WO2022263454A1 - Generative fertigungsverfahren zur herstellung von dreidimensionalen gegenständen - Google Patents
Generative fertigungsverfahren zur herstellung von dreidimensionalen gegenständen Download PDFInfo
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- WO2022263454A1 WO2022263454A1 PCT/EP2022/066196 EP2022066196W WO2022263454A1 WO 2022263454 A1 WO2022263454 A1 WO 2022263454A1 EP 2022066196 W EP2022066196 W EP 2022066196W WO 2022263454 A1 WO2022263454 A1 WO 2022263454A1
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- Prior art keywords
- composition
- weight
- novolak
- formaldehyde
- reaction temperature
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000000654 additive Substances 0.000 title claims abstract description 21
- 230000000996 additive effect Effects 0.000 title claims abstract description 12
- 239000000203 mixture Substances 0.000 claims abstract description 72
- 229920003986 novolac Polymers 0.000 claims abstract description 41
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 36
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical class O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 238000006243 chemical reaction Methods 0.000 claims abstract description 28
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 150000001412 amines Chemical class 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 28
- 239000004848 polyfunctional curative Substances 0.000 claims description 25
- -1 polyoxymethylene Polymers 0.000 claims description 20
- 238000010146 3D printing Methods 0.000 claims description 11
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 229920006324 polyoxymethylene Polymers 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 6
- 150000005690 diesters Chemical class 0.000 claims description 5
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- OXQXGKNECHBVMO-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1C(C(=O)O)CCC2OC21 OXQXGKNECHBVMO-UHFFFAOYSA-N 0.000 claims description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- 150000002118 epoxides Chemical class 0.000 claims description 3
- VDFVNEFVBPFDSB-UHFFFAOYSA-N 1,3-dioxane Chemical compound C1COCOC1 VDFVNEFVBPFDSB-UHFFFAOYSA-N 0.000 claims description 2
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical class C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 claims description 2
- VQQKXHVFMOWTMX-UHFFFAOYSA-N 3-propyloxetane-2,4-dione Chemical compound CCCC1C(=O)OC1=O VQQKXHVFMOWTMX-UHFFFAOYSA-N 0.000 claims description 2
- RCJRILMVFLGCJY-UHFFFAOYSA-N 4-phenyl-1,3-dioxane Chemical compound O1COCCC1C1=CC=CC=C1 RCJRILMVFLGCJY-UHFFFAOYSA-N 0.000 claims description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 2
- 150000008064 anhydrides Chemical class 0.000 claims description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 2
- 239000012955 diaryliodonium Substances 0.000 claims description 2
- 125000005520 diaryliodonium group Chemical group 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 claims description 2
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 claims description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 2
- 125000005409 triarylsulfonium group Chemical group 0.000 claims description 2
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- 239000005011 phenolic resin Substances 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 229920003987 resole Polymers 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 238000001459 lithography Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000006068 polycondensation reaction Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000004312 hexamethylene tetramine Substances 0.000 description 3
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920001567 vinyl ester resin Polymers 0.000 description 3
- 229920001342 Bakelite® Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004970 Chain extender Substances 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 235000012907 honey Nutrition 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000003930 superacid Substances 0.000 description 2
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical group C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920003043 Cellulose fiber Polymers 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920003261 Durez Polymers 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 235000014121 butter Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000011093 chipboard Substances 0.000 description 1
- 239000002734 clay mineral Substances 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- JXSJBGJIGXNWCI-UHFFFAOYSA-N diethyl 2-[(dimethoxyphosphorothioyl)thio]succinate Chemical compound CCOC(=O)CC(SP(=S)(OC)OC)C(=O)OCC JXSJBGJIGXNWCI-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- UNKQPEQSAGXBEV-UHFFFAOYSA-N formaldehyde;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound O=C.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 UNKQPEQSAGXBEV-UHFFFAOYSA-N 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 239000012949 free radical photoinitiator Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000004820 halides Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 229920005610 lignin Polymers 0.000 description 1
- 239000012669 liquid formulation Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 235000020777 polyunsaturated fatty acids Nutrition 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 108010001861 pregnancy-associated glycoprotein 1 Proteins 0.000 description 1
- 108010001843 pregnancy-associated glycoprotein 2 Proteins 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000036647 reaction Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/28—Chemically modified polycondensates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
Definitions
- the present invention relates to additive manufacturing processes for producing three-dimensional objects using photopolymerizable compositions comprising phenol-formaldehyde resins.
