WO2022244756A1 - Ruban adhésif - Google Patents

Ruban adhésif Download PDF

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Publication number
WO2022244756A1
WO2022244756A1 PCT/JP2022/020469 JP2022020469W WO2022244756A1 WO 2022244756 A1 WO2022244756 A1 WO 2022244756A1 JP 2022020469 W JP2022020469 W JP 2022020469W WO 2022244756 A1 WO2022244756 A1 WO 2022244756A1
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Prior art keywords
pressure
sensitive adhesive
adhesive layer
adhesive tape
weight
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PCT/JP2022/020469
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English (en)
Japanese (ja)
Inventor
徳之 内田
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積水化学工業株式会社
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Priority to JP2022536880A priority Critical patent/JPWO2022244756A1/ja
Publication of WO2022244756A1 publication Critical patent/WO2022244756A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]

Definitions

  • the present invention relates to adhesive tapes.
  • a micro LED display is a display device in which each chip constituting a pixel is a fine light emitting diode (LED) chip, and the micro LED chip emits light by itself to display an image.
  • LED light emitting diode
  • Micro LED displays have high contrast, fast response speed, and can be made thinner because they do not require color filters used in liquid crystal displays and organic EL displays. is attracting attention as In a micro LED display, a large number of micro LED chips are densely laid out in a plane.
  • a transfer laminate in which a large number of chip parts are arranged on an adhesive layer is opposed to a drive circuit board, and the chips are separated from the transfer laminate.
  • the components are peeled off and electrically connected to the drive circuit board (transfer process).
  • a method for peeling the chip component from the transfer laminate for example, a method of irradiating a laser beam from the back surface of the support of the transfer laminate focusing on the adhesive layer is known (see, for example, Patent Documents 1). Such a method is also called laser ablation.
  • heat-expandable particles, heat-expandable microcapsules, etc. are blended in the adhesive layer, and the heat-expandable particles, heat-expandable microcapsules, etc. are thermally expanded by thermocompression bonding between the transfer laminate and the drive circuit board.
  • a method of peeling chip components by reducing the adhesive area due to deformation of the adhesive layer for example, Patent Documents 2 and 3).
  • An object of the present invention is to provide an adhesive tape which is excellent in peeling performance from chip components and which can suppress adhesive residue on the chip components.
  • the present disclosure 1 is a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a block A having a structure derived from an aromatic vinyl monomer and a block B having a structure derived from a (meth)acrylic monomer. and a cross-linking agent, the block B contains a structure derived from a cross-linkable functional group-containing monomer, and the pressure-sensitive adhesive layer has a tensile modulus of 0. 008 MPa or more and 2 MPa or less.
  • the present disclosure 2 is the pressure-sensitive adhesive tape of the present disclosure 1, wherein the pressure-sensitive adhesive layer has a breaking strength of 1 MPa or more.
  • Present Disclosure 3 is the adhesive tape according to Present Disclosure 1 or 2, wherein the adhesive layer has a gel fraction of 70% by weight or more.
  • Present Disclosure 4 is the pressure-sensitive adhesive tape according to Present Disclosure 1, 2 or 3, wherein the pressure-sensitive adhesive layer has a spherical phase separation structure.
  • Present Disclosure 5 is the pressure-sensitive adhesive tape according to Present Disclosure 1, 2 or 3, wherein the pressure-sensitive adhesive layer has a cylindrical phase-separated structure.
  • Present Disclosure 6 is the pressure-sensitive adhesive tape of Present Disclosure 1, 2, 3, 4 or 5, wherein the content of the block A in the ABA type block copolymer is 1% by weight or more and 40% by weight or less. .
  • Present Disclosure 7 is the pressure-sensitive adhesive tape according to Present Disclosure 1, 2, 3, 4, 5, or 6, wherein the cross-linking agent is an epoxy-based cross-linking agent or an isocyanate-based cross-linking agent.
  • the (meth)acrylic monomer contains a (meth)acrylic acid ester monomer having an alkyl group having 8 or more carbon atoms
  • the ABA type block copolymer contains 8 or more carbon atoms 8.
  • This disclosure 9 is present disclosure 1, 2, 3, 4, 5, 6, 7 or 8 adhesive tape.
  • Present Disclosure 10 is the pressure-sensitive adhesive tape according to Present Disclosure 1, 2, 3, 4, 5, 6, 7, 8 or 9, wherein the ABA type block copolymer has a weight average molecular weight of 100,000 or more.
  • the present disclosure 11 is the pressure-sensitive adhesive tape according to the present disclosure 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10, wherein the pressure-sensitive adhesive layer further contains a tackifier that is liquid at room temperature.
  • Present Disclosure 12 is the adhesive tape according to Present Disclosure 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, or 11, wherein the adhesive layer has a thickness of 3 ⁇ m or more and 30 ⁇ m or less.
  • the present invention will be described in detail below.
  • the present inventors have found that in a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer, a specific ABA type block copolymer and a pressure-sensitive adhesive layer containing a cross-linking agent are used, and the tensile modulus of the pressure-sensitive adhesive layer is set to a specific range. Considered adjusting.
  • the inventors of the present invention have found that such an adhesive tape can improve the peeling performance of the chip parts even when the chip parts are peeled off by laser ablation, and can suppress adhesive residue on the chip parts. This led to the completion of the present invention.
  • FIG. 1 shows a cross-sectional view schematically showing an example of a process of peeling off a chip part arranged on an adhesive layer by laser abrasion.
