WO2022095211A1 - 电路板组件及电源装置 - Google Patents

电路板组件及电源装置 Download PDF

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Publication number
WO2022095211A1
WO2022095211A1 PCT/CN2020/135443 CN2020135443W WO2022095211A1 WO 2022095211 A1 WO2022095211 A1 WO 2022095211A1 CN 2020135443 W CN2020135443 W CN 2020135443W WO 2022095211 A1 WO2022095211 A1 WO 2022095211A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
sealed
area
enclosure structure
board assembly
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Application number
PCT/CN2020/135443
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English (en)
French (fr)
Inventor
张瑞强
李日照
农贵升
林宋荣
Original Assignee
深圳市大疆创新科技有限公司
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Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Publication of WO2022095211A1 publication Critical patent/WO2022095211A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular, to a circuit board assembly and a power supply device.
  • the working environment of the battery or charger of the plant protection machine is generally outdoors, and the outdoor environment is generally humid.
  • the circuit board of the battery or charger works in a humid environment for a long time, the components on the circuit board will be corroded, resulting in abnormal circuit.
  • the present application provides a circuit board assembly and a power supply device, aiming at preventing the circuit board from being corroded in a humid environment and improving the reliability of the circuit board.
  • the application provides a circuit board assembly, including:
  • circuit board including at least one area to be sealed
  • an enclosure structure which is connected to the circuit board and cooperates with the circuit board to form a cavity, and the area to be sealed is located in the cavity;
  • a first seal arranged in the cavity, for sealing the to-be-sealed area
  • the shape of the enclosure structure is adapted to the area to be sealed; the area of the area to be sealed is smaller than the surface area of the circuit board.
  • the circuit board includes opposing first and second surfaces, the region to be sealed is formed on at least one of the first surface and the second surface; and/ or,
  • a through hole that communicates with the to-be-sealed area is formed on the enclosure structure; and/or,
  • a through hole communicating with the to-be-sealed area is formed on the enclosure structure, and the first sealing member is formed by solidifying the liquid entering the cavity from the through hole.
  • the number of the enclosure structures is multiple, the multiple enclosure structures are arranged at intervals, and each enclosure structure cooperates with the circuit board to form at least one of the cavities and/or, the number of the to-be-sealed areas is multiple, and the multiple to-be-sealed areas are distributed at intervals; and/or, the enclosure structure includes a plastic enclosure structure.
  • the enclosure structure is a plastic part; and/or the height of the enclosure structure is adapted to the area to be sealed; and/or the length of the enclosure structure and the width is adapted to the to-be-sealed area; and/or, the to-be-sealed area is provided with components.
  • the height of the enclosure structure is higher than the area to be sealed; and/or,
  • the length of the enclosure structure is greater than the length of the distribution of components in the area to be sealed, and the width of the enclosure structure is greater than the width of the distribution of components in the area to be sealed; and/or,
  • the plane projection of the enclosure structure is an irregular shape that is adapted to the plane projection of the area to be sealed.
  • the enclosure structure includes:
  • the flange is connected with the cover body, so that the cover body is connected with the circuit board through the flange.
  • the cover body includes:
  • the side wall cooperates with the bottom wall to form a receiving groove, and the flange is bent and extended from the end of the side wall away from the bottom wall away from the receiving groove.
  • At least one of the bottom wall and the side wall is formed with the through hole; and/or the distance between the bottom wall and the circuit board is greater than the distance between the bottom wall and the circuit board Maximum height of components on the area to be sealed.
  • the bottom wall and/or the side wall includes a transparent area.
  • the flange is attached and connected to the circuit board.
  • the circuit board assembly further includes:
  • the second sealing member is sealingly connected to the flange and the circuit board.
  • the second sealing member includes: a sealant layer.
  • the enclosure structure includes a first enclosure structure and a second enclosure structure
  • the to-be-sealed area includes a first to-be-sealed area and a second to-be-sealed area
  • the first enclosure The blocking structure is used for surrounding the first area to be sealed
  • the second surrounding structure is used for surrounding the second area to be sealed;
  • the number of the through holes of the first enclosure structure is greater than that of the second enclosure structure the number of said vias;
  • the number of the through holes of the first enclosure structure is greater than the number of the through holes of the second enclosure structure.
  • the present application also provides a power supply device, comprising:
  • the above-mentioned circuit board assembly is arranged in the casing.
  • the power supply device includes a battery or a charger.
  • the first sealing member can seal the to-be-sealed area of the circuit board, prevent the circuit board from being corroded in a humid environment, and improve the reliability of the circuit board.
  • FIG. 1 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application.
  • Figure 3 is an exploded schematic view of the circuit board assembly in Figure 2;
  • FIG. 4 is a schematic structural diagram of a circuit board assembly provided by an embodiment of the present application.
  • FIG. 5 is an exploded schematic diagram of a circuit board assembly provided by an embodiment of the present application.
  • FIG. 6 is a cross-sectional view of a circuit board assembly provided by an embodiment of the present application.
  • Fig. 7 is a partial enlarged schematic view of the circuit board assembly at place A in Fig. 6;
  • FIG. 8 is a schematic structural diagram of an angle of the enclosure structure provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of another angle of the enclosure structure provided by an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of a power supply device provided by an embodiment of the present application.
  • circuit board 11, area to be sealed; 111, first area to be sealed; 112, second area to be sealed; 12, first surface; 13, second surface;
  • enclosure structure 21, through hole; 22, cover body; 221, bottom wall; 222, side wall; 223, receiving groove; 23, flanging; 24, first enclosure structure; 25, second enclosure structure;
  • the inventor of the present application found that the working environment of the battery or charger of the plant protection machine is generally outdoors, and the outdoor environment is generally relatively humid.
