WO2022085389A1 - 感光性樹脂組成物及びカラーフィルター - Google Patents
感光性樹脂組成物及びカラーフィルター Download PDFInfo
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- WO2022085389A1 WO2022085389A1 PCT/JP2021/036120 JP2021036120W WO2022085389A1 WO 2022085389 A1 WO2022085389 A1 WO 2022085389A1 JP 2021036120 W JP2021036120 W JP 2021036120W WO 2022085389 A1 WO2022085389 A1 WO 2022085389A1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
Definitions
- the present invention relates to a photosensitive resin composition, a resin cured film, a color filter, and an image display element.
- Patent Document 1 discloses a composition for forming a cured film containing a polymerizable compound that polymerizes by reaction with thiol and a radiation-sensitive thiol generator having two or more sulfur-containing groups in one molecule. Has been done. Patent Document 1 describes that a cured film can be formed through steps such as coating, exposure, development, and post-baking of the cured film-forming composition on a substrate.
- Patent Document 2 describes (component A) a structural unit (a1) having a residue in which a carboxyl group and / or a phenolic hydroxyl group is protected by a thermally decomposable group, and a structural unit having an epoxy group and / or an oxetanyl group.
- A2 and a colored photosensitive resin composition containing a copolymer containing at least a structural unit (a3) having a carboxyl group and / or a phenolic hydroxyl group are disclosed.
- Patent Document 1 describes that the cured film-forming composition can form a cured film having high hardness and excellent solvent resistance while improving storage stability and radiation sensitivity. And the hardness was insufficient, and further improvement was required.
- the color filter substrate is provided with an alignment film such as a polyimide film in order to orient the liquid crystal display.
- an alignment film such as a polyimide film
- the color filter layer is required to have solvent resistance (NMP resistance).
- NMP resistance N-methylpyrrolidone
- the colored photosensitive resin composition of Patent Document 2 has insufficient solvent resistance, and further improvement has been required.
- a copolymer containing an epoxy group or an oxetanyl group as described in Patent Document 2 is used, the storage stability is deteriorated, so that there is a problem that it is difficult to put it into practical use in consideration of productivity.
- the present invention has been made to solve the above-mentioned problems, and is a copolymer having good developability, a cured resin film having excellent hardness and solvent resistance, and excellent storage stability. It is an object of the present invention to provide a photosensitive resin composition containing the above. Another object of the present invention is to provide a resin cured film having excellent hardness and solvent resistance, a color filter, and an image display element provided with the same.
- a photosensitive resin composition containing (A) a copolymer, (B) a reactive diluent, (C) a photopolymerization initiator, and (D) a solvent.
- the copolymer (A) contains a structural unit (a-1) represented by the following formula (1) and a structural unit (a-2) derived from a polymerizable unsaturated compound and having an acid group.
- the content of the structural unit (a-1) in all the structural units of the (A) copolymer is more than 50 mol%.
- the photosensitive resin composition, wherein the solvent (D) contains at least one selected from a primary alcohol having 3 to 10 carbon atoms and a secondary alcohol having 3 to 10 carbon atoms.
- R 1 represents a hydrogen atom or a methyl group
- R 2 to R 4 are independent hydrogen atoms, an alkyl group having 1 to 6 carbon atoms, or an alkoxy having 1 to 6 carbon atoms.
- n is an integer of 1 to 10.
- at least one of R 2 to R 4 is an alkoxy group having 1 to 6 carbon atoms
- at least one of R 2 to R 4 is. It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
- the acid group of the structural unit (a-2) in the (A) copolymer is a carboxy group, and the acid value of the (A) copolymer is 15 to 300 KOHmg / g [1]. ] Or the photosensitive resin composition according to [2].
- the total content of the primary alcohol having 3 to 10 carbon atoms and the secondary alcohol having 3 to 10 carbon atoms in the (D) solvent is 20 to 100% by mass [1].
- the photosensitive resin composition according to any one of [4].
- the weight average molecular weight of the (A) copolymer is 1000 to 50,000, and the molecular weight distribution (Mw / Mn) of the (A) copolymer is 1.3 to 3.0 [1]. ] To [5].
- the photosensitive resin composition according to any one of.
- the content of the (A) copolymer is 5 to 85 parts by mass
- the content of the (B) reactive diluent is The photosensitive resin composition according to any one of [1] to [7], wherein the content is 5 to 85 parts by mass and the content of the (C) photopolymerization initiator is 0.1 to 30 parts by mass. ..
- a resin cured film made of a cured product of the photosensitive resin composition according to any one of [1] to [8].
- a photosensitive resin composition containing a copolymer which is excellent in developability can form a cured resin film having excellent hardness and solvent resistance, and is excellent in storage stability. Further, according to the present invention, it is possible to provide a resin cured film having excellent hardness and solvent resistance, a color filter, and an image display element provided with the same.
- (meth) acrylic acid means at least one selected from methacrylic acid and acrylic acid
- (meth) acrylate means at least one selected from methacrylate and acrylate
- (meth) acryloyl means at least one selected from methacrylic acid and acryloyl.
- the photosensitive resin composition of the present embodiment contains (A) a copolymer, (B) a reactive diluent, (C) a photopolymerization initiator, and (D) a solvent.
- the photosensitive resin composition of the present embodiment further contains (E) a colorant, if necessary.
- the photosensitive resin composition of the present embodiment is polymerized and cured by being irradiated with light to form a resin cured film.
- the (A) copolymer of the present embodiment has a structural unit (a-1) represented by the following formula (1) (hereinafter, also simply referred to as “constituent unit (a-1)”) and is not polymerizable. It is derived from a saturated compound and has a structural unit (a-2) having an acid group (hereinafter, also simply referred to as “constituent unit (a-2)”).
- the copolymer has a structural unit (a-3) derived from another polymerizable unsaturated compound (hereinafter, also simply referred to as “constituent unit (a-3)”), if necessary. You may.
- R 1 represents a hydrogen atom or a methyl group
- R 2 to R 4 are independent hydrogen atoms, an alkyl group having 1 to 6 carbon atoms, or an alkoxy having 1 to 6 carbon atoms.
- n is an integer of 1 to 10.
- at least one of R 2 to R 4 is an alkoxy group having 1 to 6 carbon atoms
- at least one of R 2 to R 4 is. It is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.
- R 1 represents a hydrogen atom or a methyl group, and is preferably a methyl group.
- the alkyl group having 1 to 6 carbon atoms represented by R 2 to R 4 is preferably an alkyl group having 1 to 4 carbon atoms, and an alkyl group having 1 to 2 carbon atoms. Is more preferable.
- the alkoxy group having 1 to 6 carbon atoms represented by R 2 to R 4 is preferably an alkoxy group having 1 to 4 carbon atoms, and more preferably an alkoxy group having 1 to 2 carbon atoms. ..
- R 2 to R 4 are independently an alkyl group having 1 to 6 carbon atoms or an alkoxy group having 1 to 6 carbon atoms, and two of R 2 to R 4 have 1 to 6 carbon atoms. It is more preferable that one of R 2 to R 4 is an alkyl group having 1 to 6 carbon atoms, and two of R 2 to R 4 are alkoxy groups having 1 to 2 carbon atoms. That is, it is a methoxy group or an ethoxy group, and it is most preferable that one of R 2 to R 4 is an alkyl group having 1 to 2 carbon atoms, that is, a methyl group or an ethyl group.
- n is an integer of 1 to 10, preferably 1 to 4, and more preferably 3.
- the structural unit (a-1) represented by the equation (1) for example, 3- (Meta) Acryloyloxypropylmethyldimethoxysilane-derived structural unit (in formula (1), R 1 is a hydrogen atom or a methyl group, R 2 is a methyl group, and R 3 and R 4 are methoxy groups. Yes, n is 3), 3- (Meta) Acryloyloxypropylethyldimethoxysilane-derived structural unit (in formula (1), R 1 is a hydrogen atom or a methyl group, R 2 is an ethyl group, and R 3 and R 4 are methoxy groups.
- n 3
- 3- (Meta) Acryloyloxypropylmethyldiethoxysilane-derived structural unit in formula (1), R 1 is a hydrogen atom or a methyl group, R 2 is a methyl group, and R 3 and R 4 are ethoxy groups. And n is 3), 3- (Meta) Acryloyloxypropylethyldiethoxysilane-derived structural unit (in formula (1), R 1 is a hydrogen atom or a methyl group, R 2 is an ethyl group, and R 3 and R 4 are ethoxy groups. And n is 3) And so on.
