WO2023191410A1 - Broche de contact électroconductrice et dispositif d'inspection la comprenant - Google Patents

Broche de contact électroconductrice et dispositif d'inspection la comprenant Download PDF

Info

Publication number
WO2023191410A1
WO2023191410A1 PCT/KR2023/004011 KR2023004011W WO2023191410A1 WO 2023191410 A1 WO2023191410 A1 WO 2023191410A1 KR 2023004011 W KR2023004011 W KR 2023004011W WO 2023191410 A1 WO2023191410 A1 WO 2023191410A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conductive
conductive contact
elastic
contact pin
connection
Prior art date
Application number
PCT/KR2023/004011
Other languages
English (en)
Korean (ko)
Inventor
안범모
박승호
변성현
Original Assignee
(주)포인트엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)포인트엔지니어링 filed Critical (주)포인트엔지니어링
Publication of WO2023191410A1 publication Critical patent/WO2023191410A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects

Definitions

  • the present invention relates to an electrically conductive contact pin and an inspection device having the same.
  • Testing the electrical properties of semiconductor devices involves approaching an inspection object (semiconductor wafer or semiconductor package) to an inspection device equipped with a plurality of electrically conductive contact pins and connecting the electrically conductive contact pins to the corresponding external terminals (solder balls or bumps, etc.) on the inspection object. It is carried out by contact.
  • inspection objects semiconductor wafer or semiconductor package
  • inspection device equipped with a plurality of electrically conductive contact pins and connecting the electrically conductive contact pins to the corresponding external terminals (solder balls or bumps, etc.) on the inspection object. It is carried out by contact.
  • testing devices include, but are not limited to, probe cards or test sockets.
  • Probe card Inspection at the semiconductor wafer level is performed by a probe card.
  • the probe card is mounted between the wafer and the test equipment head, and 8,000 to 100,000 electrically conductive contact pins on the probe card are in contact with pads within individual chips on the wafer to exchange test signals between the probe equipment and individual chips. It acts as an intermediary to enable this.
  • These probe cards include vertical probe cards, cantilever probe cards, and MEMS probe cards.
  • the electrically conductive contact pins used in vertical probe cards have a pre-deformed structure when manufactured, or have a straight structure when manufactured, but the electrically conductive contact pins are deformed by shifting the guide plate in the horizontal direction. It has been adopted and is being used.
  • the pitch of the external terminals of the inspection object is becoming increasingly narrower.
  • the conventional electrically conductive contact pin has a structure in which the body becomes convex in the horizontal direction and elastically bends or bends due to pressure applied to both ends, the electrically conductive contact pins arranged at a narrow pitch deform and make adjacent electrically conductive contacts. Problems such as short-circuiting due to contact with the pins often occur.
  • test sockets include pogo type test sockets and rubber type test sockets.
  • the electrically conductive contact pin (hereinafter referred to as 'pogo type socket pin') used in a pogo type test socket includes a pin portion and a barrel that accommodates the pin portion.
  • the pin portion provides necessary contact pressure and absorbs shock at the contact position by installing a spring member between the plungers at both ends.
  • a gap In order for the fin portion to slide within the barrel, a gap must exist between the outer surface of the pin portion and the inner surface of the barrel.
  • these pogo-type socket pins are used by separately manufacturing the barrel and the pin portion and then combining them, gap management cannot be performed precisely, such as the outer surface of the pin portion being spaced more than necessary from the inner surface of the barrel.
  • the pin portion has a sharp tip portion to increase the contact effect with the external terminal of the inspection object.
  • the pointed tip portion creates traces or grooves of press fit on the external terminal of the inspection object after inspection. Due to the loss of the contact shape of the external terminal, errors in vision inspection occur and the reliability of the external terminal is reduced in subsequent processes such as soldering.
  • the pogo type socket pin is manufactured separately from the barrel and the pin portion and then used by combining them, it is difficult to manufacture it in a small size. Therefore, the existing pogo type socket pin has limitations in responding to the narrow pitch technology trend.
  • the electrically conductive contact pin (hereinafter referred to as 'rubber type socket pin') used in a rubber type test socket has a structure in which conductive particles are placed inside silicone rubber, which is a rubber material, and is used to connect the test object (e.g., semiconductor
  • the test object e.g., semiconductor
  • the conductive gold particles press each other strongly, increasing the conductivity and creating an electrical connection.
  • these rubber-type socket pins have a problem in that contact stability is ensured only when pressed with excessive pressure.
  • damage occurs in which the conductive particles are separated from the silicone rubber or caved in, which ultimately results in the terminal not being able to function as a socket.
  • the existing rubber type socket pin prepares a molding material in which conductive particles are distributed in a fluid elastic material, inserts the molding material into a predetermined mold, and then applies a magnetic field in the thickness direction to move the conductive particles in the thickness direction. Since they are manufactured by arranging them, when the gap between magnetic fields narrows, the conductive particles are oriented irregularly and the signal flows in the plane direction. Therefore, there are limitations in responding to the narrow pitch technology trend with existing rubber type socket pins.
  • Patent Document 1 Republic of Korea Publication No. 10-2019-0011847 Patent Publication
  • Patent Document 2 Republic of Korea Publication No. 10-2020-0110012 Public Patent Publication
  • the present invention was made to solve the problems of the prior art described above, and its purpose is to provide an electrically conductive contact pin and an inspection device that improve inspection reliability for inspection objects.
  • the electrically conductive contact pin according to the present invention is a metal body portion including a first connection part, a second connection part, and a metal elastic part connecting the first connection part and the second connection part.
  • An electrically conductive contact pin including an elastic insulating material comprising: a first connection area including the first connection part; a second connection area including the second connection part; and an elastic region including the metal elastic portion, wherein at least one of the first connection region, the second connection region, and the elastic region includes the elastic insulating material.
  • the metal elastic portion has a substantial width and is formed in a plate shape with the substantial width extending in the thickness direction.
  • the metal body part is manufactured through a plating process using a mold, so that the first connection part, the second connection part, and the metal elastic part are formed as one piece.
  • the metal elastic portion is embedded in the elastic insulating material.
  • the elastic region includes a closed space, and the elastic insulating material is provided inside the closed space.
  • the closed space is formed by the first connection part, the second connection part, and the metal elastic part.
  • the closed space is formed by the metal elastic portion.
  • the closed space is entirely filled with the elastic insulating material.
  • the closed space is partially filled with the elastic insulating material.
  • the first connection part includes an upper hollow part.
  • connection part includes a lower hollow part.
  • At least one of the first connection area and the second connection area includes an elastic insulating material.
  • the first connection part includes an upper hollow portion, and the elastic insulating material is provided in the upper hollow portion.
  • the second connection part includes a lower hollow portion, and the elastic insulating material is provided in the lower hollow portion.
  • the metal body portion is formed by stacking a plurality of metal layers in the thickness direction.
  • the metal body portion has a fine trench on a side surface.
  • the elastic insulating material is silicone rubber.
  • the inspection device includes a guide plate provided with a through hole; and an electrically conductive contact pin inserted and installed in the through hole, wherein the electrically conductive contact pin includes a first connection part, a second connection part, and a metal elastic part connecting the first connection part and the second connection part. It includes a body part and an elastic insulating material, and includes a first connection area having the first connection part, a second connection area having the second connection part, and an elastic area having the metal elastic part, and the first connection part includes a body part and an elastic insulating material. At least one of the region, the second connection region, and the elastic region includes the elastic insulating material.
  • the guide plate is formed of an elastic insulating material and a different material.
  • the guide plate is made of the same material as the elastic insulating material.
  • the present invention provides an electrically conductive contact pin and an inspection device that improve inspection reliability for inspection objects.
  • FIG. 1 is a view showing a state in which an electrically conductive contact pin according to a first preferred embodiment of the present invention is inserted into a guide plate.
