WO2022071319A1 - Feuille de commande d'ondes électromagnétiques - Google Patents

Feuille de commande d'ondes électromagnétiques Download PDF

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Publication number
WO2022071319A1
WO2022071319A1 PCT/JP2021/035647 JP2021035647W WO2022071319A1 WO 2022071319 A1 WO2022071319 A1 WO 2022071319A1 JP 2021035647 W JP2021035647 W JP 2021035647W WO 2022071319 A1 WO2022071319 A1 WO 2022071319A1
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conductive pattern
electromagnetic wave
layer
ghz
base material
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PCT/JP2021/035647
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English (en)
Japanese (ja)
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昌也 戸▲高▼
大雅 松下
章悟 杉浦
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リンテック株式会社
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Priority to JP2022554012A priority Critical patent/JPWO2022071319A1/ja
Publication of WO2022071319A1 publication Critical patent/WO2022071319A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to an electromagnetic wave control sheet.
  • This application claims priority based on Japanese Patent Application No. 2020-165243 filed in Japan on September 30, 2020, the contents of which are incorporated herein by reference.
  • the electromagnetic wave control sheet that selectively absorbs electromagnetic waves of a predetermined frequency.
  • the electromagnetic wave control sheet includes, for example, a first frequency selective shielding layer and a second frequency selective shielding layer.
  • each layer absorbs an electromagnetic wave having a predetermined frequency by a thin line pattern of an FSS (Freequency Selective Surface) element formed on the first frequency selective shielding layer and the second frequency selective shielding layer.
  • FSS Freequency Selective Surface
  • TOM molding is a molding method that enhances design and functionality by laminating a special film on the surface of articles having various three-dimensional shapes.
  • Patent Document 1 describes an electromagnetic wave shielding film used for covering unevenness of 500 ⁇ m and having a storage elastic modulus of 2.0 ⁇ 105 MPa to 2.0 ⁇ 10 8 MPa at 150 ° C. ing.
  • Patent Document 2 describes numerical values of Young's modulus and relative permittivity with respect to an electromagnetic wave absorber that can be attached to an uneven surface.
  • Patent Document 1 has a problem of poor moldability because it has a high storage elastic modulus. Since Patent Document 2 does not describe the storage elastic modulus and the glass transition temperature of the electromagnetic wave absorber, there is a problem that the moldability of the electromagnetic wave absorber described in Patent Document 2 is poor.
  • the present invention has been made in view of the above circumstances, and is attached to an electromagnetic wave control sheet that can be molded into a three-dimensional shape by TOM molding at around 120 ° C., and further to an article having a curved surface at the same time as molding the sheet. It is an object of the present invention to provide an electromagnetic wave control sheet which can be used.
  • the present invention provides the following electromagnetic wave control sheet.
  • a dielectric layer and a conductive pattern provided on the dielectric layer are provided, the length of the long side of the conductive pattern is 2 mm or less, and the glass transition temperature of the dielectric layer is 30 ° C. to 120 ° C.
  • the electromagnetic wave control sheet according to [1] which has a base material layer provided with a reflective layer arranged on the back surface side of the dielectric layer, and the conductive pattern is provided on the base material layer.
  • the conductive pattern includes a first conductive pattern, a second conductive pattern, and a third conductive pattern, and the amount of electromagnetic waves absorbed by the first conductive pattern is maximized in the range of 20 GHz to 110 GHz.
  • the frequency indicating the value is A [GHz]
  • the frequency indicating the maximum value of the absorption amount of the electromagnetic wave absorbed by the second conductive pattern is B [GHz] satisfying the following formula (1).
  • the electromagnetic wave control according to any one of [1] to [3], wherein the frequency at which the absorption amount of the electromagnetic wave absorbed by the third conductive pattern shows the maximum value is C [GHz] satisfying the following formula (2). Sheet.
  • the first conductive pattern has a plurality of first arrays in which a plurality of first units having the same shape are arranged, and the second conductive pattern has the same shape as each other.
  • the third conductive pattern has a plurality of second arrays in which a plurality of second units, which are the figures of the above, are arranged, and the third conductive pattern has a plurality of third units in which a plurality of third units having the same shape as each other are arranged.
  • the electromagnetic wave control according to [4] which has a plurality of sequences of 3 and is arranged on the substrate so that the first sequence, the second sequence, and the third sequence are adjacent to each other. Sheet.
  • an electromagnetic wave control sheet that can be molded into a three-dimensional shape by TOM molding at around 120 ° C., and further, an electromagnetic wave control sheet that can be attached to an article having a curved surface at the same time as molding the sheet. can do.
  • An electromagnetic wave control sheet according to an embodiment of the present invention is schematically shown, and is a cross-sectional view of a surface of the electromagnetic wave absorber along the thickness.
  • An electromagnetic wave control sheet according to an embodiment of the present invention is schematically shown, and is a cross-sectional view of a surface of the electromagnetic wave absorber along the thickness. It is a top view which shows an example of the conduction pattern which constitutes the electromagnetic wave control sheet which concerns on one Embodiment of this invention. It is a top view which shows an example of the 1st conduction pattern which constitutes the electromagnetic wave control sheet which concerns on one Embodiment of this invention.
  • FIG. 3 is a cross-sectional view taken along the line VIII-VIII of FIG.
  • the "conductive pattern” is a collection of units that are geometric figures, and means an object that selectively absorbs electromagnetic waves of a certain frequency. It can be said that the “conductive pattern” has the same function as a so-called antenna.
  • the term “electromagnetic wave in the millimeter wave region” means an electromagnetic wave having a wavelength of 1 mm to 15 mm.
  • the “electromagnetic wave in the millimeter wave region” can be said to be an electromagnetic wave having a frequency of 20 GHz to 300 GHz.
  • "to” indicating a numerical range means that the numerical values described before and after the numerical range are included as the lower limit value and the upper limit value.
  • the electromagnetic wave control sheet of the present invention includes a dielectric layer and a conductive pattern provided on the dielectric layer.
  • the dielectric layer in the present invention is made of a dielectric material having an arbitrary dielectric constant.
  • the dielectric layer may be composed of only the base material layer or may be composed of the base material layer and the spacer layer, and refers to a dielectric material provided between the conductive pattern and the reflective layer. Further, a support constituting the reflective layer described later may be used as the dielectric layer.
  • the electromagnetic wave control sheet of the present invention may have one dielectric layer or two or more layers.
  • FIG. 1 and 2 schematically show an electromagnetic wave control sheet according to an embodiment of the present invention, and are sectional views of a surface of the electromagnetic wave control sheet along the thickness.
  • FIG. 1 is a diagram showing a case where the dielectric layer is a single layer.
  • FIG. 2 is a diagram showing a case where the dielectric layer is two layers.
  • the electromagnetic wave control sheet 10 according to the present embodiment includes a base material layer 20 and a conductive pattern 30.
  • the base material layer 20 is a dielectric layer (first dielectric layer).
  • the electromagnetic wave control sheet 10 according to the present embodiment may include a reflection layer 40 and a spacer layer 50.
  • the spacer layer 50 is a dielectric layer (second dielectric layer).
  • the conductive pattern 30 is arranged on one surface (surface) 20a of the base material layer 20.
  • the base material layer 20 is a dielectric layer.
  • the glass transition temperature of the base material layer 20 is 30 ° C to 120 ° C, preferably 40 ° C to 100 ° C, and more preferably 50 ° C to 80 ° C. If the glass transition temperature of the base material layer 20 is less than the above lower limit, the handleability of the electromagnetic wave control sheet is lowered. If the glass transition temperature of the base material layer 20 exceeds the above upper limit value, the adhesive force may decrease due to a heat load on the adhesive layer.
  • the glass transition temperature of the base material layer 20 is measured by a dynamic viscoelasticity measuring device (Dynamic Mechanical Analysis, DMA).
