WO2022134491A1 - 一种防止电镀设备挤液组件镀液结晶的装置及方法 - Google Patents

一种防止电镀设备挤液组件镀液结晶的装置及方法 Download PDF

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Publication number
WO2022134491A1
WO2022134491A1 PCT/CN2021/099472 CN2021099472W WO2022134491A1 WO 2022134491 A1 WO2022134491 A1 WO 2022134491A1 CN 2021099472 W CN2021099472 W CN 2021099472W WO 2022134491 A1 WO2022134491 A1 WO 2022134491A1
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Prior art keywords
squeezing
liquid
metallic film
plating solution
wind cutting
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PCT/CN2021/099472
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English (en)
French (fr)
Inventor
臧世伟
刘文卿
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重庆金美新材料科技有限公司
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Application filed by 重庆金美新材料科技有限公司 filed Critical 重庆金美新材料科技有限公司
Priority to JP2022534672A priority Critical patent/JP7345065B2/ja
Priority to EP21908499.3A priority patent/EP4089210A4/en
Priority to US17/752,153 priority patent/US20220282393A1/en
Publication of WO2022134491A1 publication Critical patent/WO2022134491A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Definitions

  • the invention relates to the technical field of manufacture of electroplating copper films, in particular to a device and method for preventing crystallization of a plating solution of a liquid squeezing component of electroplating equipment.
  • the squeezing components of squeezing liquid are generally conductive rollers and squeezing rollers that cooperate with each other to squeeze.
  • the plating solution on its surface will remain on the conductive roller and the squeezing roller. prick.
  • these particles or spikes will pierce the non-metallic film, or form bumps on the surface of the non-metallic film, which seriously affects the quality of the film surface.
  • the present invention provides a device and method for preventing the crystallization of the plating solution of the liquid-squeezing component of the electroplating equipment.
  • a device for preventing crystallization of a plating solution of a liquid squeezing assembly of an electroplating equipment comprising an aqueduct and a squeezing assembly located at the liquid outlet end of the aqueduct, and the non-metallic film is squeezed out through the squeezing assembly after being discharged from the aqueduct.
  • a wind cutting device is arranged between the aqueduct and the squeezing component, which is used for wind cutting the non-metallic film discharged from the liquid; the rear side of the squeezing component is provided with a spray component , for spraying the liquid squeezing component.
  • the present invention according to the above solution is characterized in that the wind cutting device includes an upper wind cutting unit and a lower wind cutting unit, the upper wind cutting unit is located on the upper side of the non-metallic film, and the lower wind cutting unit is located on the non-metallic film the underside of the film.
  • both the air outlet of the upper wind cutting unit and the air outlet of the lower wind cutting unit face the liquid outlet position of the non-metallic film.
  • the present invention according to the above solution is characterized in that the spray assembly includes an upper spray pipe and a lower spray pipe, the upper spray pipe is located on the upper side of the non-metallic film, and the lower spray pipe is located at the upper side of the non-metallic film. the underside of the non-metallic film.
  • the present invention according to the above solution is characterized in that a liquid collecting tank is provided on the lower side of the spray assembly, and the edge of the liquid collecting tank is located outside the liquid squeezing assembly.
  • the present invention according to the above solution is characterized in that a second wind cutting device is provided on the rear side of the spray assembly, and the second wind cutting device is used for wind cutting the non-metallic film after spraying.
  • an auxiliary liquid squeezing assembly is arranged between the spray assembly and the second wind cutting device, for squeezing the non-metallic film after spraying.
  • a method for preventing the crystallization of the plating solution of the liquid-squeezing component of the electroplating equipment is characterized in that, a wind cutting device is added at the liquid outlet end of the non-metallic film, and the non-metallic film with the plating solution is subjected to Wind cutting to remove the plating solution on its surface; a spray assembly is added to the rear side of the liquid squeezing assembly, and the squeezing assembly is sprayed through the spray assembly to prevent the plating solution from crystallizing.
  • the wind cutting equipment performs wind cutting on the non-metallic film after the liquid is discharged to remove the plating solution on the film surface;
  • the non-metallic film is squeezed through the squeeze component
  • the spraying component sprays the squeezing component to prevent its surface from crystallizing
  • the non-metallic film enters other process equipment after passing through the tension roller.
