WO2022130833A1 - 金属部材-樹脂部材接合体の製造方法及びフィルム - Google Patents
金属部材-樹脂部材接合体の製造方法及びフィルム Download PDFInfo
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- WO2022130833A1 WO2022130833A1 PCT/JP2021/041191 JP2021041191W WO2022130833A1 WO 2022130833 A1 WO2022130833 A1 WO 2022130833A1 JP 2021041191 W JP2021041191 W JP 2021041191W WO 2022130833 A1 WO2022130833 A1 WO 2022130833A1
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- 229920005989 resin Polymers 0.000 title claims abstract description 271
- 239000011347 resin Substances 0.000 title claims abstract description 271
- 238000000034 method Methods 0.000 title claims abstract description 119
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 239000010410 layer Substances 0.000 claims abstract description 217
- -1 phenol compound Chemical class 0.000 claims abstract description 163
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 138
- 239000003822 epoxy resin Substances 0.000 claims abstract description 137
- 229920000098 polyolefin Polymers 0.000 claims abstract description 136
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 81
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 81
- 230000001588 bifunctional effect Effects 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000011247 coating layer Substances 0.000 claims abstract description 43
- 239000000203 mixture Substances 0.000 claims abstract description 32
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims description 210
- 239000002184 metal Substances 0.000 claims description 210
- 239000000463 material Substances 0.000 claims description 90
- 125000000524 functional group Chemical group 0.000 claims description 59
- 238000011282 treatment Methods 0.000 claims description 53
- 239000004743 Polypropylene Substances 0.000 claims description 40
- 238000006243 chemical reaction Methods 0.000 claims description 36
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 35
- 229920001155 polypropylene Polymers 0.000 claims description 34
- 238000005304 joining Methods 0.000 claims description 31
- 239000012948 isocyanate Substances 0.000 claims description 25
- 238000004381 surface treatment Methods 0.000 claims description 24
- 239000000126 substance Substances 0.000 claims description 22
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 21
- 238000003466 welding Methods 0.000 claims description 20
- 238000007259 addition reaction Methods 0.000 claims description 18
- 125000003277 amino group Chemical group 0.000 claims description 18
- 239000011342 resin composition Substances 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 15
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 15
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 14
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 12
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 claims description 12
- 238000001746 injection moulding Methods 0.000 claims description 11
- 238000005498 polishing Methods 0.000 claims description 9
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 8
- 230000005674 electromagnetic induction Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 229920006241 epoxy vinyl ester resin Polymers 0.000 claims description 3
- 238000009730 filament winding Methods 0.000 claims description 3
- 238000009787 hand lay-up Methods 0.000 claims description 3
- 238000001721 transfer moulding Methods 0.000 claims description 3
- 239000002585 base Substances 0.000 description 79
- 229910052782 aluminium Inorganic materials 0.000 description 26
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 26
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 20
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- 238000012360 testing method Methods 0.000 description 18
- 239000000376 reactant Substances 0.000 description 17
- 239000002904 solvent Substances 0.000 description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 15
- 239000012790 adhesive layer Substances 0.000 description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 14
- 229910001593 boehmite Inorganic materials 0.000 description 13
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 description 13
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 11
- 239000003054 catalyst Substances 0.000 description 11
- 238000001723 curing Methods 0.000 description 11
- 239000000178 monomer Substances 0.000 description 11
- 229920001567 vinyl ester resin Polymers 0.000 description 11
- 239000008096 xylene Substances 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- 238000001035 drying Methods 0.000 description 10
- 239000011777 magnesium Substances 0.000 description 10
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 10
- 229920005862 polyol Polymers 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000003365 glass fiber Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- 229910052749 magnesium Inorganic materials 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 229920000049 Carbon (fiber) Polymers 0.000 description 8
- 239000004917 carbon fiber Substances 0.000 description 8
- 238000009864 tensile test Methods 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229920000573 polyethylene Polymers 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 235000011121 sodium hydroxide Nutrition 0.000 description 6
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 150000003573 thiols Chemical class 0.000 description 5
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- 229920003354 Modic® Polymers 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- 238000013532 laser treatment Methods 0.000 description 4
- 239000003208 petroleum Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 238000009832 plasma treatment Methods 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 150000003505 terpenes Chemical class 0.000 description 4
- 235000007586 terpenes Nutrition 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- LABQKWYHWCYABU-UHFFFAOYSA-N 4-(3-sulfanylbutanoyloxy)butyl 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCCCCOC(=O)CC(C)S LABQKWYHWCYABU-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 239000003677 Sheet moulding compound Substances 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 125000005372 silanol group Chemical group 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 239000004412 Bulk moulding compound Substances 0.000 description 2
- 102100040287 GTP cyclohydrolase 1 feedback regulatory protein Human genes 0.000 description 2
- 101710185324 GTP cyclohydrolase 1 feedback regulatory protein Proteins 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 2
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 150000007519 polyprotic acids Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000012783 reinforcing fiber Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- KYVBNYUBXIEUFW-UHFFFAOYSA-N 1,1,3,3-tetramethylguanidine Chemical compound CN(C)C(=N)N(C)C KYVBNYUBXIEUFW-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 1
- GTEXIOINCJRBIO-UHFFFAOYSA-N 2-[2-(dimethylamino)ethoxy]-n,n-dimethylethanamine Chemical compound CN(C)CCOCCN(C)C GTEXIOINCJRBIO-UHFFFAOYSA-N 0.000 description 1
- YSAANLSYLSUVHB-UHFFFAOYSA-N 2-[2-(dimethylamino)ethoxy]ethanol Chemical compound CN(C)CCOCCO YSAANLSYLSUVHB-UHFFFAOYSA-N 0.000 description 1
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- OOYYYGOZSPVMNY-UHFFFAOYSA-N 3-(disilanylsilyl)propyl 2-methylprop-2-enoate Chemical compound C(C(=C)C)(=O)OCCC[SiH2][SiH2][SiH3] OOYYYGOZSPVMNY-UHFFFAOYSA-N 0.000 description 1
- DOYKFSOCSXVQAN-UHFFFAOYSA-N 3-[diethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CCO[Si](C)(OCC)CCCOC(=O)C(C)=C DOYKFSOCSXVQAN-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- PRKPGWQEKNEVEU-UHFFFAOYSA-N 4-methyl-n-(3-triethoxysilylpropyl)pentan-2-imine Chemical compound CCO[Si](OCC)(OCC)CCCN=C(C)CC(C)C PRKPGWQEKNEVEU-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 229910021503 Cobalt(II) hydroxide Inorganic materials 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- WRSGWWSPKVSWLC-UHFFFAOYSA-N N-(1-phenylprop-2-enyl)-1-trimethoxysilylpropan-2-amine hydrochloride Chemical compound Cl.C(=C)C(C1=CC=CC=C1)NC(C[Si](OC)(OC)OC)C WRSGWWSPKVSWLC-UHFFFAOYSA-N 0.000 description 1
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 239000011951 cationic catalyst Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- ASKVAEGIVYSGNY-UHFFFAOYSA-L cobalt(ii) hydroxide Chemical compound [OH-].[OH-].[Co+2] ASKVAEGIVYSGNY-UHFFFAOYSA-L 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229920001870 copolymer plastic Polymers 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- KHEMNHQQEMAABL-UHFFFAOYSA-J dihydroxy(dioxo)chromium Chemical compound O[Cr](O)(=O)=O.O[Cr](O)(=O)=O KHEMNHQQEMAABL-UHFFFAOYSA-J 0.000 description 1
- WMYWOWFOOVUPFY-UHFFFAOYSA-L dihydroxy(dioxo)chromium;phosphoric acid Chemical compound OP(O)(O)=O.O[Cr](O)(=O)=O WMYWOWFOOVUPFY-UHFFFAOYSA-L 0.000 description 1
- KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- UFXYMLGIRKSLGL-UHFFFAOYSA-N dimethoxy-methyl-[4-(oxiran-2-ylmethoxy)butoxy]silane Chemical compound C(C1CO1)OCCCCO[Si](OC)(OC)C UFXYMLGIRKSLGL-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 238000001192 hot extrusion Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910001105 martensitic stainless steel Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- TXXWBTOATXBWDR-UHFFFAOYSA-N n,n,n',n'-tetramethylhexane-1,6-diamine Chemical compound CN(C)CCCCCCN(C)C TXXWBTOATXBWDR-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- YXJYBPXSEKMEEJ-UHFFFAOYSA-N phosphoric acid;sulfuric acid Chemical compound OP(O)(O)=O.OS(O)(=O)=O YXJYBPXSEKMEEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- PMTRSEDNJGMXLN-UHFFFAOYSA-N titanium zirconium Chemical compound [Ti].[Zr] PMTRSEDNJGMXLN-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- 125000005314 unsaturated fatty acid group Chemical group 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 150000003754 zirconium Chemical class 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- 229910000166 zirconium phosphate Inorganic materials 0.000 description 1
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/74—Joining plastics material to non-plastics material
- B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/06—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/70—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/28—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer comprising a deformed thin sheet, i.e. the layer having its entire thickness deformed out of the plane, e.g. corrugated, crumpled
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
Definitions
- the present disclosure relates to a method for manufacturing a metal member-resin member joint and a film that can be used for manufacturing the joint.
- metal-resin joints in which metal materials such as aluminum and resin are joined and integrated.
- metal materials such as aluminum and resin are joined and integrated.
- the aluminum is surface-treated in order to sufficiently secure the joint strength between the metal and the resin.
- surface treatments physical and chemical surface treatments such as blast treatment, chemical conversion treatment, and anodizing treatment are being studied.
- polystyrene resin When a polyolefin such as polypropylene is used as a resin in a metal-resin bonded body, since the polyolefin is a low-polarity poorly adhesive material, an acid-modified polyolefin should be used in order to improve the bondability with the metal. Is being considered.
- Patent Document 1 Japanese Unexamined Patent Publication No. 2016-16584
- an adhesive layer containing a modified polypropylene resin having a polar group introduced is formed on a base treatment film provided on the surface of a base material made of an aluminum alloy.
- Patent Document 1 also describes a method of providing a modified polypropylene layer having a polar group by using phosphoric acid chromate, chromic acid chromate, zirconium oxide, titanium zirconium or the like for the surface treatment of an aluminum alloy.
- Patent Document 2 International Publication No. 2016/199339
- a polypropylene resin layer is bonded to a metal substrate via a hydrophilic surface formed on the metal substrate, and the polypropylene resin layer is compatible with the polypropylene resin layer and has an anchor effect. It is described that the thermoplastic resin molded body is bonded to the polypropylene resin layer.
- Patent Document 3 International Publication No. 2016/1521178 describes a method for forming an acid-modified polypropylene layer having a melt viscosity, melting point, crystallinity, etc. on an aluminum alloy.
- Patent Document 4 Japanese Unexamined Patent Publication No. 2018-154034
- a layer composed of an epoxy resin having a thickness of 15 to 40 ⁇ m and a blocked isocyanate is formed as a first layer on the surface of a metal chemical conversion treatment film, and 4 to 4 as a second layer.
- a method for providing a 30 ⁇ m acid-modified polyolefin layer is described.
- the bonding strength of the metal-polyolefin bonded body is not sufficient, and it is desirable to further improve the bonding strength and durability.
- An object of the present disclosure is to provide a method for easily producing a metal-polyolefin bonded body having high bonding strength in view of the above-mentioned technical background.
- a method for producing a metal member-resin member joint which comprises joining the resin member on the resin coating layer of the metal member.
- the joining is performed simultaneously with the molding of the resin member on the resin coating layer of the metal member by an injection molding method, a transfer molding method, a press molding method, a filament winding molding method, or a hand lay-up molding method. 1] The method described in.
- a method for producing a metal member-resin member bonded body which comprises joining the metal base material and the resin member via the film.
- the reaction product 1 is formed by subjecting a bifunctional epoxy resin and a bifunctional phenol compound to a double addition reaction in a solution containing maleic anhydride-modified polyolefin.
- reaction product 2 is formed by reacting a thermoplastic epoxy resin produced by a double addition reaction of a bifunctional epoxy resin and a bifunctional phenol compound with a maleic anhydride-modified polyolefin.
- the method described in. [8] The method according to any one of [1] to [5], wherein the mixture is a mixture of polypropylene and a thermoplastic epoxy resin.
- the film is composed of a plurality of layers including the modified polyolefin layer and a layer other than the modified polyolefin layer, and at least one layer of the layer other than the modified polyolefin layer is formed from a resin composition containing a thermoplastic epoxy resin.
- the curable resin is at least one selected from the group consisting of urethane resin, epoxy resin, vinyl ester resin and unsaturated polyester resin.
- the metal substrate has a functional group-containing layer laminated on the surface in contact with the film.
- the functional group-containing layer contains at least one functional group selected from the group consisting of the following (1) to (7).
- At least one functional group derived from the silane coupling agent and selected from the group consisting of a glycidyl group, an amino group, a (meth) acryloyl group and a mercapto group (2) An amino group derived from the silane coupling agent.
- a functional group generated by the reaction of at least one selected from a glycidyl compound and a thiol compound (3) A glycidyl compound, an amino compound, an isocyanate compound, a (meth) acryloyl group and a glycidyl group are added to a mercapto group derived from a silane coupling agent.
