WO2022242670A1 - 电路板结构以及电子设备 - Google Patents

电路板结构以及电子设备 Download PDF

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Publication number
WO2022242670A1
WO2022242670A1 PCT/CN2022/093509 CN2022093509W WO2022242670A1 WO 2022242670 A1 WO2022242670 A1 WO 2022242670A1 CN 2022093509 W CN2022093509 W CN 2022093509W WO 2022242670 A1 WO2022242670 A1 WO 2022242670A1
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Prior art keywords
connecting portion
circuit board
connection part
area
main board
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PCT/CN2022/093509
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English (en)
French (fr)
Inventor
周德令
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维沃移动通信有限公司
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Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2022242670A1 publication Critical patent/WO2022242670A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the application belongs to the technical field of communication equipment, and in particular relates to a circuit board structure and electronic equipment.
  • the performance of electronic equipment is getting better and better, and more and more functional devices are integrated in the electronic equipment.
  • These functional devices are usually arranged on the main board of the electronic equipment.
  • the utilization rate of the board area of the main board is particularly important.
  • the memory chip is a very critical core component in electronic equipment.
  • the package size of the memory chip is large, and the memory chip is fixed on the motherboard to occupy a large board area, which is not conducive to improving the board surface utilization of the motherboard.
  • the purpose of the embodiments of the present application is to provide a circuit board structure and an electronic device, which can solve the technical problem of low board area utilization of the main board in the prior art.
  • the embodiment of the present application proposes a circuit board structure.
  • the circuit board structure includes: a main board, a connecting part, a first device and a second device;
  • the connecting portion has a first surface and a second surface opposite to each other, the first surface is provided with a plurality of first lead-out ends, and the second surface is provided with a second surface corresponding to the first lead-out ends.
  • a lead end, a connection line connecting the first lead end and the second lead end is arranged inside the connecting part;
  • the first component is fixed on the connection part through the first lead-out end; the connection part is fixed on one side of the motherboard through the second lead-out end, and the first component is connected to the main board through the connection part
  • the motherboard is connected;
  • a device arrangement space is formed between the first device and the main board, the second device is arranged in the device arrangement space, and the second device is connected to the main board.
  • the circuit board structure includes a main board, a connection part, a first component and a second component.
  • the first device is fixed on the main board through the connecting part, which raises the height of the first device on the main board, so that after the first device is installed on the main board, a device layout space is formed between the first device and the main board.
  • the second device can be arranged in the device arrangement space.
  • the main board of the circuit board structure of the present application is provided with a first device occupying a large area of the main board, but it does not affect the layout of the second device in this area of the main board, which improves the utilization rate of the board surface of the main board.
  • FIG. 1 is a structural schematic diagram 1 of a circuit board structure disclosed in the present application.
  • FIG. 2 is a structural schematic diagram of a viewing angle of the circuit board structure shown in FIG. 1 .
  • FIG. 3 is a structural schematic view of another viewing angle of the circuit board structure shown in FIG. 1 .
  • FIG. 4 is a schematic structural diagram of the connection part disclosed in the present application.
  • FIG. 5 is a first structural schematic diagram of the connection between the connecting portion and the first device disclosed in the present application.
  • FIG. 6 is a second schematic diagram of the connection between the connection part and the first device disclosed in the present application.
  • FIG. 7 is a structural schematic view of another viewing angle of the circuit board structure shown in FIG. 1 .
  • FIG. 8 is a structural schematic view of another viewing angle of the circuit board structure shown in FIG. 1 .
  • FIG. 9 is a structural schematic diagram II of the circuit board structure disclosed in the present application.
  • FIG. 10 is a structural schematic diagram III of the circuit board structure disclosed in the present application.
  • FIG. 11 is a structural schematic diagram IV of the circuit board structure disclosed in the present application.
  • FIG. 12 is a structural schematic diagram five of the circuit board structure disclosed in the present application.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.
  • circuit board The structure of the circuit board according to the embodiment of the present application will be described below with reference to FIGS. 1-12 .
  • the circuit board structure includes: a main board 1 , a connecting portion 2 , a first component 3 and a second component 4 .
  • the connecting part 2 has a first surface and a second surface opposite to each other, the first surface is provided with a plurality of first lead-out ends 21, and the second surface is provided with a plurality of first lead-out ends 21.
  • a connection wire 23 connecting the first lead-out end 21 and the second lead-out end 22 is disposed inside the connecting portion 2 .
  • the first device 3 is fixed on the connection part 2 through the first lead-out end 21, and the connection part 2 is fixed on the main board 1 side through the second lead-out end 22.
  • the first device 3 is connected to the main board 1 through the connecting portion 2.
  • a device arrangement space is formed between the first device 3 and the main board 1 , the second device 4 is arranged in the device arrangement space, and the second device 4 is connected to the main board 1 .
  • the first component is fixed on the main board through its own pins.
  • the pins of the first component are soldered to the solder joints on the main board.
  • the pins of the first device are concentrated in the central area of the first device. Connects to the motherboard via the pins located in the central area.
  • the present application proposes a new circuit board structure.
  • the first component 3 of the circuit board structure of the present application is soldered to the first lead-out end 21 , and the first component 3 is fixed on the connecting portion 2 .
