WO2022257641A1 - Revêtement isolant étanche à l'eau et application correspondante - Google Patents

Revêtement isolant étanche à l'eau et application correspondante Download PDF

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Publication number
WO2022257641A1
WO2022257641A1 PCT/CN2022/090016 CN2022090016W WO2022257641A1 WO 2022257641 A1 WO2022257641 A1 WO 2022257641A1 CN 2022090016 W CN2022090016 W CN 2022090016W WO 2022257641 A1 WO2022257641 A1 WO 2022257641A1
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WO
WIPO (PCT)
Prior art keywords
waterproof
waterproof insulating
circuit board
insulating coating
insulating film
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PCT/CN2022/090016
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English (en)
Chinese (zh)
Inventor
李鹏飞
谭东升
任林德
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荣耀终端有限公司
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Publication of WO2022257641A1 publication Critical patent/WO2022257641A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09D201/04—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08—Anti-corrosive paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Definitions

  • the application belongs to the technical field of waterproof insulating materials and electronic consumables, and in particular relates to a waterproof insulating coating and its application.
  • connectors are widely used in electronic products. As a bridge between components, connectors have the function of conducting signals and currents.
  • the use of connectors greatly improves the flexibility and convenience of electronic product assembly, maintenance and upgrading.
  • the connectors soldered on the printed circuit board (Printed Circuit Board, PCB) after the periphery of the electronic product enters the liquid are prone to short circuit and electrochemical corrosion, resulting in functional failure.
  • FIG. 1 Taking the widely used board-to-board connector (Board to Board, BTB) connector as an example, one of the existing BTB connector protection technologies in the industry is shown in Figure 1. "The foam/rubber ring 2, the foam/rubber ring 2 is compressed between the BTB male reinforcing steel plate 3 and the PCB board 4 to achieve sealing.
  • This technology mainly has the following problems: 1) Occupying the space of the board The cotton/rubber ring needs to have a certain width, and the components around the BTB need to avoid space; 2) The foam/rubber ring needs to have a certain amount of compression, which is higher than the height of the BTB female head and affects the buckle; 3) In order to achieve compression and top sealing, BTB The size of the male reinforcing steel plate needs to be increased; 4) The size of each BTB is different, and it needs to be customized according to the size of each BTB, and the manufacturing process is complicated; 5) The long-term compression of the foam reduces the resilience and the protective effect.
  • the second prior art is to carry out vacuum nano-coating on the circuit board, and form a hydrophobic or water-proof solid film layer on the surface of the connector by vapor deposition.
  • the problem with this technology is that when the thickness of the coating film is low, it cannot effectively protect the irregular surface of the connector. , when the coating thickness is thick, it will affect the functions of some devices on the board, and at the same time affect the conduction of the connector. Even if the thickness accuracy of the film layer is improved, there is a problem that the solid film layer cannot be effectively pierced when the male and female heads of the connector are fastened, resulting in the failure of the male and female heads of the connector to conduct.
  • the purpose of the embodiments of the present application is to provide a waterproof insulating coating, which aims to solve the problem that the existing vacuum nano-coating, waterproof and/or insulating coatings cannot effectively penetrate the connection in the waterproof application of electrical connectors, and the film layer is difficult to control, resulting in buckling. Unsatisfactory technical problems with unsatisfactory waterproof effects.
  • an aspect of the embodiment of the present application provides a waterproof insulating coating.
  • the waterproof and insulating coating of the embodiment of the present application includes at least one waterproof and insulating film-forming component in the following I to III:
  • R 1 to R 8 in the structural formula A are independently hydrogen atom, halogen atom, methoxy group, ethoxy group, C 1 -C 3 alkyl group, C 3 -C 10 cycloalkyl group, C 6 -C 15 Any of the aryl groups, m is an integer of 10-100;
  • the waterproof insulating coating of the embodiment of the present application can effectively form a film such as a film on a connector, and the film layer has good insulation and waterproof properties, thereby giving a device containing the waterproof insulating coating film layer, such as a connector, a good waterproof effect. , At the same time, the insulation will not affect and cause the short circuit between the pins of the connector, which improves the stability and service life of the corresponding device performance.
  • the paste-like (or fat-like) film layer formed by the waterproof insulating coating has good puncture characteristics such as proper cone penetration, and it can be effectively punctured at a fixed point under the action of an external force such as realizing male and female connectors.
  • the snap-fit conductive connection of the head is a mechanical connection, or a connector, or a good waterproof effect.
  • the film layer formed by the waterproof insulating coating has good extrusion and calendering characteristics, which reduces the strict requirements on the coating thickness of the waterproof insulating coating, and can directly adjust the thickness of the film layer to achieve good waterproof and insulating effect.