  • the chip component 1 is placed on the adhesive layer 4 laminated on the support 5, and the chip component 1 is peeled off by the laser beam 8a emitted from the laser beam irradiation device 8. to electrically connect the chip component 1 and the drive circuit board 7 (transfer step).
  • the adhesive layer 4 may be a double-sided adhesive tape having a substrate.
  • the laminate 9 of the support and the adhesive layer may be a single-sided adhesive tape using the support 5 as a base material.
  • the portion of the adhesive layer 4 irradiated with the laser beam 8a is deformed. More specifically, when the adhesive layer 4 is irradiated with the laser light 8a, the molecules of the adhesive layer 4 are cut by the heat to become low-molecular-weight, and evaporate instantaneously or sublimate when the temperature rises. A portion of the adhesive layer 4 irradiated with the laser beam 8a is deformed. Thereby, the chip component 1 can be peeled off. By using the laser beam 8a, the chip component 1 can be peeled off in a very small area. 1 can be peeled off individually and with high peeling performance.
  • the adhesive tape of the present invention is an adhesive tape having an adhesive layer.
  • the pressure-sensitive adhesive layer contains an ABA type block copolymer having a block A having a structure derived from an aromatic vinyl monomer and a block B having a structure derived from a (meth)acrylic monomer, and a cross-linking agent. contains.
  • (meth)acryl means acryl or methacryl here. Since the pressure-sensitive adhesive layer contains the ABA type block copolymer and the cross-linking agent, the tensile elastic modulus, breaking strength, gel fraction, etc. of the pressure-sensitive adhesive layer are easily adjusted to the ranges described later. As a result, the adhesive tape of the present invention is excellent in peeling performance from chip components and can suppress adhesive residue on chip components.
  • the ABA type block copolymer includes a rigid structure block A (hereinafter also referred to as "hard segment”) and a flexible structure block B (hereinafter also referred to as "soft segment”). It is a copolymer.
  • the ABA type block copolymer has a heterogeneous phase separation structure in which two blocks are difficult to be compatible, and spherical islands formed by agglomeration of the block A are scattered in the sea of the block B.
  • a non-uniform phase-separated structure in which cylindrical structures formed by agglomeration of the block A are interspersed in the sea of the block B may be formed.
  • phase-separated structure in which spherical islands are scattered is also called a spherical phase-separated structure
  • a phase-separated structure in which cylindrical structures are scattered is also called a cylindrical phase-separated structure.
  • the block A is not particularly limited as long as it has a rigid structure, and in addition to the structure derived from the aromatic vinyl monomer, it may be, for example, a compound having a cyclic structure, a compound having a short side chain substituent, or the like. It may have a derived structure.
  • the block B may have a structure derived from a monomer other than the (meth)acrylic monomer as long as the effects of the present invention are not lost.
  • aromatic vinyl monomer in the block A examples include styrene, alpha-methylstyrene, paramethylstyrene, chlorostyrene and the like. These aromatic vinyl monomers may be used alone, or two or more of them may be used in combination. Among these, styrene is preferable because it can further improve the peeling performance of the adhesive tape from the chip component and can further suppress adhesive residue on the chip component.
  • the structure derived from an aromatic vinyl monomer refers to a structure represented by the following general formula (1) or (2).
  • R 1 represents a substituent having an aromatic ring.
  • the aromatic ring-containing substituent R 1 includes a phenyl group, a methylphenyl group, a chlorophenyl group, and the like.
  • the content of the structure derived from the aromatic vinyl monomer in the ABA type block copolymer is not particularly limited, but is preferably 1% by weight or more and 30% by weight or less.
  • the tensile modulus and breaking strength of the pressure-sensitive adhesive layer can be adjusted to more preferable ranges.
  • a more preferable lower limit of the content of the structure derived from the aromatic vinyl monomer is 5% by weight, a more preferable lower limit is 8% by weight, a particularly preferable lower limit is 10% by weight, a more preferable upper limit is 28% by weight, and a further preferable upper limit is 25%. % by weight, a particularly preferred upper limit is 20% by weight.
  • the (meth)acrylic monomer may be a single monomer, or a plurality of monomers may be used.
  • a structure derived from a (meth)acrylic monomer refers to a structure represented by the following general formula (5) or (6).
  • R3 represents a side chain.
  • the side chain R3 includes methyl group , ethyl group, propyl group, butyl group, isobutyl group, pentyl group, hexyl group, cyclohexyl group, heptyl group, octyl group, isooctyl group, 2-ethylhexyl group, nonyl group, Examples include an isononyl group, a decyl group, a lauryl group, a stearyl group, an isostearyl group, and an isobornyl group.
  • Examples of the (meth)acrylic monomers include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, pentyl (meth)acrylate, hexyl ( meth)acrylate, cyclohexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, Decyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, isobornyl (meth)acrylate and the like.
  • (meth)acrylic monomers may be used alone, or two or more of them may be used in combination.
  • butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and lauryl (meth)acrylate are preferable from the viewpoint of balancing the peeling performance of chip parts and the effect of suppressing adhesive residue on chip parts. More preferred are butyl acrylate, 2-ethylhexyl acrylate and lauryl acrylate.
  • (meth)acrylate means an acrylate or a methacrylate in this specification.
  • the content of the structure derived from the (meth)acrylic monomer is not particularly limited as long as the effect of the present invention is exhibited. % or less.