- a functional group produced by the reaction of at least one selected from the group consisting of a compound having a (meth) acryloyl group and a compound having an amino group (4) A thiol compound to a (meth) acryloyl group derived from a silane coupling agent. (5) A glycidyl group derived from a silane coupling agent is reacted with at least one selected from the group consisting of a compound having an amino group and a (meth) acryloyl group, an amino compound, and a thiol compound.
- a metal-polyolefin joint having high bonding strength can be easily produced.
- the films of the present disclosure can be advantageously used in the production of metal-polyolefin conjugates.
- FIG. 1 is an explanatory diagram of a method for manufacturing a metal member-resin member joint according to the first embodiment.
- FIG. 2 is an explanatory diagram of another manufacturing method of the metal member-resin member bonded body of the first embodiment.
- FIG. 3 is an explanatory diagram of a method for manufacturing a metal member-resin member joint of the second embodiment.
- FIG. 4 is a schematic cross-sectional view of a metal member-resin member joint of one embodiment.
- FIG. 5 is a schematic cross-sectional view of a metal member-resin member joint having a functional group-containing layer.
- FIG. 6 is a schematic cross-sectional view of a metal member-resin member joint having an adhesive layer.
- FIG. 7 is an SEM photograph of the boehmite film.
- metal is meant to include both pure metals consisting of a single metal element and alloys of pure metals mixed with one or more other elements. Used.
- aluminum includes pure metals of aluminum and alloys thereof.
- bonding means connecting objects to each other, and adhesion is a subordinate concept thereof, and through organic materials such as tapes and adhesives (curable resin, thermoplastic resin, etc.), It means that two adherends (those to be bonded) are put into a bonded state.
- the method for producing the metal member-resin member bonded body of the first embodiment is a layer containing a reaction product 1 of a maleic anhydride-modified polyolefin, a bifunctional epoxy resin and a bifunctional phenol compound, a maleic anhydride-modified polyolefin and a thermoplastic epoxy.
- a film containing at least one modified polyolefin layer selected from the group consisting of a layer containing a reactant 2 with a resin and a layer containing a mixture of a polyolefin and a thermoplastic epoxy resin the modified polyolefin layer is exposed.
- the film is placed on the surface of at least a part of the metal substrate to form a metal member in which the resin coating layer is laminated on the metal substrate, on the resin coating layer of the metal member. Includes joining resin members.
- the resin coating layer laminated on the metal base material contained in the metal member is formed by using the film containing the modified polyolefin layer.
- the film may have one layer or may be composed of a plurality of layers.
- the film is composed of a plurality of layers including the modified polyolefin layer and a layer other than the modified polyolefin layer, and the layer other than the modified polyolefin layer is at least one selected from a thermoplastic epoxy resin layer and a curable resin layer.
- the modified polyolefin layer of the film is bonded to the resin member, and the layers other than the modified polyolefin layer of the film are bonded to the metal base material or the functional group-containing layer having or not having the surface treatment.
- the thermoplastic epoxy resin layer, the curable resin layer, the surface treatment and the functional group-containing layer will be described later.
- Modified polyolefin layer At least one layer of the film is a modified polyolefin layer formed from a resin composition containing a modified polyolefin.
- the film containing the modified polyolefin layer can bond (bond) the metal base material and the resin member with high bonding strength.
- the modified polyolefin layer was obtained by subjecting a bifunctional epoxy resin and a bifunctional phenol compound to a double addition reaction in the presence of maleic anhydride-modified polyolefin, and at the same time, reacting with maleic anhydride in the maleic anhydride-modified polyolefin skeleton.
- Reaction product 2 obtained by reacting a layer containing reaction product 1 with a thermoplastic epoxy resin produced by a double addition reaction of a bifunctional epoxy resin and a bifunctional phenol compound with maleic anhydride in a maleic anhydride-modified polyolefin skeleton. It is at least one selected from the group consisting of a layer containing a layer containing maleic anhydride and a layer containing a mixture of a thermoplastic epoxy resin and a polyolefin.
- reaction product 1 can be obtained by subjecting a bifunctional epoxy resin and a bifunctional phenol compound to a double addition reaction in the presence of a catalyst in a solution of maleic anhydride-modified polyolefin. At this time, the maleic anhydride-modified polyolefin also reacts with the bifunctional epoxy resin, the bifunctional phenol compound, and the thermoplastic epoxy resin produced from the bifunctional epoxy resin and the bifunctional phenol compound described later in the section of the reactant 2. it is conceivable that.
- the maleic anhydride-modified polyolefin is obtained by grafting maleic anhydride on the polyolefin, and examples thereof include maleic anhydride-modified polyethylene and maleic anhydride-modified polypropylene.
- Specific examples of the maleic anhydride-modified polyolefin include Kayaku Akzo Corporation's Kayabrid 002PP, 002PP-NW, 003PP, 003PP-NW, and Mitsubishi Chemical Corporation's Modic series.
- SCONA TPPP2112GA, TPPP8112GA, or TPPP9212GA manufactured by BYK may be used in combination with maleic anhydride-modified polyolefin as a polypropylene additive functionalized with maleic anhydride.
- bifunctional epoxy resin examples include a bisphenol type epoxy resin and a biphenyl type epoxy resin.
- the bifunctional epoxy resin may be used alone or in combination of two or more.
- Specific examples of the bifunctional epoxy resin include "jER (registered trademark) 828”, “jER (registered trademark) 834", “jER (registered trademark) 1001", and “jER (registered trademark)” manufactured by Mitsubishi Chemical Corporation. 1004 ”,“ jER® 1007 ”, and“ jER® YX-4000 ”.
- bifunctional phenol compound examples include bisphenol and biphenol.
- the bifunctional phenol compound may be used alone or in combination of two or more.
- Examples of the combination of the bifunctional phenol compound include bisphenol A type epoxy resin and bisphenol A; bisphenol A type epoxy resin and bisphenol F; biphenyl type epoxy resin and 4,4'-biphenol; and "WPE190" manufactured by Nagase ChemteX Corporation. "And” EX-991L ".
- a tertiary amine such as triethylamine, 2,4,6-tris (dimethylaminomethyl) phenol
- a phosphorus-based compound such as triphenylphosphine are preferable.
- the reaction product 2 can be obtained by reacting a thermoplastic epoxy resin produced by a double addition reaction of a bifunctional epoxy resin and a bifunctional phenol compound with a maleic anhydride-modified polyolefin.
- a maleic anhydride-modified polyolefin the bifunctional epoxy resin, and the bifunctional phenol compound used in this reaction, the same ones as those used for producing the reactant 1 can be used.
- thermoplastic epoxy resin used for producing the reaction product 2 is a resin also called a field-polymerized phenoxy resin, a field-curable phenoxy resin, a field-curable epoxy resin, or the like, and a bifunctional epoxy resin and a bifunctional phenol compound are catalysts.
- a thermoplastic structure that is, a linear polymer structure is formed.
- the linear polymer means a polymer that does not contain a crosslinked structure in the polymer molecule and is one-dimensional linear.
- the thermoplastic epoxy resin has thermoplasticity unlike the curable resin that constitutes a three-dimensional network with a crosslinked structure.
- the total amount of the bifunctional epoxy resin and the bifunctional phenol compound used in producing the reactant 1 or the reactant 2 is preferably 5 to 100 parts by mass with respect to 100 parts by mass of the maleic anhydride-modified polyolefin. It is more preferably 5 to 60 parts by mass, further preferably 10 to 30 parts by mass.
- the reaction that occurs when the reactant 1 and the reactant 2 are obtained is the reaction between the maleic anhydride-modified polyolefin and the bifunctional epoxy resin, the reaction between the maleic anhydride-modified polyolefin and the bifunctional phenol compound, and the maleic anhydride.
- Specifics based on a wide variety of reactions such as the reaction of connecting epoxies, the reaction of the epoxy group at the end of the thermoplastic epoxy resin with maleic anhydride, and the reaction of the secondary hydroxyl group in the skeleton of the thermoplastic epoxy resin with maleic anhydride. It is also not possible to comprehensively express the aspect. Therefore, it can be said that it is impossible or impractical to directly specify the modified polyolefin obtained as the reactant 1 or the reactant 2 by the structure or the property.
- the mixture of the thermoplastic epoxy resin and the polyolefin can be obtained by mixing the same thermoplastic epoxy resin as that used for producing the above-mentioned reaction product 2 and the polyolefin by a conventional method.
- the polyolefin used for forming the mixture can be used.
- the polyolefin is not particularly limited and may be a general synthetic resin. Examples of the polyolefin include polyethylene and polypropylene, and polypropylene is preferable.
- the film is composed of a plurality of layers including a modified polyolefin layer and a layer other than the modified polyolefin layer, and at least one layer other than the modified polyolefin layer is a thermoplastic formed from a resin composition containing a thermoplastic epoxy resin. It can be composed of an epoxy resin layer.
- the resin composition containing the thermoplastic epoxy resin preferably contains 40% by mass or more of the thermoplastic epoxy resin, and more preferably 70% by mass or more.
- thermoplastic epoxy resin Similar to the thermoplastic epoxy resin used for producing the reactant 2, the thermoplastic epoxy resin has a thermoplastic structure, that is, a thermoplastic structure, that is, a double-addition reaction between the bifunctional epoxy resin and the bifunctional phenol compound in the presence of a catalyst. It is a resin that forms a linear polymer structure, and has thermoplasticity unlike curable resins that form a three-dimensional network with a crosslinked structure. Since the thermoplastic epoxy resin has such characteristics, it is possible to form a thermoplastic epoxy resin layer having excellent bondability with the modified polyolefin layer.
- the composition containing the monomer of the thermoplastic epoxy resin may contain a solvent and, if necessary, an additive such as a colorant in order to sufficiently proceed the double addition reaction of the thermoplastic epoxy resin. ..
- the monomer of the thermoplastic epoxy resin is the main component among the components other than the solvent of the composition.
- the main component means that the content of the monomer of the thermoplastic epoxy resin is 50 to 100% by mass.
- the content of the monomer of the thermoplastic epoxy resin is preferably 60% by mass or more, more preferably 80% by mass or more.
- the monomer for obtaining the thermoplastic epoxy resin is preferably a combination of a bifunctional epoxy resin and a bifunctional phenolic compound.
- the double addition reaction is preferably carried out by heating at a temperature of 120 to 200 ° C. for 5 to 90 minutes, although it depends on the type of the reaction compound and the like.
- the thermoplastic epoxy resin layer can be formed by coating the composition, volatilizing the solvent as appropriate, and then heating to carry out the double addition reaction.
- the film is composed of a plurality of layers including a modified polyolefin layer and a layer other than the modified polyolefin layer, and the layer other than the modified polyolefin layer is composed of a curable resin layer formed from a resin composition containing a curable resin. You can also do it.
- the resin composition containing the curable resin may contain a solvent and, if necessary, an additive such as a colorant in order to sufficiently promote the curing reaction of the curable resin.
- the curable resin is the main component among the components other than the solvent of the resin composition.
- the main component means that the content of the curable resin is 40 to 100% by mass.
- the content of the curable resin is preferably 60% by mass or more, more preferably 70% by mass or more, and most preferably 80% by mass or more.
- curable resin examples include urethane resin, epoxy resin, vinyl ester resin, and unsaturated polyester resin.
- the curable resin layer may be formed of one of these resins, or may be formed by mixing two or more of them.
- the curable resin layer may be composed of a plurality of layers, and each layer may be formed of a resin composition containing different types of curable resin.
- the method for forming the curable resin layer using the resin composition containing the curable resin is not particularly limited, and examples thereof include a spray coating method and a dipping method.
- the curable resin means a resin that is cross-linked and cured, and is not limited to the thermosetting type, but also includes a room temperature curing type and a photocuring type.
- the photo-curing type can be cured in a short time by irradiation with visible light or ultraviolet rays.
- the photo-curing type may be used in combination with the heat-curing type and / or the room temperature curing type.
- Examples of the photocurable type include vinyl ester resins such as "Lipoxy (registered trademark) LC-760" and “Lipoxy (registered trademark) LC-720" manufactured by Showa Denko KK.
- Urethane resin is a resin usually obtained by the reaction of the isocyanato group of an isocyanate compound with the hydroxyl group of a polyol compound, and is defined in ASTM D16 as "a paint containing 10% by weight or more of a vehicle non-volatile component polyisocyanate".
- the urethane resin corresponding to the above is preferable.
- the urethane resin may be a one-component type or a two-component type.
- Examples of the one-component urethane resin include oil-modified type (cured by oxidative polymerization of unsaturated fatty acid group), moisture-curable type (cured by reaction between isocyanato group and water in air), and block type (cured by reaction between isocyanato group and water in air).
- Examples thereof include a lacquer type (a type in which a solvent is volatilized and cured by drying) and a lacquer type (a type in which a blocking agent is dissociated by heating and regenerated by reacting with an isocyanato group and a hydroxyl group to be cured).
- a moisture-curable one-component urethane resin is preferably used from the viewpoint of ease of handling.
- Specific examples of the moisture-curable one-component urethane resin include "UM-50P" manufactured by Showa Denko KK.
- Examples of the two-component urethane resin include a catalyst-curable type (a catalyst-curable group in which an isocyanato group reacts with water in the air to cure in the presence of a catalyst) and a polyol-curable type (isocyanato group and a hydroxyl group of a polyol compound). Those that cure by reaction) can be mentioned.
