WO2023059014A1 - Broche de contact électriquement conductrice - Google Patents

Broche de contact électriquement conductrice Download PDF

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Publication number
WO2023059014A1
WO2023059014A1 PCT/KR2022/014834 KR2022014834W WO2023059014A1 WO 2023059014 A1 WO2023059014 A1 WO 2023059014A1 KR 2022014834 W KR2022014834 W KR 2022014834W WO 2023059014 A1 WO2023059014 A1 WO 2023059014A1
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WO
WIPO (PCT)
Prior art keywords
moving tip
conductive contact
electrically conductive
contact pin
moving
Prior art date
Application number
PCT/KR2022/014834
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English (en)
Korean (ko)
Inventor
안범모
박승호
홍창희
Original Assignee
(주)포인트엔지니어링
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Application filed by (주)포인트엔지니어링 filed Critical (주)포인트엔지니어링
Publication of WO2023059014A1 publication Critical patent/WO2023059014A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers

Definitions

  • the present invention relates to electrically conductive contact pins.
  • FIG. 1A is a diagram schematically illustrating a probe card 1 according to the prior art.
  • FIG. 1B is a diagram showing a energized state of a probe pin 7 according to the prior art.
  • the probe card 1 includes a circuit board 2, a space converter 3 provided on the lower side of the circuit board 2, and a probe head 7 provided on the lower side of the space converter 3. do.
  • the probe head 7 includes guide plates 5 and 6 having a plurality of probe pins 7 and guide holes into which the probe pins 7 are inserted.
  • the probe head 7 includes an upper guide plate 5 and a lower guide plate 6, and the upper guide plate 5 and the lower guide plate 6 are fixedly installed through a spacer.
  • the probe pin (7) is installed vertically between the upper guide plate (5) and the lower guide plate (6) and then elastically deforms in the horizontal direction. make up
  • a semiconductor wafer (W) is approached to a probe card (1) formed with a plurality of probe pins (7), and each probe pin (7) is placed on the corresponding electrode pad (WP) on the semiconductor wafer (W). ) is carried out by contacting After reaching the position where the probe pins 7 come into contact with the electrode pads WP, an overdrive process in which the wafer W is further raised to a predetermined height toward the probe card 1 is performed.
  • the length of the plurality of probe pins 7 is different due to errors in the manufacturing process, the flatness of the guide plates 5 and 6 and the space converter 3 is slightly different, and there is a difference in height between the electrode pads WP. Because of this, the overdrive process is inevitably necessary. Also, an overdrive with a sufficient lift stroke is required to ensure good electrical and mechanical contact to all probe pins (7).
  • the end of the probe pin 7 penetrates the oxide film layer 8 formed on the surface of the electrode pad WP and is electrically connected to the conductive material layer of the electrode pad WP. As a result, the probe pins 7 become energized.
  • a contact pressure higher than a certain level is required. The contact of the probe pin 7 removes the oxide film layer 8 under a high contact pressure, and at this time, a large concave portion is formed on the surface of the electrode pad WP due to the excessive contact pressure.
  • a large concave portion causes a connection failure in a bonding process of a semiconductor device, and excessive shavings stick to the ends of the probe pins 7 to increase contact resistance.
  • Patent Document 1 Registration No. 10-1913355 Patent Publication
  • the present invention has been made to solve the problems of the prior art described above, and the present invention provides an electrically conductive contact pin capable of minimizing damage to the surface of an object to be inspected while effectively removing an oxide film layer formed on the surface of the object to be inspected. to do for that purpose.
  • the electrically conductive contact pin according to the present invention is provided in a test device for checking whether an object to be inspected is defective by applying electricity, and transmits an electrical signal by electrically and physically contacting the object to be tested.
  • a conductive contact pin comprising: a body portion having a space portion with a guide portion provided therein; and a movable tip portion at least partially inserted into the space and movably provided, wherein the head of the movable tip slides on the guide portion so that the connecting portion of the movable tip performs a wiping operation.
  • connection portion that elastically connects the body portion and the moving tip portion.
  • the connecting portion is compressed when a pressing force is applied to the connecting portion of the moving tip portion, and is restored when the pressing force is released from the moving tip portion.
  • connection part is provided in the space part to connect the body part and the moving tip part.
  • connection part is provided outside the body part to connect the body part and the moving tip part.
  • connection portion that elastically connects the elastic portion of the body portion and the moving tip portion.
  • the head part of the moving tip part comes into contact with the guide part and slides, and the moving direction of the head part does not coincide with the axial direction of the pressing force.
  • connection part of the moving tip part when a pressing force is applied to the connection part of the moving tip part, the head part of the moving tip part comes into contact with the guide part and moves along the guide part, so that the connection part of the moving tip part moves horizontally.
  • the electrically conductive contact pin according to the present invention is a conductive contact pin provided in an inspection device for applying electricity to check whether an object to be inspected is defective and used to electrically and physically contact the object to be inspected to transmit an electrical signal.
  • a movable tip portion at least partially inserted into the body portion from an end side of the body portion, wherein when a pressing force is applied to the connecting portion of the movable tip portion, at least a portion of the movable tip portion positioned inside the body portion is moved to the body portion.
  • the connection part of the moving tip part performs a wiping operation.
  • the electrically conductive contact pin is a conductive contact pin provided in an inspection device for applying electricity to check whether an object to be inspected is defective and used to electrically and physically contact the object to be inspected to transmit an electrical signal.
  • the movable tip portion includes a movable tip portion and a body portion, wherein the movable tip portion includes: a first movable tip portion positioned at a first end side of the electrically conductive contact pin; and a second movable tip portion located at a side of the second end of the electrically conductive contact pin, wherein the body portion, wherein the first movable tip portion and the second movable tip portion are elastic in the longitudinal direction of the electrically conductive contact pin.