  • the content of the structure derived from the (meth)acrylic monomer is more preferably 40% by weight or more and 95% by weight or less, and even more preferably 50% by weight or more and 90% by weight or less.
  • the (meth)acrylic monomer preferably contains a (meth)acrylic acid ester monomer having an alkyl group having 8 or more carbon atoms.
  • the tensile elastic modulus of the pressure-sensitive adhesive layer can be adjusted to a more preferable range.
  • Examples of the (meth)acrylate monomer having an alkyl group having 8 or more carbon atoms include octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, Lauryl (meth)acrylate and isostearyl (meth)acrylate can be mentioned. 2-Ethylhexyl (meth)acrylate and lauryl (meth)acrylate are particularly preferred.
  • the content of the structure derived from the (meth)acrylic acid ester monomer having an alkyl group of 8 or more carbon atoms is not particularly limited, and may be 0% by weight. , the preferred lower limit is 35% by weight.
  • the content of the structure derived from the (meth)acrylic acid ester monomer having an alkyl group of 8 or more carbon atoms is 35% by weight or more, the release performance of the adhesive tape from chip components is further improved.
  • a more preferable lower limit of the content of the structure derived from the (meth)acrylic acid ester monomer having an alkyl group having 8 or more carbon atoms is 40% by weight.
  • the upper limit of the content of the structure derived from the (meth)acrylic acid ester monomer having an alkyl group having 8 or more carbon atoms is not particularly limited, but from the viewpoint of suppressing adhesive residue on chip parts, the preferred upper limit is 70% by weight. A more preferable upper limit is 60% by weight.
  • the glass transition temperature of the block B in the ABA type block copolymer is not particularly limited, it is preferably ⁇ 30° C. or higher and 0° C. or lower.
  • the glass transition temperature of the block B is preferably ⁇ 30° C. or higher and 0° C. or lower.
  • the more preferable lower limit of the glass transition temperature of the block B is -28°C, the more preferable lower limit is -25°C, the more preferable upper limit is -5°C, and the more preferable upper limit is -10°C.
  • the glass transition temperature of block B can be obtained by measurement using, for example, a differential scanning calorimeter (manufactured by TA Instruments, Hitachi High-Tech Science, etc.). More specifically, using a differential scanning calorimeter (for example, SII Exstar 6000/DSC 6220 manufactured by Hitachi High-Tech Science Co., Ltd.), an ABA type block was obtained in a nitrogen atmosphere at a heating rate of 10°C/min. The value obtained in the 2nd run when measuring the copolymer can be used. A peak derived from block A and a peak derived from block B are obtained.
  • a differential scanning calorimeter manufactured by TA Instruments, Hitachi High-Tech Science, etc.
  • SII Exstar 6000/DSC 6220 manufactured by Hitachi High-Tech Science Co., Ltd.
  • the method for adjusting the glass transition temperature of the block B to the above range is not particularly limited. It is preferable to contain a (meth)acrylic acid ester monomer having a glass transition temperature of 0° C. or higher. By containing a (meth)acrylic acid ester monomer having a glass transition temperature of 0° C. or higher when the (meth)acrylic monomer is the homopolymer, the tensile elastic modulus of the pressure-sensitive adhesive layer is set in a more preferable range. can be adjusted. Examples of (meth)acrylic acid ester monomers having a glass transition temperature of 0° C.
  • methyl acrylate and methyl methacrylate are preferred.
  • the content of the structure derived from the (meth)acrylic acid ester monomer having a glass transition temperature of 0 ° C. or higher when converted to the homopolymer is not particularly limited, and is 0% by weight. but the preferred lower limit is 35% by weight. If the content of the structure derived from the (meth)acrylic acid ester monomer having a glass transition temperature of 0° C. or higher when converted to the homopolymer is 35% by weight or more, the peeling performance of the adhesive tape chip parts is further improved. do.
  • the upper limit of the content of the structure derived from the (meth)acrylic acid ester monomer having a glass transition temperature of 0° C. or higher when converted to the homopolymer is not particularly limited, but from the viewpoint of temporarily fixing the chip component, the preferred upper limit is 60% by weight, more preferably 50% by weight.
  • the block B contains a structure derived from a crosslinkable functional group-containing monomer. Since the block B contains a structure derived from the crosslinkable functional group-containing monomer, the cohesive force of the adhesive layer is increased by crosslinking of the crosslinkable functional group, so that the peeling performance of the adhesive tape chip component is improved. Furthermore, it is possible to suppress adhesive residue on the chip component.
  • the crosslinkable functional group may or may not be crosslinked, but is more preferably crosslinked. However, even if the structure remains uncrosslinked, the interaction between the functional groups increases the cohesive force of the pressure-sensitive adhesive layer, improves the peeling performance of the pressure-sensitive adhesive tape from the chip parts, and increases the adhesion of the pressure-sensitive adhesive tape to the chip parts. Residual glue can be suppressed.
  • the structure derived from a monomer having a crosslinkable functional group refers to a structure represented by the following general formula (3) or (4).
  • R2 represents a substituent containing at least one crosslinkable functional group.
  • crosslinkable functional groups include carboxyl groups, hydroxyl groups, epoxy groups, double bonds, triple bonds, amino groups, amide groups, nitrile groups and the like.
  • the substituent R 2 containing at least one crosslinkable functional group may contain an alkyl group, an ether group, a carbonyl group, an ester group, a carbonate group, an amide group, a urethane group, etc. as its constituent elements.
