WO2022079850A1 - Procédé de montage de bille et dispositif de montage de bille - Google Patents

Procédé de montage de bille et dispositif de montage de bille Download PDF

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Publication number
WO2022079850A1
WO2022079850A1 PCT/JP2020/038885 JP2020038885W WO2022079850A1 WO 2022079850 A1 WO2022079850 A1 WO 2022079850A1 JP 2020038885 W JP2020038885 W JP 2020038885W WO 2022079850 A1 WO2022079850 A1 WO 2022079850A1
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WO
WIPO (PCT)
Prior art keywords
ball
wafer
flux
ball mounting
transfer
Prior art date
Application number
PCT/JP2020/038885
Other languages
English (en)
Japanese (ja)
Inventor
大介 小林
英生 玉本
秀樹 岩田
武志 上野
昭隆 山岸
Original Assignee
株式会社小森コーポレーション
アスリートＦａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社小森コーポレーション, アスリートＦａ株式会社 filed Critical 株式会社小森コーポレーション
Priority to CN202080106155.7A priority Critical patent/CN116508402A/zh
Priority to PCT/JP2020/038885 priority patent/WO2022079850A1/fr
Priority to KR1020237011341A priority patent/KR20230058520A/ko
Publication of WO2022079850A1 publication Critical patent/WO2022079850A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/10—Intaglio printing ; Gravure printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7515—Means for applying permanent coating, e.g. in-situ coating
    • H01L2224/7518—Means for blanket deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/81009—Pre-treatment of the bump connector or the bonding area
    • H01L2224/81024—Applying flux to the bonding area

