WO2020078191A1 - 喷淋装置及清洗设备 - Google Patents

喷淋装置及清洗设备 Download PDF

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Publication number
WO2020078191A1
WO2020078191A1 PCT/CN2019/108137 CN2019108137W WO2020078191A1 WO 2020078191 A1 WO2020078191 A1 WO 2020078191A1 CN 2019108137 W CN2019108137 W CN 2019108137W WO 2020078191 A1 WO2020078191 A1 WO 2020078191A1
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WO
WIPO (PCT)
Prior art keywords
cleaned
spray
liquid
cleaning
liquid inlet
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Application number
PCT/CN2019/108137
Other languages
English (en)
French (fr)
Inventor
刘伟
陈洁
刘效岩
吴仪
Original Assignee
北京北方华创微电子装备有限公司
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Application filed by 北京北方华创微电子装备有限公司 filed Critical 北京北方华创微电子装备有限公司
Publication of WO2020078191A1 publication Critical patent/WO2020078191A1/zh
Priority to US17/224,714 priority Critical patent/US11823917B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/18—Roses; Shower heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/14—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet
    • B05B12/1472—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet separate supply lines supplying different materials to separate outlets of the spraying apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B05B13/0228—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being rotative
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
    • B05B13/0405—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with reciprocating or oscillating spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/24—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas with means, e.g. a container, for supplying liquid or other fluent material to a discharge device
    • B05B7/26—Apparatus in which liquids or other fluent materials from different sources are brought together before entering the discharge device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
    • B05B12/04—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery for sequential operation or multiple outlets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/14—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet
    • B05B12/1418—Arrangements for controlling delivery; Arrangements for controlling the spray area for supplying a selected one of a plurality of liquids or other fluent materials or several in selected proportions to a spray apparatus, e.g. to a single spray outlet for supplying several liquids or other fluent materials in selected proportions to a single spray outlet

Definitions

  • the present invention relates to the field of semiconductor manufacturing, and in particular, to a spray device and cleaning equipment.
  • the cleanliness and flatness requirements of the oxide film on the wafer surface are becoming higher and higher.
  • the excessive thickness of the oxide film on the wafer surface will directly affect the quality of subsequent processes, resulting in integrated circuit chips
  • the performance of the product deteriorates, which reduces the product yield.
  • Monolithic wet etching technology has become a very important technology to improve the uniformity of film thickness due to the advantages of no cross-contamination and regional corrosion.
  • Factors such as the concentration, temperature, and flow rate of the corrosion solution are important factors that affect the rate of chemical reaction.
  • the edge linear velocity of the rotating wafer is much greater than the center linear velocity, so that when the chemical liquid is sprayed uniformly and vertically to the wafer surface, the thickness of the liquid film on the edge area of the wafer surface is significantly smaller than the center
  • the thickness of the liquid film on the area causes the uneven thickness of the liquid film in the radial direction of the wafer.
  • the corrosion rate is slow, and it is easy to form bumps, which affects the product yield.
  • the present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a spraying device and cleaning equipment, which can improve the uniformity of cleaning and improve the product yield.
  • a spraying device including:
  • a spray assembly for spraying cleaning liquid toward the surface of the workpiece to be cleaned and the spray assembly is set to correspond to the concentration of the cleaning liquid sprayed at different positions in the radial direction of the surface to be cleaned ,
  • the temperature and / or the flow rate are different, so that the cleaning rate of the cleaning liquid at different positions in the radial direction of the surface to be cleaned is consistent.
  • the spray assembly includes a spray head, multiple liquid inlet lines and a driving source, wherein,
  • the spray head is used to spray cleaning liquid toward the surface to be cleaned
  • the driving source is used to drive the spray head to reciprocate between the edge and the center of the surface to be cleaned when the workpiece is rotated;
  • a plurality of the liquid inlet lines are used to provide cleaning liquid to the spray head, and an on-off valve is provided on each liquid inlet line; and, by using preset rules during the movement of the spray head Opening sequence of the on-off valve and / or switching the number of openings of the on-off valve to achieve the concentration, temperature and / or the cleaning liquid sprayed at different positions in the radial direction corresponding to the surface to be cleaned Traffic is different.
  • the preset rules include:
  • the concentration and / or temperature of the cleaning liquid provided by each of the liquid inlet lines is different; and, during the movement of the spray head, the on-off valve is opened in a preset order, and all the liquid inlet pipes are always maintained Only one of the on-off valves on the liquid inlet line in the road is open to achieve different concentrations and / or temperatures of the cleaning liquid sprayed at different positions in the radial direction corresponding to the surface to be cleaned .
  • the preset sequence is:
  • connection and disconnection on the corresponding liquid inlet pipelines are sequentially turned on in order of concentration and / or temperature from high to low valve;
  • the on-off valves on the corresponding liquid inlet pipelines are sequentially opened in order from low to high concentration and / or temperature .
  • the preset rules include:
  • the number of opening and closing valves gradually decreases
  • the number of opening and closing valves gradually increases.
  • the driving source is a rotary driving source, which is used to drive the spray head to swing back and forth between the edge and the center of the surface to be cleaned.
  • the rotary drive source includes a drive arm and a rotary motor, wherein,
  • the driving arm is vertically arranged on one side of a carrier for carrying the workpiece to be processed; the spray head is arranged on the driving arm and above the carrier;
  • the rotating motor is used to drive the driving arm to rotate clockwise or counterclockwise by a predetermined angle.
  • the spray assembly includes a spray head and multiple liquid inlet lines, wherein,
  • the spray head includes a plurality of spray holes, and the multiple spray holes are arranged on a plurality of circumferences with different radii centered on the center of the surface to be cleaned;
  • the number of the liquid inlet lines corresponds to the number of the circumferences, and is provided in a one-to-one correspondence.
