WO2022155895A1 - 遮挡掩膜版、掩膜版组件及蒸镀装置 - Google Patents

遮挡掩膜版、掩膜版组件及蒸镀装置 Download PDF

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Publication number
WO2022155895A1
WO2022155895A1 PCT/CN2021/073312 CN2021073312W WO2022155895A1 WO 2022155895 A1 WO2022155895 A1 WO 2022155895A1 CN 2021073312 W CN2021073312 W CN 2021073312W WO 2022155895 A1 WO2022155895 A1 WO 2022155895A1
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WIPO (PCT)
Prior art keywords
mask
region
reticle
area
masking
Prior art date
Application number
PCT/CN2021/073312
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English (en)
French (fr)
Inventor
黄琰
吴建鹏
徐倩
牛彤
张国梦
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to CN202180000048.0A priority Critical patent/CN115667572B/zh
Priority to US17/610,157 priority patent/US20230295790A1/en
Priority to PCT/CN2021/073312 priority patent/WO2022155895A1/zh
Publication of WO2022155895A1 publication Critical patent/WO2022155895A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the embodiments of the present disclosure relate to, but are not limited to, the field of display technology, and in particular, relate to a masking mask, a mask assembly, and an evaporation device.
  • the organic film layers such as the light-emitting layer of the OLED device are mainly produced by a vacuum evaporation process.
  • the mask assembly used in the vacuum evaporation process is mainly composed of a frame, a full mask sheet and a fine metal mask (FMM).
  • the fine metal mask is welded on the frame, and the masking mask is mainly used to support the fine metal mask and define the evaporation area of the substrate, and the fine metal mask is supported on the masking mask.
  • the base substrate is attached to the fine metal mask, and the evaporation material in the evaporation source is heated to form vapor and then deposited on the predetermined area of the base substrate through the mask pattern area of the fine metal mask. , so as to form a corresponding pattern of film layers on the base substrate.
  • a magnetic adsorption device is installed in the evaporation chamber, and the mask assembly is subjected to the magnetic adsorption of the magnetic adsorption device, so that the fine metal mask is closely attached to the substrate to ensure that the evaporation material is accurately evaporated. to the preset area of the base substrate.
  • the fine metal mask is prone to wrinkles during the evaporation process, resulting in poor evaporation accuracy, resulting in defects such as color mixing.
  • An embodiment of the present disclosure provides a masking mask of a mask assembly, the masking mask includes a plate body, the plate body includes a first surface, and the first surface of the plate body is configured to support the mask A plurality of fine metal masks of the stencil assembly, the plate body is provided with a plurality of openings, the openings are arranged to expose the mask pattern regions of the fine metal masks; the plate body includes a peripheral edge close to the The first area and the second area surrounded by the first area, in the direction perpendicular to the plate body, the first surface of the second area protrudes from the first surface of the first area; A support part is provided on the first surface of the first area, the support part avoids the opening, and the support part is arranged to be able to support the plurality of fine metals together with the first surface of the second area mask.
  • Embodiments of the present disclosure further provide a mask assembly, including the shielding mask, a frame and a plurality of fine metal masks; a circumferential edge of the plate body is provided with an overlapping portion, and the overlapping The parts are overlapped and fixed on the frame, the two ends of the fine metal mask are fixed on two opposite frames of the frame, and the first sides of the plurality of fine metal masks face the the first surface of the plate body.
  • Embodiments of the present disclosure further provide an evaporation device, including an evaporation chamber, an evaporation source, the mask assembly, and a magnetic adsorption device disposed in the evaporation chamber; the evaporation source and The magnetic adsorption devices are respectively located on the upper and lower sides of the mask assembly, and the magnetic adsorption devices are configured to generate an upward magnetic adsorption force on the masking mask, and the fine metal mask is located on the masking mask.
  • the side of the reticle facing the magnetic adsorption device is configured to generate an upward magnetic adsorption force on the masking mask.
  • FIG. 1 is a schematic diagram of some reticle components subjected to magnetic adsorption in the evaporation chamber during the evaporation process;
  • FIG. 2 is a schematic structural diagram of a frame of a reticle assembly in some exemplary embodiments
  • 3a is a schematic structural diagram of a mobile phone-type occlusion mask in some exemplary embodiments
  • 3b is a schematic structural diagram of a wear-like occlusion mask in some exemplary embodiments.
  • FIG. 4 is a schematic diagram of an assembly structure of a reticle assembly in some exemplary embodiments
  • 5a is a schematic diagram of a partial structure of a mobile phone-type occlusion mask and an FMM in some exemplary embodiments;
  • 5b is a schematic diagram of a partial structure of a wear-type occlusion mask and an FMM in some exemplary embodiments
  • FIG. 6 is a schematic diagram of a reticle assembly of some technologies during an evaporation process
  • FIG. 7 is a schematic structural diagram of the FMM in the reticle assembly of FIG. 6 generating a bulge during the evaporation process
  • FIG. 8 is a schematic diagram of the regional distribution of poor color mixing caused by the use of the reticle assembly of FIG. 6 to vaporize the light-emitting layer on the substrate substrate;
  • FIG. 9 is a schematic structural diagram of a masking mask in some exemplary embodiments.
  • FIG. 10a is a schematic diagram showing the positional relationship between the masking reticle of FIG. 9 and the partial two fine metal masks of the reticle assembly in some exemplary embodiments;
  • Figure 10b is a schematic diagram of the partial structure at E in Figure 10a;
  • FIG. 11 is a schematic structural diagram of a masking mask in other exemplary embodiments.
  • FIG. 12 is a schematic structural diagram of an evaporation apparatus in some exemplary embodiments.
  • connection means a fixed connection or a detachable connection, or integrally connected;
  • installed may be direct connection, or indirect connection through an intermediary, or internal communication between two elements.
  • parallel refers to a state where the angle formed by the two straight lines is -10° or more and 10° or less, and thus includes a state where the angle is -5° or more and 5° or less.
  • perpendicular means a state in which the angle formed by two straight lines is 80° or more and 100° or less, and therefore, the angle includes a state in which an angle of 85° or more and 95° or less is included.
  • FIG. 1 is a schematic diagram of the reticle assembly subjected to the magnetic adsorption in the evaporation chamber during the evaporation process.
  • the mask assembly is mainly composed of a frame 11 , a mask mask 12 and a fine metal mask (FMM) 13 , wherein the mask mask 12 and a plurality of fine metal masks 13 are welded on the frame 11 , the masking mask 12 is mainly used to support the fine metal mask 13 and define the evaporation area of the base substrate 20 , and the fine metal mask 13 is supported on the masking mask 12 .
  • FMM fine metal mask
  • the base substrate 20 is placed above the reticle assembly, and the reticle 12 of the reticle assembly is subjected to the magnetic adsorption action of the magnetic adsorption device in the evaporation chamber (the line with the arrow in FIG. 1 represents the magnetic force.
  • the magnetic force of the adsorption device drives the fine metal mask 13 to attach to the base substrate 20 .
  • the thickness of the fine metal mask 13 is much thinner than that of the shadow mask 12, so the self-weight and magnetic adsorption strength of the shadow mask 12 are much larger than those of the fine metal mask 13. Therefore, during the evaporation process, The magnetic force and self-weight of the fine metal mask 13 itself can be ignored, and it can be considered that the shield mask 12 drives the fine metal mask 13 to attach to the base substrate 20 mainly.
  • FIG. 2 is a schematic structural diagram of a frame of a reticle assembly.
  • the frame 11 may include four borders, and the frame 11 has a rectangular frame structure.
  • the four sides of the shielding mask 12 are respectively welded on the four borders of the frame 11 , and the shielding mask 12 is provided with a plurality of openings 121 (shown in the examples of FIG. 3 a and FIG. 3 b ), and the plurality of openings 121 are respectively used to define a plurality of vapor deposition areas (display areas) of the base substrate 20 , and the shape of the opening 121 of the shielding mask 12 is the same as that of the vapor deposition area of the base substrate 20 .
  • the display area of mobile phone products is generally rectangular, and the shape of the opening 121 of the mask 12 is correspondingly rectangular, and the display area of some watch products is circular, so the shape of the opening 121 of the mask 12 is blocked. Correspondingly round.
  • FIG. 3 a is a schematic structural diagram of a mobile phone type shielding mask
  • FIG. 3 b is a structural schematic diagram of a wearable type shielding mask.
  • the masking mask (which may be referred to as a mobile phone masking mask) 12 having a rectangular opening may include a support plate, and the support plate is provided with a plurality of rectangular openings 121, and the plurality of rectangular openings 121 may be Arranged in an array, the number and arrangement of the rectangular openings 121 can be set as required.