- the constituent unit (a-1) is derived from 3- (meth) acryloyloxypropylmethyldimethoxysilane from the viewpoint of easy availability of materials and (A) reactivity when synthesizing a copolymer. And 3- (meth) acryloyloxypropylmethyldiethoxysilane-derived constituent units are preferred.
- the content of the structural unit (a-1) in all the structural units of the copolymer is more than 50 mol%, preferably more than 50 mol% to 90 mol%, and more than 50 mol% to 80. More preferably, it is mol%.
- the content of the structural unit (a-1) is 50 mol% or less, the developability of the photosensitive resin composition is insufficient, and the hardness and solvent resistance of the cured resin film are insufficient.
- the structural unit (a-2) derived from the polymerizable unsaturated compound contained in the (A) copolymer of the present embodiment and having an acid group is to copolymerize the polymerizable unsaturated compound having an acid group.
- the polymerizable unsaturated compound having an acid group is not particularly limited as long as it is a compound having an acid group and an ethylenically unsaturated group and does not contain silicon.
- a carboxy group is more preferable from the viewpoint of developability as a photosensitive resin composition.
- the structural unit (a-2) include (meth) acrylic acid, crotonic acid, cinnamic acid, vinyl sulfonic acid, 2- (meth) acryloyloxyethyl succinic acid, 2-acryloyloxyethyl phthalic acid, and the like.
- examples thereof include constituent units derived from 2- (meth) acryloyloxyethyl hexahydrophthalic acid, 2- (meth) acryloyloxyethyl acid phosphate and the like.
- the structural unit derived from (meth) acrylic acid is preferable as the structural unit (a-2) from the viewpoint of easy availability and (A) reactivity when synthesizing the copolymer.
- the content of the structural unit (a-2) in all the structural units of the copolymer is preferably 5 mol% or more and less than 50 mol%, more preferably 10 mol% to 45 mol%, and 20 mol% to 40. Mol% is most preferred.
- the content of the structural unit (a-2) is 5 mol% or more, good developability can be obtained when the photosensitive resin composition is applied to a substrate, exposed to light, and developed.
- the content of the structural unit (a-2) is less than 50 mol%, the content of the structural unit (a-1) is sufficiently large, and good hardness can be obtained as a resin cured film.
- the (A) copolymer of the present embodiment has a structural unit (a-3) derived from another polymerizable insatiable compound in addition to the structural unit (a-1) and the structural unit (a-2). You may.
- Other polymerizable unsaturated compounds are polymerizable unsaturated compounds having no acid group or silyl group. Examples of other polymerizable insatiable compounds include dienes such as butadiene, (meth) acrylic acid esters, (meth) acrylic acid amides, styrenes, unsaturated dicarboxylic acid diesters, and unsaturated polybasic acid anhydrides. , Other vinyl compounds.
- (meth) acrylic acid esters include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylic rate, and sec-.
- (meth) acrylic acid amides include (meth) acrylic acid amide, (meth) acrylic acid N, N-dimethylamide, (meth) acrylic acid N, N-diethylamide, (meth) acrylic acid N, N-dipropylamide, (meth) acrylic acid N, N-di-isopropylamide, (meth) acrylic acid anthracenylamide, N-isopropyl (meth) acrylamide, (meth) acrylic morpholine, diacetone (meth) Examples include acrylamide.
- styrenes include styrene, ⁇ -, o-, m-, p-alkyl, nitro, cyano, and amide derivatives of styrene.
- unsaturated dicarboxylic acid diester examples include diethyl citraconic acid, diethyl maleate, diethyl fumaric acid, diethyl itaconic acid and the like.
- unsaturated polybasic acid anhydride examples include maleic anhydride, itaconic anhydride, citraconic anhydride and the like.
- vinyl compounds include norbornene (bicyclo [2.2.1] hept-2-ene), 5-methylbicyclo [2.2.1] hept-2-ene, and 5-ethylbicyclo [ 2.2.1] Hept-2-ene, tetracyclo [4.4.0.12,5.17,10] dodeca-3-ene, 8-methyltetracyclo [4.4.0.12, 5.
- These polymerizable insatiable compounds may be used alone or in combination of two or more.
- polymerizable insatiable compounds include methyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, benzyl (meth) acrylate, and 2-hydroxyethyl.
- (meth) acrylates More preferred are (meth) acrylates, glycidyl (meth) acrylates, (3-ethyloxetane-3-yl) methyl (meth) acrylates, (meth) acrylic acid esters with blocked isocyanato groups, styrene and vinyltoluene.
- oxidases such as ⁇ -caprolactam, ⁇ -valerolactam, ⁇ -butyrolactam, ⁇ -propiolactam; methanol, ethanol, propanol, butanol, ethylene glycol, methylcellosolve, butylcellosolve, methylcarbi.
- Alcohols such as toll, benzyl alcohol, phenylcellosolve, flufuryl alcohol, cyclohexanol; butylphenol such as phenol, cresol, xylenol, ethylphenol, o-isopropylphenol, p-tert-butylphenol, p-tert-octylphenol, nonylphenol, Phenols such as dinonylphenol, styrenated phenol, oxybenzoic acid ester, timol, p-naphthol, p-nitrophenol, p-chlorophenol; dimethyl malonate, diethyl malonate, methyl acetoacetate, ethyl acetoacetate, acetylacetone, etc.
- butylphenol such as phenol, cresol, xylenol, ethylphenol, o-isopropylphenol, p-tert-butylphenol
- Active oxime system mercaptan system such as butyl mercaptan, thiophenol, tert-dodecyl mercaptan; amine system such as diphenylamine, phenylnaphthylamine, aniline, carbazole; acid amide system such as acetoanilide, acetoaniside, acetic acid amide, benzamide; succinic acid imide , Oxime-based such as maleic acidimide; imidazole-based such as imidazole, 2-methylimidazole, 2-ethylimidazole; urea-based such as urea, thiourea and ethyleneurea; phenyl N-phenylcarbamate, 2-oxazolidone and the like.
- mercaptan system such as butyl mercaptan, thiophenol, tert-dodecyl mercaptan
- amine system such as diphenylamine, pheny
- Carbamidate-based such as ethyleneimine and polyethyleneimine
- Oxime-based such as formaldehyde, acetaldoxime, acetoxime, methylethylketooxime, methylisobutylketooxime, cyclohexanoneoxime
- Examples include oxime sulfates.
- the content of the structural unit (a-3) in all the structural units of the (A) copolymer is 0.1 mol%. It is preferably from 40 mol%, more preferably from 1 mol% to 30 mol%, and most preferably from 5 mol% to 20 mol%.
- the content of the structural unit (a-3) is 0.1 mol% or more, the function derived from the structural unit (a-3) can be sufficiently imparted to the photosensitive resin composition.
- the content of the structural unit (a-3) is 40 mol% or less, the contents of the structural unit (a-1) and the structural unit (a-2) are sufficiently large, so that the photosensitive resin composition can be used as a photosensitive resin composition.
- a resin cured film having good developability and excellent hardness and adhesion can be obtained.
- the weight average molecular weight (Mw) of the (A) copolymer of the present embodiment is preferably 1000 to 50,000, more preferably 2000 to 30,000, and most preferably 3000 to 10000 in terms of polystyrene. preferable.
- Mw weight average molecular weight
- the weight average molecular weight (Mw) of the copolymer is 1000 or more, problems such as chipping of the cured resin film after development are less likely to occur.
- the weight average molecular weight of the copolymer is 50,000 or less, the developing time as the photosensitive resin composition is sufficiently short, and the practicality is excellent.
- the value of the weight average molecular weight (Mw) of the (A) copolymer of the present embodiment is measured by gel permeation chromatography (GPC) under the following conditions and calculated in terms of polystyrene.
- GPC gel permeation chromatography
- the molecular weight distribution (Mw / Mn) of the (A) copolymer of the present embodiment is preferably 1.3 to 3.0, more preferably 1.5 to 2.8, and 1.5. It is most preferably about 2.6.
- the target numerical range such as the weight average molecular weight and the acid value is optimized, and (A) the reaction when producing the copolymer. Conditions and the like can be set with a certain width, which is efficient.
- the molecular weight distribution (Mw / Mn) of the copolymer is 3.0 or less, the performance of the photosensitive resin composition such as developability does not vary.
- the molecular weight distribution is measured from the above GPC measurement chromatogram. Mn indicates a number average molecular weight.
- the acid value of the (A) copolymer of the present embodiment is not particularly limited, but is preferably 15 KOH mg / g to 300 KOH mg / g, more preferably 20 KOH mg / g to 200 KOH mg / g, and most preferably 25 KOH mg / g. It is g to 150 KOH mg / g.
- the acid value of the (A) copolymer is 15 KOHmg / g or more, better developability can be obtained.
