WO2022062041A1 - 背钻刀具及其制备方法 - Google Patents

背钻刀具及其制备方法 Download PDF

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Publication number
WO2022062041A1
WO2022062041A1 PCT/CN2020/124004 CN2020124004W WO2022062041A1 WO 2022062041 A1 WO2022062041 A1 WO 2022062041A1 CN 2020124004 W CN2020124004 W CN 2020124004W WO 2022062041 A1 WO2022062041 A1 WO 2022062041A1
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Prior art keywords
blade
boss
tip
diameter
drilling tool
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PCT/CN2020/124004
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English (en)
French (fr)
Inventor
郑鑫
陈汉泉
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广东鼎泰高科技术股份有限公司
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Priority to JP2023537448A priority Critical patent/JP2023539950A/ja
Publication of WO2022062041A1 publication Critical patent/WO2022062041A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16—Perforating by tool or tools of the drill type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
    • B23P15/32—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools twist-drills

Definitions

  • the present application relates to the technical field of circuit board processing, for example, to a back drilling tool and a preparation method thereof.
  • the Plated-through-hole (PTH) in the multilayer printed circuit board plays the function of interconnecting the inner power layer and the ground layer.
  • PTH Plated-through-hole
  • the PTH hole will become the bottleneck and obstacle of signal integrity. It is like more than one "tail” (Stubs) in the transmission line, acting as a notch filter. In the signal transmission line, this phenomenon occurs in two places. When stubs are planted, a section of oscillation will be formed, whether it is filtering or oscillation, which will damage the high-speed signal transmission and distort the signal.
  • Back-drilling is to remove the copper (Stubs) part of the hole that is not conducive to signal transmission in the PTH hole that has been plated through the method of secondary drilling. favorable. At present, electronic products have entered the era of high-speed signal transmission, and the corresponding requirements for the length of the Stubs remaining in the PTH hole are getting shorter and shorter.
  • the methods of PCB back drilling mainly include: Method 1.
  • Method 1 the blind hole drilling function of the drilling rig is used.
  • the outer layer is used as the signal feedback layer.
  • the feedback signal reaches the Servo, drill down to a preset depth.
  • the diameter of the drill needle of the back drill is generally 0.2mm-0.25mm larger than that of the first drill hole, and the plate goes through the alkaline etching process.
  • the etching will also remove some of the hole copper.
  • the disadvantage of method 1 is that the back-drilling depth of the holes processed by this back-drilling method is consistent, while the thickness of the plate is not uniform.
  • Method 2 use the blind hole drilling function of the drilling rig to set the signal feedback layer in the inner layer (such as the reference layer), and connect the signal feedback layer to the board surface through a tool hole.
  • the preset drilling depth is only With the thickness of one dielectric layer, the precision of back drilling will be greatly improved.
  • the reference layer for back drilling is the ground plane.
  • the disadvantage of method 2 is that the inner layer is used as the signal feedback layer for back drilling, which is excellent in the ability to control the copper length of the hole. The process control is difficult, and the back-drilling diameter is more than 0.3mm larger than the first drilling.
  • the present application provides a back-drilling tool, which can accurately control the hole depth during back-drilling processing.
  • a back-drilling tool which can accurately control the hole depth during back-drilling processing.
  • the present application provides a method for preparing a back-drilling tool, which is used to prepare the above-mentioned back-drilling tool, so that the back-drilling tool can accurately control the hole depth during back-drilling processing, and get rid of the dependence of the hole depth accuracy on the workpiece thickness and process control, Greatly improve the processing efficiency and processing accuracy.
  • an embodiment provides a back-drilling tool for machining an internally conductive workpiece, the back-drilling tool includes a shank and a blade, and the blade includes a blade body, a boss and a blade tip connected in sequence; the The blade body is connected with the handle; the maximum diameter D1 of the blade tip and the diameter D3 of the blade body are both smaller than the diameter D2 of the boss; the outer surfaces of the blade tip and the blade body are non-conductive, and the convex The outer surface of the stage conducts electricity.
  • the tool shank and the cutting edge are made of conductive material.
  • a non-conductive film layer is provided on the outer surface of the blade body and the outer surface of the blade tip, and the outer surface of the connection part between the blade handle and the blade body is provided with a non-conductive film layer. Whether to apply a non-conductive film layer is selected according to the actual production situation.
  • the conductive material may be stainless steel, die steel, high-speed steel, cemented carbide, and the like.
