WO2022077240A1 - Structure de dissipation de chaleur, caméra et véhicule aérien sans pilote - Google Patents

Structure de dissipation de chaleur, caméra et véhicule aérien sans pilote Download PDF

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Publication number
WO2022077240A1
WO2022077240A1 PCT/CN2020/120708 CN2020120708W WO2022077240A1 WO 2022077240 A1 WO2022077240 A1 WO 2022077240A1 CN 2020120708 W CN2020120708 W CN 2020120708W WO 2022077240 A1 WO2022077240 A1 WO 2022077240A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
circuit board
dissipation structure
heat
air inlet
Prior art date
Application number
PCT/CN2020/120708
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English (en)
Chinese (zh)
Inventor
杜俊
飯沼大
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN202080017478.9A priority Critical patent/CN113508571A/zh
Priority to PCT/CN2020/120708 priority patent/WO2022077240A1/fr
Publication of WO2022077240A1 publication Critical patent/WO2022077240A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D47/00—Equipment not otherwise provided for
    • B64D47/08—Arrangements of cameras
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present application relates to the field of camera devices, and in particular, to a heat dissipation structure, a camera with the heat dissipation structure, and an unmanned aerial vehicle with the camera.
  • a camera in the related art includes a lens assembly and a heat dissipation structure, and the heat dissipation structure is provided with a circuit board.
  • the camera has the following shortcomings in specific applications:
  • the heat dissipation air inlet of the heat dissipation structure is directly external, so that when it is used in an environment with water splashes, it is easy to inhale water droplets, which affects the service life of the electrical components inside the heat dissipation structure.
  • the embodiments of the present application provide a heat dissipation structure, which can improve the heat dissipation effect, and has a simple structure and low heat dissipation power consumption.
  • a heat dissipation structure which includes a casing, a first circuit board, a second circuit board and a fan, wherein the casing is formed with an inner cavity, a first air inlet communicating with the inner cavity, an air outlet communicated with the inner cavity, the first circuit board, the second circuit board and the fan are all arranged in the inner cavity, and the first circuit board and the second circuit board spaced and oppositely arranged, an air duct communicating with the air outlet is formed between the first circuit board and the second circuit board, and the fan is arranged between the first air inlet and the air duct for guiding air from the first air inlet into the air duct.
  • an embodiment of the present application provides a camera, which includes a lens assembly and the above-mentioned heat dissipation structure, wherein the lens assembly is disposed at one end of the heat dissipation structure.
  • embodiments of the present application provide an unmanned aerial vehicle, which includes a body and the aforementioned camera, where the camera is mounted on the body.
  • an air duct is formed between the first circuit board and the second circuit board, and external air is driven by a fan to blow into the air duct from the first air inlet, so as to prevent The hot air in the air duct is discharged from the air outlet, thereby realizing the effect of using one fan to dissipate heat for two circuit boards at the same time.
  • the heat dissipation structure provided in the embodiment of the present application is applied to the camera of the unmanned aerial vehicle, it can be beneficial to prolong the endurance time of the unmanned aerial vehicle.
  • FIG. 1 is a three-dimensional schematic diagram of a heat dissipation structure provided by an embodiment of the present application
  • Fig. 2 is the sectional schematic diagram of A-A in Fig. 1;
  • Fig. 3 is the partial enlarged schematic diagram of B place in Fig. 2;
  • Fig. 4 is the assembly schematic diagram one of the first circuit board, the first heat sink, the heat conduction component and the image sensor provided by the embodiment of the present application;
  • FIG. 5 is a second assembly schematic diagram of a first circuit board, a first heat sink, a thermally conductive component, and an image sensor provided by an embodiment of the present application;
  • FIG. 6 is an assembly schematic diagram of a first circuit board, a first heat sink, a thermally conductive support, and a thermally conductive sheet provided by an embodiment of the present application;
  • FIG. 7 is an assembly schematic diagram of a second circuit board and a second heat sink provided by an embodiment of the present application.