- a catalyst-curable type a catalyst-curable group in which an isocyanato group reacts with water in the air to cure in the presence of a catalyst
- a polyol-curable type isocyanato group and a hydroxyl group of a polyol compound
- polyol compound in the polyol curing type examples include polyester polyols and polyether polyol-phenol resins.
- Examples of the isocyanate compound having an isocyanato group in the polyol-cured type include aliphatic isocyanates such as hexamethylene diisocyanate (HDI), tetramethylene diisocyanate, and dimerate diisocyanate; 2,4- or 2,6-tolylene diisocyanate (TDI). Or a mixture thereof, aromatic isocyanates such as p-phenylenediisocyanate, xylylene diisocyanate, diphenylmethane diisocyanate (MDI) or a polynuclear mixture thereof, Polymeric MDI; and alicyclic isocyanates such as isophorone diisocyanate (IPDI).
- HDI hexamethylene diisocyanate
- TDI dimerate diisocyanate
- TDI 2,4- or 2,6-tolylene diisocyanate
- aromatic isocyanates such as p-phenylenediisocyanate,
- the compounding ratio of the polyol compound and the isocyanate compound in the polyol-curable two-component urethane resin is preferably in the range of 0.7 to 1.5 in the molar equivalent ratio of the hydroxyl group / isocyanato group.
- Examples of the urethanization catalyst used in the two-component urethane resin include triethylenediamine, tetramethylguanidine, N, N, N', N'-tetramethylhexane-1,6-diamine, dimethyletheramine, N, N.
- the epoxy resin is a resin having at least two epoxy groups in one molecule.
- the prepolymer before curing of the epoxy resin include ether-based bisphenol-type epoxy resin, novolak-type epoxy resin, polyphenol-type epoxy resin, aliphatic-type epoxy resin, ester-based aromatic epoxy resin, and cyclic aliphatic epoxy resin. And ether ester type epoxy resin.
- bisphenol A type epoxy resin is preferably used.
- the epoxy resin may be used alone or in combination of two or more.
- bisphenol A type epoxy resin examples include “jER (registered trademark) 828” and “jER (registered trademark) 1001" manufactured by Mitsubishi Chemical Corporation.
- novolak type epoxy resin examples include "DEN (registered trademark) 438” manufactured by The Dow Chemical Company.
- Examples of the curing agent used for the epoxy resin include aliphatic amines, aromatic amines, acid anhydrides, phenol resins, thiols, imidazoles, and cationic catalysts.
- the curing agent in combination with long-chain aliphatic amines and / and thiols, a film having a large elongation rate and excellent impact resistance can be formed.
- thiols are not particularly limited, and for example, pentaerythritol tetrakis (3-mercaptopropionate) (for example, "QX40” manufactured by Mitsubishi Chemical Co., Ltd. and “QE-” manufactured by Toray Fine Chemical Co., Ltd. 340M "), ether-based first-class thiol (for example,” Cup Cure 3-800 “manufactured by Cognis), 1,4-bis (3-mercaptobutyryloxy) butane (for example,” Karenz “manufactured by Showa Denko KK.
- pentaerythritol tetrakis (3-mercaptopropionate) for example, "QX40" manufactured by Mitsubishi Chemical Co., Ltd. and “QE-” manufactured by Toray Fine Chemical Co., Ltd. 340M "
- ether-based first-class thiol for example," Cup Cure 3-800 “manufactured by Cognis
- pentaerythritol tetrakis (3-mercaptobutyrate) for example, "Karensu MT (registered trademark) PE1" manufactured by Showa Denko KK
- Karensu MT registered trademark
- PE1 registered trademark
- the vinyl ester resin is obtained by dissolving a vinyl ester compound in a polymerizable monomer (for example, styrene).
- the vinyl ester resin is also generally referred to as an epoxy (meth) acrylate resin, but in the present disclosure, the vinyl ester resin also includes a urethane (meth) acrylate resin.
- vinyl ester resin for example, those described in "Polyester Resin Handbook” (Nikkan Kogyo Shimbun, published in 1988), “Paint Glossary” (Japan Society of Color Material, published in 1993), etc. can be used. can.
- Specific examples of the vinyl ester resin include “Lipoxy (registered trademark) R-802", “Lipoxy (registered trademark) R-804", and “Lipoxy (registered trademark) R-806" manufactured by Showa Denko KK. Can be mentioned.
- the urethane (meth) acrylate resin is, for example, radical polymerization obtained by reacting an isocyanate compound with a polyol compound and then reacting with a hydroxyl group-containing (meth) acrylic monomer (and, if necessary, a hydroxyl group-containing allyl ether monomer).
- examples include sex-unsaturated radical-containing oligomers.
- Specific examples of the urethane (meth) acrylate resin include "Ripoxy (registered trademark) R-6545" manufactured by Showa Denko KK.
- Vinyl ester resin can be cured by radical polymerization by heating in the presence of a catalyst such as an organic peroxide.
- organic peroxides examples include ketone peroxides, peroxyketals, hydroperoxides, diallyl peroxides, diacyl peroxides, peroxyesters, and peroxydicarbonates. By combining these organic peroxides with a cobalt metal salt or the like, curing at room temperature is also possible.
- cobalt metal salt examples include cobalt naphthenate, cobalt octylate, and cobalt hydroxide. Among these, cobalt naphthenate and cobalt octylate are preferable.
- the unsaturated polyester resin dissolves a condensation product (unsaturated polyester) of an esterification reaction between a polyol compound and an unsaturated polybasic acid (and, if necessary, a saturated polybasic acid) in a polymerizable monomer (for example, styrene). It was done.
- unsaturated polyester resin for example, those described in "Polyester Resin Handbook” (Nikkan Kogyo Shimbun, published in 1988), “Paint Glossary” (Japan Society of Color Material, published in 1993), etc. shall be used. Can be done. Specific examples of the unsaturated polyester resin include “Rigolac (registered trademark)” manufactured by Showa Denko KK.
- the unsaturated polyester resin can be cured by radical polymerization by heating in the presence of a catalyst similar to the vinyl ester resin.
- the one or more layers constituting the film may contain, as an optional component, a film forming agent, a tackifier, or both.
- Other optional components that can be used in the film include, for example, colorants such as fillers, pigments and dyes, heat stabilizers, UV absorbers, and antioxidants.
- the film forming agent By using the film forming agent, it is possible to improve the film forming property at the time of manufacturing the film and the shape retention after manufacturing.
- the film forming agent include chlorinated polyolefins such as polyethylene, polypropylene, polyvinyl chloride, chlorinated polyethylene and chlorinated polypropylene, polystyrene copolymers such as thermoplastic polyurethane, polystyrene, polystyrene-maleic anhydride copolymer, and thermoplastic polyesters. Examples thereof include polyethylene polymers such as polyethylene, thermoplastic polyamides and hydroxyethyl cellulose, polyvinyl acetal, and polyvinyl butyral.
- the film can be reliably fixed to the metal substrate, whereby the resin coating layer can be formed at a desired position with high accuracy.
- the tackifier include rosin-based resins such as disproportionate rosin ester, polymerized rosin ester, and hydrogenated rosin ester, terpene-based resin, terpene phenol resin, aromatic-modified terpene resin, hydrogenated terpene resin, and aliphatic-based resin.
- C5 series petroleum resin
- aromatic (C9) petroleum resin aromatic (C9) petroleum resin
- aliphatic-arosin (C5-C9 series) petroleum resin hydrogenated petroleum resin
- kumaron inden resin phenolic resin
- styrene resin examples include xylene-based resins.
- the film can be produced, for example, by the following procedure.
- Reactant 2 obtained by reacting a thermoplastic epoxy resin produced by a double addition reaction of a bifunctional epoxy resin and a bifunctional phenol compound with maleic anhydride in a maleic anhydride-modified polyolefin skeleton, or (3) A film precursor composition 1 containing a mixture of a thermoplastic epoxy resin and a polyolefin, and if necessary, a solvent and an optional component is prepared.
- the reactants 1, the reactants 2, and the mixture of the thermoplastic epoxy resin and the polyolefin are the same as described for the modified polyolefin layer.
- the film precursor composition 1 is applied, sprayed, or extruded and laminated on a release film or release paper having a release coating such as a silicone type so as to form a film having a thickness of 1 ⁇ m to 10 mm after drying. ..
- the coating can be performed using a bar coater, a roll coater, or the like.
- the spraying can be performed using a spray coater or the like.
- Extrusion stacking can be performed using a single-screw or twin-screw extruder.
- the film can be formed on the release film or the release paper by leaving it in an environment of room temperature to 40 ° C. to volatilize the solvent.
- the release film or the release paper may be used for handling the film as a carrier (support) of the film, or the film may be peeled off from the release film or the release paper to obtain a self-standing film.
- the modified polyolefin layer of the film is completely filled with a component (for example, a bifunctional epoxy resin, a bifunctional phenol compound, a maleic anhydride-modified polyolefin, etc.) which is a constituent unit of the reactant 1, the reactant 2, or the thermoplastic epoxy resin. It may be contained in a state of reacting to, or a part of them may be contained in an unreacted state. In the latter case, when the metal base material or the resin member and the film (resin coating layer) are bonded, the unreacted component may be further reacted. With the reaction of the unreacted components, the bonding strength between the film (resin coating layer) and the metal base material or the resin member may be increased.
- a component for example, a bifunctional epoxy resin, a bifunctional phenol compound, a maleic anhydride-modified polyolefin, etc.
- a film composed of a plurality of layers including a modified polyolefin layer and a layer other than the modified polyolefin layer can be produced, for example, by the following procedure.
- a film precursor composition 2 containing the components is prepared.
- the resin composition containing the thermoplastic epoxy resin and the composition containing the monomer of the thermoplastic epoxy resin are the same as those described for the thermoplastic epoxy resin layer.
- the resin composition containing the curable resin is the same as that described for the curable resin layer.
- the film precursor composition 2 is applied, sprayed, or extruded and laminated on a release film or release paper having a release coating such as a silicone type so as to form a film having a thickness of 1 ⁇ m to 10 mm after drying. ..
- the thermoplastic epoxy is left to stand in an environment of room temperature to 40 ° C. to volatilize the solvent, heat it to proceed with the double addition reaction or the curing reaction, or irradiate it with visible light or ultraviolet rays to proceed with the curing reaction.
- a resin layer or a curable resin layer is formed on a release film or a release paper.
- the modified polyolefin layer By forming the modified polyolefin layer on these layers by the above procedure, a film composed of a plurality of layers including the modified polyolefin layer and a layer other than the modified polyolefin layer can be obtained.
- the order of forming the modified polyolefin layer and the layer other than the modified polyolefin layer may be changed. That is, the thermoplastic epoxy resin layer or the curable resin layer may be formed on the modified polyolefin layer formed in advance by the above-mentioned procedure.
- thermoplastic epoxy resin layer or the curable resin layer of the film is in a state in which the constituent units of these resins (for example, a bifunctional epoxy resin, a bifunctional phenol compound, a polyol, an isocyanate compound, etc.) are completely reacted. It may be contained in, and a part thereof may be contained in an unreacted state. In the latter case, the unreacted components may be further reacted when the metal substrate and the film are bonded. With the reaction of this unreacted component, it may be possible to increase the bonding strength between the film and the metal substrate.
- a bifunctional epoxy resin, a bifunctional phenol compound, a polyol, an isocyanate compound, etc. may be contained in, and a part thereof may be contained in an unreacted state. In the latter case, the unreacted components may be further reacted when the metal substrate and the film are bonded. With the reaction of this unreacted component, it may be possible to increase the bonding strength between the film and the metal substrate.
- the thickness of the film depends on the type of resin of the resin member and the bonding area, but is preferably 1 ⁇ m to 10 mm, more preferably 2 ⁇ m or more, from the viewpoint of obtaining excellent bonding properties with the metal substrate and the resin member. It is 8 mm, more preferably 3 ⁇ m to 5 mm. Specifically, when the carbon fiber reinforced resin member (CFRP member) or the glass fiber reinforced resin member (GFRP member) is bonded to the metal base material, the thickness of the film is preferably 0.1 to 10 mm, which is more preferable. Is 0.2 to 8 mm, more preferably 0.5 to 5 mm. When the film has multiple layers, the thickness of the film is the total thickness of each layer.
- the planar shape of the film can be appropriately set according to the bonding location between the metal base material and the resin member and the desired bonding strength.
- the planar shape of the film can be, for example, a geometric shape such as a square, a rectangle, a triangle, a circle, or an ellipse.
- the planar shape of the film can also be grid-like, comb-like, or the like so that a single continuous film provides multiple joints.
- the resin coating layer of the present disclosure is derived from a film.
- the film When arranging the film on the surface of the metal substrate, it is preferable to heat the film, and it is more preferable to heat and pressurize the film.
- the heating can be 50 ° C to 180 ° C.
- the pressurization can be 0.01 MPa to 50 MPa.
- the modified polyolefin layer is exposed, in other words, the layer other than the modified polyolefin layer has or has a surface treatment. It is laminated so as to be in contact with a non-metal substrate or a functional group-containing layer.
- the resin coating layer is formed on the surface of the metal base material with excellent bondability, and exhibits excellent bondability with the resin member.
