WO2022148183A1 - 一种光模块 - Google Patents

一种光模块 Download PDF

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Publication number
WO2022148183A1
WO2022148183A1 PCT/CN2021/134352 CN2021134352W WO2022148183A1 WO 2022148183 A1 WO2022148183 A1 WO 2022148183A1 CN 2021134352 W CN2021134352 W CN 2021134352W WO 2022148183 A1 WO2022148183 A1 WO 2022148183A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
circuit
optical module
electrical
tube shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/134352
Other languages
English (en)
French (fr)
Inventor
邵乾
刘维伟
姚建伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202110024351.6A external-priority patent/CN114755765B/zh
Priority claimed from CN202110026033.3A external-priority patent/CN114755767B/zh
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Publication of WO2022148183A1 publication Critical patent/WO2022148183A1/zh
Priority to US18/126,782 priority Critical patent/US12399332B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations

Definitions

  • the present disclosure relates to the technical field of optical communication, and in particular, to an optical module.
  • the optical module is a tool for realizing the mutual conversion of photoelectric signals, and it is one of the key components in the optical communication equipment.
  • the transmission rate of the optical module continues to increase.
  • an embodiment of the present disclosure provides an optical module, comprising: a tube casing with a cavity inside, and a photoelectric element is arranged in the cavity; The other end is provided with a socket, the surface of the socket is made of metal, and the socket is communicated with the cavity; one end of the circuit board is inserted into the tube shell through the socket, and the A metal layer is provided at the contact between the circuit board and the socket, the gap between the metal layer of the circuit board and the socket is filled with a solder piece, and the metal layer is welded and fixed to the socket through the solder piece , in order to realize the airtight packaging of the tube shell and the circuit board; the end inserted into the tube shell is provided with a first electrical circuit, the end away from the tube shell is provided with a second electrical circuit, the tube The electrical element in the casing is electrically connected to the first electrical circuit, and the first electrical circuit is electrically connected to the second electrical circuit through the circuit board internal circuit.
  • an embodiment of the present disclosure provides an optical module, comprising: a tube casing with a cavity inside, and a photoelectric element is arranged in the cavity;
  • the light window transmits; the other end is provided with a socket, the surface of the socket is metal, and the socket is communicated with the cavity;
  • one end of the circuit board is inserted into the tube shell through the socket, the A metal layer is provided on each side of the circuit board inserted into the tube shell, the gap between the metal layer and the socket is filled with a solder piece, and the outer side of the solder piece is coated with a first waterproof
  • a recessed area is provided on the metal layer on one side of the circuit board inserted into the package, and a first electrical circuit is arranged in the recessed area , and the gap between the first electrical circuit is coated with a second waterproof layer;
  • the end of the circuit board away from the casing is provided with a second electrical circuit, and the electrical components in the casing are connected to the first electrical circuit.
  • the electrical circuit is electrically connected, and
  • FIG. 1 is a connection diagram of an optical communication system according to some embodiments
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • FIG. 3 is a structural diagram of an optical module according to some embodiments.
  • FIG. 4 is an exploded view of an optical module according to some embodiments.
  • FIG. 5 is a schematic diagram of the structure of the existing airtight tube shell in the optical module
  • FIG. 6 is an exploded schematic diagram of an existing airtight tube casing in an optical module
  • FIG. 7 is a schematic structural diagram of an airtight tube casing in an optical module according to some embodiments.
  • FIG. 8 is an exploded schematic view of an airtight tube casing in an optical module according to some embodiments.
  • FIG. 9 is a schematic structural diagram of a circuit board in an optical module according to some embodiments.
  • FIG. 10 is another perspective structural diagram of a circuit board in an optical module according to some embodiments.
  • FIG. 11 is a cross-sectional view of a circuit board in an optical module according to some embodiments.
  • FIG. 12 is a schematic diagram of an assembly process of an airtight tube case and a circuit board in an optical module according to some embodiments
  • FIG. 13 is a partial assembly cross-sectional view of an airtight case and a circuit board in an optical module according to some embodiments
  • FIG. 14 is a schematic diagram of the path of water vapor infiltrating into the airtight tube case from the inside of the circuit board in an optical module according to some embodiments;
  • FIG. 15 is a schematic structural diagram of a solder member in an optical module according to some embodiments.
  • 16 is another schematic structural diagram of a circuit board in an optical module according to some embodiments.
  • FIG. 17 is a schematic diagram illustrating the assembly of an airtight tube case and a circuit board in an optical module according to some embodiments.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • a feature defined as “first”, “second” may expressly or implicitly include one or more of that feature.
  • plural means two or more.
  • the expressions “coupled” and “connected” and their derivatives may be used.
  • the term “connected” may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.
  • the term “coupled” may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact.
  • the terms “coupled” or “communicatively coupled” may also mean that two or more components are not in direct contact with each other, yet still co-operate or interact with each other.
  • the embodiments disclosed herein are not necessarily limited by the content herein.
  • At least one of A, B, and C has the same meaning as “at least one of A, B, or C”, and both include the following combinations of A, B, and C: A only, B only, C only, A and B , A and C, B and C, and A, B, and C.
  • a and/or B includes the following three combinations: A only, B only, and a combination of A and B.
  • optical communication technology light is used to carry the information to be transmitted, and the optical signal carrying the information is transmitted to information processing equipment such as computers through information transmission equipment such as optical fibers or optical waveguides to complete the transmission of information. Since optical signals have passive transmission characteristics when transmitted through optical fibers or optical waveguides, low-cost and low-loss information transmission can be achieved.
  • the signals transmitted by information transmission equipment such as optical fibers or optical waveguides are optical signals, while the signals that can be recognized and processed by information processing equipment such as computers are electrical signals. To establish an information connection between them, it is necessary to realize the mutual conversion of electrical signals and optical signals.
  • the optical module realizes the mutual conversion function of the above-mentioned optical signal and electrical signal in the technical field of optical fiber communication.
  • the optical module includes an optical port and an electrical port.
  • the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, and realizes electrical connection with an optical network terminal (for example, an optical cat) through the electrical port. It is mainly used to realize power supply, I2C signal transmission, data signal transmission and grounding; optical network terminals transmit electrical signals to information processing equipment such as computers through network cables or wireless fidelity technology (Wi-Fi).
  • Wi-Fi wireless fidelity technology
  • FIG. 1 is a connection diagram of an optical communication system according to some embodiments.
  • the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101 and a network cable 103;
  • the optical fiber 101 is connected to the remote server 1000 , and the other end is connected to the optical network terminal 100 through the optical module 200 .
  • the optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6 kilometers to 8 kilometers). On this basis, if repeaters are used, ultra-long distance transmission can theoretically be achieved. Therefore, in a common optical communication system, the distance between the remote server 1000 and the optical network terminal 100 can usually reach several kilometers, tens of kilometers or hundreds of kilometers.
  • the local information processing device 2000 may be any one or more of the following devices: a router, a switch, a computer, a mobile phone, a tablet computer, a television, and the like.
  • the physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing device 2000 and the optical network terminal 100 .
  • the connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103 ; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100 .
  • the optical module 200 includes an optical port and an electrical port.
  • the optical port is configured to be connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 can establish a two-way optical signal connection; electrical signal connection.
  • the optical module 200 realizes the mutual conversion of optical signals and electrical signals, so as to establish a connection between the optical fiber 101 and the optical network terminal 100 .
  • the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input into the optical network terminal 100
  • the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input into the optical fiber 101 .
  • the optical network terminal 100 includes a substantially rectangular housing, and an optical module interface 102 and a network cable interface 104 disposed on the housing.
  • the optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 can establish a bidirectional electrical signal connection;
  • the network cable interface 104 is configured to access the network cable 103, so that the optical network terminal 100 and the network cable 103 are connected.
  • a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100 .
  • the optical network terminal 100 transmits the electrical signal from the optical module 200 to the network cable 103, and transmits the signal from the network cable 103 to the optical module 200.
  • the optical network terminal 100 as the host computer of the optical module 200, can monitor the optical module 200. work.
  • the host computer of the optical module 200 may also include an optical line terminal (Optical Line Terminal, OLT) and the like.
  • OLT Optical Line Terminal
  • a bidirectional signal transmission channel is established between the remote server 1000 and the local information processing device 2000 through the optical fiber 101 , the optical module 200 , the optical network terminal 100 and the network cable 103 .
  • FIG. 2 is a structural diagram of an optical network terminal according to some embodiments.
  • the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105 , and an electrical connector disposed inside the cage 106 .
  • the electrical connector is configured to be connected to the electrical port of the optical module 200 ; the heat sink 107 has protrusions such as fins that increase the heat dissipation area.
  • the optical module 200 is inserted into the cage 106 of the optical network terminal 100 , and the optical module 200 is fixed by the cage 106 .
  • the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , so that the optical module 200 and the optical network terminal 100 establish a bidirectional electrical signal connection.
  • the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 and the optical fiber 101 establish a bidirectional electrical signal connection.
  • FIG. 3 is a structural diagram of an optical module according to some embodiments
  • FIG. 4 is an exploded view of an optical module according to some embodiments.
  • the optical module 200 includes a casing, a circuit board 300 disposed in the casing, and an optical transceiver device;
  • the casing includes an upper casing 201 and a lower casing 202 , and the upper casing 201 is covered with the lower casing
  • the outer contour of the casing generally presents a square body.
  • the lower casing 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and perpendicular to the bottom plate;
  • the upper casing 201 includes a cover plate, and two sides of the cover plate are perpendicular to the cover plate.
  • the two upper side plates are combined with the two side plates by the two side walls to realize that the upper casing 201 is covered on the lower casing 202 .
  • the direction of the connection between the two openings 204 and 205 may be consistent with the length direction of the optical module 200 , or may be inconsistent with the length direction of the optical module 200 .
  • the opening 204 is located at the end of the optical module 200 (the right end in FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end in FIG. 3 ).
  • the opening 204 is located at the end of the optical module 200
  • the opening 205 is located at the side of the optical module 200 .
  • the opening 204 is an electrical port, and the golden fingers of the circuit board 300 protrude from the electrical port 204 and are inserted into the host computer (such as the optical network terminal 100 );
  • the optical fiber 101 is connected to the optical transceiver device inside the optical module 200 .
  • the combination of the upper case 201 and the lower case 202 is used to facilitate the installation of the circuit board 300, optical transceivers and other devices into the case, and the upper case 201 and the lower case 202 can form encapsulation protection for these devices.
