WO2011002125A1 - 검사용 탐침 장치 - Google Patents
검사용 탐침 장치 Download PDFInfo
- Publication number
- WO2011002125A1 WO2011002125A1 PCT/KR2009/004206 KR2009004206W WO2011002125A1 WO 2011002125 A1 WO2011002125 A1 WO 2011002125A1 KR 2009004206 W KR2009004206 W KR 2009004206W WO 2011002125 A1 WO2011002125 A1 WO 2011002125A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- barrel
- plunger
- inspection
- semiconductor chip
- conductive silicon
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/303—Contactless testing of integrated circuits
Definitions
- the present invention relates to an inspection probe device, and more particularly, an inspection probe device, which can improve inspection reliability by using a conductive silicon portion to stably flow an inspection current.
- Chips are integrated circuits that perform various functions due to logic elements formed on the surface of thin and small pieces of plate, and electrical signals transmitted from circuit boards are transmitted through a bus to accomplish this operation.
- a printed circuit board is formed by coating copper on a thin substrate made of epoxy or bakelite resin, which is an insulator, to form a circuit wiring.
- the components are mounted on the printed circuit board by soldering on the circuit wiring.
- Micro-chip is a chip made by densely integrated electronic circuits of such a circuit board, and it is essential to inspect the process by an inspection device to check whether a chip is mounted in an electronic product before it is assembled. It goes through.
- test method there is a method of performing a test by mounting a chip on a test socket device, and a test probe device is mounted and used to check the chip without damaging the chip in the socket device.
- an inspection socket is mounted on an inspection circuit board, and a microchip, which is an inspection object, is placed on an upper portion of the socket, and inspection is performed, and a plurality of inspection probe devices are mounted on the inspection socket.
- FIG. 1 is a cross-sectional view showing a conventional inspection probe device.
- the upper plunger 10 and the lower plunger 40 are formed at the lower portion of the barrel and the barrel 20 and the inspection probe protrusion 12 installed to be slidably movable in the barrel 20.
- the compression coil spring 30 is accommodated in the barrel 20 to elastically support the upper plunger 10.
- the microchip When the microchip is inspected through this configuration, the microchip rests on the upper portion of the inspection socket, and the pressing portion provided in the inspection socket presses the microchip downward so that the microchip comes into contact with the probe protrusion of the upper plunger.
- FIG. 2 is a state diagram illustrating a state in which a current flows through the inspection probe device of FIG. 1.
- the current of the inspection circuit board flows to an inspection device (not shown) separately provided through the inspection probe device, and through this process, it is possible to inspect whether the semiconductor chip is normally operated.
- the reliability of an inspection using such an inspection probe depends on the smooth flow of current through the inspection probe. Even though the coil spring 30 is compressed, only a portion A contacts the inner surface of the barrel 20, so that the current flowing to the lower plunger side through the coil spring 30 causes the response characteristic of the inspection current to become unstable during the inspection process. Caused it.
- the present invention has been made to solve the above problems, and an object of the present invention is to provide an inspection probe device having improved inspection reliability by improving the structure so that the inspection current can stably flow.
- the inspection probe device includes a barrel having an upper and lower opening, an upper plunger formed at an upper end thereof with a probe protrusion contacting a connection terminal of a semiconductor chip, and having a lower portion received at an upper portion of the barrel, and an upper portion at a lower portion of the barrel.
- An inspection probe for inspecting a semiconductor chip comprising a lower plunger in which is accommodated, wherein the conductive silicon portion containing the metal ball in the cylindrical silicon is conductive and is contained within the barrel.
- the unit electrically connects the upper plunger and the lower plunger and elastically supports the downward pressure transmitted to the upper plunger during the semiconductor chip inspection process.
- the barrel is characterized in that the cylindrical coil spring is elastically supporting the upper plunger.
- the difference (d2-d1) of the inner diameter (d1) of the cylindrical coil spring and the outer diameter (d2) of the conductive silicon portion is characterized in that 0.02 ⁇ 0.2mm.