  • an elastic part to be displaced and a support portion provided outside the elastic portion along the longitudinal direction of the electrically conductive contact pin to guide the elastic portion to be compressed and stretched in the longitudinal direction of the electrically conductive contact pin and to prevent the elastic portion from buckling while being compressed. and, when a pressing force is applied to the connecting part of the second moving tip, at least a part of the second moving tip positioned inside the support moves in sliding contact with the inside of the support, thereby wiping the connecting part of the second moving tip. Make an action.
  • the elastic part may include a first elastic part connected to the first moving tip part; a second elastic part connected to the second moving tip part; and an intermediate fixing part connected to the first elastic part and the second elastic part between the first elastic part and the second elastic part and integrally provided with the support part.
  • the electrically conductive contact pin is formed by stacking a plurality of metal layers in a thickness direction of the electrically conductive contact pin.
  • the electrically conductive contact pin includes a fine trench provided on its side surface.
  • the present invention provides an electrically conductive contact pin capable of minimizing damage to the surface of an object to be inspected while effectively removing an oxide layer formed on the surface of an object to be inspected.
  • 1A is a view schematically showing a probe card according to the prior art
  • Figure 1b is a diagram showing the energized state of the probe pins according to the prior art.
  • Fig. 2 shows a probe head equipped with electrically conductive contact pins according to a first preferred embodiment of the present invention
  • 3a to 7b show an electrically conductive contact pin according to a first preferred embodiment of the present invention
  • FIGS. 8A to 8E are views for explaining a method of manufacturing an electrically conductive contact pin according to a first preferred embodiment of the present invention.
  • 9a and 9b show an electrically conductive contact pin according to a second preferred embodiment of the present invention.
  • 10a and 10b show an electrically conductive contact pin according to a third preferred embodiment of the present invention.
  • Figure 11 shows an electrically conductive contact pin according to a fourth preferred embodiment of the present invention.
  • Embodiments described in this specification will be described with reference to sectional views and/or perspective views, which are ideal exemplary views of the present invention. Films and thicknesses of regions shown in these drawings are exaggerated for effective description of technical content.
  • the shape of the illustrative drawings may be modified due to manufacturing techniques and/or tolerances. Therefore, embodiments of the present invention are not limited to the specific shapes shown, but also include changes in shapes generated according to manufacturing processes.
  • Technical terms used in this specification are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.
  • the electrically conductive contact pins according to each preferred embodiment of the present invention are provided in a test device for checking whether an object to be tested is defective by applying electricity and electrically and physically contact with the object to be tested to transmit an electrical signal. It may be a contact pin.
  • the inspection device may be an inspection device used in a semiconductor manufacturing process, and may be, for example, a probe card or a test socket.
  • the electrically conductive contact pins may be probe pins provided in a probe card to inspect a semiconductor chip, or socket pins provided in a test socket to inspect a packaged semiconductor package to inspect a semiconductor package.
  • the width direction of the electrically conductive contact pin described below is the ⁇ x direction indicated in the drawing
  • the length direction of the electrically conductive contact pin is the ⁇ y direction indicated in the drawing
  • the thickness direction of the electrically conductive contact pin is the ⁇ z direction indicated in the drawing. am.
  • the electrically conductive contact pin has an overall length dimension L in the longitudinal direction ( ⁇ y direction), an overall thickness dimension H in the thickness direction ( ⁇ z direction) perpendicular to the longitudinal direction, and It has an overall width dimension (W) in the width direction ( ⁇ x direction).
  • a probe card according to a preferred embodiment of the present invention is used in an inspection process of inspecting a chip fabricated on a wafer during a semiconductor manufacturing process, and is capable of responding to micrometers.
  • a probe card according to a preferred embodiment of the present invention is more useful for testing non-memory semiconductor chips such as microprocessors, microcontrollers, and ASICs.
  • a probe card includes a space converter (ST) having a connection pad (CP); Guide plates (GP1, FP2) provided spaced apart from the space converter (ST) below the space converter (ST); and probe pins 100 installed by being inserted into the holes of the guide plates GP1 and GP2.
  • ST space converter
  • CP connection pad
  • GP1, FP2 Guide plates
  • probe pins 100 installed by being inserted into the holes of the guide plates GP1 and GP2.
  • the electrically conductive contact pins 100 are inserted into the guide holes of the upper guide plate GP1 and the guide holes of the lower guide plate GP2.
  • the pitch interval between the probe pins 100 installed on the guide plates GP1 and GP2 may be 50 ⁇ m or more and 150 ⁇ m or less, the left and right widths of the probe pins 100 are 40 ⁇ m or more and 200 ⁇ m or less, and the probe pins 100 ) may have a thickness of 40 ⁇ m or more and 200 ⁇ m or less.
  • the electrically conductive contact pin 100 includes a body portion 120 having a space portion 125 in which a guide portion 127 is provided; and a movable tip portion movably provided with at least a portion inserted into the space portion 120 ( 130), but the head 131 of the movable tip 130 slides on the guide 127 so that the connection 133 of the movable tip 130 performs a wiping operation.
  • the electrically conductive contact pin 100 includes a body portion 120, a fixing tip portion 110 provided on the upper side of the body portion 120, and at least into the inside of the body portion 120 from the lower end side of the body portion 120. It includes a movable tip part 130, a part of which is inserted and movably provided.
  • the fixed tip 110 of the electrically conductive contact pin 100 is connected to the connection pad CP of the space transducer ST, and the moving tip 130 of the electrically conductive contact pin 100 is connected to the connection pad of the test object.
  • the inspection target may be a semiconductor device.
  • the body portion 120 has a cavity portion 121 therein.