  • the circuit board of the battery or charger works in a humid environment for a long time, the components on the circuit board will be corroded, resulting in abnormal circuit.
  • a sealant layer can be designed, which covers the entire surface of the circuit board, thereby sealing the components on the circuit board to prevent the components from being corroded in a humid environment. Ensure the normal operation of the circuit board.
  • the inventors of the present application have improved the circuit board assembly and the power supply device to prevent the circuit board from being corroded in a humid environment and improve the reliability of the circuit board.
  • an embodiment of the present application provides a circuit board assembly 100 , which includes a circuit board 10 , an enclosure structure 20 and a first sealing member 30 .
  • the circuit board 10 includes at least one area 11 to be sealed.
  • the enclosure structure 20 is connected to the circuit board 10 .
  • the enclosure structure 20 cooperates with the circuit board 10 to form a cavity 40 (please refer to FIG. 6 ).
  • the area to be sealed 11 is located in the cavity 40 .
  • the first sealing member 30 is disposed in the cavity 40 for sealing the area to be sealed 11 .
  • the shape of the enclosure structure 20 is adapted to the area to be sealed 11 .
  • the area of the area to be sealed 11 is smaller than the surface area of the circuit board 10 .
  • the enclosure structure 20 includes a plastic enclosure structure, for example, can be made of plastic material, so as to be light in weight and easy to form.
  • the enclosure structure 20 may include a blister cover.
  • the first sealing member 30 can seal the to-be-sealed area 11 of the circuit board 10 , prevent the circuit board 10 from being corroded in a humid environment, ensure the normal operation of the circuit board 10 , and improve the reliability of the circuit board 10 . sex.
  • the components of the circuit board 10 or the to-be-sealed area 11 of the circuit board 10 that needs to be sealed may only occupy a part of the area of the board surface of the circuit board 10 .
  • different to-be-sealed regions 11 are arranged at intervals on the board surface of the circuit board 10 , for example, components of different functional modules of the circuit board 10 are arranged at intervals on the board surface of the circuit board 10 .
  • the circuit board assembly 100 of the embodiment of the present application Compared with the entire surface of the circuit board 10 sealed by the sealant layer, in the circuit board assembly 100 of the embodiment of the present application, since the shape of the enclosure structure 20 is adapted to the area 11 to be sealed, the area of the area to be sealed 11 is smaller than that of the circuit board 10 . Therefore, there is no need to dispose the first sealing member 30 in the non-sealed area of the circuit board 10, so that the material cost for manufacturing the first sealing member 30 can be reduced, the weight of the first sealing member 30 can be reduced, and the circuit board can be reduced accordingly. The weight of the assembly 100 is reduced, and the material cost of the circuit board assembly 100 is reduced.
  • the area to be sealed 11 is provided with components.
  • the first sealing member 30 can seal the components in the area 11 to be sealed, prevent the components from being corroded in a humid environment, and ensure the normal operation of the circuit board 10 .
  • the circuit board 10 includes opposing first surfaces 12 and second surfaces 13 .
  • a region to be sealed 11 is formed on at least one of the first surface 12 and the second surface 13 .
  • the area to be sealed 11 is provided on one of the first surface 12 and the second surface 13 .
  • both the first surface 12 and the second surface 13 are provided with an area to be sealed 11 .
  • the enclosure structure 20 is formed with a through hole 21 that communicates with the area to be sealed 11 .
  • the number of the through holes 21 may be one, two, three or more.
  • the enclosure structure 20 is formed with a through hole 21 that communicates with the area to be sealed 11 .
  • the first sealing member 30 is formed by solidifying the liquid entering the cavity 40 from the through hole 21 . Specifically, the liquid enters the cavity 40 through the through hole 21 and solidifies to form the first sealing member 30 . When the liquid enters the cavity 40 through the through hole 21 , the liquid will flow in the area to be sealed 11 . At this time, the enclosure structure 20 can restrict the flow of the liquid, so that the shape of the first sealing member 30 is the same as that of the area to be sealed 11 . It is adapted to avoid material waste and weight increase caused by liquid flowing to non-sealed areas of the circuit board 10 .
  • the liquid entering the cavity 40 from the through hole 21 is liquid glue.
  • the first sealing member 30 is a sealant layer.
  • the number of the through holes 21 on each enclosure structure 20 is determined according to the requirement for filling liquid and the density of the components distributed in the area to be sealed 11 corresponding to the enclosure structure 20 .
  • the number of the enclosure structures 20 is multiple.
  • a plurality of enclosure structures 20 are arranged at intervals.
  • Each enclosure structure 20 cooperates with the circuit board 10 to form at least one cavity 40 .
  • each enclosure structure 20 cooperates with the circuit board 10 to form a cavity 40 .
  • each enclosure structure 20 cooperates with the circuit board 10 to form two, three or more cavities 40 .
  • the number of areas 11 to be sealed may be one, two, three or more. Referring to FIG. 3 , exemplarily, the number of the regions 11 to be sealed is multiple, and the multiple regions 11 to be sealed are distributed at intervals. In this way, the first sealing member 30 does not need to be provided in the spaced areas between different to-be-sealed areas 11 , thereby reducing the material cost for manufacturing the first sealing member 30 and reducing the weight of the first sealing member 30 .