  • the second lead-out end 22 of the connecting portion 2 is welded to one side of the main board 1 .
  • the first device 3 is connected to the main board 1 through the connecting part 2, and the height of the first device 3 on the main board 1 is raised, so that after the first device 3 is installed on the main board 1, the gap between the first device 3 and the main board 1 A device layout space is formed.
  • the second device 4 can be arranged in the device arrangement space.
  • the main board 1 of the circuit board structure of the present application is provided with a first device 3 occupying a larger area of the main board, but it does not affect the layout of the second device 4 in this area of the main board 1, which improves the utilization rate of the board surface of the main board 1 .
  • the first device 3 of the present application may be a Universal Flash Storage (UFS) chip or the like.
  • the first device 3 is a device with a large area, and the first device 3 may be in a sheet structure or a block structure.
  • the second device 4 of the present application may be small components such as resistors, capacitors, and inductors.
  • first lead-out end 21 may be a solder joint.
  • the second lead-out end 22 may be a solder joint.
  • the first device 3 is fixed on the main board 1 , and the first device 3 is electrically connected to the main board 1 .
  • the connection part 2 includes a first lead-out end 21 , a second lead-out end 22 and a connection wire 23 connecting the first lead-out end 21 and the second lead-out end 22 .
  • the connection part 2 plays a role of raising the installation height of the first component 3 .
  • the connection part 2 plays a central role in transmitting signals, so that the circuit board structure can work normally.
  • a first adhesive 5 is filled between the first component 3 and the first surface of the connecting portion 2 .
  • the first device 3 is fixed on the connection part 2 through the first lead-out end 21, and then the first adhesive 5 is filled between the first device 3 and the connection part 2, and finally the second part of the connection part 2
  • the surface is fixed on the main board 1, so that the first device 3 is fixed on the main board 1 and connected with the main board 1.
  • This embodiment further improves the connection strength between the first device 3 and the connection part 2 .
  • the first adhesive 5 of this embodiment is filled between the first device 3 and the connection part 2, and the first adhesive 5 can protect the connection end of the first device 3 (such as the lead on the first device 3). feet) and the first lead-out end 21 of the connection part 2, to avoid damage or disconnection of the first lead-out end 21 of the first device 3 for connecting with the first lead-out end 21 and/or the connection part 2 And so on.
  • the first adhesive 5 is filled between the first device 3 and the connection part 2 , and the performance of the first adhesive 5 is not particularly limited. Because the distance between the first device 3 and the connection part 2 will decrease after the first device 3 and the connection part 2 are welded, the first adhesive 5 on the market can meet the filling requirements. Generally, after the first component 3 and the connecting portion 2 are welded, the distance between the first component 3 and the connecting portion 2 is less than 0.25 mm, which satisfies the climbing range of the first adhesive 5 . Specifically, the height distance between the connection part 2 and the first device 3 ranges from 0.1 mm to 0.2 mm. This height distance is easy to realize the glue dispensing operation between the connection part 2 and the first device 3, and can also solve the first problem. The distance between the device 3 and the main board 1 is too high, and it is difficult to fill the first adhesive.
  • the first adhesive 5 is filled between the first device 3 and the connection part 2 , which improves the connection strength between the first device 3 and the connection part 2 .
  • the usage amount of the first adhesive is also reduced, which reduces the production cost.
  • Fig. 7-Fig. The areas are equal.
  • a plurality of second lead-out ends 22 occupy the second surface of the connecting portion 2 , so that the area of the first welding region 221 formed by the second lead-out ends 22 is equal to the area of the second surface of the connecting portion 2 .
  • the second surface of the connection part 2 is welded and fixed to the main board 1 through the first welding area 221.
  • the application improves the connection between the connection part 2 and the main board by enlarging the area of the first welding area 221. 1, thereby improving the connection strength between the first device 3 and the motherboard 1.
  • the first device 3 has multiple connection terminals (the connection terminals may be pins on the first device 3 ).
  • the connection terminals may be pins on the first device 3 .
  • a plurality of connecting terminals on the first device 3 form a second soldering area.
  • the first lead-out end 21 of the connection part 2 forms a third welding area 211 , each connecting end corresponds to the first lead-out end 21 one by one, and the area of the third welding area 211 is consistent with the area of the second welding area.
  • the connecting terminals on the first device 3 are generally concentrated in a certain area of the first device 3 , the area on the first device 3 not provided with connecting terminals is connected to the connecting part 2 through the first adhesive 5 .
  • connection ends on the first device 3 are usually concentrated in a certain area of the first device 3, the third welding area 211 formed by the first lead-out end 21 of the connection part 2 is also concentrated on the first surface of the connection part 2. a certain area.
  • the area of the first welding region 221 is greater than the area of the third welding region 211 .
  • this embodiment further improves the welding strength between the connecting portion 2 and the main board 1 .
  • both the first lead-out end 21 and the second lead-out end 22 are configured as solder joints.
  • the first area 31 is attached to the connecting portion 2 , and the second area 32 is placed overhead.
  • the first device 3 includes a first region 31 and a second region 32, and the first region 31 and the second region 32 may be connected, or the first region 31 and the second region 32 may be arranged at intervals.
