WO2022068253A1 - 传送盒及物料传送系统 - Google Patents

传送盒及物料传送系统 Download PDF

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Publication number
WO2022068253A1
WO2022068253A1 PCT/CN2021/098726 CN2021098726W WO2022068253A1 WO 2022068253 A1 WO2022068253 A1 WO 2022068253A1 CN 2021098726 W CN2021098726 W CN 2021098726W WO 2022068253 A1 WO2022068253 A1 WO 2022068253A1
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WO
WIPO (PCT)
Prior art keywords
box
accommodating box
air inlet
accommodating
gas
Prior art date
Application number
PCT/CN2021/098726
Other languages
English (en)
French (fr)
Inventor
程明星
张广杰
Original Assignee
长鑫存储技术有限公司
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Priority to US17/439,084 priority Critical patent/US20230022345A1/en
Publication of WO2022068253A1 publication Critical patent/WO2022068253A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/10—Devices to locate articles in containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/20—External fittings
    • B65D25/22—External fittings for facilitating lifting or suspending of containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G17/00—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface
    • B65G17/20—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface comprising load-carriers suspended from overhead traction chains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G17/00—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface
    • B65G17/30—Details; Auxiliary devices
    • B65G17/32—Individual load-carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G17/00—Conveyors having an endless traction element, e.g. a chain, transmitting movement to a continuous or substantially-continuous load-carrying surface or to a series of individual load-carriers; Endless-chain conveyors in which the chains form the load-carrying surface
    • B65G17/30—Details; Auxiliary devices
    • B65G17/38—Chains or like traction elements; Connections between traction elements and load-carriers
    • B65G17/40—Chains acting as load-carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
    • B65D81/20—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient under vacuum or superatmospheric pressure, or in a special atmosphere, e.g. of inert gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure

Definitions

  • the present application relates to the technical field of material conveying, and in particular, to a conveying box and a material conveying system.
  • the semiconductor manufacturing process usually includes multiple processes, such as photolithography, deposition, curing, annealing, etc., and the wafers are usually placed in different equipment for corresponding processes. Wafers can be transported and stored between different equipment through a transport box, for example, the transport box is a Front Opening Unified Pod (FOUP for short).
  • FOUP Front Opening Unified Pod
  • the microenvironment in the transfer box has a significant impact on the morphology of the wafer surface.
  • the transfer box is usually a sealed structure, and the inside of the transfer box is filled with an inert gas, such as nitrogen, to remove the transfer box. Residues or contamination in the box, reducing or avoiding surface defects of the wafer.
  • the inert gas in the transfer box is prone to leak, thereby increasing the surface defects of the wafers and reducing the yield of the wafers.
  • the present application provides a conveying box and a material conveying system for improving the yield of objects to be conveyed.
  • the present application provides a conveying box, comprising an accommodating box and an air storage box, the accommodating box is provided with an air inlet and an exhaust port, and the air inlet of the accommodating box communicates with the air storage box,
  • the accommodating box is also provided with a first sensor, and the first sensor detects the pressure value in the accommodating box; in an initial state, the exhaust port of the accommodating box is opened, and the gas storage box passes through the The air inlet of the accommodating box fills the accommodating box with protective gas; when the time from the initial state is greater than the first set time, and when the pressure value is less than the first set value, the discharge of the accommodating box The air port is closed, and the air storage box fills the accommodating box with protective gas through the air inlet of the accommodating box.
  • the transmission box includes a accommodating box and an air storage box.
  • the object to be conveyed is placed in the accommodating box, and the gas storage box is filled with protective gas;
  • the gas storage box is connected, and the first sensor for detecting the pressure value in the storage box is also arranged in the storage box; in the initial state, the exhaust port of the storage box is opened, and the gas storage box passes through the air inlet of the storage box to the storage box.
  • the accommodating box is continuously filled with protective gas after the exhaust gas is discharged, so that the objects to be conveyed in the accommodating box can continue to be in the protective gas, preventing the objects to be conveyed in the accommodating box from being polluted, and reducing the surface defects of the objects to be conveyed , thereby improving the yield of the objects to be conveyed.
  • the air inlet and the exhaust port of the accommodating box are opened, and the air storage box passes through the inlet of the accommodating box.
  • the air port fills the accommodating box with protective gas to discharge the exhaust gas of the accommodating box from the exhaust port of the accommodating box.
  • the accommodating box is a cylindrical box body
  • the air inlet of the accommodating box includes a plurality of first air inlets arranged on the side wall of the accommodating box, and a plurality of the The first air inlets are arranged at intervals along the axial direction of the accommodating box.
  • the air inlet of the accommodating box further includes a plurality of second air inlets arranged at the top of the accommodating box, and a plurality of third inlets arranged at the bottom of the accommodating box. breath.
  • the gas storage box passes through the first air inlet, the second air inlet and the third air inlet.
  • the gas port fills the protective gas into the accommodating box at a first flow rate.
  • the third air inlet and the exhaust port of the accommodating box are arranged on the same side of the accommodating box; when the time from the initial state is less than the first set time, The air storage box is filled with protective gas into the containing box through the first air inlet and the second air inlet at a second flow rate, and the third air inlet is closed.
  • the gas storage box is provided with a second sensor, and the second sensor detects the protective gas concentration value in the gas storage box.
  • the protective gas concentration value is less than the second setting value, the protective gas in the gas storage box is insufficient.
  • the present application also provides a material conveying system, including a conveying chain, a driving device, and the above-mentioned conveying box; the conveying box is hung on the conveying chain, and the driving device drives the The conveyor chain moves.
  • the material conveying system in the present application includes the above-mentioned conveying box, so it has the advantages of the above-mentioned conveying box, which can reduce the surface defects of the objects to be conveyed and improve the yield of the objects to be conveyed. .
  • FIG. 1 is a schematic structural diagram of a transfer box in an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of an air storage box in an embodiment of the application.
  • Fig. 3 is the installation schematic diagram of the gas storage box in the embodiment of the application.
  • FIG. 4 is a working flow chart of the transport box in the embodiment of the application.