  • the upper case 201 and the lower case 202 can form encapsulation protection for these devices.
  • the upper casing 201 and the lower casing 202 are generally made of metal material, which is beneficial to achieve electromagnetic shielding and heat dissipation.
  • the optical module 200 further includes an unlocking component 203 located on the outer wall of the housing thereof, and the unlocking component 203 is configured to realize a fixed connection between the optical module 200 and the upper computer, or release the connection between the optical module 200 and the upper computer fixed connection.
  • the unlocking components 203 are located on the outer walls of the two lower side panels of the lower casing 202, and include engaging components matching with the cage of the upper computer (eg, the cage 106 of the optical network terminal 100).
  • the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging part of the unlocking part 203; when the unlocking part 203 is pulled, the engaging part of the unlocking part 203 moves accordingly, thereby changing the The connection relationship between the engaging member and the host computer is used to release the engaging relationship between the optical module 200 and the host computer, so that the optical module 200 can be pulled out from the cage of the host computer.
  • the circuit board 300 includes circuit traces, electronic components and chips, and the electronic components and chips are connected together according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding.
  • the electronic components may include, for example, capacitors, resistors, triodes, and metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET).
  • the chip may include, for example, a Microcontroller Unit (MCU), a limiting amplifier (limiting amplifier), a clock and data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip .
  • MCU Microcontroller Unit
  • limiting amplifier limiting amplifier
  • CDR clock and data recovery chip
  • DSP digital signal processing
  • the circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry chips smoothly; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. .
  • the circuit board 300 further includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of pins which are independent of each other.
  • the circuit board 300 is inserted into the cage 106 , and is electrically connected to the electrical connector in the cage 106 by gold fingers.
  • the golden fingers can be arranged only on one side surface of the circuit board 300 (eg, the upper surface shown in FIG. 4 ), or can be arranged on the upper and lower surfaces of the circuit board 300 , so as to meet the needs of a large number of pins.
  • the golden finger is configured to establish an electrical connection with the upper computer to realize power supply, grounding, I2C signal transmission, data signal transmission, and the like.
  • flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.
  • FIG. 5 is a schematic structural diagram of an existing airtight tube casing in an optical module
  • FIG. 6 is an exploded schematic diagram of an existing airtight tube casing in the optical module.
  • the existing airtight tube shell is mainly composed of a metal cover plate 410, a metal tube shell 420 and a ceramic circuit board 430.
  • the upper part of the metal tube shell 420 is opened, and a cavity is arranged in the inside thereof.
  • Transceiver devices including light-emitting sub-modules or light-receiving sub-modules
  • the metal cover plate 410 covers the opening above the metal tube shell 420 to form the metal cover plate 410 and the metal tube shell 420
  • the cavity is sealed to ensure the sealing of the optical components in the metal tube shell 420; one end of the ceramic circuit board 430 is inserted into the metal tube shell 420, and the ceramic circuit board 430 and the metal tube shell 420 are sealed and welded; the ceramic circuit board 430 A metal circuit is provided thereon, and the optical components in the package 420 are electrically interconnected with the circuit board 300 through the metal circuit on the ceramic circuit board 430 .
  • the ceramic circuit board 430 is inserted into the metal tube case 420, and then components such as optical components are placed in the cavity inside the tube case 420.
  • the different components of the optical component and the ceramic circuit board 430 After the electrical connection achieves the function, the metal cover plate 410 is used for airtight packaging inside the tube shell through a parallel sealing and welding process.
  • the existing airtight tube shell design method is: metallizing the ceramic, using the HTCC (High Temperature Co-Fired Ceramic, high temperature co-fired ceramic) process, and punching, filling, and printing the pre-designed circuit.
  • the method is to make metal paste on green ceramic sheets, and then through lamination, high temperature sintering and other processes to finally make ceramic circuit boards; interconnect while maintaining the airtightness of the casing.
  • non-airtight tube casings can only be used in data center computer rooms with better environments, and cannot meet the requirements of outdoor environments such as wireless 5G and other harsh environments. field application.
  • the embodiments of the present disclosure provide a new type of airtight tube shell, which is mainly composed of a circuit board (replacing the existing ceramic co-sintered circuit board), a tube shell and solder parts.
  • the board and the tube shell are welded together with solder parts, and the gaps between the circuit board and the tube shell are all sealed by the solder parts.
  • the circuit board 300 is a (Printed Circuit Board, printed circuit board) rigid PCB circuit board, which is a multi-layer PCB circuit board, and the boards of the PCB and the layers are bonded together by adhesives .
  • the main material of the PCB circuit board is copper clad laminate.
  • the copper clad laminate is composed of substrate, copper foil and adhesive.
  • the substrate is an insulating layer composed of polymer synthetic resin and reinforcing materials. High pure copper foil with good solderability, copper clad laminate with copper foil covering one side of the substrate is called single-sided copper clad laminate, copper clad laminate with copper foil on both sides of the substrate is called double-sided copper clad laminate, copper foil can be firmly covered. On the substrate, it is done by adhesive.
  • the existing ceramic circuit board 430 is not the same as the circuit board 300 provided by the present disclosure. After the ceramic circuit board 430 is sintered and welded together with the tube shell 420 at high temperature, the side of the tube shell 420 needs to be connected to the circuit board directly or through a flexible circuit board. On 300 , the electrical components in the package 420 are driven to work by the chips on the circuit board 300 .
  • FIG. 7 is a schematic structural diagram of an airtight tube case in an optical module according to some embodiments
  • FIG. 8 is an exploded schematic view of an airtight tube case in an optical module according to some embodiments.
  • the tube shell 420 in the airtight tube shell is provided with a cavity, and the cavity is provided with a photoelectric element, such as a laser chip or a photodetector, etc.;
  • One end is provided with a socket 421, and the socket 421 communicates with the cavity;
  • one end of the circuit board 300 is inserted into the tube shell 420 through the socket 421 to be electrically connected with the electrical components in the cavity, thereby driving the electrical components to achieve corresponding functions,
  • an optical port is provided on the side of the tube shell 420 opposite to the socket 421, and the light in the tube shell 420 is optically transmitted through the optical port.
  • the side of the casing 420 away from the circuit board 300 is generally
  • the light emitting sub-module When a light emitting sub-module is arranged in the tube shell 420, the light emitting sub-module generally includes electrical components such as a light emitting chip and optical devices such as a lens and an isolator.
  • the light emitting chip is close to the circuit board 300 inserted into the tube shell 420 to facilitate the passage Wiring realizes the electrical connection between the light-emitting chip and the circuit board 300, thereby driving the light-emitting chip to emit light beams;
  • the lens is arranged between the light-emitting chip and the optical port of the tube casing 420, and is located on the light-emitting optical path of the light-emitting chip, That is, it is close to the optical port of the tube case 420, so that the light beam emitted by the light emitting chip enters the lens, the divergent light beam is converted into a convergent light beam by the lens, and the convergent light beam is converged and coupled to the optical fiber adapter through the optical port
  • the light-receiving sub-module When a light-receiving sub-module is arranged in the tube case 420, the light-receiving sub-module generally includes optical devices such as lenses, and electrical components such as photodetectors and transimpedance amplifiers.
  • the lenses, photodetectors, and transimpedance amplifiers are sequentially arranged along the transmission direction of the optical path.
  • the case 420 that is, the lens is close to the optical port of the case 420
  • the transimpedance amplifier is close to the socket 421 of the case 420
  • the photodetector is arranged between the lens and the transimpedance amplifier, and both the photodetector and the transimpedance amplifier pass through
  • the bonding wire is electrically connected to the circuit board 300 .
  • the light beam transmitted by the optical fiber adapter is transmitted to the lens through the optical port of the tube shell 420, the divergent light beam is converted into a collimated light beam by the lens, the collimated light beam enters the photodetector, and the collimated light beam is converted into an electrical signal by the photodetector, and the output is output.
  • the electrical signal obtained from the signal enters the transimpedance amplifier, is amplified by the transimpedance amplifier, and the amplified electrical signal is transmitted to the circuit board 300 .
  • a transparent light window 450 is encapsulated at the light port, and the light window 450 is a glass sheet that allows light to pass through, so that the light beam emitted by the light emitting chip enters the lens,
  • the light beam is converted into a convergent light beam through the lens, and the convergent light beam is coupled to the optical fiber adapter through the optical window 450; or, the light beam transmitted by the optical fiber adapter is transmitted to the lens through the optical window 450, and the divergent beam is converted into a collimated beam by the lens, and the collimated beam is collimated.
  • the beam enters the photodetector, and the photodetector converts the collimated beam into an electrical signal.
  • the light window 450 in order to enhance the transmittance of the light window 450 and prevent the light reflection phenomenon from affecting the performance of the light conversion element, is generally inclined at a preset angle (usually 8°), and the surface of the glass sheet is coated with The anti-reflection coating corresponding to the wavelength is applied to enhance the transmittance of the light beam.
  • the surface of the socket 421 of the tube shell 420 is Metal, the tube shell 420 is directly welded with the solder member 440 .
  • the surface metal of the tube shell 420 is a metal that is easy to be welded with the solder member 440 , such as a gold-plated layer, a nickel-plated layer, and the like.
  • the solder member 440 may be a structural member, that is, the solder member 440 includes a first side plate, a second side plate and a third side plate, and two ends of the second side plate are respectively connected to the first side plate, the third side plate and the third side plate.
  • the three side plates are connected, and the first side plate and the third side plate are arranged opposite to each other.
  • a through hole is provided on the two side plates, and the circuit board 300 is inserted into the tube shell 420 through the through hole. After the circuit board 300 is passed through the through hole, the junction of the circuit board 300 and the through hole is welded together.
  • the component 440 completely seals the gap between the circuit board 300 and the package 420 .
  • the soldering member 440 can also be a soldering material. After inserting the circuit board 300 into the tube shell 420 through the socket 421 of the tube shell 420, apply solder material to the gap between the side of the circuit board 300 and the tube shell 420, and then connect the solder material to the tube shell 420. The shell 420 , the solder material and the side surface of the circuit board 300 are respectively welded, so as to completely seal the gap between the circuit board 300 and the tube shell 420 .
  • the solder member 440 includes, but is not limited to, solder paste, solder sheet, solder wire, and the like.