- an inspection probe for inspecting a semiconductor chip comprising: an upper plunger having a probe protrusion contacting a connection terminal of the semiconductor chip formed at an upper end portion thereof, a barrel having an upper and lower openings to receive a lower portion of the upper plunger upwardly;
- the inspection probe device contains a conductive metal portion containing a conductive metal ball inside the barrel to elastically support the upper plunger during the inspection process, so that the inspection current flows stably along the conductive silicon portion. There is an advantage to improve the inspection reliability.
- FIG. 1 is a cross-sectional view showing a conventional inspection probe device.
- Figure 2 is a state diagram showing a state in which a current flows through the inspection probe of Figure 1;
- FIG 3 is a cross-sectional view showing a test probe device according to an embodiment of the present invention.
- FIG. 4 is a cross-sectional view showing a test probe device according to another embodiment of the present invention.
- FIG. 5 is a cross-sectional view showing a test probe device according to another preferred embodiment of the present invention.
- FIG. 6 is a state diagram illustrating a state in which current flows through the inspection probe of FIG. 5.
- FIG 3 is a cross-sectional view showing a test probe device according to an embodiment of the present invention.
- the inspection probe device includes an upper plunger 10 having an upper end of which a probe protrusion 12 is in contact with a connection terminal of a semiconductor chip, and an upper and lower opening thereof, which open the upper plunger 10.
- a metal ball is placed in the barrel 20 in which the lower part of the upper part is accommodated, the lower plunger 40 in which the upper part is received in the lower part of the barrel 20, and the cylindrical silicon accommodated in the barrel 20. It is made of a conductive silicon portion 50 contained and conductive.
- the embodiment shown in (a) of FIG. 5 is a pressurized bent portion 22 formed on the outer circumferential surface of the barrel 20 to the bent groove 14 formed in the lower portion of the upper plunger 10, the upper plunger 10 Is fixed to the barrel 20, the embodiment shown in FIG. 5 (b) is an inward bending portion (16) formed at the upper end of the barrel 20 is a locking jaw 16 formed in the lower portion of the upper plunger 10 ( It is constrained by 24) and can be moved vertically.
- the conductive silicon portion 50 contains metal balls (called powders) in the cylindrical silicon having elasticity to become conductive and have both elasticity and conductivity.
- the vertical force transmitted through the probe protrusion 12 in the inspection process of the semiconductor chip is elastically supported by the conductive silicon portion 50, and the test current applied to the probe protrusion 12 is the conductive silicon portion ( 50 to the lower plunger 40.
- FIG. 4 is a cross-sectional view showing a test probe device according to another embodiment of the present invention.
- the coil spring 30 is added to the embodiment illustrated in FIG. 3.
- the barrel 20 has a cylindrical coil spring 30 that elastically supports the upper plunger 10, the inner diameter d1 of the cylindrical coil spring 30 and the outer diameter d2 of the conductive silicon portion 50.
- the difference d2-d1 is preferably limited to 0.02 to 0.2 mm.
- the material (bar) of the coil spring used for the inspection probe is manufactured by using a circular cross section of 0.02 to 0.20 mm, and the inner diameter (inner diameter) of the coil spring is about 0.2 to 2.0 mm depending on the inspection object. Is produced.
- the conductive silicon portion 50 is deformed to the outside during the compression process, and thus may be in contact with the inner diameter of the coil spring 30, therefore, the conductive silicon portion 50 and the coil spring within the above range. 30 should be spaced apart at regular intervals to normally elastically support the upper plunger.
- FIG. 5 is a cross-sectional view showing a test probe device according to another preferred embodiment of the present invention.
- the conductive silicon portion 50 is not in contact with the lower surface of the upper plunger 10, but is placed at a position spaced apart by the separation distance L.
- the contact is initially supported by the coil spring 30 and after the upper plunger 10 is moved by the separation distance L, the conductive silicon portion 50 is the lower surface of the upper plunger 10. It is elastically supported while in contact with (coil spring is elastically supported as well).
- FIG. 6 is a state diagram illustrating a state in which a current flows through the inspection probe device of FIG. 5.
- the present invention has a basic technical idea to provide an inspection probe device in which a conductive silicon portion is accommodated in the barrel, and within the scope of the basic idea of the present invention, Of course, many other variations are possible for those with knowledge of.
