV), to the outside. An image of an external subject may be obtained without being visually exposed.
- the first camera module 305 may be an under display camera (UDC).
- the electronic device 101 may include a display (not shown) that is disposed to be capable of sliding movement and provides a screen (eg, a display area).
- the display area of the electronic device 101 may be an area that is visually exposed and allows an image to be output.
- the electronic device 101 may adjust the display area according to the movement of the sliding plate (not shown) or the movement of the display.
- the electronic device 101 is configured such that at least a portion (eg, the housing 310) of the electronic device 101 slides at least partially to promote selective expansion of a display area.
- a rollable electronic device may be included.
- the aforementioned display 301 may also be referred to as, for example, a slide-out display or an expandable display.
- the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic stylus pen. can be placed.
- a touch sensing circuit capable of measuring the intensity (pressure) of a touch
- a digitizer capable of measuring the intensity (pressure) of a touch
- a digitizer that detects a magnetic stylus pen.
- at least a portion of the key input device 317 may be disposed in the first edge areas 310D and/or the second edge areas 310E.
- the audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 .
- a microphone for acquiring external sound may be disposed inside the microphone hole 303, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound.
- the speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for communication.
- the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).
- the audio modules 303 , 307 , and 314 are not limited to the above structure, and may be variously designed depending on the structure of the electronic device 101, such as mounting only some audio modules or adding new audio modules.
- the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state.
- the sensor module may include, for example, a first sensor module (eg, a proximity sensor) and/or a second sensor module (eg, a fingerprint sensor) disposed on the front surface 310A of the housing 310, and/or Alternatively, a third sensor module (eg, a heart rate monitor (HRM) sensor) and/or a fourth sensor module (eg, a fingerprint sensor) disposed on the rear surface 310B of the housing 310 may be included.
- HRM heart rate monitor
- the fingerprint sensor may be disposed on the rear surface 310B as well as the front surface 310A (eg, the display 301 ) of the housing 310 .
- the electronic device 101 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor may be further included.
- the sensor module is not limited to the above structure, and depending on the structure of the electronic device 101, the design may be variously changed, such as mounting only some sensor modules or adding a new sensor module.
- the camera modules 305, 312, and 313 are, for example, a front camera module 305 disposed on the front side 310A of the electronic device 101, and a rear side disposed on the rear side 310B.
- a camera module 312 and/or a flash 313 may be included.
- the camera modules 305 and 312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor.
- the flash 313 may include, for example, a light emitting diode or a xenon lamp.
- two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of electronic device 101 .
- the camera modules 305 , 312 , and 313 are not limited to the above structure, and may be variously designed depending on the structure of the electronic device 101, such as mounting only some camera modules or adding new camera modules.
- the electronic device 101 may include a plurality of camera modules (eg, a dual camera or a triple camera) each having a different property (eg, angle of view) or function.
- a plurality of camera modules 305 and 312 including lenses having different angles of view may be configured, and the electronic device 101 is a camera that is performed in the electronic device 101 based on a user's selection. It is possible to control the viewing angles of the modules 305 and 312 to be changed.
- at least one of the plurality of camera modules 305 and 312 may be a wide-angle camera and at least the other may be a telephoto camera.
- the plurality of camera modules 305 and 312 may be a front camera, and at least another one may be a rear camera.
- the plurality of camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (eg, a time of flight (TOF) camera or a structured light camera).
- IR infrared
- TOF time of flight
- the IR camera may operate as at least a part of the sensor module.
- the TOF camera may operate as at least a part of a sensor module (not shown) for detecting a distance to a subject.
- the key input device 317 may be disposed on the side surface 310C of the housing 310 .
- the electronic device 101 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 that are not included are on the display 301, such as soft keys. It can be implemented in different forms.
- the key input device may include a sensor module (not shown) disposed on the rear surface 310B of the housing 310 .
- a light emitting device may be disposed on, for example, the front surface 310A of the housing 310 .
- a light emitting element (not shown) may provide, for example, state information of the electronic device 101 in the form of light.
