WO2022188385A1 - 一种晶圆位置检测装置 - Google Patents

一种晶圆位置检测装置 Download PDF

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Publication number
WO2022188385A1
WO2022188385A1 PCT/CN2021/118651 CN2021118651W WO2022188385A1 WO 2022188385 A1 WO2022188385 A1 WO 2022188385A1 CN 2021118651 W CN2021118651 W CN 2021118651W WO 2022188385 A1 WO2022188385 A1 WO 2022188385A1
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WO
WIPO (PCT)
Prior art keywords
top cover
wafer
fluid
mounting seat
fluid pressure
Prior art date
Application number
PCT/CN2021/118651
Other languages
English (en)
French (fr)
Inventor
徐枭宇
Original Assignee
杭州众硅电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 杭州众硅电子科技有限公司 filed Critical 杭州众硅电子科技有限公司
Priority to US18/280,677 priority Critical patent/US20240145279A1/en
Priority to EP21929850.2A priority patent/EP4307353A1/en
Priority to KR1020237030677A priority patent/KR20230144593A/ko
Priority to JP2023553932A priority patent/JP2024508183A/ja
Publication of WO2022188385A1 publication Critical patent/WO2022188385A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Definitions

  • the present invention relates to the field of semiconductor processing equipment, and more particularly, to a wafer position detection device.
  • CMP planarization equipment require real-time detection of wafer position. For example, during the polishing process, the wafer is first placed on the wafer stage by the robot, and when it is detected that the wafer is placed in the designated station, the polishing head will take the wafer from the wafer stage for polishing. After polishing the wafer, the polishing head will put the wafer back on the stage, and the wafer will be transferred to the cleaning unit by the robot. During this process, if the wafer is not properly placed on the wafer due to the shaking during the movement of the wafer stage or the shaking of the robot during transmission, it will lead to failure of picking and placing the wafer or even chipping of the wafer.
  • the existing technical solutions for detecting wafers generally use indirect detection of sensors with lever brakes distributed in the circumferential direction of the wafer.
  • the signal of the sensors is different, which is used as the basis for judgment. Parts friction will produce impurities (Particles), the structure is complex, the brake lever is easy to scratch the surface of the wafer, installation and maintenance are difficult, and the indirect detection accuracy will be affected;
  • optical The direct detection of this kind of sensor is not suitable for the process technology that is sensitive to light (such as copper technology); at the same time, there are polishing liquid and droplet splashing in the working environment, and the optical sensor is prone to false alarm.
  • the purpose of the present invention is to provide a wafer position detection device, so as to solve the problems that indirect detection sensors are prone to produce defects on the wafer surface, affect the yield, and the application range of direct detection sensors is limited.
  • the present invention provides the following technical solutions:
  • a wafer position detection device comprising:
  • a trigger assembly arranged on the mounting seat includes a top cover protruding from the surface of the mounting seat to support the wafer, and a fluid inside the hollow cavity formed by the inner wall of the top cover delivery pipeline, when the top cover is provided with wafers, the top cover can move in a direction close to the fluid delivery pipeline to block the fluid delivery port of the fluid delivery pipeline; when the top cover When the wafer is not set on the top cover, under the action of fluid pressure, the top cover can move in a direction away from the fluid delivery pipeline and conduct the fluid delivery port of the fluid delivery pipeline;
  • the fluid pressure detection component is connected to the control device and detects the fluid pressure of the fluid delivery pipeline.
  • the mounting seat is provided with a mounting groove for mounting the top cover, and a surface of the mounting groove is provided with a pressure for limiting the movement of the top cover away from the fluid conveying pipeline. cover.
  • a bar-shaped guide groove for linearly guiding the movement of the top cover is provided on the circumferential side wall of the installation groove, and the bar-shaped guide groove is arranged parallel to the centerline direction of the installation groove;
  • the top cover is provided with guide protrusions for matching with the strip guide grooves.
  • an output hole is provided on the mounting seat to discharge the fluid in the hollow cavity; the output hole is provided on the bottom wall of the mounting groove and penetrates all the way away from the top cover. the mount described above.
  • the fluid delivery line comprises:
  • An input pipeline is connected with the nozzle at one end and the fluid power source at the other end.
  • the mounting seat is provided with a mounting through hole for mounting the nozzle, the mounting through hole penetrates along the thickness direction of the mounting seat, the mounting through hole is provided with an internal thread, and the nozzle is provided with an external thread that cooperates with the internal thread.
  • control device includes:
  • a fluid pressure judgment unit used for judging whether the fluid pressure value detected by the fluid pressure detection component is equal to the first preset pressure value, and if so, sending current wafer alignment reminder information; judging the fluid pressure detected by the fluid pressure detection component Whether the pressure value is equal to the second preset pressure value, if so, send a reminder message that there is no wafer in the current station, the first preset pressure value is greater than the second preset pressure value; determine that the fluid pressure detection component detects Whether the fluid pressure value is greater than the second preset pressure value and less than the first preset pressure value, and if so, send a reminder message that the current wafer is not set up.
  • the top cover is a spherical top cover.
  • the number of groups of the triggering components is several groups, and all the triggering components are evenly arranged on the mounting seat.
