WO2022182177A1 - Ensemble broche de contact électroconductrice et son procédé de fabrication - Google Patents

Ensemble broche de contact électroconductrice et son procédé de fabrication Download PDF

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Publication number
WO2022182177A1
WO2022182177A1 PCT/KR2022/002735 KR2022002735W WO2022182177A1 WO 2022182177 A1 WO2022182177 A1 WO 2022182177A1 KR 2022002735 W KR2022002735 W KR 2022002735W WO 2022182177 A1 WO2022182177 A1 WO 2022182177A1
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WO
WIPO (PCT)
Prior art keywords
electrically conductive
conductive contact
contact pin
housing
mold
Prior art date
Application number
PCT/KR2022/002735
Other languages
English (en)
Korean (ko)
Inventor
안범모
박승호
변성현
Original Assignee
(주)포인트엔지니어링
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Application filed by (주)포인트엔지니어링 filed Critical (주)포인트엔지니어링
Publication of WO2022182177A1 publication Critical patent/WO2022182177A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Definitions

  • the present invention relates to an electrically conductive contact pin assembly and a method for manufacturing the same.
  • a test apparatus and test socket having a plurality of electrically conductive contact pins between a connection terminal of a semiconductor package or wafer for testing and a connection terminal on the side of the test circuit board are used in a test apparatus for a semiconductor package or a wafer for an integrated circuit.
  • an inspection object semiconductor wafer or semiconductor package
  • the electrically conductive contact pins are applied to corresponding electrode pads (or solder balls or bumps) on the inspection object. This is done by making contact.
  • the electrically conductive contact pin and the electrode pad on the inspection object are brought into contact, after reaching a state in which both start to contact, a process for further approaching the inspection object is performed.
  • FIG. 11 shows an electrically conductive contact pin according to the prior art.
  • the electrically conductive contact pin shown in FIG. 11 is a slide-type electrically conductive contact pin that provides necessary contact pressure and absorbs shock at the contact position by installing the spring member 12 between the tip portions 11 at both ends.
  • Patent Document 1 Republic of Korea Patent Publication Registration No. 10-0659944
  • Patent Document 2 Republic of Korea Patent Publication No. 10-0647131
  • the present invention has been devised to solve the problems of the prior art described above, and it is possible to precisely manage a minute gap between the electrical conductivity and the housing by manufacturing an electrically conductive contact pin and a housing at once using a MEMS process.
  • An object of the present invention is to provide a conductive contact pin assembly and a method for manufacturing the same.
  • a method for manufacturing an electrically conductive contact pin assembly of the present invention includes: manufacturing an electrically conductive contact pin and a sidewall of a housing using a first mold made of an anodized film; manufacturing an upper surface portion of the housing to be connected to the sidewall portion and spaced apart from the first surface of the electrically conductive contact pin by using a second mold made of a patternable material; manufacturing a lower surface portion of the housing to be connected to the side wall portion and spaced apart from a second surface of the electrically conductive contact pin by using a third mold made of a patternable material; and removing the first mold, the second mold, and the third mold.
  • the manufacturing of the electrically conductive contact pin and the sidewall of the housing may include: forming a first opening pattern and a second opening pattern in a first mold made of the anodized film material; and filling the first opening pattern and the second opening pattern with metal to fabricate the electrically conductive contact pin and a sidewall of the housing.
  • the manufacturing of the upper surface of the housing may include: forming a patternable material and patterning it to form a second mold having a third opening pattern; and filling the third opening pattern of the second mold with metal to fabricate the upper surface of the housing.
  • the manufacturing of the lower surface of the housing may include: forming a patternable material and patterning it to form a third mold having a fourth opening pattern; and manufacturing the lower surface of the housing by filling the fourth opening pattern of the third mold with metal.
  • the electrically conductive contact pin assembly of the present invention an electrically conductive contact pin having a first surface, a second surface opposite to the first surface, and a side connecting the first surface and the second surface; and a housing in which the electrically conductive contact pin is slidable therein and has an upper surface portion opposite to the first surface, a lower surface portion opposite to the second surface, and a side wall portion opposite to the side surface;
  • the contact pin includes a plurality of first fine trenches formed in a long groove in the direction of the first surface and the second surface from the side of the contact pin formed side by side.