  • Figure 2 is a diagram showing an electrically conductive contact pin according to a first preferred embodiment of the present invention.
  • Figure 3 is a side view of an electrically conductive contact pin according to a first preferred embodiment of the present invention.
  • Figure 4 is a diagram showing a guide plate according to a first preferred embodiment of the present invention.
  • Figure 5 is a diagram showing an inspection device equipped with an electrically conductive contact pin according to a first preferred embodiment of the present invention.
  • 6A to 8 are diagrams showing the process of manufacturing an electrically conductive contact pin according to a first preferred embodiment of the present invention.
  • Figure 9 is a view showing that an electrically conductive contact pin according to a second preferred embodiment of the present invention is formed integrally with an elastic insulating material.
  • Figure 10 is a diagram showing an inspection device equipped with an electrically conductive contact pin according to a second preferred embodiment of the present invention.
  • Figure 11 is a view showing a state in which an electrically conductive contact pin according to a third preferred embodiment of the present invention is inserted into a guide plate.
  • Figure 12 is a diagram showing an inspection device equipped with an electrically conductive contact pin according to a third preferred embodiment of the present invention.
  • FIGS. 13A and 13B are diagrams showing an electrically conductive contact pin according to a third preferred embodiment of the present invention.
  • FIG. 13A is a front view of the electrically conductive contact pin according to a third preferred embodiment of the present invention
  • FIG. 13B is a front view of the electrically conductive contact pin according to a third preferred embodiment of the present invention.
  • FIGS. 14A and 14B are diagrams showing a first modified example of an electrically conductive contact pin according to a third preferred embodiment of the present invention
  • FIG. 14A is a diagram showing a first modified example of an electrically conductive contact pin according to a third preferred embodiment of the present invention. It is a front view of a first modification
  • Figure 14b is a perspective view of a first modification of an electrically conductive contact pin according to a third preferred embodiment of the present invention.
  • FIGS. 15A and 15B are diagrams showing a second modification of the electrically conductive contact pin according to the third preferred embodiment of the present invention.
  • Figure 15A is a diagram showing a second modification of the electrically conductive contact pin according to the third preferred embodiment of the present invention. It is a front view of the second variant, and Figure 15b is a perspective view of the second variant of the electrically conductive contact pin according to the third preferred embodiment of the present invention.
  • FIGS. 16A and 16B are diagrams showing a third modification of the electrically conductive contact pin according to the third preferred embodiment of the present invention.
  • Figure 16A is a diagram showing a third modification of the electrically conductive contact pin according to the third preferred embodiment of the present invention. It is a front view of a third variant, and Figure 16b is a perspective view of a third variant of an electrically conductive contact pin according to a third preferred embodiment of the present invention.
  • 17A to 17C are diagrams showing modifications of the metal elastic portion of the electrically conductive contact pin according to a preferred embodiment of the present invention.
  • 18A to 18C are diagrams showing modifications of the metal elastic portion of the electrically conductive contact pin according to a preferred embodiment of the present invention.
  • the electrically conductive contact pin 10 is provided in the inspection device 1 and is used to transmit an electrical signal by electrically and physically contacting the inspection object 20.
  • the inspection device 1 may be an inspection device used in a semiconductor manufacturing process, and may be a probe card or a test socket, for example.
  • the inspection device 1 includes an electrically conductive contact pin 10 and a guide plate 500 having a through hole 510 for receiving the electrically conductive contact pin 10.
  • the electrically conductive contact pin 10 may be a probe pin provided on a probe card or a socket pin provided on a test socket. Below, a socket pin is described as an example of the electrically conductive contact pin 10, but the electrically conductive contact pin 10 according to a preferred embodiment of the present invention is not limited thereto, and electricity is applied to the inspection object 20. ), any pin used to check whether it is defective is included.
  • the width direction of the electrically conductive contact pin 10 described below is the ⁇ x direction shown in the drawing
  • the longitudinal direction of the electrically conductive contact pin 10 is the ⁇ y direction shown in the drawing
  • the longitudinal direction of the electrically conductive contact pin 10 is the ⁇ y direction shown in the drawing.
  • the thickness direction is the ⁇ z direction indicated in the drawing.
  • the electrically conductive contact pin 10 has an overall length dimension (L) in the longitudinal direction ( ⁇ y direction) and an overall thickness dimension (H) in a thickness direction perpendicular to the longitudinal direction ( ⁇ z direction), It has an overall width dimension (W) in the width direction perpendicular to the longitudinal direction ( ⁇ x direction).
  • Figure 1 is a diagram showing the electrically conductive contact pin 10 according to the first preferred embodiment of the present invention inserted into the guide plate 500
  • Figure 2 is a diagram showing the electrically conductive contact pin 10 according to the first preferred embodiment of the present invention.
  • It is a drawing showing a conductive contact pin 10
  • FIG. 3 is a drawing showing a side of the electrically conductive contact pin 10 according to a first preferred embodiment of the present invention
  • FIG. 4 is a drawing showing a first preferred embodiment of the present invention.
  • FIG. 5 is a drawing showing an inspection device 1 equipped with an electrically conductive contact pin 10 according to a first preferred embodiment of the present invention
  • FIG. 6a 8 are diagrams showing the process of manufacturing the electrically conductive contact pin 10 according to the first preferred embodiment of the present invention.
  • the electrically conductive contact pin 10 includes a metal body portion 100 made of a metal material and an elastic insulating material 200 made of a non-metal material. Additionally, the electrically conductive contact pin 10 includes a first connection area 310, a second connection area 320, and an elastic area 330 in terms of position.
  • the metal body portion 100 includes a first connection portion 110 and a second connection portion 120, and the second connection portion 120 is elastically relative to the first connection portion 110 in the longitudinal direction ( ⁇ y direction). is displaced. Due to the pressure applied to the first connection part 110 and/or the second connection part 120, the first connection part 110 and the second connection part 120 are displaced toward or away from each other.
  • the first connection part 110 is provided with a metal elastic part 130 to allow elastic relative displacement with respect to the second connection part 120.
  • the metal elastic part 130 is provided between the first connection part 110 and the second connection part 120 and connects the first connection part 110 and the second connection part 120.
  • the first connection part 110, the second connection part 120, and the metal elastic part 130 are manufactured through a plating process using a mold, so that the first connection part 110, the second connection part 120, and the metal elastic part 130 are manufactured through a plating process using a mold. It is formed as one piece. While the conventional electrically conductive contact pin is prepared by manufacturing the barrel and the pin separately and then assembling or combining them, the metal body portion 100 of the electrically conductive contact pin 10 according to a preferred embodiment of the present invention is made of There is a difference in composition in that the first connection part 110, the second connection part 120, and the metal elastic part 130 are manufactured all at once using a plating process, so that they are provided as one piece.
  • each cross section in the thickness direction ( ⁇ z direction) of the metal body portion 100 is the same.
  • the same cross-sectional shape is formed by extending in the thickness direction ( ⁇ z direction).
  • the metal body portion 100 has a total thickness dimension (H) in the thickness direction ( ⁇ z direction). That is, the first connection part 110, the second connection part 120, and the elastic metal part 130 are formed to have the same thickness (H).
  • a plurality of metal layers are stacked in the thickness direction ( ⁇ z direction) of the metal body portion 100.
  • the plurality of metal layers include a first metal layer 11 and a second metal layer 12.
  • the first metal layer 11 is a metal with relatively high wear resistance compared to the second metal layer 12, and is preferably made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), and nickel (Ni). , manganese (Mn), tungsten (W), phosphorus (Ph) or their alloys, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy, nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn) ), nickel-cobalt (NiCo), or nickel-tungsten (NiW) alloy.
  • the second metal layer 12 is a metal with relatively high electrical conductivity compared to the first metal layer 11, and is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or alloys thereof. It can be. However, it is not limited to this.
  • the first metal layer 11 is provided on the front and rear surfaces in the thickness direction ( ⁇ z direction) of the metal body portion 100, and the second metal layer 12 is provided between the first metal layers 11.