  • the three groups of the trigger assemblies are symmetrically arranged along the center of the mounting seat, and the fluid delivery pipelines of the three groups of the trigger assemblies are respectively connected with one group of the fluid pressure detection assemblies .
  • the wafer position detection device includes a mounting seat; a trigger assembly arranged on the mounting seat, the trigger assembly includes a top cover protruding from the surface of the mounting seat to support the wafer, and an inner wall formed
  • the fluid delivery pipeline in the hollow cavity when the top cover is provided with a wafer, the top cover can move in the direction close to the fluid delivery pipeline to block the fluid delivery port of the fluid delivery pipeline; when the top cover is not provided with a crystal When it is round, the top cover can move the fluid delivery port of the fluid delivery pipeline in the direction away from the fluid delivery pipeline under the action of the fluid pressure; it is connected with the control device to detect the fluid pressure of the fluid delivery pipeline.
  • the application of the wafer position detection device provided by the present invention has the following technical effects:
  • the fluid pressure detection component indirectly contacts the wafer through the top cover, and indirectly detects the position of the wafer.
  • the fluid pressure detection component does not need to directly contact the wafer, preventing direct contact
  • the problem is that defects on the surface of the wafer affect the yield; compared with optical sensors, it can realize the in-position detection of light-sensitive wafers, has a wide range of applications, and improves the versatility of the device;
  • the alignment of the wafer is judged, and the position of the subsequent wafer can be determined according to the pressure value of the fluid pressure detection component at different positions. adjustment for guidance;
  • the top of the top cover is a spherical arc surface, which is in point contact with the wafer plane, reducing the contact area between the two and preventing impurities from being stored between the top cover and the wafer; When impurities are present, the scratch area caused by relative slip is reduced, and the yield is further improved;
  • FIG. 1 is a schematic diagram of the appearance structure of a wafer position detection device provided by an embodiment of the present invention
  • Fig. 2 is the partial sectional structure schematic diagram of Fig. 1;
  • FIG. 3 is a schematic diagram of an installation structure of a wafer and a wafer position detection device according to an embodiment of the present invention
  • Fig. 4 is the partial sectional structure schematic diagram of Fig. 3;
  • FIG. 5 is a schematic diagram of a position structure of a trigger component provided by an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a position where the wafer and the mounting seat are not aligned according to an embodiment of the present invention
  • FIG. 7 is a schematic diagram of the axonometric structure of FIG. 6 .
  • Top cover 1 nozzle 2
  • water pressure sensor 3 mounting seat 4
  • press cover 5 wafer 6.
  • the embodiment of the present invention discloses a wafer position detection device, so as to solve the problem of defects on the wafer surface caused by the direct contact of the sensor, which affects the yield.
  • FIG. 1 is a schematic diagram of the appearance structure of a wafer position detection device provided by an embodiment of the present invention
  • FIG. 2 is a schematic partial cross-sectional structure diagram of FIG. 1
  • FIG. 3 is a schematic diagram of a wafer provided by an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a partial cross-sectional structure of FIG. 3 ;
  • FIG. 5 is a schematic diagram of a position structure of a trigger assembly provided by an embodiment of the present invention;
  • FIG. 6 is a schematic diagram of a wafer provided by an embodiment of the present invention. Schematic diagram of the position structure that is not aligned with the mounting seat;
  • FIG. 7 is a schematic diagram of the axonometric structure of FIG. 6
  • the wafer position detection device in the present application includes a mount 4 for placing the wafer and a trigger assembly.
  • the trigger assembly is disposed on the mount 4 , and the mount 4 indirectly supports the wafer through the trigger assembly.
  • the trigger assembly includes a top cover 1 and a fluid delivery pipeline.
  • the top cover 1 protrudes from the surface of the mounting seat 4 to support the wafer 6 , and the top cover 1 can be set as a column or a stage
  • the specific structure of the top cover 1 is set as required, such as a cylinder and a circular table.
  • the inside of the top cover 1 is a hollow cavity, which is used to cover the fluid conveying pipeline; the fluid conveying pipeline is set in the hollow cavity formed by the inner wall of the top cover 1, and the top cover 1 can be close to or away from the fluid conveying pipeline.
  • the top cover 1 Move in the direction of the fluid transfer line to block/conduct the fluid transfer port of the fluid transfer line; when the top cover 1 is provided with the wafer 6, the top cover 1 can move in the direction close to the fluid transfer line to block the fluid transfer line.
  • the wafer 6 is not set on the top cover 1, the top cover 1 can move in the direction away from the fluid delivery pipeline under the action of fluid pressure, and the top cover 1 and the fluid delivery port of the fluid delivery pipeline are out of contact , the fluid delivery port of the fluid delivery pipeline is connected; the fluid delivery pipeline is connected to the hollow cavity, and the fluid of the fluid delivery pipeline flows out through the fluid delivery port, the hollow cavity and the output hole in sequence, and the output hole is arranged on the mounting seat 4 The fluid in the hollow cavity is discharged.
  • the top cover 1 For the installation method of the top cover 1 on the mounting seat, it is preferable to set a mounting groove on the mounting seat 4 for mounting the top cover 1, the top end of the top cover 1 protrudes from the mounting groove, and the tail end of the top cover 1 is connected to the mounting groove.
