WO2022193347A1 - 晶圆载具的夹取装置 - Google Patents

晶圆载具的夹取装置 Download PDF

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Publication number
WO2022193347A1
WO2022193347A1 PCT/CN2021/082821 CN2021082821W WO2022193347A1 WO 2022193347 A1 WO2022193347 A1 WO 2022193347A1 CN 2021082821 W CN2021082821 W CN 2021082821W WO 2022193347 A1 WO2022193347 A1 WO 2022193347A1
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WO
WIPO (PCT)
Prior art keywords
clamping
driving
frame
sliding
assembly
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PCT/CN2021/082821
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English (en)
French (fr)
Inventor
程博文
陈定操
杨长春
蒋孝恩
Original Assignee
台湾积体电路制造股份有限公司
台积电(中国)有限公司
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Application filed by 台湾积体电路制造股份有限公司, 台积电(中国)有限公司 filed Critical 台湾积体电路制造股份有限公司
Publication of WO2022193347A1 publication Critical patent/WO2022193347A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Definitions

  • the present application belongs to the field of semiconductor technology, and in particular relates to a clamping device for a wafer carrier.
  • Wafers refer to silicon wafers used to make silicon semiconductor circuits. Usually, multiple processes are required to finally form products. During the processing, a carrier is used to place the wafer, and a clamping device transports the carrier to the corresponding station.
  • the existing clamping device usually clamps the carrier at a specific angle, and the flexibility of the clamping device itself is not high.
  • problems such as insufficient clamping force between the clamping device and the carrier are prone to occur. Prolonged use will cause relative sliding between the clamping device and the carrier, affecting the clamping reliability.
  • the purpose of the embodiments of the present application is to provide a clamping device for a wafer carrier, which can realize multi-angle clamping of the wafer carrier and has high flexibility.
  • an embodiment of the present application provides a clamping device for a wafer carrier, which includes a robotic arm, a clamping assembly, and a plane precise positioning member.
  • the planar precise positioning member is connected between the robotic arm and the clamping assembly.
  • the robotic arm Drive the clamping assembly to move in space;
  • the plane precise positioning member includes a transmission frame, a driving wheel, a driven wheel and a conveyor belt.
  • the transmission frame is connected to the mechanical arm.
  • the driving wheel and the driven wheel are rotatably connected to the transmission frame, and the conveyor belt is connected to the driving wheel and The driven wheel;
  • the clamping assembly includes a clamping frame, two clamping members and a driving assembly, the clamping frame is extended along the first direction and is fixed to the driven wheel, and the two clamping members are oppositely arranged in the first direction and are slidable is connected to the clamping frame, and the driving component is arranged on the clamping frame and drives the two clamping members to approach or move away.
  • the driving assembly includes a driving member and a first sliding connection member, the driving member drives the first sliding connection member to slide, and the two clamping members are slidably connected to the clamping frame through the first sliding connection member
  • the first sliding connecting piece includes a first sliding piece and a first guide rail which are used in cooperation with each other, one of the first sliding piece and the first guide rail is connected with the clamping piece, and the other is connected with the clamping frame or the driving piece.
  • the first sliding connection member includes two first guide rails parallel to each other and two first sliding members corresponding to the two first guide rails one-to-one, and the first guide rails are extended along the first direction
  • a clamping member is correspondingly and fixedly connected to a first sliding member, and the two clamping members approach and move away from each other to clamp or release the wafer carrier.
  • the clamping member includes a body part, a first clamping part and a second clamping part, and the first clamping part and the second clamping part are located on the same side of the body part in the first direction
  • the clamping frames are arranged at a predetermined distance from each other in the thickness direction to form a clamping space for clamping the edge of the wafer carrier.
  • the clamping assembly further includes a first detection device, and the first detection device is disposed in the clamping space and used for judging whether the edge of the wafer carrier is within a preset range.
  • the driving assembly further includes a second sliding connection piece
  • the second sliding connection piece includes a second sliding piece and a second guide rail that are used in cooperation with each other, the second sliding piece is connected with the clamping piece, and the second sliding piece is connected to the clamping piece.
  • the guide rail is connected with the clamping frame or the driving member, and the second guide rail extends along the first direction to limit the moving track of the clamping member.
  • the clamping assembly further includes a conductive slip ring, which is disposed on a side of the clamping frame close to the plane precise positioning member and is electrically connected to the driving member, so as to transmit external data signals to the driving member .
  • the robotic arm includes a rotating shaft driving member, and the rotating shaft driving member is connected with the driving wheel to drive the driving wheel to rotate.
  • the clamping device further includes a second detection device, which is disposed outside the transmission frame and is used to detect the position information of the plane precise positioning member.
  • a tensioning wheel is arranged in the transmission frame, and the tensioning wheel is arranged in cooperation with the conveyor belt.
  • a clamping device for a wafer carrier includes a robotic arm, a clamping component and a plane precise positioning member.
  • the clamping component is used for clamping the wafer carrier and is moved to a specific station by the robotic arm During the clamping process, the plane precise positioning member will adjust the deflection angle of the clamping component relative to the robotic arm according to the placement angle of the wafer carrier on the station, thereby changing the clamping angle of the wafer carrier , to meet the use requirements in different situations, with high reliability and flexibility.
  • FIG. 1 is an axonometric view of a clamping device for a wafer carrier provided by an embodiment of the present application
  • FIG. 2 is a top view of a gripping device provided by an embodiment of the present application.
  • FIG. 3 is a bottom view of a gripping device provided by an embodiment of the present application.
  • FIG. 4 is an internal structure diagram of a clamping assembly provided by an embodiment of the present application.
  • FIG. 5 is a structural diagram of the gripping device provided by the embodiment of the present application from another perspective;
  • FIG. 6 is a structural diagram of the clamping device provided by the embodiment of the present application from another perspective.