- (A) When the acid value of the copolymer is 300 KOHmg / g or less, good developability can be obtained without dissolving the exposed portion (photocured portion) in the alkaline developer.
- the acid value of the (A) copolymer is a value measured using a mixed indicator of bromothymol blue and phenol red according to JIS K6901 5.3, and is contained in 1 g of the (A) copolymer. It means the number of mg of potassium hydroxide required to neutralize the contained acidic component.
- the silyl group equivalent of the (A) copolymer of the present embodiment is not particularly limited, but is preferably 250 g / mol to 4000 g / mol, more preferably 300 g / mol to 2000 g / mol, and most preferably 300 g. It is / mol to 1000 g / mol.
- the silyl group equivalent of the (A) copolymer is 250 g / mol or more, it is effective in further increasing the hardness and developability.
- the silyl group equivalent of the (A) copolymer is 4000 g / mol or less, sufficient hardness can be secured as a resin cured film.
- the silyl group equivalent of the (A) copolymer is a value obtained by dividing the molecular weight of the (A) copolymer by the average number of silyl groups per molecule, and (A) when synthesizing the copolymer. It is a calculated value calculated based on the amount of the polymerizable unsaturated compound used as the raw material of the structural unit (a-1) to be charged. Silyl groups are simply counted as silyl groups, even if they contain different types of silyl groups.
- the content of the (A) copolymer in the photosensitive resin composition of the present embodiment is preferably 5 parts by mass to 85 parts by mass when the total of the components excluding the (D) solvent is 100 parts by mass. , More preferably 15 parts by mass to 75 parts by mass, and most preferably 20 parts by mass to 65 parts by mass. When the content of the (A) copolymer is within the above range, the photocurability of the photosensitive resin composition becomes more appropriate.
- the (A) copolymer of the present embodiment is (A-1) a compound represented by the following formula (2) in the presence of (D-1) solvent (hereinafter, simply “(A-1) compound”. (Also also referred to as), (A-2) a polymerizable unsaturated compound having an acid group (hereinafter, also simply referred to as “(A-2) compound”), and (A-3) and others used as necessary. It can be prepared by copolymerizing a monomer mixture composed of a polymerizable insatiable compound (hereinafter, also simply referred to as “(A-3) compound”) according to a radical polymerization method known in the art.
- R 1 to R 4 and n in the formula (2) are synonymous with R 1 to R 4 and n in the formula (1).
- the (A-1) compound, the (A-2) compound and the (A-3) compound used as needed are dissolved in the (D-1) solvent to prepare a solution, and then the solution is prepared.
- a polymerization initiator may be added to the solution and reacted at 50 ° C to 130 ° C for 1 to 20 hours.
- the number of repetitions of the structural units derived from each compound and the order in which the structural units derived from each compound are bonded are not particularly limited.
- the insufficient constituent units are subjected to a modification reaction in the copolymer.
- a copolymer containing a structural unit (a-1), a structural unit (a-2) and a structural unit (a-3) may be prepared.
- the (A-1) compound and the (A-2) compound for the same reason as defining the content ratios of the structural units (a-1) to (a-3) constituting the (A) copolymer described above.
- the compounding amount of the compound can be specified. That is, when the total of the compounds (A-1) and (A-2) is 100 mol%, the blending amount of the compound (A-1) is more than 50 mol%, and more than 50 mol% to 90 mol. %, Most preferably more than 50 mol% to 80 mol%.
- the blending amount of the compound (A-2) is preferably 5 mol% or more and less than 50 mol% when the total of the compounds (A-1) and (A-2) is 100 mol%, and is 10 mol. It is more preferably% to 45 mol%, and most preferably 20 mol% to 40 mol%.
- the blending amount may be 0.1 mol% to 40 mol% when the total of the compounds (A-1) to (A-3) is 100 mol%. It is preferably 1 mol% to 30 mol%, more preferably 5 mol% to 20 mol%, and most preferably 5 mol% to 20 mol%.
- the solvent (D-1) used for preparing the (A) copolymer is not particularly limited as long as it is a solvent that is inert to the polymerization reaction. It is preferable to use a solvent similar to the solvent (D) described later used for the photosensitive resin composition because it is not necessary to separate and remove the solvent for the polymerization reaction. Further, from the viewpoint of (A) controlling the weight average molecular weight (Mw) and molecular weight distribution (Mw / Mn) of the copolymer within a predetermined range and obtaining a photosensitive resin composition having desired storage stability, carbon is used. It is preferable to use a (D-1) solvent containing at least one selected from a primary alcohol having 3 to 10 atomic atoms and a secondary alcohol having 3 to 10 carbon atoms.
- the solvent contains at least one selected from a primary alcohol having 3 to 10 carbon atoms and a secondary alcohol having 3 to 10 carbon atoms, the first alcohol having 3 to 10 carbon atoms.
- the total content of the secondary alcohol and the secondary alcohol having 3 to 10 carbon atoms is preferably 20% by mass to 100% by mass, and 50% by mass to 100% by mass with respect to the (D-1) solvent. % Is more preferable.
- (A) the weight average molecular weight (Mw) of the copolymer and The molecular weight distribution (Mw / Mn) can be easily controlled within a predetermined range, and if the (D-1) solvent is used as it is as the (D) solvent of the photosensitive resin composition, the storage stability of the photosensitive resin composition is further improved. Can be improved.
- the amount of the (D-1) solvent used for preparing the (A) copolymer is not particularly limited, but is used for the (A-1) compound, the (A-2) compound and, if necessary, (A-3).
- the total amount of the compounds charged is 100 parts by mass, it is preferably 30 parts by mass to 1000 parts by mass, and more preferably 50 parts by mass to 800 parts by mass.
- the amount used is 30 parts by mass or more, the polymerization reaction can be stably carried out, and (A) coloring and gelation of the copolymer can be prevented.
- the amount used is 1000 parts by mass or less, the decrease in the molecular weight of the (A) copolymer due to the chain transfer action can be suppressed, and the viscosity of the reaction solution can be controlled within an appropriate range.
- the polymerization initiator that can be used in this copolymerization reaction is not particularly limited, and is, for example, 2,2'-azobis (isobutyronitrile) and 2,2'-azobis (2,4-dimethylvaleronitrile). ), 2,2'-azobis (isobutyric acid) dimethyl, benzoyl peroxide, t-butylperoxy-2-ethylhexanoate and the like. These polymerization initiators may be used alone or in combination of two or more.
- the amount of the polymerization initiator used is not particularly limited, but the total amount of the compound (A-1), the compound (A-2) and the compound (A-3) used as needed is 100 parts by mass. Occasionally, it is preferably 0.1 part by mass to 20 parts by mass, and more preferably 0.5 part by mass to 16 parts by mass.
- the reaction diluent (B) of the present embodiment is not particularly limited as long as it is a low molecular weight compound having an ethylenically unsaturated group such as a vinyl group, an allyl group, and a (meth) acryloyloxy group.
- Specific examples of the (B) reactive diluent include aromatic vinyl-based monomers; polycarboxylic acid monomers such as vinyl acetate and vinyl adipic acid; (meth) acrylates; polyfunctional (meth) acrylates; triari. Lucianulate and the like can be mentioned.
- aromatic vinyl-based monomers include styrene, ⁇ -methylstyrene, ⁇ -chloromethylstyrene, vinyltoluene, divinylbenzene, diallylphthalate, diallylbenzenephosphonate and the like.
- (meth) acrylates include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, ⁇ -hydroxyethyl (meth) acrylate, and hydroxypropyl (meth) acrylate. And so on.
- polyfunctional (meth) acrylates include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, ethylene glycol di (meth) acrylate, and trimethyl propandi (meth).
- Acrylate trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tris (hydroxyethyl) isocyanurate tri (meth) acrylate and the like.
- polyfunctional (meth) acrylates are particularly preferable.
- the content of the (B) reactive diluent in the photosensitive resin composition of the present embodiment is preferably 5 parts by mass to 85 parts by mass when the total of the components excluding the solvent (D) is 100 parts by mass. It is more preferably 15 parts by mass to 75 parts by mass, and most preferably 20 parts by mass to 65 parts by mass. (B) When the content of the reactive diluent is within the above range, the viscosity and photocurability of the photosensitive resin composition become more appropriate.
