WO2022054630A1 - Lame de coupe et procédé de fabrication de lame de coupe - Google Patents

Lame de coupe et procédé de fabrication de lame de coupe Download PDF

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Publication number
WO2022054630A1
WO2022054630A1 PCT/JP2021/031828 JP2021031828W WO2022054630A1 WO 2022054630 A1 WO2022054630 A1 WO 2022054630A1 JP 2021031828 W JP2021031828 W JP 2021031828W WO 2022054630 A1 WO2022054630 A1 WO 2022054630A1
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WO
WIPO (PCT)
Prior art keywords
plating layer
cutting blade
layer
chip
body portion
Prior art date
Application number
PCT/JP2021/031828
Other languages
English (en)
Japanese (ja)
Inventor
雄策 松田
秀彦 酒井
正豊 松田
健次 堀川
利幸 谷嶋
年宏 嶌本
Original Assignee
株式会社アマダ
株式会社アマダマシナリー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アマダ, 株式会社アマダマシナリー filed Critical 株式会社アマダ
Publication of WO2022054630A1 publication Critical patent/WO2022054630A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/02—Circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/12—Straight saw blades; Strap saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/06—Connecting the ends of materials, e.g. for making abrasive belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/46—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having an endless band-knife or the like

Definitions

  • the present invention relates to a cutting blade and a method for manufacturing the cutting blade.
  • Patent Document 1 describes a band saw blade in which hard abrasive grains such as diamond are fixed to the edge of a body of a steel belt by electrodeposition.
  • the cutting blade according to one aspect of the present invention has a plate-shaped body, a first welding layer made of a brazing material formed on the end face of the body, and a plurality of abrasives superimposed on the first welding layer.
  • the present invention it is possible to provide a cutting blade in which good initial cutting performance is maintained for a long period of time and a cost burden on the operator is small, and a method for manufacturing the cutting blade.
  • FIG. 1 is a diagram showing a cutting blade 91 which is an embodiment of the cutting blade according to the embodiment of the present invention.
  • FIG. 1A is a partial front view of the band saw blade 92, which is the first example of the cutting blade 91.
  • FIG. 1B is a partial front view of the saw blade 93, which is a second example of the cutting blade 91.
  • FIG. 2 is a diagram showing a base material 11P which is a material of the base 11 of the chip body 11s included in the cutting blade 91.
  • FIG. 2A is a plan view of the base material 11P.
  • FIG. 2B is a side view of the base material 11P.
  • FIG. 3 is a cross-sectional view showing a base basic body 11pt including the base material 11P.
  • FIG. 1A is a partial front view of the band saw blade 92, which is the first example of the cutting blade 91.
  • FIG. 1B is a partial front view of the saw blade 93, which is a
  • FIG. 4 is a cross-sectional view showing a chip body 11s obtained by bending the base basic body 11pt.
  • FIG. 5 is a first process chart in the method for manufacturing the band saw blade 92.
  • FIG. 6 is a second process chart in the method for manufacturing the band saw blade 92, and is a cross-sectional view taken along the line 5 at positions S6-S6.
  • FIG. 7 is a cross-sectional view taken along the line S6-S6 in FIG.
  • FIG. 8 is a partial front view showing the body portion 941 of the saw blade 94, which is a modified example of the saw blade 93.
  • FIG. 9 is a partial front view showing the saw blade 94.
  • FIG. 10 is a cross-sectional view taken along the line S10-S10 in FIG.
  • FIG. 1 is a diagram showing a cutting blade 91, which is an example of the cutting blade according to the embodiment of the present invention.
  • FIG. 1A is a partial front view showing a band saw blade 92 which is a first example of a cutting blade 91.
  • FIG. 1B is a partial front view showing a saw blade 93 which is a second example of the cutting blade 91.
  • the band saw blade 92 is a cutting blade 91 in which both ends of a band-shaped body portion 921 are joined to form an endless shape.
  • the band saw blade 92 has a cutting portion 924 at a straight edge portion of the strip-shaped body portion 921.
  • a concave portion 922 recessed in an arc shape and a convex portion 923 of a portion that remains relatively protruding are repeatedly formed at a predetermined pitch Pa.
  • the pitch Pa is, for example, 20 mm.
  • a chip unit 1 is attached to the convex portion 923.
  • the saw blade 93 is a disk-shaped cutting blade 91, and has a cutting portion 934 on the peripheral edge of the disk-shaped body portion 931.
  • the concave portion 932 recessed in an arc shape and the convex portion 933 of the portion that remains relatively protruding are repeatedly formed at a predetermined equal angle pitch ⁇ a.
  • the equiangular pitch ⁇ a is, for example, 18 °.
  • a chip unit 1 is attached to the convex portion 933.