  • main body
  • a first detection device
  • A The first direction.
  • an embodiment of the present application provides a clamping device for a wafer carrier.
  • a wafer refers to a silicon wafer used for fabricating a silicon semiconductor circuit, and its raw material is silicon.
  • High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seed crystals, and then slowly pulled out to form cylindrical monocrystalline silicon.
  • wafers often need to be clamped and transported by a carrier, wherein the clamping assembly 3 is used to fix and clamp the wafer carrier, and the robotic arm 1 is used to transport the wafer carrier.
  • the clamping device includes a robotic arm 1 , a plane precise positioning member 2 and a clamping assembly 3 .
  • the planar precise positioning member 2 is connected between the robotic arm 1 and the clamping assembly 3 , and the robotic arm 1 drives the clamping assembly 3 to move in space.
  • the plane precise positioning member 2 includes a transmission frame 21, a driving wheel 22, a driven wheel 23 and a conveyor belt 24.
  • the transmission frame 21 is connected with the mechanical arm 1.
  • the driving wheel 22 and the driven wheel 23 are rotatably connected to the transmission frame 21.
  • the conveyor belt 24 The driving wheel 22 and the driven wheel 23 are connected.
  • the clamping assembly 3 includes a clamping frame 31 , two clamping members 32 and a driving assembly 33 .
  • the clamping frame 31 extends along the first direction A and is fixed to the driven wheel 23 , and the two clamping members 32 are in the first direction A.
  • the upper portion is oppositely disposed and slidably connected to the clamping frame 31 , and the driving assembly 33 is disposed on the clamping frame 31 and drives the two clamping members 32 to approach or move away from each other.
  • the clamping frame 31 provided in the embodiment of the present application is used to install the clamping member 32 and the driving assembly 33 .
  • the driving assembly 33 is located inside the clamping frame 31 and is responsible for driving the clamping member 32 to move.
  • the clamping member 32 is located at the side of the clamping frame 31 . Below and at least partially protruding from the clamping frame 31, the two clamping members 32 are arranged opposite to each other along the extending direction of the clamping frame 31.
  • the driving component 33 controls the two clamping members 32 to be relatively close to each other and Clamping the wafer carrier, the robotic arm 1 is used to drive the clamping component 3 and the wafer carrier to move to a specific position, and then the driving component 33 controls the two clamping members 32 to move away from each other to release the wafer carrier, the wafer Arrive at a specific station and proceed to the next step of processing.
  • the robotic arm 1 can drive the clamping assembly 3 to translate in multiple directions within a spatial range.
  • the robotic arm 1 can drive the clamping assembly 3 in three directions of XYZ.
  • the translation in any two directions can also meet the needs of movement in three directions at the same time.
  • the movable direction of the robotic arm 1 is determined according to the actual usage, which is not limited in this application.
  • the plane precise positioning member 2 includes a transmission frame 21 , a driving wheel 22 , a driven wheel 23 and a conveyor belt 24 , the transmission frame 21 is connected with the mechanical arm 1 , and the driving wheel 22 and the driven wheel 23 are located in the transmission frame 21 and rotate with the transmission frame 21 Connected, the conveyor belt 24 is sleeved on the driving wheel 22 and the driven wheel 23, and plays the role of transmitting motion.
  • the driving wheel 22 and the driven wheel 23 are gears, and corresponding racks are provided on the conveyor belt 24, thereby ensuring the reliability of transmission.
  • the driving wheel 22 rotates under the action of external force, and drives the driven wheel 23 to rotate together through the conveyor belt 24 , the clamping frame 31 moves synchronously with the driven wheel 23, and drives the two clamping members 32 to rotate at a specific angle at the same time, so as to meet the clamping needs.
  • the robotic arm 1 drives the clamping assembly 3 to move within the space by means of the plane precise positioning member 2, and the clamping assembly 3 can be deflected arbitrarily relative to the plane precise positioning member 2, so as to realize flexible clamping at multiple angles and meet the practical requirements. Grip transport required.
  • the driving assembly 33 includes a driving member 331 and a first sliding connecting member 332 , the driving member 331 drives the first sliding connecting member 332 to slide, and the two clamping members 32 are connected to the clamping member through the first sliding connecting member 332
  • the frame 31 is slidably connected;
  • the first sliding connection piece 332 includes a first sliding piece 3321 and a first guide rail 3322 which are used in cooperation with each other, and one of the first sliding piece 3321 and the first guide rail 3322 is connected with the clamping piece 32, The other is connected to the clamping frame 31 or the driving member 331 .
  • the driving member 331 is fixedly installed inside the clamping frame 31 by means of bolts or the like, and the first guide rail 3322 is slidably connected with the first sliding member 3321 to drive the clamping member 32 to move.
  • the first guide rail 3322 can be installed on the side of the driving member 331 close to the clamping member 32, or can be installed on the end of the clamping frame 31 close to the clamping member 32, and the first guide rail 3322 can be either a chute structure or a The strip-shaped raised structures, etc., are not limited in this application.
  • the number of the first guide rails 3322 can be one or two. When there is only one first guide rail 3322, the two first sliding members 3321 are located on the same first guide rail 3322. When there are two first guide rails 3322 , the two first guide rails 3322 are arranged side by side, and the two first sliding members 3321 are located on different first guide rails 3322 .
  • the first sliding connection member 332 includes two first guide rails 3322 parallel to each other and two first sliding members 3321 corresponding to the two first guide rails 3322 ,
  • the first guide rail 3322 is extended along the first direction A to the driving member 331 , and a clamping member 32 is fixedly connected to a first sliding member 3321 , and the two clamping members 32 are close to or away from each other to clamp or release the wafer. vehicle.
  • the first guide rails 3322 are two sliding groove structures parallel to each other and extending along the first direction A.