  • DMA Dynamic Mechanical Analysis
  • the storage elastic modulus of the base material layer 20 at 120 ° C. is 1.0 ⁇ 10 ⁇ 2 MPa to 1.0 ⁇ 10 3 MPa, and 1.0 ⁇ 10 -1 MPa to 7.5 ⁇ 10 2 MPa. It is preferably 1.0 MPa to 5.0 ⁇ 10 2 MPa, and more preferably 1.0 MPa to 5.0 ⁇ 10 2 MPa. If the storage elastic modulus of the base material layer 20 at 120 ° C. is less than the above lower limit, the handleability of the electromagnetic wave control sheet is lowered. When the storage elastic modulus of the base material layer 20 at 120 ° C. exceeds the above upper limit value, the TOM formability becomes poor.
  • the storage elastic modulus of the base material layer 20 is measured by a dynamic viscoelasticity measuring (Dynamic Mechanical Analysis, DMA) device.
  • DMA Dynamic Mechanical Analysis
  • the base material layer 20 is not particularly limited as long as it satisfies the glass transition temperature and the storage elastic modulus, but is composed of polyester, polyurethane, polymethylmethacrylate resin (PMMA) or vinyl chloride resin (PVC). Is preferable.
  • polyurethane include thermoplastic urethane and the like.
  • the thickness of the base material layer 20 is preferably 1 ⁇ m to 125 ⁇ m, more preferably 10 ⁇ m to 100 ⁇ m, and even more preferably 25 ⁇ m to 75 ⁇ m.
  • the thickness of the base material layer 20 is measured with a digital indicator manufactured by TECLOCK.
  • the thickness, dielectric constant, and magnetic permeability of the base material layer 20 can be appropriately set in consideration of further improvement of the electromagnetic wave absorption performance of the electromagnetic wave control sheet 10.
  • the base material layer 20 may be a layer having a high dielectric constant.
  • the thickness of the electromagnetic wave control sheet 10 can be made relatively thin.
  • the other surface (back surface) 20b of the base material layer 20 may be adhesive.
  • a release film covering the surface 20b may be provided. The release film is removed when the electromagnetic wave control sheet 10 is used.
  • the handleability at the time of distribution is improved.
  • the other surface 20b of the base material layer 20 is an adhesive layer containing an adhesive, the other surface 20b of the base material layer 20 can be made adhesive.
  • an adhesive examples include a heat-seal type adhesive that adheres by heat; an adhesive that is moistened to develop adhesiveness; and a pressure-sensitive adhesive (adhesive) that adheres by pressure.
  • a pressure-sensitive adhesive pressure sensitive adhesive
  • the pressure-sensitive adhesive include an acrylic pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, a silicone-based pressure-sensitive adhesive, and a polyvinyl ether-based pressure-sensitive adhesive.
  • at least one selected from the group consisting of an acrylic pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive and a rubber-based pressure-sensitive adhesive is preferable, and an acrylic-based pressure-sensitive adhesive is more preferable.
  • acrylic pressure-sensitive adhesive examples include the following acrylic polymers.
  • an acrylic polymer (1) containing a structural unit derived from an alkyl (meth) acrylate having a linear alkyl group or a branched alkyl group (that is, at least an alkyl (meth) acrylate as a monomer).
  • An acrylic polymer (2) containing a structural unit derived from a (meth) acrylate having a cyclic structure (that is, a polymer obtained by at least polymerizing a (meth) acrylate having a cyclic structure).
  • the acrylic polymer may be a homopolymer or a copolymer. When the acrylic polymer is a copolymer, the form of the copolymer is not particularly limited.
  • the acrylic copolymer may be a block copolymer, a random copolymer, or a graft copolymer.
  • Acrylic copolymer (Q) A structural unit derived from an alkyl (meth) acrylate having a chain alkyl group having 1 to 20 carbon atoms (hereinafter, referred to as "monomer component (q1')"). A copolymer containing q1) and a structural unit (q2) derived from a functional group-containing monomer (hereinafter, referred to as "monomer component (q2')").
  • the acrylic copolymer (Q) may further contain a structural unit (q1) and other structural units (q3) other than the structural unit (q2).
  • the structural unit (q3) is a structural unit derived from a monomer component (q3') other than the monomer component (q1') and the monomer component (q2').
  • the carbon number of the chain alkyl group contained in the monomer component (q1') is preferably 1 to 12, more preferably 4 to 8, and 4 to 6 from the viewpoint of improving the adhesive properties. Is more preferable.
  • Specific examples of the monomer component (q1') include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and the like. Examples thereof include lauryl (meth) acrylate, tridecyl (meth) acrylate, and stearyl (meth) acrylate.
  • butyl (meth) acrylate and 2-ethylhexyl (meth) acrylate are preferable, and butyl (meth) acrylate is more preferable. These may be used alone or in combination of two or more.
  • Examples of the monomer component (q2') include a hydroxy group-containing monomer, a carboxy group-containing monomer, an epoxy group-containing monomer, an amino group-containing monomer, a cyano group-containing monomer, a keto group-containing monomer, and an alkoxysilyl group-containing monomer. Can be mentioned. Among these, hydroxy group-containing monomers and carboxy group-containing monomers are preferable. Specific examples of the hydroxy group-containing monomer include, for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-.
  • Hydroxybutyl (meth) acrylate and the like can be mentioned. Among these, 2-hydroxyethyl (meth) acrylate is preferable.
  • Specific examples of the carboxy group-containing monomer include (meth) acrylic acid, maleic acid, fumaric acid, itaconic acid and the like, and (meth) acrylic acid is preferable.
  • Specific examples of the epoxy group-containing monomer include glycidyl (meth) acrylate and the like.
  • Specific examples of the amino group-containing monomer include diaminoethyl (meth) acrylate and the like.
  • Specific examples of the cyano group-containing monomer include acrylonitrile. These may be used alone or in combination of two or more.
  • Examples of the monomer component (q3') include cyclohexyl (meth) acrylate, benzyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, and dicyclo.
  • Examples thereof include (meth) acrylate having a cyclic structure such as pentenyloxyethyl (meth) acrylate, imide (meth) acrylate, and acryloylmorpholine; vinyl acetate; and styrene. These may be used alone or in combination of two or more.
  • the content of the structural unit (q1) is preferably 50% by mass to 99.5% by mass, preferably 55% by mass to 99% by mass, based on 100% by mass of the total structural unit of the acrylic copolymer (Q). %, More preferably 60% by mass to 97% by mass, and particularly preferably 65% by mass to 95% by mass.
  • the content of the structural unit (q2) is preferably 0.1% by mass to 50% by mass, preferably 0.5% by mass or more, based on 100% by mass of the total structural unit of the acrylic copolymer (Q). It is more preferably 40% by mass, further preferably 1.0% by mass to 30% by mass, and particularly preferably 1.5% by mass to 20% by mass.
  • the content of the structural unit (q3) is preferably 0 to 40% by mass, more preferably 0 to 30% by mass, based on 100% by mass of the total structural unit of the acrylic copolymer (Q). It is preferably 0 to 25% by mass, more preferably 0 to 20% by mass, and particularly preferably 0 to 20% by mass.
  • the acrylic copolymer may be crosslinked with a crosslinking agent.
  • the cross-linking agent include an epoxy-based cross-linking agent, an isocyanate-based cross-linking agent, an aziridine-based cross-linking agent, a metal chelate-based cross-linking agent, and the like.
  • a functional group derived from the monomer component (q2') can be used as a cross-linking point for reacting with the cross-linking agent.
  • the adhesive layer may be made of a material that is cured by energy rays such as ultraviolet rays, visible energy rays, infrared rays, and electron beams.
  • the adhesive layer contains an energy ray curable component.
