WO2022181498A1 - 光硬化性樹脂組成物、液晶シール剤、ならびにこれを用いた液晶表示パネルおよびその製造方法 - Google Patents
光硬化性樹脂組成物、液晶シール剤、ならびにこれを用いた液晶表示パネルおよびその製造方法 Download PDFInfo
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- WO2022181498A1 WO2022181498A1 PCT/JP2022/006747 JP2022006747W WO2022181498A1 WO 2022181498 A1 WO2022181498 A1 WO 2022181498A1 JP 2022006747 W JP2022006747 W JP 2022006747W WO 2022181498 A1 WO2022181498 A1 WO 2022181498A1
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- WIPO (PCT)
- Prior art keywords
- liquid crystal
- resin composition
- photocurable resin
- coupling agent
- display panel
- Prior art date
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- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- BMTMWCVGAVWDRA-UHFFFAOYSA-N 2-hydroxymethylanthraquinone Natural products O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CO BMTMWCVGAVWDRA-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- GYGYLGPQOCOYHH-UHFFFAOYSA-N 2-propan-2-ylxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3OC2=C1 GYGYLGPQOCOYHH-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 description 1
- OKISUZLXOYGIFP-UHFFFAOYSA-N 4,4'-dichlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=C(Cl)C=C1 OKISUZLXOYGIFP-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 1
- IKVYHNPVKUNCJM-UHFFFAOYSA-N 4-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C(C(C)C)=CC=C2 IKVYHNPVKUNCJM-UHFFFAOYSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- BWPYBAJTDILQPY-UHFFFAOYSA-N Methoxyphenone Chemical compound C1=C(C)C(OC)=CC=C1C(=O)C1=CC=CC(C)=C1 BWPYBAJTDILQPY-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical group N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- DBHQYYNDKZDVTN-UHFFFAOYSA-N [4-(4-methylphenyl)sulfanylphenyl]-phenylmethanone Chemical compound C1=CC(C)=CC=C1SC1=CC=C(C(=O)C=2C=CC=CC=2)C=C1 DBHQYYNDKZDVTN-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000001743 benzylic group Chemical group 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010227 cup method (microbiological evaluation) Methods 0.000 description 1
- 238000007333 cyanation reaction Methods 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- KGGOIDKBHYYNIC-UHFFFAOYSA-N ditert-butyl 4-[3,4-bis(tert-butylperoxycarbonyl)benzoyl]benzene-1,2-dicarboperoxoate Chemical compound C1=C(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)=CC=C1C(=O)C1=CC=C(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)=C1 KGGOIDKBHYYNIC-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 238000000589 high-performance liquid chromatography-mass spectrometry Methods 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 150000002433 hydrophilic molecules Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- RXFZJKXZSLVQJV-UHFFFAOYSA-N icosa-8,12-dienedihydrazide Chemical compound NNC(=O)CCCCCCC=CCCC=CCCCCCCC(=O)NN RXFZJKXZSLVQJV-UHFFFAOYSA-N 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 1
- 235000019341 magnesium sulphate Nutrition 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- OLUGOCOUXQGYQN-UHFFFAOYSA-N methyl 2-benzoylbenzoate;phenyl-(4-phenylphenyl)methanone Chemical compound COC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1.C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 OLUGOCOUXQGYQN-UHFFFAOYSA-N 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- FAQJJMHZNSSFSM-UHFFFAOYSA-N phenylglyoxylic acid Chemical compound OC(=O)C(=O)C1=CC=CC=C1 FAQJJMHZNSSFSM-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
Definitions
- the present invention relates to a photocurable resin composition, a liquid crystal sealant, a liquid crystal display panel using the same, and a method for manufacturing the same.
- a liquid crystal display panel usually has a pair of substrates, a frame-shaped sealing member arranged between them, and liquid crystal filled in a region surrounded by the two substrates and the sealing agent.
- two substrates each have an alignment film on their surface to align the liquid crystal in a desired direction.
- a sealing member is formed by applying a liquid crystal sealing agent to the outer peripheral side of the alignment film.
- the adhesive strength between the substrate having the alignment film and the sealing member may not be sufficient, and there has been a demand to increase the adhesive strength between them.
- the sealing member is obtained by polymerizing or cross-linking a photocurable and/or thermosetting curable compound. Therefore, it is conceivable to increase the flexibility of the sealing member by increasing the distance between the cross-linking points of the curable compounds, thereby alleviating the stress applied to the interface between the sealing member and the substrate.
- this method since the distance between the cross-linking points of the curable compounds is long, there is a problem that moisture easily penetrates through these gaps under high-temperature and high-humidity conditions.
- the present invention has been made in view of the above problems. Specifically, a photocurable resin composition capable of forming a sealing member having high adhesive strength with a substrate and high moisture resistance, a liquid crystal sealing agent containing the same, a liquid crystal display panel using the same, and its The purpose is to provide a manufacturing method.
- the present invention provides the following photocurable resin composition and liquid crystal sealant.
- Photocurable containing a curable compound (A) having an ethylenically unsaturated double bond in the molecule, a photopolymerization initiator (B), an organic fine particle (C), and a coupling agent (D) A photocurable resin composition, wherein the coupling agent (D) is a coupling agent having at least one chemical structure selected from the group consisting of butadiene rubber, butadiene-styrene rubber, acrylic rubber, and silicone rubber. elastic resin composition.
- the coupling agent (D) contains an alkoxysilyl group, and the amount of the alkoxysilyl group derived from the coupling agent (D) in the photocurable resin composition 100 is 1.0 ⁇ 10. ⁇ 5 mol or more and 5.0 ⁇ 10 ⁇ 3 mol or less, the photocurable resin composition according to [2].
- [5] further contains at least one latent heat curing agent (E) selected from the group consisting of a dihydrazide heat latent curing agent, an amine adduct heat latent curing agent, and a polyamine heat latent curing agent;
- E latent heat curing agent
- the photocurable resin composition according to any one of [4].
- a liquid crystal sealant comprising the photocurable resin composition according to any one of [1] to [6] above.
- the present invention provides the following method for manufacturing a liquid crystal display panel.
- the present invention provides the following liquid crystal display panel.
- a liquid crystal display panel including a pair of substrates, a frame-shaped sealing member arranged between the pair of substrates, and a liquid crystal arranged inside the pair of substrates and the sealing member.
- the liquid crystal display panel, wherein the frame-shaped sealing member is a cured product of the liquid crystal sealing compound according to [7].
- the photocurable resin composition of the present invention it is possible to form a seal member having high adhesive strength with a substrate and high moisture resistance.
- a numerical range represented using “ ⁇ ” means a range including the numerical values described before and after “ ⁇ ” as lower and upper limits.
- the amount of each component in the composition refers to the total amount of the multiple substances present in the composition unless otherwise specified when there are multiple substances corresponding to each component in the composition. means In the numerical ranges described stepwise in this specification, the upper limit or lower limit described in a certain numerical range may be replaced with the upper limit or lower limit of another numerical range described stepwise.
- the term "process” is not only an independent process, but also includes the term if the intended purpose of the process is achieved even if it cannot be clearly distinguished from other processes. be
- Photocurable resin composition The photocurable resin composition of the present invention comprises a curable compound (A) having an ethylenically unsaturated double bond in its molecule, a photopolymerization initiator (B), an organic fine particle (C), and a coupling agent (D).
- A curable compound having an ethylenically unsaturated double bond in its molecule
- B photopolymerization initiator
- C organic fine particle
- D a coupling agent
- a functional group present on the substrate surface and a compound in the photocurable resin composition are covalently bonded to form a bond between the substrate and the photocurable resin composition.
- sealing member was strongly adhered.
- the substrate has an alignment film on its surface, the covalent bond is not sufficiently formed, and the adhesive strength between the substrate and the sealing member cannot be sufficiently increased.
- an attempt is made to increase the stress applied to the substrate and the sealing member by reducing the cross-linking density of the sealing member and increasing the flexibility of the sealing member the moisture resistance of the sealing member tends to decrease, affecting liquid crystals and the like. something happened.