  • step S4 it also includes:
  • the non-metallic film is squeezed through the auxiliary squeeze component
  • the second wind cutting equipment performs wind cutting on the non-metallic film after spraying and squeezing, and removes the spray liquid on the film surface.
  • the beneficial effect is that by adding wind cutting equipment between the aqueduct and the squeezing assembly, the present invention can fully reduce the plating solution carried out by the non-metallic film from the aqueduct and reduce its influence on the squeezing assembly.
  • a spray component is added after the extrusion component, and the extrusion component is diluted and cleaned through the spray component to prevent the crystallization of the plating solution on the extrusion component, thereby ensuring that there is little or no residual plating solution on the extrusion component, eliminating the need for The plating solution is crystallized, thereby avoiding piercing of the non-metallic film or uneven spots caused by the crystallization, and fully improving the quality of the coated product; in addition, the present invention has a targeted additional mechanism to minimize the product volume of the electroplating equipment and reduce the production cost.
  • Fig. 1 is the structural representation of the present invention
  • FIG. 2 is an implementation flowchart of an embodiment of the present invention
  • FIG. 3 is an implementation flowchart of another embodiment of the present invention.
  • a device for preventing the crystallization of the plating solution of the liquid squeezing component of the electroplating equipment includes an aqueduct 10 and a liquid squeezing component located at the liquid outlet end of the aqueduct 10. After the non-metallic film 20 is discharged from the plating solution 11 in the aqueduct 10 , squeeze the liquid through the squeezing component.
  • a wind cutting device ie, the first wind cutting device 30
  • the squeezing assembly which is used for wind cutting the non-metallic film 20 discharged from the liquid; the rear side of the squeezing assembly is provided with The spray assembly 50 is used for spraying the liquid squeezing assembly.
  • the first wind cutting device 30 includes a first upper wind cutting unit and a first downward wind cutting unit.
  • the first upper wind cutting unit is located on the upper side of the non-metallic film 20 and is used for wind cutting the plating solution 11 on the upper side of the non-metallic film 20.
  • the first wind cutting unit is located on the lower side of the non-metallic film 20 and is used for wind cutting and removing the plating solution 11 on the lower side of the non-metallic film 20 .
  • the present invention can remove most of the plating solution 11 carried out from the aqueduct 10 on the film surface of the non-metallic film 20 through the application of the first wind cutting device 30 .
  • the air outlet of the upper wind cutting unit and the air outlet of the lower wind cutting unit are both facing the liquid outlet position of the non-metallic film 20, so that the upper wind cutting unit blows the plating solution on the upper film surface of the non-metallic film into the aqueduct 10, and the lower wind cutting unit The plating solution on the lower film surface of the non-metallic film is blown into the aqueduct 10, so that most of the plating solution on the surface of the non-metallic film 20 falls back into the aqueduct 10 to reduce corrosion to the external structure.
  • the squeezing assembly includes a first conducting roller 41 and a first squeezing roller 42, wherein the first conducting roller 41 is located on the lower side of the first squeezing roller 42, and the first squeezing roller 42 and the first conducting roller 41 communicate with each other. Squeeze, squeezing the non-metallic film 20 .
  • the spray assembly 50 includes an upper spray pipe and a lower spray pipe, the upper spray pipe is located on the upper side of the non-metallic film 20, the liquid outlet of the upper spray pipe faces the first squeezing roller 42, and the lower spray pipe is located on the non-metallic film 20. On the lower side of the metal film 20 , the liquid outlet of the lower spray pipe faces the first conductive roller 41 .
  • the upper spray pipe and the lower spray pipe are made of PVC (polyvinyl chloride) material.
  • PVC polyvinyl chloride
  • other acid and alkali-resistant materials other than PVC can also be used.
  • the spraying device in this embodiment uses pure water to spray the first conductive roller 41 and the first squeezing roller 42 to dilute the plating solution remaining on the surfaces of the first conductive roller 41 and the first squeezing roller 42 to prevent The surfaces of the first conductive roll 41 and the first squeeze roll 42 are crystallized.