  • the air gap 121 penetrates the body 120 in the thickness direction and extends along the longitudinal direction of the body 120 so that the body 120 is formed into a plurality of beam structures. . Through this, it is possible to shorten the length of the body portion 120 by allowing the body portion 120 to be more easily elastically deformed in the width direction, which is advantageous in transmitting a high frequency signal.
  • the surface area of the body part 120 is widened through the configuration of the air gap 121, it is advantageous in transmitting a high frequency signal through this.
  • a fixing tip part 110 is provided on the upper side of the body part 120 .
  • the fixing tip 110 is electrically connected to the connection pad CP of the space converter ST.
  • the fixing tip 110 includes an elastic beam 111 for connection with the connection pad CP.
  • the elastic beam 111 has one end connected to the fixing tip 110 and the other end extending toward the connection pad CP to form a free end and is provided in a cantilever shape.
  • the fixing tip 110 is elastically compressed and contacted to the connection pad CP so as to always maintain a contact state. Through this, it is possible to prevent a problem in which sparks are generated due to a gap between the fixing tip 110 and the connection pad CP.
  • the fixing tip 110 is provided with a stepped portion 113 for fixing the fixing tip 110 to the upper guide plate GP1. Since the fixing tip 110 is caught on the upper surface of the upper guide plate GP1 by the stepped portion 113, the electrically conductive contact pin 100 is prevented from passing through the upper guide plate GP1 and falling off downward.
  • the lower part of the body part 120 has a space part 125 provided with a guide part 127 therein. At least a part of the moving tip part 130 is inserted into the space part 125 and is provided.
  • the moving tip part 130 includes a head part 131 which is in sliding contact with the guide part 127 and a connection part 133 extending downward from the head part 131 .
  • the head 131 of the movable tip 130 slides on the guide 127 to be movable.
  • the connection part 133 of the moving tip part 130 When pressing force is applied to the connection part 133 of the moving tip part 130, the head part 131 of the moving tip part 130 comes into contact with the guide part 127 and slides, and the moving direction of the head part 131 is the axis of the pressing force. does not match the direction
  • the space part 125 provides a space in which the moving tip part 130 can move.
  • the space part 125 is provided with a guide part 127 that comes into contact with the head part 131 of the moving tip part 130 and guides the head part 131 of the moving tip part 130 to move in a specific direction.
  • the guide part 127 may be at least a part of an inner surface of the body part 120 constituting the space part 125 .
  • a part where the head part 131 of the moving tip part 130 contacts is formed in a curved shape, and the head part 131 of the moving tip part 130 is also formed in a curved shape.
  • the head part 131 is provided in the form of a cylinder in the thickness direction as a whole, and the side surface of the cylinder comes into contact with the guide part 127 and slides.
  • connection part 133 of the moving tip part 130 is provided in a curved shape with a curvature to minimize damage to the surface of the inspection object when the connection part 133 contacts the inspection object and performs a wiping operation.
  • the space portion 125 is provided in the form of an ellipse having a short axis and a long axis, but the long axis of the ellipse forms a predetermined angle with the axis of the body portion 120 and is inclined in an oblique direction with respect to the axis of the body portion 120.
  • the guide part 127 with which the upper surface of the head part 131 comes in contact is configured in the form of a gently rising curved surface, and the head part 131 is deflected to one side along the curved surface of the gently rising guide part 127 and rises. Let it be.
  • a hooking portion 126 is formed on the lower side of the space portion 125 .
  • the hooking portion 126 prevents the head portion 131 of the moving tip portion 130 from being separated from the space portion 125 .
  • the width of the opening formed by the hooking portion 126 is smaller than the size of the head portion 131 of the moving tip portion 130, so that the moving tip portion 130 does not fall out of the space portion 125.
  • the hooking part 126 limits the tilting angle of the moving tip part 130 by limiting the horizontal movement distance of the moving tip part 130 .
  • the extent to which the connection part 133 wipes the electrode pad WP of the object to be tested can be controlled by the size of the gap between the hooking part 126 and the moving tip part 130 .
  • the gap between the hooking part 126 and the moving tip part 130 is a factor that determines the allowable tilting angle.
  • the tilting angle of increases, and the smaller the clearance between the hooking part 126 and the moving tip part 130 is, the smaller the tilting angle of the connection part 133 of the moving tip part 130 becomes.
  • the head part 131 of the moving tip part 130 is deflected to one side and rises while making surface contact with the guide part 127, and the part of the moving tip part 130 on the lower side of the head part 131 is the hooking part 126 It is in contact with the horizontal direction movement is limited.
  • connection part 133 of the moving tip part 130 When pressing force is applied to the connection part 133 of the moving tip part 130, the head part 131 of the moving tip part 130 comes into contact with the guide part 127 and moves along the guide part 127 so that the moving tip part 130 tilted
  • the moving tip 130 is tilted relative to the body 120 based on the hooking portion 126, and the connecting portion 133 of the moving tip 130 performs a wiping operation on the surface of the object to be touched.
  • a pressing force is applied to the connection part 133 of the moving tip part 130
  • at least a part of the moving tip part 130 located inside the body part 120 is in sliding contact with the inside of the body part 120 and moves.
  • the connection part 133 of 130 performs a wiping operation.
  • the side of the moving tip part 130 is supported by the hooking part 126 and the head part 131 of the moving tip part 130 is supported from above by the guide part 127 so that the head part 131 of the moving tip part 130 ) reaches a position where it no longer rises, the tilting angle of the moving tip 130 does not proceed any further and the tilting angle is maintained.
  • the movable tip 130 when the movable tip 130 receives a pressing force, the movable tip 130 is tilted relative to the body 120 to remove the oxide film layer 8 . Through this, it is possible to minimize damage to the electrode pad WP, and an excessive amount of debris of the oxide film layer 8 is not caused, so that the use time of the electrically conductive contact pin 100 is improved.