- a light emitting device may provide a light source that interlocks with the operation of the front camera module 305, for example.
- the light emitting device may include, for example, an LED, an IR LED, and/or a xenon lamp.
- the connector holes 308 and 309 are, for example, a first connector hole capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device.
- a connector eg, a USB connector
- a second connector hole eg, earphone jack
- the camera modules 305 and 312 and/or some of the sensor modules may be disposed to be exposed to the outside through at least a portion of the display 301 .
- the camera module 305 may include a punch hole camera disposed inside a hole or recess formed on the rear surface of the display 301 .
- the camera module 312 may be disposed inside the housing 310 such that the lens is exposed to the rear surface 310B of the electronic device 101 .
- the camera module 312 may be disposed on a printed circuit board (eg, the printed circuit board 340 of FIG. 4 ).
- the camera module 305 and/or the sensor module may be in contact with the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 302 of the display 301. can be placed. Also, some sensor modules (not shown) may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device.
- FIG. 4 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure.
- an electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 3 ) according to various embodiments has a side bezel structure 331 (eg, the side bezel structure of FIG. 2 ( 318)), the first support member 372, the front plate 320 (eg, the front plate 302 of FIG. 2), the display 330 (eg, the display 301 of FIG. 2), the printed circuit board ( 340) (e.g. PCB, flexible PCB (FPCB), or rigid flexible PCB (RFPCB)), battery 350 (e.g. battery 189 of FIG. 1), second support member 360 (e.g. rear case ), an antenna 370 (eg, the antenna module 197 of FIG.
- a side bezel structure 331 eg, the side bezel structure of FIG. 2 ( 318)
- the first support member 372 eg, the front plate 302 of FIG. 2
- the display 330 eg, the display 301 of FIG. 2
- the printed circuit board ( 340) e.g. PC
- the electronic device 101 may omit at least one of the components (eg, the first support member 372 or the second support member 360) or may additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and duplicate descriptions are omitted below.
- the first support member 372 may be disposed inside the electronic device 101 and connected to the side bezel structure 331 or integrally formed with the side bezel structure 331 .
- the first support member 372 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
- the display 330 may be coupled to one surface of the first support member 372 and the printed circuit board 340 may be coupled to the other surface.
- a processor, a memory, and/or an interface may be mounted on the printed circuit board 340 .
- the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
- the printed circuit board 340 may include a flexible printed circuit board type radio frequency cable (FRC).
- FRC radio frequency cable
- the printed circuit board 340 may be disposed on at least a portion of the first support member 372, an antenna module (eg, the antenna module 197 of FIG. 1) and a communication module (eg, the antenna module 197 of FIG. 1). It may be electrically connected to the communication module 190).
- the memory may include, for example, a volatile memory or a non-volatile memory.
- the interface (eg, interface 177 of FIG. 1 ) includes, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
- HDMI high definition multimedia interface
- USB universal serial bus
- SD card interface Secure Digital
- audio interface can include The interface may electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
- the battery 350 (eg, the battery 189 of FIG. 1 ) is a device for supplying power to at least one component of the electronic device 101, for example, a non-rechargeable primary battery. cells, or rechargeable secondary cells, or fuel cells. At least a portion of the battery 350 may be disposed on a substantially coplanar surface with the printed circuit board 340 , for example.
- the battery 350 may be integrally disposed inside the electronic device 101 or may be disposed detachably from the electronic device 101 .
- the second support member 360 (eg, a rear case) may be disposed between the printed circuit board 340 and the antenna 370 .
- the second support member 360 may include one surface to which at least one of the printed circuit board 340 or the battery 350 is coupled and the other surface to which the antenna 370 is coupled.
- the antenna 370 may be disposed between the rear plate 380 and the battery 350 .
- the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
- the antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
- an antenna structure may be formed by a part of the side bezel structure 331 and/or the first support member 372 or a combination thereof.
- the rear plate 380 may form at least a part of the rear surface (eg, the rear surface 310B of FIG. 3 ) of the electronic device 101 .
