WO2022262010A1 - 显示面板及其制作方法、显示装置 - Google Patents

显示面板及其制作方法、显示装置 Download PDF

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Publication number
WO2022262010A1
WO2022262010A1 PCT/CN2021/103362 CN2021103362W WO2022262010A1 WO 2022262010 A1 WO2022262010 A1 WO 2022262010A1 CN 2021103362 W CN2021103362 W CN 2021103362W WO 2022262010 A1 WO2022262010 A1 WO 2022262010A1
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WO
WIPO (PCT)
Prior art keywords
electrode layer
layer
upper substrate
display panel
via hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/103362
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English (en)
French (fr)
Inventor
李亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
TCL China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TCL China Star Optoelectronics Technology Co Ltd filed Critical TCL China Star Optoelectronics Technology Co Ltd
Priority to US17/434,707 priority Critical patent/US12235548B2/en
Publication of WO2022262010A1 publication Critical patent/WO2022262010A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/134309—Electrodes characterised by their geometrical arrangement
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/134309—Electrodes characterised by their geometrical arrangement
    • G02F1/134318—Electrodes characterised by their geometrical arrangement having a patterned common electrode
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/42—Arrangements for providing conduction through an insulating substrate

Definitions

  • the present application relates to the field of display technology, in particular to the manufacture of display devices, in particular to a display panel, a manufacturing method thereof, and a display device.
  • LCD Liquid Crystal Display (liquid crystal display) transmits corresponding signals to each pixel electrode to form a voltage difference with the common electrode of the upper plate to drive the deflection of liquid crystal molecules, so as to control the degree of polarized light emission of each pixel point to achieve the display purpose .
  • the common electrode of the upper board is generally made of ITO (Indium Tin Oxide, indium tin oxide), but ITO has poor conductivity and large sheet resistance. When the signal in the data line changes, it will change through the capacitive coupling effect. The voltage of the common electrode on the upper panel, and the voltage of the common electrode is difficult to return to the original set potential in a short time, resulting in a large or small voltage difference between the two ends of the subsequent liquid crystal, forming horizontal crosstalk, and reducing the display quality of the screen.
  • ITO Indium Tin Oxide, indium tin oxide
  • the purpose of the present application is to provide a display panel, a manufacturing method thereof, and a display device, so as to improve the technical problem that the voltage of the common electrode of the upper plate is difficult to return to the original set potential in a short time due to the large sheet resistance.
  • the purpose of the present application is to provide a display panel, a manufacturing method thereof, and a display device, so as to improve the technical problem that the voltage of the common electrode of the upper plate is difficult to return to the original set potential in a short time due to the large sheet resistance.
  • An embodiment of the present application provides a display panel, and the display panel includes:
  • the first electrode layer is located on a side of the upper substrate close to or away from the liquid crystal layer;
  • a second electrode layer, the second electrode layer is located on a side of the upper substrate away from the first electrode layer, and the first electrode layer is electrically connected to the second electrode layer.
  • the display panel includes at least one via hole in the upper substrate in the non-display area, and each of the via holes is located in the non-display area;
  • the display panel further includes a conductive part, the conductive part is located in at least one via hole, and the first electrode layer and the second electrode layer are electrically connected through the conductive part.
  • the upper substrate includes a plurality of via holes, and the plurality of via holes are at least arranged on opposite sides of the upper substrate.
  • the conductive portion includes a conductive ball located in the via hole, or the conductive portion includes a conductive ball extending from the side wall of the via hole to the upper side of the upper substrate and the lower side of the upper substrate. metal layer.
  • the conductive ball is in the shape of an ellipsoid, and the long axis of the conductive ball is perpendicular to the first electrode layer.
  • the metal layer extends from the sidewall of the corresponding via hole to the upper and lower sides around the via hole to electrically connect the first electrode layer and the second electrode layer.
  • composition material of the metal layer is the same as that of the first electrode layer.
  • the resistivity of the conductive part is smaller than the resistivity of the first electrode layer, and the resistivity of the conductive part is smaller than the resistivity of the second electrode layer.
  • the display panel further includes:
  • a protective layer is located on a side of the first electrode layer away from the upper substrate, and the protective layer has insulation properties.
  • the display panel further includes:
  • a filter layer the filter layer is arranged opposite to the second electrode layer, the filter layer includes a plurality of filter parts, and there is a gap between two adjacent filter parts;
  • a light-shielding layer the light-shielding layer is located on a side of the second electrode layer close to the filter layer, the light-shielding layer includes a plurality of light-shielding parts, and the plurality of light-shielding parts are respectively arranged opposite to the plurality of gaps.
  • the embodiment of the present application also provides a method for manufacturing a display panel, which is used to manufacture a display panel, and the method includes:
  • first electrode layer on one side of the upper substrate by magnetron sputtering, vacuum evaporation or inkjet printing;
  • a second electrode layer is formed on the side of the upper substrate away from the first electrode layer by magnetron sputtering, vacuum evaporation or inkjet printing, and the first electrode layer is electrically connected to the second electrode layer ;
  • the upper substrate and the lower substrate are arranged oppositely, and a liquid crystal layer is filled between the lower substrate and the upper substrate.
  • the display panel includes a non-display area
  • the upper substrate includes at least one via hole, each of the via holes is in the non-display area;
  • the step of forming the first electrode layer on one side of the upper substrate by magnetron sputtering, vacuum evaporation or inkjet printing it also includes:
  • Conductive parts are formed on the upper and lower sides and sidewalls of at least one region around the via hole by vapor deposition, and the conductive parts are electrically connected to the first electrode layer and the second electrode layer.
  • the second electrode layer is formed on the side of the upper substrate away from the first electrode layer by magnetron sputtering, vacuum evaporation or inkjet printing, and the first electrode layer and the first electrode layer are After the step of electrically connecting the two electrode layers, it also includes:
  • a protective layer is formed on the first electrode layer, and the protective layer has insulating properties.
  • the protective layer having insulation properties further comprising:
  • a light-shielding layer is formed on the second electrode layer, and the light-shielding layer includes a plurality of light-shielding portions.
  • the embodiment of the present application also provides a display device, the display device includes a display panel, and the display panel includes:
  • the first electrode layer is located on a side of the upper substrate close to or away from the liquid crystal layer;
  • a second electrode layer, the second electrode layer is located on a side of the upper substrate away from the first electrode layer, and the first electrode layer is electrically connected to the second electrode layer.
  • the display panel includes at least one via hole in the upper substrate in the non-display area, and each of the via holes is located in the non-display area;
  • the display panel further includes a conductive part, the conductive part is located in at least one via hole, and the first electrode layer and the second electrode layer are electrically connected through the conductive part.
  • the upper substrate includes a plurality of via holes, and the plurality of via holes are at least arranged on opposite sides of the upper substrate.
  • the conductive portion includes a conductive ball located in the via hole, or the conductive portion includes a conductive ball extending from the side wall of the via hole to the upper side of the upper substrate and the lower side of the upper substrate. metal layer.
  • the metal layer extends from the sidewall of the corresponding via hole to the upper and lower sides around the via hole to electrically connect the first electrode layer and the second electrode layer.
  • the resistivity of the conductive part is smaller than the resistivity of the first electrode layer, and the resistivity of the conductive part is smaller than the resistivity of the second electrode layer.