  • the first fine trench is not formed on the first surface and the second surface.
  • It also includes a second micro trench formed on a sidewall of the housing in the same direction as the first micro trench.
  • the second fine trenches are not formed above and below the second fine trenches.
  • the second fine trench is not formed in the upper surface portion and the lower surface portion.
  • the electrically conductive contact pin of the present invention an electrically conductive contact pin having a first surface, a second surface opposite to the first surface, and a side connecting the first surface and the second surface; and a housing in which the electrically conductive contact pin is slidable therein and has an upper surface portion opposite to the first surface, a lower surface portion opposite to the second surface, and a side wall portion opposite to the side surface; It includes a plurality of second fine trenches formed in a long groove in the direction of the first surface and the second surface from the side wall of the sidewall formed side by side.
  • the present invention provides an electrically conductive contact pin assembly capable of precisely managing a minute gap between electrical conductivity and a housing by manufacturing the electrically conductive contact pin and a housing at once using a MEMS process, and a method for manufacturing the same.
  • FIG. 1A is a plan view of an electrically conductive contact pin assembly according to a preferred embodiment of the present invention
  • FIG. 1B is a horizontal cross-sectional view of an electrically conductive contact pin assembly according to a preferred embodiment of the present invention
  • FIG. 2 is a vertical cross-sectional view of an electrically conductive contact pin assembly according to a preferred embodiment of the present invention
  • 3 to 6 are views showing a method of manufacturing an electrically conductive contact pin assembly according to a preferred embodiment of the present invention.
  • FIG. 7 is an end perspective view of an electrically conductive contact pin according to a preferred embodiment of the present invention.
  • FIG. 8 is a photograph taken at an end of an electrically conductive contact pin according to a preferred embodiment of the present invention.
  • FIG. 9 is a view showing a side view of an electrically conductive contact pin according to a preferred embodiment of the present invention.
  • FIG. 10 is a view showing a side view of a side wall portion of a housing according to a preferred embodiment of the present invention.
  • FIG. 11 is a view showing an electrically conductive contact pin assembly according to the prior art.
  • Embodiments described herein will be described with reference to cross-sectional and/or perspective views, which are ideal illustrative drawings of the present invention.
  • the thicknesses of films and regions shown in these drawings are exaggerated for effective description of technical content.
  • the shape of the illustrative drawing may be modified due to manufacturing technology and/or tolerance. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in the form generated according to the manufacturing process.
  • the electrically conductive contact pin according to a preferred embodiment of the present invention is manufactured by MEMS technology, and the field of application may vary according to its use.
  • the electrically conductive contact pin according to a preferred embodiment of the present invention is provided in the inspection device and is used to electrically and physically contact the inspection object to transmit an electrical signal.
  • the inspection apparatus may be an inspection apparatus used in a semiconductor manufacturing process, and for example, may be a probe card or a test socket depending on an object to be inspected.
  • the inspection apparatus according to the preferred embodiment of the present invention is not limited thereto, and any apparatus for checking whether an object to be inspected is defective by applying electricity is included.
  • FIG 1 and 2 are views for explaining an electrically conductive contact pin assembly 100 according to a preferred embodiment of the present invention.
  • the electrically conductive contact pin assembly 100 is configured to include an electrically conductive contact pin 200 and a housing 300 in which the electrically conductive contact pin 200 is accommodated.
  • the electrically conductive contact pin 200 has a first surface 201, a second surface 202 opposite to the first surface 201, and a side connecting the first surface 201 and the second surface 202 ( 203) is provided.
  • the electrically conductive contact pin 200 is slidable inside the housing 300 and has an upper surface portion 301 opposite to the first surface 201, a lower surface portion 302 opposite to the second surface 202, and a side surface ( A side wall portion 303 opposite to 203 is provided.