  • the metal body portion 100 is provided by alternately stacking the first metal layer 11, the second metal layer 12, and the first metal layer 11 in that order in the thickness direction ( ⁇ z direction) of the metal body portion 100.
  • the number of stacked layers may be three or more.
  • the metal body portion 100 includes a first metal layer 11 made of palladium-cobalt (Pd-Co), a second metal layer 12 made of gold (Au), and a second metal layer 12 made of palladium-cobalt (Pd-Co). ), a first metal layer 11 composed of gold (Au), a second metal layer 12 composed of palladium-cobalt (Pd-Co), and a first metal layer 11 composed of palladium-cobalt (Pd-Co). .
  • One end of the first connection part 110 is a free end and the other end is connected to the metal elastic part 130, allowing elastic vertical movement by contact pressure.
  • the first connection part 110 includes a first contact part 112 in contact with the connection object, a first base part 113 connected to the metal elastic part 130, a first contact part 112, and a first base part 113.
  • ) includes a first side portion 114 connecting the
  • the upper hollow part 111 provided in the first connection part 110 is surrounded by the first contact part 112, the first base part 113, and the first side part 114.
  • the upper hollow portion 111 is provided in the form of penetrating the metal body portion 100 in the thickness direction ( ⁇ z direction).
  • the first base portion 113, the first contact portion 112, and both first side portions 114 are provided to surround the upper hollow portion 111, so that the upper hollow portion 111 has a sealed structure.
  • the first connection part 110 includes an upper hollow part 111, and when a connection object contacts the first connection part 110 and is pressed, the first contact part 112 located on the top of the upper hollow part 111 moves in the pressing direction. Bending deformation is possible.
  • the first contact portion 112 and the first side portion 114 of the first connection portion 110 are provided in the form of a plate having a substantial width. do.
  • the actual width of the first contact portion 112 is one wide side (the upper surface of the first contact portion 112, which is in contact with the connection object) and the opposite side (the first contact portion) based on the first contact portion 112. It is the length between the lower surface of (112) and the surface located on the upper hollow portion 111 side.
  • the first contact portion 112 When the metal body portion 100 is viewed from the connection object side, the first contact portion 112 has a plate-like shape and has four sides. Here, two of the four sides are formed in the form of corners connected to the first side portion 114, and the remaining two sides are formed in the form of ends that are not connected to any part.
  • the first side portions 114 located on both sides support the two sides of the first contact portion 112 along the thickness direction ( ⁇ z direction).
  • the middle portion of the first contact portion 112 is capable of being bent and deformed by the external force while the two sides of the first contact portion 112 are supported by the first side portion 114. It becomes a state.
  • the connection object may be the inspection object 20, and preferably may be a semiconductor package.
  • the connection terminal 25 of the semiconductor package may have a spherical shape. In this case, when the connection terminal 25 is in contact with the first contact portion 112 and pressurizes the first contact portion 112, the first contact portion 112 is connected. It is bent and deformed concavely in a direction surrounding the terminal 25. That is, the first contact portion 112 is deformed into a semi-cylindrical shape by the pressing force. Meanwhile, when the pressing force of the connection terminal 25 is released, the first contact portion 112 returns to its original state by its own elastic restoring force.
  • the first contact portion 112 of the first connection portion 110 is elastically deformed to cushion the downward shock of the connection terminal 25 and prevent damage to the connection terminal 25. Damage to the connection terminal 25 can be prevented more effectively by the buffering action of the first connection portion 110 in addition to the buffering action of the metal elastic portion 130.
  • the upper surface of the first contact portion 112 may be composed of a flat surface, a convex surface toward the upper side, or a concave surface toward the lower side.
  • the upper surface of the first contact portion 112 is illustrated as being composed of a flat surface, but the scope of the embodiment of the present invention is not limited thereto, and is composed of a convex surface toward the upper side or a lower surface of the first contact portion 112. It also includes concave sides.
  • One end of the second connection part 120 is a free end, and the other end is connected to the metal elastic part 130, allowing elastic vertical movement by contact pressure.
  • the second connection part 120 has a sealed lower hollow part 121.
  • the second connection portion 110 is elastically deformed by the lower hollow portion 121 to prevent damage to the pad 35. That is, preventing damage to the pad 35 is more effectively achieved through the cushioning action of the second connection portion 120 in addition to the buffering action of the metal elastic portion 130.
  • the metal elastic part 130 connects the first connection part 110 and the second connection part 120. One end of the metal elastic part 130 is connected to the first connection part 110, and the other end is connected to the second connection part 120.
  • the metal elastic portion 130 is elastically deformable so that the first connection portion 110 and the second connection portion 120 are displaced relative to each other in the longitudinal direction ( ⁇ y direction) by an external force.
  • the metal elastic portion 130 has the same cross-sectional shape in the thickness direction ( ⁇ z direction) of the metal body portion 100 in all thickness cross-sections. This is possible because the metal body portion 100 is manufactured through a plating process.
  • the metal elastic portion 130 has a substantial width t and is formed in a plate shape with the substantial width t extending in the thickness direction ( ⁇ z direction).
  • the metal plate portion 130 has a shape in which a plate-shaped plate having an actual width t is repeatedly bent in an S shape, and the actual width t of the plate-shaped plate is constant throughout.
  • the actual width (t) of the plate-shaped plate is the length between one wide side and the opposite side based on the plate-shaped plate, and may be the average or intermediate value of the width based on the plate-shaped plate constituting the metal elastic portion 130. there is.
  • the width direction ( ⁇ x direction) dimension of the first connection portion 110 is adjusted to the guide plate 500. It is formed to be larger than the width direction ( ⁇ x direction) dimension of the through hole 510 of (500).
  • the electrically conductive contact pin 10 includes a first connection area 310 having a first connection part 110, a second connection area 320 having a second connection part 120, and a metal elastic part 130. It includes an elastic region 330 having.
  • the elastic area 330 may be an area located inside the through hole 510 of the guide plate 400.
  • At least one of the first connection area 310, the second connection area 320, and the elastic area 330 includes an elastic insulating material 200.
  • the elastic insulating material 200 is integrally combined with the metal body 100 to form an electrically conductive contact pin 10.
  • the elastic insulating material 200 may be an insulating polymer material with a crosslinked structure.
  • Insulating polymer materials include conjugated diene-based rubbers such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber, and their hydrogenated products, and styrene-butadiene-diene block copolymer.
  • the insulating polymer material may be silicone rubber.
  • silicone rubber may be made of polysiloxane.
  • the silicone rubber may be liquid silicone rubber (LSR), and is preferably a product obtained by crosslinking or condensing liquid silicone rubber.
  • the elastic insulating material 200 functions to complement the elasticity of the metal body 100, thereby allowing the metal content of the metal body 100 to be adjusted. Since the metal body portion 100 is a path for electric flow, it must be formed of a metal with high electrical conductivity, and at the same time, since it must be elastically deformed, it must also be formed of a metal with high elasticity. By stacking the first metal layer 11 and the second metal layer 12 to form the metal body 100, it is possible to have high electrical conductivity and elasticity. However, the content of the second metal layer 12 is reduced by the content of the first metal layer 11.
  • the content of the first metal layer 11 of the metal body 100 is reduced by providing the metal body 100 and the elastic insulating material 200 together, while the second metal layer 12 ) can be increased, and as a result, the electrical conductivity of the metal body portion 100 can be further improved.
  • the elastic insulating material 200 may be provided in the elastic region 330 of the electrically conductive contact pin 10.
  • the metal elastic portion 130 When the metal elastic portion 130 is restored after being compressively deformed, the electrically conductive contact pin 10 can be more easily restored by the elastic insulating material 200.
  • the metal elastic portion 130 may be provided by being embedded in the elastic insulating material 200.
  • the metal elastic portion 130 is partially embedded in the elastic insulating material 200 so that a portion of the metal elastic portion 130 is exposed to the outside, or the metal elastic portion 130 is entirely embedded in the elastic insulating material 200.
  • the metal elastic portion 130 may be configured not to be exposed to the outside.