Definitions

  • the present invention relates to a ball mounting method and a ball mounting device for mounting a conductive ball on a substrate.
  • Patent Document 1 and Patent Document 2 disclose a ball mounting device including a screen printing unit that prints a flux on an electrode of a substrate using a mask and a ball mounting unit that mounts a ball on the flux.
  • Patent Document 3 discloses a gravure offset printing method in which ink as a wiring material is transferred from a gravure offset plate to a substrate via a blanket cylinder.
  • Patent Document 4 discloses a printing method of a fine wiring pattern by a gravure offset printing method to which the technique of Patent Document 3 is applied.
  • the wiring printing method a flexographic printing method, an inkjet printing method, a gravure printing method, a screen printing method and the like are used according to the wiring pattern, production speed and the like.
  • the gravure offset printing method is adopted.
  • the electrodes have become smaller and the intervals (pitch) between the electrodes have become shorter.
  • the screen printing method it is not possible to print the flux so that a fine ball can be placed in such a narrow pitch range. The reason for this is that there is a limit to improving the printing accuracy in the screen printing method. For this reason, the ball-mounted device that prints the flux by the screen printing method has a problem that it hinders the manufacture of electronic parts that are miniaturized and have a high density.
  • An object of the present invention is to provide a ball mounting method and a ball mounting device capable of mounting a high-definition ball.
  • the ball mounting method according to the present invention is a ball mounting method in which a conductive ball is mounted on a predetermined electrode of a substrate, and a flux is applied onto the electrode by a gravure offset printing method. It is a ball mounting method including a flux printing step for printing and a ball mounting step for mounting the ball on the flux.
  • the ball-mounting device is a ball-mounting device for mounting a conductive ball on a predetermined electrode of a substrate, and the electrode is used by using a rotary transfer body in which flux is transferred from a gravure offset indentation plate. It is a ball mounting device having a gravure offset printing unit for printing flux and a ball mounting unit for mounting the ball on the flux.
  • the flux is printed on the electrodes of the substrate with high accuracy by the gravure offset printing method. Therefore, according to the present invention, it is possible to provide a ball mounting method and a ball mounting device capable of mounting a high-definition ball.
  • FIG. 1 is a block diagram showing a configuration of a ball mounting device that implements the ball mounting method according to the present invention.
  • FIG. 2 is a plan view showing the configuration of the ball mounting device.
  • FIG. 3 is a cross-sectional view showing the configuration of the ball mounting portion.
  • FIG. 4 is an enlarged cross-sectional view showing a part of the ball mounting portion.
  • FIG. 5A is a cross-sectional view for explaining the operation of the gravure offset printing unit.
  • FIG. 5B is a cross-sectional view for explaining the operation of the gravure offset printing unit.
  • FIG. 5C is a cross-sectional view for explaining the operation of the gravure offset printing unit.
  • FIG. 6 is a flowchart for explaining the ball mounting method according to the present invention.
  • FIG. 7 is an enlarged plan view showing the flux after printing.
  • the ball mounting device 1 shown in FIG. 1 is a device for carrying out the ball mounting method according to the present invention, and mainly has three functional units. These functional units are a load & unload unit 2 located in the center of FIG. 1, a gravure offset printing unit 3 located on the left side in FIG. 1, and a ball mounting unit 4 located on the right side in FIG. Further, the ball mounting device 1 is installed in a clean room or an environment equivalent to that of a clean room.
  • the load & unload unit 2 has a function of taking out a board on which balls are not mounted as a work from the work storage container 6 and storing a board on which balls are mounted in the work storage container 6, and a gravure offset printing unit 3 and a ball mounting unit. It has a function of delivering and delivering a substrate to 4.
  • the substrate is, for example, a silicon wafer or a printed wiring board.
  • the ball mounting device 1 uses a silicon wafer (hereinafter, simply referred to as a wafer) as a substrate.
  • a closed cassette called FOUP Front Opening Unify Pod
  • the work storage container 6 has a wafer inlet / outlet (not shown) in the vicinity of the load & unload section 2.
  • the wafer entrance / exit is arranged so as to face the load & unload section 2.
  • a first work storage container 6A in which a plurality of wafers 8 not loaded with balls are stored and a second work in which a plurality of wafers 9 loaded with balls are stored are stored.
  • a storage container 6B is used.
  • the flux 11 (see FIGS. 5A to 5C) is printed on the electrode forming region 8a of the wafer 8 on which the balls are not mounted by the gravure offset printing method, and the flux 11 is printed.
  • the ball 12 (see FIG. 4) is mounted on the top.
  • the load & unload unit 2 includes a transfer robot 13 made of an articulated robot and a pre-aligner 14.
  • the transfer robot 13 includes a first transfer arm 15 that attracts the lower surface of the wafer 8 to hold the wafer 8, and moves the first transfer arm 15 in the horizontal direction and the vertical direction to transfer the wafer 8. do.
  • the pre-aligner 14 is for aligning the position of a flat notch (not shown) formed on the outer peripheral portion of the wafer 8 with a predetermined position, and is a rotary table 14a on which the wafer 8 is placed and rotated, and a flat cut. It is equipped with a sensor 14b for detecting a notch.
  • the first wafer table 16 provided near the boundary with the load & unload unit 2 and the first wafer table 16 are located within the operating range.
  • the first wafer stand 16 has three suction pins 16a. These suction pins 16a have a function of sucking the lower surface of the wafer 8 to hold the wafer 8 and a function of raising and lowering the wafer 8.
  • the first wafer transfer device 17 has a second transfer arm 17a that attracts the lower surface of the wafer 8 to hold the wafer 8, and an X slider 17b that moves the second transfer arm 17a in two horizontal directions. And a Y slider 17c.
  • the two horizontal directions referred to here are the X direction, which is the direction in which the gravure offset printing unit 3 and the ball mounting unit 4 are lined up (the left-right direction in FIG. 1), and the Y direction, which is orthogonal to the X direction in the horizontal direction. Is.
  • the X slider 17b moves the Y slider 17c and the second transfer arm 17a in the X direction.
  • the Y slider 17c moves the second transfer arm 17a in the Y direction.