  • FIG. 9 is a schematic structural diagram of a circuit board in an optical module according to some embodiments
  • FIG. 10 is a schematic structural diagram of another angle of the circuit board in an optical module according to some embodiments.
  • a metal layer is provided at the contact between the circuit board 300 and the socket 421
  • the gap between the metal layer of the circuit board 300 and the socket 421 is filled with a solder piece 440
  • the metal layer is connected to the solder piece 440 through the solder piece 440
  • the socket 421 is welded and fixed, so as to realize the airtight packaging of the tube case 420 and the circuit board 300 .
  • a metal layer may be provided on each side of the circuit board 300 inserted into the tube shell 420 , and the circuit board 300 is welded to the solder member 440 through the metal layer. That is, each side of the circuit board 300 is laid with a copper layer, and the surface of the copper layer is plated with a gold layer, which not only facilitates the welding and fixing of the side of the circuit board 300 and the solder 440, but also prevents external water vapor from passing through the circuit board 300 and the pipe. The gap between the shells 420 penetrates into the inside of the tube shell 420 .
  • the portion of the circuit board 300 inserted into the case 420 includes a first side 301 , a second side 302 , a third side 303 , a fourth side 304 and a fifth side 305
  • the first side 301 is The upper side of the circuit board 300 is open toward the upper part of the casing 420; the fifth side 305 is the lower side of the circuit board 300, which is opposite to the first side 301; the second side 302 is the rear side of the circuit board 300, the upper and lower sides of which are The edges are respectively connected with the first side 301 and the fifth side 305; the fourth side 304 is the front side of the circuit board 300, which is opposite to the second side 302; the third side 303 is the right side of the circuit board 300, on which, The lower edge is connected to the first side surface 301 and the fifth side surface 305 respectively, and the front and rear edges thereof are respectively connected to the second side surface 302 and the fourth side surface 304 .
  • the sides of the first side 301 , the second side 302 , the fourth side 304 and the fifth side 305 of the circuit board 300 that are inserted into the tube shell 420 are all covered with a copper layer and plated with gold, so that the circuit board 300 and the The gaps between the tube shells 420 are blocked and fixed by welding to prevent external water vapor from infiltrating into the tube shell 420 through the gap between the circuit board 300 and the tube shell 420 , affecting the performance of the optical components in the tube shell 420 .
  • the circuit board 300 is a multi-layer board structure, and the board of the circuit board and the joint between the layers are easily penetrated by water vapor, but the metal The waterproof performance is very good.
  • the present disclosure not only covers the first side 301 , the second side 302 , the fourth side 304 and the fifth side 305 of the circuit board 300 .
  • the side of the circuit board 300 inserted into the tube shell 420 is also covered with copper skin and the surface is gold-plated, that is, the third side 303 of the circuit board 300 is also laid with a copper layer and the surface is gold-plated.
  • the metal layer of the third side 303 of the side serves as the last line of defense against water vapor.
  • the first side 301 , the second side 302 , the fourth side 304 , and the fifth side 305 of the circuit board 300 are not provided with metal layers on the sides of the circuit board 300 that are not inserted into the casing 420 , that is, the circuit board 300 is provided with a metal layer.
  • No metal layer is provided on the end surface of the second electrical circuit 320, and the distance between the metal layer on the circuit board 300 is slightly greater than the distance between the circuit board 300 inserted into the third side 303 of the case 420 and the left side of the case 420, the circuit The rest of the board 300 is not provided with metal layers.
  • FIG. 11 is a cross-sectional view of a circuit board in an optical module according to some embodiments.
  • the end of the circuit board 300 inserted into the tube shell 420 is provided with a first
  • the electrical circuit 311 is provided with a second electrical circuit 320 at one end away from the tube shell 420 .
  • the electrical components in the tube shell 420 are electrically connected to the first electrical circuit 311 , and the first electrical circuit 311 is connected to the second electrical circuit through the internal circuit of the circuit board 300 .
  • Line 320 is electrically connected.
  • a recessed area 310 needs to be provided on the metal layer of the circuit board 300 , the surface of the recessed area 310 is the surface of the circuit board 300 , and its surface is not coated with a metal layer, and the first electrical circuit 311 is disposed in the recessed area 310 .
  • the first electrical circuit 311 and the second electrical circuit 320 may be circuit pads, a plurality of circuit pads are arranged in sequence along the width direction of the circuit board 300 , the first circuit pad and the second circuit pad Electrical connections may be made through internal wirings 350 of the circuit board 300 .
  • a first electrical circuit 311 and a second electrical circuit 320 are provided on the first side surface 301 of the circuit board 300 , the first electrical circuit 311 is located in the cavity of the package 420 , and the second electrical circuit 320 is located outside the tube shell 420. Since the surface of the circuit board 300 cannot be routed, in order to achieve electrical connection, an internal circuit 350 is provided inside the circuit board 300, and one end of the internal circuit 350 is electrically connected to the first electrical circuit 311. The other end is connected to the second electrical circuit 320 so as to lead the circuit to the inner circuit 350 in the middle layer of the circuit board 300 .
  • the circuit board 300 is provided with a first via hole 330 and a second via hole 340 .
  • the first electrical circuit 311 is electrically connected to the internal circuit 350 through the first via hole 330;
  • the second via hole 340 is disposed under the second electrical circuit 320, and the second electrical circuit 320 passes through the second via hole 340 is electrically connected to the internal wiring 350 .
  • the first via hole 330 and the second via hole 340 are both blind holes, the first via hole 330 is connected to the first electrical circuit 311 and the internal circuit 350 , and the second via hole 340 is connected to the second electrical circuit 320 with internal line 350.
  • the first electrical circuit 311 may include a plurality of first circuit pads, and the plurality of first circuit pads are arranged in sequence along the width direction of the circuit board 300 ;
  • the second electrical circuit 320 may include a plurality of second circuit pads Circuit pads, and a plurality of second circuit pads are arranged in sequence along the width direction of the circuit board 300 .
  • the first via hole 330 is arranged between the first circuit pad and the inner circuit 350
  • the second via hole 340 is arranged between the second circuit pad and the inner circuit 350
  • one end of the inner circuit 350 is connected to the first via hole 330 .
  • the other end is electrically connected to the second via hole 340 .
  • the first electrical circuit 311 is provided on the end face of the first side 301 of the circuit board 300 inserted into the tube shell 420 , the copper layer cannot be laid on the surface, so external water vapor may penetrate into the tube through the gap between the layers of the circuit board 300 Inside the shell 420, there is a gap between the edge of the first electrical circuit 311 close to the tube shell 420 and the edge of the circuit board 300, that is, there is a gap between the edge of the recessed area 310 and the third side 303, and the gap is provided with Metal layer to block the penetration of water vapor.
  • the size of the gap between the edge of the first electrical circuit 311 and the third side surface 303 of the circuit board 300 is ⁇ 0.1 mm.
  • a gap is left between the right edge of the recessed area 310 and the right edge of the first side surface 301 , and a copper layer is laid on the gap.
  • the surface is plated with a gold layer, and the metal layer on the gap is connected to the metal layer on the first side 301 and the third side 303, so as to prevent external water vapor from infiltrating the tube through the gap between the circuit board 300 and the tube shell 420
  • the interior of the case 420 affects the performance of the optical components in the case 420 .
  • FIG. 12 is a schematic diagram of an assembly process of an airtight tube case and a circuit board in an optical module according to some embodiments.
  • copper layers are laid on each side of the circuit board 300 inserted into the tube shell 420 and the surface is plated with gold, and the first electrical circuit 311 and the second electrical circuit 320 are respectively arranged on both ends of the circuit board 300 .
  • the inner circuit 350 is arranged in the middle layer of the board 300 , the first via 330 is arranged under the first electrical circuit 311 to connect the inner circuit 350 , and the second via 340 is arranged under the second electrical circuit 320 to connect the inner circuit 350 .
  • the board 300 and the shell 420 are cleaned by plasma cleaning or ultrasonic cleaning; then the circuit board 300 is inserted into the shell 420 through the socket 421 of the shell 420, so that the first electrical circuit 311 is located in the cavity of the shell 420, and the first electric circuit 311 is located in the cavity of the shell 420.
  • the second electrical circuit 320 is located outside the shell of the tube shell 420. If necessary, glue can be used to pre-fix the junction of the two;
  • the package 420 and the circuit board 300 are soldered together by solder paste.
  • the staff needs to perform visual inspection and leak detection on the welded airtight tube shell to detect the assembly sealing of the circuit board 300 and the tube shell 420 to avoid External water vapor or the like penetrates into the inside of the case 420 through the gap between the circuit board 300 and the case 420 .
  • FIG. 13 is a partial assembly cross-sectional view of an airtight case and a circuit board in an optical module according to some embodiments.
  • the optical components such as the light emitting sub-module or the light receiving sub-module
  • the package The electrical components in 420 are electrically connected to the first electrical circuit 311 on the circuit board 300 through wire bonding, and then lead the circuit back to the surface of the circuit board 300 through the first via 330, the internal circuit 350, and the second via 340.
  • the second electrical circuit 320 realizes the electrical interconnection inside and outside the casing 420; in addition, the light in the casing 420 is transmitted through the light window, thereby realizing the electrical interconnection inside and outside the casing while maintaining the airtightness of the casing.
  • FIG. 14 is a schematic diagram of the path of water vapor infiltrating into the airtight tube case from the inside of the circuit board in an optical module according to some embodiments.
  • the tube shell 420 and the circuit board 300 are welded together by the solder piece 440 , but the solder piece 440 may have problems such as explosion holes, air bubbles or even cracks during welding, resulting in the occurrence of the tube shell 420 at the welding place.
  • Air leakage causes water vapor to infiltrate into the interior of the tube case 420 from the bubbles, cracks, etc. at the welding place, which affects the performance of the optoelectronic components in the tube case 420 .
  • FIG. 15 is a schematic structural diagram of a solder member in an optical module according to some embodiments.
  • the present disclosure places the gap between the tube shell 420 and the circuit board 300 by soldering tin.
  • each outer surface of the solder parts 440 is coated with a first waterproof layer 441, and the first waterproof layer 441 can cover the air bubbles, cracks, etc. Air leakage caused by factors such as cracking of the component 440 or air bubbles.
  • the first waterproof layer 441 may be a glue layer. After the gap between the tube shell 420 and the circuit board 300 is welded together by the solder piece 440, a layer of glue is covered on the outside of the solder piece 440 to solve the problem. The phenomenon of air leakage generated at the welding place of the tube shell 420 is avoided, and water vapor is prevented from infiltrating into the inside of the tube shell 420 from welding bubbles, cracks, etc.