  • the metal elastic portion 130 may be partially embedded in the elastic insulating material 200 so that the end surface of the metal elastic portion 130 in the thickness direction ( ⁇ z direction) is exposed. .
  • the metal elastic portion 130 may be entirely embedded in the elastic insulating material 200 so that the metal elastic portion 130 is not exposed to the outside.
  • the elastic insulating material 200 covers the entire metal elastic part 130 to prevent the metal elastic part 130 from being exposed to the outside.
  • the elastic metal portion 130 can allow the elastic insulating material 200 to contact the inner wall of the through hole 510 of the guide plate 500 without contacting the inner wall of the through hole 510.
  • the elastic insulating material 200 entirely covers the metal elastic portion 130 and the elastic insulating material 200 is provided as a whole to prevent the elastic insulating material 200 from being easily separated from the metal body portion 100.
  • the elastic insulating material 200 may be provided between the metal elastic portion 130 and the inner wall of the through hole 510.
  • the metal elastic portion 130 is prevented from directly contacting the inner wall of the through hole 510, thereby preventing the inner wall of the through hole 510 from being worn by the metal elastic portion 130.
  • a through hole 510 is formed in the guide plate 500.
  • the through hole 510 has a square cross-sectional shape
  • the outer shape of the electrically conductive contact pin 10 also has a square cross-sectional shape corresponding to the cross-sectional shape of the through hole 510.
  • the outer shape of the electrically conductive contact pin 10 refers to the shape formed when the metal body portion 100 is projected from one side to the other side in the longitudinal direction ( ⁇ y direction) of the electrically conductive contact pin 10. can do.
  • the cross section of the through hole 510 has a rectangular shape.
  • the overall direction dimension (W) in the width direction ( ⁇ x direction) of the electrically conductive contact pin 10 is formed to be larger than the overall thickness dimension (H) in the thickness direction ( ⁇ z direction), so that the electrically conductive contact pin 10
  • the outer shape of is preferably formed as a rectangular shape. Through this, it is possible to prevent the electrically conductive contact pin 10 from being incorrectly inserted in a 90-degree rotation state.
  • the overall width dimension (W) of the electrically conductive contact pin 10 in the width direction ( ⁇ x direction) is longer than the length of the side opposite to the first direction of the through hole 510, and the thickness of the metal body portion 100
  • the overall thickness dimension H in the direction ( ⁇ z direction) is smaller than the length of the side of the through hole 510 opposite to the second direction.
  • the first direction of the through hole 510 is the width direction ( ⁇ x direction) of the electrically conductive contact pin 10
  • the second direction of the through hole 510 is the thickness direction ( ⁇ x direction) of the electrically conductive contact pin 10. z direction).
  • the elastic insulating material 200 is prevented from being separated from the electrically conductive contact pin 10 by the inner wall of the through hole 510.
  • the electrically conductive contact pin 10 is spanned by the first connection portion 110 on two sides of the through hole 510 opposite to each other in the first direction, but has two sides opposite to the second direction of the through hole 510. It doesn't hang. Therefore, by allowing the electrically conductive contact pin 10 to move in the two opposing side directions in the second direction of the through hole 510, fine adjustment of the alignment of the electrically conductive contact pin 10 in a few to tens of ⁇ m is possible. possible.
  • Figure 1 is a diagram showing the electrically conductive contact pin 10 inserted into the through hole 510 of the guide plate 500
  • Figure 5 is a diagram showing the position of the electrically conductive contact pin 10 during inspection. am.
  • FIG. 1 when the electrically conductive contact pin 10 is inserted into the guide plate 500, the electrically conductive contact pin 10 is moved to the lower portion of the guide plate 500 by the first contact portion 110 of the electrically conductive contact pin 10. It doesn't break away.
  • the first connection portion 110 is a guide plate ( 500) is spaced apart from the upper surface and protrudes. When inspecting the spaced protrusion height, the first connection part 110 can be further moved downward.
  • the overall length dimension (L) of the electrically conductive contact pin 10 may be 400 ⁇ m or more and 600 ⁇ m or less. Additionally, the overall width dimension (W) of the electrically conductive contact pin 10 may be 150 ⁇ m or more and 300 ⁇ m or less. Additionally, the longitudinal dimension (L2) of the guide plate 500 may be 150 ⁇ m or more and 250 ⁇ m or less. Additionally, the longitudinal dimension L1 of the electrically conductive contact pin 10 protruding above the guide plate 500 may be 50 ⁇ m or more and 200 ⁇ m or less. Additionally, the longitudinal dimension L3 of the electrically conductive contact pin 10 protruding from the lower portion of the guide plate 500 may be 50 ⁇ m or more and 200 ⁇ m or less.
  • the distance between the lower surface of the first connection portion 110 and the upper surface of the guide plate 500 may be 5 ⁇ m or more and 50 ⁇ m or less.
  • the contact stroke of the inspection object 20 can be secured through the distance L4 between the lower surface of the first connection part 110 and the upper surface of the guide plate 500.
  • the stroke may not be constant each time. Therefore, if the clearance distance for the electrically conductive contact pin 10 to move as a whole with respect to the guide plate 500 is not secured, the electrically conductive contact pin 10 may be damaged. However, it is possible to secure a contact stroke through the distance L4 between the lower surface of the first connection part 110 and the upper surface of the guide plate 500.
  • the distance (L4) between the lower surface of the first connection part 110 and the upper surface of the guide plate 500 is less than 5 ⁇ m, it is difficult to secure the contact stroke of the inspection object 20, and if it exceeds 50 ⁇ m, it is difficult to secure the contact stroke of the inspection object 20. This is not desirable because it may cause buckling deformation of the metal elastic portion 130.
  • the overall length L of the electrically conductive contact pin 10 must be short. Accordingly, the length of the metal elastic portion 130 must also be shortened. However, if the length of the metal elastic portion 130 is shortened, a problem occurs in which the contact pressure increases. In order to shorten the length of the metal elastic portion 130 and prevent the contact pressure from increasing, the actual width (t) of the plate-shaped plate constituting the metal elastic portion 130 must be reduced. However, if the actual width (t) of the plate-shaped plate constituting the metal elastic portion 130 is reduced, a problem occurs in which the metal elastic portion 130 is easily damaged. In order to shorten the length of the metal elastic portion 130, without increasing the contact pressure, and to prevent damage to the metal elastic portion 130, the overall thickness dimension (H) of the plate-shaped plate constituting the metal elastic portion 130 must be formed large. do.
  • the electrically conductive contact pin 10 is formed so that the actual width (t) of the plate-shaped plate constituting the metal elastic portion 130 is thin while the overall thickness dimension (H) of the plate-shaped plate is large. . That is, the total thickness dimension (H) is formed to be large compared to the actual width (t) of the plate-shaped plate. This is possible because, as will be described later, the metal body portion 100 is manufactured using a mold 1000 made of an anodized film.
  • the actual width (t) of the plate-shaped plate constituting the metal body portion 100 is in the range of 5 ⁇ m to 15 ⁇ m, and the total thickness dimension (H) is in the range of 70 ⁇ m to 200 ⁇ m.
  • the actual width (t) and overall thickness (H) of the plate-shaped plate are in the range of 1:5 to 1:30.
  • the actual width of the plate-shaped plate is formed to be substantially 10 ⁇ m, and the overall thickness dimension (H) is formed to be 100 ⁇ m, so that the actual width (t) and overall thickness dimension (H) of the plate-shaped plate are 1:10. It can be formed as a ratio.
  • the metal elastic portion 130 is formed by bending a plate-shaped plate, compared to an elastic portion formed by winding a wire with a certain diameter in a certain direction, current flows through the metal elastic portion 130 more smoothly. It can be done properly.
  • the overall thickness dimension (H) and overall length dimension (L) of the electrically conductive contact pin 10 are provided in the range of 1:3 to 1:9. .
  • the overall length dimension (L) of the electrically conductive contact pin 10 may be in the range of 300 ⁇ m or more and 2 mm or less, and more preferably 450 ⁇ m or more and 600 ⁇ m or less. In this way, it is possible to shorten the overall length dimension (L) of the metal body portion 100, making it easy to respond to high frequency characteristics.
  • the plate-shaped plate constituting the metal body 100 has an actual width (t) smaller than the overall thickness (H), thereby improving bending resistance in the front and rear directions.
  • the overall thickness dimension (H) and the overall width dimension (W) of the electrically conductive contact pin 10 are in the range of 1:1 to 1:5.
  • the total thickness dimension (H) of the electrically conductive contact pin 10 is in the range of 70 ⁇ m or more and 200 ⁇ m or less
  • the overall width dimension (W) of the electrically conductive contact pin 10 is 100 ⁇ m or more and 500 ⁇ m. It may be provided in the following range, and more preferably, the total width dimension (W) of the electrically conductive contact pin 10 may be provided in the range of 150 ⁇ m or more and 400 ⁇ m or less. In this way, it is possible to narrow the pitch by shortening the overall width dimension (W) of the electrically conductive contact pin 10.