- the present invention can be used for the inspection probe device, and more particularly, it can be used for the inspection probe device, characterized in that the inspection reliability can be improved by using a conductive silicon portion so that the inspection current flows stably.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (4)
- 상하가 개구된 배럴과, 반도체 칩의 접속 단자에 접촉되는 탐침 돌기가 상단부에 형성되고 상기 배럴의 상부에 하부가 수용되는 상부 플런저와, 상기 배럴의 하부에 상부가 수용되는 하부 플런저를 포함하여 이루어지는 반도체 칩을 검사하기 위한 검사용 탐침 장치에 있어서,원통 형상의 실리콘에 금속볼이 함유되어 도전성을 띠는 도전성 실리콘부가 상기 배럴의 내부에 수용되되, 상기 도전성 실리콘부는 상기 상부 플런저와 하부 플런저를 전기적으로 연결시키고, 반도체 칩 검사 과정에서 상부 플런저에 전달되는 하방 압력을 탄성 지지함을 특징으로 하는 검사용 탐침 장치.
- 제 1 항에 있어서,상기 배럴의 내부에는,상기 상부 플런저를 탄성지지하는 원통형 코일 스프링이 내장됨을 특징으로 하는 검사용 탐침 장치.
- 제 2 항에 있어서,상기 원통형 코일 스프링의 내경(d1)과 도전성 실리콘부의 외경(d2)의 차이(d2-d1)는 0.02~0.2mm 임을 특징으로 하는 검사용 탐침 장치.
- 반도체 칩을 검사하기 위한 검사용 탐침 장치에 있어서,상기 반도체 칩의 접속 단자에 접촉되는 탐침 돌기가 상단부에 형성된 상부 플런저와;상하가 개구되어 상기 상부 플런저의 하부가 상측에 수용되는 배럴과;상기 배럴의 하부에 상부가 수용되는 하부 플런저와;상기 배럴의 내부에 수용되는 상기 상부 플런저를 탄성지지하는 원통형 코일 스프링과;상기 원통형 코일 스프링의 중심에 삽입되며, 원통형상의 실리콘에 금속볼이 함유되어 도전성을 띠는 도전성 실리콘부;로 이루어져,반도체 칩에 접촉시 상기 상부 플런저는 1차적으로 상기 원통형 코일 스프링에 의해서 탄성 지지되며, 2차적으로 상기 도전성 실리콘부에 의해서 탄성 지지됨을 특징으로 하는 검사용 탐침 장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009801602138A CN102472771A (zh) | 2009-07-03 | 2009-07-29 | 测试用探针装置 |
US13/382,089 US20120105090A1 (en) | 2009-07-03 | 2009-07-29 | Probe device for testing |
JP2012517360A JP2012532313A (ja) | 2009-07-03 | 2009-07-29 | 検査用探針装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0060509 | 2009-07-03 | ||
KR1020090060509A KR101149760B1 (ko) | 2009-07-03 | 2009-07-03 | 검사용 탐침 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011002125A1 true WO2011002125A1 (ko) | 2011-01-06 |
Family
ID=43411188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/004206 WO2011002125A1 (ko) | 2009-07-03 | 2009-07-29 | 검사용 탐침 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20120105090A1 (ko) |
JP (1) | JP2012532313A (ko) |
KR (1) | KR101149760B1 (ko) |
CN (1) | CN102472771A (ko) |
TW (1) | TWI417552B (ko) |
WO (1) | WO2011002125A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160065562A (ko) * | 2014-12-01 | 2016-06-09 | (주)씨투와이드 | 반도체 칩 검사용 커넥터핀 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI426275B (zh) * | 2011-08-26 | 2014-02-11 | Pegatron Corp | 探針裝置 |
KR101715750B1 (ko) * | 2012-02-15 | 2017-03-14 | 리노공업주식회사 | 반도체 디바이스를 검사하기 위한 프로브 및 그를 사용하는 테스트 소켓 |
KR101439343B1 (ko) * | 2013-04-18 | 2014-09-16 | 주식회사 아이에스시 | 포고핀용 탐침부재 |
KR101439342B1 (ko) | 2013-04-18 | 2014-09-16 | 주식회사 아이에스시 | 포고핀용 탐침부재 |
JP6395297B2 (ja) * | 2014-08-29 | 2018-09-26 | 株式会社ヨコオ | プランジャ、コンタクトプローブ、ソケット及びプランジャの製造方法 |
KR101591013B1 (ko) * | 2014-09-29 | 2016-02-03 | (주) 네스텍코리아 | 셀프결합형 프로브 핀 |
CN104280580B (zh) * | 2014-10-30 | 2018-01-30 | 通富微电子股份有限公司 | 测试针头和半导体测试治具 |