  • the conveying box includes an accommodating box and a gas storage box, and a first sensor for detecting the pressure value in the accommodating box is arranged in the accommodating box.
  • a first sensor for detecting the pressure value in the accommodating box is arranged in the accommodating box.
  • the material conveying system provided by the embodiments of the present application is suitable for the manufacturing process of a variety of different products, for example, semiconductor products, precision electronic products, instruments, meters, mold products, and the like. Using this material conveying system, the material to be conveyed can be transferred, stored, processed or surface treated between different equipments.
  • wafers taking semiconductor manufacturing as an example, wafers usually undergo processes such as deposition, grinding, photolithography, doping, and cleaning to form desired semiconductor products. Different processes often need to be carried out on different equipment. For example, deposition equipment is used to form thin films on wafers, polishing equipment is used to planarize wafers, lithography equipment is used to pattern wafers, and implantation equipment is used for wafer processing. Ion implantation is performed in specific areas of the wafer. Wafers can be moved and stored between the above-mentioned equipments through a material conveying system to realize the corresponding process.
  • deposition equipment is used to form thin films on wafers
  • polishing equipment is used to planarize wafers
  • lithography equipment is used to pattern wafers
  • implantation equipment is used for wafer processing. Ion implantation is performed in specific areas of the wafer. Wafers can be moved and stored between the above-mentioned equipments through a material conveying system to realize the corresponding process.
  • the material conveying system includes a conveying device, a driving device and a conveying box, the wafers are placed in the conveying box, and the conveying device drives the movement of the conveying box.
  • the conveying device is a conveyor belt or a conveying chain, and the conveying device and the conveying box are usually detachably connected.
  • the driving device is connected with the conveying device to drive the conveying device to move, so as to transfer the conveying box and the wafers placed in the conveying box to different processes.
  • the material conveying system includes, in addition to the above-mentioned devices, a control system for controlling the driving device, the conveying box, and the like.
  • the control system may include a Manufacturing Execution System (MES for short), the MES is signal-connected to the transfer box, receives signals in the transfer box, transmits signals to the transfer box, and controls the opening or closing of valves in the transfer box.
  • MES Manufacturing Execution System
  • the wafers are put into the conveying box after one equipment completes the corresponding process, the conveying box can be hung on the conveying chain, and the driving device drives the conveying chain to move to the next equipment, thereby moving the conveying box to The next equipment, and then remove the wafer from the transfer box for other processes.
  • the transfer box can be mounted on the transfer device by means of clamping parts, for example, the transfer box is hung on the conveyor chain by the manipulator; the transfer box can also be installed on the transfer device by the automatic handling device, for example, the transfer box is transported by the aerial elevator ( Overhead Hoist Transport, referred to as OHT) or Automatic Guided Vehicle (Automated Guided Vehicle, referred to as AGV) docking with the conveyor chain, so that the conveyor box is transferred and installed on the conveyor chain.
  • OHT Overhead Hoist Transport
  • AGV Automatic Guided Vehicle
  • the top of the conveying box is generally provided with a connecting part 10 , and the conveying box is hung on the conveying chain of the material conveying system through the connecting part 10 for the material conveying system to move the conveying box.
  • the connecting portion 10 may be a flange, a handle, or the like.
  • the connecting portion 10 may be located in the middle part of the top of the transfer box, so as to avoid the wafer 40 in the transfer box being moved due to tilting of the transfer box during the transfer of the wafers 40 and damaging the wafer 40 .
  • the bottom of the transfer box is generally provided with a mounting seat 20.
  • the mounting seat 20 is used to support the transfer box when the transfer box is stopped, and to connect the transfer box with other equipment to ensure that the transfer box is stable when the wafer is being processed. .
  • the transfer box includes an accommodating box 30 and a gas storage box 50.
  • the accommodating box 30 is used for placing the wafers 40
  • the gas storage box 50 is used for storing protective gas.
  • the protective gas can be an inert gas, for example, the protective gas is argon One or more of gas, helium or nitrogen.
  • the accommodating box 30 may be provided with a plurality of wafer storage racks arranged at intervals for placing the wafers 40 , so that the plurality of wafers 40 are stacked and separated from each other.
  • the above-mentioned wafer storage rack is provided on the inner side wall of the accommodating box 30
  • the wafer storage rack may be a groove body provided on the inner side wall of the accommodating box 30 .
  • One wafer 40 is placed on each wafer storage rack, and the wafer 40 is placed horizontally in the accommodating box 30 in the manner shown in FIG. 1 .
  • the accommodating box 30 may be cylindrical, for example, the accommodating box 30 may be cylindrical, elliptical, or prismatic.
  • the shape of the wafer 40 is a circle that matches the accommodating box 30. In this way, the space utilization rate in the accommodating box 30 is relatively high.
  • the accommodating box 30 is taken as an example in a cylindrical shape for illustration, but it can be understood that the accommodating box 30 is not limited to a cylindrical shape.
  • the accommodating box 30 is provided with an air inlet, an air outlet 35 and a first sensor 31 .
  • the air inlet of the accommodating box 30 is communicated with the gas storage box 50, and the exhaust port 35 of the accommodating box 30 is communicated with the outside world.
  • the port 35 is exhausted, so that the accommodating box 30 can discharge the exhaust gas and maintain the purity in the accommodating box 30, that is, the protective gas can be maintained to cover the wafer 40 in the accommodating box 30, so as to prevent contaminants from contacting the wafer 40 and damaging the wafer 40. surface.
  • the air inlet of the accommodating box 30 may be provided on the top, side or bottom of the accommodating box 30, and the exhaust port 35 of the accommodating box 30 may also be provided on the top, side or bottom of the accommodating box 30. Multiple air inlets and exhaust ports 35 of the accommodating box 30 may be provided, so as to improve the efficiency of the accommodating box 30 for discharging exhaust gas and filling protective gas.
  • the side wall of the accommodating box 30 is provided with a plurality of first air inlets 32 , and the plurality of first air inlets 32 are arranged at intervals.