  • other special cleaning solutions that do not affect the composition of the plating solution may also be used.
  • the lower side of the spray assembly 50 is provided with a liquid collecting tank 90, the edge of the liquid collecting tank 90 is located on the outside of the liquid squeezing assembly, and the sprayed liquid is collected and discharged through the liquid collecting tank 90 to avoid spraying liquid Damage and damage to other parts of the equipment.
  • the present invention is provided with a second wind cutting device 70 on the rear side of the spraying assembly 50.
  • the cutting device 70 is used for wind-cutting the non-metallic film 20 after spraying, and an auxiliary squeezing component is arranged between the spraying component 50 and the second wind-cutting device 70 for wind-cutting the non-metallic film after spraying 20 to perform the squeeze.
  • the second wind cutting device 70 includes a second upper wind cutting unit and a second lower wind cutting unit, and the second upper wind cutting unit is located on the upper side of the non-metallic film 20, and is used to The liquid on the surface is subjected to wind cutting, and the second lower wind cutting unit is located on the lower side of the non-metallic film 20 and is used for wind cutting the liquid on the lower surface of the non-metallic film.
  • the auxiliary squeezing assembly includes a second conductive roller 61 and a second squeezing roller 62 .
  • the second conductive roller 61 is located on the upper side of the second squeezing roller 62 and passes through the second squeezing roller 62 and the second conductive roller 61 . They squeeze each other, and squeeze the non-metallic film 20 passing by.
  • the film exit end of the squeezing assembly and the film entering end of the auxiliary squeezing assembly are located on the same horizontal plane, so that the non-metallic film 20 between the squeezing assembly and the auxiliary squeezing assembly advances in a horizontal direction, that is, the first squeezing roller 42 and the squeezing position of the first conductive roller 41 and the squeezing position of the second squeezing roller 62 and the second conductive roller 61 are located on the same level, so that the spray assembly can realize the squeezing of the first conductive roller 41 and the first squeezing roller. 42 good spray effect.
  • a tension roller 80 is provided on the rear side of the second wind cutting device 70 , and the non-metallic film 20 is stretched by the tension roller 80 to prevent the non-metallic film 20 from wrinkling.
  • the height of the tension roller 80 is higher than the film exit end of the auxiliary liquid squeezing assembly (that is, the squeezing position between the second squeezing roller 62 and the second conductive roller 61 ), so that the distance between the auxiliary liquid squeezing assembly and the tension roller 80 is The non-metallic film 20 between them is in a rising state, and in cooperation with it, the air outlet of the second wind cutting device 70 faces the auxiliary liquid squeezing component and is inclined to the lower side.
  • the liquid collecting tank 90 is located on the lower side of each roller shaft and the equipment structure. Specifically, the liquid collecting tank 90 is located in the liquid squeezing assembly, the spray assembly 50, the auxiliary liquid squeezing assembly, the second wind cutting device 70 and the tension roller. The lower side of the 80, so that the liquid falling from each link can be recovered.
  • first wind cutting device 30 and second wind cutting device 70 are both made of stainless steel, and in other embodiments, other materials resistant to acid and alkali corrosion other than stainless steel can also be used.
  • a first wind cutting device 30 is arranged between the aqueduct 10 and the squeezing component, and the plating solution 11 carried out from the aqueduct 10 on the front and back of the non-metallic film 20 is removed by the first wind cutting device 30,
  • the plating solution is reduced to be brought into the first conductive roller 41 and the first squeezing roller 42;
  • the second wind cutting device 70 on the rear side of the auxiliary liquid squeezing component to remove the liquid on the film surface of the non-metallic film 20 caused by the spraying, and prevent the sprayed liquid from being brought into the next aqueduct 10 or other equipment
  • the above-mentioned spray liquid and the liquid blown by the second wind cutting device 70 can be collected and discharged through the liquid collecting tank 90 below.
  • a method for preventing the crystallization of the plating solution of the extrusion liquid component of the electroplating equipment is to add wind cutting equipment at the liquid outlet end of the non-metallic film, and wind the non-metallic film with the plating solution through the wind cutting equipment. Cut and remove the plating solution on the surface; add a spray component to the back of the squeeze component, and spray the squeeze component through the spray component to prevent the plating solution from crystallizing.