  • the electrically conductive contact pin 10 manufactured using a conventional photoresist mold has a limitation in that the overall thickness dimension (H) cannot be increased compared to the overall width dimension (W).
  • the conventional electrically conductive contact pin 10 has an overall thickness dimension (H) of less than 70 ⁇ m and an overall thickness dimension (H) and overall width dimension (W) in the range of 1:2 to 1:10. , the resistance to the moment that deforms the electrically conductive contact pin 10 in the front and rear directions due to contact pressure is weak.
  • the present invention makes it possible to form the overall thickness dimension (H) and the overall width dimension (W) of the electrically conductive contact pin 10 to be substantially the same length, so that the front of the electrically conductive contact pin 10 , resistance to moment acting in the rear direction increases, and as a result, contact stability is improved.
  • the overall thickness dimension (H) of the electrically conductive contact pin 10 is 70 ⁇ m or more, and the overall thickness dimension (H) and overall width dimension (W) are in the range of 1:1 to 1:5, electrical As the overall durability and deformation stability of the conductive contact pin 10 are improved, the contact stability with the connection terminal 25 is improved.
  • the overall thickness H of the electrically conductive contact pin 10 is formed to be 70 ⁇ m or more, thereby improving the current carrying capacity.
  • FIG. 6A is a plan view of the mold 1000 in which the internal space 1100 is formed
  • FIG. 6B is a cross-sectional view taken along line A-A' of FIG. 6A.
  • the mold 1000 may be made of an anodized film, photoresist, silicon wafer, or similar materials. However, preferably, the mold 1000 may be made of an anodic oxide film material.
  • An anodic oxide film refers to a film formed by anodizing a base metal, and a pore refers to a hole formed in the process of anodizing a metal to form an anodic oxide film.
  • the base metal is aluminum (Al) or an aluminum alloy
  • Al 2 0 3 aluminum oxide
  • the base metal is not limited to this and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or alloys thereof.
  • the anodic oxide film formed as above is a barrier layer in which no pores are formed vertically. It is divided into a porous layer with pores formed inside. When the base material is removed from a base material on which an anodic oxide film having a barrier layer and a porous layer is formed on the surface, only an anodic oxide film made of aluminum oxide (Al 2 0 3 ) remains.
  • the anodic oxidation film may be formed in a structure that penetrates the top and bottom of the pore by removing the barrier layer formed during anodization, or may be formed in a structure that seals the top and bottom ends of the pore while the barrier layer formed during anodization remains intact.
  • the anodic oxide film has a thermal expansion coefficient of 2 ⁇ 3ppm/°C. For this reason, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, even if the manufacturing environment for the metal body 100 is a high temperature environment, the precise metal body 100 can be manufactured without thermal deformation.
  • the metal body portion 100 is manufactured using a mold 1000 made of an anodized film instead of a photoresist mold, the precision and fineness of the shape were limited in realizing it with a photoresist mold. The effect of realizing the shape can be exerted.
  • the metal body part 100 with a thickness of about 40 ⁇ m can be manufactured, but when using the mold 1000 made of an anodized film, the metal body part with a thickness of 70 ⁇ m or more and 200 ⁇ m or less can be manufactured. (100) can now be produced.
  • a seed layer 1200 is provided on the lower surface of the mold 1000.
  • the seed layer 1200 may be provided on the lower surface of the mold 1000 before forming the internal space 1100 in the mold 1000.
  • a support substrate (not shown) is formed on the lower part of the mold 1000 to improve the handling of the mold 1000.
  • the seed layer 1200 may be formed on the upper surface of the support substrate, and the mold 1000 with the internal space 1100 formed may be used by combining the mold 1000 with the support substrate.
  • the seed layer 1200 may be made of copper (Cu) material and may be formed by a deposition method.
  • the internal space 1100 may be formed by wet etching the mold 1000 made of an anodized film. To this end, a photo resist is provided on the upper surface of the mold 1000 and patterned, and then the anodic oxide film in the patterned open area reacts with the etching solution to form the internal space 1100.
  • FIG. 6C is a plan view showing an electroplating process performed on the internal space 1100
  • FIG. 6D is a cross-sectional view taken along line A-A' of FIG. 6C.
  • the metal layer is formed while growing in the thickness direction ( ⁇ z direction) of the mold 1000, the shape at each cross section in the thickness direction ( ⁇ z direction) of the metal body portion 100 (10) is the same, and the metal layer A plurality of metal layers are stacked in the thickness direction ( ⁇ z direction) of the body portion 100.
  • the plurality of metal layers include a first metal layer 11 and a second metal layer 12.
  • the first metal layer 11 is a metal with relatively high wear resistance compared to the second metal layer 12, and is made of rhodium (Rd), platinum (Pt), iridium (Ir), palladium, or these.
  • the second metal layer 12 is a metal with relatively high electrical conductivity compared to the first metal layer 11 and includes copper (Cu), silver (Ag), gold (Au), or an alloy thereof.
  • the first metal layer 11 is provided on the lower and upper surfaces of the metal body 100 in the thickness direction ( ⁇ z direction), and the second metal layer 12 is provided between the first metal layers 11.
  • the metal body portion 100 is provided by alternately stacking the first metal layer 11, the second metal layer 12, and the first metal layer 11 in that order, and the number of stacked layers may be three or more.
  • the metal body portion 100 includes a first metal layer 11 made of palladium-cobalt (Pd-Co), a second metal layer 12 made of gold (Au), and a second metal layer 12 made of palladium-cobalt (Pd-Co). ), a first metal layer 11 composed of gold (Au), a second metal layer 12 composed of palladium-cobalt (Pd-Co), and a first metal layer 11 composed of palladium-cobalt (Pd-Co). .
  • the first metal layer 11 and the second metal layer 12 can be made more dense by raising the temperature to a high temperature and applying pressure to press the metal layer on which the plating process has been completed.
  • photoresist material is used as a mold, photoresist exists around the metal layer after the plating process is completed, so a process of raising the temperature to a high temperature and applying pressure cannot be performed.
  • a mold 1000 made of an anodized film is provided around the metal layer for which the plating process has been completed, so that even if the temperature is raised to a high temperature, deformation is minimized due to the low thermal expansion coefficient of the anodized film. It is possible to densify the first metal layer 11 and the second metal layer 12. Therefore, it is possible to obtain a more dense first metal layer 11 and a second metal layer 12 compared to the technology using photoresist as a mold.
  • FIG. 7A is a plan view of the mold 1000 in which the internal space 1100 to be filled with the elastic insulating material 200 is formed
  • FIG. 7B is a cross-sectional view taken along line A-A' of FIG. 7A
  • FIG. 7C is a plan view showing the internal space 1100 filled with the elastic insulating material 200
  • FIG. 7D is a cross-sectional view taken along line A-A' of FIG. 7C.
  • the internal space 1100 is formed by etching the anodized film around the metal elastic part 130 of the metal body part 100. Then, the internal space 1100 is filled with an elastic insulating material.
  • a process of removing the mold 1000 and the seed layer 1200 is performed. If the mold 1000 is made of an anodic oxide material, the mold 1000 is removed using a solution that selectively reacts with the anodic oxide material. Additionally, if the seed layer 1200 is made of copper (Cu), the seed layer 1200 is removed using a solution that selectively reacts with copper (Cu).
  • each electrically conductive contact pin 10 is connected by a connection portion 1300.
  • the connection portion 1300 improves the handleability of the electrically conductive contact pins 10 by connecting adjacent electrically conductive contact pins 10 to each other.
  • the electrically conductive contact pins 10 connected to each other by the connecting portion 1300 can be transported or handled at the same time.
  • a process of inserting them into the through hole 510 of the guide plate 500 is performed. While inserting the electrically conductive contact pin 10 into the through hole 510, the electrically conductive contact pin 10 is separated from the connection portion 1300.
  • the metal body portion 100 of the electrically conductive contact pin 10 includes a plurality of fine trenches 88 on its side.
  • the fine trench 88 is formed to extend long from the side of the metal body 100 in the thickness direction ( ⁇ z direction) of the metal body 100.
  • the thickness direction ( ⁇ z direction) of the metal body portion 100 refers to the direction in which the metal filler grows during electroplating.
  • the fine trench 88 has a depth ranging from 20 nm to 1 ⁇ m, and its width also ranges from 20 nm to 1 ⁇ m.
  • the width and depth of the fine trench 88 have values less than the range of the diameter of the pore of the anodic oxide mold 1000.
  • some of the pores of the anodic oxide mold 1000 are crushed by the etching solution, and the diameter of the pores formed during anodization is larger than that of the pores. At least a portion of the fine trench 88 may be formed with a depth of .
  • the anodic oxide film mold 1000 includes numerous pores, and at least a portion of the anodic oxide film mold 1000 is etched to form an internal space 1100, and a metal filler is formed inside the internal space 1100 by electroplating,