  • the first guide rails 3322 are located on the side of the driving member 331 close to the clamping member 32 .
  • a guide rail 3322 is slidably connected and is fixedly connected to the two clamping members 32 respectively.
  • the driving member 331 drives the clamping members 32 to approach or move away from each other through the first sliding member 3321 .
  • the driving member 331 may be a combination of a servo motor and a helical gear
  • the opposite surfaces of the two first sliding members 3321 are provided with racks matching the helical gear
  • the servo motor works to drive the helical gear
  • the helical gear meshes with the rack on the first sliding member 3321 for transmission, thereby driving the two first sliding members 3321 to move in opposite directions on the first guide rail 3322 respectively.
  • the two first sliding members 3321 are respectively connected with different clamping members 32.
  • connection between the first sliding member 3321 and the clamping members 32 can be bolted, and the driving member 331 drives the first sliding member 3321 to move so that the The two clamping members 32 are close to or away from each other to realize clamping and placing of the wafer carrier.
  • the clamping member 32 includes a body portion 321 , a first clamping portion 322 and a second clamping portion 323 , and the first clamping portion 322 and the second clamping portion 323 are located in the first direction A.
  • the same side of the body portion 321 is disposed at a predetermined distance from each other in the thickness direction of the clamping frame 31 to form a clamping space 324 for clamping the edge of the wafer carrier.
  • the first clamping portion 322 and the second clamping portion 323 are respectively fixedly connected to the body portion 321 , and the first clamping portion 322 and the second clamping portion 323 are located on the same side of the body portion 321 in the first direction A, and in some In an alternative embodiment, the first clamping portion 322 and the second clamping portion 323 are parallel to each other, and both are arranged perpendicular to the body portion 321 , the first clamping portion 322 can be integrally formed with the body portion 321 , and the second clamping portion 323 may also be integrally formed with the body portion 321 .
  • the first clamping portion 322 , the second clamping portion 323 and the main body portion 321 are semi-surrounded to form a clamping space 324 .
  • the size and shape of the clamping space 324 is determined by the corresponding wafer carrier, and according to the shape of the wafer carrier Differently, the two clamping spaces 324 on the two clamping members 32 may be located on the same side of the respective main body portions 321 in the first direction A, or may be located on different sides. In some optional embodiments, please refer to FIG. 4 , the two clamping spaces 324 on the two clamping members 32 may be respectively located on different sides of the respective main body parts 321 in the first direction A, and the two clamping spaces 324 relative settings.
  • the clamping assembly 3 further includes a first detection device 325, and the first detection device 325 is disposed in the clamping space 324 for determining whether the edge of the wafer carrier is within a predetermined range.
  • the clamping space 324 can also be installed with a first detection device 325.
  • the first detection device 325 is used to determine whether the wafer carrier is located within a certain distance.
  • the first detection device 325 can be in the shape of a slot.
  • the optoelectronic and slot-shaped optoelectronics are embedded and installed in the clamping space 324 of the clamping member 32 , and will not affect the clamping effect of the clamping assembly 3 .
  • the robotic arm 1 drives the clamping member 32 to move to a position flush with the carrier. If the grooves in the clamping members 32 on both sides are photoelectrically induced to the edge above the carrier, the driving component 33 drives the two The clamping members 32 are close to each other to clamp the carrier. If the trough photoelectric does not sense the carrier at this time, it is necessary to change the height position or angular position of the clamping member 32 through the operation of the mechanical arm 1 or the plane precise positioning member 2 until the carrier is within the detection range of the trough photoelectric, and then The gripper 32 moves the gripping carrier. After the wafer moves to a specific position, the driving component 33 controls the two clamping members 32 to move away from the release carrier, and the robotic arm 1 drives the clamping members 32 to move. At this time, the slot photoelectricity cannot detect the presence of the carrier.
  • the driving assembly 33 further includes a second sliding connection member 333
  • the second sliding connection member 333 includes a second sliding member 3331 and a second guide rail 3332 which are used in cooperation with each other.
  • the second sliding member 3331 is connected to the clamping member 32
  • the second guide rail 3332 is connected to the clamping frame 31 or the driving member 331
  • the second guide rail 3332 extends along the first direction A to limit the movement track of the clamping member 32 .
  • the second guide rail 3332 can be a chute disposed on the outer peripheral side of the driving member 331 , or a strip-shaped protrusion, etc., which is not limited in this application, as long as the second sliding member 3331 and the second guide rail 3332 are satisfied. They can slide relative to each other, and the extending direction of the second guide rail 3332 can be parallel to the extending direction of the first guide rail 3322 .
  • the driving member 331 drives the two clamping members 32 to approach or move away from each other
  • the clamping member 32 drives the second sliding member 3331 to relatively slide along the second guide rail 3332.
  • the second guide rail 3332 acts as an auxiliary guide rail. It is used to limit the moving direction of the clamping member 32 and improve the reliability of the movement of the clamping member 32 .
  • the clamping assembly 3 further includes a conductive slip ring 34 , and the conductive slip ring 34 is disposed on the side of the clamping frame 31 close to the plane precision positioning member 2 and is electrically connected to the driving member 331 , to transmit external data to the driver 331 .
  • the clamping frame 31 is connected with the driven wheel 23 to realize synchronous movement, and the conductive slip ring 34 is arranged between the transmission frame 21 and the clamping frame 31 .
  • the clamping frame 31 will rotate relative to the transmission frame 21, and the driving member 331 needs to be connected with external equipment to realize control. Rotation at any angle can be realized.
  • the conductive slip ring 34 provided above the clamping frame 31 can realize the rotation at any angle, and the overall reliability of the clamping device can be enhanced.