- FIG 5 illustrates an appearance of an antenna module according to an embodiment of the present disclosure.
- a metal 501 and a module stack structure 502 constituting an external appearance of the electronic device 101 are shown.
- the present disclosure proposes a mechanism structure optimized for improving antenna performance and securing waterproof performance.
- FIG 6 shows an existing structure including an antenna module.
- FIG. 7 illustrates an improvement structure for securing antenna performance according to an embodiment of the present disclosure.
- the existing structure of the module stack structure 502 includes an antenna module (eg, 601 in FIG. 6), and is located in a region including a radiation direction from the lower end of the antenna module (eg, 601 in FIG. 6).
- the lower glass eg, back glass 602 in FIG. 6
- the metal eg, 604 in FIG. 6 forming the outer edge of the electronic device 101, the antenna module (eg, 601 in FIG. 6), and the metal (eg, 601 in FIG. 6) are located.
- the injection member included in the existing structure contains glass fiber as a thermoplastic resin. It plays a role in securing waterproof performance by reducing set deformation, ensuring durability, and/or preventing set damage.
- the material surrounding the periphery of the module stacked structure 502, which is an antenna mounting structure is molded from a single material to secure reliability of the mechanical structure, such as waterproof performance.
- an antenna performance influence section eg, 610 in FIG. 6
- the antenna performance effect section is partially limited by a metal having conductivity (eg, 604 in FIG. this can be improved.
- the performance of the antenna may be related to the permittivity of the ejection member (eg, 603 of FIG. 6 ).
- the dielectric constant a material having a dielectric constant ranging between about 2.0 and 3.5 may be used as a raw material (eg, high molecular weight polymer or resin) of the injection member (eg, 603 in FIG. 6 ), and may include an inorganic material.
- the dielectric constant is distributed between about 7.2 and 7.3, so increasing the ratio of glass fibers increases the dielectric constant.
- CDF can be a 5G antenna performance evaluation measurement method, and generally can use about 50% of the measured value as a criterion for determining UE performance. In other words, CDF 50% measures the performance of all 5G antenna beams and, assuming that all beams are 100, permittivity through equivalent isotropic radiated power (EIRP), which is the output power value of one beam with the 50th best performance Each antenna performance can be simulated.
- EIRP equivalent isotropic radiated power
- a gain value for antenna performance may be derived by simulating each of a plurality of frequency bands (for example, n258 and n261) for each permittivity. It can be seen that as the permittivity gradually increases, the total gain value increases, which can be advantageous for securing performance. If the permittivity of the injection member (e.g., 603 in FIG. 6) is increased, the performance of the antenna can be improved. Searing problems may arise.
- ceramic-based inorganic materials such as zirconia and alumina having smaller particle sizes than glass fibers may be added to improve fluidity of the resin and prevent injection at high temperatures.
- fluidity When an inorganic material is added, fluidity may be better than that of glass fiber, but in the case of a ceramic-based inorganic material, a problem in that impact resistance and rigidity may be lower than that of glass fiber may occur. If the rigidity is low, cracks may occur when falling, making it difficult to secure waterproof performance.
- the improved structure can be described with reference to FIG. 7 so as to secure the performance of the antenna, reinforce its rigidity, and have waterproof characteristics.
- FIG. 7 is an improved structure inside the module stacked structure 502, including an antenna module (eg, 601 in FIG. 6), and a lower glass (eg, FIG. 6 ) at the bottom of the antenna module (eg, 601 in FIG. back glass 602) is located, a metal housing (eg, 704 in FIG. 7 ) constituting the outer edge of the electronic device 101, and an antenna module (eg, 601 in FIG. 6 ) and a metal housing (eg, in FIG. 7 ). 704) and a first ejection member (eg, 701 in FIG. 7) positioned between them.
- a metal housing (eg, 704 in FIG. 7 ) and a second injection member (eg, 702 in FIG. 7 ) are included outside the electronic device 101 .
