CN111223805A - 一种晶圆盒及充气系统 - Google Patents

一种晶圆盒及充气系统 Download PDF

Info

Publication number
CN111223805A
CN111223805A CN201911078941.6A CN201911078941A CN111223805A CN 111223805 A CN111223805 A CN 111223805A CN 201911078941 A CN201911078941 A CN 201911078941A CN 111223805 A CN111223805 A CN 111223805A
Authority
CN
China
Prior art keywords
wafer
box
gas
inflation system
new
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201911078941.6A
Other languages
English (en)
Other versions
CN111223805B (zh
Inventor
陈叶源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blue Plan Beijing Technology Co ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201911078941.6A priority Critical patent/CN111223805B/zh
Publication of CN111223805A publication Critical patent/CN111223805A/zh
Application granted granted Critical
Publication of CN111223805B publication Critical patent/CN111223805B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

本发明涉及集成电路技术领域，且公开了一种晶圆盒及充气系统，包括箱体和箱盖，所述箱体和箱盖活动连接，所述箱盖的内部设有加热腔，所述加热腔通过进气阀连接外部换气设备。该晶圆盒及充气系统，通过较热的新气将旧气压出，由于新旧气的温度不同，密度也不相同，自然形成分层，减少新旧气的对流和混合，注入等体积的新气即可完成旧气的替换，且替换效果更好，通过检测排气阀的排气温度或箱体的底部温度即可了解是否完成替换，更加直观明了，另一方面，新气为温度较高洁净气体，而旧气温度较低，新旧气相遇不会出现因为温度变化而产生的液化现象，托举槽设置的斜面使晶圆朝着一个方向倾斜，盖上箱盖时也不用刻意对准。