  • the conductive slip ring 34 belongs to the application category of electrical contact and sliding connection. It is a precise power transmission device that realizes the image, data signal and power transmission of two relative rotating mechanisms, and is suitable for any continuous rotation.
  • the conductive slip ring 34 is mainly composed of two parts: the rotating part and the static part.
  • the rotating part is located at the center of the circle and rotates with the clamping frame 31;
  • the device is electrically connected.
  • the rotating part of the conductive slip ring 34 rotates relative to the stationary part, and the connection between the stationary part and the rotating part realizes data transmission by electric shock, so as to realize the effect of transmitting power or data from the fixed position to the rotating position.
  • the conductive slip ring 34 is provided with an insulating sheet on the conductive slip ring and an upper sealing cover on the conductive slip ring in sequence on the side close to the transmission frame 21 , and the conductive slip ring is laminated on the side close to the clamping frame 31 in sequence.
  • the transmission frame 21 is provided with a connection assembly 25 , and the robotic arm 1 is connected to the transmission frame 21 through the connection assembly 25 .
  • the connecting assembly 25 is located above the transmission frame 21 , that is, on the side away from the clamping frame 31 , the connecting assembly 25 includes a mechanical arm connecting piece 251 and a mechanical arm connecting reinforcement 252 , and the mechanical arm connecting piece 251 is connected with the mechanical arm
  • the reinforcing members 252 are provided with connecting holes, and the mechanical arm 1 is connected to the mechanical arm connecting member 251 and the mechanical arm connecting reinforcing member 252 by means of bolts or the like.
  • the robotic arm 1 includes a rotating shaft driving member, and the rotating shaft driving member drives the driving wheel 22 to rotate.
  • the rotating shaft driving member (not shown in the figure) is located inside the mechanical arm 1.
  • the rotating shaft driving member is the joint of the mechanical arm 1. When the joint of the mechanical arm 1 rotates, the driving wheel 22 is driven to transmit rotational power to make the clamping Component 3 rotates.
  • the clamping device further includes a second detection device 26 , which is disposed outside the transmission frame 21 and is used for detecting the position information of the plane precise positioning member 2 .
  • the second detection device 26 is disposed on the outer peripheral side of the transmission frame 21 , and the specific position of the second detection device 26 is not limited in the present application.
  • the second detection device 26 is used to detect the position information of the shelf or work station. When the corresponding shelf or work station appears within the detection range of the second detection device 26, the second detection device 26 transmits the position information to the external control system, and the control system Control the robot arm 1 to move and place the wafer carrier to the destination.