  • the energy ray-curable component include, when the energy ray is ultraviolet rays, a compound having two or more ultraviolet-polymerizable functional groups in one molecule.
  • Specific examples of the compound having two or more ultraviolet-polymerizable functional groups in one molecule include trimethylolpropane tri (meth) acrylate, ethoxylated isocyanuric acid tri (meth) acrylate, and trimethylolpropane tetra (meth) acrylate.
  • Tetramethylolmethane Tetra (meth) acrylate pentaerythritol tri (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, caprolactone-modified dipentaerythritol hexa (meth) acrylate, 1, 4-butylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, dicyclopentadiene dimethoxydi (meth) acrylate, polyethylene glycol di (meth) acrylate, oligoester (meth) acrylate, urethane (meth) ) Acrylate oligomers, epoxy-modified (meth) acrylates, polyether (meth) acrylates and the like. These may be used alone or in combination of two or more.
  • the adhesive layer is energy ray curable
  • a photopolymerization initiator increases the curing rate.
  • Specific examples of the photopolymerization initiator include, for example, benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal, 2,4.
  • FIG. 3 is a top view showing an example of the electromagnetic wave control sheet of the present embodiment.
  • the electromagnetic wave control sheet 10 has a flat plate-shaped base material layer 20 and a conductive pattern 30 formed on one surface 20a of the base material layer 20.
  • the conductive pattern 30 includes a first conductive pattern 31, a second conductive pattern 32, and a third conductive pattern 33.
  • FIG. 4 is a top view showing the first conductive pattern 31.
  • the first conductive pattern 31 is composed of a plurality of first units u1.
  • Each of the first units u1 is a geometric figure. That is, it can be said that the first conductive pattern 31 is an aggregate of the first unit u1 which is a geometric figure.
  • Each of the first units u1 functions as one antenna.
  • the first conductive pattern 31 may be, for example, a fine wire pattern of an FSS element.
  • the first conductive pattern 31 a plurality of first sequences R1 in which the plurality of first units u1 are arranged along the direction indicated by the double-headed arrow P in FIG. 4 are formed. It can be said that the first conductive pattern 31 has a plurality of first arrays R1.
  • the first conductive pattern 31 can be configured by forming a plurality of first arrays R1 on the base material layer 20 at predetermined intervals along the direction indicated by the double-headed arrow P.
  • the spacing between the plurality of first sequences R1 is not particularly limited. The spacing between the first sequences R1 may be regular or irregular.
  • FIG. 5 is a top view showing the first unit u1.
  • FIG. 5 is a top view showing a first unit u1 constituting the first conductive pattern 31.
  • the shape of the first unit u1 is a vertically and horizontally symmetrical cross shape.
  • the first unit u1 has one cross portion S1 and four end portions T1.
  • the cross portion S1 is composed of a straight line portion parallel to the x-axis direction and a straight line portion parallel to the y-axis direction in FIG.
  • Each end T1 of a straight line is in contact with both ends of a straight line portion parallel to the x-axis direction and both ends of a straight line portion parallel to the y-axis direction so as to be orthogonal to each straight line portion.
  • the electromagnetic wave generated by the first unit u1 that functions as one antenna By adjusting the length L1 in the x-axis direction of the first unit u1 and the length W1 in the x-axis direction of each of the four ends T1, the electromagnetic wave generated by the first unit u1 that functions as one antenna.
  • the absorption characteristics can be adjusted.
  • the absorption characteristics of electromagnetic waves can be adjusted in the same manner in the y-axis direction.
  • the length L1 of the first unit u1 in the x-axis direction is defined as the length of the long side of the first unit u1.
  • the length L1 of the first unit u1 in the x-axis direction is 2 mm or less, preferably 1.5 mm or less. If the length L1 in the x-axis direction of the first unit u1 exceeds the above upper limit value, the absorption performance at a desired frequency is deteriorated, and the conductive pattern may be broken during TOM molding.
  • the shape of the first unit is not limited to the cross shape.
  • the shape of the first unit is not particularly limited as long as the value of the frequency at which the absorption amount of the electromagnetic wave absorbed by the first conductive pattern 31 shows the maximum value is A [GHz].
  • examples of the shape of the figure, which is the first unit include a circular shape, an annular shape, a linear shape, a rectangular shape, a polygonal shape, an H-shape, a Y-shape, a V-shape, and the like.
  • the shapes of the plurality of first units u1 are the same as each other. However, the shapes of the plurality of first units u1 do not have to be the same figure. In another example of the present invention, the shapes of the plurality of first units may be the same or different from each other as long as the effects of the present invention can be obtained.
  • the first conductive pattern 31 selectively absorbs an electromagnetic wave having a frequency of A [GHz].
  • the frequency value A [GHz] is a frequency value when the absorption amount of the electromagnetic wave absorbed by the first conductive pattern 31 shows a maximum value in the range of 20 GHz to 110 GHz.
  • the frequency value A [GHz] at which the absorption amount of the electromagnetic wave absorbed by the first conductive pattern 31 shows the maximum value can be specified by, for example, the following method X and method Y.
  • Method X The frequency of the electromagnetic wave when the electromagnetic wave is irradiated to the standard film described later while changing the frequency within the range of 20 GHz to 110 GHz and the absorption amount of the electromagnetic wave absorbed by the standard film reaches the maximum value is A [GHz].
  • Method Y From the electromagnetic wave control sheet having the base material layer and the plurality of conductive patterns formed on the base material layer, the conductive pattern is removed from the base material layer so that only a single conductive pattern remains. Next, the film having only a single conductive pattern is irradiated with electromagnetic waves while changing the frequency within the range of 20 GHz to 110 GHz, and the frequency of the electromagnetic waves when the absorption amount of the electromagnetic waves of the film reaches the maximum value is A [. GHz].
  • the standard film has a standard base material layer that is flat and has a standard pattern formed on the standard base material layer.
  • the details of the standard base material layer can be the same as those of the base material layer 20. Therefore, the details of the standard base material layer will be described in detail in the description of the base material layer 20 described later.
  • a standard pattern consists only of a plurality of standard units whose shapes are the same as each other.
  • a standard pattern consisting of only one type of figure having the same shape is formed on the standard base material layer.
  • the standard pattern can be formed by the fine line pattern of a normal FSS element.
  • the standard pattern is the same electromagnetic wave absorption pattern as the first conductive pattern 31.
  • the shapes of the plurality of standard units are not particularly limited as long as they are the same figure.
  • Examples of the shape of the figure which is a standard unit, include a circular shape, an annular shape, a linear shape, a square shape, a polygonal shape, a cross shape, an H shape, a Y shape, a V shape, and the like.
  • the shape of the standard unit is the same as the first unit u1.
  • a plurality of standard units are arranged on the standard base material layer so that the distance between the ends of the figure is 1 mm.
  • the standard unit figure is a cross shape
  • the intersection of the crosses is the center of the figure
  • the ends of the figure are the farthest from the center along each of the directions of the two straight lines that make up the cross. It is the part that is.
  • the material of the standard unit constituting the standard pattern is such that when the standard film is irradiated with electromagnetic waves while changing within the range of 20 GHz to 110 GHz, the absorption amount of the electromagnetic waves absorbed by the standard film can take the maximum value. However, it is not particularly limited. The details of the material of the standard unit can be the same as those of the first unit.
  • the amount of electromagnetic waves absorbed by the standard film can be calculated by the following formula (3).
  • Absorption amount input signal-reflection characteristic (S11) -transmission characteristic (S21) ...
  • the input signal is an index of the intensity of the electromagnetic wave at the irradiation source when the standard film is irradiated with the electromagnetic wave.
  • the reflection characteristic (S11) is an index of the intensity of the electromagnetic wave reflected by the standard film when the standard film is irradiated with the electromagnetic wave from the irradiation source.