  • a certain component on the circuit board 10 generates a relatively large amount of heat, and another component on the circuit board 10 generates a relatively small amount of heat. If the same sealant layer seals the entire surface of the circuit board 10, the heat generated by the components with relatively large heat generation may be conducted to the components with relatively small heat generation through the sealant layer, thereby disturbing the components with relatively small heat generation. component work.
  • At least two areas 11 to be sealed are formed on the same surface (eg, the first surface 12 ) of the circuit board 10 .
  • the to-be-sealed area 11 with larger heat generation does not interfere with the less-heated area to be sealed 11 .
  • first sealing member 30 in each to-be-sealed area 11 may be the same or different, as long as it can seal the corresponding to-be-sealed area 11 .
  • the enclosure structure 20 may be made of any suitable material, as long as the liquid flow in the cavity 40 can be restricted so that the shape of the first sealing member 30 is adapted to the area to be sealed 11 .
  • the enclosure structure 20 is a lightweight enclosure structure 20 .
  • the enclosure structure 20 is a plastic part.
  • the enclosure structure 20 is a plastic plastic part made of thermoplastic material.
  • the height of the enclosure structure 20 is adapted to the area to be sealed 11 .
  • the height of the enclosure structure 20 is higher than the area to be sealed 11 .
  • the height of the enclosure structure 20 is higher than the maximum height of the components in the area to be sealed 11 , so that the first sealing member 30 can be guaranteed to seal the maximum height or all areas of the components in the area to be sealed 11 . Sealing reliability of a seal 30 .
  • the planar projected area of the enclosure structure 20 is smaller than the surface area of the circuit board 10 .
  • the plane projected area of the enclosure structure 20 refers to the projected area of the enclosure structure 20 on the board surface of the circuit board 10 .
  • the length and width of the enclosure structure 20 are adapted to the area 11 to be sealed. That is, the length of the enclosure structure 20 is adapted to the area 11 to be sealed. The width of the enclosure structure 20 is adapted to the area 11 to be sealed.
  • the length of the enclosure structure 20 is greater than the length of the distribution of components in the area to be sealed 11
  • the width of the enclosure structure 20 is greater than the width of the distribution of components in the area to be sealed 11 . In this way, it can be ensured that the provided first sealing member 30 can seal each component or all regions of the area to be sealed 11 , thereby improving the sealing reliability of the first sealing member 30 .
  • the plane projection of the enclosure structure 20 is an irregular shape adapted to the plane projection of the area to be sealed 11 .
  • the plane projection of the enclosure structure 20 refers to the plane projection of the enclosure structure 20 on the board surface of the circuit board 10 .
  • the plane projection of the area to be sealed 11 refers to the plane projection of the area to be sealed 11 on the board surface of the circuit board 10 .
  • the plane projection of the enclosure structure 20 is a bending shape that is compatible with the plane projection of the area to be sealed 11 .
  • the plane projection of the enclosure structure 20 is an approximately L-shape that is compatible with the plane projection of the area to be sealed 11 .
  • the plane projection of the enclosure structure 20 is a regular shape suitable for the plane projection of the area to be sealed 11 .
  • the plane projection of the enclosure structure 20 is a square that is compatible with the plane projection of the area to be sealed 11 .
  • the enclosure structure 20 includes a cover body 22 and a flange 23 .
  • the cover 22 cooperates with the circuit board 10 to form a cavity 40 .
  • the flange 23 is connected to the cover body 22 , so that the cover body 22 is connected to the circuit board 10 through the flange 23 .
  • one end of the cover body 22 close to the circuit board 10 is connected to the flange 23 , and the flange 23 is located outside the cavity 40 .
  • the cover body 22 and the flange 23 are manufactured by integral molding. In other embodiments, the cover body 22 and the flange 23 may also be detachably connected or fixedly connected through an intermediate connecting piece.
  • the flange 23 may also be omitted, and one end of the cover body 22 close to the circuit board 10 is connected to the circuit board 10 .
  • the cover body 22 includes a bottom wall 221 and a side wall 222 .
  • the side wall 222 cooperates with the bottom wall 221 to form a receiving groove 223 .
  • the flange 23 is bent and extended away from the receiving groove 223 from one end of the side wall 222 away from the bottom wall 221 .
  • the side wall 222 and the bottom wall 221 are enclosed to form a receiving groove 223 .
  • the circuit board 10 covers the opening of the receiving groove 223 to form the cavity 40 .
  • the side wall 222 can restrict the flow of the liquid, so that the shape of the first sealing member 30 is adapted to the area to be sealed 11 , preventing the liquid from flowing to the circuit board 10 . Unsealed areas result in wasted material and increased weight.
  • the cover body 22 can be liquid-proof and dustproof for the to-be-sealed area 11 , so as to protect the to-be-sealed area 11 in the cover body 22 .
  • At least one of the bottom wall 221 and the side wall 222 is formed with a through hole 21 .
  • a through hole 21 is formed on the bottom wall 221 , and no through hole 21 is formed on the side wall 222 .
  • the bottom wall 221 is not formed with the through hole 21
  • the side wall 222 is formed with the through hole 21 .
  • through holes 21 are formed on the bottom wall 221 , and through holes 21 are also formed on the side walls 222 .
  • the distance between the bottom wall 221 and the circuit board 10 is greater than the maximum height of the components on the area 11 to be sealed. In this way, it can be ensured that the first sealing member 30 can seal the maximum height of the components in the area to be sealed 11 , thereby improving the sealing reliability of the first sealing member 30 .
  • bottom wall 221 and/or side wall 222 include transparent regions. In this way, through the transparent area, it is possible to observe whether the liquid entering the cavity 40 through the through hole 21 is evenly distributed or defective in the to-be-sealed area 11 , ensuring the sealing reliability of the first sealing member 30 and improving the quality.