  • the chip unit 1 is a combination of a plurality of chip bodies 11s shown in FIGS. 4 and 5 and integrated. In the band saw blade 92 and the saw blade 93, the two chip bodies 11s are overlapped and integrated.
  • the chip body 11s is integrated with the base 11 of a foil material bent so as to have an L-shaped cross section, a plating layer 12 formed on one surface side of the base 11, and embedded in the plating layer 12. It has a plurality of abrasive grains 13 that are fixed to the surface.
  • 2 (a) and 2 (b) are diagrams showing the base material 11P which finally becomes the base 11.
  • FIG. 2A is a plan view of the base material 11P.
  • FIG. 2B is a side view of the base material 11P.
  • the base material 11P is a brazing material foil.
  • the base material 11P is a rectangular silver brazing foil (Silver Brazing Foil) having a length of about 10 mm, a width of about 5 mm, and a thickness of about 0.1 mm.
  • diamond abrasive grains having an average particle size of about 0.2 mm are prepared as the abrasive grains 13.
  • the base material 11P is immersed in the electrolytic plating solution of the electrolytic plating tank. Then, a plating step of applying nickel plating is executed with the abrasive grains 13 in contact with or close to one surface of the base material 11P at a predetermined density by a jig or the like.
  • the thickness of the plating layer 12 to be formed is, for example, about 0.15 mm.
  • the other surface side of the base material 11P is masked so that the plating layer is not formed.
  • a flat plate-shaped base basic body 11pt having a plating layer 12 and abrasive grains 13 is formed.
  • the plating layer 12 is a nickel plating layer formed on one side of the base material 11P.
  • the abrasive grains 13 are embedded in the plating layer 12, and a part of the tip side is projected and exposed.
  • the bending process of forming the bent portion 11a as shown in FIG. 4 is executed by bending one end side of the base basic body 11pt in the longitudinal direction at a right angle.
  • a chip body 11s having an L-shaped cross section having a bent portion 11a and an original flat portion 11b is formed.
  • the length L11 which is the inner method of the bent portion 11a, is substantially the same as the thickness t92 shown in FIG. 5 of the body portion 921 of the band saw blade 92.
  • the thickness t92 is, for example, 0.8 mm.
  • FIG. 5 shows a state in which the first chip body 11s and the second chip body 11s (hereinafter, simply referred to as two chip bodies 11s) are attached to the body portion 921.
  • one surface of the body portion 921 is referred to as a first surface sf1, and the other surface is referred to as a second surface sf2.
  • the body portion 921 has an endless shape in which the ends thereof are joined to each other.
  • the chip laminated body 1P in which the bent portions 11a of the two chip bodies 11s are overlapped on one convex portion 923 is temporarily fixed to one convex portion 923. There is. Temporary fixing is performed by interposing a flux between the members to be temporarily fixed.
  • the chip laminated body 1P temporarily fixed to the plurality of convex portions 923 of the body portion 921 shown in FIG. 5 is referred to as a manufacturing intermediate 1M of the chip unit 1.
  • the temperature rising step is executed.
  • the production intermediate 1M is heated to a temperature Ta which is equal to or higher than the melting point of the base 11 which is a silver brazing material and lower than the melting point of nickel, maintained for a predetermined time tm, and then naturally to room temperature. Or forcibly lower the temperature.
  • the melting point of the silver brazing material is about 700 ° C.
  • the melting point of nickel is about 1400 ° C. Therefore, the temperature Ta is set to, for example, about 700 to 800 ° C.
  • the time tm maintained at the temperature Ta is, for example, 5 to 15 seconds.
  • a process of raising the temperature of the manufacturing intermediate 1M from room temperature, maintaining the temperature at Ta for a time tm, and then lowering the temperature to room temperature is referred to as a temperature raising process.
  • a temperature raising process After the base 11 is melted by the temperature raising treatment, it solidifies on the convex portion 923.
  • the chip laminate 1P is pressed and held by the jig 81s and the jig 81t so as to be in close contact with the body portion 921. Specifically, the chip laminate 1P is pressed so that the flat portion 11b is compressed by the jig 81s against the body portion 921 in the thickness direction of the body portion 921. Further, the chip laminated body 1P is pressed by the jig 81t so that the two bent portions 11a on which the two chip bodies 11s overlap are pressed against the end surface 921t of the body portion 921.