  • the clamping device has a modular design as a whole, which has the advantages of small size and low noise, and there is no hard friction inside the device, so it is not easy to generate particles, which can meet the requirements of wafer processing. required environmental requirements.
  • the transmission frame 21 is provided with a tensioning wheel 211 , and the tensioning wheel 211 is arranged in cooperation with the conveyor belt 24 .
  • the tensioning pulley 211 is arranged inside the transmission frame 21.
  • the conveyor belt 24 includes a curved portion and a flat portion. The curved portion is sleeved on the driving pulley 22 and the driven pulley 23. 24 to maintain tension.
  • a tension sensor 212 is further provided inside the transmission frame 21 , and the tension sensor 212 is arranged corresponding to the flat portion of the conveyor belt 24 for detecting the tension degree of the conveyor belt 24 .
  • the cooperating use of the wheel 211 ensures reliable transmission.
  • an embodiment of the present application provides a clamping device for a wafer carrier, which includes a robotic arm, a clamping component and a plane precise positioning member.
  • the clamping component is used for clamping the wafer carrier and is moved by the robotic arm. to a specific station.
  • the plane precise positioning member will adjust the deflection angle of the clamping component relative to the robotic arm according to the different placement angles of the wafer carrier on the station, thereby changing the clamping angle of the wafer carrier to meet the The use requirements in different situations, high reliability and flexibility.
  • the overall clamping device realizes a modular and motorized design, which has the advantages of small size and low noise, and can meet the environmental requirements required for wafer processing.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

一种晶圆载具的夹取装置，包括机械臂（1）、平面精准定位件（2）和夹持组件（3），平面精准定位件（2）连接于机械臂（1）与夹持组件（3）之间，机械臂（1）带动夹持组件（3）空间移动，平面精准定位件（2）包括传动架（21）、主动轮（22）、从动轮（23）和传送带（24），传动架（21）与机械臂（1）连接设置，主动轮（22）和从动轮（23）可转动地连接于传动架（21），传送带（24）连接主动轮（22）和从动轮（23）；夹持组件（3）包括夹持架（31）、两个夹持件（32）和驱动组件（33），夹持架（31）沿第一方向（A）延伸且固定于从动轮（23）设置，两个夹持件（32）在第一方向（A）上相对设置且可滑动地连接于夹持架（31），驱动组件（33）设置于夹持架（31）且驱动两个夹持件（32）靠近或远离。该夹取装置可以实现对晶圆载具的多角度夹持，满足不同情况下的使用要求。

Description

晶圆载具的夹取装置
相关申请的交叉引用
本申请要求享有于2021年3月19日提交的名称为“晶圆载具的夹取装置”的中国专利申请202120570882.0的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请属于半导体技术领域，尤其涉及一种晶圆载具的夹取装置。
背景技术
晶圆是指制作硅半导体电路所用的硅晶片，通常需要经过多道工序最终形成产品，在加工过程中，载具用于安放晶圆，夹取装置将载具运输至相应工位上。
现有的夹取装置通常以特定角度夹取载具，夹取装置自身灵活性不高，当载具位置发生偏移时，夹取装置与载具之间容易出现夹持力不足等问题，长时间使用会导致夹取装置与载具间出现相对滑动，影响夹持可靠性。
发明内容
本申请实施例的目的是提供一种晶圆载具的夹取装置，该夹取装置可以实现多角度夹持晶圆载具，灵活性强。
为此，本申请实施例提供了一种晶圆载具的夹取装置，包括机械臂、夹持组件和平面精准定位件，平面精准定位件连接于机械臂与夹持组件之间，机械臂带动夹持组件空间移动；平面精准定位件包括传动架、主动轮、从动轮和传送带，传动架与所机械臂连接设置，主动轮和从动轮可转动地连接于传动架，传送带连接主动轮和从动轮；夹持组件包括夹持架、两个夹持件和驱动组件，夹持架沿第一方向延伸且固定于从动轮设置，两个夹 持件在第一方向上相对设置且可滑动地连接于夹持架，驱动组件设置于夹持架且驱动两个夹持件靠近或远离。