  • the non-conductive film layer may be a film layer prepared by CVD or PVD process.
  • the tool tip includes a pointed neck portion and a tip portion, and the value range of the length L1 of the pointed neck portion is 0.1 mm ⁇ L1 ⁇ 0.5 mm.
  • the length L2 of the boss has a value range of 0.1mm ⁇ L2 ⁇ 0.5mm.
  • the diameter D2 of the boss is the same as the hole diameter to be machined, and 0.02mm ⁇ D2-D1 ⁇ 0.2mm.
  • the maximum diameter D1 of the tool tip is equal to the diameter of the tool body.
  • an embodiment provides a method for preparing a back drilling tool, comprising the following steps:
  • the semi-finished bar includes a handle and a blade, and the blade includes a blade body, a boss and a blade that are connected in sequence.
  • the diameter of the blade is D1 and the The diameter D3 of the blade body is smaller than the diameter D2 of the boss;
  • step S1 the semi-finished bar is obtained by performing outer circle step difference processing on the conductive raw material bar.
  • the back-drilling tool includes a handle, a blade, a transition table and a non-conductive film layer, the blade includes a blade body, a boss and a blade tip connected in sequence, one end of the transition table is connected with the handle, and the other end is connected with the blade body;
  • the maximum diameter of the tip and the diameter of the blade body are both smaller than the diameter of the boss;
  • the outer surfaces of the blade tip and blade body are non-conductive, and the outer surface of the boss is conductive.
  • the boss and the inner layer of the workpiece form an electrical path, which plays a role in signal transmission, so that the hole depth can be precisely controlled.
  • the back-drilling tool preparation method provided by the present application is used for processing the above-mentioned back-drilling tool, so that the back-drilling tool can accurately control the hole depth during back-drilling processing, get rid of the dependence of the hole depth accuracy on the workpiece thickness and process control, and greatly improve the Machining efficiency and machining accuracy.
  • Fig. 1 is the schematic diagram of the first method of back drilling provided by the related art
  • FIG. 2 is a schematic diagram of a second method of back drilling provided by the related art
  • FIG. 3 is a schematic structural diagram of a back drilling tool provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of a method for preparing a back drilling tool provided in an embodiment of the present application.
  • connection should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between the two elements.
  • connection may be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between the two elements.
  • a first feature "on” or “under” a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them.
  • the first feature being “above”, “over” and “above” the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature.
  • the first feature is “below”, “below” and “below” the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.
  • this embodiment provides a back-drilling tool, including a handle 1, a blade 2, a transition table 3 and a non-conductive film layer 4, the handle 1 is used to connect with the power equipment, and the blade 2 is used to The inner conductive workpiece is back drilled, and the transition table 3 is used to connect the tool holder 1 and the tool edge 2.
  • the internally conductive workpiece can be a circuit board.
  • back-drilling the circuit board in order to accurately control the hole depth during back-drilling, and get rid of the dependence of the hole depth accuracy on the thickness of the circuit board and process control, improve the processing efficiency and machining accuracy.
  • the blade 2 includes a blade body 21, a boss 22 and a blade tip 23 connected in sequence, one end of the transition table 3 is connected with the blade body 21, and the other end is connected with the blade handle 1; the diameter D1 of the blade tip 23 and the diameter D3 of the blade body 21 are smaller than the diameter D2 of the boss 22 ; the blade tip 23 and the outer surface of the blade body 21 are non-conductive, and the outer surface of the boss 22 is conductive.
  • the back-drilling tool provided in this embodiment has strong processing ability and can precisely control the length of Stubs, so as to meet the higher requirements of customers.
  • the blade 2 is made of conductive material, and the outer surfaces of the blade tip 23 and the blade body 21 are both coated with a non-conductive film layer 4 .
  • the outer surface of the boss 22 is electrically conductive.
  • the boss 22 is energized with the copper layer inside the circuit board to realize timely feedback of signals and ensure hole depth accuracy.
  • Whether or not to coat the non-conductive film layer 4 on the outer surface of the connection part between the handle 1 and the blade body 21 can be selected according to actual production conditions.
  • a conductive film layer can be coated on the outer surface of the boss 22, and the above-mentioned effects can also be achieved.
  • the back drilling tool uses cemented carbide (tungsten steel) as the raw material, and the material itself has conductivity, and the outer surface of the cutting edge 2 is coated with a non-conductive layer, so that the boss 22 is partially conductive.
