WO2022054630A1 - Cutting blade, and method for manufacturing cutting blade - Google Patents

Cutting blade, and method for manufacturing cutting blade Download PDF

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Publication number
WO2022054630A1
WO2022054630A1 PCT/JP2021/031828 JP2021031828W WO2022054630A1 WO 2022054630 A1 WO2022054630 A1 WO 2022054630A1 JP 2021031828 W JP2021031828 W JP 2021031828W WO 2022054630 A1 WO2022054630 A1 WO 2022054630A1
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WO
WIPO (PCT)
Prior art keywords
plating layer
cutting blade
layer
chip
body portion
Prior art date
Application number
PCT/JP2021/031828
Other languages
French (fr)
Japanese (ja)
Inventor
雄策 松田
秀彦 酒井
正豊 松田
健次 堀川
利幸 谷嶋
年宏 嶌本
Original Assignee
株式会社アマダ
株式会社アマダマシナリー
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Filing date
Publication date
Application filed by 株式会社アマダ, 株式会社アマダマシナリー filed Critical 株式会社アマダ
Publication of WO2022054630A1 publication Critical patent/WO2022054630A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/02Circular saw blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/12Straight saw blades; Strap saw blades
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/06Connecting the ends of materials, e.g. for making abrasive belts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12Cut-off wheels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/46Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having an endless band-knife or the like

Definitions

  • the present invention relates to a cutting blade and a method for manufacturing the cutting blade.
  • Patent Document 1 describes a band saw blade in which hard abrasive grains such as diamond are fixed to the edge of a body of a steel belt by electrodeposition.
  • the cutting blade according to one aspect of the present invention has a plate-shaped body, a first welding layer made of a brazing material formed on the end face of the body, and a plurality of abrasives superimposed on the first welding layer.
  • the present invention it is possible to provide a cutting blade in which good initial cutting performance is maintained for a long period of time and a cost burden on the operator is small, and a method for manufacturing the cutting blade.
  • FIG. 1 is a diagram showing a cutting blade 91 which is an embodiment of the cutting blade according to the embodiment of the present invention.
  • FIG. 1A is a partial front view of the band saw blade 92, which is the first example of the cutting blade 91.
  • FIG. 1B is a partial front view of the saw blade 93, which is a second example of the cutting blade 91.
  • FIG. 2 is a diagram showing a base material 11P which is a material of the base 11 of the chip body 11s included in the cutting blade 91.
  • FIG. 2A is a plan view of the base material 11P.
  • FIG. 2B is a side view of the base material 11P.
  • FIG. 3 is a cross-sectional view showing a base basic body 11pt including the base material 11P.
  • FIG. 1A is a partial front view of the band saw blade 92, which is the first example of the cutting blade 91.
  • FIG. 1B is a partial front view of the saw blade 93, which is a
  • FIG. 4 is a cross-sectional view showing a chip body 11s obtained by bending the base basic body 11pt.
  • FIG. 5 is a first process chart in the method for manufacturing the band saw blade 92.
  • FIG. 6 is a second process chart in the method for manufacturing the band saw blade 92, and is a cross-sectional view taken along the line 5 at positions S6-S6.
  • FIG. 7 is a cross-sectional view taken along the line S6-S6 in FIG.
  • FIG. 8 is a partial front view showing the body portion 941 of the saw blade 94, which is a modified example of the saw blade 93.
  • FIG. 9 is a partial front view showing the saw blade 94.
  • FIG. 10 is a cross-sectional view taken along the line S10-S10 in FIG.
  • FIG. 1 is a diagram showing a cutting blade 91, which is an example of the cutting blade according to the embodiment of the present invention.
  • FIG. 1A is a partial front view showing a band saw blade 92 which is a first example of a cutting blade 91.
  • FIG. 1B is a partial front view showing a saw blade 93 which is a second example of the cutting blade 91.
  • the band saw blade 92 is a cutting blade 91 in which both ends of a band-shaped body portion 921 are joined to form an endless shape.
  • the band saw blade 92 has a cutting portion 924 at a straight edge portion of the strip-shaped body portion 921.
  • a concave portion 922 recessed in an arc shape and a convex portion 923 of a portion that remains relatively protruding are repeatedly formed at a predetermined pitch Pa.
  • the pitch Pa is, for example, 20 mm.
  • a chip unit 1 is attached to the convex portion 923.
  • the saw blade 93 is a disk-shaped cutting blade 91, and has a cutting portion 934 on the peripheral edge of the disk-shaped body portion 931.
  • the concave portion 932 recessed in an arc shape and the convex portion 933 of the portion that remains relatively protruding are repeatedly formed at a predetermined equal angle pitch ⁇ a.
  • the equiangular pitch ⁇ a is, for example, 18 °.
  • a chip unit 1 is attached to the convex portion 933.
  • the chip unit 1 is a combination of a plurality of chip bodies 11s shown in FIGS. 4 and 5 and integrated. In the band saw blade 92 and the saw blade 93, the two chip bodies 11s are overlapped and integrated.
  • the chip body 11s is integrated with the base 11 of a foil material bent so as to have an L-shaped cross section, a plating layer 12 formed on one surface side of the base 11, and embedded in the plating layer 12. It has a plurality of abrasive grains 13 that are fixed to the surface.
  • 2 (a) and 2 (b) are diagrams showing the base material 11P which finally becomes the base 11.
  • FIG. 2A is a plan view of the base material 11P.
  • FIG. 2B is a side view of the base material 11P.
  • the base material 11P is a brazing material foil.
  • the base material 11P is a rectangular silver brazing foil (Silver Brazing Foil) having a length of about 10 mm, a width of about 5 mm, and a thickness of about 0.1 mm.
  • diamond abrasive grains having an average particle size of about 0.2 mm are prepared as the abrasive grains 13.
  • the base material 11P is immersed in the electrolytic plating solution of the electrolytic plating tank. Then, a plating step of applying nickel plating is executed with the abrasive grains 13 in contact with or close to one surface of the base material 11P at a predetermined density by a jig or the like.
  • the thickness of the plating layer 12 to be formed is, for example, about 0.15 mm.
  • the other surface side of the base material 11P is masked so that the plating layer is not formed.
  • a flat plate-shaped base basic body 11pt having a plating layer 12 and abrasive grains 13 is formed.
  • the plating layer 12 is a nickel plating layer formed on one side of the base material 11P.
  • the abrasive grains 13 are embedded in the plating layer 12, and a part of the tip side is projected and exposed.
  • the bending process of forming the bent portion 11a as shown in FIG. 4 is executed by bending one end side of the base basic body 11pt in the longitudinal direction at a right angle.
  • a chip body 11s having an L-shaped cross section having a bent portion 11a and an original flat portion 11b is formed.
  • the length L11 which is the inner method of the bent portion 11a, is substantially the same as the thickness t92 shown in FIG. 5 of the body portion 921 of the band saw blade 92.
  • the thickness t92 is, for example, 0.8 mm.
  • FIG. 5 shows a state in which the first chip body 11s and the second chip body 11s (hereinafter, simply referred to as two chip bodies 11s) are attached to the body portion 921.
  • one surface of the body portion 921 is referred to as a first surface sf1, and the other surface is referred to as a second surface sf2.
  • the body portion 921 has an endless shape in which the ends thereof are joined to each other.
  • the chip laminated body 1P in which the bent portions 11a of the two chip bodies 11s are overlapped on one convex portion 923 is temporarily fixed to one convex portion 923. There is. Temporary fixing is performed by interposing a flux between the members to be temporarily fixed.