  • the present application provides a display panel, a manufacturing method thereof, and a display device.
  • the display panel includes: a lower substrate; an upper substrate, the upper substrate and the lower substrate are arranged opposite to each other; a liquid crystal layer, and the liquid crystal layer is filled in the lower substrate. Between the substrate and the upper substrate; a first electrode layer, the first electrode layer is located on one side of the upper substrate; a second electrode layer, the second electrode layer is located on the upper substrate away from the first On one side of the electrode layer, the first electrode layer is electrically connected to the second electrode layer.
  • the electrically connected first electrode layer and the second electrode layer are arranged on both sides of the upper substrate respectively, and the overall resistance of the first electrode layer and the second electrode layer is relatively small.
  • FIG. 1 is a schematic diagram of an expanded three-dimensional structure of a display panel provided by an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional view of a display panel provided by an embodiment of the present application.
  • FIG. 3 is a schematic cross-sectional view of another display panel provided by an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of another display panel provided by an embodiment of the present application.
  • FIG. 5 is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.
  • FIG. 6 is a schematic diagram of a scene of a manufacturing method of a display panel provided by an embodiment of the present application.
  • the present application provides a display panel, which includes but is not limited to the following embodiments and the following
  • the display panel 100 includes: a lower substrate 60; an upper substrate 10, the upper substrate 10 and the lower substrate 60 are arranged opposite to each other; a liquid crystal layer, the liquid crystal layer is filled in Between the lower substrate 60 and the upper substrate 10; the first electrode layer 201, the first electrode layer 201 is located on the side of the upper substrate 10 close to or away from the liquid crystal layer; the second electrode layer 202, The second electrode layer 202 is located on a side of the upper substrate 10 away from the first electrode layer 201 , and the first electrode layer 201 is electrically connected to the second electrode layer 202 .
  • the upper substrate 10 can be a rigid substrate or a flexible substrate, and the rigid substrate can be glass or a silicon wafer, and the composition material of the rigid substrate can include but not limited to quartz powder, strontium carbonate, barium carbonate, boric acid, boron Anhydride, aluminum oxide, calcium carbonate, barium nitrate, magnesium oxide, tin oxide, zinc oxide at least one,
  • the flexible substrate can be a polymer material substrate, metal foil substrate, ultra-thin glass substrate, polymer and inorganic Composite substrates of materials or composite substrates of polymers, organic substances, and inorganic substances, wherein the polymer materials may include polyethylene, polypropylene, polystyrene, polyethylene terephthalate, polyethylene naphthalate At least one of glycol ester and polyimide.
  • both the first electrode layer 201 and the second electrode layer 202 have conductivity and are transparent in color
  • the composition material of the first electrode layer 201 and the composition of the second electrode layer 202 The materials can be the same or different.
  • the constituent materials of the first electrode layer 201 and the constituent materials of the second electrode layer 202 may include but not limited to ITO, and the first electrode layer 201 and the second electrode layer 202 may pass through but It is not limited to magnetron sputtering, vacuum evaporation, and inkjet printing.
  • the first electrode layer 201 and the second electrode layer 202 in this embodiment are respectively arranged on opposite sides of the upper substrate 10 and electrically connected, that is, the The first electrode layer 201 and the second electrode layer 202 can be electrically connected to form a composite electrode layer 20 with conductivity.
  • the composite electrode layer 20 in this embodiment presents a small resistance, that is, the capacitive coupling effect between the composite electrode layer 20 and the data line on the lower plate is small, which can improve horizontal crosstalk , and the composite electrode layer 20 has less influence on the signals in the data lines on the lower plate, which finally improves the quality of the picture display.
  • the composite electrode layer 20 is close to the side of the lower plate.
  • the distance between the side and the lower plate will not be smaller, compared with the distance between the electrode layer and the lower plate in the prior art, that is, the distance between the composite electrode layer 20 and the lower plate in this embodiment will not be smaller. It will be reduced, that is, the composite electrode layer 20 will not increase the interference to the signal in the data line on the lower board.
  • the display panel 100 includes the upper substrate 10 in the non-display area and includes at least one via hole 101 , and each of the via holes 101 is located in the non-display area.
  • the display panel 100 further includes: a conductive part 203, the conductive part 203 is located in at least one via hole 101, and the first electrode layer 201 and the second electrode layer 202 are electrically connected through the conductive part 203. connect.
  • each via hole 101 is located in the non-display area to avoid hollowing out in the display area to affect the picture display.
  • the non-display area can be, but not limited to, close to the display panel. 100 edge area.
  • the via hole 101 may be located in an area near any side of the upper substrate 10, and the conductive part 203 is located in the via hole 101, The size of the via hole 101 can be set larger to ensure the electrical connection between the first electrode layer 201 and the second electrode layer 202 .
  • the plurality of via holes 101 can be arranged at least on opposite sides of the upper substrate 10, and the size of the plurality of via holes 101 can be The same or different, the number and size of the via holes 101 can be reasonably set to ensure that the first electrode layer 201 and the second electrode layer 202 are electrically connected, of course, a plurality of via holes 101 can also be at least Arranged in a region near two ends of one diagonal line in the upper substrate 10 , the conductive portion 203 is located in at least one of the via holes 101 .
  • the height of the conductive part 203 may not be smaller than the height of the corresponding via hole 101, so as to ensure that the conductive part 203 is up and down.
  • the two ends can be electrically connected to the first electrode layer 201 and the second electrode layer 202 respectively, so as to ensure the electrical connection between the first electrode layer 201 and the second electrode layer 202.
  • the height of the conductive part 203 can be equal to the height of the corresponding via hole 101, so as to avoid pad height from affecting the subsequently formed first electrode layer 201 or The height of the second electrode layer 202 at the via hole 101 .
  • the projection of the conductive part 203 on the upper substrate 10 may be located in the corresponding via hole 101, that is, the size of the cross section of the conductive part 203 may be smaller than that of the corresponding via hole 101.
  • the dimension of the section is used to reduce the cost of the conductive part 203 .
  • the conductive part 203 includes a conductive ball 2031 located in the via hole 101, or the conductive part 203 includes a conductive part extending from the side wall of the via hole to The metal layer 2032 on the upper side of the upper substrate 10 and the lower side of the upper substrate 10 .
  • the conductive ball 2031 can be in the shape of an ellipsoid, the long axis of the conductive ball 2031 can be perpendicular to the first electrode layer 201, the number of the conductive ball 2031 can be greater than 1, and the metal layer 2032 can be made of
  • the corresponding sidewalls of the via hole 101 extend to the upper and lower sides around the via hole 101 to electrically connect the first electrode layer 201 and the second electrode layer 202 .
  • the conductive ball 2031 may be placed directly in the via hole 101 or a metal material may be deposited in the via hole 101 to form the metal layer 2032 .
  • the constituent material of the conductive ball 2031 may include but not limited to gold, and the constituent material of the metal layer 2032 includes but not limited to copper, aluminum, and molybdenum.
  • an electrode layer 201 is used as a support for placing at least one conductive ball 2031 into the containing space formed by the first electrode layer 201 and the via hole 101 .
  • the first electrode layer 201 may be formed before at least one via hole 101 is formed.