  • connection ends of the first device 3 for connecting to the first lead-out ends 21 are collectively arranged in the first region 31 .
  • the first region 31 of the first device 3 is welded and fixed to the connection part 2, and the connection part 2 is not provided under the second region 32 of the first device 3, and the second region 32 can be set overhead, so that a device layout space is formed between the second area 32 and the motherboard 1 , the device layout space is used to place the second device 4 , and the second device 4 is electrically connected to the motherboard 1 through the second adhesive 41 .
  • the main board 1 of the circuit board structure in this embodiment is provided with a first device occupying a large area of the main board, but it does not affect the layout of the second device 4 in this area of the main board 1, which improves the utilization rate of the board surface of the main board 1 .
  • the connecting portion 2 has a first size
  • the first device 3 has a second size
  • the first A size is equal to the second size
  • connection part 2 Along the second direction of the connection part 2, the connection part 2 has a third size, the first device 3 has a fourth size, and the third size is smaller than the fourth size.
  • the dashed-line box indicates the first device 3
  • the solid-line box indicates the connection part 2 .
  • the first lead-out ends 21 on the first surface of the connecting portion 2 form a third welding area 211 in an array.
  • the third welding area 211 corresponds to the second welding area formed by the connecting end of the first device 3 .
  • the second soldering area of the first device 3 is located in the first region 31 of the first device 3 .
  • the number of second connection leads 22 on the first welding area 221 formed on the second surface of the connection part 2 is more.
  • connection part 2 is a cuboid structure, wherein the first direction of the connection part 2 is the length direction of the connection part 2 , and the second direction of the connection part 2 is the width direction of the connection part 2 .
  • the length dimension of the connecting part 2 is equal to the length dimension of the first device 3 .
  • the length dimension of the connecting part 2 is slightly larger than the length dimension of the first component 3 .
  • the width dimension of the connection part 2 is smaller than the width dimension of the first device 3 . Therefore, the first region 31 of the first device 3 is soldered to the first soldering region 221 , and the connection part 2 is not provided under the second region 32 of the first device 3 .
  • a device layout space is formed between the second area 32 and the main board 1 , and the device layout space can place the second device 4 .
  • the connecting portion 2 includes a first connecting portion 2a, a second connecting portion 2b located on one side of the first connecting portion 2a, and the first connecting portion 2a is connected to the first connecting portion 2a.
  • the second connecting parts 2b are arranged at intervals to form an interval area;
  • Both the first connecting portion 2 a and the second connecting portion 2 b are connected to the first device 3 , and the second region 32 is exposed through the spaced region.
  • the connecting part 2 includes a first connecting part 2a and a second connecting part 2b which are independent of each other, wherein the first connecting part 2a and the second connecting part 2b are arranged at intervals, so that the first device 3 is fixed on the first connecting part 2a and the second connecting part 2a.
  • the second connecting portion 2b On the second connecting portion 2b, the second region 32 of the first device 3 is exposed through the spacer region.
  • a device layout space is formed between the second area 32 and the main board 1 , and the device layout space can place the second device 4 .
  • connection part 2 includes a first connection part 2a, a second connection part 2b and a third connection part 2c.
  • the second connecting portion 2b is disposed on the first side of the first connecting portion 2a and spaced apart from the first connecting portion 2a.
  • the third connecting portion 2c is disposed on the second side of the first connecting portion 2a and spaced apart from the first connecting portion 2a.
  • the length dimension of the first connection part 2a is substantially equal to the length dimension of the first device 3
  • the length dimension of the second connection part 2b is substantially equal to the length dimension of the first device 3
  • the third connection part 2a is substantially equal to the length dimension of the first device 3.
  • the length dimension of the portion 2c is substantially equal to the length dimension of the first device 3 .
  • the width dimension of the first connecting portion 2a is smaller than the width dimension of the first device 3
  • the width dimension of the second connecting portion 2b is smaller than the width dimension of the first device 3
  • the width of the third connecting portion 2c The dimension is smaller than the width dimension of the first device 3 .
  • a first lead-out terminal 21 is provided on the first surface of the first connecting portion 2a, and the first region 31 of the first device 3 is fixed on the first connecting portion 2a. Neither the first lead-out end 21 is provided on the first surface of the second connecting portion 2b nor the first surface of the third connecting portion 2c. The second region 32 of the first device 3 is fixed to the second connection portion 2 b and the third connection portion 2 c by the first adhesive 5 .
  • a first welding region 221a equal in area to the second surface of the first connection portion 2a is formed on the second surface of the first connection portion 2a, and a connection with the second connection portion 2b is formed on the second surface of the second connection portion 2b.
  • the first welding region 221b equal to the second surface area and the second surface of the third connecting portion 2c form the first welding region 221c equal to the second surface area of the third connecting portion 2c. Connection strength to motherboard 1.
  • a hollow area is formed on the connecting portion 2 , and when the first device 3 is fixed on the connecting portion 2 , the second area 32 passes through the The hollow area is exposed.
  • a hollow area is formed on the connecting portion 2 , wherein along the third direction of the connecting portion 2 , the hollow area penetrates the connecting portion 2 .