- the metal base material is provided with excellent adhesiveness (bondability via the resin coating layer) to the resin member containing polyolefin. Therefore, it can be said that the resin coating layer is a primer layer arranged on the joint surface of the metal base material.
- the primer layer is interposed between the metal base material and the resin member when the metal member and the resin member are joined, and the adhesiveness of the metal base material to the resin member (via the resin coating layer). It means that it is a layer that improves bondability).
- the surface of the metal base material is protected by the resin coating layer, it is possible to suppress deterioration such as adhesion of dirt to the surface of the metal base material and oxidation. Therefore, it is possible to obtain a metal member capable of maintaining excellent adhesiveness to the resin member even when stored for a long period of several months.
- the metal type of the metal base material is not particularly limited, and examples thereof include aluminum, iron, titanium, magnesium, stainless steel, and copper. Of these, aluminum is particularly preferably used from the viewpoint of light weight and ease of processing.
- the metal base material may be an extruded material, a die-cast material, a forged material, a cast material, or the like.
- the metal base material has at least a surface treatment on the surface to be joined with the resin member.
- the surface-treated portion (surface-treated portion) of the metal substrate is regarded as a part of the metal substrate.
- Examples of the surface treatment include cleaning / degreasing treatment with a solvent, blast treatment, polishing treatment, plasma treatment, laser treatment, etching treatment, and chemical conversion treatment, which are surface treatments that generate hydroxyl groups on the surface of a metal substrate. It is preferable to have. These surface treatments may be performed with only one type or two or more types. As a specific method for these surface treatments, known methods can be used.
- the surface treatment is to remove contaminants on the surface of the metal base material and / or to form fine irregularities on the surface of the metal base material to roughen the surface for the purpose of anchoring effect.
- the bondability between the surface of the metal substrate and the film can be improved, and as a result, the adhesiveness between the metal substrate and the resin member to be bonded (bondability via the film) is improved. You can also do it.
- the surface treatment at least one selected from the group consisting of blast treatment, polishing treatment, etching treatment and chemical conversion treatment is preferable.
- cleaning / degreasing treatment examples include degreasing the surface of a metal substrate with an organic solvent such as acetone or toluene.
- the cleaning / degreasing treatment is preferably performed before other surface treatments.
- blast processing examples include shot blasting and sand blasting.
- polishing treatment examples include buffing using a polishing cloth, roll polishing using polishing paper (sandpaper), and electrolytic polishing.
- Plasma treatment uses a high-voltage power supply to inject a plasma beam emitted from a rod called an electrode onto the surface of a material to first clean the foreign matter or oil film on the surface and then put energy into the gas according to the material. This is a method of exciting surface molecules.
- the plasma treatment include atmospheric pressure plasma treatment capable of imparting a hydroxyl group or other polar groups to the surface.
- Laser treatment is a technique for rapidly heating and cooling only the surface layer by laser irradiation to improve the surface properties of a material, and is an effective method for roughening the surface.
- a known laser treatment technique can be used as the laser treatment.
- etching treatment examples include a chemical etching treatment such as an alkali method, a phosphoric acid-sulfuric acid method, a fluoride method, a chromic acid-sulfuric acid method, and a salt iron method, and an electrochemical etching treatment such as an electrolytic etching method. ..
- the etching treatment is preferably an alkaline method using a sodium hydroxide aqueous solution or a potassium hydroxide aqueous solution as an etching solution, and a caustic soda method using a sodium hydroxide aqueous solution is more preferable.
- the alkaline method can be carried out, for example, by immersing the metal substrate in an aqueous solution of sodium hydroxide or potassium hydroxide having a concentration of 3 to 20% by mass at 20 to 70 ° C. for 1 to 15 minutes.
- a chelating agent, an oxidizing agent, a phosphate or the like may be added to the etching solution. After soaking, it is preferable to neutralize (de-smut) with a 5 to 20% by mass nitric acid aqueous solution, wash with water, and dry.
- the chemical conversion treatment mainly forms a chemical conversion film as a surface treatment portion on the surface of a metal base material.
- Examples of the chemical conversion treatment include boehmite treatment and zirconium treatment.
- the chemical conversion treatment is preferably boehmite treatment.
- a boehmite film is formed on the surface of the metal base material by treating the metal base material with hot water.
- Ammonia, triethanolamine or the like may be added to water as a reaction accelerator.
- a zirconium compound film is formed on the surface of the metal base material by immersing the metal base material in a zirconium salt-containing liquid such as zirconium phosphate.
- the metal substrate is immersed in a chemical agent for zirconium treatment (for example, "Pearl Coat 3762” manufactured by Nihon Parkerizing Co., Ltd., "Pearl Coat 3796", etc.) at 45 to 70 ° C. for 0.5 to 3 minutes. It is preferable to do this.
- the zirconium treatment is preferably performed after the etching treatment by the caustic soda method.
- the metal base material is aluminum, it is preferable that the metal base material is subjected to at least one surface treatment selected from etching treatment and boehmite treatment.
- One or more functional group-containing layers may be provided on the surface of the metal substrate in contact with the film.
- the functional group of the functional group-containing layer reacts with the hydroxyl group on the surface of the metal substrate and the functional group of the resin constituting the film to form a chemical bond, thereby adhering the surface of the metal substrate to the film.
- the property can be improved, and as a result, the adhesiveness (bonding property via a film) between the metal base material and the resin member to be bonded can also be improved.
- the functional group-containing layer is preferably formed by treating the surface of the metal base material with at least one selected from the group consisting of the following (1') to (7').
- seed and silane coupling agent having an amino group (3') Glycidyl compound, amino compound, isocyanate compound, compound having (meth) acryloyl group and glycidyl group, and compound having (meth) acryloyl group and amino group.
- a combination of at least one selected from the group consisting of a compound having an acryloyl group, an amino compound and a thiol compound and a silane coupling agent having a glycidyl group (6') isocyanate compound (7') thiol compound isocyanate compound.
- the functional group-containing layer preferably contains the functional group introduced by the above treatment, and specifically, preferably contains at least one functional group selected from the group consisting of the following (1) to (7).
- At least one functional group derived from the silane coupling agent and selected from the group consisting of a glycidyl group, an amino group, a (meth) acryloyl group and a mercapto group (2) An amino group derived from the silane coupling agent.
- a glycidyl compound, an amino compound, an isocyanate compound, a (meth) acryloyl group and a glycidyl group are added to a mercapto group derived from a silane coupling agent.
- a glycidyl group derived from a silane coupling agent is reacted with at least one selected from the group consisting of a compound having an amino group and a (meth) acryloyl group, an amino compound, and a thiol compound.
- the above-mentioned surface treatment portion can be provided on the surface of the metal base material.
- Anchor effect due to fine irregularities on the surface treatment part and chemical bonds formed by the functional groups of the functional group-containing layer reacting with the hydroxyl groups on the surface of the metal substrate and the functional groups of the resin constituting the film. Due to the synergistic effect, the adhesiveness between the surface of the metal base material and the film and the adhesiveness between the metal base material and the resin member to be bonded (bondability via the film) can be further improved.
- the method for forming the functional group-containing layer using a silane coupling agent, an isocyanate compound, a thiol compound, or the like is not particularly limited, and examples thereof include a spray coating method and a dipping method.
- the metal substrate is immersed in a solution of a silane coupling agent having a concentration of 5 to 50% by mass at room temperature to 100 ° C. for 1 minute to 5 days, and then immersed at room temperature to 100 ° C. for 1 minute to 5 hours.
- a functional group-containing layer can be formed by drying.
- silane coupling agent for example, a known one used for surface treatment of glass fiber or the like can be used.
- a silanol group produced by hydrolyzing a silane coupling agent or a silanol group of an oligomer product formed by condensing a silanol group reacts with a hydroxyl group existing on the surface of a metal substrate to bond to form a film.
- a functional group based on the structure of the silane coupling agent that can be chemically bonded to the functional group of the constituent resin can be imparted (introduced) to the metal substrate.
- the silane coupling agent is not particularly limited, and for example, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane and N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane.
- the isocyanate compound is based on the structure of the isocyanate compound which can be chemically bonded to the functional group of the resin constituting the film by reacting and bonding the isocyanato group in the isocyanate compound with the hydroxyl group existing on the surface of the metal substrate.
- a functional group can be imparted (introduced) to a metal substrate.
- the isocyanate compound is not particularly limited, and is, for example, a polyfunctional isocyanate such as diphenylmethane diisocyanate (MDI), hexamethylene diisocyanate (HDI), tolylene diisocyanate (TDI), isophorone diisocyanate (IPDI); and 2-isosia.
- MDI diphenylmethane diisocyanate
- HDI hexamethylene diisocyanate
- TDI tolylene diisocyanate
- IPDI isophorone diisocyanate
- 2-isosia for example, “Karenzu MOI (registered trademark)” manufactured by Showa Denko Co., Ltd.
- 2-isocyanatoethyl acrylate for example, "Karenzu AOI (registered trademark)” manufactured by Showa Denko Co., Ltd. "," AOI-VM (registered).
- Examples thereof include isocyanate compounds having a radically reactive group such as ”)”) and 1,1- (bisacryloyloxyethyl) ethyl isocyanate (for example, "Karenzu BEI (registered trademark)” manufactured by Showa Denko Co., Ltd.).
- the thiol compound is based on the structure of the thiol compound which can be chemically bonded to the functional group of the resin constituting the film by reacting and bonding the mercapto group in the thiol compound with the hydroxyl group existing on the surface of the metal substrate.
- a functional group can be imparted (introduced) to a metal substrate.
- the thiol compound is not particularly limited, and is, for example, pentaerythritol tetrakis (3-mercaptopropionate) (for example, "QX40” manufactured by Mitsubishi Chemical Co., Ltd., “QE-340M” manufactured by Toray Fine Chemical Co., Ltd.). , Ether-based first-class thiol (for example, “Cup Cure 3-800” manufactured by Cognis), 1,4-bis (3-mercaptobutyryloxy) butane (for example, "Karensu MT (registered) manufactured by Showa Denko KK).
- pentaerythritol tetrakis (3-mercaptopropionate) for example, "QX40” manufactured by Mitsubishi Chemical Co., Ltd., "QE-340M” manufactured by Toray Fine Chemical Co., Ltd.
- Ether-based first-class thiol for example, "Cup Cure 3-800” manufactured by Cognis
- Metal member-resin member joint By joining the resin member on the resin coating layer of the metal member, it is possible to manufacture a metal member-resin member joint body in which the metal member and the resin member are joined with high bonding strength.
- the resin member contains polyolefin.
- the polyolefin is not particularly limited, and examples thereof include polyethylene and polypropylene.
- Polypropylene is generally a highly rigid homopolymer obtained by polymerizing only propylene, a highly transparent and flexible random polymer copolymerized with a small amount of ethylene, and a rubber component (EPR) uniformly and finely dispersed in the homopolymer or random polymer. It is classified as a block copolymer with high impact resistance.
- Polypropylene may contain homopolymers, random polymers, or block copolymers, or mixtures thereof.
- Polypropylene may be a high-strength type containing talc, glass fiber, or carbon fiber. Examples of the talc-containing polypropylene include TRC104N, which is a trade name manufactured by SunAllomer Ltd.
- glass fiber-containing polypropylene examples include product name PP-GF40-01 F02 manufactured by Daicel FineChem Co., Ltd.
- carbon fiber-containing polypropylene examples include product name PP-CF40-01 F008 manufactured by Daicel FineChem Co., Ltd.
- Glass fiber-containing polypropylene is a type of glass fiber reinforced resin (GFRP), and carbon fiber-containing polypropylene is a type of carbon fiber reinforced resin (CFRP).
- the resin containing reinforcing fibers such as glass fiber and carbon fiber may be in the form of a molded body such as a sheet molding compound (SMC) or a bulk molding compound (BMC).
- SMC is a sheet-shaped molded body obtained by impregnating reinforcing fibers such as glass fiber and carbon fiber with a resin composition in which polypropylene, a low shrinkage agent, a filler and the like are mixed.
- a metal member-resin member joint is manufactured by separately manufacturing a metal member and a resin member and joining (adhering) them.
- the joining can be performed by at least one method selected from the group consisting of an ultrasonic welding method, a vibration welding method, an electromagnetic induction method, a high frequency method, a laser method, and a heat pressing method.
- FIG. 1 which is an explanatory view of this embodiment, the film 4 and the metal base material 2 are prepared (upper stage), and the film 4 is placed on the surface of at least a part of the metal base material 2 so that the modified polyolefin layer is exposed.
- a metal member 1 in which a resin coating layer (derived from film 4) is laminated is formed on the metal base material 2 (middle stage), and is placed on the resin coating layer (derived from film 4) of the metal member 1.
- the metal member-resin member joint 10 is manufactured (lower stage). According to this embodiment, since a device such as an injection molding machine is not required for manufacturing the metal member-resin member joint, the degree of freedom in the dimensions and shape of the metal member or the resin member is high, and the shape is large or complicated. A metal member-resin member joint can be easily manufactured.
- a metal member-resin member joint is manufactured by joining (adhering) the metal member and the resin member at the same time as molding the resin member. Specifically, the joining is performed simultaneously with the molding of the resin member on the resin coating layer of the metal member by an injection molding method, a transfer molding method, a press molding method, a filament winding molding method, or a hand lay-up molding method. ..