- the coupling agent (D) has at least one chemical structure selected from the group consisting of butadiene rubber, butadiene-styrene rubber, acrylic rubber, and silicone rubber. It is a coupling agent with Such a coupling agent (D) is largely oriented at the interface between the substrate and the sealing member when the sealing member is formed.
- the main causes of peeling between the sealing member and the substrate are the residual stress generated when the photocurable resin composition (liquid crystal sealing compound) is cured and the peeling stress applied in the direction of peeling the substrate and the sealing member.
- the coupling agent (D) is present between the sealing member and the substrate, the rubber-derived structure relaxes the residual stress and peeling stress.
- the coupling agent (D) exhibits its effect even when added in a small amount. Therefore, the coupling agent (D) hardly affects the crosslinked structure and crosslinked density of the curable compound (A), and the high moisture resistance of the sealing member can be maintained.
- Curable compound (A) The curable compound (A) may be any compound having an ethylenically unsaturated double bond in its molecule.
- the curable compound (A) may be any monomer, oligomer or polymer.
- Examples of the curable compound (A) include compounds having a (meth)acryloyl group in the molecule.
- the number of (meth)acryloyl groups per molecule of the compound having the (meth)acryloyl group may be one, or two or more.
- the term "(meth)acryloyl group” means an acryloyl group, a methacryloyl group, or both.
- the description of (meth)acrylate means acrylate or methacrylate, or both.
- (meth)acrylic refers to acrylic or methacrylic, or both.
- curable compound (A) containing one (meth) acryloyl group in one molecule examples include methyl (meth) acrylate, ethyl (meth) acrylate, (meth) acrylic acid 2-hydroxyethyl ester, etc. (Meth)acrylic acid alkyl esters are included.
- Examples of the curable compound (A) having two or more (meth)acryloyl groups in one molecule include di(meth)acrylates derived from polyethylene glycol, propylene glycol, polypropylene glycol, etc.; tris(2-hydroxyethyl)isocyanate Di(meth)acrylate derived from nurate; Di(meth)acrylate derived from diol obtained by adding 4 mol or more of ethylene oxide or propylene oxide to 1 mol of neopentyl glycol; 2 mol of ethylene oxide or propylene to 1 mol of bisphenol A di(meth)acrylates derived from diols obtained by addition of oxides; di- or tri(meth)acrylates derived from triols obtained by adding 3 mol or more of ethylene oxide or propylene oxide to 1 mol of trimethylolpropane; bisphenol A1 Diol-derived di(meth)acrylate obtained by adding 4 mol or more of ethylene oxide or propylene oxide per mol; tri
- the curable compound (A) may further have an epoxy group in its molecule.
- the number of epoxy groups per molecule may be one, or two or more.
- the photocurable resin composition can also be cured by heat. That is, it becomes possible to use both photocuring and heat curing.
- the photocurable resin composition has photocurable and thermosetting properties, it becomes possible to cure the photocurable resin composition efficiently in a short time.
- Examples of the curable compound (A) having a (meth)acryloyl group and an epoxy group in the molecule include (meth)acrylic acid obtained by reacting an epoxy compound and (meth)acrylic acid in the presence of a basic catalyst. Includes glycidyl acrylate.
- the epoxy compound to be reacted with (meth)acrylic acid may be a polyfunctional epoxy compound having two or more epoxy groups in the molecule.
- a bifunctional epoxy compound is preferred from the viewpoint of suppressing a decrease in the .
- Examples of bifunctional epoxy compounds include bisphenol type epoxy compounds (bisphenol A type, bisphenol F type, 2,2'-diallylbisphenol A type, bisphenol AD type, hydrogenated bisphenol type, etc.), biphenyl type epoxy compounds, and naphthalene-type epoxy compounds.
- bisphenol A-type and bisphenol F-type bisphenol epoxy compounds are preferable from the viewpoint that the coatability of the photocurable resin composition is easily improved.
- the curable compound (A) derived from a bisphenol-type epoxy compound has advantages such as superior coatability compared to the curable compound (A) derived from a biphenyl ether-type epoxy compound.
- the curable compound (A) may contain only one of the above compounds, or may contain two or more of them.
- the curable compound (A) includes a compound (A1) having a (meth)acryloyl group in the molecule and no epoxy group, and a compound (A2) having a (meth)acryloyl group and an epoxy group in the molecule. ).
- the photocurable resin composition further contains another curable compound (for example, an epoxy compound) described later, the compatibility between the compound (A1) and the epoxy compound may be low.
- the compound (A2) having an epoxy group is combined, the compatibility between the other resins in the photocurable resin composition and the curable compound (A) is enhanced.
- hydrophobic compounds e.g., epoxy compounds, etc.
- compound (A1) and compound (A2) By combining (A2), the elution of the epoxy compound into the liquid crystal is easily suppressed.
- the content of the compound (A2) having a (meth)acryloyl group and an epoxy group in the molecule is not particularly limited, but is preferably 30% by mass or more relative to the total amount of the curable compound (A).
- the weight average molecular weight is preferably about 310 to 1,000.
- the weight average molecular weight of the curable compound (A) can be measured, for example, by gel permeation chromatography (GPC) in terms of polystyrene.
- the content of the curable compound (A) is preferably 40-80% by mass, more preferably 50-75% by mass, relative to the total amount of the photocurable resin composition.
- amount of the curable compound (A) is within this range, the strength of the resulting cured product (eg, seal member) can be enhanced, and the adhesion between the substrate and the cured product (seal member) can be enhanced.
- the photopolymerization initiator is not particularly limited as long as it is a compound capable of radically polymerizing the curable compound (A) by irradiation with light.
- it may be a self-cleavage type photopolymerization initiator or a hydrogenated inorganic type photopolymerization initiator.
- self-cleavage photopolymerization initiators examples include alkylphenone compounds (eg, benzyl dimethyl ketal such as 2,2-dimethoxy-1,2-diphenylethan-1-one (manufactured by BASF, IRGACURE 651); ⁇ -aminoalkylphenones such as -methyl-2-morpholino(4-thiomethylphenyl)propan-1-one (manufactured by BASF, IRGACURE 907); 1-hydroxy-cyclohexyl-phenyl-ketone (manufactured by BASF, IRGACURE 184) ), etc.), acylphosphine oxide compounds (eg, 2,4,6-trimethylbenzoindiphenylphosphine oxide, etc.), titanocene compounds (eg, bis( ⁇ 5-2,4-cyclopentadiene-1- yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)tit
- diethoxyacetophenone 2-hydroxy-2-methyl-1-phenylpropane -1-one, benzyl dimethyl ketal, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropan-1-one, 4-(2-hydroxyethoxy)phenyl-(2-hydroxy-2-propyl) ketones, 1-hydroxycyclohexyl-phenylketone, 2-methyl-2-morpholino(4-thiomethylphenyl)propan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone, etc.
- phenylglyoxylate-based compounds e.g., methylphenylglyoxyester, etc.
- benzoin ether-based compounds e.g., benzoin, benzoin methyl ether, benzoin isopropyl ether, etc.
- oxime ester-based compounds e.g., 1,2-octanedione- 1-[4-(phenylthio)-2-(O-benzoyloxime)] (manufactured by BASF, IRGACURE OXE01), ethanone-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3 -yl]-1-(0-acetyloxime) (manufactured by BASF, IRGACURE OXE02), etc.).
- hydrogen abstraction type photopolymerization initiators examples include benzophenone compounds (eg, benzophenone, methyl o-benzoylbenzoate-4-phenylbenzophenone, 4,4′-dichlorobenzophenone, hydroxybenzophenone, 4-benzoyl-4′- methyl-diphenyl sulfide, acrylated benzophenone, 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone, 3,3'-dimethyl-4-methoxybenzophenone, etc.), thioxanthone compounds (e.g., thioxanthone, 2-chlorothioxanthone (manufactured by Tokyo Chemical Industry Co., Ltd.), 1-chloro-4-propoxythioxanthone, 1-chloro-4-ethoxythioxanthone (manufactured by Lambson Limited, Speedcure CPTX), 2-isopropylxanthone (manu
- the absorption wavelength of the photopolymerization initiator (B) is not particularly limited, and for example, a photopolymerization initiator (B) that absorbs light with a wavelength of 360 nm or longer is preferable. Among them, it is more preferable to absorb light in the visible light region, and the photopolymerization initiator (B) that absorbs light having a wavelength of 360 to 430 nm is particularly preferable.