  • the third direction of the connection part 2 is the height direction of the connection part 2 .
  • the second region 32 of the first device 3 is exposed through the hollow region.
  • a device layout space is formed between the second area 32 and the main board 1 , and the device layout space can place the second device 4 .
  • the length dimension of the connecting portion 2 is equal to the length dimension of the first device 3 .
  • the width dimension of the connection part 2 is equal to the width dimension of the first device 3 .
  • Two hollow areas are formed on the connection part 2 by the hole-digging technique, and the two hollow areas expose the two second areas 32 of the first device 3 .
  • a device layout space is formed between the two second regions 32 and the motherboard 1 , and the device layout space can place the second device 4 .
  • a notch is formed on the connecting portion 2 , wherein along the third direction of the connecting portion 2 , the notch penetrates the connecting portion 2 .
  • the third direction of the connection part 2 is the height direction of the connection part 2 .
  • the outer contour of the connecting portion 2 forms a notch.
  • the second region 32 of the first device 3 is exposed through the notch.
  • a device layout space is formed between the second area 32 and the main board 1 , and the device layout space can place the second device 4 .
  • connection part 2 is roughly in the shape of a "cross", and four notches are formed on the connection part 2, and the four notches expose the four second regions 32 of the first device 3.
  • a device layout space is formed between each of the second regions 32 and the main board 1 , and the device layout space can place the second device 4 .
  • the height of the connecting portion 2 ranges from 0.25 mm to 0.55 mm.
  • the third direction of the circuit board structure is the height direction of the circuit board structure.
  • the height of the connecting part 2 ranges from 0.25mm to 0.55mm, and the inside of the connecting part 2 contains 2-layer to 6-layer connecting wires 23, through which the connection signal of the first device 3 is transmitted to the The first lead-out end 21 of the connection part 2 .
  • the height range of the connecting portion 2 is controlled within this range, and the utilization rate of the board surface of the main board is improved without affecting the overall structure of the circuit board structure.
  • a method for assembling the first device 3 and the motherboard 1 includes:
  • Step 1 provide a connection part assembly, the connection part assembly includes a first surface and a second surface arranged opposite to each other, a first lead-out end is provided on the first surface, and a second lead-out end is provided on the second surface;
  • the connecting part assembly is usually assembled by splicing a plurality of connecting parts 2, and the length of the connecting part assembly ranges from several hundred millimeters; the width of the connecting part assembly ranges from several hundred millimeters.
  • Solder paste is printed on the first side of the connector component, and solder paste is printed on the second side of the connector component.
  • Step 2 Welding multiple first devices 3 to the first surface of the connection part assembly.
  • the first device 3 and the connection part assembly are fixed by reflow soldering. After the first device 3 is soldered and fixed to the connection part assembly, the flux residue is cleaned.
  • Step 3 filling the first adhesive between the first device 3 and the connecting part assembly.
  • the first adhesive is filled between the first device 3 and the connection part assembly.
  • Step 4 cutting the connecting part assembly connected with the first device 3 .
  • the shape of the cut connection part includes the shapes shown in FIGS. 7-12 .
  • Step 5 Fix the connecting part connected with the first device 3 on the main board
  • Step 6 Install the second device in the device layout space formed between the first device 3 and the main board 1 .
  • the main board 1 of the circuit board structure of the present application is provided with a first device occupying a large area of the main board, but it does not affect the layout of the second device 4 in this area of the main board 1, which improves the utilization rate of the board surface of the main board 1 .
  • an electronic device includes the circuit board structure described above.
  • the circuit board structure is applied to electronic equipment, more components can be integrated on the circuit board structure, which improves the performance of the electronic equipment.
  • the electronic device may be a mobile phone, a computer, a head-mounted device, or a wristband device.
  • references to the terms “one embodiment,” “some embodiments,” “exemplary embodiments,” “example,” “specific examples,” or “some examples” are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present application.
  • schematic representations of the above terms do not necessarily refer to the same embodiment or example.
