CN115565931A - 一种用于半导体晶圆的自动翻转装置 - Google Patents

一种用于半导体晶圆的自动翻转装置 Download PDF

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CN115565931A
CN115565931A CN202211227822.4A CN202211227822A CN115565931A CN 115565931 A CN115565931 A CN 115565931A CN 202211227822 A CN202211227822 A CN 202211227822A CN 115565931 A CN115565931 A CN 115565931A
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张贤龙
刘恩龙
马刚
乐佳浩
曹洁
董怀宝
张山伟
王晨旭
曲泉铀
武一鸣
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Shanghai Guangchuan Technology Co ltd
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Abstract

本发明涉及机械制造的技术领域,公开了一种用于半导体晶圆的自动翻转装置,其特征在于:包括旋转机构,设置在基座上,用于带动夹持机构连同晶圆在0‑180度之间转动;夹持机构,与旋转机构相连,采用气动驱动,用于夹持或者释放晶圆;限位检测机构,设置在旋转机构的旁边,用于对旋转机构的0度位置和180度位置进行限位和检测。整个装置结构简单,组装简单,维护难度低,便于推广应用。

Description

一种用于半导体晶圆的自动翻转装置
技术领域
本发明涉及机械制造的技术领域,具体涉及一种用于半导体晶圆的自动翻转装置。
背景技术
随着集成电路半导体晶圆运输、制造以及封装等高端技术的迅猛发展,对应用于这些领域的半导体工艺设备提出了更高的技术要求。
作为半导体工艺设备整套系统中的一个集成子系统,EFEM(Equipment Front EndModule半导体设备前端模块)主要应用于半导体晶圆的人工或自动上下料,是将晶圆从大气状态搬送到真空工艺腔室内的过渡模块,主要和半导体工艺设备对接,通常由上料装置、半导体机器人、预对准装置、过滤器单元、自动翻转装置等主要部件组成。因此,半导体工艺设备整套系统的产能不仅受到工艺设备自身产能的影响,还受到设备的产能影响。
通常来说,半导体晶圆在进入工艺设备前,需要对半导体晶圆进行双面检查以及调整正反面进入,如果自动翻转装置不能快速、精确的翻转晶圆,会严重影响设备的产能及质量进而影响半导体工艺设备整套系统的产能及质量。
目前行业内主要采用中空马达实现晶圆的翻转,该技术方案在实际使用过程中,发现存在以下问题没有得到很好的解决:
1.中空马达多集成有步进电机,其控制精度不高,时常需要重新校零才能实时检测位置;
2.仅能实现两个控制角度,无法灵活多样性的控制翻转位置及速度;
3.由于采用中空马达,能穿过的线缆及气管局限于中空马达的中心孔大小。
发明内容
本发明提供了一种用于半导体晶圆的自动翻转装置,。
本发明可通过以下技术方案实现:
一种用于半导体晶圆的自动翻转装置,包括
旋转机构,设置在基座上,用于带动夹持机构连同晶圆在0-180度之间转动;
夹持机构,与旋转机构相连,采用气动驱动,用于夹持或者释放晶圆;
限位检测机构,设置在旋转机构的旁边,用于对旋转机构的0度位置和180度位置进行限位和检测。
进一步,所述基座包括底板,在所述底板上设置有中空的方体,在所述方体的内部设置有旋转机构、限位检测机构,其中一个侧板上设置有通孔,所述夹持机构设置在方体的外侧,经由通孔与旋转机构相连,在所述方体的另一个侧板设置有多个气动接口、电气接口、转速调节旋钮、气动阀门。
进一步,所述旋转机构包括电动机,所述电动机的输出轴与主动带轮相连,所述主动带轮通过皮带与从动带轮相连,所述从动带轮的中心孔与传动轴配合,所述传动轴的一个端部穿过通孔与夹持机构相连,所述电动机用于带动主动带轮转动,经由皮带带动从动带轮连同传动轴转动,从而带动夹持机构转动。
进一步,所述限位检测机构设置在从动带轮旁边,包括设置从动带轮上的L形检测片,两者同步转动,在所述从动带轮两侧的0度和180度位置各设置一个U形光电传感器,每个所述U形光电传感器均通过安装座设置在从动带轮的旁边,其U形检测端与L形检测片的短边配合,所述安装座与L形检测片的长边配合。
进一步,所述安装座设置在在方体的其中一个侧板上,两者的连接位置设置有多个长腰型的调节通孔。
进一步,所述电动机通过安装板能够拆卸地设置在方体的其中一个侧板上,两者的连接位置设置有多个长腰型的调节通孔。