- the term “visible light region” refers to a wavelength range of 360 nm to 780 nm.
- Examples of the photopolymerization initiator (B) that absorbs light having a wavelength of 360 nm or more include alkylphenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, thioxanthone compounds, and anthraquinone compounds. , preferably an oxime ester compound.
- the structure of the photopolymerization initiator (B) can be identified by combining high performance liquid chromatography (HPLC) and liquid chromatography mass spectrometry (LC/MS) with NMR measurement or IR measurement.
- HPLC high performance liquid chromatography
- LC/MS liquid chromatography mass spectrometry
- the molecular weight of the photopolymerization initiator (B) is preferably 200 or more and 5000 or less, for example.
- the molecular weight of the photopolymerization initiator (B) is more preferably 230 or more and 3000 or less, even more preferably 230 or more and 1500 or less.
- the molecular weight of the photopolymerization initiator (B) can be determined as the "relative molecular mass" of the molecular structure of the main peak detected when analyzed by high performance liquid chromatography (HPLC).
- a sample solution is prepared by dissolving the photopolymerization initiator (B) in THF (tetrahydrofuran), and high performance liquid chromatography (HPLC) measurement is performed. Then, the area percentage of the detected peaks (the ratio of the area of each peak to the sum of the areas of all peaks) is obtained, and the presence or absence of the main peak is confirmed.
- the main peak is the peak with the highest intensity (peak with the highest peak height) among all peaks detected at a detection wavelength characteristic of each compound (for example, 400 nm for thioxanthone compounds).
- the relative molecular mass corresponding to the peak apex of the detected main peak can be measured by Liquid Chromatography Mass Spectrometry (LC/MS).
- the amount of the photopolymerization initiator (B) is preferably 0.01 to 10% by mass with respect to the curable compound (A) described above. When the amount of the photopolymerization initiator (B) is 0.01% by mass or more relative to the curable compound (A), the curability of the photocurable resin composition tends to be favorable. If the content of the photopolymerization initiator (B) is 10% by mass or less, the photopolymerization initiator (B) is less likely to elute into the liquid crystal when the photocurable resin composition is used as a liquid crystal sealant.
- the content of the photopolymerization initiator (B) is more preferably 0.1 to 5% by mass, more preferably 0.1 to 3% by mass, with respect to the curable compound (A), 0.1 to 2.5 % by weight is particularly preferred.
- Organic fine particles (C) The type of organic fine particles (C) contained in the photocurable resin composition is not particularly limited, and examples of the organic fine particles (C) include silicone particles, acrylic particles, styrene particles such as styrene-divinylbenzene copolymer, and Polyolefin particles and the like are included.
- the photocurable resin composition may contain only one kind of organic fine particles (C), or may contain two or more kinds thereof.
- the average primary particle size of the organic fine particles (C) is preferably 0.05 to 13 ⁇ m, more preferably 0.1 to 10 ⁇ m, even more preferably 0.1 to 8 ⁇ m.
- the shape of the organic fine particles (C) is not particularly limited, it is preferably spherical, more preferably spherical. Being spherical means that the ratio b/a of the minimum value (b) to the maximum value (a) of the diameter of each particle is 0.9 to 1.0.
- the average primary particle size of the organic fine particles (C) can be measured by microscopy, specifically by electron microscope image analysis.
- the surface of the organic fine particles (C) is preferably smooth. When the surface is smooth, the specific surface area decreases, and the amount of the organic fine particles (C) that can be added to the photocurable resin composition increases.
- the content of the organic fine particles (C) is preferably 0.1 to 30 parts by mass, more preferably 0.3 to 20 parts by mass, and 0.3 to 15 parts by mass with respect to 100 parts by mass of the photocurable resin composition. Part is more preferred.
- the amount of the organic fine particles (C) is within this range, the elastic modulus of the photocurable resin composition after photocuring tends to fall within the desired range.
- the coupling agent (D) has at least one chemical structure (hereinafter also referred to as "rubber structure") selected from the group consisting of butadiene rubber, butadiene styrene rubber, acrylic rubber, and silicone rubber, and a liquid crystal display panel substrate. Any compound having a functional group present on the surface and a group capable of reacting may be used.
- the coupling agent (D) include a compound in which an organic metal compound having a group capable of reacting with a functional group present on the substrate surface of the liquid crystal display panel is bonded to the side chain or main chain of the rubber structure. .
- Examples of the coupling agent (D) include a silane coupling agent in which the organometallic compound is a silane-based compound, a titanate coupling agent in which the organometallic compound is a titanate-based compound, and a zirconate-based compound as the organometallic compound. a certain zirconate coupling agent, a zirconium aluminate coupling agent in which the organometallic compound is a zirconium aluminate-based compound, an aluminate coupling agent in which the organometallic compound is an aluminate-based compound, and the like.
- silane coupling agents are particularly preferable from the viewpoint of availability, cost, and the like.
- the functional group that binds to the metal in the organometallic compound that is, the type of the group that can react with the functional group present on the substrate surface of the liquid crystal display panel is not particularly limited, and examples thereof include polycondensation with OH groups on the substrate surface. possible alkoxy groups and the like.
- the amount of alkoxysilyl groups derived from the coupling agent (D) in 100 g of the photocurable resin composition is 1.0 ⁇ 10 -5 mol or more and 5.0 ⁇ 10 ⁇ 3 mol or less is preferable, 2.5 ⁇ 10 ⁇ 5 mol to 1.0 ⁇ 10 ⁇ 3 mol is more preferable, and 5.0 ⁇ 10 ⁇ 5 mol or more and 8.0 ⁇ 10 ⁇ 4 mol or less is more preferable.
- the amount of alkoxysilyl groups derived from the coupling agent (D) in 100 g of the photocurable resin composition (hereinafter also referred to as "mol/100 g") is 5.0 ⁇ 10 -5 mol/100 g or more.
- the alkoxysilyl group forms a siloxane bond with the OH group or the like on the substrate surface of the liquid crystal display panel, and the obtained seal member does not become excessively hard, and the alkoxysilyl group is generated when the photocurable resin composition is cured. It is easy to relax the residual stress, etc. Therefore, the bonding strength between the obtained sealing member and the substrate is increased.
- the amount of alkoxysilyl groups derived from the coupling agent (D) is 8.0 ⁇ 10 ⁇ 4 mol/100 g or less, the resulting cured product of the photocurable resin composition is not excessively softened. , less likely to deteriorate moisture permeability.
- the amount of alkoxysilyl groups derived from the coupling agent (D) in the photocurable resin composition is obtained from the following formula.
- Amount of alkoxysilyl group ⁇ (amount (g) of coupling agent (D) having alkoxysilyl group in 100 g of photocurable resin)/(molecular weight of the coupling agent (D)) ⁇ x (the coupling number of alkoxysilyl groups in agent (D))
- silane-based compounds which are organometallic compounds, include compounds represented by the following structures.
- the rubber structure contained in the coupling agent (D) is not particularly limited, and may be any structure of butadiene rubber, butadiene styrene rubber, acrylic rubber, or silicone rubber. Multiple of these structures may be included in the molecule. Among them, the coupling agent (D) having a butadiene rubber structure is preferable from the viewpoint of versatility and the like.
- the number average molecular weight of the coupling agent (D) is preferably 1,000 or more and 1,000,000 or less, more preferably 2,000 or more and 100,000 or less.
- the molecular weight of the coupling agent (D) is 1,000 or more, the rubber structure portion of the coupling agent (D) becomes sufficiently large, and, for example, the stress applied between the sealing member and the substrate and the photocurable resin composition It becomes easy to sufficiently relax the residual stress generated during hardening.
- the molecular weight of the coupling agent (D) is 1,000,000 or less, it is difficult for the coupling agent (D) to excessively widen the distance between the cross-linking points of the curable compound (A), and the moisture resistance of the sealing member is improved. can be done.
- the above number average molecular weight is a value (styrene conversion value) obtained by gel permeation chromatography (GPC) using toluene, tetrahydrofuran, chloroform, or the like as a developing solvent.