  • the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

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Abstract

本申请公开了一种电路板结构以及电子设备。所述电路板结构包括：主板、连接部、第一器件和第二器件；所述连接部具有相背设置的第一面和第二面，所述第一面上设置有多个第一引出端，所述第二面上设置有与所述第一引出端对应第二引出端，所述连接部内部设置有连接所述第一引出端和所述第二引出端的连接线；所述第一器件通过所述第一引出端固定于所述连接部上；所述连接部通过所述第二引出端固定在所述主板一侧，所述第一器件通过所述连接部与所述主板连接；所述第一器件与所述主板之间形成有器件布设空间，所述器件布设空间内设置有所述第二器件，所述第二器件与所述主板连接。

Description

电路板结构以及电子设备
相关申请的交叉引用
本申请要求于2021年05月21日提交的申请号为202110558018.3，发明名称为“电路板结构以及电子设备”的中国专利申请的优先权，其通过引用方式全部并入本申请。
技术领域
本申请属于通讯设备技术领域，具体涉及一种电路板结构以及电子设备。
背景技术
目前电子设备的性能越来越优良，电子设备内集成的功能器件也越来越多，这些功能器件通常布设在电子设备的主板上。在电子设备整机尺寸确定的情况下，主板的板面的利用率尤为重要。
例如电子设备中存储芯片是一个非常关键的核心零部件，目前，存储芯片封装尺寸较大，存储芯片固定在主板上占据了较大的板面面积，不利于提高主板的板面利用率。
发明内容
本申请实施例的目的是提供一种电路板结构以及电子设备，能够解决现有技术中主板的板面利用率较低的技术问题。
第一方面，本申请实施例提出了一种电路板结构。所述电路板结构包括：主板、连接部、第一器件和第二器件；
所述连接部具有相背设置的第一面和第二面，所述第一面上设置有多个第一引出端，所述第二面上设置有与所述第一引出端对应第二引出端，所述 连接部内部设置有连接所述第一引出端和所述第二引出端的连接线；
所述第一器件通过所述第一引出端固定于所述连接部上；所述连接部通过所述第二引出端固定在所述主板一侧，所述第一器件通过所述连接部与所述主板连接；
所述第一器件与所述主板之间形成有器件布设空间，所述器件布设空间内设置有所述第二器件，所述第二器件与所述主板连接。
在本申请的实施例中，电路板结构包括主板、连接部、第一器件和第二器件。第一器件通过连接部固定在主板上，抬高了第一器件设置在主板上高度，使得第一器件安装在主板上后，第一器件与主板之间形成了器件布设空间。器件布设空间内能够布设第二器件。本申请电路板结构的主板上设置有占用主板面积较大的第一器件，但是不影响主板在该区域布设第二器件，提高了主板的板面的利用率。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1所示为本申请公开的电路板结构的结构示意图一。
图2所示为图1所示电路板结构的一个视角的结构示意图。
图3所示为图1所示电路板结构的另一个视角的结构示意图。
图4所示为本申请公开的连接部的结构示意图。
图5所示为本申请公开的连接部与第一器件连接的结构示意图一。
图6所示为本申请公开的连接部与第一器件连接的结构示意图二。
图7所示为图1所示电路板结构的又一个视角的结构示意图。
图8所示为图1所示电路板结构的又一个视角的结构示意图。
图9所示为本申请公开的电路板结构的结构示意图二。
图10所示为本申请公开的电路板结构的结构示意图三。
图11所示为本申请公开的电路板结构的结构示意图四。
图12所示为本申请公开的电路板结构的结构示意图五。
附图标记：
1-主板，2-连接部，2a-第一连接部，2b-第二连接部，2c-第三连接部，21-第一引出端，22-第二引出端，23-连接线，211-第三焊接区域，221-第一焊接区域，3-第一器件，31-第一区域，32-第二区域，4-第二器件，41-第二粘接剂，5-第一粘接剂。
具体实施方式
下面将详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
下面结合图1-图12描述根据本申请实施例的电路板结构。
参照图1-图12所示，所述电路板结构包括：主板1、连接部2、第一器件3和第二器件4。
所述连接部2具有相背设置的第一面和第二面，所述第一面上设置有多个第一引出端21，所述第二面上设置有与所述第一引出端21对应第二引出端22，所述连接部2内部设置有连接所述第一引出端21和所述第二引出端22的连接线23。所述第一器件3通过所述第一引出端21固定于所述连接部2上，所述连接部2通过所述第二引出端22固定在所述主板1一侧，所述第一器件3通过所述连接部2与所述主板1连接。所述第一器件3与所述主板1之间形成有器件布设空间，所述器件布设空间内设置有所述第二器件4，所述第二器件4与所述主板1连接。
在现有技术中，第一器件通过自身的引脚固定在主板上。第一器件的引脚与主板上的焊点焊接。第一器件的引脚集中在第一器件的中心区域。通过位于中心区域的引脚与主板连接。当第一器件固定在主板上，由于第一器件的引脚与主板上的焊点之间的距离太小，第一器件上未设置有引脚的区域与主板之间的区域无法在被利用，使得主板的板面的利用率较低。