  • the masking mask 12 with the opening shape of a rectangle may include a plurality of support bars spaced along a first direction (which may be the width direction of the masking mask 12 ) and a second direction (which may be the masking mask)
  • the length direction of the stencil 12) is a plurality of shielding strips arranged at intervals, each shielding strip may extend along the first direction, and each supporting strip may extend along the second direction, and the plurality of supporting strips and the plurality of shielding strips intersect so as to A plurality of rectangular openings are formed. As shown in FIG.
  • the masking mask (which may be called a wearable masking mask) 12 with a circular opening may include a support plate, and a plurality of circular openings 121 are formed on the support plate.
  • the 121 can be arranged in an array, and the number and arrangement of the circular openings 121 can be set as required.
  • FIG. 4 which is a schematic view of the assembly structure of the reticle assembly 10 , there are two FMMs 13 not shown in FIG. Part of stencil 12.
  • the four sides of the shielding mask 12 are respectively welded on the four borders of the frame 11 .
  • the FMM 13 can be a long sheet-like structure, the FMM includes a long sheet-like mask version body, and the mask version body is provided with a mask pattern area 131, and the mask pattern area 131 can be an integral area.
  • the mask version body may be provided with a plurality of mask pattern regions, each of which is exposed by a corresponding one of the openings 121 that shield the mask plate 12 .
  • Each FMM 13 can extend along the width direction of the masking mask 12, a plurality of FMMs 13 are arranged in parallel along the length direction of the masking mask 12, and the plurality of FMMs 13 are supported on the masking mask 12 and have two ends respectively. Welded with the opposite two borders of the frame 11 .
  • the number of the openings 121 of the mask mask 12 of the mask assembly may be the same as the number of display panels formed in one process.
  • the masking mask 12 can be welded to the frame 11 first, and then the plurality of FMMs 13 can be welded to the frame 11 one by one.
  • FIG. 5a is a schematic diagram of a partial structure of a mobile phone-type occlusion mask and the FMM
  • FIG. 5b is a schematic diagram of a partial structure of a wearable occlusion mask and the FMM.
  • the openings 121 of the mobile phone shielding mask 12 are relatively large, and one FMM 13 usually covers a row of openings 121 of the mobile phone shielding mask 12 (a column of openings 121 in FIG. 5a includes three openings 121 ).
  • the openings 121 of the wearable mask 12 are small, and one FMM 13 usually covers two or more columns of openings 121 (one column of openings 121 in FIG. 5b includes nine openings 121).
  • the base substrate 20 is fixed above the mask assembly by a fixing device 30 , using the magnetic adsorption method to make the masking mask 12 of the mask assembly drive the FMM 13 to be attached to the base substrate 20 upward.
  • the circumferential edge of the shielding reticle 12 is welded and fixed to the frame 11 through the lap joint, and the shielding reticle 12 includes a region A in the middle, a region B near the circumferential edge, and a region located in the region A. Area C between A and B.
  • the masking mask 12 of the mask assembly is a wearable masking mask, as shown in Fig. 6 and Fig. 7 .
  • the area of the FMM 13 of the stencil assembly corresponding to the area B of the wearing type occlusion mask 12 is wrinkled M (shown in FIG. 6 ), and a bulge N (shown in FIG. 7 ) is formed, causing the wrinkled area of the FMM 13 to be closely related to the lining.
  • the alignment of the base substrate 20 is uneven, the vapor deposition accuracy is deteriorated, and defects such as color mixing are caused.
  • FIG. 8 shows the distribution positions of poor color mixing of the base substrates of some wearable products.
  • the poor color mixing of the base substrates 20 of wearable products is mainly concentrated in the area 21 of the base substrate 20 near the circumferential edge, which is different from the wearable products.
  • Region B of the occlusion-like reticle 12 corresponds.
  • the shielding mask 12 of the mask assembly adopts the mobile phone shielding mask.
  • the prepared The substrate substrate of mobile phone products does not have the above-mentioned problem of poor color mixing of the substrate substrate of wearable products.
  • the area corresponding to the area B of the mobile phone mask mask 12 of the FMM 13 of the mask assembly does not have wrinkles or bulges. Phenomenon.
  • the FMM When the light-emitting layer of the RGB pixel of the base substrate of the wearable product is formed by evaporation, the FMM is wrinkled, resulting in poor color mixing of the base of the wearable product, and when the light-emitting layer of the RGB pixel of the base substrate of the mobile phone is formed by evaporation, the FMM There is no wrinkle, and there is no poor color mixing of the base substrate of the mobile phone product substrate substrate.
  • the inventor of the present application considers that it is because the wearable type masking mask and the mobile phone type masking mask are mixed. Due to the difference in structure:
  • the shape of the opening 121 of the mobile phone type shielding mask 12 is a rectangle.
  • the shape of the opening 121 of the wearable type shielding mask 12 is a circle.
  • the total area of the opening area of the wearable mask mask with a circular opening shape is small.
  • the total opening area of the masking mask with a rectangular opening used in the manufacture of 7-inch mobile phone products accounts for about 78% of the area of the entire masking mask, while the opening shape of the 1.3-inch watch products is circular.
  • the total area of the opening area of the masking mask is about 50% of the area of the entire masking mask.
  • the mobile phone type masking mask and the wearable masking mask have a larger self-weight, and the effective area of magnetic adsorption (that is, the masking mask The skeleton area) has a larger area, and the magnetic adsorption strength is greater than that of the mobile phone type occlusion mask.
  • the opening 121 of the mobile phone mask 12 is relatively large, one FMM 13 usually covers a row of openings 121 of the mobile phone mask 12 , and the magnetic adsorption effective area 122 of the mobile phone mask 12 is (shown in Figure 3a) the bonding area with the FMM 13 is less.
  • the mask pattern area 131 of each FMM 13 is hardly affected by the magnetic adsorption effective area of the mobile phone type shielding mask 12, that is, the mobile phone type shielding mask
  • the plate 12 hardly restricts the flow spreading of the FMM 13 in the mask pattern area 131 . As shown in FIG.
  • the openings 121 of the wearable mask 12 are relatively small, one FMM 13 usually covers two or more columns of openings 121, and the magnetic adsorption effective area 122 of the wearable mask 12 (FIG. 3b)
  • the bonding area with the FMM 13 is large, and the mask pattern area 131 of each FMM 13 will be affected by the magnetic adsorption effective area of the wearable mask 12 .
  • the area B of the shielding reticle 12 is close to the position where the shielding reticle 12 is welded and fixed to the frame 11 .
  • the area B of the shielding reticle 12 is simultaneously constrained by the welding and fixing and magnetic force Due to the adsorption effect, the area A and the area C of the mask 12 are hardly restricted by welding.
  • the mobile phone mask components mask components using mobile phone mask masks
  • wearable mask components masks using wear mask masks
  • the areas A and C of the masking mask 12 first drive the FMM 13 to attach to the base substrate 20.
  • the FMMs 13 at the areas A and C of the masking mask 12 are wrinkled, they are usually It will flow and stretch to the area B of the shielding mask 12 that has not been attached for the time being. Therefore, usually, the FMM 13 at the area A and the area C of the shielding mask 12 is in a better bonding state with the base substrate 20, and the vapor deposition Accuracy is accurate.
  • the mask pattern area of each FMM is less affected by the magnetic adsorption effective area of the mobile phone type masking mask, even if the FMM at the area B of the mobile phone type masking mask is less affected.
  • the mask pattern area of each FMM is greatly affected by the magnetic adsorption effective area of the wearable masking mask.
  • the area B of the wearable masking mask drives the FMM and the After the substrate and substrate are attached, the FMM is fixed between the substrate substrate and the magnetic adsorption effective area of the wearable masking mask.
  • the magnetic adsorption effective area of the wearable masking mask will block the wearable masking mask.
  • the wrinkles generated in the mask pattern area of the FMM at the area B spread out and flow to the periphery, thereby forming bulges, resulting in deviations in the alignment between the wrinkled area of the FMM and the substrate, and the evaporation accuracy deteriorates, causing color mixing and other defects.
  • the masking mask 12 includes a plate body, and the plate body includes a first surface , the first surface of the board body is set to support a plurality of fine metal masks 13 of the mask assembly, the board body is provided with a plurality of openings 121, and the openings 121 are set to expose the fine metal
  • the shielding reticle 12 of the reticle assembly is arranged such that the first surface of the second region 42 of the shielding reticle 12 is protruded from the first surface of the first region 41 , and is arranged in the first region 41
  • a support portion is provided on the first surface of the second region 42, and the support portion is configured to jointly support a plurality of fine metal masks 13 of the reticle assembly with the first surface of the second region 42, so, in some exemplary embodiments , during the evaporation process of the mask assembly using the masking mask 12 of the embodiment of the present disclosure, the second area 42 of the masking mask 12 first drives the second area 42 under the magnetic adsorption in the evaporation chamber.
  • the plurality of fine metal masks 13 at the second region 13 are attached to the base substrate 20, and after the second region 42 of the masking mask 12 is attached to the plurality of fine metal masks 13 at the second region 42, the mask is masked.