进一步,在所述底板上设置有多个长腰型的调节通孔。
本发明有益的技术效果在于:
1.采用独立结构的电动机作为旋转机构的驱动器,较中空马达来说,适应性更强,可生产工艺的实际需要控制夹持机构转动至0至180度之间的任意角度,应用范围更广,并且无需类似步进电机的频率校零操作,简化操作流程,提高半导体晶圆自动翻转的位置控制精度;
2.为了避免夹持机构的转动干涉,夹持机构的驱动气管需隐藏延伸至基座内部,借助中空的传动轴结构,可以提供很好的延伸通道,并且可以根据实际需要适当调整传动轴的直径大小,来适应不同外径的气管。
本发明兼容性强,控制方式灵活,调节方便,适用行业范围广泛,即可应用于IC行业,也可应用于LED等其他泛半导体行业。
附图说明
图1为本发明的总体结构示意图;
图2为本发明的基座结构示意图;
图3为本发明的旋转机构的结构示意图;
其中,1-基座,101-底板,102-方体,103-通孔,2-夹持机构,3-电动机,4-主动带轮,5-皮带,6-从动带轮,7-安装板,8-L形检测片8,9-U形光电传感器。
具体实施方式
下面结合附图及较佳实施例详细说明本发明的具体实施方式。
如图1-3所示,本发明提供了一种用于半导体晶圆的自动翻转装置,包括旋转机构,设置在基座1上,用于带动夹持机构2连同晶圆在0-180度之间转动;夹持机构2,与旋转机构相连,采用气动驱动,用于夹持或者释放晶圆;限位检测机构,设置在旋转机构的旁边,用于对旋转机构的0度位置和180度位置进行限位和检测。这样,借助旋转机构带动夹持机构连同晶圆在0-180度之间转动,可以精确地控制晶圆的任意转动角度,实现对晶圆的灵活控制,满足更多的作业需求,同时在0度位置和180度位置设置有限位监测机构,以便对特定位置进行监测,为其他转动角度提供依据,确保晶圆快速检测工作的准确顺利进行,提高了作业效率和工艺流程的稳定性。
具体如下:
该基座1包括底板101,在底板101上设置有中空的方体102,在方体102的内部设置有旋转机构、限位检测机构,其中一个侧板上设置有通孔103,该夹持机构2设置在方体102的外侧,经由通孔103与旋转机构相连,在方体102的另一个侧板设置有多个气动接口、电气接口、转速调节旋钮、气动阀门,这样通过方体102的另一个侧板上的这些连接接口,实现与旋转机构、限位检测机构和夹持机构2的电路、气路的连接和控制,操作更加方便,同时为了适应晶圆的位置调结,我们可以在底板上多个长腰型的调节通孔,方便基座的位置调整。
另外,基座1采用中空的方体结构,还可以提供更多的空间用来放置各种线缆、控制电路板以及采用气动驱动的夹持机构的气管等等。
该旋转机构包括电动机3,该电动机3可采用伺服电机,其输出轴与主动带轮4相连,该主动带轮4通过皮带5与从动带轮6相连,该从动带轮6的中心孔与传动轴配合,该传动轴的一个端部穿过方体上的通孔103与夹持机构2相连,该电动机3用于带动主动带轮4转动,经由皮带5带动从动带轮6连同传动轴转动,从而带动夹持机构2转动。该皮带5可以采用同步带结构,具体的节距设置根据实际转速控制的精度而定,而且带齿牙的同步带驱动可以减少打滑,提高旋转机构的控制精度。
为了安装需求,我们可以将电动机3安装在带有通孔13的侧板上,然后通过上述皮带式的传动机构实现对夹持机构的转动控制,同时,为了调节主动带轮4和从动带轮6之间距离以改变皮带的张紧度,在电动机3和侧板的安装位置设置有安装板,先将电动机3安装在安装板7上,在将安装板7安装在侧板上,可以通过在安装板7上设置多个长腰型的调节通孔,以满足电动机3的位置调节需要即主动带轮4和从动带轮6之间的距离调节需要。
为了方便气动式的夹持机构2的驱动结构布置,我们可以将传动轴设置成中空结构,方便驱动气管通过延伸至基座内部,而传动轴的直径大小可以依据旋转机构本身、夹持机构所需空间综合考量,较中空马达的适应性更强,实用性更好。
该限位检测机构设置在从动带轮6旁边,包括设置从动带轮6上的L形检测片8,两者同步转动,在从动带轮6两侧的0度位置和180度位置各设置一个U形光电传感器9,当然可以仅要求光电传感器的检测端为U形结构,每个U形光电传感器9均通过安装座设置在从动带轮6的旁边,其U形检测端与L形检测片8的短边配合,该安装座与L形检测片8的长边配合。这样,随着L形检测片8跟着从动带轮6一同转动,转动到0度或者180度时,L形检测片8的短边插入U形光电传感器9的U形检测端,阻隔了光电传感器之间的光路传输,使得传感器输出检测信号,控制电动机开始制动,同时L形检测片的长边会抵在安装座上,限定了L形检测片8的继续转动即限定从动带轮6的转动,起到了限位作用。
虽然以上描述了本发明的具体实施方式,但是本领域的技术人员应当理解,这些仅是举例说明,在不背离本发明的原理和实质的前提下,可以对这些实施方式做出多种变更或修改,因此,本发明的保护范围由所附权利要求书限定。