- the (C) photopolymerization initiator of the present embodiment is not particularly limited as long as it is a compound that generates a radical by irradiation with light, but for example, benzoin such as benzoin, benzoin methyl ether, benzoin ethyl ether and the like and alkyl ethers thereof; Acetophenones such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 4- (1-t-butyldioxy-1-methylethyl) acetophenone; 1-hydroxycyclohexylphenylketone, 2-hydroxy Alkylphenones such as -2-methyl-1-phenylpropane-1-one; anthraquinones such as 2-methylanthraquinone, 2-amylanthraquinone, 2-t-butylanthraquinone, 1-chloroanthraquino
- the content of the (C) photopolymerization initiator in the photosensitive resin composition of the present embodiment is preferably 0.1 part by mass to 30 parts by mass when the total of the components excluding the (D) solvent is 100 parts by mass. Parts, more preferably 0.5 parts by mass to 20 parts by mass, and most preferably 1 part by mass to 15 parts by mass.
- the content of the photopolymerization initiator is 0.1 part by mass or more, the photosensitive resin composition has sufficient photocurability.
- the content of the photopolymerization initiator is 30 parts by mass or less, the storage stability of the photosensitive resin composition and the performance of the cured resin film are not adversely affected.
- the solvent (D) of the present embodiment contains at least one selected from a primary alcohol having 3 to 10 carbon atoms and a secondary alcohol having 3 to 10 carbon atoms, and each of the photosensitive resin compositions.
- the solvent is not particularly limited as long as it is inactive with respect to the components and can dissolve each component.
- the solvent (D-1) used for preparing the copolymer the same solvent as the solvent (D) is used, and as the solvent (D) of the photosensitive resin composition as it is without separating and removing this solvent. It may be used, or a solvent may be newly added when mixing each component of the photosensitive resin composition. It may be a solvent that coexists with each component of the photosensitive resin composition when it is mixed.
- the solvent (D) preferably contains a primary alcohol having 3 to 10 carbon atoms.
- primary alcohols having 3 to 10 carbon atoms and secondary alcohol solvents having 3 to 10 carbon atoms include monoalcohols, (poly) alkylene glycol monoalkyl ethers and the like.
- monoalcohols include primary alcohols such as propyl alcohol, butyl alcohol, pentyl alcohol, hexyl alcohol, octyl alcohol, nonyl alcohol, decyl alcohol and dodecyl alcohol; and secondary alcohols such as benzyl alcohol. ..
- (poly) alkylene glycol monoalkyl ethers include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-propyl ether, and diethylene glycol mono-n-butyl ether.
- Triethylene glycol monomethyl ether Triethylene glycol monoethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol Examples thereof include primary alcohols such as mono-n-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether and 3-methoxy-1-butanol.
- (poly) alkylene glycol monoalkyl ethers are preferable as the (D) solvent from the viewpoint of easy availability and storage stability as a photosensitive resin composition.
- the solvent (D) of the present embodiment may contain other solvents in addition to the above-mentioned solvent.
- other solvents include tertiary alcohols such as tert-butyl alcohol and diacetone alcohol; ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, and propylene glycol monoethyl ether acetate.
- a (poly) alkylene glycol monoalkyl ether acetate-based solvent such as propylene glycol monomethyl ether acetate is preferable.
- the total content of the primary alcohol having 3 to 10 carbon atoms and the secondary alcohol having 3 to 10 carbon atoms in the solvent is preferably 20% by mass to 100% by mass, preferably 50. More preferably, it is from% by mass to 100% by mass.
- the content of the other solvent is preferably 0% by mass to 80% by mass, more preferably 0% by mass to 50% by mass.
- the content of the solvent (D) in the photosensitive resin composition of the present embodiment is preferably 30 parts by mass to 1000 parts by mass, and more preferably, when the total of the components excluding the solvent (D) is 100 parts by mass. It is preferably 50 parts by mass to 800 parts by mass, and most preferably 100 parts by mass to 700 parts by mass. (D) When the content of the solvent is within the above range, the viscosity of the photosensitive resin composition can be adjusted to an appropriate range.
- the photosensitive resin composition of the present embodiment may further contain (E) a colorant, if necessary.
- a colorant a known dye or pigment can be used.
- E When a dye is used as the colorant, a coloring pattern having higher brightness can be obtained as compared with the case where a pigment is used, and good alkali developability is exhibited.
- the dyes include (D) acid dyes having acidic groups such as carboxyl groups and acidic dyes from the viewpoints of solubility in solvents and alkaline developing solutions, interaction with other components in the photosensitive resin composition, heat resistance, and the like. It is preferable to use a salt of the dye with a nitrogen compound, a sulfonamide of an acid dye, or the like.
- dyes examples include acid alizarin violet N; acid black1, 2, 24, 48; acid blue1, 7, 9, 25, 29, 40, 45, 62, 70, 74, 80, 83, 90, 92, 112, 113, 120, 129, 147; acid chrome violet K; acid Fuchsin; acid green 1, 3, 5, 25, 27, 50; acid orange 6, 7, 8, 10, 12, 50, 51, 52, 56, 63, 74, 95; acid red1, 4, 8, 14, 17, 18, 26, 27, 29, 31, 34, 35, 37, 42, 44, 50, 51, 52, 57, 69, 73.
- azo-based, xanthene-based, anthraquinone-based or phthalocyanine-based acid dyes are preferable. These dyes may be used alone or in combination of two or more, depending on the color of the target pixel.
- pigment for example, C.I. I. Pigment Yellow 1, 3, 12, 13, 14, 15, 16, 17, 20, 24, 31, 53, 83, 86, 93, 94, 109, 110, 117, 125, 128, 137, 138, 139, Yellow pigments such as 147, 148, 150, 153, 154, 166, 173, 194, 214; C.I. I. Pigment Orange 13, 31, 36, 38, 40, 42, 43, 51, 55, 59, 61, 64, 65, 71, 73 and the like; C.I. I.
- the content of the (E) colorant in the photosensitive resin composition of the present embodiment is preferably 5 parts by mass to 75 parts by mass when the total of the components excluding the (D) solvent is 100 parts by mass. It is more preferably 5 parts by mass to 65 parts by mass, and most preferably 10 parts by mass to 55 parts by mass.
- a known dispersant may be added to the photosensitive resin composition from the viewpoint of improving the dispersibility of the pigment.
- the dispersant it is preferable to use a polymer dispersant having excellent dispersion stability over time.
- the polymer dispersant include urethane dispersants, polyethyleneimine dispersants, polyoxyethylene alkyl ether dispersants, polyoxyethylene glycol diester dispersants, sorbitan aliphatic ester dispersants, and aliphatic modified esters. Examples include system dispersants.
- polymer dispersants examples include trade names such as EFKA (manufactured by EFKA), Disperbyk (manufactured by Big Chemie), Disparon (manufactured by Kusumoto Kasei Co., Ltd.), and SOLPERSE (manufactured by Zeneca).
- EFKA manufactured by EFKA
- Disperbyk manufactured by Big Chemie
- Disparon manufactured by Kusumoto Kasei Co., Ltd.
- SOLPERSE manufactured by Zeneca
- the blending amount of the dispersant in the photosensitive resin composition of the present invention is appropriately adjusted according to the type of pigment or the like.
- the photosensitive resin composition of the present embodiment may contain known additives such as known leveling agents and thermal polymerization inhibitors in order to impart predetermined properties.
- the blending amount of these additives in the photosensitive resin composition is not particularly limited as long as it does not impair the effects of the present invention.
- the viscosity of the photosensitive resin composition of the present embodiment can be appropriately adjusted according to the thickness of the target resin cured film.
- the viscosity of the photosensitive resin composition is preferably 1 mP ⁇ s to 25 mP ⁇ s, and preferably 2 mP ⁇ s to 20 mP ⁇ s. More preferably, it is 3 mP ⁇ s to 15 mP ⁇ s, and most preferably.
- the photosensitive resin composition of the present embodiment may be prepared by mixing the above components using a known mixing device, or may first contain (A) a copolymer and (D) a solvent. After preparing the composition, i.e., a monomer mixture consisting of (A-1) compound, (A-2) compound and optionally used (A-3) compound is copolymerized in the presence of (D) solvent. After the polymerization, it may be prepared by adding (B) a reactive diluent, (C) a photopolymerization initiator, and an optional component (E) a colorant and mixing them. In the latter preparation method, (D-2) or other solvent may be newly added after the copolymerization, if necessary. The (D-2) other solvent may be the same as or different from the (D) solvent.
- the photosensitive resin composition of the present embodiment Since the photosensitive resin composition of the present embodiment has alkaline developability, it can be developed by using an alkaline aqueous solution. In particular, the photosensitive resin composition of the present embodiment can give a pattern having excellent developability. Therefore, the photosensitive resin composition of the present embodiment is a resist used for manufacturing an organic EL display device, a liquid crystal display device, a color filter incorporated in a solid-state image sensor, a black matrix, an overcoat, a protective film, and an insulating film. It is preferably used as.