  • the chip laminated body 1P temporarily fixed to the plurality of convex portions 923 of the body portion 921 shown in FIG. 5 is referred to as a manufacturing intermediate 1M of the chip unit 1.
  • the temperature rising step is executed.
  • the production intermediate 1M is heated to a temperature Ta which is equal to or higher than the melting point of the base 11 which is a silver brazing material and lower than the melting point of nickel, maintained for a predetermined time tm, and then naturally to room temperature. Or forcibly lower the temperature.
  • the melting point of the silver brazing material is about 700 ° C.
  • the melting point of nickel is about 1400 ° C. Therefore, the temperature Ta is set to, for example, about 700 to 800 ° C.
  • the time tm maintained at the temperature Ta is, for example, 5 to 15 seconds.
  • a process of raising the temperature of the manufacturing intermediate 1M from room temperature, maintaining the temperature at Ta for a time tm, and then lowering the temperature to room temperature is referred to as a temperature raising process.
  • a temperature raising process After the base 11 is melted by the temperature raising treatment, it solidifies on the convex portion 923.
  • the chip laminate 1P is pressed and held by the jig 81s and the jig 81t so as to be in close contact with the body portion 921. Specifically, the chip laminate 1P is pressed so that the flat portion 11b is compressed by the jig 81s against the body portion 921 in the thickness direction of the body portion 921. Further, the chip laminated body 1P is pressed by the jig 81t so that the two bent portions 11a on which the two chip bodies 11s overlap are pressed against the end surface 921t of the body portion 921.
  • the base 11 in contact with the body portion 921 is melted and then solidified by the temperature raising treatment and welded to the body portion 921. Due to the temperature rise treatment, the base 11 in contact with the nickel plating layer 12 enters the voids formed in the plating layer 12 in the molten state and the recesses or minute cracks existing on the interface with the base 11. And solidify. As a result, the portion of the base 11 on the boundary side with the plating layer 12 is a mixed layer 15 in which nickel and silver wax are substantially mixed and integrated.
  • the base 11 of the outer bent portion 11a is solidified including the mixed layers 151 and 152.
  • the mixed layers 151 and 152 are portions where the molten base 11 has entered into the gaps and minute cracks between the abrasive grains 13 and the plating layer 12 of both the inner and outer bent portions 11a and solidified. Therefore, the plating layer 12 of the inner bent portion 11a and the plating layer 12 of the outer bent portion 11a are more firmly integrated.
  • the base 11 of the chip laminate 1P is well welded to the body portion 921 and is also well integrated with the plating layer 12. In this way, the chip unit 1 in which the two chip bodies 11s are overlapped and integrated is provided on the convex portion 923.
  • the band saw blade 92 having the chip unit 1 shown in FIG. 1A can be obtained. Further, the above-mentioned method for attaching the chip unit 1 using a plurality of chip bodies 11s can also be applied to the convex portion 933 of the saw blade 93. As a result, as a second example of the cutting blade 91, a saw blade 93 having the chip unit 1 shown in FIG. 2B is obtained.
  • a first welded layer 111 in which a base 11 made of a brazing material such as silver brazing is melt-solidified is formed on an end face 921t of a plate-shaped body portion 921.
  • a first plating layer 121 which is a plating layer 12 holding a plurality of abrasive grains 13, is formed on the outside of the first welding layer 111.
  • a second welding layer 112 in which a base 11 made of a brazing material such as silver brazing is melt-solidified is formed so as to be overlapped on the outside of the first plating layer 121.
  • a second plating layer 122, which is a plating layer 12 holding a plurality of abrasive grains 13, is formed on the outside of the second welding layer 112.
  • first welding layer 111 and the first plating layer 121 extend to the first surface sf1 side which is one surface (first surface) of the body portion 921.
  • the second welding layer 112 and the second plating layer 122 extend to the second surface sf2 side, which is the other surface (second surface) opposite to one surface (first surface).
  • the band saw blade 92 two layers, a first plating layer 121 and a second plating layer 122, are formed as a plating layer 12 corresponding to a layer of abrasive grains 13 on the end surface 921t side of the body portion 921.
  • the cutting blade 91 has two plating layers 12 corresponding to the layers of the abrasive grains 13 on the end face side of the blade. Therefore, the machinability of the cutting blade 91 is maintained for a long period of time, and the durability is excellent.
  • the band saw blade 92 only one plating layer 12 corresponding to the layer of the abrasive grains 13 is formed on the first surface sf1 and the second surface sf2, which are the side surfaces.
  • the saw blade 93 has only one plating layer 12 corresponding to the abrasive grains 13 on the side surface side of the blade. Therefore, the cutting width of the cutting blade 91 is not widened, and unnecessary cutting of the work material can be suppressed.
  • the cutting blade according to the embodiment is not limited to the above-mentioned configuration, and may be a modification as long as it does not deviate from the gist of the present invention.
  • the saw blade 93 may be a saw blade 94 having a plurality of through holes 944 in the peripheral portion shown in FIG. 9.
  • FIG. 8 is a partial front view showing the body portion 941 of the saw blade 94.
  • FIG. 9 is a partial front view showing a saw blade 94 in which a plurality of tip units 1 are attached to a body portion 941. The saw blade 94 is attached so that the tip unit 1 closes at least one through hole 944.
  • FIG. 10 is a cross-sectional view taken at the S10-S10 position in FIG.
  • the melted base 11 enters the inside of the through hole 944 in the temperature raising process when the chip body 11s constituting the chip unit 1 is welded. After that, when the melted base 11 solidifies by cooling, an engaging portion 11k caught in the through hole 944 is formed. Therefore, the first welding layer 111 forms an engaging portion 11k engaged with the through hole 944. As a result, the chip unit 1 and the body portion 941 are more firmly integrated, and the risk of the chip unit 1 falling off or the like is reduced. Therefore, the quality and reliability of the saw blade 94 are improved.
  • the second welding layer 112 may form an engaging portion 11k engaged with the through hole 944.
  • the saw blade 94 having a plurality of through holes 944 has an effect that air flows through the through holes 944 to cool the saw blade 93 and promote the discharge of chips during dry cutting or wet cutting. can get.
  • the material and dimensions of the body 921 of the band saw blade 92 are not limited. Further, the material and dimensions of the body portions 931, 941 of the saw blades 93 and 94 are not limited.
  • the material of the brazing material of the base 11 of the chip body 11s is not limited.
  • the plating layer 12 is not limited to nickel plating. It is sufficient that the melting point of the metal forming the plating layer 12 is at least higher than the melting point of the base 11.
  • the abrasive grains 13 are not limited to diamond abrasive grains, and may be abrasive grains made of other materials such as ceramic abrasive grains. Further, the particle size of the abrasive grains of any material is not limited.
  • the cutting blade according to the embodiment includes a plate-shaped body portion 921,931,941 and a first welding layer 111 made of a brazing material formed on an end face 921t of the body portion 921,931,941 and a first.
  • the first plating layer 121 which is laminated on the welding layer 111 and holds a plurality of abrasive grains 13, the second welding layer 112, which is laminated on the first plating layer 121 and is made of a brazing material, and the second welding layer 112.
  • a second plating layer 122 that holds a plurality of abrasive grains 13 that are stacked is provided.
  • two plating layers 12 for holding the abrasive grains 13 are formed on the blade end face side of the cutting blade 91.
  • the machinability of the cutting blade 91 is maintained for a long period of time and the durability is excellent. That is, it is possible to provide a cutting blade 91 in which the cutting performance is maintained for a long period of time and the cost burden of the operator is small.
  • the first welding layer 111 and the first plating layer 121 extend toward the first surface sf1 of the body portion 921,931,941 and extend to the side of the first surface sf1, and the second welding layer 112 and the first plating layer 121.