  • the first area 41 of the plate 12 drives the fine metal masks 13 at the first area 41 (the number of the fine metal masks 13 at the first area 41 is one or more) to be attached to the base substrate 20 .
  • the second area 42 of the shielding mask 12 first drives the plurality of fine metal masks 13 in the second area 42 to attach to the base substrate 20 , even if the plurality of fine metal masks 13 in the second area 42 are attached to the base substrate 20 .
  • the metal mask 13 has wrinkles, and the wrinkles usually flow and stretch to the first area 41 of the mask mask 12 that has not been attached yet, so the multiple fine metal masks at the second area 42 of the mask mask 12 are masked.
  • the stencil 13 usually does not appear wrinkled, and fits well with the base substrate 20.
  • the area of the base substrate 20 corresponding to the second area 42 of the reticle 12 is more accurate in evaporation deposition accuracy, and it is not easy to appear mixed color, etc. bad.
  • the first side surface of the fine metal mask 13 at the first area 41 is (The first side of the fine metal mask 13 faces the first surface of the plate body that shields the mask 12) is supported on the support part of the first area 41 and on the first surface of the second area 42.
  • the first There is a gap between the first side of the fine metal mask 13 at a region 41 and the first surface of the first region 41 of the mask mask 12 , and the gap can make the fine metal mask at the first region 41
  • the plate 13 flows and stretches, that is, blocking the first surface of the first region 41 of the mask plate 12 will not restrict the flow of wrinkles occurring in the mask pattern region 131 of the fine metal mask plate 13 at the first region 41 , so that the flow of wrinkles can be improved.
  • the wrinkles of the fine metal mask 13 at the first area 41 are reduced, so that the fine metal mask 13 and the base substrate 20 are well attached, and the positional accuracy of the fine metal mask 13 relative to the base substrate 20 is improved, thereby It is possible to reduce the occurrence of poor color mixing in the area of the base substrate 20 corresponding to the first area 41 of the shielding mask 12 .
  • the thickness of the first region 41 is smaller than the thickness of the second region 42 .
  • the first region 41 may be formed by etching and thinning a region of the first surface of the plate body of the shielding mask 12 close to the circumferential edge through an etching process. In order to prevent defects such as cutting through, the deepest etching depth may be less than 1/3 of the overall thickness of the board.
  • the thickness of the second region 42 is d, and the thickness of the first region 41 may be greater than or equal to 2d/3 less than d.
  • a plurality of unetched portions remain in the first region 41, and the plurality of unetched portions may be the support portions.
  • the thickness of the first region 41 is smaller than the thickness of the second region 42, so that the first region 41 of the mask 12 has better flexibility and stretchability than the second region 42, which is more beneficial to the first region 41.
  • the stretch flow of the fine metal mask 13 at the area 41 reduces the generation of wrinkles.
  • the support portion includes a plurality of first-direction support portions 51 , and the first-direction support portions 51 are arranged to extend along a first direction; the plurality of first-direction support portions 51 are provided.
  • the direction support part 51 includes a plurality of first support parts 511, the first support parts 511 are arranged to correspond to the boundary positions between two adjacent fine metal masks 13 of the mask assembly, and are arranged To support one side of each fine metal mask 13 of the two adjacent fine metal masks 13 .
  • the first direction is the width direction of the plate body.
  • the plurality of first support parts 511 are symmetrically arranged with respect to the center line in the longitudinal direction of the plate body.
  • the lengths of the plurality of first support parts 511 may be the same or different.
  • One ends of the plurality of first support parts 511 may extend to the boundary between the first area 41 and the second area 42 .
  • the first direction support portion 51 is flush with the first surface of the second region 42 , so that the fine metal mask 13 can be supported more uniformly .
  • the width of the first support portion 511 is 0.5 mm to 2 mm.
  • the width of the first support portion 511 is very narrow and the area is very small, the magnetic force received during the evaporation process is very weak, and the blocking and limiting effect on the fine metal mask 13 is also weak, which can be basically ignored and will not affect the fine metal mask.
  • the flow of the folds of the plate 13 is stretched, and during the evaporation process, the first support portion 511 can jointly support the fine metal mask 13 with the first surface of the second region 42, so that the fine metal mask 13 and the first region 42 can be supported.
  • FIG. 10a is a schematic diagram of the positional relationship between the masking mask 12 of FIG. 9 and the two fine metal masks 13 in the part of the mask assembly. As shown in FIG. 10a, the two fine metal masks The metal mask 13 is supported on the first surface of the plate body that shields the mask 12 . The plurality of openings 121 of the mask mask 12 expose the mask pattern regions 131 of the fine metal mask 13 .
  • FIG. 10b is a schematic diagram of the partial structure at E in FIG. 10a.
  • the width of the first support portion 511 is greater than the width L of the gap between two adjacent fine metal masks 13 of the mask assembly, and the mask Corresponding two sides of two adjacent fine metal masks 13 of the plate assembly are supported on the first support portion 511 .
  • the plurality of first direction support parts 51 may further include a second support part 512 , and the second support part 512 is configured to support the reticle assembly. Sides of the fine metal reticle 13 located at the ends close to the respective ends of the reticle assembly.
  • two second support parts 512 are provided, and the two second support parts 512 are respectively located at both ends of the plate body in the length direction, and one of the second support parts 512 is arranged to support one side of the fine metal mask 13 near the first end of the reticle assembly, and another second support 512 is arranged to support the fine metal mask 13 near the second end of the reticle assembly one side of .
  • the support part further includes a plurality of second direction support parts 52 , the second direction support parts 52 are arranged to extend in a second direction, the second direction perpendicular to the first direction; the plurality of second direction support parts 52 are arranged in the regions of the first region 41 located at both ends of the length direction of the plate body, the length direction of the plate body is the same as that of the plate body.
  • the second direction is parallel.
  • the provision of the second direction support portion 52 can make the shielding mask 12 bear a relatively large net tension, and can ensure that the sagging amount of the shielding mask 12 is within the control range.
  • FIG. 9 the support part further includes a plurality of second direction support parts 52 , the second direction support parts 52 are arranged to extend in a second direction, the second direction perpendicular to the first direction; the plurality of second direction support parts 52 are arranged in the regions of the first region 41 located at both ends of the length direction of the plate body, the length direction of the plate body is the same as that of the plate body.
  • the extending direction of the second direction support portion 52 and the extending direction of the first direction support portion 51 may be perpendicular.
  • Adjacent two second direction support portions 52 may be disposed at intervals of a plurality of openings 121 (in this example, six openings 121 are separated).
  • One ends of the plurality of second direction support portions 52 may extend to the boundary between the first area 41 and the second area 42 .
  • the second direction support portion 52 can be flush with the first surface of the second area 42 , so that the second direction support portion 52 can be aligned with the first surface of the second area 42 .
  • a surface collectively supports the plurality of fine metal masks 13 .
  • the second area 42 includes a first sub-area 421 close to the first area 41 and a second sub-area surrounded by the first sub-area 421 422; in the direction perpendicular to the plate body, the first surface of the second sub-region 422 protrudes from the first surface of the first sub-region 421, and the first surface of the first sub-region 421 Protruding from the first surface of the first region 41 ; in the direction perpendicular to the plate body, the first direction support portion 51 is flush with the first surface of the second sub-region 422 .
  • the reticle assembly using the reticle 12 of the present embodiment shields the second sub-region 422 of the reticle 12 under the action of magnetic attraction in the evaporation chamber during the evaporation process.
  • the first sub-region 421 and the first region 41 can successively drive the fine metal mask 13 at the corresponding region to attach to the substrate substrate 20, and the fine metal mask 13 at the second sub-region 422 is in contact with the substrate. Even if wrinkles occur during the lamination process of the substrate 20 , they will stretch and flow to the first sub-region 421 , so the fine metal mask 13 at the second sub-region 422 is not prone to wrinkles.
  • the first sub-region 421 and the first region 41 drive the fine metal mask 13 at the corresponding region to attach the fine metal mask 13 to the base substrate 20 , the fine metal mask 13 at the first sub-region 421 and the first region 41 Both can be supported on the first direction support portion 51 and the first surface of the second sub-area 422.
  • the first side surface of the fine metal mask 13 at the first sub-area 421 and the first area 41 and the shadow mask There are gaps between the first surfaces of the corresponding regions of the stencil 12, and the gap can make the fine metal mask 13 at the first sub-region 421 and the first region 41 flow and stretch better, reducing the generation of wrinkles, Therefore, it is possible to reduce the occurrence of poor color mixing in the corresponding regions of the base substrate 20 and the first sub-region 421 and the first region 41 of the shielding mask 12 .
  • the thickness of the second sub-region 422 is greater than that of the first sub-region 421 , and the thickness of the first sub-region 421 is greater than that of the first region 41 thickness of.