  • the groove is snapped to prevent the top cover 1 from disengaging from the mounting groove; it is understood that the top cover 1 and the mounting groove are clearance fit, so that the top cover 1 can move along the centerline of the mounting groove, approaching or away from the fluid delivery pipeline. move in the direction.
  • a bar-shaped guide groove for linearly guiding the movement of the top cover 1 is arranged on the side wall, and the bar-shaped guide groove is arranged parallel to the centerline direction of the installation groove. More preferably, the bar-shaped guide groove is parallel to the axis of the fluid conveying pipeline.
  • the top cover 1 is provided with guide protrusions for matching with the bar-shaped guide grooves, so as to ensure that the movement of the top cover 11 is a linear movement.
  • the rotational freedom of the top cover 1 is restricted, preventing The top cover 1 rotates around its center line under the action of the fluid pressure of the fluid conveying pipeline, and scratches caused by relative movement are generated between the top cover 1 and the wafer, which further improves the yield and the reliability of the device.
  • the fluid pressure detection component is connected with the control device, and detects the fluid pressure of the fluid delivery pipeline, so as to detect whether the wafer is in place and aligned according to the fluid pressure of the fluid delivery pipeline.
  • the fluid is generally set to deionized water, air or other inert gas, etc., which can be set as required, and set the corresponding fluid pressure detection component according to the fluid type, all within the protection scope of the present invention.
  • the fluid in the fluid delivery pipeline enters the hollow cavity through the fluid delivery port, and the top cover 1 moves along the strip-shaped guide groove away from the fluid delivery pipeline under pressure
  • the maximum sliding position of the top cover 1 is limited by the end wall of the installation hole.
  • the pressure of the fluid conveying pipeline can be detected by the fluid pressure detection component, and whether the current top cover 1 is on the current top cover 1 can be judged according to the detected pressure value.
  • the top cover 1 moves in the direction close to the fluid delivery pipeline under the action of the wafer's gravity to block the fluid delivery port of the fluid delivery pipeline.
  • the fluid cannot be It enters the hollow cavity through the fluid delivery port and flows out, the fluid pressure increases, and it is judged whether the current wafer is placed correctly according to the detected pressure value.
  • the pressure of the fluid conveying pipeline is used to detect whether the wafer is in place by the fluid pressure detection component.
  • the fluid pressure detection component when the top cover 1 is provided with a wafer, it is detected by the fluid pressure detection component.
  • the fluid pressure value of the system is compared with the preset pressure value to detect whether the wafer is aligned. For example, when the wafer is aligned, the system preset fluid pressure is 3Mpa.
  • the alignment detection process according to the fluid pressure The fluid pressure detected by the detection component is judged. When it is not 3Mpa, it is considered that the current wafer is not aligned. In the actual application process, a certain error range can be set as required.
  • the above trigger components can also be used in combination with other mechanical structures or sensors to detect whether the wafer is in place and aligned, such as lever mechanisms, displacement sensors or beam sensors, etc., which can be set as required.
  • the mounting seat 4 is provided with a mounting groove for mounting the top cover 1 , and the surface of the mounting groove is provided with a gland 5 for limiting the movement of the top cover 1 away from the fluid conveying pipeline.
  • Removable fixed connection between the gland 5 and the mounting groove such as by threaded fasteners.
  • the bottom edge of the top cover 1 and the mounting groove is provided with an outer edge portion, the outer edge portion cooperates with the pressing cover 5 to limit the position of the top cover 1, and the outer edge portion is continuously arranged around the bottom edge of the top cover 1;
  • the cover 5 is preferably arranged continuously around the circumferential edge of the installation groove, or can also be arranged at intervals, which are all within the protection scope of the present invention.
  • the fluid delivery pipeline includes the nozzle 2 and the input pipeline.
  • the nozzle 2 is detachably and fixedly connected to the mounting seat 4.
  • the mounting seat 4 is provided with a mounting through hole for mounting the nozzle 2.
  • the mounting through hole penetrates along the thickness direction of the mounting seat 4, and the mounting through hole
  • the nozzle 2 is provided with an internal thread, and the nozzle 2 is provided with an external thread matched with the internal thread.
  • the nozzle 2 and the mounting seat 4 are fixed by threaded connection; one end of the input pipeline is connected to the nozzle 2, and the other end is connected to the fluid power source.
  • the fluid pressure is detected
  • the assembly is preferably arranged on the fluid conveying pipeline, and the fluid flow rate is stable, which reduces the interference to the fluid pressure detection and improves the fluid pressure detection accuracy.
  • the output hole is arranged toward the other side of the mounting seat 4 , and the output hole is arranged on the bottom wall of the mounting groove and along the direction away from the top cover 1 .
  • the axis of the output hole is preferably arranged in parallel with the axis of the fluid conveying pipeline, so as to optimize the installation space and facilitate the connection of the output hole and the output pipeline.
  • the fluid pressure detection component is a water pressure sensor 3, the fluid is deionized water, the water pressure sensor 3 has a simple structure and is easy to install, and the deionized water has high cleanliness to reduce interference on the wafer surface.