  • a plurality of first air inlets 32 may be arranged at intervals along the axial direction of the accommodating box 30 , that is, a dotted line formed by sequentially connecting the plurality of first air inlets 32 is parallel to the axis (center line) of the accommodating box 30 . . As shown in FIG. 1 , the plurality of first air inlets 32 are arranged in a vertical direction, that is, each first air inlet 32 is located directly above or directly below the adjacent first air inlets 32 . In order to have a better air intake effect in the accommodating box 30 , a plurality of first air inlets 32 may be arranged at equal intervals.
  • Air flow channel there is an air flow channel between the accommodating box 30 and the air storage box 50.
  • the vertical part on the right side of the accommodating box 30 is the air flow channel, and the air flow channel is connected to the air storage box and the plurality of first inlets. Air port 32.
  • the plurality of first air inlets 32 may also be arranged along the circumferential direction of the side wall of the accommodating box 30.
  • the plurality of first air inlets 32 are spirally arranged along the side wall of the accommodating box 30.
  • the center line of the spiral of the first air inlets 32 coincides with the center line of the accommodating box 30 .
  • the top of the accommodating box 30 may be provided with a plurality of second air inlets 33, and the bottom of the accommodating box 30 may be provided with a plurality of third air inlets 34, so as to further improve the air intake rate of the accommodating box 30, so that the The protective gas can be filled quickly.
  • the first air inlet 32 , the second air inlet 33 and the third air inlet 34 may collectively constitute the air inlet of the accommodating box 30 .
  • the number of the first air inlets 32 may be greater than the number of the second air inlets 33 and the number of the third air inlets 34
  • the number of the second air inlets 33 may be the same as the number of the third air inlets 34 .
  • each second air inlet 33 is disposed opposite to one third air inlet 34 .
  • the accommodating box 30 is further provided with a first sensor 31 , and the first sensor 31 detects the pressure value in the accommodating box 30 .
  • the first sensor 31 may be a pressure sensor, and the pressure sensor detects and transmits pressure information in the accommodating box 30 .
  • the first sensor 31 may output the measured pressure information to the processor of the transfer box through wireless transmission.
  • the processor of the conveying box can be provided separately, for example, the processor is arranged in the conveying box; the processor can also be a control system or a part of the control system in the material conveying system.
  • the processor is signal-connected with the first sensor 31, and can receive the pressure information detected by the first sensor 31 and compare it with a first preset value, wherein the first preset value can be the outside atmospheric pressure value.
  • the processor can also control the valve action of the air inlet and the air outlet 35 of the accommodating box 30 to realize the opening and closing of the air inlet and the air outlet 35 of the accommodating box 30 .
  • the accommodating box 30 may be provided with one first sensor 31.
  • the first sensor 31 may be provided at the bottom of the accommodating box 30; A sensor 31 is arranged at different positions in the accommodating box 30 to improve the detection accuracy of the pressure value in the accommodating box 30 .
  • both the air inlet and the exhaust port 35 of the accommodating box 30 are opened, the accommodating box 30 performs the exhaust gas process, the gas storage box 50 fills the protective gas into the accommodating box 30 through the air inlet of the accommodating box 30, and the exhaust gas is The exhaust port 35 of the accommodating box 30 is discharged.
  • the first air inlet 32 , the second air inlet 33 and the exhaust port 35 of the accommodating box 30 are all open, and the air storage box 50 passes through the first air inlet 32 and the second air inlet 32 of the accommodating box 30 .
  • the air inlet 33 is filled with protective gas into the accommodating box 30 at the second flow rate to discharge the exhaust gas from the exhaust port 35 of the accommodating box 30, and the third air inlet 34 of the accommodating box 30 is closed to prevent the accommodating box 30 from being damaged.
  • the gas in the third air inlet 34 recoils the exhaust gas so that the exhaust gas cannot be completely discharged.
  • the flow velocity of the protective gas in the gas storage box 50 flowing through the first air inlet 32 of the accommodating box 30 and the flow velocity of the protective gas flowing through the second air inlet 33 of the accommodating box 30 may be the same, both of which are second.
  • the flow rate is set in such a way that the intake air of each intake port of the accommodating box 30 is balanced.
  • both the second air inlet 33 and the air outlet 35 of the accommodating box 30 are opened, the first air inlet 32 and the third air inlet 34 are both closed, and the air storage box 50 passes through the second air inlet.
  • the air port 33 is charged into the accommodating box 30 at the second flow rate, and the exhaust gas is discharged from the exhaust port 35 of the accommodating box 30 .
  • the initial state can be controlled by the processor of the transport box, that is, when the first sensor 31 in the accommodating box 30 receives the cleaning instruction from the processor of the transport box, the transport box is in the initial state, and the accommodating box 30 discharges exhaust gas . That is, the state when the housing box 30 starts to discharge exhaust gas is the initial state.
  • the accommodating box 30 When the time from the initial state is less than the first set time, the accommodating box 30 is always in the process of exhausting gas. That is to say, when the time from the initial state is less than the first set time, both the air inlet and the exhaust port 35 of the accommodating box 30 are opened, and the air storage box 50 flows into the accommodating box 30 through the air inlet of the accommodating box 30 .
  • the protective gas is filled to discharge the exhaust gas of the accommodating box 30 from the exhaust port 35 of the accommodating box 30 .
  • the first preset time is greater than or equal to the time for the accommodating box 30 to discharge exhaust gas, and is set according to the volume of the accommodating box 30 , the intake air flow rate and the exhaust gas flow rate, for example, the first preset time may be 5-10 minutes. It can be understood that, when the time from the initial state is equal to the first preset time, the waste gas in the accommodating box 30 has been discharged, and the accommodating box 30 is filled with protective gas. Port 35 can be closed.
  • the time from the initial state can be detected by a timing device, which is signally connected to the processor of the transfer box.
  • the timing device may be separately arranged in the accommodating box 30 and signally connected to the processor; the timing device may also be arranged outside the accommodating box 30 and signally connected to the processor, for example, the timing device is a part of the processor.
  • the timing device may be a timer or a timer.
  • the timing device is a timer.
  • the timer starts timing, and when the timer reaches a first preset time, the processor controls the air inlet and the exhaust port of the transport box to close.
  • the timing device is a timer, and the time of the timer is equal to the first preset time.