  • the reflection characteristic (S11) can be measured by the free space method using, for example, a vector network analyzer.
  • the transmission characteristic (S21) is an index of the intensity of the electromagnetic wave transmitted through the standard film when the standard film is irradiated with the electromagnetic wave from the irradiation source.
  • the transmission characteristic (S21) can be measured by the free space method using, for example, a vector network analyzer.
  • the frequency A [GHz] can be specified by, for example, the following method.
  • the standard film is irradiated with electromagnetic waves while changing the frequency within the range of 20 GHz to 110 GHz, and the absorption amount of the electromagnetic waves absorbed by the standard film is calculated by the above formula (3).
  • the changed frequency is plotted on the horizontal axis, and the absorption spectrum diagram is created by plotting the absorption amount calculated by the above equation (3) on the vertical axis.
  • the frequency of the electromagnetic wave when the absorption amount of the electromagnetic wave reaches the maximum value can be set to A [GHz].
  • the frequency of the electromagnetic wave irradiating the standard film may be changed within a range narrower than 20 GHz to 110 GHz.
  • the frequency of the electromagnetic wave irradiating the standard film may be changed in the range of 50 GHz to 110 GHz.
  • the first conductive pattern 31 absorbs an electromagnetic wave having a frequency of A [GHz] specified by the above method X.
  • the frequency value A is preferably 50 GHz to 110 GHz, more preferably 60 GHz to 100 GHz, further preferably 65 GHz to 95 GHz, and 70 GHz to 90 GHz. Is particularly preferred.
  • the conductive pattern 30 can absorb electromagnetic waves in the millimeter wave region, and is applied to automobile parts, road peripheral members, building exterior wall-related materials, windows, communication equipment, radio telescopes, and the like. It becomes easy and easy.
  • the absorption amount of the electromagnetic wave of the film can be measured in the same manner as in the method X. That is, the film is irradiated with electromagnetic waves while changing the frequency within the range of 20 to 110 [GHz], and the absorption amount of the electromagnetic waves absorbed by the film is calculated by the above formula (3).
  • an absorption spectrum diagram is created in which the frequency is plotted on the horizontal axis and the absorption amount calculated by the above equation (3) is plotted on the vertical axis. Normally, in this absorption spectrum diagram, there is one value of the frequency at which the absorption amount becomes the maximum value on the horizontal axis. Therefore, in the plot diagram, a single peak is formed in which the amount of electromagnetic wave absorption is the maximum value. In this way, the frequency of the electromagnetic wave when the absorption amount of the electromagnetic wave reaches the maximum value can be set to A [GHz].
  • the material of the first unit u1 is not particularly limited as long as it is within the range in which the absorption of electromagnetic waves can be obtained.
  • Examples of the material of the first unit include a thin metal wire, a conductive thin film, and a fixing material of a conductive paste.
  • Metal materials include copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, or alloys containing two or more of these metals (for example, steel such as stainless steel and carbon steel, brass, phosphorus bronze, etc.). Examples thereof include zirconium-copper alloys, beryllium copper, iron-nickel, nichrome, nickel-titanium, cantal, hasteroi, and renium-tungsten.
  • Examples of the material of the conductive thin film include metal particles, carbon nanoparticles, carbon fiber and the like.
  • the distance between the ends of the figure, which is the first unit u1 is not particularly limited as long as the absorption of electromagnetic waves can be obtained.
  • the intervals between the ends of the figures, which are the first unit u1 may be the same or different from each other.
  • the distance between the ends of the figure, which is the first unit u1 is set. , Preferably identical to each other.
  • FIG. 6 is a top view showing the second conductive pattern 32.
  • the second conductive pattern 32 is composed of a plurality of second units u2.
  • Each of the second units u2 is a geometric figure. That is, it can be said that the second conductive pattern 32 is an aggregate of the second unit u2 which is a geometric figure.
  • Each of the second units u2 functions as one antenna.
  • the second conductive pattern 32 may be, for example, a fine wire pattern of an FSS element.
  • a second array R2 is formed in which a plurality of second units u2 are arranged along the direction indicated by the double-headed arrow P in FIG. It can be said that the second conductive pattern 32 has a plurality of second arrays R2.
  • the second conductive pattern 32 can be configured by forming the second array R2 on the base material layer 20 at predetermined intervals along the direction indicated by the double-headed arrow P.
  • the spacing between the plurality of second sequences R2 is not particularly limited. The spacing between the second sequences R2 may be regular or irregular.
  • FIG. 7 is a top view showing the second unit u2.
  • the shape of the second unit u2 is a vertically and horizontally symmetrical cross shape.
  • the second unit u2 has one cross section S2 and four end portions T2.
  • the cross portion S2 is composed of a straight line portion parallel to the x-axis direction and a straight line portion parallel to the y-axis direction in FIG. 7.
  • Each end T2 of a straight line is in contact with both ends of a straight line portion parallel to the x-axis direction and both ends of a straight line portion parallel to the y-axis direction so as to be orthogonal to each straight line portion.
  • the length L2 of the second unit u2 in the x-axis direction is shorter than the length L1 of the first unit u1 in the x-axis direction.
  • the length W2 of each of the four ends T2 in the x-axis direction or the y-axis direction is shorter than the length W1 of each of the four ends T1 of the first unit u1.
  • the length L2 of the second unit u2 in the x-axis direction is defined as the length of the long side of the second unit u2.
  • the length L2 of the second unit u2 in the x-axis direction is 2 mm or less, preferably 1.2 mm or less.
  • the shapes of the plurality of second units u2 are the same as each other. However, the shapes of the plurality of second units u2 do not have to be the same figure. In another example of the present invention, the shapes of the plurality of second units may be the same or different from each other as long as the effects of the present invention can be obtained.
  • the second conductive pattern 32 selectively absorbs an electromagnetic wave having a frequency of B [GHz] satisfying the following formula (1).
  • the frequency value B [GHz] is a frequency value when the absorption amount of the electromagnetic wave absorbed by the second conductive pattern 32 shows a maximum value.
  • the frequency value B [GHz] satisfies the following equation (1). 1.037 ⁇ A ⁇ B ⁇ 1.30 ⁇ A ... Equation (1)
  • the second conductive pattern 32 absorbs an electromagnetic wave having a frequency of 1.037 ⁇ A [GHz] to 1.30 ⁇ A [GHz].
  • the second conductive pattern 32 preferably absorbs an electromagnetic wave having a frequency of 1.17 ⁇ A [GHz] to 1.30 ⁇ A [GHz]. Since the second conductive pattern 32 absorbs electromagnetic waves having a frequency of 1.037 ⁇ A [GHz] or higher, the peak of the amount of electromagnetic waves absorbed by the second conductive pattern 32 in the frequency band higher than A [GHz]. The peak of the absorption amount of the electromagnetic wave by the first conductive pattern 31 sufficiently overlaps with the peak.
  • the frequency band of the electromagnetic wave that can be absorbed by the entire electromagnetic wave control sheet is extended to the frequency band on the higher frequency side than A [GHz] as compared with the film having the first conductive pattern 31 alone. Since the second conductive pattern 32 absorbs electromagnetic waves having a frequency of 1.30 ⁇ A [GHz] or less, the peak of the amount of electromagnetic waves absorbed by the second conductive pattern 32 in the frequency band higher than A [GHz]. The difference in frequency from the peak of the amount of electromagnetic wave absorbed by the first conductive pattern 31 is reduced. As a result, a single peak is formed in which the absorption amount of the electromagnetic wave absorbed by the entire electromagnetic wave control sheet becomes the maximum value.