  • the bottom wall 221 may also be omitted.
  • the flange 23 is attached to the circuit board 10 to achieve a sealed connection between the enclosure structure 20 and the circuit board 10 .
  • the enclosure structure 20 can also be mounted on the circuit board 10 by any suitable mounting method with good sealing performance.
  • the circuit board assembly 100 further includes a second sealing member 50 .
  • the second sealing member 50 is sealingly connected to the flange 23 and the circuit board 10 , so as to realize the sealing connection between the enclosure structure 20 and the circuit board 10 .
  • the second sealing member 50 includes: a sealant layer and the like. Specifically, the second sealing member 50 includes: a double-sided sealant layer.
  • the enclosure structure 20 includes a first enclosure structure 24 and a second enclosure structure 25 .
  • the to-be-sealed area 11 includes a first to-be-sealed area 111 and a second to-be-sealed area 112 .
  • the first enclosure structure 24 is used to enclosure the first area to be sealed 111
  • the second enclosure structure 25 is used to enclosure the second area to be sealed 112 .
  • the first enclosure structure 24 is spaced apart from the second enclosure structure 25 .
  • the first enclosure structure 24 and/or the second enclosure structure 25 are formed with reinforcements 26 for enhancing the structural strength of the first enclosure structure 24 and/or the second enclosure structure 25 .
  • the sum of the planar projected area of the first enclosure structure 24 and the planar projected area of the second enclosure structure 25 is smaller than the board surface area of the circuit board 10 .
  • the number of through holes 21 in the first enclosure structure 24 is greater than that in the second enclosure structure 25 for the number of vias 21.
  • the number of through holes 21 of the first enclosure structure 24 is greater than that of the second enclosure structure 25 . quantity.
  • an embodiment of the present application further provides a power supply device 1000 , including a housing 200 and the circuit board assembly 100 of any one of the above embodiments.
  • the circuit board assembly 100 is disposed in the casing 200 .
  • the first sealing member 30 can seal the to-be-sealed area 11 of the circuit board 10 , prevent the circuit board 10 from being corroded in a humid environment, ensure the normal operation of the circuit board 10 , and improve the reliability of the circuit board 10 . .
  • the components of the circuit board 10 or the to-be-sealed area 11 of the circuit board 10 that needs to be sealed may only occupy a part of the area of the board surface of the circuit board 10 .