  • the thickness of the second sub-region 422 is a
  • the thickness of the first sub-region 421 is b
  • the thickness of the first region 41 is c, where a/2 ⁇ b ⁇ a, b/2 ⁇ c ⁇ b.
  • the first surface of the plate body of the shielding mask 12 may be etched and thinned in sub-regions through an etching thinning process, so as to form the second sub-section of the plate body of the shielding mask 12
  • the thickness of the region 422 , the first sub-region 421 and the first region 41 , and the thickness of the second sub-region 422 , the first sub-region 421 and the first region 41 and the protruding height of the first surface are all different.
  • the thicknesses of the second sub-region 422, the first sub-region 421 and the first region 41 become smaller in sequence, so that the magnetic attraction effect on the second sub-region 422, the first sub-region 421 and the first region 41 also becomes smaller in sequence.
  • the first sub-region 421 and the first region 41 can slowly drive the fine metal mask 13 at the corresponding region to adhere to the base substrate 20 , which is beneficial to the first sub-region 421 And the slow stretching of the fine metal mask 13 at the first region 41 is more conducive to reducing the generation of wrinkles.
  • the support portion of the first region 41 may extend into the first sub-region 421 , for example, the plurality of first direction support portions 51 of the first region 41
  • the plurality of first support parts 511 in the above-described first sub-region 421 may extend into the first sub-region 421 and may extend to the boundary between the first sub-region 421 and the second sub-region 422 .
  • the first direction support portion 51 is flush with the first surface of the second sub-region 422 . In this way, the support of the fine metal mask 13 by the first direction supporting portion 51 and the first surface of the second sub-region 422 will be more uniform.
  • the first sub-region 421 and the first The gap between the first side of the fine metal mask 13 at the region 41 and the first surface of the corresponding region of the mask mask 12 is more uniform, which is beneficial to reduce the wrinkles in the first sub-region 421 and the first region 41. produce.
  • the plurality of the second direction support parts 52 of the first region 41 may extend into the first sub-region 421 and may extend into the first sub-region 421 at the boundary with the second sub-region 422 .
  • the second direction support portion 52 in a direction perpendicular to the plate body, is flush with the first surface of the second sub-region 422 .
  • the second direction support portion 52 can provide support for the fine metal mask 13 at the corresponding area, and the support of the fine metal mask 13 by the masking mask 12 will be more uniform, so that the masking mask 13 can be supported more uniformly.
  • a more uniform gap is maintained between the first surface of the stencil 12 and the fine metal mask 13 , which is beneficial to reduce the generation of wrinkles of the fine metal mask 13 .
  • the width W of the first region 41 along the length direction of the plate body is equal to the width of one or more of the fine metal masks 13 , so
  • the length direction of the plate body can be perpendicular to the first direction, that is, the length direction of the plate body can be perpendicular to the extension direction of the first direction support part 51, and the extension direction of the first direction support part 51 can be perpendicular to the fine metal mask.
  • the longitudinal direction of the stencil 13 is parallel. In the example of FIG. 9 , it can be considered that the width W of the first region 41 along the length direction of the board is equal to the width of one fine metal mask 13 , and one fine metal mask 13 can cover two Column opening 121 .
  • the shape of the opening 121 may be a circle, the shape of the outer contour of the plate body of the shielding mask 12 may be a rectangle, and the plurality of openings 121 may be multiple A multi-column array arrangement.
  • the second area 42 is rectangular, and the peripheral edge of the first area 41 may extend to the four sides of the plate body that shields the mask 12 .