  • the two-plated layer 122 extends to the side of the second surface sf2 opposite to the first surface sf1 of the body portion 921,931,941.
  • a plating layer 12 for holding the abrasive grains 13 is further formed on the blade side surface side of the cutting blade 91. Therefore, it is possible to prevent the cutting width of the cutting blade 91 from becoming wide.
  • the first welding layer 111 and the second welding layer 112 are silver brazing materials.
  • the first welding layer 111 and the second welding layer 112 more reliably enter the voids formed in the plating layer 12 and the recesses or minute cracks existing at the interface with the base 11. It is formed. Therefore, the chip unit 1 and the body portion 921,931,941 can be more firmly integrated. As a result, it is possible to suppress the occurrence of the chip unit 1 falling off or the like. Therefore, the cutting performance of the cutting blade 91 can be maintained for a longer period of time.
  • the body portion 921,931,941 is the body portion of the band saw blade 92 formed in an endless shape or the body portion of the saw blade 93,94 formed in a disk shape. .. Thereby, it is possible to provide the band saw blade 92 or the saw blades 93, 94 in which the cutting performance is maintained for a long period of time and the cost burden of the operator is small.
  • the body portion 941 is disk-shaped and has a through hole 944 at the peripheral edge portion, and the first welding layer 111 is engaged with the through hole 944.
  • the portion 11k is formed.
  • the method for manufacturing a cutting blade is a plate-shaped body portion 921,931,941 and a plurality of chip units 1 attached to one edge portion of the body portion 921,931,941 at a predetermined pitch. It is a method of manufacturing a cutting blade having The plating process of 11 pt and 11 pt and the first and second base basic bodies 11 pt and 11 pt are bent into an L-shaped cross section having a bent portion 11a and a flat portion 11b so that one surface is on the outside. The bending process of the first and second chip bodies 11s and 11s and the bending portion 11a of the first chip body 11s are placed on the end of one edge from one side of the body portion 921,931,941.
  • the temperature is raised to a temperature exceeding the melting point and lower than the melting point of the plating layer 12, and then the temperature is lowered to room temperature, and the plating layer 12 of the first chip body 11s is provided with the first and second brazing materials to form the body portion 921,931.
  • two plating layers 12 for holding the abrasive grains 13 are formed on the blade end face side of the cutting blade 91.
  • the machinability of the cutting blade 91 is maintained for a long period of time and the durability is excellent. That is, it is possible to manufacture a cutting blade 91 in which the cutting performance is maintained for a long period of time and the cost burden of the operator is small.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

This cutting blade (91) comprises a plate-form trunk section (921), a first deposition layer (111) that is formed on an end surface (921t) of the trunk section (921) and that is formed from a brazing material, a first plating layer (121) that is accumulated on the first deposition layer (111) and that holds a plurality of abrasive grains (13), a second deposition layer (112) that is accumulated on the first plating layer (121) and that is formed from a brazing material, and a second plating layer (122) that is accumulated on the second deposition layer (112) and that holds a plurality of abrasive grains (13).

Description

切削ブレード及び切削ブレードの製造方法Cutting blades and manufacturing methods for cutting blades
 本発明は、切削ブレード及び切削ブレードの製造方法に関する。 The present invention relates to a cutting blade and a method for manufacturing the cutting blade.
 ソーブレード及びバンドソーブレードなどの切削ブレードにおいて、縁部に硬質砥粒を固着したものが知られている。例えば、特許文献1には、スチールベルトの胴部の縁部に、ダイヤモンドなどの硬質の砥粒が電着により固定されたバンドソーブレードが記載されている。 It is known that cutting blades such as saw blades and band saw blades have hard abrasive grains fixed to the edges. For example, Patent Document 1 describes a band saw blade in which hard abrasive grains such as diamond are fixed to the edge of a body of a steel belt by electrodeposition.
特許第3298839号公報Japanese Patent No. 3298839
 特許文献1に記載されたバンドソーブレードのように、硬質の砥粒を胴部の縁部に電着によって固定すると、縁部には砥粒が単層で形成される。そのため、切削ブレードとして初期の良好な切削性が長期間維持できず寿命が比較的短い。また、硬質の砥粒を胴部の縁部に電着で固着するための製造設備として、電着のための大型の電解槽が必要であると共に電解液の処理費用も生じ、事業者にとって設備投資及びその維持費用などのコスト負担が大きい。 When hard abrasive grains are fixed to the edge of the body by electrodeposition as in the band saw blade described in Patent Document 1, the abrasive grains are formed in a single layer on the edge. Therefore, the initial good machinability of the cutting blade cannot be maintained for a long period of time, and the life is relatively short. In addition, as a manufacturing facility for electrodepositing hard abrasive grains to the edge of the body, a large electrolytic cell for electrodeposition is required, and processing costs for the electrolytic solution are also incurred, which is a facility for the business operator. The cost burden such as investment and its maintenance cost is large.
 本発明の一態様に係る切削ブレードは、板状の胴部と、前記胴部の端面に形成されたロウ材からなる第1溶着層と、前記第1溶着層に重ねられた、複数の砥粒を保持する第1めっき層と、前記第1めっき層に重ねられた、ロウ材からなる第2溶着層と、前記第2溶着層に重ねられた、複数の砥粒を保持する第2めっき層と、を備える。 The cutting blade according to one aspect of the present invention has a plate-shaped body, a first welding layer made of a brazing material formed on the end face of the body, and a plurality of abrasives superimposed on the first welding layer. A first plating layer that holds grains, a second welding layer made of brazing material that is layered on the first plating layer, and a second plating that holds a plurality of abrasive grains that are layered on the second welding layer. With layers.
 本発明の一態様によれば、初期の良好な切削性能が長期間維持され、事業者のコスト負担が少ない切削ブレード、及び切削ブレードの製造方法を提供することができる。 According to one aspect of the present invention, it is possible to provide a cutting blade in which good initial cutting performance is maintained for a long period of time and a cost burden on the operator is small, and a method for manufacturing the cutting blade.
図1は、本発明の実施形態に係る切削ブレードの実施例である切削ブレード91を示す図である。図1(a)は切削ブレード91の第1の例であるバンドソーブレード92の部分正面図である。図1(b)は切削ブレード91の第2の例であるソーブレード93の部分正面図である。FIG. 1 is a diagram showing a cutting blade 91 which is an embodiment of the cutting blade according to the embodiment of the present invention. FIG. 1A is a partial front view of the band saw blade 92, which is the first example of the cutting blade 91. FIG. 1B is a partial front view of the saw blade 93, which is a second example of the cutting blade 91. 図2は、切削ブレード91が有するチップ体11sのベース11の素材であるベース素材11Pを示す図である。図2(a)はベース素材11Pの平面図である。図2(b)はベース素材11Pの側面図である。FIG. 2 is a diagram showing a base material 11P which is a material of the base 11 of the chip body 11s included in the cutting blade 91. FIG. 2A is a plan view of the base material 11P. FIG. 2B is a side view of the base material 11P. 図3は、ベース素材11Pを含むベース基本体11ptを示す断面図である。FIG. 3 is a cross-sectional view showing a base basic body 11pt including the base material 11P. 図4は、ベース基本体11ptを折り曲げて得られたチップ体11sを示す断面図である。FIG. 4 is a cross-sectional view showing a chip body 11s obtained by bending the base basic body 11pt. 図5は、バンドソーブレード92の製造方法における第1の工程図である。FIG. 5 is a first process chart in the method for manufacturing the band saw blade 92. 図6は、バンドソーブレード92の製造方法における第2の工程図であって図5におけるS6-S6位置での断面図である。FIG. 6 is a second process chart in the method for manufacturing the band saw blade 92, and is a cross-sectional view taken along the line 5 at positions S6-S6. 図7は、図5におけるS6-S6位置での断面図である。FIG. 7 is a cross-sectional view taken along the line S6-S6 in FIG. 図8は、ソーブレード93の変形例であるソーブレード94の胴部941を示す部分正面図である。FIG. 8 is a partial front view showing the body portion 941 of the saw blade 94, which is a modified example of the saw blade 93. 図9は、ソーブレード94を示す部分正面図である。FIG. 9 is a partial front view showing the saw blade 94. 図10は、図9におけるS10-S10位置での断面図である。FIG. 10 is a cross-sectional view taken along the line S10-S10 in FIG.