  • cemented carbide tungsten steel
  • the back-drilling tool can also use stainless steel, die steel or high-speed steel.
  • the non-conductive film layer 4 is a diamond-like-carbon coating (Dlamond-like-carbon, DLC for short).
  • DLC films have high hardness and elastic modulus, low friction coefficient, wear resistance and good vacuum tribological properties.
  • the blade tip 23 includes a pointed neck portion 231 and a tip portion 232, and the length L1 of the pointed neck portion 231 ranges from 0.1 mm ⁇ L1 ⁇ 0.5 mm.
  • the value range of the length L2 of the boss 22 is 0.1mm ⁇ L2 ⁇ 0.5mm.
  • the diameter D2 of the boss 22 is the same as the hole diameter to be processed, and 0.02mm ⁇ D2-D1 ⁇ 0.2mm, so as to ensure the rigidity and non-conductivity of the tool tip 23 .
  • the diameter D1 of the blade tip 23 is equal to the diameter of the blade body 21 , so as to improve the structural strength of the blade 2 and avoid needle breakage.
  • the handle 1 and the blade body 21 are connected by a transition table 3 .
  • the transition table 3 is in the shape of a trapezoidal truncated truncated cone, which reduces the stress concentration at the connection part and improves the connection strength of the tool handle 1 and the tool body 21 .
  • the present embodiment also provides a method for preparing a back-drilling tool, including the following steps:
  • the semi-finished bar includes a handle 1, a blade 2 and a transition table 3, and the blade 2 includes a blade body 21, a boss 22 and a blade tip 23 connected in sequence , the diameter D1 of the blade tip 23 and the diameter D3 of the blade body 21 are both smaller than the diameter D2 of the boss 22;
  • the semi-finished bar is obtained by performing outer circle step difference processing on the conductive raw material bar.
  • the raw material bar can also be processed into the semi-finished bar material in other ways.
  • the outer circumference of the raw material bar is also subjected to rough and fine grinding.