  • FIG. 8 is an assembly schematic diagram of a rear case and a third radiator provided by an embodiment of the present application.
  • FIG. 9 is an exploded schematic diagram 1 of a rear case and a third radiator provided by an embodiment of the present application.
  • FIG. 10 is a second exploded schematic diagram of the rear case and the third radiator provided by the embodiment of the present application.
  • FIG. 11 is a schematic diagram of the composition of the first circuit board and the second circuit board provided by the embodiment of the present application.
  • FIG. 12 is a schematic perspective view of an unmanned aerial vehicle provided by an embodiment of the present application.
  • the heat dissipation structure 100 is applied to the camera 10 , and includes a casing 110 , a first circuit board 120 , a second circuit board 130 and a fan 140 ;
  • the casing 110 is formed with an inner cavity 111 , the first air inlet 112 communicated with the inner cavity 111, the air outlet 113 communicated with the inner cavity 111;
  • the first circuit board 120, the second circuit board 130 and the fan 140 are all arranged in the inner cavity 111, and the first circuit board 120 and the second circuit board 130 are spaced apart and arranged opposite to each other, an air duct 114 communicating with the air outlet 113 is formed between the first circuit board 120 and the second circuit board 130 , and the fan 140 is arranged at the first air inlet 112 and the air duct 114 for guiding the air from the first air inlet 112 into the air duct 114 .
  • both the first circuit board 120 and the second circuit board 130 generate heat.
  • a fan 140 is used to dissipate heat for the two circuit boards (ie, the first circuit board 120 and the second circuit board 130 ) at the same time.
  • the heat dissipation effect is good, and compared with the solution of using two fans 140 to dissipate heat for two circuit boards, the heat dissipation structure 100 of this embodiment has the characteristics of compact structure, simple structure, low heat dissipation power consumption, and low weight.
  • the external air is drawn into the inner cavity 111 from the first air inlet 112 , and is guided into the air duct 114 between the first circuit board 120 and the second circuit board 130 to displace the air duct 114
  • the heat inside is taken away from the air outlet 113 , so as to achieve the effect of dissipating heat for the first circuit board 120 and the second circuit board 130 at the same time.
  • the heat dissipation structure 100 further includes a first heat sink 150 , and the first circuit board 120 has a first side surface 121 facing the air duct 114 and a first side surface facing away from the air duct 114 .
  • the first radiator 150 is disposed between the first side surface 121 and the air duct 114 , and the first radiator 150 abuts against the first side surface 121 .
  • the first side surface 121 of the first circuit board 120 is set to fit with the first heat sink 150, so that the heat of the first side surface 121 can be quickly conducted to the first heat sink 150, thereby facilitating the improvement of the first circuit Heat dissipation efficiency of the board 120 .
  • the heat generated by the first side surface 121 is conducted to the first radiator 150 , the air flowing in the air duct 114 exchanges heat with the first radiator 150 , and the first radiator 150 The heat is taken away, so as to achieve the purpose of dissipating heat to the first circuit board 120 .
  • the main heat generating device on the first circuit board 120 is disposed on the first side surface 121 , so that the heat dissipation effect and heat dissipation efficiency of the first circuit board 120 can be improved by the first heat sink 150 .
  • the side of the first radiator 150 facing the air duct 114 is formed with a plurality of first ribs 153 arranged at intervals, which is beneficial to increase the size of the air between the first radiator 150 and the air. Therefore, the heat dissipation effect and heat dissipation efficiency of the first heat sink 150 are improved.
  • the heat dissipation structure 100 further includes a thermally conductive component 160 , and the thermally conductive component 160 extends from the second side surface 122 to connect to the first heat sink 150 for connecting the second side surface.
  • the heat of 122 is conducted to the first heat sink 150 .
  • the first circuit board 120 is sandwiched between the heat-conducting component 160 and the first heat sink 150.