  • the work table slider 18 has a flat support surface 18a for sucking and holding the wafer 8 and three elevating suction pins 18b, and is configured to move in the X direction and the Y direction.
  • a plurality of alignment cameras 23 that image the wafer 8 on the work table slider 18 from above are installed.
  • the work table slider 18 moves in the X direction and the Y direction so that the wafer 8 is arranged at a predetermined print position based on the image of the wafer 8 captured by the alignment camera 23.
  • the blanket roll 19 is a roll in which a rubber blanket 19a is wound around the outer peripheral portion, and has a function of rotating around an axis C1 extending in the X direction, a function of moving in the Y direction, and a predetermined lowering position. It has a function to move up and down to and from the ascending position.
  • the blanket roll 19 corresponds to the "rotary transfer body" in the present invention.
  • the lowering position of the blanket roll 19 is a position where the blanket roll 19 comes into contact with the wafer 8 on the work table slider 18 and the intaglio 24 for gravure offset printing on the plate slider 21, which will be described later.
  • the ascending position is a position where the blanket roll 19 is separated above the wafer 8 and the intaglio 24 for gravure offset printing.
  • the blanket roll 19 according to this embodiment is arranged between the work table slider 18 and the plate slider 21 described later.
  • the scraper 20 includes a blade 20a made of a strip-shaped plate extending in the X direction.
  • the blade 20a can swing about the axis C2 extending in the X direction.
  • the scraper 20 has a function of swinging the blade 20a, and is configured to move in the Y direction integrally with the blanket roll 19.
  • the scraper 20 according to this embodiment moves in one direction in the Y direction (upper side in FIG. 2) with the lower end of the blade 20a in contact with the upper surface of the intaglio 24 for gravure offset printing described later, and the lower end of the blade 20a is gravure. It moves to the other side in the Y direction (lower side in FIG. 2) while being separated from the offset printing intaglio 24. It was
  • the plate slider 21 positions and holds the intaglio 24 for gravure offset printing (hereinafter, simply referred to as the intaglio 24) at a predetermined position.
  • the intaglio 24 is a lithographic plate formed in a flat plate shape, and recesses 25 are provided on the upper surface thereof at positions corresponding to a large number of electrodes 8b of the wafer 8.
  • the recess 25 is formed in the print area 24a (see FIG. 2) of the intaglio 24.
  • the material forming the intaglio 24 is glass, synthetic resin, metal, or the like.
  • a dispenser 22 that supplies the flux 11 to the intaglio 24 is arranged above the plate slider 21, a dispenser 22 that supplies the flux 11 to the intaglio 24 is arranged.
  • the ball mounting portion 4 has a second wafer pedestal 31 provided near the boundary with the load & unloading portion 2 and a second wafer pedestal 31 within the operating range.
  • the second wafer stand 31 has the same configuration as the first wafer stand 16 and has three elevating suction pins 31a.
  • the second wafer transfer device 32 has the same configuration as the first wafer transfer device 17, and includes a third transfer arm 32a, an X slider 32b, and a Y slider 32c.
  • the third transfer arm 32a attracts the lower surface of the wafer 8 to hold the wafer 8.
  • the X slider 32b moves the Y slider 32c and the third transfer arm 32a in the X direction.
  • the Y slider 32c moves the third transfer arm 32a in the Y direction.
  • the wafer stage 33 has a flat upper surface 33a and also has a plurality of air holes 41 that open in the upper surface 33a.
  • the air hole 41 communicates the suction chamber 42 provided at the lower part of the wafer stage 33 with the space above the wafer stage 33.
  • An air suction device (not shown) is connected to the suction chamber 42.
  • the wafer stage 33 receives a plurality of elevating suction pins (in order to receive the wafer 8 on which the balls are not mounted from the third transfer arm 32a and to transfer the wafer 9 on which the balls are mounted to the third transfer arm 32a). (Not shown).
  • the ball arrangement mask 34 is formed in a shape that covers the wafer stage 33 from above, is arranged above the wafer stage 33, and is configured to be movable in the vertical direction.
  • the ball arrangement mask 34 has a plurality of through holes 43 into which the balls 12 are transferred.
  • the through holes 43 are provided at positions corresponding to a large number of electrodes 8b of the wafer 8, respectively.
  • the hole diameter of the through hole 43 is a hole diameter into which only one ball 12 can be inserted.
  • the thickness of the ball arrangement mask 34 is such that the upper end of the ball 12 transferred into the through hole 43 is located near the upper surface of the ball arrangement mask 34.
  • a ball suction device for sucking and removing the surplus balls 12 on the ball arrangement mask 34 can be provided in the vicinity of the ball arrangement mask 34.
  • the ball transfer unit 35 is formed in a tubular shape and is connected to a ball supply device (not shown).
  • the ball 12 is supplied from above into the ball transfer unit 35 from the ball supply device.
  • the ball 12 is a conductive ball having conductivity such as a solder ball.
  • the ball transfer unit 35 has a function of rotating around the axis C3 extending in the vertical direction and a function of moving in the X direction, the Y direction, and the vertical direction.
  • a brush squeegee 36 is provided at the lower end of the ball transfer portion 35.
  • the brush squeegee 36 is a cylindrical brush whose outer diameter gradually increases toward the bottom.
  • step S1 the wafer 8 is carried into the gravure offset printing unit 3 (step S1).
  • the wafer 8 is pulled out from the first work storage container 6A by the transfer robot 13 and transferred to the pre-aligner 14.
  • the wafer 8 is transferred from the pre-aligner 14 to the first wafer stand 16 by the transfer robot 13. This transfer is performed by retracting the first transfer arm 15 of the transfer robot 13 with respect to the wafer 8 while the wafer 8 is held by the three suction pins 16a.
  • the wafer 8 is transferred from the first wafer pedestal 16 to the second transfer arm 17a of the first wafer transfer device 17, and further, the second transfer arm 17a is moved above the work table slider 18. Then, the wafer 8 is transferred to the work table slider 18.
  • the second transfer arm 17a is inserted under the wafer 8 and the three suction pins 16a are released from suction in this state. Lower it while it is still in place.
  • the three suction pins 18b of the work table slider 18 are raised to push the wafer 8 up from the second transfer arm 17a, and in this state, the second transfer arm 8 is used.
  • the transfer arm 17a of 2 is retracted from the wafer 8. Then, the suction pin 18b is lowered so that the wafer 8 is placed on the upper surface of the work table slider 18 in a state where the wafer 8 is sucked by the suction pin 18b.