  • the base 11 in contact with the body portion 921 is melted and then solidified by the temperature raising treatment and welded to the body portion 921. Due to the temperature rise treatment, the base 11 in contact with the nickel plating layer 12 enters the voids formed in the plating layer 12 in the molten state and the recesses or minute cracks existing on the interface with the base 11. And solidify. As a result, the portion of the base 11 on the boundary side with the plating layer 12 is a mixed layer 15 in which nickel and silver wax are substantially mixed and integrated.
  • the base 11 of the outer bent portion 11a is solidified including the mixed layers 151 and 152.
  • the mixed layers 151 and 152 are portions where the molten base 11 has entered into the gaps and minute cracks between the abrasive grains 13 and the plating layer 12 of both the inner and outer bent portions 11a and solidified. Therefore, the plating layer 12 of the inner bent portion 11a and the plating layer 12 of the outer bent portion 11a are more firmly integrated.
  • the base 11 of the chip laminate 1P is well welded to the body portion 921 and is also well integrated with the plating layer 12. In this way, the chip unit 1 in which the two chip bodies 11s are overlapped and integrated is provided on the convex portion 923.
  • the band saw blade 92 having the chip unit 1 shown in FIG. 1A can be obtained. Further, the above-mentioned method for attaching the chip unit 1 using a plurality of chip bodies 11s can also be applied to the convex portion 933 of the saw blade 93. As a result, as a second example of the cutting blade 91, a saw blade 93 having the chip unit 1 shown in FIG. 2B is obtained.
  • a first welded layer 111 in which a base 11 made of a brazing material such as silver brazing is melt-solidified is formed on an end face 921t of a plate-shaped body portion 921.
  • a first plating layer 121 which is a plating layer 12 holding a plurality of abrasive grains 13, is formed on the outside of the first welding layer 111.
  • a second welding layer 112 in which a base 11 made of a brazing material such as silver brazing is melt-solidified is formed so as to be overlapped on the outside of the first plating layer 121.
  • a second plating layer 122, which is a plating layer 12 holding a plurality of abrasive grains 13, is formed on the outside of the second welding layer 112.
  • first welding layer 111 and the first plating layer 121 extend to the first surface sf1 side which is one surface (first surface) of the body portion 921.
  • the second welding layer 112 and the second plating layer 122 extend to the second surface sf2 side, which is the other surface (second surface) opposite to one surface (first surface).
  • the band saw blade 92 two layers, a first plating layer 121 and a second plating layer 122, are formed as a plating layer 12 corresponding to a layer of abrasive grains 13 on the end surface 921t side of the body portion 921.
  • the cutting blade 91 has two plating layers 12 corresponding to the layers of the abrasive grains 13 on the end face side of the blade. Therefore, the machinability of the cutting blade 91 is maintained for a long period of time, and the durability is excellent.
  • the band saw blade 92 only one plating layer 12 corresponding to the layer of the abrasive grains 13 is formed on the first surface sf1 and the second surface sf2, which are the side surfaces.
  • the saw blade 93 has only one plating layer 12 corresponding to the abrasive grains 13 on the side surface side of the blade. Therefore, the cutting width of the cutting blade 91 is not widened, and unnecessary cutting of the work material can be suppressed.
  • the cutting blade according to the embodiment is not limited to the above-mentioned configuration, and may be a modification as long as it does not deviate from the gist of the present invention.
  • the saw blade 93 may be a saw blade 94 having a plurality of through holes 944 in the peripheral portion shown in FIG. 9.
  • FIG. 8 is a partial front view showing the body portion 941 of the saw blade 94.
  • FIG. 9 is a partial front view showing a saw blade 94 in which a plurality of tip units 1 are attached to a body portion 941. The saw blade 94 is attached so that the tip unit 1 closes at least one through hole 944.
  • FIG. 10 is a cross-sectional view taken at the S10-S10 position in FIG.
  • the melted base 11 enters the inside of the through hole 944 in the temperature raising process when the chip body 11s constituting the chip unit 1 is welded. After that, when the melted base 11 solidifies by cooling, an engaging portion 11k caught in the through hole 944 is formed. Therefore, the first welding layer 111 forms an engaging portion 11k engaged with the through hole 944. As a result, the chip unit 1 and the body portion 941 are more firmly integrated, and the risk of the chip unit 1 falling off or the like is reduced. Therefore, the quality and reliability of the saw blade 94 are improved.
  • the second welding layer 112 may form an engaging portion 11k engaged with the through hole 944.
  • the saw blade 94 having a plurality of through holes 944 has an effect that air flows through the through holes 944 to cool the saw blade 93 and promote the discharge of chips during dry cutting or wet cutting. can get.