  • the method for preventing the crystallization of the plating solution of the squeezing component of the electroplating equipment specifically includes the following steps:
  • the first wind cutting device winds the non-metallic film after the liquid is discharged to remove the plating solution on the film surface;
  • the non-metallic film is squeezed through the squeezing assembly (the first conductive roller and the first squeezing roller);
  • the spraying component sprays the squeezing component (the first conductive roller and the first squeezing roller) to prevent the surface crystallization, and the sprayed liquid is collected in the sump;
  • the non-metallic film enters other process equipment after passing through the tension roller.
  • the method for preventing the crystallization of the plating solution of the liquid-squeezing component of the electroplating equipment specifically includes the following steps:
  • the first wind cutting device winds the non-metallic film after the liquid is discharged to remove the plating solution on the film surface;
  • the non-metallic film is squeezed through the squeezing assembly (the first conductive roller and the first squeezing roller);
  • the spraying component sprays the squeezing component (the first conductive roller and the first squeezing roller) to prevent the surface crystallization, and the sprayed liquid is collected in the sump;
  • the non-metallic film is squeezed through the auxiliary squeezing component (the second conductive roller and the second squeezing roller);
  • the second wind-cutting equipment wind-cuts the non-metallic film after passing through the auxiliary liquid squeezing components (the second conductive roller and the second liquid squeezing roller) to remove the spray liquid on the rice noodles, so as to avoid the impact of the spray liquid on the subsequent process. ;
  • the non-metallic film enters other process equipment after passing through the tension roller.
