WO2022070779A1 - 電子部品、電子部品の製造方法、及びコンデンサ、コンデンサの製造方法 - Google Patents

電子部品、電子部品の製造方法、及びコンデンサ、コンデンサの製造方法 Download PDF

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Publication number
WO2022070779A1
WO2022070779A1 PCT/JP2021/032549 JP2021032549W WO2022070779A1 WO 2022070779 A1 WO2022070779 A1 WO 2022070779A1 JP 2021032549 W JP2021032549 W JP 2021032549W WO 2022070779 A1 WO2022070779 A1 WO 2022070779A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
barrier film
capacitor
film
clay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/032549
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
宏樹 竹岡
崇幸 服部
幸博 島崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2022553722A priority Critical patent/JP7756368B2/ja
Priority to CN202180064913.8A priority patent/CN116235263B/zh
Publication of WO2022070779A1 publication Critical patent/WO2022070779A1/ja
Priority to US18/174,598 priority patent/US12334266B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/252—Terminals the terminals being coated on the capacitive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation

Definitions

  • Patent Document 1 describes a case-molded capacitor.
  • the case-molded capacitor includes a capacitor element, a lead terminal, a mold resin, and a case.
  • the capacitor element is a winding type film capacitor element and is housed in a case made of polyphenylene sulfide (PPS) resin.
  • PPS polyphenylene sulfide
  • the mold resin is filled in the case and seals the capacitor element.
  • the lead terminal is electrically connected to the capacitor element and is led out from the mold resin part to the outside of the case.
  • the method for manufacturing a capacitor according to one aspect of the present disclosure includes a step of winding a metallized film to form a winding body, a step of winding a barrier film around at least a part around the winding body, and the above-mentioned step.
  • a step of spraying a metal material on both ends of the wound body around which the barrier film is wound to form an external electrode is provided.
  • a clay layer is formed on the insulating film. When the barrier film is wound around the winding body, the clay layer is wound so as to face the winding body.
  • the thickness of the resin case and sealing resin needs to be 2 mm or more even if it is the thinnest. Therefore, the resin case of the epoxy resin and the film capacitor using the sealing resin are heavy and tend to be very complicated in the manufacturing process. Further, when the film capacitor is an in-vehicle capacitor, the shape is custom-designed so as to be different for each vehicle model, so that it is a difficult product to reduce the cost.
  • the electronic component 1 since the electronic component 1 according to the present embodiment has the clay layer 31 containing clay in the barrier film 30 covering the electronic component element 2, the electronic component 1 has a clay layer 31 of the same thickness as compared with the resin layer formed of the resin alone.
  • the amount of water passing through the barrier film 30 is likely to be reduced. Therefore, the amount of water reaching the electronic component element 2 from the outside of the electronic component 1 is reduced, the moisture is less likely to act on the electronic component element 2, and the electronic component 1 having excellent moisture resistance can be easily obtained.
  • the clay layer 31 can be formed on the surface of the insulating film 33 by a simple means such as coating, the manufacturing process of the electronic component 1 is less likely to be complicated, and the cost can be easily reduced.
  • the electronic component 1 includes an electronic component element 2 and a barrier film 30.
  • the electronic component element 2 is a component or part for exhibiting the desired function of the electronic component 1.
  • the electronic component element 2 has external electrodes 24 at both ends.
  • the clay layer 31 is arranged so as to face the electronic component element 2. That is, it is preferable that the barrier film 30 covers the periphery of the electronic component element 2 so that the clay layer 31 is located inside (toward the electronic component element 2) when viewed from the position of the insulating film 33.
  • the clay layer 31 has higher adhesion to the electronic component element 2 than the insulating film 33. Therefore, by arranging the barrier film 30 with the clay layer 31 facing toward the electronic component element 2, the clay layer 31 and the electronic component element 2 are easily brought into close contact with each other, and moisture can penetrate into the electronic component element 2. It becomes easy to reduce.
  • the end face of the barrier film 30 may be covered with the external electrode 24. That is, as shown in FIG. 3B, it is preferable that the peripheral end portion 241 of the external electrode 24 is located outside the end surface in the width direction of the barrier film 30. In this case, it is preferable that the peripheral end portion 241 of the external electrode 24 covers the end surface of the barrier film 30 in the width direction over the entire circumference. In this case, by covering the boundary between the element body 2a and the barrier film 30 with the barrier film 30, it is possible to suppress the infiltration of water from the boundary portion between the element body 2a and the barrier film 30.
  • the electronic component 1 may further include an exterior resin layer 4 that covers the electronic component element 2 and the barrier film 30.
  • the exterior resin layer 4 has a function of protecting the electronic component element 2 and the barrier film 30 from moisture. Further, the exterior resin layer 4 may have a function of protecting the electronic component element 2 and the barrier film 30 from heat, light, electromagnetic waves, impacts, chemicals and the like.
  • the exterior resin layer 4 is formed of one or both of the case (container) and the mold resin.
  • the capacitor element 20 has external electrodes 24 at both ends in the axial direction.
  • the external electrode 24 is preferably formed by thermal spraying of a metal material. Further, the external electrode 24 preferably contains 50% by weight or more of tin. This type of external electrode 24 is usually formed by spraying zinc, but the external electrode 24 made of zinc tends to be porous, and moisture may infiltrate from the external electrode 24. Therefore, in the present embodiment, the tin content of the external electrode 24 is increased, which makes the metal structure constituting the external electrode 24 dense and makes it difficult for water to pass through the external electrode 24, so that the capacitor element 20 The infiltration of water into the water is reduced.
  • the barrier film 30 has a clay layer 31 containing clay.
  • the clay layer 31 contains clay and is formed in a layered manner.
  • clay is an aggregate of a plurality of mineral particles 311.
  • Clay may also contain a small amount of water in an aggregate of a plurality of mineral particles 311.
  • Mineral particles 311 include one or more selected from the herd of mica, vermiculite, montmorillonite, iron montmorillonite, byderite, saponite, hectorite, stepvensite, nontronite.
  • the mineral particles 311 preferably contain montmorillonite, which is a highly moisture-resistant clay material.
  • FIG. 2B shows a schematic perspective view of one mineral particle 311.
  • the mineral particles 311 are plate-shaped or flaky particles. That is, the mineral particles 311 are particles having a thickness a smaller than the width b.
  • the width b is the dimension of the longest portion of the mineral particles 311 when the mineral particles 311 are viewed from the front (viewed from directly in the thickness direction). If the mineral particle 311 is, for example, a disk, the diameter is b.