KR102028000B1 (ko) * | 2018-06-19 | 2019-10-04 | 주식회사 포마텍 | 탐침 장치 |
KR101930866B1 (ko) * | 2018-08-08 | 2018-12-20 | 황동원 | 반도체 디바이스 테스트용 콘택트 및 소켓장치 |
CN113614899B (zh) * | 2019-03-13 | 2023-10-24 | 日本发条株式会社 | 接触式探针及信号传送方法 |
CN112327128B (zh) * | 2020-11-06 | 2021-05-14 | 法特迪精密科技(苏州)有限公司 | 一种测试装置及测试方法 |
TWI819531B (zh) * | 2022-03-21 | 2023-10-21 | 皇亮科技股份有限公司 | 探針 |
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JP2001255340A (ja) * | 2000-03-13 | 2001-09-21 | Yokowo Co Ltd | コンタクトプローブ及び該コンタクトプローブを設けたicパッケージ検査用ソケット |
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KR200427407Y1 (ko) * | 2006-06-02 | 2006-09-26 | 주식회사 아이에스시테크놀러지 | 실리콘 콘택터 |
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EP0294696A3 (de) * | 1987-06-10 | 1989-04-26 | Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung | Federkontaktstift |
JPH01163872U (ko) * | 1988-05-06 | 1989-11-15 | ||
EP0974845A1 (en) * | 1998-07-08 | 2000-01-26 | Christian Leth Petersen | Apparatus for testing electric properties using a multi-point probe |
JP2003084047A (ja) * | 2001-06-29 | 2003-03-19 | Sony Corp | 半導体装置の測定用治具 |
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US7545159B2 (en) * | 2006-06-01 | 2009-06-09 | Rika Denshi America, Inc. | Electrical test probes with a contact element, methods of making and using the same |
TWM307751U (en) * | 2006-06-05 | 2007-03-11 | Hon Hai Prec Ind Co Ltd | Pogo pin |
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2009
- 2009-07-03 KR KR1020090060509A patent/KR101149760B1/ko active IP Right Grant
- 2009-07-29 WO PCT/KR2009/004206 patent/WO2011002125A1/ko active Application Filing
- 2009-07-29 US US13/382,089 patent/US20120105090A1/en not_active Abandoned
- 2009-07-29 JP JP2012517360A patent/JP2012532313A/ja active Pending
- 2009-07-29 CN CN2009801602138A patent/CN102472771A/zh active Pending
- 2009-08-19 TW TW098127784A patent/TWI417552B/zh active
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JP2001255340A (ja) * | 2000-03-13 | 2001-09-21 | Yokowo Co Ltd | コンタクトプローブ及び該コンタクトプローブを設けたicパッケージ検査用ソケット |
JP2004333459A (ja) * | 2003-05-06 | 2004-11-25 | Kazuhiko Goto | コンタクトプローブ、これを用いた半導体及び電気検査装置 |
KR200427407Y1 (ko) * | 2006-06-02 | 2006-09-26 | 주식회사 아이에스시테크놀러지 | 실리콘 콘택터 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160065562A (ko) * | 2014-12-01 | 2016-06-09 | (주)씨투와이드 | 반도체 칩 검사용 커넥터핀 |
KR101645450B1 (ko) * | 2014-12-01 | 2016-08-04 | (주)씨투와이드 | 반도체 칩 검사용 커넥터핀 |
Also Published As
Publication number | Publication date |
---|---|
KR101149760B1 (ko) | 2012-06-01 |
KR20110002959A (ko) | 2011-01-11 |
JP2012532313A (ja) | 2012-12-13 |
CN102472771A (zh) | 2012-05-23 |
TWI417552B (zh) | 2013-12-01 |
US20120105090A1 (en) | 2012-05-03 |
TW201102660A (en) | 2011-01-16 |
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