- the phenolic resins obtained by hardening phenolic resins are among the first industrially produced plastics, with the first phenol-formaldehyde resin, invented back in 1907, still being sold today under the Bakelite brand name. These polycondensates are known for their chemical resistance, excellent flame properties and thermal stability, which is why they are used in space, aviation and the automotive industry, among other things. Due to the relatively large amounts of water formed during polycondensation, molding processing with simultaneous curing of phenolic resins usually takes place not only at elevated temperatures to promote condensation, but also under very high pressures of sometimes even over 150 bar to prevent the water from evaporating and escaping, which can otherwise lead to the formation of bubbles. In addition, processing was mainly limited to injection molding and melt pressing, with chipboard being one of the best-known examples of products based on phenol-formaldehyde resins as binders.
- These materials are based on reactive components that are cured by heating or exposure to light, where radical (eg for acrylates) or cationic (eg for epoxides) polymerization are usually used.
- Photoinitiators are added to the resin for light-induced curing in order to initiate the polymerization of the reactive components.
- WO 2015/074088 A2 discloses photopolymerizable compositions with a dynamic viscosity at room temperature of at least 20 Pa.s, which are heated to at least 30° C. during curing (“hot lithography”). For comparison: 20 Pa.s roughly corresponds to the viscosity of ethylene glycol or viscous honey, while butter with a viscosity of around 30 Pa.s is barely flowable.
- compositions comprising phenolic resins that are said to be suitable for 3D printing. These each comprise a thermally curable novolak resin, a low molecular weight second resin selected from phenolic resins, polyvinyl alcohols and polyacrylates, diisocyanates as chain extenders, allyl or buteneamine as capping agents, polyunsaturated fatty acids as crosslinkers and toughness and strength modifiers.
- compositions are prepared in a twin screw extruder by mixing the two resins together, heating the mixture above 150°C to melt them, sequentially adding the chain extender, capping agent, crosslinker and enhancers, and extruding and pelletizing the mixture.
- the granules are processed into three-dimensional bodies using the 3D printing process known as "melt extrusion accumulation molding", in which layers of the remelted granules are applied one after the other and solidified by cooling. Photopolymerization is thus not mentioned therein.
- RU 2699556 C1 from 2019 discloses mixtures of a special phenolic resin modified with propargyl halide groups, a photopolymerizable vinyl ester resin based on bisphenol A and a free-radical photoinitiator. To process these mixtures, the vinyl ester resin is first photopolymerized by exposure, after which the modified phenolic resin is thermally cured in the solid product thus obtained.
- Both resoles and novolaks are disclosed as suitable phenolic resins and the production of polymer films, three-dimensional products and prototypes by means of stereolithography is mentioned as possible applications. In fact, however, the respective mixtures are only introduced between two glass plates and subsequently cured in two stages, ie by initial exposure to light and subsequent heating.
- JP 2019/203097 A discloses specific Novo Cresol-based lak resins with some 1-ethoxyethyl-protected OH groups for use in photoresists.
- US 2002/076651 A1 discloses compositions for thick-film photoresists in which "epoxidized polyfunctional bisphenol-A-formaldehyde novolak resins" are used, i.e. novolak resins modified with several, preferably eight, epoxy groups per molecule, which are decisive for the polyaddition to epoxy resins; and also WO 2017/112653 A1 discloses - in addition to a large number of other resins - also epoxidized phenol-formaldehyde resin for use in photopolymerizable compositions. The latter, however, comprise two different polymerizable precursor compositions, which should preferably result in the flattening of interpenetrating polymer networks (IPN).
- IPN interpenetrating polymer networks
- resoles can also be used as precursors of such resins to be epoxidized.
- more or less strongly crosslinked epoxy resins are obtained in the curing brought about by means of photoacid generators, which comprise the respective phenolic resin components (or according to WO 2017/112653 A1: can comprise).
- the aim of the present invention was the development of photopolymerizable compositions from which, by means of additive manufacturing processes, i.e. 3D printing, three-dimensional moldings with improved mechanical properties compared to the prior art can be obtained.