  • the shape of the opening 121 may be oval, polygonal, or irregular.
  • the peripheral edge of the plate body of the shielding mask 12 may be provided with overlapping parts 123 , and the overlapping parts 123 are configured to overlap and be fixed on the mask. on the frame 11 of the stencil assembly.
  • the four sides of the board body of the shielding mask 12 are provided with a plurality of protruding parts protruding toward the outside of the board body, and the plurality of protruding parts are the overlapping parts 123 .
  • the plurality of protrusions on the four sides of the board body can be overlapped and welded on the four borders of the frame 11 .
  • Embodiments of the present disclosure further provide a mask assembly, including the masking mask 12 described in any of the foregoing embodiments, a frame 11 and a plurality of fine metal masks 13 .
  • a mask assembly including the masking mask 12 described in any of the foregoing embodiments, a frame 11 and a plurality of fine metal masks 13 .
  • an overlap portion 123 (shown in FIG. 11 ) is provided on the circumferential edge of the plate body of the shielding mask 12 , and the overlap portion 123 overlaps and is fixed on the On the frame 11, both ends of the fine metal mask 13 are fixed on two opposite frames of the frame 11, and the first sides of the plurality of fine metal masks 13 face the edge of the board. first surface.
  • the length direction of the fine metal mask 13 and the width direction of the shadow mask 12 may be parallel.
  • Embodiments of the present disclosure further provide an evaporation device.
  • the evaporation device includes an evaporation chamber, and an evaporation source 60 disposed in the evaporation chamber.
  • the reticle assembly and the magnetic adsorption device 70 described in any of the embodiments; the evaporation source 60 and the magnetic adsorption device 70 are respectively located on the upper and lower sides of the reticle assembly, and the magnetic adsorption device 70 is provided
  • the fine metal mask 13 is located on the side of the masking mask 12 facing the magnetic attraction device 70 .
  • the masking mask 12 can drive the fine metal mask 13 to be attached to the base substrate 20 upward, and the evaporation material in the evaporation source 60 is heated to form vapor. Then, through the opening 121 of the mask 12 and the mask pattern area 131 of the fine metal mask 13 to deposit on the predetermined area of the base substrate 20, a film layer with a corresponding pattern is formed on the base substrate 20, In addition, poor color mixing in the edge region of the base substrate 20 can be reduced.

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Abstract

一种遮挡掩膜版、掩膜版组件及蒸镀装置，所述遮挡掩膜版包括板体，所述板体包括第一表面，所述板体的第一表面设置为支撑所述掩膜版组件的多个精细金属掩膜版，所述板体设有多个开口，所述开口设置为暴露所述精细金属掩膜版的掩膜图案区；所述板体包括靠近周向边缘的第一区域和被所述第一区域包围的第二区域，在垂直于所述板体的方向上，所述第二区域的第一表面凸出于所述第一区域的第一表面；所述第一区域的第一表面上设有支撑部，所述支撑部避开所述开口，所述支撑部设置为能够与所述第二区域的第一表面共同支撑所述多个精细金属掩膜版。

Description

遮挡掩膜版、掩膜版组件及蒸镀装置 技术领域
本公开实施例涉及但不限于显示技术领域，具体涉及一种遮挡掩膜版、掩膜版组件及蒸镀装置。
背景技术
有机电致发光二极管(OLED)显示面板制造技术中，OLED器件的发光层等有机膜层主要采用真空蒸镀工艺制作。真空蒸镀工艺中用到的掩膜版组件主要由框架(Frame)、遮挡掩膜版(Full mask sheet)和精细金属掩膜版(FMM)组装而成，其中，遮挡掩膜版和多个精细金属掩膜版均焊接在框架上，遮挡掩膜版主要用于支撑精细金属掩膜版和限定衬底基板的蒸镀区域，精细金属掩膜版支撑在遮挡掩膜版上。蒸镀过程中，将衬底基板与精细金属掩膜版贴合，蒸镀源中的蒸镀材料受热形成蒸气后通过精细金属掩膜版的掩膜图案区沉积在衬底基板的预设区域，从而在衬底基板上形成相应图案的膜层。
一些技术中，在蒸镀腔室内设置磁力吸附装置，掩膜版组件受到磁力吸附装置的磁力吸附作用会使精细金属掩膜版与衬底基板紧密贴合，以保证蒸镀材料准确地蒸镀到衬底基板的预设区域。但是，在蒸镀过程中精细金属掩膜版容易产生褶皱，导致蒸镀精度变差，引起混色等不良。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本公开实施例提供一种掩膜版组件的遮挡掩膜版，所述遮挡掩膜版包括板体，所述板体包括第一表面，所述板体的第一表面设置为支撑所述掩膜版组件的多个精细金属掩膜版，所述板体设有多个开口，所述开口设置为暴露所述精细金属掩膜版的掩膜图案区；所述板体包括靠近周向边缘的第一区域和被所述第一区域包围的第二区域，在垂直于所述板体的方向上，所述第二区域的第一表面凸出于所述第一区域的第一表面；所述第一区域的第一表面 上设有支撑部，所述支撑部避开所述开口，所述支撑部设置为能够与所述第二区域的第一表面共同支撑所述多个精细金属掩膜版。
本公开实施例还提供一种掩膜版组件，包括所述的遮挡掩膜版、框架和多个精细金属掩膜版；所述板体的周向边缘设有搭接部，所述搭接部搭接并固定在所述框架上，所述精细金属掩膜版的两端固定在所述框架的相对的两个边框上，所述多个精细金属掩膜版的第一侧面朝向所述板体的第一表面。
本公开实施例还提供一种蒸镀装置，包括蒸镀腔室，以及设于所述蒸镀腔室内的蒸镀源、所述的掩膜版组件和磁力吸附装置；所述蒸镀源和所述磁力吸附装置分别位于所述掩膜版组件的上下两侧，所述磁力吸附装置设置为对所述遮挡掩膜版产生向上的磁吸附力，所述精细金属掩膜版位于所述遮挡掩膜版的朝向所述磁力吸附装置的一侧。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图说明
附图用来提供对本公开技术方案的进一步理解，并且构成说明书的一部分，与本公开的实施例一起用于解释本公开的技术方案，并不构成对本公开技术方案的限制。
图1为一些掩膜版组件在蒸镀过程中受蒸镀腔室内的磁力吸附作用的示意图；
图2为在一些示例性实施例中掩膜版组件的框架的结构示意图；