- the cured resin film of the present embodiment is formed by applying the above-mentioned photosensitive resin composition to a substrate, prebaking, exposing, and post-baking.
- a pattern is formed by a photolithography method, the above-mentioned photosensitive resin composition is applied to a substrate, prebaked, and then the formed coating film is exposed through a photomask of a predetermined pattern to expose an exposed portion.
- Light cure is performed, if necessary, after exposure and heat treatment, the unexposed portion is dissolved in an alkaline aqueous solution, developed, and then post-baked to form a predetermined pattern.
- the method for applying the photosensitive resin composition is not particularly limited, but a screen printing method, a roll coating method, a curtain coating method, a spray coating method, a spin coating method, a slit coating method and the like are used.
- prebaking process After forming the coating film by the coating step, it is preferable to prebake (preheat treatment) in order to dry the coating film and reduce the residual amount of the solvent in the coating film.
- the prebaking step can be carried out at a temperature of generally 70 ° C. to 120 ° C., preferably 90 ° C. to 110 ° C., for 10 seconds to 600 seconds, preferably 120 seconds to 180 seconds when using a hot plate.
- the surface of the formed coating film is exposed by light irradiation.
- the surface of the coating film is exposed through a photomask of a predetermined pattern.
- the light source used for light irradiation is not particularly limited, and for example, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, a xenon lamp, a metal halide lamp, or the like is used. Further, the exposure amount is not particularly limited, and is appropriately set according to the composition of the photosensitive resin composition.
- post-exposure heating process In the case of forming a pattern, post-exposure heat treatment (Post Exposure Backing) can be performed after the exposure step, if necessary. By this step, the dissolution contrast between the exposed portion and the unexposed portion of the coating film can be made more remarkable. Unlike the post-baking process described later, this step is not performed to completely cure the coating film, but only the pattern of the exposed portion is left on the substrate after the developing step, and the coating film of the unexposed portion is developed. Make sure that it can be removed. Therefore, it is not an indispensable step in forming the resin cured film of the present embodiment.
- a hot plate, an oven, furnace, or the like can be used. The heating temperature range is preferably 40 ° C.
- the heating temperature is 40 ° C. or higher, the dissolution contrast between the exposed portion and the unexposed portion of the coating film can be improved, and the effect of the post-exposure heat treatment can be fully exhibited.
- the heating temperature is 70 ° C. or lower, the acid generated in the exposed portion does not diffuse to the unexposed portion, and good dissolution contrast can be obtained.
- the heating time is preferably 20 seconds to 600 seconds. If it is 20 seconds or more, the temperature history of the entire coating film can be made uniform. If it is 600 seconds or less, the acid generated in the exposed portion does not diffuse to the unexposed portion, and a good dissolution contrast can be obtained.
- the alkaline aqueous solution used for development is not particularly limited, but is, for example, an aqueous solution of sodium carbonate, potassium carbonate, calcium carbonate, sodium hydroxide, potassium hydroxide and the like; an aqueous solution of an amine compound such as ethylamine, diethylamine and dimethylethanolamine.
- An aqueous solution of a quaternary ammonium salt such as tetramethylammonium hydroxide; 3-methyl-4-amino-N, N-diethylaniline, 3-methyl-4-amino-N-ethyl-N- ⁇ -hydroxyethylaniline , 3-Methyl-4-amino-N-ethyl-N- ⁇ -methanesulfonamide ethylaniline, 3-methyl-4-amino-N-ethyl-N- ⁇ -methoxyethylaniline and their sulfates, hydrochlorides
- an aqueous solution of a p-phenylenediamine-based compound such as p-toluenesulfonate can be mentioned.
- aqueous solution of a p-phenylenediamine-based compound it is preferable to use an aqueous solution of a p-phenylenediamine-based compound. If necessary, a defoaming agent or a surfactant may be added to these alkaline aqueous solutions. Further, it is preferable to wash with water and dry after developing with the above alkaline aqueous solution.
- Post-baking is performed after the developing step to obtain a resin cured film.
- the post-baking conditions are not particularly limited, and the heat treatment may be performed according to the composition of the photosensitive resin composition. For example, it may be heated at a temperature of 80 ° C. to 250 ° C. for 10 minutes to 60 minutes.
- the temperature range of the post-baking process is preferably 80 ° C. to 130 ° C., preferably 80 ° C. to 100 ° C. from the viewpoint of reducing damage due to heat of the base material and the circuit. It is more preferable to do so.
- the resin cured film of this embodiment has high light transmittance and excellent transparency. Further, since the hardness of the cured resin film is good, it can be suitably used for an overcoat on the upper part of a color filter, various protective films, and the like. Further, it can be suitably used as various insulating materials such as an insulating film between electrodes such as ITO of a touch panel and an interlayer insulating film of a TFT.
- FIG. 1 is a schematic cross-sectional view showing a color filter of the present embodiment.
- the color filter of the present embodiment includes a base material 1 and a black matrix 3 formed on the boundary between the RGB pixels 2 and the pixels 2 formed on one surface of the base material 1. , A protective film 4 formed on the pixel 2 and the black matrix 3.
- the color filter of the present embodiment known configurations can be adopted except that the pixel 2 and the black matrix 3 (coloring pattern) are formed by using the above-mentioned photosensitive resin composition. ..
- the configuration of the color filter shown in FIG. 1 is an example, and the color filter of the present embodiment is not limited to this configuration.
- a coloring pattern is formed on one surface of the base material 1. Specifically, the pixels 2 and the black matrix 3 are sequentially formed on one surface of the base material 1.
- the coloring pattern can be formed by the above-mentioned method for producing a cured resin film (photolithography method).
- the base material 1 is not particularly limited, and examples thereof include a glass substrate, a silicon substrate, a polycarbonate substrate, a polyester substrate, a polyamide substrate, a polyamide-imide substrate, a polyimide substrate, an aluminum substrate, a printed wiring board, and an array substrate.
- the protective film 4 is formed on the coloring pattern (pixel 2 and black matrix 3).
- the protective film 4 is not particularly limited, and is formed by using a known material and forming method.
- the color filter produced in this manner is produced by using a photosensitive resin composition having good storage stability and excellent developability, and a coloring pattern (pixel 2 and black matrix 3) having excellent solvent resistance. ).
- the image display element of the present embodiment includes the above-mentioned color filter.
- Examples of the image display element include a liquid crystal display element, an organic EL display element, and the like.
- the image display element of the present embodiment is capable of high-luminance display by providing the above-mentioned color filter.
- the copolymerization reaction was carried out by stirring at 105 ° C. for 2 hours, and the sample 1 (weight average molecular weight (Mw): 3500, number average molecular weight (Mn): 2300, molecular weight distribution (Mw / Mn): 1. 5.
- a copolymer having an acid value of 20.5 KOHmg / g and a silyl group equivalent of 300 g / mol) was obtained.
- Viscosity increase rate (([Viscosity after test]-[Viscosity before test]) / [Viscosity before test]) x 100%
- the criteria for this evaluation are as follows. ⁇ : thickening rate less than 10%
- Tables 4 and 5 The above evaluation results of storage stability are shown in Tables 4 and 5.
- a photosensitive resin composition was prepared according to the following method.
- Photosensitive resin compositions (samples 28 to 54) using a dye (VALIFAST BLUE 2620) as the (E) colorant were prepared according to the blending components and blending ratios shown in Table 3.
- the blending amount of the (A) copolymer (or (A') copolymer, the same applies hereinafter) in Table 3 does not contain the solvent used for synthesizing the (A) copolymer, and is shown in Table 3.
- the blending amount of the solvent (B) in No. 3 is the sum of the solvent used for synthesizing the (A) copolymer and the additionally blended propylene glycol monomethyl ether.
- the pencil hardness of the resin cured film produced as described above was measured according to JIS K5600-5-4 using a pencil hardness tester (No. 553-M, manufactured by Yasuda Seiki Seisakusho). The criteria are as follows. ⁇ : Pencil hardness 3H or more ⁇ : Pencil hardness less than 3H The evaluation results of the above pencil hardness are shown in Tables 4 and 5.
- Examples 1 to 12 and Comparative Examples 1 to 15 are applied onto a 5 cm square glass substrate (non-alkali glass substrate) by the spin coater method, and 100 The solvent was volatilized by heating at ° C. for 3 minutes to form a coating film on the glass substrate. Next, the coating film was exposed to light having a wavelength of 365 nm, and the coating surface was photocured. Next, the film was allowed to stand in a dryer at 230 ° C. for 30 minutes for heat treatment (post-baking) to obtain a cured resin film having a film thickness of 2.5 ⁇ m.