  • the electrically conductive contact pin 100 While the prior art has a structure in which the process of removing the oxide film layer 8 is performed while the probe pin 7 itself is elastically deformed, the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention has a body There is a difference in the basic operation principle of the wiping operation in that the movable tip unit 130 provided in the unit 120 to be relatively displaceable performs the wiping operation.
  • the electrically conductive contact pin 100 can minimize damage to the electrode pad WP because the oxide film layer 8 is removed while the moving tip 130 is tilted relative to the body 120 .
  • a housing may be provided to prevent the movable tip 130 from falling in front of or behind the electrically conductive contact pin 100 .
  • the housing (not shown) may be provided in a form that entirely surrounds the electrically conductive contact pin 100 or may be provided in a form that seals the front and rear portions of the space portion 125 .
  • the body 120 and the movable tip 130 are elastically coupled to each other in order to prevent the movable tip 130 from falling out of the front and rear of the electrically conductive contact pin 100.
  • a connection unit 150 for connection may be provided.
  • connection part 150 is provided in the space part 125 .
  • the connection part 150 connects the body part 120 and the moving tip part 130 elastically between the body part 120 and the moving tip part 130.
  • One end of the connection part 150 is connected to the body part 120 and the other end of the connection part 150 is provided to the moving tip part 130 .
  • the moving tip part 130, the connection part 150, and the body part 150 are integrally provided.
  • the thickness H of the connecting portion 130 is formed to the same thickness as the thickness H of the body portion 120 . Through this, it is effectively prevented from being damaged when the connecting portion 130 is compressed and deformed.
  • the connecting portion 150 is formed in a ring shape to elastically connect the body portion 120 and the moving tip portion 130 to each other. At least one ring shape is provided to elastically connect the body part 120 and the moving tip part 130 to each other.
  • the connection part 150 is compressed according to the movement of the moving tip part 130 when pressing force is applied to the connection part 133 of the moving tip part 130, and when the pressing force applied to the moving tip part 130 is released, it is restored to its original state and the moving tip part ( 130) to return to its original position.
  • connection part 150 is provided in the space part 125 .
  • the connection part 150 connects the body part 120 and the moving tip part 130 elastically between the body part 120 and the moving tip part 130.
  • One end of the connection part 150 is connected to the body part 120 and the other end of the connection part 150 is provided to the moving tip part 130 .
  • the moving tip part 130, the connection part 150, and the body part 150 are integrally provided.
  • the thickness H of the connecting portion 130 is formed to the same thickness as the thickness H of the body portion 120 . Through this, it is effectively prevented from being damaged when the connecting portion 130 is compressed and deformed.
  • connection part 150 is formed in the shape of a coil spring to elastically connect the body part 120 and the moving tip part 130 to each other.
  • An “S” shape is repeatedly formed to elastically connect the body part 120 and the moving tip part 130 to each other.
  • the connection part 150 is compressed according to the movement of the moving tip part 130 when pressing force is applied to the connection part 133 of the moving tip part 130, and when the pressing force applied to the moving tip part 130 is released, it is restored to its original state and the moving tip part ( 130) to return to its original position.
  • connection part 150 is provided outside the body part 120 .
  • the connection part 150 connects the body part 120 and the moving tip part 130 elastically between the body part 120 and the moving tip part 130.
  • the moving tip part 130, the connection part 150, and the body part 150 are integrally provided.
  • the thickness H of the connecting portion 130 is formed to the same thickness as the thickness H of the body portion 120 . Through this, it is effectively prevented from being damaged when the connecting portion 130 is compressed and deformed.
  • connection part 150 is connected to the body part 120 and the other end of the connection part 150 is provided to the moving tip part 130 . More specifically, one end of the connection part 150 is connected to the end side of the body part 120 in the direction of the test object, and the other end of the connection part 150 is connected to the side of the moving tip part 130 .
  • the connection part 150 includes a first connection part 151 having one end connected to the left side of the end side of the body part 120 and the other end connected to the left side of the moving tip part 130, and one end connected to the end side of the body part 120. It includes a second connection part 152 connected to the right side and the other end connected to the right side of the moving tip part 130.
  • connection part 150 is formed in the shape of a plate spring to elastically connect the body part 120 and the moving tip part 130 to each other. It is formed in a curved shape in the form of an arc to connect the body portion 120 and the moving tip portion 130 to each other elastically.
  • the connection part 150 is compressed according to the movement of the moving tip part 130 when pressing force is applied to the connection part 133 of the moving tip part 130, and when the pressing force applied to the moving tip part 130 is released, it is restored to its original state and the moving tip part ( 130) to return to its original position.
  • the electrically conductive contact pin 100 is provided by stacking a plurality of metal layers in the thickness direction of the electrically conductive contact pin 100 .
  • the plurality of metal layers include a first metal layer 160 and a second metal layer 180 .
  • the first metal layer 160 is a metal having relatively high wear resistance compared to the second metal layer 180, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), or nickel (Ni).
  • the second metal layer 180 is a metal having relatively high electrical conductivity compared to the first metal layer 160, and is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof. It can be.
  • the first metal layer 160 is provided on the bottom and top surfaces of the electrically conductive contact pin 100 in the thickness direction, and the second metal layer 180 is provided between the first metal layers 160 .
  • the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 160, the second metal layer 180, and the first metal layer 160 in that order, and the number of layers to be stacked is three or more. It can be.
  • a manufacturing method of the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention will be described with reference to FIGS. 8A to 8E.
  • FIG. 8A is a plan view of the mold M in which the inner space IH is formed
  • FIG. 8B is a cross-sectional view taken along line A-A' of FIG. 8A.
  • the mold M may be made of an anodic oxide film, photoresist, silicon wafer or similar material.