- a photopolymerizable composition comprising a phenol-formaldehyde resin, a hardener and a photoinitiator in an additive manufacturing process for the production of three-dimensional objects by means of layer-by-layer exposure to harden the composition, wherein the method is characterized in that a) the composition is heated to a reaction temperature of at least 70°C before and during the curing; b) the composition b1) comprises a novolak as the phenol-formaldehyde resin, b2) a formaldehyde derivative which is stable at the reaction temperature as the curing agent and b3) a photoacid generator as the photoinitiator; and c) the curing of the composition is carried out at atmospheric pressure;
- the novolak comprises essentially no other functionalities participating in the photopolymerization apart from the OH groups;
- the hardener is not an amine-containing formaldehyde derivative.
- the invention provides an additive manufacturing process for the production of three-dimensional objects by means of layered exposure for curing a photopolymerizable composition comprising a phenol-formaldehyde resin, a hardener and a photoinitiator, which, as mentioned above, is characterized in that a) the composition is heated to a reaction temperature of at least 70°C before and during curing; b) the composition b1) a novolak as phenol-formaldehyde resin which has a viscosity of not more than 20 Pa.s at the reaction temperature, b2) a formaldehyde derivative stable at the reaction temperature as hardener and b3) a photoacid generator as photoinitiator includes; and c) the curing of the composition is carried out at atmospheric pressure; with the proviso that the hardener is not an amine-containing formaldehyde derivative.
- the inventors have surprisingly found that in the photoacid-initiated polycondensation of novolaks, i.e. phenolic resins with a formaldehyde-phenol ratio of less than 1:1, with simultaneous crosslinking with formaldehyde derivatives, even at reaction temperatures above 100° C., no increased Pressure needs to be applied to prevent the water formed by the condensation reactions from escaping. Without wishing to be bound by any particular theory, the inventors believe that this is due to the high curing rates of the photopolymerizable compositions in the process of the invention.
- novolaks i.e. phenolic resins with a formaldehyde-phenol ratio of less than 1:1
- relatively high-molecular novolaks can also be used as starting resins, while the reaction mixtures remain mixable, e.g than 20 Pa.s.
- the reaction mixtures remain mixable, e.g than 20 Pa.s.
- a viscosity of 20 Pa.s roughly corresponds to that of ethylene glycol or viscous honey. Nevertheless, novolaks which have a viscosity in the range of this limit value at the reaction temperature can be used without any problems according to the present invention, sometimes by adding a defined (small) amount of low molecular weight novolak or one or more other viscosity-reducing additives, preferably if required however, by using a formaldehyde derivative as a hardener, which is in the liquid state at the reaction temperature.
- the mold used as a hardener Aldehyde derivative preferably selected from polyoxymethylene, polyoxymethylene diesters, polyoxymethylene diethers and derivatives of 1,3-dioxolane and 1,3-dioxane, more preferably from 4-phenyl-1,3-dioxane and polyoxymethylene diacetate and other polyoxymethylene diesters , which on the one hand are liquid at the respective reaction temperature and, in the case of the diesters, also consume two molecules of water in the case of acid-catalyzed cleavage of the diester molecule.
- all of these hardeners are thermally stable in that they do not release any formaldehyde at the respective reaction temperature as long as the reaction mixture has not been exposed to light to split the photoacid generator.
- This is an essential feature of the present invention with regard to the shape accuracy of the three-dimensional objects to be produced additively.
- amine-containing formaldehyde derivatives such as hexamethylenetetramine
- ammonia are released, which can neutralize the photoacid in the process according to the invention present invention excluded.
- a novolak which at the reac tion temperature has a viscosity of not more than 10 Pa.s, not more than 5 Pa.s or not more than 1 Pa.s in order not to be too severely restricted with regard to the selection of the hardener and/or to be able to add further additives, such as other, e.g. also relatively high molecular weight, resins to the reaction mixture. According to the invention, however, the latter is to be preferred only in certain cases.
- the novolak used according to the present invention contains essentially no - and preferably none at all - apart from the OH groups, other functionalities participating in the photopolymerization, so that curing takes place almost exclusively through polycondensation between the phenol groups of the novolak and the formaldehyde groups of the harder.