 以下、図面を参照しながら、実施形態に係る切削ブレード、及び切削ブレードの製造方法について説明する。なお、同一の機能を有する要素については同一の符号を付し、重複する説明を省略する。 Hereinafter, the cutting blade according to the embodiment and the manufacturing method of the cutting blade will be described with reference to the drawings. Elements having the same function are designated by the same reference numerals, and duplicate description will be omitted.
(実施例)
 図1は、本発明の実施形態に係る切削ブレードの実施例である、切削ブレード91を示す図である。図1(a)は切削ブレード91の第1の例であるバンドソーブレード92を示す部分正面図である。図1(b)は切削ブレード91の第2の例であるソーブレード93を示す部分正面図である。
(Example)
FIG. 1 is a diagram showing a cutting blade 91, which is an example of the cutting blade according to the embodiment of the present invention. FIG. 1A is a partial front view showing a band saw blade 92 which is a first example of a cutting blade 91. FIG. 1B is a partial front view showing a saw blade 93 which is a second example of the cutting blade 91.
 バンドソーブレード92は帯状の胴部921の両端を結合して無端状にした切削ブレード91である。バンドソーブレード92は、帯状の胴部921における直状の一縁部に、切削部924を有する。切削部924には、弧状に窪ませた凹部922と、相対的に突出して残る部分の凸部923と、が所定のピッチPaで繰り返し形成されている。ピッチPaは、例えば20mmである。凸部923には、チップユニット1が取り付けられている。 The band saw blade 92 is a cutting blade 91 in which both ends of a band-shaped body portion 921 are joined to form an endless shape. The band saw blade 92 has a cutting portion 924 at a straight edge portion of the strip-shaped body portion 921. In the cutting portion 924, a concave portion 922 recessed in an arc shape and a convex portion 923 of a portion that remains relatively protruding are repeatedly formed at a predetermined pitch Pa. The pitch Pa is, for example, 20 mm. A chip unit 1 is attached to the convex portion 923.
 ソーブレード93は、円盤状の切削ブレード91であって、円盤状の胴部931の周縁部に切削部934を有する。切削部934は、弧状に窪ませた凹部932と、相対的に突出して残る部分の凸部933と、が所定の等角度ピッチθaで繰り返し形成されている。等角度ピッチθaは例えば18°である。凸部933には、チップユニット1が取り付けられている。 The saw blade 93 is a disk-shaped cutting blade 91, and has a cutting portion 934 on the peripheral edge of the disk-shaped body portion 931. In the cutting portion 934, the concave portion 932 recessed in an arc shape and the convex portion 933 of the portion that remains relatively protruding are repeatedly formed at a predetermined equal angle pitch θa. The equiangular pitch θa is, for example, 18 °. A chip unit 1 is attached to the convex portion 933.
 チップユニット1は、図4および図5に示されるチップ体11sを複数組み合わせて一体化したものである。バンドソーブレード92及びソーブレード93では、二つのチップ体11sが重ね合わされて一体化されている。チップ体11sは、断面がL字状となるように折り曲げ形成された箔材のベース11と、ベース11の一面側に形成されためっき層12と、めっき層12に埋め込まれてベース11と一体的に固定された複数の砥粒13とを有する。 The chip unit 1 is a combination of a plurality of chip bodies 11s shown in FIGS. 4 and 5 and integrated. In the band saw blade 92 and the saw blade 93, the two chip bodies 11s are overlapped and integrated. The chip body 11s is integrated with the base 11 of a foil material bent so as to have an L-shaped cross section, a plating layer 12 formed on one surface side of the base 11, and embedded in the plating layer 12. It has a plurality of abrasive grains 13 that are fixed to the surface.
 バンドソーブレード92の製造方法におけるチップ体11sの形成方法を、図2(a)、図2(b)、及び図3を参照して説明する。図2(a)、及び図2(b)は、最終的にベース11となるベース素材11Pを示す図である。図2(a)はベース素材11Pの平面図である。図2(b)はベース素材11Pの側面図である。まず、図2(a)、及び図2(b)に示される矩形のベース素材11Pを用意する。ベース素材11Pは、ロウ材(Brazing material)の箔である。具体的には、ベース素材11Pは、長さが約10mm、幅が約5mm、厚さが約0.1mmの長方形の銀ロウ箔(Silver Brazing Foil)である。ある実施形態では、砥粒13として、平均粒径約0.2mmのダイヤモンド砥粒を用意する。 The method of forming the chip body 11s in the method of manufacturing the band saw blade 92 will be described with reference to FIGS. 2 (a), 2 (b), and 3. 2 (a) and 2 (b) are diagrams showing the base material 11P which finally becomes the base 11. FIG. 2A is a plan view of the base material 11P. FIG. 2B is a side view of the base material 11P. First, the rectangular base material 11P shown in FIGS. 2 (a) and 2 (b) is prepared. The base material 11P is a brazing material foil. Specifically, the base material 11P is a rectangular silver brazing foil (Silver Brazing Foil) having a length of about 10 mm, a width of about 5 mm, and a thickness of about 0.1 mm. In one embodiment, diamond abrasive grains having an average particle size of about 0.2 mm are prepared as the abrasive grains 13.
 次に、電解めっき槽の電解めっき液中に、ベース素材11Pを浸漬する。そして、治具などによって、ベース素材11Pの一面の側に砥粒13が所定の密度で接触又は近接した状態として、電気ニッケルめっきを施すめっき工程を実行する。形成するめっき層12の厚さは、例えば約0.15mmである。ベース素材11Pの他面側は、めっき層が形成されないようにマスキング処理をしておく。 Next, the base material 11P is immersed in the electrolytic plating solution of the electrolytic plating tank. Then, a plating step of applying nickel plating is executed with the abrasive grains 13 in contact with or close to one surface of the base material 11P at a predetermined density by a jig or the like. The thickness of the plating layer 12 to be formed is, for example, about 0.15 mm. The other surface side of the base material 11P is masked so that the plating layer is not formed.
 このめっき工程によって、図3に示されるように、めっき層12と、砥粒13と、を有する平板状のベース基本体11ptが形成される。めっき層12は、ベース素材11Pの一面側に形成されたニッケルのめっき層である。砥粒13は、めっき層12の中に埋め込まれ、先端側の一部が突出して露出している。 By this plating step, as shown in FIG. 3, a flat plate-shaped base basic body 11pt having a plating layer 12 and abrasive grains 13 is formed. The plating layer 12 is a nickel plating layer formed on one side of the base material 11P. The abrasive grains 13 are embedded in the plating layer 12, and a part of the tip side is projected and exposed.