  • different to-be-sealed regions 11 are arranged at intervals on the board surface of the circuit board 10 , for example, components of different functional modules of the circuit board 10 are arranged at intervals on the board surface of the circuit board 10 .
  • the circuit board assembly 100 of the embodiment of the present application Compared with the entire surface of the circuit board 10 sealed by the sealant layer, in the circuit board assembly 100 of the embodiment of the present application, since the shape of the enclosure structure 20 is adapted to the area 11 to be sealed, the area of the area to be sealed 11 is smaller than that of the circuit board 10 . Therefore, there is no need to dispose the first sealing member 30 in the non-sealed area of the circuit board 10, so that the material cost for manufacturing the first sealing member 30 can be reduced, the weight of the first sealing member 30 can be reduced, and the circuit board can be reduced accordingly. The weight of the assembly 100 is reduced, and the material cost of the circuit board assembly 100 is reduced.
  • the power supply device 1000 includes a battery or a charger or the like.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

一种电路板组件（100）及电源装置，该电路板组件（100）包括电路板（10）、围挡结构（20）和第一密封件（30），电路板（10）包括至少一个待密封区域（11）；围挡结构（20），与电路板（10）相连接，与电路板（10）配合形成腔体，待密封区域（11）位于腔体内；第一密封件（30），设于腔体中，用于密封待密封区域（11）；其中，围挡结构（20）的形状与待密封区域（11）相适应；待密封区域（11）的面积小于电路板（10）的板面面积。该电路板组件（100）及电源装置能够防止电路板（10）在潮湿环境被腐蚀，提高电路板（10）的可靠性。

Description

电路板组件及电源装置 技术领域
本申请涉及电子设备技术领域，尤其涉及一种电路板组件及电源装置。
背景技术
植保机的电池或充电器工作环境一般都在室外，室外环境一般湿度较大。当电池或充电器的电路板长期在潮湿环境下工作时，电路板上的元器件就会被腐蚀，导致电路异常。
发明内容
本申请提供了一种电路板组件及电源装置，旨在防止电路板在潮湿环境被腐蚀，提高电路板的可靠性。
本申请提供一种电路板组件，包括：
电路板，包括至少一个待密封区域；
围挡结构，与所述电路板相连接，与所述电路板配合形成腔体，所述待密封区域位于所述腔体内；
第一密封件，设于腔体中，用于密封所述待密封区域；
其中，所述围挡结构的形状与所述待密封区域相适应；所述待密封区域的面积小于所述电路板的板面面积。
在本申请的电路板组件中，所述电路板包括相对的第一表面和第二表面，所述第一表面和所述第二表面的至少一者上形成有所述待密封区域；和/或，
所述围挡结构上形成有与所述待密封区域连通的通孔；和/或，
所述围挡结构上形成有与所述待密封区域连通的通孔，所述第一密封件由从所述通孔进入所述腔体内的液体固化形成。
在本申请的电路板组件中，所述围挡结构的数量为多个，多个所述围挡结构间隔设置，每个所述围挡结构与所述电路板配合形成至少一个所述腔体；和/或，所述待密封区域的数量为多个，多个所述待密封区域间隔分布；和/或，所述围挡结构包括塑料围挡结构。
在本申请的电路板组件中，所述围挡结构为吸塑件；和/或，所述围挡结构的高度与所述待密封区域相适应；和/或，所述围挡结构的长度和宽度与所述待密封区域相适应；和/或，所述待密封区域设有元器件。
在本申请的电路板组件中，所述围挡结构的高度高于所述待密封区域；和/或，
所述围挡结构的长度大于所述待密封区域中元器件分布的长度，所述围挡结构的宽度大于所述待密封区域中元器件分布的宽度；和/或，
当所述待密封区域的平面投影为不规则形状时，所述围挡结构的平面投影为与所述待密封区域的平面投影相适应的不规则形状。
在本申请的电路板组件中，所述围挡结构包括：
罩体，与所述电路板配合形成所述腔体；
翻边，与所述罩体相连接，使所述罩体通过所述翻边与所述电路板连接。
在本申请的电路板组件中，所述罩体包括：
底壁；
侧壁，与所述底壁配合形成收容槽，所述翻边从所述侧壁远离所述底壁的一端背离所述收容槽弯折延伸。
在本申请的电路板组件中，所述底壁和所述侧壁中的至少一者形成有所述通孔；和/或，所述底壁与所述电路板之间的间距大于所述待密封区域上的元器件的最大高度。
在本申请的电路板组件中，所述底壁和/或所述侧壁包括透明区域。
在本申请的电路板组件中，所述翻边与所述电路板贴合连接。
在本申请的电路板组件中，所述电路板组件还包括：
第二密封件，密封连接于所述翻边与所述电路板。
在本申请的电路板组件中，所述第二密封件包括：密封胶层。
在本申请的电路板组件中，所述围挡结构包括第一围挡结构、第二围挡结构，所述待密封区域包括第一待密封区域、第二待密封区域，所述第一围挡结构用于围挡所述第一待密封区域，所述第二围挡结构用于围挡所述第二待密封区域；
当所述第一待密封区域分布的元器件比所述第二待密封区域分布的元器件更密集时，所述第一围挡结构的所述通孔数量多于所述第二围挡结构的所述通 孔数量；和/或，
当第一围挡结构比所述第二围挡结构的元尺寸更大时，所述第一围挡结构的所述通孔数量多于所述第二围挡结构的所述通孔数量。
本申请还提供一种电源装置，包括：
壳体；以及