  • the first electrode layer 201 The metal layer 2032 is formed on the bottom and side walls of the accommodation space formed with the via hole 101, and the metal layer 2032 extends to the upper and lower sides around the via hole 101; or, as shown in FIG. 3
  • the first electrode layer 201 may be formed after at least one via hole 101 and the metal layer 2032 are formed. Specifically, after the via hole 101 is formed, the upper and lower sides of the area around the via hole 101 may be formed.
  • the metal layer 2032 is formed, and the metal layer 2032 is also formed on the sidewall of the via hole 101 .
  • the composition material of the metal layer 2032 can also be ITO, at this time, the ITO material can be deposited on one side of the upper substrate 10 to form the metal layer 2032 and the metal layer filled in the via hole 101 sequentially.
  • the first electrode layer 201 that is, the metal layer 2032 and the first electrode layer 201 can be manufactured through a single process, further, the upper substrate 10 can be reversed and then deposited on the other side of the upper substrate 10
  • the ITO material forms an entire surface of the second electrode layer 202 .
  • the first electrode layer 201 and the second electrode layer 202 may also be electrically connected through a conductive line located on the side wall of at least one edge of the display panel 100, and the composition material of the conductive line may include But not limited to copper, the two ends of the conductive wire are electrically connected to the edge of the first electrode layer 201 and the edge of the second electrode layer 202 respectively. It can be understood that electrically connecting the first electrode layer 201 and the second electrode layer 202 through the conductive wire can avoid setting the via hole 101 on the upper substrate 10 and setting the via hole 101 in the via hole 101.
  • the conductive part 203 is provided.
  • the resistivity of the conductive portion 203 is smaller than the resistivity of the first electrode layer 201 , and the resistivity of the conductive portion 203 is smaller than the resistivity of the second electrode layer 202 . It can be understood that setting the resistivity of the conductive part 203 to be small can avoid increasing the resistance of the composite electrode layer 20 and reduce the capacitive coupling between the composite electrode layer 20 and the data lines on the lower plate. effect. Similarly, when the conductive wire is provided, the resistivity of the conductive wire may also be smaller than the resistivity of the first electrode layer 201, and the resistivity of the conductive wire is smaller than the resistance of the second electrode layer 202. Rate.
  • the display panel 100 further includes: a protective layer 30 located on the side of the first electrode layer 201 away from the upper substrate 10 , the protective layer 30 Layer 30 has insulating properties.
  • the side of the protective layer 30 away from the upper substrate 10 also includes film layers such as polarizers and cover plates, and the protective layer 30 is used to isolate the first electrode layer 201 from the polarizer. and other film layers to avoid affecting the electrical and optical properties of the first electrode layer 201 .
  • the protection layer 30 is transparent to avoid reducing the light transmittance.
  • the composition material of the protection layer 30 may include but not limited to at least one of silicon nitride and silicon oxide. kind.
  • the display panel 100 further includes: a filter layer 40 , the filter layer 40 is arranged opposite to the second electrode layer 202 , and the filter layer 40 includes a plurality of filter parts 401, and there is a gap between two adjacent filter parts 401.
  • FIG. 50 is located on a side of the second electrode layer 202 close to the filter layer 40 , and the light shielding layer 50 includes a plurality of light shielding portions 501 , and the plurality of light shielding portions 501 are respectively disposed opposite to the plurality of gaps.
  • the light shielding layer 50 is disposed on the side of the second electrode layer 202 close to the filter layer 40, so that the distance between the light shielding layer 50 and the filter layer 40 is relatively short, The alignment accuracy of the light shielding layer 50 and the filter layer 40 can be improved.
  • the display panel 100 may be a liquid crystal display panel, and after the light shielding layer 50 and the filter layer 40 are aligned, liquid crystal molecules may be arranged between the light shielding layer 50 and the filter layer 40 , it should be noted that, as shown in FIG. 1 and FIG.
  • the lower substrate 60 located on the side of the filter layer 40 away from the upper substrate 10 may be a thin film transistor array substrate, and the thin film transistor array substrate
  • the voltage in different regions on the substrate is different from the voltage on the composite electrode layer 20, that is, there is a voltage difference between each region on the thin film transistor array substrate and the composite electrode layer 20, and the voltage difference can drive the corresponding At least one of the liquid crystal molecules is deflected to cooperate with the corresponding filter portion 401 to present a corresponding color.
  • the display panel 100 may be an OLED (Organic Light-Emitting Diode (organic electroluminescent diode) display panel
  • the filter layer 40 can be set on the same layer as the light-shielding layer 50, and a plurality of the filter parts 401 and a plurality of the light-shielding parts 501 are arranged alternately, that is, the light shielding portions 501 are used to prevent color mixing of light passing through two adjacent filter portions 401 .
  • a flat layer and a light-emitting layer can be sequentially arranged on the plurality of filter parts 401 and the plurality of light-shielding parts 501, and the light-emitting layer can emit white light to a side close to the filter part 401, and the Color display can be realized by white light passing through the filter layer 40 .
  • the present application provides a method for manufacturing a display panel, which includes but is not limited to
  • the method may include but not limited to the following steps.
  • the upper substrate 10 may be a rigid substrate or a flexible substrate
  • the rigid substrate may be glass or a silicon wafer
  • the composition material of the rigid substrate may include but not limited to quartz powder, strontium carbonate, At least one of barium carbonate, boric acid, boric anhydride, aluminum oxide, calcium carbonate, barium nitrate, magnesium oxide, tin oxide, zinc oxide
  • the flexible substrate can be polymer material substrate, metal foil substrate, ultra-thin glass Substrates, composite substrates of polymers and inorganic substances or composite substrates of polymers, organic substances, and inorganic substances, wherein the polymer materials may include polyethylene, polypropylene, polystyrene, polyethylene terephthalate, At least one of polyethylene naphthalate and polyimide.
  • the first electrode layer 201 is conductive and transparent.
  • the composition material of the first electrode layer 201 may include but not limited to ITO magnetron sputtering.
  • the first electrode layer 201 and the second electrode layer 202 in this embodiment are respectively arranged on opposite sides of the upper substrate 10 and electrically connected, that is, the The first electrode layer 201 and the second electrode layer 202 can be electrically connected to form a composite electrode layer 20 with conductivity.
  • the composite electrode layer 20 in this embodiment presents a small resistance, that is, the capacitive coupling effect between the composite electrode layer 20 and the data line on the lower plate is small, which can improve horizontal crosstalk , and the composite electrode layer 20 has less influence on the signals in the data lines on the lower plate, which finally improves the quality of the picture display.
  • the composite electrode layer 20 is close to the side of the lower plate.
  • the distance between the side and the lower plate will not be smaller, compared with the distance between the electrode layer and the lower plate in the prior art, that is, the distance between the composite electrode layer 20 and the lower plate in this embodiment will not be smaller. It will be reduced, that is, the composite electrode layer 20 will not increase the interference to the signal in the data line on the lower board.
  • an opening may be reserved after the upper substrate and the lower substrate are assembled, through which liquid crystal molecules are poured into between the upper substrate and the lower substrate after the assembly to form the liquid crystal layer , and then close the opening to avoid damage to the liquid crystal layer.
  • the display panel includes a non-display area
  • the upper substrate 10 includes at least one via hole 101, and each via hole 101 is located in the non-display area.
  • step S20 may include but not limited to the following steps.
  • each of the via holes 101 is located in the non-display area to avoid hollowing out in the display area to affect the screen display.