  • a first wind cutting device is added between the plating tank, the first conductive roller and the first squeezing roller, and a spray component is added after the first conductive roller and the first squeezing roller, so as to reduce the loss of the plating solution from the plating solution.
  • the plating solution taken out of the tank is diluted and cleaned by the spray operation to the first conductive roller and the first squeeze roller, which ensures that little or no plating solution remains on the first conductive roller and the first squeeze roller, eliminating the need for plating. Liquid crystallizing, thereby reducing the uneven spots on the film surface and improving the quality of copper film products.
  • the invention can fully reduce the plating solution carried out by the non-metallic film from the aqueduct, and reduce its influence on the squeezing component, and at the same time add a spray component after the squeezing component, Dilute and clean the squeezing assembly through the spray assembly to prevent the crystallization of the plating solution on the squeezing assembly, thereby ensuring that little or no plating solution remains on the squeezing assembly, eliminating the crystallization of the plating solution, thereby avoiding the non-metallic film caused by crystallization
  • the piercing or concave and convex points can fully improve the quality of the coated products, so the device and method for preventing the crystallization of the plating solution of the liquid squeezing component of the electroplating equipment of the present invention are practical.

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  • Chemical Kinetics & Catalysis (AREA)
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Abstract

本发明公开了电镀铜膜的制造技术领域中的一种防止电镀设备挤液组件镀液结晶的装置及方法，该装置包括渡槽及位于渡槽出液端的挤液组件，非金属薄膜由渡槽中出液后经挤液组件挤液，渡槽与挤液组件之间设有风切设备，用于对出液的非金属薄膜进行风切；挤液组件的后侧设有喷淋组件，用于对挤液组件进行喷淋；该方法包括增设风切设备对非金属薄膜进行风切除镀液的步骤和增设喷淋组件对挤液组件进行喷淋的步骤。本发明有针对性的增加风切设备和喷淋组件，消除镀液结晶，从而避免结晶造成的非金属薄膜刺穿或凹凸点，充分提高镀膜产品的质量。

Description

一种防止电镀设备挤液组件镀液结晶的装置及方法 技术领域
本发明涉及电镀铜膜的制造技术领域，具体的说，是涉及一种防止电镀设备挤液组件镀液结晶的装置及方法。