  • the side of the electrically conductive contact pin 10 is provided with a fine trench 88 formed while contacting the pores of the anodic oxide film mold 1000.
  • the fine trench 88 as described above has the effect of increasing the surface area on the side surface of the metal body portion 100.
  • heat generated in the metal body 100 can be quickly dissipated, thereby suppressing the temperature rise of the electrically conductive contact pin 10. It becomes possible.
  • the torsional resistance ability of the electrically conductive contact pin 10 when deformed can be improved. It also improves bonding strength with the elastic insulating material 200.
  • Figure 9 is a diagram showing an electrically conductive contact pin according to a second preferred embodiment of the present invention formed integrally with an elastic insulating material
  • Figure 10 shows an electrically conductive contact pin according to a second preferred embodiment of the present invention. This is a drawing showing the inspection device provided.
  • the electrically conductive contact pin 10 according to the second preferred embodiment of the present invention is electrically conductive according to the first embodiment in that the plurality of metal body parts 100 are integrally connected by the elastic insulating material 200. There is a difference in the configuration of the contact pin 10, but the remaining configuration is the same.
  • a plurality of metal body parts 100 may be inserted into the through hole 510 of the guide plate 500 and installed on the guide plate 500 while connected to each other by an elastic insulating material 200, or may be installed on the guide plate 500, or a separate guide may be used.
  • the elastic insulating material 200 may also perform the function of the guide plate 500 without the plate 500.
  • FIGS. 11 to 16B Figure 11 is a diagram showing the electrically conductive contact pin 10 according to the third preferred embodiment of the present invention inserted into the guide plate 500
  • Figure 12 is a diagram showing the electrically conductive contact pin 10 according to the third preferred embodiment of the present invention.
  • It is a diagram showing an inspection device 1 equipped with a conductive contact pin 10
  • FIGS. 13A and 13B are diagrams showing an electrically conductive contact pin 10 according to a third preferred embodiment of the present invention.
  • 13a is a front view of the electrically conductive contact pin 10 according to a third preferred embodiment of the present invention
  • FIG. 13b is a perspective view of the electrically conductive contact pin 10 according to a third preferred embodiment of the present invention.
  • the elastic region 330 of the electrically conductive contact pin 10 according to the third preferred embodiment of the present invention includes a closed space 350, and the elastic insulating material 200 is provided inside the closed space 350. There is a difference from the configuration of the electrically conductive contact pin 10 according to the first embodiment.
  • the metal elastic part 130 includes a first elastic part 131 and a second elastic part 132.
  • the first elastic part 131 and the second elastic part 132 are provided to be spaced apart from each other in the width direction ( ⁇ x direction). One end of the first elastic part 131 is connected to the first connection part 110 and the other end is connected to the second connection part 120. Additionally, one end of the second elastic portion 132 is connected to the first connection portion 110 and the other end is connected to the second connection portion 120.
  • the first elastic part 131 and the second elastic part 132 are provided in the shape of a plate with a substantial width t and behave like a leaf spring due to a pressing force.
  • the first elastic portion 131 is provided in a curved shape to enable elastic deformation.
  • the first elastic portion 131 is provided in a curved shape that is convex inward.
  • the second elastic portion 132 is also provided in a curved shape to enable elastic deformation.
  • the second elastic portion 132 is provided in a curved shape that is convex inward.
  • the first elastic part 131 and the second elastic part 132 have been described as being symmetrical in the width direction ( ⁇ x direction) and provided in an inwardly convex shape, but are not limited thereto, and have a closed space 350 inside them. ), but includes any shape that can be elastically deformed.
  • the closed space 350 is formed by the first connection part 110, the second connection part 120, and the metal elastic part 130.
  • the closed space 350 is surrounded by the first connection part 110, the second connection part 120, and the metal elastic part 130 and is sealed except for two surfaces in the thickness direction.
  • the closed space 350 is provided in the form of penetrating the elastic region 330 in the thickness direction ( ⁇ z direction).
  • the closed space 350 is entirely filled with an elastic insulating material 200.
  • the elastic insulating material 200 fills the entire interior of the closed space 350.
  • the elastic insulating material 200 is provided inside the closed space 350, the elastic restoring force of the metal elastic portion 130 is reinforced by the elastic force of the elastic insulating material 200.
  • the second connection part 120 may be provided in the same shape as the first connection part 110. That is, the second connection part 120 includes a second contact part 122 in contact with the connection object (pad 35 of the circuit board 30), and a second base part 123 connected to the metal elastic part 130. ), and a second side portion 124 connecting the second contact portion 122 and the second base portion 123.
  • the lower hollow portion 121 provided in the second connection portion 120 is surrounded by the second contact portion 122, the second base portion 123, and the second side portion 124.
  • the lower hollow portion 121 is provided in the form of penetrating the metal body portion 100 in the thickness direction ( ⁇ z direction).
  • the second connection part 120 includes a lower hollow part 121, and when a connection object (pad 35) contacts the second connection part 120 and is pressed, the second contact part located below the lower hollow part 121 (122) is capable of bending and deformation in the pressing direction.
  • the second base portion 123, the second contact portion 122, and both second side portions 124 are provided to surround the lower hollow portion 121, so that the lower hollow portion 121 is formed in a sealed structure.
  • the dimension of the second connection portion 120 in the width direction ( ⁇ direction) is smaller than the dimension of the first connection portion 110 in the width direction ( ⁇ direction).
  • FIGS. 14A and 14B are diagrams showing a first modification of the electrically conductive contact pin 10 according to the third preferred embodiment of the present invention
  • FIG. 14A shows the electrically conductive contact pin 10 according to the third preferred embodiment of the present invention
  • Figure 14b is a front view of a first variant of the pin 10
  • Figure 14b is a perspective view of a first variant of the electrically conductive contact pin 10 according to a third preferred embodiment of the present invention.
  • the first modification of the electrically conductive contact pin 10 according to the third embodiment differs from the third embodiment in that the closed space 350 is partially filled with the elastic insulating material 200. .
  • the free space 370 is an empty space in the closed space 350 that is not filled with the elastic insulating material 200.
  • the spare space 370 formed as an empty space acts as a space that allows the elastic insulating material 200 to expand when elastically deformed, thereby allowing the elastic region 330 to be more easily elastically deformed. Meanwhile, the free space 370 may be located at the center of the elastic insulating material 200, but the location of the free space 370 is not limited to this.
  • FIGS. 15A and 15B are diagrams showing a second modification of the electrically conductive contact pin 10 according to the third preferred embodiment of the present invention
  • FIG. 15A shows the electrically conductive contact pin 10 according to the third preferred embodiment of the present invention
  • Figure 15b is a front view of a second variant of the pin 10
  • Figure 15b is a perspective view of a second variant of the electrically conductive contact pin 10 according to a third preferred embodiment of the present invention.
  • the second modification of the electrically conductive contact pin 10 according to the third embodiment includes an elastic insulating material 200 in at least one of the first connection area 310 and the second connection area 320. In this respect, there is a difference in composition from the third embodiment.
  • the first connection portion 110 of the first connection area 310 includes an upper hollow portion 111, and the elastic insulating material 200 is provided in the upper hollow portion 111. Through this, the first contact portion 112 is more easily elastically restored after being bent and deformed by a pressing force.
  • the elastic insulating material 200 is entirely filled in the upper hollow portion 111.
  • the second connection portion 120 of the second connection area 320 includes a lower hollow portion 121, and the elastic insulating material 200 is provided in the lower hollow portion 121. Through this, the second contact portion 122 is more easily elastically restored after being bent and deformed by a pressing force.
  • the elastic insulating material 200 is entirely filled in the lower hollow portion 121.
  • FIGS. 16A and 16B are diagrams showing a third modification of the electrically conductive contact pin 10 according to the third preferred embodiment of the present invention
  • FIG. 16A shows the electrically conductive contact pin 10 according to the third preferred embodiment of the present invention
  • Figure 16b is a front view of a third variant of the pin 10