  • the second conductive pattern 32 absorbs electromagnetic waves having a frequency of 1.037 ⁇ A [GHz] to 1.30 ⁇ A [GHz], the amount of electromagnetic waves absorbed by the entire electromagnetic wave control sheet is large. It is extended to the frequency band on the high frequency side.
  • the shape of the second unit is not limited to a cross shape.
  • the shape of the second unit is not particularly limited as long as it is within the range in which the absorption of electromagnetic waves can be obtained.
  • examples of the shape of the figure, which is the second unit include a circular shape, an annular shape, a linear shape, a rectangular shape, a polygonal shape, an H-shape, a Y-shape, a V-shape, and the like.
  • the material of the second unit constituting the second conductive pattern 32 is not particularly limited as long as it can absorb the electromagnetic wave of B [GHz], and is particularly limited as long as it is within the range where the electromagnetic wave absorption can be obtained. Not limited.
  • the material of the second unit is the same as the content described for the material of the first unit u1.
  • the distance between the ends of the figure, which is the second unit u2 is not particularly limited as long as the absorption of electromagnetic waves can be obtained.
  • the intervals between the ends of the figures, which are the second unit u2 may be the same or different from each other.
  • the distance between the ends of the figure, which is the second unit u2 is set. , Preferably identical to each other.
  • FIG. 8 is a top view showing the third conductive pattern 33.
  • the third conductive pattern 33 is composed of a plurality of third units u3.
  • Each of the third units u3 is a geometric figure. That is, it can be said that the third conductive pattern 33 is an aggregate of the third unit u3 which is a geometric figure.
  • Each of the third units u3 functions as one antenna.
  • the third conductive pattern 33 may be, for example, a fine wire pattern of an FSS element.
  • a third array R3 is formed in which a plurality of third units u3 are arranged along the direction indicated by the double-headed arrow P in FIG. It can be said that the third conductive pattern 33 has a plurality of third arrays R3.
  • the third conductive pattern 33 can be configured by forming the third array R3 on the base material layer 20 at predetermined intervals along the direction indicated by the double-headed arrow P.
  • the spacing between the plurality of third sequences R3 is not particularly limited. The spacing between the third sequences R3 may be regular or irregular.
  • FIG. 9 is a top view showing the third unit u3.
  • the shape of the third unit u3 is a vertically and horizontally symmetrical cross shape.
  • the third unit u3 has one cross section S3 and four end portions T3.
  • the cross section S3 is composed of a straight line portion parallel to the x-axis direction and a straight line portion parallel to the y-axis direction in FIG.
  • Each end T3 of a straight line is in contact with both ends of a straight line portion parallel to the x-axis direction and both ends of a straight line portion parallel to the y-axis direction so as to be orthogonal to each straight line portion.
  • the length L3 of the third unit u3 in the x-axis direction is longer than the length L1 of the first unit u1 in the x-axis direction.
  • the length W3 of each of the four ends T3 in the x-axis direction or the y-axis direction is longer than the length W1 of each of the four ends T1 of the first unit u1.
  • the length L3 in the x-axis direction of the third unit u3 is defined as the length of the long side of the third unit u3.
  • the length L3 of the third unit u3 in the x-axis direction is 2 mm or less, preferably 1.8 mm or less.
  • the shapes of the plurality of third units u3 are the same as each other. However, the shapes of the plurality of third units u3 do not have to be the same figure. In another example of the present invention, the shapes of the plurality of third units may be the same or different from each other as long as the effects of the present invention can be obtained.
  • the third conductive pattern 33 selectively absorbs an electromagnetic wave having a frequency of C [GHz] satisfying the following formula (2).
  • the frequency value C [GHz] is a frequency value when the absorption amount of the electromagnetic wave absorbed by the third conductive pattern 33 shows a maximum value.
  • the frequency value C [GHz] satisfies the following equation (2). 0.60 ⁇ A ⁇ C ⁇ 0.933 ⁇ A ... Equation (2)
  • the third conductive pattern 33 absorbs an electromagnetic wave having a frequency of 0.60 ⁇ A [GHz] to 0.933 ⁇ A [GHz].
  • the third conductive pattern 33 preferably absorbs an electromagnetic wave having a frequency of 0.60 ⁇ A [GHz] to 0.83 ⁇ A [GHz]. Since the third conductive pattern 33 absorbs electromagnetic waves having a frequency of 0.60 ⁇ A [GHz] or higher, the peak of the amount of electromagnetic waves absorbed by the third conductive pattern 33 in the frequency band lower than A [GHz]. The difference in frequency from the peak of the amount of electromagnetic wave absorbed by the first conductive pattern 31 is reduced. As a result, a single peak is formed in which the absorption amount of the electromagnetic wave absorbed by the entire conductive pattern 30 is the maximum value.
  • the third conductive pattern 33 absorbs electromagnetic waves having a frequency of 0.933 ⁇ A [GHz] or less, the peak of the amount of electromagnetic waves absorbed by the third conductive pattern 33 in a frequency band lower than A [GHz].
  • the peak of the absorption amount of the electromagnetic wave by the first conductive pattern 31 sufficiently overlaps with the peak.
  • the frequency band of the electromagnetic wave that can be absorbed by the entire electromagnetic wave control sheet is extended to the frequency band on the lower frequency side than A [GHz] as compared with the film having the first conductive pattern 31 alone.
  • the third conductive pattern 3 absorbs electromagnetic waves having a frequency of 0.60 ⁇ A [GHz] to 0.933 ⁇ A [GHz], the amount of electromagnetic waves absorbed by the entire conductive pattern 30 is large. It is extended to the frequency band on the low frequency side.
  • the shape of the third unit u3 is not limited to a cross shape.
  • the shape of the third unit u3 is not particularly limited as long as it is within the range in which the absorption of electromagnetic waves can be obtained.
  • examples of the shape of the figure which is the third unit include a circular shape, an annular shape, a linear shape, a square shape, a polygonal shape, an H shape, a Y shape, a V shape, and the like.
  • the material of the third unit u3 constituting the third conductive pattern 33 is not particularly limited as long as it can absorb the electromagnetic wave of C [GHz], and is within the range where the electromagnetic wave absorption can be obtained. Not particularly limited.
  • the material of the third unit u3 is the same as the content described for the material of the first unit u1.
  • the distance between the ends of the figure, which is the third unit u3, is not particularly limited as long as the absorption of electromagnetic waves can be obtained.
  • the intervals between the ends of the figures, which are the third unit u3, may be the same or different from each other.
  • the distance between the ends of the figure, which is the third unit u3, is set. , Preferably identical to each other.
  • the first array R1, the second array R2, and the third array R3 are arranged along the direction indicated by the double-headed arrow P so as to be adjacent to each other.
  • the first conductive pattern 31 is selectively absorbed.
  • the frequency band of the electromagnetic wave selectively absorbed by the second conductive pattern 32 and the frequency of the electromagnetic wave selectively absorbed by the third conductive pattern 33 based on the value A [GHz] of the frequency of the peak position of the electromagnetic wave. Both bands overlap.
  • the absorption region of the electromagnetic wave absorbed by the entire conductive pattern 30 is likely to be expanded to both the high frequency side and the low frequency side with reference to the frequency value A [GHz] at the peak position.
  • the intervals d3 of may be the same as or different from each other.
  • the interval d1 may be, for example, 0.2 mm to 4 mm, 0.3 mm to 2 mm, or 0.5 mm to 1 mm.
  • the interval d2 may be, for example, 0.2 mm to 4 mm, 0.3 mm to 2 mm, or 0.5 mm to 1 mm.
  • the interval d3 may be, for example, 0.2 mm to 4 mm, 0.3 mm to 2 mm, or 0.5 mm to 1 mm.
  • the absorption range of the electromagnetic wave absorbed by the entire conductive pattern 30 is more likely to be expanded with reference to the frequency value A [GHz] at the peak position. ..