  • step S4 "select whether to coat the non-conductive film layer 4 on the outer surface of the connection part between the handle 1 and the blade body 21 according to the actual production situation" means when the drilling depth is greater than the length of the blade 2 , in order to prevent the electrical connection between the tool handle 1 and the circuit board from affecting the system control, it is necessary to coat the connection part between the tool edge 2 and the tool handle 1 (in this embodiment, the transition table 3 and part of the tool handle 1) non-conductive coating Film layer 4; when the drilling depth is much smaller than the length of the cutting edge 2, there is no need to coat the non-conductive film layer 4 at the connection between the handle 1 and the cutting edge 2.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Drilling Tools (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)

Abstract

一种背钻刀具及其制备方法。该背钻刀具，包括刀柄(1)和刀刃(2)，刀刃(2)包括依次连接的刀身(21)、凸台(22)和刀尖(23)，刀身连接刀柄；刀尖的最大直径和刀身的直径均小于凸台的直径；刀尖和刀身的外表面不导电，凸台的外表面导电。在加工时，凸台与工件内层形成电通路，起到信号传输作用，从而能够精确的控制孔深，提高加工效率和加工精度。

Description

背钻刀具及其制备方法
本申请要求申请日为2020年9月28日、申请号为202011045343.1的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及电路板加工技术领域，例如涉及一种背钻刀具及其制备方法。
背景技术
多层印制电路板(Printed-Circuit-Board，简称PCB)中镀通孔(Plated-through-hole，简称PTH)起到内层电源层与接地层的相互连通的功能，当系统进入高速讯号传输时，PTH孔将成为信号完整性的瓶颈和障碍，在传输线中犹如一条多于的“尾巴”(Stubs)，扮演着凹痕式滤波器的功能，在信号传输线路中，两处出现这种Stubs时，将形成一段震荡段，不管是滤波或是震荡，对高速讯号传输产生伤害，使信号失真。背钻是通过二次钻孔的方式，将已经完成电镀的PTH孔内，不利于信号传输的孔铜(Stubs)部分去除，背钻后残留的Stubs长度越短，对信号传输的完整性越有利。目前电子产品已经进入高速信号传输时代，相应的对PTH孔内残留的Stubs的长度要求越来越短。
目前，PCB背钻的方法主要包括：方法一、如图1所示，利用钻机的钻盲孔功能，背钻时，以外层作为信号反馈层，当钻针接触到板面时，反馈信号到伺服器，下钻预先设定的深度。背钻的钻针直径一般比第一钻孔大0.2mm-0.25mm，板件走碱蚀流程，背钻步骤在图形电镀后，碱性蚀刻前进行，可以避免钻产生的铜丝，在预设下钻深度时，还要考虑蚀刻时也会去除部分孔铜。方法一的缺点在于：该背钻方法加工的孔的背钻深度都是一致的，而板件的厚度是不均匀的，一般是板件四周薄，中间厚，那么背钻后残留的孔铜长度均一性差，限制了背钻能力的提升，板件越厚，厚度均匀性越差，残留孔铜的长度就越大。方法二、如图2所示，利用钻机的钻盲孔功能，将信号反馈层设置在内层(例如参考层)，通过一个工具孔，将信号反馈层连接到板面，预设钻深只有一层介质层厚度，背钻的精度会大大提高。一般情况下，背钻的参考层为接地层。方法二的缺点在于：以内层作为信号反馈层背钻，在控制孔铜长度能力方面表现优秀，板厚均匀性将不再是背钻的影响因素，但对生产流程中其他步骤能力要 求高，流程控制难度大，同时背钻孔径比第一次钻孔大0.3mm以上。
发明内容
本申请提供了一种背钻刀具，在背钻加工时能精确的控制孔深，通过创新刀具结构设计，摆脱孔深精度对工件厚度和流程控制的依赖性，大大提高加工效率和加工精度。
本申请提供了一种背钻刀具制备方法，用于制备上述背钻刀具，使背钻刀具在背钻加工时能精确的控制孔深，摆脱孔深精度对工件厚度和流程控制的依赖性，大大提高加工效率和加工精度。