  • the material and dimensions of the body 921 of the band saw blade 92 are not limited. Further, the material and dimensions of the body portions 931, 941 of the saw blades 93 and 94 are not limited.
  • the material of the brazing material of the base 11 of the chip body 11s is not limited.
  • the plating layer 12 is not limited to nickel plating. It is sufficient that the melting point of the metal forming the plating layer 12 is at least higher than the melting point of the base 11.
  • the abrasive grains 13 are not limited to diamond abrasive grains, and may be abrasive grains made of other materials such as ceramic abrasive grains. Further, the particle size of the abrasive grains of any material is not limited.
  • the cutting blade according to the embodiment includes a plate-shaped body portion 921,931,941 and a first welding layer 111 made of a brazing material formed on an end face 921t of the body portion 921,931,941 and a first.
  • the first plating layer 121 which is laminated on the welding layer 111 and holds a plurality of abrasive grains 13, the second welding layer 112, which is laminated on the first plating layer 121 and is made of a brazing material, and the second welding layer 112.
  • a second plating layer 122 that holds a plurality of abrasive grains 13 that are stacked is provided.
  • two plating layers 12 for holding the abrasive grains 13 are formed on the blade end face side of the cutting blade 91.
  • the machinability of the cutting blade 91 is maintained for a long period of time and the durability is excellent. That is, it is possible to provide a cutting blade 91 in which the cutting performance is maintained for a long period of time and the cost burden of the operator is small.
  • the first welding layer 111 and the first plating layer 121 extend toward the first surface sf1 of the body portion 921,931,941 and extend to the side of the first surface sf1, and the second welding layer 112 and the first plating layer 121.
  • the two-plated layer 122 extends to the side of the second surface sf2 opposite to the first surface sf1 of the body portion 921,931,941.
  • a plating layer 12 for holding the abrasive grains 13 is further formed on the blade side surface side of the cutting blade 91. Therefore, it is possible to prevent the cutting width of the cutting blade 91 from becoming wide.
  • the first welding layer 111 and the second welding layer 112 are silver brazing materials.
  • the first welding layer 111 and the second welding layer 112 more reliably enter the voids formed in the plating layer 12 and the recesses or minute cracks existing at the interface with the base 11. It is formed. Therefore, the chip unit 1 and the body portion 921,931,941 can be more firmly integrated. As a result, it is possible to suppress the occurrence of the chip unit 1 falling off or the like. Therefore, the cutting performance of the cutting blade 91 can be maintained for a longer period of time.
  • the body portion 921,931,941 is the body portion of the band saw blade 92 formed in an endless shape or the body portion of the saw blade 93,94 formed in a disk shape. .. Thereby, it is possible to provide the band saw blade 92 or the saw blades 93, 94 in which the cutting performance is maintained for a long period of time and the cost burden of the operator is small.
  • the body portion 941 is disk-shaped and has a through hole 944 at the peripheral edge portion, and the first welding layer 111 is engaged with the through hole 944.
  • the portion 11k is formed.
  • the method for manufacturing a cutting blade is a plate-shaped body portion 921,931,941 and a plurality of chip units 1 attached to one edge portion of the body portion 921,931,941 at a predetermined pitch. It is a method of manufacturing a cutting blade having The plating process of 11 pt and 11 pt and the first and second base basic bodies 11 pt and 11 pt are bent into an L-shaped cross section having a bent portion 11a and a flat portion 11b so that one surface is on the outside. The bending process of the first and second chip bodies 11s and 11s and the bending portion 11a of the first chip body 11s are placed on the end of one edge from one side of the body portion 921,931,941.
  • the temperature is raised to a temperature exceeding the melting point and lower than the melting point of the plating layer 12, and then the temperature is lowered to room temperature, and the plating layer 12 of the first chip body 11s is provided with the first and second brazing materials to form the body portion 921,931.
  • two plating layers 12 for holding the abrasive grains 13 are formed on the blade end face side of the cutting blade 91.
  • the machinability of the cutting blade 91 is maintained for a long period of time and the durability is excellent. That is, it is possible to manufacture a cutting blade 91 in which the cutting performance is maintained for a long period of time and the cost burden of the operator is small.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