  • an electrically conductive contact pin 200 includes a first contact tip 210 , a second contact tip 230 , and a first contact tip 210 and and a body part 250 connecting the second contact tip part 230 .
  • An elastic contact portion 270 is formed on at least one of the first contact tip portion 210 and the second contact tip portion 230 .
  • the first contact tip portion 210 , the second contact tip portion 230 , and the body portion 250 are integrally manufactured by MEMS technology.
  • the body part 250 may be formed in a zigzag shape to be elastically stretchable in the longitudinal direction of the electrically conductive contact pin 200 .
  • the shape of the body part 250 may be manufactured in another shape as long as it is elastically deformable other than the zigzag shape.
  • the electrically conductive contact pins 200 and the housing 300 may be formed of a conductive material.
  • the conductive material is platinum (Pt), rhodium (Ph), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir), nickel (Ni), cobalt (Co) or these or at least one selected from a nickel-cobalt (NiCo) alloy, a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (NiP) alloy.
  • the electrically conductive contact pins 200 and the sidewall 303 of the housing 300 may have a multi-layered structure in which a plurality of conductive materials are stacked.
  • Each conductive layer made of a different material is platinum (Pt), rhodium (Ph), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir), nickel (Ni) ), cobalt (Co) or an alloy thereof, or a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (NiP) alloy.
  • the first contact tip portion 210 is a portion that substantially contacts the pad of the inspection device or the inspection object
  • the second contact tip portion 230 is a portion that is in substantially contact with the inspection object or the pad of the inspection device, and is an electrically conductive contact pin
  • the elastic contact portion 270 is formed on at least one of the first contact tip portion 210 and the second contact tip portion 230 . 1 shows a configuration in which the elastic contact portion 270 is provided on the first contact tip portion 210 .
  • One end of the elastic contact portion 270 is connected to the first contact tip portion 400 , and the other end of the elastic contact portion 270 is a free end. Through this, the elastic contact portion 270 is elastically deformable while being supported and fixed by the first contact tip portion 400 .
  • the elastic contact portion 270 provided on the left side of the electrically conductive contact pin 200 is curved in the same shape as the English alphabet "C” shape, and the elastic contact portion 270 provided on the right side of the electrically conductive contact pin 200 . ) is formed by being curved in the same shape as the "inverted C” shape.
  • One end of the elastic contact portion 270 is a root portion connected to the first contact tip portion 400, and the thickness of the electrically conductive contact pin 200 increases from the other end to the root portion. Through this, it has an effect of preventing the stress from being concentrated and damaged in the vicinity of the electrically conductive contact pin 200 when deformed.
  • the other end of the elastic contact portion 270 is configured as a free end. If the other end of the elastic contact portion 270 is not configured as a free end but is connected to somewhere in the electrically conductive contact pin 200, the elastic contact portion 270 deforms when the first contact tip portion 210 slides. Since it is not large, the frictional resistance can act significantly. On the contrary, the elastic contact portion 270 according to the preferred embodiment of the present invention has the other end configured as a free end, so that when the first contact tip portion 210 slides, deformation of the elastic contact portion 270 easily occurs, thereby reducing frictional resistance. has the effect of reducing
  • the elastic contact portion 270 is provided on both sides of the first contact tip portion 210 .
  • the length of the width before deformation of the elastic contact portion 270 provided on both sides of the first contact tip portion 210 is smaller than the length between the inner surfaces of the housing 500 . Through this, the first contact tip 210 can always maintain a state of contact with the inner surface of the housing 500 .
  • the elastic contact part 270 has a curved shape, even when the first contact tip part 210 slides along the inner surface of the housing 500 , the normal drag force of the frictional force acting on the elastic contact part 270 is the first contact tip part It acts in the (210) direction. As a result, the first contact tip 210 can always maintain a contact state with the inner surface of the housing 500 even when sliding.