  • Each liquid inlet line is used to provide different concentration and temperature to each of the liquid injection holes on the circumference corresponding thereto And / or flow of cleaning fluid.
  • the larger the radius of the circumference the greater the concentration, temperature, and / or flow rate of the cleaning liquid provided by the liquid inlet lines corresponding to the liquid ejection holes on the circumference.
  • the spray assembly includes a spray head and a liquid inlet line, wherein,
  • the spray head includes a plurality of liquid spray holes arranged on a plurality of circles with different radii centered on the center of the surface to be cleaned; and, the larger the radius of the circle, the circle The larger the diameter of the liquid injection hole on the;
  • the liquid inlet line is used to simultaneously provide cleaning liquid to all the liquid injection holes.
  • the present invention also provides a cleaning device, including a carrier for carrying a workpiece to be processed and a spray device for cleaning the surface of the workpiece to be cleaned.
  • the spray device uses the present invention The above-mentioned spray device provided by the invention.
  • the spraying device provided by the invention sprays the cleaning liquid toward the surface of the workpiece to be cleaned by means of the spraying assembly, and the spraying assembly is set to spray at different positions in the radial direction corresponding to the surface to be cleaned
  • the concentration, temperature and / or flow rate of the cleaning liquid are different, so that the cleaning rate of the cleaning liquid at different positions in the radial direction of the surface to be cleaned can be uniform, thereby improving the uniformity of cleaning and avoiding the formation of bumps due to the small thickness of the liquid film , Which in turn can improve product yield.
  • the feedback rate can be increased.
  • the cleaning equipment provided by the present invention can improve the uniformity of cleaning and improve the product yield by using the above-mentioned spray device provided by the present invention.
  • FIG. 1 is a structural diagram of a shower device provided by a first embodiment of the present invention
  • FIG. 2 is a schematic diagram of a spraying device provided by a first embodiment of the present invention
  • FIG. 3 is a structural diagram of a liquid inlet pipe used in the first embodiment of the present invention.
  • FIG. 5 is a structural diagram of a shower head of a shower device according to a second embodiment of the present invention.
  • the invention provides a spray device, which includes a spray assembly for spraying a cleaning liquid toward a surface of a workpiece to be cleaned.
  • the cleaning liquid is usually a chemical liquid, which can chemically react with substances on the surface of the workpiece to be cleaned, thereby corroding unnecessary oxide films or other film layers on the surface to be cleaned.
  • it is usually necessary to rotate the workpiece to be processed.
  • the linear velocity of the edge of the rotating wafer is much greater than the central linear velocity
  • the chemical liquid is sprayed uniformly and vertically onto the wafer surface
  • the thickness of the liquid film on the edge area of the wafer surface is significantly smaller than the thickness of the liquid film on the center area, resulting in uneven liquid film thickness in the radial direction of the wafer, and because the thickness of the liquid film on the edge area of the wafer surface is too small, the corrosion rate Slow, it is easy to form bumps, which affects the product yield.
  • the spray assembly provided by the present invention is configured to have different concentrations, temperatures, and / or flow rates of the cleaning liquid sprayed at different positions in the radial direction corresponding to the surface to be cleaned. Since the concentration, temperature and flow rate are all important factors affecting the chemical reaction rate, specifically, the higher the concentration or temperature of the cleaning liquid, the greater the thickness of the liquid film sprayed on the surface to be cleaned; otherwise, the concentration of the cleaning liquid or The lower the temperature, the smaller the thickness of the liquid film sprayed on the surface to be cleaned.
  • the greater the flow rate of the cleaning liquid the greater the thickness of the liquid film sprayed on the surface to be cleaned; conversely, the smaller the flow rate of the cleaning liquid, the smaller the thickness of the liquid film sprayed on the surface to be cleaned.
  • the spray assembly corresponding to the concentration, temperature and / or flow rate of the cleaning liquid sprayed at different positions in the radial direction of the surface to be cleaned, the cleaning rate of the cleaning liquid at different positions in the radial direction of the surface to be cleaned can be made Consistent, which can improve the cleaning uniformity, and at the same time avoid the formation of bumps due to the small thickness of the liquid film, which can improve the product yield.
  • the feedback rate can be increased.
  • the spray assembly provided in the first embodiment of the present invention includes a spray head 40, a plurality of liquid inlet lines 41 and a driving source 30, wherein the spray head 40 is used to face the workpiece
  • the cleaning surface 21 of 20 ejects the cleaning liquid
  • the driving source 30 is used to drive the spray head 40 to reciprocate between the edge and the center of the surface 21 to be cleaned when the workpiece to be rotated rotates, so that the spray liquid can be sprayed by the spray head 40 Cover the entire surface 21 to be cleaned.
  • a plurality of liquid inlet lines 41 are used to provide cleaning liquid to the spray head 40, and an on-off valve is provided on each liquid inlet line 41; and, during the movement of the spray head, the preset rules are used to control the The sequence of opening and / or switching the number of opening and closing valves to achieve different concentrations, temperatures and / or flow rates of the cleaning liquid sprayed at different positions in the radial direction corresponding to the surface to be cleaned.
  • the driving source 30 is a rotary driving source, which is used to drive the spray head 40 to swing back and forth between the edge and the center of the surface 21 to be cleaned.
  • the rotary driving source includes a driving arm and a rotating motor, wherein the driving arm is vertically arranged on the side of the carrier 10 for carrying the workpiece 20 to be processed; the spray head 40 is arranged on the driving arm and is located on the carrier 10 Above; the rotating motor is used to drive the driving arm to rotate clockwise or counterclockwise by a predetermined angle.