Lame de coupe (91) comprenant une section tronc en forme de plaque (921), une première couche de dépôt (111) qui est formée sur une surface d'extrémité (921t) de la section tronc (921) et qui est constituée d'un matériau de brasage, une première couche de placage (121) qui est accumulée sur la première couche de dépôt (111) et qui contient une pluralité de grains abrasifs (13), une seconde couche de dépôt (112) qui est accumulée sur la première couche de placage (121) et qui est constituée d'un matériau de brasage, et une seconde couche de placage (122) qui est accumulée sur la seconde couche de dépôt (112) et qui contient une pluralité de grains abrasifs (13).
PCT/JP2021/031828 2020-09-09 2021-08-31 Lame de coupe et procédé de fabrication de lame de coupe WO2022054630A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-151053 2020-09-09
JP2020151053A JP7449829B2 (ja) 2020-09-09 2020-09-09 切削ブレード及び切削ブレードの製造方法

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WO2022054630A1 true WO2022054630A1 (fr) 2022-03-17

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124574A (ja) * 1982-12-29 1984-07-18 Daiyamondo Giken Kk 切断刃の製造方法
JPS60161070A (ja) * 1984-01-27 1985-08-22 Honda Motor Co Ltd 電着砥石の製造方法
JPH0365667U (fr) * 1989-05-15 1991-06-26
KR20050051010A (ko) * 2003-11-26 2005-06-01 신한다이아몬드공업 주식회사 브레이징법에 의한 연마공구 및 절삭공구의 제조방법
US20070151554A1 (en) * 2004-02-09 2007-07-05 Shinhan Diamond Industrial Co., Ltd. Diamond tools with multilayers of abrasive grain and method for manufacturing the same
US20180311772A1 (en) * 2014-07-02 2018-11-01 United Technologies Corporation Abrasive Preforms and Manufacture and Use Methods

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124574A (ja) * 1982-12-29 1984-07-18 Daiyamondo Giken Kk 切断刃の製造方法
JPS60161070A (ja) * 1984-01-27 1985-08-22 Honda Motor Co Ltd 電着砥石の製造方法
JPH0365667U (fr) * 1989-05-15 1991-06-26
KR20050051010A (ko) * 2003-11-26 2005-06-01 신한다이아몬드공업 주식회사 브레이징법에 의한 연마공구 및 절삭공구의 제조방법
US20070151554A1 (en) * 2004-02-09 2007-07-05 Shinhan Diamond Industrial Co., Ltd. Diamond tools with multilayers of abrasive grain and method for manufacturing the same
US20180311772A1 (en) * 2014-07-02 2018-11-01 United Technologies Corporation Abrasive Preforms and Manufacture and Use Methods

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JP7449829B2 (ja) 2024-03-14

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