  • the shapes of the first unit u1, the second unit u2, and the third unit u3 are the same as each other.
  • the shapes of the first unit u1, the second unit u2, and the third unit u3 do not have to be the same figure. That is, in another example of the present invention, the shapes of the first unit u1, the second unit u2, and the third unit u3 may be the same or different from each other.
  • the conductive pattern 30 may have a plurality of second conductive patterns 32.
  • the conductive pattern 30 may further have the following conductive patterns 32a and 32b in addition to the second conductive pattern 2.
  • Electromagnetic wave absorption pattern 32a A conductive pattern in which the value of the frequency at which the absorption amount of the absorbed electromagnetic wave shows the maximum value is D [GHz] satisfying the following equation (4).
  • Electromagnetic wave absorption pattern 32b A conductive pattern in which the value of the frequency at which the absorption amount of the absorbed electromagnetic wave shows the maximum value is E [GHz] satisfying the following formula (5).
  • 1.037 ⁇ A ⁇ D ⁇ 1.09 ⁇ A ... Equation (4) 1.09 ⁇ A ⁇ E ⁇ 1.17 ⁇ A ... Equation (5)
  • A is the frequency [GHz] specified by the above method X or the above method Y.
  • the conductive pattern 30 may have a plurality of third conductive patterns.
  • the conductive pattern 30 may further have the following conductive pattern 33a and the conductive pattern 33b in addition to the third conductive pattern 33.
  • Conductive pattern 33a A conductive pattern in which the value of the frequency at which the absorption amount of the absorbed electromagnetic wave shows the maximum value is F [GHz] satisfying the following formula (6).
  • Conductive pattern 33b A conductive pattern in which the value of the frequency at which the absorption amount of the absorbed electromagnetic wave shows the maximum value is G [GHz] satisfying the following formula (7). 0.91 ⁇ A ⁇ F ⁇ 0.933 ⁇ A ... Equation (6) 0.83 ⁇ A ⁇ G ⁇ 0.91 ⁇ A ... Equation (7)
  • A is the frequency [GHz] specified by the above-mentioned method X or method Y.
  • the conductive pattern 30 further includes the conductive pattern 33a and the conductive pattern 33b in addition to the third conductive pattern 33, the value of the frequency at which the absorption amount of the electromagnetic wave absorbed by the third conductive pattern 33 shows the maximum value is , 0.60 ⁇ A [GHz] to 0.83 ⁇ A [GHz] are preferable. In this case, the effect of expanding the frequency band of the electromagnetic wave that can be absorbed by the entire conductive pattern 30 toward the low frequency side is more remarkable, and the absorption of the electromagnetic wave is further remarkable.
  • FIG. 10 is a cross-sectional view taken along the line VIII-VIII of the electromagnetic wave control sheet 10 of FIG.
  • the base material layer 20 has two surfaces 20a and 20b facing each other.
  • a first conductive pattern 31, a second conductive pattern 32, and a third conductive pattern 33 are formed on one surface 20a of the base material layer 20.
  • a plurality of first units u1, a plurality of second units u2, and a plurality of third units u3 are provided on one surface 20a of the base material layer 20, respectively.
  • the thickness H1 of the first conductive pattern 31, the thickness H2 of the second conductive pattern 32, and the thickness H3 of the third conductive pattern 33 are not particularly limited.
  • the thickness H1, the thickness H2, and the thickness H3 can be arbitrarily changed according to desired characteristics. Further, the thickness H1, the thickness H2, and the thickness H3 may be the same or different from each other.
  • the thickness H1, the thickness H2, and the thickness H3 may be, for example, 1 ⁇ m to 100 ⁇ m, 5 ⁇ m to 50 ⁇ m, or 10 ⁇ m to 30 ⁇ m.
  • the thicker each of the thickness H1, the thickness H2, and the thickness H3 is, the better the electromagnetic wave absorption is, but the higher the manufacturing cost is. In consideration of this point, each of the thickness H1, the thickness H2, and the thickness H3 may be set.
  • the electromagnetic wave control sheet 10 can be produced, for example, by the following method. First, the base material layer 20 is prepared. Next, the first conductive pattern 31, the second conductive pattern 32, and the third conductive pattern 33 are formed on one surface 20a of the base material layer 20.
  • the first conductive pattern 31 is formed, the value of the frequency at which the absorption amount of the electromagnetic wave absorbed by the first conductive pattern 31 shows the maximum value is A [GHz].
  • the second conductive pattern 32 the value of the frequency at which the absorption amount of the electromagnetic wave absorbed by the second conductive pattern 32 shows the maximum value is B [GHz].
  • the value of the frequency at which the absorption amount of the electromagnetic wave absorbed by the third conductive pattern 33 shows the maximum value is C [GHz].
  • the order in which the first conductive pattern 31, the second conductive pattern 32, and the third conductive pattern 33 are formed is not particularly limited.
  • the first conductive pattern 31, the second conductive pattern 32, and the third conductive pattern 33 may be formed in the same process, or may be formed in separate steps.
  • the method for forming each conductive pattern is not particularly limited as long as it can form a predetermined frequency.
  • Examples of the method for forming each conductive pattern include the following methods.
  • each conductive pattern is printed on one surface 20a of the base material layer 20 to form each unit u1, u2, u3 which is a figure.
  • the printing method is not particularly limited. For example, screen printing, gravure printing, inkjet method and the like can be mentioned.
  • the conductive paste used for printing include a paste-like composition containing at least one selected from the group consisting of metal particles, carbon nanoparticles and carbon fibers and a binder resin component.
  • the metal particles include metal particles such as copper, silver, nickel, and aluminum.
  • the binder resin component include thermoplastic resins such as polyester resin, (meth) acrylic resin, polystyrene resin and polyamide resin; and thermosetting resins such as epoxy resin, amino resin and polyimide resin.
  • the metal particles and the binder resin component are not limited to these examples.
  • the conductive paste may further contain a black pigment such as carbon black.
  • a black pigment such as carbon black.
  • each unit u1, u2, u3 which is a figure.
  • a developing method a negative type developing method in which a developed product is developed in an exposed portion without being covered by an exposure mask and a positive type developing method in which a developed product is developed in an unexposed portion covered with an exposure mask.
  • each unit u1, u2, u3 is formed as a developed product in a shape opposite to that of the exposure mask.
  • each unit u1, u2, u3 is formed as a developed product in the same shape as the exposure mask.
  • Silver is usually used as the metal used in the developed product.
  • a resist is applied to one surface 20a of the base material layer 20, and after heat treatment, the solvent is removed from the resist.
  • the resist is exposed to a desired pattern and the resist pattern is developed to form a layer composed of the resist pattern.
  • a thin-film deposition film is formed over the entire surface on the base material layer 20 and the layer composed of the resist pattern, and the layer composed of the resist pattern and the vapor-film deposition film on the resist pattern are simultaneously removed by using a resist stripping agent. ..
  • a conductive pattern can be formed on the surface of the base material layer 20.
  • a metal thin film is provided on the base material layer 20, a resist is applied to a part of the surface of the metal thin film, and heat treatment is performed. Next, the metal thin film in the portion where the resist is not applied is removed by the etching process. Then, if necessary, the resist is removed to form an electromagnetic wave absorption pattern.
  • a metal plating layer (not shown) may be further provided on the surface of each unit u1, u2, u3 constituting each electromagnetic wave absorption pattern.
  • the metal constituting the metal wire include the same metal as the above-mentioned metal as the material of each unit u1, u2, u3.
  • the metal wire may be plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloy, solder or the like, or the surface may be coated with a carbon material, a polymer or the like.
  • the carbon material that coats the surface of the metal wire include carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, amorphous carbon such as carbon fiber; graphite; fullerene; graphene; carbon nanotubes and the like.