  • the waterproof insulating coating includes a mixture of two waterproof insulating film-forming components I and II, and the mass ratio of the two waterproof insulating film-forming components I and II is 3:(0.8-1.2).
  • the waterproof insulating coating includes a mixture of two waterproof insulating film-forming components I and III, and the mass ratio of the two waterproof insulating film-forming components I and III is 3:(1.5-2.5).
  • the waterproof insulating coating includes a mixture of two waterproof insulating film-forming components II and III, and the mass ratio of the two waterproof insulating film-forming components II and III is 1:(1.3-2.8).
  • the waterproof insulating coating includes a mixture of three waterproof and insulating film-forming components of I, II and III, and the mass ratio of the three waterproof and insulating film-forming components of I, II and III is 3:(0.8 -1.2): (1.5-2.5).
  • the organolinear siloxane compound contains a halogen atom
  • the halogen atom is any of F, CL, Br, I
  • C 1 -C 3 alkyl includes any one of methyl, ethyl, propyl, and isopropyl
  • the organolinear siloxane compound contains C 3 -C 10 cycloalkyl, C 3 -C 10 cycloalkane
  • the group includes any of three-carbon cycloalkyl, four-carbon cycloalkyl, and five-carbon cycloalkyl
  • the organolinear siloxane compound contains a C 6 -C 15 aryl group
  • the C 6 -C 15 aryl group includes Any of the aryl group containing one phenol group and the aryl group containing two phenol groups.
  • organolinear siloxane compounds include polydiphenyldimethyllinear siloxane, polydimethoxylinear siloxane, polymethylethoxylinear siloxane, polymethyltrifluoropropyl
  • At least one of linear siloxane and polymethylchlorophenyl linear siloxane and normal alkanes include at least one of n-octane, n-decane, n-undecane, laurane, and n-tetradecane
  • isoparaffins include at least one of iso-dodecane, iso-decane, and iso-tetradecane
  • fluorine-containing aliphatic polymers include bis-heptafluoropropyl ketone, methyl nonafluorobutyl ether , at least one of pentafluoroethyl heptafluoropropyl ketone and heptafluorocyclopentane.
  • the waterproof effect of waterproof and insulating coatings can be effectively improved on the basis of imparting insulation effects to waterproof and insulating coatings, and the characteristics of piercing at fixed points can be improved, and its applicability can be improved.
  • the applicability in the field of connectors can also improve the extrusion and calendering properties of the waterproof insulating coating film.
  • the waterproof insulating coating further includes at least one of a viscosity modifier and a volatile solvent.
  • a viscosity modifier and a volatile solvent By adding a viscosity modifier and a volatile solvent to the waterproof insulating coating, the uniformity of dispersion of the components contained in the waterproof insulating coating is improved, the film-forming quality of the waterproof insulating coating is improved and the diversity of film-forming methods is increased.
  • the viscosity modifier includes at least one of titanium dioxide, silicon dioxide, talcum powder, and calcium carbonate;
  • the volatile solvent includes at least one of perfluorinated solvents, ester solvents, and ether solvents.
  • the perfluorinated solvent includes at least one of methyl perfluorobutyl ether, methyl perfluoroisobutyl ether, ethyl perfluorobutyl ether, and ethyl perfluoroisobutyl ether;
  • the ester solvent includes ethyl acetate, At least one of methyl acetate;
  • ether solvents include at least one of diethyl ether and petroleum ether.
  • the above-mentioned functions of the viscosity modifier and the volatile solvent can be improved in the waterproof insulating coating, and the solute of the waterproof insulating coating, such as the solubility of the waterproof insulating film-forming component, can be improved.
  • the viscosity of the waterproof insulating coating is used to improve the dispersion stability of the components of the waterproof insulating coating, thereby improving the film-forming quality of the waterproof insulating coating. Waterproof and insulating properties.
  • the waterproof insulating coating comprises a mixture of the waterproof insulating film-forming component and the viscosity-adjusting agent, and the mass ratio of the waterproof insulating film-forming component to the viscosity-adjusting agent is 1:(1-2) .
  • the waterproof insulating coating includes a mixture of the waterproof insulating film-forming component and the volatile solvent, and the mass ratio of the waterproof insulating film-forming component to the volatile solvent is 1:(5-20 ).
  • the waterproof insulating coating includes a mixture of the waterproof insulating film-forming component, the volatile solvent and the viscosity-adjusting agent, and the waterproof insulating film-forming component, the volatile solvent and the viscosity-adjusting agent The mass ratio is 1:(5-20):(1-2).
  • the stability of the waterproof insulating coating is improved, the film-forming quality is improved, and the fixed-point puncture, film layer extrusion and calendering characteristics and waterproof insulation performance of the waterproof insulating coating are further improved.
  • the penetration of the film layer formed by the waterproof insulating paint is 200-350 (0.1mm); and/or
  • the resistance of the film layer formed by the waterproof insulating coating is >10 8 ⁇ ;
  • the surface water contact angle of the film layer formed by the waterproof insulating coating is >100°;
  • the leakage current of the film layer formed by the waterproof insulating coating is ⁇ 0.01mA.
  • the waterproof insulating coating is endowed with good puncture characteristics, high insulation and water resistance.
  • Another aspect of the embodiment of the present application provides an application method of the waterproof insulating coating according to the embodiment of the present application, and its application in circuit board connectors, electronic products, home appliances, and automobiles. Since the waterproof insulating coating of the embodiment of the present application has good stability and film-forming properties as described above, its film layer has excellent waterproofness, insulation performance, cone penetration, and extrusion and calendering characteristics of the film layer, which effectively expands the embodiment of the present application. The application field of the waterproof insulating coating, and the application effect in the corresponding field and device are enhanced, and the quality of the corresponding device is improved.
  • a circuit board connector in yet another aspect of the embodiments of the present application, includes a circuit board connector body, at least a waterproof insulating film layer is formed on the conductor joint area of the circuit board connector body, and the waterproof insulating film layer is formed by the waterproof insulating coating of the embodiment of the present application form. In this way, at least the conductor joint area of the circuit board connector is covered and protected by the waterproof insulating film layer.
  • the film layer covering the pins will be pierced and squeezed to realize the contact conduction of the male and female heads of the circuit board connector, and the film layer at the non-pins will still be squeezed.
  • the film layer formed by the waterproof insulating coating in the embodiment of the present application has good film extrusion and calendering characteristics, the thickness control requirements of the waterproof insulating film layer can be significantly reduced, and both male and female connectors of circuit board connectors can be realized. Stable fastening, and can significantly reduce the production process conditions and control of the waterproof insulating film layer, improve the production efficiency of the circuit board connector and reduce the cost.
  • the thickness of the waterproof insulating film layer included in the circuit board connector is not less than 10 ⁇ m. Since the waterproof insulating film layer has good film extrusion and calendering characteristics, it is only necessary to control the minimum thickness requirement of the waterproof insulating film layer, which can significantly reduce the thickness accuracy requirement of the waterproof insulating film layer.
  • Still another aspect of the embodiments of the present application provides a circuit board.
  • the circuit board in the embodiment of the present application includes a circuit board connector, and the circuit board connector is the circuit board connector in the embodiment of the present application.
  • the male and female connectors contained in the circuit board of the embodiment of the application have stable buckling and conduction, and have a good waterproof effect, which can effectively improve the life of the circuit board connector, thereby giving the circuit of the embodiment of the application Board stable performance, and long life.
  • Still another aspect of the embodiments of the present application provides an electronic product.
  • the electronic product in the embodiment of the present application includes a circuit board, and the circuit board is the circuit board in the embodiment of the present application.
  • electronic products include mobile phones, tablets, PCs, watches, bracelets, and earphones.
  • Still another aspect of the embodiments of the present application provides a household electrical appliance.
  • the home appliance product in the embodiment of the present application includes a circuit board, and the circuit board is the circuit board in the embodiment of the present application.
  • Still another aspect of the embodiments of the present application provides a car.
  • the car in the embodiment of the present application includes a circuit board, and the circuit board is the circuit board in the embodiment of the present application.
  • the electronic products, home appliances and automobiles of the embodiments of the present application all contain the circuit boards of the embodiments of the present application. Therefore, the electrical modules contained in the electronic products, home appliances and automobiles in the embodiments of the present application have stable working performance and long service life.
  • Figure 1 is a picture of the "frame-shaped" foam/rubber ring pasted around the female head of the existing BTB connector and a schematic diagram of the structure after the male head and the female head of the BTB connector are buckled;
  • Fig. 2 is a structural diagram of one embodiment of the circuit board connector body contained in the circuit board connector of the embodiment of the present application and a structural schematic diagram of the fastening of the female head and the male head after the film formation of the circuit board connector body of this embodiment;
  • Figure a in Figure 2 is a structural diagram of one embodiment of the female head of the circuit board connector body;
  • Figure b in Figure 2 shows the female head of the circuit board connector with the main body of the circuit board connector shown in Figure a in Figure 2 Schematic diagram of the structure of the male buckle;
  • FIG. 3 is a schematic diagram of the formation process of the waterproof insulating film layer contained in the circuit board connector of the embodiment of the present application and the buckling principle of the male and female heads of the circuit board connector;
  • Fig. 4 is a schematic flow diagram of forming a waterproof insulating film layer on the circuit board connector body by a paste waterproof insulating coating according to an embodiment of the present application;
  • FIG. 5 is a schematic flow diagram of forming a waterproof insulating film layer on a circuit board connector body by a liquid waterproof insulating paint according to an embodiment of the present application.
  • 2-foam/rubber ring 3-(BTB male) reinforced steel plate; 4-PCB board; 5-waterproof insulating film.
  • At least one means one or more, and “multiple” means two or more.
  • At least one of the following” or similar expressions refer to any combination of these items, including any combination of single or plural items.
  • at least one item (unit) of a, b, or c or “at least one item (unit) of a, b, and c” can mean: a, b, c, a-b( That is, a and b), a-c, b-c, or a-b-c, where a, b, and c can be single or multiple.
  • the term "and/or” describes the relationship between related objects, indicating that there may be three relationships, for example, A and/or B, which may mean: A exists alone, A and B exist simultaneously, and A and B exist independently. There is a case of B. Among them, A and B can be singular or plural.
  • the character "/" generally indicates that the contextual objects are an "or" relationship.
  • sequence numbers of the above-mentioned processes do not mean the order of execution, and some or all steps may be executed in parallel or sequentially, and the execution order of each process shall be based on its functions and The internal logic is determined and should not constitute any limitation to the implementation process of the embodiment of the present application.
  • the weight of the relevant components mentioned in the description of the embodiments of the present application can not only refer to the specific content of each component, but also represent the proportional relationship between the weights of the various components.
  • the scaling up or down of the content of the fraction is within the scope disclosed in the description of the embodiments of the present application.
  • the mass described in the description of the embodiments of the present application may be ⁇ g, mg, g, kg and other well-known mass units in the chemical industry.
  • first and second are only used for descriptive purposes to distinguish objects such as substances from each other, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • first XX can also be called the second XX
  • second XX can also be called the first XX.
  • a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features.
  • PCB English is Printed Circuit Board, Chinese is printed circuit board.
  • BTB Board to Board in English, board to board in Chinese, refers to a type of connector in the embodiment of this application, specifically refers to a board to board connector.
  • BTB connector A type of connector, specifically a board-to-board connector, which is also a BTB (Board to Board) connector.
  • the embodiment of the present application provides a waterproof insulating coating.
  • the waterproof and insulating coating of the embodiment of the present application includes at least one waterproof and insulating film-forming component in the following I to III:
  • R 1 to R 8 in the structural formula A are independently hydrogen atom, halogen atom, methoxy group, ethoxy group, C 1 -C 3 alkyl group, C 3 -C 10 cycloalkyl group, C 6 -C 15 Any of the aryl groups, m is an integer of 10-100; in an embodiment, the halogen atom can be any of F, CL, Br, and I, and the C 1 -C 3 alkyl group includes methyl, ethyl Any of , propyl, isopropyl, etc., C 3 -C 10 cycloalkyl can be, but not limited to, any of three-carbon cycloalkyl, four-carbon cycloalkyl, five-carbon cycloalkyl, etc.
  • the C 6 -C 15 aryl group may be any one including an aryl group containing one phenol group, an aryl group containing two phenol groups, and the like.
  • the organic linear siloxane compound can specifically be polydiphenyldimethyl linear siloxane, polydimethoxy linear siloxane, polymethylethoxy linear siloxane, polymethoxy At least one of trifluoropropyl linear siloxane and polymethylchlorophenyl linear siloxane.
  • n in the structural formula B is an integer of 8-15; in an embodiment, the n-alkane can specifically be n-octane (C8), n-decane (C10), n-undecane (C11), laurane (C12 ), normal tetradecane (C14); the isoparaffin may specifically be at least one of iso-dodecane, iso-decane, and iso-tetradecane.
  • the polymer may be at least one of bis-heptafluoropropyl ketone, methyl nonafluorobutyl ether, pentafluoroethyl heptafluoropropyl ketone, and heptafluorocyclopentane.
  • At least one waterproof insulating film-forming component in the above-mentioned I to III has good hydrophobicity, insulation, cone penetration and calendering deformation, and also has good film-forming properties. Therefore, the waterproof insulating coating of the embodiment of the present application can effectively form a film such as a film on a connector, and give the film layer good insulation and waterproof performance, thereby giving a device containing the waterproof insulating coating film layer such as a good connector. Waterproof effect, and the insulation of the waterproof insulating coating of the embodiment of the present application will not affect or cause short circuit between pins of the connector, which improves the stability and service life of the corresponding device performance.
  • the waterproof insulating coating is endowed with a paste-like or fat-like film layer, and the film layer is endowed with good puncture properties such as proper cone penetration characteristics, which can be effectively punctured at a fixed point under the action of external forces. Snap-fit conductive connection of male and female connectors.
  • it also endows the film layer formed by the waterproof insulating coating with good extrusion calendering and deformation characteristics, which reduces the strict requirements on the coating thickness of the waterproof insulating coating, and can directly adjust the thickness of the film layer to achieve Good waterproof and insulating effect.
  • above-mentioned waterproof insulating paint comprises following embodiment at least:
  • the waterproof insulating coating includes a mixture of two waterproof insulating film-forming components I and II, and the mass ratio of the two waterproof insulating film-forming components I and II is 3:(0.8-1.2) .
  • the waterproof insulating coating includes a mixture of two waterproof insulating film-forming components I and III, and the mass ratio of the two waterproof insulating film-forming components I and III is 3:(1.5- 2.5).
  • the waterproof insulating coating includes a mixture of two waterproof insulating film-forming components II and III, and the mass ratio of the two waterproof insulating film-forming components II and III is 1:(1.3-2.8) .
  • the waterproof insulating coating includes a mixture of three waterproof and insulating film-forming components of I, II and III, and the mass ratio of the three waterproof and insulating film-forming components of I, II and III is 3:( 0.8-1.2): (1.5-2.5).
  • the waterproof and insulating paint also includes the embodiment that only contains any one of the waterproof and insulating film-forming components from I to III.
  • the waterproof effect of the waterproof and insulating coating can be effectively improved on the basis of endowing the waterproof and insulating coating with insulation properties, and the fixed-point puncture can be improved, such as improving the cone penetration characteristics, film-forming properties and deformation.
  • the fixed-point puncture can be improved, such as improving the cone penetration characteristics, film-forming properties and deformation.
  • improve its applicability such as applicability in the field of connectors.
  • the above waterproof insulating coating further includes at least one of a viscosity modifier and a volatile solvent.
  • a viscosity modifier and a volatile solvent By adding a viscosity modifier and a volatile solvent to the waterproof insulating coating, the uniformity of dispersion of the components contained in the waterproof insulating coating is improved, the film-forming quality of the waterproof insulating coating is improved and the diversity of film-forming methods is increased.
  • the viscosity modifier includes at least one of titanium dioxide, silicon dioxide, talc, and calcium carbonate.
  • These viscosity modifiers can effectively adjust the viscosity of the waterproof insulating coating, improve the dispersion uniformity of each component of the waterproof insulating coating before and during use, thereby improving the film-forming quality of the waterproof insulating coating.
  • these viscosity-adjusting agents will also play a synergistic effect on insulation and other properties with the above-mentioned waterproof and insulating film-forming components, and improve the insulating effect of the above-mentioned waterproof and insulating film-forming components, and will not affect the penetration of the waterproof and insulating coating. and extrusion properties.
  • the volatile solvent includes at least one of perfluorinated solvents, ester solvents, and ether solvents.
  • the perfluorinated solvent includes at least one of methyl perfluorobutyl ether, methyl perfluoroisobutyl ether, ethyl perfluorobutyl ether, and ethyl perfluoroisobutyl ether;
  • the ester solvent includes ethyl acetate, At least one of methyl acetate;
  • ether solvents include at least one of diethyl ether and petroleum ether.
  • the above-mentioned functions of the viscosity modifier and volatile solvent in the waterproof insulating coating can be improved, and the solute of the waterproof insulating coating, such as the solubility of the waterproof insulating film-forming component, can be improved.
  • the solute of the waterproof insulating coating such as the solubility of the waterproof insulating film-forming component. 1. Increase the viscosity of the waterproof insulating coating to improve the dispersion stability of the components of the waterproof insulating coating, thereby improving the film-forming quality of the waterproof insulating coating. properties and waterproof insulation properties.
  • the above-mentioned waterproof insulating coating contains at least one of a viscosity-adjusting agent and a volatile solvent
  • the above-mentioned waterproof insulating coating includes at least the following embodiments:
  • the waterproof insulating coating includes a mixture of the waterproof insulating film-forming component and the viscosity-adjusting agent, and the mass ratio of the waterproof insulating film-forming component to the viscosity-adjusting agent is 1:( 1-2).
  • the waterproof insulating coating includes a mixture of the waterproof insulating film-forming component and the volatile solvent, and the mass ratio of the waterproof insulating film-forming component to the volatile solvent is 1:( 5-20).
  • the waterproof insulating coating includes a mixture of the waterproof insulating film-forming component, the volatile solvent and the viscosity modifier, and the waterproof insulating film-forming component, the volatile solvent and the The mass ratio of the viscosity adjusting agent is 1:(5-20):(1-2).
  • the stability of the waterproof insulating coating is improved, the film-forming quality is improved, and the fixed-point puncture, film layer extrusion and calendering characteristics and waterproof insulation performance of the waterproof insulating coating are further improved.
  • the waterproof insulating coatings are given excellent waterproof effect, fixed-point puncture characteristics and film-forming properties. and deformation properties. If it is tested, the penetration of the film layer formed by the waterproof insulating paint is 200-350, the resistance of the film layer formed by the waterproof insulating paint is >10 8 ⁇ , and the surface water contact angle of the film layer formed by the waterproof insulating paint is >100° , The leakage current of the film layer formed by the waterproof insulating coating is ⁇ 0.01mA.
  • the preparation methods of the above-mentioned waterproof and insulating coatings in each embodiment can be formulated according to the components and contents contained therein, and all the components can be mixed evenly.
  • the embodiment of the present application also provides the application method of the above waterproof and insulating coating, and the application of the waterproof and insulating coating in circuit board connectors, electronic products, home appliances, and automobiles. This application effectively expands the application field of the waterproof insulating coating of the embodiment of the present application, and enhances the application effect in corresponding fields and devices.
  • the embodiment of the present application provides a circuit board connector.
  • the circuit board connector of the embodiment of the present application includes a circuit board connector body, and a waterproof insulating film layer is formed at least on the conductor joint area of the circuit board connector body, and the waterproof insulating film layer is formed by the waterproof insulating coating of the embodiment of the present application.
  • the structure of the circuit board connector in the embodiment of the present application is shown in Figure 2, Figure 4 and Figure 5, which includes the circuit board connector body 1, at least in the conductor joint area of the circuit board connector body 1, that is, A waterproof and insulating film layer 5 is formed on the female connector 11, and the waterproof and insulating film layer 5 is formed by forming a film of the waterproof and insulating paint in the above application embodiment.
  • the female head 11 of the circuit board connector body 1 can be as shown in figure a in FIG. 2 , FIG. 4 and FIG. 5 , and of course the circuit board connector body 1 can also have other structures. In this way, when the female head 11 and the male head 12 of the circuit board connector body 1 are buckled by the reinforcing steel plate 3, the waterproof insulating film layer 5 covering the pins will be pierced and squeezed to realize the female connector of the circuit board connector.
  • the pins of the header 11 and the male header 12 are in contact with each other, and the waterproof insulating film layer 5 at the non-pin is squeezed and still attached to the pins to achieve wrapping and protection, as shown in Figure 2 b, so as to realize the
  • the good waterproof and insulation protection of the circuit board connector improves the stable connection of the circuit board connector and prolongs the service life.
  • the waterproof insulating film layer 5 formed by the waterproof insulating coating in the embodiment of the present application has good film extrusion and rolling characteristics, the thickness control requirements of the waterproof insulating film layer 5 can be significantly reduced, and the circuit board connector can be realized.
  • the circuit board connector in the embodiment of the present application is generally installed on the PCB board, as shown in FIG. 2 , FIG. 4 and FIG. 5 , it is installed on the PCB board 4 .
  • the waterproof insulating film 5 Since the waterproof insulating film 5 has good film extrusion and calendering properties, it is only necessary to control the minimum thickness requirement of the waterproof insulating film layer 5 , which can significantly reduce the thickness accuracy requirement of the waterproof insulating film layer 5 .
  • the thickness of the waterproof insulating film layer 5 included in the circuit board connector is not less than 10 ⁇ m. Since the waterproof insulating film layer 5 has good calenderability of the film layer, it only needs to control its minimum guaranteed insulation and waterproof thickness, and any thickness greater than this thickness meets the requirements of the film layer.
  • the formation process of the waterproof insulating film layer 5 contained in the circuit board connector of the embodiment of the present application and the buckling principle of the female connector 11 and the male connector 12 of the circuit board connector body 1 are shown in FIG. 3 .
  • the connector pins of the circuit board connector body 11 squeeze and pierce the waterproof insulating film layer 5 at the pins to achieve conductive connection, and the waterproof insulation in other areas of the pins
  • the film layer 5 will surround the pins for waterproof and insulation, so as to protect the circuit board connector from waterproof and insulation, so as to significantly improve the working stability and service life of the circuit board connector.
  • the waterproof insulating film layer 5 contained in the circuit board connector of the embodiment of the present application can be formed according to the method of coating formation.
  • the paste-like waterproof insulating coating can be directly formed into a film on the circuit board connector body 1, such as by scraping, spraying, rolling, etc. to form a film, that is, to form a waterproof
  • the insulating film layer 5 forms a circuit board connector.
  • the liquid waterproof insulating coating can be directly formed into a film on the circuit board connector body 1.
  • the liquid waterproof insulating coating is dripped Apply on the surface of the circuit board connector body 11 to form droplets 6, the droplets 6 will diffuse to form a film, forming a waterproof insulating film layer 5, and the volatile solvent will be volatilized during the process of the droplets 6 spreading to form a film
  • the circuit board connector is formed after the solvent evaporates.
  • the waterproof insulating film layer 5 may also be formed by spraying or the like.
  • an embodiment of the present application further provides a circuit board.
  • the circuit board in the embodiment of the present application includes a circuit board connector, which is the circuit board connector in the embodiment of the above application.
  • the male and female connectors contained in the circuit board of the embodiment of the application have stable buckling and conduction, and have a good waterproof effect, which can effectively improve the life of the circuit board connector, thereby giving the circuit of the embodiment of the application Board stable performance, and long life.
  • the circuit board may be a single board or a multi-layer board.
  • the embodiment of the present application further provides any device or product including a circuit board, such as an electronic product, a home appliance product, an automobile, or the like.
  • a circuit board such as an electronic product, a home appliance product, an automobile, or the like.
  • the circuit board contained in any device or product such as electronic products, home appliances, automobiles, etc. is the circuit board of the embodiment of the present application.
  • electronic products include mobile phones, tablets, PCs, watches, bracelets, and earphones.
  • electronic products can also be other electronic products containing the above-mentioned circuit board of the embodiment of the present application.
  • the home appliance products include large household appliances, consumer electronics products, kitchen and bathroom and small home appliances, environment and health home appliances, smart home appliances and other products.
  • the vehicle includes traditional energy vehicles, trams, new energy vehicles and the like.
  • the waterproof insulating paint contains an organolinear siloxane compound of polydiphenyldimethyllinear siloxane.
  • the waterproof insulating paint contains alkane of laurane (C12).
  • the waterproof insulating paint contains fluorine-containing aliphatic polymer of methyl nonafluorobutyl ether.
  • the waterproof insulating coating contains a mixture of organolinear siloxane compound of polydiphenyldimethyl linear siloxane and alkane of laurane (C12), and the mass ratio of organolinear siloxane compound to alkane is 3:1 .
  • the waterproof insulating coating contains a mixture of an organolinear siloxane compound of polydiphenyldimethyl linear siloxane and a fluorine-containing aliphatic polymer of methyl nonafluorobutyl ether, and the organolinear siloxane compound contains The mass ratio of fluoroaliphatic polymer is 3:2.
  • This embodiment provides a waterproof insulating coating.
  • the mixture of alkane of laurane (C12) and fluorine-containing aliphatic polymer of methyl nonafluorobutyl ether, and the mass ratio of alkane to fluorine-containing aliphatic polymer is 1:2.
  • This embodiment provides a waterproof insulating coating.
  • the organolinear siloxane compound of polydiphenyldimethyl linear siloxane, the mixture of alkane of laurane (C12) and fluorinated aliphatic polymer of methyl nonafluorobutyl ether, and organolinear siloxane The mass ratio of alkanes, alkanes and fluorine-containing aliphatic polymers is 3:1:2.
  • This embodiment provides a waterproof insulating coating.
  • This embodiment provides a waterproof insulating coating.
  • This embodiment provides a waterproof insulating coating.
  • This embodiment provides a waterproof insulating coating.
  • the mixture of organolinear siloxane compound of polymethylchlorophenyl linear siloxane, alkane of isodecane and fluorine-containing aliphatic polymer of heptafluorocyclopentane, ethyl acetate volatile solvent and talcum powder , and the mass ratio of organolinear siloxane compound, alkane, fluorine-containing aliphatic polymer, volatile solvent and talcum powder is 3:0.8:2.5:60:9.
  • the waterproof and insulating coatings provided in the above-mentioned embodiments A1 to A11 are respectively applied to the connectors contained in the circuit board to form a film, and a waterproof and insulating film layer is formed on the connectors to obtain the circuit board connector and the circuit board respectively.
  • a circuit board connector is provided. Compared with the embodiment B1, the circuit board connector does not contain a waterproof insulating film layer.
  • the waterproof insulating paint of embodiment A1 to embodiment A11 is coated on the insulation resistance (Surface Insulation Resistance, SIR) test board to form waterproof insulating film layer, then apply 50V bias voltage, be placed in double 85 environment (temperature 85 °C, humidity 85% RH), under the test voltage of 100V, test the resistance every 0.5h for 1 week (168h).