上述的电路板组件，设于所述壳体内。
在本申请的电源装置中，所述电源装置包括电池或者充电器。
本申请提供的电路板组件及电源装置，第一密封件能够密封电路板的待密封区域，防止电路板在潮湿环境下被腐蚀，提高电路板的可靠性。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本申请实施例的公开内容。
附图说明
为了更清楚地说明本申请实施例技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一实施例提供的电路板组件的结构示意图；
图2是本申请一实施例提供的电路板组件的结构示意图；
图3是图2中电路板组件的分解示意图；
图4是本申请一实施例提供的电路板组件的结构示意图；
图5是本申请一实施例提供的电路板组件的分解示意图；
图6是本申请一实施例提供的电路板组件的剖视图；
图7是图6中电路板组件在A处的局部放大示意图；
图8是本申请一实施例提供的围挡结构一角度的结构示意图；
图9是本申请一实施例提供的围挡结构另一角度的结构示意图；
图10是本申请一实施例提供的电源装置的结构示意图。
附图标记说明：
1000、电源装置；
100、电路板组件；
10、电路板；11、待密封区域；111、第一待密封区域；112、第二待密封区域；12、第一表面；13、第二表面；
20、围挡结构；21、通孔；22、罩体；221、底壁；222、侧壁；223、收容槽；23、翻边；24、第一围挡结构；25、第二围挡结构；
30、第一密封件；40、腔体；50、第二密封件；
200、壳体。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
还应当理解，在本申请说明书中所使用的术语仅仅是出于描述特定实施例的目的而并不意在限制本申请。如在本申请说明书和所附权利要求书中所使用的那样，除非上下文清楚地指明其它情况，否则单数形式的“一”、“一个”及“该”意在包括复数形式。
还应当进一步理解，在本申请说明书和所附权利要求书中使用的术语“和/或”是指相关联列出的项中的一个或多个的任何组合以及所有可能组合，并且包括这些组合。
本申请的发明人发现，植保机的电池或充电器工作环境一般都在室外，室外环境一般湿度较大。当电池或充电器的电路板长期在潮湿环境下工作时，电路板上的元器件就会被腐蚀，导致电路异常。
为了保护电路板上的元器件不被腐蚀，可以设计密封胶层，该密封胶层覆盖电路板的整个板面，从而密封电路板上的元器件，以防止元器件在潮湿环境下被腐蚀，保证电路板的正常工作。
为此，本申请的发明人对电路板组件及电源装置进行了改进，以防止电路板在潮湿环境下被腐蚀，提高电路板的可靠性。
下面结合附图，对本申请的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参阅图1至图7，本申请实施例提供一种电路板组件100，包括电路板10、 围挡结构20和第一密封件30。电路板10包括至少一个待密封区域11。围挡结构20与电路板10相连接。围挡结构20与电路板10配合形成腔体40(请参阅图6)。待密封区域11位于腔体40内。第一密封件30设于腔体40中，用于密封待密封区域11。其中，围挡结构20的形状与待密封区域11相适应。待密封区域11的面积小于电路板10的板面面积。围挡结构20包括塑料围挡结构，例如，可以为塑料材质，从而重量轻、易成型。围挡结构20可以包括吸塑盖。
上述实施例的电路板组件100，第一密封件30能够密封电路板10的待密封区域11，防止电路板10在潮湿环境下被腐蚀，保证电路板10的正常工作，提高电路板10的可靠性。
可以理解地，电路板10的元器件或者电路板10所需要密封的待密封区域11可能仅仅只占电路板10的板面的其中一部分区域。或者，不同待密封区域11间隔设置在电路板10的板面上，比如电路板10的不同功能模块的元器件间隔设置在电路板10的板面上。不同待密封区域11之间具有间隔区域，若电路板10的该间隔区域也被密封胶层覆盖，则会增加电路板组件100的重量，并提高物料成本。
与密封胶层密封电路板10的整个板面相比，本申请实施例的电路板组件100，由于围挡结构20的形状与待密封区域11相适应，待密封区域11的面积小于电路板10的板面面积，因而在电路板10的非密封区域无需设置第一密封件30，从而能够减少用于制作第一密封件30的物料成本，减轻第一密封件30的重量，由此减轻电路板组件100的重量，并降低电路板组件100的物料成本。
请参阅图3、图5和图6，在一些实施例中，待密封区域11设有元器件。第一密封件30能够密封待密封区域11的元器件，防止元器件在潮湿环境下被腐蚀，保证电路板10的正常工作。
请参阅图2至图7，在一些实施例中，电路板10包括相对的第一表面12和第二表面13。第一表面12和第二表面13的至少一者上形成有待密封区域11。在一些实施方式中，第一表面12和第二表面13中的其中一者上设有待密封区域11。在另一些实施方式中，第一表面12和第二表面13均设有待密封区域11。
请参阅图2至图5，在一些实施例中，围挡结构20上形成有与待密封区域11连通的通孔21。通孔21的数量可以为一个、两个、三个或者更多。
请参阅图2至图5、图7，在一些实施例中，围挡结构20上形成有与待密 封区域11连通的通孔21。第一密封件30由从通孔21进入腔体40内的液体固化形成。具体地，液体经通孔21进入腔体40内并固化形成第一密封件30。当液体经通孔21进入腔体40内时，液体会在待密封区域11内流动，此时，围挡结构20能够限制液体的流动，使得第一密封件30的形状与待密封区域11相适应，避免液体流至电路板10的非密封区域而造成物料浪费以及重量增加。
示例性地，从通孔21进入腔体40内的液体为液体胶。第一密封件30为密封胶层。
示例性地，每个围挡结构20上的通孔21的数量根据灌液需求、与该围挡结构20对应的待密封区域11分布的元器件的密集程度进行确定。
请参阅图2和图3，在一些实施例中，围挡结构20的数量为多个。多个围挡结构20间隔设置。每个围挡结构20与电路板10配合形成至少一个腔体40。在一些实施方式中，每个围挡结构20与电路板10配合可以形成一个腔体40。在另一些实施方式中，每个围挡结构20与电路板10配合可以形成两个、三个或者更多个腔体40。
待密封区域11的数量可以为一个、两个、三个或者更多。请参阅图3，示例性地，待密封区域11的数量为多个，多个待密封区域11间隔分布。如此，不同待密封区域11之间的间隔区域无需设置第一密封件30，从而减少了用于制作第一密封件30的物料成本，并减轻第一密封件30的重量。