- the description of FIG. 6 may be applied to the antenna module (eg, 601 of FIG. 6 ) and the lower glass (eg, back glass 602 of FIG. 6 ).
- the antenna module eg, 601 in FIG. 6
- the antenna module is installed in an existing structure (eg, in FIG. 6) in a lower glass (eg, back glass 602 in FIG. ) may be spaced apart from each other by a certain distance.
- the antenna module (eg 601 in FIG. 6 ) includes a first ejection member (eg 701 in FIG. 7 ) and a second ejection member (eg 702 in FIG. 7 ) placed on a radiation area (eg 710 in FIG. 7 ).
- injection members may be mounted in the same x-axis direction as the antenna module (eg, 601 in FIG. 6), and a metal housing having conductivity (eg, 704 in FIG. 7) area can be minimized.
- a metal housing (eg, 704 in FIG. 7 ) may be bonded to two injection members.
- the two injection members may have different dielectric constants.
- the first injection member (eg, 701 in FIG. 7 ) bonded inside the metal housing (eg, 704 in FIG. 7 ) may supplement mechanical rigidity to prevent cracks and reinforce rigidity.
- the first injection member (eg, 701 of FIG. 7 ) bonded inside the metal housing (eg, 704 of FIG. 7 ) may form a first organic layer (eg, 703 of FIG. 7 ).
- the second injection member (eg, 702 in FIG. 7 ) forms the outer boundary of the electronic device 101 together with the metal housing (eg, 704 in FIG.
- the second injection member (eg, 702 of FIG. 7 ) bonded to the metal housing (eg, 704 of FIG. 7 ) may form a second organic layer (not shown) on at least a portion of the bonding surface.
- the first organic layer (eg, 704 in FIG. 7 ) may be formed through a TRI process, and the second organic layer (not shown) may be formed after the first organic layer (eg, 704 in FIG. 7 ) is formed. .
- the first organic layer or the second organic layer included in the metal housing (eg, 704 of FIG. 7 ) may enhance bonding strength between the metal housing (eg, 704 of FIG. 7 ) and the injection member.
- the metal housing (eg, 704 in FIG. 7 ) may be formed symmetrically about the x-axis so as not to interfere with the radiation area (eg, 710 in FIG. 7 ). It can be seen that the radiation area (eg, 710 in FIG. 7 ) has a wider range than the antenna performance influence zone (eg, 610 in FIG. 6 ) in the existing structure (eg, FIG. 6 ).
- the description of the first injection member (eg, 701 of FIG. 7 ) of FIG. 6 may be applied mutatis mutandis.
- the first injection member may be mounted inside a metal housing (eg, 704 in FIG. 7 ), and may form a metal housing (eg, 704 in FIG. 7 ) and a first organic layer (eg, 703 in FIG. 7 ).
- the first injection member (eg, 701 of FIG. 7 ) may include a thermoplastic resin and an inorganic material (eg, primary PBT, secondary PC).
- Inorganic materials increase the rigidity of the injection member to secure the strength of the appliance, reduce set deformation by reducing shrinkage, secure durability of the appliance, and secure waterproof performance by preventing damage to the appliance.
- the fluidity of the injection-molded product decreases, which may cause difficulty in injection due to lack of fluidity, and when the temperature is raised to increase the fluidity, carbonization and poor appearance may occur.
- the first injection member eg, 701 in FIG.
- the first injection member eg, 701 of FIG. 7
- the metal housing eg, 704 of FIG. 7
- the resin applied to the first injection member may contain about 30% or more of an inorganic material such as glass fiber in order to secure mechanical rigidity and prevent shrinkage.
- the first injection member eg, 701 of FIG. 7
- the second injection member may use a material having a higher permittivity than that of the first injection member (eg, 701 of FIG. 7 ) to improve antenna performance.
- the second injection member eg, 702 in FIG. 7
- the resin raw material base of the second injection member may include, for example, polycarbonate, polybutylene terephthalate, or polyphenylene sulfide.