  • the monomer having a crosslinkable functional group is not particularly limited, and examples include carboxyl group-containing monomers, hydroxyl group-containing monomers, epoxy group-containing monomers, double bond-containing monomers, triple bond-containing monomers, amino group-containing monomers, and amide group-containing monomers. , a nitrile group-containing monomer, and the like. These monomers having crosslinkable functional groups may be used alone, or two or more of them may be used in combination. Among them, carboxyl group-containing monomers, hydroxyl group-containing monomers, epoxy group-containing monomers, and double bond-containing monomers have been found to improve the peeling performance of adhesive tapes from chip parts and to further suppress adhesive residue on chip parts.
  • At least one selected from the group consisting of monomers, triple bond-containing monomers and amide group-containing monomers is preferred.
  • the carboxyl group-containing monomer include (meth)acrylic acid-based monomers such as (meth)acrylic acid.
  • the hydroxyl group-containing monomer include hydroxyalkyl acrylates and hydroxyalkyl methacrylates such as 4-hydroxybutyl (meth)acrylate and 2-hydroxyethyl (meth)acrylate. Glycidyl (meth)acrylate etc. are mentioned as said epoxy group containing monomer.
  • the double bond-containing monomer include allyl (meth)acrylate, hexanediol di(meth)acrylate, and the like.
  • Examples of the triple bond-containing monomer include propargyl (meth)acrylate.
  • Examples of the amide group-containing monomer include (meth)acrylamide.
  • carboxyl group-containing monomers and hydroxyl group-containing monomers are preferable because they can further improve the peeling performance of the adhesive tape from chip parts and can further suppress adhesive residue on chip parts.
  • (meth)acrylic acid-based monomers and hydroxyalkyl acrylates are more preferred, and acrylic acid, 2-hydroxyethyl acrylate and 4-hydroxybutyl acrylate are even more preferred.
  • the block A may also contain a structure derived from the crosslinkable functional group-containing monomer.
  • the content of the structure derived from the monomer having the crosslinkable functional group (the sum of the content in the block A and the content in the block B) is not particularly limited. is preferably 0.1% by weight or more and 30% by weight or less.
  • the content of the structure derived from the monomer having the crosslinkable functional group is within the above range, the cohesive force of the pressure-sensitive adhesive layer is further increased, the peeling performance of the pressure-sensitive adhesive tape for chip components is further improved, and the chip Adhesive residue on parts can be further suppressed.
  • a more preferable lower limit of the content of the structure derived from the monomer having the crosslinkable functional group is 0.5% by weight, a more preferable lower limit is 1% by weight, a more preferable upper limit is 25% by weight, and a further preferable upper limit is 20% by weight. be.
  • the content of the block A (hard segment) in the ABA type block copolymer is not particularly limited, but is preferably 1% by weight or more and 40% by weight or less.
  • the tensile elastic modulus of the pressure-sensitive adhesive layer can be adjusted to a more preferable range.
  • a more preferred lower limit for the content of block A is 2% by weight, a still more preferred lower limit is 5% by weight, and a particularly preferred lower limit is 10% by weight.
  • the upper limit of the content of block A is 35% by weight, more preferably 30% by weight, still more preferably 25% by weight, still more preferably 22% by weight, and particularly preferably 20% by weight.
  • the weight average molecular weight (Mw) of the ABA type block copolymer is not particularly limited, but is preferably 50,000 or more and 800,000 or less. When the weight-average molecular weight is within the above range, the tensile elastic modulus of the pressure-sensitive adhesive layer can be adjusted to a more preferable range.
  • a more preferable lower limit of the weight average molecular weight is 75,000, a still more preferable lower limit is 100,000, and a still more preferable lower limit is 200,000.
  • a more preferable upper limit of the weight average molecular weight is 600,000.
  • the weight average molecular weight can be determined, for example, by GPC (Gel Permeation Chromatography) in terms of standard polystyrene.
  • the raw material monomers of the block A and the block B are radically reacted in the presence of a polymerization initiator to obtain the block A and the block B. , the two may be reacted or copolymerized. Alternatively, after the block A is obtained, the raw material monomer for the block B may be continuously added for copolymerization.
  • the method of causing the radical reaction that is, the polymerization method
  • conventionally known methods are used, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, bulk polymerization, and the like.
  • the cross-linking agent is not particularly limited, and is selected according to the type of cross-linkable functional group in the ABA type block copolymer.
  • a chelate-based cross-linking agent and the like are included. More specifically, for example, when the crosslinkable functional group in the ABA type block copolymer is a carboxyl group, the crosslinker may be, for example, an epoxy crosslinker, an isocyanate crosslinker, or a metal chelate crosslinker. agents and the like.
  • the epoxy-based cross-linking agent and the isocyanate-based cross-linking agent are preferable because the tensile modulus of elasticity of the pressure-sensitive adhesive layer can be easily adjusted to a more preferable range.
  • the content of the cross-linking agent is not particularly limited, and by adjusting the amount of the cross-linkable functional group in the ABA type block copolymer and the content of the cross-linking agent, the pressure-sensitive adhesive layer can be cross-linked. degree (gel fraction) can be adjusted.
  • the content of the cross-linking agent is preferably 0.01 parts by weight or more and 10 parts by weight or less with respect to 100 parts by weight of the ABA type block copolymer. When the content of the cross-linking agent is within the above range, the ABA type block copolymer can be appropriately cross-linked to increase the cohesive force of the pressure-sensitive adhesive layer, and the release performance of the adhesive tape chip parts. is further improved, and adhesive residue on chip parts can be further suppressed.
