WO2022161616A1 - Verfahren und vorrichtung zur aufbringung einer metallischen beschichtung auf eine oberfläche - Google Patents
Verfahren und vorrichtung zur aufbringung einer metallischen beschichtung auf eine oberfläche Download PDFInfo
- Publication number
- WO2022161616A1 WO2022161616A1 PCT/EP2021/052112 EP2021052112W WO2022161616A1 WO 2022161616 A1 WO2022161616 A1 WO 2022161616A1 EP 2021052112 W EP2021052112 W EP 2021052112W WO 2022161616 A1 WO2022161616 A1 WO 2022161616A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ink
- print head
- nozzle
- metallic coating
- roughening
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 74
- 239000002184 metal Substances 0.000 title claims abstract description 74
- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000000576 coating method Methods 0.000 title claims abstract description 55
- 239000011248 coating agent Substances 0.000 title claims abstract description 52
- 150000003839 salts Chemical class 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000000203 mixture Substances 0.000 claims abstract description 18
- 150000007524 organic acids Chemical class 0.000 claims abstract description 12
- 238000000354 decomposition reaction Methods 0.000 claims description 25
- 238000007788 roughening Methods 0.000 claims description 22
- 239000002737 fuel gas Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 13
- 230000008569 process Effects 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 150000001735 carboxylic acids Chemical class 0.000 claims description 11
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 8
- 238000002425 crystallisation Methods 0.000 claims description 8
- 230000008025 crystallization Effects 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 239000007789 gas Substances 0.000 claims description 7
- 239000007921 spray Substances 0.000 claims description 7
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 claims description 6
- 230000001154 acute effect Effects 0.000 claims description 5
- 230000005670 electromagnetic radiation Effects 0.000 claims description 3
- 238000005422 blasting Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000003495 polar organic solvent Substances 0.000 claims description 2
- 239000004576 sand Substances 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims 1
- 230000001419 dependent effect Effects 0.000 claims 1
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 235000005985 organic acids Nutrition 0.000 claims 1
- 239000000976 ink Substances 0.000 description 117
- 239000004033 plastic Substances 0.000 description 25
- 229920003023 plastic Polymers 0.000 description 25
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 7
- CLUOTFHJTGLPSG-UHFFFAOYSA-L copper;7,7-dimethyloctanoate Chemical compound [Cu+2].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O CLUOTFHJTGLPSG-UHFFFAOYSA-L 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 150000001768 cations Chemical class 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000013528 metallic particle Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 238000000862 absorption spectrum Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 150000002763 monocarboxylic acids Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OJBOWZVSJWNXKS-UHFFFAOYSA-N 2,2,3,5-tetramethylhexanoic acid Chemical compound CC(C)CC(C)C(C)(C)C(O)=O OJBOWZVSJWNXKS-UHFFFAOYSA-N 0.000 description 1
- IMHQFVGHBDXALM-UHFFFAOYSA-N 2,2-diethylhexanoic acid Chemical compound CCCCC(CC)(CC)C(O)=O IMHQFVGHBDXALM-UHFFFAOYSA-N 0.000 description 1
- IKNDGHRNXGEHTO-UHFFFAOYSA-N 2,2-dimethyloctanoic acid Chemical compound CCCCCCC(C)(C)C(O)=O IKNDGHRNXGEHTO-UHFFFAOYSA-N 0.000 description 1
- WWPDEUORQAIWDC-UHFFFAOYSA-N 2,4-dimethyl-2-propan-2-ylpentanoic acid Chemical compound CC(C)CC(C)(C(C)C)C(O)=O WWPDEUORQAIWDC-UHFFFAOYSA-N 0.000 description 1