 次に、ベース基本体11ptの長手方向の一端側を直角に折り曲げて、図4に示されるような、折り曲げ部11aを形成する曲げ加工工程を実行する。この加工により、折り曲げ部11aと、元来の平状部11bとを有する断面形状がL字状のチップ体11sが形成される。折り曲げ部11aの内法である長さL11は、バンドソーブレード92の胴部921の図5に示される厚さt92とほぼ同じである。厚さt92は、例えば0.8mmである。 Next, the bending process of forming the bent portion 11a as shown in FIG. 4 is executed by bending one end side of the base basic body 11pt in the longitudinal direction at a right angle. By this processing, a chip body 11s having an L-shaped cross section having a bent portion 11a and an original flat portion 11b is formed. The length L11, which is the inner method of the bent portion 11a, is substantially the same as the thickness t92 shown in FIG. 5 of the body portion 921 of the band saw blade 92. The thickness t92 is, for example, 0.8 mm.
 図5は、第1のチップ体11s及び第2のチップ体11s(以下、単に二つのチップ体11sと称する)を胴部921に取り付けた状態を示している。図5に示されるように、胴部921の一方の表面を第1面sf1とし、他方の表面を第2面sf2とする。胴部921は、端部同士が接合されて無端状となっている。 FIG. 5 shows a state in which the first chip body 11s and the second chip body 11s (hereinafter, simply referred to as two chip bodies 11s) are attached to the body portion 921. As shown in FIG. 5, one surface of the body portion 921 is referred to as a first surface sf1, and the other surface is referred to as a second surface sf2. The body portion 921 has an endless shape in which the ends thereof are joined to each other.
 図5に示されるように、一つの凸部923に、二つのチップ体11sの各々の折り曲げ部11aが重ね合わされたチップ積層体1Pが、一つの凸部923に仮止めされた状態となっている。仮止めは、仮止めする部材間にフラックスを介在させて行う。図5に示される、胴部921の複数の凸部923にチップ積層体1Pが仮止めされたものを、チップユニット1の製造中間体1Mと称する。 As shown in FIG. 5, the chip laminated body 1P in which the bent portions 11a of the two chip bodies 11s are overlapped on one convex portion 923 is temporarily fixed to one convex portion 923. There is. Temporary fixing is performed by interposing a flux between the members to be temporarily fixed. The chip laminated body 1P temporarily fixed to the plurality of convex portions 923 of the body portion 921 shown in FIG. 5 is referred to as a manufacturing intermediate 1M of the chip unit 1.
 次に、昇温工程を実行する。昇温工程では、製造中間体1Mを、銀ロウ材であるベース11の融点以上、かつニッケルの融点未満である温度Taに昇温し、所定の時間tmだけ維持し、その後常温まで、自然に又は強制的に降温させる。銀ロウ材の融点は、概ね700℃前後であり、ニッケルの融点は約1400℃である。そのため、温度Taは、例えば700~800℃程度とされる。また、温度Taで維持する時間tmは、例えば5~15秒である。以下、製造中間体1Mを常温から昇温し、温度Taで時間tmだけ維持した後、常温に降温させる処理を、昇温処理と称する。昇温処理によってベース11は溶融した後、凸部923に凝固する。 Next, the temperature rising step is executed. In the temperature raising step, the production intermediate 1M is heated to a temperature Ta which is equal to or higher than the melting point of the base 11 which is a silver brazing material and lower than the melting point of nickel, maintained for a predetermined time tm, and then naturally to room temperature. Or forcibly lower the temperature. The melting point of the silver brazing material is about 700 ° C., and the melting point of nickel is about 1400 ° C. Therefore, the temperature Ta is set to, for example, about 700 to 800 ° C. The time tm maintained at the temperature Ta is, for example, 5 to 15 seconds. Hereinafter, a process of raising the temperature of the manufacturing intermediate 1M from room temperature, maintaining the temperature at Ta for a time tm, and then lowering the temperature to room temperature is referred to as a temperature raising process. After the base 11 is melted by the temperature raising treatment, it solidifies on the convex portion 923.
 昇温処理では、図6に示されるように、チップ積層体1Pは、胴部921に対し密着するように治具81s及び治具81tによって押圧されて保持される。詳しくは、チップ積層体1Pは、胴部921の厚さ方向には、平状部11bが胴部921に対し治具81sで圧縮するように押圧される。また、チップ積層体1Pは、胴部921の端面921tに対して、二つのチップ体11sの重なった二つの折り曲げ部11aが押し付けられるように治具81tで押圧される。 In the temperature raising process, as shown in FIG. 6, the chip laminate 1P is pressed and held by the jig 81s and the jig 81t so as to be in close contact with the body portion 921. Specifically, the chip laminate 1P is pressed so that the flat portion 11b is compressed by the jig 81s against the body portion 921 in the thickness direction of the body portion 921. Further, the chip laminated body 1P is pressed by the jig 81t so that the two bent portions 11a on which the two chip bodies 11s overlap are pressed against the end surface 921t of the body portion 921.
 図7に示されるように、昇温処理によって、胴部921に接触しているベース11は、溶融した後に凝固し、胴部921に溶着する。昇温処理によって、ニッケルのめっき層12と接触しているベース11は、溶融状態でめっき層12に形成された空隙、及び、ベース11との境界面に存在する凹部或いは微小のクラックに進入して凝固する。これにより、ベース11におけるめっき層12との境界側の部分は、実質的にニッケルと銀ロウとが混在して一体化した混在層15となっている。 As shown in FIG. 7, the base 11 in contact with the body portion 921 is melted and then solidified by the temperature raising treatment and welded to the body portion 921. Due to the temperature rise treatment, the base 11 in contact with the nickel plating layer 12 enters the voids formed in the plating layer 12 in the molten state and the recesses or minute cracks existing on the interface with the base 11. And solidify. As a result, the portion of the base 11 on the boundary side with the plating layer 12 is a mixed layer 15 in which nickel and silver wax are substantially mixed and integrated.
 特に、胴部921の端面921tに重ね合わされた内側及び外側の折り曲げ部11a,11aのうちの、外側の折り曲げ部11aのベース11は、混在層151,152を含んで凝固する。混在層151,152は、溶融したベース11が、内側及び外側の両方の折り曲げ部11aの砥粒13とめっき層12との間の隙間や微小のクラックに進入して凝固した部分である。そのため、内側の折り曲げ部11aのめっき層12と外側の折り曲げ部11aのめっき層12とは、より強固に一体化する。これにより、チップ積層体1Pのベース11は、胴部921に良好に溶着すると共にめっき層12とも良好に一体化する。このようにして、二つのチップ体11sが重ねられて一体化したチップユニット1が、凸部923に設けられる。 In particular, of the inner and outer bent portions 11a and 11a overlapped with the end surface 921t of the body portion 921, the base 11 of the outer bent portion 11a is solidified including the mixed layers 151 and 152. The mixed layers 151 and 152 are portions where the molten base 11 has entered into the gaps and minute cracks between the abrasive grains 13 and the plating layer 12 of both the inner and outer bent portions 11a and solidified. Therefore, the plating layer 12 of the inner bent portion 11a and the plating layer 12 of the outer bent portion 11a are more firmly integrated. As a result, the base 11 of the chip laminate 1P is well welded to the body portion 921 and is also well integrated with the plating layer 12. In this way, the chip unit 1 in which the two chip bodies 11s are overlapped and integrated is provided on the convex portion 923.
 このようにして、切削ブレード91の第1の例として、図1(a)に示されるチップユニット1を有するバンドソーブレード92が得られる。また、上述のチップ体11sを複数用いたチップユニット1の取付方法は、ソーブレード93の凸部933に対しても適用できる。これにより、切削ブレード91の第2の例として、図2(b)に示されるチップユニット1を有するソーブレード93が得られる。 In this way, as a first example of the cutting blade 91, the band saw blade 92 having the chip unit 1 shown in FIG. 1A can be obtained. Further, the above-mentioned method for attaching the chip unit 1 using a plurality of chip bodies 11s can also be applied to the convex portion 933 of the saw blade 93. As a result, as a second example of the cutting blade 91, a saw blade 93 having the chip unit 1 shown in FIG. 2B is obtained.