可以理解地，由于电路板10上的某个待密封区域11的发热量比较大，电路板10上的另一待密封区域11发热量比较小。若同一个密封胶层密封电路板10的整个板面，则发热量比较大的待密封区域11所产生的热量可能会通过密封胶层传导至发热量比较小的待密封区域11。
比如，电路板10上的某个元器件的发热量比较大，电路板10上的另一元器件发热量比较小。若同一个密封胶层密封电路板10的整个板面，则发热量比较大的元器件所产生的热量可能会通过密封胶层传导至发热量比较小的元器件，进而干扰发热量较小的元器件的工作。
为此，请参阅图2和图3，在一些实施例中，电路板10的同一表面(比如第一表面12)上形成有至少两个待密封区域11。与同一个第一密封件30密封电路板10的整个板面相比，本申请实施例的电路板组件100，发热量较大的待密封区域11不会干扰发热量较小的待密封区域11。
可以理解地，各待密封区域11内的第一密封件30的结构或材质可以相同也可以不同，只要能够密封对应待密封区域11即可。
可以理解地，待密封区域11可以设置一个、两个、三个或者更多个元器件，在此不作限制。
围挡结构20可以采用任意合适的材料制成，只要能够限制腔体40内的液体流动使得第一密封件30的形状与待密封区域11相适应即可。在一些实施例中，围挡结构20为轻质的围挡结构20。比如，围挡结构20为吸塑件。具体地，围挡结构20为采用热塑性材料制成的吸塑件。
请参阅图2至图6，在一些实施例中，围挡结构20的高度与待密封区域11相适应。在一些实施方式中，围挡结构20的高度高于待密封区域11。具体地，围挡结构20的高度高于待密封区域11的元器件的最大高度，如此，能够保证第一密封件30能够密封待密封区域11的元器件的最大高度处或者所有区域，提高第一密封件30的密封可靠性。
请参阅图2至图6，示例性地，围挡结构20的平面投影面积小于电路板10的板面面积。围挡结构20的平面投影面积是指围挡结构20在电路板10的板面投影的面积。
在一些实施例中，围挡结构20的长度和宽度与待密封区域11相适应。即围挡结构20的长度与待密封区域11相适应。围挡结构20的宽度与待密封区域11相适应。
请参阅图2至图5，在一些实施方式中，围挡结构20的长度大于待密封区域11中元器件分布的长度，围挡结构20的宽度大于待密封区域11中元器件分布的宽度。如此，能够保证所设置的第一密封件30能够密封待密封区域11的各元器件或者所有区域，提高第一密封件30的密封可靠性。
请参阅图2至图4，在一些实施例中，当待密封区域11的平面投影为不规则形状时，围挡结构20的平面投影为与待密封区域11的平面投影相适应的不规则形状。具体地，围挡结构20的平面投影是指围挡结构20在电路板10的板面上的平面投影。待密封区域11的平面投影是指待密封区域11在电路板10的板面上的平面投影。
示例性地，当待密封区域11的平面投影为弯折形时，围挡结构20的平面投影为与待密封区域11的平面投影相适应的弯折形。比如，当待密封区域11 的平面投影为近似L形时，围挡结构20的平面投影为与待密封区域11的平面投影相适应的近似L形。
可以理解地，当待密封区域11的平面投影为规则形状时，围挡结构20的平面投影为与待密封区域11的平面投影相适应的规则形状。比如，当待密封区域11的平面投影为方形时，围挡结构20的平面投影为与待密封区域11的平面投影相适应的方形。
请参阅图6、图8和图9，在一些实施例中，围挡结构20包括罩体22和翻边23。罩体22与电路板10配合形成腔体40。翻边23与罩体22相连接，使罩体22通过翻边23与电路板10连接。具体地，罩体22靠近电路板10的一端与翻边23连接，翻边23位于腔体40外部。
在一些实施方式中，罩体22与翻边23通过一体成型加工制得。在另一些实施方式中，罩体22与翻边23也可以可拆卸连接或者通过中间连接件固定连接。
在其他实施例中，翻边23也可以省略，罩体22靠近电路板10的一端之间与电路板10连接。
请参阅图6、图8和图9在一些实施例中，罩体22包括底壁221和侧壁222。侧壁222与底壁221配合形成收容槽223。翻边23从侧壁222远离底壁221的一端背离收容槽223弯折延伸。
具体地，侧壁222与底壁221围合形成收容槽223。电路板10盖合该收容槽223的开口，以形成腔体40。
可以理解地，当液体经通孔21进入腔体40内时，侧壁222能够限制液体的流动，使得第一密封件30的形状与待密封区域11相适应，避免液体流至电路板10的非密封区域而造成物料浪费以及重量增加。此外，该罩体22能够对待密封区域11进行防液和防尘，从而对罩体22内的待密封区域11进行保护。
在一些实施例中，底壁221和侧壁222中的至少一者形成有通孔21。请参阅图8和图9，在一些实施方式中，底壁221上形成有通孔21，侧壁222上未形成通孔21。在另一些实施方式中，底壁221上未形成有通孔21，侧壁222上形成有通孔21。在又一些实施方式中，底壁221上形成有通孔21，且侧壁222上也形成有通孔21。
请参阅图6，在一些实施例中，底壁221与电路板10之间的间距大于待密 封区域11上的元器件的最大高度。如此，能够保证第一密封件30能够密封待密封区域11的元器件的最大高度处，提高第一密封件30的密封可靠性。
在一些实施例中，底壁221和/或侧壁222包括透明区域。如此，可以通过透明区域观察经通孔21进入腔体40内的液体在待密封区域11是否均匀分布或者是否有残缺，保证第一密封件30的密封可靠性，有利于提升品质。
在一些实施例中，底壁221也可以省略。
请参阅图6，在一些实施例中，翻边23与电路板10贴合连接，以实现围挡结构20与电路板10的密封连接。
可以理解地，围挡结构20也可以采用任意合适的密封性能良好的贴装方式与电路板10贴装。请参阅图7，示例性地，电路板组件100还包括第二密封件50。第二密封件50密封连接于翻边23与电路板10，从而实现围挡结构20与电路板10的密封连接。
在一些实施例中，第二密封件50包括：密封胶层等。具体地，第二密封件50包括：双面密封胶层。
请参阅图2和图3，在一些实施例中，围挡结构20包括第一围挡结构24、第二围挡结构25。待密封区域11包括第一待密封区域111、第二待密封区域112。第一围挡结构24用于围挡第一待密封区域111，第二围挡结构25用于围挡第二待密封区域112。具体地，第一围挡结构24与第二围挡结构25间隔设置。第一围挡结构24和/或第二围挡结构25形成有增强件26，用于增强第一围挡结构24和/或第二围挡结构25的结构强度。
示例性地，第一围挡结构24的平面投影面积与第二围挡结构25的平面投影面积之和小于电路板10的板面面积。
在一些实施方式中，当第一待密封区域111分布的元器件比第二待密封区域112分布的元器件更密集时，第一围挡结构24的通孔21数量多于第二围挡结构25的通孔21数量。