  • FIG. 16 is another schematic structural diagram of a circuit board in an optical module according to some embodiments
  • FIG. 17 is a schematic diagram of assembling an airtight tube case and a circuit board in an optical module according to some embodiments.
  • the end of the circuit board 300 inserted into the package 420 is provided with a recessed area 310
  • the bottom surface of the recessed area 310 is the surface of the circuit board
  • the top surface of the recessed area 310 is The surface of the metal layer of the circuit board
  • the first electrical circuit 311 is arranged in the recessed area 310.
  • the surface of the recessed area 310 is not provided with a metal layer, so that the water vapor passes through the multilayer board of the circuit board 300. After the gap between them enters the circuit board 300 , the water vapor can enter the inside of the tube case 420 through the recessed area 310 , thereby affecting the performance of the optoelectronic components in the tube case 420 .
  • the circuit board 300 is surrounded by copper sheets on the first electrical circuit 311 inside the casing 420 , so that a depression is formed between the first electrical circuit 311 and the outer copper sheet.
  • the area 310 is the cross-hatched position in the figure, and this position is also the position where the water vapor penetrates.
  • a second waterproof layer is provided on the surface of the recessed area 310 .
  • a second waterproof layer is arranged in the gap between the first electrical circuits 311 , so that even if there is water vapor inside the circuit board 300 , the second waterproof layer can block the water vapor, and the water vapor cannot enter the inside of the casing 420 from the surface of the recessed area 310 .
  • the second waterproof layer may be a glue layer.
  • the circuit board 300 is provided with one end of the first electrical circuit 311 After inserting the tube shell 420, after the circuit board 300 and the tube shell 420 are welded together by the soldering piece 440, the electrical components in the tube shell 420 are electrically connected to the first electrical circuit 311 by bonding wires, and then the circuit board 300 is in the depression of the circuit board 300.
  • a layer of glue for releasing water vapor is added in the area 310, and the concave design prevents the glue from flowing around. After the glue is cured, a waterproof layer is formed, which can prevent water vapor from infiltrating here.
  • the optical module includes a tube case, a circuit board and a soldering piece.
  • a cavity is provided inside the tube case, and a photoelectric element is arranged in the cavity; an end of the tube case is provided with a socket, the socket is communicated with the cavity, and the circuit board is provided with a socket.
  • One end of the circuit board is inserted into the tube shell through the socket, and a metal layer is provided on each side of the circuit board inserted into the tube shell.
  • the solder piece welds the circuit board and the tube shell together, and the outer side of the solder piece is provided with a first waterproof layer, and the first waterproof layer covers the bubbles, cracks, etc.
  • the air-tight packaging can avoid air leakage caused by factors such as soldering parts or air bubbles; the end of the circuit board inserted into the tube case is provided with a recessed area, and the first electrical circuit is arranged in the recessed area, and the circuit board is far from the tube case.
  • One end is provided with a second electrical circuit
  • the middle layer of the circuit board is provided with an internal circuit
  • the first electrical circuit is electrically connected to the internal circuit through the first via hole
  • the second electrical circuit is electrically connected to the internal circuit through the second via hole
  • the cavity The electrical components in the body are electrically connected to the first electrical circuit on the circuit board by wire bonding, so that the circuit is led to the middle layer of the circuit board through the first via hole, and after the internal circuit of the middle layer goes to the outside of the tube shell,
  • the circuit is then led back to the second electrical circuit on the surface of the circuit board by the second via hole, thereby realizing the electrical interconnection between the inside and outside of the casing; since the surface of the recessed area is not provided with a metal layer, it is impossible to prevent water vapor from penetrating into the casing 420 from here.
  • a second waterproof layer is provided in the area where the first electrical circuit is removed in the recessed area, and the bottom surface of the recessed area is covered by the second waterproof layer to prevent water vapor from infiltrating from here; the other end of the tube shell is provided with a light window, The light in the tube is transmitted through the light window to realize the emission or reception of light.
  • the circuit board is directly inserted into the tube shell, the gap between the circuit board and the tube shell is completely sealed by the soldering piece, and the first waterproof layer on the outside of the soldering piece is used to avoid factors such as welding cracking or air bubbles of the soldering piece
  • the water vapor infiltration caused by the second waterproof layer on the bottom surface of the recessed area of the circuit board is used to prevent the water vapor from infiltrating into the tube shell from the recessed area.
  • the process is simple and the cost is low.
  • the electrical components of the optical components are directly connected to the circuit board through wire bonding, and the high-frequency performance is better, which can better meet the applications in harsh environments such as 5G outdoors.
