WO2022177389A1 - 전기 전도성 접촉핀 및 그 어셈블리 - Google Patents

전기 전도성 접촉핀 및 그 어셈블리 Download PDF

Info

Publication number
WO2022177389A1
WO2022177389A1 PCT/KR2022/002515 KR2022002515W WO2022177389A1 WO 2022177389 A1 WO2022177389 A1 WO 2022177389A1 KR 2022002515 W KR2022002515 W KR 2022002515W WO 2022177389 A1 WO2022177389 A1 WO 2022177389A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conductive
contact
tip portion
contact pin
conductive contact
Prior art date
Application number
PCT/KR2022/002515
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
안범모
박승호
홍창희
Original Assignee
(주)포인트엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)포인트엔지니어링 filed Critical (주)포인트엔지니어링
Publication of WO2022177389A1 publication Critical patent/WO2022177389A1/ko

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects

Definitions

  • the present invention relates to an electrically conductive contact pin and an assembly thereof.
  • a test apparatus and test socket having a plurality of electrically conductive contact pins between a connection terminal of a semiconductor package or wafer for testing and a connection terminal on the side of the test circuit board are used in a test apparatus for a semiconductor package or a wafer for an integrated circuit.
  • an inspection object semiconductor wafer or semiconductor package
  • the electrically conductive contact pins are applied to corresponding electrode pads (or solder balls or bumps) on the inspection object. This is done by making contact.
  • the electrically conductive contact pin and the electrode pad on the inspection object are brought into contact, after reaching a state in which both start to contact, a process for further approaching the inspection object is performed.
  • FIG. 1 shows an electrically conductive contact pin according to the prior art.
  • the electrically conductive contact pin shown in FIG. 1 is a slide-type electrically conductive contact pin that enables the application of a necessary contact pressure and shock absorption at the contact position by installing the spring member 12 between the tip portions 11 at both ends.
  • the electrically conductive contact pin In order for the electrically conductive contact pin to slide within the housing, a gap must exist between the outer surface of the electrically conductive contact pin and the inner surface of the housing.
  • the outer surface of the electrically conductive contact pin is spaced apart from the inner surface of the housing 13 more than necessary. It is not possible to precisely perform niche management. Accordingly, loss and distortion of the electrical signal are generated in the process in which the electrical signal is transmitted to the housing via the tip portion 11 , so that the inspection reliability is reduced.
  • Patent Document 1 Republic of Korea Patent Publication Registration No. 10-0659944
  • Patent Document 2 Republic of Korea Patent Publication No. 10-0647131
  • the present invention has been devised to solve the problems of the prior art, and by adopting an elastic contact structure to a contact tip sliding within a housing, and slidingly moving while always in contact with the inner surface of the housing, an electrically conductive contact pin that minimizes contact resistance and an assembly thereof.
  • an electrically conductive contact pin includes a first contact tip portion; a second contact tip portion; a body portion connecting the first contact tip portion and the second contact tip portion; and an elastic contact portion formed on at least one of the first contact tip portion and the second contact tip portion.
  • one end of the elastic contact portion is connected to the first contact tip portion, and the other end of the elastic contact portion is a free end.
  • the elastic contact portion is formed to be curved.
  • the electrically conductive contact pin assembly is an electrically conductive contact pin assembly including an electrically conductive contact pin which is inserted into a housing, the first contact tip portion; a second contact tip portion; a body portion connecting the first contact tip portion and the second contact tip portion; and an elastic contact portion formed on at least one of the first contact tip portion and the second contact tip portion, wherein the elastic contact portion slides in contact with the interior of the housing.
  • a metal layer made of a material having high electrical conductivity is coated on the inner wall of the housing.
  • the present invention provides an electrically conductive contact pin and an assembly thereof that minimizes contact resistance by slidingly moving while always in contact with the inner surface of the housing by adopting an elastic contact structure to the contact tip portion that slides within the housing.
  • FIG. 1 is a view showing an electrically conductive contact pin according to the prior art.
  • FIG. 2 is a plan view of an electrically conductive contact pin according to a first preferred embodiment of the present invention
  • FIG. 3 is a perspective view of an electrically conductive contact pin according to a first preferred embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of an electrically conductive contact pin assembly according to a first preferred embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of an electrically conductive contact pin assembly according to a second preferred embodiment of the present invention.