  • Figure 16b is a perspective view of a third variant of the electrically conductive contact pin 10 according to a third preferred embodiment of the present invention.
  • the third modification of the electrically conductive contact pin 10 according to the third embodiment includes an elastic insulating material 200 in at least one of the first connection area 310 and the second connection area 320. There is a structural difference from the third embodiment in that the upper hollow portion 111 and/or the lower hollow portion 121 is partially filled with the elastic insulating material 200. There is.
  • the first connection portion 110 of the first connection area 310 includes an upper hollow portion 111, and the elastic insulating material 200 is provided in the upper hollow portion 111. Through this, after the first contact portion 112 is bent and deformed by the pressing force, it is more easily elastically restored by the restoring force of the elastic insulating material 200.
  • the elastic insulating material 200 partially fills the upper hollow portion 111.
  • the empty space not filled with the elastic insulating material 200 functions as a free space 370.
  • the elastic insulating material 200 is provided on the bottom surface of the upper hollow portion 111, so that a free space 370 is formed at the top of the elastic insulating material 200. That is, from top to bottom, the first contact portion 112 of the first connection portion 110, the free space portion 370, and the elastic insulating material 200 are arranged in that order.
  • the second connection portion 120 of the second connection area 320 includes a lower hollow portion 121, and the elastic insulating material 200 is provided in the lower hollow portion 121. Through this, the second contact portion 122 is more easily elastically restored after being bent and deformed by a pressing force.
  • the elastic insulating material 200 partially fills the lower hollow portion 121.
  • the empty space not filled with the elastic insulating material 200 functions as a free space 370.
  • the elastic insulating material 200 is provided on the ceiling surface of the lower hollow portion 121, so that a free space 370 is formed below the elastic insulating material 200. That is, from bottom to top, the second contact portion 122 of the second connection portion 120, the free space portion 370, and the elastic insulating material 200 are arranged in that order.
  • first connection part 110 and the second connection part 120 will be referred to in the previous description, and hereinafter, a modification of the metal elastic part 130 of the electrically conductive contact pin 10 according to the present invention will be discussed. see.
  • 17A to 18C are diagrams showing a modified example of the metal elastic portion 130 of the electrically conductive contact pin 10 according to a preferred embodiment of the present invention.
  • the metal elastic portion 130 is provided in a straight shape. One end of the straight metal elastic part 130 is connected to the first connection part 110 at an eccentric position, and the other end is also connected to the second connection part 120 at an eccentric position.
  • the metal elastic part 130 is provided in the form of a straight plate spring and is elastically deformed by an external force in the longitudinal direction ( ⁇ y direction) applied to the first connection part 110 and/or the second connection part 120.
  • the metal elastic portion 130 is provided in an X shape where straight plate-shaped plates overlap each other in the central area.
  • two closed spaces 350 are formed in the elastic region 330.
  • the closed space 350 is formed in the space between the first connection part 110 and the metal elastic part 130 and the space between the second connection part 120 and the metal elastic part 130.
  • This closed space 350 may be fully or partially provided with an elastic insulating material 200.
  • the metal elastic portion 130 may be embedded in a form surrounded by an elastic insulating material 200.
  • the metal elastic portion 130 is formed by connecting two straight plate-shaped plates to the first connection portion 110 and the second connection portion 120 without overlapping each other and each having a different inclination. It is provided with for example, one metal elastic part 130 may have a positive slope and the other elastic part 130 may have a negative slope. Through this, one closed space 350 is formed in the elastic region 330. The closed space 350 is formed in the space between the first connection part 110, the second connection part 120, and the metal elastic part 130. This closed space 350 may be fully or partially provided with an elastic insulating material 200. Additionally, the metal elastic portion 130 may be embedded in a form surrounded by an elastic insulating material 200.
  • the metal elastic portion 130 is provided in a form in which two arc-shaped plate plates are spaced apart without overlapping each other and are respectively connected to the first connection portion 110 and the second connection portion 120. .
  • one closed space 350 is formed in the elastic region 330.
  • the closed space 350 is formed in the space between the first connection part 110, the second connection part 120, and the metal elastic part 130.
  • This closed space 350 may be fully or partially provided with an elastic insulating material 200.
  • the metal elastic portion 130 may be embedded in a form surrounded by an elastic insulating material 200.
  • the metal elastic portion 130 is formed by ring-shaped plate-shaped plates overlapping each other top and bottom. At least one ring-shaped plate may be provided. Through this, at least one closed space 350 is formed in the elastic region 330.
  • Figure 18b shows two closed spaces 350.
  • the closed space 350 is formed by the metal elastic portion 130. This closed space 350 may be fully or partially provided with an elastic insulating material 200. Additionally, the metal elastic portion 130 may be embedded in a form surrounded by an elastic insulating material 200.
  • the metal elastic portion 130 includes a unit elastic portion 135 and a neck portion 137 having a closed space 350 therein.
  • the closed space 350 is formed by the metal elastic portion 130.
  • Two or more unit elastic parts 135 may be provided, and the unit elastic parts 135 may be connected to each other by a neck portion 137.
  • the unit elastic portion 135 is connected to the first connection portion 110 through the neck portion 137 located at the upper portion, and the neck portion 137 located at the lower portion. It is connected to the second connection part 120 through.
  • the closed space 350 provided inside the unit elastic portion 135 may be fully or partially provided with an elastic insulating material 200.
  • the closed space 350 includes two circular spaces 391 and a horizontal space 393 connecting them, and the dimension of the horizontal space 393 in the longitudinal direction ( ⁇ y direction) is the length of the circular space 391. It is smaller than the dimension in the direction ( ⁇ y direction).
  • the elastic insulating material 200 may be provided in the horizontal space 393 and not in the circular space 391. Through this, the two circular spaces 391 can function as a free space 370 into which the elastic insulating material 200, which expands due to pressure, can be introduced. Additionally, the metal elastic portion 130 may be embedded in a form surrounded by an elastic insulating material 200.
  • the electrically conductive contact pin 10 according to the preferred embodiment and modification of the present invention described above is provided in the inspection device 1 and is used to transmit an electrical signal by electrically and physically contacting the inspection object 20. .
  • the inspection device 1 includes a guide plate 500 provided with a through hole 510 and an electrically conductive contact pin 10 inserted into the through hole 510, and the electrically conductive contact pin 10 Silver, elastic insulation with the metal body portion 100 including the first connection portion 110, the second connection portion 120, and the metal elastic portion 130 connecting the first connection portion 110 and the second connection portion 120.
  • the guide plate 500 may be formed of a different material from the elastic insulating material 200.
  • the guide plate 500 may be made of polyimide (PI) material, silicon nitride (Si 3 N 4 ) material, or an anodic oxide material.
  • the guide plate 500 may be formed of the same material as the elastic insulating material 200. In this case, the guide plate 500 may be silicone rubber.
  • the inspection device 1 may be an inspection device used in a semiconductor manufacturing process, and may be a probe card or a test socket, for example.
  • the electrically conductive contact pins 10 may be electrically conductive contact pins provided on a probe card to inspect a semiconductor chip, or may be socket pins provided in a test socket for inspecting a packaged semiconductor package.
  • the inspection devices 1 in which the electrically conductive contact pin 10 described above can be used are not limited to this, and any inspection device for checking whether the inspection object 20 is defective by applying electricity is included.
  • the inspection object 20 of the inspection device 1 may include a semiconductor device, a memory chip, a microprocessor chip, a logic chip, a light emitting device, or a combination thereof.
  • inspection objects include logic LSIs (such as ASICs, FPGAs, and ASSPs), microprocessors (such as CPUs and GPUs), memory (DRAM, hybrid memory cubes (HMCs), magnetic RAMs (MRAMs), and phase-processing memory (PCMs).
  • LED Change Memory
  • ReRAM Resistive RAM
  • FeRAM FeRAM
  • flash memory flash memory
  • semiconductor light emitting devices including LED, mini LED, micro LED, etc.
  • power devices analog IC (DC-AC converter and (such as insulated gate bipolar transistors (IGBTs)), MEMS (such as acceleration sensors, pressure sensors, oscillators, and gyroscope sensors), wireless devices (such as GPS, FM, NFC, RFEM, MMIC, and WLAN), discrete devices, Includes BSI, CIS, camera module, CMOS, passive devices, GAW filter, RF filter, RF IPD, APE and BB.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