  • the non-display area can be, but not limited to, close to the An area of an edge of the display panel 100 .
  • the via hole 101 may be located in an area close to any side of the upper substrate 10, and the size of the via hole 101 may be set larger to Ensure that the first electrode layer 201 and the second electrode layer 202 are electrically connected.
  • the plurality of via holes 101 can be arranged at least on opposite sides of the upper substrate 10, and the size of the plurality of via holes 101 can be The same or different, the number and size of the via holes 101 can be reasonably set to ensure that the first electrode layer 201 and the second electrode layer 202 are electrically connected, of course, a plurality of via holes 101 can also be at least Arranged in the area near the two ends of one of the diagonal lines in the upper substrate 10 .
  • the conductive part 203 can be the metal layer 2032, that is, after the via hole 101 is formed, it can be formed by vapor deposition on the upper and lower sides of the area around the via hole 101
  • the metal layer 2032 , and the metal layer 2032 is also formed on the sidewall of the via hole 101 .
  • the first electrode layer 201 may also be formed before at least one via hole 101 is formed, and the via hole 101 is formed by etching, and then the first electrode layer 201 is used as a support to provide At least one conductive ball 2031 is placed in the accommodation space formed by the first electrode layer 201 and the via hole 101; or, the first electrode layer 201 is formed before the at least one via hole 101 is formed.
  • the metal layer 2032 is formed on the bottom and side walls of the accommodation space formed by the first electrode layer 201 and the via hole 101 , and the metal layer 2032 extends to the upper and lower sides around the via hole 101 .
  • the conductive ball 2031 and the metal layer 2032 reference may be made to the relevant description above, and here only the upper substrate 10 includes at least one via hole 101 as an example for illustration.
  • part of the metal layer 2032 can be formed on the upper side of the area around the via hole 101 first, and then the upper substrate 10 can be reversed and formed on the area around the via hole 101. part of the metal layer 2032 is formed on the upper side of the upper substrate 10, and then the first electrode layer 201 is formed on one side of the upper substrate 10 and the metal layer 2032. Similarly, after the upper substrate 10 is reversed, the One side of the upper substrate 10 and the metal layer 2032 forms the second electrode layer 202 .
  • the composition material of the metal layer 2032 can also be ITO, at this time, the ITO material can be deposited on one side of the upper substrate 10 to form the metal layer 2032 and the metal layer filled in the via hole 101 sequentially.
  • the first electrode layer 201 that is, the metal layer 2032 and the first electrode layer 201 can be manufactured through a single process, further, the upper substrate 10 can be reversed and then deposited on the other side of the upper substrate 10
  • the ITO material forms an entire surface of the second electrode layer 202 .
  • step after step S30 may include but not limited to the following steps.
  • the side of the protective layer 30 away from the upper substrate 10 also includes film layers such as polarizers and cover plates, and the protective layer 30 is used to isolate the first electrode layer 201 from the polarizer. and other film layers to avoid affecting the electrical and optical properties of the first electrode layer 201 .
  • the protection layer 30 is transparent to avoid reducing the light transmittance.