图3a为在一些示例性实施例中手机类遮挡掩膜版的结构示意图；
图3b为在一些示例性实施例中穿戴类遮挡掩膜版的结构示意图；
图4为在一些示例性实施例中掩膜版组件的装配结构示意图；
图5a为在一些示例性实施例中手机类遮挡掩膜版与FMM贴合的局部结构示意图；
图5b为在一些示例性实施例中穿戴类遮挡掩膜版与FMM贴合的局部结构示意图；
图6为一些技术的掩膜版组件在蒸镀过程中的示意图；
图7为图6的掩膜版组件中的FMM在蒸镀过程中产生鼓包的结构示意图；
图8为采用图6的掩膜版组件蒸镀发光层的衬底基板产生的混色不良的区域分布示意图；
图9为在一些示例性实施例中遮挡掩膜版的结构示意图；
图10a为在一些示例性实施例中图9的遮挡掩膜版与掩膜版组件的局部的两个精细金属掩膜版的位置关系示意图；
图10b为图10a中E处的局部结构示意图；
图11为在另一些示例性实施例中遮挡掩膜版的结构示意图；
图12为在一些示例性实施例中蒸镀装置的结构示意图。
具体实施方式
本领域的普通技术人员应当理解，可以对本公开实施例的技术方案进行修改或者等同替换，而不脱离本公开实施例技术方案的精神和范围，均应涵盖在本公开的权利要求范围当中。
在本文的描述中，术语“上”、“下”、“左”、“右”、“顶”、“内”、“外”、“轴向”、“四角”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开实施例的简化描述，而不是指示或暗示所指的结构具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
在本文的描述中，除非另有明确的规定和限定，术语“连接”、“固定连接”、“安装”、“装配”应做广义理解，例如，可以是固定连接，或者是可拆卸连接，或一体地连接；术语“安装”、“连接”、“固定连接”可以是直接相连，或是通过中间媒介间接相连，或是两个元件内部的连通。对于本领域的普通技术人员而言，可以理解上述术语在本文中的含义。
在本文的描述中，“平行”是指两条直线形成的角度为-10°以上且10°以下的状态，因此，包括该角度为-5°以上且5°以下的状态。另外，“垂直”是指两条直线形成的角度为80°以上且100°以下的状态，因此，该角度包括85°以上且95°以下的角度的状态。
如图1所示，图1为掩膜版组件在蒸镀过程中受蒸镀腔室内的磁力吸附作用的示意图。掩膜版组件主要由框架11、遮挡掩膜版12和精细金属掩膜版(FMM)13组装而成，其中，遮挡掩膜版12和多个精细金属掩膜版13均焊接在框架11上，遮挡掩膜版12主要用于支撑精细金属掩膜版13和限定衬底基板20的蒸镀区域，精细金属掩膜版13支撑在遮挡掩膜版12上。蒸镀过程中，衬底基板20置于掩膜版组件上方，掩膜版组件的遮挡掩膜版12在蒸镀腔室内受到磁力吸附装置的磁力吸附作用(图1中的带箭头直线表示磁力吸附装置的磁力)而带动精细金属掩膜版13与衬底基板20贴合。一般地，精细金属掩膜版13的厚度比遮挡掩膜版12薄得多，则遮挡掩膜版12的自重和磁力吸附强度远大于精细金属掩膜版13，因此，在蒸镀过程中，可以忽略精细金属掩膜版13本身的磁力影响和自重，可认为主要是遮挡掩膜版12带动精细金属掩膜版13与衬底基板20贴合。
在一些示例性实施例中，图2为掩膜版组件的框架的结构示意图，如图2所示，所述框架11可以包括四个边框，框架11呈矩形框结构。所述遮挡掩膜版12的四个侧边分别焊接在框架11的四个边框上，遮挡掩膜版12设有多个开口121(图3a和图3b的示例中示出)，多个开口121分别用于限定衬底基板20的多个蒸镀区域(显示区域)，遮挡掩膜版12的开口121的形状与衬底基板20的蒸镀区域的形状相同。比如，手机类产品的显示区域一般为矩形，则遮挡掩膜版12的开口121的形状相应地为矩形，一些手表类产品的显示区域为圆形，则遮挡掩膜版12的开口121的形状相应地为圆形。
在一些示例性实施例中，图3a为手机类遮挡掩膜版的结构示意图，图3b为穿戴类遮挡掩膜版的结构示意图。如图3a所示，开口形状为矩形的遮挡掩膜版(可称为手机类遮挡掩膜版)12可以包括支撑板，支撑板上开设有多个矩形的开口121，多个矩形开口121可以呈阵列排布，矩形开口121的数目和排布方式可以根据需要设置。在其他示例中，开口形状为矩形的遮挡掩膜版12可以包括沿第一方向(可以是遮挡掩膜版12的宽度方向)间隔设置的多个支撑条和沿第二方向(可以是遮挡掩膜版12的长度方向)间隔设置的多个遮蔽条，每个遮蔽条可均沿第一方向延伸，每个支撑条可均沿第二方向延伸，多个支撑条和多个遮蔽条相交从而形成多个矩形开口。如图3b所示， 开口形状为圆形的遮挡掩膜版(可称为穿戴类遮挡掩膜版)12可以包括支撑板，支撑板上开设有多个圆形开口121，多个圆形开口121可以呈阵列排布，圆形开口121的数目和排布方式可以根据需要设置。
在一些示例性实施例中，如图4所示，图4为掩膜版组件10的装配结构示意图，图4中有两个FMM 13未示出，未示出FMM 13的位置暴露出遮挡掩膜版12的一部分。遮挡掩膜版12的四个侧边分别焊接在框架11的四个边框上。FMM 13可以为长条片状结构，FMM包括长条片状的掩膜版本体，掩膜版本体设有掩膜图案区131，掩膜图案区131可以是一个整体区域，在其他示例中，掩膜版本体可以设有多个掩膜图案区，每个掩膜图案区被相应的一个遮挡掩膜版12的开口121暴露。每个FMM 13可均沿遮挡掩膜版12的宽度方向延伸，多个FMM 13沿遮挡掩膜版12的长度方向平行排布，多个FMM 13支撑在遮挡掩膜版12上且两端分别与框架11的相对的两个边框焊接。掩膜版组件的遮挡掩膜版12的开口121的个数可以与一次制程中形成的显示面板的个数相同。掩膜版组件10装配过程中，可以先将遮挡掩膜版12焊接在框架11上，然后将多个FMM 13逐一焊接在框架11上。
在一些示例性实施例中，图5a为手机类遮挡掩膜版与FMM贴合的局部结构示意图，图5b为穿戴类遮挡掩膜版与FMM贴合的局部结构示意图。如图5a所示，手机类遮挡掩膜版12的开口121较大，一个FMM 13通常覆盖手机类遮挡掩膜版12的一列开口121(图5a中一列开口121包括三个开口121)。如图5b所示，穿戴类遮挡掩膜版12的开口121较小，一个FMM 13通常覆盖两列或者更多列的开口121(图5b中一列开口121包括九个开口121)。
在一些示例性实施例中，如图6所示，蒸镀形成衬底基板20的RGB(红绿蓝)像素的发光层过程中，衬底基板20采用固定装置30固定在掩膜版组件上方，采用磁力吸附方式使掩膜版组件的遮挡掩膜版12带动FMM 13向上与衬底基板20贴合。一些掩膜版组件中，遮挡掩膜版12的周向边缘处通过搭接部与框架11焊接固定，遮挡掩膜版12包括位于中间的区域A、靠近周向边缘的区域B，以及位于区域A和区域B之间的区域C。蒸镀形成穿戴类产品衬底基板的RGB像素的发光层时，掩膜版组件的遮挡掩膜版12采用 穿戴类遮挡掩膜版，如图6、图7所示，蒸镀过程中发现掩膜版组件的FMM13的与穿戴类遮挡掩膜版12的区域B对应的区域产生有褶皱M(图6示出)，并形成鼓包N(图7示出)，导致FMM 13的褶皱区域与衬底基板20的对位出现偏差，蒸镀精度变差，引起混色等不良。图8示出了一些穿戴类产品衬底基板混色不良的分布位置，可以看出，穿戴类产品衬底基板20的混色不良主要集中于衬底基板20的靠近周向边缘的区域21，与穿戴类遮挡掩膜版12的区域B对应。蒸镀形成手机类产品衬底基板20的RGB(红绿蓝)像素的发光层时，掩膜版组件的遮挡掩膜版12采用手机类遮挡掩膜版，蒸镀过程中，发现所制备的手机类产品衬底基板则不存在穿戴类产品衬底基板的上述混色不良问题，此外，掩膜版组件的FMM 13的与手机类遮挡掩膜版12的区域B对应的区域没有产生褶皱、鼓包现象。
蒸镀形成穿戴类产品衬底基板的RGB像素的发光层时，FMM产生褶皱导致穿戴类产品衬底基板产生混色不良，而蒸镀形成手机类产品衬底基板的RGB像素的发光层时，FMM没有产生褶皱，且手机类产品衬底基板没有产生穿戴类产品衬底基板的混色不良，针对此现象，本申请的发明人考虑到是因为穿戴类遮挡掩膜版与手机类遮挡掩膜版的结构不同所致：
如图3a所示，手机类遮挡掩膜版12的开口121的形状为矩形，如图3b所示，穿戴类遮挡掩膜版12的开口121的形状为圆形，相较于开口形状为矩形的手机类遮挡掩膜版，开口形状为圆形的穿戴类遮挡掩膜版的开口区域总面积的占比较小。比如，制造7英寸手机类产品所用的开口形状为矩形的遮挡掩膜版的开口区域总面积约占整张遮挡掩膜版面积的78％，而制造1.3英寸手表类产品的开口形状为圆形的遮挡掩膜版的开口区域总面积约占整张遮挡掩膜版面积的50％。因此，手机类遮挡掩膜版和穿戴类遮挡掩膜版在同样大小、同样厚度和同等磁力条件下，穿戴类遮挡掩膜版的自重更大，且磁力吸附有效区(即遮挡掩膜版的骨架区域)面积更大，磁力吸附强度大于手机类遮挡掩膜版。
此外，如图5a所示，手机类遮挡掩膜版12的开口121较大，一个FMM13通常覆盖手机类遮挡掩膜版12的一列开口121，手机类遮挡掩膜版12的磁力吸附有效区122(图3a示出)与FMM 13的贴合面积较少。手机类遮挡 掩膜版12在蒸镀腔室内受到磁力吸附时，每个FMM 13的掩膜图案区131几乎不受手机类遮挡掩膜版12的磁力吸附有效区影响，即手机类遮挡掩膜版12几乎不限制FMM 13在掩膜图案区131的流动舒展。如图5b所示，穿戴类遮挡掩膜版12的开口121较小，一个FMM 13通常覆盖两列或者更多列的开口121，穿戴类遮挡掩膜版12的磁力吸附有效区122(图3b示出)与FMM 13的贴合面积较大，每个FMM 13的掩膜图案区131会受到穿戴类遮挡掩膜版12的磁力吸附有效区的影响。