  • circuit structure, article or device comprising a series of elements includes not only those elements, It also includes other elements not expressly listed, or elements inherent to such a circuit structure, article or device.
  • an element qualified by the phrase “comprising a" does not preclude the presence of additional identical elements in the circuit structure, article or device that includes the element.

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Abstract

光模块（200），包括管壳（420）与电路板（300），管壳（420）的一端设有插口（421），插口（421）的表面为金属，电路板（300）通过插口（421）插入管壳（420）内，电路板（300）与插口（421）的接触处设置有金属层，金属层与插口（421）之间的间隙内填充有焊锡件（440），金属层通过焊锡件（440）与插口（421）焊接固定，电路板（300）两端分别设有第一电气线路（311）、第二电气线路（320），管壳（420）内的电元件与第一电气线路（311）电连接，第一电气线路（311）通过电路板内部线路（350）与第二电气线路（320）电连接。

Description

一种光模块
本公开要求在2021年01月08日提交中国专利局、申请号为202110024351.6、专利名称为“一种光模块”、在2021年01月08日提交中国专利局、申请号为202110026033.3、专利名称为“一种光模块”的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及光通信技术领域，尤其涉及一种光模块。
背景技术
随着云计算、移动互联网、视频等新型业务和应用模式发展，光通信技术的发展进步变的愈加重要。而在光通信技术中，光模块是实现光电信号相互转换的工具，是光通信设备中的关键器件之一，并且随着光通信技术发展的需求光模块的传输速率不断提高。
发明内容
一方面，本公开实施例提供了一种光模块，包括：管壳，内部设有腔体，所述腔体内设置有光电元件；其一端设有光窗，所述管壳内的光通过所述光窗进行传输；其另一端设有插口，所述插口的表面为金属，所述插口与所述腔体连通；电路板，其一端通过所述插口插入所述管壳内，且所述电路板与所述插口的接触处设置有金属层，所述电路板的金属层与所述插口之间的间隙内填充有焊锡件，所述金属层通过所述焊锡件与所述插口焊接固定，以实现所述管壳与所述电路板的气密封装；其插入所述管壳的一端设置有第一电气线路，其远离所述管壳的一端设置有第二电气线路，所述管壳内的电元件与所述第一电气线路电连接，所述第一电气线路通过所述电路板内部线路与所述第二电气线路电连接。
另一方面，本公开实施例提供了一种光模块，包括：管壳，内部设有腔体，所述腔体内设置有光电元件；其一端设有光窗，所述管壳内的光通过所述光窗进行传输；其另一端设有插口，所述插口的表面为金属，所述插口与所述腔体连通；电路板，其一端通过所述插口插入所述管壳内，所述电路板插入所述管壳内的各个侧面上均设置有金属层，所述金属层与所述插口之间的间隙内填充有焊锡件，所述焊锡件的外侧面上涂覆有第一防水层，以实现所述管壳与所述电路板的气密封装；所述电路板插入所述管壳的一侧面的金属层上设置有凹陷区，所述凹陷区内设置有第一电气线路，且所述第一电气线路的间隙处涂覆有第二防水层；所述电路板远离所述管壳的一端设置有第二电气线路，所述管壳内的电元件与所述第一电气线路电连接，所述第一电气线路通过所述电路板内部线路与所述第二电气线路电连接。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图， 对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程、信号的实际时序等的限制。
图1为根据一些实施例的一种光通信系统的连接关系图；
图2为根据一些实施例的一种光网络终端的结构图；
图3为根据一些实施例的一种光模块的结构图；
图4为根据一些实施例的一种光模块的分解图；
图5为光模块中已有气密管壳结构示意图；
图6为光模块中已有气密管壳的分解示意图；
图7为根据一些实施例的一种光模块中气密管壳的结构示意图；
图8为根据一些实施例的一种光模块中气密管壳的分解示意图；
图9为根据一些实施例的一种光模块中电路板的结构示意图；
图10为根据一些实施例的一种光模块中电路板的另一角度结构示意图；
图11为根据一些实施例的一种光模块中电路板的剖视图；
图12为根据一些实施例的一种光模块中气密管壳与电路板的装配过程示意图；
图13为根据一些实施例的一种光模块中气密管壳与电路板的局部装配剖视图；
图14为根据一些实施例的一种光模块中水汽从电路板内部渗入气密管壳的路径示意图；
图15为根据一些实施例的一种光模块中焊锡件的结构示意图；
图16为根据一些实施例的一种光模块中电路板的另一结构示意图；
图17为根据一些实施例的一种光模块中气密管壳与电路板的装配示意图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”、“特定示例(specific example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示 或者隐含地包括一个或者更多个该特征。在本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“耦接”和“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。又如，描述一些实施例时可能使用了术语“耦接”以表明两个或两个以上部件有直接物理接触或电接触。然而，术语“耦接”或“通信耦合(communicatively coupled)”也可能指两个或两个以上部件彼此间并无直接接触，但仍彼此协作或相互作用。这里所公开的实施例并不必然限制于本文内容。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“适用于”或“被配置为”的使用意味着开放和包容性的语言，其不排除适用于或被配置为执行额外任务或步骤的设备。
如本文所使用的那样，“约”、“大致”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
光通信技术中，使用光携带待传输的信息，并使携带有信息的光信号通过光纤或光波导等信息传输设备传输至计算机等信息处理设备，以完成信息的传输。由于光信号通过光纤或光波导中传输时具有无源传输特性，因此可以实现低成本、低损耗的信息传输。此外，光纤或光波导等信息传输设备传输的信号是光信号，而计算机等信息处理设备能够识别和处理的信号是电信号，因此为了在光纤或光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，需要实现电信号与光信号的相互转换。
光模块在光纤通信技术领域中实现上述光信号与电信号的相互转换功能。光模块包括光口和电口，光模块通过光口实现与光纤或光波导等信息传输设备的光通信，通过电口实现与光网络终端(例如，光猫)之间的电连接，电连接主要用于实现供电、I2C信号传输、数据信号传输以及接地等；光网络终端通过网线或无线保真技术(Wi-Fi)将电信号传输给计算机等信息处理设备。
图1为根据一些实施例的一种光通信系统的连接关系图。如图1所示，光通信系统主要包括远端服务器1000、本地信息处理设备2000、光网络终端100、光模块200、光纤101及网线103；
光纤101的一端连接远端服务器1000，另一端通过光模块200与光网络终端100连接。光纤本身可支持远距离信号传输，例如数千米(6千米至8千米)的信号传输，在此基础上如果使用中继器，则理论上可以实现超长距离传输。因此在通常的光通信系统中，远端服务器1000与光网络终端100之间的距离通常可达到数千米、数十千米或数百千米。
网线103的一端连接本地信息处理设备2000，另一端连接光网络终端100。本地信息处理设备2000可以为以下设备中的任一种或几种：路由器、交换机、计算机、手机、平 板电脑、电视机等。
远端服务器1000与光网络终端100之间的物理距离大于本地信息处理设备2000与光网络终端100之间的物理距离。本地信息处理设备2000与远端服务器1000的连接由光纤101与网线103完成；而光纤101与网线103之间的连接由光模块200和光网络终端100完成。
光模块200包括光口和电口。光口被配置为与光纤101连接，从而使得光模块200与光纤101建立双向的光信号连接；电口被配置为接入光网络终端100中，从而使得光模块200与光网络终端100建立双向的电信号连接。光模块200实现光信号与电信号的相互转换，从而使得光纤101与光网络终端100之间建立连接。示例的，来自光纤101的光信号由光模块200转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块200转换为光信号输入至光纤101中。
光网络终端100包括大致呈长方体的壳体(housing)，以及设置在壳体上的光模块接口102和网线接口104。光模块接口102被配置为接入光模块200，从而使得光网络终端100与光模块200建立双向的电信号连接；网线接口104被配置为接入网线103，从而使得光网络终端100与网线103建立双向的电信号连接。光模块200与网线103之间通过光网络终端100建立连接。示例的，光网络终端100将来自光模块200的电信号传递给网线103，将来自网线103的信号传递给光模块200，因此光网络终端100作为光模块200的上位机，可以监控光模块200的工作。光模块200的上位机除光网络终端100之外还可以包括光线路终端(Optical Line Terminal，OLT)等。
远端服务器1000通过光纤101、光模块200、光网络终端100及网线103，与本地信息处理设备2000之间建立了双向的信号传递通道。
图2为根据一些实施例的一种光网络终端的结构图，为了清楚地显示光模块200与光网络终端100的连接关系，图2仅示出了光网络终端100的与光模块200相关的结构。如图2所示，光网络终端100中还包括设置于壳体内的PCB电路板105，设置在PCB电路板105的表面的笼子106，以及设置在笼子106内部的电连接器。电连接器被配置为接入光模块200的电口；散热器107具有增大散热面积的翅片等凸起部。
光模块200插入光网络终端100的笼子106中，由笼子106固定光模块200，光模块200产生的热量传导给笼子106，然后通过散热器107进行扩散。光模块200插入笼子106中后，光模块200的电口与笼子106内部的电连接器连接，从而光模块200与光网络终端100建立双向的电信号连接。此外，光模块200的光口与光纤101连接，从而光模块200与光纤101建立双向的电信号连接。
图3为根据一些实施例的一种光模块的结构图，图4为根据一些实施例的一种光模块的分解图。如图3和图4所示，光模块200包括壳体、设置于壳体中的电路板300及光收发器件；壳体包括上壳体201和下壳体202，上壳体201盖合在下壳体202上，以形成具有两个开口204和205的上述壳体；壳体的外轮廓一般呈现方形体。
在本公开一些实施例中，下壳体202包括底板以及位于底板两侧、与底板垂直设置的两个下侧板；上壳体201包括盖板，以及位于盖板两侧与盖板垂直设置的两个上侧板，由 两个侧壁与两个侧板结合，以实现上壳体201盖合在下壳体202上。
两个开口204和205的连线所在方向可以与光模块200的长度方向一致，也可以与光模块200的长度方向不一致。示例地，开口204位于光模块200的端部(图3的右端)，开口205也位于光模块200的端部(图3的左端)。或者，开口204位于光模块200的端部，而开口205则位于光模块200的侧部。其中，开口204为电口，电路板300的金手指从电口204伸出，插入上位机(如光网络终端100)中；开口205为光口，配置为接入外部的光纤101，以使光纤101连接光模块200内部的光收发器件。
采用上壳体201、下壳体202结合的装配方式，便于将电路板300、光收发器件等器件安装到壳体中，由上壳体201、下壳体202可以对这些器件形成封装保护。此外，在装配电路板300等器件时，便于这些器件的定位部件、散热部件以及电磁屏蔽部件的部署，有利于自动化的实施生产。
在一些实施例中，上壳体201及下壳体202一般采用金属材料制成，利于实现电磁屏蔽以及散热。
在一些实施例中，光模块200还包括位于其壳体外壁的解锁部件203，解锁部件203被配置为实现光模块200与上位机之间的固定连接，或解除光模块200与上位机之间的固定连接。