  • control device includes:
  • the fluid pressure judgment unit is used to judge whether the fluid pressure value detected by the fluid pressure detection assembly is equal to the first preset pressure value, and if so, send the current wafer 6 alignment reminder information; judge whether the fluid pressure value detected by the fluid pressure detection assembly is equal to the first preset pressure value. equal to the second preset pressure value, if yes, send a reminder message that there is no wafer 6 in the current station, the first preset pressure value is greater than the second preset pressure value; determine whether the fluid pressure value detected by the body pressure detection component is greater than the second preset pressure value The preset pressure value is smaller than the first preset pressure value. If it is, a reminder message that the current wafer 6 is not set up will be sent, so as to realize the positioning and set-up detection of the wafer.
  • FIGS. 6 and 7 it can be understood that when there are multiple groups of trigger components, and the fluid pressure values detected by all the fluid pressure detection components are respectively equal to the first preset pressure value, it is considered that there is no wafer on the mounting seat 4, and it is possible to Carry out the unloading operation; when the fluid pressure values detected by all the fluid pressure detection components are respectively equal to the second preset pressure value, it is considered that there is a wafer on the mounting seat 4 and the wafer position is positioned correctly, and the fetching operation can be performed; when any When the fluid pressure value detected by a group of fluid pressure detection components is between the first preset pressure value and the second preset pressure value, it is considered that there is a wafer on the mounting seat 4 but the wafer position is not aligned, and an alarm is issued; In both cases, the fluid pressure value detected by the fluid pressure detection component of each trigger component should be respectively equal to the first preset pressure value/the second preset pressure value, thereby further improving detection.
  • the accuracy is high, and the loading condition of the
  • the top cover 1 is a spherical arc top cover 1 to prevent relative movement between the wafer and the top cover 1
  • the top cover 1 can also be set as an arc top cover 1 or other forms of end covers, as long as the same technical effect can be achieved; it is understandable that when the top cover is When the spherical top cover/arc top cover is used, the corresponding nozzle structure can be set as a spherical curved surface nozzle/arc nozzle, so as to be able to cooperate with the inner wall of the top cover to improve the blocking effect and reduce the Fluid pressure detection error.