根据本申请实施例的一个方面，驱动组件包括驱动件和第一滑动连接件，驱动件驱动第一滑动连接件滑动，两个夹持件通过第一滑动连接件与夹持架可滑动地连接；第一滑动连接件包括相互配合使用的第一滑动件和第一导轨，第一滑动件和第一导轨中的一者与夹持件连接，另一者与夹持架或驱动件连接。
根据本申请实施例的一个方面，第一滑动连接件包括相互平行的两个第一导轨和与两个第一导轨一一对应的两个第一滑动件，第一导轨沿第一方向延伸设置于驱动件，一个夹持件对应固定连接于一个第一滑动件，两个夹持件相互靠近和远离，以夹持或释放晶圆载具。
根据本申请实施例的一个方面，夹持件包括本体部、第一夹持部和第二夹持部，第一夹持部和第二夹持部在第一方向上位于本体部的同一侧且在夹持架的厚度方向上相互间隔预设距离设置，以形成夹持晶圆载具边沿的夹持空间。
根据本申请实施例的一个方面，夹持组件还包括第一探测装置，第一探测装置设置于夹持空间内，用于判断晶圆载具边沿是否位于预设范围内。
根据本申请实施例的一个方面，驱动组件还包括第二滑动连接件，第二滑动连接件包括相互配合使用的第二滑动件和第二导轨，第二滑动件与夹持件连接，第二导轨与夹持架或驱动件连接，第二导轨沿第一方向延伸，以限制夹持件的移动轨迹。
根据本申请实施例的一个方面，夹持组件还包括导电滑环，导电滑环设置于夹持架靠近平面精准定位件的一侧并与驱动件电连接，以将外部数据信号传递至驱动件。
根据本申请实施例的一个方面，机械臂包括转轴驱动件，转轴驱动件与主动轮连接，以驱动主动轮转动。
根据本申请实施例的一个方面，夹取装置还包括第二探测装置，第二探测装置设置于传动架的外部，用于探测平面精准定位件所处的位置信息。
根据本申请实施例的一个方面，传动架内设置有张紧轮，张紧轮与传 送带配合设置。
本申请实施例的一种晶圆载具的夹取装置，包括机械臂、夹持组件和平面精准定位件，夹持组件用于夹持晶圆载具，并通过机械臂移动至特定工位处，在夹取过程中，平面精准定位件会根据晶圆载具在工位上的放置角度的不同，调节夹持组件相对机械臂的偏转角度，进而改变对晶圆载具的夹持角度，满足不同情况下的使用要求，可靠性高，灵活性强。
附图说明
从下面结合附图对本申请的具体实施方式的描述中可以更好地理解本申请，其中，通过阅读以下参照附图对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显，相同或相似的附图标记表示相同或相似的特征。
图1是本申请实施例提供的晶圆载具的夹取装置的轴测图；
图2是本申请实施例提供的夹取装置的俯视图；
图3是本申请实施例提供夹取装置的仰视图；
图4是本申请实施例提供的夹持组件的内部结构图；
图5是本申请实施例提供的夹取装置另一视角的结构图；
图6是本申请实施例提供的夹取装置其他视角的结构图。
附图标记说明：
1、机械臂；
2、平面精准定位件；
21、传动架；
211、张紧轮；
212、张紧传感器；
22、主动轮；
23、从动轮；
24、传送带；
25、连接组件；
251、机械臂连接件；
252、机械臂连接加强件；
26、第二探测装置；
3、夹持组件；
31、夹持架；
32、夹持件；
321、本体部；
322、第一夹持部；
323、第二夹持部；
324、夹持空间；
325、第一探测装置；
33、驱动组件；
331、驱动件；
332、第一滑动连接件；
3321、第一滑动件；
3322、第一导轨；
333、第二滑动连接件；
3331、第二滑动件；
3332、第二导轨；
34、导电滑环；
A：第一方向。
具体实施方式
下面将详细描述本申请的各个方面的特征和示例性实施例，为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及具体实施例，对本申请进行进一步详细描述。应理解，此处所描述的具体实施例仅意在解释本申请，而不是限定本申请。对于本领域技术人员来说，本申请可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本申请的示例来提供对本申请更好的理解。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用 来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
请参考图1至图3，本申请实施例提供了一种晶圆载具的夹取装置，晶圆是指制作硅半导体电路所用的硅晶片，其原始材料是硅。高纯度的多晶硅溶解后掺入硅晶体晶种，然后慢慢拉出，形成圆柱形的单晶硅，硅晶棒在经过研磨，抛光，切片后，形成硅晶圆片，也就是晶圆。在晶圆加工过程中，晶圆往往需要通过载具实现夹持运输，其中，夹持组件3用于固定夹持晶圆载具，机械臂1用于运输晶圆载具。
夹取装置包括机械臂1、平面精准定位件2和夹持组件3，平面精准定位件2连接于机械臂1与夹持组件3之间，机械臂1带动夹持组件3空间移动。
平面精准定位件2包括传动架21、主动轮22、从动轮23和传送带24，传动架21与所机械臂1连接设置，主动轮22和从动轮23可转动地连接于传动架21，传送带24连接主动轮22和从动轮23。
夹持组件3包括夹持架31、两个夹持件32和驱动组件33，夹持架31沿第一方向A延伸且固定于从动轮23设置，两个夹持件32在第一方向A上相对设置且可滑动地连接于夹持架31，驱动组件33设置于夹持架31且驱动两个夹持件32靠近或远离。
本申请实施例提供的夹持架31用于安装夹持件32和驱动组件33，驱动组件33位于夹持架31内部并负责驱动夹持件32移动，夹持件32位于夹持架31的下方并且至少部分伸出夹持架31，两个夹持件32沿夹持架31的延伸方向相对设置，当需要对晶圆进行搬运时，驱动组件33控制两个夹持件32相对靠近并夹持晶圆载具，机械臂1用于带动夹持组件3和晶圆载 具移动至特定位置，然后驱动组件33控制两个夹持件32相对远离从而松开晶圆载具，晶圆到达特定工位并进行下一步加工。在一些可选实施例中，机械臂1可以带动夹持组件3在空间范围内多方位平移，例如在图1的空间直角坐标系中，机械臂1可以带动夹持组件3在XYZ三个方向中的任意两个方向平移，也可以做到同时满足三个方向移动的需要，对于机械臂1的可移动方向根据实际使用情况决定，本申请对此不进行限定。
平面精准定位件2包括传动架21、主动轮22、从动轮23和传送带24，传动架21与机械臂1相连接，主动轮22和从动轮23均位于传动架21内并与传动架21转动连接，传送带24套设在主动轮22和从动轮23上，起到传递运动的作用。在一些可选实施例中，主动轮22和从动轮23为齿轮，传送带24上对应设置有相应齿条，进而保证传动可靠性。
本申请实施例提供的一种晶圆载具的夹取装置，根据晶圆载具的实际位置情况的不同，主动轮22在外力的作用下进行转动，并通过传送带24带动从动轮23一起转动，夹持架31随从动轮23一起同步运动，带动两个夹持件32同时转动特定角度，从而满足夹持需要。本实施例中的机械臂1借助平面精准定位件2带动夹持组件3在空间范围内移动，而夹持组件3可相对平面精准定位件2任意偏转，从而实现多角度灵活夹持，满足实际夹取运输需要。