  • the composition material of the protection layer 30 may include but not limited to at least one of silicon nitride and silicon oxide. kind.
  • step after step S50 may include but not limited to the following steps.
  • the light-shielding layer 50 and the plurality of light-shielding parts 501 can refer to the above related description.
  • An embodiment of the present application provides a display device, and the display device includes the display panel as described above.
  • the present application provides a display panel, a manufacturing method thereof, and a display device.
  • the display panel includes: a lower substrate; an upper substrate, the upper substrate and the lower substrate are arranged opposite to each other; a liquid crystal layer, and the liquid crystal layer is filled in the lower substrate. Between the substrate and the upper substrate; a first electrode layer, the first electrode layer is located on one side of the upper substrate; a second electrode layer, the second electrode layer is located on the upper substrate away from the first On one side of the electrode layer, the first electrode layer is electrically connected to the second electrode layer.
  • the electrically connected first electrode layer and the second electrode layer are arranged on both sides of the upper substrate respectively, and the overall resistance of the first electrode layer and the second electrode layer is relatively small.

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Abstract

显示面板(100)及其制作方法、显示装置；显示面板（100）包括相对设置的上基板（10）和下基板（60）、液晶层、第一电极层（201）、第二电极层（202），第一电极层（201）位于上基板（10）靠近或者远离液晶层的一侧，第二电极层（202）位于上基板（10）远离第一电极层（201）的一侧，第一电极层（201）和第二电极层（202）电性连接。

Description

显示面板及其制作方法、显示装置 技术领域
本申请涉及显示技术领域，尤其涉及显示器件的制造，具体涉及显示面板及其制作方法、显示装置。
 背景技术
LCD(Liquid Crystal Display，液晶显示器)通过向每一像素电极传入对应的信号以和上板的公共电极之间形成电压差以驱动液晶分子偏转，从而达到控制每个像素点偏振光出射程度而达到显示目的。
目前，上板的公共电极一般采用ITO(Indium Tin Oxide，氧化铟锡)制作，但是ITO的导电性较差并且方块电阻较大，当数据线中的信号发生变动时，通过电容耦合效应会改变上板的公共电极的电压，而公共电极的电压难以在短时间内恢复到原始设定的电位，造成后续液晶两端的电压差偏大或者偏小，形成水平串扰，降低了画面显示质量。
因此，有必要提供可以改善水平串扰现象以提高画面显示质量的显示面板及其制作方法、显示装置。
 技术问题
本申请的目的在于提供显示面板及其制作方法、显示装置，以改善上板的公共电极因方块电阻较大导致公共电极的电压难以在短时间内恢复到原始设定的电位的技术问题。
 技术解决方案
本申请的目的在于提供显示面板及其制作方法、显示装置，以改善上板的公共电极因方块电阻较大导致公共电极的电压难以在短时间内恢复到原始设定的电位的技术问题。
本申请实施例提供显示面板，所述显示面板包括：
下基板；
上基板，所述上基板和所述下基板相对设置；
液晶层，所述液晶层填充于所述下基板和所述上基板之间；
第一电极层，所述第一电极层位于所述上基板靠近或者远离所述液晶层的一侧；
第二电极层，所述第二电极层位于所述上基板远离所述第一电极层的一侧，所述第一电极层和所述第二电极层电性连接。
在一实施例中，所述显示面板包括非显示区内所述上基板包括至少一过孔，每一所述过孔均位于所述非显示区内；
其中，所述显示面板还包括导电部，所述导电部位于至少一所述过孔中，所述第一电极层和所述第二电极层通过所述导电部电性连接。
在一实施例中，所述上基板包括多个所述过孔，多个所述过孔至少排列于所述上基板中相对的两侧。
在一实施例中，所述导电部包括位于所述过孔中的导电球，或者所述导电部包括从所述过孔侧壁上延伸至所述上基板上侧和所述上基板下侧的金属层。
在一实施例中，所述导电球呈椭球形状，所述导电球的长轴垂直于所述第一电极层。
在一实施例中，所述金属层由对应的所述过孔的侧壁延伸至所述过孔周围的上下两侧以电性连接所述第一电极层和所述第二电极层。
在一实施例中，所述金属层的组成材料和所述第一电极层的组成材料相同。
在一实施例中，所述导电部的电阻率小于所述第一电极层的电阻率，并且所述导电部的电阻率小于所述第二电极层的电阻率。
在一实施例中，所述显示面板还包括：
保护层，所述保护层位于所述第一电极层远离所述上基板的一侧，所述保护层具有绝缘性。
在一实施例中，所述显示面板还包括：
滤光层，所述滤光层和所述第二电极层相对设置，所述滤光层包括多个滤光部，相邻的两个所述滤光部之间具有间隙；
遮光层，所述遮光层位于所述第二电极层靠近所述滤光层的一侧，所述遮光层包括多个遮光部，多个所述遮光部分别与多个所述间隙相对设置。
本申请实施例还提供显示面板的制作方法，用于制作显示面板，所述方法包括：
提供一基板；
在所述上基板的一侧通过磁控溅射、真空蒸镀或者喷墨打印形成第一电极层；
在所述上基板远离所述第一电极层的一侧通过磁控溅射、真空蒸镀或者喷墨打印形成第二电极层，所述第一电极层和所述第二电极层电性连接；
将所述上基板和下基板相对设置，并且在所述下基板和所述上基板之间填充液晶层。
在一实施例中，所述显示面板包括非显示区，所述上基板包括至少一过孔，每一所述过孔均于所述非显示区内；
其中，在所述上基板的一侧通过磁控溅射、真空蒸镀或者喷墨打印形成第一电极层的步骤之前，还包括：
在至少一所述过孔四周区域的上下侧和侧壁通过气相沉积形成导电部，所述导电部电性连接所述第一电极层和所述第二电极层。
在一实施例中，在所述上基板远离所述第一电极层的一侧通过磁控溅射、真空蒸镀或者喷墨打印形成第二电极层，所述第一电极层和所述第二电极层电性连接的步骤之后，还包括：
在第一电极层上形成保护层，所述保护层具有绝缘性。
在一实施例中，在第一电极层上形成保护层，所述保护层具有绝缘性的步骤之后，还包括：
在所述第二电极层上形成遮光层，所述遮光层包括多个遮光部。
本申请实施例还提供显示装置，所述显示装置包括显示面板，所述显示面板包括：
下基板；
上基板，所述上基板和所述下基板相对设置；
液晶层，所述液晶层填充于所述下基板和所述上基板之间；
第一电极层，所述第一电极层位于所述上基板靠近或者远离所述液晶层的一侧；
第二电极层，所述第二电极层位于所述上基板远离所述第一电极层的一侧，所述第一电极层和所述第二电极层电性连接。