- the inorganic material may include, for example, Glass Fiber, Talc, Wollastonite, or ZrO2.
- the second injection member (eg, 702 of FIG. 7 ) may have a different composition ratio or a different application of at least one of the components included in the raw material base and the inorganic material than that of the first injection member (eg, 701 of FIG. 7 ). there is.
- the basic permittivity of each material may be as follows.
- raw materials that can be used are about 2.9 to 3.0 for polycarbonate, about 2.1 to 2.2 for polypropylene, about 2.0 to 2.1 for modified polyphenylene oxide, about 3.0 to 3.2 for polybutylene terephthalate, and about 3.1 to 3.3 for polyphenylene sulfide.
- glass fiber has a permittivity of about 7.2 to 7.3
- mineral materials such as Talc/Wollastonite have a permittivity of about 4.5 to 6.5
- ZrO2 a ceramic material such as zirconia
- a material is made with a different composition from the first injection member (eg, 701 in FIG. 7), and the first injection member (eg, FIG. 7 701 of) and a second extrusion member (eg, 702 in FIG. 7) having a different dielectric constant can be utilized, and antenna characteristics can be optimized by increasing the permittivity of the second extrusion member (eg, 702 in FIG. 7).
- mechanical rigidity may be secured by forming a physical coupling structure (or interlacing structure).
- FIG. 8A, 8, and 8C show a coupling structure of an ejection member according to various embodiments of the present disclosure.
- 9A, 9B, and 9C show a coupling structure of an ejection member according to various embodiments of the present disclosure.
- FIG. 10 illustrates a manufacturing process using injection molding materials having different dielectric constants according to an embodiment of the present disclosure.
- FIG. 12 illustrates a coupling structure of a first injection member and a second injection member according to an embodiment of the present disclosure.
- FIG. 8A shows a metal housing and a second injection member (eg, 702 in FIG. 7 and 802 in FIG. 8A ) exposed to the outside of the electronic device 101 , and the first injection molding is located inside the electronic device 101 .
- a member eg, 701 in FIG. 7 and 801 in FIG. 8A
- FIGS. 5 to 7 may be applied to the first injection member (eg, 801 of FIG. 8A ) and the second injection member (eg, 802 of FIG. 8A ).
- FIG. 8B is a cross section AA′ of FIG. 8A, and shows a coupling structure (eg, 701 in FIG. 7 and 801 in FIG. 8A) and a second injection member (eg, 702 in FIG. 7 and 802 in FIG. 8A) (example). : 810 of FIG. 8A).
- Figure 8c shows a cross section of the finished product.
- the coupling structure (eg, 810 in FIG. 8B ) is applied to coupling of two injection members having different dielectric constants and different raw material bases, thereby ensuring durability of the appliance. It is shown that the coupling structure can be formed in various shapes (eg, 901a, 901b, 901c) in FIGS. 9a to 9c. 8C is a cross-section of a finished product 811, which includes various types of coupling structures (eg, 810 in FIG. 8B, 901a in FIG. 9A, 901B in FIG. 9B, and 901C in FIG. 9C) between a plurality of injection members. can For example, the coupling structure (eg, 810 in FIG.
- first injection member eg, 701 in FIG. 7 , 801 in FIG. 8A
- second injection member eg, 702 in FIG. 7 , 802 in FIG. 8A
- the second injection member protrudes inwardly and surrounds the first injection member (eg, 701 in FIG. 7 or 801 in FIG. 8A ).
- the coupling structure eg, 810 in FIG. 8A
- the second injection member eg, 702 in FIG. 7 , 802 in FIG. 8A
- first injection member eg, 701 in FIG. 7 , 801 in FIG. 8A
- the first injection member protrudes inwardly and surrounds the second injection member (eg, 702 in FIG. 7 or 802 in FIG. 8A ).
- a coupling structure eg, 810 in FIG. 8B
- a first injection member eg, 701 in FIG. 7 , 801 in FIG. 8A
- a second injection member eg, 702 in FIG. 7 , 802 in FIG. 8A
- It may contain penetrating shapes.