- FIG. 2 which is an explanatory view of this embodiment, the film 4 and the metal base material 2 are prepared (upper stage), and the film 4 is placed on the surface of at least a part of the metal base material 2 so that the modified polyolefin layer is exposed.
- a metal member 1 in which a resin coating layer (derived from film 4) is laminated is formed on the metal base material 2 (middle stage), and is placed on the resin coating layer (derived from film 4) of the metal member 1.
- the metal member-resin member joint 10 is manufactured (lower stage). According to this embodiment, since it is not necessary to separately mold the resin member, it is possible to reduce the manufacturing process of the metal member-resin member joint.
- the method for manufacturing the metal member-resin member joint of the second embodiment is to prepare the above film, to sandwich the film between the metal base material and the resin member so that the modified polyolefin layer comes into contact with the resin member. It includes joining a metal base material and a resin member via a film. The joining can be performed by at least one method selected from the group consisting of an ultrasonic welding method, a vibration welding method, an electromagnetic induction method, a high frequency method, a laser method, and a heat pressing method.
- an ultrasonic welding method a vibration welding method
- an electromagnetic induction method a high frequency method
- a laser method and a heat pressing method.
- the film 4 is arranged between the metal base material 2 and the resin member 6 (upper stage), and the film 4 is made of a metal base so that the modified polyolefin layer comes into contact with the resin member 6.
- the metal member-resin member joint 10 is manufactured by sandwiching the material 2 and the resin member 6 and joining the metal base material 2 and the resin member 6 via the film 4 (lower stage). In the second embodiment, it can be considered that the production of the metal member and the production of the metal member-resin member joint are performed at the same time.
- the film is arranged so as to be in contact with the surface-treated portion or the functional group-containing layer of the metal substrate. According to the second embodiment, the number of manufacturing steps of the metal member-resin member joint can be further reduced.
- FIG. 4 shows a schematic cross-sectional view of the metal member-resin member joint of one embodiment.
- the metal base material 2 having the surface treatment portion 2a and the resin member 6 are joined via the film 4 (resin coating layer).
- the film 4 has a multilayer structure having a modified polyolefin layer 4a, a thermoplastic epoxy resin layer 4b and / or a curable resin layer 4c, so that the modified polyolefin layer 4a is in contact with the resin member 6. Is located in.
- FIG. 5 shows a schematic cross-sectional view of a metal member-resin member joint of another embodiment.
- the functional group-containing layer 3 is arranged between the film 4 and the metal base material 2, and the film 4 is laminated on the functional group-containing layer 3.
- the metal member-resin member joint may have an adhesive layer arranged between the film (resin coating layer) and the resin member.
- FIG. 6 shows a schematic cross-sectional view of the metal member-resin member joint of this embodiment.
- the metal member-resin member joint 10 has an adhesive layer 5 arranged between the film 4 (resin coating layer) and the resin member 6.
- the metal base material and the resin member can be bonded with higher bonding strength by using the adhesive layer.
- the adhesive for the adhesive layer is appropriately selected depending on the type of resin of the resin member, and for example, known adhesives such as epoxy resin-based, urethane resin-based, and vinyl ester resin-based adhesives can be used.
- the metal member-resin member bonded body is thermally deformed due to the difference in the coefficient of thermal expansion between the metal base material and the resin member in the process of cooling to room temperature after joining (bonding). May be done. From the viewpoint of suppressing and alleviating such thermal deformation, it is desirable that the total thickness of the film (resin coating layer) and the adhesive layer be 4 ⁇ m or more.
- the above-mentioned total thickness should be determined in consideration of physical properties such as the elongation rate of the film (resin coating layer) and the adhesive layer in the temperature change at the time of joining (the temperature change from the heating temperature at the time of joining to room temperature cooling). Is preferable.
- the preferable upper limit of the total thickness of the film (resin coating layer) and the adhesive layer is 10 mm.
- the layer involved in the joining between the metal member and the resin member is referred to as a joining layer, and the thickness thereof is referred to as the thickness of the joining layer.
- the metal member-resin member joint has an adhesive layer
- both the film (resin coating layer) and the adhesive layer are the bonding layers
- the total thickness of the film (resin coating layer) and the adhesive layer is the bonding layer. Is the thickness of.
- the film (resin coating layer) is the joint layer, and the thickness thereof is the thickness of the joint layer.
- the method and film for manufacturing a metal member-resin member joint of the present disclosure include, for example, a door side panel, a bonnet roof, a tailgate, a steering hanger, an A pillar, a B pillar, a C pillar, a D pillar, a crash box, and a power control unit.
- Automotive parts such as housings, electric compressor members (inner wall, suction port, exhaust control valve (ECV) insertion, mount boss, etc.), lithium-ion battery (LIB) spacers, battery cases, LED headlamps, etc. , And can be used in the manufacture of electrical and electronic products such as smartphones, laptops, tablet computers, smart watches, large LCD TVs (LCD-TVs), and outdoor LED lighting.
- the composition of the aluminum alloy is Si: 0.45% by mass, Fe: 0.21% by mass, Cu: 0.05% by mass, Mg: 0.75% by mass, Cr: 0.05% by mass, and the balance is Al and It was an unavoidable impurity.
- the tensile strength of the aluminum plate was 240 MPa, and its Young's modulus was 68 GPa.
- the aluminum plate was immersed in a sodium hydroxide aqueous solution having a concentration of 5% by mass for 1.5 minutes, neutralized with a nitric acid aqueous solution having a concentration of 5% by mass, washed with water, and dried to perform an etching treatment.
- the etched aluminum plate was boiled in pure water for 10 minutes and then baked at 250 ° C. for 10 minutes to perform boehmite treatment to form a boehmite film on the surface of the aluminum plate.
- the aluminum plate after the boehmite treatment was prepared by dissolving 2 g of 3-aminopropyltrimethoxysilane (“KBM-903” manufactured by Shinetsu Silicone Co., Ltd .; a silane coupling agent) in 1000 g of industrial ethanol in a silane cup at 70 ° C. After immersing in the ring agent-containing solution for 20 minutes, the aluminum plate was taken out and dried to form a functional group-containing layer on the surface of the boehmite film. In this way, an aluminum substrate having an amino group-containing layer on the etching treatment and the boehmite film was prepared.
- KBM-903 3-aminopropyltrimethoxysilane manufactured by Shinetsu Silicone Co., Ltd .
- a silane coupling agent 1000 g of industrial ethanol in a silane cup at 70 ° C.
- ⁇ Manufacturing example 4 Copper base material> As a metal base material, a copper plate having a thickness of 18 mm ⁇ 45 mm and a thickness of 1.5 mm was degreased with acetone.
- the degreased copper plate was prepared with a silane cup at 70 ° C. in which 0.5 g of 3-methacryloxypropyltrimethoxysilane (KBM-503 manufactured by Shinetsu Silicone Co., Ltd .; a silane coupling agent) was dissolved in 100 g of industrial ethanol. After immersing in the ring agent-containing solution for 5 minutes, the copper plate was taken out and dried, and a functional group derived from the silane coupling agent was introduced on the surface of the degreased copper plate.
- KBM-503 manufactured by Shinetsu Silicone Co., Ltd .
- a silane coupling agent a silane coupling agent
- 1,4-bis (3-mercaptobutyryloxy) butane (Carens MT (registered trademark) BD1 manufactured by Showa Denko KK), which is a bifunctional thiol compound: 0.6 g, 2,4,6-tris (dimethyl).
- Aminomethyl) phenol (DMP-30): 0.05 g was immersed in a solution dissolved in 150 g of toluene at 70 ° C. for 10 minutes, then pulled up and dried. In this way, a copper base material having two functional group-containing layers (methacryloyl group-containing layer and mercapto group-containing layer) was prepared on the degreased surface.
- Iron base material> As a metal base material, an iron plate having a thickness of 18 mm ⁇ 45 mm and a thickness of 1.5 mm was sanded using # 100 sandpaper to form fine irregularities on the surface of the iron plate. In this way, an iron substrate having a sanded surface was produced.
- Magnesium base material> As a metal base material, a magnesium plate having a thickness of 18 mm ⁇ 45 mm and a thickness of 1.5 mm was sanded using # 100 sandpaper to form fine irregularities on the surface of the magnesium plate. Next, the same operation as in Production Example 4 was carried out to form a functional group-containing layer on the surface of the magnesium plate after the sanding treatment. In this way, a magnesium base material having two functional group-containing layers (methacryloyl group-containing layer and mercapto group-containing layer) was prepared on the sanding treatment.
- ⁇ Manufacturing example 7 SUS base material> As a metal base material, a martensitic stainless steel (SUS403) steel sheet with a thickness of 18 mm ⁇ 45 mm and a thickness of 1.5 mm is sanded using # 100 sandpaper to form fine irregularities on the surface of the stainless steel sheet. did. Next, the same operation as in Production Example 3 was performed to form a functional group-containing layer on the surface of the stainless steel sheet after the sanding treatment. In this way, a SUS substrate having an amino group-containing layer on the sanding treatment was produced.
- SUS403 martensitic stainless steel
- Table 2 shows the details of the metal base material and the functional group-containing layer of Production Examples 3 to 7.
- Example 1 Preparation of film A> A xylene solution of modified PP-1 is applied on a release film so that the thickness after drying is 30 ⁇ m, and the solvent is volatilized by leaving it in the air at room temperature for 30 minutes to volatilize the solvent on the release film. Film A was produced.
- thermoplastic epoxy resin composition A xylene solution of a thermoplastic epoxy resin composition is applied onto a release film so that the thickness after drying is 30 ⁇ m, and the solvent is volatilized by leaving it in the air at room temperature for 30 minutes to volatilize the release film.
- a thermoplastic epoxy resin layer was formed on the film.
- a xylene solution of modified PP-2 was applied to the surface of the thermoplastic epoxy resin layer so that the thickness after drying was 30 ⁇ m.
- the solvent was volatilized by leaving the coating film in the air at room temperature for 30 minutes and then held at 150 ° C. for 30 minutes to prepare a film B having a modified polyolefin layer and a thermoplastic epoxy resin layer.
- Example 3 Metal member-resin member joint> In a drying oven at a temperature of 120 ° C., a film A from which the release film was peeled off was pressure-bonded onto a functional group-containing layer of an aluminum base material to prepare a metal member having a resin coating layer derived from the film A.
- the metal member and the resin member A are overlapped with each other so that the resin coating layer of the metal member and the resin member A are in contact with each other and the joint portion has a length of 5 mm and a width of 10 mm.
- Ultrasonic welding was performed using an ultrasonic welding machine SONOPET-JII430T-M (28.5 KHz) manufactured by Seidensha Electronics Co., Ltd. As a result, a test piece for tensile test (metal member-resin member joint) conforming to ISO19095 was produced.
- Example 4 Injection molding joining> Polypropylene resin (PP resin) containing glass fibers (PP resin) (Daicel FineChem Co., Ltd.) on a resin coating layer of a metal member produced in the same procedure as in Example 3 except that the aluminum base material of Example 3 was changed to an iron base material.
- PP-GF40-01 F02 manufactured by Injection Molding Machine (SE100V manufactured by Sumitomo Heavy Industries, Ltd .; Cylinder temperature 200 ° C, Tool temperature 30 ° C, Injection speed 50 mm / sec, Peak / Holding pressure 195/175 [MPa / MPa] ]
- the resin member was joined to the metal member while being molded by injection molding.
- test piece for tensile test (PP resin, 10 mm ⁇ 45 mm ⁇ 3 mm, joint length 5 mm) (metal member-resin member joint) conforming to ISO19095 was produced.
- the joint strength of the test piece was measured by the same method as in Example 3. The measurement results are shown in Table 3.
- Example 5 Sandwich joining> A film A from which the release film has been peeled off is sandwiched between the aluminum base material and the resin member A so that the film A comes into contact with the functional group-containing layer of the aluminum base material, and the joint portion has a length of 5 mm and a width of 10 mm.
- ultrasonic welding was performed using an ultrasonic welding machine SONOPET-JII430T-M (28.5 KHz) manufactured by Seidensha Electronics Co., Ltd.
- SONOPET-JII430T-M 28.5 KHz
- Example 6 Metal member-resin member joining> In a drying furnace at a temperature of 120 ° C., the film B from which the release film was peeled off was pressure-bonded onto the functional group-containing layer of the copper substrate so that the modified polyolefin layer was exposed, and the resin coating layer derived from the film B was pressed. A metal member having the above was produced.
- the metal member and the resin member A are overlapped with each other so that the resin coating layer of the metal member and the resin member A are in contact with each other and the joint portion has a length of 5 mm and a width of 10 mm.
- Ultrasonic welding was performed using an ultrasonic welding machine SONOPET-JII430T-M (28.5 KHz) manufactured by Seidensha Electronics Co., Ltd.
- SONOPET-JII430T-M 28.5 KHz
- a test piece for tensile test (metal member-resin member joint) conforming to ISO19095 was produced.
- the joint strength of the test piece was measured by the same method as in Example 3. The measurement results are shown in Table 3.
- Example 7 Injection molding joining> Polypropylene resin (PP resin) containing carbon fibers (PP resin) (Daicel FineChem Co., Ltd.) on a resin coating layer of a metal member produced in the same procedure as in Example 6 except that the copper base material of Example 6 was changed to a SUS base material.