Claims (7)

1.一种用于半导体晶圆的自动翻转装置,其特征在于:包括
旋转机构,设置在基座上,用于带动夹持机构连同晶圆在0-180度之间转动;
夹持机构,与旋转机构相连,采用气动驱动,用于夹持或者释放晶圆;
限位检测机构,设置在旋转机构的旁边,用于对旋转机构的0度位置和180度位置进行限位和检测。
2.根据权利要求1所述的用于半导体晶圆的自动翻转装置,其特征在于:所述基座包括底板,在所述底板上设置有中空的方体,在所述方体的内部设置有旋转机构、限位检测机构,其中一个侧板上设置有通孔,所述夹持机构设置在方体的外侧,经由通孔与旋转机构相连,在所述方体的另一个侧板设置有多个气动接口、电气接口、转速调节旋钮、气动阀门。
3.根据权利要求2所述的用于半导体晶圆的自动翻转装置,其特征在于:所述旋转机构包括电动机,所述电动机的输出轴与主动带轮相连,所述主动带轮通过皮带与从动带轮相连,所述从动带轮的中心孔与传动轴配合,所述传动轴的一个端部穿过通孔与夹持机构相连,所述电动机用于带动主动带轮转动,经由皮带带动从动带轮连同传动轴转动,从而带动夹持机构转动。
4.根据权利要求3所述的用于半导体晶圆的自动翻转装置,其特征在于:所述限位检测机构设置在从动带轮旁边,包括设置从动带轮上的L形检测片,两者同步转动,在所述从动带轮两侧的0度和180度位置各设置一个U形光电传感器,每个所述U形光电传感器均通过安装座设置在从动带轮的旁边,其U形检测端与L形检测片的短边配合,所述安装座与L形检测片的长边配合。
5.根据权利要求4所述的用于半导体晶圆的自动翻转装置,其特征在于:所述安装座设置在在方体的其中一个侧板上,两者的连接位置设置有多个长腰型的调节通孔。
6.根据权利要求3所述的用于半导体晶圆的自动翻转装置,其特征在于:所述电动机通过安装板能够拆卸地设置在方体的其中一个侧板上,两者的连接位置设置有多个长腰型的调节通孔。
7.根据权利要求2所述的用于半导体晶圆的自动翻转装置,其特征在于:在所述底板上设置有多个长腰型的调节通孔。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116453999A (zh) * 2023-03-28 2023-07-18 上海广川科技有限公司 一种用于半导体晶圆传输系统的自动翻转校正装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116453999A (zh) * 2023-03-28 2023-07-18 上海广川科技有限公司 一种用于半导体晶圆传输系统的自动翻转校正装置
CN116453999B (zh) * 2023-03-28 2024-03-22 上海广川科技有限公司 一种用于半导体晶圆传输系统的自动翻转校正装置

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