  • the driving arm drives the spray head 40 to rotate a predetermined angle clockwise from an edge A of the surface 21 to be cleaned to rotate to the center B of the surface 21 to be cleaned; then from the center B Rotate a predetermined angle clockwise to rotate to the other edge C of the surface 21 to be cleaned; after that, the driving arm drives the spray head 40 to rotate a predetermined angle counterclockwise from the edge C to reversely rotate to the center B; then rotate counterclockwise from the center B Predetermined angle to return to edge A.
  • the cleaning liquid can cover the entire surface to be cleaned, and at the same time, the spray head 40 can swing back and forth between the edge and the center of the surface 21 to be cleaned.
  • the driving arm may also adopt other rotation paths, as long as the cleaning liquid can cover the entire surface to be cleaned, and at the same time, the spray head 40 can swing back and forth between the edge and the center of the surface to be cleaned 21.
  • a linear drive source can be used instead of the above-mentioned rotary drive source.
  • the linear drive source is used to drive the nozzle to reciprocate linearly in the radial direction of the surface to be cleaned, which can also achieve that the cleaning liquid can cover the entire to-be-cleaned
  • the surface also allows the spray head to swing back and forth between the edge and center of the surface to be cleaned.
  • the spray assembly further includes a liquid inlet main path 42; the outlet ends of the plurality of liquid inlet lines 41 are all connected to the liquid inlet end of the liquid inlet main path 42; The outlet end of the main path 42 is connected to the spray head 40.
  • the liquid inlet lines 41 may also be independent of each other, and the liquid outlets of the liquid inlet lines 41 are directly connected to the spray head 40, as shown in FIG. 4.
  • the concentration and / or temperature of the cleaning liquid provided by each liquid inlet line 41 is different. Since a plurality of liquid inlet lines 41 for transporting cleaning liquids of different concentrations and / or temperatures are provided, during the reciprocating rotary movement of the spray head 40 between the edge and the center of the surface 21 to be cleaned, by By opening the on-off valve, different liquid inlet lines 41 can provide cleaning liquid with different concentrations and / or temperatures to the spray head 40, so as to achieve the concentration and / or cleaning liquid sprayed at different positions in the radial direction corresponding to the surface to be cleaned. Or the temperature is different, so that the cleaning liquid has a uniform cleaning rate at different positions in the radial direction of the surface to be cleaned.
  • the above preset sequence may be: during the reciprocating movement of the driving source 30 driving the spray head 41 from the edge to the center of the surface 21 to be cleaned, the corresponding liquid feeds are sequentially turned on in order of the concentration and / or temperature from high to low
  • the on-off valve on the pipeline 41 and always keep only one on-off valve on all the inlet pipelines 41 is open. That is to say, during the reciprocating movement of the spray head 41 from the edge to the center of the surface 21 to be cleaned, there is always only one liquid inlet line 41 to supply cleaning liquid to the spray head 41, and by switching the different liquid inlet lines 41, Achieve changes in concentration and / or temperature.
  • the concentration and / or temperature of the cleaning liquid can be reduced from the edge to the center of the surface 21 to be cleaned, so that the difference in the thickness of the liquid film caused by the difference in the linear velocity of the workpiece to be processed can be compensated for, thereby making the surface 21 to be cleaned
  • the thickness of the liquid film in the radial direction tends to be uniform.
  • the on-off valve instantaneous switch to switch between different liquid inlet lines 41, the delay of the concentration and / or temperature change of the cleaning liquid sprayed from the nozzle can be reduced, so that the waiting The concentration and / or temperature uniformity of the cleaning liquid in the radial direction of the cleaning surface.
  • liquid inlet lines 41 there are three liquid inlet lines 41, namely a first liquid inlet line 41A, a second liquid inlet line 41B, and a third liquid inlet line 41C.
  • a first on-off valve 43A, a second on-off valve 43B, and a third on-off valve 43C are provided on the first liquid inlet line 41A, the second liquid inlet line 41B, and the third liquid inlet line 41C, respectively .
  • the on-off valves (43A to 43C) on the three liquid inlet lines (41A to 41C) are opened in sequence according to the sequence number, and Each time the on-off valve on the inlet line is opened, the on-off valve on the last opened inlet line is closed to ensure that only the on-off valve on the inlet line is opened.
  • the on-off valves on the corresponding inlet lines 41 are sequentially opened in the order of concentration and / or temperature from low to high , And always keep only one of the inlet and outlet valves on all inlet lines 41 is open. In this way, the concentration and / or temperature of the cleaning liquid can be increased from the center to the edge of the surface 21 to be cleaned.
  • the above-mentioned preset rule may further include: during the reciprocating rotational movement of the spray head 40 between the edge and the center of the surface 21 to be cleaned, the spraying of the spray head 40 is realized by switching the number of opening and closing valves The flow rate of the outgoing cleaning liquid is adjusted, so that the flow rate of the cleaning liquid sprayed at different positions in the radial direction corresponding to the surface to be cleaned is different, so that the cleaning rate of the cleaning liquid at different positions in the radial direction of the surface to be cleaned is consistent.
  • the number of opening and closing valves gradually decreases.
  • the flow rate of the cleaning liquid can be reduced from the edge to the center of the surface 21 to be cleaned, thereby making it possible to compensate for the difference in the thickness of the liquid film caused by the difference in the linear velocity of the workpiece 20 to be processed, and thus to make The upward liquid film thickness tends to be uniform.
  • the on-off valves can be operated during the movement of the driving source 30 driving the spray head 40 from the edge of the surface 21 to be cleaned toward the center.
  • the first operation of the on-off valve, the number x is 3, that is, the on-off valves (43A to 43C) on the three liquid inlet lines 41 are opened at the same time, at this time the flow rate of the cleaning liquid sprayed by the spray head 40 is the largest; the second The number of on-off valves for the second operation is 2, that is, the on-off valves on the two inlet lines 41 are opened at the same time.