- PP-CF40-01 F008 manufactured by injection molding machine (SE100V manufactured by Sumitomo Heavy Industries, Ltd .; cylinder temperature 200 ° C, tool temperature 30 ° C, injection speed 50 mm / sec, peak / holding pressure 195/175 [MPa / MPa] ]), The resin member was joined to the metal member while being molded by injection molding.
- test piece for tensile test (PP resin, 10 mm ⁇ 45 mm ⁇ 3 mm, joint length 5 mm) (metal member-resin member joint) conforming to ISO19095 was produced.
- the joint strength of the test piece was measured by the same method as in Example 3. The measurement results are shown in Table 3.
- Example 8 Sandwich joining> The release film is formed so that the modified polyolefin layer of the film B comes into contact with the resin member A and the thermoplastic epoxy resin layer comes into contact with the functional group-containing layer of the magnesium base material between the magnesium base material and the resin member A.
- the ultrasonic welding machine SONOPET- Ultrasonic welding was performed using JII430TM (28.5 KHz).
- JII430TM 28.5 KHz
- a test piece for tensile test metal member-resin member joint
- the joint strength of the test piece was measured by the same method as in Example 3. The measurement results are shown in Table 3.
- Metal member-resin member joint A test piece for a tensile test (metal member-resin member joint) was produced by the same procedure as in Example 3 except that the film C was used instead of the film A. The joint strength of the test piece was measured by the same method as in Example 3. The measurement results are shown in Table 3.
- the present invention can be used for manufacturing a metal member-resin member joint.
- Metal member 2 Metal base material 2a: Surface treatment part 3: Functional group-containing layer 4: Film (resin coating layer) 4a: Modified polyolefin layer 4b: Thermoplastic epoxy resin layer 4c: Curable resin layer 5: Adhesive layer 6: Resin member 10: Metal member-resin member bonded body
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Abstract
Description
[1]
無水マレイン酸変性ポリオレフィンと2官能エポキシ樹脂と2官能フェノール化合物との反応物1を含む層、無水マレイン酸変性ポリオレフィンと熱可塑性エポキシ樹脂との反応物2を含む層、及びポリオレフィンと熱可塑性エポキシ樹脂との混合物を含む層からなる群より選ばれる少なくとも1種の変性ポリオレフィン層を含むフィルムを用意すること、
前記変性ポリオレフィン層が露出するように、前記フィルムを金属基材の少なくとも一部の表面の上に配置して、前記金属基材の上に樹脂コーティング層が積層された金属部材を形成すること、
前記金属部材の前記樹脂コーティング層の上に樹脂部材を接合すること
を含む、金属部材-樹脂部材接合体を製造する方法。
[2]
前記接合が、超音波溶着法、振動溶着法、電磁誘導法、高周波法、レーザー法、及び熱プレス法からなる群より選ばれる少なくとも1種の方法で行われる、[1]に記載の方法。
[3]
前記接合が、前記金属部材の前記樹脂コーティング層の上に、射出成形法、トランスファ成形法、プレス成形法、フィラメントワインディング成形法、又はハンドレイアップ成形法による樹脂部材の成形と同時に行われる、[1]に記載の方法。
[4]
無水マレイン酸変性ポリオレフィンと2官能エポキシ樹脂と2官能フェノール化合物との反応物1を含む層、無水マレイン酸変性ポリオレフィンと熱可塑性エポキシ樹脂との反応物2を含む層、及びポリオレフィンと熱可塑性エポキシ樹脂との混合物を含む層からなる群より選ばれる少なくとも1種の変性ポリオレフィン層を含むフィルムを用意すること、
前記変性ポリオレフィン層が樹脂部材と接触するように前記フィルムを金属基材と前記樹脂部材との間に挟むこと、
前記金属基材と前記樹脂部材とを前記フィルムを介して接合すること
を含む、金属部材-樹脂部材接合体を製造する方法。
[5]
前記接合が、超音波溶着法、振動溶着法、電磁誘導法、高周波法、レーザー法、及び熱プレス法からなる群より選ばれる少なくとも1種の方法で行われる、[4]に記載の方法。
[6]
前記反応物1が、無水マレイン酸変性ポリオレフィンを含む溶液中で、2官能エポキシ樹脂と2官能フェノール化合物を重付加反応させてなる、[1]~[5]のいずれかに記載の方法。
[7]
前記反応物2が、2官能エポキシ樹脂と2官能フェノール化合物の重付加反応により生成した熱可塑性エポキシ樹脂と、無水マレイン酸変性ポリオレフィンとを反応させてなる、[1]~[5]のいずれかに記載の方法。
[8]
前記混合物が、ポリプロピレンと熱可塑性エポキシ樹脂との混合物である、[1]~[5]のいずれかに記載の方法。
[9]
前記フィルムが、前記変性ポリオレフィン層と、前記変性ポリオレフィン層以外の層とを含む複数層からなり、前記変性ポリオレフィン層以外の層の少なくとも1層が、熱可塑性エポキシ樹脂を含む樹脂組成物から形成された熱可塑性エポキシ樹脂層及び硬化性樹脂を含む樹脂組成物から形成された硬化性樹脂層から選ばれる少なくとも1種である、[1]~[8]のいずれかに記載の方法。
[10]
前記硬化性樹脂が、ウレタン樹脂、エポキシ樹脂、ビニルエステル樹脂及び不飽和ポリエステル樹脂からなる群より選ばれる少なくとも1種である、[9]に記載の方法。
[11]
前記金属基材が、前記フィルムと接する表面に積層された官能基含有層を有し、
前記官能基含有層が、下記(1)~(7)からなる群より選ばれる少なくとも1つの官能基を含む、[1]~[10]のいずれかに記載の方法。
(1)シランカップリング剤由来であって、グリシジル基、アミノ基、(メタ)アクリロイル基及びメルカプト基からなる群より選ばれる少なくとも1つの官能基
(2)シランカップリング剤由来のアミノ基に、グリシジル化合物及びチオール化合物から選ばれる少なくとも1種が反応して生成した官能基
(3)シランカップリング剤由来のメルカプト基に、グリシジル化合物、アミノ化合物、イソシアネート化合物、(メタ)アクリロイル基及びグリシジル基を有する化合物、並びに(メタ)アクリロイル基及びアミノ基を有する化合物からなる群より選ばれる少なくとも1種が反応して生成した官能基
(4)シランカップリング剤由来の(メタ)アクリロイル基に、チオール化合物が反応して生成した官能基
(5)シランカップリング剤由来のグリシジル基に、アミノ基及び(メタ)アクリロイル基を有する化合物、アミノ化合物、及びチオール化合物からなる群より選ばれる少なくとも1種が反応して生成した官能基
(6)イソシアネート化合物由来のイソシアナト基
(7)チオール化合物由来のメルカプト基
[12]
前記金属基材の表面に、ブラスト処理、研磨処理、エッチング処理及び化成処理からなる群より選ばれる少なくとも1種の表面処理が施されている、[1]~[11]のいずれかに記載の方法。
[13]
無水マレイン酸変性ポリオレフィンと2官能エポキシ樹脂と2官能フェノール化合物との反応物1を含む層、無水マレイン酸変性ポリオレフィンと熱可塑性エポキシ樹脂との反応物2を含む層、及びポリオレフィンと熱可塑性エポキシ樹脂との混合物を含む層からなる群より選ばれる少なくとも1種の変性ポリオレフィン層を含むフィルム。
第1実施形態の金属部材-樹脂部材接合体の製造方法は、無水マレイン酸変性ポリオレフィンと2官能エポキシ樹脂と2官能フェノール化合物との反応物1を含む層、無水マレイン酸変性ポリオレフィンと熱可塑性エポキシ樹脂との反応物2を含む層、及びポリオレフィンと熱可塑性エポキシ樹脂との混合物を含む層からなる群より選ばれる少なくとも1種の変性ポリオレフィン層を含むフィルムを用意すること、変性ポリオレフィン層が露出するように、フィルムを金属基材の少なくとも一部の表面の上に配置して、金属基材の上に樹脂コーティング層が積層された金属部材を形成すること、金属部材の樹脂コーティング層の上に樹脂部材を接合することを含む。
金属部材に含まれる金属基材の上に積層された樹脂コーティング層は、上記変性ポリオレフィン層を含むフィルムを用いて形成される。
フィルムの少なくとも1層は、変性ポリオレフィンを含む樹脂組成物から形成された変性ポリオレフィン層である。変性ポリオレフィン層を含むフィルムは、金属基材と樹脂部材とを高い接合強度で接着(接合)することができる。
反応物1は、無水マレイン酸変性ポリオレフィンの溶液中で、2官能エポキシ樹脂と2官能フェノール化合物とを触媒存在下で重付加反応させることで得ることができる。このとき、無水マレイン酸変性ポリオレフィンは、2官能エポキシ樹脂、2官能フェノール化合物、及び反応物2の項にて後述する2官能エポキシ樹脂と2官能フェノール化合物から生成した熱可塑性エポキシ樹脂とも反応するものと考えられる。
無水マレイン酸変性ポリオレフィンは、無水マレイン酸をポリオレフィンにグラフトしたものであり、例えば、無水マレイン酸変性ポリエチレン、及び無水マレイン酸変性ポリプロピレンが挙げられる。無水マレイン酸変性ポリオレフィンとしては、具体的には、化薬アクゾ社製カヤブリッド002PP、002PP-NW、003PP、003PP-NW、及び三菱ケミカル株式会社製Modicシリーズが挙げられる。無水マレイン酸で機能化させたポリプロピレン添加剤としてBYK社製SCONA TPPP2112GA、TPPP8112GA、又はTPPP9212GAを無水マレイン酸変性ポリオレフィンと併用してもよい。
2官能エポキシ樹脂としては、例えば、ビスフェノール型エポキシ樹脂、及びビフェニル型エポキシ樹脂が挙げられる。2官能エポキシ樹脂は、単独で用いてもよく、2種以上を併用してもよい。2官能エポキシ樹脂としては、具体的には、三菱ケミカル株式会社製「jER(登録商標)828」、「jER(登録商標)834」、「jER(登録商標)1001」、「jER(登録商標)1004」、「jER(登録商標)1007」、及び「jER(登録商標)YX-4000」が挙げられる。
2官能フェノール化合物としては、例えば、ビスフェノール、及びビフェノールが挙げられる。2官能フェノール化合物は、単独で用いてもよく、2種以上を併用してもよい。2官能フェノール化合物の組み合わせとしては、例えば、ビスフェノールA型エポキシ樹脂とビスフェノールA;ビスフェノールA型エポキシ樹脂とビスフェノールF;ビフェニル型エポキシ樹脂と4,4’-ビフェノール;及びナガセケムテックス株式会社製「WPE190」と「EX-991L」が挙げられる。
反応物2は、2官能エポキシ樹脂と2官能フェノール化合物の重付加反応により生成した熱可塑性エポキシ樹脂と、無水マレイン酸変性ポリオレフィンを反応させることで得ることができる。この反応で用いる無水マレイン酸変性ポリオレフィン、2官能エポキシ樹脂、及び2官能フェノール化合物としては、反応物1を生成するときと同じものを用いることができる。