背景技术
在铜膜电镀的过程中，非金属薄膜从渡槽中出来的时候，其表面会带有一定的镀液，为了防止对后面工序的影响，渡槽的出液端均设有用于对非金属薄膜进行挤液的挤液组件，一般为相互配合挤压的导电辊和挤液辊。非金属薄膜在经过该挤液组件的时候，其表面的镀液会残留在导电辊和挤液辊上，时间久了之后，导电辊和挤液辊上残留的镀液会结晶形成颗粒或尖刺。后续非金属薄膜在经过该挤液组件的时候，这些颗粒或尖刺会刺破非金属薄膜，或在非金属薄膜的表面形成凹凸点，严重影响了膜面的质量。
现有的电镀设备为了防止这类情况发生，会在各个辊轴结构上设置刮刀，通过刮刀对辊轴表面的铜进行刮除，但是由于电镀设备中辊轴数量较大，这类结构的增设会大大增加整个电镀设备的生产成本；另外，不平整的刮刀也会划伤辊轴表面，起到不利的效果。
上述缺陷，值得解决。
发明内容
为了克服现有的技术的不足，本发明提供一种防止电镀设备挤液组件镀液结晶的装置及方法。
本发明技术方案如下所述：
一方面，一种防止电镀设备挤液组件镀液结晶的装置，包括渡槽及位于所述渡槽出液 端的挤液组件，非金属薄膜由所述渡槽中出液后经所述挤液组件挤液，其特征在于，所述渡槽与所述挤液组件之间设有风切设备，用于对出液的所述非金属薄膜进行风切；所述挤液组件的后侧设有喷淋组件，用于对所述挤液组件进行喷淋。
根据上述方案的本发明，其特征在于，所述风切设备包括上风切单元和下风切单元，所述上风切单元位于所述非金属薄膜的上侧，所述下风切单元位于所述非金属薄膜的下侧。
进一步的，所述上风切单元的出风口和所述下风切单元的出风口均朝向所述非金属薄膜的出液位置。
根据上述方案的本发明，其特征在于，所述喷淋组件包括上喷淋管和下喷淋管，所述上喷淋管位于所述非金属薄膜的上侧，所述下喷淋管位于所述非金属薄膜的下侧。
根据上述方案的本发明，其特征在于，所述喷淋组件的下侧设有集液槽，所述集液槽的边缘位于所述挤液组件的外侧。
根据上述方案的本发明，其特征在于，所述喷淋组件的后侧设有第二风切设备，所述第二风切设备用于对喷淋后的所述非金属薄膜进行风切。
进一步的，所述喷淋组件与所述第二风切设备之间设有辅助挤液组件，用于对喷淋后的所述非金属薄膜进行挤液。
另一方面，一种防止电镀设备挤液组件镀液结晶的方法，其特征在于，在非金属薄膜出液端增加风切设备，通过所述风切设备对带有镀液的非金属薄膜进行风切，去除其表面的镀液；在挤液组件后侧增加喷淋组件，通过所述喷淋组件对所述挤液组件进行喷淋，防止镀液结晶。
根据上述方案的本发明，其特征在于，具体包括以下步骤：
S1、非金属薄膜出液；
S2、风切设备对出液后的非金属薄膜进行风切，去除膜面的镀液；
S3、非金属薄膜经过挤液组件进行挤液；
S4、喷淋组件对挤液组件进行喷淋，防止其表面结晶；
S5、非金属薄膜经过张力辊后进入其他工序设备。
进一步的，在步骤S4后，还包括：
A1、非金属薄膜经过辅助挤液组件进行挤液；
A2、第二风切设备对喷淋和挤液后的非金属薄膜进行风切，去除膜面的喷淋液。
根据上述方案的本发明，其有益效果在于，本发明通过在渡槽和挤液组件之间增加风切设备，充分减少非金属薄膜从渡槽中带出的镀液，减少其对挤液组件的影响，同时在挤液组件之后增加喷淋组件，通过喷淋组件对挤液组件进行稀释和清洗，防止挤液组件上的镀液结晶，进而保证挤液组件上很少甚至没有镀液残留，消除镀液结晶，从而避免结晶造成的非金属薄膜刺穿或凹凸点，充分提高镀膜产品的质量；另外，本发明有针对性的增设机构，尽可能减少电镀设备的产品体积，降低生产成本。
附图说明
图1为本发明的结构示意图；
图2为本发明一实施例的实现流程图；
图3为本发明另一实施例的实现流程图。
在图中，10-渡槽；11-镀液；20-非金属薄膜；30-第一风切设备；41-第一导电辊；42-第一挤液辊；50-喷淋组件；61-第二导电辊；62-第二挤液辊；70-第二风切设备；80-张力辊；90-集液槽。
具体实施方式
下面结合附图以及实施方式对本发明进行进一步的描述：
如图1所示，一种防止电镀设备挤液组件镀液结晶的装置，包括渡槽10及位于渡槽10 出液端的挤液组件，非金属薄膜20由渡槽10内的镀液11中出液后，经由挤液组件挤液。在本发明中，渡槽10与挤液组件之间设有风切设备(即第一风切设备30)，用于对出液的非金属薄膜20进行风切；挤液组件的后侧设有喷淋组件50，用于对挤液组件进行喷淋。
第一风切设备30包括第一上风切单元和第一下风切单元，第一上风切单元位于非金属薄膜20的上侧，用于对非金属薄膜20上侧的镀液11进行风切去除，第一下风切单元位于非金属薄膜20的下侧，用于对非金属薄膜20下侧的镀液11进行风切去除。本发明通过第一风切设备30的应用，可以去除非金属薄膜20膜面上从渡槽10中带出的绝大多数镀液11。