- Various weaving structures or coupling structures may be formed to supplement durability of the electronic device 101 .
- a process of manufacturing the module stacked structure 502 formed of two injection members having different dielectric constants may refer to FIG. 10 .
- a first injection member is inserted into a metal housing (eg, 604 in FIG. 6) (eg, 1001 in FIG. 10), and the second injection member is CNC-processed.
- a second injection member eg, 702 in FIG. 7 having a different dielectric constant is inserted (eg, 702 in FIG. 7) : 1003 in FIG. 10) and a shape may be manufactured (eg, 1004 in FIG. 10) by CNC machining to secure a mounting space in which an antenna module (eg, 601 in FIG. 6) can be located.
- FIG. 11A and 11B illustrate an antenna module stack structure to which additional components may be attached according to various embodiments of the present disclosure.
- a metal housing (eg, 604 in FIG. 6 ) including a metal (eg, 501 in FIG. 5 ) and a module stack structure (eg, 502 in FIG. 5 ), a first injection member (eg, 502 in FIG. 7 ) 701 of ) and the second injection member (eg, 702 of FIG. 7 ) may apply the descriptions of FIGS. 5 to 7 mutatis mutandis.
- the film (eg, 1101 in FIG. 11A ) provides waterproofing, rigidity, or decoration without forming a separate coupling structure with components inside the module stack structure (eg, 502 in FIG. 5 ).
- it may be located outside the electronic device 101.
- the film may be attached to the second injection member (eg, 702 of FIG. 7 ) exposed outside the electronic device 101 through painting/deposition.
- a film (eg, 1101 of FIG. 11A ) may implement various textures based on metallic paint or deposition.
- the film may implement a metallic texture by including a plastic material.
- a material (for example, 1102 in FIG. 11B) and/or tape for bonding is between the first injection member (for example, 701 in FIG.
- a film (eg, 1101 of FIG. 11A ) is an example of the present disclosure, and may be formed of at least one of a deposition layer and a coating layer.
- a plurality of injection members having different dielectric constants may form a coupling structure as shown in FIG. 12 .
- a plurality of injection members may be included to form the module stacked structure 502, for example, a first injection member (eg, 1201 of FIG. 12 ), a second injection member (eg, 1201 of FIG. 12 ), 1202 of FIG. 12 ) and the third ejection member (eg, 1203 of FIG. 12 ) may be coupled to each other.
- the first injection member eg, 701 of FIG. 7
- the second injection member eg, 702 of FIG. 7
- the first injection member and the second injection member Boundaries (eg, 1201 and 1202 of FIG. 12 , 1202 and 1203 of FIG. 12 ) of the two injection members may form a coupling structure in which two injection members having different dielectric constants are intertwined for durability.
- disposed, located on the radial direction of the antenna module, and having a second permittivity different from the first permittivity, and along an inner surface of the metal housing for bonding with at least a portion of the first ejection member may include a first organic film disposed thereon, a second ejection member forms an exterior of the portable electronic device together with a metal housing, and the second ejection member is one of the first ejection member and the second ejection member.
- a portable electronic device coupled to the first ejection member through a coupling structure that at least partially protrudes from the other one of the first ejection member and the second ejection member may be proposed.
- a second organic layer disposed along an inner surface of the metal housing to be bonded to at least a portion of the second injection member may be included.
- the metal housing may be located above and below the second injection member based on the radiation direction of the antenna module.
- the composition ratio of raw materials and inorganic substances included in the first injection member may be different from that of the second injection member, and the types of raw materials and inorganic substances included in the first injection member may be different from those of the second injection member.
- the first permittivity may have a difference in permittivity from the second permittivity of 0.5 or more.
- the second injection member may have a higher dielectric constant than the first injection member.
- the second injection member may protrude into the first injection member.
- the first injection member may protrude into the second injection member.
- At least one of a film covering at least a portion of a surface of the second injection member forming an exterior of the portable electronic device, a deposition layer, and a coating layer may be further included.