  • the front and back sides of the first circuit board 120 ie, the first The heat of the side surface 121 and the second side surface 122
  • the first heat sink 150 for heat dissipation, thereby effectively improving the heat dissipation efficiency of the first circuit board 120 .
  • the thermally conductive assembly 160 includes a thermally conductive plate 161 and a thermally conductive support 162 , and the thermally conductive plate 161 has a first side 1611 facing away from the first circuit board 120 and facing The second side portion 1612 of the first circuit board 120 is stacked on the second side portion 122 , and the thermally conductive support 162 extends from the first side portion 1611 to connect to the first heat sink 150 .
  • the thermally conductive component 160 is stacked on the second side surface 122 through the thermally conductive plate 161 , and is connected to the thermally conductive plate 161 and the first heat sink 150 through the thermally conductive support 162 , so as to improve the contact area between the thermally conductive component 160 and the first circuit board 120 , so as to improve the heat dissipation efficiency of the second side surface 122 .
  • the heat dissipation structure 100 further includes an image sensor 170 , and the image sensor 170 abuts against the first side portion 1611 .
  • the image sensor 170 is used to collect image signals of the lens assembly 200 and transmit them to the first circuit board 120 .
  • the image sensor 170 is set to abut against the first side portion 1611 , so that the heat generated by the image sensor 170 during operation can be conducted to the first heat sink 150 through the heat-conducting component 160 , thereby helping to improve the performance of the image sensor 170
  • the heat dissipation effect and heat dissipation efficiency are improved, and an additional independent heat dissipation device is not required to dissipate heat for the image sensor 170 .
  • the first side portion 1611 is formed with a groove 1613 , and the image sensor 170 is installed in the groove 1613 .
  • the arrangement of the grooves 1613 is beneficial to improve the compactness of the heat dissipation structure 100 on the one hand, and to improve the heat conduction effect of the heat conduction component 160 on the image sensor 170 on the other hand.
  • the first circuit board 120 is provided with through holes 123 extending from the first side surface 121 toward the second side surface 122 .
  • 150 includes a heat sink body 151 located between the first side surface 121 and the air duct 114 and a boss 152 extending from the heat sink body 151 through the through hole 123 and extending to abut against the second side portion 1612 .
  • the first rib 153 is formed on the side of the radiator body 151 facing the air duct 114 .
  • the arrangement of the bosses 152 can make the heat in the middle portion of the heat-conducting plate 161 be directly conducted to the first heat sink 150 , thereby helping to improve the heat-dissipating efficiency of the heat-conducting plate 161 .
  • the thermally conductive assembly 160 further includes a thermally conductive sheet 163 , and both ends of the thermally conductive sheet 163 abut against the first heat sink 150 and the second side surface 122 respectively for use in The heat of the second side surface 122 is conducted to the first heat sink 150 .
  • the disposition of the heat conducting sheet 163 can further improve the heat dissipation efficiency of the second side surface 122 .
  • the thermally conductive support 162 and the thermally conductive sheet 163 respectively cover at least part of the edges of the first circuit board 120 from the periphery of the first circuit board 120 .
  • at least a part of the heat of each circumferential edge of the first circuit board 120 can be directly conducted to the first heat sink 150 through the heat conducting component 160 for heat dissipation, thereby improving the heat dissipation efficiency of the first circuit board 120 and reducing the The heat diffused from the edge of the first circuit board 120 to the surrounding.
  • the first circuit board 120 includes a first edge 124 , a second edge 125 , a third edge 126 and a fourth edge 127 , the first edge 124 and the fourth edge 127 .
  • the second edge 125 is arranged oppositely
  • the third edge 126 and the fourth edge 127 are arranged oppositely
  • the thermally conductive support 162 covers at least part of the first edge 124 , at least part of the second edge 125 , and at least part of the third edge 126
  • the thermally conductive sheet 163 covers at least part of the fourth edge 127 .
  • the thermally conductive bracket 162 is formed with an opening 1621 toward the fourth edge 127 , and the first circuit board 120 and the thermally conductive plate 161 can be installed in and removed from the thermally conductive bracket 162 from the opening 1621 .
  • the thermally conductive sheet 163 is a graphite sheet, which has high heat dissipation efficiency, small footprint and light weight.
  • the heat dissipation structure 100 further includes a second heat sink 180
  • the second circuit board 130 has a third side surface 131 facing the air duct 114 and a third side surface facing away from the air duct 114 .
  • the second radiator 180 is disposed between the third side 131 and the air duct 114 , and the second radiator 180 abuts against the third side 131 .
  • the third side surface 131 is attached to the second heat sink 180 , so that the heat of the second circuit board 130 can be conducted to the second heat sink 180 for heat dissipation, thereby improving the heat dissipation efficiency of the second circuit board 130 .
  • the fourth side surface 132 abuts on the inner wall of the inner cavity 111 , so that the fourth side surface 132 can be attached to the housing 110 to dissipate heat, thereby helping to improve the second Heat dissipation efficiency and heat dissipation effect of the circuit board 130 .
  • the heating power of the third side 131 is greater than the heating power of the fourth side 132 , that is, the third side 131 is the side with higher heating power of the second radiator 180 (components with higher heating power are located on the third side 131 ). ), the fourth side 132 is the side with lower heating power of the second radiator 180 , which is beneficial to improve the heat dissipation efficiency of the second circuit board 130 through the second radiator 180 and the air duct 114 .
  • the second radiator 180 is formed with a plurality of second ribs 181 arranged at intervals, which is beneficial to increase the contact area between the second radiator 180 and the air, thereby increasing the contact area between the second radiator 180 and the air. It is beneficial to improve the heat dissipation effect and heat dissipation efficiency of the second heat sink 180 .
  • the heat dissipation structure 100 further includes a third radiator 190 , and the third radiator 190 is connected to the housing 110 and covers the first air inlet 112
  • the third radiator 190 includes a shielding portion 191 disposed opposite to the first air inlet 112 and covering the first air inlet 112, and a connecting portion 192 bent and extended from the edge of the shielding portion 191 to connect to the housing 110.
  • the connecting portion 192 is formed on There is a second air inlet 1921 for communicating with the first air inlet 112 for outside air to enter the first air inlet 112 .
  • the arrangement of the third heat sink 190 can cover the first air inlet 112 on the one hand, so that the first air inlet 112 on the casing 110 forms a hidden design, which is beneficial to improve the waterproof performance of the heat dissipation structure 100 and beautify the appearance of the heat dissipation structure 100 ; On the other hand, it is beneficial to improve the heat dissipation effect of the casing 110 .
  • the external air enters the space enclosed by the third radiator 190 and the casing 110 from the second air inlet 1921 , then enters the casing 110 through the first air inlet 112 , and is guided by the fan 140 .
  • the air is sent to the air duct 114, and after heat exchange with the first radiator 150 and the second radiator 180, it is blown out of the air outlet 113 from the air outlet 113, thereby completing a cycle of external air entering the heat dissipation structure 100 for heat exchange.
  • the casing 110 includes a front casing 115 and a rear casing 116 , and the front casing 115 and the rear casing 116 are enclosed to form an inner cavity 111 .
  • Both the air outlet 112 and the air outlet 113 are formed on the rear case 116 , and the connecting portion 192 is connected to the rear case 116 .
  • both the first air inlet 112 and the air outlet 113 are arranged on the rear shell 116, which has a compact structure and is convenient for production; of course, in specific applications, as an alternative embodiment, the air outlet 113 can also be arranged on the front case 115.
  • the fan 140 is a centrifugal fan, and the centrifugal fan uses centrifugal force to throw the fluid from the circumferential direction after inhaling the fluid from the axial direction of the fan. out the fan.
  • the rear shell 116 has a shell front 1161 facing the front shell 115 , a shell back 1162 facing away from the front shell 115 , and a shell side 1163 extending from the shell back 1162 to connect the shell front 1161 , the first air inlet 112 It is formed on the side part 1163 of the casing, the back 1162 of the casing is formed with a first cavity 1164, the front part 1161 of the casing is formed with a second cavity 1165, and the first air inlet 112 is formed in the first cavity 1164 and the second cavity 1164.
  • the first cavity 1164 and the second cavity 1165 are connected between the cavities 1165; the shielding part 191 covers the first cavity 1164, the connecting part 192 extends from the shielding part 191 into the first cavity 1164, and the second air inlet 1921 is used for
  • the front case 115 covers the second cavity 1165 and encloses the second cavity 1165 to form an inner cavity 111 .
  • the first air inlet 112 is arranged on the back 1162 of the casing, and the air outlet 113 is arranged on the side 1163 of the casing, which is beneficial to improve the compactness of the heat dissipation structure 100 and prevent interference between the air intake and the air outlet.
  • the first air inlet 112 is formed between the first cavity 1164 and the second cavity 1165 of the rear case 116, and the first air inlet 112 is shielded by the shielding portion 191 of the third radiator 190, the first air inlet 112 is realized.
  • the hidden design of the air inlet 112 makes the outside air enter the inner cavity 111 along a curved path, so that the splash of rainwater or other water droplets will be blocked by the third radiator 190, thereby effectively increasing the heat dissipation
  • the waterproof performance of the structure 100 can meet the IPX3 waterproof level; on the other hand, people cannot directly see the first air inlet 112, so that the appearance of the heat dissipation structure 100 is more integrated and more beautiful.
  • two connecting portions 192 are provided, and the two connecting portions 192 are respectively provided on opposite sides of the shielding portion 191, so as to not only ensure the reliability of the connection between the third radiator 190 and the rear case 116, but also facilitate the It is ensured that the third radiator 190 has a larger air intake area.
  • the side of the third radiator 190 facing away from the housing 110 is formed with a plurality of third ribs 193 arranged at intervals, which facilitates The contact area between the third radiator 190 and the air is increased, so as to improve the heat dissipation effect of the third radiator 190 .
  • the second air inlet 1921 is hollowed out and formed between the ends of any two adjacent third ribs 193 .
  • the first radiator 150, the second radiator 180 and the third radiator 190 are all made of materials with better thermal conductivity, which is beneficial to ensure the heat dissipation of the first radiator 150, the second radiator 180 and the third radiator thermal conductivity of the device 190.
  • the first radiator 150 , the second radiator 180 and the third radiator 190 are made of aluminum material, so on the one hand, it is beneficial to protect the first radiator 150 and the second radiator 180 and the third radiator 190; on the other hand, it is beneficial to make the weight of the first radiator 150, the second radiator 180 and the third radiator 190 smaller.
  • the first circuit board 120 includes a first input unit 128 for receiving the initial image signal and a first output unit 129 for transmitting the initial image signal to the second circuit board 130 .
  • the second circuit board 130 includes a second input unit 133 for receiving the initial image signal transmitted by the first circuit board 120, a processing unit 134 for processing the initial image signal, a power management unit 135 for managing power signals, and a power management unit 135 for outputting The second output unit 136 of the processing result of the processing unit 134 .
  • the first circuit board 120 is a sensor circuit board (ie, a sensor circuit board), which is used to control the transmission of the initial image signal.
  • the second circuit board 130 is a main control circuit board, which is used to control the processing of image signals, the external output of the image signals of the camera 10 and the management of power supply.
  • an embodiment of the present application further provides a camera 10 , which includes a lens assembly 200 and the above-mentioned heat dissipation structure 100 .
  • the lens assembly 200 is disposed at one end of the heat dissipation structure 100 . Since the camera 10 provided in this embodiment adopts the above-mentioned heat dissipation structure 100 , the bad phenomenon of image noise and deterioration of image quality caused by the serious heat generation of the circuit board in the camera 10 when the camera 10 is used in a high temperature environment is avoided, and
  • the camera 10 has the characteristics of compact structure, low heat dissipation and power consumption, and low weight.
  • the camera 10 provided in this embodiment is used to implement a surveying and mapping function, and the heat dissipation structure 100 provided in this embodiment of the present application is applied to the surveying and mapping camera 10, which can greatly improve the heat dissipation effect of the surveying and mapping camera 10, and can make the surveying and mapping camera 10
  • the heat dissipation power consumption is small and the weight is small, which is convenient for long-term surveying and mapping.
  • an embodiment of the present application further provides an unmanned aerial vehicle, which includes a body 20 and the aforementioned camera 10 , and the camera 10 is mounted on the body 20 . Since the unmanned aerial vehicle provided in this embodiment adopts the above-mentioned camera 10 , the battery life of the unmanned aerial vehicle can be guaranteed on the premise of ensuring the heat dissipation effect of the camera 10 .

Abstract

L'invention concerne une structure de dissipation de chaleur, une caméra et un véhicule aérien sans pilote. La structure de dissipation de chaleur comprend un boîtier, une première carte de circuit imprimé, une seconde carte de circuit imprimé et un ventilateur. Le boîtier est formé avec une cavité interne, une première entrée d'air en communication avec la cavité interne, et une sortie d'air en communication avec la cavité interne ; la première carte de circuit imprimé, la seconde carte de circuit imprimé et le ventilateur sont tous disposés dans la cavité interne, la première carte de circuit imprimé et la seconde carte de circuit imprimé sont agencées selon un intervalle et de façon à être opposées, un conduit d'air en communication avec la sortie d'air est formé entre la première carte de circuit imprimé et la seconde carte de circuit imprimé, et le ventilateur est disposé entre la première entrée d'air et le conduit d'air de façon à guider l'air de la première entrée d'air jusque dans le conduit d'air. La structure de dissipation de chaleur utilise un seul ventilateur pour dissiper la chaleur pour deux cartes de circuit en même temps, et elle présente un bon effet de dissipation de chaleur, une structure simple et compacte, une faible consommation d'énergie de dissipation de chaleur et un faible poids. L'application de la structure de dissipation de chaleur à une caméra d'un véhicule aérien sans pilote peut faciliter la prolongation de l'endurance du véhicule aérien sans pilote.
PCT/CN2020/120708 2020-10-13 2020-10-13 Structure de dissipation de chaleur, caméra et véhicule aérien sans pilote WO2022077240A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202080017478.9A CN113508571A (zh) 2020-10-13 2020-10-13 散热结构、相机及无人飞行器
PCT/CN2020/120708 WO2022077240A1 (fr) 2020-10-13 2020-10-13 Structure de dissipation de chaleur, caméra et véhicule aérien sans pilote

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/120708 WO2022077240A1 (fr) 2020-10-13 2020-10-13 Structure de dissipation de chaleur, caméra et véhicule aérien sans pilote

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WO2022077240A1 true WO2022077240A1 (fr) 2022-04-21

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CN (1) CN113508571A (fr)
WO (1) WO2022077240A1 (fr)

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CN115134503A (zh) * 2022-08-30 2022-09-30 苏州次源科技服务有限公司 一种高效散热的运动图像传感器

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JP2009071722A (ja) * 2007-09-14 2009-04-02 Olympus Imaging Corp 電子カメラ
CN105744106A (zh) * 2014-12-25 2016-07-06 立志凯株式会社 图像读取装置
CN110139544A (zh) * 2016-09-26 2019-08-16 深圳市大疆创新科技有限公司 散热机构及具有该散热机构的无人飞行器
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Publication number Priority date Publication date Assignee Title
CN115134503A (zh) * 2022-08-30 2022-09-30 苏州次源科技服务有限公司 一种高效散热的运动图像传感器
CN115134503B (zh) * 2022-08-30 2022-11-01 苏州次源科技服务有限公司 一种高效散热的运动图像传感器

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