  • the flow rate of the cleaning liquid sprayed from the spray head 40 decreases relative to the on-off valve for the first operation
  • the third operation of the on-off valve, the quantity x is 1, that is, to open an on-off valve on the liquid inlet line 41, at this time the flow rate of the cleaning liquid sprayed by the spray head 40 is the smallest.
  • the number x of opening and closing valves gradually increases. In this way, the flow rate of the cleaning liquid can be increased from the center to the edge of the surface 21 to be cleaned.
  • the spray head 40 may have one liquid discharge hole, or may also have multiple liquid discharge holes.
  • the shower device provided by the second embodiment of the present invention also includes a shower assembly.
  • the spray assembly includes a spray head 40 'and a plurality of liquid inlet lines, wherein the spray head 40' includes a plurality of spray holes 401 arranged in a circle centered on the center of the surface to be cleaned, And on multiple circles with different radii.
  • FIG. 5 shows that a plurality of liquid injection holes 401 are arranged on 5 circumferences (1 to 5); the number of liquid inlet lines corresponds to the number of circumferences, and is provided in a one-to-one correspondence, each liquid inlet
  • the pipeline is used to simultaneously supply cleaning liquids of different concentrations, temperatures, and / or flow rates to the respective liquid injection holes 401 on the circumference corresponding thereto.
  • the concentration, temperature, and / or flow rate of the cleaning liquid sprayed from the spray holes 401 on different circumferences are different, that is, the concentration, temperature, and / or cleaning liquid sprayed at different positions in the radial direction corresponding to the surface to be cleaned Or the flow rate is different.
  • the larger the radius of the circumference the greater the concentration, temperature, and / or flow rate of the cleaning liquid provided by the liquid inlet lines corresponding to the liquid injection holes 401 on the circumference.
  • the workpiece can be compensated for the radial
  • the difference in the thickness of the liquid film caused by the difference in the linear velocity of the linear velocity which in turn makes the thickness of the liquid film in the radial direction of the surface to be cleaned tend to be consistent.
  • the spray head 40 is fixed differently, and the multiple circumferences where the multiple spray holes 401 are located correspond to different positions in the radial direction of the surface to be cleaned, and The concentration, temperature and / or flow rate of the cleaning liquid sprayed from the liquid spray holes 401 are different, and finally the thickness of the liquid film in the radial direction of the surface to be cleaned tends to be uniform.
  • the diameters of the multiple spray holes 401 may be the same or different, and the larger the radius of the circumference, the larger the diameter of the spray holes 401 on the circumference, so that the flow rate of the sprayed cleaning liquid It gradually decreases from the edge of the surface to be cleaned toward the center.
  • one liquid inlet line can be used to provide cleaning liquid to all the liquid injection holes; or, there are multiple liquid inlet lines, and each liquid inlet line sprays to each of the corresponding circumferences
  • the flow rate of the cleaning liquid provided by the liquid hole 401 may be the same, or may be different.
  • the spray device provided by the above embodiments of the present invention sprays the cleaning liquid toward the surface of the workpiece to be cleaned by means of the spray assembly, and the spray assembly is set to correspond to the diameter of the surface to be cleaned
  • the concentration, temperature, and / or flow rate of the cleaning liquid sprayed at different positions upwards can make the cleaning liquid have a uniform cleaning rate at different positions in the radial direction of the surface to be cleaned, thereby improving the uniformity of cleaning and avoiding the liquid
  • the film thickness is too small to form bumps, which can improve product yield.
  • the feedback rate can be increased.
  • an embodiment of the present invention further provides a cleaning device, including a carrier for carrying a workpiece to be processed and a spray device for cleaning the surface of the workpiece to be cleaned.
  • the spray device uses the present invention Invent the spray device provided by the above embodiments.
  • the cleaning equipment provided by the embodiments of the present invention can improve the uniformity of cleaning and improve the product yield by using the above-mentioned spray device provided by the embodiments of the present invention.