- the coupling agent (D) include compounds represented by the following chemical formulas obtained by reacting a polybutadiene compound with an organic silane compound.
- the coupling agent (D) represented by the above chemical formula includes butadiene-derived repeating units having a 2,3-vinyl structure, butadiene-derived repeating units having a 1,2-vinyl structure, and the 1,2-vinyl and a repeating unit to which a silane-based compound is bonded to the structure.
- the order of each repeating unit is not particularly limited.
- x may be 0 or more, preferably 1-40, more preferably 2-20.
- y may be 1 or more, preferably 1 to 40, more preferably 2 to 20.
- z may be 0 or more, preferably 0 to 10, more preferably 0 to 5.
- a is an integer of 1 to 3, preferably 2 or 3.
- R 1 in the above chemical formula is preferably a substituted or unsubstituted hydrocarbon group having 1 to 12 carbon atoms, examples of which include alkyl groups such as methyl group, ethyl group and isopropyl group; cycloalkyl groups such as cyclopentyl group; alkenyl groups such as vinyl group; aryl groups such as phenyl group and tolyl group; aralkyl groups such as benzyl group and 2-phenylethyl group; halogenated alkyl groups such as 3-chloropropyl group; cyanation such as 2-cyanoethyl group Alkyl group; Among these, an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms is preferable, an alkyl group is more preferable, and an ethyl group is particularly preferable.
- alkyl groups such as methyl group, ethyl group and isopropyl group
- R 2 is preferably a substituted or unsubstituted hydrocarbon group having 1 to 12 carbon atoms, examples of which include alkyl groups such as methyl group, ethyl group and isopropyl group; cycloalkyl groups; alkenyl groups such as allyl group; Aryl groups such as phenyl group and tolyl group; aralkyl groups such as benzyl group and 2-phenylethyl group; halogenated alkyl groups such as 3-chloropropyl group; cyanated alkyl groups such as 2-cyanoethyl group; Alkyl groups containing ether linkages such as groups; Among these, an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms is preferable, an alkyl group is more preferable, and a methyl group is particularly preferable.
- alkyl groups such as methyl group, ethyl group and isopropyl group
- the content of the coupling agent (D) is preferably 0.5 to 5 parts by mass, more preferably 1 to 4 parts by mass, and further 1 to 3 parts by mass with respect to 100 parts by mass of the photocurable resin composition. preferable.
- the amount of the coupling agent (D) is 1 part by mass or more, the adhesive strength between the sealing member obtained from the photocurable resin composition and the substrate increases.
- the amount of the coupling agent (D) is 5 parts by mass or less, the distance between the cross-linking points of the curable compound (A) is hardly affected, and the moisture resistance of the sealing member is improved.
- Latent thermosetting agent (E) The photocurable resin composition preferably further contains a latent thermosetting agent (E).
- the latent heat curing agent (E) does not cure the curable compound (A) or other curable compounds described later under normal storage conditions (room temperature, under visible light, etc.), but when heat is applied, these It is a compound that cures the compound. That is, when the photocurable resin composition contains the latent thermosetting agent (E), the photocurable resin composition can be thermally cured.
- the latent thermosetting agent (E) is preferably, for example, a curable compound containing an epoxy group or a curing agent capable of curing an epoxy-based compound described below (hereinafter also referred to as "epoxy curing agent").
- the epoxy curing agent preferably has a melting point of 50° C. or higher and 250° C. or lower, and a melting point of 100° C. or higher and 200° C. or higher, from the viewpoint of increasing the viscosity stability of the photocurable resin composition and not impairing the moisture resistance of the cured product. ° C. or less is more preferable, and 150° C. or more and 200° C. or less is even more preferable.
- epoxy curing agents include dihydrazide thermal latent curing agents, amine adduct thermal latent curing agents, polyamine thermal latent curing agents, dicyandiamide thermal latent curing agents, and imidazole thermal latent curing agents. included.
- the photocurable resin composition may contain only one of these, or may contain two or more.
- dihydrazide thermal latent curing agents examples include adipic acid dihydrazide, 1,3-bis(hydrazinocarboethyl)-5-isopropylhydantoin, 7,11-octadecadien-1,18-dicarbohydrazide, dodecane Diacid dihydrazide, sebacic acid dihydrazide, and the like are included.
- the amine adduct-based thermal latent curing agent is a thermal latent curing agent consisting of an addition compound obtained by reacting an amine-based compound with catalytic activity with an arbitrary compound.
- amine adduct thermal latent curing agents include Amicure PN-40, Amicure PN-23, Amicure PN-31, Amicure PN-H, Amicure MY-24, and Amicure MY-H (all from Ajinomoto Co., Inc.). manufactured by Fine Techno Co., Ltd.).
- a polyamine-based thermal latent curing agent is a thermal latent curing agent having a polymer structure obtained by reacting an amine with an epoxy resin. (manufactured by ADEKA) and the like.
- dicyandiamide-based thermal latent curing agents examples include dicyandiamide and the like.
- imidazole-based thermal latent curing agents examples include 2,4-diamino-6-[2'-ethylimidazolyl-(1')]-ethyltriazine, 2-phenylimidazole, and the like.
- the latent heat curing agent (C) may contain only one type of epoxy curing agent, or may contain two or more types thereof.
- the amount of the latent heat curing agent (E) is preferably 3 to 30 parts by mass, more preferably 3 to 20 parts by mass, and further 5 to 20 parts by mass with respect to 100 parts by mass of the total amount of the photocurable resin composition.
- the photocurable resin composition may be a one-component curable resin composition.
- the one-component curable resin composition is excellent in workability because it is not necessary to mix the main agent and the curing agent in use.
- the photocurable resin composition may further contain an inorganic filler (F) as needed.
- the photocurable resin composition contains the inorganic filler (F)
- the viscosity of the photocurable resin composition, the strength of the cured product, the linear expansibility, and the like tend to be improved.
- inorganic fillers (F) include calcium carbonate, magnesium carbonate, barium sulfate, magnesium sulfate, aluminum silicate, zirconium silicate, iron oxide, titanium oxide, titanium nitride, aluminum oxide (alumina), zinc oxide, silicon dioxide, Potassium titanate, kaolin, talc, glass beads, sericite activated clay, bentonite, aluminum nitride, silicon nitride and the like are included. Among them, silicon dioxide and talc are preferred.
- the shape of the inorganic filler (F) may be a regular shape such as a spherical shape, a plate shape, a needle shape, or an irregular shape.
- the inorganic filler (F) preferably has an average primary particle diameter of 1.5 ⁇ m or less and a specific surface area of 0.5 to 20 m 2 /g.
- the average primary particle size of the inorganic filler (F) can be measured by the laser diffraction method described in JIS Z8825-1.
- the specific surface area of the filler can be measured by the BET method described in JIS Z8830.
- the amount of the inorganic filler (F) is preferably 5 to 15 parts by mass with respect to 100 parts by mass of the total amount of the photocurable resin composition.
- the amount of the inorganic filler (F) is 5 parts by mass or more, the moisture resistance of the cured product (seal member) of the photocurable resin composition tends to increase, and when the amount is 10 parts by mass or less, the photocurable resin composition The coating stability of the product is less likely to be impaired.
- the content of the inorganic filler (F) is more preferably 5 to 10 parts by mass relative to the photocurable resin composition.
- the photocurable resin composition may further contain a thermosetting compound.
- the thermosetting compound is a compound different from the curable compound (A) described above.
- thermosetting compounds include epoxy compounds having epoxy groups in the molecule. Epoxy compounds may be monomeric, oligomeric or polymeric. When the photocurable resin composition contains an epoxy compound, the resulting liquid crystal panel has good display characteristics, and the moisture resistance of the cured product (sealing member) is enhanced.
- the epoxy compound preferably has an aromatic ring. Moreover, the weight average molecular weight of the epoxy compound is preferably 500 to 10,000, more preferably 1,000 to 5,000. The weight average molecular weight of the epoxy compound is measured in terms of polystyrene by gel permeation chromatography (GPC).
- aromatic epoxy compounds include aromatic diols represented by bisphenol A, bisphenol S, bisphenol F, bisphenol AD, etc., and diols obtained by modifying these aromatic diols with ethylene glycol, propylene glycol, alkylene glycol, etc.