- PKJSRUTWBDIWAR-UHFFFAOYSA-N 2-ethyl-2,5-dimethylhexanoic acid Chemical compound CCC(C)(C(O)=O)CCC(C)C PKJSRUTWBDIWAR-UHFFFAOYSA-N 0.000 description 1
- BDPWLKPVAKYQNL-UHFFFAOYSA-L 7,7-dimethyloctanoate;manganese(2+) Chemical compound [Mn+2].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O BDPWLKPVAKYQNL-UHFFFAOYSA-L 0.000 description 1
- VNBCIRBFLBYHCW-UHFFFAOYSA-L 7,7-dimethyloctanoate;nickel(2+) Chemical compound [Ni+2].CC(C)(C)CCCCCC([O-])=O.CC(C)(C)CCCCCC([O-])=O VNBCIRBFLBYHCW-UHFFFAOYSA-L 0.000 description 1
- 229910001006 Constantan Inorganic materials 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical class [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910000914 Mn alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000005495 cold plasma Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004624 confocal microscopy Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- UTICYDQJEHVLJZ-UHFFFAOYSA-N copper manganese nickel Chemical compound [Mn].[Ni].[Cu] UTICYDQJEHVLJZ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000001093 holography Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005305 interferometry Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical group 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 150000002891 organic anions Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 150000003628 tricarboxylic acids Chemical class 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/04—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/06—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/145—Radiation by charged particles, e.g. electron beams or ion irradiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/2033—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Optics & Photonics (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Chemically Coating (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202180096466.4A CN117083416A (zh) | 2021-01-29 | 2021-01-29 | 将金属涂层施加到表面上的方法和装置 |
JP2023546190A JP2024510371A (ja) | 2021-01-29 | 2021-01-29 | 金属被膜を表面に塗布するための方法及び装置 |
PCT/EP2021/052112 WO2022161616A1 (de) | 2021-01-29 | 2021-01-29 | Verfahren und vorrichtung zur aufbringung einer metallischen beschichtung auf eine oberfläche |
EP21703850.4A EP4284961A1 (de) | 2021-01-29 | 2021-01-29 | Verfahren und vorrichtung zur aufbringung einer metallischen beschichtung auf eine oberfläche |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2021/052112 WO2022161616A1 (de) | 2021-01-29 | 2021-01-29 | Verfahren und vorrichtung zur aufbringung einer metallischen beschichtung auf eine oberfläche |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022161616A1 true WO2022161616A1 (de) | 2022-08-04 |
Family
ID=74561856
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2021/052112 WO2022161616A1 (de) | 2021-01-29 | 2021-01-29 | Verfahren und vorrichtung zur aufbringung einer metallischen beschichtung auf eine oberfläche |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP4284961A1 (de) |
JP (1) | JP2024510371A (de) |
CN (1) | CN117083416A (de) |
WO (1) | WO2022161616A1 (de) |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0484808A2 (de) * | 1990-11-05 | 1992-05-13 | Heraeus Noblelight GmbH | Verfahren und Einrichtung zur Herstellung von partiellen metallischen Schichten |
DE19958473A1 (de) | 1999-12-04 | 2001-06-07 | Bosch Gmbh Robert | Verfahren zur Herstellung von Kompositschichten mit einer Plasmastrahlquelle |
US20050220994A1 (en) * | 2004-03-31 | 2005-10-06 | Eastman Kodak Company | Process for the selective deposition of particulate material |
WO2006041657A2 (en) * | 2004-09-27 | 2006-04-20 | Optomec Design Company | Maskless direct write of copper using an annular aerosol jet |
WO2006076603A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electrical conductors |
JP2007141893A (ja) * | 2005-11-14 | 2007-06-07 | Seiko Epson Corp | 半導体装置の製造方法および電子機器 |