- the coupling structure may have a structure in which one of the first injection member and the second injection member penetrates the other one of the first injection member and the second injection member.
- a portable electronic device includes a metal housing, an antenna module disposed in the metal housing, a first extruded member including an inorganic material and having a first permittivity, and a second ejection member having a second permittivity higher than the first permittivity.
- the second injection member may form an exterior of the portable electronic device together with the metal housing, and at least a portion of the second injection member may be bonded to the first injection member through a coupling structure with the first injection member.
- the portable electronic device may include a first organic layer disposed along an inner surface of the metal housing to be bonded to at least a portion of the first injection member.
- the portable electronic device may include a second organic layer disposed along an inner surface of the metal housing to be bonded to at least a portion of the second injection member.
- the first injection member and the second injection member may be located in a radiation direction of the antenna module.
- the composition ratio of the raw material and the inorganic material included in the first injection member may be different from that of the second injection member.
- the types of raw materials and minerals included in the first injection member may be different from those of the second injection member.
- the first permittivity may have a difference in permittivity from the second permittivity of 0.5 or more.
- the first injection member may protrude toward the inside of the second injection member.
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Abstract
Description
Claims (15)
- 휴대용 전자 장치에 있어서,금속 하우징;상기 금속 하우징 내에 위치한 안테나 모듈;상기 안테나 모듈의 방사 방향 상에 위치하고, 제1 유전율을 가지는 제1 사출 부재;상기 제1 사출 부재와 적어도 일부가 접촉 배치되고, 상기 안테나 모듈의 방사 방향 상에 위치하며, 상기 제1 유전율과 상이한 제2 유전율을 가지는 제2 사출 부재; 및상기 제1 사출 부재의 적어도 일부와 접합하기 위한 상기 금속 하우징의 내측면을 따라 배치된 제1 유기막을 포함하고,상기 제2 사출 부재는 상기 금속 하우징과 함께 상기 휴대용 전자 장치의 외관을 형성하고,상기 제2 사출 부재는 상기 제1 사출 부재 또는 상기 제2 사출 부재 중 하나가 상기 제1 사출 부재 또는 상기 제2 사출 부재 중 다른 하나에 적어도 부분적으로 돌출되는 결합 구조를 통해 제1 사출 부재와 결합된 휴대용 전자 장치.
- 제1항에서,상기 제2 사출 부재의 적어도 일부와 접합하기 위한 상기 금속 하우징의 내측면을 따라 배치된 제2 유기막을 포함하는 휴대용 전자 장치.
- 제1항에서,상기 금속 하우징은 상기 안테나 모듈의 상기 방사 방향을 기준으로 상기 제2 사출 부재의 상단 및 하단에 위치하는 휴대용 전자 장치.
- 제1항에서,상기 제1 사출 부재에 포함된 원재료 및 무기물에 대한 조성비가 상기 제2 사출 부재와 다른 휴대용 전자 장치.
- 제1항에서,상기 제1 사출 부재에 포함된 원재료 및 무기질에 대한 종류가 상기 제2 사출 부재와 다른 휴대용 전자 장치.
- 제1항에서,상기 제1 유전율은 상기 제2 유전율과 0.5 이상의 유전율 차이를 갖는 휴대용 전자 장치.
- 제1항에서,상기 결합 구조에서, 상기 제2 사출 부재는 상기 제1 사출 부재 내측으로 돌출 되는 휴대용 전자 장치.
- 제1 항에서,상기 결합 구조에서, 상기 제1 사출 부재는 상기 제2 사출 부재 내측으로 돌출되는 휴대용 전자 장치.
- 제1항에서,상기 제2 사출 부재는 상기 제1 사출 부재보다 더 높은 유전율을 가지는 휴대용 전자 장치.
- 제1항에서,상기 휴대용 전자 장치의 외관을 형성하는 상기 제2 사출 부재의 표면의 적어도 일부를 감싸는 필름을 더 포함하는 휴대용 전자 장치.