  • the number of groups of trigger components is several groups, and all trigger components are evenly arranged on the mounting base 4 .
  • the nozzles 2 of each group of trigger components are respectively connected to the fluid pressure detection components, and the water is supplied separately. Through the detection of the fluid pressure detection components connected to the trigger components at different positions By judging the pressure, it can judge and adjust the posture of the wafer, and provide guidance for the control device to control the driving component to drive the wafer to adjust the corresponding position, and simplify the alignment operation.
  • the nozzles 2 of each group of trigger assemblies can also be connected to the same main pipeline for water supply, and each main pipeline is connected to the same fluid pressure detection component. In this arrangement, the device and the pipeline are connected Simple and inexpensive. It can be understood that the number of groups of trigger components is set correspondingly with reference to the size of the mounting base 4 and the weight of the wafer 6 .
  • the three sets of trigger assemblies are symmetrically arranged along the center of the mounting base 4 , and the fluid delivery pipelines of the three sets of trigger assemblies are respectively connected with one set of fluid pressure detection assemblies.
  • the three groups of trigger assemblies have the same structure to facilitate production and processing.
  • the mounting seat 4 is preferably a circular mounting seat 4 . All trigger assemblies are symmetrically arranged along the center of the circular mounting seat 4 to further optimize the structure of the mounting seat 4 .
  • the application of the wafer position detection device provided by the present invention has the following technical effects:
  • the fluid pressure detection component indirectly contacts the wafer through the top cover, and indirectly detects the position of the wafer.
  • the fluid pressure detection component does not need to directly contact the wafer, preventing direct contact
  • the problem is that defects on the surface of the wafer affect the yield; compared with optical sensors, it can realize the in-position detection of light-sensitive wafers, has a wide range of applications, and improves the versatility of the device;
  • the alignment of the wafer is judged, and the position of the subsequent wafer can be determined according to the pressure value of the fluid pressure detection component at different positions. adjustment for guidance;