  • the thickness a is a dimension in a direction orthogonal to the width b, and is a dimension between two facing surfaces of the mineral particles 311.
  • P / P0 (1- ⁇ ) / (1 + 0.5A ⁇ ) ... (1)
  • P / P0 indicates the specific transmittance.
  • ⁇ indicates the volume fraction of the mineral particles 311 in the clay layer 31.
  • A indicates the aspect ratio of the mineral particles 311.
  • the barrier film 30 through which moisture does not easily pass in order to improve the moisture resistance of the capacitor 10, it is preferable to increase the volume fraction of the mineral particles 311 in the clay layer 31, and the mineral having a high aspect ratio. It is preferable to increase the content of the particles 311.
  • the aspect ratio of the mineral particles 311 is preferably 20 or more. In order to obtain the clay layer 31 through which moisture does not easily pass, it is preferable to use mineral particles 311 having a higher aspect ratio, but other performances of the clay layer 31, for example, strength, adhesion and formation of the clay layer 31. The above range is preferable in consideration of easiness and the like.
  • the aspect ratio of the mineral particles 311 is more preferably 100 or more, and further preferably 150 or more.
  • the upper limit of the aspect ratio of the mineral particles 311 is not particularly set, and is appropriately set in consideration of the dispersibility of the mineral particles 311 in the clay layer 31 and the like.
  • the content of the mineral particles 311 in the clay layer 31 is 50% by mass or more with respect to the total amount.
  • the content of the mineral particles 311 is 50% by mass or more and 95% by mass or less with respect to the total amount of the clay layer 31, and the content of the binder 312 is contained.
  • the ratio is preferably 5% by mass or more and 50% by mass or less with respect to the total amount of the clay layer 31. This makes it easier to obtain the clay layer 31 through which moisture does not easily pass, while ensuring the strength, adhesion, and ease of formation of the clay layer 31.
  • the insulating film 33 is preferably flexible. Further, the insulating film 33 is preferably a resin film. Examples of the resin film include a film containing a synthetic resin such as polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyamide (nylon (registered trademark)). Thickness of the insulating film 33. Is appropriately set in consideration of electrical insulation and flexibility, but is preferably several tens of ⁇ m, more preferably 10 ⁇ m or more and 30 ⁇ m or less.
  • PP polypropylene
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • nylon polyamide
  • the second metallized film 72 is formed in the same manner as the first metallized film 71. That is, the second metallized film 72 has a second dielectric film 702 and a second conductive layer 712.
  • the second dielectric film 702 is a long object having the same width as the first dielectric film 701.
  • a second conductive layer 712 is formed on one side of the second dielectric film 702 except for the second margin portion 722.
  • the second margin portion 722 is a portion where the second dielectric film 702 is exposed, and is formed along one long side of the second dielectric film 702 in a strip shape thinner than the second conductive layer 712. There is.
  • the first dielectric film 701 and the second dielectric film 702 are made of, for example, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyphenyl sulfide, polystyrene, or the like.
  • the first conductive layer 711 and the second conductive layer 712 are formed by a method such as a thin film deposition method or a sputtering method.
  • the first conductive layer 711 and the second conductive layer 712 are made of, for example, aluminum, zinc, magnesium, or the like.
  • the barrier film 30 covers the winding body 73 before forming the first external electrode 21 and the second external electrode 22 by metal spraying (metallikon) has been described, but the first is not limited to this.
  • the winding body 73 may be coated with the barrier film 30.
  • the first external electrode 21 and the second external electrode 22 are formed on the winding body 73.
  • the winding body 73, the first external electrode 21, and the second external electrode 22 may be covered with the barrier film 30.
  • the barrier film 30 covers the first external electrode 21 and the second external electrode 22.
  • the winding body 73 may be coated before forming.
  • the width of the barrier film 30 is increased by 1 to 2 mm from the width of the metallized films 71 and 72 forming the winding body 73, and the end portion 301 of the barrier film 30 is the axial end surface 730 of the winding body 73. Protrude more than.
  • the formation of the first external electrode 21 and the second external electrode 22 by metal spraying is performed on the axial end surface 730 of the winding body 73 in the space surrounded by the end portion 301 of the barrier film 30.
  • the electronic component 1 includes an electronic component element 2 having external electrodes 24 at both ends, an exterior resin layer 4 covering at least a part of the electronic component element 2, and an exterior resin layer.
  • a barrier film 30 that covers at least a part of the periphery of the wall is provided. Similar to the above, the barrier film 30 has an insulating film 33 having an electrically insulating property and a clay layer 31 containing clay.
  • the fourth aspect is the electronic component (1) according to any one of the first to third aspects, in which the external electrode (24) is formed by thermal spraying and contains (50)% by weight or more of tin.
  • the exterior resin layer (4) makes it easier to further reduce the moisture absorption of the electronic component element (2), and the exterior resin layer (4) secures the strength of the electronic component element (2) to ensure the strength of the electronic component. There is an advantage that the element (2) can be protected.
  • the barrier film (30) provided on the outside of the exterior resin layer (4) has an advantage that the infiltration of water can be further reduced and the moisture resistance is improved.
  • the electronic component element (2) according to any one of the first to seventh aspects includes a capacitor element (20).
  • the clay layer (31) through which moisture does not easily pass, it becomes easy to secure the moisture resistance performance without increasing the thickness of the mold resin and the case, and it becomes easy to manufacture a miniaturized capacitor. , Has the advantage. Further, since the barrier film (30) is wound around the winding body (73) following the process of winding the metallized film (71, 72), there is an advantage that the process is rational and can be simplified. be.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
PCT/JP2021/032549 2020-09-30 2021-09-03 電子部品、電子部品の製造方法、及びコンデンサ、コンデンサの製造方法 Ceased WO2022070779A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022553722A JP7756368B2 (ja) 2020-09-30 2021-09-03 フィルムコンデンサ、フィルムコンデンサの製造方法
CN202180064913.8A CN116235263B (zh) 2020-09-30 2021-09-03 电子部件、电子部件的制造方法以及电容器、电容器的制造方法
US18/174,598 US12334266B2 (en) 2020-09-30 2023-02-24 Electronic component, electronic component manufacturing method, capacitor, and capacitor manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020165742 2020-09-30
JP2020-165742 2020-09-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/174,598 Continuation US12334266B2 (en) 2020-09-30 2023-02-24 Electronic component, electronic component manufacturing method, capacitor, and capacitor manufacturing method