反応物2の製造に使用する熱可塑性エポキシ樹脂は、現場重合型フェノキシ樹脂、現場硬化型フェノキシ樹脂、現場硬化型エポキシ樹脂などとも呼ばれる樹脂であり、2官能エポキシ樹脂と2官能フェノール化合物とが触媒存在下で重付加反応することにより、熱可塑構造、すなわち、リニアポリマー構造を形成する。ここで、リニアポリマーとは、ポリマー分子中に架橋構造を含まず、1次元の直鎖状であるポリマーを意味する。熱可塑性エポキシ樹脂は、架橋構造による3次元ネットワークを構成する硬化性樹脂とは異なり、熱可塑性を有する。
混合物の形成に使用するポリオレフィンとしては、樹脂部材に使用されるポリオレフィンを使用することができる。ポリオレフィンは、特に限定されるものではなく、一般的な合成樹脂であってよい。ポリオレフィンとしては、例えば、ポリエチレン、及びポリプロピレンが挙げられ、ポリプロピレンが好ましい。
フィルムを、変性ポリオレフィン層と、変性ポリオレフィン層以外の層とを含む複数層で構成し、変性ポリオレフィン層以外の層の少なくとも1層を、熱可塑性エポキシ樹脂を含む樹脂組成物から形成された熱可塑性エポキシ樹脂層で構成することができる。
熱可塑性エポキシ樹脂は、反応物2の製造に使用する熱可塑性エポキシ樹脂と同様に、2官能エポキシ樹脂と2官能フェノール化合物とが触媒存在下で重付加反応することにより、熱可塑構造、すなわち、リニアポリマー構造を形成する樹脂であり、架橋構造による3次元ネットワークを構成する硬化性樹脂とは異なり、熱可塑性を有する。熱可塑性エポキシ樹脂は、このような特徴を有していることにより、変性ポリオレフィン層との接合性に優れた熱可塑性エポキシ樹脂層を形成することができる。
フィルムを、変性ポリオレフィン層と、変性ポリオレフィン層以外の層とを含む複数層で構成し、変性ポリオレフィン層以外の層を、硬化性樹脂を含む樹脂組成物から形成された硬化性樹脂層で構成することもできる。
ウレタン樹脂は、通常、イソシアネート化合物のイソシアナト基とポリオール化合物の水酸基との反応によって得られる樹脂であり、ASTM D16において、「ビヒクル不揮発成分10重量%以上のポリイソシアネートを含む塗料」と定義されるものに該当するウレタン樹脂が好ましい。ウレタン樹脂は、一液型であってもよく、二液型であってもよい。
エポキシ樹脂は、1分子中に少なくとも2個のエポキシ基を有する樹脂である。エポキシ樹脂の硬化前のプレポリマーとしては、例えば、エーテル系ビスフェノール型エポキシ樹脂、ノボラック型エポキシ樹脂、ポリフェノール型エポキシ樹脂、脂肪族型エポキシ樹脂、エステル系の芳香族エポキシ樹脂、環状脂肪族エポキシ樹脂、及びエーテル・エステル系エポキシ樹脂が挙げられる。これらの中でも、ビスフェノールA型エポキシ樹脂が好適に用いられる。エポキシ樹脂は、単独で用いてもよく、2種以上を併用してもよい。
ビニルエステル樹脂は、ビニルエステル化合物を重合性モノマー(例えば、スチレン)に溶解したものである。ビニルエステル樹脂は、一般にエポキシ(メタ)アクリレート樹脂とも呼ばれるが、本開示において、ビニルエステル樹脂にはウレタン(メタ)アクリレート樹脂も包含される。
不飽和ポリエステル樹脂は、ポリオール化合物と不飽和多塩基酸(及び必要に応じて飽和多塩基酸)とのエステル化反応による縮合生成物(不飽和ポリエステル)を重合性モノマー(例えば、スチレン)に溶解したものである。
フィルムを構成する1つ又は複数の層は、任意成分として、フィルム形成剤、粘着付与剤、又はその両方を含んでもよい。フィルムに使用することのできる他の任意成分としては、例えば、フィラー、顔料及び染料等の着色剤、熱安定剤、紫外線吸収剤、及び酸化防止剤も挙げられる。
フィルム形成剤を用いることにより、フィルムの製造時の成膜性及び製造後の形状保持性を高めることができる。フィルム形成剤としては、例えば、ポリエチレン、ポリプロピレン、ポリ塩化ビニル、塩素化ポリエチレン及び塩素化ポリプロピレン等の塩素化ポリオレフィン、熱可塑性ポリウレタン、ポリスチレン、ポリスチレン-無水マレイン酸コポリマー等のポリスチレンコポリマー、熱可塑性ポリエステル、ポリエーテル、熱可塑性ポリアミド、ヒドロキシエチルセルロース等のセルロースポリマー、ポリビニルアセタール、及びポリビニルブチラールが挙げられる。
粘着付与剤を用いることにより、フィルムを金属基材に確実に固定することができ、これにより高い精度で所望の位置に樹脂コーティング層を形成することができる。粘着付与剤としては、例えば、不均化ロジンエステル、重合ロジンエステル及び水添ロジンエステル等のロジン系樹脂、テルペン系樹脂、テルペンフェノール樹脂、芳香族変性テルペン樹脂、水添テルペン樹脂、脂肪族系(C5系)石油樹脂、芳香族系(C9)石油樹脂、脂肪族-芳香族系(C5-C9系)石油樹脂、水添石油樹脂、クマロンインデン樹脂、フェノール系樹脂、スチレン系樹脂、及びキシレン系樹脂が挙げられる。
フィルムの変性ポリオレフィン層が露出するように、フィルムを金属基材の少なくとも一部の表面の上に配置することにより、金属基材の上に樹脂コーティング層が積層された金属部材を形成することができる。したがって、本開示の樹脂コーティング層はフィルムに由来する。フィルムを金属基材の表面の上に配置する際に、フィルムを加熱することが好ましく、加熱及び加圧することがより好ましい。加熱は50℃~180℃とすることができる。加圧は0.01MPa~50MPaとすることができる。金属基材が後述する表面処理部及び/又は官能基含有層を有する場合は、これらの上にフィルムが配置される。変性ポリオレフィン層と、当該変性ポリオレフィン層以外の層とを含む複数層で構成されるフィルムは、変性ポリオレフィン層が露出するように、言い換えると変性ポリオレフィン層以外の層が、表面処理を有する若しくは有さない金属基材又は官能基含有層に接触するように積層される。
金属基材の金属種としては、特に限定されるものではなく、例えば、アルミニウム、鉄、チタン、マグネシウム、ステンレス鋼、銅等が挙げられる。これらのうち、軽量性及び加工容易性等の観点から、アルミニウムが特に好適に用いられる。金属基材は、押出材、ダイカスト材、鍛造材、鋳造材等であってよい。
金属基材は、少なくとも樹脂部材との接合予定面に表面処理を有することが好ましい。本開示において、金属基材において表面処理がなされた部分(表面処理部)は、金属基材の一部とみなす。
溶剤等による洗浄・脱脂処理としては、例えば、金属基材の表面を、アセトン、トルエン等の有機溶剤を用いて脱脂することが挙げられる。洗浄・脱脂処理は、他の表面処理の前に行うことが好ましい。
ブラスト処理としては、例えば、ショットブラスト、及びサンドブラストが挙げられる。
研磨処理としては、例えば、研磨布を用いたバフ研磨、研磨紙(サンドペーパー)を用いたロール研磨、及び電解研磨が挙げられる。
プラズマ処理とは、高圧電源を用いて、電極と呼ばれるロッドから出るプラズマビームを材料表面に入射させることで、表面に存在する異物又は油膜を先ず洗浄し、素材に応じたガスにエネルギーを投入することで表面分子を励起する方法である。プラズマ処理としては、例えば、表面に水酸基又はその他の極性基を付与することができる大気圧プラズマ処理が挙げられる。
レーザー処理とは、レーザー照射によって表面層のみを急速に加熱及び冷却して、材料の表面特性を改善する技術であり、表面の粗面化に有効な方法である。レーザー処理として、公知のレーザー処理技術を使用することができる。
エッチング処理としては、例えば、アルカリ法、リン酸-硫酸法、フッ化物法、クロム酸-硫酸法、塩鉄法などの化学的エッチング処理、及び電解エッチング法などの電気化学的エッチング処理が挙げられる。
化成処理とは、主として金属基材の表面に、表面処理部として化成皮膜を形成するものである。化成処理としては、例えば、ベーマイト処理、及びジルコニウム処理が挙げられる。金属基材がアルミニウムである場合、化成処理はベーマイト処理であることが好ましい。
フィルムと接触する金属基材の表面の上に、一層又は複数層の官能基含有層を設けることもできる。官能基含有層が有する官能基が、金属基材の表面の水酸基及びフィルムを構成する樹脂が有する官能基とそれぞれ反応して化学結合を形成することにより、金属基材の表面とフィルムとの接着性を向上させることができ、その結果、金属基材と接合対象である樹脂部材との接着性(フィルムを介した接合性)も向上させることができる。
官能基含有層は、金属基材の表面を、下記(1’)~(7’)からなる群より選ばれる少なくとも1つを用いて処理することにより、形成されたものであることが好ましい。
(1’)グリシジル基、アミノ基、(メタ)アクリロイル基及びメルカプト基からなる群より選ばれる少なくとも1つの官能基を含有するシランカップリング剤
(2’)グリシジル化合物及びチオール化合物から選ばれる少なくとも1種と、アミノ基を有するシランカップリング剤の組み合わせ
(3’)グリシジル化合物、アミノ化合物、イソシアネート化合物、(メタ)アクリロイル基及びグリシジル基を有する化合物、並びに(メタ)アクリロイル基及びアミノ基を有する化合物からなる群より選ばれる少なくとも1種と、メルカプト基を有するシランカップリング剤の組み合わせ
(4’)チオール化合物と、(メタ)アクリロイル基を有するシランカップリング剤の組み合わせ
(5’)アミノ基及び(メタ)アクリロイル基を有する化合物、アミノ化合物、及びチオール化合物からなる群より選ばれる少なくとも1種と、グリシジル基を有するシランカップリング剤の組み合わせ
(6’)イソシアネート化合物
(7’)チオール化合物
官能基含有層は、前記処理により導入された官能基を含むことが好ましく、具体的には、下記(1)~(7)からなる群より選ばれる少なくとも1つの官能基を含むことが好ましい。
(1)シランカップリング剤由来であって、グリシジル基、アミノ基、(メタ)アクリロイル基及びメルカプト基からなる群より選ばれる少なくとも1つの官能基
(2)シランカップリング剤由来のアミノ基に、グリシジル化合物及びチオール化合物から選ばれる少なくとも1種が反応して生成した官能基
(3)シランカップリング剤由来のメルカプト基に、グリシジル化合物、アミノ化合物、イソシアネート化合物、(メタ)アクリロイル基及びグリシジル基を有する化合物、並びに(メタ)アクリロイル基及びアミノ基を有する化合物からなる群より選ばれる少なくとも1種が反応して生成した官能基
(4)シランカップリング剤由来の(メタ)アクリロイル基に、チオール化合物が反応して生成した官能基
(5)シランカップリング剤由来のグリシジル基に、アミノ基及び(メタ)アクリロイル基を有する化合物、アミノ化合物、及びチオール化合物からなる群より選ばれる少なくとも1種が反応して生成した官能基
(6)イソシアネート化合物由来のイソシアナト基
(7)チオール化合物由来のメルカプト基
シランカップリング剤としては、例えば、ガラス繊維の表面処理等に用いられる公知のものを使用することができる。シランカップリング剤を加水分解させて生成したシラノール基、又はシラノール基が縮合して生成したオリゴマー化物のシラノール基が、金属基材の表面に存在する水酸基と反応して結合することにより、フィルムを構成する樹脂が有する官能基と化学結合可能なシランカップリング剤の構造に基づく官能基を、金属基材に対して付与する(導入する)ことができる。
イソシアネート化合物は、イソシアネート化合物中のイソシアナト基が、金属基材の表面に存在する水酸基と反応して結合することにより、フィルムを構成する樹脂が有する官能基と化学結合可能なイソシアネート化合物の構造に基づく官能基を、金属基材に対して付与する(導入する)ことができる。
チオール化合物は、チオール化合物中のメルカプト基が、金属基材の表面に存在する水酸基と反応して結合することにより、フィルムを構成する樹脂が有する官能基と化学結合可能なチオール化合物の構造に基づく官能基を、金属基材に対して付与する(導入する)ことができる。
金属部材の樹脂コーティング層の上に樹脂部材を接合することにより、金属部材と樹脂部材とが高い接合強度で接合された金属部材-樹脂部材接合体を製造することができる。
樹脂部材はポリオレフィンを含む。ポリオレフィンは、特に限定されるものではなく、例えば、ポリエチレン、及びポリプロピレンが挙げられる。
第2実施形態の金属部材-樹脂部材接合体の製造方法は、上記フィルムを用意すること、変性ポリオレフィン層が樹脂部材と接触するようにフィルムを金属基材と樹脂部材との間に挟むこと、金属基材と樹脂部材とをフィルムを介して接合することを含む。接合は、超音波溶着法、振動溶着法、電磁誘導法、高周波法、レーザー法、及び熱プレス法からなる群より選ばれる少なくとも1種の方法で行うことができる。第2実施形態の説明図である図3では、フィルム4を金属基材2と樹脂部材6の間に配置し(上段)、変性ポリオレフィン層が樹脂部材6と接触するようにフィルム4を金属基材2と樹脂部材6との間に挟み、金属基材2と樹脂部材6とをフィルム4を介して接合することで、金属部材-樹脂部材接合体10が製造される(下段)。第2実施形態では、金属部材の作製と金属部材-樹脂部材接合体の製造が同時に行われると考えることもできる。金属基材が表面処理部及び/又は官能基含有層を有する場合、フィルムは金属基材の表面処理部又は官能基含有層と接触するように配置される。第2実施形態によれば、金属部材-樹脂部材接合体の製造工程数を更に削減することができる。
表1に示す条件で、射出成形機(住友重機械工業株式会社製 SE100V)を使用して、引張試験の試験片に使用する樹脂部材A(幅10mm、長さ45mm、厚さ3mm)を作製した。