示例地，解锁部件203位于下壳体202的两个下侧板的外壁，包括与上位机的笼子(例如，光网络终端100的笼子106)匹配的卡合部件。当光模块200插入上位机的笼子里，由解锁部件203的卡合部件将光模块200固定在上位机的笼子里；拉动解锁部件203时，解锁部件203的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块200与上位机的卡合关系，从而可以将光模块200从上位机的笼子里抽出。
电路板300包括电路走线、电子元件及芯片，通过电路走线将电子元件和芯片按照电路设计连接在一起，以实现供电、电信号传输及接地等功能。电子元件例如可以包括电容、电阻、三极管、金属氧化物半导体场效应管(Metal-Oxide-Semiconductor Field-Effect Transistor，MOSFET)。芯片例如可以包括微控制单元(Microcontroller Unit，MCU)、限幅放大器(limiting amplifier)、时钟数据恢复芯片(Clock and Data Recovery，CDR)、电源管理芯片、数字信号处理(Digital Signal Processing，DSP)芯片。
电路板300一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳的承载芯片；硬性电路板还可以插入上位机笼子中的电连接器中。
电路板300还包括形成在其端部表面的金手指，金手指由相互独立的多个引脚组成。电路板300插入笼子106中，由金手指与笼子106内的电连接器导通连接。金手指可以仅设置在电路板300一侧的表面(例如图4所示的上表面)，也可以设置在电路板300上下两侧的表面，以适应引脚数量需求大的场合。金手指被配置为与上位机建立电连接，以实现供电、接地、I2C信号传递、数据信号传递等。当然，部分光模块中也会使用柔性电路板。柔性电路板一般与硬性电路板配合使用，以作为硬性电路板的补充。
图5为光模块中已有气密管壳的结构示意图，图6为光模块中已有气密管壳的分解示 意图。如图5、图6所示，已有的气密管壳主要由金属盖板410、金属管壳420与陶瓷电路板430组成，金属管壳420的上方开口，其内部设置有腔体，光收发器件(包括光发射次模块或光接收次模块)等器件设置于该腔体内；金属盖板410盖合在金属管壳420上方的开口处，以通过金属盖板410与金属管壳420形成密封腔体，保证金属管壳420内光学组件等的封装密封性；陶瓷电路板430的一端插入金属管壳420内，且陶瓷电路板430与金属管壳420之间密封焊接；陶瓷电路板430上设有金属电路，管壳420内的光学组件等通过陶瓷电路板430上的金属电路与电路板300进行电气互联。
在本公开的某一些实施例中，将陶瓷电路板430插入金属管壳420内，再将光学组件等器件放置于管壳420内部的腔体中，光学组件的不同零器件与陶瓷电路板430电连接实现功能后，将金属盖板410通过平行封焊工艺实现管壳内部的气密封装。
已有的气密管壳设计方式为：将陶瓷进行金属化，采用HTCC(High Temperature Co-Fired Ceramic，高温共烧陶瓷)工艺，将预先设计好的电路通过打孔、填孔、印制等方式用金属浆料制作在生瓷片上，然后再经过叠层、高温烧结等工艺最终制成陶瓷电路板；然后将陶瓷电路板与金属管壳进行高温烧结焊接在一起，从而实现管壳内外电气互联的同时并保持管壳的气密性。
但是，已有气密管壳的陶瓷电路板采用的高温陶瓷烧结工艺复杂，技术难点大，成本高居不下。为了降低成本、提高高速信号质量，目前已经在数据中心领域引入非气密管壳，但非气密管壳只能在环境较好的数据中心机房使用，无法满足户外如无线5G等环境恶劣的领域应用。
为了解决上述问题，本公开实施例提供了一种新型的气密管壳，该气密管壳主要由电路板(替代已有方案的陶瓷共烧结电路板)、管壳及焊锡件组成，电路板与管壳之间使用焊锡件焊接在一起，通过焊锡件将电路板与管壳之间的缝隙全部密封。
在本公开实施例中，电路板300为(Printed Circuit Board，印刷电路板)硬性PCB线路板，其为多层PCB电路板，PCB的板材及层与层之间通过粘合剂粘合在一起。PCB电路板主要材料是覆铜板，覆铜板是由基板、铜箔和粘合剂构成的，基板是由高分子合成树脂和增强材料组成的绝缘层板，在基板的表面覆盖着一层导电率较高、焊接性良好的纯铜箔，铜箔覆盖在基板一面的覆铜板称为单面覆铜板，基板的两面均覆盖铜箔的覆铜板称为双面覆铜板，铜箔能够牢固地覆在基板上，由粘合剂来完成。而已有的陶瓷电路板430与本公开提供的电路板300并不相同，其与管壳420高温烧结焊接在一起后，其位于管壳420的一侧需直接或通过柔性电路板连接至电路板300上，通过电路板300上的芯片驱动管壳420内的电元件工作。
图7为根据一些实施例的一种光模块中气密管壳的结构示意图，图8为根据一些实施例的一种光模块中气密管壳的分解示意图。如图7、图8所示，根据一些实施例的气密管壳中的管壳420内部设有腔体，该腔体内设置有光电元件，如激光器芯片或光电探测器等；管壳420的一端设有插口421，该插口421与腔体相连通；电路板300的一端通过该插口421插入管壳420内，以与腔体内的电元件进行电连接，从而驱动电元件实现相应的功能，如实现光发射或光接收功能；管壳420上与插口421相对的侧面上的设置有光口，管壳420 内的光通过光口进行光传输。管壳420远离电路板300的一侧一般连接有光纤适配器，光纤适配器与管壳420的光口相连接，以方便光口与光纤适配器之间的光束传输。
当管壳420内设置有光发射次模块时，光发射次模块一般包括光发射芯片等电元件及透镜、隔离器等光器件，光发射芯片靠近插入管壳420的电路板300，以方便通过打线实现光发射芯片与电路板300的电连接，从而驱动光发射芯片发射光束；透镜设置在光发射芯片与管壳420的光口之间，且其位于光发射芯片的光发射光路上，即靠近管壳420的光口，如此光发射芯片发射的光束进入透镜，经透镜将发散光束转换为会聚光束，会聚光束经过管壳420的光口会聚耦合至光纤适配器中，实现了光的发射。
当管壳420内设置有光接收次模块时，光接收次模块一般包括透镜等光器件及光探测器、跨阻放大器等电元件，透镜、光探测器与跨阻放大器沿光路传输方向依次设置在管壳420内，即透镜靠近管壳420的光口，跨阻放大器靠近管壳420的插口421，光探测器设置在透镜与跨阻放大器之间，且光探测器与跨阻放大器均通过打线与电路板300电连接。如此光纤适配器传输的光束经管壳420的光口传输至透镜，经透镜将发散光束转换为准直光束，准直光束进入光探测器内，经光探测器将准直光束转换为电信号，输出的电信号进入跨阻放大器，经跨阻放大器进行放大，放大后的电信号传输至电路板300。
在本公开实施例中，为保证管壳420的密封性，在该光口处封装有透明的光窗450，光窗450为允许光通过的玻璃片，如此光发射芯片发射的光束进入透镜，经透镜将光束转换为会聚光束，会聚光束透过光窗450耦合至光纤适配器中；或者，光纤适配器传输的光束经光窗450传输至透镜，经透镜将发散光束转换为准直光束，准直光束进入光探测器内，经光探测器将准直光束转换为电信号。
在本公开实施例中，为了增强光窗450的透射度，防止光反射现象影响光转换元件的性能，通常将光窗450倾斜一个预设角度(通常为8°)，且玻璃片的表面镀上对应波长的增透膜，以增强光束的透过率。
电路板300插入管壳420后，通过焊锡件440将电路板300与管壳420之间的缝隙进行密封，因此，为方便管壳420与焊锡件440的焊接，管壳420的插口421表面为金属，管壳420与焊锡件440直接焊接。在本公开实施例中，管壳420的表面金属为容易与焊锡件440焊接的金属，如镀金层、镀镍层等。
在本公开实施例中，焊锡件440可为结构件，即焊锡件440包括第一侧板、第二侧板与第三侧板，第二侧板的两端分别与第一侧板、第三侧板相连接，且第一侧板与第三侧板相对设置，将焊锡件440的第一侧板与第三侧板分别与插口421的两侧壁焊接在一起；焊锡件440的第二侧板上设置有通孔，电路板300穿过该通孔插入管壳420内，将电路板300穿过通孔后，将电路板300与通孔的交界处焊接在一起，如此通过焊锡件440将电路板300与管壳420之间的缝隙全部密封。
焊锡件440也可为焊接材料，将电路板300通过管壳420的插口421插入管壳420后，在电路板300的侧面与管壳420的缝隙处涂上焊锡料，然后将焊锡料与管壳420、焊锡料与电路板300的侧面之间分别进行焊接，以将电路板300与管壳420之间的缝隙全部密封。
在本公开实施例中，焊锡件440包括但不限于焊锡膏、焊料片、焊锡丝等。
图9为根据一些实施例的一种光模块中电路板的结构示意图，图10为根据一些实施例的一种光模块中电路板的另一角度结构示意图。如图9、图10所示，电路板300与插口421的接触处设置有金属层，电路板300的金属层与插口421之间的间隙内填充有焊锡件440，金属层通过焊锡件440与插口421焊接固定，以实现管壳420与电路板300的气密封装。
在本公开实施例中，为方便在电路板300的侧面上设置金属层，可在电路板300插入管壳420的各个侧面上均设置金属层，电路板300通过金属层与焊锡件440焊接。即电路板300的各个侧面上铺设有铜层，且铜层表面上镀有金层，如此既可方便电路板300的侧面与焊锡件440焊接固定，也可避免外部水汽通过电路板300与管壳420之间的缝隙渗入到管壳420内部。
在本公开的某一些实施例中，电路板300插入管壳420的部分包括第一侧面301、第二侧面302、第三侧面303、第四侧面304与第五侧面305，第一侧面301为电路板300的上侧面，朝向管壳420的上部开口；第五侧面305为电路板300的下侧面，与第一侧面301相对；第二侧面302为电路板300的后侧面，其上、下边缘分别与第一侧面301、第五侧面305连接；第四侧面304为电路板300的前侧面，其与第二侧面302相对；第三侧面303为电路板300的右侧面，其上、下边缘分别与第一侧面301、第五侧面305连接，其前、后边缘分别与第二侧面302、第四侧面304连接。电路板300的第一侧面301、第二侧面302、第四侧面304与第五侧面305插入管壳420的侧面上均铺设有铜层并表面镀金，以便于使用焊锡件440将电路板300与管壳420之间的缝隙堵住并焊接固定，以免外部水汽等通过电路板300与管壳420之间的缝隙渗入到管壳420的内部，影响管壳420内光学组件的性能。
虽然电路板300与管壳420之间通过焊锡件440实现了密封，但电路板300是多层板结构，电路板的板材以及层与层之间的结合处都容易被水汽渗入，但金属的防水性能是非常好的，为了防止水汽通过电路板300内部渗入到管壳420内部，本公开除了对电路板300的第一侧面301、第二侧面302、第四侧面304与第五侧面305铺上铜皮且表面镀金外，电路板300插入管壳420内部的侧面也铺上铜皮并表面镀金，即电路板300的第三侧面303也铺设有铜层并表面镀金，如此电路板300右侧面的第三侧面303的金属层起到阻挡水汽的最后一道防线的作用。
在本公开实施例中，电路板300的第一侧面301、第二侧面302、第四侧面304与第五侧面305未插入管壳420的侧面上没有设置金属层，即电路板300上设置有第二电气线路320的端面上没有设置金属层，电路板300上设置金属层的距离略大于电路板300插入管壳420的第三侧面303至管壳420的左侧面之间的距离，电路板300的其余部分并没有设置金属层。
图11为根据一些实施例的一种光模块中电路板的剖视图。如图11所示，由于电路板300的上下表面为了气密焊接铺设了铜层并表面镀金，使得电路板300的表面上无法走线，因此电路板300插入管壳420的一端设置有第一电气线路311，其远离管壳420的一端设置有第二电气线路320，管壳420内的电元件与第一电气线路311电连接，第一电气线路 311通过电路板300内部线路与第二电气线路320电连接。由于电路板300插入管壳420的各个侧面上均设有金属层，为了在电路板300插入管壳420的一端设置第一电气线路311，需要在电路板300的金属层上设置一个凹陷区310，该凹陷区310的表面为电路板300的表面，且其表面并未涂覆金属层，第一电气线路311即设置在该凹陷区310内。在本公开实施例中，第一电气线路311与第二电气线路320可为电路焊盘，沿电路板300的宽度方向依次设置多个电路焊盘，第一电路焊盘与第二电路焊盘可通过电路板300的内部线路350电连接。
在本公开的某一些实施例中，电路板300的第一侧面301上设置有第一电气线路311与第二电气线路320，第一电气线路311位于管壳420的腔体内，第二电气线路320位于管壳420的外部，由于电路板300的表面上无法走线，为了实现电气连接，在电路板300内部设置有内部线路350，该内部线路350的一端与第一电气线路311电连接，另一端与第二电气线路320连接，从而将电路引到电路板300中间层的内部线路350，通过内部线路350走到管壳420的外部后，再将电路引回到电路板300的表面。
为了实现第一电气线路311、第二电气线路320与电路板300的内部线路350电连接，电路板300内设置有第一过孔330与第二过孔340，第一过孔330设置于第一电气线路311的下方，第一电气线路311通过第一过孔330与内部线路350电连接；第二过孔340设置于第二电气线路320的下方，第二电气线路320通过第二过孔340与内部线路350电连接。在本公开实施例中，第一过孔330与第二过孔340均为盲孔，第一过孔330连通第一电气线路311与内部线路350，第二过孔340连通第二电气线路320与内部线路350。