Publications (1)

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WO2022070779A1 true WO2022070779A1 (ja) 2022-04-07

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PCT/JP2021/032549 Ceased WO2022070779A1 (ja) 2020-09-30 2021-09-03 電子部品、電子部品の製造方法、及びコンデンサ、コンデンサの製造方法

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US (1) US12334266B2 (https=)
JP (1) JP7756368B2 (https=)
CN (1) CN116235263B (https=)
WO (1) WO2022070779A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12362099B2 (en) * 2022-08-30 2025-07-15 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component
WO2026070058A1 (ja) * 2024-09-24 2026-04-02 株式会社村田製作所 フィルムコンデンサ

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JP2007207884A (ja) * 2006-01-31 2007-08-16 Nichicon Corp 金属化ポリプロピレンフィルムコンデンサ
JP2014022508A (ja) * 2012-07-17 2014-02-03 Konica Minolta Inc Ｌｅｄ装置及びその製造方法
JP2018160498A (ja) * 2017-03-22 2018-10-11 ニチコン株式会社 ケースレスフィルムコンデンサ
WO2020044778A1 (ja) * 2018-08-28 2020-03-05 パナソニックＩｐマネジメント株式会社 コンデンサ及びその製造方法

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JP2007207884A (ja) * 2006-01-31 2007-08-16 Nichicon Corp 金属化ポリプロピレンフィルムコンデンサ
JP2014022508A (ja) * 2012-07-17 2014-02-03 Konica Minolta Inc Ｌｅｄ装置及びその製造方法
JP2018160498A (ja) * 2017-03-22 2018-10-11 ニチコン株式会社 ケースレスフィルムコンデンサ
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US12362099B2 (en) * 2022-08-30 2025-07-15 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component
WO2026070058A1 (ja) * 2024-09-24 2026-04-02 株式会社村田製作所 フィルムコンデンサ

Also Published As

Publication number Publication date
CN116235263A (zh) 2023-06-06
JPWO2022070779A1 (https=) 2022-04-07
US20230223194A1 (en) 2023-07-13
JP7756368B2 (ja) 2025-10-20
US12334266B2 (en) 2025-06-17
CN116235263B (zh) 2025-08-15

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