- Aromatic polyhydric glycidyl ether compounds obtained by reaction with epichlorohydrin; novolak resins derived from phenol or cresol and formaldehyde; polyphenols represented by polyalkenylphenols and their copolymers, and epichlorohydrin Novolac-type polyhydric glycidyl ether compounds obtained by the reaction; glycidyl ether compounds of xylylene phenol resins, and the like are included.
- cresol novolak-type epoxy compounds cresol novolak-type epoxy compounds, phenol novolak-type epoxy compounds, bisphenol A-type epoxy compounds, bisphenol F-type epoxy compounds, triphenolmethane-type epoxy compounds, triphenolethane-type epoxy compounds, trisphenol-type epoxy compounds, dicyclopentadiene-type Epoxy compounds, diphenyl ether type epoxy compounds or biphenyl type epoxy compounds are preferred.
- the photocurable resin composition may contain one type of epoxy compound, or may contain two or more types.
- the epoxy compound may be liquid or solid.
- a solid epoxy compound is preferable from the viewpoint of easily increasing the moisture resistance of the cured product.
- the softening point of the solid epoxy compound is preferably 40°C or higher and 150°C or lower. The softening point can be measured by the ring and ball method specified in JIS K7234.
- the content of the thermosetting compound is preferably 3 to 20 parts by mass with respect to 100 parts by mass of the photocurable resin composition.
- the amount of the thermosetting compound is 3 parts by mass or more, the moisture resistance of the cured product (seal member) of the photocurable resin composition can be favorably improved.
- the content of the thermosetting compound is 20 parts by mass or less, it is difficult for the photocurable resin composition to excessively increase in viscosity.
- the amount of the thermosetting compound is more preferably 3 to 15 parts by mass, still more preferably 4 to 15 parts by mass, per 100 parts by mass of the photocurable resin composition.
- the content of the thermosetting compound is preferably 3.8 to 50 parts by mass, more preferably 5 to 30 parts by mass, per 100 parts by mass of the curable compound (A).
- the content of the thermosetting compound with respect to the curable compound (A) is 3.8 parts by mass or more, the moisture resistance of the cured product and the adhesive strength to the glass substrate are further enhanced.
- it is 50 parts by mass or less, the compatibility with the curable compound (A) tends to be good during production.
- the photocurable resin composition of the present invention optionally includes a thermal radical polymerization initiator, a silane coupling agent other than the coupling agent (D) described above, an ion trapping agent, an ion exchange agent, a leveling agent, Additives such as pigments, dyes, sensitizers, plasticizers and defoamers may also be included.
- silane coupling agents examples include vinyltrimethoxysilane, ⁇ -(meth)acryloxypropyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycidoxypropyltriethoxysilane and the like.
- the content of the silane coupling agent is preferably 0.01 to 5 parts by mass with respect to 100 parts by mass of the curable compound (A). When the content of the silane coupling agent is 0.01 parts by mass or more, the cured product of the photocurable resin composition is likely to be further enhanced.
- the photocurable resin composition of the present invention may further contain a spacer or the like for adjusting the gap of the liquid crystal display panel.
- the total amount of other components is preferably 1 to 50 parts by mass with respect to the total amount of 100 parts by mass of the photocurable resin composition.
- the total amount of the other components is 50 parts by mass or less, the viscosity of the photocurable resin composition is less likely to increase excessively, and the coating stability of the photocurable resin composition is less likely to be impaired.
- the viscosity of the photocurable resin composition of the present invention at 25 ° C. and 2.5 rpm of an E-type viscometer is preferably 200 to 450 Pa s, more preferably 300 to 400 Pa s. . When the viscosity is within the above range, the applicability of the photocurable resin composition using a dispenser is improved.
- the photocurable resin composition of the present invention can be used as a sealant as described above.
- the photocurable resin composition is particularly suitable as a display element sealant used for sealing display elements such as liquid crystal display elements, organic EL elements and LED elements.
- the photocurable resin composition of the present invention hardly contaminates liquid crystals, it is very suitable as a liquid crystal sealant for a liquid crystal dropping method.
- the liquid crystal display panel of the present invention comprises a pair of substrates (display substrate and counter substrate) each having an alignment film, and a frame-shaped seal disposed between the alignment films of the pair of substrates. and a liquid crystal layer filled in a space surrounded by the sealing member between the pair of substrates.
- the seal member is a cured product of the photocurable resin composition (liquid crystal sealant) described above.
- Both the display substrate and the counter substrate are transparent substrates.
- the material of the transparent substrate may be an inorganic material such as glass, or a plastic such as polycarbonate, polyethylene terephthalate, polyethersulfone, or PMMA.
- a matrix TFT, a color filter, a black matrix, etc. may be arranged on the surface of the display substrate or the counter substrate.
- An alignment film is further arranged on the surface of the display substrate or the counter substrate.
- the alignment film includes known organic alignment agents and inorganic alignment agents.
- the above photocurable resin composition (liquid crystal sealant) has an alkoxy group that reacts with the substrate surface, so the coupling agent (D) present in the vicinity of the interface with the substrate is rubber in its molecular structure. Since it has a structure, it is possible to relax the residual stress generated in the sealing member during curing, particularly at the fragile interface between the substrate and the sealing member, and to absorb external stress applied to the liquid crystal display panel. Therefore, even if the sealing member is arranged in the region where the alignment film is formed, peeling hardly occurs at the interface between them. Therefore, the liquid crystal display panel of the present invention can realize a narrow frame.
- a liquid crystal display panel is manufactured using the liquid crystal sealant of the present invention.
- Liquid crystal display panels are generally manufactured by a liquid crystal dropping method and a liquid crystal injection method, but the liquid crystal display panel of the present invention is preferably manufactured by the liquid crystal dropping method.
- the manufacturing method of the liquid crystal display panel by the liquid crystal dripping method is 1) A step of applying the liquid crystal sealing agent in a pattern (frame shape) onto the alignment film of one of a pair of substrates each having an alignment film to form a seal pattern; 2) a step of dropping liquid crystal onto one substrate and within a region surrounded by the seal pattern, or onto the other substrate, while the seal pattern is in an uncured state; 3) a step of superimposing one substrate and the other substrate via a seal pattern and a liquid crystal; 4) curing the seal pattern.
- step 1) a liquid crystal sealant is applied to the desired shape.
- a coating method is not particularly limited, and a general method can be used.
- the width of the seal pattern to be formed is not particularly limited, but the liquid crystal sealant described above has a high adhesive strength to the substrate. Therefore, it is possible to set the width of the sealant to about 0.3 mm to 0.6 mm.
- the state in which the seal pattern is uncured means a state in which the curing reaction of the liquid crystal sealant has not progressed to the gelation point. Therefore, in step 2), the seal pattern may be semi-cured by light irradiation or heating in order to suppress the dissolution of the liquid crystal sealant into the liquid crystal.
- the one substrate and the other substrate are respectively a display substrate and a counter substrate.
- step 4 only curing by light irradiation may be performed, but curing by heating may be performed after curing by light irradiation. Since the liquid crystal sealant can be cured in a short time by curing by light irradiation, dissolution into the liquid crystal can be suppressed. By combining curing by light irradiation and curing by heating, damage to the liquid crystal layer due to light can be reduced as compared with curing by light irradiation alone.
- the light to be irradiated is appropriately selected according to the type of the photopolymerization initiator (B) in the liquid crystal sealant (photocurable resin composition) described above, but light in the visible light region is preferable, for example, wavelengths from 370 to 370. 450 nm light is preferred. This is because the light of the above wavelength causes relatively little damage to the liquid crystal material and drive electrodes.
- a known light source that emits ultraviolet light or visible light can be used for light irradiation. When irradiating with visible light, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, a xenon lamp, a fluorescent lamp, or the like can be used.
- the light irradiation energy may be any energy that can cure the curable compound (A).
- the photocuring time depends on the composition of the liquid crystal sealant, but is, for example, about 10 minutes.
- thermosetting temperature is, for example, 120°C, although it depends on the composition of the liquid crystal sealant, and the thermosetting time is about 2 hours.