  • the flux 11 is supplied to the intaglio plate 24 (step S2).
  • a predetermined amount of flux 11 is dropped onto the intaglio 24 by the dispenser 22.
  • the blade 20a of the scraper 20 is tilted so that the lower end contacts the intaglio 24, and the scraper 20 and the blanket roll 19 in the raised position are placed on one side of the Y direction (work table in the Y direction). Move in the direction away from the slider 18.
  • the blade 20a is tilted so that the downstream side in the moving direction is located downward.
  • the recess 25 is filled with the flux 11.
  • the blade 20a is swung to separate the lower end from the intaglio 24, and the blanket roll 19 is positioned in the descending position and pressed against the intaglio 24 while pressing them against the intaglio 24.
  • the blanket roll 19 rotates by moving in the Y direction while in contact with the intaglio plate 24.
  • the flux 11 in the recess 25 is transferred to the blanket roll 19 as the blanket roll 19 rotates (step S3).
  • Step S4 When the blanket roll 19 rolls on the intaglio 24 to the other end in the Y direction, the flux 11 is transferred from all the recesses 25 to the blanket 19a of the blanket roll 19. Then, the blanket roll 19 continuously moves in the Y direction and rolls on the wafer 8 as shown in FIG. 5C. The flux 11 on the blanket roll 19 is transferred from the blanket 19a to the electrode 8b of the wafer 8 by moving the blanket roll 19 toward the other side in the Y direction while rotating on the wafer 8 while being pressed against the wafer 8. (Step S4). In this embodiment, the steps shown in steps S1 to S4 correspond to the "flux printing step" of the ball mounting method of the present invention.
  • the wafer 8 is conveyed to the ball mounting unit 4 (step S5).
  • the wafer 8 on the work table slider 18 is transferred to the first wafer stand 16 by the first wafer transfer device 17, and the wafer 8 is transferred to the first wafer stand 16 by the transfer robot 13.
  • Reprinted from to pre-aligner 14 the wafer 8 after flux printing is rotated to correct the position of the wafer 8 in the circumferential direction. After that, the wafer 8 is transferred from the pre-aligner 14 to the ball mounting portion 4 by the transfer robot 13 (step S5).
  • the wafer 8 is transferred from the pre-aligner 14 to the second wafer stand 31 by the transfer robot 13, and the wafer 8 is further moved below the ball arrangement mask 34 by the second wafer transfer device 32.
  • the wafer is transferred to the wafer stage 33.
  • the wafer 8 is attracted to the upper surface 33a of the wafer stage 33 by setting the inside of the suction chamber 42 of the wafer stage 33 to have a negative pressure so that air is sucked from the air holes 41.
  • the ball arrangement mask 34 is lowered onto the upper surface of the wafer 8 and mounted (step S6).
  • the ball transfer unit 35 is moved onto the ball arrangement mask 34, and the ball 12 is supplied into the ball transfer unit 35. Then, the ball transfer unit 35 is rotated, and the ball transfer unit 35 is moved in the X direction and the Y direction along the ball arrangement mask 34 while the brush squeegee 36 sweeps the ball 12.
  • the ball transfer unit 35 By operating the ball transfer unit 35 in this way, as shown in FIG. 4, the ball 12 is transferred into the through hole 43 of the ball arrangement mask 34 (step S7). After being swung into the through hole 43, the ball 12 is pushed by another ball 12 from above, and adheres to the flux 11 in a state of being slightly pushed into the flux 11 printed on the electrode 8b.
  • the ball transfer portion 35 is moved out of the ball arrangement mask 34, and the excess balls 12 remaining on the ball arrangement mask 34 are removed by, for example, a suction device. .. Then, the ball arrangement mask 34 is pulled upward from the wafer 8 (step S8).
  • steps S5 to S8 correspond to the "ball mounting step" of the ball mounting method according to the present invention.
  • the dot diameter D of the flux 11 could be reduced to 60 ⁇ m or less as shown in FIG.
  • the inter-pitch L could be 100 ⁇ m or less.
  • the flux 11 is printed on the electrode 8b of the wafer 8 with high accuracy by the gravure offset printing method. Therefore, it is possible to provide a ball mounting method and a ball mounting device capable of mounting a high-definition ball.
  • the intaglio 24 for gravure offset is a planographic plate. Therefore, the flux 11 is transferred from the intaglio 24 to the blanket roll 19 with high accuracy without being distorted. Therefore, according to this embodiment, the flux 11 can be printed on the wafer 8 so that the printing accuracy is further improved.
  • the outer diameter ⁇ of the electrode of the wafer 8 is 30 ⁇ m
  • the pitch is 50 ⁇ m
  • the total pitch is 295 mm (in the effective area of the ⁇ 12 inch wafer)
  • the dot diameter is ⁇ 20 ⁇ m
  • the printing position accuracy is ⁇ 5 ⁇ m.
  • the flux 11 can be printed. That is, according to this embodiment, it is possible to realize printing with a dot diameter of 60 ⁇ m or less and a pitch of 100 ⁇ m or less, which is the maximum accuracy of conventional screen printing.
  • the gravure offset printing unit 3 performs gravure offset printing using the intaglio 24 for gravure offset printing made of lithographic plates.
  • the gravure offset printing unit 3 may be another gravure offset printing method using an intaglio plate other than a lithographic plate. Even in such a case, a step of transferring the ink material (flux 11) to the surface of the transfer body while contacting and rotating the transfer body (blanket roll 19) with the printed pattern portion of the intaglio plate which is not a lithographic plate, and the transfer body.
  • the ball mounting method of the present invention can be carried out by a step of crimping a printed matter (for example, a wafer 8) to transfer a printed pattern to the printed matter and a step of mounting the ball 12 on the printed matter.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Printing Methods (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne un procédé de montage de bille qui est destiné à monter une bille conductrice sur une électrode prédéfinie d'une plaquette (substrat). Le procédé consiste en un processus d'impression de flux (étapes S1-S4) qui est destiné à imprimer un flux sur l'électrode par impression par gravure-offset. Le procédé consiste également en un processus de montage de bille (étapes S5-S8) qui est destiné à monter une bille sur le flux.　Il est possible de mettre en œuvre un procédé de montage de bille qui permet un montage de bille de haute précision.
PCT/JP2020/038885 2020-10-15 2020-10-15 Procédé de montage de bille et dispositif de montage de bille WO2022079850A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202080106155.7A CN116508402A (zh) 2020-10-15 2020-10-15 球珠搭载方法以及球珠搭载装置
PCT/JP2020/038885 WO2022079850A1 (fr) 2020-10-15 2020-10-15 Procédé de montage de bille et dispositif de montage de bille
KR1020237011341A KR20230058520A (ko) 2020-10-15 2020-10-15 볼 탑재방법 및 볼 탑재장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/038885 WO2022079850A1 (fr) 2020-10-15 2020-10-15 Procédé de montage de bille et dispositif de montage de bille