  • a more preferable lower limit of the content of the crosslinking agent is 0.1 parts by weight, a more preferable upper limit is 5 parts by weight, a still more preferable lower limit is 0.15 parts by weight, and a still more preferable upper limit is 3 parts by weight.
  • the pressure-sensitive adhesive layer may further contain a tackifier (tackifier).
  • tackifier is not particularly limited and may be a tackifier that is solid at room temperature, but a tackifier that is liquid at room temperature is preferable. Since the pressure-sensitive adhesive layer contains the tackifier that is liquid at room temperature, the tensile modulus of the pressure-sensitive adhesive layer can be easily adjusted within a more preferable range, and thus the release performance of the pressure-sensitive adhesive tape for chip parts is further improved.
  • normal temperature means 20 to 25° C.
  • liquid means having fluidity.
  • the tackifier that is solid at room temperature is not particularly limited, and examples thereof include rosin ester resins, terpene phenol resins, terpene resins, and coumarone resins.
  • the tackifier that is liquid at room temperature is not particularly limited, and examples thereof include liquid rosin esters and liquid terpene phenols.
  • the content of the tackifier, which is solid at room temperature is not particularly limited, and from the viewpoint of the peeling performance of the adhesive tape from chip parts, it is preferred that the tackifier is not contained in the adhesive layer.
  • the tackifier, which is solid at room temperature is contained, it is preferably 10 parts by weight or less per 100 parts by weight of the ABA type block copolymer.
  • the content of the tackifier, which is solid at room temperature is within the above range, the release performance of the adhesive tape for chip components is further improved.
  • a more preferable upper limit of the content of the tackifier that is solid at room temperature is 5 parts by weight.
  • the content of the tackifier, which is liquid at room temperature is not particularly limited, but is preferably 5 parts by weight or more and 50 parts by weight or less with respect to 100 parts by weight of the ABA type block copolymer.
  • the content of the tackifier, which is liquid at room temperature is within the above range, the release performance of the adhesive tape for chip components is further improved.
  • a more preferred lower limit to the content of the tackifier that is liquid at room temperature is 10 parts by weight, and a more preferred upper limit is 30 parts by weight.
  • the pressure-sensitive adhesive layer preferably further contains an ultraviolet absorber.
  • the pressure-sensitive adhesive layer contains the ultraviolet absorber, the stimulation of the laser light in the pressure-sensitive adhesive layer is efficiently converted into heat or vibration, so that the pressure-sensitive adhesive layer is easily deformed by laser abrasion, resulting in an adhesive tape.
  • the peeling performance of the chip parts is further improved.
  • the ultraviolet absorber is not particularly limited, and examples thereof include benzotriazole-based ultraviolet absorbers, hydroxylphenyltriazine-based ultraviolet absorbers, and the like. Further examples include ethylhexyl methoxycinnamate, octyl methoxycinnamate, ethylhexyl paramethoxycinnamate, hexyl diethylaminohydroxybenzoylbenzoate, bisethylhexyloxyphenolmethoxyphenyltriazine, t-butylmethoxydibenzoylmethane and the like.
  • benzotriazole-based UV absorbers and hydroxylphenyltriazine-based UV absorbers are preferable from the viewpoint of excellent compatibility with other components in the pressure-sensitive adhesive layer.
  • These ultraviolet absorbers may be used alone, or two or more of them may be used in combination.
  • the content of the ultraviolet absorber is not particularly limited, but the preferred lower limit is 6 parts by weight with respect to 100 parts by weight of the ABA type block copolymer. When the content of the ultraviolet absorber is 6 parts by weight or more, the peeling performance of the adhesive tape for chip components is further improved. A more preferable lower limit for the content of the ultraviolet absorber is 10 parts by weight, and a more preferable lower limit is 15 parts by weight.
  • the upper limit of the content of the ultraviolet absorber is not particularly limited, but from the viewpoint of ensuring the adhesive strength of the pressure-sensitive adhesive layer, the preferred upper limit is 30 parts by weight.
  • the pressure-sensitive adhesive layer may further contain an inorganic filler such as fumed silica.
  • an inorganic filler such as fumed silica.
  • the pressure-sensitive adhesive layer may further contain known additives such as plasticizers, resins, surfactants, waxes and fine particle fillers. These additives may be used alone, or two or more of them may be used in combination.
  • the pressure-sensitive adhesive layer has a tensile modulus with a lower limit of 0.008 MPa and an upper limit of 2 MPa.
  • the tensile modulus of elasticity is 0.008 MPa or more, the pressure-sensitive adhesive layer is less likely to tear when the chip component is peeled off by laser abrasion, and adhesive residue on the chip component can be suppressed.
  • the tensile elastic modulus is 2 MPa or less, the adhesive layer is likely to be deformed by laser abrasion, and the peeling performance of the adhesive tape for chip components is improved.
  • the preferred lower limit of the tensile modulus is 0.01 MPa, the preferred upper limit is 0.7 MPa, the more preferred lower limit is 0.015 MPa, the more preferred upper limit is 0.68 MPa, and the still more preferred upper limit is 0.65 MPa.
  • the preferable lower limit of the tensile modulus is 0.01 MPa, and the preferable upper limit thereof is 2 MPa. From the same point of view, the more preferable lower limit of the tensile modulus is 0.7 MPa, the more preferable upper limit is 1.9 MPa, the more preferable lower limit is 0.8 MPa, the more preferable upper limit is 1.8 MPa, and the still more preferable upper limit is 1.5 MPa.
  • the tensile modulus of the pressure-sensitive adhesive layer can be measured, for example, using Autograph (manufactured by Shimadzu Corporation) or the like, according to JIS K7161:2014, under an environment of a temperature of 23° C. and a relative humidity of 50%, and a tensile speed of 500 mm/ It can be calculated from the slope of the stress-strain curve at 100% strain when the pressure-sensitive adhesive layer is pulled at min.
  • the tensile modulus is measured after removing the substrate and preparing a sample of only the adhesive layer.
  • the method for removing the substrate is not particularly limited as long as treatment using a solvent, treatment involving a chemical reaction, treatment at a high temperature, or the like is avoided in order to avoid denaturation of the pressure-sensitive adhesive layer.
  • a method of selecting an appropriate temperature and peeling speed, peeling off the substrate and the adhesive layer by peeling off, and removing the substrate, or A method of physically grinding the substrate can be selected.
  • the breaking strength of the pressure-sensitive adhesive layer is not particularly limited, the preferred lower limit is 1 MPa.
  • the breaking strength is 1 MPa or more, the adhesive layer is less likely to be torn off when the chip component is peeled off by laser ablation, and adhesive residue on the chip component can be further suppressed.
  • a more preferable lower limit of the breaking strength is 1.3 MPa, and a further preferable lower limit is 1.4 MPa.
  • the upper limit of the breaking strength is not particularly limited, but if the breaking strength is too high, the tensile elastic modulus also increases, and the peeling performance of the adhesive tape from the chip parts decreases.
  • a more preferred upper limit is 4 MPa, and a still more preferred upper limit is 3.1 MPa.
  • the breaking strength of the pressure-sensitive adhesive layer is measured, for example, using Autograph (manufactured by Shimadzu Corporation) or the like according to JIS K7161: 2014 at a temperature of 23 ° C. and a tensile speed of 500 mm / min under an environment of relative humidity of 50%. It can be calculated from the stress at break when the pressure-sensitive adhesive layer is pulled with.
  • the adhesive tape has a substrate
  • the tensile modulus is measured after removing the substrate and preparing a sample of only the adhesive layer.
  • the method for removing the substrate is not particularly limited as long as treatment using a solvent, treatment involving a chemical reaction, treatment at a high temperature, or the like is avoided in order to avoid denaturation of the pressure-sensitive adhesive layer.
  • a method of selecting an appropriate temperature and peeling speed, peeling off the substrate and the adhesive layer by peeling off, and removing the substrate, or A method of physically grinding the substrate can be selected.
  • the gel fraction of the pressure-sensitive adhesive layer is not particularly limited, but the preferred lower limit is 70% by weight. When the gel fraction is 70% by weight or more, the peeling performance of the adhesive tape from chip components is further improved, and adhesive residue on chip components can be further suppressed. A more preferable lower limit of the gel fraction is 80% by weight. Although the upper limit of the gel fraction is not particularly limited, the preferred upper limit is 98% by weight, and the more preferred upper limit is 95% by weight, from the viewpoint that the tensile elastic modulus of the pressure-sensitive adhesive layer is easily adjusted to a more preferred range. In addition, the gel fraction of the adhesive layer can be measured by the following method.
  • the method for adjusting the tensile elastic modulus, breaking strength, gel fraction, etc. of the pressure-sensitive adhesive layer within the above range is not particularly limited. Examples include a method of adjusting the type or amount of the cross-linking agent as described above.
  • the phase-separated structure of the pressure-sensitive adhesive layer is not particularly limited, it preferably has a spherical phase-separated structure. Since the pressure-sensitive adhesive layer has a sphere-like phase separation structure, the tensile elastic modulus, breaking strength, gel fraction, etc. of the pressure-sensitive adhesive layer are easily adjusted within the ranges described later, and the peeling performance of the adhesive tape chip parts. is further improved, and adhesive residue on chip parts can be further suppressed.
  • the phase separation structure of the adhesive layer can be controlled by adjusting the ratio of each block in the ABA type block copolymer.
  • the pressure-sensitive adhesive layer may have a cylindrical phase-separated structure. Since the pressure-sensitive adhesive layer has a cylindrical phase separation structure, the tensile elastic modulus, breaking strength, gel fraction, etc. of the pressure-sensitive adhesive layer are easily adjusted within the ranges described later, and the peeling performance of the chip parts of the pressure-sensitive adhesive tape. is further improved, and adhesive residue on chip parts can be further suppressed. In particular, when the pressure-sensitive adhesive layer has a cylindrical phase-separated structure, it becomes easier to adjust the tensile modulus, breaking strength, etc.
  • phase separation structure of the pressure-sensitive adhesive layer can be confirmed by observation with a transmission electron microscope (TEM). means that the microphase separation structure is a cylindrical structure.
  • the size of the island structure in the sphere-like phase separation structure is not particularly limited.
  • a more preferable lower limit is 10 nm, and a more preferable upper limit is 50 nm.
  • the average length of the island structure in the sphere-like phase-separated structure can be measured by the following method. Observation of the pressure-sensitive adhesive layer with a transmission electron microscope (TEM) is performed at a magnification of 5000 times to acquire an observation image of an area of 4.3 ⁇ m ⁇ 4.3 ⁇ m.
  • TEM transmission electron microscope
  • the acquired image is automatically binarized using image analysis software (eg, Avizo, ver2019.4, manufactured by Thermo Fisher Scientific, etc.).
  • image analysis software eg, Avizo, ver2019.4, manufactured by Thermo Fisher Scientific, etc.
  • the major axis of each island structure is measured from the binarized image, and the arithmetic mean value of these is taken as the average major axis.
  • the automatic binarization method refer to a known document ("Automatic Threshold Selection Method Based on Discrimination and Least Squares Criteria", Nobuyuki Otsu, The Institute of Electronics, Information and Communication Engineers Transactions D, Vol. J63-D, No. .4, pp.349-356).
  • the thickness of the pressure-sensitive adhesive layer is not particularly limited, but the preferred lower limit is 3 ⁇ m and the preferred upper limit is 200 ⁇ m.
  • the thickness of the pressure-sensitive adhesive layer is 3 ⁇ m or more, the chip component holding performance and peeling performance of the pressure-sensitive adhesive tape are further improved. If the thickness of the pressure-sensitive adhesive layer is 200 ⁇ m or less, adhesive residue on the chip component can be further suppressed.
  • the more preferable lower limit of the thickness of the adhesive layer is 5 ⁇ m, and the more preferable upper limit is 50 ⁇ m, since the adhesive tape can further improve the holding performance and peeling performance of the chip components and can further suppress the adhesive residue on the chip components. is.
  • the more preferable lower limit of the thickness of the pressure-sensitive adhesive layer is 10 ⁇ m
  • the more preferable upper limit is 30 ⁇ m
  • the even more preferable lower limit is 15 ⁇ m
  • the much more preferable lower limit is 20 ⁇ m.
  • the pressure-sensitive adhesive tape of the present invention may be a support type having a substrate or a non-support type having no substrate.
  • the adhesive tape of the present invention may be a single-sided adhesive tape having an adhesive layer only on one side of the substrate, or a double-sided adhesive tape having an adhesive layer on both sides of the substrate. good.
  • at least one side may be an adhesive layer as described above.
  • the adhesive layers on both sides may have the same composition or may have different compositions.
  • the substrate is not particularly limited, and examples of materials for the substrate include polyethylene terephthalate, polyethylene naphthalate, polyacetal, polyamide, polycarbonate, polyphenylene ether, polybutylene terephthalate, ultra-high molecular weight polyethylene, syndiotactic polystyrene, poly Arylate, polysulfone, polyethersulfone, polyphenylene sulfide, polyetheretherketone, polyimide, polyetherimide, fluororesin, liquid crystal polymer and the like.
  • polyethylene terephthalate and polyethylene naphthalate are preferable because of their excellent heat resistance.
  • the thickness of the base material is not particularly limited, but a preferable lower limit is 5 ⁇ m and a preferable upper limit is 188 ⁇ m. When the thickness of the base material is within the above range, the pressure-sensitive adhesive tape can have appropriate stiffness and excellent handleability.
  • a more preferable lower limit of the thickness of the substrate is 12 ⁇ m, and a more preferable upper limit thereof is 125 ⁇ m.
  • the application of the adhesive tape of the present invention is not particularly limited. It is suitable for use in the step of peeling off chip components placed on the agent layer by laser ablation.
  • the chip component is not particularly limited, and examples thereof include MiniLED chips, microLED chips, optical chips for image sensors, etc. MicroLED chips are particularly preferred.
  • the method of transferring chip components using the adhesive tape of the present invention is not particularly limited. and a method of transferring a chip component including a step of peeling off.
  • the method for manufacturing electronic device components using the adhesive tape of the present invention is not particularly limited, and examples thereof include methods for manufacturing electronic device components, including the transfer method for chip components as described above. According to these methods, it is possible to transfer the chip components with a high yield, and to suppress the adhesive residue on the chip components.
  • the adhesive tape which is excellent in the peeling performance of a chip component and can suppress the adhesive residue on a chip component can be provided.
  • Example 1 Preparation of ABA type block copolymer 0.902 g of 1,6-hexanedithiol, 1.83 g of carbon disulfide and 11 mL of dimethylformamide were put into a two-necked flask and stirred at 25°C. To this, 2.49 g of triethylamine was added dropwise over 15 minutes, and the mixture was stirred at 25°C for 3 hours. Then, 2.75 g of methyl- ⁇ -bromophenylacetic acid was added dropwise over 15 minutes, and the mixture was stirred at 25°C for 4 hours.
  • reaction solution A portion of the reaction solution was sampled, 4000 parts by weight of n-hexane was added thereto, stirred to precipitate the reaction product, unreacted monomers and solvent were filtered, and the reaction product was dried under reduced pressure at 70°C. to obtain an ABA type block copolymer.
  • the weight average molecular weight of the obtained ABA type block copolymer was measured by GPC method and found to be 250,000. The measurement was performed using a "2690 Separations Module" manufactured by Water as a measuring instrument, a "GPC KF-806L” manufactured by Showa Denko as a column, ethyl acetate as a solvent, a sample flow rate of 1 mL/min, and a column temperature of 40°C.
  • the obtained ABA type block copolymer was measured using a differential scanning calorimeter (manufactured by Hitachi High-Tech Science Co., Ltd., SII Exstar 6000/DSC 6220) under the conditions of a temperature increase rate of 10°C/min under a nitrogen atmosphere.
  • the glass transition temperature of block B was obtained using the value obtained in the 2nd run when the measurement was performed.