- "essentially none” is to be understood herein that only in exceptional cases a small proportion of such other functionalities may be contained in order to slightly modify, if necessary, a specific parameter of the polycondensates obtained.
- a small proportion is to be understood here as a single-digit mole percentage, based on the average number of OH groups in the novolak, such as, for example, 1 to 5 or 1 to 2 mole %.
- the photoacid generator used as a photoinitiator according to the present invention is not specifically restricted, so that in principle all compounds that are conventionally used and are commercially available are suitable.
- the photoacid generator is preferably selected from diaryliodonium and triarylsulfonium salts, more preferably from their hexafluoroantimonate, tetrafluoroborate and tetrakis(pentafluorophenyl)borate salts, which have proven themselves in the past as photoacid generators under a wide variety of reaction conditions and also with exposure release extremely strong acids, sometimes even superacids.
- the wavelength used for exposure also depends on the choice of photoacid generator.
- the composition is heated to a reaction temperature not higher than 130°C in order not to induce thermal decomposition of individual components and to limit energy consumption.
- a particularly preferred reaction temperature range according to the invention is 80.degree. C. to 120.degree.
- composition according to the present invention can also include other monomers and/or prepolymers that are capable of copolymerizing with the novolak and/or the hardener, and optionally, as already mentioned, also include one or more other additives, to optimize the properties of the reac tion mixtures and/or the three-dimensional objects produced.
- the composition can, for example, contain vinyl ester, epoxy, furan, melamine-formaldehyde or urea-formaldehyde resins or polyol, saturated or unsaturated polyester resins and alkyd resins as prepolymers and/or bis phenol A diglycidyl ether (“BADGE”), 3,4-epoxycyclohexanecarboxylic acid 3 ⁇ 4'-epoxy-cyclohexylmethyl ester (“CE”), or another epoxide as a comonomer.
- BADGE bis phenol A diglycidyl ether
- CE 3,4-epoxycyclohexanecarboxylic acid 3 ⁇ 4'-epoxy-cyclohexylmethyl ester
- another epoxide as a comonomer.
- one or more carboxylic anhydrides can be added to the polymerizable composition as additives, which are preferably selected from dicarboxylic anhydrides, more preferably from phthalic anhydride, butanedicarboxylic anhydride, maleic anhydride and cyclohexane-1,2-dicarboxylic anhydride. These also act as water scavengers, among other things, by binding the water released during the condensation reactions.
- Other suitable additives are, for example, the fillers customary in phenolic resins, as well as dyes and pigments, which can each be used in amounts such that the properties of the composition or the three-dimensional object obtained therefrom are not impaired.
- inorganic and organic fillers can be used as fillers, such as glass fibers, glass beads, clay minerals, silicates (silicic acid, quartz, talc, mica), carbonates, iron powder, silanes, graphite, graphene, cork, carbon fibers, felt flour, felt fibers , cotton fibers, lignin, cellulose (fibers), duromers, thermoplastic fibers, organoborates and organophosphates, just to name a few.
- the composition comprises 30 to 90% by weight novolak, 10 to 50% by weight hardener and 1 to 10% by weight photoacid generator, in particularly preferred embodiments 50 to 80% by weight novolak, 20 to 40% by weight of hardener and about 5% by weight of photoacid generator, in each case in proportions such that their total is 100% by weight.
- One or more other monomers and / or prepolymers can be added, for example, in such amounts that they up to 50% of Replace quantity of novolak.
- carboxylic acid anhydrides serving as water scavengers as additives can be contained, for example, in proportions of 5 to 25% by weight, based on 100% by weight as the sum of all components, preferably in proportions of 10 to 20% by weight. .
- the generative manufacturing process is preferably a 3D printing process and more preferably a hot lithography (“Hot Lithogra- phy”) process, by means of which three-dimensional objects with excellent mechanical properties can be produced very quickly and extremely accurately, usually by laser exposure , can be produced.
- Hot Lithogra- phy hot lithography
- the present invention also provides three-dimensional objects obtained by the new inventive method defined above, having improved mechanical properties compared to the prior art.
- the sole figure 1 is a photograph of three-dimensional objects produced in the examples according to the invention.