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Abstract

一种喷淋装置及清洗设备，该喷淋装置包括喷淋组件，用于朝向被加工工件（20）的待清洗表面喷出清洗液体，且喷淋组件被设置为对应待清洗表面的径向上的不同位置处喷出的清洗液体的浓度、温度和/或流量不同，以使清洗液体对待清洗表面的径向上的不同位置处的清洗速率一致。该喷淋装置，其可以提高清洗均匀性，提高产品良率。

Description

喷淋装置及清洗设备 技术领域
本发明涉及半导体制造领域，具体地，涉及一种喷淋装置及清洗设备。
背景技术
随着集成电路特征尺寸的不断缩小，对晶片表面氧化膜的清洁度和平整度的要求越来越高，例如，晶片表面氧化膜厚度超限会直接影响后续工艺的质量，从而导致集成电路芯片的性能变差，使产品良率下降。
单片湿法腐蚀技术由于具备无交叉污染和可以区域腐蚀等的优点成为了一种非常重要的提高膜厚均匀性的技术。但是，随着晶片尺寸的不断增大，精准控制单片湿法腐蚀的速率及均匀性也变得越来越具有挑战性。
腐蚀溶液的浓度、温度以及流量等的因素都是影响化学反应速率的重要因素。但是，在进行工艺时，由于旋转中的晶片的边缘线速度远大于中心线速度，导致当药液均匀且垂直地喷射到晶圆表面时，晶片表面的边缘区域上的液膜厚度明显小于中心区域上的液膜厚度，从而造成晶片径向上的液膜厚度不均匀，同时由于晶片表面的边缘区域上的液膜厚度过小，腐蚀速度慢，容易形成凸点，从而影响产品良率。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一，提出了一种喷淋装置及清洗设备，其可以提高清洗均匀性，提高产品良率。
为实现本发明的目的而提供一种喷淋装置，包括：
喷淋组件，用于朝向被加工工件的待清洗表面喷出清洗液体，且所述喷淋组件被设置为对应所述待清洗表面的径向上的不同位置处喷出的所述清洗 液体的浓度、温度和/或流量不同，以使所述清洗液体对所述待清洗表面的径向上的不同位置处的清洗速率一致。
可选的，所述喷淋组件包括喷头、多条进液管路和驱动源，其中，
所述喷头用于朝向所述待清洗表面喷出清洗液体；
所述驱动源用于在所述被加工工件旋转时驱动所述喷头在所述待清洗表面的边缘与中心之间作往复运动；
多条所述进液管路均用于向所述喷头提供清洗液体，且在每条所述进液管路上设置有通断阀；并且，通过在所述喷头运动过程中采用预设规则控制所述通断阀的开启顺序和/或切换所述通断阀的开启数量，来实现对应所述待清洗表面的径向上的不同位置处喷出的所述清洗液体的浓度、温度和/或流量不同。
可选的，所述预设规则包括：
每条所述进液管路提供的清洗液体的浓度和/或温度不同；并且，在所述喷头运动过程中按预设顺序开启所述通断阀，且始终保持所有的所述进液管路中仅有一条所述进液管路上的所述通断阀是开启的，以实现对应所述待清洗表面的径向上的不同位置处喷出的所述清洗液体的浓度和/或温度不同。
可选的，所述预设顺序为：
在所述驱动源驱动所述喷头自所述待清洗表面的边缘向中心运动的过程中，按浓度和/或温度由高至低的顺序依次开启相应所述进液管路上的所述通断阀；
在所述驱动源驱动所述喷头自所述待清洗表面的中心向边缘运动的过程中，按浓度和/或温度由低至高的顺序依次开启相应所述进液管路上的所述通断阀。
可选的，所述预设规则包括：
在所述驱动源驱动所述喷头自所述待清洗表面的边缘向中心运动的过 程中，所述通断阀的开启数量逐渐减小；
在所述驱动源驱动所述喷头自所述待清洗表面的中心向边缘运动的过程中，所述通断阀的开启数量逐渐增大。
可选的，所述驱动源为旋转驱动源，用于驱动所述喷头在所述待清洗表面的边缘与中心之间作往复摆动。
可选的，所述旋转驱动源包括驱动臂和旋转电机，其中，
所述驱动臂竖直设置在用于承载所述被加工工件的载具的一侧；所述喷头设置在所述驱动臂上，且位于所述载具的上方；
所述旋转电机用于驱动所述驱动臂顺时针或者逆时针旋转预定角度。
可选的，所述喷淋组件包括喷头和多条进液管路，其中，
所述喷头包括多个喷液孔，多个喷液孔排布在以所述待清洗表面的中心为圆心，且半径不同的多个圆周上；
所述进液管路的数量与所述圆周的数量对应，且一一对应地设置，每条进液管路用于向与之对应的圆周上的各个所述喷液孔提供不同浓度、温度和/或流量的清洗液体。
可选的，所述圆周的半径越大，该圆周上的各个所述喷液孔所对应的所述进液管路提供的清洗液体的浓度、温度和/或流量越大。
可选的，所述喷淋组件包括喷头和进液管路，其中，
所述喷头包括多个喷液孔，多个喷液孔排布在以所述待清洗表面的中心为圆心，且半径不同的多个圆周上；并且，所述圆周的半径越大，该圆周上的所述喷液孔的直径越大；
所述进液管路用于同时向所有的所述喷液孔提供清洗液体。
作为另一个技术方案，本发明还提供一种清洗设备，包括用于承载被加工工件的载具和用于清洗所述被加工工件的待清洗表面的喷淋装置，所述喷淋装置采用本发明提供的上述喷淋装置。
本发明具有以下有益效果：
本发明提供的喷淋装置，其借助喷淋组件朝向被加工工件的待清洗表面喷出清洗液体，且该喷淋组件被设置为：对应该待清洗表面的径向上的不同位置处喷出的清洗液体的浓度、温度和/或流量不同，可以使清洗液体对待清洗表面的径向上的不同位置处的清洗速率一致，从而可以提高清洗均匀性，同时避免因液膜厚度过小而形成凸点，进而可以提高产品良率。此外，由于清洗液体的浓度、温度和/或流量的变化对清洗速率的影响效果较明显，因此，可以提高反馈速率。