在本公开实施例中，第一电气线路311可包括多个第一电路焊盘，多个第一电路焊盘沿电路板300的宽度方向依次设置；第二电气线路320可包括多个第二电路焊盘，多个第二电路焊盘沿电路板300的宽度方向依次设置。第一过孔330设置在第一电路焊盘与内部线路350之间，第二过孔340设置在第二电路焊盘与内部线路350之间，且内部线路350的一端与第一过孔330电连接、另一端与第二过孔340电连接。
由于电路板300的第一侧面301插入管壳420的端面上设置有第一电气线路311，其表面上无法铺设铜层，如此外部水汽可能通过电路板300层与层之间的缝隙渗入至管壳420内部，因此在第一电气线路311靠近管壳420的边缘与电路板300的边缘之间存在间隙，即凹陷区310的边缘与第三侧面303之间存在有间隙，该间隙上设置有金属层，以阻挡水汽渗入。在本公开实施例中，第一电气线路311的边缘与电路板300的第三侧面303之间间隙的尺寸≥0.1mm。
在本公开的某一些实施例中，在电路板300的第一侧面301上，凹陷区310的右侧边缘与第一侧面301的右侧边缘之间留有间隙，该间隙上铺设有铜层并表面镀有金层，且该间隙上的金属层与第一侧面301、第三侧面303上的金属层相连接，以免外部水汽等通过电路板300与管壳420之间的缝隙渗入到管壳420的内部，影响管壳420内光学组件的性能。
图12为根据一些实施例的一种光模块中气密管壳与电路板的装配过程示意图。如图12所示，将电路板300插入管壳420的各个侧面上均铺设铜层并表面镀金，且在电路板 300的两端分别设置第一电气线路311与第二电气线路320，在电路板300的中间层设置内部线路350，在第一电气线路311下方设置第一过孔330连接内部线路350，在第二电气线路320下方设置第二过孔340连接内部线路350后，分别对电路板300与管壳420进行清洗，可使用等离子清洗或超声波清洗；然后将电路板300通过管壳420的插口421插入管壳420内，使得第一电气线路311位于管壳420的腔体内，第二电气线路320位于管壳420的壳体外，必要时可使用胶水将两者的交界处进行预固定；然后在管壳420与电路板300交界处的缝隙处涂上焊锡膏，通过回流焊将管壳420与电路板300通过焊锡膏焊接在一起。
将管壳420与电路板300通过焊锡膏焊接在一起后，需要工作人员对焊接后的气密管壳进行外观检查与检漏，以检测电路板300与管壳420的装配密封性，以避免外部水汽等通过电路板300与管壳420之间的缝隙渗入到管壳420内部。
图13为根据一些实施例的一种光模块中气密管壳与电路板的局部装配剖视图。如图13所示，将管壳420与电路板300通过焊锡膏焊接在一起后，将光学组件(如光发射次模块或光接收次模块)放置于管壳420的腔体内，并将管壳420内的电元件通过打线与电路板300上的第一电气线路311进行电连接，然后通过第一过孔330、内部线路350、第二过孔340将电路引回到电路板300表面的第二电气线路320，由此实现管壳420内外的电气互联；另外，管壳420内的光通过光窗进行传输，从而实现了管壳内外电气互联的同时并保持管壳的气密性。
图14为根据一些实施例的一种光模块中水汽从电路板内部渗入气密管壳的路径示意图。如图14所示，管壳420与电路板300之间通过焊锡件440焊接在一起，但焊锡件440焊接时有可能产生炸孔、气泡甚至裂纹等不良问题，导致管壳420在焊接处产生漏气，从而导致水汽由焊接处的气泡、裂纹等渗入至管壳420的内部，影响管壳420内光电元件的性能。
图15为根据一些实施例的一种光模块中焊锡件的结构示意图。如图15所示，为了避免焊接件440与管壳420、电路板300焊接时，因焊接不好出现气泡裂纹等导致水汽渗入，本公开在管壳420与电路板300之间的缝隙通过焊锡件440焊接在一起后，在焊锡件440的各个外侧面上均涂覆有第一防水层441，第一防水层441可覆盖焊锡件440焊接不好出现的气泡、裂纹等，如此可解决焊锡件440开裂或气泡等因素造成的漏气现象。在本公开实施例中，第一防水层441可为胶水层，在管壳420与电路板300之间的缝隙通过焊锡件440焊接在一起后，在焊锡件440的外面覆盖一层胶水，解决了管壳420在焊接处产生的漏气现象，避免了水汽由焊接的气泡、开裂等处渗入至管壳420的内部。
图16为根据一些实施例的一种光模块中电路板的另一结构示意图，图17为根据一些实施例的一种光模块中气密管壳与电路板的装配示意图。如图16、图17所示，在本公开实施例中，电路板300插入管壳420的一端设有凹陷区310，该凹陷区310的底面为电路板的表面，凹陷区310的顶面为电路板的金属层表面，且该凹陷区310内设置有第一电气线路311，为了设置第一电气线路311，凹陷区310的表面并未设置金属层，如此水汽通过电路板300的多层板之间的缝隙进入电路板300后，水汽可通过凹陷区310进入管壳420的内部，影响管壳420内光电元件的性能。
为了避免水汽由电路板300内部渗透至管壳420内，电路板300在管壳420内部的第一电气线路311的四周全部为铜皮，使第一电气线路311与外围铜皮之间形成凹陷区310，即图中的剖线位置，该位置也即水汽渗入的位置。本公开实施例在凹陷区310的表面设置第二防水层。即将第一电气线路311设置在凹陷区310内，且第一电气线路311通过第一过孔330与电路板300内部线路350电连接后，在第一电气线路311与凹陷区310边缘之间、第一电气线路311之间的间隙内设置第二防水层，如此即便电路板300内部存有水汽，第二防水层可阻挡水汽，水汽也无法由凹陷区310的表面进入管壳420的内部。
在本公开实施例中，第二防水层可为胶水层，为了方便管壳420内的电元件通过打线与第一电气线路311电连接，将电路板300设置有第一电气线路311的一端插入管壳420后，通过焊锡件440将电路板300与管壳420焊接在一起之后，将管壳420内的电元件通过打线与第一电气线路311电连接，之后在电路板300的凹陷区310内添加一层放水汽的胶水，凹陷设计使胶水不会四处流动，胶水固化后形成防水层，即可阻止水汽从此处渗入。
根据一些实施例的光模块包括管壳、电路板与焊锡件，管壳内部设有腔体，该腔体内设置有光电元件；管壳的一端设有插口，插口与腔体相连通，电路板的一端通过插口插入管壳内，且电路板插入管壳的各个侧面上均设置有金属层，插口的表面为金属，焊锡件设置在管壳的插口与电路板之间的间隙内，从而通过焊锡件将电路板与管壳焊接在一起，且焊锡件的外侧设置有第一防水层，通过第一防水层覆盖焊锡件焊接不好时出现的气泡、裂纹等，以实现管壳与电路板的气密封装，从而避免焊锡件开料或气泡等因素造成的漏气现象；电路板插入管壳内的一端设有凹陷区，该凹陷区内设置有第一电气线路，电路板远离管壳的一端设有第二电气线路，电路板的中间层设置有内部线路，第一电气线路通过第一过孔与内部线路电连接，第二电气线路通过第二过孔与内部线路电连接，腔体内的电元件通过打线方式与电路板上的第一电气线路电连接，从而通过第一过孔将电路引到电路板的中间层，通过中间层的内部线路走到管壳的外部后，再由第二过孔将电路引回到电路板表面的第二电气线路，从而实现了管壳内外电气互联；由于凹陷区的表面未设置金属层，无法阻挡水汽由此处渗入管壳420内，因此在凹陷区内除去第一电气线路的区域内设置有第二防水层，通过第二防水层覆盖凹陷区的底面，以阻止水汽由此处渗入；管壳的另一端设有光窗，管壳内的光通过该光窗进行传输，以实现光的发射或接收。本公开提供的光模块将电路板直接插入管壳内，通过焊锡件将电路板与管壳之间的缝隙全部密封，通过焊锡件外侧的第一防水层来避免焊锡件焊接开裂或气泡等因素造成的水汽渗入，通过电路板凹陷区底面的第二防水层来避免水汽由凹陷区渗入管壳内，工艺简单，成本低，替代了目前工艺复杂、成本高的高温共烧陶瓷工艺的气密管壳，且光学组件的电元件直接通过打线与电路板电连接，高频性能更佳，更好地满足户外如5G等环境恶劣领域的应用。
需要说明的是，在本说明书中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的电路结构、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种电路结构、物品或者设备所固有的要素。在没有更多限制的情况下，有语句“包括一个……”限定的要素，并不排除在包括所述要素的电路结构、物品或者设备中还存在另外的相同要素。
本领域技术人员在考虑说明书及实践这里发明的公开后，将容易想到本公开的其他实施方案。本公开旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求的内容指出。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (19)

  1. 一种光模块，其特征在于，包括：
    管壳，内部设有腔体，所述腔体内设置有光电元件；其一端设有光窗，所述管壳内的光通过所述光窗进行传输；其另一端设有插口，所述插口的表面为金属，所述插口与所述腔体连通；
    电路板，其一端通过所述插口插入所述管壳内，且所述电路板与所述插口的接触处设置有金属层，所述电路板的金属层与所述插口之间的间隙内填充有焊锡件，所述金属层通过所述焊锡件与所述插口焊接固定，以实现所述管壳与所述电路板的气密封装；其插入所述管壳的一端设置有第一电气线路，其远离所述管壳的一端设置有第二电气线路，所述管壳内的电元件与所述第一电气线路电连接，所述第一电气线路通过所述电路板内部线路与所述第二电气线路电连接。
  2. 根据权利要求1所述的光模块，其特征在于，所述电路板包括相对设置的第一侧面与第四侧面、第二侧面与第五侧面，所述第一侧面、所述第二侧面、所述第四侧面与所述第五侧面插入所述管壳的部分侧面上均设置有金属层，其未插入所述管壳的部分侧面上没有设置金属层。
  3. 根据权利要求2所述的光模块，其特征在于，所述电路板还包括与所述第一侧面、所述第二侧面、所述第四侧面与所述第五侧面相连接的第三侧面，所述第三侧面插入所述管壳内，且所述第三侧面上设置有金属层。
  4. 根据权利要求2所述的光模块，其特征在于，所述第一电气线路与所述第二电气线路设置于所述电路板的第一侧面上，所述第一电气线路靠近所述管壳的边缘与所述电路板的边缘之间存在间隙，所述间隙上设置有金属层。
  5. 根据权利要求4所述的光模块，其特征在于，所述间隙的尺寸≥0.1mm。
  6. 根据权利要求1所述的光模块，其特征在于，所述电路板内设有第一过孔与第二过孔，所述第一电气线路通过所述第一过孔与所述内部线路电连接，所述第二电气线路通过所述第二过孔与所述内部线路电连接。
  7. 根据权利要求6所述的光模块，其特征在于，所述第一过孔与所述第二过孔均为盲孔。
  8. 根据权利要求1所述的光模块，其特征在于，所述插口的金属为镀金层、镀镍层。
  9. 根据权利要求1所述的光模块，其特征在于，所述电路板上的金属层为铜层，且所述铜层表面上镀有金层。
  10. 根据权利要求1所述的光模块，其特征在于，所述焊锡件包括焊锡膏、焊料片与焊锡丝。
  11. 一种光模块，其特征在于，包括：
    管壳，内部设有腔体，所述腔体内设置有光电元件；其一端设有光窗，所述管壳内的光通过所述光窗进行传输；其另一端设有插口，所述插口的表面为金属，所述插口与所述腔体连通；
    电路板，其一端通过所述插口插入所述管壳内，所述电路板插入所述管壳内的各个侧面上均设置有金属层，所述金属层与所述插口之间的间隙内填充有焊锡件，所述焊锡件的外侧面上涂覆有第一防水层，以实现所述管壳与所述电路板的气密封装；所述电路板插入所述管壳的一侧面的金属层上设置有凹陷区，所述凹陷区内设置有第一电气线路，且所述第一电气线路的间隙处涂覆有第二防水层；所述电路板远离所述管壳的一端设置有第二电气线路，所述管壳内的电元件与所述第一电气线路电连接，所述第一电气线路通过所述电路板内部线路与所述第二电气线路电连接。
  12. 根据权利要求11所述的光模块，其特征在于，所述电路板包括第一侧面、第二侧面、第三侧面、第四侧面与第五侧面，所述第一侧面、所述第二侧面、所述第三侧面、所述第四侧面与所述第五侧面插入所述管壳的侧面上均设置有金属层；
    所述凹陷区设置于所述第一侧面位于所述管壳内的侧面上，所述凹陷区的表面上没有设置金属层，所述第二防水层设置于所述第一电气线路与所述凹陷区的空隙处。
  13. 根据权利要求12所述的光模块，其特征在于，所述第一电气线路包括多个第一电路焊盘，所述第二防水层覆盖相邻所述第一电路焊盘之间、所述第一电路焊盘的边缘与所述凹陷区的边缘之间的空隙。
  14. 根据权利要求12所述的光模块，其特征在于，所述凹陷区靠近所述光窗的边缘与所述电路板靠近所述光窗的边缘之间设置有间隙，所述间隙处涂覆有金属层。
  15. 根据权利要求14所述的光模块，其特征在于，所述凹陷区与所述电路板边缘之间间隙处的金属层与所述电路板侧面上的金属层相连接。
  16. 根据权利要求13所述的光模块，其特征在于，所述第二电气线路包括多个第二电路焊盘，所述第二电路焊盘与所述电路板内部线路之间设置有第二过孔；所述第一电路焊盘与所述电路板内部线路之间设置有第一过孔，所述内部线路的一端与所述第一过孔电连接、另一端与所述第二过孔电连接。
  17. 根据权利要求16所述的光模块，其特征在于，所述第一过孔与所述第二过孔均为盲孔。
  18. 根据权利要求16所述的光模块，其特征在于，所述电路板上设置有第二电气线路的端面上没有设置金属层。
  19. 根据权利要求11所述的光模块，其特征在于，所述第一防水层与所述第二防水层均为胶水层。
PCT/CN2021/134352 2021-01-08 2021-11-30 一种光模块 Ceased WO2022148183A1 (zh)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022148183A1 (zh) * 2021-01-08 2022-07-14 青岛海信宽带多媒体技术有限公司 一种光模块