- Curable Compound (A) The following curable compounds (A-1) to (A-4) were prepared.
- Curable compound (A-1) methacrylic-modified bisphenol F type epoxy resin prepared in Synthesis Example 1 below
- Curable compound (A-2) acrylic resin (light acrylate 14EG-A, manufactured by Kyoei Chemical Co., Ltd.)
- Curable compound (A-3) acrylic resin prepared in Synthesis Example 2 below
- Coupling Agent (D) The following coupling agents (D-1) and (D-2) were prepared.
- Coupling agent (D-1) a commercially available silane coupling agent represented by the following chemical formula (average molecular weight: 6000, number of alkoxysilyl groups: 1) (In the above chemical formula, R is an alkyl group)
- Latent Heat Curing Agent (E) The following latent heat curing agents (E-1) and (E-2) were prepared. - Latent heat curing agent (E-1): adipic acid dihydrazide (ADH, manufactured by Nippon Kasei Co., Ltd., melting point 177 to 184 ° C.) ⁇ Latent heat curing agent (E-2): modified polyamine (EH-5030S, manufactured by ADEKA)
- Example 1 8 parts by mass of an epoxy resin, 54 parts by mass of the curable compound (A-1) obtained in Synthesis Example 1, 2 parts by mass of the curable compound (A-2) (polyethylene glycol diacrylate), and Synthesis Example 2 5 parts by weight of the curable compound obtained in (A-3), 5 parts by weight of the curable compound (A-4) obtained in Synthesis Example 3, a photopolymerization initiator (B) 1 part by weight, and an organic Fine particles (C) 12 parts by mass, coupling agent (D-1) 2 parts by mass, latent thermosetting agent (E-1) (dihydrazide adipic acid) 5 parts by mass, inorganic filler (F) (silica Particles) and 6 parts by mass were sufficiently mixed using a triple roll so as to form a uniform composition to obtain a photocurable resin composition.
- A-1 8 parts by mass of an epoxy resin, 54 parts by mass of the curable compound (A-1) obtained in Synthesis Example 1, 2 parts by mass of the curable compound (A-2) (
- Examples 2-4 and Comparative Examples 1-5 A photocurable resin composition was prepared in the same manner as in Example 1, except that the composition was changed as shown in Table 1.
- Adhesion strength test The obtained photocurable resin composition was applied to a pair of substrates (40 mm ⁇ 45 mm glass substrates (RT-DM88-RT-DM88- PIN (manufactured by EHC)) was applied in a frame shape on one substrate to form a seal pattern.
- the seal pattern was a 38 mm ⁇ 38 mm square with a cross-sectional area of 2500 ⁇ m 2 (corresponding to a frame width of 0.5 mm).
- the frame width of the sealing material for recent liquid crystal displays is as narrow as 1.8 mm, generally about 8 mm, and this test is a severe condition for an adhesive strength test with an extremely narrow line width.
- One glass substrate on which the seal pattern was formed and the other glass substrate were bonded together under reduced pressure so that the directions of the alignment films of each other were perpendicular to each other, and then exposed to the atmosphere. Then, the two bonded glass substrates were held in a light shielding box for 1 minute. Then, it was irradiated with light containing visible light (light with a wavelength of 370 to 450 nm) at 3000 mJ/cm 2 and heated at 120° C. for 1 hour to cure the photocurable resin composition to obtain a test piece.
- visible light light with a wavelength of 370 to 450 nm
- the moisture permeability of the photocurable resin composition was measured by a moisture permeable cup method according to JIS:Z0208. Specifically, the above photocurable resin composition was applied to a film thickness of 100 ⁇ m on release paper using an applicator. The release paper on which the coating film of the photocurable resin composition was formed was irradiated with ultraviolet light at 3 J/cm 2 . After that, it was held in a hot air drying oven at 120° C. for 60 minutes, then taken out and cooled. Then, the coating film was peeled off from the release paper to obtain a film having a thickness of 100 ⁇ m.
- the photocurable resin composition of the present invention it is possible to form a seal member having high adhesive strength with a substrate and high moisture resistance. Therefore, the photocurable resin composition is very useful as a sealant for various display elements.
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Abstract
Description