在一实施例中，所述显示面板包括非显示区内所述上基板包括至少一过孔，每一所述过孔位于所述非显示区内；
其中，所述显示面板还包括导电部，所述导电部位于至少一所述过孔中，所述第一电极层和所述第二电极层通过所述导电部电性连接。
在一实施例中，所述上基板包括多个所述过孔，多个所述过孔至少排列于所述上基板中相对的两侧。
在一实施例中，所述导电部包括位于所述过孔中的导电球，或者所述导电部包括从所述过孔侧壁上延伸至所述上基板上侧和所述上基板下侧的金属层。
在一实施例中，所述金属层由对应的所述过孔的侧壁延伸至所述过孔周围的上下两侧以电性连接所述第一电极层和所述第二电极层。
在一实施例中，所述导电部的电阻率小于所述第一电极层的电阻率，并且所述导电部的电阻率小于所述第二电极层的电阻率。
 有益效果
本申请提供了显示面板及其制作方法、显示装置，所述显示面板包括：下基板；上基板，所述上基板和所述下基板相对设置；液晶层，所述液晶层填充于所述下基板和所述上基板之间；第一电极层，所述第一电极层位于所述上基板的一侧；第二电极层，所述第二电极层位于所述上基板远离所述第一电极层的一侧，所述第一电极层和所述第二电极层电性连接。本方案通过在所述上基板的两侧分别设置电性连接的所述第一电极层和所述第二电极层，所述第一电极层和所述第二电极层整体呈现的电阻较小，即削弱了所述第一电极层和所述第二电极层整体和下板上的数据线之间的电容耦合效应，因此能缩短所述第一电极层和所述第二电极层恢复到初始设定的电位的时长以削弱水平串扰，还能降低对数据线中的信号的影响，最终提高了画面显示的质量。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供的显示面板的三维结构展开示意图。
图2为本申请实施例提供的一种显示面板的剖面示意图。
图3为本申请实施例提供的另一种显示面板的剖面示意图。
图4为本申请实施例提供的又一种显示面板的剖面示意图。
图5为本申请实施例提供的显示面板的制作方法的流程图。
图6为本申请实施例提供的显示面板的制作方法的场景示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行
清楚、完整的描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“上”、“下”、“靠近”、“一侧”等指示的方位或位置关系为基于附图所示的方位或位置关系，例如，“上”只是表面在物体上方，具体指代正上方、斜上方、上表面都可以，只要居于物体水平之上即可；“两侧”或者“两端”是指代图中可以体现出的物体的相对的两个位置，所述两个位置可以和物体直接或者间接接触，以上方位或位置关系仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
另外，还需要说明的是，附图提供的仅仅是和本申请关系比较密切的结
构和步骤，省略了一些与申请关系不大的细节，目的在于简化附图，使申请点一目了然，而不是表明实际中装置和方法就是和附图一模一样，不作为实际中装置和方法的限制。
本申请提供显示面板，所述显示面板包括但不限于以下实施例以及以下
实施例的组合。
在一实施例中，如图1所示，所述显示面板100包括：下基板60；上基板10，所述上基板10和所述下基板60相对设置；液晶层，所述液晶层填充于所述下基板60和所述上基板10之间；第一电极层201，所述第一电极层201位于所述上基板10靠近或者远离所述液晶层的一侧；第二电极层202，所述第二电极层202位于所述上基板10远离所述第一电极层201的一侧，所述第一电极层201和所述第二电极层202电性连接。
其中，所述上基板10可以为刚性基板或者柔性基板，所述刚性基板可以为玻璃或者硅片，所述刚性基板的组成材料可以包括但不限于石英粉、碳酸锶、碳酸钡、硼酸、硼酐、氧化铝、碳酸钙、硝酸钡、氧化镁、氧化锡、氧化锌中的至少一种，所述柔性基板可以为聚合物材料基板、金属箔片基板、超薄玻璃基板、聚合物与无机物的复合基板或者聚合物、有机物、无机物的复合基板，其中所述聚合物材料可以包括聚乙烯、聚丙烯、聚苯乙烯、聚对苯二甲酸乙二醇酯、聚对萘二甲酸乙二醇酯、聚酰亚胺中的至少一种。
其中，所述第一电极层201和所述第二电极层202均具有导电性并且均呈透明色，进一步的，所述第一电极层201的组成材料和所述第二电极层202的组成材料可以相同或者不同。具体的，所述第一电极层201的组成材料和所述第二电极层202的组成材料均可以包括但不限于ITO，所述第一电极层201和所述第二电极层202可以通过但不限于磁控溅射、真空蒸镀、喷墨打印这些方式制作。
可以理解的，如图1所示，本实施例中的所述第一电极层201和所述第二电极层202分别设置在所述上基板10中相对的两侧且电性连接，即所述第一电极层201和所述第二电极层202通过电性连接可以形成一具有导电性的复合电极层20，相比较现有技术中仅在所述上基板10中靠近下板的一侧设置电极层，本实施例中的所述复合电极层20呈现的电阻较小，即所述复合电极层20和所述下板上的数据线之间的电容耦合效应较小，可以改善水平串扰，并且所述复合电极层20对所述下板上的数据线中的信号的影响较小，最终提高了画面显示的质量。
需要注意的是，由于本实施例中的所述第一电极层201位于所述上基板10远离所述第二电极层202的一侧，即所述复合电极层20靠近所述下板的一侧和所述下板的距离不会较小，相较于现有技术中的电极层和所述下板的距离，即本实施例中所述复合电极层20和所述下板的距离不会有所减小，即所述复合电极层20不会增加对所述下板上的数据线中的信号的干扰。
在一实施例中，如图1所示，所述显示面板100包括非显示区内所述上基板10包括至少一过孔101，每一所述过孔101均位于所述非显示区内。所述显示面板100还包括：导电部203，所述导电部203位于至少一所述过孔101中，所述第一电极层201和所述第二电极层202通过所述导电部203电性连接。
可以理解的，每一所述过孔101均位于所述非显示区可以避免在显示区内进行挖空以影响画面显示，进一步的，所述非显示区可以为但不限于靠近所述显示面板100的边缘的区域。其中，当所述上基板10包括一所述过孔101时，所述过孔101可以位于所述上基板10中靠近任一侧的区域，所述导电部203位于所述过孔101中，所述过孔101的尺寸可以设置的较大以确保所述第一电极层201和所述第二电极层202电性连接。其中，当所述上基板10包括多个所述过孔101时，多个所述过孔101可以至少排列于所述上基板10中相对的两侧，多个所述过孔101的尺寸可以相同或者不同，可以合理地设置所述过孔101的数目和尺寸以确保所述第一电极层201和所述第二电极层202电性连接，当然，多个所述过孔101也可以至少排列于所述上基板10中的其中一对角线的两端点附近的区域，所述导电部203位于其中至少一所述过孔101中。
其中，在将所述导电部203固定于对应的所述过孔101中之前，所述导电部203的高度可以不小于对应的所述过孔101的高度，以保证所述导电部203的上下两端分别可以电性连接至所述第一电极层201和所述第二电极层202，以确保第一电极层201和所述第二电极层202电性连接，可以理解的，将所述导电部203固定于对应的所述过孔101中之后，所述导电部203的高度可以等于对应的所述过孔101的高度，以避免垫高影响后续形成的所述第一电极层201或者所述第二电极层202在所述过孔101处的高度。其中，所述导电部203的在所述上基板10上的投影可以位于对应的所述过孔101内，即所述导电部203的横截面的尺寸可以小于对应的所述过孔101的横截面的尺寸，以降低所述导电部203的成本。
在一实施例中，如图2和图3所示，所述导电部203包括位于所述过孔101中的导电球2031，或者所述导电部203包括从所述过孔侧壁上延伸至所述上基板10上侧和所述上基板10下侧的金属层2032。其中，所述导电球2031可以呈椭球形状，所述导电球2031的长轴可以垂直于所述第一电极层201，所述导电球2031的数目可以大于1，所述金属层2032可以由对应的所述过孔101的侧壁延伸至所述过孔101周围的上下两侧以电性连接所述第一电极层201和所述第二电极层202。具体的，可以直接在所述过孔101中放置所述导电球2031或者在所述过孔101中沉积金属材料形成所述金属层2032。具体的，所述导电球2031的组成材料可以包括但不限于金，所述金属层2032的组成材料包括但不限于铜、铝、钼。