KR102813610B1 (ko) * 2022-09-26 2025-05-29 한국전자통신연구원 연성인쇄회로기판과 세라믹 피드스루 구조체의 고정밀 접합을 위한 광 트랜시버 및 패키지 구조체

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013044952A (ja) * 2011-08-24 2013-03-04 Fujitsu Ltd 防水アダプタ及び光モジュール取り付け方法
CN104459907A (zh) * 2014-12-05 2015-03-25 苏州旭创科技有限公司 光模块及其制造方法
CN104730656A (zh) * 2015-04-01 2015-06-24 苏州旭创科技有限公司 光模块及其制造方法
US20160154177A1 (en) * 2014-11-27 2016-06-02 Electronics And Telecommunications Research Institute Optical module
CN205350898U (zh) * 2016-01-29 2016-06-29 石家庄七彩联创光电科技有限公司 一种超薄防水led灯

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7439449B1 (en) * 2002-02-14 2008-10-21 Finisar Corporation Flexible circuit for establishing electrical connectivity with optical subassembly
US6786627B2 (en) * 2001-09-21 2004-09-07 Sumitomo Electric Industries, Ltd. Light generating module
US6867368B2 (en) * 2002-02-14 2005-03-15 Finisar Corporation Multi-layer ceramic feedthrough structure in a transmitter optical subassembly
JP2004281682A (ja) * 2003-03-14 2004-10-07 Sumitomo Electric Ind Ltd 光送信装置
US7322754B2 (en) * 2004-02-11 2008-01-29 Jds Uniphase Corporation Compact optical sub-assembly
US7317742B2 (en) * 2004-02-19 2008-01-08 Sumitomo Electric Industries, Ltd. Optical sub-assembly having a thermo-electric cooler and an optical transceiver using the optical sub-assembly
US7629537B2 (en) * 2004-07-09 2009-12-08 Finisar Corporation Single layer flex circuit
JP2007071980A (ja) * 2005-09-05 2007-03-22 Mitsubishi Electric Corp 光モジュール
JP5263286B2 (ja) * 2008-03-11 2013-08-14 富士通オプティカルコンポーネンツ株式会社 接続装置および光デバイス
GB201012829D0 (en) * 2010-07-30 2010-09-15 Oclaro Technology Ltd Enclosure for a laser package and laser package comprising same
KR101430634B1 (ko) * 2010-11-19 2014-08-18 한국전자통신연구원 광 모듈
JP5779339B2 (ja) * 2010-11-24 2015-09-16 日本オクラロ株式会社 光モジュール
US8644357B2 (en) * 2011-01-11 2014-02-04 Ii-Vi Incorporated High reliability laser emitter modules
US9538637B2 (en) * 2011-06-29 2017-01-03 Finisar Corporation Multichannel RF feedthroughs
US9042735B2 (en) * 2011-12-13 2015-05-26 Sumitomo Electric Industries, Ltd. Optical transceiver having an extra area in circuit board for mounting electronic circuits
JP2013145356A (ja) * 2011-12-13 2013-07-25 Sumitomo Electric Ind Ltd 光通信モジュール
WO2013125728A1 (en) * 2012-02-21 2013-08-29 Sumitomo Electric Industries, Ltd. Receiver optical module for receiving wavelength multiplexed optical signals
KR20140063323A (ko) * 2012-11-16 2014-05-27 한국전자통신연구원 피드 스루
JP6055661B2 (ja) * 2012-11-16 2016-12-27 日本オクラロ株式会社 光モジュール及び光送受信装置
JP6398316B2 (ja) * 2014-05-20 2018-10-03 住友電気工業株式会社 光トランシーバ
WO2015190089A1 (en) * 2014-06-10 2015-12-17 Sumitomo Electric Industries, Ltd. Optical receiver module and process to assemble optical receiver module
JP2016197634A (ja) * 2015-04-02 2016-11-24 日立金属株式会社 光モジュール
JP2016197635A (ja) * 2015-04-02 2016-11-24 日立金属株式会社 送受一体型光サブアセンブリ及び光モジュール
US9548817B1 (en) * 2015-06-19 2017-01-17 Inphi Corporation Small form factor transmitting device
US9671580B1 (en) * 2015-07-01 2017-06-06 Inphi Corporation Photonic transceiving device package structure
JP6651868B2 (ja) * 2016-01-26 2020-02-19 住友電気工業株式会社 光受信モジュール
JP6834108B2 (ja) * 2016-11-25 2021-02-24 住友電工デバイス・イノベーション株式会社 電子装置組立体
JP7030417B2 (ja) * 2017-03-27 2022-03-07 日本ルメンタム株式会社 光サブアセンブリ、光モジュール、及び光伝送装置
US10484121B2 (en) * 2017-06-30 2019-11-19 Sumitomo Electric Industries, Ltd. Receiver optical module implementing optical attenuator
CN109287092B (zh) * 2017-07-19 2019-11-29 苏州旭创科技有限公司 光模块
CN109283634B (zh) * 2017-07-19 2020-05-22 苏州旭创科技有限公司 光模块
JP2019021866A (ja) * 2017-07-21 2019-02-07 住友電工デバイス・イノベーション株式会社 半導体レーザ装置
JP6958098B2 (ja) * 2017-08-10 2021-11-02 住友電気工業株式会社 光モジュール
JP2019106473A (ja) * 2017-12-13 2019-06-27 住友電気工業株式会社 フレキシブルプリント基板及び光モジュール
US10313024B1 (en) * 2018-04-26 2019-06-04 Applied Optoelectronics, Inc. Transmitter optical subassembly with trace routing to provide electrical isolation between power and RF traces
US10816739B2 (en) * 2018-10-16 2020-10-27 Ii-Vi Delaware Inc. Horizontal flex circuit with resistance weldable cover
WO2020137682A1 (ja) * 2018-12-26 2020-07-02 住友電工デバイス・イノベーション株式会社 光半導体装置
US10948671B2 (en) * 2019-03-07 2021-03-16 Applied Optoelectronics, Inc. Transmitter optical subassembly (TOSA) with laser diode driver (LDD) circuitry mounted to feedthrough of TOSA housing
JP6784793B2 (ja) * 2019-04-12 2020-11-11 株式会社フジクラ レーザモジュール及びその製造方法
US10754111B1 (en) * 2019-04-22 2020-08-25 The Boeing Company Method for modifying small form factor pluggable transceiver for avionics applications
CN110530056B (zh) * 2019-08-20 2021-05-18 武汉联特科技股份有限公司 多通道并行发射光器件及半导体致冷器
WO2021053764A1 (ja) * 2019-09-18 2021-03-25 日本電信電話株式会社 光モジュール用パッケージ
JP7392501B2 (ja) * 2020-02-06 2023-12-06 住友電気工業株式会社 光受信モジュール用パッケージ
WO2022148183A1 (zh) * 2021-01-08 2022-07-14 青岛海信宽带多媒体技术有限公司 一种光模块
CN114911012B (zh) * 2021-02-09 2024-11-22 宁波环球广电科技有限公司 光通讯模组及光收发器
CN116626819A (zh) * 2022-02-14 2023-08-22 宁波环球广电科技有限公司 光模块
US12160269B2 (en) * 2022-07-29 2024-12-03 Global Technology Inc. Bi-directional and multi-channel optical module with single transmitter and multiple receivers in single casing
US12520418B2 (en) * 2023-06-20 2026-01-06 Ciena Corporation High-speed optical package with continuous radio frequency (RF) flexible printed circuit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013044952A (ja) * 2011-08-24 2013-03-04 Fujitsu Ltd 防水アダプタ及び光モジュール取り付け方法
US20160154177A1 (en) * 2014-11-27 2016-06-02 Electronics And Telecommunications Research Institute Optical module
CN104459907A (zh) * 2014-12-05 2015-03-25 苏州旭创科技有限公司 光模块及其制造方法
CN104730656A (zh) * 2015-04-01 2015-06-24 苏州旭创科技有限公司 光模块及其制造方法
CN205350898U (zh) * 2016-01-29 2016-06-29 石家庄七彩联创光电科技有限公司 一种超薄防水led灯

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