为了解决现有技术中主板的板面利用率较低的技术问题，本申请提出了一种新型的电路板结构。
本申请电路板结构的第一器件3与第一引出端21焊接，第一器件3固定在连接部2上。连接部2的第二引出端22与主板1的一侧焊接。本申请第一器件3通过连接部2与主板1连接，抬高了第一器件3设置在主板1 上高度，使得第一器件3安装在主板1上后，第一器件3与主板1之间形成了器件布设空间。器件布设空间内能够布设第二器件4。本申请电路板结构的主板1上设置有占用主板面积较大的第一器件3，但是不影响主板1在该区域布设第二器件4，提高了主板1的板面的利用率。
在一个具体的实施例中，本申请的第一器件3可以是通用闪存(Universal Flash Storage，UFS)芯片等。优选地，第一器件3为具有较大面积的器件，第一器件3可以呈片状结构或者块状结构。
本申请的第二器件4可以是电阻、电容、电感等小型元器件。
在一个具体的实施例中，第一引出端21可以是焊点。第二引出端22可以是焊点。
本申请实施例中，将第一器件3固定在主板1上，第一器件3与主板1电连接。连接部2包括第一引出端21、第二引出端22以及连接第一引出端21和第二引出端22的连接线23。一方面连接部2起到抬高第一器件3安装高度的作用。另一方面连接部2起到传递信号的中枢作用，使得电路板结构能够正常工作。
在一个实施例中，参照图3和图6所示，所述第一器件3与所述连接部2的第一面之间填充有第一粘接剂5。
本实施例中第一器件3通过第一引出端21固定在连接部2上，再在第一器件3与连接部2之间填充第一粘接剂5，最后再将连接部2的第二面固定在主板1上，使得第一器件3固定在主板1上并与主板1连接。
本实施例进一步提高了第一器件3与连接部2的连接强度。另外本实施例的第一粘接剂5填充在第一器件3和连接部2之间，第一粘接剂5能够起到保护第一器件3的连接端(例如第一器件3上的引脚)和连接部2的第一引出端21的作用，避免第一器件3用于与第一引出端21连接的连接端和/或连接部2的第一引出端21出现损坏或者断开连接等现象。
本申请第一粘接剂5填充在第一器件3和连接部2之间，对第一粘接剂5的性能不进行特别限定。因为第一器件3和连接部2焊接之后，第一器件 3和连接部2之间的间距会减小，现有市面上的第一粘接剂5均能够满足填充要求。一般情况下，第一器件3和连接部2焊接之后，第一器件3和连接部2之间的间距小于0.25mm，满足第一粘接剂5的爬高范围。具体地，连接部2与第一器件3之间的高度间距范围在0.1mm～0.2mm，该高度间距容易实现连接部2与第一器件3之间的点胶操作，另外也可以解决第一器件3与主板1之间距离过高，第一粘接剂填充困难的问题。
与第一器件3被抬高固定之后，在第一器件3和主板1之间填充第一粘接剂的方案相比，由于第一器件3与主板1之间的间距较大(包含了连接部2的高度)，流动性较好的第一粘接剂的爬高范围有限，不能够很好的实现对第一器件3和主板1之间的填充，反而会影响电路板结构的外观和第一器件3与主板1之间的连接强度。因此本实施例中在第一器件3和连接部2之间填充第一粘接剂5，提高了第一器件3与连接部2之间的连接强度。另外也降低了第一粘接剂的使用量，降低了生产成本。
在一个实施例中，参照图1、图7-图12所示，多个所述第二引出端22形成第一焊接区域221，所述第一焊接区域221的面积与所述第二面的面积相等。
例如多个第二引出端22占据了连接部2的第二面，使得第二引出端22形成的第一焊接区域221的面积与连接部2的第二面的面积相等。在第一器件3固定在连接部2之后，连接部2的第二面通过第一焊接区域221与主板1焊接固定，本申请通过扩大第一焊接区域221的面积，提高了连接部2与主板1之间的连接强度，进而提高了第一器件3与主板1之间的连接强度。
在一个具体的实施例中，第一器件3上具有多个连接端(连接端可以为第一器件3上的引脚)。例如第一器件3上的多个连接端形成第二焊接区域。连接部2的第一引出端21形成第三焊接区域211，每一连接端与第一引出端21一一对应，第三焊接区域211的面积与第二焊接区域的面积一致。
另外由于第一器件3上的连接端通常集中设置在第一器件3的某一区域，第一器件3上没有设置连接端的区域与连接部2通过第一粘接剂5连接。
由于第一器件3上的连接端通常集中设置在第一器件3的某一区域，因此连接部2的第一引出端21形成的第三焊接区域211也集中在连接部2的第一面的某一区域。在连接部2的第一面的尺寸与连接部2的第二面的尺寸相同的情况下，第一焊接区域221的面积大于第三焊接区域211的面积。与第一焊接区域的面积和第三焊接区域的面积相等的方案相比，本实施例进一步提高了连接部2与主板1的焊接强度。
在一个可选的实施例中，第一引出端21和第二引出端22均设置为焊点。通过增大第一引出端21的横截面积和第二引出端22的横截面积，进一步提高连接部2与主板1之间的连接强度。
在一个实施例中，参照图7-图12所示，所述第一器件3与所述连接部2相对设置的表面包括第一区域31和第二区域32；在所述第一器件3固定在所述连接部2上的情况下，所述第一区域31与所述连接部2贴合设置，所述第二区域32架空设置。
具体的，第一器件3包括第一区域31和第二区域32，第一区域31和第二区域32可以连接，或者第一区域31和第二区域32间隔设置。