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WO2022079850A1 true WO2022079850A1 (fr) 2022-04-21

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PCT/JP2020/038885 WO2022079850A1 (fr) 2020-10-15 2020-10-15 Procédé de montage de bille et dispositif de montage de bille

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WO (1) WO2022079850A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007324426A (ja) * 2006-06-02 2007-12-13 Hitachi Ltd パターン形成方法、導体配線パターン
JP2014073653A (ja) * 2012-10-05 2014-04-24 Komori Corp グラビアオフセット印刷方法
JP2019067991A (ja) * 2017-10-04 2019-04-25 アスリートＦａ株式会社 ボール配列用マスク、ボール搭載装置及びボール搭載方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5098434B2 (ja) 2007-05-21 2012-12-12 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP5574209B1 (ja) 2013-01-17 2014-08-20 Ｄｉｃ株式会社 グラビアオフセット印刷方法、グラビアオフセット印刷装置及びグラビア版

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007324426A (ja) * 2006-06-02 2007-12-13 Hitachi Ltd パターン形成方法、導体配線パターン
JP2014073653A (ja) * 2012-10-05 2014-04-24 Komori Corp グラビアオフセット印刷方法
JP2019067991A (ja) * 2017-10-04 2019-04-25 アスリートＦａ株式会社 ボール配列用マスク、ボール搭載装置及びボール搭載方法

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KR20230058520A (ko) 2023-05-03

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