- Comparative Example 10 using the (A') copolymer of Comparative Synthesis Example 10 having an acid value of 0, the result was that developability could not be obtained.
- Comparative Examples 11 to 13 using the (A') copolymer of Comparative Synthesis Examples 11 to 13 having a small content of the structural unit (a-1) derived from the polymerizable unsaturated compound having an alkoxysilyl group are developing groups. Since the amount of the compound is not sufficient, the developability is inferior, and the hardness and the solvent resistance are also inferior.
- a photosensitive resin composition containing a copolymer which is good in developability, can form a cured resin film having excellent hardness and solvent resistance, and is excellent in storage stability. Further, a resin cured film having excellent hardness and solvent resistance, and an image display element provided with the resin cured film are provided.
- the photosensitive resin composition can be preferably used as a transparent film, a protective film, an insulating film, an overcoat, a photo spacer, a black matrix, a black column spacer, and a resist for a color filter.
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Abstract
Description
[1](A)共重合体と、(B)反応性希釈剤と、(C)光重合開始剤と、(D)溶剤とを含む感光性樹脂組成物であって、
前記(A)共重合体が、下記式(1)で表される構成単位(a-1)、及び重合性不飽和化合物に由来し、酸基を有する構成単位(a-2)を含み、
前記(A)共重合体の全構成単位における前記構成単位(a-1)の含有量が、50モル%超であり、
前記(D)溶剤が、炭素原子数3~10の第一級アルコール及び炭素原子数3~10の第二級アルコールから選択される少なくとも1種を含むことを特徴とする感光性樹脂組成物。
なお、本明細書において、「(メタ)アクリル酸」は、メタクリル酸及びアクリル酸から選択される少なくとも1種を意味し、「(メタ)アクリレート」は、メタクリレート及びアクリレートから選択される少なくとも1種を意味し、「(メタ)アクリロイル」は、メタクリロイル及びアクリロイルから選択される少なくとも1種を意味する。
本実施形態の感光性樹脂組成物は、(A)共重合体と、(B)反応性希釈剤と、(C)光重合開始剤と、(D)溶剤とを含有するものである。本実施形態の感光性樹脂組成物は、必要に応じて、(E)着色剤を更に含有する。本実施形態の感光性樹脂組成物は、光照射されることにより重合硬化し、樹脂硬化膜を形成する。
本実施形態の(A)共重合体は、下記式(1)で表される構成単位(a-1)(以下、単に「構成単位(a-1)」とも言う。)と、重合性不飽和化合物に由来し、酸基を有する構成単位(a-2)(以下、単に「構成単位(a-2)」とも言う。)とを有する。(A)共重合体は、必要に応じて、その他の重合性不飽和化合物由来の構成単位(a-3)(以下、単に「構成単位(a-3)」とも言う。)を有していてもよい。
式(1)中、R2~R4で表される炭素原子数1~6のアルキル基は、炭素原子数1~4のアルキル基であることが好ましく、炭素原子数1~2のアルキル基であることがより好ましい。R2~R4で表される炭素原子数1~6のアルコキシ基は、炭素原子数1~4のアルコキシ基であることが好ましく、炭素原子数1~2のアルコキシ基であることがより好ましい。R2~R4は各々独立に、炭素原子数1~6のアルキル基又は炭素原子数1~6のアルコキシ基であることが好ましく、R2~R4のうち2つが炭素原子数1~6のアルコキシ基であり、R2~R4のうち1つが炭素原子数1~6のアルキル基であることがより好ましく、R2~R4のうち2つが炭素原子数1~2のアルコキシ基、すなわちメトキシ基又はエトキシ基であり、R2~R4のうち1つが炭素原子数1~2のアルキル基、すなわちメチル基又はエチル基であることが最も好ましい。R2~R4の全てが、炭素原子数1~6のアルコキシ基であると、架橋点が多くなるため樹脂硬化膜としたときの硬度の点では有利になるが、(A)共重合体の十分な保存安定性が得られない。(A)共重合体の保存安定性が不十分であると、感光性樹脂組成物の保存安定性が低下する。
式(1)中、nは1~10の整数であり、1~4であることが好ましく、3であることがより好ましい。
3-(メタ)アクリロイルオキシプロピルメチルジメトキシシラン由来の構成単位(式(1)中、R1が水素原子又はメチル基であり、R2がメチル基であり、R3及びR4がメトキシ基であり、nが3である)、
3-(メタ)アクリロイルオキシプロピルエチルジメトキシシラン由来の構成単位(式(1)中、R1が水素原子又はメチル基であり、R2がエチル基であり、R3及びR4がメトキシ基であり、nが3である)、
3-(メタ)アクリロイルオキシプロピルメチルジエトキシシラン由来の構成単位(式(1)中、R1が水素原子又はメチル基であり、R2がメチル基であり、R3及びR4がエトキシ基であり、nが3である)、
3-(メタ)アクリロイルオキシプロピルエチルジエトキシシラン由来の構成単位(式(1)中、R1が水素原子又はメチル基であり、R2がエチル基であり、R3及びR4がエトキシ基であり、nが3である)
等が挙げられる。これらの中でも、材料入手のし易さ及び(A)共重合体を合成する際の反応性の観点から、構成単位(a-1)としては、3-(メタ)アクリロイルオキシプロピルメチルジメトキシシラン由来の構成単位及び3-(メタ)アクリロイルオキシプロピルメチルジエトキシシラン由来の構成単位が好ましい。
カラム:ショウデックス(登録商標)LF-804+LF-804(昭和電工株式会社製)
カラム温度:40℃
試料:(A)共重合体の含有量が0.2質量%のテトラヒドロフラン溶液
展開溶媒:テトラヒドロフラン
検出器:示差屈折計(商品名:ショウデックス(登録商標)RI-71S、昭和電工株式会社製)
流速:1mL/分
なお、(A)共重合体の酸価とは、JIS K6901 5.3に従ってブロモチモールブルーとフェノールレッドとの混合指示薬を用いて測定された値であって、(A)共重合体1g中に含まれる酸性成分を中和するのに要する水酸化カリウムのmg数を意味する。
なお、(A)共重合体のシリル基当量は、(A)共重合体の分子量を1分子当たりのシリル基の平均個数で割った値であり、(A)共重合体を合成する際に用いる、構成単位(a-1)の原料となる重合性不飽和化合物の仕込み量に基づいて算出される計算値とする。シリル基は異なる種類のシリル基が含まれていても、単にシリル基としてカウントする。
重合開始剤の使用量は、特に限定されないが、(A-1)化合物、(A-2)化合物及び必要に応じて用いられる(A-3)化合物の仕込み量の合計を100質量部としたときに、好ましくは0.1質量部~20質量部であり、より好ましくは0.5質量部~16質量部である。
本実施形態の(B)反応希釈剤としては、ビニル基、アリル基、(メタ)アクリロイルオキシ基等のエチレン性不飽和基を有する低分子量化合物であれば特に限定されない。(B)反応性希釈剤の具体例としては、芳香族ビニル系モノマー類;酢酸ビニル、アジピン酸ビニル等のポリカルボン酸モノマー類;(メタ)アクリレート類;多官能(メタ)アクリレート類;トリアリルシアヌレート等が挙げられる。