本发明提供的清洗设备，其通过采用本发明提供的上述喷淋装置，可以提高清洗均匀性，提高产品良率。
附图说明
图1为本发明第一实施例提供的喷淋装置的结构图；
图2为本发明第一实施例提供的喷淋装置的原理图；
图3为本发明第一实施例采用的进液管路的一种结构图；
图4为本发明第一实施例采用的进液管路的另一种结构图；
图5为本发明第二实施例提供的喷淋装置的喷头的结构图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案，下面结合附图来对本发明提供的喷淋装置及清洗设备进行详细描述。
本发明提供一种喷淋装置，其包括喷淋组件，用于朝向被加工工件的待清洗表面喷出清洗液体。该清洗液体通常为化学药液，可以与被加工工件的待清洗表面上的物质发生化学反应，从而腐蚀掉待清洗表面上不需要的氧化膜或者其他膜层。在实际应用中，为了保证工艺均匀性，通常需要使被加工工件旋转，但是，由于旋转中的晶片的边缘线速度远大于中心线速度，导致 当药液均匀且垂直地喷射到晶圆表面时，晶片表面的边缘区域上的液膜厚度明显小于中心区域上的液膜厚度，从而造成晶片径向上的液膜厚度不均匀，同时由于晶片表面的边缘区域上的液膜厚度过小，腐蚀速度慢，容易形成凸点，从而影响产品良率。
为了解决上述问题，本发明提供的喷淋组件，其被设置为：对应待清洗表面的径向上的不同位置处喷出的清洗液体的浓度、温度和/或流量不同。由于浓度、温度和流量都是影响化学反应速率的重要因素，具体地，清洗液体的浓度或者温度越高，则喷淋在待清洗表面上的液膜厚度越大；反之，清洗液体的浓度或者温度越低，则喷淋在待清洗表面上的液膜厚度越小。清洗液体的流量越大，则喷淋在待清洗表面上的液膜厚度越大；反之，清洗液体的流量越小，则喷淋在待清洗表面上的液膜厚度越小。基于此，借助喷淋组件对应待清洗表面的径向上的不同位置处喷出的清洗液体的浓度、温度和/或流量不同，可以使清洗液体对待清洗表面的径向上的不同位置处的清洗速率一致，从而可以提高清洗均匀性，同时避免因液膜厚度过小而形成凸点，进而可以提高产品良率。此外，由于清洗液体的浓度、温度和/或流量的变化对清洗速率的影响效果较明显，因此，可以提高反馈速率。
下面对本发明提供的喷淋组件的具体实施方式进行详细描述。具体地，请参阅图1和图2，本发明第一实施例提供的喷淋组件，其包括喷头40、多条进液管路41和驱动源30，其中，喷头40用于朝向被加工工件20的待清洗表面21喷出清洗液体；驱动源30用于在被加工工件旋转时驱动喷头40在待清洗表面21的边缘与中心之间作往复运动，以实现喷头40能够将喷出的清洗液体覆盖整个待清洗表面21。多条进液管路41均用于向喷头40提供清洗液体，在每条进液管路41上设置有通断阀；并且，通过在喷头运动过程中，采用预设规则控制通断阀的开启顺序和/或切换通断阀的开启数量，来实现对应待清洗表面的径向上的不同位置处喷出的清洗液体的浓度、温度和/ 或流量不同。
这样，可以达到使清洗液体对待清洗表面21的径向上的不同位置处的清洗速率一致。同时，通过采用通断阀瞬时开关的方式来实现不同进液管路41之间的切换，可以降低自喷头喷出的清洗液体的浓度和/或温度变化的延时性，从而可以准确控制待清洗表面径向上的清洗液体的浓度和/或温度的均匀性，进而可以精确控制腐蚀速率，提高对晶片的腐蚀均匀性。
在本实施例中，驱动源30为旋转驱动源，用于驱动喷头40在待清洗表面21的边缘与中心之间作往复摆动。具体地，旋转驱动源包括驱动臂和旋转电机，其中，驱动臂竖直设置在用于承载被加工工件20的载具10的一侧；喷头40设置在驱动臂上，且位于载具10的上方；旋转电机用于驱动驱动臂顺时针或者逆时针旋转预定角度。
例如，如图2所示，在旋转电机的驱动下，驱动臂带动喷头40自待清洗表面21的一个边缘A顺时针旋转预定角度，以旋转至待清洗表面21的中心B；然后自中心B顺时针旋转预定角度，以旋转至待清洗表面21的另一个边缘C；之后，驱动臂带动喷头40自边缘C逆时针旋转预定角度，以反向旋转至中心B；然后自中心B逆时针旋转预定角度，以返回边缘A。如此往复，在被加工工件20的旋转运动的配合下，可以实现清洗液体覆盖整个待清洗表面，同时使喷头40能够在待清洗表面21的边缘与中心之间作往复摆动。
当然，在实际应用中，驱动臂还可以采用其他旋转路径，只要清洗液体能够覆盖整个待清洗表面，同时使喷头40能够在待清洗表面21的边缘与中心之间作往复摆动即可。或者，也可以采用直线驱动源代替上述旋转驱动源，在这种情况下，直线驱动源用于驱动喷头沿待清洗表面的径向作直线往复运动，这同样可以实现清洗液体能够覆盖整个待清洗表面，同时使喷头能够在待清洗表面的边缘与中心之间作往复摆动。
在本实施例中，如图3所示，喷淋组件还包括进液总路42；多条进液管路41的出液端均与该进液总路42的进液端连接；进液总路42的出液端与喷头40连接。当然，在实际应用中，进液管路41也可以相互独立，并且进液管路41的出液端均直接与喷头40连接，如图4所示。
在本实施例中，每条进液管路41提供的清洗液体的浓度和/或温度不同。由于设置有多条用于输送不同浓度和/或温度的清洗液体的进液管路41，在喷头40在待清洗表面21的边缘与中心之间作往复旋转运动的过程中，通过按预设顺序开启通断阀，可以使不同的进液管路41向喷头40提供浓度和/或温度不同的清洗液体，从而实现对应待清洗表面的径向上的不同位置处喷出的清洗液体的浓度和/或温度不同，进而使清洗液体对待清洗表面的径向上的不同位置处的清洗速率一致。