 図7を参照して、昇温処理後のチップユニット1について、断面の層構造の観点から詳述する。板状の胴部921の端面921tには、銀ロウなどのロウ材からなるベース11が溶融凝固した第1溶着層111が形成されている。第1溶着層111の外側に重ねて、複数の砥粒13を保持しためっき層12である第1めっき層121が形成されている。第1めっき層121の外側に重ねて、銀ロウなどのロウ材からなるベース11が溶融凝固した第2溶着層112が形成されている。第2溶着層112の外側に重ねて、複数の砥粒13を保持しためっき層12である第2めっき層122が形成されている。 With reference to FIG. 7, the chip unit 1 after the temperature rise treatment will be described in detail from the viewpoint of the layer structure of the cross section. A first welded layer 111 in which a base 11 made of a brazing material such as silver brazing is melt-solidified is formed on an end face 921t of a plate-shaped body portion 921. A first plating layer 121, which is a plating layer 12 holding a plurality of abrasive grains 13, is formed on the outside of the first welding layer 111. A second welding layer 112 in which a base 11 made of a brazing material such as silver brazing is melt-solidified is formed so as to be overlapped on the outside of the first plating layer 121. A second plating layer 122, which is a plating layer 12 holding a plurality of abrasive grains 13, is formed on the outside of the second welding layer 112.
 また、図7に示されるように、第1溶着層111及び第1めっき層121は、胴部921の一方の面(第1の面)である第1面sf1側に延出している。第2溶着層112及び第2めっき層122は、一方の面(第1の面)の反対側である他方の面(第2の面)である第2面sf2側に延出している。 Further, as shown in FIG. 7, the first welding layer 111 and the first plating layer 121 extend to the first surface sf1 side which is one surface (first surface) of the body portion 921. The second welding layer 112 and the second plating layer 122 extend to the second surface sf2 side, which is the other surface (second surface) opposite to one surface (first surface).
 バンドソーブレード92では、胴部921の端面921t側に、砥粒13の層に相当するめっき層12として、第1めっき層121及び第2めっき層122の二層が形成されている。ソーブレード93についても同様である。このように、切削ブレード91は、ブレードの端面側に、砥粒13の層に相当するめっき層12を二層有する。そのため、切削ブレード91の切削性が長期に維持され、耐久性に優れる。 In the band saw blade 92, two layers, a first plating layer 121 and a second plating layer 122, are formed as a plating layer 12 corresponding to a layer of abrasive grains 13 on the end surface 921t side of the body portion 921. The same applies to the saw blade 93. As described above, the cutting blade 91 has two plating layers 12 corresponding to the layers of the abrasive grains 13 on the end face side of the blade. Therefore, the machinability of the cutting blade 91 is maintained for a long period of time, and the durability is excellent.
 バンドソーブレード92は、側面となる第1面sf1及び第2面sf2には、砥粒13の層に相当するめっき層12が一層のみ形成されている。ソーブレード93についても同様である。このように、切削ブレード91は、ブレードの側面側に、砥粒13を層に相当するめっき層12を一層のみ有する。そのため、切削ブレード91の切削幅が広くならず、被削材の無駄な切削を抑制することができる。 In the band saw blade 92, only one plating layer 12 corresponding to the layer of the abrasive grains 13 is formed on the first surface sf1 and the second surface sf2, which are the side surfaces. The same applies to the saw blade 93. As described above, the cutting blade 91 has only one plating layer 12 corresponding to the abrasive grains 13 on the side surface side of the blade. Therefore, the cutting width of the cutting blade 91 is not widened, and unnecessary cutting of the work material can be suppressed.
 実施形態に係る切削ブレードは、上述した構成に限定されるものではなく、本発明の要旨を逸脱しない範囲において変形例としてもよい。 The cutting blade according to the embodiment is not limited to the above-mentioned configuration, and may be a modification as long as it does not deviate from the gist of the present invention.
 ソーブレード93は、変形例として、図9に示される、周縁部に複数の貫通孔944を有するソーブレード94であってもよい。図8は、ソーブレード94の胴部941示す部分正面図である。図9は、胴部941に複数のチップユニット1を取り付けたソーブレード94を示す部分正面図である。ソーブレード94は、チップユニット1が貫通孔944を少なくとも一つ塞ぐように取り付けられている。 As a modification, the saw blade 93 may be a saw blade 94 having a plurality of through holes 944 in the peripheral portion shown in FIG. 9. FIG. 8 is a partial front view showing the body portion 941 of the saw blade 94. FIG. 9 is a partial front view showing a saw blade 94 in which a plurality of tip units 1 are attached to a body portion 941. The saw blade 94 is attached so that the tip unit 1 closes at least one through hole 944.
 図10は、図9におけるS10-S10位置での断面図である。図10に示されるソーブレード94では、チップユニット1を構成するチップ体11sを溶着する際の昇温処理において、溶融したベース11が貫通孔944の内部に進入する。その後、溶融したベース11が冷却により凝固する際に、貫通孔944に引っ掛かった係合部11kが形成される。従って、第1溶着層111は、貫通孔944に係合した係合部11kを形成している。これにより、チップユニット1と胴部941とがより強固に一体化し、チップユニット1の脱落等の発生の虞が低減する。このため、ソーブレード94の品質及び信頼性が向上する。なお、図示した例のように、第2溶着層112が、貫通孔944に係合した係合部11kを形成してもよい。 FIG. 10 is a cross-sectional view taken at the S10-S10 position in FIG. In the saw blade 94 shown in FIG. 10, the melted base 11 enters the inside of the through hole 944 in the temperature raising process when the chip body 11s constituting the chip unit 1 is welded. After that, when the melted base 11 solidifies by cooling, an engaging portion 11k caught in the through hole 944 is formed. Therefore, the first welding layer 111 forms an engaging portion 11k engaged with the through hole 944. As a result, the chip unit 1 and the body portion 941 are more firmly integrated, and the risk of the chip unit 1 falling off or the like is reduced. Therefore, the quality and reliability of the saw blade 94 are improved. As shown in the illustrated example, the second welding layer 112 may form an engaging portion 11k engaged with the through hole 944.
 複数の貫通孔944を有するソーブレード94は、乾式切削時、又は湿式切削時において、貫通孔944内に空気が流通してソーブレード93を冷却するとともに、切粉の排出を促進するという効果が得られる。 The saw blade 94 having a plurality of through holes 944 has an effect that air flows through the through holes 944 to cool the saw blade 93 and promote the discharge of chips during dry cutting or wet cutting. can get.
 バンドソーブレード92の胴部921の材質及び寸法は、限定されない。また、ソーブレード93,94の胴部931,941の材質及び寸法は、限定されない。チップ体11sのベース11のロウ材の材質は限定されない。めっき層12はニッケルめっきに限定されない。少なくともベース11の融点よりもめっき層12を形成する金属の融点が高ければよい。砥粒13は、ダイヤモンド砥粒に限定されず、セラミック砥粒など他の素材の砥粒であってもよい。また、いずれの素材の砥粒においても粒径は限定されない。 The material and dimensions of the body 921 of the band saw blade 92 are not limited. Further, the material and dimensions of the body portions 931, 941 of the saw blades 93 and 94 are not limited. The material of the brazing material of the base 11 of the chip body 11s is not limited. The plating layer 12 is not limited to nickel plating. It is sufficient that the melting point of the metal forming the plating layer 12 is at least higher than the melting point of the base 11. The abrasive grains 13 are not limited to diamond abrasive grains, and may be abrasive grains made of other materials such as ceramic abrasive grains. Further, the particle size of the abrasive grains of any material is not limited.