  • the mold M according to a more preferred embodiment of the present invention may be made of an anodic oxide film material. Therefore, the electrically conductive contact pin 100 according to a preferred embodiment of the present invention has an effect exerted by being manufactured using the mold M made of an anodic oxide film in addition to the effect exhibited by the structural advantage.
  • the mold (M) made of anodized film material will be described as a standard.
  • the anodic oxide film means a film formed by anodic oxidation of a base metal
  • the pore means a hole formed in the process of forming an anodic oxide film by anodic oxidation of a metal.
  • the base metal is aluminum (Al) or an aluminum alloy
  • an anodized film made of aluminum oxide (Al 2 O 3 ) is formed on the surface of the base metal.
  • the base metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or an alloy thereof.
  • the anodic oxide film formed as above is a barrier layer without pores formed vertically therein. And, it is divided into a porous layer in which pores are formed.
  • the anodic oxidation film may be formed in a structure in which the barrier layer formed during anodic oxidation is removed to pass through the upper and lower pores, or in a structure in which the barrier layer formed during anodic oxidation remains as it is and seals one end of the upper and lower portions of the pores.
  • the anodic oxide film has a thermal expansion coefficient of 2 to 3 ppm/°C. Due to this, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, the electrically conductive contact pin 100 can be manufactured accurately without thermal deformation even in a high-temperature environment in which the electrically conductive contact pin 100 is manufactured.
  • the electrically conductive contact pin 100 is manufactured using a mold M made of anodized film instead of a mold M made of photoresist, the mold M made of photoresist It is possible to exert the effect of realizing the precision of the shape and the fine shape, which were limited in implementation.
  • the existing photoresist mold (M) it is possible to manufacture an electrically conductive contact pin with a thickness of 40 ⁇ m, but in the case of using the mold (M) made of anodized film, a thickness of 40 ⁇ m or more to 200 ⁇ m or less
  • the electrically conductive contact pin 100 can be manufactured.
  • a seed layer SL is provided on the lower surface of the mold M.
  • the seed layer SL may be provided on the lower surface of the mold M before forming the inner space IH in the mold M.
  • a support substrate (not shown) is formed under the mold M to improve handling of the mold M.
  • the seed layer SL is formed on the upper surface of the support substrate and the mold M having the inner space IH formed thereon may be bonded to the support substrate and used.
  • the seed layer SL may be formed of a copper (Cu) material and may be formed by a deposition method.
  • the inner space IH may be formed by wet etching a partial area of the mold M made of an anodic oxide film. To this end, a photoresist is provided on the upper surface of the mold M and patterned, and then the anodic oxide film in the patterned open area reacts with the etching solution to form the inner space IH.
  • FIG. 8C is a plan view illustrating an electroplating process performed on the inner space IH
  • FIG. 8D is a cross-sectional view A-A′ of FIG. 8C.
  • the metal layer is formed while growing in the thickness direction of the mold M, the shape of each cross section in the thickness direction of the electrically conductive contact pin 100 is the same.
  • a plurality of metal layers are stacked in the thickness direction of the electrically conductive contact pin 100 .
  • the plurality of metal layers include a first metal layer 160 and a second metal layer 180 .
  • the first metal layer 160 is a metal having relatively high wear resistance compared to the second metal layer 180, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), or nickel (Ni).
  • the second metal layer 180 is a metal having relatively high electrical conductivity compared to the first metal layer 160, and is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof. It can be.
  • the first metal layer 160 is provided on the bottom and top surfaces of the electrically conductive contact pin 100 in the thickness direction, and the second metal layer 180 is provided between the first metal layers 160 .
  • the electrically conductive contact pin 100 is provided by alternately stacking the first metal layer 160, the second metal layer 180, and the first metal layer 160 in that order, and the number of layers to be stacked is three or more. It can be.
  • the first metal layer 160 and the second metal layer 180 may be made more dense by raising the temperature to a high temperature and pressing the metal layer on which the plating process is completed by applying pressure.
  • a photoresist material is used as the mold M
  • a process of heating to a high temperature and applying pressure cannot be performed because the photoresist exists around the metal layer after the plating process is completed.
  • the mold M made of the anodic oxide film is provided around the metal layer on which the plating process is completed, even if the temperature is raised to a high temperature, the deformation is minimized due to the low thermal expansion coefficient of the anodic oxide film. It is possible to densify the first metal layer 160 and the second metal layer 180 . Therefore, it is possible to obtain a higher density first metal layer 160 and second metal layer 180 compared to a technique using a photoresist as a mold M.
  • a process of removing the mold M and the seed layer SL is performed.
  • the mold M is made of an anodic oxide film material
  • the mold M is removed using a solution that selectively reacts to the anodic oxide film material.
  • the seed layer SL is made of copper (Cu)
  • the seed layer SL is removed using a solution that selectively reacts with copper (Cu).
  • the thickness of the electrically conductive contact pin 100 cannot be made sufficiently thick either.
  • the electrically conductive contact pin 100 needs to be manufactured to have a predetermined thickness or more in consideration of electrical conductivity, restoring force and brittle fracture.
  • a mold M in which photoresists are stacked in multiple layers may be used.
  • the side surface of the electrically conductive contact pin 100 is not formed vertically, and a slightly stepped area remains.
  • the photoresist is laminated in multiple layers, it is difficult to precisely reproduce the shape of the electrically conductive contact pin 100 having a size range of several to several tens of ⁇ m or less.
  • the mold M made of photoresist material is provided with a photoresist between its inner space and the inner space.
  • the width of the photoresist provided between the inner spaces is 15 ⁇ m or less, the photoresist is not properly formed, In particular, when the height compared to the width is large, a problem arises in that the standing state of the photoresist at the corresponding position is not properly maintained.