在一些其他实施例中，驱动组件33包括驱动件331和第一滑动连接件332，驱动件331驱动第一滑动连接件332滑动，两个夹持件32通过第一滑动连接件332与夹持架31可滑动地连接；第一滑动连接件332包括相互配合使用的第一滑动件3321和第一导轨3322，第一滑动件3321和第一导轨3322中的一者与夹持件32连接，另一者与夹持架31或驱动件331连接。
驱动件331通过螺栓等方式固定安装在夹持架31内部，第一导轨3322与第一滑动件3321滑动连接以带动夹持件32运动。第一导轨3322可以安装于驱动件331靠近夹持件32的一侧，也可以安装于夹持架31靠近夹持件32的一端，并且第一导轨3322既可以为滑槽结构，也可以为条状凸起结构等，本申请对此均不作限定。并且第一导轨3322的数量可以为一条或两条，当只有一条第一导轨3322时，两个第一滑动件3321位于同一条第 一导轨3322上。当第一导轨3322为两条时，两条第一导轨3322并排设置，两个第一滑动件3321位于不同的第一导轨3322上。
在一些可选实施例中，请参阅图3和图4，第一滑动连接件332包括相互平行的两个第一导轨3322和与两个第一导轨3322对应的两个第一滑动件3321，第一导轨3322沿第一方向A延伸设置于驱动件331，一个夹持件32对应固定连接于一个第一滑动件3321，两个夹持件32相互靠近或远离，以夹持或释放晶圆载具。第一导轨3322为两条相互平行且沿第一方向A延伸的滑槽结构，第一导轨3322位于驱动件331靠近夹持件32的一侧，两个第一滑动件3321分别与两条第一导轨3322滑动连接，且分别与两个夹持件32固定连接，驱动件331通过第一滑动件3321带动夹持件32相互靠近或者远离。
在一些可选实施例中，驱动件331可以为伺服电机与斜齿轮的组合，两个第一滑动件3321的相对表面上均设有与斜齿轮相匹配的齿条，伺服电机工作驱动斜齿轮运动，斜齿轮与第一滑动件3321上的齿条啮合传动，从而带动两个第一滑动件3321分别在第一导轨3322上沿相反方向运动。两个第一滑动件3321分别与不同夹持件32相连接，第一滑动件3321与夹持件32之间的连接方式可以为螺栓连接，驱动件331通过带动第一滑动件3321移动从而使得两个夹持件32相互靠近或者远离，实现对晶圆载具的夹取放置。
在一些其他实施例中，夹持件32包括本体部321、第一夹持部322和第二夹持部323，第一夹持部322和第二夹持部323在第一方向A上位于本体部321的同一侧且在夹持架31的厚度方向上相互间隔预设距离设置，以形成夹持晶圆载具边沿的夹持空间324。
第一夹持部322与第二夹持部323分别与本体部321固定连接，第一夹持部322和第二夹持部323在第一方向A上位于本体部321的同一侧，在一些可选实施例中，第一夹持部322与第二夹持部323相互平行，并且均与本体部321垂直设置，第一夹持部322可以与本体部321一体成型，第二夹持部323也可以与本体部321一体成型。第一夹持部322、第二夹持部323及本体部321半包围形成夹持空间324，夹持空间324的尺寸形状由 相对应的晶圆载具决定，并且根据晶圆载具的形状不同，两个夹持件32上的两个夹持空间324可以分别位于各自本体部321在第一方向A上的同一侧，也可以位于异侧。在一些可选实施例中，请参考图4，两个夹持件32上的两个夹持空间324可以分别位于各自本体部321在第一方向A上的不同侧，并且两个夹持空间324相对设置。
在一些其他实施例中，夹持组件3还包括第一探测装置325，第一探测装置325设置于夹持空间324内，用于判断晶圆载具的边沿是否位于预设范围内。夹持空间324除了用于夹持晶圆载具外还可以安装第一探测装置325，第一探测装置325用于判断晶圆载具是否位于特定距离内，第一探测装置325可以为槽形光电，槽形光电嵌入安装在夹持件32的夹持空间324内，不会对夹持组件3的夹取效果产生影响。当夹取装置工作时，机械臂1带动夹持件32移动至与载具平齐位置，若两侧夹持件32中的槽形光电感应到载具上方的边沿，则驱动组件33带动两个夹持件32相互靠近夹取载具。若槽形光电此时未感应到载具，则需要通过机械臂1或平面精准定位件2工作改变夹持件32的高度位置或角度位置，直至载具处于槽型光电的探测范围内，然后夹持件32移动夹取载具。晶圆移动至特定位置后，驱动组件33控制两个夹持件32远离松开载具，机械臂1带动夹持件32移动，此时槽型光电无法侦测到载具存在。
在一些其他实施例中，驱动组件33还包括第二滑动连接件333，第二滑动连接件333包括相互配合使用的第二滑动件3331和第二导轨3332。第二滑动件3331与夹持件32连接，第二导轨3332与夹持架31或驱动件331连接，第二导轨3332沿第一方向A延伸，以限制夹持件32的移动轨迹。
请参考图4，第二导轨3332可以为设置在驱动件331外周侧的滑槽，也可以为条状凸起等，本申请对此不作限定，只要满足第二滑动件3331与第二导轨3332之间可相对滑动，并且第二导轨3332的延伸方向与第一导轨3322的延伸方向平行即可。驱动件331带动两个夹持件32相互靠近或远离时，夹持件32带动第二滑动件3331沿第二导轨3332上相对滑动，在这个过程中第二导轨3332起到辅助导轨的作用，用于对夹持件32的移动方向起到限位作用，提高夹持件32运动的可靠性。
在一些其他实施例中，请参考图5，夹持组件3还包括导电滑环34，导电滑环34设置于夹持架31靠近平面精准定位件2的一侧并与驱动件331电连接，以将外部数据传递至驱动件331。
夹持架31与从动轮23相连接并实现同步运动，导电滑环34设置在传动架21与夹持架31之间。夹取装置工作时，夹持架31会相对传动架21发生转动，驱动件331则需要与外界设备连接实现控制，若采用常规电缆连接方式，在使用过程中电缆容易出现弯折等问题，无法实现任意角度的旋转，在本实施例中，通过在夹持架31上方设置的导电滑环34可以实现任意角度的旋转，并且增强夹取装置整体可靠性。
导电滑环34属于电接触滑动连接应用范畴，是实现两个相对转动机构的图像、数据信号及动力传递的精密输电装置，适用于任意连续旋转。导电滑环34主要由旋转和静止两大部分组成，旋转部分位于圆心部位并随夹持架31一起转动，静止部分位于旋转部分的外周侧并与传动架21固定连接，静止部分通过导线与外接设备电连接。夹取装置工作过程中，导电滑环34的旋转部分相对静止部分发生旋转，静止部分与旋转部分之间通过连接触电实现数据传输，从而实现固定位置到旋转位置传送功率或数据的效果。
在本实施例中，导电滑环34靠近传动架21的一侧依次层叠设置有导电滑环上绝缘片和导电滑环上密封盖，靠近夹持架31的一侧依次层叠设置有导电滑环下绝缘片和导电滑环下密封盖。
在一些其他实施例中，传动架21上设置有连接组件25，机械臂1通过连接组件25与传动架21连接。请参阅图5，连接组件25位于传动架21的上方即远离夹持架31的一侧，连接组件25包括机械臂连接件251和机械臂连接加强件252，机械臂连接件251与机械臂连接加强件252上均设置有连接孔，机械臂1与通过螺栓等方式与机械臂连接件251、机械臂连接加强件252相连接。