具体地，上述预设顺序可以为：在驱动源30驱动喷头41自待清洗表面21的边缘向中心作往复运动的过程中，按浓度和/或温度由高至低的顺序依次开启相应进液管路41上的通断阀，且始终保持所有的进液管路41中仅有一条进液管路上的通断阀是开启的。也就是说，在喷头41自待清洗表面21的边缘向中心作往复运动的过程中，始终只有一条进液管路41向喷头41提供清洗液体，而通过切换不同的进液管路41，来实现浓度和/或温度的改变。
这样，可以使清洗液体的浓度和/或温度自待清洗表面21的边缘向中心降低，从而可以补偿被加工工件因径向上的线速度差异而产生的液膜厚度差异，进而使待清洗表面21的径向上的液膜厚度趋于一致。同时，通过采用通断阀瞬时开关的方式来实现不同进液管路41之间的切换，可以降低自喷头喷出的清洗液体的浓度和/或温度变化的延时性，从而可以准确控制待清洗表面径向上的清洗液体的浓度和/或温度的均匀性。
例如，如图3所示，进液管路41为三条，分别为第一进液管路41A、第二进液管路41B和第三进液管路41C。并且，在第一进液管路41A、第二 进液管路41B和第三进液管路41C上分别设置有第一通断阀43A、第二通断阀43B和第三通断阀43C。在这种情况下，可以设定第一进液管路41A、第二进液管路41B和第三进液管路41C中的清洗液体的浓度和/或温度按序号顺序依次降低。在驱动源30驱动喷头41自待清洗表面21的边缘向中心作往复运动的过程中，按序号顺序依次开启三条进液管路(41A～41C)上的通断阀(43A～43C)，且在每开启一条进液管路上的通断阀的同时，将上一条开启的进液管路上的通断阀关闭，以保证只有一条进液管路上的通断阀是开启的。
相反的，在驱动源30驱动喷头40自待清洗表面21的中心向边缘作往复运动的过程中，按浓度和/或温度由低至高的顺序依次开启相应进液管路41上的通断阀，且始终保持所有的进液管路41中仅有一条进液管路上的所述通断阀是开启的。这样，可以使清洗液体的浓度和/或温度自待清洗表面21的中心向边缘提高。
在本实施例中，上述预设规则还可以包括：在喷头40在待清洗表面21的边缘与中心之间作往复旋转运动的过程中，通过切换通断阀的开启数量，来实现对喷头40喷出的清洗液体的流量进行调节，从而实现对应待清洗表面的径向上的不同位置处喷出的清洗液体的流量不同，以使清洗液体对待清洗表面的径向上的不同位置处的清洗速率一致。此外，由于是通过在不同的进液管路之间进行切换，来调节喷头40喷出的清洗液体的流量大小，这与采用流量调节阀调节流量大小的方式相比，不存在流量调节的滞后性，从而可以提高反馈速率，同时可以提高流量控制的精确性。
具体地，在驱动源30驱动喷头40自待清洗表面21的边缘向中心运动的过程中，通断阀的开启数量逐渐减小。这样，可以使清洗液体的流量自待清洗表面21的边缘向中心减小，从而可以补偿被加工工件20因径向上的线速度差异而产生的液膜厚度差异，进而使待清洗表面21的径向上的液膜厚度趋于一致。
以图3示出的三条进液管路(41A～41C)为例，在驱动源30驱动喷头40自待清洗表面21的边缘向中心运动的过程中，可以进行三次通断阀的操作，其中，第一次操作通断阀，数量x为3，即，同时开启三条进液管路41上的通断阀(43A～43C)，此时喷头40喷出的清洗液体的流量最大；第二次操作通断阀，数量x为2，即，同时开启两条进液管路41上的通断阀，此时喷头40喷出的清洗液体的流量相对于第一次操作通断阀减小；第三次操作通断阀，数量x为1，即，开启一条进液管路41上的通断阀，此时喷头40喷出的清洗液体的流量最小。
相反的，在驱动源30驱动喷头40自待清洗表面21的中心向边缘运动的过程中，通断阀的开启数量x逐渐增大。这样，可以使清洗液体的流量自待清洗表面21的中心向边缘提高。
需要说明的是，在本实际应用中，喷头40可以具有一个喷液孔，或者，也可以具有多个喷液孔。
还需要说明的是，在实际应用中，还可以采用其他任意规则来控制通断阀的开启顺序和/或切换通断阀的开启数量，只要能够实现对应待清洗表面的径向上的不同位置处喷出的清洗液体的浓度、温度和/或流量不同。
请参阅图5，本发明第二实施例提供的喷淋装置，其与上述第一实施例相比，同样包括喷淋组件。
具体地，该喷淋组件包括喷头40’和多条进液管路，其中，喷头40’包括多个喷液孔401，多个喷液孔401排布在以待清洗表面的中心为圆心，且半径不同的多个圆周上。例如，图5中示出了多个喷液孔401排布在5个圆周上(1～5)；进液管路的数量与圆周的数量对应，且一一对应地设置，每条进液管路用于同时向与之对应的圆周上的各个喷液孔401提供不同浓度、温度和/或流量的清洗液体。
这样，不同的圆周上的喷液孔401喷出的清洗液体的浓度、温度和/或流 量不同，即，对应待清洗表面的径向上的不同位置处喷出的清洗液体的浓度、温度和/或流量不同。具体地，圆周的半径越大，该圆周上的各个喷液孔401所对应的进液管路提供的清洗液体的浓度、温度和/或流量越大，这样，可以补偿被加工工件因径向上的线速度差异而产生的液膜厚度差异，进而使待清洗表面的径向上的液膜厚度趋于一致。
由上可知，在本实施例中，喷头40’是固定不同的，且多个喷液孔401所在的多个圆周与待清洗表面的径向上的不同位置相对应，并通过使不同的圆周上的喷液孔401喷出的清洗液体的浓度、温度和/或流量不同，最终实现待清洗表面的径向上的液膜厚度趋于一致。