[1]分子内にエチレン性不飽和二重結合を有する硬化性化合物(A)、光重合開始剤(B)、有機微粒子(C)、およびカップリング剤(D)、を含有する光硬化性樹脂組成物であり、前記カップリング剤(D)が、ブダジエンゴム、ブタジエンスチレンゴム、アクリルゴム、およびシリコーンゴムからなる群より選ばれる、少なくとも一つの化学構造を有するカップリング剤である、光硬化性樹脂組成物。
[3]前記カップリング剤(D)が、アルコキシシリル基を含み、前記光硬化性樹脂組成物100中の前記カップリング剤(D)由来の前記アルコキシシリル基の量が、1.0×10-5mol以上5.0×10-3mol以下である、[2]に記載の光硬化性樹脂組成物。
[4]前記カップリング剤(D)の含有量が、前記光硬化性樹脂組成物の総量100質量部に対して、0.5~5質量部である、[1]~[3]のいずれかに記載の光硬化性樹脂組成物。
[7]上記[1]~[6]のいずれかに記載の光硬化性樹脂組成物を含む、液晶シール剤。
[8]上記[7]に記載の液晶シール剤を、一対の基板の少なくとも一方の基板にパターン状に塗布し、シールパターンを形成する工程と、前記シールパターンが未硬化の状態で、前記一方の基板の前記シールパターンに囲まれた領域、および/または他方の基板上に液晶を滴下する工程と、前記一方の基板と前記他方の基板とを、前記シールパターンおよび前記液晶を介して重ね合わせる工程と、前記シールパターンを硬化させる工程と、を含む、液晶表示パネルの製造方法。
[10]前記シールパターンを硬化させる工程において、前記シールパターンに光を照射する、[8]または[9]に記載の液晶表示パネルの製造方法。
[12]前記シールパターンに照射する光が、可視光領域の光を含む、[10]または[11]に記載の液晶表示パネルの製造方法。
[13]一対の基板と、前記一対の基板の間に配置された、枠状のシール部材と、前記一対の基板および前記シール部材の内側に配置された液晶と、を含む液晶表示パネルであって、枠状の前記シール部材が、[7]に記載の液晶シール剤の硬化物である、液晶表示パネル。
本発明の光硬化性樹脂組成物は、分子内にエチレン性不飽和二重結合を有する硬化性化合物(A)、光重合開始剤(B)、有機微粒子(C)、およびカップリング剤(D)を含有する。
硬化性化合物(A)は、分子内にエチレン性不飽和二重結合を有する化合物であればよい。硬化性化合物(A)は、モノマー、オリゴマーまたはポリマーのいずれであってもよい。当該硬化性化合物(A)の例には、分子内に(メタ)アクリロイル基を有する化合物が含まれる。当該(メタ)アクリロイル基を有する化合物1分子あたりの(メタ)アクリロイル基の数は、1つであってもよく、2以上であってもよい。本明細書において、(メタ)アクリロイル基との記載は、アクリロイル基またはメタクリロイル基、もしくはこれら両方を意味する。また、(メタ)アクリレートとの記載は、アクリレートまたはメタクリレート、もしくはこれら両方を意味する。さらに(メタ)アクリルとの記載は、アクリルまたはメタクリル、もしくはこれら両方を意味する。
光重合開始剤は、光の照射によって、上記硬化性化合物(A)をラジカル重合等させることが可能な化合物であれば特に制限されない。例えば、自己開裂型の光重合開始剤であってもよく、水素引き無機型の光重合開始剤であってもよい。
光硬化性樹脂組成物が含む有機微粒子(C)の種類は特に制限されず、有機微粒子(C)の例には、シリコーン粒子、アクリル粒子、スチレン・ジビニルベンゼン共重合体等のスチレン粒子、およびポリオレフィン粒子等が含まれる。光硬化性樹脂組成物は、有機微粒子(C)を一種のみ含んでもよく、二種以上含んでもよい。有機微粒子(C)の平均一次粒子径は、0.05~13μmが好ましく、0.1~10μmがより好ましく、0.1~8μmがさらに好ましい。
カップリング剤(D)は、ブダジエンゴム、ブタジエンスチレンゴム、アクリルゴム、およびシリコーンゴムからなる群より選ばれる、少なくとも一つの化学構造(以下、「ゴム構造」とも称する)と、液晶表示パネルの基板表面に存在する官能基と反応可能な基と、を有する化合物であればよい。当該カップリング剤(D)の例には、ゴム構造の側鎖または主鎖に、液晶表示パネルの基板表面に存在する官能基と反応可能な基を有する有機金属化合物が結合した化合物が含まれる。
アルコキシシリル基の量={(光硬化性樹脂100g中のアルコキシシリル基を有するカップリング剤(D)の量(g))/(当該カップリング剤(D)の分子量)}×(当該カップリング剤(D)中のアルコキシシリル基の数)
光硬化性樹脂組成物は、潜在性熱硬化剤(E)をさらに含むことが好ましい。潜在性熱硬化剤(E)は、通常の保存条件下(室温、可視光線下等)では硬化性化合物(A)や後述のその他の硬化性化合物を硬化させないが、熱を与えると、これらの化合物を硬化させる化合物である。つまり、光硬化性樹脂組成物が潜在性熱硬化剤(E)を含むと、光硬化性樹脂組成物が熱硬化可能になる。潜在性熱硬化剤(E)は、例えばエポキシ基を含む硬化性化合物や、後述のエポキシ系化合物の硬化が可能な硬化剤(以下、「エポキシ硬化剤」とも称する)が好ましい。
光硬化性樹脂組成物は、必要に応じて無機充填剤(F)をさらに含んでいてもよい。光硬化性樹脂組成物が無機充填剤(F)を含むと、光硬化性樹脂組成物の粘度や硬化物の強度、および線膨張性等が良好になりやすい。
光硬化性樹脂組成物は、熱硬化性化合物をさらに含んでいてもよい。ただし、当該熱硬化性化合物は、上述の硬化性化合物(A)とは異なる化合物である。
本発明の光硬化性樹脂組成物は、必要に応じて熱ラジカル重合開始剤、上述のカップリング剤(D)以外のシランカップリング剤、イオントラップ剤、イオン交換剤、レベリング剤、顔料、染料、増感剤、可塑剤及び消泡剤等の添加剤をさらに含んでいてもよい。
本発明の光硬化性樹脂組成物の、E型粘度計の25℃、2.5rpmにおける粘度は、200~450Pa・sが好ましく、300~400Pa・sがより好ましい。粘度が上記範囲にあると、光硬化性樹脂組成物のディスペンサーによる塗布性が良好となる。
本発明の液晶表示パネルは、それぞれ配向膜を有する一対の基板(表示基板および対向基板)と、当該一対の基板の配向膜どうしの間に配置された枠状のシール部材と、一対の基板の間の前記シール部材で囲まれた空間に充填された液晶層と、を含む。当該シール部材が、上述の光硬化性樹脂組成物(液晶シール剤)の硬化物である。
1)それぞれ配向膜を有する一対の基板の、一方の基板の配向膜上に、上述の液晶シール剤をパターン状(枠状)に塗布し、シールパターンを形成する工程と、
2)シールパターンが未硬化の状態において、一方の基板上、かつシールパターンで囲まれた領域内、または他方の基板上に、液晶を滴下する工程と、
3)一方の基板および他方の基板を、シールパターンおよび液晶を介して重ね合わせる工程と、
4)シールパターンを硬化させる工程とを含む。
1-1.硬化性化合物(A)の準備
以下の硬化性化合物(A-1)~(A-4)を準備した。
・硬化性化合物(A-1):以下の合成例1で調製したメタクリル変性ビスフェノールF型エポキシ樹脂
・硬化性化合物(A-2):アクリル樹脂(ライトアクリレート14EG-A、共栄化学社製)
・硬化性化合物(A-3):以下の合成例2で調製したアクリル樹脂
・硬化性化合物(A-4):以下の合成例1で調製したメタクリル変性ビスフェノールF型エポキシ樹脂
液状ビスフェノールF型エポキシ樹脂(エポトートYDF-8170C、東都化成社製、エポキシ当量160g/eq)160gと、重合禁止剤(p-メトキシフェノール)0.1gと、触媒(トリエタノールアミン)0.2gと、メタクリル酸43.0gと、をフラスコ内に仕込み、乾燥空気を送り込んで90℃で還流攪拌しながら5時間反応させた。得られた樹脂を、超純水にて20回洗浄し、硬化性化合物(A-2)(メタクリル酸変性ビスフェノールF型エポキシ樹脂(部分変性メタクリル化物))を得た。
2-ヒドロキシエチルアクリレート116gと、重合禁止剤(p-メトキシフェノール)0.1gと、無水コハク酸100gと、をフラスコ内に仕込み、乾燥空気を送り込んで90℃で還流攪拌しながら5時間反応させた。続いて、ビスフェノールAジグリシジルエーテル170gを加え、同様に90℃で還流攪拌しながら5時間反応させた。得られた樹脂を、超純水にて20回洗浄し、硬化性化合物(A-3)を得た。
液状ビスフェノールF型エポキシ樹脂(エポトートYDF-8170C、東都化成社製、エポキシ当量160g/eq)160gと、重合禁止剤(p-メトキシフェノール)0.1gと、触媒(トリエタノールアミン)0.2gと、メタアクリル酸81.7gと、をフラスコ内に仕込み、乾燥空気を送り込んで90℃で還流攪拌しながら5時間反応させた。得られた樹脂を、超純水にて20回洗浄し、硬化性化合物(A-4)(メタクリル酸変性ビスフェノールF型エポキシ樹脂(95モル%部分変性メタクリル化物))を得た。
光重合開始剤(B)として、IRGACURE OXE01、BASFジャパン社製を準備した。
有機微粒子(C)として、微粒子ポリマーF351、アイカ工業社製を準備した。
以下のカップリング剤(D-1)および(D-2)を準備した。
・カップリング剤(D-1):以下の化学式で示される、市販のシランカップリング剤(平均分子量:6000、アルコキシシリル基数:1)
・カップリング剤(D-2):シランカップリング剤(KBM-403、信越シリコーン社製、分子量:236、アルコキシシリル基数:1)
以下の潜在性熱硬化剤(E-1)および(E-2)を準備した。
・潜在性熱硬化剤(E-1):アジピン酸ジヒドラジド(ADH、日本化成社製、融点177~184℃)
・潜在性熱硬化剤(E-2):変性ポリアミン(EH-5030S、ADEKA社製)
無機充填剤(F)として、シリカ粒子(S-100日本触媒化学社製)を準備した。
以下の化合物も準備した。
・エポキシ樹脂:YL983U、三菱ケミカル社製
・ポリイソプレンゴム1:UC-102、クラレ社製(重量平均分子量:17,000)
・ポリイソプレンゴム2:UC-203M、クラレ社製(重量平均分子量:35,000)