优选的，上风切单元的出风口和下风切单元的出风口均朝向非金属薄膜20的出液位置，使得上风切单元将非金属薄膜上膜面的镀液吹至渡槽10中，下风切单元将非金属薄膜下膜面的镀液吹至渡槽10中，使得非金属薄膜20表面的大部分镀液回落，并落至渡槽10中，减少对外部结构的腐蚀。
挤液组件包括第一导电辊41和第一挤液辊42，其中第一导电辊41位于第一挤液辊42的下侧，通过第一挤液辊42和第一导电辊41之间相互挤压，对非金属薄膜20进行挤液。喷淋组件50包括上喷淋管和下喷淋管，上喷淋管位于非金属薄膜20的上侧，上喷淋管的出液口朝向第一挤液辊42，下喷淋管位于非金属薄膜20的下侧，下喷淋管的出液口朝向第一导电辊41。
本实施例中的上喷淋管和下喷淋管采用PVC(聚氯乙烯)材质制作形成，在其他实施例中，还可以采用除PVC外的其他耐酸碱腐蚀的材料制作。
优选的，本实施例的喷淋装置采用纯水对第一导电辊41和第一挤液辊42进行喷淋，稀释第一导电辊41和第一挤液辊42表面残留的镀液，防止第一导电辊41和第一挤液辊42表面结晶。在其他实施例中，还可以采用其他不影响镀液成分的专用清洗液。
本发明中，喷淋组件50的下侧设有集液槽90，集液槽90的边缘位于挤液组件的外侧，喷淋后的液体通过集液槽90进行收集并排出，避免喷淋液对设备的其他零部件造成损伤和 破坏。
为了避免喷淋后的非金属薄膜20进入其他渡槽时，喷淋液对渡槽10内镀液11造成稀释，本发明在喷淋组件50的后侧设有第二风切设备70，第二风切设备70用于对喷淋后的非金属薄膜20进行风切，并于喷淋组件50与第二风切设备70之间设有辅助挤液组件，用于对喷淋后的非金属薄膜20进行挤液。与第一风切设备30结构类似，第二风切设备70包括第二上风切单元和第二下风切单元，第二上风切单元位于非金属薄膜20的上侧，用于对非金属薄膜上表面的液体进行风切，第二下风切单元位于非金属薄膜20的下侧，用于对非金属薄膜下表面的液体进行风切。
具体的，辅助挤液组件包括第二导电辊61和第二挤液辊62，第二导电辊61位于第二挤液辊62的上侧，通过第二挤液辊62和第二导电辊61之间相互挤压，对经过的非金属薄膜20进行挤液。
优选的，挤液组件的出膜端与辅助挤液组件的入膜端位于同一水平面，使得挤液组件与辅助挤液组件之间的非金属薄膜20呈水平方向前进，即第一挤液辊42与第一导电辊41的挤液位置和第二挤液辊62与第二导电辊61的挤液位置位于同一水平面，可以使得喷淋组件实现对第一导电辊41和第一挤液辊42良好的喷淋效果。
第二风切设备70后侧设有张力辊80，通过张力辊80对非金属薄膜20进行拉伸，避免非金属薄膜20起皱。优选的，张力辊80的高度高于辅助挤液组件的出膜端(即第二挤液辊62和第二导电辊61之间的挤液位置)，使得辅助挤液组件与张力辊80之间的非金属薄膜20呈上升状态，与之相配合的，第二风切设备70的出风口朝向辅助挤液组件，且偏向下侧。
上述实施例中，集液槽90位于各个辊轴及设备结构下侧，具体的，集液槽90位于挤液组件、喷淋组件50、辅助挤液组件、第二风切设备70及张力辊80的下侧，使得各个环节落下的液体均能进行回收。
上述的第一风切设备30和第二风切设备70均为不锈钢材质，在其他实施例中，还可以采用除不锈钢外的其他耐酸碱腐蚀的材料制作。
本发明的实现过程中：首先渡槽10与挤液组件之间设置第一风切设备30，通过第一风切设备30去除非金属薄膜20正反面上从渡槽10中带出的镀液11，减少镀液被带入第一导电辊41和第一挤液辊42；其次，通过在挤液组件后侧设置喷淋组件50，从喷淋组件50出来的液体(优选为雾状的纯水)到达第一导电辊41和第一挤液辊42的表面，稀释并清洗辊轴上的镀液；再次，挤液组件后侧设置辅助挤液组件，对喷淋后的非金属薄膜20进行挤液，同时在辅助挤液组件后侧设置第二风切设备70，去除因为喷淋而导致的非金属薄膜20膜面的液体，防止喷淋的液体被带入下一渡槽10或其他设备中；最后，上述的喷淋液和第二风切设备70吹下的液体能够通过下方的集液槽90进行收集并排出。
如图2、图3所示，一种防止电镀设备挤液组件镀液结晶的方法，在非金属薄膜出液端增加风切设备，通过风切设备对带有镀液的非金属薄膜进行风切，去除其表面的镀液；在挤液组件后侧增加喷淋组件，通过喷淋组件对挤液组件进行喷淋，防止镀液结晶。
如图2所示，在一个实施例中，该防止电镀设备挤液组件镀液结晶的方法，具体包括以下步骤：
S1、非金属薄膜出液；
S2、第一风切设备对出液后的非金属薄膜进行风切，去除膜面的镀液；
S3、非金属薄膜经过挤液组件(第一导电辊和第一挤液辊)进行挤液；
S4、喷淋组件对挤液组件(第一导电辊和第一挤液辊)进行喷淋，防止其表面结晶，并且喷淋后的喷淋液收集于集液槽内；
S5、非金属薄膜经过张力辊后进入其他工序设备。
如图3所示，在另一个实施例中，该防止电镀设备挤液组件镀液结晶的方法，具体包括以下步骤：
S1、非金属薄膜出液；