  • the timer starts to count down, and when the timer counts down, the processor controls the air inlet and exhaust of the transport box. mouth closed.
  • the transfer box When the time from the initial state is greater than the first set time, the transfer box performs the following process:
  • the exhaust port 35 of the accommodating box 30 is closed, and the air inlet of the accommodating box 30 is opened.
  • the gas storage box 50 fills the accommodating box 30 with protective gas through the air inlet of the accommodating box 30 , so that the accommodating box 30 is filled with protective gas, so as to keep the wafers 40 in the accommodating box 30 always in the protective gas.
  • the first air inlet 32, the second air inlet 33 and the third air inlet 34 of the accommodating box 30 are all opened, and the storage
  • the gas box 50 is filled with protective gas into the accommodating box 30 at a first flow rate. That is, the first air inlet 32, the second air inlet 33 and the third air inlet 34 all charge the protective gas into the containing box 30 at a first flow rate, and the first flow rate may be smaller than the second flow rate.
  • both the air inlet and the air outlet 35 of the accommodating box 30 are closed.
  • the pressure value in the accommodating box 30 is equal to the external atmospheric pressure value, and the accommodating box 30 is in a state of equilibrium. At this time, the accommodating box 30 neither enters nor exhausts.
  • the air inlet of the accommodating box 30 is closed, the exhaust port 35 of the accommodating box 30 is opened, and the accommodating box 30 lowers the accommodating box 30 by discharging the protective gas to the outside. to prevent damage to the accommodating box 30 due to excessive internal pressure.
  • the pressure value detected by the first sensor 31 is less than the first set value, the pressure value detected by the first sensor 31 is equal to the first set value, and the pressure value detected by the first sensor 31 is greater than or equal to the first set value.
  • a set value is not sequential.
  • the processor of the transport box controls the valve action of the air inlet and the exhaust port 35 of the accommodating box 30 according to the pressure value detected by the first sensor 31 , so that the pressure value in the accommodating box 30 is consistent with the external pressure value.
  • the first sensor 31 can continuously detect the pressure value in the accommodating box 30, and adjust the air inlet and exhaust port of the accommodating box 30 according to the detected pressure value. 35 on and off.
  • the gas storage box 50 may be filled with high-compression protective gas, for example, the gas storage box 50 is filled into the gas storage box 50 after being compressed by a device such as a compression pump.
  • a second sensor 51 may also be arranged in the gas storage box 50 , and the second sensor 51 may be arranged on the top of the gas storage box 50 to detect the concentration value or pressure value of the protective gas in the gas storage box 50 .
  • the second sensor 51 may be signal-connected to the processor of the transport box.
  • the second sensor 51 detects the protective gas concentration value in the gas storage box 50, and can transmit the measured protective gas concentration information to the processor of the transmission box in a wired or wireless manner.
  • the controller sends out an alarm message, prompting the user to replace the gas storage box 50 .
  • the second sensor 51 detects the pressure value in the air storage box 50, and transmits the measured pressure information to the processor of the transmission box in a wired or wireless manner.
  • the controller sends out an alarm message, prompting the user to replace the gas storage box 50 .
  • the air storage box 50 and the accommodating box 30 are detachably connected.
  • the accommodating box 30 is provided with a card slot 60
  • the gas storage box 50 is installed in the card slot 60 by snapping.
  • the gas storage box 50 can be made into a uniform specification, and the arrangement in this way facilitates the replacement of the gas storage box 50 and shortens the time required for the replacement of the gas storage box 50 .
  • FIG. 3 when the gas storage box 50 needs to be replaced, the used gas storage box 50 is pulled out from the card slot 60 , and then a new gas storage box 50 is inserted into the card slot 60 .
  • the air inlet of the gas storage box 50 is connected to the protective gas pump.
  • the gas storage box 50 is filled with protective gas through the protective gas pump to maintain the protective gas in the gas storage box 50 content. In this way, when the protective gas in the gas storage box 50 is insufficient, it can be filled in time to prevent the protective gas in the storage box 30 from being unable to cover the wafer 40 .
  • the conveying box includes an accommodating box 30 and an air storage box 50, the object to be conveyed is placed in the accommodating box 30, and the air storage box 50 is filled with protective gas;
  • the accommodating box 30 is provided with an air inlet and an exhaust port 35 , the air inlet of the accommodating box 30 is communicated with the air storage box 50, and the first sensor 31 for detecting the pressure value in the accommodating box 30 is also provided in the accommodating box 30;
  • the air inlet fills the accommodating box 30 with protective gas, and the exhaust port 35 of the accommodating box 30 is opened; when the time from the initial state is greater than the first set time, and when the pressure value is less than the first set value, the The exhaust port 35 is closed, and the gas storage box 50 fills the accommodating box 30 with protective gas through the air inlet of the accommodating box 30 .
  • the accommodating box 30 By continuously injecting protective gas into the accommodating box 30, after the exhaust gas in the accommodating box 30 is discharged, the accommodating box 30 is kept filled with protective gas, so that the objects to be conveyed in the accommodating box 30 are in the protective gas, preventing the accommodating box 30 from being filled with protective gas.
  • the objects to be conveyed in 30 are polluted, which reduces the surface defects of the objects to be conveyed, thereby improving the yield of the objects to be conveyed.
  • references to the terms “one embodiment,” “some embodiments,” “illustrative embodiments,” “examples,” “specific examples,” or “some examples” and the like are meant to incorporate embodiments A particular feature, structure, material, or characteristic described or exemplified is included in at least one embodiment or example of the present application.
  • schematic representations of the above terms do not necessarily refer to the same embodiment or example.