- 제1항에서,상기 결합 구조는 상기 제1 사출 부재 또는 상기 제2 사출 부재 중 하나가 상기 제1 사출 부재 또는 상기 제2 사출 부재 중 다른 하나를 관통하는 형상을 포함하는 구조인 휴대용 전자 장치.
- 휴대용 전자 장치에 있어서,금속 하우징;상기 금속 하우징 내에 위치한 안테나 모듈;무기물을 포함하며 제1 유전율을 가지는 제1 사출 부재; 및제1 유전율보다 높은 제2 유전율을 가지는 제2 사출 부재를 포함하고,상기 제2 사출 부재는 상기 금속 하우징과 함께 상기 휴대용 전자 장치의 외관을 형성하고,상기 제2 사출 부재는 적어도 일부가 상기 제1 사출 부재와 결합 구조를 통해 상기 제1 사출 부재와 접합하도록 형성되는 휴대용 전자 장치.
- 제12항에서상기 제1 사출 부재의 적어도 일부와 접합하기 위한 상기 금속 하우징의 내측면을 따라 배치된 제1 유기막을 포함하는 휴대용 전자 장치.
- 제12항에서상기 제2 사출 부재의 적어도 일부와 접합하기 위한 상기 금속 하우징의 내측면을 따라 배치된 제2 유기막을 포함하는 휴대용 전자 장치.
- 제12항에서상기 제1 사출 부재 및 상기 제2 사출 부재는 상기 안테나 모듈의 방사 방향 상에 위치하는 휴대용 전자 장치.
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CN202280038987.9A CN117397374A (zh) | 2021-06-14 | 2022-05-20 | 包括天线模块的电子装置 |
EP22825163.3A EP4290991A1 (en) | 2021-06-14 | 2022-05-20 | Electronic device including antenna module |
US17/831,963 US20220400171A1 (en) | 2021-06-14 | 2022-06-03 | Electronic device including antenna module |
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KR1020210076961A KR20220167678A (ko) | 2021-06-14 | 2021-06-14 | 안테나 모듈을 포함하는 전자 장치 |
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US17/831,963 Continuation US20220400171A1 (en) | 2021-06-14 | 2022-06-03 | Electronic device including antenna module |
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US20120157175A1 (en) * | 2010-12-20 | 2012-06-21 | Golko Albert J | Peripheral Electronic Device Housing Members with Gaps and Dielectric Coatings |
JP2016036104A (ja) * | 2014-08-04 | 2016-03-17 | 富士通株式会社 | 無線通信モジュール |
US20200259258A1 (en) * | 2019-02-08 | 2020-08-13 | Apple Inc. | Electronic Device Having Multi-Frequency Ultra-Wideband Antennas |
US20210119338A1 (en) * | 2019-02-28 | 2021-04-22 | Apple Inc. | Electronic Devices with Dielectric Resonator Antennas |
KR20210069598A (ko) * | 2019-12-03 | 2021-06-11 | 애플 인크. | 핸드헬드 전자 장치 |
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2021
- 2021-06-14 KR KR1020210076961A patent/KR20220167678A/ko unknown
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2022
- 2022-05-20 WO PCT/KR2022/007212 patent/WO2022265237A1/ko active Application Filing
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US20120157175A1 (en) * | 2010-12-20 | 2012-06-21 | Golko Albert J | Peripheral Electronic Device Housing Members with Gaps and Dielectric Coatings |
JP2016036104A (ja) * | 2014-08-04 | 2016-03-17 | 富士通株式会社 | 無線通信モジュール |
US20200259258A1 (en) * | 2019-02-08 | 2020-08-13 | Apple Inc. | Electronic Device Having Multi-Frequency Ultra-Wideband Antennas |
US20210119338A1 (en) * | 2019-02-28 | 2021-04-22 | Apple Inc. | Electronic Devices with Dielectric Resonator Antennas |
KR20210069598A (ko) * | 2019-12-03 | 2021-06-11 | 애플 인크. | 핸드헬드 전자 장치 |
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