需要注意的是，当所述导电部203包括所述导电球2031时，如图2所示，可以在形成至少一所述过孔101之前形成所述第一电极层201，再以所述第一电极层201作为支撑，以向所述第一电极层201和所述过孔101形成的容纳空间内放置至少一所述导电球2031。需要注意的是，当所述导电部203包括所述金属层2032时，可以在形成至少一所述过孔101之前形成所述第一电极层201，同理，在所述第一电极层201和所述过孔101形成的容纳空间的底部和侧壁上均形成所述金属层2032，并且所述金属层2032延伸至所述过孔101周围的上下两侧；或者，如图3所示，可以在形成至少一所述过孔101和所述金属层2032之后形成所述第一电极层201，具体的，形成所述过孔101后，可以在所述过孔101四周区域的上下侧形成所述金属层2032，并且所述金属层2032还形成于所述过孔101的侧壁。
特别的，所述金属层2032的组成材料还可以为ITO，此时可以在所述上基板10的一侧沉积ITO材料依次形成填充于所述过孔101中的所述金属层2032和所述第一电极层201，即所述金属层2032和所述第一电极层201可以通过一道工序制作，进一步的，可以将所述上基板10反转后在所述上基板10的另一侧沉积ITO材料形成一整面的所述第二电极层202。
其中，所述第一电极层201和所述第二电极层202也可以通过位于所述显示面板100中至少一边缘的侧壁上的导电线电性连接，所述导电线的组成材料可以包括但不限于铜，所述导电线的两端分别电性连接所述第一电极层201的边缘和所述第二电极层202的边缘。可以理解的，通过所述导电线电性连接所述第一电极层201和所述第二电极层202可以避免在所述上基板10上设置所述过孔101以及在所述过孔101中设置所述导电部203。
在一实施例中，所述导电部203的电阻率小于所述第一电极层201的电阻率，并且所述导电部203的电阻率小于所述第二电极层202的电阻率。可以理解的，将所述导电部203的电阻率设置的较小可以避免增加所述复合电极层20的电阻，降低所述复合电极层20和所述下板上的数据线之间的电容耦合效应。同理，当设置所述导电线时，所述导电线的电阻率也可以小于所述第一电极层201的电阻率，并且所述导电线的电阻率小于所述第二电极层202的电阻率。
在一实施例中，如图4所示，所述显示面板100还包括：保护层30，所述保护层30位于所述第一电极层201远离所述上基板10的一侧，所述保护层30具有绝缘性。需要注意的是，所述保护层30远离所述上基板10的一侧还包括偏光片、盖板等膜层，所述保护层30用于隔离所述第一电极层201和所述偏光片等膜层以避免影响所述第一电极层201的电学和光学性质。进一步的，所述保护层30还呈透明色，以避免降低光线的穿透率，具体的，所述保护层30的组成材料可以包括但不限于氮化硅、氧化硅两者中的至少一种。
在一实施例中，如图1和图4所示，所述显示面板100还包括：滤光层40，所述滤光层40和所述第二电极层202相对设置，所述滤光层40包括多个滤光部401，相邻的两个所述滤光部401之间具有间隙，进一步的，如图4所示，所述显示面板100还包括：遮光层50，所述遮光层50位于所述第二电极层202靠近所述滤光层40的一侧，所述遮光层50包括多个遮光部501，多个所述遮光部501分别与多个所述间隙相对设置。
可以理解的，将所述遮光层50设于所述第二电极层202靠近所述滤光层40的一侧，使得所述遮光层50和所述滤光层40之间的距离较近，可以提高所述遮光层50和所述滤光层40对位的准确性。具体的，所述显示面板100可以为液晶显示面板，当所述遮光层50和所述滤光层40对位以后，可以在所述遮光层50和所述滤光层40之间设置液晶分子，需要注意的是，如图1和图4所示，位于所述滤光层40远离所述上基板10的一侧的所述下基板60可以为薄膜晶体管阵列基板，所述薄膜晶体管阵列基板上不同区域的电压和所述复合电极层20上的电压不同，即所述薄膜晶体管阵列基板上的每一区域和所述复合电极层20之间存在电压差，所述电压差可以驱动对应的至少一所述液晶分子偏转，配合对应的所述滤光部401以呈现相应的颜色。
在一实施例中，所述显示面板100可以为OLED(Organic Light-Emitting Diode,有机电致发光二极管)显示面板，此时，所述滤光层40可以和所述遮光层50同层设置，并且多个所述滤光部401和多个所述遮光部501交替设置，即所述遮光部501用于防止穿过相邻的两个所述滤光部401的光线发生混色。进一步的，多个所述滤光部401和多个所述遮光部501上可以依次设置平坦层、发光层，所述发光层可以向靠近所述滤光部401的一侧发出白光，所述白光经过所述滤光层40可以实现彩色显示。
本申请提供显示面板的制作方法，所述显示面板的制作方法包括但不限
于以下实施例以及以下实施例的组合。
在一实施例中，如图5和图6所示，所述方法可以包括但不限于如下步骤。
S10，提供上基板10。
其中，结合图6所示，所述上基板10可以为刚性基板或者柔性基板，所述刚性基板可以为玻璃或者硅片，所述刚性基板的组成材料可以包括但不限于石英粉、碳酸锶、碳酸钡、硼酸、硼酐、氧化铝、碳酸钙、硝酸钡、氧化镁、氧化锡、氧化锌中的至少一种，所述柔性基板可以为聚合物材料基板、金属箔片基板、超薄玻璃基板、聚合物与无机物的复合基板或者聚合物、有机物、无机物的复合基板，其中所述聚合物材料可以包括聚乙烯、聚丙烯、聚苯乙烯、聚对苯二甲酸乙二醇酯、聚对萘二甲酸乙二醇酯、聚酰亚胺中的至少一种。
S20，在所述上基板10的一侧通过磁控溅射、真空蒸镀、喷墨打印形成第一电极层201。
其中，所述第一电极层201均具有导电性并且呈透明色。具体的，所述第一电极层201的组成材料可以包括但不限于ITO磁控溅射。
S30，在所述上基板10远离所述第一电极层201的一侧通过磁控溅射、真空蒸镀、喷墨打印形成第二电极层202，所述第一电极层201和所述第二电极层202电性连接。
其中，所述第二电极层202可以参考上文关于所述第一电极层201的相关描述。
可以理解的，如图1所示，本实施例中的所述第一电极层201和所述第二电极层202分别设置在所述上基板10中相对的两侧且电性连接，即所述第一电极层201和所述第二电极层202通过电性连接可以形成一具有导电性的复合电极层20，相比较现有技术中仅在所述上基板10中靠近下板的一侧设置电极层，本实施例中的所述复合电极层20呈现的电阻较小，即所述复合电极层20和所述下板上的数据线之间的电容耦合效应较小，可以改善水平串扰，并且所述复合电极层20对所述下板上的数据线中的信号的影响较小，最终提高了画面显示的质量。需要注意的是，由于本实施例中的所述第一电极层201位于所述上基板10远离所述第二电极层202的一侧，即所述复合电极层20靠近所述下板的一侧和所述下板的距离不会较小，相较于现有技术中的电极层和所述下板的距离，即本实施例中所述复合电极层20和所述下板的距离不会有所减小，即所述复合电极层20不会增加对所述下板上的数据线中的信号的干扰。
S40，将所述上基板和下基板相对设置，并且在所述下基板和所述上基板之间填充液晶层。
其中，所述上基板和所述下基板对组后可以预留一开口，通过所述开口将液晶分子灌入对组后的所述上基板和所述下基板之间以形成所述液晶层，再封闭所述开口，避免破坏所述液晶层。
在一实施例中，如图6所示，所述显示面板包括非显示区，所述上基板10包括至少一过孔101，每一所述过孔101均位于所述非显示区内，在所述步骤S20之前可以包括但不限于如下步骤。
S101，在至少一所述过孔101四周区域的上下侧和侧壁通过气相沉积形成导电部203，所述导电部203电性连接所述第一电极层201和所述第二电极层202。
其中，可以理解的，每一所述过孔101均位于所述非显示区可以避免在显示区内进行挖空以影响画面显示，进一步的，所述非显示区可以为但不限于靠近所述显示面板100的边缘的区域。其中，当所述上基板10包括一所述过孔101时，所述过孔101可以位于所述上基板10中靠近任一侧的区域，所述过孔101的尺寸可以设置的较大以确保所述第一电极层201和所述第二电极层202电性连接。其中，当所述上基板10包括多个所述过孔101时，多个所述过孔101可以至少排列于所述上基板10中相对的两侧，多个所述过孔101的尺寸可以相同或者不同，可以合理地设置所述过孔101的数目和尺寸以确保所述第一电极层201和所述第二电极层202电性连接，当然，多个所述过孔101也可以至少排列于所述上基板10中的其中一对角线的两端点附近的区域。
需要注意的是，根据上文分析可知，基于所述上基板10包括至少一所述过孔101，即所述过孔101形成于所述第一电极层201之前，此时无法形成所述容纳空间以支撑所述导电球2031，故此处的所述导电部203可以为所述金属层2032，即形成所述过孔101后，可以在所述过孔101四周区域的上下侧通过气相沉积形成所述金属层2032，并且所述金属层2032还形成于所述过孔101的侧壁。