  • the electrically conductive contact pin 100 includes a micro trench 88 formed on its side surface. On the side surface of the electrically conductive contact pin 100, peaks and valleys with a depth of 20 nm or more and 1 ⁇ m or less are repeated along the side surface of the electrically conductive contact pin 100 in a direction perpendicular to the thickness direction of the electrically conductive contact pin 100. A fine trench 88 having a corrugated shape is formed.
  • the fine trench 88 is formed to elongate in the thickness direction of the electrically conductive contact pin 100 from the side of the electrically conductive contact pin 100 .
  • the extension direction of the peaks and valleys of the fine trench 88 becomes the thickness direction of the electrically conductive contact pin 100 .
  • the thickness direction of the electrically conductive contact pin 100 means a direction in which metal fillers grow during electroplating.
  • the fine trench 88 is configured in a corrugated form in which peaks and valleys are repeated in a direction perpendicular to the thickness direction of the plate-shaped plate.
  • the fine trench 88 has a depth of 20 nm or more and 1 ⁇ m or less, and a width of 20 nm or more and 1 ⁇ m or less.
  • the width and depth of the fine trench 88 have a value less than the range of the diameter of the pore of the anodic oxide film mold M. .
  • the anodic oxide film mold (M) includes numerous pores, and at least a part of the anodic oxide film mold (M) is etched to form an inner space (IH), and an electrically conductive contact pin (100) is electroplated into the inner space (IH). ), the side surface of the electrically conductive contact pin 100 is provided with a fine trench 88 formed while contacting the pores of the anodic oxide film mold M.
  • the surface area on the side surface of the electrically conductive contact pin 100 can be increased. have a possible effect.
  • the density of the current flowing along the electrically conductive contact pin 100 by increasing the surface area through which the current flows according to the skin effect through the configuration of the micro trench 88 formed on the side surface of the electrically conductive contact pin 100. is increased to improve electrical characteristics (particularly, high-frequency characteristics) of the electrically conductive contact pin 100 .
  • the heat generated from the electrically conductive contact pins 100 can be quickly dissipated through the configuration of the micro trenches 88, the temperature rise of the electrically conductive contact pins 100 can be suppressed.
  • FIGS. 9A and 9B are diagrams showing an electrically conductive contact pin and a wiping operation thereof according to a second preferred embodiment of the present invention.
  • An electrically conductive contact pin 200 includes a body portion 220 having a space portion 225 in which a guide portion 227 is provided; a movable tip 230 having at least a portion inserted into the space 220 to be movable; and a connection part 250 that elastically connects the body part 220 and the moving tip part 230; The connection part 233 of the wiping operation.
  • the moving tip part 230 includes a head part 231 in sliding contact with the guide part 227, a connection part 233 in contact with the test object, and a neck part 232 connecting the head part 231 and the connection part 233.
  • connection part 233 is provided in a curved shape to minimize damage to the surface of the test object when the connection part 233 performs a wiping operation.
  • the guide portion 227 is formed in a curved shape in which a portion of the moving tip portion 230 in contact with the head portion 231 rises in one direction.
  • the head 231 of the moving tip 130 is also formed in a curved shape, and the head 231 is in sliding contact with the guide 227 to slide along the shape of the guide 227 .
  • the hooking portion 226 prevents the head portion 231 of the moving tip portion 230 from being separated from the space portion 225 .
  • the width of the opening formed by the hooking portion 226 is smaller than the size of the head portion 231 of the moving tip portion 230, so that the moving tip portion 230 does not fall out of the space portion 225.
  • the hooking part 226 limits the tilting angle of the moving tip part 230 by limiting the horizontal movement distance of the moving tip part 230 .
  • the extent to which the connection part 233 wipes the electrode pad WP of the object to be tested can be controlled by the size of the gap between the hooking part 226 and the moving tip part 230 .
  • the gap between the hooking part 226 and the moving tip part 230 is a factor that determines the allowable tilting angle.
  • the tilting angle of increases, and the smaller the gap between the hooking part 226 and the moving tip part 230 is, the smaller the tilting angle of the connection part 233 of the moving tip part 230 becomes.
  • connection part 233 of the moving tip part 230 When a pressing force is applied to the connection part 233 of the moving tip part 230, at least a part of the moving tip part 230 located inside the body part 220 is in sliding contact with the inside of the body part 220 and moves, so that the moving tip part ( The connection part 233 of 230 performs a wiping operation.
  • connection part 250 is connected to the body part 220 and the other end of the connection part 250 is provided to the moving tip part 230 . More specifically, one end of the connection part 250 is connected to the end side of the body part 220 in the direction of the test object, and the other end of the connection part 250 is connected to the side of the moving tip part 230 .
  • the connection part 250 includes a first connection part 251 having one end connected to the left side of the end side of the body part 220 and the other end connected to the left side of the moving tip part 230, and one end side connected to the end side of the body part 220. It includes a second connection part 252 connected to the right side and the other end connected to the right side of the moving tip part 230.
  • connection part 250 is formed in the shape of a plate spring to elastically connect the body part 220 and the moving tip part 230 to each other. It is formed in a curved shape in the form of an arc to connect the body portion 220 and the moving tip portion 230 to each other elastically.
  • the thickness H of the connecting portion 230 is formed to have the same thickness as the thickness H of the body portion 220 .
  • the connection part 250 is compressed according to the movement of the moving tip part 230 when a pressing force is applied to the connection part 233 of the moving tip part 230, and when the pressing force applied to the moving tip part 230 is released, it is restored to its original state and the moving tip part ( 230) to return to its original position.
  • connection unit 250 is not limited thereto, and it is possible to adopt the configuration of the connection unit 150 of the first embodiment described above.
  • the electrically conductive contact pin 200 has a body There is a difference in the basic operation principle of the wiping operation in that the movable tip unit 230 provided to the unit 220 to be relatively displaceable performs the wiping operation.
  • the electrically conductive contact pin 200 can minimize damage to the electrode pad WP because the oxide film layer 8 is removed while the moving tip 230 is tilted relative to the body 220 .