Description

一种晶圆盒及充气系统
技术领域
本发明涉及集成电路技术领域，具体为一种晶圆盒及充气系统。
背景技术
集成电路制作过程中需要经过多种工艺，这些工艺需要在不同区域内进行，晶圆的搬运和存储都需要使用晶圆盒，随着半导体制成技术不断微缩，对晶圆盒内部的环境要求越来越高，需要定时的对晶圆盒进行换气，排除内部水分和氧气，延长晶圆制成的最长等待时间。
在进行换气的时候，由于气体为同种气体，其晶圆盒内空间狭小且分散，气体流动时会产生对流使新气旧气融合在一起，需要填充较多的其他才能将旧气替换出去，同时，由于新旧气体的温度并不相同，当新气的温度低于旧气的时候，旧气中的水汽可能会液化凝结在晶圆表面上，降低晶圆品质，另一方面，由于新旧气为同种气体，难以检测旧气是否完全被新气替换完毕，须得根据经验确定换气时间，但由于晶圆摆放密度和角度以及环境的不同，特别对流产生的死角，换气的时间及效果难以把握。
其次，为了便于放入晶圆，晶圆盒的限位卡槽的宽度大于晶圆及晶圆承载装置的宽度，再用晶圆盒的限位卡槽将晶圆固定，实际使用中，较宽的限位卡槽使得晶圆朝着不同方向倾斜，不方便合上盒盖，为了使晶圆方向倾斜一致，需将晶圆盒放置在一个斜面上，操作颇为不便。
发明内容
针对上述背景技术的不足，本发明提供了一种晶圆盒及充气系统的技术方案，具有充气快速和操作方便的优点，解决了背景技术提出的问题。
本发明提供如下技术方案：一种晶圆盒及充气系统，包括箱体和箱盖，所述箱体和箱盖活动连接，所述箱盖的内部设有加热腔，所述加热腔通过进气阀连接外部换气设备，所述加热腔通过进气通道连通箱体的内腔，所述箱体的底部设有排气阀。
优选的，每片晶圆的两侧均设有至少一个所述进气通道。
优选的，所述箱盖的底部设有固定槽，所述进气通道连通固定槽两侧的内部空腔，所述固定槽内部空腔通过气孔连通箱体的内腔。
优选的，所述箱体的两侧低端固定安装托举槽，所述箱体的底部设置为斜面，所述排气阀安装在箱体的斜面低端。
优选的，所述托举槽的底部一侧设置有斜面。
优选的，所述固定槽对应托举槽底部斜面的一侧适当延长，所述固定槽的延长段设置有两段斜面，且上段斜面接近竖直。
优选的，所述排气阀或箱体的最低处设有温度传感器。
本发明具备以下有益效果：
1、该晶圆盒及充气系统，通过较热的新气将旧气压出，由于新旧气的温度不同，密度也不相同，自然形成分层，减少新旧气的对流和混合，注入等体积的新气即可完成旧气的替换，且替换效果更好，通过检测排气阀的排气温度或箱体的底部温度即可了解是否完成替换，更加直观明了，另一方面，新气为温度较高洁净气体，而旧气温度较低，新旧气相遇不会出现因为温度变化而产生的液化现象。
2、该晶圆盒及充气系统，托举槽设置的斜面使晶圆朝着一个方向倾斜，盖上箱盖时也不用刻意对准，便于操作，特别在自动化的流水线上，对准的精确度要求降低，可节约设备成本。
附图说明
图1为本发明的结构示意图；
图2为本发明中箱体的结构示意图；
图3为本发明中托举槽的使用示意图；
图4为本发明中固定槽的使用示意图。
图中：1、箱体；2、箱盖；3、加热腔；4、进气阀；5、进气通道；6、排气阀；7、固定槽；8、托举槽。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1-4，一种晶圆盒及充气系统，包括箱体1和箱盖2，箱体1和箱盖2活动连接，箱盖2的内部设有加热腔3，加热腔3通过进气阀4连接外部换气设备，新气进入加热腔3后经过加热，温度高于旧气，其密度较低，加热腔3通过进气通道5连通箱体1的内腔，由于新气的密度较低，会充满箱体1顶部，并随着新气的变多逐渐向下压，箱体1的底部设有排气阀6，旧气随着新气的下压，逐渐从排气阀6排出。
其中，每片晶圆的两侧均设有至少一个进气通道5，每个进气通道5均匀出气填充晶圆间的缝隙，替换原有旧气，节省扩散时间，更加高效。
其中，箱盖2的底部设有固定槽7，进气通道5连通固定槽7两侧的内部空腔，固定槽7内部空腔通过气孔连通箱体1的内腔，由于晶圆较薄，将通气孔设在固定槽7的内部可以减少额外空间的占用。
其中，箱体1的两侧低端固定安装托举槽8，箱体1的底部设置为斜面，排气阀6安装在箱体1的斜面低端，由于气体分别从晶圆间的缝隙流过，托平整的底部可能会形成对流，使新旧气混在一起，斜面可回避这一问题。
其中，托举槽8的底部一侧设置有斜面，晶圆放入后，自动滑向低处，使晶圆朝同一方向倾斜。
其中，固定槽7对应托举槽8底部斜面的一侧适当延长，在晶圆倾斜方向一致的前提下，延长段从侧面将晶圆扶正同时通过斜面引导使其卡入限位槽中，固定槽7的延长段设置有两段斜面，且上段斜面接近竖直，固定槽7为橡胶制品，斜面增加了固定槽7底部的宽度，更加容易卡入晶圆。
其中，排气阀6或箱体1的最低处设有温度传感器，通过温度传感器确定换气是否完成。
本发明的工作原理以及工作流程：
依次将晶圆及晶圆承载结构放入箱体1的限位槽中，将箱盖2从上部错位半个卡槽的间距放下，再将箱盖2推正，此时，晶圆顺着固定槽7的斜面滑动并卡入固定槽7内，进一步下压箱盖2使其完全封闭，需要换气时，通过进气阀4连通输气装置，打开排气阀6和加热腔3内部的加热装置，新气，通常为氮气，输入后，在加热腔3内加热，使其温度高于箱体1内旧气，新气通过进气通道5注入两片晶圆之间的缝隙，由于其密度较低，会位于箱体1的上端，随着新气的不断注入，将旧气压出，且由于箱体1底部为斜面，旧气斜向下流出，通过温度传感器判断是否完成换气。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同物限定。

Claims (7)

1.一种晶圆盒及充气系统，包括箱体(1)和箱盖(2)，所述箱体(1)和箱盖(2)活动连接，其特征在于：所述箱盖(2)的内部设有加热腔(3)，所述加热腔(3)通过进气阀(4)连接外部换气设备，所述加热腔(3)通过进气通道(5)连通箱体(1)的内腔，所述箱体(1)的底部设有排气阀(6)。
2.根据权利要求1所述的一种晶圆盒及充气系统，其特征在于：每片晶圆的两侧均设有至少一个所述进气通道(5)。
3.根据权利要求1所述的一种晶圆盒及充气系统，其特征在于：所述箱盖(2)的底部设有固定槽(7)，所述进气通道(5)连通固定槽(7)两侧的内部空腔，所述固定槽(7)内部空腔通过气孔连通箱体(1)的内腔。
4.根据权利要求1所述的一种晶圆盒及充气系统，其特征在于：所述箱体(1)的两侧低端固定安装托举槽(8)，所述箱体(1)的底部设置为斜面，所述排气阀(6)安装在箱体(1)的斜面低端。
5.根据权利要求4所述的一种晶圆盒及充气系统，其特征在于：所述托举槽(8)的底部一侧设置有斜面。
6.根据权利要求5所述的一种晶圆盒及充气系统，其特征在于：所述固定槽(7)对应托举槽(8)底部斜面的一侧适当延长，所述固定槽(7)的延长段设置有两段斜面，且上段斜面接近竖直。
7.根据权利要求5所述的一种晶圆盒及充气系统，其特征在于：所述排气阀(6)或箱体(1)的最低处设有温度传感器。
CN201911078941.6A 2019-11-07 2019-11-07 一种晶圆盒 Active CN111223805B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911078941.6A CN111223805B (zh) 2019-11-07 2019-11-07 一种晶圆盒