  • a peak derived from block A and a peak derived from block B were obtained.
  • the obtained pressure-sensitive adhesive solution was applied onto a corona-treated PET film having a thickness of 50 ⁇ m as a substrate using an applicator so that the thickness of the dry film became 20 ⁇ m, and dried at 110° C. for 3 minutes. rice field. Then, it was heated and cured at 40° C. for 48 hours to obtain an adhesive tape.
  • Adhesive was prepared in the same manner as in Example 1 except that the composition of the ABA block copolymer, the type or amount of the tackifier, or the type or amount of the cross-linking agent was changed as shown in Tables 1 and 2. got the tape.
  • the tackifiers include ME-GH (manufactured by Arakawa Chemical Industries, Ltd.) as a liquid (liquid at room temperature) tackifier, YS Polyster G-150 (manufactured by Yasuhara Chemical Co., Ltd.) as a non-liquid (solid at room temperature) tackifier A, Pencel D-135 (manufactured by Arakawa Chemical Industries, Ltd.) was used as the non-liquid (solid at room temperature) tackifier B.
  • an ABA type block copolymer having a higher weight average molecular weight was prepared by prolonging the polymerization reaction time.
  • Example 1 A pressure-sensitive adhesive tape was obtained in the same manner as in Example 1, except that a (meth)acrylic polymer prepared as follows was used instead of the ABA type block copolymer.
  • Example 4 In the same manner as in Example 1, except that the styrene-ethylene-butylene-styrene (SEBS) block copolymer (Dynaron 8300, manufactured by JSR Corporation) shown in Table 2 was used instead of the ABA type block copolymer. , got the adhesive tape.
  • SEBS styrene-ethylene-butylene-styrene
  • the adhesive tape which is excellent in the peeling performance of a chip component and can suppress the adhesive residue on a chip component can be provided.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention vise à fournir un ruban adhésif qui présente une excellente performance de pelage par rapport à un composant de puce, et qui peut supprimer un résidu adhésif sur un composant de puce. La présente invention concerne un ruban adhésif qui a une couche adhésive. La couche adhésive contient un agent de réticulation et un copolymère séquencé de type A-B-A présentant une séquence A, qui a une structure dérivée d'un monomère de vinyle aromatique, et une séquence B, qui a une structure dérivée d'un monomère (méth)acrylique. La séquence B contient une structure dérivée d'un monomère contenant un groupe fonctionnel réticulable. La couche adhésive présente un module d'élasticité en traction de 0,008 à 2 MPa.
PCT/JP2022/020469 2021-05-17 2022-05-17 Ruban adhésif WO2022244756A1 (fr)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001115124A (ja) * 1998-12-08 2001-04-24 Nitto Denko Corp 粘着剤組成物およびその製造方法と粘着シ―ト類
JP2002241451A (ja) * 2000-12-15 2002-08-28 Nippon Synthetic Chem Ind Co Ltd:The 樹脂組成物及びその用途
JP2018080330A (ja) * 2016-11-07 2018-05-24 協立化学産業株式会社 相溶組成物、接着剤組成物、複合構造物並びに複合構造物の製造方法及び解体方法、チップの表面加工方法並びに複合体の製造方法
JP2018098225A (ja) * 2016-12-07 2018-06-21 住友ベークライト株式会社 粘着テープ
WO2020032163A1 (fr) * 2018-08-08 2020-02-13 東亞合成株式会社 Composition adhésive et son utilisation
WO2020059791A1 (fr) * 2018-09-21 2020-03-26 積水化学工業株式会社 Ruban adhésif double face
JP2020132713A (ja) * 2019-02-15 2020-08-31 積水化学工業株式会社 粘着テープ
WO2020218430A1 (fr) * 2019-04-24 2020-10-29 積水化学工業株式会社 Ruban adhésif sensible à la pression
WO2022102691A1 (fr) * 2020-11-13 2022-05-19 積水化学工業株式会社 Procédé de production d'un composant électronique, procédé de production d'un dispositif d'affichage et ruban de support

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001115124A (ja) * 1998-12-08 2001-04-24 Nitto Denko Corp 粘着剤組成物およびその製造方法と粘着シ―ト類
JP2002241451A (ja) * 2000-12-15 2002-08-28 Nippon Synthetic Chem Ind Co Ltd:The 樹脂組成物及びその用途
JP2018080330A (ja) * 2016-11-07 2018-05-24 協立化学産業株式会社 相溶組成物、接着剤組成物、複合構造物並びに複合構造物の製造方法及び解体方法、チップの表面加工方法並びに複合体の製造方法
JP2018098225A (ja) * 2016-12-07 2018-06-21 住友ベークライト株式会社 粘着テープ
WO2020032163A1 (fr) * 2018-08-08 2020-02-13 東亞合成株式会社 Composition adhésive et son utilisation
WO2020059791A1 (fr) * 2018-09-21 2020-03-26 積水化学工業株式会社 Ruban adhésif double face
JP2020132713A (ja) * 2019-02-15 2020-08-31 積水化学工業株式会社 粘着テープ
WO2020218430A1 (fr) * 2019-04-24 2020-10-29 積水化学工業株式会社 Ruban adhésif sensible à la pression
WO2022102691A1 (fr) * 2020-11-13 2022-05-19 積水化学工業株式会社 Procédé de production d'un composant électronique, procédé de production d'un dispositif d'affichage et ruban de support

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