  • FIGS. 10A and 10B are views showing an electrically conductive contact pin and a wiping operation thereof according to a third preferred embodiment of the present invention.
  • An electrically conductive contact pin 300 includes a body portion 320 having a space portion 325 in which a guide portion 327 is provided; a movable tip 330 having at least a portion inserted into the space 320 to be movable; and a connection part 350 that elastically connects the body part 320 and the moving tip part 330; The connection part 333 of the wiping operation.
  • the moving tip part 330 includes a head part 331 in sliding contact with the guide part 327 and a connection part 333 in contact with the test object.
  • the connecting portion 333 is provided in a curved shape to minimize damage to the surface of the test object when the connecting portion 333 performs a wiping operation.
  • the guide portion 327 is formed in an oblique shape such that a portion of the moving tip portion 330 in contact with the head portion 331 rises in one direction.
  • the guide part 327 includes a first guide part 327a in the form of a diagonal line going upward to the right and a second guide part 327b in the form of a diagonal line going downward to the right.
  • the head part 331 of the moving tip part 330 is formed in a triangular shape composed of a first side 331a in the shape of a diagonal line going upward to the right and a second side side 331b in the shape of a diagonal line going downward to the right.
  • the connecting portion 333 of the movable tip 330 moves in the horizontal direction. Then, when the first side 331a comes into contact with the first guide part 327a, the movement of the head part 331 is stopped.
  • the hooking portion 326 prevents the head portion 331 of the moving tip portion 330 from being separated from the space portion 325 .
  • the width of the opening formed by the hooking portion 326 is smaller than the size of the head portion 331 of the moving tip portion 330, so that the moving tip portion 330 does not fall out of the space portion 325.
  • connection part 333 of the moving tip part 330 When a pressing force is applied to the connection part 333 of the moving tip part 330, at least a part of the moving tip part 330 located inside the body part 320 is in sliding contact with the inside of the body part 320 and moves, so that the moving tip part ( The connection part 333 of 330 performs a wiping operation.
  • connection part 350 is connected to the body part 320 and the other end of the connection part 350 is provided to the moving tip part 330 . More specifically, one end of the connection part 350 is connected to the end side of the body part 320 in the direction of the test object, and the other end of the connection part 350 is connected to the side of the moving tip part 330 .
  • the connection part 350 includes a first connection part 351 having one end connected to the left side of the end side of the body part 320 and the other end connected to the left side of the moving tip part 330, and one end connected to the end side of the body part 320. It includes a second connection part 352 connected to the right side and the other end connected to the right side of the moving tip part 330.
  • the connection part 350 is formed in the shape of a plate spring to elastically connect the body part 320 and the moving tip part 330 to each other. It is formed in a curved shape in the form of an arc to connect the body portion 320 and the moving tip portion 330 to each other elastically.
  • the thickness H of the connecting portion 330 is formed to have the same thickness as the thickness H of the body portion 320 .
  • the connection part 350 is compressed according to the movement of the moving tip part 330 when a pressing force is applied to the connection part 333 of the moving tip part 330, and when the pressing force applied to the moving tip part 330 is released, it is restored to its original state and the moving tip part ( 330) to return to its original position.
  • connection unit 250 is not limited thereto, and it is possible to adopt the configuration of the connection unit 150 of the first embodiment described above.
  • the head part 331 of the moving tip part 330 comes into contact with the guide part 327 and moves along the guide part 327 while moving along the moving tip part 330.
  • the connection part 333 moves horizontally.
  • the third embodiment is different from the first, second, and fourth embodiments in that the moving tip 330 is not tilted and the contact portion 333 removes the oxide layer while moving in the horizontal direction on the surface of the test object. can Since the movable tip part 330 removes the oxide film layer while moving relative to the body part 320 in a horizontal direction, it is possible to minimize damage to the surface of the test object during the wiping process.
  • the electrically conductive contact pin 300 has a body There is a difference in the basic operation principle of the wiping operation in that the movable tip unit 330 provided in the unit 320 to be relatively displaceable performs the wiping operation.
  • the electrically conductive contact pin 300 can minimize damage to the electrode pad WP because the moving tip 330 removes the oxide film layer 8 while moving relative to the body 320 .
  • FIGS. 11 to 12B are diagram showing an electrically conductive contact pin 400 according to a fourth preferred embodiment of the present invention
  • FIGS. 12A and 12B are diagrams of an electrically conductive contact pin 400 according to a fourth preferred embodiment of the present invention. It is a drawing showing the wiping operation.
  • An electrically conductive contact pin 400 includes a moving tip part 430 and a body part 420.
  • the moving tip portion 430 includes a first moving tip portion 431 positioned at the first end side of the electrically conductive contact pin 400 and a second moving tip portion positioned at the second end side of the electrically conductive contact pin 400. (435);
  • the body portion 420 includes an elastic portion 421 for allowing the first moving tip portion 431 and the second moving tip portion 435 to be elastically displaced in the longitudinal direction of the electrically conductive contact pin 400; and guides the elastic portion 421 to be compressed and stretched in the longitudinal direction of the electrically conductive contact pin 400, and along the longitudinal direction of the electrically conductive contact pin 400 to prevent the elastic portion 421 from buckling while being compressed.
  • One end of the first moving tip part 431 is a free end, and the other end is connected to the first elastic part 421a, so that it can move vertically elastically by contact pressure.
  • One end of the second moving tip 435 is a free end, and the other end is connected to the second elastic part 421b, so that it can move vertically elastically by contact pressure.
  • connection part 450 connects the second elastic part 421b of the body part 420 and the second moving tip part 435.
  • the support part 425 includes a first support part 425a provided on the left side of the elastic part 421 and a second support part 425b provided on the right side of the elastic part 421 .