・ポリブタジエンゴム:LBR-361、クラレ社製(重量平均分子量:5,500)
・ポリスチレンブタジエンゴム:Ricon100、クレイバレー社製(重量平均分子量:4,500)
2-1.実施例1
エポキシ樹脂8質量部と、合成例1で得られた硬化性化合物(A-1)を54質量部と、硬化性化合物(A-2)(ポリエチレングリコールジアクリレート)2質量部と、合成例2で得られた硬化性化合物(A-3)5質量部と、合成例3で得られた硬化性化合物(A-4)5質量部と、光重合開始剤(B)1質量部と、有機微粒子(C)12質量部と、カップリング剤(D-1)2質量部と、潜在性熱硬化剤(E-1)(アジピン酸ジヒドラジド)5質量部と、無機充填剤(F)(シリカ粒子)6質量部とを、三本ロールを用いて均一な組成物になるように十分に混合して、光硬化性樹脂組成物を得た。
表1に示すように組成を変更した以外は、実施例1と同様にして光硬化性樹脂組成物を作製した。
実施例1~4および比較例1~5で得られた光硬化性樹脂組成物について、光硬化性樹脂組成物中のアルコキシシリル基の量、相溶性、接着強度および透湿量を以下の方法で評価した。結果を表1に示す。
光硬化性樹脂組成物100g中のアルコキシシリル基の量(mol/100g)は、以下のように求めた。
アルコキシシリル基の量(mol/100g)={(光硬化性樹脂100g中のアルコキシシリル基を有するカップリング剤(D)の量(g))/(当該カップリング剤(D)の分子量)}×(当該カップリング剤(D)中のアルコキシシリル基の数)
上述のように、三本ロールを用いて均一に混合した光硬化性樹脂組成物を、容器に入れて10分間静置した。その後、目視で分離が生じていないかを、以下の基準で判断した。
〇:分離なし
×:分離が認められる
得られた光硬化性樹脂組成物を、ディスペンサー(ショットマスター、武蔵エンジニアリング社製)により、透明電極および配向膜が予め形成された一対の基板(40mm×45mmガラス基板(RT-DM88-PIN、EHC社製))の一方の基板上に枠状に塗布し、シールパターンを形成した。シールパターンは、38mm×38mmの四角形とし、その断面積が2500μm2(枠の幅としては0.5mmに対応)なるように形成した。なお、近年の液晶ディスプレイのシール材の枠幅は狭いもので1.8mm、一般的には8mm程度であり、本テストは極めて線幅が狭い接着強度試験としては厳しい条件である。当該シールパターンを形成した一方のガラス基板と他方のガラス基板とを、互いの配向膜の向きが垂直になるように減圧下で貼り合せた後、大気開放した。そして、貼り合わせた2枚のガラス基板を1分間遮光ボックス内で保持した。その後、3000mJ/cm2で可視光を含む光(波長370~450nmの光)を照射し、さらに120℃で1時間加熱して光硬化性樹脂組成物を硬化させて、試験片を得た。
〇:15N/mm以上の場合
△:10N/mm以上15N/mm未満の場合
×:10N/mm未満の場合
光硬化性樹脂組成物の透湿量は、JIS:Z0208に準拠した透湿カップ法で測定した。具体的には、上述の光硬化性樹脂組成物を、アプリケータを用いて離型紙上に100μmの膜厚に塗布した。当該光硬化性樹脂組成物の塗膜が形成された離型紙に、紫外光を3J/cm2照射した。その後、120℃の熱風乾燥オーブンで60分間保持した後、取り出して冷却した。そして、離型紙から塗膜を剥離して、膜厚100μmのフィルムを得た。
透湿量(g/m2・100μm・24h)=[24h放置後のアルミカップ重量(g)-放置前のアルミカップ重量(g)]/フィルム面積(m2)
透湿性は以下の基準で評価した。
〇:100g/m2・100μm・24h未満の場合
△:100g/m2・100μm・24h以上130g/m2・100μm・24h未満の場合
×:130g/m2・100μm・24h以上の場合
Claims (13)
- 分子内にエチレン性不飽和二重結合を有する硬化性化合物(A)、
光重合開始剤(B)、
有機微粒子(C)、および
カップリング剤(D)、を含有する光硬化性樹脂組成物であり、
前記カップリング剤(D)が、ブダジエンゴム、ブタジエンスチレンゴム、アクリルゴム、およびシリコーンゴムからなる群より選ばれる、少なくとも一つの化学構造を有するカップリング剤である、
光硬化性樹脂組成物。 - 前記カップリング剤(D)が、ブタジエンゴム構造を有するシランカップリング剤である、
請求項1に記載の光硬化性樹脂組成物。 - 前記カップリング剤(D)が、アルコキシシリル基を含み、
前記光硬化性樹脂組成物100g中の前記カップリング剤(D)由来の前記アルコキシシリル基の量が、1.0×10-5mol以上5.0×10-3mol以下である、
請求項2に記載の光硬化性樹脂組成物。 - 前記カップリング剤(D)の含有量が、前記光硬化性樹脂組成物の総量100質量部に対して、0.5~5質量部である、
請求項1~3のいずれか一項に記載の光硬化性樹脂組成物。 - ジヒドラジド系熱潜在性硬化剤、アミンアダクト系熱潜在性硬化剤、およびポリアミン系熱潜在性硬化剤からなる群より選ばれる少なくとも一つの潜在性熱硬化剤(E)をさらに含有する、
請求項1~4のいずれか一項に記載の光硬化性樹脂組成物。 - 無機充填剤(F)をさらに含有し、
前記無機充填剤(F)の含有量が、前記光硬化性樹脂組成物の総量100質量部に対して、5~15質量部である、
請求項1~5のいずれか一項に記載の光硬化性樹脂組成物。 - 請求項1~6のいずれか一項に記載の光硬化性樹脂組成物を含む、液晶シール剤。
- 請求項7に記載の液晶シール剤を、一対の基板の少なくとも一方の基板にパターン状に塗布し、シールパターンを形成する工程と、
前記シールパターンが未硬化の状態で、前記一方の基板の前記シールパターンに囲まれた領域、および/または他方の基板上に液晶を滴下する工程と、
前記一方の基板と前記他方の基板とを、前記シールパターンおよび前記液晶を介して重ね合わせる工程と、
前記シールパターンを硬化させる工程と、
を含む、
液晶表示パネルの製造方法。 - 前記一対の基板の少なくとも一方が、前記液晶と接する面に配向膜を有する、
請求項8に記載の液晶表示パネルの製造方法。 - 前記シールパターンを硬化させる工程において、
前記シールパターンに光を照射する、
請求項8または9に記載の液晶表示パネルの製造方法。 - 前記シールパターンを硬化させる工程において、
前記シールパターンに光を照射した後、加熱を行う、
請求項8~10のいずれか一項に記載の液晶表示パネルの製造方法。 - 前記シールパターンに照射する光が、可視光領域の光を含む、
請求項10または11に記載の液晶表示パネルの製造方法。 - 一対の基板と、前記一対の基板の間に配置された、枠状のシール部材と、前記一対の基板および前記シール部材の内側に配置された液晶と、を含む液晶表示パネルであって、
枠状の前記シール部材が、請求項7に記載の液晶シール剤の硬化物である、
液晶表示パネル。
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JP2000273126A (ja) * | 1999-03-23 | 2000-10-03 | Korea Res Inst Chem Technol | アルコキシシリル基含有ジエン共重合体、及び該重合体を含んでなる組成物 |
JP2001253911A (ja) * | 2000-03-09 | 2001-09-18 | Nippon Mitsubishi Oil Corp | エポキシ基およびアルコキシシリル基を有するポリブタジエン誘導体 |
JP2010525090A (ja) * | 2007-04-16 | 2010-07-22 | ダウ コーニング コーポレーション | 基材への改良された自己接着性を有する縮合硬化性組成物 |
JP2017219564A (ja) * | 2016-06-02 | 2017-12-14 | 三井化学株式会社 | 液晶滴下工法用シール材、液晶表示パネル及び液晶表示パネルの製造方法 |
JP2017219565A (ja) * | 2016-06-02 | 2017-12-14 | 三井化学株式会社 | 液晶滴下工法用シール材、液晶表示パネル及び液晶表示パネルの製造方法 |
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JP6144961B2 (ja) | 2013-05-09 | 2017-06-07 | 積水化学工業株式会社 | 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子 |
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JP2000273126A (ja) * | 1999-03-23 | 2000-10-03 | Korea Res Inst Chem Technol | アルコキシシリル基含有ジエン共重合体、及び該重合体を含んでなる組成物 |
JP2001253911A (ja) * | 2000-03-09 | 2001-09-18 | Nippon Mitsubishi Oil Corp | エポキシ基およびアルコキシシリル基を有するポリブタジエン誘導体 |
JP2010525090A (ja) * | 2007-04-16 | 2010-07-22 | ダウ コーニング コーポレーション | 基材への改良された自己接着性を有する縮合硬化性組成物 |
JP2017219564A (ja) * | 2016-06-02 | 2017-12-14 | 三井化学株式会社 | 液晶滴下工法用シール材、液晶表示パネル及び液晶表示パネルの製造方法 |
JP2017219565A (ja) * | 2016-06-02 | 2017-12-14 | 三井化学株式会社 | 液晶滴下工法用シール材、液晶表示パネル及び液晶表示パネルの製造方法 |
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