  • the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

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Abstract

一种传送盒及物料传送系统，传送盒包括容纳盒（30）和储气盒（50），容纳盒（30）设有进气口和排气口（35），容纳盒（30）的进气口与储气盒（50）连通；容纳盒（30）内还设有用于检测容纳盒（30）内压力值的第一传感器（31）；在初始状态时，容纳盒（30）的排气口（35）打开，储气盒（50）通过容纳盒（30）的进气口向容纳盒（30）充保护气体；当距初始状态的时间大于第一设定时间且当压力值小于第一设定值时，容纳盒（30）的排气口（35）关闭，储气盒（50）通过容纳盒（30）的进气口向容纳盒（30）充保护气体，容纳盒（30）在排出废气后持续填充有保护气体，可以防止容纳盒（30）内的待传送物受到污染。物料传送系统包括传送盒。

Description

传送盒及物料传送系统
本申请要求于2020年09月30日提交中国专利局、申请号为202011066333.6、申请名称为“传送盒及物料传送系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及物料传送技术领域，尤其涉及一种传送盒及物料传送系统。
背景技术
半导体制造过程通常包括多个制程，例如光刻、沉积、固化、退火等，晶圆通常放置在不同的设备中进行相应的制程。晶圆在不同的设备之间可以通过传送盒进行传送和储存，例如，传送盒为前开式传送盒(Front Opening Unified Pod，简称FOUP)。
传送盒内的微环境对晶圆表面的形态有重要影响。为防止制程结束后传送盒内的残留物或者外界环境中的污染物进入传送盒内损坏晶圆表面，传送盒通常为密封结构，通过在传送盒的内部填充惰性气体，例如氮气，以清除传送盒内的残留物或污染物，减少或者避免晶圆的表面缺陷。
然而，当制程之间的等待时间较长时，传送盒中的惰性气体的易产生泄漏，从而使得晶圆的表面缺陷增加，导致晶圆的良品率降低。
发明内容
鉴于上述问题，本申请提供一种传送盒及物料传送系统，用于提高待传送物的良品率。
为了实现上述目的，本申请提供如下技术方案：
第一方面，本申请提供一种传送盒，包括容纳盒和储气盒，所述容纳盒设有进气口和排气口，所述容纳盒的进气口与所述储气盒连通，所述容纳盒内还设有第一传感器，所述第一传感器检测所述容纳盒内的压力值；在初始状态时，所述容纳盒的排气口打开，所述储气盒通过所述容纳盒的 进气口向所述容纳盒充保护气体；当距所述初始状态的时间大于第一设定时间，且当所述压力值小于第一设定值时，所述容纳盒的排气口关闭，所述储气盒通过所述容纳盒的进气口向所述容纳盒充保护气体。
本申请提供的传送盒具有如下优点：
本申请中，传送盒包括容纳盒和储气盒，容纳盒中放置待传送物，储气盒中填充有保护气体；容纳盒设有进气口和排气口，容纳盒的进气口与储气盒连通，容纳盒内还设有用于检测容纳盒内的压力值的第一传感器；在初始状态时，容纳盒的排气口打开，储气盒通过容纳盒的进气口向容纳盒充保护气体；当距初始状态的时间大于第一设定时间，且当压力值小于第一设定值时，容纳盒的排气口关闭，储气盒通过容纳盒的进气口向容纳盒充保护气体，容纳盒在废气排出后持续填充有保护气体，使得容纳盒内的待传送物可以持续处于保护气体之中，防止容纳盒内的待传送物受到污染，减少待传送物的表面缺陷，进而提高待传送物的良品率。
如上所述的传送盒中，当距所述初始状态的时间大于第一设定时间，且当所述压力值大于所述第一设定值时，所述容纳盒的进气口关闭，所述容纳盒的排气口打开。
如上所述的传送盒中，当距所述初始状态的时间大于第一设定时间，且当所述压力值等于所述第一设定值时，所述容纳盒的进气口和排气口关闭。
如上所述的传送盒中，当距所述初始状态的时间小于第一设定时间时，所述容纳盒的进气口和排气口打开，所述储气盒通过所述容纳盒的进气口向所述容纳盒中充保护气体，以将所述容纳盒的废气从所述容纳盒的排气口排出。
如上所述的传送盒中，所述容纳盒为圆柱状盒体，所述容纳盒的进气口包括设置在所述容纳盒的侧壁上的多个第一进气口，多个所述第一进气口沿所述容纳盒的轴向间隔设置。
如上所述的传送盒中，所述容纳盒的进气口还包括设置在所述容纳盒的顶部的多个第二进气口，以及设置在所述容纳盒的底部的多个第三进气口。
如上所述的传送盒中，当所述压力值小于所述第一设定值时，所述储气盒通过所述第一进气口、所述第二进气口和所述第三进气口以第一流速 向所述容纳盒中充保护气体。
如上所述的传送盒中，所述第三进气口与所述容纳盒的排气口设置在所述容纳盒的同一侧；当距所述初始状态的时间小于第一设定时间时，所述储气盒通过所述第一进气口、所述第二进气口以第二流速向所述容纳盒中充保护气体，所述第三进气口关闭。
如上所述的传送盒中，所述储气盒中设置有第二传感器，所述第二传感器检测所述储气盒中的保护气体浓度值，当所述保护气体浓度值小于第二设定值时，所述储气盒中的所述保护气体不足。
第二方面，本申请还提供了一种物料传送系统，包括传送链、驱动装置，以及如上所述的传送盒；所述传送盒挂装在所述传送链上，所述驱动装置驱动所述传送链移动。
本申请中的物料传送系统包括上述传送盒，因而具有上述传送盒的优点，可以降低待传送物的表面缺陷，提高待传送物的良品率，具体效果参照上文所述，在此不再赘述。
附图说明
图1为本申请实施例中的传送盒的结构示意图；
图2为本申请实施例中的储气盒的结构示意图；
图3为本申请实施例中的储气盒的安装示意图；
图4为本申请实施例中的传送盒的工作流程图。
具体实施方式
本申请实施例中，传送盒包括容纳盒和储气盒，容纳盒内设有用于检测容纳盒内压力值的第一传感器，在容纳盒排出废气后，且当压力值小于第一设定值时，容纳盒的排气口关闭，储气盒由容纳盒的进气口向容纳盒内充入保护气体，使得容纳盒持续填充有保护气体，从而防止容纳盒内的待传送物受到污染，提高待传送物的良品率。
为了使本申请实施例的上述目的、特征和优点能够更加明显易懂，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请的一部分实施例，而不 是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动的前提下所获得的所有其它实施例，均属于本申请保护的范围。
本申请实施例提供的物料传送系统适用于多种不同产品的生产制造过程中，例如，半导体产品、精密电子产品、仪器、仪表、模具产品等。利用该物料传送系统可以使待传送物在不同设备之间进行转移、存储、加工或表面处理。
例如，以半导体制造为例，晶圆通常经过沉积、研磨、光刻、掺杂、清洁等制程，形成所需半导体产品。不同的制程常需要在不同的设备上进行，例如，利用沉积设备在晶圆上形成薄膜，利用研磨设备对晶圆进行平坦化处理，利用光刻设备对晶圆进行图形化处理，利用注入设备在晶圆的特定区域进行离子注入。晶圆在上述各设备之间可以通过物料传送系统进行移动和储存，以实现相应的制程。
本申请实施例以及以下各实施例均以用于传输晶圆的物料传送系统为例进行详述。
本申请实施例提供的物料传送系统包括传送装置、驱动装置和传送盒，传送盒内放置晶圆，传送装置带动传送盒的移动。示例性的，传送装置为传送带或者传送链，传送装置与传送盒之间通常可拆卸连接。驱动装置与传送装置连接，以驱动传送装置移动，进而将传送盒和放置在传送盒内的晶圆转移至不同的制程。
进一步地，本申请实施例提供的物料传送系统除了包括上述装置外，还包括控制系统，用于控制驱动装置以及传送盒等。控制系统可以包括制造执行系统(Manufacturing Execution System，简称MES)，MES与传送盒信号连接，接收传送盒中的信号、向传送盒中发射信号，以及控制传送盒中的阀门的打开或关闭。
当使用上述物料传送系统时，晶圆在一个设备完成相应制程后放入传送盒中，传送盒可以挂装在传送链上，驱动装置带动传送链移动至下一个设备，从而将传送盒移动至下一个设备，再从传送盒中取出晶圆进行其它制程。
传送盒可以通过夹持部件安装在传送装置上，例如，传送盒通过机械手挂装在传送链上；传送盒也可以通过自动搬运装置安装在传送装置上， 例如，传送盒通过空中升降机输动车(Overhead Hoist Transport，简称OHT)或者自动引导传输车(Automated Guided Vehicle，简称AGV)与传送链对接，从而将传送盒转送并安装在传送链上。
参照图1，在一些实施例中，传送盒的顶部一般设置有连接部10，通过连接部10将传送盒挂装在物料传送系统的传送链上，以供物料传送系统移动传送盒。连接部10可以为法兰、把手等。示例性的，连接部10可以位于传送盒的顶部的中间部位，避免晶圆40传送过程中，传送盒倾斜而导致传送盒内的晶圆40移动，损伤晶圆40。
传送盒的底部一般设置有安装座20，安装座20用于当传送盒被停止传送时支撑传送盒，以及将传送盒与其他设备连接，以保证传送盒在晶圆进行相关制程时稳定不动。
继续参照图1，传送盒包括容纳盒30和储气盒50，容纳盒30用于放置晶圆40，储气盒50用于存储保护气体，保护气体可以为惰性气体，例如，保护气体为氩气、氦气或者氮气中的一种或多种。
容纳盒30中可以设置有多个间隔设置的晶圆储存架，用于放置晶圆40，使得多个晶圆40堆叠设置，并且多个晶圆40之间相互分开。示例性的，容纳盒30的内侧壁上设置有上述晶圆储存架，晶圆储存架可以为设置在容纳盒30的内侧壁的槽体。每个晶圆储存架上放置有一个晶圆40，晶圆40以如图1中所示的方式水平放置在容纳盒30内。
容纳盒30可以为柱状，例如，容纳盒30可以为圆柱状、椭圆柱状或者棱柱状。当容纳盒30为圆柱状时，晶圆40的形状为与容纳盒30相匹配的圆形，如此设计，容纳盒30内的空间利用率较高，本申请实施例及以下各实施例中，以容纳盒30为圆柱状为例进行阐述，可以理解的是，容纳盒30不仅限于圆柱状。
继续参照图1，容纳盒30设置有进气口、排气口35和第一传感器31。容纳盒30的进气口与储气盒50连通，容纳盒30的排气口35与外界连通，通过容纳盒30的进气口向容纳盒30充入保护气体，通过容纳盒30的排气口35排气，从而使得容纳盒30可以排出废气并维持容纳盒30内的纯净，即容纳盒30内可以维持保护气体包覆晶圆40，从而避免污染物接触晶圆40，损伤晶圆40表面。
容纳盒30的进气口可以设置在容纳盒30的顶部、侧部或者底部，容 纳盒30的排气口35也可以设置在容纳盒30的顶部、侧部或者底部。容纳盒30的进气口和排气口35均可以设置有多个，以提高容纳盒30排出废气以及填充保护气体的效率。参照图1，容纳盒30的侧壁设置有多个第一进气口32，多个第一进气口32间隔排布。
示例性的，多个第一进气口32可以沿容纳盒30的轴向间隔排布，即依次连接多个第一进气口32形成的虚线与容纳盒30的轴线(中心线)相平行。如图1所示，多个第一进气口32沿竖直方向排布，即每个第一进气口32位于相邻的第一进气口32的正上方或者正下方。为使得容纳盒30中具有较好的进气效果，多个第一进气口32可以等间隔排布。
可以理解的，容纳盒30与储气盒50之间存在气流通道，如图1所示，容纳盒30右侧的竖直部分即为气流通道，气流通道连通储气盒和多个第一进气口32。
需要说明的是，多个第一进气口32也可以沿容纳盒30的侧壁周向排布，例如，多个第一进气口32沿容纳盒30的侧壁螺旋形排布，多个第一进气口32的螺旋中心线与容纳盒30的中心线相重合。
容纳盒30的顶部可以设置有多个第二进气口33，容纳盒30的底部可以设置有多个第三进气口34，以进一步提高容纳盒30的进气速率，使得容纳盒30中可以较快的充满保护气体。容纳盒30的排气口35也设置有多个，多个排气口35设置在容纳盒30的底部，以使得容纳盒30内的废气可以较快排出。
第一进气口32、第二进气口33以及第三进气口34可以共同构成容纳盒30的进气口。第一进气口32的数量可以多于第二进气口33的数量和第三进气口34的数量，第二进气口33的数量可以与第三进气口34的数量相同。例如，每个第二进气口33均与一个第三进气口34相对设置。
继续参照图1，容纳盒30内还设置有第一传感器31，第一传感器31检测容纳盒30内的压力值。第一传感器31可以为压力传感器，压力传感器检测并传输容纳盒30内的压力信息。例如，第一传感器31可以通过无线传输的方式将所测得的压力信息输出至传送盒的处理器。
传送盒的处理器可以单独设置，例如，处理器设置在传送盒内；处理器也可以为物料传送系统中的控制系统或者控制系统的一部分。处理器与第一传感器31信号连接，可以接收第一传感器31检测到的压力信息，并 与第一预设值进行比较，其中，第一设定值可以为外界大气压值。处理器还可以控制容纳盒30的进气口和排气口35的阀门动作，以实现容纳盒30的进气口和排气口35的打开和关闭。
需要说明的是，容纳盒30中可以设置有一个第一传感器31，例如，第一传感器31设置在容纳盒30的底部；容纳盒30中也可以设置有多个第一传感器31，多个第一传感器31设置在容纳盒30内的不同位置，以提高容纳盒30内压力值的检测准确性。
参照图4，以下结合图4详述本申请实施例中的传送盒的工作过程，该传送盒中，容纳盒30包括设置在容纳盒30侧壁的多个第一进气口32、设置在容纳盒30顶部的多个第二进气口33，以及设置在容纳盒30底部的多个第三进气口34和多个排气口35。即容纳盒30的多个第三进气口34与容纳盒30的多个排气口35位于容纳盒30的同一侧。如图1所示，多个排气口35可以环绕传送盒的安装座20设置。
初始状态时，容纳盒30的进气口和排气口35均打开，容纳盒30进行排废气过程，储气盒50通过容纳盒30的进气口向容纳盒30内充保护气体，废气由容纳盒30的排气口35排出。
在一些可能的示例中，容纳盒30的第一进气口32、第二进气口33以及排气口35均打开，储气盒50通过容纳盒30的第一进气口32和第二进气口33以第二流速向容纳盒30内充保护气体，以将废气从容纳盒30的排气口35中排出，容纳盒30的第三进气口34关闭，以防止容纳盒30的第三进气口34的气体对废气形成反冲而导致废气不能完全排出。
可以理解的是，储气盒50内的保护气体流经容纳盒30的第一进气口32的流速与流经容纳盒30的第二进气口33中的流速可以相同，均为第二流速，如此设置，容纳盒30的各进气口的进气均衡。
在另一些可能的示例中，容纳盒30的第二进气口33和排气口35均打开，第一进气口32和第三进气口34均关闭，储气盒50通过第二进气口33以第二流速充入容纳盒30中，废气由容纳盒30的排气口35排出。
需要说明的是，初始状态可以通过传送盒的处理器控制，即当容纳盒30内的第一传感器31收到传送盒的处理器的清洁指令时，传送盒处于初始状态，容纳盒30排出废气。即容纳盒30开始排废气时的状态为初始状态。
当距初始状态的时间小于第一设定时间时，容纳盒30一直处于排废气过程。也就是说，当距初始状态的时间小于第一设定时间时，容纳盒30的进气口和排气口35均打开，储气盒50通过容纳盒30的进气口向容纳盒30中充保护气体，以将容纳盒30的废气从容纳盒30的排气口35排出。
第一预设时间大于或者等于容纳盒30排完废气的时间，根据容纳盒30的容积、进气流量以及排气流量设定，示例性的，第一预设时间可以为5～10分钟。可以理解的是，当距初始状态的时间等于第一预设时间时，容纳盒30内的废气已经排干净，容纳盒30内充满保护气体，此时，容纳盒30的进气口与排气口35可以关闭。
距初始状态的时间可以通过计时装置进行检测，计时装置与传送盒的处理器信号连接。计时装置可以单独设置在容纳盒30内，与处理器信号连接；计时装置也可以设置在容纳盒30外，与处理器信号连接，例如，计时装置为处理器的一部分。
计时装置可以计时器或者定时器。示例性的，计时装置为计时器，当传送盒处于初始状态时，计时器开始计时，当计时器计时达到第一预设时间时，处理器控制传送盒的进气口和排气口关闭。或者，计时装置为定时器，定时器的时间等于第一预设时间，当传送盒处于初始状态时，定时器开始倒计时，定时器倒计时完毕时，处理器控制传送盒的进气口和排气口关闭。
当距初始状态的时间大于第一设定时间时，传送盒进行如下过程：
当第一传感器31检测到的压力值小于第一设定值时，容纳盒30的排气口35关闭，容纳盒30的进气口打开。储气盒50通过容纳盒30的进气口向容纳盒30充保护气体，使得容纳盒30内充满保护气体，以维持容纳盒30内的晶圆40始终处于保护气体之中。
示例性的，当第一传感器31检测到的压力值小于第一设定值时，容纳盒30的第一进气口32、第二进气口33和第三进气口34均打开，储气盒50以第一流速向容纳盒30内充保护气体。即第一进气口32、第二进气口33和第三进气口34均以第一流速向容纳盒30内充保护气体，第一流速可以小于第二流速。
当第一传感器31检测到的压力值等于第一设定值时，容纳盒30的进气口和排气口35均关闭。容纳盒30内的压力值等于外界大气压值，容纳 盒30内处于平衡状态，此时容纳盒30既不进气也不排气。
当第一传感器31检测到的压力值大于第一设定值时，容纳盒30的进气口关闭，容纳盒30的排气口35打开，容纳盒30通过向外界排出保护气体降低容纳盒30内的压力值，以防止容纳盒30因内部压力过大而损坏。
可以理解的是，第一传感器31检测到的压力值小于第一设定值、第一传感器31检测到的压力值等于第一设定值，以及第一传感器31检测到的压力值大于等于第一设定值并不具有顺序性。传送盒的处理器根据第一传感器31检测到的压力值控制容纳盒30的进气口和排气口35的阀门动作，从而使得容纳盒30内的压力值与外界压力值相一致。
需要说明的是，传送盒在两个制程之间的等待时间中，第一传感器31可以持续检测容纳盒30内的压力值，根据检测到压力值调节容纳盒30的进气口和排气口35的打开以及关闭。
继续参照图1，储气盒50内可以填充有高压缩保护气体，例如，通过压缩泵等装置将保护气体压缩后充入储气盒50内。如图2所示，储气盒50内还可以设置有第二传感器51，第二传感器51可以设置在储气盒50的顶部，用于检测储气盒50内的保护气体浓度值或者压力值。第二传感器51可以与传送盒的处理器信号连接。
在一些可能的示例中，第二传感器51检测储气盒50内的保护气体浓度值，并可以将所测得的保护气体浓度信息以有线或者无线的方式传输至传送盒的处理器。当第二传感器51检测到的保护气体浓度值小于第二设定值时，控制器发出报警信息，提示用户更换储气盒50。
在另一些可能的示例中，第二传感器51检测储气盒50内的压力值，并将所测得的压力信息以有线或者无线的方式传输至传送盒的处理器。当第二传感器51检测到的压力值小于第三设定值时，控制器发出报警信息，提示用户更换储气盒50。
储气盒50与容纳盒30之间可拆卸连接，例如，容纳盒30上设置有卡槽60，储气盒50卡合安装在卡槽60内。储气盒50可以制作成统一规格，如此设置，方便储气盒50的更换，缩短更换储气盒50所需时间。如图3所示，当储气盒50需要更换时，将使用的储气盒50从卡槽60中抽出，然后将新的储气盒50插入卡槽60中即可。
或者，储气盒50的进气口与保护气体泵相连接，当需要更换储气盒 50时，通过保护气体泵向储气盒50充入保护气体，以维持储气盒50内的保护气体含量。如此设置，当储气盒50内的保护气体不足时，可以及时充入，以避免容纳盒30内的保护气体不能包覆晶圆40。
本申请实施例中，传送盒包括容纳盒30和储气盒50，容纳盒30中放置待传送物，储气盒50中填充有保护气体；容纳盒30设有进气口和排气口35，容纳盒30的进气口与储气盒50连通，容纳盒30内还设有用于检测容纳盒30内的压力值的第一传感器31；在初始状态时，储气盒通过容纳盒30的进气口向容纳盒30充保护气体，容纳盒30的排气口35打开；当距初始状态的时间大于第一设定时间，且当压力值小于第一设定值时，容纳盒30的排气口35关闭，储气盒50通过容纳盒30的进气口向容纳盒30充保护气体。通过向容纳盒30中持续冲入保护气体，在容纳盒30内的废气排出后继续维持容纳盒30内填充有保护气体，使得容纳盒30内的待传送物处于保护气体之中，防止容纳盒30内的待传送物受到污染，减少待传送物的表面缺陷，进而提高待传送物的良品率。
本说明书中各实施例或实施方式采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分相互参见即可。
本领域技术人员应理解的是，在本申请的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的系统或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本申请的限制。
在本说明书的描述中，参考术“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合实施方式或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
最后应说明的是：以上各实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述各实施例对本申请进行了详细的说明，本领域的 普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (10)

  1. 一种传送盒，其中，包括容纳盒和储气盒，所述容纳盒设有进气口和排气口，所述容纳盒的进气口与所述储气盒连通，所述容纳盒内还设有第一传感器，所述第一传感器检测所述容纳盒内的压力值；
    在初始状态时，所述容纳盒的排气口打开，所述储气盒通过所述容纳盒的进气口向所述容纳盒充保护气体；当距所述初始状态的时间大于第一设定时间，且当所述压力值小于第一设定值时，所述容纳盒的排气口关闭，所述储气盒通过所述容纳盒的进气口向所述容纳盒充保护气体。
  2. 根据权利要求1所述的传送盒，其中，当距所述初始状态的时间大于第一设定时间，且当所述压力值大于所述第一设定值时，所述容纳盒的进气口关闭，所述容纳盒的排气口打开。
  3. 根据权利要求1所述的传送盒，其中，当距所述初始状态的时间大于第一设定时间，且当所述压力值等于所述第一设定值时，所述容纳盒的进气口和排气口关闭。
  4. 根据权利要求1所述的传送盒，其中，当距所述初始状态的时间小于第一设定时间时，所述容纳盒的进气口和排气口打开，所述储气盒通过所述容纳盒的进气口向所述容纳盒中充保护气体，以将所述容纳盒的废气从所述容纳盒的排气口排出。
  5. 根据权利要求1-4任一项所述的传送盒，其中，所述容纳盒为圆柱状盒体，所述容纳盒的进气口包括设置在所述容纳盒的侧壁上的多个第一进气口，多个所述第一进气口沿所述容纳盒的轴向间隔设置。
  6. 根据权利要求5所述的传送盒，其中，所述容纳盒的进气口还包括设置在所述容纳盒的顶部的多个第二进气口，以及设置在所述容纳盒的底部的多个第三进气口。
  7. 根据权利要求6所述的传送盒，其中，当所述压力值小于所述第一设定值时，所述储气盒通过所述第一进气口、所述第二进气口和所述第三进气口以第一流速向所述容纳盒中充保护气体。
  8. 根据权利要求6所述的传送盒，其中，所述第三进气口与所述容纳盒的排气口设置在所述容纳盒的同一侧；
    当距所述初始状态的时间小于第一设定时间时，所述储气盒通过所述 第一进气口、所述第二进气口以第二流速向所述容纳盒中充保护气体，所述第三进气口关闭。
  9. 根据权利要求1-4任一项所述的传送盒，其中，所述储气盒中设置有第二传感器，所述第二传感器检测所述储气盒中的保护气体浓度值，当所述保护气体浓度值小于第二设定值时，所述储气盒中的所述保护气体不足。
  10. 一种物料传送系统，其中，包括传送链、驱动装置，以及如权利要求1-9任一项所述的传送盒；
    所述传送盒挂装在所述传送链上，所述驱动装置驱动所述传送链移动。
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