本実施形態の(C)光重合開始剤としては、光照射によりラジカルを発生する化合物であれば特に限定されないが、例えば、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル等のベンゾインとそのアルキルエーテル類;アセトフェノン、2,2-ジメトキシ-2-フェニルアセトフェノン、1,1-ジクロロアセトフェノン、4-(1-t-ブチルジオキシ-1-メチルエチル)アセトフェノン等のアセトフェノン類;1-ヒドロキシシクロヘキシルフェニルケトン、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン等のアルキルフェノン類;2-メチルアントラキノン、2-アミルアントラキノン、2-t-ブチルアントラキノン、1-クロロアントラキノン等のアントラキノン類;2,4-ジメチルチオキサントン、2,4-ジイソプロピルチオキサントン、2-クロロチオキサントン等のチオキサントン類;アセトフェノンジメチルケタール、ベンジルジメチルケタール等のケタール類;ベンゾフェノン、4-(1-t-ブチルジオキシ-1-メチルエチル)ベンゾフェノン、3,3’,4,4’-テトラキス(t-ブチルジオキシカルボニル)ベンゾフェノン等のベンゾフェノン類;1,2-オクタンジオン,1-[4-(フェニルチオ)-2-(o-ベンゾイルオキシム)]、エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル],1-(o-アセチルオキシム)等のオキシムエステル類;2-メチル-1-[4-(メチルチオ)フェニル]-2-モルホリノ-プロパン-1-オン;2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)ブタノン-1;2,4,6-トリメチルベンゾイルジフェニルホスフィンオキサイド、ビス(2,4,6-トリメチルベンゾイル)フェニルホスフィンオキサイド等のアシルホスフィンオキサイド類;キサントン類等が挙げられる。これらの(C)光重合開始剤は、1種を単独で用いてもよいし、2種以上を組み合わせて用いてもよい。
本実施形態の(D)溶剤は、炭素原子数3~10の第一級アルコール及び炭素原子数3~10の第二級アルコールから選択される少なくとも1種を含み、感光性樹脂組成物の各成分に対し不活性であり且つ各成分を溶解可能な溶剤であれば特に限定されない。(A)共重合体の調製に用いる(D-1)溶剤として、(D)溶剤と同様の溶剤を用い、この溶媒を分離、除去することなくそのまま感光性樹脂組成物の(D)溶剤として用いてもよいし、感光性樹脂組成物の各成分を混合する際に溶剤を新たに添加してもよい。感光性樹脂組成物の各成分を混合する際にそれらの成分と共存する溶剤であってもよい。感光性樹脂組成物としての保存安定性の観点から、(D)溶剤は、炭素原子数3~10の第一級アルコールを含むことが好ましい。炭素原子数3~10の第一級アルコール及び炭素原子数3~10の第二級アルコール溶剤の例としては、例えば、モノアルコール類、(ポリ)アルキレングリコールモノアルキルエーテル類等が挙げられる。
その他の溶剤の含有量は、0質量%~80質量%であることが好ましく、0質量%~50質量%であることがより好ましい。
本実施形態の感光性樹脂組成物は、必要に応じて、(E)着色剤を更に含有してよい。(E)着色剤としては、公知の染料又は顔料を用いることができる。(E)着色剤として染料を用いる場合には、顔料を用いた場合に比べて、輝度の高い着色パターンを得ることができ、また、良好なアルカリ現像性を示す。
本発明の感光性樹脂組成物における分散剤の配合量は、顔料等の種類に応じて適宜調整される。
本実施形態の感光性樹脂組成物は、公知の混合装置を用い、上記の成分を混合することによって調製してもよいし、あるいは先に、(A)共重合体及び(D)溶剤を含む組成物を調製した後、即ち、(A-1)化合物、(A-2)化合物及び必要に応じて用いられる(A-3)化合物からなるモノマー混合物を、(D)溶剤の存在下で共重合させた後、(B)反応性希釈剤、(C)光重合開始剤、及び任意成分の(E)着色剤を添加し、混合することによって調製してもよい。後者の調製方法では、必要に応じて、共重合後に(D-2)その他の溶剤を新たに添加してもよい。(D-2)その他の溶剤は、(D)溶剤と同じでもよいし、異なってもよい。
本実施形態の樹脂硬化膜は、上述の感光性樹脂組成物を基材に塗布、プリベーク、露光、ポストベークすることにより形成される。フォトリソグラフィ法によりパターンを形成する場合には、上述の感光性樹脂組成物を基材に塗布、プリベークした後、形成した塗布膜を所定のパターンのフォトマスクを介して露光することにより露光部分を光硬化させる。そして、必要に応じて露光後加熱処理をした後、未露光部分をアルカリ水溶液で溶解して現像した後、ポストベークすることにより所定のパターンを形成することができる。
感光性樹脂組成物の塗布方法としては、特に限定されないが、スクリーン印刷法、ロールコート法、カーテンコート法、スプレーコート法、スピンコート法、スリットコート法等が用いられる。
塗布工程により塗膜を形成させた後、その塗膜を乾燥させて塗膜中の溶剤残存量を減少させるため、プリベーク(前加熱処理)することが好ましい。プリベーク工程は、一般に70℃~120℃、好ましくは90℃~110℃の温度で、ホットプレートによる場合には10秒間~600秒間、好ましくは120秒間~180秒間実施することができる。
形成した塗膜表面を、光照射により露光する。パターンを形成する場合には、塗膜表面を所定のパターンのフォトマスクを介して露光する。光照射に用いられる光源としては、特に限定されないが、例えば、低圧水銀ランプ、中圧水銀ランプ、高圧水銀ランプ、キセノンランプ、メタルハライドランプ等が用いられる。また、露光量も、特に限定されず、感光性樹脂組成物の組成に応じて適宜設定される。
パターンを形成する場合には、露光工程後に必要に応じて露光後加熱処理(Post Exposure Baking)を行うことができる。この工程により、塗膜の露光部と未露光部の溶解コントラストをより顕著に出すことができる。この工程は、後述するポストベーク工程とは異なり、塗膜を完全に硬化させるために行うものではなく、現像工程後に露光部のパターンだけを基板上に残し、未露光部の塗膜を現像により確実に除去することが可能となるように行う。従って、本実施形態の樹脂硬化膜の形成において、必須の工程ではない。露光後加熱処理を行う場合、ホットプレート、オーブン、又はファーネス等を使用することができる。加熱温度の範囲としては、40℃~70℃が好ましく、50℃~60℃が更に好ましい。加熱温度が40℃以上であれば、塗膜の露光部と未露光部の溶解コントラストを向上させて、露光後加熱処理の効果を十分に発揮することができる。加熱温度が70℃以下であれば、露光部に発生した酸が未露光部まで拡散することもなく良好な溶解コントラストを得られる。加熱時間の範囲としては、20秒~600秒が好ましい。20秒以上であれば塗膜全体の温度履歴を均一にすることができる。600秒以下であれば、露光部に発生した酸が未露光部まで拡散することもなく良好な溶解コントラストを得られる。
露光後、必要に応じて露光後加熱処理を行ったあと、塗膜を現像処理する。現像の際に用いられる現像液としては、従来、感光性樹脂組成物の現像に用いられている任意の現像液を用いることができる。現像に用いられるアルカリ水溶液としては、特に限定されないが、例えば、炭酸ナトリウム、炭酸カリウム、炭酸カルシウム、水酸化ナトリウム、水酸化カリウム等の水溶液;エチルアミン、ジエチルアミン、ジメチルエタノールアミン等のアミン系化合物の水溶液;水酸化テトラメチルアンモニウム等の第4級アンモニウム塩の水溶液;3-メチル-4-アミノ-N,N-ジエチルアニリン、3-メチル-4-アミノ-N-エチル-N-β-ヒドロキシエチルアニリン、3-メチル-4-アミノ-N-エチル-N-β-メタンスルホンアミドエチルアニリン、3-メチル-4-アミノ-N-エチル-N-β-メトキシエチルアニリン及びこれらの硫酸塩、塩酸塩又はp-トルエンスルホン酸塩等のp-フェニレンジアミン系化合物の水溶液等が挙げられる。これらの中でも、p-フェニレンジアミン系化合物の水溶液を用いることが好ましい。なお、これらのアルカリ水溶液には、必要に応じて、消泡剤や界面活性剤を添加してもよい。また、上記のアルカリ水溶液による現像の後、水洗して乾燥させることが好ましい。
現像工程後にポストベークを行い、樹脂硬化膜を得る。ポストベークの条件は、特に限定されず、感光性樹脂組成物の組成に応じて加熱処理を行えばよい。例えば、80℃~250℃の温度にて、10分間~60分間加熱すればよい。基材に各種樹脂フィルムなどを用いる場合には、基材や回路の熱によるダメージ低減の観点からポストベーク工程の温度範囲を、80℃~130℃とすることが好ましく、80℃~100℃とすることがより好ましい。
本実施形態のカラーフィルターは、(A)~(E)成分を含む感光性樹脂組成物を用いて、上述の樹脂硬化膜の製造方法により作製される。
以下、図面を参照して、本実施形態のカラーフィルターについて説明する。
図1は、本実施形態のカラーフィルターを示す概略断面図である。