在一些其他实施例中，机械臂1包括转轴驱动件，转轴驱动件驱动主动轮22转动。转轴驱动件(图中未示出)位于机械臂1内部，在一些可选实施例中，转轴驱动件为机械臂1关节，机械臂1关节旋转时通过带动主 动轮22传递旋转动力使得夹持组件3旋转。
在一些其他实施例中，请参阅图6，夹取装置还包括第二探测装置26，第二探测装置26设置于传动架21的外部，用于探测平面精准定位件2所处的位置信息。第二探测装置26设置在传动架21的外周侧，本申请对第二探测装置26的具体位置不作限定。第二探测装置26用于探测货架或工位的位置信息，当第二探测装置26的探测范围内出现相应的货架或工位，第二探测装置26将位置信息传递至外部控制系统，控制系统控制机械臂1运动并将晶圆载具放置到目的地。
本实施例中的所有设备均通过电动方式实现控制，夹取装置整体实现模块化设计，具有体积小和噪音小等优点，并且装置内部不存在硬摩擦，因此不易产生颗粒物，可以满足晶圆加工所需的环境要求。
在一些其他实施例中，请参阅图6，传动架21内设有张紧轮211，张紧轮211与传送带24配合设置。张紧轮211设置在传动架21内部，传送带24包括弯曲部和平铺部，弯曲部套设在主动轮22和从动轮23上，张紧轮211与传送带24平铺部对应设置，以保证传送带24时刻保持张紧状态。在一些可选实施例中，传动架21内部还设有张紧传感器212，张紧传感器212与传送带24平铺部对应设置，用于检测传送带24的张紧程度，张紧传感器212与张紧轮211配合使用确保传动可靠。
由此，本申请实施例提供了一种晶圆载具的夹取装置，包括机械臂、夹持组件和平面精准定位件，夹持组件用于夹持晶圆载具，并通过机械臂移动至特定工位处。在夹取过程中，平面精准定位件会根据晶圆载具在工位上的放置角度的不同，调节夹持组件相对机械臂的偏转角度，进而改变对晶圆载具的夹持角度，满足不同情况下的使用要求，可靠性高，灵活性强。另外，夹取装置整体实现模块化和电动化设计，具有体积小和噪音小等优点，可以满足晶圆加工所需的环境要求。
本领域技术人员应能理解，上述实施例均是示例性而非限制性的。在不同实施例中出现的不同技术特征可以进行组合，以取得有益效果。本领域技术人员在研究附图、说明书及权利要求书的基础上，应能理解并实现所揭示的实施例的其他变化的实施例。在权利要求书中，术语“包括”并 不排除其他装置或步骤；物品没有使用数量词修饰时旨在包括一个/种或多个/种物品，并可以与“一个/种或多个/种物品”互换使用”；术语“第一”、“第二”用于标示名称而非用于表示任何特定的顺序。权利要求中的任何附图标记均不应被理解为对保护范围的限制。权利要求中出现的多个部分的功能可以由一个单独的硬件或软件模块来实现。某些技术特征出现在不同的从属权利要求中并不意味着不能将这些技术特征进行组合以取得有益效果。

Claims (10)

  1. 一种晶圆载具的夹取装置，包括机械臂、夹持组件和平面精准定位件，所述平面精准定位件连接于所述机械臂与所述夹持组件之间，所述机械臂带动所述夹持组件空间移动；
    所述平面精准定位件包括传动架、主动轮、从动轮和传送带，所述传动架与所述机械臂连接设置，所述主动轮和所述从动轮可转动地连接于所述传动架，所述传送带连接所述主动轮和所述从动轮；
    所述夹持组件包括夹持架、两个夹持件和驱动组件，所述夹持架沿第一方向延伸且固定于所述从动轮设置，两个所述夹持件在所述第一方向上相对设置且可滑动地连接于所述夹持架，所述驱动组件设置于所述夹持架且驱动两个所述夹持件靠近或远离。
  2. 根据权利要求1所述的夹取装置，其中，所述驱动组件包括驱动件和第一滑动连接件，所述驱动件驱动所述第一滑动连接件滑动，两个所述夹持件通过所述第一滑动连接件与所述夹持架可滑动地连接；
    所述第一滑动连接件包括相互配合使用的第一滑动件和第一导轨，所述第一滑动件和所述第一导轨中的一者与所述夹持件连接，另一者与所述夹持架或所述驱动件连接。
  3. 根据权利要求2所述的夹取装置，其中，所述第一滑动连接件包括相互平行的两个所述第一导轨和与两个所述第一导轨一一对应的两个所述第一滑动件；
    所述第一导轨沿所述第一方向延伸设置于所述驱动件，一个所述夹持件对应固定连接于一个所述第一滑动件，两个所述夹持件相互靠近和远离，以夹持或释放晶圆载具。
  4. 根据权利要求2所述的夹取装置，其中，所述夹持件包括本体部、第一夹持部和第二夹持部，所述第一夹持部和所述第二夹持部在所述第一方向上位于所述本体部的同一侧且在所述夹持架的厚度方向上相互间隔预设距离设置，以形成夹持晶圆载具边沿的夹持空间。
  5. 根据权利要求4所述的夹取装置，其中，所述夹持组件还包括第一探测装置，所述第一探测装置设置于所述夹持空间内，用于判断所述晶圆载具边沿是否位于预设范围内。
  6. 根据权利要求2所述的夹取装置，其中，所述驱动组件还包括第二滑动连接件，所述第二滑动连接件包括相互配合使用的第二滑动件和第二导轨，所述第二滑动件与所述夹持件连接，所述第二导轨与所述夹持架或所述驱动件连接，所述第二导轨沿所述第一方向延伸，以限制所述夹持件的移动轨迹。
  7. 根据权利要求2所述的夹取装置，其中，所述夹持组件还包括导电滑环，所述导电滑环设置于所述夹持架靠近所述平面精准定位件的一侧并与所述驱动件电连接，以将外部数据信号传递至所述驱动件。
  8. 根据权利要求1所述的夹取装置，其中，所述机械臂包括转轴驱动件，所述转轴驱动件与所述主动轮连接，以驱动所述主动轮转动。
  9. 根据权利要求1所述的夹取装置，还包括第二探测装置，所述第二探测装置设置于所述传动架的外部，用于探测所述平面精准定位件所处的位置信息。
  10. 根据权利要求1所述的夹取装置，其中，所述传动架内设有张紧轮，所述张紧轮与所述传送带配合设置。
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CN116605643A (zh) * 2023-04-19 2023-08-18 深圳市桃子自动化科技有限公司 机械抓手及上料装置
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CN117558676A (zh) * 2023-12-28 2024-02-13 苏州赛腾精密电子股份有限公司 晶圆的检测夹持设备
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CN116525531B (zh) * 2023-07-05 2023-09-15 深圳光远智能装备股份有限公司 一种应用于电池片高密度焊带的夹持机构及串焊装置
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CN117565098A (zh) * 2023-12-01 2024-02-20 睿尔曼智能科技（北京）有限公司 一种电动夹爪和机械臂
CN117565098B (zh) * 2023-12-01 2024-05-10 睿尔曼智能科技（北京）有限公司 一种电动夹爪和机械臂
CN117542790A (zh) * 2023-12-28 2024-02-09 苏州赛腾精密电子股份有限公司 晶圆的检测治具
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