フラスコに無水マレイン酸変性ポリプロピレン(三菱ケミカル株式会社製Modic(登録商標)ER321P):5g、キシレン:95gを仕込み、撹拌しながら125℃に昇温して溶解した。次に、2官能エポキシ樹脂(三菱ケミカル株式会社製jER(登録商標)1001:ビスフェノールAとエピクロロヒドリンの重縮合物):1.01g、ビスフェノールA:0.24g、2,4,6-トリス(ジメチルアミノメチル)フェノール:0.006gをフラスコ中に投入し、125℃で30分間撹拌し、熱可塑性エポキシ樹脂、2官能エポキシ樹脂及び2官能フェノール化合物で変性した無水マレイン酸変性ポリプロピレン:変性PP-1のキシレン溶液を得た。
フラスコに無水マレイン酸変性ポリプロピレン(三菱ケミカル株式会社製Modic(登録商標)ER321P):5g、キシレン:95gを仕込み、撹拌しながら125℃に昇温して溶解した。次に、2官能エポキシ樹脂(三菱ケミカル株式会社製jER(登録商標)1004):0.49g、ビスフェノールA:0.06g、2,4,6-トリス(ジメチルアミノメチル)フェノール:0.003gをフラスコ中に投入し、125℃で30分間撹拌し、熱可塑性エポキシ樹脂、2官能エポキシ樹脂及び2官能フェノール化合物で変性した無水マレイン酸変性ポリプロピレン:変性PP-2のキシレン溶液を得た。
A6063アルミニウム合金からなるアルミニウム板を熱間押出により成形し、押出成形されたアルミニウム板を長さ45mm、幅18mm、厚さ1.5mmに切断し、その表面を機械切削加工により平滑にした。アルミニウム合金の組成は、Si:0.45質量%、Fe:0.21質量%、Cu:0.05質量%、Mg:0.75質量%、Cr:0.05質量%、残部がAl及び不可避不純物であった。アルミニウム板の引張強度は240MPaであり、そのヤング率は68GPaであった。
金属基材として、18mm×45mm、厚さ1.5mmの銅板に対し、アセトンで脱脂処理を行った。
金属基材として、18mm×45mm、厚さ1.5mmの鉄板に対し、#100のサンドペーパーを使用してサンディング処理を行い、鉄板の表面に微細な凹凸を形成した。このようにして、サンディング処理された表面を有する鉄基材を作製した。
金属基材として、18mm×45mm、厚さ1.5mmのマグネシウム板に対し、#100のサンドペーパーを使用してサンディング処理を行い、マグネシウム板の表面に微細な凹凸を形成した。次に、製造例4と同様の操作を行い、サンディング処理後のマグネシウム板の表面に、官能基含有層を形成した。このようにして、サンディング処理の上に2層の官能基含有層(メタクリロイル基含有層及びメルカプト基含有層)を有するマグネシウム基材を作製した。
金属基材として、18mm×45mm、厚さ1.5mmのマルテンサイト系ステンレス(SUS403)鋼板に対し、#100のサンドペーパーを使用してサンディング処理を行い、ステンレス鋼板の表面に微細な凹凸を形成した。次に、製造例3と同様の操作を行い、サンディング処理後のステンレス鋼板の表面に、官能基含有層を形成した。このようにして、サンディング処理の上にアミノ基含有層を有するSUS基材を作製した。
変性PP-1のキシレン溶液を、離型フィルム上に乾燥後の厚さが30μmになるように塗布し、空気中に常温で30分間放置することによって溶剤を揮発させ、該離型フィルム上にフィルムAを作製した。
撹拌機、還流冷却器、及び温度計を備えた1Lフラスコ中で、2官能エポキシ樹脂(三菱ケミカル株式会社製jER(登録商標)1001):100g、ビスフェノールA:24g、及びトリエチルアミン:0.4gをキシレン250gに溶解させた。得られた溶液を150℃で30分間撹拌して重付加反応を行うことにより、熱可塑性エポキシ樹脂組成物のキシレン溶液を得た。熱可塑性エポキシ樹脂組成物のキシレン溶液を、離型フィルム上に乾燥後の厚さが30μmになるように塗布し、空気中に常温で30分間放置することによって溶剤を揮発させ、該離型フィルム上に熱可塑性エポキシ樹脂層を形成した。
無水マレイン酸変性ポリプロピレン(三菱ケミカル株式会社製Modic(登録商標)ER321P):5gをキシレン:95gに溶解した溶液を、離型フィルム上に乾燥後の厚さが30μmになるように塗布し、空気中に常温で30分間放置することによって溶剤を揮発させ、該離型フィルム上にフィルムCを作製した。
温度120℃の乾燥炉中で、アルミニウム基材の官能基含有層の上に、離型フィルムを剥がしたフィルムAを圧着し、フィルムAに由来する樹脂コーティング層を有する金属部材を作製した。
作製した試験片(金属部材-樹脂部材接合体)について、常温で1日間放置後、ISO19095 1-4に準拠して、引張試験機(株式会社島津製作所製万能試験機オートグラフ「AG-IS」;ロードセル10kN、引張速度10mm/min、温度23℃、50%RH)にて、引張せん断強度試験を行い、接合強度を測定した。測定結果を表3に示す。
実施例3のアルミニウム基材を鉄基材に変更した以外は実施例3と同様の手順で作製した金属部材の樹脂コーティング層の上に、ガラス繊維入りポリプロピレン樹脂(PP樹脂)(ダイセルミライズ株式会社製PP-GF40-01 F02)を、射出成形機(住友重機械工業株式会社製SE100V;シリンダー温度200℃、ツール温度30℃、インジェクションスピード50mm/sec、ピーク/ホールディング圧力195/175[MPa/MPa])にて射出成形することにより、樹脂部材を成形しながら金属部材に樹脂部材を接合した。これにより、ISO19095に準拠した引張試験用試験片(PP樹脂、10mm×45mm×3mm、接合部長さ5mm)(金属部材-樹脂部材接合体)を作製した。その試験片について、実施例3と同じ手法で接合強度を測定した。測定結果を表3に示す。
アルミニウム基材と樹脂部材Aとの間に、フィルムAがアルミニウム基材の官能基含有層に接触するように、離型フィルムを剥がしたフィルムAを挟み、接合部が長さ5mm、幅10mmとなるように、アルミニウム基材と樹脂部材Aとを重ね合わせた状態で、精電舎電子工業株式会社製超音波溶着機SONOPET-JII430T-M(28.5KHz)を使用して超音波溶着した。これにより、ISO19095に準拠した引張試験用試験片(金属部材-樹脂部材接合体)を作製した。その試験片について、実施例3と同じ手法で接合強度を測定した。測定結果を表3に示す。
温度120℃の乾燥炉中で、銅基材の官能基含有層の上に、変性ポリオレフィン層が露出するように、離型フィルムを剥がしたフィルムBを圧着し、フィルムBに由来する樹脂コーティング層を有する金属部材を作製した。
実施例6の銅基材をSUS基材に変更した以外は実施例6と同様の手順で作製した金属部材の樹脂コーティング層の上に、炭素繊維入りポリプロピレン樹脂(PP樹脂)(ダイセルミライズ株式会社製PP-CF40-01 F008)を、射出成形機(住友重機械工業株式会社製SE100V;シリンダー温度200℃、ツール温度30℃、インジェクションスピード50mm/sec、ピーク/ホールディング圧力195/175[MPa/MPa])にて射出成形することにより、樹脂部材を成形しながら金属部材に樹脂部材を接合した。これにより、ISO19095に準拠した引張試験用試験片(PP樹脂、10mm×45mm×3mm、接合部長さ5mm)(金属部材-樹脂部材接合体)を作製した。その試験片について、実施例3と同じ手法で接合強度を測定した。測定結果を表3に示す。
マグネシウム基材と樹脂部材Aとの間に、フィルムBの変性ポリオレフィン層が樹脂部材Aに接触し、熱可塑性エポキシ樹脂層がマグネシウム基材の官能基含有層に接触するように、離型フィルムを剥がしたフィルムBを挟み、接合部が長さ5mm、幅10mmとなるように、マグネシウム基材と樹脂部材Aとを重ね合わせた状態で、精電舎電子工業株式会社製超音波溶着機SONOPET-JII430T-M(28.5KHz)を使用して超音波溶着した。これにより、ISO19095に準拠した引張試験用試験片(金属部材-樹脂部材接合体)を作製した。その試験片について、実施例3と同じ手法で接合強度を測定した。測定結果を表3に示す。
フィルムAの代わりにフィルムCを用いた以外は、実施例3と同様の手順で引張試験用試験片(金属部材-樹脂部材接合体)を作製した。その試験片について、実施例3と同じ手法で接合強度を測定した。測定結果を表3に示す。
2:金属基材
2a:表面処理部
3:官能基含有層
4:フィルム(樹脂コーティング層)
4a:変性ポリオレフィン層
4b:熱可塑性エポキシ樹脂層
4c:硬化性樹脂層
5:接着剤層
6:樹脂部材
10:金属部材-樹脂部材接合体
Claims (13)
- 無水マレイン酸変性ポリオレフィンと2官能エポキシ樹脂と2官能フェノール化合物との反応物1を含む層、無水マレイン酸変性ポリオレフィンと熱可塑性エポキシ樹脂との反応物2を含む層、及びポリオレフィンと熱可塑性エポキシ樹脂との混合物を含む層からなる群より選ばれる少なくとも1種の変性ポリオレフィン層を含むフィルムを用意すること、
前記変性ポリオレフィン層が露出するように、前記フィルムを金属基材の少なくとも一部の表面の上に配置して、前記金属基材の上に樹脂コーティング層が積層された金属部材を形成すること、
前記金属部材の前記樹脂コーティング層の上に樹脂部材を接合すること
を含む、金属部材-樹脂部材接合体を製造する方法。 - 前記接合が、超音波溶着法、振動溶着法、電磁誘導法、高周波法、レーザー法、及び熱プレス法からなる群より選ばれる少なくとも1種の方法で行われる、請求項1に記載の方法。
- 前記接合が、前記金属部材の前記樹脂コーティング層の上に、射出成形法、トランスファ成形法、プレス成形法、フィラメントワインディング成形法、又はハンドレイアップ成形法による樹脂部材の成形と同時に行われる、請求項1に記載の方法。
- 無水マレイン酸変性ポリオレフィンと2官能エポキシ樹脂と2官能フェノール化合物との反応物1を含む層、無水マレイン酸変性ポリオレフィンと熱可塑性エポキシ樹脂との反応物2を含む層、及びポリオレフィンと熱可塑性エポキシ樹脂との混合物を含む層からなる群より選ばれる少なくとも1種の変性ポリオレフィン層を含むフィルムを用意すること、
前記変性ポリオレフィン層が樹脂部材と接触するように前記フィルムを金属基材と前記樹脂部材との間に挟むこと、
前記金属基材と前記樹脂部材とを前記フィルムを介して接合すること
を含む、金属部材-樹脂部材接合体を製造する方法。 - 前記接合が、超音波溶着法、振動溶着法、電磁誘導法、高周波法、レーザー法、及び熱プレス法からなる群より選ばれる少なくとも1種の方法で行われる、請求項4に記載の方法。
- 前記反応物1が、無水マレイン酸変性ポリオレフィンを含む溶液中で、2官能エポキシ樹脂と2官能フェノール化合物を重付加反応させてなる、請求項1~5のいずれか一項に記載の方法。
- 前記反応物2が、2官能エポキシ樹脂と2官能フェノール化合物の重付加反応により生成した熱可塑性エポキシ樹脂と、無水マレイン酸変性ポリオレフィンとを反応させてなる、請求項1~5のいずれか一項に記載の方法。
- 前記混合物が、ポリプロピレンと熱可塑性エポキシ樹脂との混合物である、請求項1~5のいずれか一項に記載の方法。
- 前記フィルムが、前記変性ポリオレフィン層と、前記変性ポリオレフィン層以外の層とを含む複数層からなり、前記変性ポリオレフィン層以外の層の少なくとも1層が、熱可塑性エポキシ樹脂を含む樹脂組成物から形成された熱可塑性エポキシ樹脂層及び硬化性樹脂を含む樹脂組成物から形成された硬化性樹脂層から選ばれる少なくとも1種である、請求項1~8のいずれか一項に記載の方法。
- 前記硬化性樹脂が、ウレタン樹脂、エポキシ樹脂、ビニルエステル樹脂及び不飽和ポリエステル樹脂からなる群より選ばれる少なくとも1種である、請求項9に記載の方法。
- 前記金属基材が、前記フィルムと接する表面に積層された官能基含有層を有し、
前記官能基含有層が、下記(1)~(7)からなる群より選ばれる少なくとも1つの官能基を含む、請求項1~10のいずれか一項に記載の方法。
(1)シランカップリング剤由来であって、グリシジル基、アミノ基、(メタ)アクリロイル基及びメルカプト基からなる群より選ばれる少なくとも1つの官能基
(2)シランカップリング剤由来のアミノ基に、グリシジル化合物及びチオール化合物から選ばれる少なくとも1種が反応して生成した官能基
(3)シランカップリング剤由来のメルカプト基に、グリシジル化合物、アミノ化合物、イソシアネート化合物、(メタ)アクリロイル基及びグリシジル基を有する化合物、並びに(メタ)アクリロイル基及びアミノ基を有する化合物からなる群より選ばれる少なくとも1種が反応して生成した官能基
(4)シランカップリング剤由来の(メタ)アクリロイル基に、チオール化合物が反応して生成した官能基
(5)シランカップリング剤由来のグリシジル基に、アミノ基及び(メタ)アクリロイル基を有する化合物、アミノ化合物、及びチオール化合物からなる群より選ばれる少なくとも1種が反応して生成した官能基
(6)イソシアネート化合物由来のイソシアナト基
(7)チオール化合物由来のメルカプト基 - 前記金属基材の表面に、ブラスト処理、研磨処理、エッチング処理及び化成処理からなる群より選ばれる少なくとも1種の表面処理が施されている、請求項1~11のいずれか一項に記載の方法。
- 無水マレイン酸変性ポリオレフィンと2官能エポキシ樹脂と2官能フェノール化合物との反応物1を含む層、無水マレイン酸変性ポリオレフィンと熱可塑性エポキシ樹脂との反応物2を含む層、及びポリオレフィンと熱可塑性エポキシ樹脂との混合物を含む層からなる群より選ばれる少なくとも1種の変性ポリオレフィン層を含むフィルム。
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