  • the top of the top cover is a spherical arc surface, which is in point contact with the wafer plane, reducing the contact area between the two and preventing impurities from being stored between the top cover and the wafer; When impurities are present, the scratch area caused by relative slip is reduced, and the yield is further improved;

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

本发明公开了一种晶圆位置检测装置，包括安装座、触发组件和流体压力检测组件；设于安装座上的触发组件包括凸出于安装座的表面对晶圆进行支撑的顶盖，及设于顶盖的内壁形成的中空腔体内的流体输送管路，当顶盖上设有晶圆时、顶盖能够沿靠近流体输送管路的方向移动封堵流体输送管路的流体输送口；当顶盖上未设置晶圆时、顶盖在流体压力作用下能够沿远离流体输送管路的方向移动导通流体输送管路的流体输送口；流体压力检测组件通过顶盖与晶圆进行间接接触，对晶圆的到位情况进行间接检测，防止因直接接触使晶圆表面产生缺陷，影响成品率的问题；相较于光学传感器，其能够实现对光照敏感的晶圆的到位检测，适用范围广，提高装置通用性。

Description

一种晶圆位置检测装置 技术领域
本发明涉及半导体加工设备领域，更具体地说，涉及一种晶圆位置检测装置。
背景技术
近年来，随着半导体行业的迅速发展，半导体芯片的制造工艺线宽由0.18um缩减至10nm以下，金属层数由5-6层向更多层数发展，铜工艺多层布线解决了铝互联工艺的瓶颈问题，同时也对全局平整化提出了更高的要求。CMP是目前最好的全局平坦化技术，铜互联工艺中必不可少的工艺环节。铜(Cu)CMP制程中除了容易出现蝶形、侵蚀、刮伤外也容易出现腐蚀缺陷。
化学机械抛光平坦化设备的各个部分均需要实时检测晶圆的位置。例如抛光过程中，晶圆片先由机械手放到载片台上，当检测到晶圆放到指定的工位后，抛光头会从载片台上取片抛光。晶圆片抛光结束后，抛光头会将晶圆放回载片台上，并由机械手将晶圆传送到清洗单元。在此过程中，如果载片台运动过程中发生抖动或机械手传输时抖动导致晶圆片没有在载片台上放正，会导致取放晶圆失败甚至晶圆碎裂。
现有检测晶圆的技术方案一般采用在晶圆周向分布杠杆制动的传感器间接检测，当晶圆位置偏移时传感器的信号出现差异，以此作为判断依据，杠杆制动的传感器间接检测，零部件摩擦会有杂质(Particle)产生，结构复杂，制动杠杆容易划伤晶圆表面，安装维护困难，间接检测精度会受影响；也有在晶圆周向分布传感器直接检测的技术方案，如光学传感器，该种传感器直接检测不适用于对光照敏感的制程工艺(比如铜工艺)；同时工作环境中有抛光液和液滴飞溅，光学传感器容易误报警。
　
发明内容
有鉴于此，本发明的目的在于提供一种晶圆位置检测装置，以解决间接检测的传感器易在晶圆表面产生缺陷、影响成品率、直接检测的传感器适用范围存在限制的问题。
为了达到上述目的，本发明提供如下技术方案：
一种晶圆位置检测装置，包括：
安装座；
设于所述安装座上的触发组件，所述触发组件包括凸出于所述安装座的表面对晶圆进行支撑的顶盖，及设于所述顶盖的内壁形成的中空腔体内的流体输送管路，当所述顶盖上设有晶圆时、所述顶盖能够沿靠近所述流体输送管路的方向移动封堵所述流体输送管路的流体输送口；当所述顶盖上未设置晶圆时、所述顶盖在流体压力作用下能够沿远离所述流体输送管路的方向移动导通所述流体输送管路的流体输送口；
与控制装置连接、对所述流体输送管路的流体压力进行检测的流体压力检测组件。
优选地，所述安装座上设有用以安装所述顶盖的安装槽，所述安装槽的表面设有用以对所述顶盖远离所述流体输送管路的方向的移动进行限位的压盖。
优选地，所述安装槽的周向侧壁上设有用以对所述顶盖的移动进行直线导向的条形导向槽，所述条形导向槽平行于所述安装槽的中心线方向设置；所述顶盖上设有用以与所述条形导向槽配合的导向凸起。
优选地，设于所述安装座上、对所述中空腔体内的流体进行排出的输出孔；所述输出孔设于所述安装槽的底壁上且沿远离所述顶盖的方向贯通所述安装座。
优选地，所述流体输送管路包括：
可拆卸的固定连接于所述安装座上的喷嘴；
一端与所述喷嘴连接、另一端与流体动力源连接的输入管路。
优选地，所述安装座上设有用以安装所述喷嘴的安装通孔，所述安装通孔沿所述安装座的厚度方向贯通，所述安装通孔设有内螺纹，所述喷嘴设有与所述内螺纹配合的外螺纹。
优选地，所述控制装置包括：
流体压力判断单元，用于判断所述流体压力检测组件检测的流体压力值是否等于第一预设压力值，若是，则发送当前晶圆放正提醒信息；判断所述流体压力检测组件检测的流体压力值是否等于第二预设压力值，若是，则发送当前工位无晶圆提醒信息，所述第一预设压力值大于所述第二预设压力值；判断所述流体压力检测组件检测的流体压力值是否大于所述第二预设压力值且小于所述第一预设压力值，若是，则发送当前晶圆未放正提醒信息。
优选地，所述顶盖为球弧面顶盖。
优选地，所述触发组件的组数为若干组，全部所述触发组件在所述安装座上均匀设置。
优选地，所述触发组件为三组，三组所述触发组件沿所述安装座的中心中心对称设置，三组所述触发组件的流体输送管路均分别连接有一组所述流体压力检测组件。
本发明提供的晶圆位置检测装置，包括安装座；设于安装座上的触发组件，触发组件包括凸出于安装座的表面对晶圆进行支撑的顶盖，及设于顶盖的内壁形成的中空腔体内的流体输送管路，当顶盖上设有晶圆时、顶盖能够沿靠近流体输送管路的方向移动封堵流体输送管路的流体输送口；当顶盖上未设置晶圆时、顶盖在流体压力作用下能够沿远离流体输送管路的方向移动导通流体输送管路的流体输送口；与控制装置连接、对流体输送管路的流体压力进行检测的流体压力检测组件。
相较于现有技术，应用本发明提供的晶圆位置检测装置，具有以下技术效果：
第一，流体压力检测组件通过顶盖与晶圆进行间接接触，对晶圆的到位情况进行间接检测，相较于杠杆制动传感器，流体压力检测组件无需直接与晶圆接触，防止因直接接触而使得晶圆表面产生缺陷，影响成品率的问题；相较于光学传感器，其能够实现对光照敏感的晶圆的到位检测，适用范围广，提高装置通用性；
第二，根据流体压力检测组件的检测压力值与预设压力值的比较，对晶圆的放正情况进行判断，同时根据不同位置处的流体压力检测组件的压力值大小能够对后续晶圆位置调整进行指导；
第三，顶盖的顶部为球弧面，其与晶圆平面点接触，减小二者间的接触面积，防止顶盖和晶圆间存有杂质；且当顶盖和晶圆间存有杂质时，减小因相对滑移而产生的划痕面积，进一步提高成品率；