La présente invention concerne une broche de contact électroconductrice et un dispositif d'inspection dont la fiabilité d'inspection est améliorée par rapport à un objet à inspecter. La broche de contact électro-conductrice, comprenant : une partie de corps métallique composée d'une première partie de connexion, d'une seconde partie de connexion et d'une partie métallique élastique pour connecter la première partie de connexion et la seconde partie de connexion ; et un matériau d'isolation élastique, qui comprend : une première zone de connexion comprenant la première partie de connexion ; une seconde zone de connexion composée de la seconde partie de connexion ; et une zone élastique composée de la partie métallique élastique, la première zone de connexion, la deuxième zone de connexion et/ou la zone élastique comprenant le matériau d'isolation élastique.
PCT/KR2023/004011 2022-03-30 2023-03-27 Broche de contact électroconductrice et dispositif d'inspection la comprenant WO2023191410A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2022-0039778 2022-03-30
KR1020220039778A KR20230140921A (ko) 2022-03-30 2022-03-30 전기 전도성 접촉핀 및 이를 구비하는 검사장치

Publications (1)

Publication Number Publication Date
WO2023191410A1 true WO2023191410A1 (fr) 2023-10-05

Family

ID=88202680

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2023/004011 WO2023191410A1 (fr) 2022-03-30 2023-03-27 Broche de contact électroconductrice et dispositif d'inspection la comprenant

Country Status (3)

Country Link
KR (1) KR20230140921A (fr)
TW (1) TW202403316A (fr)
WO (1) WO2023191410A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150123974A (ko) * 2013-08-02 2015-11-04 오므론 가부시키가이샤 전주 부품 및 그 제조 방법
KR101575830B1 (ko) * 2014-08-21 2015-12-08 주식회사 아이에스시 검사용 소켓
KR20170012661A (ko) * 2015-07-21 2017-02-03 비앤비산업 주식회사 X-밴드 핀을 이용한 반도체 소자 및 디스플레이 패널 품질 검사용 마이크로 테스트 컨택터 및 그 제조 방법
KR101712367B1 (ko) * 2015-12-04 2017-03-07 한국기계연구원 계층적 구조를 갖는 반도체 검사용 프로브 및 그 제조 방법
KR20220034446A (ko) * 2020-09-11 2022-03-18 주식회사 오킨스전자 멀티-레이어 콘택 핀

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101969771B1 (ko) 2017-07-25 2019-04-18 리노공업주식회사 검사프로브
KR20200110012A (ko) 2019-03-15 2020-09-23 주식회사 아이에스시 테스트 소켓

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150123974A (ko) * 2013-08-02 2015-11-04 오므론 가부시키가이샤 전주 부품 및 그 제조 방법
KR101575830B1 (ko) * 2014-08-21 2015-12-08 주식회사 아이에스시 검사용 소켓
KR20170012661A (ko) * 2015-07-21 2017-02-03 비앤비산업 주식회사 X-밴드 핀을 이용한 반도체 소자 및 디스플레이 패널 품질 검사용 마이크로 테스트 컨택터 및 그 제조 방법
KR101712367B1 (ko) * 2015-12-04 2017-03-07 한국기계연구원 계층적 구조를 갖는 반도체 검사용 프로브 및 그 제조 방법
KR20220034446A (ko) * 2020-09-11 2022-03-18 주식회사 오킨스전자 멀티-레이어 콘택 핀

Also Published As

Publication number Publication date
KR20230140921A (ko) 2023-10-10
TW202403316A (zh) 2024-01-16

Similar Documents

Publication Publication Date Title
US6181144B1 (en) Semiconductor probe card having resistance measuring circuitry and method fabrication
US5811982A (en) High density cantilevered probe for electronic devices
US7332922B2 (en) Method for fabricating a structure for making contact with a device
US6922069B2 (en) Needle assembly of probe card
US20070017093A1 (en) Method of making an interposer with contact structures
US20010054907A1 (en) High density cantilevered probe for electronic devices
JP2002062315A (ja) コンタクトストラクチャ
WO2020022745A1 (fr) Feuille conductrice de test
KR100384287B1 (ko) 반도체 장치 제조방법
WO2023167479A1 (fr) Broche de contact électroconductrice, plaque d'alignement et appareil d'inspection les comprenant
KR102127728B1 (ko) 개선된 그립핑 구조를 가지는 프로브 핀
CN112748268A (zh) 探针卡器件
KR102002256B1 (ko) Ｒｆ 칩 테스트를 위한 필름 타입 프로브 카드
WO2023191410A1 (fr) Broche de contact électroconductrice et dispositif d'inspection la comprenant
US6621710B1 (en) Modular probe card assembly
WO2022080755A1 (fr) Broche de contact électriquement conductrice, son procédé de fabrication, appareil d'inspection, procédé de fabrication de produit moulé et produit moulé ainsi fabriqué
WO2023219322A1 (fr) Broche de contact électroconductrice et dispositif d'inspection la comprenant
WO2023163447A1 (fr) Broche de contact électroconductrice et dispositif d'inspection la comprenant
US20040135594A1 (en) Compliant interposer assembly for wafer test and "burn-in" operations
WO2023172046A1 (fr) Article moulé métallique, son procédé de fabrication et dispositif d'inspection le comprenant
WO2024112050A1 (fr) Broche de contact électroconductrice et dispositif de test la comprenant
WO2023140617A1 (fr) Broche de contact électroconductrice et dispositif d'inspection la comprenant
WO2023090746A1 (fr) Broche de contact électriquement conductrice et dispositif d'inspection pourvu de celle-ci
WO2023033417A1 (fr) Broche de contact électroconductrice et carte de sonde verticale la comportant
WO2023140655A1 (fr) Broche de contact électriquement conductrice

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23781266

Country of ref document: EP

Kind code of ref document: A1