図1に示すように、本実施形態のカラーフィルターは、基材1と、基材1の一方の面上に形成される、RGBの画素2及び画素2の境界に形成されるブラックマトリックス3と、画素2及びブラックマトリックス3上に形成される保護膜4とを備える。
なお、図1に示したカラーフィルターの構成は一例であり、本実施形態のカラーフィルターは、この構成に限定されない。
まず、基材1の一方の面に着色パターンを形成する。具体的には、基材1の一方の面に、画素2及びブラックマトリックス3を順次形成する。着色パターンは、上述の樹脂硬化膜の製造方法(フォトリソグラフィ法)により形成することができる。
基材1としては、特に限定されないが、ガラス基板、シリコン基板、ポリカーボネート基板、ポリエステル基板、ポリアミド基板、ポリアミドイミド基板、ポリイミド基板、アルミニウム基板、プリント配線基板、アレイ基板等が挙げられる。
保護膜4は、特に限定されず、公知の材料及び形成方法を用いて形成される。
本実施形態の画像表示素子は、上述のカラーフィルターを具備する。画像表示素子の例としては、例えば、液晶表示素子、有機EL表示素子等が挙げられる。特に、本実施形態の画像表示素子は、上述のカラーフィルターを具備することにより、高輝度表示が可能である。
攪拌装置、滴下ロート、コンデンサー、温度計及びガス導入管を備えたフラスコに、3-メトキシ-1-ブタノール700gを入れ、窒素置換しながら攪拌し、105℃に昇温した。
次に、メタクリル酸9.4g(0.1モル)及び3-メタクリロイルオキシプロピルメチルジエトキシシラン256.1g(0.9モル)からなるモノマー混合物に、2,2’-アゾビス(イソ酪酸)ジメチル(重合開始剤)34.5gを添加したものを、滴下ロートから前記フラスコ中に滴下した。
滴下終了後、105℃にて2時間攪拌して共重合反応を行い、試料1(重量平均分子量(Mw):3500、数平均分子量(Mn):2300、分子量分布(Mw/Mn):1.5、酸価:20.5KOHmg/g、シリル基当量:300g/mol)の共重合体を得た。
表1及び2に記載の原料を用いる以外は合成例1と同様にして、共重合反応を行い、試料2~27の共重合体を得た。得られた試料の重量平均分子量(Mw)、数平均分子量(Mn)、分子量分布(Mw/Mn)、酸価及びシリル基当量を、表1及び2に示す。
(1)保存安定性
得られた試料1~27を用いて、以下の方法に従い、保存安定性の評価を行った。
試料を20mlのガラス容器に10gずつ計り取ってサンプルとし、粘度を測定した。なお、本明細書において、粘度とは、E型粘度計(東機産業製RE-80、ローター1°34’×R24)を使用して、25℃、回転数20rpmで測定した値を意味する。続いて、これらのサンプルをそれぞれ12℃に保った恒温器の中に3ヶ月間静置して保存した後、再び粘度を測定した。保存安定性試験前後の粘度を用いて、下記式より増粘率(粘度の増加率)を求めた。
増粘率=(([試験後の粘度]-[試験前の粘度])/[試験前の粘度])×100%
この評価の基準は以下の通りである。
○:増粘率10%未満
×:増粘率10%以上
上記の保存安定性の評価結果を表4及び5に示す。なお、保存安定性に優れる共重合体を感光性樹脂組成物に配合すると、感光性樹脂組成物自体の保存安定性を向上させることができる。
表3に示す配合成分及び配合割合に従って、(E)着色剤として、染料(VALIFAST BLUE 2620)を用いた感光性樹脂組成物(試料28~54)を調製した。
なお、表3における(A)共重合体(又は(A’)共重合体、以下同様)の配合量は、(A)共重合体を合成する際に用いた溶剤を含んでおらず、表3における(B)溶剤の配合量は、(A)共重合体を合成する際に用いた溶剤と追加で配合したプロピレングリコールモノメチルエーテルとを合算したものである。
(1)現像性
調製された感光性樹脂組成物(実施例1~12及び比較例1~15)を、露光後の厚さが2.5μmとなるようにスピンコーター法により5cm角のガラス基板(無アルカリガラス基板)上に塗布し、100℃にて3分間加熱することで溶剤を揮発させ、ガラス基板上に塗布膜を形成した。次に、幅3~100μmのライン&スペースのパターンを有するフォトマスクを、塗布膜から100μmの距離に配置し、このフォトマスクを介して超高圧水銀灯の光を200mJ/cm2照射した。その後、セミクリーンDL-A10現像液(5倍希釈)を使用し、温度23℃、圧力0.1MPa、現像時間60秒の条件で未露光部を除去した。上記のようにして作製したパターンを有する塗膜の顕微鏡観察を行い、現像された最小ライン幅(最小現像寸法)及び未露光部の残渣の有無を評価した。最小現像寸法については、良好に現像できずパターンが判別できなかったものについては「×」で示した。
残渣の有無については、以下の基準で示す。
残渣○:未露光部に残渣無し
残渣×:未露光部に残渣あり
上記の現像性の評価結果を表4及び5に示す。
調製された感光性樹脂組成物(実施例1~12及び比較例1~15)を、スピンコーター法により5cm角のガラス基板(無アルカリガラス基板)上に塗布し、100℃にて3分間加熱することで溶剤を揮発させ、ガラス基板上に塗布膜を形成した。次に、塗布膜に波長365nmの光を露光し、塗布面を光硬化させた。次いで、乾燥機中に230℃、30分の条件で静置して加熱処理(ポストベーク)を行い、膜厚2.5μmの樹脂硬化膜を得た。
上記のようにして作製した樹脂硬化膜の鉛筆硬度を、鉛筆硬度計(No.553-M、安田精機製作所製)を用いて、JIS K5600-5-4に従い測定した。
この基準は以下の通りである。
○:鉛筆硬度3H以上
×:鉛筆硬度3H未満
上記の鉛筆硬度の評価結果を表4及び5に示す。
調製された感光性樹脂組成物(実施例1~12及び比較例1~15)を、スピンコーター法により5cm角のガラス基板(無アルカリガラス基板)上に塗布し、100℃にて3分間加熱することで溶剤を揮発させ、ガラス基板上に塗布膜を形成した。次に、塗布膜に波長365nmの光を露光し、塗布面を光硬化させた。次いで、乾燥機中に230℃、30分の条件で静置して加熱処理(ポストベーク)を行い、膜厚2.5μmの樹脂硬化膜を得た。
容量500mLの蓋付きガラス瓶に、200mLのN-メチル-2-ピロリドンを入れ、60℃の条件下に静置した。その中に上記の樹脂硬化膜付き試験片を浸漬した後、60℃に維持した状態で、30分静置した。
試験片のN-メチル-2-ピロリドンへの浸漬前後の色変化(ΔE*ab)を分光光度計(UV-1650PC、島津製作所製)にて測定した。
この評価の基準は以下の通りである。
○:ΔE*abが3.0未満
×:ΔE*abが3.0以上
上記の耐溶剤性の評価結果を表4及び5に示す。
Claims (11)
- (A)共重合体と、
(B)反応性希釈剤と、
(C)光重合開始剤と、
(D)溶剤と
を含む感光性樹脂組成物であって、
前記(A)共重合体が、下記式(1)で表される構成単位(a-1)、及び重合性不飽和化合物に由来し、酸基を有する構成単位(a-2)を含み、
前記(A)共重合体の全構成単位における前記構成単位(a-1)の含有量が、50モル%超であり、
前記(D)溶剤が、炭素原子数3~10の第一級アルコール及び炭素原子数3~10の第二級アルコールから選択される少なくとも1種を含むことを特徴とする感光性樹脂組成物。
- 前記式(1)で表される構成単位(a-1)において、R2~R4のうち2つが炭素原子数1~2のアルコキシ基であり、R2~R4のうち1つが炭素原子数1~2のアルキル基である請求項1に記載の感光性樹脂組成物。
- 前記(A)共重合体中の構成単位(a-2)の有する酸基が、カルボキシ基であり、
前記(A)共重合体の酸価が15~300KOHmg/gである請求項1又は2に記載の感光性樹脂組成物。 - 前記(A)共重合体中の構成単位(a-2)が、(メタ)アクリル酸由来の構成単位である請求項1~3のいずれか一項に記載の感光性樹脂組成物。
- 前記(D)溶剤における、炭素原子数3~10の第一級アルコール及び炭素原子数3~10の第二級アルコールの合計の含有量が、20~100質量%である請求項1~4のいずれか一項に記載の感光性樹脂組成物。
- 前記(A)共重合体の重量平均分子量が、1000~50000であり、
前記(A)共重合体の分子量分布(Mw/Mn)が、1.3~3.0である請求項1~5のいずれか一項に記載の感光性樹脂組成物。 - (E)着色剤を更に含有する請求項1~6のいずれか一項に記載の感光性樹脂組成物。
- 前記(D)溶剤を除く成分の総和を100質量部としたときに、
前記(A)共重合体の含有量が5~85質量部であり、
前記(B)反応性希釈剤の含有量が5~85質量部であり、
前記(C)光重合開始剤の含有量が0.1~30質量部である請求項1~7のいずれか一項に記載の感光性樹脂組成物。 - 請求項1~8のいずれか一項に記載の感光性樹脂組成物の硬化物からなる樹脂硬化膜。
- 請求項7に記載の感光性樹脂組成物の硬化物からなる着色パターンを有するカラーフィルター。
- 請求項10に記載のカラーフィルターを具備する画像表示素子。
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