  • the resistance of each waterproof insulating film layer is greater than 10 8 ⁇ .
  • the resistances are also greater than 10 8 ⁇ , and the connector body in each embodiment has no corrosion, indicating that the waterproof insulating film layer in each embodiment has good and stable insulation properties, and coating on the connector will not cause Connector contact pins are shorted or corroded.
  • each circuit board connector in embodiment B1 to embodiment B11 After the waterproof insulating film layer of each circuit board connector in embodiment B1 to embodiment B11 is formed, the water contact angle on the surface of each waterproof insulating film layer is tested with a water drop angle tester and is greater than 100°, indicating that each waterproof insulating film layer has a good Hydrophobic effect;
  • the waterproof insulating paint of embodiment A1 to embodiment A11 is coated on the insulation resistance (SIR) test plate to form waterproof insulating film layer, then drip 10uL tap water on the surface of each waterproof insulating film layer, apply the voltage of 5V to test, 24h There is no corrosion on the body of each connector and the current reading is 0 (replenish in time after the dripped tap water volatilizes during the test), and the blank insulation resistance (SIR) without waterproof coating is corroded within 5 minutes of dripping water, and 2.76 mA current, until the dripped tap water reacts completely on the insulation resistance (SIR) test board, the resulting leakage current is >5mA.
  • each waterproof insulating film layer has a good water-proof effect, and water will not penetrate each waterproof insulating film layer to cause short circuit and corrosion. After coating on the surface of the connector, water will not penetrate the material and cause short circuit of the connector when the connector is powered on.
  • Example A9 Example A9
  • Example B9 Comparative Example 21 were selected as samples.
  • the relevant performance data obtained by testing the circuit board connector according to the above-mentioned 3.1 to 3.3 test methods are shown in Table 1 below, wherein the uncoated in Table 1 is a comparative example 21 test data:
  • Example A11 Example A11
  • Example B11 Comparative Example 21
  • Table 3 the relevant performance data obtained by testing the circuit board connector according to the above-mentioned 3.1 to 3.3 test methods are shown in Table 3 below, wherein the uncoated in Table 3 is a comparative example 21 test data:

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Paints Or Removers (AREA)

Abstract

La présente invention concerne un revêtement isolant étanche à l'eau et une application correspondante ; le revêtement isolant étanche à l'eau comprend au moins un composant filmogène isolant étanche à l'eau parmi les éléments I à III suivants : I : un composé siloxane organolinéaire représenté par la formule structurale A représentée ci-dessous, R1 à R8 dans la formule structurale A étant indépendamment l'un quelconque parmi un atome d'hydrogène, un atome d'halogène, un méthoxy, un éthoxy, un alkyle en C1-C3, un cycloalkyle en C3-C10, et un aryle en C6-C15, et m étant un nombre entier compris entre 10 et 100 ; II : un n-alcane ou un isoalcane représenté par la formule structurale B : CnH2n+n, n dans la formule structurale B étant un nombre entier compris entre 8 et 15 ; et III : un polymère aliphatique contenant du fluor représenté par la formule structurale C : CxFyHzNjOk, x dans la formule structurale C étant un nombre entier compris entre 8 et 20, y étant un nombre entier compris entre 6 et 42, z étant un nombre entier compris entre 0 et 9, j étant 0 ou 1, et k étant 0 ou 1.
PCT/CN2022/090016 2021-06-09 2022-04-28 Revêtement isolant étanche à l'eau et application correspondante WO2022257641A1 (fr)

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CN101225234A (zh) * 2008-02-01 2008-07-23 南京凯汇工业科技有限公司 一种导热绝缘材料及其制备方法
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CN105623503A (zh) * 2016-03-23 2016-06-01 华北电力大学 一种用于绝缘子的硅橡胶疏水涂层及其制备方法

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CN109096915B (zh) * 2018-06-26 2021-04-20 广东美的厨房电器制造有限公司 涂料组合物和涂料以及涂层和氧化硅涂层以及具有涂层的制品和在基底表面形成涂层的方法
CN108864936A (zh) * 2018-07-26 2018-11-23 合肥广民建材有限公司 一种建筑外墙防水绝缘涂料及其制备方法
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CN101225234A (zh) * 2008-02-01 2008-07-23 南京凯汇工业科技有限公司 一种导热绝缘材料及其制备方法
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CN105623503A (zh) * 2016-03-23 2016-06-01 华北电力大学 一种用于绝缘子的硅橡胶疏水涂层及其制备方法

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