WO2008077608A2 (de) | 2006-12-23 | 2008-07-03 | Leoni Ag | Verfahren und vorrichtung zum aufspritzen insbesondere einer leiterbahn, elektrisches bauteil mit einer leiterbahn sowie dosiervorrichtung |
DE102008027461B4 (de) | 2008-06-09 | 2011-07-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Vorrichtung und Verfahren zur mikrostrukturierten Plasmabehandlung |
EP2781620A1 (de) * | 2011-11-15 | 2014-09-24 | NOF Corporation | Zusammensetzung zur formung einer kupferstruktur und verfahren zur formung einer kupferstruktur |
WO2016152722A1 (ja) * | 2015-03-24 | 2016-09-29 | 昭和電工株式会社 | 導電パターン形成用組成物及び導電パターン形成方法 |
US20160305016A1 (en) * | 2013-12-19 | 2016-10-20 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Method for Producing Patterned Metallic Coatings |
EP2711441B1 (de) | 2012-09-21 | 2017-08-02 | Maschinenfabrik Reinhausen GmbH | Vorrichtung und Verfahren zur Erzeugung eines Schichtsystems |
CN107148154A (zh) | 2017-07-12 | 2017-09-08 | 江南大学 | 一种基于喷墨打印的导电线路印刷工艺 |
WO2019068070A1 (en) * | 2017-10-01 | 2019-04-04 | Space Foundry Inc. | MODULAR PRINT HEAD ASSEMBLY FOR PLASMA JET PRINTING |
JP2020004648A (ja) | 2018-06-29 | 2020-01-09 | 旭化成株式会社 | 導電性パターンの製造方法、及びプラズマ処理装置 |
EP2674223B1 (de) | 2012-04-20 | 2020-01-15 | Maschinenfabrik Reinhausen GmbH | Vorrichtung zum Kennzeichnen eines Substrats |
EP3663095A1 (de) * | 2018-12-07 | 2020-06-10 | Nanogate SE | Tintenstrahldruck auf polycarbonatsubstraten |
-
2021
- 2021-01-29 EP EP21703850.4A patent/EP4284961A1/de active Pending
- 2021-01-29 WO PCT/EP2021/052112 patent/WO2022161616A1/de active Application Filing
- 2021-01-29 CN CN202180096466.4A patent/CN117083416A/zh active Pending
- 2021-01-29 JP JP2023546190A patent/JP2024510371A/ja active Pending
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0484808A2 (de) * | 1990-11-05 | 1992-05-13 | Heraeus Noblelight GmbH | Verfahren und Einrichtung zur Herstellung von partiellen metallischen Schichten |
DE19958473A1 (de) | 1999-12-04 | 2001-06-07 | Bosch Gmbh Robert | Verfahren zur Herstellung von Kompositschichten mit einer Plasmastrahlquelle |
US20050220994A1 (en) * | 2004-03-31 | 2005-10-06 | Eastman Kodak Company | Process for the selective deposition of particulate material |
WO2006041657A2 (en) * | 2004-09-27 | 2006-04-20 | Optomec Design Company | Maskless direct write of copper using an annular aerosol jet |
WO2006076603A2 (en) * | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electrical conductors |
JP2007141893A (ja) * | 2005-11-14 | 2007-06-07 | Seiko Epson Corp | 半導体装置の製造方法および電子機器 |
WO2008077608A2 (de) | 2006-12-23 | 2008-07-03 | Leoni Ag | Verfahren und vorrichtung zum aufspritzen insbesondere einer leiterbahn, elektrisches bauteil mit einer leiterbahn sowie dosiervorrichtung |
DE102008027461B4 (de) | 2008-06-09 | 2011-07-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Vorrichtung und Verfahren zur mikrostrukturierten Plasmabehandlung |
EP2781620A1 (de) * | 2011-11-15 | 2014-09-24 | NOF Corporation | Zusammensetzung zur formung einer kupferstruktur und verfahren zur formung einer kupferstruktur |
EP2674223B1 (de) | 2012-04-20 | 2020-01-15 | Maschinenfabrik Reinhausen GmbH | Vorrichtung zum Kennzeichnen eines Substrats |
EP2711441B1 (de) | 2012-09-21 | 2017-08-02 | Maschinenfabrik Reinhausen GmbH | Vorrichtung und Verfahren zur Erzeugung eines Schichtsystems |
US20160305016A1 (en) * | 2013-12-19 | 2016-10-20 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Method for Producing Patterned Metallic Coatings |
WO2016152722A1 (ja) * | 2015-03-24 | 2016-09-29 | 昭和電工株式会社 | 導電パターン形成用組成物及び導電パターン形成方法 |
CN107148154A (zh) | 2017-07-12 | 2017-09-08 | 江南大学 | 一种基于喷墨打印的导电线路印刷工艺 |
WO2019068070A1 (en) * | 2017-10-01 | 2019-04-04 | Space Foundry Inc. | MODULAR PRINT HEAD ASSEMBLY FOR PLASMA JET PRINTING |
JP2020004648A (ja) | 2018-06-29 | 2020-01-09 | 旭化成株式会社 | 導電性パターンの製造方法、及びプラズマ処理装置 |
EP3663095A1 (de) * | 2018-12-07 | 2020-06-10 | Nanogate SE | Tintenstrahldruck auf polycarbonatsubstraten |