在一些实施方式中，当第一围挡结构24比第二围挡结构25的元尺寸更大时，第一围挡结构24的通孔21数量多于第二围挡结构25的通孔21数量。
请参阅图1至图10，本申请实施例还提供一种电源装置1000，包括壳体200和上述任意一个实施例的电路板组件100。电路板组件100设于壳体200内。
上述实施例的电源装置1000，第一密封件30能够密封电路板10的待密封 区域11，防止电路板10在潮湿环境下被腐蚀，保证电路板10的正常工作，提高电路板10的可靠性。
可以理解地，电路板10的元器件或者电路板10所需要密封的待密封区域11可能仅仅只占电路板10的板面的其中一部分区域。或者，不同待密封区域11间隔设置在电路板10的板面上，比如电路板10的不同功能模块的元器件间隔设置在电路板10的板面上。不同待密封区域11之间具有间隔区域，若电路板10的该间隔区域也被密封胶层覆盖，则会增加电路板组件100的重量，并提高物料成本。
与密封胶层密封电路板10的整个板面相比，本申请实施例的电路板组件100，由于围挡结构20的形状与待密封区域11相适应，待密封区域11的面积小于电路板10的板面面积，因而在电路板10的非密封区域无需设置第一密封件30，从而能够减少用于制作第一密封件30的物料成本，减轻第一密封件30的重量，由此减轻电路板组件100的重量，并降低电路板组件100的物料成本。
在一些实施例中，电源装置1000包括电池或者充电器等。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (15)

  1. 一种电路板组件，其特征在于，包括：
    电路板，包括至少一个待密封区域；
    围挡结构，与所述电路板相连接，与所述电路板配合形成腔体，所述待密封区域位于所述腔体内；
    第一密封件，设于腔体中，用于密封所述待密封区域；
    其中，所述围挡结构的形状与所述待密封区域相适应；所述待密封区域的面积小于所述电路板的板面面积。
  2. 根据权利要求1所述的电路板组件，其特征在于，所述电路板包括相对的第一表面和第二表面，所述第一表面和所述第二表面的至少一者上形成有所述待密封区域；和/或，
    所述围挡结构上形成有与所述待密封区域连通的通孔；和/或，
    所述围挡结构上形成有与所述待密封区域连通的通孔，所述第一密封件由从所述通孔进入所述腔体内的液体固化形成。
  3. 根据权利要求1所述的电路板组件，其特征在于，
    所述围挡结构的数量为多个，多个所述围挡结构间隔设置，每个所述围挡结构与所述电路板配合形成至少一个所述腔体；和/或，
    所述待密封区域的数量为多个，多个所述待密封区域间隔分布；和/或，
    所述围挡结构包括塑料围挡结构。
  4. 根据权利要求1所述的电路板组件，其特征在于，所述围挡结构为吸塑件；和/或，所述围挡结构的高度与所述待密封区域相适应；和/或，所述围挡结构的长度和宽度与所述待密封区域相适应；和/或，所述待密封区域设有元器件。
  5. 根据权利要求4所述的电路板组件，其特征在于，所述围挡结构的高度高于所述待密封区域；和/或，
    所述围挡结构的长度大于所述待密封区域中元器件分布的长度，所述围挡结构的宽度大于所述待密封区域中元器件分布的宽度；和/或，
    当所述待密封区域的平面投影为不规则形状时，所述围挡结构的平面投影为与所述待密封区域的平面投影相适应的不规则形状。
  6. 根据权利要求2所述的电路板组件，其特征在于，所述围挡结构包括：
    罩体，与所述电路板配合形成所述腔体；
    翻边，与所述罩体相连接，使所述罩体通过所述翻边与所述电路板连接。
  7. 根据权利要求6所述的电路板组件，其特征在于，所述罩体包括：
    底壁；
    侧壁，与所述底壁配合形成收容槽，所述翻边从所述侧壁远离所述底壁的一端背离所述收容槽弯折延伸。
  8. 根据权利要求7所述的电路板组件，其特征在于，所述底壁和所述侧壁中的至少一者形成有所述通孔；和/或，所述底壁与所述电路板之间的间距大于所述待密封区域上的元器件的最大高度。
  9. 根据权利要求7所述的电路板组件，其特征在于，所述底壁和/或所述侧壁包括透明区域。
  10. 根据权利要求6所述的电路板组件，其特征在于，所述翻边与所述电路板贴合连接。
  11. 根据权利要求7所述的电路板组件，其特征在于，所述电路板组件还包括：
    第二密封件，密封连接于所述翻边与所述电路板。
  12. 根据权利要求11所述的电路板组件，其特征在于，所述第二密封件包括：密封胶层。
  13. 根据权利要求2所述的电路板组件，其特征在于，所述围挡结构包括第一围挡结构、第二围挡结构，所述待密封区域包括第一待密封区域、第二待密封区域，所述第一围挡结构用于围挡所述第一待密封区域，所述第二围挡结构用于围挡所述第二待密封区域；
    当所述第一待密封区域分布的元器件比所述第二待密封区域分布的元器件更密集时，所述第一围挡结构的所述通孔数量多于所述第二围挡结构的所述通孔数量；和/或，
    当第一围挡结构比所述第二围挡结构的元尺寸更大时，所述第一围挡结构的所述通孔数量多于所述第二围挡结构的所述通孔数量。
  14. 一种电源装置，其特征在于，包括：
    壳体；以及
    权利要求1-13任一项所述的电路板组件，设于所述壳体内。
  15. 根据权利要求14所述的电源装置，其特征在于，所述电源装置包括电池或者充电器。
PCT/CN2020/135443 2020-11-09 2020-12-10 电路板组件及电源装置 WO2022095211A1 (zh)

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CN211378414U (zh) * 2019-11-26 2020-08-28 格力博(江苏)股份有限公司 一种电路板组件以及具有该电路板组件的电池包

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US9627126B2 (en) * 2013-06-05 2017-04-18 Samsung Electronics Co., Ltd. Printed circuit board including inductor
CN106851969A (zh) * 2017-04-01 2017-06-13 奇酷互联网络科技（深圳）有限公司 印刷电路板及其加工工艺
CN207854268U (zh) * 2018-01-19 2018-09-11 广东欧珀移动通信有限公司 电路板组件、显示屏组件及电子设备
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