S2、第一风切设备对出液后的非金属薄膜进行风切，去除膜面的镀液；
S3、非金属薄膜经过挤液组件(第一导电辊和第一挤液辊)进行挤液；
S4、喷淋组件对挤液组件(第一导电辊和第一挤液辊)进行喷淋，防止其表面结晶，并且喷淋后的喷淋液收集于集液槽内；
S5、非金属薄膜经过辅助挤液组件(第二导电辊和第二挤液辊)进行挤液；
S6、第二风切设备对经过辅助挤液组件(第二导电辊和第二挤液辊)后的非金属薄膜进行风切，去除米面的喷淋液，避免喷淋液对后续工艺造成影响；
S7、非金属薄膜经过张力辊后进入其他工序设备。
本发明通过在镀槽与第一导电辊、第一挤液辊之间新增第一风切设备，并在第一导电辊和第一挤液辊后增设喷淋组件，减少镀液从镀槽内带出的镀液，并通过喷淋操作稀释和清洗第一导电辊、第一挤液辊，保证了第一导电辊、第一挤液辊上很少或者无镀液残留，消除镀液结晶，从而减少膜面凹凸点，提高铜膜产品质量。
应当理解的是，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，而所有这些改进和变换都应属于本发明所附权利要求的保护范围。
上面结合附图对本发明专利进行了示例性的描述，显然本发明专利的实现并不受上述方式的限制，只要采用了本发明专利的方法构思和技术方案进行的各种改进，或未经改进将本发明专利的构思和技术方案直接应用于其它场合的，均在本发明的保护范围内。
本发明通过在渡槽和挤液组件之间增加风切设备，充分减少非金属薄膜从渡槽中带出的镀液，减少其对挤液组件的影响，同时在挤液组件之后增加喷淋组件，通过喷淋组件对挤液组件进行稀释和清洗，防止挤液组件上的镀液结晶，进而保证挤液组件上很少甚至没有镀液残留，消除镀液结晶，从而避免结晶造成的非金属薄膜刺穿或凹凸点，充分提高镀膜产品的质量，由此本发明的防止电镀设备挤液组件镀液结晶的装置及方法具有实用性。

Claims (10)

  1. 一种防止电镀设备挤液组件镀液结晶的装置，包括渡槽及位于所述渡槽出液端的挤液组件，非金属薄膜由所述渡槽中出液后经所述挤液组件挤液，其特征在于，所述渡槽与所述挤液组件之间设有风切设备，用于对出液的所述非金属薄膜进行风切；所述挤液组件的后侧设有喷淋组件，用于对所述挤液组件进行喷淋。
  2. 根据权利要求1所述的防止电镀设备挤液组件镀液结晶的装置，其特征在于，所述风切设备包括上风切单元和下风切单元，所述上风切单元位于所述非金属薄膜的上侧，所述下风切单元位于所述非金属薄膜的下侧。
  3. 根据权利要求2所述的防止电镀设备挤液组件镀液结晶的装置，其特征在于，所述上风切单元的出风口和所述下风切单元的出风口均朝向所述非金属薄膜的出液位置。
  4. 根据权利要求1所述的防止电镀设备挤液组件镀液结晶的装置，其特征在于，所述喷淋组件包括上喷淋管和下喷淋管，所述上喷淋管位于所述非金属薄膜的上侧，所述下喷淋管位于所述非金属薄膜的下侧。
  5. 根据权利要求1所述的防止电镀设备挤液组件镀液结晶的装置，其特征在于，所述喷淋组件的下侧设有集液槽，所述集液槽的边缘位于所述挤液组件的外侧。
  6. 根据权利要求1所述的防止电镀设备挤液组件镀液结晶的装置，其特征在于，所述喷淋组件的后侧设有第二风切设备，所述第二风切设备用于对喷淋后的所述非金属薄膜进行风切。
  7. 根据权利要求6所述的防止电镀设备挤液组件镀液结晶的装置，其特征在于，所述喷淋组件与所述第二风切设备之间设有辅助挤液组件，用于对喷淋后的所述非金属薄膜进行挤液。
  8. 一种防止电镀设备挤液组件镀液结晶的方法，其特征在于，在非金属薄膜出液端增加风切设备，通过所述风切设备对带有镀液的非金属薄膜进行风切，去除其表面的镀液；
    在挤液组件后侧增加喷淋组件，通过所述喷淋组件对所述挤液组件进行喷淋，防止镀 液结晶。
  9. 根据权利要求8所述的防止电镀设备挤液组件镀液结晶的方法，其特征在于，具体包括以下步骤：
    S1、非金属薄膜出液；
    S2、风切设备对出液后的非金属薄膜进行风切，去除膜面的镀液；
    S3、非金属薄膜经过挤液组件进行挤液；
    S4、喷淋组件对挤液组件进行喷淋，防止其表面结晶；
    S5、非金属薄膜经过张力辊后进入其他工序设备。
  10. 根据权利要求9所述的防止电镀设备挤液组件镀液结晶的方法，其特征在于，在步骤S4后，还包括：
    A1、非金属薄膜经过辅助挤液组件进行挤液；
    A2、第二风切设备对喷淋和挤液后的非金属薄膜进行风切，去除膜面的喷淋液。
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EP4089210A4 (en) 2023-08-30
JP2023510488A (ja) 2023-03-14

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