 チップユニット1として、二つのチップ体11sを重ね合わせた構成を例示したが、三つ以上のチップ体11sを重ね合わせた構成としてもよい。 Although the configuration in which two chip bodies 11s are overlapped is exemplified as the chip unit 1, a configuration in which three or more chip bodies 11s are overlapped may be used.
 以下、実施形態に係る切削ブレードの作用効果について説明する。 Hereinafter, the action and effect of the cutting blade according to the embodiment will be described.
(1)実施形態に係る切削ブレードは、板状の胴部921,931,941と、胴部921,931,941の端面921tに形成されたロウ材からなる第1溶着層111と、第1溶着層111に重ねられた、複数の砥粒13を保持する第1めっき層121と、第1めっき層121に重ねられた、ロウ材からなる第2溶着層112と、第2溶着層112に重ねられた、複数の砥粒13を保持する第2めっき層122と、を備える。これにより、切削ブレード91のブレード端面側には、砥粒13を保持するめっき層12が二層形成される。そのため、切削ブレード91の切削性が長期に維持され耐久性に優れる。即ち、切削性能が長期間維持され、事業者のコスト負担が少ない切削ブレード91を提供することができる。 (1) The cutting blade according to the embodiment includes a plate-shaped body portion 921,931,941 and a first welding layer 111 made of a brazing material formed on an end face 921t of the body portion 921,931,941 and a first. The first plating layer 121, which is laminated on the welding layer 111 and holds a plurality of abrasive grains 13, the second welding layer 112, which is laminated on the first plating layer 121 and is made of a brazing material, and the second welding layer 112. A second plating layer 122 that holds a plurality of abrasive grains 13 that are stacked is provided. As a result, two plating layers 12 for holding the abrasive grains 13 are formed on the blade end face side of the cutting blade 91. Therefore, the machinability of the cutting blade 91 is maintained for a long period of time and the durability is excellent. That is, it is possible to provide a cutting blade 91 in which the cutting performance is maintained for a long period of time and the cost burden of the operator is small.
(2)実施形態に係る切削ブレードでは、第1溶着層111及び第1めっき層121は、胴部921,931,941の第1の面sf1の側に延出し、第2溶着層112及び第2めっき層122は、胴部921,931,941の第1の面sf1とは反対側の第2の面sf2の側に延出している。これにより、切削ブレード91のブレード側面側には、砥粒13を保持するめっき層12が一層形成される。そのため、切削ブレード91の切削幅が広くなるのを抑制することができる。 (2) In the cutting blade according to the embodiment, the first welding layer 111 and the first plating layer 121 extend toward the first surface sf1 of the body portion 921,931,941 and extend to the side of the first surface sf1, and the second welding layer 112 and the first plating layer 121. The two-plated layer 122 extends to the side of the second surface sf2 opposite to the first surface sf1 of the body portion 921,931,941. As a result, a plating layer 12 for holding the abrasive grains 13 is further formed on the blade side surface side of the cutting blade 91. Therefore, it is possible to prevent the cutting width of the cutting blade 91 from becoming wide.
(3)実施形態に係る切削ブレードでは、第1溶着層111及び第2溶着層112は、銀ロウ材である。これにより、第1溶着層111及び第2溶着層112は、めっき層12に形成された空隙、及び、ベース11との境界面に存在する凹部或いは微小のクラックに、より確実に進入した状態で形成される。そのため、チップユニット1と、胴部921,931,941と、をより強固に一体化させることができる。これにより、チップユニット1の脱落等の発生を抑制することができる。従って、切削ブレード91の切削性能を、より長期間維持することができる。 (3) In the cutting blade according to the embodiment, the first welding layer 111 and the second welding layer 112 are silver brazing materials. As a result, the first welding layer 111 and the second welding layer 112 more reliably enter the voids formed in the plating layer 12 and the recesses or minute cracks existing at the interface with the base 11. It is formed. Therefore, the chip unit 1 and the body portion 921,931,941 can be more firmly integrated. As a result, it is possible to suppress the occurrence of the chip unit 1 falling off or the like. Therefore, the cutting performance of the cutting blade 91 can be maintained for a longer period of time.
(4)実施形態に係る切削ブレードでは、胴部921,931,941は、無端状に形成されたバンドソーブレード92の胴部、又は円盤状に形成されたソーブレード93,94の胴部である。これにより、切削性能が長期間維持され、事業者のコスト負担が少ないバンドソーブレード92、又はソーブレード93,94を提供することができる。 (4) In the cutting blade according to the embodiment, the body portion 921,931,941 is the body portion of the band saw blade 92 formed in an endless shape or the body portion of the saw blade 93,94 formed in a disk shape. .. Thereby, it is possible to provide the band saw blade 92 or the saw blades 93, 94 in which the cutting performance is maintained for a long period of time and the cost burden of the operator is small.
(5)実施形態の変形例に係る切削ブレードでは、胴部941は、円盤状であって周縁部に貫通孔944を有し、第1溶着層111は、貫通孔944に係合した係合部11kを形成している。これにより、チップユニット1と、胴部941と、をより強固に一体化させることができる。そのため、チップユニット1の脱落等の発生を抑制することができる。従って、切削ブレード91の切削性能を、より長期間維持することができる。 (5) In the cutting blade according to the modified example of the embodiment, the body portion 941 is disk-shaped and has a through hole 944 at the peripheral edge portion, and the first welding layer 111 is engaged with the through hole 944. The portion 11k is formed. As a result, the chip unit 1 and the body portion 941 can be more firmly integrated. Therefore, it is possible to suppress the occurrence of the chip unit 1 falling off or the like. Therefore, the cutting performance of the cutting blade 91 can be maintained for a longer period of time.
(6)実施形態に係る切削ブレードの製造方法は、板状の胴部921,931,941と、胴部921,931,941の一縁部に所定のピッチで取り付けられた複数のチップユニット1と、を有する切削ブレードの製造方法であって、第1及び第2のロウ材の箔の一面に複数の砥粒13を保持するめっき層12を形成して第1及び第2のベース基本体11pt,11ptとするめっき工程と、第1及び第2のベース基本体11pt,11ptを、一面が外側となるよう折り曲げ部11aと平状部11bとを有する断面L字状に曲げ加工して第1及び第2のチップ体11s,11sとする曲げ加工工程と、第1のチップ体11sの折り曲げ部11aを、胴部921,931,941の一面側から一縁部の端部に載せ、第2のチップ体11sの折り曲げ部11aを胴部921,931,941の他面側から第1のチップ体11sの折り曲げ部11aに重ねて載せる重ね合わせ工程と、第1及び第2のロウ材の融点を超えめっき層12の融点未満の温度に昇温し、その後常温に降温させて、第1及び第2のロウ材によって第1のチップ体11sのめっき層12を、胴部921,931,941と第2のチップ体11sのめっき層12とに溶着する昇温工程と、を含む。これにより、切削ブレード91のブレード端面側には、砥粒13を保持するめっき層12が二層形成される。そのため、切削ブレード91の切削性が長期に維持され耐久性に優れる。即ち、切削性能が長期間維持され、事業者のコスト負担が少ない切削ブレード91を製造することができる。 (6) The method for manufacturing a cutting blade according to an embodiment is a plate-shaped body portion 921,931,941 and a plurality of chip units 1 attached to one edge portion of the body portion 921,931,941 at a predetermined pitch. It is a method of manufacturing a cutting blade having The plating process of 11 pt and 11 pt and the first and second base basic bodies 11 pt and 11 pt are bent into an L-shaped cross section having a bent portion 11a and a flat portion 11b so that one surface is on the outside. The bending process of the first and second chip bodies 11s and 11s and the bending portion 11a of the first chip body 11s are placed on the end of one edge from one side of the body portion 921,931,941. The stacking step of superimposing the bent portion 11a of the chip body 11s 2 on the bent portion 11a of the first chip body 11s from the other surface side of the body portion 921,931,941 and the first and second brazing materials. The temperature is raised to a temperature exceeding the melting point and lower than the melting point of the plating layer 12, and then the temperature is lowered to room temperature, and the plating layer 12 of the first chip body 11s is provided with the first and second brazing materials to form the body portion 921,931. It includes a temperature raising step of welding 941 to the plating layer 12 of the second chip body 11s. As a result, two plating layers 12 for holding the abrasive grains 13 are formed on the blade end face side of the cutting blade 91. Therefore, the machinability of the cutting blade 91 is maintained for a long period of time and the durability is excellent. That is, it is possible to manufacture a cutting blade 91 in which the cutting performance is maintained for a long period of time and the cost burden of the operator is small.