本实施例中第一器件3用于与第一引出端21连接的连接端集中设置在第一区域31。在第一器件3固定在连接部2的情况下，第一器件3的第一区域31与连接部2焊接固定，第一器件3的第二区域32下方未设置有连接部2，第二区域32能够被架空设置，使得第二区域32与主板1之间形成器件布设空间，器件布设空间用于放置第二器件4，第二器件4通过第二粘接剂41与主板1电连接。本实施例电路板结构的主板1上设置有占用主板面积较大的第一器件，但是不影响主板1在该区域布设第二器件4，提高了主板1的板面的利用率。
在一个实施例中，参照图7-图8所示，沿所述连接部2的第一方向，所述连接部2具有第一尺寸，所述第一器件3具有第二尺寸，所述第一尺寸与所述第二尺寸相等。
沿所述连接部2的第二方向，所述连接部2具有第三尺寸，所述第一器 件3具有第四尺寸，所述第三尺寸小于所述第四尺寸。
例如，参照图7-图8所示，虚线框示意为第一器件3，实线框示意为连接部2。参照图7所示，连接部2的第一面的第一引出端21呈阵列方式形成第三焊接区域211。其中第三焊接区域211与第一器件3的连接端形成的第二焊接区域相对应。第一器件3的第二焊接区域位于第一器件3的第一区域31。
参照图8所示，连接部2的第二面形成的第一焊接区域221上的第二连接引出端22数目更多。
本实施例连接部2为一长方体结构，其中连接部2的第一方向为连接部2的长度方向，连接部2的第二方向为连接部2的宽度方向。
沿连接部2的第一方向，连接部2的长度尺寸与第一器件3的长度尺寸相等。或者连接部2的长度尺寸略大于第一器件3的长度尺寸。沿连接部2的第二方向，连接部2的宽度尺寸小于第一器件3的宽度尺寸。因此第一器件3的第一区域31与第一焊接区域221焊接，第一器件3的第二区域32下方未设置有连接部2。第二区域32与主板1之间形成了器件布设空间，器件布设空间可以放置第二器件4。
在一个实施例中，参照图9所示，所述连接部2包括第一连接部2a、位于所述第一连接部2a的一侧的第二连接部2b，所述第一连接部2a与所述第二连接部2b间隔设置形成间隔区域；
所述第一连接部2a和第二连接部2b均与所述第一器件3连接，所述第二区域32通过所述间隔区域露出。
例如，连接部2包括互相独立的第一连接部2a和第二连接部2b，其中第一连接部2a和第二连接部2b间隔设置，使得第一器件3固定在第一连接部2a和第二连接部2b上，通过间隔区域将第一器件3的第二区域32露出。第二区域32与主板1之间形成了器件布设空间，器件布设空间可以放置第二器件4。
在一个具体的实施例中，参照图9所示，连接部2包括第一连接部2a、第二连接部2b和第三连接部2c。第二连接部2b设置在第一连接部2a的第一侧并与第一连接部2a间隔设置。第三连接部2c设置在第一连接部2a的第二侧并与第一连接部2a间隔设置。
沿连接部2的第一方向，第一连接部2a的长度尺寸与第一器件3的长度尺寸基本相等、第二连接部2b的长度尺寸与第一器件3的长度尺寸基本相等、第三连接部2c的长度尺寸与第一器件3的长度尺寸基本相等。
沿连接部2的第二方向，第一连接部2a的宽度尺寸小于第一器件3的宽度尺寸、第二连接部2b的宽度尺寸小于第一器件3的宽度尺寸、第三连接部2c的宽度尺寸小于第一器件3的宽度尺寸。
第一连接部2a的第一面设置有第一引出端21，第一器件3的第一区域31固定在第一连接部2a上。第二连接部2b的第一面上和第三连接部2c的第一面上均未设置第一引出端21。第一器件3的第二区域32与第二连接部2b、第三连接部2c通过第一粘接剂5固定。
第一连接部2a的第二面上形成了与第一连接部2a的第二面面积相等的第一焊接区域221a、第二连接部2b的第二面上形成了与第二连接部2b的第二面面积相等的第一焊接区域221b、第三连接部2c的第二面上形成了与第三连接部2c的第二面面积相等的第一焊接区域221c，本例子提高了连接部2与主板1的连接强度。
在一个实施例中，参照图10所示，所述连接部2上形成有中空区域，在所述第一器件3固定在所述连接部2的情况下，所述第二区域32通过所述中空区域露出。
例如连接部2上形成有中空区域，其中沿所述连接部2的第三方向，中空区域贯穿所述连接部2。连接部2的第三方向为连接部2的高度方向。
本实施例通过中空区域将第一器件3的第二区域32露出。第二区域32与主板1之间形成了器件布设空间，器件布设空间可以放置第二器件4。
参照图10所示，沿连接部2的第一方向，连接部2的长度尺寸与第一器件3的长度尺寸相等。沿连接部2的第二方向，连接部2的宽度尺寸与第一器件3的宽度尺寸相等。通过挖孔技术在连接部2上形成了两个中空区域，两个中空区域将第一器件3的两个第二区域32露出。两个第二区域32均与主板1之间形成器件布设空间，器件布设空间可以放置第二器件4。
在一个实施例中，参照图11-图12所示，在所述连接部2的边缘区域形成有缺口部，在所述第一器件3固定在所述连接部2的情况下，所述第二区域32通过所述缺口部露出。
例如连接部2上形成缺口部，其中沿所述连接部2的第三方向，缺口部贯穿所述连接部2。连接部2的第三方向为连接部2的高度方向。具体地，连接部2的外轮廓形成缺口部。
本实施例通过缺口部将第一器件3的第二区域32露出。第二区域32与主板1之间形成了器件布设空间，器件布设空间可以放置第二器件4。