- composition components indicated below were each mixed in a container with stirring and heating up to 80°C until a homogeneously distributed mixture was obtained which, on cooling to room temperature, was used in all cases where a novolak was used as the phenolic resin , a highly viscous, became a substantially solid mass, while the comparative example using resole remained liquid even after cooling.
- a construction platform is first immersed in the liquefied composition from above up to a defined distance from the bottom of the tub. This distance corresponds to the thickness of a layer to be hardened, which in turn depends on the depth of penetration of the light into the respective composition. In the examples, layer thicknesses of 50-100 ⁇ m were set for this.
- the UV laser then scans the underside of the composition through the transparent tank floor under computer control at a speed of up to 1000 mm/s in order to harden the first layer, after which the construction platform is raised by the amount corresponding to the layer thickness so that fresh liquid formulation can flow between the hardened layer and the bottom of the tank, which in turn is then exposed and thereby hardened, etc.
- the phenolic resin used as the novolak was, in most of the examples, Supraplast 3616 ("Novolak 1") from Süd-West-Chemie GmbH in Neu-Ulm, Germany, which has a number-average molecular weight Mn of 341, a weight-average molecular weight Mw of 474 and, according to the manufacturer, has a melting range of 30-50 °C, a melt viscosity at 50 °C of 200-400 Pa.s and a melt viscosity at 80 °C of 2-8 Pa.s.
- Example 5 used phenolic resin was Supraplast 052 ("Resol”) from Süd-West-Chemie GmbH, a viscous at room temperature (dynamic viscosity at 20 ° C up to 18 Pa.s), self-condensing resol resin, which according to the manufacturer a gel time at 100 °C of 70-90 min and an initial boiling point > 100 °C.
- Resol Supraplast 052
- a viscous at room temperature dynamic viscosity at 20 ° C up to 18 Pa.s
- self-condensing resol resin which according to the manufacturer a gel time at 100 °C of 70-90 min and an initial boiling point > 100 °C.
- PAG 1 HRcure-9392 by Tianjin Huiren Chemtech Co., Ltd; 4-(Octyloxy)phenyl)-(phenyl)iodonium hexafluoroantimonate
- PAG 2 SpeedCure 937 from Lambson Limited; Bis(4-dodecylphenyl)iodonium hexafluoroantimonate
- PAG 3 SpeedCure 976s from Lambson Limited; Sulfandiyldibenzene-4,1-diyl)-bis-(diphenylsulfonium)-bis(hexafluoroantimonate)
- PAG 4" Irgacure 290 from BASF Corporation; (4-(4-Acetylphenylthio)phenyl)sulfonium tetrakis(pentafluorophenyl)borate
- the prepolymers capable of copolymerization used in Examples 17 and 18 were Epilok 60-838 ("Prepolymer 1"), an epoxidized novolak resin from Bitrez Ltd. with a dynamic viscosity at 50 °C of around 40 Pa.s and at 70 °C of around 5 Pa.s, in Example 19 Supraplast 680/95 (“prepolymer 2”), a melamine-formaldehyde resin from Süd-West -Chemie GmbH with a melting range of 70-95 °C, and in example 20 Deuteron SF 707 (“prepolymer 3”), a liquid at room temperature Fl arn substance-formaldehyde Flarz Deuteron GmbFI in Achim, Germany, used.
- Prepolymer 1 Epilok 60-838
- Prepolymer 2 an epoxidized novolak resin from Bitrez Ltd. with a dynamic viscosity at 50 °C of around 40 Pa.s and at 70 °C of around 5 Pa.s
- Hardeners The hardeners used in the formulations are listed in Table 1 overleaf together with the other components, ie the phenolic resin (“Flarz”), the photoacid generator (“PAG”) and any comonomers/prepolymers “CoM/Prä") Proportions in the tested formulations (in % by weight of the total composition) and the respective reaction temperatures (in °C) for Examples 1 to 22 according to the invention ("B1" to “B22”) and Comparative Examples 1 to 5 (“V1" to "V5").
- the desired object could be printed without any problems from the formulations listed above for Examples 1 to 22 according to the invention, which consisted in each case of a hard duromer with the stated composition that was no longer deformable even when heated and was infusible.