  • the elastic contact part 270 contacts the inner surface of the housing 500 made of an electrically conductive material, a current path passing through the first contact tip part 210 , the housing 500 , and the second contact tip part 230 is formed. Therefore, the elastic deformation of the electrically conductive contact pin 200 is handled by the body part 250, and the current path of the electrically conductive contact pin 200 is the first contact tip part 210, the housing 500, and the second contact tip part ( As the 230 is in charge, it is possible to form a shorter path of the current flowing through the electrically conductive contact pin 200 .
  • Locking projections 310 are provided at both ends of the housing 500 .
  • the size of the hole formed by the locking protrusion 310 is such that the electrically conductive contact pin 200 cannot easily come out.
  • the size of the hole formed by the locking protrusion 310 is larger than the width of the first contact tip portion 210 and smaller than the longest distance between the two elastic contact portions 270 .
  • the locking jaw 310 supports the root of the elastic contact part 270 . Through this, it is possible to make a clearance between the housing 500 and the locking jaw 310 during the manufacturing process, and it is possible to ensure smooth sliding movement of the first contact tip portion 210 .
  • the elastic contact part 270 since the elastic contact part 270 always maintains a state of contact with the inner surface of the housing 500 , foreign substances are prevented from penetrating into the housing 500 . Moreover, since a sufficient separation space exists between the locking jaw 310 and the first contact tip 210 on the proximal side of the elastic contact portion 270 , it is possible to easily discharge foreign substances generated during the sliding process to the outside.
  • the electrically conductive contact pin 200 and the housing 300 are simultaneously manufactured using a MEMS process.
  • a method of manufacturing the electrically conductive contact pin assembly 100 according to a preferred embodiment of the present invention will be described with reference to FIGS. 3 to 6 .
  • the manufacturing method of the electrically conductive contact pin assembly 100 comprises (i) an electrically conductive contact pin 200 and a housing 300 using a first mold 10 made of an anodized film material. manufacturing the side wall portion 303; (ii) the upper surface portion of the housing 300 so as to be connected to the side wall portion 303 using the second mold 20 made of a patternable material and spaced apart from the first surface 201 of the electrically conductive contact pin 200 ( 301) making; (iii) the lower surface of the housing 300 so as to be connected to the sidewall 303 using the third mold 30 of a patternable material and spaced apart from the second surface 202 of the electrically conductive contact pin 200 ( 302) making; and (iv) removing the first mold 10 , the second mold 20 , and the third mold 30 .
  • manufacturing the electrically conductive contact pins 200 and the sidewall portion 303 of the housing 300 includes the first opening pattern 11 and the second forming an opening pattern 12; and filling the first opening pattern 11 and the second opening pattern 12 with metal to fabricate the electrically conductive contact pin 200 and the sidewall portion 303 of the housing 300 .
  • a first mold 10 made of an anodized film material is prepared.
  • a first seed layer 15 is provided under the first mold 10 made of an anodized film material.
  • the first seed layer 15 is previously formed under the first mold 10 for subsequent electroplating.
  • the first seed layer 15 is preferably made of copper (Cu), platinum (Pt), tantalum (Ta), titanium (Ti), or an alloy thereof. There is no limit.
  • the first seed layer 15 may be made of copper (Cu).
  • the first seed layer 15 may be formed to a thickness of 10 nm or more and 1 ⁇ m or less by a sputtering process.
  • the first mold 10 made of an anodization film means a film formed by anodizing a metal, which is a base material, and the pores mean a hole formed in the process of forming an anodization film by anodizing the metal.
  • a metal which is a base material
  • the pores mean a hole formed in the process of forming an anodization film by anodizing the metal.
  • the base metal is aluminum (Al) or an aluminum alloy
  • Al 2 0 3 aluminum oxide
  • the anodic oxide film formed as described above is vertically divided into a barrier layer in which pores are not formed and a porous layer in which pores are formed.
  • the anodized film may be formed in a structure in which the barrier layer formed during anodization is removed to penetrate the top and bottom of the pores, or the barrier layer formed during anodization remains as it is and seals one end of the top and bottom of the pores.
  • the anodized film has a coefficient of thermal expansion of 2-3 ppm/°C. For this reason, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, even in a high-temperature environment in the manufacturing environment of the electrically conductive contact pin 200, the precise electrically conductive contact pin 200 can be manufactured without thermal deformation.