Non-Patent Citations (1)
Title |
---|
LEE B ET AL: "A low-cure-temperature copper nano ink for highly conductive printed electrodes", CURRENT APPLIED PHYSICS, ELSEVIER, AMSTERDAM, NL, vol. 9, no. 2, 1 March 2009 (2009-03-01), pages e157 - e160, XP026196925, ISSN: 1567-1739, [retrieved on 20090313], DOI: 10.1016/J.CAP.2009.03.008 * |
Also Published As
Publication number | Publication date |
---|---|
EP4284961A1 (de) | 2023-12-06 |
JP2024510371A (ja) | 2024-03-07 |
CN117083416A (zh) | 2023-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE102005005359B4 (de) | Verfahren zum Kaltgasspritzen | |
EP0498286B1 (de) | Verfahren zur Erzeugung einer verschleissmindernden Schicht | |
DE102010016973B4 (de) | Verfahren zur Herstellung eines einseitig metallisierten Bedienelements aus Kunststoff mit hinterleuchtbarer Symbolik | |
WO2008077608A2 (de) | Verfahren und vorrichtung zum aufspritzen insbesondere einer leiterbahn, elektrisches bauteil mit einer leiterbahn sowie dosiervorrichtung | |
DE2452684A1 (de) | Vorrichtung und verfahren zum aufspruehen von zerstaeubten teilchen | |
DE112011105618T5 (de) | Oxidfilm-Niederschlagsverfahren und Oxidfilm-Niederschlagsvorrichtung | |
DE4129120C2 (de) | Verfahren und Vorrichtung zum Beschichten von Substraten mit hochtemperaturbeständigen Kunststoffen und Verwendung des Verfahrens | |
DE202019103960U1 (de) | Bedienelement aus Kunststoff mit hinterleuchtbarer Symbolik, sowie Maschine zur Herstellung eines Bedienelements aus Kunststoff mit hinterleuchtbarer Symbolik | |
DE102005062271B3 (de) | Verfahren zum Aufbringen von Material auf ein Bauteil sowie Bauteil | |
WO2014167468A1 (de) | Verfahren und vorrichtung zum aufbau einer struktur auf einem substrat | |
WO2022161616A1 (de) | Verfahren und vorrichtung zur aufbringung einer metallischen beschichtung auf eine oberfläche | |
DE102016223244A1 (de) | Verfahren und Vorrichtung zum generativen Fertigen eines dreidimensionalen Objekts und dreidimensionales Objekt | |
WO2013189486A1 (de) | Verfahren zur herstellung einer dreidimensionalen leiterbahnstruktur sowie eine nach diesem verfahren hergestellte leiterbahnstruktur | |
EP2562287A2 (de) | Verfahren und Vorrichtung zum thermischen Spritzen von Beschichtungswerkstoffen | |
DE19852776A1 (de) | Verfahren zur Metallisierung von Kunststoffen | |
DE102014208249A1 (de) | Verfahren zur Herstellung von Polymerfolien oder plattenförmigen Elementen aus Polymer | |
DE10241137B4 (de) | Verfahren zur Metallisierung von Kunststoffen | |
DE4141317C1 (en) | Prodn. of wear-reducing coating to reduce cracking and distortion - for screw surface in e.g. plastic extruder comprises introducing molybdenum@-contg. material into laser beam and depositing on steel body | |
WO2011154184A2 (de) | Verfahren und vorrichtung zum kontaktieren eines halbleitersubstrates mittels eines strahldruckverfahrens | |
AT518578A1 (de) | Verfahren und Vorrichtung zum Aufbringen eines Beschichtungswerkstoffes | |
EP4059617A1 (de) | Lackierverfahren mit gedruckter maske sowie druckvorrichtung | |
EP2906025B1 (de) | Verfahren zur selektiven Aktivierung mindestens eines Bereiches einer Oberfläche eines dielektrischen Substrats | |
DE102013220841A1 (de) | Verfahren zur Vorbehandlung einer Substratoberfläche und Verfahren zur Beschichtung der Substratoberfläche | |
EP4286144A1 (de) | Verfahren zur behandlung einer oberfläche eines formteils | |
DE10361119A1 (de) | Verfahren zur Herstellung eines metallischen Körpers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21703850 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2023546190 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2021703850 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2021703850 Country of ref document: EP Effective date: 20230829 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202180096466.4 Country of ref document: CN |