- the inventors attribute this negative result to the fact that the large amounts of ammonia released during the decomposition of hexamethylenetetramine neutralize the photoacid formed by exposure to light, which means that it no longer triggers the Polycondensation of the novolak is able. For this reason, those amine-containing hardeners which liberate ammonia when they decompose are excluded from the scope of the present invention. It was also surprising that no solid object could be printed with the resol resin considered to be self-condensing in comparison example 5 in combination with 10% by weight of photo acid generator - without formaldehyde flair be attributed to low reaction temperatures in the 3D printing process.
- the additive manufacturing process according to the invention preferably 3D printing processes, can be used for the first time to produce three-dimensional objects based on formaldehyde-crosslinked novolak duromers with excellent mechanical properties, without other binders or co-flares need to be added - although according to the present invention this option also exists.
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Citations (8)
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US20020076651A1 (en) | 2000-09-15 | 2002-06-20 | Microchem Corp., A Corporation Of The State Of Massachussets | Fast drying thick film negative photoresist |
CN103980657A (zh) | 2014-04-30 | 2014-08-13 | 中国科学院化学研究所 | 一种3d打印改性酚醛树脂材料及其制备方法 |
WO2015075094A1 (de) | 2013-11-22 | 2015-05-28 | Technische Universität Wien | Vorrichtung zum verarbeiten von photopolymerisierbarem material zum schichtweisen aufbau eines formkörpers |
WO2015074088A2 (de) | 2013-11-22 | 2015-05-28 | Technische Universität Wien | Vorrichtung zum verarbeiten von photopolymerisierbarem material zum schichtweisen aufbau eines formkörpers |
WO2016078838A1 (de) | 2014-11-19 | 2016-05-26 | Ivoclar Vivadent Ag | Stereolithographievorrichtung mit Heizeinrichtung |
WO2017112653A1 (en) | 2015-12-22 | 2017-06-29 | Carbon, Inc. | Dual precursor resin systems for additive manufacturing with dual cure resins |
RU2699556C1 (ru) | 2019-03-18 | 2019-09-06 | Акционерное общество "Институт новых углеродных материалов и технологий" (АО "ИНУМиТ") | Отверждаемая полимерная композиция и способ изготовления из неё отверждённого продукта |
JP2019203097A (ja) | 2018-05-25 | 2019-11-28 | 住友ベークライト株式会社 | 感光性樹脂組成物用のノボラック型フェノール樹脂 |
-
2021
- 2021-06-14 AT ATA112/2021A patent/AT525128B1/de active
-
2022
- 2022-06-14 EP EP22734910.7A patent/EP4355802A1/de active Pending
- 2022-06-14 WO PCT/EP2022/066196 patent/WO2022263454A1/de active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US20020076651A1 (en) | 2000-09-15 | 2002-06-20 | Microchem Corp., A Corporation Of The State Of Massachussets | Fast drying thick film negative photoresist |
WO2015075094A1 (de) | 2013-11-22 | 2015-05-28 | Technische Universität Wien | Vorrichtung zum verarbeiten von photopolymerisierbarem material zum schichtweisen aufbau eines formkörpers |
WO2015074088A2 (de) | 2013-11-22 | 2015-05-28 | Technische Universität Wien | Vorrichtung zum verarbeiten von photopolymerisierbarem material zum schichtweisen aufbau eines formkörpers |
CN103980657A (zh) | 2014-04-30 | 2014-08-13 | 中国科学院化学研究所 | 一种3d打印改性酚醛树脂材料及其制备方法 |
WO2016078838A1 (de) | 2014-11-19 | 2016-05-26 | Ivoclar Vivadent Ag | Stereolithographievorrichtung mit Heizeinrichtung |
WO2017112653A1 (en) | 2015-12-22 | 2017-06-29 | Carbon, Inc. | Dual precursor resin systems for additive manufacturing with dual cure resins |
JP2019203097A (ja) | 2018-05-25 | 2019-11-28 | 住友ベークライト株式会社 | 感光性樹脂組成物用のノボラック型フェノール樹脂 |
RU2699556C1 (ru) | 2019-03-18 | 2019-09-06 | Акционерное общество "Институт новых углеродных материалов и технологий" (АО "ИНУМиТ") | Отверждаемая полимерная композиция и способ изготовления из неё отверждённого продукта |
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