  • the dielectric layer may be composed of a base material layer and a spacer layer.
  • the electromagnetic wave control sheet 10 according to the present embodiment may include a base material layer 20, a conductive pattern 30, and a spacer layer 50.
  • the electromagnetic wave control sheet 10 according to the present embodiment may include a reflective layer 40.
  • the reflective layer 40 is arranged on the other surface 20b side of the base material layer 20.
  • the spacer layer 50 is arranged between the base material layer 20 and the reflective layer 40. That is, the base material layer 20 and the reflective layer 40 are laminated via the spacer layer 50.
  • the reflective layer 40 has two surfaces 40a and 40b. One surface 40a of the reflective layer 40 is in contact with the other surface 50b of the spacer layer 50.
  • the reflective layer 40 is not particularly limited as long as it can fly to the surface of the electromagnetic wave control sheet 10 and reflect the electromagnetic wave transmitted through the electromagnetic wave control sheet 10. Of the electromagnetic waves coming to the electromagnetic wave control sheet 10, a part is reflected by the conductive pattern 30 or absorbed by the conductive pattern 30. On the other hand, the electromagnetic wave that is neither reflected nor absorbed by the conductive pattern 30 passes through the conductive pattern 30. The electromagnetic wave transmitted through the conductive pattern 30 is reflected by the reflective layer 40 toward the conductive pattern 30.
  • the reflective layer 40 has conductivity in the surface directions of the two surfaces 40a and 40b, the electromagnetic wave transmitted through the conductive pattern 30 can be reflected.
  • a metal foil such as a copper foil may be attached to a support made of a resin film such as polyethylene terephthalate, and a reflective layer 40 may be formed on the support.
  • the reflective layer 40 may be directly laminated on the spacer layer 50.
  • a mesh sheet formed of an immediate conductive film such as ITO, a metal wire, or the like may be used.
  • the support of the reflective layer 40 can also be used as a dielectric layer.
  • a metal wire, a conductive yarn, a twisted yarn containing the metal wire and the conductive yarn, and a conductive thin film may be provided on the other surface 40b of the reflective layer 40.
  • the conductive thin film can be provided on the surface 40b by, for example, a printing method such as screen printing, gravure printing, inkjet method; sputtering method or vacuum vapor deposition; photolithography.
  • the reflective layer 40 can be omitted because the object having conductivity such as metal plays the role of the reflective layer 40.
  • the other surface 40b of the reflective layer 40 may be adhesive.
  • a release film may be provided to cover the surface 40b.
  • the adhesive the same adhesive as in the case where the other surface 20b of the base material layer 20 is adhesive is used.
  • the spacer layer 50 is a dielectric layer.
  • the spacer layer 50 is provided on the other surface 20b of the base material layer 20.
  • the spacer layer 50 has two surfaces 50a and 50b. One surface 50a of the spacer layer 50 is in contact with the other surface 20b of the base material layer 20.
  • a reflective layer 40 is provided on the other surface 50b of the spacer layer 50.
  • the spacer layer 50 may have a single-layer structure or a multi-layer structure.
  • the material of the spacer layer 50 can be appropriately selected depending on the use of the electromagnetic wave control sheet 10.
  • the spacer layer 50 may be made of a transparent material for the purpose of providing the transparency of the electromagnetic wave absorbing film electromagnetic wave control sheet 10.
  • the spacer layer 50 may be made of a flexible material for the purpose of providing followability to the curved surface of the electromagnetic wave control sheet 10. Examples of the flexible material include plastic films, rubber, paper, cloth, non-woven fabrics, foam sheets, rubber sheets and the like. Among these, the foamed sheet is preferable from the viewpoint of followability to the curved surface of the electromagnetic wave control sheet 10.
  • the resin constituting the plastic film for example, the same resin as the thermoplastic resin described for the above-mentioned base material layer 20 can be used.
  • the foamed sheet for example, a foamed sheet formed into a sheet by foaming a resin constituting the plastic film can be used.
  • the foam sheet include polyethylene foam, polypropylene foam, polyurethane foam and the like.
  • the polyethylene foam include low-density polyethylene foam and high-density polyethylene foam.
  • the glass transition temperature of the spacer layer 50 is preferably 30 ° C to 120 ° C, more preferably 40 ° C to 100 ° C, and even more preferably 50 ° C to 80 ° C.
  • the glass transition temperature of the spacer layer 50 is equal to or higher than the above lower limit value, the handleability of the electromagnetic wave control sheet deteriorates. If the glass transition temperature of the spacer layer 50 is not more than the above upper limit value, the adhesive force may decrease due to a heat load on the adhesive layer.
  • the glass transition temperature of the spacer layer 50 is measured in the same manner as the glass transition temperature of the base material layer 20.
  • the storage elastic modulus of the spacer layer 50 at 120 ° C. is preferably 1.0 ⁇ 10 ⁇ 2 MPa to 1.0 ⁇ 10 3 MPa, preferably 1.0 ⁇ 10 -1 MPa to 7.5 ⁇ 10 2 MPa. It is more preferably 1.0 MPa to 5.0 ⁇ 10 2 MPa. If the storage elastic modulus of the spacer layer 50 at 120 ° C. is at least the above lower limit value, the electromagnetic wave control sheet handleability deteriorates. When the storage elastic modulus of the spacer layer 50 at 120 ° C. is not more than the above upper limit value, the TOM formability becomes poor.
  • the storage elastic modulus of the spacer layer 50 is measured in the same manner as the storage elastic modulus of the base material layer 20.
  • the thickness of the spacer layer 50 is appropriately changed according to the wavelength of the electromagnetic wave to be absorbed and the relative permittivity of the spacer layer 50.
  • ⁇ is the wavelength of the incoming electromagnetic wave
  • ⁇ is the relative permittivity of the spacer layer 50.
  • the thickness of the spacer layer 40 in the z-axis direction may be appropriately adjusted for absorption characteristics.
  • the thickness of the spacer layer 40 obtained by the formula (8) in the z-axis direction can be changed in the range of 0.1 times to 3.0 times.
  • the electromagnetic wave absorber 10 When the relationship between the thickness of the spacer layer 50 in the z-axis direction and the wavelength ⁇ satisfies the above equation (8), the electromagnetic wave absorber 10 has a so-called ⁇ / 4 structure. As a result, the maximum value of the amount of electromagnetic waves absorbed by the electromagnetic wave absorber 10 becomes even higher.
  • the thickness of the spacer layer 50 can be appropriately set according to the wavelength ⁇ of the electromagnetic wave to be absorbed.
  • the thickness of the spacer layer 50 may be, for example, 25 ⁇ m to 5000 ⁇ m, 50 ⁇ m to 4500 ⁇ m, or 100 ⁇ m to 4000 ⁇ m.
  • the spacer layer 50 may be made of a material having a high dielectric constant.
  • the spacer layer 50 is a layer having a high dielectric constant, the thickness of the spacer layer 50 can be made relatively thin.
  • the spacer layer 50 contains at least one selected from the group consisting of barium titanate, titanium oxide, and strontium titanate.
  • the spacer layer 50 preferably contains at least one selected from the group consisting of a plastic film, a foamed sheet, and a rubber sheet, and more preferably contains a foamed sheet.
  • the spacer layer 50 is at least one selected from the group consisting of a plastic film, a foam sheet, and a rubber sheet, the followability of the electromagnetic wave control sheet 10 to the curved surface is improved.
  • the spacer layer 50 may be a single-layer structure composed of a single sheet or a multi-layer structure in which a plurality of sheets are laminated. The material and structure of the sheet constituting the spacer layer 50 can be appropriately selected depending on the use of the electromagnetic wave absorbing sheet.
  • the two surfaces 50a and 50b of the spacer layer 50 are preferably adhesive.