如图6所示，遮挡掩膜版12的区域B靠近遮挡掩膜版12的与框架11焊接固定的位置，蒸镀过程中，遮挡掩膜版12的区域B同时受到焊接固定的约束和磁力吸附作用，遮挡掩膜版12的区域A和区域C几乎不受焊接固定的约束。蒸镀过程中，在磁力吸附作用下，手机类掩膜版组件(采用手机类遮挡掩膜版的掩膜版组件)和穿戴类掩膜版组件(采用穿戴类遮挡掩膜版的掩膜版组件)，均是遮挡掩膜版12的区域A和区域C首先带动FMM 13与衬底基板20贴合，遮挡掩膜版12的区域A和区域C与FMM 13贴合后，遮挡掩膜版12的区域B带动FMM 13与衬底基板20进行贴合。在磁力吸附作用下，遮挡掩膜版12的区域A和区域C首先带动FMM 13与衬底基板20贴合，即使遮挡掩膜版12的区域A和区域C处的FMM 13有褶皱，通常也会向暂未贴合的遮挡掩膜版12的区域B处流动舒展，因此，通常遮挡掩膜版12的区域A和区域C处的FMM 13与衬底基板20贴合状态较好，蒸镀精度准确。
如前文所述，对于手机类掩膜版组件，每个FMM的掩膜图案区受手机类遮挡掩膜版的磁力吸附有效区影响较小，即使手机类遮挡掩膜版的区域B处的FMM的掩膜图案区出现褶皱，褶皱在FMM的掩膜图案区也容易舒展流动，因此手机类掩膜版组件的FMM不易产生褶皱、鼓包现象。对于穿戴类掩膜版组件，每个FMM的掩膜图案区受穿戴类遮挡掩膜版的磁力吸附有效区影响较大，如图7所示，穿戴类遮挡掩膜版的区域B带动FMM与衬底基板贴合后，FMM被固定在衬底基板和穿戴类遮挡掩膜版的磁力吸附有效区之间，穿戴类遮挡掩膜版的磁力吸附有效区会阻挡限制穿戴类遮挡掩膜版的区域B处的FMM的掩膜图案区产生的褶皱向周边舒展流动，从而形成鼓 包，导致FMM的褶皱区域与衬底基板的对位出现偏差，蒸镀精度变差，引起混色等不良。
本公开实施例提供一种掩膜版组件的遮挡掩膜版，在一些示例性实施例中，如图9所示，所述遮挡掩膜版12包括板体，所述板体包括第一表面，所述板体的第一表面设置为支撑所述掩膜版组件的多个精细金属掩膜版13，所述板体设有多个开口121，所述开口121设置为暴露所述精细金属掩膜版13的掩膜图案区131；所述板体包括靠近周向边缘的第一区域41和被所述第一区域41包围的第二区域42，在垂直于所述板体的方向上，所述第二区域42的第一表面凸出于所述第一区域41的第一表面；所述第一区域41的第一表面上设有支撑部，所述支撑部避开所述开口121，所述支撑部设置为能够与所述第二区域42的第一表面共同支撑所述多个精细金属掩膜版13。
本公开实施例的掩膜版组件的遮挡掩膜版12，将遮挡掩膜版12的第二区域42的第一表面凸出于第一区域41的第一表面设置，并且在第一区域41的第一表面上设置支撑部，支撑部设置为能够与所述第二区域42的第一表面共同支撑掩膜版组件的多个精细金属掩膜版13，如此，在一些示例性实施例中，采用本公开实施例的遮挡掩膜版12的掩膜版组件在蒸镀过程中，在蒸镀腔室内的磁力吸附作用下，遮挡掩膜版12的第二区域42首先带动第二区域42处的多个精细金属掩膜版13与衬底基板20贴合，遮挡掩膜版12的第二区域42与第二区域42处的多个精细金属掩膜版13贴合后，遮挡掩膜版12的第一区域41会带动第一区域41处的精细金属掩膜版13(第一区域41处的精细金属掩膜版13为一个或多个)与衬底基板20进行贴合。在磁力吸附作用下，遮挡掩膜版12的第二区域42首先带动第二区域42处的多个精细金属掩膜版13与衬底基板20贴合，即使第二区域42处的多个精细金属掩膜版13出现褶皱，褶皱通常也会向暂未贴合的遮挡掩膜版12的第一区域41处流动舒展，因此遮挡掩膜版12的第二区域42处的多个精细金属掩膜版13通常不会出现褶皱，与衬底基板20贴合良好，相应地，衬底基板20的与遮挡掩膜版12的第二区域42对应的区域蒸镀精度较为准确，不易出现混色等不良。遮挡掩膜版12的第一区域41带动第一区域41处的精细金属掩膜版13与衬底基板20贴合过程中，由于第一区域41处的精细金属掩膜版13的第一侧面 (精细金属掩膜版13的第一侧面朝向遮挡掩膜版12的板体的第一表面)是支撑在第一区域41的支撑部上和第二区域42的第一表面上，因此，第一区域41处的精细金属掩膜版13的第一侧面与遮挡掩膜版12的第一区域41的第一表面之间存在有空隙，该空隙可以使第一区域41处的精细金属掩膜版13流动舒展，即遮挡掩膜版12的第一区域41的第一表面不会限制第一区域41处的精细金属掩膜版13的掩膜图案区131出现的褶皱舒展流动，由此可减少第一区域41处的精细金属掩膜版13产生褶皱，从而使精细金属掩膜版13与衬底基板20贴合良好，提高精细金属掩膜版13相对衬底基板20的位置精度，从而可以减少衬底基板20的与遮挡掩膜版12的第一区域41对应的区域出现混色不良。
在一些示例性实施例中，如图9所示，所述第一区域41的厚度小于所述第二区域42的厚度。本实施例的一个示例中，可以通过刻蚀工艺对遮挡掩膜版12的板体的第一表面的靠近周向边缘的区域进行刻蚀减薄，从而形成所述第一区域41。为防止刻穿等不良，最深的刻蚀深度可以小于整体板体厚度的1/3，在一些示例中，第二区域42的厚度为d，第一区域41的厚度可以为大于等于2d/3小于d。通过刻蚀减薄工艺形成第一区域41过程中，在第一区域41内保留多个未刻蚀部，多个未刻蚀部可以为所述支撑部。所述第一区域41的厚度小于所述第二区域42的厚度，这样，遮挡掩膜版12的第一区域41相较于第二区域42柔韧性和舒展性更好，更加有利于第一区域41处的精细金属掩膜版13的舒展流动，减少褶皱产生。
在一些示例性实施例中，如图9所示，所述支撑部包括多个第一方向支撑部51，所述第一方向支撑部51设置为沿第一方向延伸；所述多个第一方向支撑部51包括多个第一支撑部511，所述第一支撑部511设置为与所述掩膜版组件的相邻的两个精细金属掩膜版13之间的边界位置对应，并设置为支撑所述相邻的两个精细金属掩膜版13中每个精细金属掩膜版13的一个侧边。本实施例的一个示例中，所述第一方向为所述板体的宽度方向。所述第一区域41内，所述多个第一支撑部511关于所述板体的长度方向上的中心线对称设置。多个第一支撑部511的长度可以相同或者不同。多个所述第一支撑部511的一端可以延伸至所述第一区域41与所述第二区域42的边界处。在垂 直于所述板体的方向上，所述第一方向支撑部51与所述第二区域42的第一表面平齐，这样，可以对所述精细金属掩膜版13进行较为均匀的支撑。
在一些示例性实施例中，如图9所示，所述第一支撑部511的宽度为0.5mm至2mm。第一支撑部511宽度很窄，面积很小，蒸镀过程中受到的磁力非常微弱，对精细金属掩膜版13的阻挡限制作用也会很弱，基本可以忽略，不会影响精细金属掩膜版13褶皱的流动舒展，且在蒸镀过程中，第一支撑部511可以与第二区域42的第一表面共同支撑精细金属掩膜版13，可以使精细金属掩膜版13与第一区域41的第一表面之间保持更为均匀的空隙，有利于精细金属掩膜版13褶皱的流动舒展。所述第一支撑部511的截面形状可以为矩形。如图10a和图10b所示，图10a为图9的遮挡掩膜版12与掩膜版组件的局部的两个精细金属掩膜版13的位置关系示意图，如图10a所示，两个精细金属掩膜版13支撑在遮挡掩膜版12的板体的第一表面上。遮挡掩膜版12的多个开口121暴露出精细金属掩膜版13的掩膜图案区131。图10b为图10a中E处的局部结构示意图，可以看出，第一支撑部511的宽度大于掩膜版组件的相邻的两个精细金属掩膜版13之间的缝隙宽度L，掩膜版组件的相邻的两个精细金属掩膜版13的相应两个侧边支撑在第一支撑部511上。
在一些示例性实施例中，如图9所示，所述多个第一方向支撑部51还可以包括第二支撑部512，所述第二支撑部512设置为支撑所述掩膜版组件的位于端部的所述精细金属掩膜版13的靠近所述掩膜版组件的相应端的侧边。本实施例的一个示例中，如图9所示，所述第二支撑部512设置有两个，两个第二支撑部512分别位于板体的长度方向的两端，其中一个第二支撑部512设置为支撑靠近掩膜版组件的第一端的精细金属掩膜版13的一个侧边，另一个第二支撑部512设置为支撑靠近掩膜版组件的第二端的精细金属掩膜版13的一个侧边。
在一些示例性实施例中，如图9所示，所述支撑部还包括多个第二方向支撑部52，所述第二方向支撑部52设置为沿第二方向延伸，所述第二方向与所述第一方向垂直；所述多个第二方向支撑部52设置在所述第一区域41的位于所述板体的长度方向的两端的区域内，所述板体的长度方向与所述第二方向平行。设置第二方向支撑部52可以使遮挡掩膜版12承受较大的张网 拉力，可保证遮挡掩膜版12的下垂量在管控范围。本实施例的一个示例中，如图9所示，所述第二方向支撑部52的延伸方向与所述第一方向支撑部51的延伸方向可以垂直。相邻的两个第二方向支撑部52可间隔多个开口121(本示例中，间隔6个开口121)设置。多个所述第二方向支撑部52的一端可以延伸至所述第一区域41与所述第二区域42的边界处。在垂直于所述板体的方向上，所述第二方向支撑部52与所述第二区域42的第一表面可以平齐，这样，第二方向支撑部52能够与第二区域42的第一表面共同支撑所述多个精细金属掩膜版13。
在一些示例性实施例中，如图11所示，所述第二区域42包括靠近所述第一区域41的第一子区421，以及被所述第一子区421包围的第二子区422；在垂直于所述板体的方向上，所述第二子区422的第一表面凸出于所述第一子区421的第一表面，所述第一子区421的第一表面凸出于所述第一区域41的第一表面；在垂直于所述板体的方向上，所述第一方向支撑部51与所述第二子区422的第一表面平齐。这样，在一些示例中，采用本实施例的遮挡掩膜版12的掩膜版组件在蒸镀过程中，在蒸镀腔室内的磁力吸附作用下，遮挡掩膜版12的第二子区422、第一子区421和第一区域41可以先后依次带动相应区域处的精细金属掩膜版13与衬底基板20贴合，第二子区422处的精细金属掩膜版13在与衬底基板20贴合过程中即使出现褶皱也会向第一子区421处舒展流动，因此第二子区422处的精细金属掩膜版13不易产生褶皱。第一子区421和第一区域41带动相应区域处的精细金属掩膜版13与衬底基板20贴合过程中，第一子区421处和第一区域41处的精细金属掩膜版13均可以支撑在第一方向支撑部51和第二子区422的第一表面上，因此，第一子区421处和第一区域41处的精细金属掩膜版13的第一侧面与遮挡掩膜版12的相应区域的第一表面之间存在有空隙，该空隙可以使第一子区421处和第一区域41处的精细金属掩膜版13更好地流动舒展，降低褶皱的产生，从而可以减少衬底基板20的与遮挡掩膜版12的第一子区421和第一区域41的对应区域出现混色不良。