一方面，一实施例提供了一种背钻刀具，用于加工内部导电的工件，所述背钻刀具包括刀柄和刀刃，所述刀刃包括依次连接的刀身、凸台和刀尖；所述刀身与所述刀柄连接；所述刀尖的最大直径D1和所述刀身的直径D3均小于所述凸台的直径D2；所述刀尖和所述刀身的外表面不导电，所述凸台的外表面导电。
作为所述的背钻刀具的可选方案，所述刀柄和刀刃由导电材料制成。
作为所述的背钻刀具的可选方案，所述刀身的外表面上、所述刀尖的外表面上均设置有非导电膜层，所述刀柄与所述刀身的连接部位的外表面上依据实际生产情况选择是否涂覆非导电膜层。
作为所述的背钻刀具的可选方案，所述导电材料可以是不锈钢、模具钢、高速钢、硬质合金等。
作为所述的背钻刀具的可选方案，所述非导电膜层可以是CVD或PVD工艺制备的膜层。
作为所述的背钻刀具的可选方案，所述刀尖包括尖颈部和尖端部，所述尖颈部的长度L1的取值范围为0.1mm≤L1≤0.5mm。
作为所述的背钻刀具的可选方案，所述凸台的长度L2的取值范围为0.1mm≤L2≤0.5mm。
作为所述的背钻刀具的可选方案，所述凸台的直径D2与所需加工的孔径相同，且0.02mm≤D2-D1≤0.2mm。
作为所述的背钻刀具的可选方案，所述刀尖的最大直径D1等于所述刀身的直径。
另一方面，一实施例提供了一种背钻刀具制备方法，包括如下步骤：
S1、对导电原料棒料进行预处理获得半成品棒料，所述半成品棒料包括刀柄和刀刃，所述刀刃包括依次连接的刀身、凸台和刀尖，所述刀尖的直径D1和所述刀身的直径D3均小于所述凸台的直径D2；
S2、对所述刀身、凸台和刀尖开螺旋槽；
S3、对所述刀尖的尖端部进行磨尖处理；
S4、在所述刀刃上涂覆非导电膜层，在所述刀柄与所述刀身的连接部位的外表面上依据实际生产情况选择是否涂覆非导电膜层；
S5、将所述凸台上的非导电膜层打磨掉。
作为所述的背钻刀具制备方法的可选方案，在步骤S1中，通过对导电原料棒材进行外圆段差加工以获得所述半成品棒料。
本申请提供的背钻刀具，包括刀柄、刀刃、过渡台和非导电膜层，刀刃包括依次连接的刀身、凸台和刀尖，过渡台一端与刀柄连接，另一端与刀身连接；刀尖的最大直径和刀身的直径均小于凸台的直径；刀尖和刀身的外表面不导电，凸台的外表面导电。在加工时，凸台与工件内层形成电通路，起到信号传输作用，从而能够精确的控制孔深。通过创新刀具结构设计，摆脱孔深精度对工件厚度和流程控制的依赖性，大大提高加工效率和加工精度。
本申请提供的背钻刀具制备方法，用于加工上述背钻刀具，使背钻刀具在背钻加工时能精确的控制孔深，摆脱孔深精度对工件厚度和流程控制的依赖性，大大提高加工效率和加工精度。
附图说明
图1为相关技术提供的背钻方法一的示意图；
图2为相关技术提供的背钻方法二的示意图；
图3为本申请实施例提供的背钻刀具的结构示意图；
图4为本申请实施例提供的背钻刀具制备方法的示意图。
附图标记：
1-刀柄；
2-刀刃；21-刀身；22-凸台；23-刀尖；231-尖颈部；232-尖端部；
3-过渡台；
4-非导电膜层。
具体实施方式
为了使本领域技术人员更好地理解本申请的技术方案，下面结合附图并通过具体实施方式来进一步说明本申请的技术方案。
在本申请的描述中，除非另有明确的规定和限定，术语“相连”、“连接”、“固定”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本实施例的描述中，术语“上”、“下”、“左”、“右”等方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述和简化操作，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅仅用于在描述上加以区分，并没有特殊的含义。
如图3所示，本实施例提供了一种背钻刀具，包括刀柄1、刀刃2、过渡台3和非导电膜层4，刀柄1用于与动力设备连接，刀刃2用于对内部导电的工件进行背钻加工，过渡台3用于连接刀柄1和刀刃2。
内部导电的工件可以是电路板，用于对电路板进行背钻加工时，为了在背钻时能够精确控制孔深，并摆脱孔深精度对电路板厚度和流程控制的依赖性，提高加工效率和加工精度。
可选地，所述刀刃2包括依次连接的刀身21、凸台22和刀尖23，所述过渡台3一端与刀身21连接，另一端与刀柄1连接；所述刀尖23的直径D1和所述刀身21的直径D3均小于所述凸台22的直径D2；所述刀尖23和所述刀身21的外表面不导电，所述凸台22的外表面导电。通过应用上述刀刃2，本实施例提供的背钻刀具，加工能力强，且能够精确控制Stubs长度，以满足客户更高的需求。
简而言之，利用凸台22的导电性，背钻刀具上的凸台22与电路板内层的 铜层接触后，形成通路，起到信号传输作用。相比相关技术中的钻刀，能够实现精确控制钻深，加工效率高。
可选地，所述刀刃2由导电材料制成，所述刀尖23和所述刀身21的外表面上均涂覆有非导电膜层4。所述凸台22的外表面导电，当背钻刀具钻至目标深度时，凸台22与电路板内部的铜层通电，实现信号的及时反馈，保证孔深精度。所述刀柄1与所述刀身21的连接部位的外表面上可依据实际生产情况选择是否涂覆非导电膜层4。可选地，当背钻刀具采用非导电材料制成时，可在凸台22的外表面涂覆导电膜层，也可以达到上述效果。