  • the base material layer 20 and the reflective layer 40 can be attached to each of the two surfaces 50a and 50b.
  • the two surfaces 50a and 50b can be made adhesive.
  • the details and preferred embodiments of the adhesive layer can be the same as those described for the adhesive layer in the base material layer 20.
  • the electromagnetic wave absorber 10 can be manufactured by, for example, the following method.
  • the adhesive composition is applied onto the peeled surface of the release film, and the obtained coating film is dried to form an adhesive layer.
  • An adhesive sheet is obtained by laminating another release-treated surface of the release film on the adhesive layer.
  • one of the release films of the adhesive sheet is peeled off, and the other surface 20b of the base material layer 20 in the laminate (electromagnetic wave control sheet 10) composed of the base material layer 20 and the conductive pattern 30 produced as described above.
  • One side of the exposed adhesive sheet is attached to.
  • the electromagnetic wave control sheet 10 is obtained by the above method.
  • the base material layer 20 as the dielectric layer, or the base material layer 20 and the spacer layer 50, and the conductive pattern provided on the dielectric layer are provided.
  • the length of the long side of the conductive pattern 30 is 2 mm or less
  • the glass transition temperature of the dielectric layer is 30 ° C to 120 ° C
  • the storage elastic modulus of the dielectric layer at 120 ° C is 1.0 ⁇ 10-2 . MPa to 1.0 ⁇ 10 3 MPa. Therefore, since the electromagnetic wave control sheet 10 of the present embodiment can be three-dimensionally molded by TOM molding at around 120 ° C., it can be attached along the adherend having a curved surface. Further, the sheet can be molded and at the same time attached to an article having a curved surface.
  • a PMMA sheet with a thickness of 75 ⁇ m as a base material (PMMA sheet, manufactured by Mitsubishi Chemical Corporation, product name: acrylic TM HBS010) is provided with an adhesive having a thickness of 35 ⁇ m on one surface, and a long side as shown in FIG.
  • a conductive pattern having a length of 2 mm or less was formed on the surface opposite to the pressure-sensitive adhesive. Copper was used as the material of the conductive pattern. The thickness of the conductive pattern was 18 ⁇ m in each case. Further, a spacer layer was laminated on the surface of the base material opposite to the surface on which the conductive pattern was formed, via the adhesive surface of the adhesive PMMA sheet.
  • the spacer layer As the spacer layer, a foamed sheet (low density polyethylene foam, manufactured by Inoac Corporation, product name: VR3003B, thickness: 3 mm) was used. Next, another adhesive support was prepared, and a reflective layer made of copper having a thickness of 100 nm was formed on the surface of the support opposite to the adhesive surface by the PVD method. Next, the adhesive surface of the reflective layer was bonded to the surface of the spacer layer opposite to the base material to obtain an electromagnetic wave control sheet of Example 1.
  • the dielectric layer is a support for the substrate, spacer layer and reflective layer.
  • Example 2 An electromagnetic wave control sheet of Example 2 was obtained in the same manner as in Example 1 except that a foamed sheet (high-density polyethylene foam, manufactured by Inoac Corporation, product name: B-150, thickness: 3 mm) was used as the spacer layer. rice field.
  • the dielectric layer is a support for the substrate, spacer layer and reflective layer.
  • Example 3 An electromagnetic wave control sheet of Example 3 was obtained in the same manner as in Example 1 except that the spacer layer and the reflective layer were not provided. In Example 3, the dielectric layer is composed of only the base material.
  • Comparative Example 1 Electromagnetic waves of Comparative Example 1 in the same manner as in Example 1 except that a foam sheet manufactured by Inoac Corporation (low density polyethylene foam, manufactured by Inoac Corporation, product name: LD-45, thickness: 3 mm) was used as the spacer layer. I got a control sheet.
  • the dielectric layer is composed of a base material and a spacer layer.
  • Comparative Example 2 A rubber sheet (trade name: MS-760N-N, manufactured by Shin Nihon Radio Absorber Co., Ltd.) was used as a base material, and a comparative example was obtained in the same manner as in Example 1 except that a spacer layer and a reflective layer were not provided. 2 electromagnetic wave control sheets were obtained.
  • the dielectric layer is composed of only the base material.
  • TOM moldability test The electromagnetic wave control sheets of Examples 1 to 3 and Comparative Examples 1 and 2 were subjected to a TOM moldability test using a TOM molding machine manufactured by SIBE AUTOMATION. A hemisphere having a radius of 40 mm was used as a mold, and the moldability of the electromagnetic wave control sheet when tested at 120 ° C. was visually evaluated. The case where molding was possible without poor appearance was evaluated as " ⁇ ", and the case where molding was not possible and the electromagnetic wave control sheet had appearance defects such as wrinkles and tears was evaluated as "x”. The results are shown in Table 1.
  • the storage elastic modulus of the support of the base material and the reflective layer is 115.8 MPa
  • the glass transition temperature is 114 ° C.
  • the storage elastic modulus of the spacer layer is 2. It has a glass transition temperature of .93 MPa and a glass transition temperature of 89 ° C.
  • the storage elastic modulus of the substrate and the support of the reflective layer is 115.8 MPa
  • the glass transition temperature is 114 ° C.
  • the storage elastic modulus of the spacer layer is 3.29 MPa
  • the glass transition temperature is 1. It is 100 ° C. It was confirmed that Examples 1 and 2 were excellent in TOM moldability at 120 ° C.
  • the storage elastic modulus of the base material and the support of the reflective layer is 115.8 MPa
  • the glass transition temperature is 114 ° C.
  • the storage elastic modulus of the spacer layer is 3.5 MPa
  • the glass transition temperature is 127 ° C.
  • the electromagnetic wave control sheet of Comparative Example 1 was inferior in TOM moldability at 120 ° C. From the results shown in Table 1, the electromagnetic wave control sheets of Examples 1 to 3 in which the storage elastic modulus of the substrate and the support of the reflective layer is 115.8 MPa and the glass transition temperature is 114 ° C. are TOM molded at 120 ° C.
  • the electromagnetic wave control sheet of the present invention can be used for automobile parts, road peripheral members, building exterior wall-related materials, windows, communication equipment, radio telescopes, and the like.
  • Electromagnetic wave control sheet 20 Base material layer 30 Conductive pattern 31 First conductive pattern 32 Second conductive pattern 33 Third conductive pattern 40 Reflective layer 50 Spacer layer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne une feuille de commande d'ondes électromagnétiques (10) comprenant : une couche diélectrique (couche de base (20)) ; et un motif conducteur (30) disposé sur la couche diélectrique (couche de base (20)), la longueur d'un côté plus long du motif conducteur (30) étant d'au plus 2 mm, la température de transition vitreuse de la couche diélectrique (couche de base (20)) est de 30 à 120 °C, et le module de stockage de la couche diélectrique (couche de base (20)) est de 1.0 × 10-2 à 1.0 × 103 MPa à 120 °C.
PCT/JP2021/035647 2020-09-30 2021-09-28 Feuille de commande d'ondes électromagnétiques WO2022071319A1 (fr)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019097977A1 (fr) * 2017-11-17 2019-05-23 東レ株式会社 Film, feuille de transfert de moulage le comprenant, rouleau de film, et procédé de production de film
WO2020179349A1 (fr) * 2019-03-01 2020-09-10 リンテック株式会社 Film d'absorption d'ondes électromagnétiques et feuille d'absorption d'ondes électromagnétiques

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019097977A1 (fr) * 2017-11-17 2019-05-23 東レ株式会社 Film, feuille de transfert de moulage le comprenant, rouleau de film, et procédé de production de film
WO2020179349A1 (fr) * 2019-03-01 2020-09-10 リンテック株式会社 Film d'absorption d'ondes électromagnétiques et feuille d'absorption d'ondes électromagnétiques

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