  • a first opening pattern 11 and a second opening pattern 12 are formed on the first mold 10 made of an anodized film material.
  • the first opening pattern 11 and the second opening pattern 12 may be formed by removing at least a portion of the first mold 10 made of an anodized film material.
  • the first opening pattern 11 and the second opening pattern 12 may be formed by etching the first mold 10 made of an anodized film material.
  • a photoresist is provided on the upper surface of the first mold 10 made of an anodization film and patterned. Then, the patterned and open anodization film reacts with the etching solution to form the first opening pattern 11 and the second opening.
  • a pattern 12 may be formed.
  • a photosensitive material is provided on the upper surface of the first mold 10 made of an anodization film material before the first opening pattern 11 and the second opening pattern 12 are formed, and then exposure and development processes are performed.
  • can At least a portion of the photosensitive material may be patterned and removed while forming an open area by an exposure and development process.
  • the etching process is performed on the first mold 10 made of the anodized film material through the open region from which the photosensitive material is removed by the patterning process to form the first opening pattern 11 and the second opening pattern 12 .
  • the first mold 10 made of an anodization film is wet-etched with an etching solution, a first opening pattern 11 and a second opening pattern 12 having vertical inner walls are formed.
  • the shape precision of the plating layer is improved, and the electrically conductive contact pins 200 and the sidewalls of the housing 300 have a precise microstructure. (303) can be produced.
  • a plurality of first fine trenches 250 formed in a long groove in the direction of the first surface 201 and the second surface 202 are formed side by side, and the first A second fine trench 350 is formed in the sidewall 303 of the housing 300 in the same direction as the fine trench 250 .
  • a detailed configuration of the first fine trench 250 and the second fine trench 350 will be described later.
  • an electroplating process is performed using the first seed layer 15 .
  • a plating layer is formed inside the first opening pattern 11 to form an electrically conductive contact pin 200
  • a plating layer is formed inside the second opening pattern 12 to form a sidewall portion 303 of the housing 300 .
  • a planarization process may be performed.
  • the plating layer protruding from the upper surface of the first mold 10 made of an anodized film is removed and planarized through a chemical mechanical polishing (CMP) process.
  • CMP chemical mechanical polishing
  • the upper surface of the housing 300 is connected to the side wall portion 303 using the second mold 20 made of a patternable material and spaced apart from the first surface 201 of the electrically conductive contact pin 200 .
  • a step of manufacturing the part 301 is performed.
  • the manufacturing of the upper surface portion 301 of the housing 300 may include patterning the second seed layer 17 ; forming a second mold 20 having a third opening pattern 21 by forming a patternable material and patterning it; and filling the third opening pattern 21 of the second mold 20 with a metal.
  • a second seed layer 17 is provided on the first mold 10 made of an anodized film material.
  • the second seed layer 17 is preferably made of copper (Cu), platinum (Pt), tantalum (Ta), titanium (Ti), or an alloy thereof. There is no limit.
  • the second seed layer 17 may be made of copper (Cu).
  • the second seed layer 17 may be formed to a thickness of 10 nm or more and 1 ⁇ m or less by a sputtering process.
  • the second seed layer 17 is patterned.
  • the patterned second seed layer 17 is formed between the upper surface of the first surface 201 of the electrically conductive contact pin 200 and the side wall portion 303 of the housing 300 and the electrically conductive contact pin 200 . It is formed on the upper surface of the mold 10 .
  • the second seed layer 17 is not formed on the upper surface of the side wall portion 303 of the housing 300 .
  • a patternable material is formed on the upper surface of the first mold 10 .
  • the patternable material is a material capable of exposure and development processes, and may preferably be a photoresist material.
  • the patternable material is exposed and developed to form the third opening pattern 21 .
  • the second mold 20 having the third opening pattern 21 is formed.
  • the second seed layer 17 and the upper surface of the sidewall 303 of the housing 300 are exposed inside the third opening pattern 21 .