可以理解的，也可以在形成至少一所述过孔101之前形成所述第一电极层201，并且通过刻蚀形成所述过孔101，再以所述第一电极层201作为支撑，以向所述第一电极层201和所述过孔101形成的容纳空间内放置至少一所述导电球2031；或者，在形成至少一所述过孔101之前形成所述第一电极层201，在所述第一电极层201和所述过孔101形成的容纳空间的底部和侧壁上均形成所述金属层2032，并且所述金属层2032延伸至所述过孔101周围的上下两侧。具体的，所述导电球2031和所述金属层2032可以参考上文的相关描述，此处仅以所述上基板10包括至少一所述过孔101为例进行说明。
需要注意的是，如图6所示，可以先在所述过孔101四周区域的上侧形成部分所述金属层2032，再将所述上基板10反转后在所述过孔101四周区域的上侧形成部分所述金属层2032，然后在所述上基板10和所述金属层2032的一侧形成所述第一电极层201，同理，再将所述上基板10反转后在所述上基板10和所述金属层2032的一侧形成所述第二电极层202。
特别的，所述金属层2032的组成材料还可以为ITO，此时可以在所述上基板10的一侧沉积ITO材料依次形成填充于所述过孔101中的所述金属层2032和所述第一电极层201，即所述金属层2032和所述第一电极层201可以通过一道工序制作，进一步的，可以将所述上基板10反转后在所述上基板10的另一侧沉积ITO材料形成一整面的所述第二电极层202。
进一步的，如图6所示，所述步骤S30之后可以包括但不限于如下步骤。
S50，在所述第一电极层201上形成保护层30，所述保护层30具有绝缘性。
需要注意的是，所述保护层30远离所述上基板10的一侧还包括偏光片、盖板等膜层，所述保护层30用于隔离所述第一电极层201和所述偏光片等膜层以避免影响所述第一电极层201的电学和光学性质。进一步的，所述保护层30还呈透明色，以避免降低光线的穿透率，具体的，所述保护层30的组成材料可以包括但不限于氮化硅、氧化硅两者中的至少一种。
进一步的，如图6所示，所述步骤S50之后可以包括但不限于如下步骤。
S60，在所述第二电极层202上形成遮光层50，所述遮光层50包括多个遮光部501。
同理，需要将所述上基板10反转后在所述第二电极层202上形成所述遮光层50，具体的，所述遮光层50和多个所述遮光部501可以参考上文的相关描述。
本申请实施例提供显示装置，所述显示装置包括如上文任一所述的显示面板。
本申请提供了显示面板及其制作方法、显示装置，所述显示面板包括：下基板；上基板，所述上基板和所述下基板相对设置；液晶层，所述液晶层填充于所述下基板和所述上基板之间；第一电极层，所述第一电极层位于所述上基板的一侧；第二电极层，所述第二电极层位于所述上基板远离所述第一电极层的一侧，所述第一电极层和所述第二电极层电性连接。本方案通过在所述上基板的两侧分别设置电性连接的所述第一电极层和所述第二电极层，所述第一电极层和所述第二电极层整体呈现的电阻较小，即削弱了所述第一电极层和所述第二电极层整体和下板上的数据线之间的电容耦合效应，因此能缩短所述第一电极层和所述第二电极层恢复到初始设定的电位的时长以削弱水平串扰，还能降低对数据线中的信号的影响，最终提高了画面显示的质量。
以上对本申请实施例所提供的显示面板及其制作、显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (20)

  1. 一种显示面板，其中，包括：
    下基板；
    上基板，所述上基板和所述下基板相对设置；
    液晶层，所述液晶层填充于所述下基板和所述上基板之间；
    第一电极层，所述第一电极层位于所述上基板靠近或者远离所述液晶层的一侧；
    第二电极层，所述第二电极层位于所述上基板远离所述第一电极层的一侧，所述第一电极层和所述第二电极层电性连接。
  2. 如权利要求1所述的显示面板，其中，所述显示面板包括非显示区，所述上基板包括至少一过孔，每一所述过孔位于所述非显示区内；
    其中，所述显示面板还包括导电部，所述导电部位于至少一所述过孔中，所述第一电极层和所述第二电极层通过所述导电部电性连接。
  3. 如权利要求2所述的显示面板，其中，所述上基板包括多个所述过孔，多个所述过孔至少排列于所述上基板中相对的两侧。
  4. 如权利要求2所述的显示面板，其中，所述导电部包括位于所述过孔中的导电球，或者所述导电部包括从所述过孔侧壁上延伸至所述上基板上侧和所述上基板下侧的金属层。
  5. 如权利要求4所述的显示面板，其中，所述导电球呈椭球形状，所述导电球的长轴垂直于所述第一电极层。
  6. 如权利要求4所述的显示面板，其中，所述金属层由对应的所述过孔的侧壁延伸至所述过孔周围的上下两侧以电性连接所述第一电极层和所述第二电极层。
  7. 如权利要求4所述的显示面板，其中，所述金属层的组成材料和所述第一电极层的组成材料相同。
  8. 如权利要求2所述的显示面板，其中，所述导电部的电阻率小于所述第一电极层的电阻率，并且所述导电部的电阻率小于所述第二电极层的电阻率。
  9. 如权利要求1所述的显示面板，其中，所述显示面板还包括：
    保护层，所述保护层位于所述第一电极层远离所述上基板的一侧，所述保护层具有绝缘性。
  10. 如权利要求1所述的显示面板，其中，所述显示面板还包括：
    滤光层，所述滤光层和所述第二电极层相对设置，所述滤光层包括多个滤光部，相邻的两个所述滤光部之间具有间隙；
    遮光层，所述遮光层位于所述第二电极层靠近所述滤光层的一侧，所述遮光层包括多个遮光部，多个所述遮光部分别与多个所述间隙相对设置。
  11. 一种显示面板的制作方法，其中，所述方法包括：
    提供一基板；
    在所述上基板的一侧通过磁控溅射、真空蒸镀或者喷墨打印形成第一电极层；
    在所述上基板远离所述第一电极层的一侧通过磁控溅射、真空蒸镀或者喷墨打印形成第二电极层，所述第一电极层和所述第二电极层电性连接；
    将所述上基板和下基板相对设置，并且在所述下基板和所述上基板之间填充液晶层。
  12. 如权利要求11所述的显示面板的制作方法，其中，所述显示面板包括非显示区，所述上基板包括至少一过孔，每一所述过孔位于所述非显示区内；
    其中，在所述上基板的一侧通过磁控溅射、真空蒸镀或者喷墨打印形成第一电极层的步骤之前，还包括：
    在至少一所述过孔四周区域的上下侧和侧壁通过气相沉积形成导电部，所述导电部电性连接所述第一电极层和所述第二电极层。
  13. 如权利要求11所述的显示面板的制作方法，其中，在所述上基板远离所述第一电极层的一侧通过磁控溅射、真空蒸镀或者喷墨打印形成第二电极层，所述第一电极层和所述第二电极层电性连接的步骤之后，还包括：
    在第一电极层上形成保护层，所述保护层具有绝缘性。
  14. 如权利要求13所述的显示面板的制作方法，其中，在第一电极层上形成保护层，所述保护层具有绝缘性的步骤之后，还包括：
    在所述第二电极层上形成遮光层，所述遮光层包括多个遮光部。
  15. 一种显示装置，其中，所述显示装置包括显示面板，所述显示面板包括：
    下基板；
    上基板，所述上基板和所述下基板相对设置；
    液晶层，所述液晶层填充于所述下基板和所述上基板之间；
    第一电极层，所述第一电极层位于所述上基板靠近或者远离所述液晶层的一侧；
    第二电极层，所述第二电极层位于所述上基板远离所述第一电极层的一侧，所述第一电极层和所述第二电极层电性连接。
  16. 如权利要求15所述的显示装置，其中，所述显示面板包括非显示区内所述上基板包括至少一过孔，每一所述过孔位于所述非显示区内；
    其中，所述显示面板还包括导电部，所述导电部位于至少一所述过孔中，所述第一电极层和所述第二电极层通过所述导电部电性连接。
  17. 如权利要求16所述的显示装置，其中，所述上基板包括多个所述过孔，多个所述过孔至少排列于所述上基板中相对的两侧。
  18. 如权利要求16所述的显示装置，其中，所述导电部包括位于所述过孔中的导电球，或者所述导电部包括从所述过孔侧壁上延伸至所述上基板上侧和所述上基板下侧的金属层。
  19. 如权利要求18所述的显示装置，其中，所述金属层由对应的所述过孔的侧壁延伸至所述过孔周围的上下两侧以电性连接所述第一电极层和所述第二电极层。
  20. 如权利要求16所述的显示装置，其中，所述导电部的电阻率小于所述第一电极层的电阻率，并且所述导电部的电阻率小于所述第二电极层的电阻率。
PCT/CN2021/103362 2021-06-18 2021-06-30 显示面板及其制作方法、显示装置 Ceased WO2022262010A1 (zh)

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