第四，安装槽中设有条形导向槽，以使得顶盖仅能够沿直线方向移动，对在流体作用下可能出现的旋转自由度进行限位，防止因顶盖旋转而与晶圆间产生划痕，使得顶盖和晶圆保持相对固定，进一步提高装置的可靠性。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的晶圆位置检测装置的外观结构示意图；
图2为图1的局部剖视结构示意图；
图3为本发明实施例提供的晶圆与晶圆位置检测装置的安装结构示意图；
图4为图3的局部剖视结构示意图；
图5为本发明实施例提供的触发组件的位置结构示意图；
图6为本发明实施例提供的晶圆与安装座未对正的位置结构示意图；
图7为图6的轴测结构示意图。
附图中标记如下：
顶盖1、喷嘴2、水压传感器3、安装座4、压盖5、晶圆6。
具体实施方式
本发明实施例公开了一种晶圆位置检测装置，以解决因传感器直接接触使晶圆表面产生缺陷、影响成品率的问题。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1-图7，图1为本发明实施例提供的晶圆位置检测装置的外观结构示意图；图2为图1的局部剖视结构示意图；图3为本发明实施例提供的晶圆与晶圆位置检测装置的安装结构示意图；图4为图3的局部剖视结构示意图；图5为本发明实施例提供的触发组件的位置结构示意图；图6为本发明实施例提供的晶圆与安装座未对正的位置结构示意图；图7为图6的轴测结构示意图
在一种具体的实施方式中，本申请中的晶圆位置检测装置包括用以放置晶圆的安装座4和触发组件。触发组件设于安装座4上，安装座4通过触发组件间接对晶圆进行承载。
继续参见图2和图4，其中，触发组件包括顶盖1和流体输送管路，顶盖1凸出于安装座4的表面对晶圆6进行支撑，顶盖1可设置为柱体或台体，如圆柱体、圆台，根据需要设置顶盖1的具体结构。顶盖1内部为中空腔体，用以对流体输送管路进行罩设；流体输送管路设于顶盖1的内壁形成的中空腔体中，顶盖1能够沿靠近或远离流体输送管路的方向移动对流体输送管路的流体输送口进行封堵/导通；当顶盖1上设有晶圆6时、顶盖1能够沿靠近流体输送管路的方向移动封堵流体输送管路的流体输送口；当顶盖1上未设置晶圆6时、顶盖1在流体压力作用下能够沿远离流体输送管路的方向移动，顶盖1和流体输送管路的流体输送口脱离接触，流体输送管路的流体输送口导通；流体输送管路与中空腔体导通，流体输送管路的流体依次经流体输送口、中空腔体和输出孔流出，输出孔设于安装座4上对中空腔体内的流体进行排出。
对于顶盖1在安装座上的安装方式，优选为在安装座4上设置用以安装顶盖1的安装槽，顶盖1的顶端凸出于安装槽设置，顶盖1的尾端与安装槽卡接，以防止顶盖1脱离安装槽；可以理解的是，顶盖1和安装槽间隙配合，以使得顶盖1能够沿安装槽的中心线方向移动，向靠近或远离流体输送管路的方向移动。进一步地，为了防止顶盖1在流体压力作用下绕自身轴线转动，而与晶圆6之间产生相对旋转运动，进而导致晶圆6表面产生磨损或划痕，优选为在安装孔的周向侧壁上设置对顶盖1的移动进行直线导向的条形导向槽，条形导向槽平行于安装槽的中心线方向设置，更为优选地，条形导向槽平行于流体输送管路的轴线方向，顶盖1上设有用以与条形导向槽配合的导向凸起，以保证顶盖11的移动为直线移动。由此设置，对顶盖1的旋转自由度进行限制，防止 顶盖1在流体输送管路的流体压力作用下绕自身中心线转动，与晶圆之间产生因相对移动所造成的划痕，进一步提高成品率，提高装置的可靠性。
流体压力检测组件与控制装置连接、对流体输送管路的流体压力进行检测，以根据流体输送管路的流体压力进行晶圆是否到位及放正进行检测。流体一般设置为去离子水，空气或其他惰性气体等，可根据需要进行设置，并根据流体类型设置相应的流体压力检测组件，均在本发明的保护范围内。
在作业时，当顶盖1上无晶圆时，流体输送管路的流体通过流体输送口进入至中空腔体中，顶盖1在压力作用下沿条形导向槽向远离流体输送管路的方向移动，通过安装孔的端壁对顶盖1的最大滑移位置进行限定，此时可通过流体压力检测组件对流体输送管路的压力进行检测，根据检测压力值判断当前顶盖1上是否存在晶圆；当顶盖1上安装有晶圆时，顶盖1在晶圆重力作用下向靠近流体输送管路的方向移动对流体输送管路的流体输送口进行封堵，此时流体无法通过流体输送口进入至中空腔体并进行流出，流体压力增大，根据检测压力值判断当前晶圆是否放正。如上所述，通过流体压力检测组件对流体输送管路的压力进行晶圆是否到位的检测，在另一种实施例中，当顶盖1上设置有晶圆时，通过流体压力检测组件检测到的流体压力值与预设压力值进行比较，以对晶圆是否放正进行检测，举例说明：当晶圆摆正时、系统预设流体压力为3Mpa，在放正检测过程中，根据流体压力检测组件检测的流体压力进行判断，当其不为3Mpa时，则认为当前晶圆没有摆正，在实际应用过程中，可根据需要设置一定的误差范围。
同时，上述触发组件也可以与其他机械结构或传感器组合使用，以检测晶圆是否在位及放正，如杠杆机构、位移传感器或对射传感器等，可根据需要进行设置。
具体的，安装座4上设有用以安装顶盖1的安装槽，安装槽的表面设有用以对顶盖1远离流体输送管路的方向的移动进行限位的压盖5。压盖5和安装槽可拆卸的固定连接，如通过螺纹紧固件固定。顶盖1与安装槽配合的底部边缘设有外沿部，外沿部和压盖5配合以对顶盖1进行限位，外沿部在顶盖1的底部边缘连续环绕设置；其中，压盖5优选为在安装槽的周向边缘连续环绕设置，或者，也可以间隔设置，均在本发明的保护范围内。
其中，流体输送管路包括喷嘴2和输入管路。喷嘴2可拆卸的固定连接于安装座4上，在一种实施例中，安装座4上设有用以安装喷嘴2的安装通孔，安装通孔沿安装座4的厚度方向贯通，安装通孔设有内螺纹，喷嘴2设有与内螺纹配合的外螺纹，通过螺纹连接实现喷嘴2和安装座4的固定；输入管路一端与喷嘴2连接、另一端与流体动力源连接，流体压力检测组件优选设置在流体输送管路上，其流体流速稳定，减小对流体压力检测造成的干扰，提高流体压力检测精度。
在一种实施例中，为了防止流体溅出对晶圆造成损伤，影响成品率，输出孔朝向安装座4的另一侧面设置，输出孔设于安装槽的底壁上且沿远离顶盖1的方向贯通安装座4，输出孔的轴线优选与流体输送管路的轴线平行设置，以优化安装空间，便于输出孔与输出管路连接。
优选地，流体压力检测组件为水压传感器3，流体为去离子水，水压传感器3结构简单便于设置，且去离子水洁净度高，减少对晶圆表面产生的干扰。
具体的，控制装置包括：
流体压力判断单元，用于判断流体压力检测组件检测的流体压力值是否等于第一预设压力值，若是，则发送当前晶圆6放正提醒信息；判断流体压力检测组件检测的流体压力值是否等于第二预设压力值，若是，则发送当前工位无晶圆6提醒信息，第一预设压力值大于第二预设压力值；判断体压力检测组件检测的流体压力值是否大于第二预设压力值且小于第一预设压力值，若是，则发送当前晶圆6未放正提醒信息，由此以实现晶圆的到位及放正检测。