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911078941.6A CN111223805B (zh) 2019-11-07 2019-11-07 一种晶圆盒

Publications (2)

Publication Number Publication Date
CN111223805A true CN111223805A (zh) 2020-06-02
CN111223805B CN111223805B (zh) 2023-12-12

Family

ID=70827605

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911078941.6A Active CN111223805B (zh) 2019-11-07 2019-11-07 一种晶圆盒

Country Status (1)

Country Link
CN (1) CN111223805B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022068253A1 (zh) * 2020-09-30 2022-04-07 长鑫存储技术有限公司 传送盒及物料传送系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3122023U (ja) * 2005-12-19 2006-06-01 聯華電子股▲ふん▼有限公司 ウェーハキャリア装置および前開式ウェーハポッド
CN103170469A (zh) * 2011-12-22 2013-06-26 中芯国际集成电路制造(上海)有限公司 用于清洗和干燥晶圆盒的装置及方法
CN207651457U (zh) * 2017-12-22 2018-07-24 昆山成功环保科技有限公司 一种晶圆热处理装置
CN109119318A (zh) * 2017-06-23 2019-01-01 东京毅力科创株式会社 检查气体供给系统的方法
CN109326546A (zh) * 2017-07-31 2019-02-12 富士迈半导体精密工业（上海）有限公司 用于晶圆盒的气体填充装置及气体填充系统

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3122023U (ja) * 2005-12-19 2006-06-01 聯華電子股▲ふん▼有限公司 ウェーハキャリア装置および前開式ウェーハポッド
CN103170469A (zh) * 2011-12-22 2013-06-26 中芯国际集成电路制造(上海)有限公司 用于清洗和干燥晶圆盒的装置及方法
CN109119318A (zh) * 2017-06-23 2019-01-01 东京毅力科创株式会社 检查气体供给系统的方法
CN109326546A (zh) * 2017-07-31 2019-02-12 富士迈半导体精密工业（上海）有限公司 用于晶圆盒的气体填充装置及气体填充系统
CN207651457U (zh) * 2017-12-22 2018-07-24 昆山成功环保科技有限公司 一种晶圆热处理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022068253A1 (zh) * 2020-09-30 2022-04-07 长鑫存储技术有限公司 传送盒及物料传送系统

Also Published As

Publication number Publication date
CN111223805B (zh) 2023-12-12

Similar Documents

Publication Publication Date Title
CN210952133U (zh) 硅片烘干槽
CN111223805A (zh) 一种晶圆盒及充气系统
CN108164259B (zh) 物料排胶和烧结生产线
KR20100037990A (ko) 플로트 유리의 제조방법 및 이의 제조장치
CN117195508A (zh) 一种基于bim的砌块的自动排布方法及装置
CN104029266B (zh) 竹条炭化设备
CN211205680U (zh) 一种密闭阀门用气密性检测装置
CN207205192U (zh) 一种石蜡模具造型通风冷却架
CN207257201U (zh) 一种玻璃马赛克自动铺贴装置
CN210326019U (zh) 一种锂电池化成分容设备
CN215319471U (zh) 一种预焙阳极生坯冷却自动恒温系统
CN208869701U (zh) 一种用于电镀生产线的输送线
CN209971090U (zh) 陶瓷储坯机
CN209480743U (zh) 机架总成及玻璃上下料机
CN208914523U (zh) 一种医用提取板的注塑成型模具
CN107804959B (zh) 玻璃热弯机
CN207387586U (zh) 一种玻璃加工装夹平台
CN201196654Y (zh) 测试台晶圆吸盘装置
CN106477861A (zh) 成型炉
CN110773772A (zh) 用于法兰的钻孔装置
CN217304680U (zh) 一种动态高温炉窑用耐火预制砖的强度检测装置
CN214265775U (zh) 一种pvc型材精密在线定尺切割设备
CN204555591U (zh) 一种新型转移镀铝膜烘干装置
CN209393480U (zh) 一种数码管胶壳的保温作业台
CN207901515U (zh) 一种薄膜生产中的冷却装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20231120

Address after: Room 408, 4th Floor, Floor 101, Building 4, Building 4, No. 3, Fuxing 4th Street, Shunyi District, Beijing 101319

Applicant after: Blue Plan (Beijing) Technology Co.,Ltd.

Address before: No.145, Tiandou West Village, Yanshou village, Houlu Township, Guiping City, Guigang City, Guangxi Zhuang Autonomous Region 537100

Applicant before: Chen Yeyuan

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant