CN115667572A - 遮挡掩膜版、掩膜版组件及蒸镀装置 - Google Patents
遮挡掩膜版、掩膜版组件及蒸镀装置 Download PDFInfo
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- CN115667572A CN115667572A CN202180000048.0A CN202180000048A CN115667572A CN 115667572 A CN115667572 A CN 115667572A CN 202180000048 A CN202180000048 A CN 202180000048A CN 115667572 A CN115667572 A CN 115667572A
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- 238000001704 evaporation Methods 0.000 title claims abstract description 52
- 230000008020 evaporation Effects 0.000 title claims abstract description 52
- 229910001111 Fine metal Inorganic materials 0.000 claims abstract description 85
- 238000001179 sorption measurement Methods 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000009834 vaporization Methods 0.000 claims description 7
- 230000008016 vaporization Effects 0.000 claims description 7
- 230000001174 ascending effect Effects 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 56
- 238000000034 method Methods 0.000 description 29
- 230000037303 wrinkles Effects 0.000 description 16
- 230000000873 masking effect Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 10
- 238000002156 mixing Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000004680 force modulation microscopy Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
一种遮挡掩膜版、掩膜版组件及蒸镀装置,所述遮挡掩膜版包括板体,所述板体包括第一表面,所述板体的第一表面设置为支撑所述掩膜版组件的多个精细金属掩膜版,所述板体设有多个开口,所述开口设置为暴露所述精细金属掩膜版的掩膜图案区;所述板体包括靠近周向边缘的第一区域和被所述第一区域包围的第二区域,在垂直于所述板体的方向上,所述第二区域的第一表面凸出于所述第一区域的第一表面;所述第一区域的第一表面上设有支撑部,所述支撑部避开所述开口,所述支撑部设置为能够与所述第二区域的第一表面共同支撑所述多个精细金属掩膜版。
Description
PCT国内申请,说明书已公开。
Claims (18)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2021/073312 WO2022155895A1 (zh) | 2021-01-22 | 2021-01-22 | 遮挡掩膜版、掩膜版组件及蒸镀装置 |
Publications (2)
Publication Number | Publication Date |
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CN115667572A true CN115667572A (zh) | 2023-01-31 |
CN115667572B CN115667572B (zh) | 2024-05-17 |
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CN202180000048.0A Active CN115667572B (zh) | 2021-01-22 | 2021-01-22 | 遮挡掩膜版、掩膜版组件及蒸镀装置 |
Country Status (3)
Country | Link |
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US (1) | US20230295790A1 (zh) |
CN (1) | CN115667572B (zh) |
WO (1) | WO2022155895A1 (zh) |
Families Citing this family (1)
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CN116083842A (zh) * | 2023-01-03 | 2023-05-09 | 京东方科技集团股份有限公司 | 掩膜板组件 |
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JP2017155338A (ja) * | 2016-03-03 | 2017-09-07 | エルジー ディスプレイ カンパニー リミテッド | 有機発光素子の蒸着装置 |
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US20190323117A1 (en) * | 2016-11-18 | 2019-10-24 | Dai Nippon Printing Co., Ltd. | Deposition mask |
KR20200009799A (ko) * | 2018-07-20 | 2020-01-30 | 주식회사 티지오테크 | 프레임 일체형 마스크의 제조 방법 |
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-
2021
- 2021-01-22 CN CN202180000048.0A patent/CN115667572B/zh active Active
- 2021-01-22 WO PCT/CN2021/073312 patent/WO2022155895A1/zh active Application Filing
- 2021-01-22 US US17/610,157 patent/US20230295790A1/en active Pending
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CN106158697A (zh) * | 2014-12-19 | 2016-11-23 | 三星显示有限公司 | 掩模框架组件、沉积装置及有机发光显示装置的制造方法 |
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Also Published As
Publication number | Publication date |
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US20230295790A1 (en) | 2023-09-21 |
WO2022155895A1 (zh) | 2022-07-28 |
CN115667572B (zh) | 2024-05-17 |
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