  • the intermediate fixing portion 421c extends in the width direction of the electrically conductive contact pin 400 and connects the first support portion 425a and the second support portion 425b.
  • the first elastic part 421a is provided on the upper part with respect to the intermediate fixing part 421c
  • the second elastic part 421b is provided on the lower part with respect to the intermediate fixing part 421c. Based on the intermediate fixing part 421c, the first elastic part 421a and the second elastic part 421b are compressed or stretched.
  • the intermediate fixing part 421c is fixed to the first and second support parts 425a and 425b so that when the first and second elastic parts 421a and 421b are compressed and deformed, the position of the first and second elastic parts 421a and 421b moves.
  • An area provided with the first elastic part 421a and an area provided with the second elastic part 421b are distinguished from each other by the intermediate fixing part 421c. Therefore, foreign substances introduced into the upper opening 143a cannot flow into the second elastic portion 421b, and foreign substances introduced into the lower opening 143b cannot flow into the first elastic portion 421a. Through this, by limiting the movement of the foreign matter introduced into the support part 425, it is possible to prevent the foreign matter from interfering with the operation of the first and second elastic parts 421a and 421b.
  • the first support portion 425a and the second support portion 425b are formed along the longitudinal direction of the electrically conductive contact pin 400, and the first support portion 425a and the second support portion 425b form the electrically conductive contact pin 100. It is integrally connected to the intermediate fixing part 421c formed to extend along the width direction of. While the first and second elastic parts 421a and 421b are integrally connected through the intermediate fixing part 421c, the electrically conductive contact pin 400 is formed as one body as a whole.
  • the first and second elastic parts 421a and 421b are formed by alternately connecting a plurality of straight parts and a plurality of curved parts.
  • the straight portion connects left and right adjacent curved portions, and the curved portion connects upward and downward adjacent straight portions.
  • the curved portion is provided in an arc shape.
  • a straight portion is disposed at the central portion of the first and second elastic portions 421a and 421b, and a curved portion is disposed at an outer portion of the first and second elastic portions 421a and 421b.
  • the straight portion is provided parallel to the width direction so that deformation of the curved portion according to the contact pressure is more easily achieved.
  • the first elastic part 421a requires a compression amount sufficient for the first movable tip parts 431 of the plurality of electrically conductive contact pins 400 to stably contact the connection pad CP of the space transformer ST, respectively.
  • the second elastic portion 421b requires an amount of compression sufficient to allow the second movable tips 435 of the plurality of electrically conductive contact pins 400 to stably contact the chips. Therefore, the spring coefficient of the first elastic part 421a and the spring coefficient of the second elastic part 421b are different from each other. For example, the length of the first elastic part 421a and the length of the second elastic part 421b are provided differently. Also, the length of the second elastic part 421b may be longer than that of the first elastic part 421a.
  • the support part 425 is provided with a guide part 427 that allows the first moving tip part 435 to perform a wiping operation.
  • the guide part 427 includes a first guide part 427a provided on the first support part 425a and a second guide part 427b provided on the second support part 425b.
  • the first guide part 427a and the second guide part 427b guide the head part 437 of the first moving tip part 435 to move upward to one side by pressing force.
  • the first guide part 427a and the second guide part 427b are provided in a curved shape.
  • a space 429 is provided between the first guide part 427a and the second guide part 427b.
  • the space portion 429 is a space in which the second moving tip portion 435 can move, and the inner wall of the support portion 425 forming the space portion 429 serves as the guide portion 427 .
  • connection part 436 of the second moving tip part 435 When a pressing force is applied to the connection part 436 of the second moving tip part 435, at least a part of the second moving tip part 435 located inside the support part 425 comes into sliding contact with the inside of the support part 425 and moves.
  • the connection part 436 of the two-moving tip part 435 performs a wiping operation.
  • the second elastic part 421b is compressed according to the movement of the second moving tip part 435 when a pressing force is applied to the connecting part 436 of the second moving tip part 435, and the pressing force applied to the second moving tip part 435 is released.
  • the second moving tip 435 returns to its original position. Even when the second movable tip 435 is restored to its original position, the second movable tip 435 is guided by at least one of the first guide part 427a and the second guide part 427b and descends.
  • At least part of the guide part 427 may be in the form of a curved surface or at least part of it in the form of an oblique line, but it is not limited to such a shape, and when a pressing force is applied to the second moving tip part 435, the second moving tip part 427 All shapes 435 capable of performing a wiping operation are included.
  • the electrically conductive contact pin 400 has a body There is a difference in the basic operating principle of the wiping operation in that the second movable tip 435 provided in the unit 420 to be relatively movable performs the wiping operation.
  • the electrically conductive contact pin 400 can minimize damage to the electrode pad WP because the oxide film layer 8 is removed while the second moving tip 435 is tilted relative to the body 420 .

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne une broche électriquement conductrice équipée d'une partie de pointe mobile dont au moins une partie est insérée dans une partie d'espace de manière à être mobile, une partie de tête de la partie de pointe mobile glissant vers une partie de guidage de sorte qu'une partie de liaison de la partie de pointe mobile effectue une opération de balayage, éliminant ainsi efficacement une couche d'oxyde formée sur la surface d'un objet à inspecter tout en limitant les dommages à la surface de l'objet à inspecter.
PCT/KR2022/014834 2021-10-06 2022-09-30 Broche de contact électriquement conductrice WO2023059014A1 (fr)

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KR101799309B1 (ko) * 2016-07-25 2017-12-20 (주) 루켄테크놀러지스 프로브 핀 및 이를 포함하는 디바이스 검사 장치
KR101913355B1 (ko) 2017-09-19 2018-12-28 윌테크놀러지(주) 미세피치 대응이 가능한 수직형 프로브 카드용 니들유닛 및 이를 이용한 프로브 카드

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