  • electroplating is performed using the first seed layer 15 , the second seed layer 17 , and the already formed plating layer to be connected to the sidewall 303 and electrically conductive contact.
  • the upper surface portion 301 of the housing 300 spaced apart from the first surface 201 of the pin 200 is manufactured.
  • the upper surface 301 of the housing 300 is spaced apart from the first surface 201 of the electrically conductive contact pin 200 by the thickness of the second seed layer 17 . Since the thickness of the second seed layer 17 is formed to a thickness of 10 nm or more and 1 ⁇ m or less, the upper surface 301 of the housing 300 is separated from the electrically conductive contact pins 200 by a distance of 10 nm or more and 1 ⁇ m or less. It is spaced apart from the first surface 201 .
  • the housing 300 is connected to the sidewall 303 and spaced apart from the second surface 202 of the electrically conductive contact pin 200.
  • a step of manufacturing the lower surface portion 302 is performed.
  • the manufacturing of the lower surface portion 302 of the housing 300 includes: patterning the first seed layer 17 ; forming a third mold 30 having a fourth opening pattern 31 by forming a patternable material and patterning it; and filling the fourth opening pattern 31 of the third mold 30 with a metal.
  • the one manufactured in the step of FIG. 5A is inverted by 180°.
  • the first seed layer 15 is patterned.
  • the patterned first seed layer 15 includes the upper surface (based on the drawing) of the second surface 202 of the electrically conductive contact pin 200 , the side wall portion 303 of the housing 300 and the electrically conductive contact pin 200 . It is formed on the upper surface (based on the drawing) of the first mold 10 in between.
  • the first seed layer 15 is not formed on the upper surface (based on the drawing) of the side wall portion 303 of the housing 300 .
  • a patternable material is formed on the upper surface (based on the drawing) of the first mold 10 .
  • the patternable material is a material capable of exposure and development processes, and may preferably be a photoresist material.
  • the patternable material is exposed and developed to form the fourth opening pattern 31 .
  • the third mold 30 having the fourth opening pattern 31 is formed.
  • the first seed layer 15 and the upper surface (based on the drawing) of the sidewall 303 of the housing 300 are exposed inside the fourth opening pattern 31 .
  • the lower surface 302 of the housing 300 is manufactured to be spaced apart from the second surface 202 of the pin 200 .
  • the lower surface 302 of the housing 300 is spaced apart from the second surface 202 of the electrically conductive contact pin 200 by the thickness of the first seed layer 15 . Since the thickness of the first seed layer 17 is formed to a thickness of 10 nm or more and 1 ⁇ m or less, the lower surface 302 of the housing 300 is separated from the electrically conductive contact pin 200 by a distance of 10 nm or more and 1 ⁇ m or less. It is spaced apart from the second surface 202 .
  • first mold 10 is made of an anodized film material
  • first mold 10 is removed using an etching solution that selectively reacts only to the anodized film.
  • second mold 20 and the third mold 30 are made of a photoresist material
  • the second mold 20 and the third mold 30 are removed using an etching solution that selectively reacts only with the photoresist.
  • the electrically conductive contact pin 200 and the housing 300 are manufactured at once, so the housing 300 and the electrically conductive contact pin 200 .
  • the inconvenience of the prior art of having to separately manufacture and then combine them is eliminated.
  • the electrically conductive contact pin 200 and the housing 300 are determined by the thickness of the anodization film and the first and second seed layers 15 and 17 present therebetween during the manufacturing process, the electrically conductive contact pin ( It is possible to make the gap between the 200 and the housing 300 fine. As a result, by minimizing the large flow of the electrically conductive contact pin 200 in the housing 300 , the problem of the prior art in which the electrically conductive contact pin 200 has a large flow in the housing 300 is solved. .
  • the distance between the electrically conductive contact pin 200 and the sidewall 303 of the housing 300 is determined by the width of the anodized film material, and the anodized film material positioned therebetween is the electrically conductive contact pin 200 and the housing. Refining the distance between the electrically conductive contact pin 200 and the sidewall 303 of the housing 300 is to reduce the gap between the electrically conductive contact pin 200 and the sidewall 303 of the housing 300 because it exists before the sidewall portion 303 of the 300 is manufactured and is not a configuration that is separately filled in the interspace. It is possible. Through this, a vertical glide that substantially satisfies the design contact position between the first contact tip part 210 and the second contact tip part 230 with the contact object is possible.
  • the first micro-trench 250 is formed in the direction of the first surface 201 and the second surface 202 from the side of the electrically conductive contact pin 200 , and the housing in the same direction as the first micro-trench 250 .
  • a second micro trench 350 is formed in the side wall portion 303 of the 300 .
  • the electrically conductive contact pin 200 includes a plurality of first micro trenches 250 formed on at least one surface of the electrically conductive contact pin 200 .
  • the first micro trenches 250 are formed on the side surfaces 203 of the electrically conductive contact pins 200 .
  • the first micro-trench 250 is formed to extend long in the thickness direction of the electrically conductive contact pin 200 from the side surface 203 of the electrically conductive contact pin 200 .
  • the thickness direction of the electrically conductive contact pin 200 refers to a direction in which the plating layer grows during electroplating.
  • the first fine trench 250 has a depth of 20 nm or more and 3 ⁇ m or less, and a width of 20 nm or more and 3 ⁇ m or less.
  • the width and depth of the first fine trench 250 is the first mold 10 made of the anodized film material.
  • the width and depth of the first fine trench 250 is the first mold 10 made of the anodized film material.
  • a part of the pores of the first mold 10 made of an anodization film are crushed by the etching solution during anodization. At least a portion of the first fine trenches 250 having a depth larger than a diameter range of the formed pores may be formed.
  • the first mold 10 made of an anodized film material includes a number of pores, and at least a portion of the first mold 10 made of the anodized film material is etched to form a first opening pattern 11, and the first opening pattern ( 11) Since the plating layer is formed inside by electroplating, the first micro trench 250 formed while in contact with the pores of the first mold 10 made of an anodized film material is provided on the side of the electrically conductive contact pin 200 .
  • the electrically conductive contact pin 200 is a first surface 201, a second surface 202 opposite to the first surface 201, a side ( 203), a plurality of first fine trenches ( 250).
  • the first micro-trench 250 is formed entirely over the side surface 203 of the electrically conductive contact pin 200 , but is not formed on the first surface 201 and the second surface 202 except for the side surface 203 .
  • the first fine trench 250 as described above has the effect of increasing the surface area on the side of the electrically conductive contact pin 200 .
  • the electrically conductive contact pin 200 according to the preferred embodiment of the present invention has the same shape dimensions as the conventional electrically conductive contact pin 200, the surface area at the side surface 203 of the electrically conductive contact pin 200 can be made larger.
  • the contact resistance of the electrically conductive contact pin 200 when contacting the contact object is reduced.
  • the first mold 10 made of the anodized film material may include a barrier layer and a pore layer formed during the manufacturing process of the anodized film.
  • the barrier layer may have a thickness of 10 nm or more and 500 nm or less.
  • the illuminance range of the side surface 203 is different from the illuminance range of the first surface 201 and the second surface 202 .
  • the roughness range of the side surface 203 of the electrically conductive contact pin 200 is the first of the electrically conductive contact pin 200 . greater than the illuminance range of the face 201 and the second face 202 .
  • the electrically conductive contact pin 200 is formed by stacking a plurality of layers in the thickness direction of the electrically conductive contact pin 200 , and the same layer may be formed of the same metal material. Referring to FIG. 8 , the electrically conductive contact pins 200 may be provided in a form in which a total of three metal layers are stacked.
  • the first layer 291 and the third layer 293 have excellent hardness properties to provide excellent mechanical elasticity to the electrically conductive contact pin 200 , and the second layer 292 provides excellent electrical properties for electrical conductivity.
  • the first layer 291 and the third layer 293 may be made of nickel (Ni) or a nickel (Ni) alloy material, and the second layer 292 may be made of copper (Cu) or a copper (Cu) alloy material. can be Through this, it is possible to provide a contact pin having excellent mechanical properties and at the same time having excellent electrical properties.
  • the side wall portion 303 of the housing 300 is formed in the side wall portion 303 of the housing 300 in the same direction as the first micro trench 250 . It includes a second fine trench 350 .
  • the second fine trench 350 is formed on the side surface of the side wall portion 303 .
  • the second fine trench 350 is formed to extend long in the thickness direction of the side wall portion 303 from the side surface of the side wall portion 303 of the housing 300 .
  • the thickness direction of the side wall portion 303 refers to a direction in which the plating layer grows during electroplating.
  • the second fine trench 350 has a depth of 20 nm or more and 3 ⁇ m or less, and a width of 20 nm or more and 3 ⁇ m or less.
  • the width and depth of the second fine trench 350 are the first mold 10 made of the anodized film material.
  • a part of the pores of the first mold 10 made of the anodization film are crushed by the etching solution during anodization. At least a portion of the second fine trench 350 having a depth greater than a diameter range of the formed pores may be formed.
  • the first mold 10 made of an anodized film material includes numerous pores, and at least a portion of the first mold 10 made of the anodized film material is etched to form a second opening pattern 12 , and the second opening pattern 11 ), since the plating layer is formed inside by electroplating, the sidewall portion 303 is provided with a second fine trench 350 formed while making contact with the pores of the first mold 10 made of an anodized film material.
  • the second fine trenches 350 are formed as long grooves in the direction from the first surface 201 to the second surface 202 in the sidewall 303 of the housing 300 , and a plurality of trenches are formed side by side.
  • the second fine trench 350 is formed on the side surface 203 of the side wall part 350 , but is not formed on the upper surface part 301 and the lower surface part 3022 except for the side wall part 303 .
  • the second fine trench 350 is not formed on the upper portion of the second fine trench 350 among the side surfaces of the sidewall part 350 and the second fine trench 350 is not formed. That is, the second fine trenches 350 are spaced apart by a predetermined distance from the upper portion and spaced apart from the lower portion by a predetermined distance based on the side surface of the sidewall part 350 .
  • the distance at which the second fine trench 350 is spaced apart from the upper portion of the side surface of the sidewall part 350 is the same as the thickness of the second seed layer 17 , and the second fine trench 350 is the side surface of the sidewall part 350 .
  • the distance spaced apart from the lower part of is equal to the thickness of the first seed layer 15 .
  • the second fine trench 350 as described above has an effect of increasing the surface area of the side wall portion 303 of the housing 300 .
  • the surface area of the side wall portion 303 of the housing 300 can be made larger.
  • the electrically conductive contact pin 200 and the housing 300 are separated from each other has been described as an example, but at least a portion of the electrically conductive contact pin 200 may be integrally configured with the housing 300 . have.
  • the first contact tip portion 210 or the second contact tip portion 230 of the electrically conductive contact pin 200 may be integrally configured with the housing 300, and more preferably, the elastic contact portion 270 is not provided.
  • the second contact tip 230 may be integrally formed with the housing 300 .

Abstract

La présente invention concerne un ensemble broche de contact électroconductrice et son procédé de fabrication, une broche de contact électroconductrice et un boîtier étant fabriqués en une seule fois au moyen d'un procédé MEMS, de telle sorte qu'un espace minuscule entre la broche de contact électroconductrice et le boîtier peut être géré avec précision.
PCT/KR2022/002735 2021-02-26 2022-02-24 Ensemble broche de contact électroconductrice et son procédé de fabrication WO2022182177A1 (fr)

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KR1020210026551A KR102517778B1 (ko) 2021-02-26 2021-02-26 전기 전도성 접촉핀 어셈블리 및 그 제조방법
KR10-2021-0026551 2021-02-26

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WO2022182177A1 true WO2022182177A1 (fr) 2022-09-01

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TWI818449B (zh) 2023-10-11
TW202234072A (zh) 2022-09-01

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