参照图11和图12所示，连接部2大致呈“十字”形结构，连接部2上形成有四个缺口部，四个缺口部将第一器件3的四个第二区域32露出，四个第二区域32均与主板1之间形成器件布设空间，器件布设空间可以放置第二器件4。
在一个实施例中，沿所述电路板结构的第三方向，所述连接部2的高度范围为0.25mm～0.55mm。
例如，电路板结构的第三方向为电路板结构的高度方向。沿电路板结构的高度方向，连接部2的高度范围为0.25mm～0.55mm，连接部2的内部含2层～6层连接线23，通过连接线23实现第一器件3的连接信号传输到连接部2的第一引出端21。
本实施例将连接部2的高度范围控制在此范围内，在不影响电路板结构的整体结构的情况下，提高了主板的板面的利用率。
在一个具体的实施例中，提供了一种第一器件3与主板1组装的方法。参照图4-图6所示，所述方法包括：
第一步：提供连接部组件，连接部组件包括相背设置的第一面和第二面，在所述第一面设置第一引出端、在所述第二面设置第二引出端；
具体地，连接部组件通常为多个连接部2拼接而成，连接部组件的长度尺寸范围为数百毫米；连接部组件的宽度尺寸范围为数百毫米。
在连接部组件的第一面上印刷焊锡膏，在连接部组件的第二面上印刷焊锡膏。
第二步：将多个第一器件3与连接部组件的第一面焊接。
具体地，第一器件3与连接部组件通过回流焊接进行固定。第一器件3与连接部组件焊接固定后并对助焊剂残留物清洗。
第三步：在第一器件3与连接部组件之间填充第一粘接剂。
具体地，在对第一器件3与连接部组件之间的助焊剂残留物清洗干净后，对第一器件3与连接部组件之间填充第一粘接剂。
第四步：对已连接有第一器件3的连接部组件进行切割。
具体地，对已连接有第一器件3的连接部组件进行切割，第一器件3固定在连接部上。其中切割后的连接部的形状包括图7-图12所示的形状。
第五步：将已连接有第一器件3的连接部固定在主板上；
第六步：在第一器件3与主板1之间形成的器件布设空间内设置第二器件。
本申请电路板结构的主板1上设置有占用主板面积较大的第一器件，但是不影响主板1在该区域布设第二器件4，提高了主板1的板面的利用率。
根据本公开实施例，提供了一种电子设备。电子设备包括上述所述的电路板结构。例如将电路板结构应用到电子设备中，电路板结构上可以集成更多的元器件，提升了电子设备的性能。例如电子设备可以是手机、电脑、头戴设备或者腕带设备等。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例 或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (10)

  1. 一种电路板结构，包括：主板、连接部、第一器件和第二器件；
    所述连接部具有相背设置的第一面和第二面，所述第一面上设置有多个第一引出端，所述第二面上设置有与所述第一引出端对应第二引出端，所述连接部内部设置有连接所述第一引出端和所述第二引出端的连接线；
    所述第一器件通过所述第一引出端固定于所述连接部上；所述连接部通过所述第二引出端固定在所述主板一侧，所述第一器件通过所述连接部与所述主板连接；
    所述第一器件与所述主板之间形成有器件布设空间，所述器件布设空间内设置有所述第二器件，所述第二器件与所述主板连接。
  2. 根据权利要求1所述的电路板结构，其中，所述第一器件与所述连接部的第一面之间填充有第一粘接剂。
  3. 根据权利要求1或2所述的电路板结构，其中，多个所述第二引出端形成第一焊接区域，所述第一焊接区域的面积与所述第二面的面积相等。
  4. 根据权利要求1所述的电路板结构，其中，所述第一器件与所述连接部相对设置的表面包括第一区域和第二区域；在所述第一器件固定在所述连接部上的情况下，所述第一区域与所述连接部贴合设置，所述第二区域架空设置。
  5. 根据权利要求4所述的电路板结构，其中，沿所述连接部的第一方向，所述连接部具有第一尺寸，所述第一器件具有第二尺寸，所述第一尺寸与所述第二尺寸相等；
    沿所述连接部的第二方向，所述连接部具有第三尺寸，所述第一器件具 有第四尺寸，所述第三尺寸小于所述第四尺寸。
  6. 根据权利要求4所述的电路板结构，其中，所述连接部包括第一连接部、位于所述第一连接部的第一侧的第二连接部，所述第一连接部与所述第二连接部间隔设置形成间隔区域；
    所述第一连接部和第二连接部均与所述第一器件连接，所述第二区域通过所述间隔区域露出。
  7. 根据权利要求4所述的电路板结构，其中，所述连接部上形成有中空区域，在所述第一器件固定在所述连接部的情况下，所述第二区域通过所述中空区域露出。
  8. 根据权利要求4所述的电路板结构，其中，在所述连接部的边缘区域形成有缺口部，在所述第一器件固定在所述连接部的情况下，所述第二区域通过所述缺口部露出。
  9. 根据权利要求1所述的电路板结构，其中，沿所述电路板结构的第三方向，所述连接部的高度范围为0.25mm～0.55mm。
  10. 一种电子设备，包括如权利要求1-9任一项所述的电路板结构。
PCT/CN2022/093509 2021-05-21 2022-05-18 电路板结构以及电子设备 WO2022242670A1 (zh)

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