在一些示例性实施例中，如图11所示，所述第二子区422的厚度大于所述第一子区421的厚度，所述第一子区421的厚度大于所述第一区域41的厚 度。本实施例的一个示例中，第二子区422的厚度为a，第一子区421的厚度为b，第一区域41的厚度为c，其中，a/2≤b<a，b/2≤c<b。本实施例的一个示例中，可以通过刻蚀减薄工艺对遮挡掩膜版12的板体的第一表面进行分区域刻蚀减薄，从而形成遮挡掩膜版12的板体的第二子区422、第一子区421和第一区域41，且第二子区422、第一子区421和第一区域41的厚度和第一表面的凸出高度均不同。第二子区422、第一子区421和第一区域41的厚度依次变小，这样，第二子区422、第一子区421和第一区域41所受到的磁力吸附作用也依次变小，相较于第二子区422，第一子区421和第一区域41可以缓慢地带动相应区域处的精细金属掩膜版13与衬底基板20贴合，从而有利于第一子区421和第一区域41处的精细金属掩膜版13的缓慢舒展，更加有利于减少褶皱产生。
在一些示例性实施例中，如图11所示，第一区域41的支撑部可以延伸至所述第一子区421内，比如，第一区域41的多个所述第一方向支撑部51中的多个第一支撑部511可以延伸至所述第一子区421内，并可以延伸至第一子区421与第二子区422的边界处。并且，在垂直于所述板体的方向上，所述第一方向支撑部51与所述第二子区422的第一表面平齐。这样，第一方向支撑部51与所述第二子区422的第一表面对精细金属掩膜版13的支撑会更加均匀，在蒸镀过程中，可以使第一子区421处和第一区域41处的精细金属掩膜版13的第一侧面与遮挡掩膜版12的相应区域的第一表面之间的空隙更加均匀，有利于减少第一子区421和第一区域41内褶皱的产生。
在一些示例性实施例中，如图11所示，第一区域41的多个所述第二方向支撑部52可以延伸至所述第一子区421内，并可以延伸至第一子区421与第二子区422的边界处。本实施例的一个示例中，在垂直于所述板体的方向上，所述第二方向支撑部52与所述第二子区422的第一表面平齐。这样，在蒸镀过程中，第二方向支撑部52可以对相应区域处的精细金属掩膜版13提供支撑，遮挡掩膜版12对精细金属掩膜版13的支撑会更加均匀，使遮挡掩膜版12的第一表面与精细金属掩膜版13之间保持更均匀的空隙，有利于减少精细金属掩膜版13褶皱的产生。
在一些示例性实施例中，如图9所示，所述第一区域41在沿所述板体的 长度方向上的宽度W等于一个或多个所述精细金属掩膜版13的宽度，所述板体的长度方向可以与所述第一方向垂直，即所述板体的长度方向可以与第一方向支撑部51的延伸方向垂直，第一方向支撑部51的延伸方向可以与精细金属掩膜版13的长度方向平行。图9的示例中，可认为所述第一区域41在沿所述板体的长度方向上的宽度W等于一个所述精细金属掩膜版13的宽度，一个精细金属掩膜版13可覆盖两列开口121。
在一些示例性实施例中，如图9所示，所述开口121的形状可以为圆形，所述遮挡掩膜版12的板体的外轮廓形状可以为矩形，多个开口121可呈多行多列式的阵列排布。第二区域42为矩形，第一区域41的周向边缘可延伸至遮挡掩膜版12的板体的四个侧边。在其他示例中，开口121的形状可以为椭圆形、多边形或者不规则形状。
在一些示例性实施例中，如图11所示，所述遮挡掩膜版12的板体的周向边缘可以设有搭接部123，所述搭接部123设置为搭接并固定在掩膜版组件的框架11上。本实施例的一个示例中，遮挡掩膜版12的板体的四个侧边均设有多个朝向板体外侧凸出的凸出部，多个凸出部即搭接部123。板体的四个侧边的多个凸出部可以搭接并焊接在框架11的四个边框上。
本公开实施例还提供一种掩膜版组件，包括前文任一实施例所述的遮挡掩膜版12、框架11和多个精细金属掩膜版13。在一些示例中，如图4所示，所述遮挡掩膜版12的板体的周向边缘设有搭接部123(图11示出)，所述搭接部123搭接并固定在所述框架11上，所述精细金属掩膜版13的两端固定在所述框架11的相对的两个边框上，所述多个精细金属掩膜版13的第一侧面朝向所述板体的第一表面。所述精细金属掩膜版13的长度方向与所述遮挡掩膜版12的宽度方向可以平行。
本公开实施例还提供一种蒸镀装置，在一些示例中，如图12所示，所述蒸镀装置包括蒸镀腔室，以及设于所述蒸镀腔室内的蒸镀源60、前文任一实施例所述的掩膜版组件和磁力吸附装置70；所述蒸镀源60和所述磁力吸附装置70分别位于所述掩膜版组件的上下两侧，所述磁力吸附装置70设置为对所述遮挡掩膜版12产生向上的磁吸附力，所述精细金属掩膜版13位于所述遮挡掩膜版12的朝向所述磁力吸附装置70的一侧。
蒸镀过程中，在磁力吸附装置70的磁力吸附作用下，遮挡掩膜版12可以带动精细金属掩膜版13向上与衬底基板20贴合，蒸镀源60中的蒸镀材料受热形成蒸气后通过遮挡掩膜版12的开口121，并通过精细金属掩膜版13的掩膜图案区131沉积在衬底基板20的预设区域，从而在衬底基板20上形成相应图案的膜层，并且可以减少衬底基板20的边缘区域的混色不良。

Claims (18)

  1. 一种掩膜版组件的遮挡掩膜版，所述遮挡掩膜版包括板体，所述板体包括第一表面，所述板体的第一表面设置为支撑所述掩膜版组件的多个精细金属掩膜版，所述板体设有多个开口，所述开口设置为暴露所述精细金属掩膜版的掩膜图案区；
    所述板体包括靠近周向边缘的第一区域和被所述第一区域包围的第二区域，在垂直于所述板体的方向上，所述第二区域的第一表面凸出于所述第一区域的第一表面；
    所述第一区域的第一表面上设有支撑部，所述支撑部避开所述开口，所述支撑部设置为能够与所述第二区域的第一表面共同支撑所述多个精细金属掩膜版。
  2. 如权利要求1所述的掩膜版组件的遮挡掩膜版，其中，所述支撑部包括多个第一方向支撑部，所述第一方向支撑部设置为沿第一方向延伸；
    所述多个第一方向支撑部包括多个第一支撑部，所述第一支撑部设置为与所述掩膜版组件的相邻的两个精细金属掩膜版之间的边界位置对应，并设置为支撑所述相邻的两个精细金属掩膜版中每个精细金属掩膜版的一个侧边。
  3. 如权利要求2所述的掩膜版组件的遮挡掩膜版，其中，所述第一支撑部的宽度为0.5mm至2mm。
  4. 如权利要求2所述的掩膜版组件的遮挡掩膜版，其中，所述多个第一方向支撑部还包括第二支撑部，所述第二支撑部设置为支撑所述掩膜版组件的位于端部的所述精细金属掩膜版的靠近所述掩膜版组件的相应端的侧边。
  5. 如权利要求2所述的掩膜版组件的遮挡掩膜版，其中，所述支撑部还包括多个第二方向支撑部，所述第二方向支撑部设置为沿第二方向延伸，所述第二方向与所述第一方向垂直；
    所述多个第二方向支撑部设置在所述第一区域的位于所述板体的长度方向的两端的区域内，所述板体的长度方向与所述第二方向平行。
  6. 如权利要求2所述的掩膜版组件的遮挡掩膜版，其中，多个所述第一支撑部的一端延伸至所述第一区域与所述第二区域的边界处。
  7. 如权利要求2所述的掩膜版组件的遮挡掩膜版，其中，在垂直于所述板体的方向上，所述第一方向支撑部与所述第二区域的第一表面平齐。
  8. 如权利要求5所述的掩膜版组件的遮挡掩膜版，其中，在垂直于所述板体的方向上，所述第二方向支撑部与所述第二区域的第一表面平齐。
  9. 如权利要求1所述的掩膜版组件的遮挡掩膜版，其中，所述第一区域的厚度小于所述第二区域的厚度。
  10. 如权利要求2至4任一项所述的掩膜版组件的遮挡掩膜版，其中，所述第二区域包括靠近所述第一区域的第一子区，以及被所述第一子区包围的第二子区；
    在垂直于所述板体的方向上，所述第二子区的第一表面凸出于所述第一子区的第一表面，所述第一子区的第一表面凸出于所述第一区域的第一表面；
    在垂直于所述板体的方向上，所述第一方向支撑部与所述第二子区的第一表面平齐。
  11. 如权利要求10所述的掩膜版组件的遮挡掩膜版，其中，多个所述第一方向支撑部延伸至所述第一子区内。
  12. 如权利要求10所述的掩膜版组件的遮挡掩膜版，其中，所述支撑部还包括多个第二方向支撑部，所述第二方向支撑部设置为沿第二方向延伸，所述第二方向与所述第一方向垂直；
    所述多个第二方向支撑部设置在所述第一区域的位于所述板体的长度方向的两端的区域内，并延伸至所述第一子区内，所述板体的长度方向与所述第二方向平行。
  13. 如权利要求12所述的掩膜版组件的遮挡掩膜版，其中，在垂直于所述板体的方向上，所述第二方向支撑部与所述第二子区的第一表面平齐。
  14. 如权利要求10所述的掩膜版组件的遮挡掩膜版，其中，所述第二子区的厚度大于所述第一子区的厚度，所述第一子区的厚度大于所述第一区域的厚度。
  15. 如权利要求2所述的掩膜版组件的遮挡掩膜版，其中，所述第一区域在沿所述板体的长度方向上的宽度等于一个或多个所述精细金属掩膜版的 宽度，所述板体的长度方向与所述第一方向垂直。
  16. 如权利要求1所述的掩膜版组件的遮挡掩膜版，其中，所述开口的形状为圆形、椭圆形、多边形或者不规则形状。
  17. 一种掩膜版组件，包括权利要求1至16任一项所述的遮挡掩膜版、框架和多个精细金属掩膜版；
    所述板体的周向边缘设有搭接部，所述搭接部搭接并固定在所述框架上，所述精细金属掩膜版的两端固定在所述框架的相对的两个边框上，所述多个精细金属掩膜版的第一侧面朝向所述板体的第一表面。
  18. 一种蒸镀装置，包括蒸镀腔室，以及设于所述蒸镀腔室内的蒸镀源、权利要求17所述的掩膜版组件和磁力吸附装置；
    所述蒸镀源和所述磁力吸附装置分别位于所述掩膜版组件的上下两侧，所述磁力吸附装置设置为对所述遮挡掩膜版产生向上的磁吸附力，所述精细金属掩膜版位于所述遮挡掩膜版的朝向所述磁力吸附装置的一侧。
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