 2020年9月9日に出願された特願2020-151053の全内容は、ここに援用される。 The entire contents of Japanese Patent Application No. 2020-151053 filed on September 9, 2020 are incorporated herein by reference.

Claims (6)

  1.  板状の胴部と、
     前記胴部の端面に形成されたロウ材からなる第1溶着層と、
     前記第1溶着層に重ねられた、複数の砥粒を保持する第1めっき層と、
     前記第1めっき層に重ねられた、ロウ材からなる第2溶着層と、
     前記第2溶着層に重ねられた、複数の砥粒を保持する第2めっき層と、
    を備えた切削ブレード。
    With a plate-shaped body,
    A first welding layer made of a brazing material formed on the end face of the body, and
    A first plating layer that is laminated on the first welding layer and holds a plurality of abrasive grains, and a first plating layer.
    A second welding layer made of brazing material, which is laminated on the first plating layer,
    A second plating layer that is laminated on the second welding layer and holds a plurality of abrasive grains, and a second plating layer.
    Cutting blade with.
  2.  前記第1溶着層及び前記第1めっき層は、前記胴部の第1の面の側に延出し、
     前記第2溶着層及び前記第2めっき層は、前記胴部の前記第1の面とは反対側の第2の面の側に延出している、請求項1記載の切削ブレード。
    The first welding layer and the first plating layer extend toward the first surface side of the body portion.
    The cutting blade according to claim 1, wherein the second welding layer and the second plating layer extend to the side of the second surface of the body portion opposite to the first surface.
  3.  前記第1溶着層及び前記第2溶着層は、銀ロウ材である、請求項1記載の切削ブレード。 The cutting blade according to claim 1, wherein the first welding layer and the second welding layer are silver brazing materials.
  4.  前記胴部は、無端状に形成されたバンドソーブレードの胴部、又は円盤状に形成されたソーブレードの胴部である、請求項1~3のいずれか1項に記載の切削ブレード。 The cutting blade according to any one of claims 1 to 3, wherein the body portion is a body portion of a band saw blade formed in an endless shape or a body portion of a saw blade formed in a disk shape.
  5.  前記胴部は、円盤状であって周縁部に貫通孔を有し、
     前記第1溶着層は、前記貫通孔に係合した係合部を形成している、請求項1~3のいずれか1項に記載の切削ブレード。
    The body portion is disk-shaped and has a through hole at the peripheral portion.
    The cutting blade according to any one of claims 1 to 3, wherein the first welding layer forms an engaging portion engaged with the through hole.
  6.  板状の胴部と、
     前記胴部の一縁部に所定のピッチで取り付けられた複数のチップユニットと、を有する切削ブレードの製造方法であって、
     第1及び第2のロウ材の箔の一面に複数の砥粒を保持するめっき層を形成して第1及び第2のベース基本体とするめっき工程と、
     前記第1及び第2のベース基本体を、前記一面が外側となるよう折り曲げ部と平状部とを有する断面L字状に曲げ加工して第1及び第2のチップ体とする曲げ加工工程と、
     前記第1のチップ体の折り曲げ部を、前記胴部の一面側から前記一縁部の端部に載せ、前記第2のチップ体の折り曲げ部を前記胴部の他面側から前記第1のチップ体の折り曲げ部に重ねて載せる重ね合わせ工程と、
     前記第1及び第2のロウ材の融点を超え前記めっき層の融点未満の温度に昇温し、その後常温に降温させて、前記第1及び第2のロウ材によって前記第1のチップ体の前記めっき層を、前記胴部と前記第2のチップ体の前記めっき層とに溶着する昇温工程と、
    を含む、切削ブレードの製造方法。
    With a plate-shaped body,
    A method for manufacturing a cutting blade having a plurality of chip units attached to one edge of the body portion at a predetermined pitch.
    A plating process in which a plating layer for holding a plurality of abrasive grains is formed on one surface of the foils of the first and second brazing materials and used as the first and second base basic bodies.
    Bending process of bending the first and second base basic bodies into an L-shaped cross section having a bent portion and a flat portion so that one surface is on the outside to obtain first and second chip bodies. When,
    The bent portion of the first chip body is placed on the end portion of the one edge portion from one surface side of the body portion, and the bent portion of the second chip body is placed on the other surface side of the body portion. The stacking process of stacking on the bent part of the chip body and
    The temperature is raised to a temperature exceeding the melting point of the first and second brazing materials and lower than the melting point of the plating layer, and then the temperature is lowered to room temperature, and the first and second brazing materials are used to form the first chip body. A temperature rising step of welding the plating layer to the body and the plating layer of the second chip body.
    How to make cutting blades, including.
PCT/JP2021/031828 2020-09-09 2021-08-31 Cutting blade, and method for manufacturing cutting blade WO2022054630A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124574A (en) * 1982-12-29 1984-07-18 Daiyamondo Giken Kk Preparation of cutting edge
JPS60161070A (en) * 1984-01-27 1985-08-22 Honda Motor Co Ltd Manufacture of electrodeposition grindstone
JPH0365667U (en) * 1989-05-15 1991-06-26
KR20050051010A (en) * 2003-11-26 2005-06-01 신한다이아몬드공업 주식회사 Manufacturing method for grinding and cutting tool using metal brazing
US20070151554A1 (en) * 2004-02-09 2007-07-05 Shinhan Diamond Industrial Co., Ltd. Diamond tools with multilayers of abrasive grain and method for manufacturing the same
US20180311772A1 (en) * 2014-07-02 2018-11-01 United Technologies Corporation Abrasive Preforms and Manufacture and Use Methods

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124574A (en) * 1982-12-29 1984-07-18 Daiyamondo Giken Kk Preparation of cutting edge
JPS60161070A (en) * 1984-01-27 1985-08-22 Honda Motor Co Ltd Manufacture of electrodeposition grindstone
JPH0365667U (en) * 1989-05-15 1991-06-26
KR20050051010A (en) * 2003-11-26 2005-06-01 신한다이아몬드공업 주식회사 Manufacturing method for grinding and cutting tool using metal brazing
US20070151554A1 (en) * 2004-02-09 2007-07-05 Shinhan Diamond Industrial Co., Ltd. Diamond tools with multilayers of abrasive grain and method for manufacturing the same
US20180311772A1 (en) * 2014-07-02 2018-11-01 United Technologies Corporation Abrasive Preforms and Manufacture and Use Methods

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