可选地，所述背钻刀具采用硬质合金(钨钢)为原材料，材质本身就具有导电性，刀刃2的外表面上涂敷非导电层，使凸台22部分起导电作用。示例性地，背钻刀具还可以采用不锈钢、模具钢或高速钢等。
可选地，所述非导电膜层4为类金刚石镀膜涂层(Dlamond-like-carbon，简称DLC)。DLC膜具有高硬度和高弹性模量，低摩擦因数，耐磨损以及良好的真空摩擦学特性。
考虑到便于加工，同时防止断针，所述刀尖23包括尖颈部231和尖端部232，所述尖颈部231的长度L1的取值范围为0.1mm≤L1≤0.5mm。
考虑到凸台22的长度L2要大于电路板内层铜厚，同时为了方便加工，所述凸台22的长度L2的取值范围为0.1mm≤L2≤0.5mm。
可选地，所述凸台22的直径D2与所需加工的孔径相同，且0.02mm≤D2-D1≤0.2mm，以保证所述刀尖23的刚度及不导电性。
在本实施例中，所述刀尖23的直径D1等于所述刀身21的直径，以提高刀刃2的结构强度，避免断针。
示例性地，刀柄1和刀身21通过过渡台3相连接。可选地，过渡台3为梯形圆台状，减小连接部位的应力集中，提高刀柄1和刀身21的连接强度。
为了制备上述背钻刀具，如图4结合图3所示，本实施例还提供了一种背钻刀具制备方法，包括如下步骤：
S1、对导电原料棒料进行预处理获得半成品棒料，所述半成品棒料包括刀柄1、刀刃2和过渡台3，所述刀刃2包括依次连接的刀身21、凸台22和刀尖23，所述刀尖23的直径D1和所述刀身21的直径D3均小于凸台22的直径D2；
S2、对刀身21、凸台22和刀尖23开螺旋槽；
S3、对所述刀尖23的尖端部232进行磨尖处理；
S4、在所述刀刃2上涂覆非导电膜层4，在所述刀柄1与所述刀身21的连接部位的外表面上依据实际生产情况选择是否涂覆非导电膜层4；
S5、将所述凸台22上的非导电膜层4打磨掉。
示例性地，在步骤S1中，通过对导电原料棒材进行外圆段差加工以获得所述半成品棒料。在其他实施例中，还可以通过其他方式将原料棒料加工成所述半成品棒料。
可选地，在步骤S1中，在外圆段差加工之前还包括对原料棒料的外周进行粗精磨。
在步骤S4中，“在所述刀柄1与所述刀身21的连接部位的外表面上依据实际生产情况选择是否涂覆非导电膜层4”是指当钻孔深度大于刀刃2的长度时，为了避免刀柄1与电路板电连通影响系统控制，此时需要在刀刃2和刀柄1的连接部位(在本实施例中为过渡台3处及部分刀柄1)上涂覆非导电膜层4；当钻孔深度远远小于刀刃2的长度时，则无需在刀柄1和刀刃2的连接部位涂覆非导电膜层4。

Claims (10)

  1. 一种背钻刀具，用于加工内部导电的工件，所述背钻刀具包括刀柄(1)和刀刃(2)，其中，所述刀刃(2)包括依次连接的刀身(21)、凸台(22)、刀尖(23)，所述刀身(21)一端与所述刀柄(1)连接；所述刀尖(23)的最大直径D1和所述刀身(21)的直径D3均小于所述凸台(22)的直径D2；所述刀尖(23)和所述刀身(21)的外表面不导电，所述凸台(22)的外表面导电。
  2. 根据权利要求1所述的背钻刀具，其中，所述刀柄(1)和刀刃(2)由导电材料制成。
  3. 根据权利要求2所述的背钻刀具，其中，所述导电材料为不锈钢、模具钢、高速钢或硬质合金。
  4. 根据权利要求2所述的背钻刀具，其中，所述刀身(21)的外表面上和所述刀尖(23)的外表面上均设置有非导电膜层(4)。
  5. 根据权利要求4所述的背钻刀具，其中，所述非导电膜层(4)为CVD或PVD工艺制备的膜层。
  6. 根据权利要求1所述的背钻刀具，其中，所述刀尖(23)包括尖颈部(231)和尖端部(232)，所述尖颈部(231)的长度L1的取值范围为0.1mm≤L1≤0.5mm。
  7. 根据权利要求1所述的背钻刀具，其中，所述凸台(22)的长度L2的取值范围为0.1mm≤L2≤0.5mm。
  8. 根据权利要求1所述的背钻刀具，其中，所述凸台(22)的直径D2与所需加工的孔径相同，且0.02mm≤D2-D1≤0.2mm。
  9. 根据权利要求1所述的背钻刀具，其中，所述刀尖(23)的最大直径D1等于所述刀身(21)的直径。
  10. 一种背钻刀具制备方法，包括如下步骤：
    S1、对导电原料棒料进行预处理获得半成品棒料，所述半成品棒料包括刀柄(1)和刀刃(2)，所述刀刃(2)包括依次连接的刀身(21)、凸台(22)和刀尖(23)，所述刀尖(23)的直径D1和所述刀身(21)的直径D3均小于所述凸台(22)的直径D2；
    S2、对所述刀身(21)、所述凸台(22)和所述刀尖(23)开螺旋槽；
    S3、对所述刀尖(23)的尖端部(232)进行磨尖处理；
    S4、在所述刀刃(2)上涂覆非导电膜层(4)，在所述刀柄(1)与所述刀身(21)的连接部位的外表面上依据实际生产情况选择是否涂覆非导电膜层(4)；
    S5、将所述凸台(22)外表面上的非导电膜层(4)打磨掉。
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