  • FIG. 6 is a plan view showing a modified example of the electrically conductive contact pin according to the first and second preferred embodiments of the present invention.
  • Embodiments described herein will be described with reference to cross-sectional and/or perspective views, which are ideal illustrative drawings of the present invention.
  • the thicknesses of films and regions shown in these drawings are exaggerated for effective description of technical content.
  • the shape of the illustrative drawing may be modified due to manufacturing technology and/or tolerance. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in the form generated according to the manufacturing process.
  • the electrically conductive contact pin according to a preferred embodiment of the present invention may be manufactured by MEMS technology, and application fields may vary according to its use.
  • the electrically conductive contact pin according to a preferred embodiment of the present invention is provided in the inspection device and is used to electrically and physically contact the inspection object to transmit an electrical signal.
  • the inspection apparatus may be an inspection apparatus used in a semiconductor manufacturing process, and for example, may be a probe card or a test socket depending on an object to be inspected.
  • the inspection apparatus according to a preferred embodiment of the present invention is not limited thereto, and any apparatus for checking whether an object to be inspected is defective by applying electricity is included.
  • An electrically conductive contact pin assembly is configured to include an electrically conductive contact pin and a housing in which the electrically conductive contact pin is accommodated.
  • FIG. 2 to 4 are views for explaining an electrically conductive contact pin 100 and an assembly thereof according to a first embodiment of the present invention
  • FIG. 2 is an electrically conductive contact pin 100 according to the first embodiment of the present invention
  • 3 is a perspective view of the electrically conductive contact pin 100 according to the first embodiment
  • FIG. 4 is a plan view of the electrically conductive contact pin assembly according to the first embodiment.
  • an electrically conductive contact pin 100 includes a first contact tip portion 210 , a second contact tip portion 230 , a first contact tip portion 210 and a second contact tip portion 210 . It includes a body part 300 for connecting the two contact tip parts 230 .
  • An elastic contact portion 400 is formed on at least one of the first contact tip portion 210 and the second contact tip portion 230 .
  • the first contact tip portion 210 , the second contact tip portion 230 , and the body portion 300 may be integrally manufactured by MEMS technology.
  • the body part 300 may be formed in a zigzag shape to be elastically stretchable in the longitudinal direction of the electrically conductive contact pin 100 .
  • the shape of the body part 300 may be manufactured in another shape as long as it is elastically deformable in addition to the zigzag shape.
  • the electrically conductive contact pins 100 may be formed of a conductive material.
  • the conductive material is platinum (Pt), rhodium (Ph), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir) or an alloy thereof, or nickel-cobalt (NiCo). At least one may be selected from an alloy, a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (NiP) alloy.
  • the body portion of the electrically conductive contact pin 100 may have a multilayer structure in which a plurality of conductive materials are stacked.
  • Each conductive layer composed of different materials is platinum (Pt), rhodium (Ph), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir) or alloys thereof. , or a palladium-cobalt (PdCo) alloy, a palladium-nickel (PdNi) alloy, or a nickel-phosphorus (NiP) alloy.
  • the first contact tip portion 210 is a portion substantially in contact with the pad of the inspection device
  • the second contact tip portion 230 is a portion substantially in contact with the object to be inspected, and is a compressive force applied to both ends of the electrically conductive contact pin 100 .
  • the body part 300 is elastically compressed in the longitudinal direction, and when the compressive force applied to both ends is released, the body part 300 is restored to its original state again.
  • the electrically conductive contact pin 100 may be manufactured by a mold made of an anodized film material. More specifically, the electrically conductive contact pin 100 may be manufactured by forming an opening in a mold made of an anodization film material and electroplating using a seed layer provided under the mold made of an anodization film material.
  • a mold made of an anodized film material means a film formed by anodizing a metal as a base material, and a pore means a hole formed in the process of anodizing a metal to form an anodizing film.
  • the base metal is aluminum (Al) or an aluminum alloy
  • an anodization film made of aluminum oxide (Al 2 0 3 ) material is formed on the surface of the base material.
  • the anodic oxide film formed as described above is vertically divided into a barrier layer having no pores formed therein and a porous layer having pores formed therein.
  • the anodization film may be formed in a structure in which the barrier layer formed during anodization is removed to penetrate the top and bottom of the pores, or the barrier layer formed during anodization remains as it is and seals one end of the top and bottom of the pores.
  • the anodized film has a coefficient of thermal expansion of 2-3 ppm/°C. For this reason, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, even in a high-temperature environment in the manufacturing environment of the electrically conductive contact pin 100, the precise electrically conductive contact pin 100 can be manufactured without thermal deformation.
  • the elastic contact portion 400 is formed on at least one of the first contact tip portion 210 and the second contact tip portion 230 . 2 and 3 show a configuration in which the elastic contact portion 400 is provided on the first contact tip portion 210 .
  • One end of the elastic contact portion 400 is connected to the first contact tip portion 400 , and the other end of the elastic contact portion 400 is a free end. Through this, the elastic contact portion 400 is elastically deformable while being supported and fixed by the first contact tip portion 400 .
  • the elastic contact part 400 provided on the left side of the electrically conductive contact pin 100 is curved in the same shape as the English alphabet "C” shape, and the elastic contact part 400 provided on the right side of the electrically conductive contact pin 100 . ) is formed by being curved in the same shape as the "inverted C” shape.
  • One end of the elastic contact part 400 is a root part connected to the first contact tip part 400, and the thickness of the electrically conductive contact pin 100 increases from the other end to the root part. Through this, it has an effect of preventing damage due to concentration of stress in the vicinity of the electrically conductive contact pin 100 during deformation.
  • the other end of the elastic contact part 400 is configured as a free end.
  • the elastic contact part 400 deforms when the first contact tip part 210 slides. Since it is not large, the frictional resistance can act significantly.
  • the elastic contact part 400 according to the preferred embodiment of the present invention has the other end configured as a free end, so that when the first contact tip part 210 slides, deformation of the elastic contact part 400 easily occurs, thereby reducing frictional resistance. has the effect of reducing
  • the elastic contact part 400 is provided on both sides of the first contact tip part 210 .
  • the length of the width before deformation of the elastic contact portion 400 provided on both sides of the first contact tip portion 210 is smaller than the length between the inner surfaces of the housing 500 . Through this, the first contact tip 210 can always maintain a state of contact with the inner surface of the housing 500 .
  • the elastic contact part 400 has a curved shape, even when the first contact tip part 210 slides along the inner surface of the housing 500 , the normal drag force of the frictional force acting on the elastic contact part 400 is the first contact tip part It acts in the (210) direction. As a result, the first contact tip 210 can always maintain a contact state with the inner surface of the housing 500 even when sliding.
  • the housing 500 comprises an electrically conductive material.
  • the housing 500 itself may be constructed of an electrically conductive material.
  • the inner surface of the housing 500 may be formed by coating an electrically conductive material.
  • the elastic contact part 400 contacts the inner surface of the housing 500 made of an electrically conductive material, a current path passing through the first contact tip part 210 , the housing 500 , and the second contact tip part 230 is formed. Therefore, the elastic deformation of the electrically conductive contact pin 100 is handled by the body portion 300, and the current path of the electrically conductive contact pin 100 is the first contact tip portion 210, the housing 500, and the second contact tip portion ( As the 230 is in charge, it is possible to form a shorter path of the current flowing through the electrically conductive contact pin 100 .
  • the housing 500 may have a rectangular cross-section. Since the cross-sectional shape of the electrically conductive contact pin 100 is a rectangular shape and the cross-sectional shape of the housing 500 is manufactured to have a rectangular shape, the electrically conductive contact pin 100 is prevented from tilting in the housing 500 and the electrically conductive contact pin It has the advantage of being able to arrange the assemblies at narrower pitch intervals. When the cross-section of the housing 500 is manufactured in a circular shape, there is a limitation in arranging the electrically conductive contact pin assembly in a narrow pitch. In addition, there may be a problem in that the electrically conductive contact pin 100 having a rectangular cross-section is tilted within the housing 500 . However, according to a preferred embodiment of the present invention, through the configuration in which the electrically conductive contact pin 100 of the rectangular cross-section is provided in the housing 500 of the rectangular cross-section, it is possible to simultaneously achieve tilting prevention and narrow pitch implementation.
  • Caulking parts 510 are formed at both ends of the housing 500 .
  • the size of the hole formed by the caulking part 510 is such that the electrically conductive contact pin 100 cannot easily come out.
  • the size of the hole formed by the caulking portion 510 is greater than the width of the first contact tip portion 210 and smaller than the longest distance between the two elastic contact portions 400 .
  • the caulking portion 510 supports the proximal portion 410 of the elastic contact portion 400 . Through this, it is possible to make a clearance between the housing 500 and the caulking part 510 in the manufacturing process, and it is possible to ensure the smooth sliding movement of the first contact tip part 210 .
  • the elastic contact part 400 since the elastic contact part 400 always maintains a state of contact with the inner surface of the housing 500 , foreign substances are prevented from penetrating into the housing 500 . Moreover, at the proximal side of the elastic contact part 400 , a sufficient separation space exists between the caulking part 510 and the first contact tip part 210 , so that foreign substances generated during the sliding process can be easily discharged to the outside.
  • FIG. 5 is a view for explaining an electrically conductive contact pin 100 and an assembly thereof according to a second preferred embodiment of the present invention. Since the configuration of the electrically conductive contact pin 100 is the same as that of the electrically conductive contact pin 100 according to the first embodiment described above, a detailed description thereof will be omitted.
  • the electrically conductive contact pin assembly according to the second embodiment of the present invention differs only in the configuration of the housing of the electrically conductive contact pin assembly of the first embodiment.
  • the housing 600 according to the second embodiment has a plurality of housings 600 in one housing 600 .
  • the electrically conductive contact pins 100 are provided.
  • FIG. 5 only one electrically conductive contact pin 100 is shown in FIG. 5 , a plurality of electrically conductive contact pins 100 are provided.
  • the housing 500 according to the first embodiment has a caulking part 510 to prevent the first and second contact tip parts 210 and 230 from falling off
  • the housing 600 according to the second embodiment has an upper portion.
  • the configuration prevents the first and second contact tip portions 210 and 230 from falling off through the coupling of the housing 610 and the lower housing 630 .
  • the upper housing 610 has a first hole 611 and a second hole 613 having a larger inner width than the first hole 611 therein
  • the lower housing 630 has a second hole 613 and A third hole 631 having the same inner width and a fourth hole 633 having a smaller inner width than the third hole 631 are provided.
  • the size of the first hole 611 is greater than the width of the first contact tip portion 210 and is smaller than the longest distance between the two elastic contact portions 400 .
  • the first hole 611 supports the proximal portion 410 of the elastic contact portion 400 . Through this, it is possible to make a clearance between the housing 500 and the caulking part 510 in the manufacturing process, and it is possible to ensure the smooth sliding movement of the first contact tip part 210 .
  • the inner surface of the housing 600 may be coated with a metal layer having excellent electrical conductivity.
  • a current path passing through the first contact tip part 210 , the housing 600 , and the second contact tip part 230 is formed. Therefore, the elastic deformation of the electrically conductive contact pin 100 is carried out by the body portion 300, and the current path of the electrically conductive contact pin 100 is the first contact tip portion 210, the housing 600, and the second contact tip portion ( As the 230 is in charge, it is possible to form a shorter path of the current flowing through the electrically conductive contact pin 100 .
  • the elastic contact portion 400 includes the first contact tip portion 210 and the second contact tip portion ( 230) may also be provided.
  • the configuration and effect of the elastic contact portion 400 provided in the second contact tip portion 230 is the same as the configuration and effect of the elastic contact portion 400 provided in the first contact tip portion 210, and thus a detailed description thereof will be omitted.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
PCT/KR2022/002515 2021-02-22 2022-02-21 전기 전도성 접촉핀 및 그 어셈블리 WO2022177389A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020210023285A KR102509525B1 (ko) 2021-02-22 2021-02-22 전기 전도성 접촉핀 및 그 어셈블리
KR10-2021-0023285 2021-02-22

Publications (1)

Publication Number Publication Date
WO2022177389A1 true WO2022177389A1 (ko) 2022-08-25

Family

ID=82931008

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2022/002515 WO2022177389A1 (ko) 2021-02-22 2022-02-21 전기 전도성 접촉핀 및 그 어셈블리

Country Status (3)

Country Link
KR (1) KR102509525B1 (zh)
TW (1) TWI812020B (zh)
WO (1) WO2022177389A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005345443A (ja) * 2004-06-07 2005-12-15 Japan Electronic Materials Corp プローブカード用接続ピンおよびそれを用いたプローブカード
JP5459801B2 (ja) * 2008-10-24 2014-04-02 タイコ エレクトロニクス サービシズ ゲゼルシャフト ミット ベシュレンクテル ハフツンク 試験プローブ
JP5847576B2 (ja) * 2011-12-29 2016-01-27 株式会社エンプラス プローブピン及び電気部品用ソケット
JP2018009790A (ja) * 2016-07-11 2018-01-18 アルプス電気株式会社 スプリングコンタクトおよびスプリングコンタクトを使用したソケット
KR102166677B1 (ko) * 2019-08-09 2020-10-16 주식회사 오킨스전자 멤스 포고 핀 및 이를 이용한 검사 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100647131B1 (ko) 2005-07-12 2006-11-23 리노공업주식회사 절곡홈이 형성된 프로브 및 그 제조방법
KR100659944B1 (ko) 2005-12-23 2006-12-21 리노공업주식회사 플런저 및 이를 장착한 검사용 탐침장치
KR20080113951A (ko) * 2007-06-26 2008-12-31 송정규 프로브 가이드 조립체
KR100984876B1 (ko) * 2008-05-08 2010-10-04 한국기계연구원 가변강성 기능을 가진 수직형 미세 접촉 프로브
JP5868239B2 (ja) * 2012-03-27 2016-02-24 株式会社日本マイクロニクス プローブ及びプローブカード
US10359447B2 (en) * 2012-10-31 2019-07-23 Formfactor, Inc. Probes with spring mechanisms for impeding unwanted movement in guide holes
JP2018009789A (ja) 2016-07-11 2018-01-18 アルプス電気株式会社 スプリングコンタクトと、スプリングコンタクトを使用したソケット、およびスプリングコンタクトの製造方法
KR101827736B1 (ko) * 2016-07-29 2018-02-09 오재숙 반도체 칩 검사용 커넥터 핀 장치 및 그의 제작 방법
KR101951705B1 (ko) * 2017-07-18 2019-02-25 송유선 포고 핀 및 포고 핀의 배열을 구현하는 검사용 소켓
KR101852849B1 (ko) 2018-02-14 2018-04-27 주식회사 오킨스전자 틸트 콘택 특성을 가지는 반도체 테스트 소켓용 핀

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005345443A (ja) * 2004-06-07 2005-12-15 Japan Electronic Materials Corp プローブカード用接続ピンおよびそれを用いたプローブカード
JP5459801B2 (ja) * 2008-10-24 2014-04-02 タイコ エレクトロニクス サービシズ ゲゼルシャフト ミット ベシュレンクテル ハフツンク 試験プローブ
JP5847576B2 (ja) * 2011-12-29 2016-01-27 株式会社エンプラス プローブピン及び電気部品用ソケット
JP2018009790A (ja) * 2016-07-11 2018-01-18 アルプス電気株式会社 スプリングコンタクトおよびスプリングコンタクトを使用したソケット
KR102166677B1 (ko) * 2019-08-09 2020-10-16 주식회사 오킨스전자 멤스 포고 핀 및 이를 이용한 검사 방법

Also Published As

Publication number Publication date
KR20220119879A (ko) 2022-08-30
KR102509525B1 (ko) 2023-03-14
TW202244506A (zh) 2022-11-16
TWI812020B (zh) 2023-08-11

Similar Documents

Publication Publication Date Title
WO2022010246A1 (ko) 수직형 프로브 핀 및 이를 구비한 프로브 카드
EP0632545B1 (en) Apparatus for interconnecting electrical contacts
WO2014129784A1 (ko) 고밀도 도전부를 가지는 테스트용 소켓
US8465312B2 (en) Socket cartridge and socket cartridge assembly
WO2018221886A1 (ko) 수직형 프로브핀 및 이를 구비한 프로브핀 조립체
WO2014204161A2 (ko) 검사용 인서트
WO2009145416A1 (ko) 반도체 칩 검사용 소켓
WO2011002125A1 (ko) 검사용 탐침 장치
WO2021137527A1 (ko) 테스트 소켓 조립체
WO2014104782A1 (ko) 테스트 소켓 및 소켓본체
WO2015102304A1 (ko) 시트형 커넥터 및 전기적 커넥터 장치
WO2023003255A1 (ko) 접촉 프로브
WO2020096238A1 (ko) 도전성 입자 및 이를 갖는 신호 전송 커넥터
US6255832B1 (en) Flexible wafer level probe
WO2019245153A1 (ko) 판 스프링 타입의 연결핀
WO2022177389A1 (ko) 전기 전도성 접촉핀 및 그 어셈블리
WO2021137379A1 (ko) 고성능 외통형 스프링핀
WO2021241784A1 (ko) 개선된 그립핑 구조를 가지는 프로브 핀
WO2011099822A2 (ko) 테스트 소켓
WO2016190601A1 (ko) 필름 컨택터 및 이를 포함하는 테스트 소켓
WO2023080533A1 (ko) 테스트 소켓
JPH02309579A (ja) 検査用ｉｃソケット
WO2022181951A1 (ko) 전기 전도성 접촉핀의 정렬 모듈 및 정렬 이송방법
WO2017155134A1 (ko) 검사용 탐침부재
WO2015020353A1 (ko) 켈빈 테스트를 위한 프로브 장치

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22756587

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22756587

Country of ref document: EP

Kind code of ref document: A1