在实际应用中，多个喷液孔401的孔径可以相同，或者也可以不同，并且圆周的半径越大，该圆周上的喷液孔401的直径越大，以使喷出的清洗液体的流量自待清洗表面的边缘向中心逐渐减小。在这种情况下，进液管路可以为一条，用于向所有的喷液孔提供清洗液体；或者，进液管路为多条，各进液管路向与之对应的圆周上的各个喷液孔401提供的清洗液体的流量可以相同，或者也可以不同。
综上所述，本发明上述各个实施例提供的喷淋装置，其借助喷淋组件朝向被加工工件的待清洗表面喷出清洗液体，且该喷淋组件被设置为对应该待清洗表面的径向上的不同位置处喷出的清洗液体的浓度、温度和/或流量不同，可以使清洗液体对待清洗表面的径向上的不同位置处的清洗速率一致，从而可以提高清洗均匀性，同时避免因液膜厚度过小而形成凸点，进而可以提高产品良率。此外，由于清洗液体的浓度、温度和/或流量的变化对清洗速率的影响效果较明显，因此，可以提高反馈速率。
作为另一个技术方案，本发明实施例还提供一种清洗设备，包括用于承载被加工工件的载具和用于清洗被加工工件的待清洗表面的喷淋装置，该喷淋装置采用了本发明上述各个实施例提供的喷淋装置。
本发明实施例提供的清洗设备，其通过采用本发明实施例提供的上述喷淋装置，可以提高清洗均匀性，提高产品良率。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (11)

  1. 一种喷淋装置，其特征在于，包括：
    喷淋组件，用于朝向被加工工件的待清洗表面喷出清洗液体，且所述喷淋组件被设置为对应所述待清洗表面的径向上的不同位置处喷出的所述清洗液体的浓度、温度和/或流量不同，以使所述清洗液体对所述待清洗表面的径向上的不同位置处的清洗速率一致。
  2. 根据权利要求1所述的喷淋装置，其特征在于，所述喷淋组件包括喷头、多条进液管路和驱动源，其中，
    所述喷头用于朝向所述待清洗表面喷出清洗液体；
    所述驱动源用于在所述被加工工件旋转时驱动所述喷头在所述待清洗表面的边缘与中心之间作往复运动；
    多条所述进液管路均用于向所述喷头提供清洗液体，且在每条所述进液管路上设置有通断阀；并且，通过在所述喷头运动过程中采用预设规则控制所述通断阀的开启顺序和/或切换所述通断阀的开启数量，来实现对应所述待清洗表面的径向上的不同位置处喷出的所述清洗液体的浓度、温度和/或流量不同。
  3. 根据权利要求2所述的喷淋装置，其特征在于，所述预设规则包括：
    每条所述进液管路提供的清洗液体的浓度和/或温度不同；并且，在所述喷头运动过程中按预设顺序开启所述通断阀，且始终保持所有的所述进液管路中仅有一条所述进液管路上的所述通断阀是开启的，以实现对应所述待清洗表面的径向上的不同位置处喷出的所述清洗液体的浓度和/或温度不同。
  4. 根据权利要求3所述的喷淋装置，其特征在于，所述预设顺序为：
    在所述驱动源驱动所述喷头自所述待清洗表面的边缘向中心运动的过 程中，按浓度和/或温度由高至低的顺序依次开启相应所述进液管路上的所述通断阀；
    在所述驱动源驱动所述喷头自所述待清洗表面的中心向边缘运动的过程中，按浓度和/或温度由低至高的顺序依次开启相应所述进液管路上的所述通断阀。
  5. 根据权利要求2所述的喷淋装置，其特征在于，所述预设规则包括：
    在所述驱动源驱动所述喷头自所述待清洗表面的边缘向中心运动的过程中，所述通断阀的开启数量逐渐减小；
    在所述驱动源驱动所述喷头自所述待清洗表面的中心向边缘运动的过程中，所述通断阀的开启数量逐渐增大。
  6. 根据权利要求2-5任意一项所述的喷淋装置，其特征在于，所述驱动源为旋转驱动源，用于驱动所述喷头在所述待清洗表面的边缘与中心之间作往复摆动。
  7. 根据权利要求6所述的喷淋装置，其特征在于，所述旋转驱动源包括驱动臂和旋转电机，其中，
    所述驱动臂竖直设置在用于承载所述被加工工件的载具的一侧；所述喷头设置在所述驱动臂上，且位于所述载具的上方；
    所述旋转电机用于驱动所述驱动臂顺时针或者逆时针旋转预定角度。
  8. 根据权利要求1所述的喷淋装置，其特征在于，所述喷淋组件包括喷头和多条进液管路，其中，
    所述喷头包括多个喷液孔，多个喷液孔排布在以所述待清洗表面的中心为圆心，且半径不同的多个圆周上；
    所述进液管路的数量与所述圆周的数量对应，且一一对应地设置，每条 进液管路用于向与之对应的圆周上的各个所述喷液孔提供不同浓度、温度和/或流量的清洗液体。
  9. 根据权利要求8所述的喷淋装置，其特征在于，所述圆周的半径越大，该圆周上的各个所述喷液孔所对应的所述进液管路提供的清洗液体的浓度、温度和/或流量越大。
  10. 根据权利要求1所述的喷淋装置，其特征在于，所述喷淋组件包括喷头和进液管路，其中，
    所述喷头包括多个喷液孔，多个喷液孔排布在以所述待清洗表面的中心为圆心，且半径不同的多个圆周上；并且，所述圆周的半径越大，该圆周上的所述喷液孔的直径越大；
    所述进液管路用于同时向所有的所述喷液孔提供清洗液体。
  11. 一种清洗设备，包括用于承载被加工工件的载具和用于清洗所述被加工工件的待清洗表面的喷淋装置，其特征在于，所述喷淋装置采用权利要求1-10任意一项所述的喷淋装置。
PCT/CN2019/108137 2018-10-18 2019-09-26 喷淋装置及清洗设备 WO2020078191A1 (zh)

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