参见图6、7，可以理解的是，当触发组件为多组时，全部流体压力检测组件检测的流体压力值均分别等于第一预设压力值时，认为安装座4上无晶圆，可以进行放片操作；当全部流体压力检测组件检测的流体压力值分别等于第二预设压力值时，认为安装座4上有晶圆且晶圆位置放正时，可以进行取片操作；当任意一组流体压力检测组件检测的流体压力值处于第一预设压力值和第二预设压力值间时，认为安装座4上有晶圆但晶圆位置未放正时，进行报警；上述前两种情况中，各触发组件的流体压力检测组件检测的流体压力值应分别等于第一预设压力值/第二预设压力值，由此以进一步提高检测 精度，且能够在取片/放片操作前，对安装座4的承载情况进行监控，提高装置安全性。
在上述各实施例的基础上，为了减少顶盖1和晶圆间的接触面积，防止产生划痕，顶盖1为球弧面顶盖1，以防止晶圆和顶盖1间发生相对移动时产生划痕，进一步提高成品率，同时，顶盖1也可以设置为弧形顶盖1或其他形式的端盖，只要能够达到相同的技术效果即可；可以理解的是，当顶盖为球弧面顶盖/弧形顶盖时，相应地喷嘴的结构可设置为球弧面型喷嘴/弧形喷嘴，以能够与顶盖的内壁配合，在封堵时提高封堵效果，减小流体压力检测误差。
具体的，触发组件的组数为若干组，全部触发组件在安装座4上均匀设置。均匀设置如呈矩阵式排列，沿横向或纵向排列等方式，各组触发组件的喷嘴2分别连接流体压力检测组件，单独供水，通过对不同位置处的触发组件所连接的流体压力检测组件的检测压力进行判断，可进行晶圆位姿的判断及调整，为控制装置控制驱动组件带动晶圆进行相应的位置调节提供指导，简化对正操作。在另一种实施例中，也可以将各组触发组件的喷嘴2均分别连接同一主管路进行供水，每个主管路上连接同一个流体压力检测组件，该种设置方式中，器件及管路连接简单，成本低廉。可以理解的是，触发组件的组数参考安装座4的大小及晶圆6的重量进行相应地设置。
优选地，触发组件为三组，三组触发组件沿安装座4的中心中心对称设置，三组触发组件的流体输送管路均分别连接有一组流体压力检测组件。三组触发组件的结构相同，以便于生产加工，安装座4优选为圆型安装座4，全部触发组件沿圆形安装座4的圆心中心对称设置，进一步优化安装座4的结构。
相较于现有技术，应用本发明提供的晶圆位置检测装置，具有以下技术效果：
第一，流体压力检测组件通过顶盖与晶圆进行间接接触，对晶圆的到位情况进行间接检测，相较于杠杆制动传感器，流体压力检测组件无需直接与晶圆接触，防止因直接接触而使得晶圆表面产生缺陷，影响成品率的问题；相较于光学传感器，其能够实现对光照敏感的晶圆的到位检测，适用范围广，提高装置通用性；
第二，根据流体压力检测组件的检测压力值与预设压力值的比较，对晶圆的放正情况进行判断，同时根据不同位置处的流体压力检测组件的压力值大小能够对后续晶圆位置调整进行指导；
第三，顶盖的顶部为球弧面，其与晶圆平面点接触，减小二者间的接触面积，防止顶盖和晶圆间存有杂质；且当顶盖和晶圆间存有杂质时，减小因相对滑移而产生的划痕面积，进一步提高成品率；
第四，安装槽中设有条形导向槽，以使得顶盖仅能够沿直线方向移动，对在流体作用下可能出现的旋转自由度进行限位，防止因顶盖旋转而与晶圆间产生划痕，使得顶盖和晶圆保持相对固定，进一步提高装置的可靠性。
最后，还需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。

Claims (4)

  1. 一种晶圆位置检测装置，其特征在于，包括：
    安装座；
    设于所述安装座上的触发组件，所述触发组件包括凸出于所述安装座的表面对晶圆进行支撑的顶盖，及设于所述顶盖的内壁形成的中空腔体内的流体输送管路，当所述顶盖上设有晶圆时、所述顶盖能够沿靠近所述流体输送管路的方向移动封堵所述流体输送管路的流体输送口；当所述顶盖上未设置晶圆时、所述顶盖在流体压力作用下能够沿远离所述流体输送管路的方向移动导通所述流体输送管路的流体输送口；
    与控制装置连接、对所述流体输送管路的流体压力进行检测的流体压力检测组件。
  2. 根据权利要求1所述的晶圆位置检测装置，其特征在于，所述安装座上设有用以安装所述顶盖的安装槽，所述安装槽的表面设有用以对所述顶盖远离所述流体输送管路的方向的移动进行限位的压盖。
  3. 根据权利要求2所述的晶圆位置检测装置，其特征在于，所述安装槽的周向侧壁上设有用以对所述顶盖的移动进行直线导向的条形导向槽，所述条形导向槽平行于所述安装槽的中心线方向设置；所述顶盖上设有用以与所述条形导向槽配合的导向凸起。
    4、根据权利要求2所述的晶圆位置检测装置，其特征在于，还包括设于所述安装座上、对所述中空腔体内的流体进行排出的输出孔，所述输出孔设于所述安装槽的底壁上且沿远离所述顶盖的方向贯通所述安装座。
    5、根据权利要求2所述的晶圆位置检测装置，其特征在于，所述流体输送管路包括：
    可拆卸的固定连接于所述安装座上的喷嘴；
    一端与所述喷嘴连接、另一端与流体动力源连接的输入管路。
    6、根据权利要求5所述的晶圆位置检测装置，其特征在于，所述安装座上设有用以安装所述喷嘴的安装通孔，所述安装通孔沿所述安装座的厚度方向贯通，所述安装通孔设有内螺纹，所述喷嘴设有与所述内螺纹配合的外螺纹。
  4. 根据权利要求1所述的晶圆位置检测装置，其特征在于，所述控制装置包括：
    流体压力判断单元，用于判断所述流体压力检测组件检测的流体压力值是否等于第一预设压力值，若是，则发送当前晶圆放正提醒信息；判断所述流体压力检测组件检测的流体压力值是否等于第二预设压力值，若是，则发送当前工位无晶圆提醒信息，所述第一预设压力值大于所述第二预设压力值；判断所述流体压力检测组件检测的流体压力值是否大于所述第二预设压力值且小于所述第一预设压力值，若是，则发送当前晶圆未放正提醒信息。
    8、根据权利要求1-7任一项所述的晶圆位置检测装置，其特征在于，所述顶盖为球弧面顶盖。
    9、根据权利要求8所述的晶圆位置检测装置，其特征在于，所述触发组件的组数为若干组，全部所述触发组件在所述安装座上均匀设置。
    10、根据权利要求9所述的晶圆位置检测装置，其特征在于，所述触发组件为三组，三组所述触发组件沿所述安装座的中心中心对称设置，三组所述触发组件的流体输送管路均分别连接有一组所述流体压力检测组件。
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